ATSAMD10D14A-MNT

Atmel SAM D10 SMART ARM-Based Microcontroller DATASHEET SUMMARY Description The Atmel® | SMART™ SAM D10 is a series of low-power microcontrollers using the 32-bit ARM® Cortex®-M0+ processor, and ranging from 14- to 24-pins with up to 16KB Flash and 4KB of SRAM. The SAM D10 devices operate at a maximum frequency of 48MHz and reach 2.46 Coremark/MHz. They are designed for simple and intuitive migration with identical peripheral modules, hex compatible code, identical linear address map and pin compatible migration paths between all devices in the product series. All devices include intelligent and flexible peripherals, Atmel Event System for inter-peripheral signaling, and support for capacitive touch button, slider and wheel user interfaces. The SAM D10 series is compatible to the other product series in the SAM D family, enabling easy migration to larger device with added features. The Atmel SAM D10 devices provide the following features: In-system programmable Flash, sixchannel direct memory access (DMA) controller, 6 channel Event System, programmable interrupt controller, up to 22 programmable I/O pins, 32-bit real-time clock and calendar, two 16bit Timer/Counters (TC) and one 24-bit Timer/Counter for Control (TCC), where each TC can be configured to perform frequency and waveform generation, accurate program execution timing or input capture with time and frequency measurement of digital signals. The TCs can operate in 8or 16-bit mode, selected TCs can be cascaded to form a 32-bit TC, and one timer/counter has extended functions optimized for motor, lighting and other control applications. The series provide up to three Serial Communication Modules (SERCOM) that each can be configured to act as an USART, UART, SPI, I2C up to 3.4MHz, SMBus, PMBus and LIN slave; up to 10-channel 350ksps 12-bit ADC with programmable gain and optional oversampling and decimation supporting up to 16-bit resolution, one 10-bit 350ksps DAC, two analog comparators with window mode, Peripheral Touch Controller supporting up to 72 buttons, sliders, wheels and proximity sensing; programmable Watchdog Timer, brown-out detector and power-on reset and two-pin Serial Wire Debug (SWD) program and debug interface. All devices have accurate and low-power external and internal oscillators. All oscillators can be used as a source for the system clock. Different clock domains can be independently configured to run at different frequencies, enabling power saving by running each peripheral at its optimal clock frequency, and thus maintaining a high CPU frequency while reducing power consumption. The SAM D10 devices have two software-selectable sleep modes, idle and standby. In idle mode the CPU is stopped while all other functions can be kept running. In standby all clocks and functions are stopped expect those selected to continue running. The device supports SleepWalking. This feature allows the peripheral to wake up from sleep based on predefined conditions, and thus allows the CPU to wake up only when needed, e.g. when a threshold is crossed or a result is ready. The Event System supports synchronous and asynchronous events, allowing peripherals to receive, react to and send events even in standby mode. The Flash program memory can be reprogrammed in-system through the SWD interface. The same interface can be used for non-intrusive on-chip debug and trace of application code. A boot loader running in the device can use any communication interface to download and upgrade the application program in the Flash memory. The Atmel SAM D10 devices are supported with a full suite of program and system development tools, including C compilers, macro assemblers, program debugger/simulators, programmers and evaluation kits. Atmel-42242HS-SAM-D10-Summary_09/2016 SMART Features z Processor z ARM Cortex-M0+ CPU running at up to 48MHz z Single-cycle hardware multiplier z Micro Trace Buffer z Memories z 8/16KB in-system self-programmable Flash z 4KB SRAM Memory z System z Power-on reset (POR) and brown-out detection (BOD) z Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M) and 48MHz to 96MHz Fractional Digital Phase Locked Loop (FDPLL96M) z External Interrupt Controller (EIC) z 8 external interrupts z One non-maskable interrupt z Two-pin Serial Wire Debug (SWD) programming, test and debugging interface z Low Power z Idle and standby sleep modes z SleepWalking peripherals z Peripherals z 6-channel Direct Memory Access Controller (DMAC) z 6-channel Event System z Two 16-bit Timer/Counters (TC), configurable as either: z One 16-bit TC with compare/capture channels z One 8-bit TC with compare/capture channels z One 32-bit TC with compare/capture channels, by using two TCs z One 24-bit Timer/Counters for Control (TCC), with extended functions: z Up to four compare channels with optional complementary output z Generation of synchronized pulse width modulation (PWM) pattern across port pins z Deterministic fault protection, fast decay and configurable dead-time between complementary output z Dithering that increase resolution with up to 5 bit and reduce quantization error z 32-bit Real Time Counter (RTC) with clock/calendar function z Watchdog Timer (WDT) z CRC-32 generator z Up to three Serial Communication Interfaces (SERCOM), each configurable to operate as either: z USART with full-duplex and single-wire half-duplex configuration z I2C Bus up to 3.4MHz z SMBUS/PMBUS z SPI z LIN slave z 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 10 channels z Differential and single-ended input z 1/2x to 16x programmable gain stage z Automatic offset and gain error compensation z Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution z 10-bit, 350ksps Digital-to-Analog Converter (DAC) z Two Analog Comparators (AC) with window compare function z Peripheral Touch Controller (PTC) z Up to 72-channel capacitive touch and proximity sensing z I/O z Up to 22 programmable I/O pins z Packages z 24-pin QFN z 20-pin SOIC z 20-ball WLCSP z 14-pin SOIC z Operating Voltage z 1.62V – 3.63V Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 2 1. Configuration Summary Table 1-1. Configuration Summary SAM D10D – 24-pin QFN SAM D10D – 20-pin SOIC / WLCSP SAM D10C – 14-pin SOIC Pins 24 20 14 General Purpose I/O-pins (GPIOs) 22 18 12 Flash 16/8KB 16/8KB 16/8KB SRAM 4KB 4KB 4KB Timer Counter (TC) 2 2 2(3) Waveform output channels for TC 2 2 2 Timer Counter for Control (TCC) 1 1 1 Waveform output channels per TCC 8 8 8 DMA channels 6 6 6 Serial Communication Interface (SERCOM) 3 3 2 Analog-to-Digital Converter (ADC) channels 10 8 5 Analog Comparators (AC) 2 2 2 Digital-to-Analog Converter (DAC) channels 1 1 1 Yes Yes Yes 1 1 1 Real-Time Counter (RTC) RTC alarms Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 3 Table 1-1. Configuration Summary (Continued) SAM D10D – 24-pin QFN SAM D10D – 20-pin SOIC / WLCSP SAM D10C – 14-pin SOIC 1 32-bit value or 2 16-bit values 1 32-bit value or 2 16-bit values 1 32-bit value or 2 16-bit values 8 8 8 Peripheral Touch Controller (PTC) channels (X- x Y-lines) for mutual capacitance(1) 72 (9x8) 42 (7x6) 12 (4x3) Peripheral Touch Controller (PTC) channels for self capacitance (Ylines only)(2) 16 13 7 48MHz 48MHz 48MHz QFN SOIC / WLCSP SOIC RTC compare values External Interrupt lines Maximum CPU frequency Packages 32.768kHz crystal oscillator (XOSC32K) 0.4-32MHz crystal oscillator (XOSC) 32.768kHzinternal oscillator (OSC32K) 32kHz ultra-low-power internal oscillator (OSCULP32K) 8MHz high-accuracy internal oscillator (OSC8M) 48MHz Digital Frequency Locked Loop (DFLL48M) 96MHz Fractional Digital Phased Locked Loop (FDPLL96M) Oscillators Event System channels 6 6 6 SW Debug Interface Yes Yes Yes Watchdog Timer (WDT) Yes Yes Yes Notes: 1. 2. 3. The number of X- and Y-lines depends on the configuration of the device, as some I/O lines can be configured as either X-lines or Y-lines. The number in the “Configuration Summary” on page 3 is the maximum number of channels that can be obtained. The number of Y-lines depends on the configuration of the device, as some I/O lines can be configured as either X-lines or Y-lines. The number given here is the maximum number of Y-lines that can be obtained. The signals for TC2 are not routed out on the 14-pin package. Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 4 2. Ordering Information SAMD 10 C 14 A - M U T Product Family Package Carrier SAMD = General Purpose Microcontroller No character = Tray (Default) T = Tape and Reel Product Series 10 = Cortex M0+ DMA Package Grade O Pin Count U = -40 - 85 C Matte Sn Plating N = -40 - 105 C Matte Sn Plating O C = 14 pins D = 20/24 pins Package Type Flash Memory Density M = QFN SS = SOIC U = WLCSP 14 = 16KB 13 = 8KB Device Variant A = Default Variant 2.1 SAM D10C – 14-pin SOIC Ordering Code FLASH (bytes) SRAM (bytes) Package Carrier Type ATSAMD10C13A-SSUT 8K 4K SOIC14 Tape & Reel ATSAMD10C13A-SSNT 8K 4K SOIC14 Tape & Reel ATSAMD10C14A-SSUT 16K 4K SOIC14 Tape & Reel ATSAMD10C14A-SSNT 16K 4K SOIC14 Tape & Reel FLASH (bytes) SRAM (bytes) Package Carrier Type ATSAMD10D13A-SSUT 8K 4K SOIC20 Tape & Reel ATSAMD10D13A-SSNT 8K 4K SOIC20 Tape & Reel ATSAMD10D14A-SSUT 16K 4K SOIC20 Tape & Reel ATSAMD10D14A-SSNT 16K 4K SOIC20 Tape & Reel 2.2 SAM D10D – 20-pin SOIC Ordering Code Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 5 2.3 SAM D10D – 20-ball WLCSP Ordering Code FLASH (bytes) SRAM (bytes) Package Carrier Type 16K 4K WLCSP20 Tape & Reel FLASH (bytes) SRAM (bytes) Package Carrier Type ATSAMD10D13A-MUT 8K 4K QFN24 Tape & Reel ATSAMD10D13A-MNT 8K 4K QFN24 Tape & Reel ATSAMD10D14A-MUT 16K 4K QFN24 Tape & Reel ATSAMD10D14A-MNT 16K 4K QFN24 Tape & Reel ATSAMD10D14A-UUT 2.4 SAM D10D – 24-pin QFN Ordering Code 2.5 Device Identification The DSU - Device Service Unit peripheral provides the Device Selection bits in the Device Identification register (DID.DEVSEL) in order to identify the device by software. The device variants have a reset value of DID=0x1001drxx, with the LSB identifying the die number ('d'), the die revision ('r') and the device selection ('xx'). Table 2-1. Device Identification Values Device Variant DID.DEVSEL Device ID (DID) SAMD10D14AM 0x00 0x10020r00 SAMD10D13AM 0x01 0x10020r01 Reserved 0x02 SAMD10D14ASS 0x03 0x10020r03 SAMD10D13ASS 0x04 0x10020r04 Reserved 0x05 SAMD10C14A 0x06 0x10020r06 SAMD10C13A 0x07 0x10020r07 Reserved 0x08 SAMD10D14AU 0x09 0x10020r09 Note: The device variant (last letter of the ordering number) is independent of the die revision (DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks evolution of the die. The device variant denotes functional differences, whereas the die revision marks evolution of the die Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 6 3. Block Diagram SWCLK CORTEX-M0+ PROCESSOR Fmax 48 MHz SERIAL WIRE SWDIO MICRO TRACE BUFFER IOBUS DEVICE SERVICE UNIT M 8/16 KB NVM 4 KB RAM NVM CONTROLLER Cache SRAM CONTROLLER M M S M HIGH SPEED BUS MATRIX PERIPHERAL ACCESS CONTROLLER S AHB-APB BRIDGE B S AHB-APB BRIDGE A AHB-APB BRIDGE C PERIPHERAL ACCESS CONTROLLER SYSTEM CONTROLLER PORT DMA S PERIPHERAL ACCESS CONTROLLER DMA 36xxSERCOM SERCOM VREF BOD33 S PAD0 PAD1 PAD2 PAD3 OSCULP32K XOUT32 XIN32 OSC32K XOSC32K DMA OSC8M XIN XOUT XOSC 2 x TIMER / COUNTER 8 x Timer Counter WO0 WO1 DFLL48M POWER MANAGER CLOCK CONTROLLER RESETN RESET CONTROLLER GCLK_IO[5..0] SLEEP CONTROLLER WATCHDOG TIMER Notes: 1. 2. 1 x TIMER / COUNTER FOR CONTROL EXTERNAL INTERRUPT CONTROLLER WO0 WO1 (2) WOn AIN[9..0] DMA 10-CHANNEL 12-bit ADC 350KSPS GENERIC CLOCK CONTROLLER REAL TIME COUNTER EXTINT[7..0] NMI EVENT SYSTEM DMA PORT FDPLL96M 2 ANALOG COMPARATORS DMA VREFA VREFB AIN[3..0] VOUT 10-bit DAC VREFA X[10] PERIPHERAL TOUCH CONTROLLER Y[5..0] X[9..0] / Y[15..6] (3) Some products have different number of SERCOM instances, PTC signals and ADC signals. The number of PTC X- and Y-lines depend on the configuration of the device, as some I/O lines can be configured as either X-lines or Y-lines. Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 7 4. Pinout 4.1 SAM D10C 14-pin SOIC PA05 1 14 PA04 PA08 2 13 PA02 PA09 3 12 VDDIO/IN/ANA PA14 4 11 GND PA15 5 10 PA25 6 9 PA24 7 8 PA31 PA28/RST PA30 DIGITAL PIN ANALOG PIN OSCILLATOR GROUND INPUT SUPPLY RESET/GPIO PIN 4.2 SAM D10D 20-pin SOIC PA05 1 20 PA04 PA06 2 19 PA03 PA07 3 18 PA02 PA08 4 17 VDDIO/IN/ANA PA09 5 16 GND PA14 6 15 PA25 PA15 7 14 PA24 PA16 8 13 PA31 PA22 9 12 PA30 PA23 10 11 PA28/RST DIGITAL PIN ANALOG PIN OSCILLATOR GROUND INPUT SUPPLY RESET/GPIO PIN Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 8 4.3 SAM D10D 20-ball WLCSP A 1 02 PA 3 A0 2 P 3 PA 4 PA 04 06 B D VD/IN/ANA IO 5 A0 P 07 PA 08 PA C 25 PA ND G 16 PA 09 PA D 24 PA 0 A3 P 23 PA 14 PA E 31 PA / 28 A P ST R 22 PA 15 PA Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 9 GND PA25 PA24 PA31 PA30 24 23 22 21 20 19 VDDIO/IN/ANA SAM D10D 24-pin QFN 1 2 3 4 5 6 18 17 16 15 14 13 PA28/RST PA27 PA23 PA22 PA17 PA16 7 8 9 10 11 12 PA02 PA03 PA04 PA05 PA06 PA07 DIGITAL PIN ANALOG PIN OSCILLATOR GROUND INPUT SUPPLY RESET/GPIO PIN PA08 PA09 PA10 PA11 PA14 PA15 4.4 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 10 5. Product Mapping Figure 5-1. Atmel SAM D10 Product Mapping Global Memory Space 0x00000000 Code 0x00000000 Internal Flash Code 0x20000000 0x00004000 Reserved SRAM 0x1FFFFFFF 0x20001000 Undefined 0x40000000 AHB-APB Bridge C SRAM 0x20000000 Peripherals 0x42000000 PAC2 0x42000400 Internal SRAM EVSYS 0x42000800 SERCOM0 0x20001000 0x43000000 0x42000C00 Reserved 0x60000000 AHB-APB SERCOM1 0x42001000 SERCOM2 0x40000000 AHB-APB Bridge A Undefined 0x42001400 TCC0 0x42001800 0x60000200 TC1 0x41000000 AHB-APB Bridge B Reserved 0xFFFFFFFF 0x42001C00 TC2 0x42002000 0x42000000 AHB-APB Bridge C 0x42FFFFFF ADC 0x42002400 AC 0x42002800 DAC AHB-APB Bridge A 0x42002C00 AHB-APB Bridge B 0x41000000 0x40000000 PAC1 PAC0 DSU PM 0x41004000 0x40000800 NVMCTRL SYSCTRL 0x41004400 0x40000C00 PORT GCLK 0x41004800 0x40001000 DMAC WDT 0x41005000 0x40001400 Reserved RTC 0x41006000 0x40001800 MTB EIC 0x41004700 0x40001C00 Reserved 0x40FFFFFF Reserved 0x40FFFFFF 0x41002000 0x40000400 PTC 0x42003000 Reserved 0x41FFFFFF Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 11 6. Processor And Architecture 6.1 Cortex M0+ Processor The Atmel SAM D10 implements the ARM® Cortex™-M0+ processor, which is based on the ARMv6 Architecture and Thumb®-2 ISA. The Cortex M0+ is 100% instruction set compatible with its predecessor, the Cortex-M0 processor, and upward compatible to Cortex-M3 and M4 processors. For more information refer to www.arm.com. 6.1.1 Cortex M0+ Configuration Features Configuration option Atmel SAM D10 configuration Interrupts External interrupts 0-32 32 Data endianness Little-endian or big-endian Little-endian SysTick timer Present or absent Present Number of watchpoint comparators 0, 1, 2 2 Number of breakpoint comparators 0, 1, 2, 3, 4 4 Halting debug support Present or absent Present Multiplier Fast or small Fast (single cycle) Single-cycle I/O port Present or absent Present Wake-up interrupt controller Supported or not supported Not supported Vector Table Offset Register Present or absent Present Unprivileged/Privileged support Present or absent Absent(1) Memory Protection Unit Not present or 8-region Not present Reset all registers Present or absent Absent Instruction fetch width 16-bit only or mostly 32-bit 32-bit Note: 1. All software run in privileged mode only The ARM Cortex-M0+ core has two bus interfaces: z Single 32-bit AMBA®-3 AHB-Lite™ system interface that provides connections to peripherals and all system memory, including flash and RAM z Single 32-bit I/O port bus interfacing to the PORT with one-cycle loads and stores Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 12 7. Packaging Information 7.1 Thermal Considerations 7.1.1 Thermal Resistance Data Table 6-1 on page 13 summarizes the thermal resistance data depending on the package. Table 7-1. 7.1.2 Thermal Resistance Data Package Type θJA θJC Units 24-pin QFN 61.7 25.4 °C/W 20-pin SOIC 44.0 21.0 °C/W 20-ball WLCSP 37.4 6.6 °C/W 14-pin SOIC 58.5 26.3 °C/W Junction Temperature The average chip-junction temperature, TJ, in °C can be obtained from the following: Equation 1 T J = T A + ( P D × θ JA ) Equation 2 T J = T A + ( P D × ( θ HEATSINK + θ JC ) ) where: z θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 6-1 on page 13. z θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in Table 6-1 on page 13. z θHEATSINK = cooling device thermal resistance (°C/W), provided in the device datasheet. z PD = device power consumption (W). z TA = ambient temperature (°C). From the Equation 1, the user can derive the estimated lifetime of the chip and decide if a cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be used to compute the resulting average chip-junction temperature TJ in °C. Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 13 7.2 Package Drawings 7.2.1 24-pin QFN Table 7-2. Device and Package Maximum Weight 44 mg Table 7-3. Package Characteristics Moisture Sensitivity Level Table 7-4. MSL3 Package Reference JEDEC Drawing Reference MO-220 JESD97 Classification E3 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 14 7.2.2 20-pin SOIC Table 7-5. Device and Package Maximum Weight 530 mg Table 7-6. Package Characteristics Moisture Sensitivity Level Table 7-7. MSL3 Package Reference JEDEC Drawing Reference MS-013 JESD97 Classification E3 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 15 7.2.3 20-ball WLCSP Table 7-8. Device and Package Maximum Weight 7 mg Table 7-9. Package Characteristics Moisture Sensitivity Level MSL3 Table 7-10. Package Reference JEDEC Drawing Reference MS-220 JESD97 Classification E8 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 16 7.2.4 14-pin SOIC Table 7-11. Device and Package Maximum Weight 230 mg Table 7-12. Package Characteristics Moisture Sensitivity Level MSL3 Table 7-13. Package Reference JEDEC Drawing Reference MS-012 JESD97 Classification E3 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 17 7.3 Soldering Profile The following table gives the recommended soldering profile from J-STD-20. Profile Feature Green Package Average Ramp-up Rate (217°C to peak) 3°C/s max Preheat Temperature 175°C +/-25°C 150-200°C Time Maintained Above 217°C 60-150s Time within 5°C of Actual Peak Temperature 30s Peak Temperature Range 260°C Ramp-down Rate 6°C/s max Time 25°C to Peak Temperature 8 minutes max A maximum of three reflow passes is allowed per component. ___REV___383142 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 18 Table of Contents Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1. Configuration Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 2.2 2.3 2.4 2.5 SAM D10C – 14-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SAM D10D – 20-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SAM D10D – 20-ball WLCSP. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SAM D10D – 24-pin QFN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Device Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 6 6 6 3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4.1 4.2 4.3 4.4 SAM D10C 14-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 SAM D10D 20-pin SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 SAM D10D 20-ball WLCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 SAM D10D 24-pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5. Product Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6. Processor And Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6.1 Cortex M0+ Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 7. Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 7.1 7.2 7.3 Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Atmel | SMART SAM D10 [DATASHEET SUMMARY] Atmel-42242HS-SAM-D10-Summary_09/2016 19 ARM Connected Logo XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2016 Atmel Corporation. / Rev.: Atmel-42242HS-SAM-D10-Summary_09/2016. 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