32-bit ARM-Based
Microcontrollers
SAM D21E / SAM D21G / SAM D21J
Introduction
®
®
The SAM D21 is a series of low-power microcontrollers using the 32-bit ARM Cortex -M0+ processor,
and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The SAM D21 operate at a
®
maximum frequency of 48MHz and reach 2.46 CoreMark /MHz. They are designed for simple and
intuitive migration with identical peripheral modules, hex compatible code, identical linear address map
and pin compatible migration paths between all devices in the product series. All devices include
intelligent and flexible peripherals, Event System for inter-peripheral signaling, and support for capacitive
touch button, slider and wheel user interfaces.
Features
•
•
•
•
•
Processor
– ARM Cortex-M0+ CPU running at up to 48MHz
• Single-cycle hardware multiplier
• Micro Trace Buffer (MTB)
Memories
– 32/64/128/256KB in-system self-programmable Flash
– 4/8/16/32KB SRAM Memory
System
– Power-on reset (POR) and brown-out detection (BOD)
– Internal and external clock options with 48MHz Digital Frequency Locked Loop (DFLL48M)
and 48MHz to 96MHz Fractional Digital Phase Locked Loop (FDPLL96M)
– External Interrupt Controller (EIC)
– 16 external interrupts
– One non-maskable interrupt
– Two-pin Serial Wire Debug (SWD) programming, test and debugging interface
Low Power
– Idle and standby sleep modes
– SleepWalking peripherals
Peripherals
– 12-channel Direct Memory Access Controller (DMAC)
– 12-channel Event System
– Up to five 16-bit Timer/Counters (TC), configurable as either:
• One 16-bit TC with two compare/capture channels
• One 8-bit TC with two compare/capture channels
• One 32-bit TC with two compare/capture channels, by using two TCs
– Three 24-bit Timer/Counters for Control (TCC), with extended functions:
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Datasheet Complete
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32-bit ARM-Based Microcontrollers
•
•
•
–
–
–
–
–
–
–
–
–
–
•
•
•
•
Up to four compare channels with optional complementary output
Generation of synchronized pulse width modulation (PWM) pattern across port pins
Deterministic fault protection, fast decay and configurable dead-time between
complementary output
• Dithering that increase resolution with up to 5 bit and reduce quantization error
32-bit Real Time Counter (RTC) with clock/calendar function
Watchdog Timer (WDT)
CRC-32 generator
One full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface
• Embedded host and device function
• Eight endpoints
Up to six Serial Communication Interfaces (SERCOM), each configurable to operate as either:
• USART with full-duplex and single-wire half-duplex configuration
• I2C up to 3.4MHz
• SPI
• LIN slave
One two-channel Inter-IC Sound (I2S) interface
One 12-bit, 350ksps Analog-to-Digital Converter (ADC) with up to 20 channels
• Differential and single-ended input
• 1/2x to 16x programmable gain stage
• Automatic offset and gain error compensation
• Oversampling and decimation in hardware to support 13-, 14-, 15- or 16-bit resolution
10-bit, 350ksps Digital-to-Analog Converter (DAC)
Two Analog Comparators (AC) with window compare function
Peripheral Touch Controller (PTC)
• 256-Channel capacitive touch and proximity sensing
I/O
– Up to 52 programmable I/O pins
Drop in compatible with SAM D20
Packages
– 64-pin TQFP, QFN, UFBGA
– 48-pin TQFP, QFN, WLCSP
– 32-pin TQFP, QFN, WLCSP
Operating Voltage
– 1.62V – 3.63V
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40001882A-page 2
Table of Contents
Introduction......................................................................................................................1
Features.......................................................................................................................... 1
1. Description...............................................................................................................12
2. Configuration Summary...........................................................................................13
3. Ordering Information................................................................................................15
3.1.
3.2.
3.3.
3.4.
SAM D21E..................................................................................................................................15
SAM D21G................................................................................................................................. 18
SAM D21J.................................................................................................................................. 20
Device Identification................................................................................................................... 22
4. Block Diagram......................................................................................................... 24
5. Pinout...................................................................................................................... 25
5.1.
5.2.
5.3.
SAM D21J.................................................................................................................................. 25
SAM D21G................................................................................................................................. 27
SAM D21E..................................................................................................................................29
6. Signal Descriptions List........................................................................................... 31
7. I/O Multiplexing and Considerations........................................................................33
7.1.
7.2.
Multiplexed Signals.................................................................................................................... 33
Other Functions..........................................................................................................................35
8. Power Supply and Start-Up Considerations............................................................ 38
8.1.
8.2.
8.3.
8.4.
Power Domain Overview............................................................................................................38
Power Supply Considerations.................................................................................................... 38
Power-Up................................................................................................................................... 40
Power-On Reset and Brown-Out Detector................................................................................. 40
9. Product Mapping..................................................................................................... 42
10. Memories.................................................................................................................43
10.1. Embedded Memories................................................................................................................. 43
10.2. Physical Memory Map................................................................................................................ 43
10.3. NVM Calibration and Auxiliary Space........................................................................................ 44
11. Processor And Architecture.....................................................................................48
11.1.
11.2.
11.3.
11.4.
11.5.
Cortex M0+ Processor............................................................................................................... 48
Nested Vector Interrupt Controller..............................................................................................49
Micro Trace Buffer...................................................................................................................... 51
High-Speed Bus System............................................................................................................ 52
AHB-APB Bridge........................................................................................................................ 54
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11.6. PAC - Peripheral Access Controller........................................................................................... 55
12. Peripherals Configuration Summary........................................................................67
13. DSU - Device Service Unit...................................................................................... 69
13.1. Overview.................................................................................................................................... 69
13.2. Features..................................................................................................................................... 69
13.3. Block Diagram............................................................................................................................ 70
13.4. Signal Description...................................................................................................................... 70
13.5. Product Dependencies............................................................................................................... 70
13.6. Debug Operation........................................................................................................................ 71
13.7. Chip Erase..................................................................................................................................73
13.8. Programming..............................................................................................................................73
13.9. Intellectual Property Protection.................................................................................................. 74
13.10. Device Identification................................................................................................................... 75
13.11. Functional Description................................................................................................................76
13.12. Register Summary..................................................................................................................... 82
13.13. Register Description...................................................................................................................84
14. Clock System.........................................................................................................100
14.1.
14.2.
14.3.
14.4.
14.5.
14.6.
14.7.
14.8.
Clock Distribution..................................................................................................................... 100
Synchronous and Asynchronous Clocks..................................................................................101
Register Synchronization......................................................................................................... 101
Enabling a Peripheral............................................................................................................... 106
Disabling a Peripheral.............................................................................................................. 106
On-demand, Clock Requests................................................................................................... 106
Power Consumption vs. Speed................................................................................................ 107
Clocks after Reset.................................................................................................................... 107
15. GCLK - Generic Clock Controller.......................................................................... 108
15.1.
15.2.
15.3.
15.4.
15.5.
15.6.
15.7.
15.8.
Overview.................................................................................................................................. 108
Features................................................................................................................................... 108
Block Diagram.......................................................................................................................... 108
Signal Description.................................................................................................................... 109
Product Dependencies............................................................................................................. 109
Functional Description.............................................................................................................. 110
Register Summary....................................................................................................................115
Register Description................................................................................................................. 116
16. PM – Power Manager............................................................................................127
16.1.
16.2.
16.3.
16.4.
16.5.
16.6.
16.7.
16.8.
Overview.................................................................................................................................. 127
Features................................................................................................................................... 127
Block Diagram.......................................................................................................................... 128
Signal Description.................................................................................................................... 128
Product Dependencies............................................................................................................. 128
Functional Description..............................................................................................................130
Register Summary....................................................................................................................137
Register Description................................................................................................................. 137
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32-bit ARM-Based Microcontrollers
17. SYSCTRL – System Controller............................................................................. 150
17.1.
17.2.
17.3.
17.4.
17.5.
17.6.
17.7.
17.8.
Overview.................................................................................................................................. 150
Features................................................................................................................................... 150
Block Diagram.......................................................................................................................... 152
Signal Description.................................................................................................................... 152
Product Dependencies............................................................................................................. 152
Functional Description..............................................................................................................154
Register Summary....................................................................................................................170
Register Description................................................................................................................. 172
18. WDT – Watchdog Timer........................................................................................ 205
18.1.
18.2.
18.3.
18.4.
18.5.
18.6.
18.7.
18.8.
Overview.................................................................................................................................. 205
Features................................................................................................................................... 205
Block Diagram.......................................................................................................................... 206
Signal Description.................................................................................................................... 206
Product Dependencies............................................................................................................. 206
Functional Description..............................................................................................................207
Register Summary....................................................................................................................212
Register Description................................................................................................................. 212
19. RTC – Real-Time Counter..................................................................................... 218
19.1.
19.2.
19.3.
19.4.
19.5.
19.6.
19.7.
19.8.
Overview.................................................................................................................................. 218
Features................................................................................................................................... 218
Block Diagram.......................................................................................................................... 219
Signal Description.................................................................................................................... 219
Product Dependencies............................................................................................................. 219
Functional Description..............................................................................................................221
Register Summary....................................................................................................................226
Register Description................................................................................................................. 229
20. DMAC – Direct Memory Access Controller........................................................... 252
20.1. Overview.................................................................................................................................. 252
20.2. Features................................................................................................................................... 252
20.3. Block Diagram.......................................................................................................................... 254
20.4. Signal Description.................................................................................................................... 254
20.5. Product Dependencies............................................................................................................. 254
20.6. Functional Description..............................................................................................................255
20.7. Register Summary....................................................................................................................275
20.8. Register Description................................................................................................................. 276
20.9. Register Summary - SRAM...................................................................................................... 299
20.10. Register Description - SRAM................................................................................................... 299
21. EIC – External Interrupt Controller........................................................................ 305
21.1.
21.2.
21.3.
21.4.
21.5.
Overview.................................................................................................................................. 305
Features................................................................................................................................... 305
Block Diagram.......................................................................................................................... 305
Signal Description.................................................................................................................... 306
Product Dependencies............................................................................................................. 306
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32-bit ARM-Based Microcontrollers
21.6. Functional Description..............................................................................................................307
21.7. Register Summary....................................................................................................................311
21.8. Register Description................................................................................................................. 312
22. NVMCTRL – Non-Volatile Memory Controller....................................................... 320
22.1.
22.2.
22.3.
22.4.
22.5.
22.6.
22.7.
22.8.
Overview.................................................................................................................................. 320
Features................................................................................................................................... 320
Block Diagram.......................................................................................................................... 320
Signal Description.................................................................................................................... 321
Product Dependencies............................................................................................................. 321
Functional Description..............................................................................................................322
Register Summary....................................................................................................................329
Register Description................................................................................................................. 329
23. PORT - I/O Pin Controller......................................................................................339
23.1.
23.2.
23.3.
23.4.
23.5.
23.6.
23.7.
23.8.
Overview.................................................................................................................................. 339
Features................................................................................................................................... 339
Block Diagram.......................................................................................................................... 340
Signal Description.................................................................................................................... 340
Product Dependencies............................................................................................................. 340
Functional Description..............................................................................................................342
Register Summary....................................................................................................................348
Register Description................................................................................................................. 350
24. EVSYS – Event System........................................................................................ 363
24.1.
24.2.
24.3.
24.4.
24.5.
24.6.
24.7.
24.8.
Overview.................................................................................................................................. 363
Features................................................................................................................................... 363
Block Diagram.......................................................................................................................... 363
Signal Description.................................................................................................................... 364
Product Dependencies............................................................................................................. 364
Functional Description..............................................................................................................365
Register Summary....................................................................................................................370
Register Description................................................................................................................. 370
25. SERCOM – Serial Communication Interface.........................................................382
25.1.
25.2.
25.3.
25.4.
25.5.
25.6.
Overview.................................................................................................................................. 382
Features................................................................................................................................... 382
Block Diagram.......................................................................................................................... 383
Signal Description.................................................................................................................... 383
Product Dependencies............................................................................................................. 383
Functional Description..............................................................................................................385
26. SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiver
and Transmitter......................................................................................................391
26.1.
26.2.
26.3.
26.4.
Overview.................................................................................................................................. 391
USART Features...................................................................................................................... 391
Block Diagram.......................................................................................................................... 392
Signal Description.................................................................................................................... 392
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32-bit ARM-Based Microcontrollers
26.5.
26.6.
26.7.
26.8.
Product Dependencies............................................................................................................. 392
Functional Description..............................................................................................................394
Register Summary....................................................................................................................406
Register Description................................................................................................................. 406
27. SERCOM SPI – SERCOM Serial Peripheral Interface..........................................423
27.1.
27.2.
27.3.
27.4.
27.5.
27.6.
27.7.
27.8.
Overview.................................................................................................................................. 423
Features................................................................................................................................... 423
Block Diagram.......................................................................................................................... 424
Signal Description.................................................................................................................... 424
Product Dependencies............................................................................................................. 424
Functional Description..............................................................................................................426
Register Summary....................................................................................................................435
Register Description................................................................................................................. 436
28. SERCOM I2C – SERCOM Inter-Integrated Circuit................................................ 449
28.1. Overview.................................................................................................................................. 449
28.2. Features................................................................................................................................... 449
28.3. Block Diagram.......................................................................................................................... 450
28.4. Signal Description.................................................................................................................... 450
28.5. Product Dependencies............................................................................................................. 450
28.6. Functional Description..............................................................................................................452
28.7. Register Summary - I2C Slave.................................................................................................471
28.8. Register Description - I2C Slave...............................................................................................471
28.9. Register Summary - I2C Master...............................................................................................485
28.10. Register Description - I2C Master............................................................................................ 486
29. I2S - Inter-IC Sound Controller.............................................................................. 501
29.1.
29.2.
29.3.
29.4.
29.5.
29.6.
29.7.
29.8.
29.9.
Overview.................................................................................................................................. 501
Features................................................................................................................................... 501
Block Diagram.......................................................................................................................... 502
Signal Description.................................................................................................................... 503
Product Dependencies............................................................................................................. 503
Functional Description..............................................................................................................505
I2S Application Examples......................................................................................................... 516
Register Summary....................................................................................................................519
Register Description................................................................................................................. 520
30. TC – Timer/Counter............................................................................................... 533
30.1.
30.2.
30.3.
30.4.
30.5.
30.6.
30.7.
30.8.
Overview.................................................................................................................................. 533
Features................................................................................................................................... 533
Block Diagram.......................................................................................................................... 534
Signal Description.................................................................................................................... 534
Product Dependencies............................................................................................................. 535
Functional Description..............................................................................................................536
Register Summary....................................................................................................................548
Register Description................................................................................................................. 550
31. TCC – Timer/Counter for Control Applications...................................................... 565
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32-bit ARM-Based Microcontrollers
31.1.
31.2.
31.3.
31.4.
31.5.
31.6.
31.7.
31.8.
Overview.................................................................................................................................. 565
Features................................................................................................................................... 565
Block Diagram.......................................................................................................................... 566
Signal Description.................................................................................................................... 566
Product Dependencies............................................................................................................. 567
Functional Description..............................................................................................................568
Register Summary....................................................................................................................601
Register Description................................................................................................................. 603
32. USB – Universal Serial Bus...................................................................................638
32.1.
32.2.
32.3.
32.4.
32.5.
32.6.
32.7.
32.8.
Overview.................................................................................................................................. 638
Features................................................................................................................................... 638
USB Block Diagram..................................................................................................................639
Signal Description.................................................................................................................... 639
Product Dependencies............................................................................................................. 639
Functional Description..............................................................................................................641
Register Summary....................................................................................................................659
Register Description................................................................................................................. 663
33. ADC – Analog-to-Digital Converter........................................................................714
33.1.
33.2.
33.3.
33.4.
33.5.
33.6.
33.7.
33.8.
Overview.................................................................................................................................. 714
Features................................................................................................................................... 714
Block Diagram.......................................................................................................................... 715
Signal Description.................................................................................................................... 715
Product Dependencies............................................................................................................. 716
Functional Description..............................................................................................................717
Register Summary....................................................................................................................726
Register Description................................................................................................................. 727
34. AC – Analog Comparators.....................................................................................744
34.1.
34.2.
34.3.
34.4.
34.5.
34.6.
34.7.
34.8.
Overview.................................................................................................................................. 744
Features................................................................................................................................... 744
Block Diagram.......................................................................................................................... 745
Signal Description.................................................................................................................... 745
Product Dependencies............................................................................................................. 745
Functional Description..............................................................................................................747
Register Summary....................................................................................................................757
Register Description................................................................................................................. 757
35. DAC – Digital-to-Analog Converter........................................................................768
35.1.
35.2.
35.3.
35.4.
35.5.
35.6.
35.7.
35.8.
Overview.................................................................................................................................. 768
Features................................................................................................................................... 768
Block Diagram.......................................................................................................................... 768
Signal Description.................................................................................................................... 768
Product Dependencies............................................................................................................. 768
Functional Description..............................................................................................................770
Register Summary....................................................................................................................774
Register Description................................................................................................................. 774
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32-bit ARM-Based Microcontrollers
36. PTC - Peripheral Touch Controller.........................................................................781
36.1.
36.2.
36.3.
36.4.
36.5.
36.6.
Overview.................................................................................................................................. 781
Features................................................................................................................................... 781
Block Diagram.......................................................................................................................... 782
Signal Description.................................................................................................................... 783
Product Dependencies............................................................................................................. 783
Functional Description..............................................................................................................784
37. Electrical Characteristics....................................................................................... 786
37.1. Disclaimer.................................................................................................................................786
37.2. Absolute Maximum Ratings......................................................................................................786
37.3. General Operating Ratings.......................................................................................................786
37.4. Supply Characteristics..............................................................................................................787
37.5. Maximum Clock Frequencies................................................................................................... 788
37.6. Power Consumption................................................................................................................. 789
37.7. Peripheral Power Consumption................................................................................................795
37.8. I/O Pin Characteristics..............................................................................................................798
37.9. Injection Current....................................................................................................................... 800
37.10. Analog Characteristics............................................................................................................. 801
37.11. NVM Characteristics.................................................................................................................816
37.12. Oscillators Characteristics........................................................................................................817
37.13. PTC Typical Characteristics..................................................................................................... 825
37.14. USB Characteristics................................................................................................................. 831
37.15. Timing Characteristics..............................................................................................................832
38. Packaging Information...........................................................................................842
38.1. Thermal Considerations........................................................................................................... 842
38.2. Package Drawings................................................................................................................... 843
38.3. Soldering Profile....................................................................................................................... 854
39. Schematic Checklist.............................................................................................. 855
39.1.
39.2.
39.3.
39.4.
39.5.
39.6.
39.7.
39.8.
Introduction...............................................................................................................................855
Power Supply........................................................................................................................... 855
External Analog Reference Connections................................................................................. 856
External Reset Circuit...............................................................................................................858
Clocks and Crystal Oscillators..................................................................................................859
Unused or Unconnected Pins...................................................................................................862
Programming and Debug Ports................................................................................................862
USB Interface........................................................................................................................... 865
40. Errata.....................................................................................................................867
40.1. Device Variant A.......................................................................................................................867
40.2. Device Variant B.......................................................................................................................900
40.3. Device Variant C.......................................................................................................................908
41. Conventions...........................................................................................................912
41.1. Numerical Notation...................................................................................................................912
41.2. Memory Size and Type.............................................................................................................912
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32-bit ARM-Based Microcontrollers
41.3. Frequency and Time.................................................................................................................912
41.4. Registers and Bits.................................................................................................................... 913
42. Acronyms and Abbreviations.................................................................................914
43. Datasheet Revision History................................................................................... 917
43.1. Rev. A – 01/2017......................................................................................................................917
43.2. Rev. O – 12/2016..................................................................................................................... 917
43.3. Rev. N – 10/2016......................................................................................................................918
43.4. Rev. M – 09/2016..................................................................................................................... 918
43.5. Rev. L – 09/2016...................................................................................................................... 918
43.6. Rev. K – 09/2016......................................................................................................................919
43.7. Rev. J – 07/2016...................................................................................................................... 920
43.8. Rev. I – 03/2016....................................................................................................................... 920
43.9. Rev. H – 01/2016......................................................................................................................921
43.10. Rev. G – 09/2015..................................................................................................................... 922
43.11. Rev. F – 07/2015...................................................................................................................... 923
43.12. Rev. E – 02/2015......................................................................................................................924
43.13. Rev. D – 09/2014..................................................................................................................... 925
43.14. Rev. C – 07/2014..................................................................................................................... 926
43.15. Rev. B – 07/2014......................................................................................................................926
43.16. Rev. A - 02/2014...................................................................................................................... 932
44. Appendix A. Electrical Characteristics at 125°C....................................................933
44.1.
44.2.
44.3.
44.4.
44.5.
44.6.
44.7.
44.8.
44.9.
Disclaimer.................................................................................................................................933
Absolute Maximum Ratings......................................................................................................933
General Operating Ratings.......................................................................................................934
Maximum Clock Frequencies................................................................................................... 934
Power Consumption................................................................................................................. 937
Analog Characteristics............................................................................................................. 941
NVM Characteristics.................................................................................................................953
Oscillators Characteristics........................................................................................................954
Timing Characteristics.............................................................................................................. 963
The Microchip Web Site.............................................................................................. 968
Customer Change Notification Service........................................................................968
Customer Support....................................................................................................... 968
Product Identification System...................................................................................... 968
Microchip Devices Code Protection Feature............................................................... 969
Legal Notice.................................................................................................................970
Trademarks................................................................................................................. 970
Quality Management System Certified by DNV...........................................................971
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40001882A-page 10
32-bit ARM-Based Microcontrollers
Worldwide Sales and Service......................................................................................972
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40001882A-page 11
32-bit ARM-Based Microcontrollers
1.
Description
®
®
The SAM D21 is a series of low-power microcontrollers using the 32-bit ARM Cortex -M0+ processor,
and ranging from 32- to 64-pins with up to 256KB Flash and 32KB of SRAM. The SAM D21 operate at a
maximum frequency of 48MHz and reach 2.46 CoreMark/MHz. They are designed for simple and intuitive
migration with identical peripheral modules, hex compatible code, identical linear address map and pin
compatible migration paths between all devices in the product series. All devices include intelligent and
flexible peripherals, Event System for inter-peripheral signaling, and support for capacitive touch button,
slider and wheel user interfaces.
The SAM D21 provide the following features: In-system programmable Flash, twelve-channel direct
memory access (DMA) controller, 12 channel Event System, programmable interrupt controller, up to 52
programmable I/O pins, 32-bit real-time clock and calendar, up to five 16-bit Timer/Counters (TC) and
three 24-bit Timer/Counters for Control (TCC), where each TC can be configured to perform frequency
and waveform generation, accurate program execution timing or input capture with time and frequency
measurement of digital signals. The TCs can operate in 8- or 16-bit mode, selected TCs can be cascaded
to form a 32-bit TC, and three timer/counters have extended functions optimized for motor, lighting and
other control applications. The series provide one full-speed USB 2.0 embedded host and device
interface; up to six Serial Communication Modules (SERCOM) that each can be configured to act as an
USART, UART, SPI, I2C up to 3.4MHz, SMBus, PMBus, and LIN slave; two-channel I2S interface; up to
twenty-channel 350ksps 12-bit ADC with programmable gain and optional oversampling and decimation
supporting up to 16-bit resolution, one 10-bit 350ksps DAC, two analog comparators with window mode,
Peripheral Touch Controller supporting up to 256 buttons, sliders, wheels and proximity sensing;
programmable Watchdog Timer, brown-out detector and power-on reset and two-pin Serial Wire Debug
(SWD) program and debug interface.
All devices have accurate and low-power external and internal oscillators. All oscillators can be used as a
source for the system clock. Different clock domains can be independently configured to run at different
frequencies, enabling power saving by running each peripheral at its optimal clock frequency, and thus
maintaining a high CPU frequency while reducing power consumption.
The SAM D21 have two software-selectable sleep modes, idle and standby. In idle mode the CPU is
stopped while all other functions can be kept running. In standby all clocks and functions are stopped
expect those selected to continue running. The device supports SleepWalking. This feature allows the
peripheral to wake up from sleep based on predefined conditions, and thus allows the CPU to wake up
only when needed, e.g. when a threshold is crossed or a result is ready. The Event System supports
synchronous and asynchronous events, allowing peripherals to receive, react to and send events even in
standby mode.
The Flash program memory can be reprogrammed in-system through the SWD interface. The same
interface can be used for non-intrusive on-chip debug of application code. A boot loader running in the
device can use any communication interface to download and upgrade the application program in the
Flash memory.
The SAM D21 microcontrollers are supported with a full suite of program and system development tools,
including C compilers, macro assemblers, program debugger/simulators, programmers and evaluation
kits.
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32-bit ARM-Based Microcontrollers
2.
Configuration Summary
SAM D21J
SAM D21G
SAM D21E
Pins
64
48 (45 for WLCSP)
32 (35 for WLCSP)
General Purpose I/O-pins
(GPIOs)
52
38
26
Flash
256/128/64/32KB
256/128/64/32KB
256/128/64/32KB
SRAM
32/16/8/4KB
32/16/8/4KB
32/16/8/4KB
Timer Counter (TC)
instances
5
3 (5 for WLCSP)
3
Waveform output channels 2
per TC instance
2
2
Timer Counter for Control
(TCC) instances
3
3
Waveform output channels 8/4/2
per TCC
8/4/2
6/4/2
DMA channels
12
12
12
USB interface
1
1
1
Serial Communication
Interface (SERCOM)
instances
6
6
4
Inter-IC Sound (I2S)
interface
1
1
1
Analog-to-Digital Converter 20
(ADC) channels
14
10
Analog Comparators (AC)
2
2
2
Digital-to-Analog Converter 1
(DAC) channels
1
1
Real-Time Counter (RTC)
Yes
Yes
Yes
RTC alarms
1
1
1
RTC compare values
One 32-bit value or
One 32-bit value or
One 32-bit value or
two 16-bit values
two 16-bit values
two 16-bit values
16
16
16
12x10
10x6
External Interrupt lines
3
Peripheral Touch Controller 16x16
(PTC) X and Y lines
Maximum CPU frequency
48MHz
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 13
32-bit ARM-Based Microcontrollers
Packages
Oscillators
SAM D21J
SAM D21G
SAM D21E
QFN
QFN
QFN
TQFP
TQFP
TQFP
UFBGA
WLCSP
WLCSP
32.768kHz crystal oscillator (XOSC32K)
0.4-32MHz crystal oscillator (XOSC)
32.768kHz internal oscillator (OSC32K)
32KHz ultra-low-power internal oscillator (OSCULP32K)
8MHz high-accuracy internal oscillator (OSC8M)
48MHz Digital Frequency Locked Loop (DFLL48M)
96MHz Fractional Digital Phased Locked Loop (FDPLL96M)
Event System channels
12
12
12
SW Debug Interface
Yes
Yes
Yes
Watchdog Timer (WDT)
Yes
Yes
Yes
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 14
32-bit ARM-Based Microcontrollers
3.
Ordering Information
SAMD 21 E 15 A - M U T
Product Family
Package Carrier
SAMD = General Purpose Microcontroller
No character = Tray (Default)
T = Tape and Reel
Product Series
21 = Cortex M0 + CPU, Basic Feature Set
+ DMA + USB
Package Grade
Pin Count
U = -40 - 85 C Matte Sn Plating
F = -40 - 125 C Matte Sn Plating
O
O
E = 32 Pins (35 Pins for WLCSP)
G = 48 Pins (45 Pins for WLCSP)
J = 64 Pins
Package Type
Flash Memory Density
A = TQFP
M = QFN
U = WLCSP
C = UFBGA
18 = 256KB
17 = 128KB
16 = 64KB
15 = 32KB
Device Variant
A = Default Variant
B = Added RWW support for 32KB and 64KB memory options
C = Silicon revision F for WLCSP35 package option.
3.1
SAM D21E
Table 3-1. Device Variant A
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21E15A-AU
32K
4K
TQFP32
Tray
ATSAMD21E15A-AUT
Tape & Reel
ATSAMD21E15A-AF
Tray
ATSAMD21E15A-AFT
Tape & Reel
ATSAMD21E15A-MU
QFN32
Tray
ATSAMD21E15A-MUT
Tape & Reel
ATSAMD21E15A-MF
Tray
ATSAMD21E15A-MFT
Tape & Reel
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 15
32-bit ARM-Based Microcontrollers
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21E16A-AU
64K
8K
TQFP32
Tray
ATSAMD21E16A-AUT
Tape & Reel
ATSAMD21E16A-AF
Tray
ATSAMD21E16A-AFT
Tape & Reel
ATSAMD21E16A-MU
QFN32
Tray
ATSAMD21E16A-MUT
Tape & Reel
ATSAMD21E16A-MF
Tray
ATSAMD21E16A-MFT
Tape & Reel
ATSAMD21E17A-AU
128K
16K
TQFP32
Tray
ATSAMD21E17A-AUT
Tape & Reel
ATSAMD21E17A-AF
Tray
ATSAMD21E17A-AFT
Tape & Reel
ATSAMD21E17A-MU
QFN32
Tray
ATSAMD21E17A-MUT
Tape & Reel
ATSAMD21E17A-MF
Tray
ATSAMD21E17A-MFT
Tape & Reel
ATSAMD21E18A-AU
256K
32K
TQFP32
Tray
ATSAMD21E18A-AUT
Tape & Reel
ATSAMD21E18A-AF
Tray
ATSAMD21E18A-AFT
Tape & Reel
ATSAMD21E18A-MU
QFN32
Tray
ATSAMD21E18A-MUT
Tape & Reel
ATSAMD21E18A-MF
Tray
ATSAMD21E18A-MFT
Tape & Reel
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 16
32-bit ARM-Based Microcontrollers
Table 3-2. Device Variant B
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21E15B-AU
32K
4K
TQFP32
Tray
ATSAMD21E15B-AUT
Tape & Reel
ATSAMD21E15B-AF
Tray
ATSAMD21E15B-AFT
Tape & Reel
ATSAMD21E15B-MU
QFN32
Tray
ATSAMD21E15B-MUT
Tape & Reel
ATSAMD21E15B-MF
Tray
ATSAMD21E15B-MFT
Tape & Reel
ATSAMD21E15B-UUT
ATSAMD21E16B-AU
64K
8K
WLCSP35 (GJR)
Tape & Reel
TQFP32
Tray
ATSAMD21E16B-AUT
Tape & Reel
ATSAMD21E16B-AF
Tray
ATSAMD21E16B-AFT
Tape & Reel
ATSAMD21E16B-MU
QFN32
Tray
ATSAMD21E16B-MUT
Tape & Reel
ATSAMD21E16B-MF
Tray
ATSAMD21E16B-MFT
Tape & Reel
ATSAMD21E16B-UUT
64K
8K
WLCSP35 (GJR)
Tape & Reel
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21E15C-UUT
32K
4K
WLCSP35 (GJS)
Tape & Reel
ATSAMD21E16C-UUT
64K
8K
WLCSP35 (GJS)
Tape & Reel
Table 3-3. Device Variant C
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 17
32-bit ARM-Based Microcontrollers
3.2
SAM D21G
Table 3-4. Device Variant A
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21G15A-AU
32K
4K
TQFP48
Tray
ATSAMD21G15A-AUT
Tape & Reel
ATSAMD21G15A-AF
Tray
ATSAMD21G15A-AFT
Tape & Reel
ATSAMD21G15A-MU
QFN48
Tray
ATSAMD21G15A-MUT
Tape & Reel
ATSAMD21G15A-MF
Tray
ATSAMD21G15A-MFT
Tape & Reel
ATSAMD21G16A-AU
64K
8K
TQFP48
Tray
ATSAMD21G16A-AUT
Tape & Reel
ATSAMD21G16A-AF
Tray
ATSAMD21G16A-AFT
Tape & Reel
ATSAMD21G16A-MU
QFN48
Tray
ATSAMD21G16A-MUT
Tape & Reel
ATSAMD21G16A-MF
Tray
ATSAMD21G16A-MFT
Tape & Reel
ATSAMD21G17A-AU
128K
16K
TQFP48
Tray
ATSAMD21G17A-AUT
Tape & Reel
ATSAMD21G17A-AF
Tray
ATSAMD21G17A-AFT
Tape & Reel
ATSAMD21G17A-MU
QFN48
Tray
ATSAMD21G17A-MUT
Tape & Reel
ATSAMD21G17A-MF
Tray
ATSAMD21G17A-MFT
Tape & Reel
ATSAMD21G17A-UUT
© 2017 Microchip Technology Inc.
WLCSP45
Datasheet Complete
Tape & Reel
40001882A-page 18
32-bit ARM-Based Microcontrollers
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21G18A-AU
256K
32K
TQFP48
Tray
ATSAMD21G18A-AUT
Tape & Reel
ATSAMD21G18A-AF
Tray
ATSAMD21G18A-AFT
Tape & Reel
ATSAMD21G18A-MU
QFN48
Tray
ATSAMD21G18A-MUT
Tape & Reel
ATSAMD21G18A-MF
Tray
ATSAMD21G18A-MFT
Tape & Reel
ATSAMD21G18A-UUT
WLCSP45
Tape & Reel
Table 3-5. Device Variant B
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21G15B-AU
32K
4K
TQFP48
Tray
ATSAMD21G15B-AUT
Tape & Reel
ATSAMD21G15B-AF
Tray
ATSAMD21G15B-AFT
Tape & Reel
ATSAMD21G15B-MU
QFN48
Tray
ATSAMD21G15B-MUT
Tape & Reel
ATSAMD21G15B-MF
Tray
ATSAMD21G15B-MFT
Tape & Reel
ATSAMD21G16B-AU
64K
8K
TQFP48
Tray
ATSAMD21G16B-AUT
Tape & Reel
ATSAMD21G16B-AF
Tray
ATSAMD21G16B-AFT
Tape & Reel
ATSAMD21G16B-MU
QFN48
Tray
ATSAMD21G16B-MUT
Tape & Reel
ATSAMD21G16B-MF
Tray
ATSAMD21G16B-MFT
Tape & Reel
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 19
32-bit ARM-Based Microcontrollers
3.3
SAM D21J
Table 3-6. Device Variant A
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21J15A-AU
32K
4K
TQFP64
Tray
ATSAMD21J15A-AUT
Tape & Reel
ATSAMD21J15A-AF
Tray
ATSAMD21J15A-AFT
Tape & Reel
ATSAMD21J15A-MU
QFN64
Tray
ATSAMD21J15A-MUT
Tape & Reel
ATSAMD21J15A-MF
Tray
ATSAMD21J15A-MFT
Tape & Reel
ATSAMD21J16A-AU
64K
8K
TQFP64
Tray
ATSAMD21J16A-AUT
Tape & Reel
ATSAMD21J16A-AF
Tray
ATSAMD21J16A-AFT
Tape & Reel
ATSAMD21J16A-MU
QFN64
Tray
ATSAMD21J16A-MUT
Tape & Reel
ATSAMD21J16A-MF
Tray
ATSAMD21J16A-MFT
Tape & Reel
ATSAMD21J16A-CU
UFBGA64
ATSAMD21J16A-CUT
ATSAMD21J17A-AU
Tray
Tape & Reel
128K
16K
TQFP64
Tray
ATSAMD21J17A-AUT
Tape & Reel
ATSAMD21J17A-AF
Tray
ATSAMD21J17A-AFT
Tape & Reel
ATSAMD21J17A-MU
QFN64
Tray
ATSAMD21J17A-MUT
Tape & Reel
ATSAMD21J17A-MF
Tray
ATSAMD21J17A-MFT
Tape & Reel
ATSAMD21J17A-CU
UFBGA64
ATSAMD21J17A-CUT
© 2017 Microchip Technology Inc.
Tray
Tape & Reel
Datasheet Complete
40001882A-page 20
32-bit ARM-Based Microcontrollers
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21J18A-AU
256K
32K
TQFP64
Tray
ATSAMD21J18A-AUT
Tape & Reel
ATSAMD21J18A-AF
Tray
ATSAMD21J18A-AFT
Tape & Reel
ATSAMD21J18A-MU
QFN64
Tray
ATSAMD21J18A-MUT
Tape & Reel
ATSAMD21J18A-MF
Tray
ATSAMD21J18A-MFT
Tape & Reel
ATSAMD21J18A-CU
UFBGA64
ATSAMD21J18A-CUT
Tray
Tape & Reel
Table 3-7. Device Variant B
Ordering Code
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
ATSAMD21J15B-AU
32K
4K
TQFP64
Tray
ATSAMD21J15B-AUT
Tape & Reel
ATSAMD21J15B-AF
Tray
ATSAMD21J15B-AFT
Tape & Reel
ATSAMD21J15B-MU
QFN64
Tray
ATSAMD21J15B-MUT
Tape & Reel
ATSAMD21J15B-MF
Tray
ATSAMD21J15B-MFT
Tape & Reel
ATSAMD21J16B-AU
64K
8K
TQFP64
Tray
ATSAMD21J16B-AUT
Tape & Reel
ATSAMD21J16B-AF
Tray
ATSAMD21J16B-AFT
Tape & Reel
ATSAMD21J16B-MU
QFN64
Tray
ATSAMD21J16B-MUT
Tape & Reel
ATSAMD21J16B-MF
Tray
ATSAMD21J16B-MFT
Tape & Reel
ATSAMD21J16B-CU
UFBGA64
ATSAMD21J16B-CUT
© 2017 Microchip Technology Inc.
Tray
Tape & Reel
Datasheet Complete
40001882A-page 21
32-bit ARM-Based Microcontrollers
3.4
Device Identification
The DSU - Device Service Unit peripheral provides the Device Selection bits in the Device Identification
register (DID.DEVSEL) in order to identify the device by software. The SAM D21 variants have a reset
value of DID=0x1001drxx, with the LSB identifying the die number ('d'), the die revision ('r') and the
device selection ('xx').
Table 3-8. SAM D21 Device Identification Values
Device Variant
DID.DEVSEL
Device ID (DID)
SAMD21J18A
0x00
0x10010000
SAMD21J17A
0x01
0x10010001
SAMD21J16A
0x02
0x10010002
SAMD21J15A
0x03
0x10010003
Reserved
0x04
SAMD21G18A
0x05
0x10010005
SAMD21G17A
0x06
0x10010006
SAMD21G16A
0x07
0x10010007
SAMD21G15A
0x08
0x10010008
Reserved
0x09
SAMD21E18A
0x0A
0x1001000A
SAMD21E17A
0x0B
0x1001000B
SAMD21E16A
0x0C
0x1001000C
SAMD21E15A
0x0D
0x1001000D
Reserved
0x0E
SAMD21G18A (WLCSP)
0x0F
0x1001000F
SAMD21G17A (WLCSP)
0x10
0x10010010
Reserved
0x11 - 0x1F
SAMD21J16B
0x20
0x10011420 (die revision E)
0x10011520 (die revision F)
SAMD21J15B
0x21
0x10011421 (die revision E)
0x10011521 (die revision F)
Reserved
0x22
SAMD21G16B
0x23
0x10011423 (die revision E)
0x10011523 (die revision F)
SAMD21G15B
0x24
0x10011424 (die revision E)
0x10011524 (die revision F)
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 22
32-bit ARM-Based Microcontrollers
Device Variant
DID.DEVSEL
Reserved
0x25
SAMD21E16B
0x26
Device ID (DID)
0x10011426 (die revision E)
0x10011526 (die revision F)
SAMD21E15B
0x27
0x10011427 (die revision E)
0x10011527 (die revision F)
Reserved
0x28-0x54
SAMD21E16B (WLCSP)
0x55
0x10011455 (die revision E)
SAMD21E15B (WLCSP)
0x56
0x10011456 (die revision E)
Reserved
0x57 - 0x61
SAMD21E16C (WLCSP)
0x62
0x10011562 (die revision F)
SAMD21E15C (WLCSP)
0x63
0x10011563 (die revision F)
Reserved
0x64-0xFF
Note: The device variant (last letter of the ordering number) is independent of the die revision
(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks
evolution of the die. The device variant denotes functional differences, whereas the die revision marks
evolution of the die.
Related Links
DID
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 23
32-bit ARM-Based Microcontrollers
Block Diagram
SERIAL
WIRE
SWDIO
DEVICE
SERVICE
UNIT
M
256/128/64/32KB
NVM
32/16/8/4KB
RAM
NVM
CONTROLLER
Cache
SRAM
CONTROLLER
M
S
S
M
HIGH SPEED
BUS MATRIX
PERIPHERAL
ACCESS CONTROLLER
S
AHB-APB
BRIDGE B
S
USB FS
DEVICE
MINI-HOST
S
AHB-APB
BRIDGE A
DMA
66xxSERCOM
SERCOM
VREF
OSC32K
XOSC32K
DMA
OSC8M
5 x TIMER / COUNTER
8 x Timer Counter
XOSC
FDPLL96M
POWER MANAGER
CLOCK
CONTROLLER
RESET
CONTROLLER
SLEEP
CONTROLLER
EVENT SYSTEM
DMA
RESETN
PAD0
PAD1
PAD2
PAD3
OSCULP32K
DFLL48M
XIN
XOUT
DM
SOF 1KHZ
PERIPHERAL
ACCESS CONTROLLER
SYSTEM CONTROLLER
XIN32
XOUT32
DP
AHB-APB
BRIDGE C
PERIPHERAL
ACCESS CONTROLLER
BOD33
DMA
3x TIMER / COUNTER
FOR CONTROL
WO0
WO1
WO0
WO1
PORT
SWCLK
CORTEX-M0+
PROCESSOR
Fmax 48 MHz
MICRO
TRACE BUFFER
IOBUS
PORT
4.
(2)
WOn
AIN[19..0]
DMA
20-CHANNEL
12-bit ADC 350KSPS
VREFA
VREFB
CMP[1..0]
2 ANALOG
COMPARATORS
GENERIC CLOCK
CONTROLLER
GCLK_IO[7..0]
REAL TIME
COUNTER
DMA
EXTINT[15..0]
NMI
VOUT
10-bit DAC
WATCHDOG
TIMER
EXTERNAL INTERRUPT
CONTROLLER
PERIPHERAL
TOUCH
CONTROLLER
DMA
INTER-IC
SOUND
CONTROLLER
1.
2.
AIN[3..0]
VREFA
X[15..0]
Y[15..0]
MCK[1..0]
SCK[1..0]
SD[1..0]
FS[1..0]
Some products have different number of SERCOM instances, Timer/Counter instances, PTC
signals and ADC signals. Refer to the Configuration Summary for details.
The three TCC instances have different configurations, including the number of Waveform Output
(WO) lines. Refer to the TCC Configuration for details.
Related Links
Configuration Summary
TCC Configurations
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 24
32-bit ARM-Based Microcontrollers
Pinout
5.1
SAM D21J
5.1.1
QFN64 / TQFP64
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PB03
PB02
PB01
PB00
PB31
PB30
PA31
PA30
VDDIN
VDDCORE
GND
PA28
RESET
PA27
PB23
PB22
5.
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VDDIO
GND
PA25
PA24
PA23
PA22
PA21
PA20
PB17
PB16
PA19
PA18
PA17
PA16
VDDIO
GND
PA08
PA09
PA10
PA11
VDDIO
GND
PB10
PB11
PB12
PB13
PB14
PB15
PA12
PA13
PA14
PA15
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PA00
PA01
PA02
PA03
PB04
PB05
GNDANA
VDDANA
PB06
PB07
PB08
PB09
PA04
PA05
PA06
PA07
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED OUTPUT SUPPLY
RESET PIN
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 25
32-bit ARM-Based Microcontrollers
5.1.2
UFBGA64
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 26
32-bit ARM-Based Microcontrollers
SAM D21G
5.2.1
QFN48 / TQFP48
48
47
46
45
44
43
42
41
40
39
38
37
PB03
PB02
PA31
PA30
VDDIN
VDDCORE
GND
PA28
RESET
PA27
PB23
PB22
5.2
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
VDDIO
GND
PA25
PA24
PA23
PA22
PA21
PA20
PA19
PA18
PA17
PA16
PA08
PA09
PA10
PA11
VDDIO
GND
PB10
PB11
PA12
PA13
PA14
PA15
13
14
15
16
17
18
19
20
21
22
23
24
PA00
PA01
PA02
PA03
GNDANA
VDDANA
PB08
PB09
PA04
PA05
PA06
PA07
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED OUTPUT SUPPLY
RESET PIN
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 27
32-bit ARM-Based Microcontrollers
5.2.2
WLCSP45
A
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 28
32-bit ARM-Based Microcontrollers
SAM D21E
5.3.1
QFN32 / TQFP32
32
31
30
29
28
27
26
25
PA31
PA30
VDDIN
VDDCORE
GND
PA28
RESET
PA27
5.3
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
PA25
PA24
PA23
PA22
PA19
PA18
PA17
PA16
VDDANA
GND
PA08
PA09
PA10
PA11
PA14
PA15
9
10
11
12
13
14
15
16
PA00
PA01
PA02
PA03
PA04
PA05
PA06
PA07
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED OUTPUT SUPPLY
RESET PIN
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 29
32-bit ARM-Based Microcontrollers
5.3.2
WLCSP35
A
1
0
PA
2
0
PA
B
D
GN
4
D
VD
VD
28
PA
27
PA
24
PA
2
03
PA
D
GN
2
PA
2
23
PA
4
0
PA
5
11
PA
17
PA
19
PA
7
08
PA
09
PA
1
PA
6
18
PA
0
D
GN
1
PA
4
1
PA
31
PA
0
PA
0
PA
6
0
PA
0
PA
6
VD
T
25
PA
AN
5
F
SE
1
A
E
E
RE
30
PA
AN
R
CO
D
D
GN
0
A
3
C
O
DI
© 2017 Microchip Technology Inc.
D
VD
N
DI
1
PA
5
Datasheet Complete
40001882A-page 30
32-bit ARM-Based Microcontrollers
6.
Signal Descriptions List
The following table gives details on signal names classified by peripheral.
Signal Name Function
Type
Active Level
Analog Comparators - AC
AIN[3:0]
AC Analog Inputs
Analog
CMP[:0]
AC Comparator Outputs
Digital
Analog Digital Converter - ADC
AIN[19:0]
ADC Analog Inputs
Analog
VREFA
ADC Voltage External Reference A
Analog
VREFB
ADC Voltage External Reference B
Analog
Digital Analog Converter - DAC
VOUT
DAC Voltage output
Analog
VREFA
DAC Voltage External Reference
Analog
External Interrupt Controller
EXTINT[15:0] External Interrupts
Input
NMI
Input
External Non-Maskable Interrupt
Generic Clock Generator - GCLK
GCLK_IO[7:0] Generic Clock (source clock or generic clock generator
output)
I/O
Inter-IC Sound Controller - I2S
MCK[1:0]
Master Clock
I/O
SCK[1:0]
Serial Clock
I/O
FS[1:0]
I2S Word Select or TDM Frame Sync
I/O
SD[1:0]
Serial Data Input or Output
I/O
Power Manager - PM
RESETN
Reset
Input
Low
Serial Communication Interface - SERCOMx
PAD[3:0]
SERCOM I/O Pads
I/O
System Control - SYSCTRL
XIN
Crystal Input
Analog/ Digital
XIN32
32kHz Crystal Input
Analog/ Digital
XOUT
Crystal Output
Analog
XOUT32
32kHz Crystal Output
Analog
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 31
32-bit ARM-Based Microcontrollers
Signal Name Function
Type
Active Level
Timer Counter - TCx
WO[1:0]
Waveform Outputs
Output
Timer Counter - TCCx
WO[1:0]
Waveform Outputs
Output
Peripheral Touch Controller - PTC
X[15:0]
PTC Input
Analog
Y[15:0]
PTC Input
Analog
General Purpose I/O - PORT
PA25 - PA00
Parallel I/O Controller I/O Port A
I/O
PA28 - PA27
Parallel I/O Controller I/O Port A
I/O
PA31 - PA30
Parallel I/O Controller I/O Port A
I/O
PB17 - PB00
Parallel I/O Controller I/O Port B
I/O
PB23 - PB22
Parallel I/O Controller I/O Port B
I/O
PB31 - PB30
Parallel I/O Controller I/O Port B
I/O
Universal Serial Bus - USB
DP
DP for USB
I/O
DM
DM for USB
I/O
SOF 1kHz
USB Start of Frame
I/O
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 32
32-bit ARM-Based Microcontrollers
7.
I/O Multiplexing and Considerations
7.1
Multiplexed Signals
Each pin is by default controlled by the PORT as a general purpose I/O and alternatively it can be
assigned to one of the peripheral functions A, B, C, D, E, F, G or H. To enable a peripheral function on a
pin, the Peripheral Multiplexer Enable bit in the Pin Configuration register corresponding to that pin
(PINCFGn.PMUXEN, n = 0-31) in the PORT must be written to one. The selection of peripheral function
A to H is done by writing to the Peripheral Multiplexing Odd and Even bits in the Peripheral Multiplexing
register (PMUXn.PMUXE/O) in the PORT.
This table describes the peripheral signals multiplexed to the PORT I/O pins.
Table 7-1. PORT Function Multiplexing
Pin(1)
SAMD21E
SAMD21G
I/O Pin
Supply
SAMD21J
B(2)(3)
A
EIC
REF
ADC
AC
PTC
DAC
C
D
E
F
G
H
SERCOM(2)(3)
SERCOM-ALT
TC(4)
TCC
COM
AC/
/TCC
1
1
1
PA00
VDDANA
EXTINT[0]
SERCOM1/
PAD[0]
TCC2/WO[0]
2
2
2
PA01
VDDANA
EXTINT[1]
SERCOM1/
PAD[1]
TCC2/WO[1]
3
3
3
PA02
VDDANA
EXTINT[2]
4
4
4
PA03
VDDANA
EXTINT[3]
ADC/
VREFA
DAC/
VREFA
AIN[0]
Y[0]
AIN[1]
Y[1]
Y[10]
VOUT
5
PB04
VDDANA
EXTINT[4]
AIN[12]
6
PB05
VDDANA
EXTINT[5]
AIN[13]
Y[11]
9
PB06
VDDANA
EXTINT[6]
AIN[14]
Y[12]
10
PB07
VDDANA
EXTINT[7]
AIN[15]
Y[13]
7
11
PB08
VDDANA
EXTINT[8]
AIN[2]
Y[14]
SERCOM4/
PAD[0]
TC4/WO[0]
8
12
PB09
VDDANA
EXTINT[9]
AIN[3]
Y[15]
SERCOM4/
PAD[1]
TC4/WO[1]
5
9
13
PA04
VDDANA
EXTINT[4]
6
10
14
PA05
VDDANA
7
11
15
PA06
8
12
16
11
13
12
AIN[4]
AIN[0]
Y[2]
SERCOM0/
PAD[0]
TCC0/WO[0]
EXTINT[5]
AIN[5]
AIN[1]
Y[3]
SERCOM0/
PAD[1]
TCC0/WO[1]
VDDANA
EXTINT[6]
AIN[6]
AIN[2]
Y[4]
SERCOM0/
PAD[2]
TCC1/WO[0]
PA07
VDDANA
EXTINT[7]
AIN[7]
AIN[3]
Y[5]
SERCOM0/
PAD[3]
TCC1/WO[1]
17
PA08
VDDIO
NMI
AIN[16]
X[0]
SERCOM0/
PAD[0]
SERCOM2/
PAD[0]
TCC0/WO[0]
TCC1/
WO[2]
I2S/SD[1]
14
18
PA09
VDDIO
EXTINT[9]
AIN[17]
X[1]
SERCOM0/
PAD[1]
SERCOM2/
PAD[1]
TCC0/WO[1]
TCC1/
WO[3]
I2S/
MCK[0]
13
15
19
PA10
VDDIO
EXTINT[10]
AIN[18]
X[2]
SERCOM0/
PAD[2]
SERCOM2/
PAD[2]
TCC1/WO[0]
TCC0/
WO[2]
I2S/
SCK[0]
GCLK_IO[4]
14
16
20
PA11
VDDIO
EXTINT[11]
AIN[19]
X[3]
SERCOM0/
PAD[3]
SERCOM2/
PAD[3]
TCC1/WO[1]
TCC0/
WO[3]
I2S/FS[0]
GCLK_IO[5]
19
23
PB10
VDDIO
EXTINT[10]
SERCOM4/
PAD[2]
TC5/WO[0]
TCC0/
WO[4]
I2S/
MCK[1]
GCLK_IO[4]
20
24
PB11
VDDIO
EXTINT[11]
SERCOM4/
PAD[3]
TC5/WO[1]
TCC0/
WO[5]
I2S/
SCK[1]
GCLK_IO[5]
25
PB12
VDDIO
EXTINT[12]
X[12]
SERCOM4/
PAD[0]
TC4/WO[0]
TCC0/
WO[6]
I2S/FS[1]
GCLK_IO[6]
26
PB13
VDDIO
EXTINT[13]
X[13]
SERCOM4/
PAD[1]
TC4/WO[1]
TCC0/
WO[7]
27
PB14
VDDIO
EXTINT[14]
X[14]
SERCOM4/
PAD[2]
TC5/WO[0]
© 2017 Microchip Technology Inc.
ADC/
VREFB
GCLK
Datasheet Complete
I2S/SD[0]
GCLK_IO[7]
GCLK_IO[0]
40001882A-page 33
32-bit ARM-Based Microcontrollers
Pin(1)
SAMD21E
SAMD21G
I/O Pin
Supply
SAMD21J
B(2)(3)
A
EIC
REF
ADC
AC
C
PTC
D
E
F
G
SERCOM-ALT
TC(4)
TCC
COM
AC/
/TCC
GCLK
TC5/WO[1]
GCLK_IO[1]
PB15
VDDIO
EXTINT[15]
21
29
PA12
VDDIO
EXTINT[12]
SERCOM2/
PAD[0]
SERCOM4/
PAD[0]
TCC2/WO[0]
TCC0/
WO[6]
AC/CMP[0]
22
30
PA13
VDDIO
EXTINT[13]
SERCOM2/
PAD[1]
SERCOM4/
PAD[1]
TCC2/WO[1]
TCC0/
WO[7]
AC/CMP[1]
15
23
31
PA14
VDDIO
EXTINT[14]
SERCOM2/
PAD[2]
SERCOM4/
PAD[2]
TC3/WO[0]
TCC0/
WO[4]
GCLK_IO[0]
16
24
32
PA15
VDDIO
EXTINT[15]
SERCOM2/
PAD[3]
SERCOM4/
PAD[3]
TC3/WO[1]
TCC0/
WO[5]
GCLK_IO[1]
17
25
35
PA16
VDDIO
EXTINT[0]
X[4]
SERCOM1/
PAD[0]
SERCOM3/
PAD[0]
TCC2/WO[0]
TCC0/
WO[6]
GCLK_IO[2]
18
26
36
PA17
VDDIO
EXTINT[1]
X[5]
SERCOM1/
PAD[1]
SERCOM3/
PAD[1]
TCC2/WO[1]
TCC0/
WO[7]
GCLK_IO[3]
19
27
37
PA18
VDDIO
EXTINT[2]
X[6]
SERCOM1/
PAD[2]
SERCOM3/
PAD[2]
TC3/WO[0]
TCC0/
WO[2]
AC/CMP[0]
20
28
38
PA19
VDDIO
EXTINT[3]
X[7]
SERCOM1/
PAD[3]
SERCOM3/
PAD[3]
TC3/WO[1]
TCC0/
WO[3]
I2S/SD[0]
AC/CMP[1]
39
PB16
VDDIO
EXTINT[0]
SERCOM5/
PAD[0]
TC6/WO[0]
TCC0/
WO[4]
I2S/SD[1]
GCLK_IO[2]
40
PB17
VDDIO
EXTINT[1]
SERCOM5/
PAD[1]
TC6/WO[1]
TCC0/
WO[5]
I2S/
MCK[0]
GCLK_IO[3]
29
41
PA20
VDDIO
EXTINT[4]
X[8]
SERCOM5/
PAD[2]
SERCOM3/
PAD[2]
TC7/WO[0]
TCC0/
WO[6]
I2S/
SCK[0]
GCLK_IO[4]
30
42
PA21
VDDIO
EXTINT[5]
X[9]
SERCOM5/
PAD[3]
SERCOM3/
PAD[3]
TC7/WO[1]
TCC0/
WO[7]
I2S/FS[0]
GCLK_IO[5]
21
31
43
PA22
VDDIO
EXTINT[6]
X[10]
SERCOM3/
PAD[0]
SERCOM5/
PAD[0]
TC4/WO[0]
TCC0/
WO[4]
22
32
44
PA23
VDDIO
EXTINT[7]
X[11]
SERCOM3/
PAD[1]
SERCOM5/
PAD[1]
TC4/WO[1]
TCC0/
WO[5]
USB/SOF
1kHz
23
33
45
PA24(6)
VDDIO
EXTINT[12]
SERCOM3/
PAD[2]
SERCOM5/
PAD[2]
TC5/WO[0]
TCC1/
WO[2]
USB/DM
24
34
46
PA25(6)
VDDIO
EXTINT[13]
SERCOM3/
PAD[3]
SERCOM5/
PAD[3]
TC5/WO[1]
TCC1/
WO[3]
USB/DP
37
49
PB22
VDDIO
EXTINT[6]
SERCOM5/
PAD[2]
TC7/WO[0]
GCLK_IO[0]
38
50
PB23
VDDIO
EXTINT[7]
SERCOM5/
PAD[3]
TC7/WO[1]
GCLK_IO[1]
25
39
51
PA27
VDDIO
EXTINT[15]
27
41
53
PA28
VDDIO
EXTINT[8]
31
45
57
PA30
VDDIO
EXTINT[10]
SERCOM1/
PAD[2]
TCC1/WO[0]
SWCLK
32
46
58
PA31
VDDIO
EXTINT[11]
SERCOM1/
PAD[3]
TCC1/WO[1]
SWDIO(5)
59
PB30
VDDIO
EXTINT[14]
SERCOM5/
PAD[0]
TCC0/WO[0]
TCC1/
WO[2]
60
PB31
VDDIO
EXTINT[15]
SERCOM5/
PAD[1]
TCC0/WO[1]
TCC1/
WO[3]
61
PB00
VDDANA
EXTINT[0]
AIN[8]
Y[6]
SERCOM5/
PAD[2]
TC7/WO[0]
62
PB01
VDDANA
EXTINT[1]
AIN[9]
Y[7]
SERCOM5/
PAD[3]
TC7/WO[1]
47
63
PB02
VDDANA
EXTINT[2]
AIN[10]
Y[8]
SERCOM5/
PAD[0]
TC6/WO[0]
48
64
PB03
VDDANA
EXTINT[3]
AIN[11]
Y[9]
SERCOM5/
PAD[1]
TC6/WO[1]
3.
SERCOM4/
PAD[3]
H
28
1.
2.
X[15]
DAC
SERCOM(2)(3)
GCLK_IO[6]
GCLK_IO[7]
GCLK_IO[0]
GCLK_IO[0]
GCLK_IO[0]
Use the SAMD21J pinout muxing for WLCSP45 package.
All analog pin functions are on peripheral function B. Peripheral function B must be selected to
disable the digital control of the pin.
Only some pins can be used in SERCOM I2C mode. Refer to SERCOM I2C Pins.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 34
32-bit ARM-Based Microcontrollers
4.
5.
6.
Note that TC6 and TC7 are not supported on the SAM D21E and G devices. Refer to Configuration
Summary for details.
This function is only activated in the presence of a debugger.
If the PA24 and PA25 pins are not connected, it is recommended to enable a pull-up on PA24 and
PA25 through input GPIO mode. The aim is to avoid an eventually extract power consumption
( MASK)
return 1;
return 0;
Dithering on Period
Writing DITHERCY in PER will lead to an average PWM period configured by the following formulas.
DITH4 mode:
��������� =
DITHERCY
1
+ PER
16
�GCLK_TCC
Note: If DITH4 mode is enabled, the last 4 significant bits from PER/CCx or COUNT register correspond
to the DITHERCY value, rest of the bits corresponds to PER/CCx or COUNT value.
DITH5 mode:
��������� =
DITHERCY
1
+ PER
32
�GCLK_TCC
��������� =
DITHERCY
1
+ PER
64
�GCLK_TCC
DITH6 mode:
Dithering on Pulse Width
Writing DITHERCY in CCx will lead to an average PWM pulse width configured by the following formula.
DITH4 mode:
������������ℎ =
DITHERCY
1
+ CCx
16
�GCLK_TCC
������������ℎ =
DITHERCY
1
+ CCx
32
�GCLK_TCC
������������ℎ =
DITHERCY
1
+ CCx
64
�GCLK_TCC
DITH5 mode:
DITH6 mode:
Note: The PWM period will remain static in this case.
31.6.3.4 Ramp Operations
Three ramp operation modes are supported. All of them require the timer/counter running in single-slope
PWM generation. The ramp mode is selected by writing to the Ramp Mode bits in the Waveform Control
register (WAVE.RAMP).
RAMP1 Operation
This is the default PWM operation, described in Single-Slope PWM Generation.
RAMP2 Operation
These operation modes are dedicated for power factor correction (PFC), Half-Bridge and Push-Pull
SMPS topologies, where two consecutive timer/counter cycles are interleaved, see Figure 31-18. In cycle
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 584
32-bit ARM-Based Microcontrollers
A, odd channel output is disabled, and in cycle B, even channel output is disabled. The ramp index
changes after each update, but can be software modified using the Ramp index command bits in Control
B Set register (CTRLBSET.IDXCMD).
Standard RAMP2 (RAMP2) Operation
Ramp A and B periods are controlled by the PER register value. The PER value can be different on each
ramp by the Circular Period buffer option in the Wave register (WAVE.CIPEREN=1). This mode uses a
two-channel TCC to generate two output signals, or one output signal with another CC channel enabled
in capture mode.
Figure 31-18. RAMP2 Standard Operation
Ramp
A
B
A
B
Retrigger
on
FaultA
TOP(B)
TOP(A)
CC0
TOP(B)
CIPEREN = 1
CC1
CC1
COUNT
"clear" update
"match"
CC0
ZERO
WO[0]
POL0 = 1
WO[1]
Keep on FaultB
POL1 = 1
FaultA input
FaultB input
Alternate RAMP2 (RAMP2A) Operation
Alternate RAMP2 operation is similar to RAMP2, but CC0 controls both WO[0] and WO[1] waveforms
when the corresponding circular buffer option is enabled (CIPEREN=1). The waveform polarity is the
same on both outputs. Channel 1 can be used in capture mode.
Figure 31-19. RAMP2 Alternate Operation
Ramp
A
B
A
TOP(B)
TOP(A)
B
Retrigger
on
FaultA
CC0(B)
COUNT
CC0(A)
"clear" update
"match"
TOP(B)
CIPEREN = 1
CC0(B)
CICCEN0 = 1
CC0(A)
ZERO
WO[0]
Keep on FaultB
WO[1]
POL0 = 1
FaultA input
FaultB input
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 585
32-bit ARM-Based Microcontrollers
31.6.3.5 Recoverable Faults
Recoverable faults can restart or halt the timer/counter. Two faults, called Fault A and Fault B, can trigger
recoverable fault actions on the compare channels CC0 and CC1 of the TCC. The compare channels'
outputs can be clamped to inactive state either as long as the fault condition is present, or from the first
valid fault condition detection on until the end of the timer/counter cycle.
Fault Inputs
The first two channel input events (TCCxMC0 and TCCxMC1) can be used as Fault A and Fault B inputs,
respectively. Event system channels connected to these fault inputs must be configured as
asynchronous. The TCC must work in a PWM mode.
Fault Filtering
There are three filters available for each input Fault A and Fault B. They are configured by the
corresponding Recoverable Fault n Configuration registers (FCTRLA and FCTRLB). The three filters can
either be used independently or in any combination.
Input
Filtering
By default, the event detection is asynchronous. When the event occurs, the fault system
will immediately and asynchronously perform the selected fault action on the compare
channel output, also in device power modes where the clock is not available. To avoid false
fault detection on external events (e.g. due to a glitch on an I/O port) a digital filter can be
enabled and configured by the Fault B Filter Value bits in the Fault n Configuration registers
(FCTRLn.FILTERVAL). If the event width is less than FILTERVAL (in clock cycles), the
event will be discarded. A valid event will be delayed by FILTERVAL clock cycles.
Fault
Blanking
This ignores any fault input for a certain time just after a selected waveform output edge.
This can be used to prevent false fault triggering due to signal bouncing, as shown in the
figure below. Blanking can be enabled by writing an edge triggering configuration to the
Fault n Blanking Mode bits in the Recoverable Fault n Configuration register
(FCTRLn.BLANK). The desired duration of the blanking must be written to the Fault n
Blanking Time bits (FCTRLn.BLANKVAL).
The blanking time tbis calculated by
�� =
1 + BLANKVAL
�GCLK_TCCx_PRESC
Here, fGCLK_TCCx_PRESC is the frequency of the prescaled peripheral clock frequency
fGCLK_TCCx.
The maximum blanking time (FCTRLn.BLANKVAL=
255) at fGCLK_TCCx=96MHz is 2.67µs (no prescaler) or 170µs (prescaling). For
fGCLK_TCCx=1MHz, the maximum blanking time is either 170µs (no prescaling) or 10.9ms
(prescaling enabled).
© 2017 Microchip Technology Inc.
Datasheet Complete
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32-bit ARM-Based Microcontrollers
Figure 31-20. Fault Blanking in RAMP1 Operation with Inverted Polarity
"clear" update
"match"
TOP
"Fault input enabled"
- "Fault input disabled"
CC0
x
"Fault discarded"
COUNT
ZERO
CMP0
FCTRLA.BLANKVAL = 0
FCTRLA.BLANKVAL > 0
FaultA Blanking
FCTRLA.BLANKVAL > 0
-
-
x
xxx
FaultA Input
WO[0]
Fault
Qualification
This is enabled by writing a '1' to the Fault n Qualification bit in the Recoverable Fault
n Configuration register (FCTRLn.QUAL). When the recoverable fault qualification is
enabled (FCTRLn.QUAL=1), the fault input is disabled all the time the corresponding
channel output has an inactive level, as shown in the figures below.
Figure 31-21. Fault Qualification in RAMP1 Operation
MAX
"clear" update
TOP
"match"
CC0
COUNT
"Fault input enabled"
- "Fault input disabled"
CC1
x
"Fault discarded"
ZERO
Fault A Input Qual
-
-
-
-
-
x x x
x x x x x x
Fault Input A
Fault B Input Qual
-
-
-
x x x
-
x x x x x
-
x x x x x x x
-
x x x x
Fault Input B
Figure 31-22. Fault Qualification in RAMP2 Operation with Inverted Polarity
Cycle
"clear" update
MAX
"match"
TOP
"Fault input enabled"
COUNT
CC0
- "Fault input disabled"
x
CC1
"Fault discarded"
ZERO
Fault A Input Qual
-
-
x
x
-
x
x
x
x
x
x
x
x
x
x
Fault Input A
-
Fault B Input Qual
x
x
x
x
x
-
x
x
x
x
x
x
x
x
x
-
x
Fault Input B
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 587
32-bit ARM-Based Microcontrollers
Fault Actions
Different fault actions can be configured individually for Fault A and Fault B. Most fault actions are not
mutually exclusive; hence two or more actions can be enabled at the same time to achieve a result that is
a combination of fault actions.
Keep
Action
This is enabled by writing the Fault n Keeper bit in the Recoverable Fault n Configuration
register (FCTRLn.KEEP) to '1'. When enabled, the corresponding channel output will be
clamped to zero as long as the fault condition is present. The clamp will be released on the
start of the first cycle after the fault condition is no longer present, see next Figure.
Figure 31-23. Waveform Generation with Fault Qualification and Keep Action
MAX
"clear" update
TOP
"match"
"Fault input enabled"
CC0
COUNT
- "Fault input disabled"
x
"Fault discarded"
ZERO
Fault A Input Qual
-
-
-
-
x
-
x
x
x
Fault Input A
WO[0]
Restart
Action
KEEP
KEEP
This is enabled by writing the Fault n Restart bit in Recoverable Fault n Configuration register
(FCTRLn.RESTART) to '1'. When enabled, the timer/counter will be restarted as soon as the
corresponding fault condition is present. The ongoing cycle is stopped and the timer/counter
starts a new cycle, see Figure 31-24. In Ramp 1 mode, when the new cycle starts, the
compare outputs will be clamped to inactive level as long as the fault condition is present.
Note: For RAMP2 operation, when a new timer/counter cycle starts the cycle index will
change automatically, see Figure 31-25. Fault A and Fault B are qualified only during the
cycle A and cycle B respectively: Fault A is disabled during cycle B, and Fault B is disabled
during cycle A.
Figure 31-24. Waveform Generation in RAMP1 mode with Restart Action
MAX
"clear" update
"match"
TOP
COUNT
CC0
CC1
ZERO
Restart
Restart
Fault Input A
WO[0]
WO[1]
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 588
32-bit ARM-Based Microcontrollers
Figure 31-25. Waveform Generation in RAMP2 mode with Restart Action
Cycle
CCx=ZERO
CCx=TOP
"clear" update
"match"
MAX
TOP
COUNT
CC0/CC1
ZERO
No fault A action
in cycle B
Restart
Fault Input A
WO[0]
WO[1]
Capture
Action
Several capture actions can be selected by writing the Fault n Capture Action bits in the
Fault n Control register (FCTRLn.CAPTURE). When one of the capture operations is
selected, the counter value is captured when the fault occurs. These capture operations are
available:
•
CAPT - the equivalent to a standard capture operation, for further details refer to
Capture Operations
•
CAPTMIN - gets the minimum time stamped value: on each new local minimum
captured value, an event or interrupt is issued.
•
CAPTMAX - gets the maximum time stamped value: on each new local maximum
captured value, an event or interrupt (IT) is issued, see Figure 31-26.
•
LOCMIN - notifies by event or interrupt when a local minimum captured value is
detected.
•
LOCMAX - notifies by event or interrupt when a local maximum captured value is
detected.
•
DERIV0 - notifies by event or interrupt when a local extreme captured value is
detected, see Figure 31-27.
CCx Content:
In CAPTMIN and CAPTMAX operations, CCx keeps the respective extremum captured
values, see Figure 31-26. In LOCMIN, LOCMAX or DERIV0 operation, CCx follows the
counter value at fault time, see Figure 31-27.
Before enabling CAPTMIN or CAPTMAX mode of capture, the user must initialize the
corresponding CCx register value to a value different from zero (for CAPTMIN) top (for
CAPTMAX). If the CCx register initial value is zero (for CAPTMIN) top (for CAPTMAX), no
captures will be performed using the corresponding channel.
MCx Behaviour:
In LOCMIN and LOCMAX operation, capture is performed on each capture event. The MCx
interrupt flag is set only when the captured value is upper or equal (for LOCMIN) or lower or
equal (for LOCMAX) to the previous captured value. So interrupt flag is set when a new
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relative local Minimum (for CAPTMIN) or Maximum (for CAPTMAX) value has been
detected. DERIV0 is equivalent to an OR function of (LOCMIN, LOCMAX).
In CAPT operation, capture is performed on each capture event. The MCx interrupt flag is
set on each new capture.
In CAPTMIN and CAPTMAX operation, capture is performed only when on capture event
time, the counter value is lower (for CAPTMIN) or upper (for CAPMAX) than the last
captured value. The MCx interrupt flag is set only when on capture event time, the counter
value is upper or equal (for CAPTMIN) or lower or equal (for CAPTMAX) to the value
captured on the previous event. So interrupt flag is set when a new absolute local Minimum
(for CAPTMIN) or Maximum (for CAPTMAX) value has been detected.
Interrupt Generation
In CAPT mode, an interrupt is generated on each filtered Fault n and each dedicated CCx
channel capture counter value. In other modes, an interrupt is only generated on an extreme
captured value.
Figure 31-26. Capture Action “CAPTMAX”
TOP
COUNT
"clear" update
"match"
CC0
ZERO
FaultA Input
CC0 Event/
Interrupt
Figure 31-27. Capture Action “DERIV0”
TOP
COUNT
"update"
"match"
CC0
ZERO
FaultA Input
CC0 Event/
Interrupt
Hardware
This is configured by writing 0x1 to the Fault n Halt mode bits in the Recoverable Fault n
Halt Action Configuration register (FCTRLn.HALT). When enabled, the timer/counter is halted and the
cycle is extended as long as the corresponding fault is present.
The next figure ('Waveform Generation with Halt and Restart Actions') shows an example
where both restart action and hardware halt action are enabled for Fault A. The compare
channel 0 output is clamped to inactive level as long as the timer/counter is halted. The
timer/counter resumes the counting operation as soon as the fault condition is no longer
present. As the restart action is enabled in this example, the timer/counter is restarted
after the fault condition is no longer present.
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The figure after that ('Waveform Generation with Fault Qualification, Halt, and Restart
Actions') shows a similar example, but with additionally enabled fault qualification. Here,
counting is resumed after the fault condition is no longer present.
Note that in RAMP2 and RAMP2A operations, when a new timer/counter cycle starts, the
cycle index will automatically change.
Figure 31-28. Waveform Generation with Halt and Restart Actions
MAX
"clear" update
"match"
TOP
COUNT
CC0
HALT
ZERO
Restart
Restart
Fault Input A
WO[0]
Figure 31-29. Waveform Generation with Fault Qualification, Halt, and Restart
Actions
MAX
"update"
"match"
TOP
COUNT
CC0
HALT
ZERO
Resume
Fault A Input Qual
-
-
-
-
x
x
-
x
Fault Input A
WO[0]
Software
Halt Action
KEEP
This is configured by writing 0x2 to the Fault n Halt mode bits in the Recoverable Fault n
configuration register (FCTRLn.HALT). Software halt action is similar to hardware halt
action, but in order to restart the timer/counter, the corresponding fault condition must not
be present anymore, and the corresponding FAULT n bit in the STATUS register must be
cleared by software.
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Figure 31-30. Waveform Generation with Software Halt, Fault Qualification, Keep and Restart
Actions
MAX
"update"
"match"
TOP
COUNT
CC0
HALT
ZERO
Restart
Fault A Input Qual
-
-
Restart
-
x
-
x
Fault Input A
Software Clear
WO[0]
KEEP
NO
KEEP
31.6.3.6 Non-Recoverable Faults
The non-recoverable fault action will force all the compare outputs to a pre-defined level programmed into
the Driver Control register (DRVCTRL.NRE and DRVCTRL.NRV). The non-recoverable fault input (EV0
and EV1) actions are enabled in Event Control register (EVCTRL.EVACT0 and EVCTRL.EVACT1).
To avoid false fault detection on external events (e.g. a glitch on an I/O port) a digital filter can be enabled
using Non-Recoverable Fault Input x Filter Value bits in the Driver Control register
(DRVCTRL.FILTERVALn). Therefore, the event detection is synchronous, and event action is delayed by
the selected digital filter value clock cycles.
When the Fault Detection on Debug Break Detection bit in Debug Control register (DGBCTRL.FDDBD) is
written to '1', a non-recoverable Debug Faults State and an interrupt (DFS) is generated when the system
goes in debug operation.
31.6.3.7 Waveform Extension
Figure 31-31 shows a schematic diagram of actions of the four optional units that follow the recoverable
fault stage on a port pin pair: Output Matrix (OTMX), Dead-Time Insertion (DTI), SWAP and Pattern
Generation. The DTI and SWAP units can be seen as a four port pair slices:
•
Slice 0 DTI0 / SWAP0 acting on port pins (WO[0], WO[WO_NUM/2 +0])
•
Slice 1 DTI1 / SWAP1 acting on port pins (WO[1], WO[WO_NUM/2 +1])
And more generally:
•
Slice n DTIx / SWAPx acting on port pins (WO[x], WO[WO_NUM/2 +x])
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Figure 31-31. Waveform Extension Stage Details
WEX
OTMX
PORTS
DTI
SWAP
OTMX[x+WO_NUM/2]
PATTERN
PGV[x+WO_NUM/2]
P[x+WO_NUM/2]
LS
OTMX
DTIx
PGO[x+WO_NUM/2]
DTIxEN
INV[x+WO_NUM/2]
SWAPx
PGO[x]
HS
INV[x]
P[x]
OTMX[x]
PGV[x]
The output matrix (OTMX) unit distributes compare channels, according to the selectable configurations
in Table 31-4.
Table 31-4. Output Matrix Channel Pin Routing Configuration
Value
OTMX[x]
0x0
CC3
CC2
CC1
CC0
CC3
CC2
CC1
CC0
0x1
CC1
CC0
CC1
CC0
CC1
CC0
CC1
CC0
0x2
CC0
CC0
CC0
CC0
CC0
CC0
CC0
CC0
0x3
CC1
CC1
CC1
CC1
CC1
CC1
CC1
CC0
Notes on Table 31-4:
•
Configuration 0x0 is the default configuration. The channel location is the default one, and channels
are distributed on outputs modulo the number of channels. Channel 0 is routed to the Output matrix
output OTMX[0], and Channel 1 to OTMX[1]. If there are more outputs than channels, then channel
0 is duplicated to the Output matrix output OTMX[CC_NUM], channel 1 to OTMX[CC_NUM+1] and
so on.
•
Configuration 0x1 distributes the channels on output modulo half the number of channels. This
assigns twice the number of output locations to the lower channels than the default configuration.
This can be used, for example, to control the four transistors of a full bridge using only two compare
channels.
Using pattern generation, some of these four outputs can be overwritten by a constant level,
enabling flexible drive of a full bridge in all quadrant configurations.
•
Configuration 0x2 distributes compare channel 0 (CC0) to all port pins. With pattern generation, this
configuration can control a stepper motor.
•
Configuration 0x3 distributes the compare channel CC0 to the first output, and the channel CC1 to
all other outputs. Together with pattern generation and the fault extension, this configuration can
control up to seven LED strings, with a boost stage.
Table
31-5. Example: four compare channels on four outputs
•
Value
OTMX[3]
OTMX[2]
OTMX[1]
OTMX[0]
0x0
CC3
CC2
CC1
CC0
0x1
CC1
CC0
CC1
CC0
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Value
OTMX[3]
OTMX[2]
OTMX[1]
OTMX[0]
0x2
CC0
CC0
CC0
CC0
0x3
CC1
CC1
CC1
CC0
The dead-time insertion (DTI) unit generates OFF time with the non-inverted low side (LS) and inverted
high side (HS) of the wave generator output forced at low level. This OFF time is called dead time. Deadtime insertion ensures that the LS and HS will never switch simultaneously.
The DTI stage consists of four equal dead-time insertion generators; one for each of the first four
compare channels. Figure 31-32 shows the block diagram of one DTI generator. The four channels have
a common register which controls the dead time, which is independent of high side and low side setting.
Figure 31-32. Dead-Time Generator Block Diagram
DTHS
DTLS
Dead Time Generator
LOAD
EN
Counter
=0
D
OTMX output
"DTLS"
Q
(To PORT)
"DTHS"
Edge Detect
(To PORT)
As shown in Figure 31-33, the 8-bit dead-time counter is decremented by one for each peripheral clock
cycle until it reaches zero. A non-zero counter value will force both the low side and high side outputs into
their OFF state. When the output matrix (OTMX) output changes, the dead-time counter is reloaded
according to the edge of the input. When the output changes from low to high (positive edge) it initiates a
counter reload of the DTLS register. When the output changes from high to low (negative edge) it reloads
the DTHS register.
Figure 31-33. Dead-Time Generator Timing Diagram
"dti_cnt"
T
tP
tDTILS
t DTIHS
"OTMX output"
"DTLS"
"DTHS"
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The pattern generator unit produces a synchronized bit pattern across the port pins it is connected to.
The pattern generation features are primarily intended for handling the commutation sequence in
brushless DC motors (BLDC), stepper motors, and full bridge control. See also Figure 31-34.
Figure 31-34. Pattern Generator Block Diagram
COUNT
UPDATE
BV
PGEB[7:0]
EN
BV
PGE[7:0]
PGVB[7:0]
EN
SWAP output
PGV[7:0]
WOx[7:0]
As with other double-buffered timer/counter registers, the register update is synchronized to the UPDATE
condition set by the timer/counter waveform generation operation. If synchronization is not required by
the application, the software can simply access directly the PATT.PGE, PATT.PGV bits registers.
31.6.4
DMA, Interrupts, and Events
Table 31-6. Module Requests for TCC
Condition
Interrupt
request
Event
output
Overflow / Underflow
Yes
Yes
Channel Compare
Match or Capture
Yes
Yes
Retrigger
Yes
Yes
Count
Yes
Yes
Capture Overflow Error
Yes
Debug Fault State
Yes
Recoverable Faults
Yes
Event
input
Yes(2)
DMA
request
DMA request is
cleared
Yes(1)
On DMA acknowledge
Yes(3)
For circular buffering:
on DMA acknowledge
For capture channel:
when CCx register is
read
Non-Recoverable Faults Yes
TCCx Event 0 input
Yes(4)
TCCx Event 1 input
Yes(5)
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Notes:
1. DMA request set on overflow, underflow or re-trigger conditions.
2. Can perform capture or generate recoverable fault on an event input.
3. In capture or circular modes.
4. On event input, either action can be executed:
– re-trigger counter
– control counter direction
– stop the counter
– decrement the counter
– perform period and pulse width capture
– generate non-recoverable fault
5. On event input, either action can be executed:
– re-trigger counter
–
–
–
–
–
increment or decrement counter depending on direction
start the counter
increment or decrement counter based on direction
increment counter regardless of direction
generate non-recoverable fault
31.6.4.1 DMA Operation
The TCC can generate the following DMA requests:
Counter
overflow
(OVF)
If the Ones-shot Trigger mode in the control A register (CTRLA.DMAOS) is written to '0',
the TCC generates a DMA request on each cycle when an update condition (overflow,
underflow or re-trigger) is detected.
When an update condition (overflow, underflow or re-trigger) is detected while
CTRLA.DMAOS=1, the TCC generates a DMA trigger on the cycle following the DMA
One-Shot Command written to the Control B register (CTRLBSET.CMD=DMAOS).
In both cases, the request is cleared by hardware on DMA acknowledge.
Channel
A DMA request is set only on a compare match if CTRLA.DMAOS=0. The request is
Match (MCx) cleared by hardware on DMA acknowledge.
When CTRLA.DMAOS=1, the DMA requests are not generated.
Channel
Capture
(MCx)
For a capture channel, the request is set when valid data is present in the CCx register,
and cleared once the CCx register is read.
In this operation mode, the CTRLA.DMAOS bit value is ignored.
DMA Operation with Circular Buffer
When circular buffer operation is enabled, the buffer registers must be written in a correct order and
synchronized to the update times of the timer. The DMA triggers of the TCC provide a way to ensure a
safe and correct update of circular buffers.
Note: Circular buffer are intended to be used with RAMP2, RAMP2A and DSBOTH operation only.
DMA Operation with Circular Buffer in RAMP and RAMP2A Mode
When a CCx channel is selected as a circular buffer, the related DMA request is not set on a compare
match detection, but on start of ramp B.
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If at least one circular buffer is enabled, the DMA overflow request is conditioned to the start of ramp A
with an effective DMA transfer on previous ramp B (DMA acknowledge).
The update of all circular buffer values for ramp A can be done through a DMA channel triggered on a MC
trigger. The update of all circular buffer values for ramp B, can be done through a second DMA channel
triggered by the overflow DMA request.
Figure 31-35. DMA Triggers in RAMP and RAMP2 Operation Mode and Circular Buffer Enabled
Ramp
Cycle
A
B
A
B
A
B
N-1
N-2
N
"update"
COUNT
ZERO
STATUS.IDX
DMA_CCx_req
DMA Channel i
Update ramp A
DMA_OVF_req
DMA Channel j
Update ramp B
DMA Operation with Circular Buffer in DSBOTH Mode
When a CC channel is selected as a circular buffer, the related DMA request is not set on a compare
match detection, but on start of down-counting phase.
If at least one circular buffer is enabled, the DMA overflow request is conditioned to the start of upcounting phase with an effective DMA transfer on previous down-counting phase (DMA acknowledge).
When up-counting, all circular buffer values can be updated through a DMA channel triggered by MC
trigger. When down-counting, all circular buffer values can be updated through a second DMA channel,
triggered by the OVF DMA request.
Figure 31-36. DMA Triggers in DSBOTH Operation Mode and Circular Buffer Enabled
Cycle
N-2
N
N-1
New Parameter Set
Old Parameter Set
"update"
COUNT
ZERO
CTRLB.DIR
DMA_CCx_req
DMA Channel i
Update Rising
DMA_OVF_req
DMA Channel j
Update Rising
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31.6.4.2 Interrupts
The TCC has the following interrupt sources:
•
•
•
•
•
•
•
•
Overflow/Underflow (OVF)
Retrigger (TRG)
Count (CNT) - refer also to description of EVCTRL.CNTSEL.
Capture Overflow Error (ERR)
Debug Fault State (DFS)
Recoverable Faults (FAULTn)
Non-recoverable Faults (FAULTx)
Compare Match or Capture Channels (MCx)
These interrupts are asynchronous wake-up sources. See Sleep Mode Entry and Exit Table in PM/Sleep
Mode Controller section for details.
Each interrupt source has an interrupt flag associated with it. The interrupt flag in the Interrupt Flag Status
and Clear (INTFLAG) register is set when the interrupt condition occurs. Each interrupt can be
individually enabled by writing a '1' to the corresponding bit in the Interrupt Enable Set (INTENSET)
register, and disabled by writing a '1' to the corresponding bit in the Interrupt Enable Clear (INTENCLR)
register. An interrupt request is generated when the interrupt flag is set and the corresponding interrupt is
enabled. The interrupt request remains active until the interrupt flag is cleared, the interrupt is disabled, or
the TCC is reset. See INTFLAG for details on how to clear interrupt flags. The TCC has one common
interrupt request line for all the interrupt sources. The user must read the INTFLAG register to determine
which interrupt condition is present.
Note: Interrupts must be globally enabled for interrupt requests to be generated. Refer to Nested Vector
Interrupt Controller for details.
Related Links
Nested Vector Interrupt Controller
Sleep Mode Controller
IDLE Mode
STANDBY Mode
31.6.4.3 Events
The TCC can generate the following output events:
•
Overflow/Underflow (OVF)
•
Trigger (TRG)
•
Counter (CNT) For further details, refer to EVCTRL.CNTSEL description.
•
Compare Match or Capture on compare/capture channels: MCx
Writing a '1' ('0') to an Event Output bit in the Event Control Register (EVCTRL.xxEO) enables (disables)
the corresponding output event. Refer also to EVSYS – Event System.
The TCC can take the following actions on a channel input event (MCx):
•
Capture event
•
Generate a recoverable or non-recoverable fault
The TCC can take the following actions on counter Event 1 (TCCx EV1):
•
Counter re-trigger
•
Counter direction control
•
Stop the counter
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•
•
•
Decrement the counter on event
Period and pulse width capture
Non-recoverable fault
The TCC can take the following actions on counter Event 0 (TCCx EV0):
•
Counter re-trigger
•
Count on event (increment or decrement, depending on counter direction)
•
Counter start - start counting on the event rising edge. Further events will not restart the counter;
the counter will keep on counting using prescaled GCLK_TCCx, until it reaches TOP or ZERO,
depending on the direction.
•
Counter increment on event. This will increment the counter, irrespective of the counter direction.
•
Count during active state of an asynchronous event (increment or decrement, depending on
counter direction). In this case, the counter will be incremented or decremented on each cycle of
the prescaled clock, as long as the event is active.
•
Non-recoverable fault
The counter Event Actions are available in the Event Control registers (EVCTRL.EVACT0 and
EVCTRL.EVACT1). For further details, refer to EVCTRL.
Writing a '1' ('0') to an Event Input bit in the Event Control register (EVCTRL.MCEIx or EVCTRL.TCEIx)
enables (disables) the corresponding action on input event.
Note: When several events are connected to the TCC, the enabled action will apply for each of the
incoming events. Refer to EVSYS – Event System for details on how to configure the event system.
Related Links
EVSYS – Event System
31.6.5
Sleep Mode Operation
The TCC can be configured to operate in any sleep mode. To be able to run in standby the RUNSTDBY
bit in the Control A register (CTRLA.RUNSTDBY) must be '1'. The MODULE can in any sleep mode wake
up the device using interrupts or perform actions through the Event System.
31.6.6
Synchronization
Due to asynchronicity between the main clock domain and the peripheral clock domains, some registers
need to be synchronized when written or read.
The following bits are synchronized when written:
•
Software Reset and Enable bits in Control A register (CTRLA.SWRST and CTRLA.ENABLE)
The following registers are synchronized when written:
•
•
•
•
•
•
•
Control B Clear and Control B Set registers (CTRLBCLR and CTRLBSET)
Status register (STATUS)
Pattern and Pattern Buffer registers (PATT and PATTB)
Waveform register (WAVE)
Count Value register (COUNT)
Period Value and Period Buffer Value registers (PER and PERB)
Compare/Capture Channel x and Channel x Compare/Capture Buffer Value registers (CCx and
CCBx)
The following registers are synchronized when read:
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•
•
•
•
•
•
Control B Clear and Control B Set registers (CTRLBCLR and CTRLBSET)
Count Value register (COUNT): synchronization is done on demand through READSYNC command
(CTRLBSET.CMD)
Pattern and Pattern Buffer registers (PATT and PATTB)
Waveform register (WAVE)
Period Value and Period Buffer Value registers (PER and PERB)
Compare/Capture Channel x and Channel x Compare/Capture Buffer Value registers (CCx and
CCBx)
Required write-synchronization is denoted by the "Write-Synchronized" property in the register
description.
Required read-synchronization is denoted by the "Read-Synchronized" property in the register
description.
Related Links
Register Synchronization
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31.7
Offset
Register Summary
Name
0x00
0x01
0x02
Bit Pos.
7:0
CTRLA
0x03
RESOLUTION[1:0]
15:8
ALOCK
ENABLE
PRESCYNC[1:0]
RUNSTDBY
SWRST
PRESCALER[2:0]
23:16
31:24
CPTEN3
CPTEN2
CPTEN1
CPTEN0
0x04
CTRLBCLR
7:0
CMD[2:0]
IDXCMD[1:0]
ONESHOT
LUPD
DIR
0x05
CTRLBSET
7:0
CMD[2:0]
IDXCMD[1:0]
ONESHOT
LUPD
DIR
CTRLB
ENABLE
SWRST
0x06
...
Reserved
0x07
0x08
0x09
0x0A
7:0
SYNCBUSY
0x0B
7:0
15:8
FCTRLA
31:24
0x10
7:0
FCTRLB
0x13
STATUS
CC3
CC2
CC1
CC0
CCB3
CCB2
CCB1
CCB0
PERB
WAVEB
PATTB
QUAL
KEEP
RESTART
BLANK[1:0]
CAPTURE[2:0]
BLANK[1:0]
QUAL
KEEP
CAPTURE[2:0]
7:0
WEXCTRL
CHSEL[1:0]
OTMX[1:0]
DTIEN3
23:16
DTLS[7:0]
31:24
DTHS[7:0]
0x18
7:0
0x19
DRVCTRL
0x1B
HALT[1:0]
FILTERVAL[3:0]
0x17
0x1A
SRC[1:0]
BLANKVAL[7:0]
31:24
15:8
HALT[1:0]
FILTERVAL[3:0]
RESTART
15:8
0x15
SRC[1:0]
CHSEL[1:0]
BLANKVAL[7:0]
23:16
0x14
0x16
COUNT
23:16
0x0F
0x11
PATT
31:24
0x0D
0x12
WAVE
15:8
23:16
0x0C
0x0E
PER
NRE7
NRE6
NRE5
NRE4
NRE3
DTIEN2
DTIEN1
DTIEN0
NRE2
NRE1
NRE0
15:8
NRV7
NRV6
NRV5
NRV4
NRV3
NRV2
NRV1
NRV0
23:16
INVEN7
INVEN6
INVEN5
INVEN4
INVEN3
INVEN2
INVEN1
INVEN0
31:24
FILTERVAL1[3:0]
FILTERVAL0[3:0]
0x1C
...
Reserved
0x1D
0x1E
DBGCTRL
0x1F
Reserved
0x20
0x21
7:0
FDDBD
7:0
CNTEO
TRGEO
OVFEO
MCEI2
MCEI1
MCEI0
0x23
31:24
MCEO3
MCEO2
MCEO1
MCEO0
0x24
7:0
ERR
CNT
TRG
OVF
0x25
15:8
MC2
MC1
MC0
0x26
0x27
INTENCLR
FAULT1
TCEI0
FAULT0
TCINV1
EVACT0[2:0]
MCEI3
EVCTRL
TCEI1
EVACT1[2:0]
23:16
0x22
15:8
CNTSEL[1:0]
DBGRUN
FAULTB
TCINV0
FAULTA
23:16
DFS
MC3
31:24
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Offset
Name
0x28
0x29
0x2A
Bit Pos.
7:0
INTENSET
0x2B
15:8
FAULT1
FAULT0
FAULTB
7:0
15:8
INTFLAG
FAULT1
FAULT0
FAULTB
OVF
MC3
MC2
MC1
MC0
ERR
CNT
TRG
OVF
MC2
MC1
MC0
IDX
STOP
DFS
DFS
MC3
31:24
0x30
7:0
PERBV
WAVEBV
PATTBV
15:8
FAULT1
FAULT0
FAULTB
STATUS
FAULTA
23:16
0x2F
0x32
TRG
31:24
0x2D
0x31
CNT
FAULTA
23:16
0x2C
0x2E
ERR
DFS
FAULTA
23:16
FAULT1IN
FAULT0IN
FAULTBIN
FAULTAIN
CCBV3
CCBV2
CCBV1
CCBV0
CMP3
CMP2
CMP1
CMP0
0x33
31:24
0x34
7:0
COUNT[7:0]
15:8
COUNT[15:8]
23:16
COUNT[23:16]
0x35
0x36
COUNT
0x37
0x38
0x39
31:24
PATT
7:0
PGE0[7:0]
15:8
PGV0[7:0]
0x3A
...
Reserved
0x3B
0x3C
7:0
0x3D
15:8
0x3E
WAVE
0x3F
CIPEREN
RAMP[1:0]
WAVEGEN[2:0]
CICCEN3
POL3
POL2
POL1
POL0
SWAP3
SWAP2
SWAP1
SWAP0
7:0
15:8
PER[9:2]
23:16
PER[17:10]
0x43
PER[1:0]
DITHER[5:0]
31:24
0x44
7:0
0x45
15:8
CC[9:2]
23:16
CC[17:10]
0x46
CC0
0x47
CC[1:0]
DITHER[5:0]
31:24
0x48
7:0
0x49
15:8
CC[9:2]
23:16
CC[17:10]
0x4A
CC1
0x4B
CC[1:0]
DITHER[5:0]
31:24
0x4C
7:0
0x4D
15:8
CC[9:2]
23:16
CC[17:10]
0x4E
CC2
0x4F
CC[1:0]
DITHER[5:0]
31:24
0x50
7:0
0x51
15:8
CC[9:2]
23:16
CC[17:10]
0x52
0x53
CICCEN0
23:16
0x41
PER
CICCEN1
31:24
0x40
0x42
CICCEN2
CC3
CC[1:0]
DITHER[5:0]
31:24
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32-bit ARM-Based Microcontrollers
Offset
Name
Bit Pos.
0x54
...
Reserved
0x63
0x64
0x65
PATTB
7:0
PGEB0[7:0]
15:8
PGVB0[7:0]
0x66
...
Reserved
0x67
0x68
7:0
0x69
15:8
0x6A
WAVEB
CIPERENB
RAMPB[1:0]
WAVEGENB[2:0]
CICCENB3
CICCENB2
CICCENB1
CICCENB0
23:16
POLB3
POLB2
POLB1
POLB0
0x6B
31:24
SWAPB 3
SWAPB 2
SWAPB 1
SWAPB 0
0x6C
7:0
0x6D
0x6E
PERB
0x6F
PERB[1:0]
DITHERB[5:0]
15:8
PERB[9:2]
23:16
PERB[17:10]
31:24
0x70
7:0
0x71
15:8
CCB[9:2]
23:16
CCB[17:10]
0x72
CCB0
0x73
31:24
0x74
7:0
0x75
0x76
CCB1
0x77
CCB[1:0]
DITHERB[5:0]
CCB[1:0]
DITHERB[5:0]
15:8
CCB[9:2]
23:16
CCB[17:10]
31:24
0x78
7:0
0x79
15:8
CCB[9:2]
23:16
CCB[17:10]
0x7A
CCB2
0x7B
31:24
0x7C
7:0
0x7D
0x7E
CCB3
0x7F
31.8
CCB[1:0]
DITHERB[5:0]
CCB[1:0]
DITHERB[5:0]
15:8
CCB[9:2]
23:16
CCB[17:10]
31:24
Register Description
Registers can be 8, 16, or 32 bits wide. Atomic 8-, 16-, and 32-bit accesses are supported. In addition,
the 8-bit quarters and 16-bit halves of a 32-bit register, and the 8-bit halves of a 16-bit register can be
accessed directly.
Some registers require synchronization when read and/or written. Synchronization is denoted by the
"Read-Synchronized" and/or "Write-Synchronized" property in each individual register description.
Optional write-protection by the Peripheral Access Controller (PAC) is denoted by the "PAC WriteProtection" property in each individual register description.
Some registers are enable-protected, meaning they can only be written when the module is disabled.
Enable-protection is denoted by the "Enable-Protected" property in each individual register description.
31.8.1
Control A
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32-bit ARM-Based Microcontrollers
Name: CTRLA
Offset: 0x00
Reset: 0x00000000
Property: PAC Write-Protection, Enable-Protected, Write-Synchronized (ENABLE, SWRST)
Bit
31
30
29
28
Access
Reset
Bit
27
26
25
24
CPTEN3
CPTEN2
CPTEN1
CPTEN0
R/W
R/W
R/W
R/W
0
0
0
0
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
Access
Reset
Bit
ALOCK
Access
Reset
Bit
7
PRESCYNC[1:0]
RUNSTDBY
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
6
5
4
3
2
RESOLUTION[1:0]
Access
Reset
PRESCALER[2:0]
R/W
1
0
ENABLE
SWRST
R/W
R/W
R/W
R/W
0
0
0
0
Bits 24, 25, 26, 27 – CPTEN0, CPTEN1, CPTEN2, CPTEN3: Capture Channel x Enable
These bits are used to select the capture or compare operation on channel x.
Writing a '1' to CPTENx enables capture on channel x.
Writing a '0' to CPTENx disables capture on channel x.
Bit 14 – ALOCK: Auto Lock
This bit is not synchronized.
Value
0
1
Description
The Lock Update bit in the Control B register (CTRLB.LUPD) is not affected by overflow/
underflow, and re-trigger events
CTRLB.LUPD is set to '1' on each overflow/underflow or re-trigger event.
Bits 13:12 – PRESCYNC[1:0]: Prescaler and Counter Synchronization
These bits select if on re-trigger event, the Counter is cleared or reloaded on either the next GCLK_TCCx
clock, or on the next prescaled GCLK_TCCx clock. It is also possible to reset the prescaler on re-trigger
event.
These bits are not synchronized.
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32-bit ARM-Based Microcontrollers
Value
Name
Description
Counter Reloaded
Prescaler
0x0
GCLK
Reload or reset Counter on next
GCLK
-
0x1
PRESC
Reload or reset Counter on next
prescaler clock
-
0x2
RESYNC
Reload or reset Counter on next
GCLK
Reset prescaler counter
0x3
Reserved
Bit 11 – RUNSTDBY: Run in Standby
This bit is used to keep the TCC running in standby mode.
This bit is not synchronized.
Value
0
1
Description
The TCC is halted in standby.
The TCC continues to run in standby.
Bits 10:8 – PRESCALER[2:0]: Prescaler
These bits select the Counter prescaler factor.
These bits are not synchronized.
Value
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
Name
DIV1
DIV2
DIV4
DIV8
DIV16
DIV64
DIV256
DIV1024
Description
Prescaler: GCLK_TCC
Prescaler: GCLK_TCC/2
Prescaler: GCLK_TCC/4
Prescaler: GCLK_TCC/8
Prescaler: GCLK_TCC/16
Prescaler: GCLK_TCC/64
Prescaler: GCLK_TCC/256
Prescaler: GCLK_TCC/1024
Bits 6:5 – RESOLUTION[1:0]: Dithering Resolution
These bits increase the TCC resolution by enabling the dithering options.
These bits are not synchronized.
Table 31-7. Dithering
Value
Name
Description
0x0
NONE
The dithering is disabled.
0x1
DITH4
Dithering is done every 16 PWM frames.
PER[3:0] and CCx[3:0] contain dithering pattern
selection.
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Value
Name
Description
0x2
DITH5
Dithering is done every 32 PWM frames.
PER[4:0] and CCx[4:0] contain dithering pattern
selection.
0x3
DITH6
Dithering is done every 64 PWM frames.
PER[5:0] and CCx[5:0] contain dithering pattern
selection.
Bit 1 – ENABLE: Enable
Due to synchronization there is delay from writing CTRLA.ENABLE until the peripheral is enabled/
disabled. The value written to CTRLA.ENABLE will read back immediately and the ENABLE bit in the
SYNCBUSY register (SYNCBUSY.ENABLE) will be set. SYNCBUSY.ENABLE will be cleared when the
operation is complete.
Value
0
1
Description
The peripheral is disabled.
The peripheral is enabled.
Bit 0 – SWRST: Software Reset
Writing a '0' to this bit has no effect.
Writing a '1' to this bit resets all registers in the TCC (except DBGCTRL) to their initial state, and the TCC
will be disabled.
Writing a '1' to CTRLA.SWRST will always take precedence; all other writes in the same write-operation
will be discarded.
Due to synchronization there is a delay from writing CTRLA.SWRST until the reset is complete.
CTRLA.SWRST and SYNCBUSY.SWRST will both be cleared when the reset is complete.
Value
0
1
31.8.2
Description
There is no reset operation ongoing.
The reset operation is ongoing.
Control B Clear
This register allows the user to change this register without doing a read-modify-write operation. Changes
in this register will also be reflected in the Control B Set (CTRLBSET) register.
Name: CTRLBCLR
Offset: 0x04
Reset: 0x00
Property: PAC Write-Protection, Write-Synchronized, Read-Synchronized
Bit
7
6
5
4
CMD[2:0]
Access
Reset
3
IDXCMD[1:0]
2
1
0
ONESHOT
LUPD
DIR
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
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Bits 7:5 – CMD[2:0]: TCC Command
These bits can be used for software control of re-triggering and stop commands of the TCC. When a
command has been executed, the CMD bit field will read back zero. The commands are executed on the
next prescaled GCLK_TCC clock cycle.
Writing zero to this bit group has no effect.
Writing a '1' to any of these bits will clear the pending command.
Value
0x0
0x1
0x2
0x3
0x4
Name
NONE
RETRIGGER
STOP
UPDATE
READSYNC
Description
No action
Clear start, restart or retrigger
Force stop
Force update of double buffered registers
Force COUNT read synchronization
Bits 4:3 – IDXCMD[1:0]: Ramp Index Command
These bits can be used to force cycle A and cycle B changes in RAMP2 and RAMP2A operation. On
timer/counter update condition, the command is executed, the IDX flag in STATUS register is updated
and the IDXCMD command is cleared.
Writing zero to these bits has no effect.
Writing a '1' to any of these bits will clear the pending command.
Value
0x0
0x1
0x2
0x3
Name
DISABLE
SET
CLEAR
HOLD
Description
DISABLE Command disabled: IDX toggles between cycles A and B
Set IDX: cycle B will be forced in the next cycle
Clear IDX: cycle A will be forced in next cycle
Hold IDX: the next cycle will be the same as the current cycle.
Bit 2 – ONESHOT: One-Shot
This bit controls one-shot operation of the TCC. When one-shot operation is enabled, the TCC will stop
counting on the next overflow/underflow condition or on a stop command.
Writing a '0' to this bit has no effect
Writing a '1' to this bit will disable the one-shot operation.
Value
0
1
Description
The TCC will update the counter value on overflow/underflow condition and continue
operation.
The TCC will stop counting on the next underflow/overflow condition.
Bit 1 – LUPD: Lock Update
This bit controls the update operation of the TCC buffered registers.
When CTRLB.LUPD is set, no any update of the registers with value of its buffered register is performed
on hardware UPDATE condition. Locking the update ensures that all buffer registers are valid before an
hardware update is performed. After all the buffer registers are loaded correctly, the buffered registers
can be unlocked.
This bit has no effect when input capture operation is enabled.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will enable updating.
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Value
0
1
Description
The CCBx, PERB, PGVB, PGOB, and SWAPBx buffer registers values are copied into the
corresponding CCx, PER, PGV, PGO and SWAPx registers on hardware update condition.
The CCBx, PERB, PGVB, PGOB, and SWAPBx buffer registers values are not copied into
the corresponding CCx, PER, PGV, PGO and SWAPx registers on hardware update
condition.
Bit 0 – DIR: Counter Direction
This bit is used to change the direction of the counter.
Writing a '0' to this bit has no effect
Writing a '1' to this bit will clear the bit and make the counter count up.
Value
0
1
31.8.3
Description
The timer/counter is counting up (incrementing).
The timer/counter is counting down (decrementing).
Control B Set
This register allows the user to change this register without doing a read-modify-write operation. Changes
in this register will also be reflected in the Control B Set (CTRLBCLR) register.
Name: CTRLBSET
Offset: 0x05
Reset: 0x00
Property: PAC Write-Protection, Write-Synchronized, Read-Synchronized
Bit
7
6
5
4
CMD[2:0]
Access
Reset
3
IDXCMD[1:0]
2
1
0
ONESHOT
LUPD
DIR
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 7:5 – CMD[2:0]: TCC Command
These bits can be used for software control of re-triggering and stop commands of the TCC. When a
command has been executed, the CMD bit field will be read back as zero. The commands are executed
on the next prescaled GCLK_TCC clock cycle.
Writing zero to this bit group has no effect
Writing a valid value to this bit group will set the associated command.
Value
0x0
0x1
0x2
0x3
0x4
Name
NONE
RETRIGGER
STOP
UPDATE
READSYNC
Description
No action
Force start, restart or retrigger
Force stop
Force update of double buffered registers
Force a read synchronization of COUNT
Bits 4:3 – IDXCMD[1:0]: Ramp Index Command
These bits can be used to force cycle A and cycle B changes in RAMP2 and RAMP2A operation. On
timer/counter update condition, the command is executed, the IDX flag in STATUS register is updated
and the IDXCMD command is cleared.
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Writing a zero to these bits has no effect.
Writing a valid value to these bits will set a command.
Value
0x0
0x1
0x2
0x3
Name
DISABLE
SET
CLEAR
HOLD
Description
Command disabled: IDX toggles between cycles A and B
Set IDX: cycle B will be forced in the next cycle
Clear IDX: cycle A will be forced in next cycle
Hold IDX: the next cycle will be the same as the current cycle.
Bit 2 – ONESHOT: One-Shot
This bit controls one-shot operation of the TCC. When in one-shot operation, the TCC will stop counting
on the next overflow/underflow condition or a stop command.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will enable the one-shot operation.
Value
0
1
Description
The TCC will count continuously.
The TCC will stop counting on the next underflow/overflow condition.
Bit 1 – LUPD: Lock Update
This bit controls the update operation of the TCC buffered registers.
When CTRLB.LUPD is set, no any update of the registers with value of its buffered register is performed
on hardware UPDATE condition. Locking the update ensures that all buffer registers are valid before an
hardware update is performed. After all the buffer registers are loaded correctly, the buffered registers
can be unlocked.
This bit has no effect when input capture operation is enabled.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will lock updating.
Value
0
1
Description
The CCBx, PERB, PGVB, PGOB, and SWAPBx buffer registers values are copied into the
corresponding CCx, PER, PGV, PGO and SWAPx registers on hardware update condition.
The CCBx, PERB, PGVB, PGOB, and SWAPBx buffer registers values are not copied into
CCx, PER, PGV, PGO and SWAPx registers on hardware update condition.
Bit 0 – DIR: Counter Direction
This bit is used to change the direction of the counter.
Writing a '0' to this bit has no effect
Writing a '1' to this bit will clear the bit and make the counter count up.
Value
0
1
31.8.4
Description
The timer/counter is counting up (incrementing).
The timer/counter is counting down (decrementing).
Synchronization Busy
Name: SYNCBUSY
Offset: 0x08
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Reset: 0x00000000
Property:
Bit
31
30
29
28
27
26
25
24
Access
Reset
Bit
22
21
20
19
18
17
16
CCB3
CCB2
CCB1
CCB0
PERB
WAVEB
PATTB
Access
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
14
13
12
Bit
23
11
10
9
8
CC3
CC2
CC1
CC0
Access
R
R
R
R
Reset
0
0
0
0
Bit
15
7
6
5
4
3
2
1
0
PER
WAVE
PATT
COUNT
STATUS
CTRLB
ENABLE
SWRST
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bits 19, 20, 21, 22 – CCBn: Compare/Capture Buffer Channel x Synchronization Busy
This bit is cleared when the synchronization of Compare/Capture Buffer Channel x register between the
clock domains is complete.
This bit is set when the synchronization of Compare/Capture Buffer Channel x register between clock
domains is started.
CCBx bit is available only for existing Compare/Capture Channels. For details on CC channels number,
refer to each TCC feature list.
Bit 18 – PERB: PER Buffer Synchronization Busy
This bit is cleared when the synchronization of PERB register between the clock domains is complete.
This bit is set when the synchronization of PERB register between clock domains is started.
Bit 17 – WAVEB: WAVE Buffer Synchronization Busy
This bit is cleared when the synchronization of WAVEB register between the clock domains is complete.
This bit is set when the synchronization of WAVEB register between clock domains is started.
Bit 16 – PATTB: PATT Buffer Synchronization Busy
This bit is cleared when the synchronization of PATTB register between the clock domains is complete.
This bit is set when the synchronization of PATTB register between clock domains is started.
Bits 8, 9, 10, 11 – CCn: Compare/Capture Channel x Synchronization Busy
This bit is cleared when the synchronization of Compare/Capture Channel x register between the clock
domains is complete.
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This bit is set when the synchronization of Compare/Capture Channel x register between clock domains
is started.
CCx bit is available only for existing Compare/Capture Channels. For details on CC channels number,
refer to each TCC feature list.
This bit is set when the synchronization of CCx register between clock domains is started.
Bit 7 – PER: PER Synchronization Busy
This bit is cleared when the synchronization of PER register between the clock domains is complete.
This bit is set when the synchronization of PER register between clock domains is started.
Bit 6 – WAVE: WAVE Synchronization Busy
This bit is cleared when the synchronization of WAVE register between the clock domains is complete.
This bit is set when the synchronization of WAVE register between clock domains is started.
Bit 5 – PATT: PATT Synchronization Busy
This bit is cleared when the synchronization of PATTERN register between the clock domains is
complete.
This bit is set when the synchronization of PATTERN register between clock domains is started.
Bit 4 – COUNT: COUNT Synchronization Busy
This bit is cleared when the synchronization of COUNT register between the clock domains is complete.
This bit is set when the synchronization of COUNT register between clock domains is started.
Bit 3 – STATUS: STATUS Synchronization Busy
This bit is cleared when the synchronization of STATUS register between the clock domains is complete.
This bit is set when the synchronization of STATUS register between clock domains is started.
Bit 2 – CTRLB: CTRLB Synchronization Busy
This bit is cleared when the synchronization of CTRLB register between the clock domains is complete.
This bit is set when the synchronization of CTRLB register between clock domains is started.
Bit 1 – ENABLE: ENABLE Synchronization Busy
This bit is cleared when the synchronization of ENABLE bit between the clock domains is complete.
This bit is set when the synchronization of ENABLE bit between clock domains is started.
Bit 0 – SWRST: SWRST Synchronization Busy
This bit is cleared when the synchronization of SWRST bit between the clock domains is complete.
This bit is set when the synchronization of SWRST bit between clock domains is started.
31.8.5
Fault Control A and B
Name: FCTRLA, FCTRLB
Offset: 0x0C + n*0x04 [n=0..1]
Reset: 0x00000000
Property: PAC Write-Protection, Enable-Protected
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32-bit ARM-Based Microcontrollers
Bit
31
30
29
28
27
26
25
24
FILTERVAL[3:0]
Access
Reset
Bit
23
22
21
20
R/W
R/W
R/W
R/W
0
0
0
0
19
18
17
16
BLANKVAL[7:0]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
CAPTURE[2:0]
Access
Reset
Bit
7
8
HALT[1:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
6
5
4
3
2
1
0
RESTART
Access
CHSEL[1:0]
QUAL
KEEP
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Reset
BLANK[1:0]
SRC[1:0]
Bits 27:24 – FILTERVAL[3:0]: Recoverable Fault n Filter Value
These bits define the filter value applied on MCEx (x=0,1) event input line. The value must be set to zero
when MCEx event is used as synchronous event.
Bits 23:16 – BLANKVAL[7:0]: Recoverable Fault n Blanking Value
These bits determine the duration of the blanking of the fault input source. Activation and edge selection
of the blank filtering are done by the BLANK bits (FCTRLn.BLANK).
When enabled, the fault input source is internally disabled for BLANKVAL* prescaled GCLK_TCC periods
after the detection of the waveform edge.
Bits 14:12 – CAPTURE[2:0]: Recoverable Fault n Capture Action
These bits select the capture and Fault n interrupt/event conditions.
Table 31-8. Fault n Capture Action
Value
0x0
0x1
Name
Description
DISABLE Capture on valid recoverable Fault n is disabled
CAPT
On rising edge of a valid recoverable Fault n, capture counter value on channel
selected by CHSEL[1:0].
INTFLAG.FAULTn flag rises on each new captured value.
0x2
CAPTMIN On rising edge of a valid recoverable Fault n, capture counter value on channel
selected by CHSEL[1:0], if COUNT value is lower than the last stored capture value
(CC).
INTFLAG.FAULTn flag rises on each local minimum detection.
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Value
0x3
Name
Description
CAPTMAX On rising edge of a valid recoverable Fault n, capture counter value on channel
selected by CHSEL[1:0], if COUNT value is higher than the last stored capture value
(CC).
INTFLAG.FAULTn flag rises on each local maximun detection.
0x4
LOCMIN
On rising edge of a valid recoverable Fault n, capture counter value on channel
selected by CHSEL[1:0].
INTFLAG.FAULTn flag rises on each local minimum value detection.
0x5
LOCMAX On rising edge of a valid recoverable Fault n, capture counter value on channel
selected by CHSEL[1:0].
INTFLAG.FAULTn flag rises on each local maximun detection.
0x6
DERIV0
On rising edge of a valid recoverable Fault n, capture counter value on channel
selected by CHSEL[1:0].
INTFLAG.FAULTn flag rises on each local maximun or minimum detection.
Bits 11:10 – CHSEL[1:0]: Recoverable Fault n Capture Channel
These bits select the channel for capture operation triggered by recoverable Fault n.
Value
0x0
0x1
0x2
0x3
Name
CC0
CC1
CC2
CC3
Description
Capture value stored into CC0
Capture value stored into CC1
Capture value stored into CC2
Capture value stored into CC3
Bits 9:8 – HALT[1:0]: Recoverable Fault n Halt Operation
These bits select the halt action for recoverable Fault n.
Value
0x0
0x1
0x2
0x3
Name
DISABLE
HW
SW
NR
Description
Halt action disabled
Hardware halt action
Software halt action
Non-recoverable fault
Bit 7 – RESTART: Recoverable Fault n Restart
Setting this bit enables restart action for Fault n.
Value
0
1
Description
Fault n restart action is disabled.
Fault n restart action is enabled.
Bits 6:5 – BLANK[1:0]: Recoverable Fault n Blanking Operation
These bits, select the blanking start point for recoverable Fault n.
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Value
0x0
0x1
0x2
0x3
Name
START
RISE
FALL
BOTH
Description
Blanking applied from start of the Ramp period
Blanking applied from rising edge of the waveform output
Blanking applied from falling edge of the waveform output
Blanking applied from each toggle of the waveform output
Bit 4 – QUAL: Recoverable Fault n Qualification
Setting this bit enables the recoverable Fault n input qualification.
Value
0
1
Description
The recoverable Fault n input is not disabled on CMPx value condition.
The recoverable Fault n input is disabled when output signal is at inactive level (CMPx == 0).
Bit 3 – KEEP: Recoverable Fault n Keep
Setting this bit enables the Fault n keep action.
Value
0
1
Description
The Fault n state is released as soon as the recoverable Fault n is released.
The Fault n state is released at the end of TCC cycle.
Bits 1:0 – SRC[1:0]: Recoverable Fault n Source
These bits select the TCC event input for recoverable Fault n.
Event system channel connected to MCEx event input, must be configured to route the event
asynchronously, when used as a recoverable Fault n input.
Value
0x0
0x1
0x2
0x3
31.8.6
Name
DISABLE
ENABLE
INVERT
ALTFAULT
Description
Fault input disabled
MCEx (x=0,1) event input
Inverted MCEx (x=0,1) event input
Alternate fault (A or B) state at the end of the previous period.
Waveform Extension Control
Name: WEXCTRL
Offset: 0x14
Reset: 0x00000000
Property: PAC Write-Protection, Enable-Protected
Bit
31
30
29
28
27
26
25
24
R/W
R/W
R/W
R/W
Reset
0
0
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bit
23
22
21
20
19
18
17
16
DTHS[7:0]
Access
DTLS[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
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Bit
15
14
13
12
Access
Reset
Bit
7
6
5
4
11
10
9
8
DTIEN3
DTIEN2
DTIEN1
DTIEN0
R/W
R/W
R/W
R/W
0
0
0
0
3
2
1
0
OTMX[1:0]
Access
Reset
R/W
R/W
0
0
Bits 31:24 – DTHS[7:0]: Dead-Time High Side Outputs Value
This register holds the number of GCLK_TCC clock cycles for the dead-time high side.
Bits 23:16 – DTLS[7:0]: Dead-time Low Side Outputs Value
This register holds the number of GCLK_TCC clock cycles for the dead-time low side.
Bits 11,10,9,8 – DTIENx : Dead-time Insertion Generator x Enable
Setting any of these bits enables the dead-time insertion generator for the corresponding output matrix.
This will override the output matrix [x] and [x+WO_NUM/2], with the low side and high side waveform
respectively.
Value
0
1
Description
No dead-time insertion override.
Dead time insertion override on signal outputs[x] and [x+WO_NUM/2], from matrix outputs[x]
signal.
Bits 1:0 – OTMX[1:0]: Output Matrix
These bits define the matrix routing of the TCC waveform generation outputs to the port pins, according
to Table 31-4.
31.8.7
Driver Control
Name: DRVCTRL
Offset: 0x18
Reset: 0x00000000
Property: PAC Write-Protection, Enable-Protected
Bit
31
30
29
28
27
FILTERVAL1[3:0]
Access
Reset
Bit
Access
Reset
26
25
24
FILTERVAL0[3:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
23
22
21
20
19
18
17
16
INVEN7
INVEN6
INVEN5
INVEN4
INVEN3
INVEN2
INVEN1
INVEN0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
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Bit
Access
Reset
Bit
Access
Reset
15
14
13
12
11
10
9
8
NRV7
NRV6
NRV5
NRV4
NRV3
NRV2
NRV1
NRV0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
7
6
5
4
3
2
1
0
NRE7
NRE6
NRE5
NRE4
NRE3
NRE2
NRE1
NRE0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 31:28 – FILTERVAL1[3:0]: Non-Recoverable Fault Input 1 Filter Value
These bits define the filter value applied on TCE1 event input line. When the TCE1 event input line is
configured as a synchronous event, this value must be 0x0.
Bits 27:24 – FILTERVAL0[3:0]: Non-Recoverable Fault Input 0 Filter Value
These bits define the filter value applied on TCE0 event input line. When the TCE0 event input line is
configured as a synchronous event, this value must be 0x0.
Bits 23,22,21,20,19,18,17,16 – INVENx: Waveform Output x Inversion
These bits are used to select inversion on the output of channel x.
Writing a '1' to INVENx inverts output from WO[x].
Writing a '0' to INVENx disables inversion of output from WO[x].
Bits 15,14,13,12,11,10,9,8 – NRVx: NRVx Non-Recoverable State x Output Value
These bits define the value of the enabled override outputs, under non-recoverable fault condition.
Bits 7,6,5,4,3,2,1,0 – NREx: Non-Recoverable State x Output Enable
These bits enable the override of individual outputs by NRVx value, under non-recoverable fault
condition.
Value
0
1
31.8.8
Description
Non-recoverable fault tri-state the output.
Non-recoverable faults set the output to NRVx level.
Debug control
Name: DBGCTRL
Offset: 0x1E
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
5
4
3
Access
Reset
2
1
0
FDDBD
DBGRUN
R/W
R/W
0
0
Bit 2 – FDDBD: Fault Detection on Debug Break Detection
This bit is not affected by software reset and should not be changed by software while the TCC is
enabled.
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By default this bit is zero, and the on-chip debug (OCD) fault protection is disabled. When this bit is
written to ‘1’, OCD break request from the OCD system will trigger non-recoverable fault. When this bit is
set, OCD fault protection is enabled and OCD break request from the OCD system will trigger a nonrecoverable fault.
Value
0
1
Description
No faults are generated when TCC is halted in debug mode.
A non recoverable fault is generated and FAULTD flag is set when TCC is halted in debug
mode.
Bit 0 – DBGRUN: Debug Running State
This bit is not affected by software reset and should not be changed by software while the TCC is
enabled.
Value
0
1
31.8.9
Description
The TCC is halted when the device is halted in debug mode.
The TCC continues normal operation when the device is halted in debug mode.
Event Control
Name: EVCTRL
Offset: 0x20
Reset: 0x00000000
Property: PAC Write-Protection, Enable-Protected
Bit
31
30
29
28
Access
Reset
Bit
23
22
21
20
Access
Reset
Bit
Access
27
26
25
24
MCEO3
MCEO2
MCEO1
MCEO0
R/W
R/W
R/W
R/W
0
0
0
0
19
18
17
16
MCEI3
MCEI2
MCEI1
MCEI0
R/W
R/W
R/W
R/W
0
0
0
0
15
14
13
12
10
9
8
TCEI1
TCEI0
TCINV1
TCINV0
11
CNTEO
TRGEO
OVFEO
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
Bit
7
6
5
1
0
CNTSEL[1:0]
Access
Reset
4
3
2
EVACT1[2:0]
EVACT0[2:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 27,26,25,24 – MCEOx: Match or Capture Channel x Event Output Enable
These bits control if the Match/capture event on channel x is enabled and will be generated for every
match or capture.
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Value
0
1
Description
Match/capture x event is disabled and will not be generated.
Match/capture x event is enabled and will be generated for every compare/capture on
channel x.
Bits 19,18,17,16 – MCEIx: Match or Capture Channel x Event Input Enable
These bits indicate if the Match/capture x incoming event is enabled
These bits are used to enable match or capture input events to the CCx channel of TCC.
Value
0
1
Description
Incoming events are disabled.
Incoming events are enabled.
Bits 15,14 – TCEIx: Timer/Counter Event Input x Enable
This bit is used to enable input event x to the TCC.
Value
0
1
Description
Incoming event x is disabled.
Incoming event x is enabled.
Bits 13,12 – TCINVx: Timer/Counter Event x Invert Enable
This bit inverts the event x input.
Value
0
1
Description
Input event source x is not inverted.
Input event source x is inverted.
Bit 10 – CNTEO: Timer/Counter Event Output Enable
This bit is used to enable the counter cycle event. When enabled, an event will be generated on begin or
end of counter cycle depending of CNTSEL[1:0] settings.
Value
0
1
Description
Counter cycle output event is disabled and will not be generated.
Counter cycle output event is enabled and will be generated depend of CNTSEL[1:0] value.
Bit 9 – TRGEO: Retrigger Event Output Enable
This bit is used to enable the counter retrigger event. When enabled, an event will be generated when the
counter retriggers operation.
Value
0
1
Description
Counter retrigger event is disabled and will not be generated.
Counter retrigger event is enabled and will be generated for every counter retrigger.
Bit 8 – OVFEO: Overflow/Underflow Event Output Enable
This bit is used to enable the overflow/underflow event. When enabled an event will be generated when
the counter reaches the TOP or the ZERO value.
Value
0
1
Description
Overflow/underflow counter event is disabled and will not be generated.
Overflow/underflow counter event is enabled and will be generated for every counter
overflow/underflow.
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Bits 7:6 – CNTSEL[1:0]: Timer/Counter Interrupt and Event Output Selection
These bits define on which part of the counter cycle the counter event output is generated.
Value
0x0
0x1
0x2
0x3
Name
BEGIN
END
BETWEEN
BOUNDARY
Description
An interrupt/event is generated at begin of each counter cycle
An interrupt/event is generated at end of each counter cycle
An interrupt/event is generated between each counter cycle.
An interrupt/event is generated at begin of first counter cycle, and end of last
counter cycle.
Bits 5:3 – EVACT1[2:0]: Timer/Counter Event Input 1 Action
These bits define the action the TCC will perform on TCE1 event input.
Value
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
Name
OFF
RETRIGGER
DIR (asynch)
STOP
DEC
PPW
PWP
FAULT
Description
Event action disabled.
Start restart or re-trigger TC on event
Direction control
Stop TC on event
Decrement TC on event
Period captured into CC0 Pulse Width on CC1
Period captured into CC1 Pulse Width on CC0
Non-recoverable Fault
Bits 2:0 – EVACT0[2:0]: Timer/Counter Event Input 0 Action
These bits define the action the TCC will perform on TCE0 event input 0.
Value
0x0
0x1
0x2
0x3
0x4
0x5
0x6
0x7
Name
OFF
RETRIGGER
COUNTEV
START
INC
COUNT (async)
FAULT
Description
Event action disabled.
Start restart or re-trigger TC on event
Count on event.
Start TC on event
Increment TC on EVENT
Count on active state of asynchronous event
Reserved
Non-recoverable Fault
31.8.10 Interrupt Enable Clear
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Interrupt Enable Set (INTENSET) register.
Name: INTENCLR
Offset: 0x24
Reset: 0x00000000
Property: PAC Write-Protection
Bit
31
30
29
28
27
26
25
24
Access
Reset
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Bit
23
22
21
20
Access
19
18
17
16
MC3
MC2
MC1
MC0
R/W
R/W
R/W
R/W
0
0
0
0
10
9
8
Reset
Bit
Access
15
14
13
12
11
FAULT1
FAULT0
FAULTB
FAULTA
DFS
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
Bit
7
6
5
4
Access
3
2
1
0
ERR
CNT
TRG
OVF
R/W
R/W
R/W
R/W
0
0
0
0
Reset
Bits 19,18,17,16 – MCx: Match or Capture Channel x Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the corresponding Match or Capture Channel x Interrupt Disable/Enable
bit, which disables the Match or Capture Channel x interrupt.
Value
0
1
Description
The Match or Capture Channel x interrupt is disabled.
The Match or Capture Channel x interrupt is enabled.
Bits 15,14 – FAULTx: Non-Recoverable Fault x Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Non-Recoverable Fault x Interrupt Disable/Enable bit, which disables
the Non-Recoverable Fault x interrupt.
Value
0
1
Description
The Non-Recoverable Fault x interrupt is disabled.
The Non-Recoverable Fault x interrupt is enabled.
Bit 13 – FAULTB: Recoverable Fault B Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Recoverable Fault B Interrupt Disable/Enable bit, which disables the
Recoverable Fault B interrupt.
Value
0
1
Description
The Recoverable Fault B interrupt is disabled.
The Recoverable Fault B interrupt is enabled.
Bit 12 – FAULTA: Recoverable Fault A Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Recoverable Fault A Interrupt Disable/Enable bit, which disables the
Recoverable Fault A interrupt.
Value
0
1
Description
The Recoverable Fault A interrupt is disabled.
The Recoverable Fault A interrupt is enabled.
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Bit 11 – DFS: Non-Recoverable Debug Fault Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Debug Fault State Interrupt Disable/Enable bit, which disables the
Debug Fault State interrupt.
Value
0
1
Description
The Debug Fault State interrupt is disabled.
The Debug Fault State interrupt is enabled.
Bit 3 – ERR: Error Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Error Interrupt Disable/Enable bit, which disables the Compare
interrupt.
Value
0
1
Description
The Error interrupt is disabled.
The Error interrupt is enabled.
Bit 2 – CNT: Counter Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Counter Interrupt Disable/Enable bit, which disables the Counter
interrupt.
Value
0
1
Description
The Counter interrupt is disabled.
The Counter interrupt is enabled.
Bit 1 – TRG: Retrigger Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Retrigger Interrupt Disable/Enable bit, which disables the Retrigger
interrupt.
Value
0
1
Description
The Retrigger interrupt is disabled.
The Retrigger interrupt is enabled.
Bit 0 – OVF: Overflow Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will clear the Overflow Interrupt Disable/Enable bit, which disables the Overflow
interrupt request.
Value
0
1
Description
The Overflow interrupt is disabled.
The Overflow interrupt is enabled.
31.8.11 Interrupt Enable Set
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Interrupt Enable Clear (INTENCLR) register.
Name:
INTENSET
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Offset: 0x28
Reset: 0x00000000
Property: PAC Write-Protection
Bit
31
30
29
28
23
22
21
20
27
26
25
24
Access
Reset
Bit
Access
Reset
Bit
Access
19
18
17
16
MC3
MC2
MC1
MC0
R/W
R/W
R/W
R/W
0
0
0
0
10
9
8
15
14
13
12
11
FAULT1
FAULT0
FAULTB
FAULTA
DFS
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
ERR
CNT
TRG
OVF
R/W
R/W
R/W
R/W
0
0
0
0
Access
Reset
Bits 19,18,17,16 – MCx: Match or Capture Channel x Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the corresponding Match or Capture Channel x Interrupt Disable/Enable bit,
which enables the Match or Capture Channel x interrupt.
Value
0
1
Description
The Match or Capture Channel x interrupt is disabled.
The Match or Capture Channel x interrupt is enabled.
Bits 15,14 – FAULTx: Non-Recoverable Fault x Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Non-Recoverable Fault x Interrupt Disable/Enable bit, which enables the
Non-Recoverable Fault x interrupt.
Value
0
1
Description
The Non-Recoverable Fault x interrupt is disabled.
The Non-Recoverable Fault x interrupt is enabled.
Bit 13 – FAULTB: Recoverable Fault B Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Recoverable Fault B Interrupt Disable/Enable bit, which enables the
Recoverable Fault B interrupt.
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Value
0
1
Description
The Recoverable Fault B interrupt is disabled.
The Recoverable Fault B interrupt is enabled.
Bit 12 – FAULTA: Recoverable Fault A Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Recoverable Fault A Interrupt Disable/Enable bit, which enables the
Recoverable Fault A interrupt.
Value
0
1
Description
The Recoverable Fault A interrupt is disabled.
The Recoverable Fault A interrupt is enabled.
Bit 11 – DFS: Non-Recoverable Debug Fault Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Debug Fault State Interrupt Disable/Enable bit, which enables the
Debug Fault State interrupt.
Value
0
1
Description
The Debug Fault State interrupt is disabled.
The Debug Fault State interrupt is enabled.
Bit 3 – ERR: Error Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Error Interrupt Disable/Enable bit, which enables the Compare interrupt.
Value
0
1
Description
The Error interrupt is disabled.
The Error interrupt is enabled.
Bit 2 – CNT: Counter Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Retrigger Interrupt Disable/Enable bit, which enables the Counter
interrupt.
Value
0
1
Description
The Counter interrupt is disabled.
The Counter interrupt is enabled.
Bit 1 – TRG: Retrigger Interrupt Enable
Writing a '0' to this bit has no effect.
Writing a '1' to this bit will set the Retrigger Interrupt Disable/Enable bit, which enables the Retrigger
interrupt.
Value
0
1
Description
The Retrigger interrupt is disabled.
The Retrigger interrupt is enabled.
Bit 0 – OVF: Overflow Interrupt Enable
Writing a '0' to this bit has no effect.
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Writing a '1' to this bit will set the Overflow Interrupt Disable/Enable bit, which enables the Overflow
interrupt request.
Value
0
1
Description
The Overflow interrupt is disabled.
The Overflow interrupt is enabled.
31.8.12 Interrupt Flag Status and Clear
Name: INTFLAG
Offset: 0x2C
Reset: 0x00000000
Property:
Bit
31
30
29
28
23
22
21
20
27
26
25
24
Access
Reset
Bit
Access
Reset
Bit
Access
19
18
17
16
MC3
MC2
MC1
MC0
R/W
R/W
R/W
R/W
0
0
0
0
10
9
8
15
14
13
12
11
FAULT1
FAULT0
FAULTB
FAULTA
DFS
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
ERR
CNT
TRG
OVF
R/W
R/W
R/W
R/W
0
0
0
0
Access
Reset
Bits 19,18,17,16 – MCx: Match or Capture Channel x Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after a match with the compare condition or once
CCx register contain a valid capture value.
Writing a '0' to one of these bits has no effect.
Writing a '1' to one of these bits will clear the corresponding Match or Capture Channel x interrupt flag
In Capture operation, this flag is automatically cleared when CCx register is read.
Bits 15,14 – FAULTx: Non-Recoverable Fault x Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after a Non-Recoverable Fault x occurs.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the Non-Recoverable Fault x interrupt flag.
Bit 13 – FAULTB: Recoverable Fault B Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after a Recoverable Fault B occurs.
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Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the Recoverable Fault B interrupt flag.
Bit 12 – FAULTA: Recoverable Fault A Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after a Recoverable Fault B occurs.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the Recoverable Fault B interrupt flag.
Bit 11 – DFS: Non-Recoverable Debug Fault State Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after an Debug Fault State occurs.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the Debug Fault State interrupt flag.
Bit 3 – ERR: Error Interrupt Flag
This flag is set if a new capture occurs on a channel when the corresponding Match or Capture Channel x
interrupt flag is one. In which case there is nowhere to store the new capture.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the error interrupt flag.
Bit 2 – CNT: Counter Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after a counter event occurs.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the CNT interrupt flag.
Bit 1 – TRG: Retrigger Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after a counter retrigger occurs.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the re-trigger interrupt flag.
Bit 0 – OVF: Overflow Interrupt Flag
This flag is set on the next CLK_TCC_COUNT cycle after an overflow condition occurs.
Writing a '0' to this bit has no effect.
Writing a '1' to this bit clears the Overflow interrupt flag.
31.8.13 Status
Name: STATUS
Offset: 0x30
Reset: 0x00000001
Property:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 625
32-bit ARM-Based Microcontrollers
Bit
27
26
25
24
CMP3
CMP2
CMP1
CMP0
Access
R
R
R
R
Reset
0
0
0
0
Bit
31
23
30
22
29
21
28
20
Access
Reset
Bit
Access
19
18
17
16
CCBV3
CCBV2
CCBV1
CCBV0
R/W
R/W
R/W
R/W
0
0
0
0
15
14
13
12
11
10
9
8
FAULT1
FAULT0
FAULTB
FAULTA
FAULT1IN
FAULT0IN
FAULTBIN
FAULTAIN
R/W
R/W
R/W
R/W
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
PERBV
WAVEBV
PATTBV
DFS
IDX
STOP
R/W
R/W
R/W
R/W
R
R
0
0
0
0
0
1
Access
Reset
Bits 27,26,25,24 – CMPx: Channel x Compare Value
This bit reflects the channel x output compare value.
Value
0
1
Description
Channel compare output value is 0.
Channel compare output value is 1.
Bits 19,18,17,16 – CCBVx: Channel x Compare or Capture Buffer Valid
For a compare channel, this bit is set when a new value is written to the corresponding CCBx register.
The bit is cleared either by writing a '1' to the corresponding location when CTRLB.LUPD is set, or
automatically on an UPDATE condition.
For a capture channel, the bit is set when a valid capture value is stored in the CCBx register. The bit is
automatically cleared when the CCx register is read.
Bits 15,14 – FAULTx: Non-recoverable Fault x State
This bit is set by hardware as soon as non-recoverable Fault x condition occurs.
This bit is cleared by writing a one to this bit and when the corresponding FAULTxIN status bit is low.
Once this bit is clear, the timer/counter will restart from the last COUNT value. To restart the timer/counter
from BOTTOM, the timer/counter restart command must be executed before clearing the corresponding
STATEx bit. For further details on timer/counter commands, refer to available commands description
(CTRLBSET.CMD).
Bit 13 – FAULTB: Recoverable Fault B State
This bit is set by hardware as soon as recoverable Fault B condition occurs.
This bit can be clear by hardware when Fault B action is resumed, or by writing a '1' to this bit when the
corresponding FAULTBIN bit is low. If software halt command is enabled (FAULTB.HALT=SW), clearing
this bit will release the timer/counter.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 626
32-bit ARM-Based Microcontrollers
Bit 12 – FAULTA: Recoverable Fault A State
This bit is set by hardware as soon as recoverable Fault A condition occurs.
This bit can be clear by hardware when Fault A action is resumed, or by writing a '1' to this bit when the
corresponding FAULTAIN bit is low. If software halt command is enabled (FAULTA.HALT=SW), clearing
this bit will release the timer/counter.
Bit 11 – FAULT1IN: Non-Recoverable Fault 1 Input
This bit is set while an active Non-Recoverable Fault 1 input is present.
Bit 10 – FAULT0IN: Non-Recoverable Fault 0 Input
This bit is set while an active Non-Recoverable Fault 0 input is present.
Bit 9 – FAULTBIN: Recoverable Fault B Input
This bit is set while an active Recoverable Fault B input is present.
Bit 8 – FAULTAIN: Recoverable Fault A Input
This bit is set while an active Recoverable Fault A input is present.
Bit 7 – PERBV: Period Buffer Valid
This bit is set when a new value is written to the PERB register. This bit is automatically cleared by
hardware on UPDATE condition when CTRLB.LUPD is set, or by writing a '1' to this bit.
Bit 6 – WAVEBV: Waveform Control Buffer Valid
This bit is set when a new value is written to the WAVEB register. This bit is automatically cleared by
hardware on UPDATE condition when CTRLB.LUPD is set, or by writing a '1' to this bit.
Bit 5 – PATTBV: Pattern Generator Value Buffer Valid
This bit is set when a new value is written to the PATTB register. This bit is automatically cleared by
hardware on UPDATE condition when CTRLB.LUPD is set, or by writing a '1' to this bit.
Bit 3 – DFS: Debug Fault State
This bit is set by hardware in debug mode when DDBGCTRL.FDDBD bit is set. The bit is cleared by
writing a '1' to this bit and when the TCC is not in debug mode.
When the bit is set, the counter is halted and the waveforms state depend on DRVCTRL.NRE and
DRVCTRL.NRV registers.
Bit 1 – IDX: Ramp Index
In RAMP2 and RAMP2A operation, the bit is cleared during the cycle A and set during the cycle B. In
RAMP1 operation, the bit always reads zero. For details on ramp operations, refer to Ramp Operations.
Bit 0 – STOP: Stop
This bit is set when the TCC is disabled either on a STOP command or on an UPDATE condition when
One-Shot operation mode is enabled (CTRLBSET.ONESHOT=1).
This bit is clear on the next incoming counter increment or decrement.
Value
0
1
Description
Counter is running.
Counter is stopped.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 627
32-bit ARM-Based Microcontrollers
31.8.14 Counter Value
Note: Prior to any read access, this register must be synchronized by user by writing the according TCC
Command value to the Control B Set register (CTRLBSET.CMD=READSYNC).
Name: COUNT
Offset: 0x34
Reset: 0x00000000
Property: PAC Write-Protection, Write-Synchronized, Read-Synchronized
Bit
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
8
Access
Reset
Bit
COUNT[23:16]
Access
COUNT[15:8]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
COUNT[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 23:0 – COUNT[23:0]: Counter Value
These bits hold the value of the counter register.
Note: When the TCC is configured as 16-bit timer/counter, the excess bits are read zero.
Note: This bit field occupies the MSB of the register, [23:m]. m is dependent on the Resolution bit in the
Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [23:m]
0x0 - NONE
23:0 (depicted)
0x1 - DITH4
23:4
0x2 - DITH5
23:5
0x3 - DITH6
23:6
31.8.15 Pattern
Name: PATT
Offset: 0x38
Reset: 0x0000
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Datasheet Complete
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32-bit ARM-Based Microcontrollers
Property: Write-Synchronized
Bit
15
14
13
12
11
10
9
8
PGV0[7:0]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
PGE0[7:0]
Access
Reset
Bits 8:15, 16:23, 24:31, 32:39, 40:47, 48:55, 56:63, 64:71 – PGVn: Pattern Generation Output Value
This register holds the values of pattern for each waveform output.
Bits 0:7, 8:15, 16:23, 24:31, 32:39, 40:47, 48:55, 56:63 – PGEn: Pattern Generation Output Enable
This register holds the enable status of pattern generation for each waveform output. A bit written to '1'
will override the corresponding SWAP output with the corresponding PGVn value.
31.8.16 Waveform
Name: WAVE
Offset: 0x3C
Reset: 0x00000000
Property: Write-Synchronized
Bit
31
30
29
28
Access
Reset
Bit
23
22
21
20
Access
Reset
Bit
15
14
13
12
Access
Reset
Bit
7
6
5
CIPEREN
Access
Reset
4
27
26
25
24
SWAP3
SWAP2
SWAP1
SWAP0
R/W
R/W
R/W
R/W
0
0
0
0
19
18
17
16
POL3
POL2
POL1
POL0
R/W
R/W
R/W
R/W
0
0
0
0
11
10
9
8
CICCEN3
CICCEN2
CICCEN1
CICCEN0
R/W
R/W
R/W
R/W
0
0
0
0
3
2
1
0
RAMP[1:0]
WAVEGEN[2:0]
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bits 24, 25, 26, 27 – SWAPn: Swap DTI Output Pair x
Setting these bits enables output swap of DTI outputs [x] and [x+WO_NUM/2]. Note the DTIxEN settings
will not affect the swap operation.
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Datasheet Complete
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32-bit ARM-Based Microcontrollers
Bits 16, 17, 18, 19 – POLn: Channel Polarity x
Setting these bits enables the output polarity in single-slope and dual-slope PWM operations.
Value
0
Name
(single-slope PWM waveform
generation)
(single-slope PWM waveform
generation)
(dual-slope PWM waveform
generation)
(dual-slope PWM waveform
generation)
1
0
1
Description
Compare output is initialized to ~DIR and set to DIR when
TCC counter matches CCx value
Compare output is initialized to DIR and set to ~DIR when
TCC counter matches CCx value.
Compare output is set to ~DIR when TCC counter matches
CCx value
Compare output is set to DIR when TCC counter matches
CCx value.
Bits 8, 9, 10, 11 – CICCENn: Circular CC Enable x
Setting this bits enables the compare circular buffer option on channel. When the bit is set, CCx register
value is copied-back into the CCx register on UPDATE condition.
Bit 7 – CIPEREN: Circular Period Enable
Setting this bits enable the period circular buffer option. When the bit is set, the PER register value is
copied-back into the PERB register on UPDATE condition.
Bits 5:4 – RAMP[1:0]: Ramp Operation
These bits select Ramp operation (RAMP). These bits are not synchronized.
Value
0x0
0x1
0x2
0x3
Name
RAMP1
RAMP2A
RAMP2
-
Description
RAMP1 operation
Alternative RAMP2 operation
RAMP2 operation
Reserved
Bits 2:0 – WAVEGEN[2:0]: Waveform Generation Operation
These bits select the waveform generation operation. The settings impact the top value and control if
frequency or PWM waveform generation should be used. These bits are not synchronized.
Value
Name
Description
Operation
Top
Update
Waveform Output
On Match
Waveform Output
On Update
OVFIF/Event
Up Down
0x0
NFRQ
Normal Frequency
PER
TOP/Zero
Toggle
Stable
TOP
Zero
0x1
MFRQ
Match Frequency
CC0
TOP/Zero
Toggle
Stable
TOP
Zero
0x2
NPWM
Normal PWM
PER
TOP/Zero
Set
Clear
TOP
Zero
0x3
Reserved
–
–
–
–
–
–
–
0x4
DSCRITICAL
Dual-slope PWM
PER
Zero
~DIR
Stable
–
Zero
0x5
DSBOTTOM
Dual-slope PWM
PER
Zero
~DIR
Stable
–
Zero
0x6
DSBOTH
Dual-slope PWM
PER
TOP & Zero
~DIR
Stable
TOP
Zero
0x7
DSTOP
Dual-slope PWM
PER
Zero
~DIR
Stable
TOP
–
31.8.17 Period Value
Name:
PER
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32-bit ARM-Based Microcontrollers
Offset: 0x40
Reset: 0xFFFFFFFF
Property: Write-Synchronized
Bit
31
30
29
28
23
22
21
20
27
26
25
24
19
18
17
16
Access
Reset
Bit
PER[17:10]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
1
1
1
1
1
1
1
1
Bit
15
14
13
12
11
10
9
8
PER[9:2]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
1
1
1
1
1
1
1
1
Bit
7
6
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
1
1
1
1
1
1
1
1
PER[1:0]
Access
Reset
DITHER[5:0]
Bits 23:6 – PER[17:0]: Period Value
These bits hold the value of the period buffer register.
Note: When the TCC is configured as 16-bit timer/counter, the excess bits are read zero.
Note: This bit field occupies the MSB of the register, [23:m]. m is dependent on the Resolution bit in the
Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [23:m]
0x0 - NONE
23:0
0x1 - DITH4
23:4
0x2 - DITH5
23:5
0x3 - DITH6
23:6 (depicted)
Bits 5:0 – DITHER[5:0]: Dithering Cycle Number
These bits hold the number of extra cycles that are added on the PWM pulse period every 64 PWM
frames.
Note: This bit field consists of the n LSB of the register. n is dependent on the value of the Resolution
bits in the Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [n:0]
0x0 - NONE
-
0x1 - DITH4
3:0
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Datasheet Complete
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32-bit ARM-Based Microcontrollers
CTRLA.RESOLUTION
Bits [n:0]
0x2 - DITH5
4:0
0x3 - DITH6
5:0 (depicted)
31.8.18 Compare/Capture Channel x
The CCx register represents the 16-, 24- bit value, CCx. The register has two functions, depending of the
mode of operation.
For capture operation, this register represents the second buffer level and access point for the CPU and
DMA.
For compare operation, this register is continuously compared to the counter value. Normally, the output
form the comparator is then used for generating waveforms.
CCx register is updated with the buffer value from their corresponding CCBx register when an UPDATE
condition occurs.
In addition, in match frequency operation, the CC0 register controls the counter period.
Name: CCn
Offset: 0x44 + n*0x04 [n=0..3]
Reset: 0x00000000
Property: Write-Synchronized, Read-Synchronized
Bit
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
8
Access
Reset
Bit
CC[17:10]
Access
CC[9:2]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
CC[1:0]
Access
Reset
DITHER[5:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 23:6 – CC[17:0]: Channel x Compare/Capture Value
These bits hold the value of the Channel x compare/capture register.
Note: When the TCC is configured as 16-bit timer/counter, the excess bits are read zero.
Note: This bit field occupies the m MSB of the register, [23:m]. m is dependent on the Resolution bit in
the Control A register (CTRLA.RESOLUTION):
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 632
32-bit ARM-Based Microcontrollers
CTRLA.RESOLUTION
Bits [23:m]
0x0 - NONE
23:0
0x1 - DITH4
23:4
0x2 - DITH5
23:5
0x3 - DITH6
23:6 (depicted)
Bits 5:0 – DITHER[5:0]: Dithering Cycle Number
These bits hold the number of extra cycles that are added on the PWM pulse width every 64 PWM
frames.
Note: This bit field consists of the n LSB of the register. n is dependent on the value of the Resolution
bits in the Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [n:0]
0x0 - NONE
-
0x1 - DITH4
3:0
0x2 - DITH5
4:0
0x3 - DITH6
5:0 (depicted)
31.8.19 Pattern Buffer
Name: PATTB
Offset: 0x64
Reset: 0x0000
Property: Write-Synchronized, Read-Synchronized
Bit
15
14
13
12
11
10
9
8
PGVB0[7:0]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
PGEB0[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 8:15, 16:23, 24:31, 32:39, 40:47, 48:55, 56:63, 64:71 – PGVBn: Pattern Generation Output
Value Buffer
This register is the buffer for the PGV register. If double buffering is used, valid content in this register is
copied to the PGV register on an UPDATE condition.
Bits 0:7, 8:15, 16:23, 24:31, 32:39, 40:47, 48:55, 56:63 – PGEBn: Pattern Generation Output Enable
Buffer
This register is the buffer of the PGE register. If double buffering is used, valid content in this register is
copied into the PGE register at an UPDATE condition.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 633
32-bit ARM-Based Microcontrollers
31.8.20 Waveform Buffer
Name: WAVEB
Offset: 0x68
Reset: 0x00000000
Property: Write-Synchronized, Read-Synchronized
Bit
31
30
29
28
Access
Reset
Bit
23
22
21
20
Access
Reset
Bit
15
14
13
12
Access
Reset
Bit
7
6
5
CIPERENB
Access
Reset
4
27
26
25
24
SWAPB 3
SWAPB 2
SWAPB 1
SWAPB 0
R/W
R/W
R/W
R/W
0
0
0
0
19
18
17
16
POLB3
POLB2
POLB1
POLB0
R/W
R/W
R/W
R/W
0
0
0
0
11
10
9
8
CICCENB3
CICCENB2
CICCENB1
CICCENB0
R/W
R/W
R/W
R/W
0
0
0
0
3
2
1
0
RAMPB[1:0]
WAVEGENB[2:0]
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bits 24, 25, 26, 27 – SWAPB n: Swap DTI output pair x Buffer
These register bits are the buffer bits for the SWAP register bits. If double buffering is used, valid content
in these bits is copied to the corresponding SWAPx bits on an UPDATE condition.
Bits 16, 17, 18, 19 – POLBn: Channel Polarity x Buffer
These register bits are the buffer bits for POLx register bits. If double buffering is used, valid content in
these bits is copied to the corresponding POBx bits on an UPDATE condition.
Bits 8, 9, 10, 11 – CICCENBn: Circular CCx Buffer Enable
These register bits are the buffer bits for CICCENx register bits. If double buffering is used, valid content
in these bits is copied to the corresponding CICCENx bits on a UPDATE condition.
Bit 7 – CIPERENB: Circular Period Enable Buffer
This register bit is the buffer bit for CIPEREN register bit. If double buffering is used, valid content in this
bit is copied to the corresponding CIPEREN bit on a UPDATE condition.
Bits 5:4 – RAMPB[1:0]: Ramp Operation Buffer
These register bits are the buffer bits for RAMP register bits. If double buffering is used, valid content in
these bits is copied to the corresponding RAMP bits on a UPDATE condition.
Bits 2:0 – WAVEGENB[2:0]: Waveform Generation Operation Buffer
These register bits are the buffer bits for WAVEGEN register bits. If double buffering is used, valid content
in these bits is copied to the corresponding WAVEGEN bits on a UPDATE condition.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 634
32-bit ARM-Based Microcontrollers
31.8.21 Period Buffer Value
Name: PERB
Offset: 0x6C
Reset: 0xFFFFFFFF
Property: Write-Synchronized, Read-Synchronized
Bit
31
30
29
28
23
22
21
20
27
26
25
24
19
18
17
16
Access
Reset
Bit
PERB[17:10]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
1
1
1
1
1
1
1
1
Bit
15
14
13
12
11
10
9
8
PERB[9:2]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
1
1
1
1
1
1
1
1
Bit
7
6
5
4
3
2
1
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
1
1
1
1
1
1
1
1
PERB[1:0]
Access
Reset
DITHERB[5:0]
Bits 23:6 – PERB[17:0]: Period Buffer Value
These bits hold the value of the period buffer register. The value is copied to PER register on UPDATE
condition.
Note: When the TCC is configured as 16-bit timer/counter, the excess bits are read zero.
Note: This bit field occupies the MSB of the register, [23:m]. m is dependent on the Resolution bit in the
Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [23:m]
0x0 - NONE
23:0
0x1 - DITH4
23:4
0x2 - DITH5
23:5
0x3 - DITH6
23:6 (depicted)
Bits 5:0 – DITHERB[5:0]: Dithering Buffer Cycle Number
These bits represent the PER.DITHER bits buffer. When the double buffering is enabled, the value of this
bit field is copied to the PER.DITHER bits on an UPDATE condition.
Note: This bit field consists of the n LSB of the register. n is dependent on the value of the Resolution
bits in the Control A register (CTRLA.RESOLUTION):
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CTRLA.RESOLUTION
Bits [n:0]
0x0 - NONE
-
0x1 - DITH4
3:0
0x2 - DITH5
4:0
0x3 - DITH6
5:0 (depicted)
31.8.22 Channel x Compare/Capture Buffer Value
CCBx is copied into CCx at TCC update time
Name: CCBn
Offset: 0x70 + n*0x04 [n=0..3]
Reset: 0x00000000
Property: Write-Synchronized, Read-Synchronized
Bit
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
Access
Reset
Bit
CCB[17:10]
Access
CCB[9:2]
Access
CCB[1:0]
Access
Reset
DITHERB[5:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 23:6 – CCB[17:0]: Channel x Compare/Capture Buffer Value
These bits hold the value of the Channel x Compare/Capture Buffer Value register. The register serves as
the buffer for the associated compare or capture registers (CCx). Accessing this register using the CPU
or DMA will affect the corresponding CCBVx status bit.
Note: When the TCC is configured as 16-bit timer/counter, the excess bits are read zero.
Note: This bit field occupies the MSB of the register, [23:m]. m is dependent on the Resolution bit in the
Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [23:m]
0x0 - NONE
23:0
0x1 - DITH4
23:4
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32-bit ARM-Based Microcontrollers
CTRLA.RESOLUTION
Bits [23:m]
0x2 - DITH5
23:5
0x3 - DITH6
23:6 (depicted)
Bits 5:0 – DITHERB[5:0]: Dithering Buffer Cycle Number
These bits represent the CCx.DITHER bits buffer. When the double buffering is enable, DITHERBUF bits
value is copied to the CCx.DITHER bits on an UPDATE condition.
Note: This bit field consists of the n LSB of the register. n is dependent on the value of the Resolution
bits in the Control A register (CTRLA.RESOLUTION):
CTRLA.RESOLUTION
Bits [n:0]
0x0 - NONE
-
0x1 - DITH4
3:0
0x2 - DITH5
4:0
0x3 - DITH6
5:0 (depicted)
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32-bit ARM-Based Microcontrollers
32.
USB – Universal Serial Bus
32.1
Overview
The Universal Serial Bus interface (USB) module complies with the Universal Serial Bus (USB) 2.1
specification supporting both device and embedded host modes.
The USB device mode supports 8 endpoint addresses. All endpoint addresses have one input and one
output endpoint, for a total of 16 endpoints. Each endpoint is fully configurable in any of the four transfer
types: control, interrupt, bulk or isochronous. The USB host mode supports up to 8 pipes. The maximum
data payload size is selectable up to 1023 bytes.
Internal SRAM is used to keep the configuration and data buffer for each endpoint. The memory locations
used for the endpoint configurations and data buffers is fully configurable. The amount of memory
allocated is dynamic according to the number of endpoints in use, and the configuration of these. The
USB module has a built-in Direct Memory Access (DMA) and will read/write data from/to the system RAM
when a USB transaction takes place. No CPU or DMA Controller resources are required.
To maximize throughput, an endpoint can be configured for ping-pong operation. When this is done the
input and output endpoint with the same address are used in the same direction. The CPU or DMA
Controller can then read/write one data buffer while the USB module writes/reads from the other buffer.
This gives double buffered communication.
Multi-packet transfer enables a data payload exceeding the maximum packet size of an endpoint to be
transferred as multiple packets without any software intervention. This reduces the number of interrupts
and software intervention needed for USB transfers.
For low power operation the USB module can put the microcontroller in any sleep mode when the USB
bus is idle and a suspend condition is given. Upon bus resume, the USB module can wake the
microcontroller from any sleep mode.
32.2
Features
•
•
•
•
•
•
Compatible with the USB 2.1 specification
USB Embedded Host and Device mode
Supports full (12Mbit/s) and low (1.5Mbit/s) speed communication
Supports Link Power Management (LPM-L1) protocol
On-chip transceivers with built-in pull-ups and pull-downs
On-Chip USB serial resistors
•
•
1kHz SOF clock available on external pin
Device mode
– Supports 8 IN endpoints and 8 OUT endpoints
– No endpoint size limitations
– Built-in DMA with multi-packet and dual bank for all endpoints
– Supports feedback endpoint
– Supports crystal less clock
Host mode
– Supports 8 physical pipes
– No pipe size limitations
•
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32-bit ARM-Based Microcontrollers
–
–
–
–
32.3
Supports multiplexed virtual pipe on one physical pipe to allow an unlimited USB tree
Built-in DMA with multi-packet support and dual bank for all pipes
Supports feedback endpoint
Supports the USB 2.0 Phase-locked SOFs feature
USB Block Diagram
Figure 32-1. High-speed Implementation: USB Block Diagram
LS/FS Implementation: USB Block Diagram
USB
SRAM Controller
AHB Slave
APB
dedicated bus
device-wide bus
AHB Master
User
Interface
DP
USB interrupts
NVIC
SOF 1kHz
GCLK_USB
GCLK
System clock domain
32.4
DM
USB 2.0
Core
USB clock domain
Signal Description
Pin Name
Pin Description
Type
DM
Data -: Differential Data Line - Port
Input/Output
DP
Data +: Differential Data Line + Port
Input/Output
SOF 1kHZ
SOF Output
Output
Refer to I/O Multiplexing and Considerations for details on the pin mapping for this peripheral. One signal
can be mapped on several pins.
Related Links
I/O Multiplexing and Considerations
32.5
Product Dependencies
In order to use this peripheral module, other parts of the system must be configured correctly, as
described below.
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32-bit ARM-Based Microcontrollers
32.5.1
I/O Lines
The USB pins may be multiplexed with the I/O lines Controller. The user must first configure the I/O
Controller to assign the USB pins to their peripheral functions.
A 1kHz SOF clock is available on an external pin. The user must first configure the I/O Controller to
assign the 1kHz SOF clock to the peripheral function. The SOF clock is available for device and host
mode.
32.5.2
Power Management
This peripheral can continue to operate in any sleep mode where its source clock is running. The
interrupts can wake up the device from sleep modes. Events connected to the event system can trigger
other operations in the system without exiting sleep modes.
Related Links
PM – Power Manager
32.5.3
Clocks
The USB bus clock (CLK_USB_AHB) can be enabled and disabled in the Power Manager, and the
default state of CLK_USB_AHB can be found in the Peripheral Clock Masking.
A generic clock (GCLK_USB) is required to clock the USB. This clock must be configured and enabled in
the Generic Clock Controller before using the USB. Refer to GCLK - Generic Clock Controller for further
details.
This generic clock is asynchronous to the bus clock (CLK_USB_AHB). Due to this asynchronicity, writes
to certain registers will require synchronization between the clock domains. Refer to GCLK
Synchronization for further details.
The USB module requires a GCLK_USB of 48 MHz ± 0.25% clock for low speed and full speed operation.
To follow the USB data rate at 12Mbit/s in full-speed mode, the CLK_USB_AHB clock should be at
minimum 8MHz.
Clock recovery is achieved by a digital phase-locked loop in the USB module, which complies with the
USB jitter specifications. If crystal-less operation is used in USB device mode, refer to USB Clock
Recovery Module.
Related Links
GCLK - Generic Clock Controller
USB Clock Recovery Module
Peripheral Clock Masking
Synchronization
32.5.4
DMA
The USB has a built-in Direct Memory Access (DMA) and will read/write data to/from the system RAM
when a USB transaction takes place. No CPU or DMA Controller resources are required.
32.5.5
Interrupts
The interrupt request line is connected to the Interrupt Controller. In order to use interrupt requests of this
peripheral, the Interrupt Controller (NVIC) must be configured first. Refer to Nested Vector Interrupt
Controller for details.
Related Links
Nested Vector Interrupt Controller
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32.5.6
Events
Not applicable.
32.5.7
Debug Operation
When the CPU is halted in debug mode the USB peripheral continues normal operation. If the USB
peripheral is configured in a way that requires it to be periodically serviced by the CPU through interrupts
or similar, improper operation or data loss may result during debugging.
32.5.8
Register Access Protection
Registers with write-access can be optionally write-protected by the Peripheral Access Controller (PAC),
except the following:
•
•
•
•
Device Interrupt Flag (INTFLAG) register
Endpoint Interrupt Flag (EPINTFLAG) register
Host Interrupt Flag (INTFLAG) register
Pipe Interrupt Flag (PINTFLAG) register
Note: Optional write-protection is indicated by the "PAC Write-Protection" property in the register
description.
When the CPU is halted in debug mode, all write-protection is automatically disabled. Write-protection
does not apply for accesses through an external debugger.
32.5.9
Analog Connections
Not applicable.
32.5.10 Calibration
The output drivers for the DP/DM USB line interface can be fine tuned with calibration values from
production tests. The calibration values must be loaded from the NVM Software Calibration Area into the
USB Pad Calibration register (PADCAL) by software, before enabling the USB, to achieve the specified
accuracy. Refer to NVM Software Calibration Area Mapping for further details.
For details on Pad Calibration, refer to Pad Calibration (PADCAL) register.
Related Links
NVM Software Calibration Area Mapping
32.6
Functional Description
32.6.1
USB General Operation
32.6.1.1 Initialization
After a hardware reset, the USB is disabled. The user should first enable the USB (CTRLA.ENABLE) in
either device mode or host mode (CTRLA.MODE).
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32-bit ARM-Based Microcontrollers
Figure 32-2. General States
HW RESET | CTRLA.SWRST
Any state
Idle
CTRLA.ENABLE = 1
CTRLA.MODE
=0
CTRLA.ENABLE = 0
CTRLA.ENABLE = 1
CTRLA.MODE
=1
CTRLA.ENABLE = 0
Device
Host
After a hardware reset, the USB is in the idle state. In this state:
•
•
•
•
The module is disabled. The USB Enable bit in the Control A register (CTRLA.ENABLE) is reset.
The module clock is stopped in order to minimize power consumption.
The USB pad is in suspend mode.
The internal states and registers of the device and host are reset.
Before using the USB, the Pad Calibration register (PADCAL) must be loaded with production calibration
values from the NVM Software Calibration Area.
The USB is enabled by writing a '1' to CTRLA.ENABLE. The USB is disabled by writing a '0' to
CTRLA.ENABLE.
The USB is reset by writing a '1' to the Software Reset bit in CTRLA (CTRLA.SWRST). All registers in the
USB will be reset to their initial state, and the USB will be disabled. Refer to the CTRLA register for
details.
The user can configure pads and speed before enabling the USB by writing to the Operating Mode bit in
the Control A register (CTRLA.MODE) and the Speed Configuration field in the Control B register
(CTRLB.SPDCONF). These values are taken into account once the USB has been enabled by writing a
'1' to CTRLA.ENABLE.
After writing a '1' to CTRLA.ENABLE, the USB enters device mode or host mode (according to
CTRLA.MODE).
The USB can be disabled at any time by writing a '0' to CTRLA.ENABLE.
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32-bit ARM-Based Microcontrollers
Refer to USB Device Operations for the basic operation of the device mode.
Refer to Host Operations for the basic operation of the host mode.
Related Links
NVM Software Calibration Area Mapping
32.6.2
USB Device Operations
This section gives an overview of the USB module device operation during normal transactions. For more
details on general USB and USB protocol, refer to the Universal Serial Bus specification revision 2.1.
32.6.2.1 Initialization
To attach the USB device to start the USB communications from the USB host, a zero should be written
to the Detach bit in the Device Control B register (CTRLB.DETACH). To detach the device from the USB
host, a one must be written to the CTRLB.DETACH.
After the device is attached, the host will request the USB device descriptor using the default device
address zero. On successful transmission, it will send a USB reset. After that, it sends an address to be
configured for the device. All further transactions will be directed to this device address. This address
should be configured in the Device Address field in the Device Address register (DADD.DADD) and the
Address Enable bit in DADD (DADD.ADDEN) should be written to one to accept communications directed
to this address. DADD.ADDEN is automatically cleared on receiving a USB reset.
32.6.2.2 Endpoint Configuration
Endpoint data can be placed anywhere in the device RAM. The USB controller accesses these endpoints
directly through the AHB master (built-in DMA) with the help of the endpoint descriptors. The base
address of the endpoint descriptors needs to be written in the Descriptor Address register (DESCADD) by
the user. Refer also to the Endpoint Descriptor structure in Endpoint Descriptor Structure.
Before using an endpoint, the user should configure the direction and type of the endpoint in Type of
Endpoint field in the Device Endpoint Configuration register (EPCFG.EPTYPE0/1). The endpoint
descriptor registers should be initialized to known values before using the endpoint, so that the USB
controller does not read random values from the RAM.
The Endpoint Size field in the Packet Size register (PCKSIZE.SIZE) should be configured as per the size
reported to the host for that endpoint. The Address of Data Buffer register (ADDR) should be set to the
data buffer used for endpoint transfers.
The RAM Access Interrupt bit in Device Interrupt Flag register (INTFLAG.RAMACER) is set when a RAM
access underflow error occurs during IN data stage.
When an endpoint is disabled, the following registers are cleared for that endpoint:
•
Device Endpoint Interrupt Enable Clear/Set (EPINTENCLR/SET) register
•
•
•
Device Endpoint Interrupt Flag (EPINTFLAG) register
Transmit Stall 0 bit in the Endpoint Status register (EPSTATUS.STALLRQ0)
Transmit Stall 1 bit in the Endpoint Status register (EPSTATUS.STALLRQ1)
32.6.2.3 Multi-Packet Transfers
Multi-packet transfer enables a data payload exceeding the endpoint maximum transfer size to be
transferred as multiple packets without software intervention. This reduces the number of interrupts and
software intervention required to manage higher level USB transfers. Multi-packet transfer is identical to
the IN and OUT transactions described below unless otherwise noted in this section.
The application software provides the size and address of the RAM buffer to be proceeded by the USB
module for a specific endpoint, and the USB module will split the buffer in the required USB data transfers
without any software intervention.
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32-bit ARM-Based Microcontrollers
Figure 32-3. Multi-Packet Feature - Reduction of CPU Overhead
Data Payload
Without Multi-packet support
Transfer Complete Interrupt
&
Data Processing
Maximum Endpoint size
With Multi-packet support
32.6.2.4 USB Reset
The USB bus reset is initiated by a connected host and managed by hardware.
During USB reset the following registers are cleared:
•
•
Device Endpoint Configuration (EPCFG) register - except for Endpoint 0
Device Frame Number (FNUM) register
•
•
•
•
•
•
•
Device Address (DADD) register
Device Endpoint Interrupt Enable Clear/Set (EPINTENCLR/SET) register
Device Endpoint Interrupt Flag (EPINTFLAG) register
Transmit Stall 0 bit in the Endpoint Status register (EPSTATUS.STALLRQ0)
Transmit Stall 1 bit in the Endpoint Status register (EPSTATUS.STALLRQ1)
Endpoint Interrupt Summary (EPINTSMRY) register
Upstream resume bit in the Control B register (CTRLB.UPRSM)
At the end of the reset process, the End of Reset bit is set in the Interrupt Flag register
(INTFLAG.EORST).
32.6.2.5 Start-of-Frame
When a Start-of-Frame (SOF) token is detected, the frame number from the token is stored in the Frame
Number field in the Device Frame Number register (FNUM.FNUM), and the Start-of-Frame interrupt bit in
the Device Interrupt Flag register (INTFLAG.SOF) is set. If there is a CRC or bit-stuff error, the Frame
Number Error status flag (FNUM.FNCERR) in the FNUM register is set.
32.6.2.6 Management of SETUP Transactions
When a SETUP token is detected and the device address of the token packet does not match
DADD.DADD, the packet is discarded and the USB module returns to idle and waits for the next token
packet.
When the address matches, the USB module checks if the endpoint is enabled in EPCFG. If the
addressed endpoint is disabled, the packet is discarded and the USB module returns to idle and waits for
the next token packet.
When the endpoint is enabled, the USB module then checks on the EPCFG of the addressed endpoint. If
the EPCFG.EPTYPE0 is not set to control, the USB module returns to idle and waits for the next token
packet.
When the EPCFG.EPTYPE0 matches, the USB module then fetches the Data Buffer Address (ADDR)
from the addressed endpoint's descriptor and waits for a DATA0 packet. If a PID error or any other PID
than DATA0 is detected, the USB module returns to idle and waits for the next token packet.
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32-bit ARM-Based Microcontrollers
When the data PID matches and if the Received Setup Complete interrupt bit in the Device Endpoint
Interrupt Flag register (EPINTFLAG.RXSTP) is equal to zero, ignoring the Bank 0 Ready bit in the Device
Endpoint Status register (EPSTATUS.BK0RDY), the incoming data is written to the data buffer pointed to
by the Data Buffer Address (ADDR). If the number of received data bytes exceeds the endpoint's
maximum data payload size as specified by the PCKSIZE.SIZE, the remainders of the received data
bytes are discarded. The packet will still be checked for bit-stuff and CRC errors. Software must never
report a endpoint size to the host that is greater than the value configured in PCKSIZE.SIZE. If a bit-stuff
or CRC error is detected in the packet, the USB module returns to idle and waits for the next token
packet.
If data is successfully received, an ACK handshake is returned to the host, and the number of received
data bytes, excluding the CRC, is written to the Byte Count (PCKSIZE.BYTE_COUNT). If the number of
received data bytes is the maximum data payload specified by PCKSIZE.SIZE, no CRC data is written to
the data buffer. If the number of received data bytes is the maximum data payload specified by
PCKSIZE.SIZE minus one, only the first CRC data is written to the data buffer. If the number of received
data is equal or less than the data payload specified by PCKSIZE.SIZE minus two, both CRC data bytes
are written to the data buffer.
Finally the EPSTATUS is updated. Data Toggle OUT bit (EPSTATUS.DTGLOUT), the Data Toggle IN bit
(EPSTATUS.DTGLIN), the current bank bit (EPSTATUS.CURRBK) and the Bank Ready 0 bit
(EPSTATUS.BK0RDY) are set. Bank Ready 1 bit (EPSTATUS.BK1RDY) and the Stall Bank 0/1 bit
(EPSTATUS.STALLQR0/1) are cleared on receiving the SETUP request. The RXSTP bit is set and
triggers an interrupt if the Received Setup Interrupt Enable bit is set in Endpoint Interrupt Enable Set/
Clear register (EPINTENSET/CLR.RXSTP).
32.6.2.7 Management of OUT Transactions
Figure 32-4. OUT Transfer: Data Packet Host to USB Device
Memory Map
HOST
I/O Register
USB I/O Registers
BULK OUT
EPT 2
D
A
T
A
0
D
A
T
A
1
D
A
T
A
0
BULK OUT
EPT 3
D
A
T
A
0
D
A
T
A
1
D
A
T
A
0
D
A
T
A
1
BULK OUT
EPT 1
D
A
T
A
0
D
A
T
A
0
D
A
T
A
1
Internal RAM
USB Module
USB Endpoints
Descriptor Table
D
A
T
A
0
DESCADD
ENDPOINT 1 DATA
ENDPOINT 3 DATA
DP
DM
USB Buffers
time
ENDPOINT 2 DATA
When an OUT token is detected, and the device address of the token packet does not match
DADD.DADD, the packet is discarded and the USB module returns to idle and waits for the next token
packet.
If the address matches, the USB module checks if the endpoint number received is enabled in the
EPCFG of the addressed endpoint. If the addressed endpoint is disabled, the packet is discarded and the
USB module returns to idle and waits for the next token packet.
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When the endpoint is enabled, the USB module then checks the Endpoint Configuration register
(EPCFG) of the addressed output endpoint. If the type of the endpoint (EPCFG.EPTYPE0) is not set to
OUT, the USB module returns to idle and waits for the next token packet.
The USB module then fetches the Data Buffer Address (ADDR) from the addressed endpoint's descriptor,
and waits for a DATA0 or DATA1 packet. If a PID error or any other PID than DATA0 or DATA1 is
detected, the USB module returns to idle and waits for the next token packet.
If EPSTATUS.STALLRQ0 in EPSTATUS is set, the incoming data is discarded. If the endpoint is not
isochronous, a STALL handshake is returned to the host and the Transmit Stall Bank 0 interrupt bit in
EPINTFLAG (EPINTFLAG.STALL0) is set.
For isochronous endpoints, data from both a DATA0 and DATA1 packet will be accepted. For other
endpoint types the PID is checked against EPSTATUS.DTGLOUT. If a PID mismatch occurs, the
incoming data is discarded, and an ACK handshake is returned to the host.
If EPSTATUS.BK0RDY is set, the incoming data is discarded, the bit Transmit Fail 0 interrupt bit in
EPINTFLAG (EPINTFLAG.TRFAIL0) and the status bit STATUS_BK.ERRORFLOW are set. If the
endpoint is not isochronous, a NAK handshake is returned to the host.
The incoming data is written to the data buffer pointed to by the Data Buffer Address (ADDR). If the
number of received data bytes exceeds the maximum data payload specified as PCKSIZE.SIZE, the
remainders of the received data bytes are discarded. The packet will still be checked for bit-stuff and CRC
errors. If a bit-stuff or CRC error is detected in the packet, the USB module returns to idle and waits for
the next token packet.
If the endpoint is isochronous and a bit-stuff or CRC error in the incoming data, the number of received
data bytes, excluding CRC, is written to PCKSIZE.BYTE_COUNT. Finally the EPINTFLAG.TRFAIL0 and
CRC Error bit in the Device Bank Status register (STATUS_BK.CRCERR) is set for the addressed
endpoint.
If data was successfully received, an ACK handshake is returned to the host if the endpoint is not
isochronous, and the number of received data bytes, excluding CRC, is written to
PCKSIZE.BYTE_COUNT. If the number of received data bytes is the maximum data payload specified by
PCKSIZE.SIZE no CRC data bytes are written to the data buffer. If the number of received data bytes is
the maximum data payload specified by PCKSIZE.SIZE minus one, only the first CRC data byte is written
to the data buffer If the number of received data is equal or less than the data payload specified by
PCKSIZE.SIZE minus two, both CRC data bytes are written to the data buffer.
Finally in EPSTATUS for the addressed output endpoint, EPSTATUS.BK0RDY is set and
EPSTATUS.DTGLOUT is toggled if the endpoint is not isochronous. The flag Transmit Complete 0
interrupt bit in EPINTFLAG (EPINTFLAG.TRCPT0) is set for the addressed endpoint.
32.6.2.8 Multi-Packet Transfers for OUT Endpoint
The number of data bytes received is stored in endpoint PCKSIZE.BYTE_COUNT as for normal
operation. Since PCKSIZE.BYTE_COUNT is updated after each transaction, it must be set to zero when
setting up a new transfer. The total number of bytes to be received must be written to
PCKSIZE.MULTI_PACKET_SIZE. This value must be a multiple of PCKSIZE.SIZE, otherwise excess
data may be written to SRAM locations used by other parts of the application.
EPSTATUS.DTGLOUT management for non-isochronous packets and EPINTFLAG.BK1RDY/BK0RDY
management are as for normal operation.
If a maximum payload size packet is received, PCKSIZE.BYTE_COUNT will be incremented by
PCKSIZE.SIZE after the transaction has completed, and EPSTATUS.DTGLOUT will be toggled if the
endpoint is not isochronous. If the updated PCKSIZE.BYTE_COUNT is equal to
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32-bit ARM-Based Microcontrollers
PCKSIZE.MULTI_PACKET_SIZE (i.e. the last transaction), EPSTATUS.BK1RDY/BK0RDY, and
EPINTFLAG.TRCPT0/TRCPT1 will be set.
32.6.2.9 Management of IN Transactions
Figure 32-5. IN Transfer: Data Packet USB Device to Host After Request from Host
Memory Map
I/O Register
HOST
CPU
USB I/O Registers
Internal RAM
EPT 2
D
A
T
A
0
D
A
T
A
1
EPT 3
D
A
T
A
0
D
A
T
A
0
D
A
T
A
1
D
A
T
A
0
D
A
T
A
1
USB Module
EPT 1
D
A
T
A
0
D
A
T
A
0
D
A
T
A
1
DP
DM
ENDPOINT 2 DATA
DESCADD
USB Endpoints
Descriptor Table
D
A
T
A
0
ENDPOINT 3 DATA
USB Buffers
EPT 2
I
N
T
O
K
E
N
I
N
EPT 3 T
O
K
E
N
I
N
EPT 1 T
O
K
E
N
ENDPOINT 1 DATA
time
When an IN token is detected, and if the device address of the token packet does not match
DADD.DADD, the packet is discarded and the USB module returns to idle and waits for the next token
packet.
When the address matches, the USB module checks if the endpoint received is enabled in the EPCFG of
the addressed endpoint and if not, the packet is discarded and the USB module returns to idle and waits
for the next token packet.
When the endpoint is enabled, the USB module then checks on the EPCFG of the addressed input
endpoint. If the EPCFG.EPTYPE1 is not set to IN, the USB module returns to idle and waits for the next
token packet.
If EPSTATUS.STALLRQ1 in EPSTATUS is set, and the endpoint is not isochronous, a STALL handshake
is returned to the host and EPINTFLAG.STALL1 is set.
If EPSTATUS.BK1RDY is cleared, the flag EPINTFLAG.TRFAIL1 is set. If the endpoint is not
isochronous, a NAK handshake is returned to the host.
The USB module then fetches the Data Buffer Address (ADDR) from the addressed endpoint's descriptor.
The data pointed to by the Data Buffer Address (ADDR) is sent to the host in a DATA0 packet if the
endpoint is isochronous. For non-isochronous endpoints a DATA0 or DATA1 packet is sent depending on
the state of EPSTATUS.DTGLIN. When the number of data bytes specified in endpoint
PCKSIZE.BYTE_COUNT is sent, the CRC is appended and sent to the host.
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For isochronous endpoints, EPSTATUS.BK1RDY is cleared and EPINTFLAG.TRCPT1 is set.
For all non-isochronous endpoints the USB module waits for an ACK handshake from the host. If an ACK
handshake is not received within 16 bit times, the USB module returns to idle and waits for the next token
packet. If an ACK handshake is successfully received EPSTATUS.BK1RDY is cleared,
EPINTFLAG.TRCPT1 is set and EPSTATUS.DTGLIN is toggled.
32.6.2.10 Multi-Packet Transfers for IN Endpoint
The total number of data bytes to be sent is written to PCKSIZE.BYTE_COUNT as for normal operation.
The Multi-packet size register (PCKSIZE.MULTI_PACKET_SIZE) is used to store the number of bytes
that are sent, and must be written to zero when setting up a new transfer.
When an IN token is received, PCKSIZE.BYTE_COUNT and PCKSIZE.MULTI_PACKET_SIZE are
fetched. If PCKSIZE.BYTE_COUNT minus PCKSIZE.MULTI_PACKET_SIZE is less than the endpoint
PCKSIZE.SIZE, endpoint BYTE_COUNT minus endpoint PCKSIZE.MULTI_PACKET_SIZE bytes are
transmitted, otherwise PCKSIZE.SIZE number of bytes are transmitted. If endpoint
PCKSIZE.BYTE_COUNT is a multiple of PCKSIZE.SIZE, the last packet sent will be zero-length if the
AUTOZLP bit is set.
If a maximum payload size packet was sent (i.e. not the last transaction), MULTI_PACKET_SIZE will be
incremented by the PCKSIZE.SIZE. If the endpoint is not isochronous the EPSTATUS.DTLGIN bit will be
toggled when the transaction has completed. If a short packet was sent (i.e. the last transaction),
MULTI_PACKET_SIZE is incremented by the data payload. EPSTATUS.BK0/1RDY will be cleared and
EPINTFLAG.TRCPT0/1 will be set.
32.6.2.11 Ping-Pong Operation
When an endpoint is configured for ping-pong operation, it uses both the input and output data buffers
(banks) for a given endpoint in a single direction. The direction is selected by enabling one of the IN or
OUT direction in EPCFG.EPTYPE0/1 and configuring the opposite direction in EPCFG.EPTYPE1/0 as
Dual Bank.
When ping-pong operation is enabled for an endpoint, the endpoint in the opposite direction must be
configured as dual bank. The data buffer, data address pointer and byte counter from the enabled
endpoint are used as Bank 0, while the matching registers from the disabled endpoint are used as Bank
1.
Figure 32-6. Ping-Pong Overview
Endpoint
single bank
Without Ping Pong
t
Endpoint
dual bank
Bank0
With Ping Pong
t
Bank1
USB data packet
Available time for data processing by CPU
to avoid NACK
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The Bank Select flag in EPSTATUS.CURBK indicates which bank data will be used in the next
transaction, and is updated after each transaction. According to EPSTATUS.CURBK,
EPINTFLAG.TRCPT0 or EPINTFLAG.TRFAIL0 or EPINTFLAG.TRCPT1 or EPINTFLAG.TRFAIL1 in
EPINTFLAG and Data Buffer 0/1 ready (EPSTATUS.BK0RDY and EPSTATUS.BK1RDY) are set. The
EPSTATUS.DTGLOUT and EPSTATUS.DTGLIN are updated for the enabled endpoint direction only.
32.6.2.12 Feedback Operation
Feedback endpoints are endpoints with same the address but in different directions. This is usually used
in explicit feedback mechanism in USB Audio, where a feedback endpoint is associated to one or more
isochronous data endpoints to which it provides feedback service. The feedback endpoint always has the
opposite direction from the data endpoint.
The feedback endpoint always has the opposite direction from the data endpoint(s). The feedback
endpoint has the same endpoint number as the first (lower) data endpoint. A feedback endpoint can be
created by configuring an endpoint with different endpoint size (PCKSIZE.SIZE) and different endpoint
type (EPCFG.EPTYPE0/1) for the IN and OUT direction.
Example Configuration for Feedback Operation:
•
Endpoint n / IN: EPCFG.EPTYPE1 = Interrupt IN, PCKSIZE.SIZE = 64.
•
Endpoint n / OUT: EPCFG.EPTYPE0= Isochronous OUT, PCKSIZE.SIZE = 512.
32.6.2.13 Suspend State and Pad Behavior
The following figure, Pad Behavior, illustrates the behavior of the USB pad in device mode.
Figure 32-7. Pad Behavior
Idle
CTRLA.ENABLE = 1
|
CTRLB.DETACH = 0
| INTFLAG.SUSPEND = 0
CTRLA.ENABLE = 0
|
CTRLB.DETACH = 1
| INTFLAG.SUSPEND = 1
Active
In Idle state, the pad is in low power consumption mode.
In Active state, the pad is active.
The following figure, Pad Events, illustrates the pad events leading to a PAD state change.
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Figure 32-8. Pad Events
Suspend detected
Cleared on Wakeup
Wakeup detected
Active
Cleared by software to acknowledge the interrupt
Idle
Active
The Suspend Interrupt bit in the Device Interrupt Flag register (INTFLAG.SUSPEND) is set when a USB
Suspend state has been detected on the USB bus. The USB pad is then automatically put in the Idle
state. The detection of a non-idle state sets the Wake Up Interrupt bit in INTFLAG(INTFLAG.WAKEUP)
and wakes the USB pad.
The pad goes to the Idle state if the USB module is disabled or if CTRLB.DETACH is written to one. It
returns to the Active state when CTRLA.ENABLE is written to one and CTRLB.DETACH is written to zero.
32.6.2.14 Remote Wakeup
The remote wakeup request (also known as upstream resume) is the only request the device may send
on its own initiative. This should be preceded by a DEVICE_REMOTE_WAKEUP request from the host.
First, the USB must have detected a “Suspend” state on the bus, i.e. the remote wakeup request can only
be sent after INTFLAG.SUSPEND has been set.
The user may then write a one to the Remote Wakeup bit in CTRLB(CTRLB.UPRSM) to send an
Upstream Resume to the host initiating the wakeup. This will automatically be done by the controller after
5 ms of inactivity on the USB bus.
When the controller sends the Upstream Resume INTFLAG.WAKEUP is set and INTFLAG.SUSPEND is
cleared.
The CTRLB.UPRSM is cleared at the end of the transmitting Upstream Resume.
In case of a rebroadcast resume initiated by the host, the End of Resume bit in
INTFLAG(INTFLAG.EORSM) flag is set when the rebroadcast resume is completed.
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In the case where the CTRLB.UPRSM bit is set while a host initiated downstream resume is already
started, the CTRLB.UPRSM is cleared and the upstream resume request is ignored.
32.6.2.15 Link Power Management L1 (LPM-L1) Suspend State Entry and Exit as Device
The LPM Handshake bit in CTRLB.LPMHDSK should be configured to accept the LPM transaction.
When a LPM transaction is received on any enabled endpoint n and a handshake has been sent in
response by the controller according to CTRLB.LPMHDSK, the Device Link Power Manager (EXTREG)
register is updated in the bank 0 of the addressed endpoint's descriptor. It contains information such as
the Best Effort Service Latency (BESL), the Remote Wake bit (bRemoteWake), and the Link State
parameter (bLinkState). Usually, the LPM transaction uses only the endpoint number 0.
If the LPM transaction was positively acknowledged (ACK handshake), USB sets the Link Power
Management Interrupt bit in INTFLAG(INTFLAG.LPMSUSP) bit which indicates that the USB transceiver
is suspended, reducing power consumption. This suspend occurs 9 microseconds after the LPM
transaction according to the specification.
To further reduce consumption, it is recommended to stop the USB clock while the device is suspended.
The MCU can also enter in one of the available sleep modes if the wakeup time latency of the selected
sleep mode complies with the host latency constraint (see the BESL parameter in EXTREG register).
Recovering from this LPM-L1 suspend state is exactly the same as the Suspend state (see Section
Suspend State and Pad Behavior) except that the remote wakeup duration initiated by USB is shorter to
comply with the Link Power Management specification.
If the LPM transaction is responded with a NYET, the Link Power Management Not Yet Interrupt Flag
INTFLAG(INTFLAG.LPMNYET) is set. This generates an interrupt if the Link Power Management Not Yet
Interrupt Enable bit in INTENCLR/SET (INTENCLR/SET.LPMNYET) is set.
If the LPM transaction is responded with a STALL or no handshake, no flag is set, and the transaction is
ignored.
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32.6.2.16 USB Device Interrupt
Figure 32-9. Device Interrupt
EPINTFLAG7.STALL
EPINTENSET7.STALL0/STALL1
EPINTFLAG7.TRFAIL1
EPINTENSET7.TRFAIL1
EPINTFLAG7.TRFAIL0
EPINTSMRY
EPINTENSET7.TRFAIL0
ENDPOINT7
EPINTFLAG7.RXSTP
EPINT7
EPINTENSET7.RXSTP
EPINT6
EPINTFLAG7.TRCPT1
EPINTENSET7.TRCPT1
EPINTFLAG7.TRCPT0
EPINTENSET7.TRCPT0
USB EndPoint
Interrupt
EPINTFLAG0.STALL
EPINTENSET0.STALL0/STALL1
EPINTFLAG0.TRFAIL1
EPINTENSET0.TRFAIL1
EPINTFLAG0.TRFAIL0
EPINTENSET0.TRFAIL0
EPINTFLAG0.RXSTP
ENDPOINT0
EPINT1
EPINT0
EPINTENSET0.RXSTP
EPINTFLAG0.TRCPT1
EPINTENSET0.TRCPT1
EPINTFLAG0.TRCPT0
USB
Interrupt
EPINTENSET0.TRCPT0
INTFLAG.LPMSUSP
INTENSET.LPMSUSP
INTFLAG.LPMNYET
INTENSET.DDISC
INTFLAG.RAMACER
INTENSET.RAMACER
INTFLAG.UPRSM
INTFLAG
INTENSET.UPRSM
INTFLAG.EORSM
USB Device Interrupt
INTENSET.EORSM
INTFLAG.WAKEUP
*
INTENSET.WAKEUP
INTFLAG.EORST
INTENSET.EORST
INTFLAG.SOF
INTENSET.SOF
INTFLAGA.MSOF
INTENSET.MSOF
INTFLAG.SUSPEND
INTENSET.SUSPEND
* Asynchronous interrupt
The WAKEUP is an asynchronous interrupt and can be used to wake-up the device from any sleep mode.
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32.6.3
Host Operations
This section gives an overview of the USB module Host operation during normal transactions. For more
details on general USB and USB protocol, refer to Universal Serial Bus Specification revision 2.1.
32.6.3.1 Device Detection and Disconnection
Prior to device detection the software must set the VBUS is OK bit in CTRLB (CTRLB.VBUSOK) register
when the VBUS is available. This notifies the USB host that USB operations can be started. When the bit
CTRLB.VBUSOK is zero and even if the USB HOST is configured and enabled, host operation is halted.
Setting the bit CTRLB.VBUSOK will allow host operation when the USB is configured.
The Device detection is managed by the software using the Line State field in the Host Status
(STATUS.LINESTATE) register. The device connection is detected by the host controller when DP or DM
is pulled high, depending of the speed of the device.
The device disconnection is detected by the host controller when both DP and DM are pulled down using
the STATUS.LINESTATE registers.
The Device Connection Interrupt bit in INTFLAG (INTFLAG.DCONN) is set if a device connection is
detected.
The Device Disconnection Interrupt bit in INTFLAG (INTFLAG.DDISC) is set if a device disconnection is
detected.
32.6.3.2 Host Terminology
In host mode, the term pipe is used instead of endpoint. A host pipe corresponds to a device endpoint,
refer to "Universal Serial Bus Specification revision 2.1." for more information.
32.6.3.3 USB Reset
The USB sends a USB reset signal when the user writes a one to the USB Reset bit in CTRLB
(CTRLB.BUSRESET). When the USB reset has been sent, the USB Reset Sent Interrupt bit in the
INTFLAG (INTFLAG.RST) is set and all pipes will be disabled.
If the bus was previously in a suspended state (Start of Frame Generation Enable bit in CTRLB
(CTRLB.SOFE) is zero) the USB will switch it to the Resume state, causing the bus to asynchronously set
the Host Wakeup Interrupt flag (INTFLAG.WAKEUP). The CTRLB.SOFE bit will be set in order to
generate SOFs immediately after the USB reset.
During USB reset the following registers are cleared:
•
•
•
•
•
•
•
All Host Pipe Configuration register (PCFG)
Host Frame Number register (FNUM)
Interval for the Bulk-Out/Ping transaction register (BINTERVAL)
Host Start-of-Frame Control register (HSOFC)
Pipe Interrupt Enable Clear/Set register (PINTENCLR/SET)
Pipe Interrupt Flag register (PINTFLAG)
Pipe Freeze bit in Pipe Status register (PSTATUS.FREEZE)
After the reset the user should check the Speed Status field in the Status register (STATUS.SPEED) to
find out the current speed according to the capability of the peripheral.
32.6.3.4 Pipe Configuration
Pipe data can be placed anywhere in the RAM. The USB controller accesses these pipes directly through
the AHB master (built-in DMA) with the help of the pipe descriptors. The base address of the pipe
descriptors needs to be written in the Descriptor Address register (DESCADD) by the user. Refer also to
Pipe Descriptor Structure.
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Before using a pipe, the user should configure the direction and type of the pipe in Type of Pipe field in
the Host Pipe Configuration register (PCFG.PTYPE). The pipe descriptor registers should be initialized to
known values before using the pipe, so that the USB controller does not read the random values from the
RAM.
The Pipe Size field in the Packet Size register (PCKSIZE.SIZE) should be configured as per the size
reported by the device for the endpoint associated with this pipe. The Address of Data Buffer register
(ADDR) should be set to the data buffer used for pipe transfers.
The Pipe Bank bit in PCFG (PCFG.BK) should be set to one if dual banking is desired. Dual bank is not
supported for Control pipes.
The Ram Access Interrupt bit in Host Interrupt Flag register (INTFLAG.RAMACER) is set when a RAM
access underflow error occurs during an OUT stage.
When a pipe is disabled, the following registers are cleared for that pipe:
•
Interval for the Bulk-Out/Ping transaction register (BINTERVAL)
•
•
•
Pipe Interrupt Enable Clear/Set register (PINTENCLR/SET)
Pipe Interrupt Flag register (PINTFLAG)
Pipe Freeze bit in Pipe Status register (PSTATUS.FREEZE)
32.6.3.5 Pipe Activation
A disabled pipe is inactive, and will be reset along with its context registers (pipe registers for the pipe n).
Pipes are enabled by writing Type of the Pipe in PCFG (PCFG.PTYPE) to a value different than 0x0
(disabled).
When a pipe is enabled, the Pipe Freeze bit in Pipe Status register (PSTATUS.FREEZE) is set. This allow
the user to complete the configuration of the pipe, without starting a USB transfer.
When starting an enumeration, the user retrieves the device descriptor by sending an
GET_DESCRIPTOR USB request. This descriptor contains the maximal packet size of the device default
control endpoint (bMaxPacketSize0) which the user should use to reconfigure the size of the default
control pipe.
32.6.3.6 Pipe Address Setup
Once the device has answered the first host requests with the default device address 0, the host assigns
a new address to the device. The host controller has to send a USB reset to the device and a
SET_ADDRESS(addr) SETUP request with the new address to be used by the device. Once this SETUP
transaction is complete, the user writes the new address to the Pipe Device Address field in the Host
Control Pipe register (CTRL_PIPE.PDADDR) in Pipe descriptor. All following requests by this pipe will be
performed using this new address.
32.6.3.7 Suspend and Wakeup
Setting CTRLB.SOFE to zero when in host mode will cause the USB to cease sending Start-of-Frames
on the USB bus and enter the Suspend state. The USB device will enter the Suspend state 3ms later.
Before entering suspend by writing CTRLB.SOFE to zero, the user must freeze the active pipes by
setting their PSTATUS.FREEZE bit. Any current on-going pipe will complete its transaction, and then all
pipes will be inactive. The user should wait at least 1 complete frame before entering the suspend mode
to avoid any data loss.
The device can awaken the host by sending an Upstream Resume (Remote Wakeup feature). When the
host detects a non-idle state on the USB bus, it sets the INTFLAG.WAKEUP. If the non-idle bus state
corresponds to an Upstream Resume (K state), the Upstream Resume Received Interrupt bit in INTFLAG
(INTFLAG.UPRSM) is set and the user must generate a Downstream Resume within 1 ms and for at
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least 20 ms. It is required to first write a one to the Send USB Resume bit in CTRLB (CTRLB.RESUME)
to respond to the upstream resume with a downstream resume. Alternatively, the host can resume from a
suspend state by sending a Downstream Resume on the USB bus (CTRLB.RESUME set to 1). In both
cases, when the downstream resume is completed, the CTRLB.SOFE bit is automatically set and the
host enters again the active state.
32.6.3.8 Phase-locked SOFs
To support the Synchronous Endpoints capability, the period of the emitted Start-of-Frame is maintained
while the USB connection is not in the active state. This does not apply for the disconnected/connected/
reset states. It applies for active/idle/suspend/resume states. The period of Start-of-Frame will be 1ms
when the USB connection is in active state and an integer number of milli-seconds across idle/suspend/
resume states.
To ensure the Synchronous Endpoints capability, the GCLK_USB clock must be kept running. If the
GCLK_USB is interrupted, the period of the emitted Start-of-Frame will be erratic.
32.6.3.9 Management of Control Pipes
A control transaction is composed of three stages:
•
•
•
SETUP
Data (IN or OUT)
Status (IN or OUT)
The user has to change the pipe token according to each stage using the Pipe Token field in PCFG
(PCFG.PTOKEN).
For control pipes only, the token is assigned a specific initial data toggle sequence:
•
•
•
SETUP: Data0
IN: Data1
OUT: Data1
32.6.3.10 Management of IN Pipes
IN packets are sent by the USB device controller upon IN request reception from the host. All the
received data from the device to the host will be stored in the bank provided the bank is empty. The pipe
and its descriptor in RAM must be configured.
The host indicates it is able to receive data from the device by clearing the Bank 0/1 Ready bit in
PSTATUS (PSTATUS.BK0/1RDY), which means that the memory for the bank is available for new USB
transfer.
The USB will perform IN requests as long as the pipe is not frozen by the user.
The generation of IN requests starts when the pipe is unfrozen (PSTATUS.PFREEZE is set to zero).
When the current bank is full, the Transmit Complete 0/1 bit in PINTFLAG (PINTFLAG.TRCPT0/1) will be
set and trigger an interrupt if enabled and the PSTATUS.BK0/1RDY bit will be set.
PINTFLAG.TRCPT0/1 must be cleared by software to acknowledge the interrupt. This is done by writing
a one to the PINTFLAG.TRCPT0/1 of the addressed pipe.
The user reads the PCKSIZE.BYTE_COUNT to know how many bytes should be read.
To free the bank the user must read the IN data from the address ADDR in the pipe descriptor and clear
the PKSTATUS.BK0/1RDY bit. When the IN pipe is composed of multiple banks, a successful IN
transaction will switch to the next bank. Another IN request will be performed by the host as long as the
PSTATUS.BK0/1RDY bit for that bank is set. The PINTFLAG.TRCPT0/1 and PSTATUS.BK0/1RDY will be
updated accordingly.
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The user can follow the current bank looking at Current Bank bit in PSTATUS (PSTATUS.CURBK) and by
looking at Data Toggle for IN pipe bit in PSTATUS (PSTATUS.DTGLIN).
When the pipe is configured as single bank (Pipe Bank bit in PCFG (PCFG.BK) is 0), only
PINTFLAG.TRCPT0 and PSTATUS.BK0 are used. When the pipe is configured as dual bank (PCFG.BK
is 1), both PINTFLAG.TRCPT0/1 and PSTATUS.BK0/1 are used.
32.6.3.11 Management of OUT Pipes
OUT packets are sent by the host. All the data stored in the bank will be sent to the device provided the
bank is filled. The pipe and its descriptor in RAM must be configured.
The host can send data to the device by writing to the data bank 0 in single bank or the data bank 0/1 in
dual bank.
The generation of OUT packet starts when the pipe is unfrozen (PSTATUS.PFREEZE is zero).
The user writes the OUT data to the data buffer pointer by ADDR in the pipe descriptor and allows the
USB to send the data by writing a one to the PSTATUS.BK0/1RDY. This will also cause a switch to the
next bank if the OUT pipe is part of a dual bank configuration.
PINTFLAGn.TRCPT0/1 must be cleared before setting PSTATUS.BK0/1RDY to avoid missing an
PINTFLAGn.TRCPT0/1 event.
32.6.3.12 Alternate Pipe
The user has the possibility to run sequentially several logical pipes on the same physical pipe. It allows
addressing of any device endpoint of any attached device on the bus.
Before switching pipe, the user should save the pipe context (Pipe registers and descriptor for pipe n).
After switching pipe, the user should restore the pipe context (Pipe registers and descriptor for pipe n)
and in particular PCFG, and PSTATUS.
32.6.3.13 Data Flow Error
This error exists only for isochronous and interrupt pipes for both IN and OUT directions. It sets the
Transmit Fail bit in PINTFLAG (PINTFLAG.TRFAIL), which triggers an interrupt if the Transmit Fail bit in
PINTENCLR/SET(PINTENCLR/SET.TRFAIL) is set. The user must check the Pipe Interrupt Summary
register (PINTSMRY) to find out the pipe which triggered the interrupt. Then the user must check the
origin of the interrupt’s bank by looking at the Pipe Bank Status register (STATUS_BK) for each bank. If
the Error Flow bit in the STATUS_BK (STATUS_BK.ERRORFLOW) is set then the user is able to
determine the origin of the data flow error. As the user knows that the endpoint is an IN or OUT the error
flow can be deduced as OUT underflow or as an IN overflow.
An underflow can occur during an OUT stage if the host attempts to send data from an empty bank. If a
new transaction is successful, the relevant bank descriptor STATUS_BK.ERRORFLOW will be cleared.
An overflow can occur during an IN stage if the device tries to send a packet while the bank is full.
Typically this occurs when a CPU is not fast enough. The packet data is not written to the bank and is
lost. If a new transaction is successful, the relevant bank descriptor STATUS_BK.ERRORFLOW will be
cleared.
32.6.3.14 CRC Error
This error exists only for isochronous IN pipes. It sets the PINTFLAG.TRFAIL, which triggers an interrupt
if PINTENCLR/SET.TRFAIL is set. The user must check the PINTSMRY to find out the pipe which
triggered the interrupt. Then the user must check the origin of the interrupt’s bank by looking at the bank
descriptor STATUS_BK for each bank and if the CRC Error bit in STATUS_BK (STATUS_BK.CRCERR) is
set then the user is able to determine the origin of the CRC error. A CRC error can occur during the IN
stage if the USB detects a corrupted packet. The IN packet will remain stored in the bank and
PINTFLAG.TRCPT0/1 will be set.
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32.6.3.15 PERR Error
This error exists for all pipes. It sets the PINTFLAG.PERR Interrupt, which triggers an interrupt if
PINTFLAG.PERR is set. The user must check the PINTSMRY register to find out the pipe which can
cause an interrupt.
A PERR error occurs if one of the error field in the STATUS_PIPE register in the Host pipe descriptor is
set and the Error Count field in STATUS_PIPE (STATUS_PIPE.ERCNT) exceeds the maximum allowed
number of Pipe error(s) as defined in Pipe Error Max Number field in CTRL_PIPE
(CTRL_PIPE.PERMAX). Refer to section STATUS_PIPE register.
If one of the error field in the STATUS_PIPE register from the Host Pipe Descriptor is set and the
STATUS_PIPE.ERCNT is less than the CTRL_PIPE.PERMAX, the STATUS_PIPE.ERCNT is
incremented.
32.6.3.16 Link Power Management L1 (LPM-L1) Suspend State Entry and Exit as Host.
An EXTENDED LPM transaction can be transmitted by any enabled pipe. The PCFGn.PTYPE should be
set to EXTENDED. Other fields as PCFG.PTOKEN, PCFG.BK and PCKSIZE.SIZE are irrelevant in this
configuration. The user should also set the EXTREG.VARIABLE in the descriptor as described in
EXTREG register.
When the pipe is configured and enabled, an EXTENDED TOKEN followed by a LPM TOKEN are
transmitted. The device responds with a valid HANDSHAKE, corrupted HANDSHAKE or no
HANDSHAKE (TIME-OUT).
If the valid HANDSHAKE is an ACK, the host will immediately proceed to L1 SLEEP and the
PINTFLAG.TRCT0 is set. The minimum duration of the L1 SLEEP state will be the
TL1RetryAndResidency as defined in the reference document "ENGINEERING CHANGE NOTICE, USB
2.0 Link Power Management Addendum". When entering the L1 SLEEP state, the CTRLB.SOFE is
cleared, avoiding Start-of-Frame generation.
If the valid HANDSHAKE is a NYET PINTFLAG.TRFAIL is set.
If the valid HANDSHAKE is a STALL the PINTFLAG.STALL is set.
If there is no HANDSHAKE or corrupted HANDSHAKE, the EXTENDED/LPM pair of TOKENS will be
transmitted again until reaching the maximum number of retries as defined by the CTRL_PIPE.PERMAX
in the pipe descriptor.
If the last retry returns no valid HANDSHAKE, the PINTFLAGn.PERR is set, and the STATUS_BK is
updated in the pipe descriptor.
All LPM transactions, should they end up with a ACK, a NYET, a STALL or a PERR, will set the
PSTATUS.PFREEZE bit, freezing the pipe before a succeeding operation. The user should unfreeze the
pipe to start a new LPM transaction.
To exit the L1 STATE, the user initiate a DOWNSTREAM RESUME by setting the bit CTRLB.RESUME or
a L1 RESUME by setting the Send L1 Resume bit in CTRLB (CTRLB.L1RESUME). In the case of a L1
RESUME, the K STATE duration is given by the BESL bit field in the EXTREG.VARIABLE field. See
EXTREG.
When the host is in the L1 SLEEP state after a successful LPM transmitted, the device can initiate an
UPSTREAM RESUME. This will set the Upstream Resume Interrupt bit in INTFLAG (INTFLAG.UPRSM).
The host should proceed then to a L1 RESUME as described above.
After resuming from the L1 SLEEP state, the bit CTRLB.SOFE is set, allowing Start-of-Frame generation.
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32.6.3.17 Host Interrupt
Figure 32-10. Host Interrupt
PINTFLAG7.STALL
PINTENSET.STALL
PINTFLAG7.PERR
PINTENSET.PERR
PINTFLAG7.TRFAIL
PINTENSET.TRFAIL
PIPE7
PINTFLAG7.TXSTP
PINTSMRY
PINT7
PINTENSET.TXSTP
PINT6
PINTFLAG7.TRCPT1
PINTENSET.TRCPT1
PINTFLAG7.TRCPT0
PINTENSET.TRCPT0
USB PIPE
Interrupt
PINTFLAG0.STALL
PINTENSET.STALL
PINTFLAG0.PERR
PINTENSET.PERR
PINTFLAG0.TRFAIL
PINTENSET.TRFAIL
PINTFLAG0.TXSTP
PIPE0
PINT1
PINT0
PINTENSET.TXSTP
PINTFLAG0.TRCPT1
PINTENSET.TRCPT1
PINTFLAG0.TRCPT0
USB
Interrupt
PINTENSET.TRCPT0
INTFLAG.DDISC *
INTENSET.DDISC
INTFLAG.DCONN *
INTENSET.DCONN
INTFLAG.RAMACER
INTFLAGA
INTENSET.RAMACER
INTFLAG.UPRSM
USB Host Interrupt
INTENSET.UPRSM
INTFLAG.DNRSM
INTENSET.DNRSM
INTFLAG.WAKEUP *
INTENSET.WAKEUP
INTFLAG.RST
INTENSET.RST
INTFLAG.HSOF
INTENSET.HSOF
* Asynchronous interrupt
The WAKEUP is an asynchronous interrupt and can be used to wake-up the device from any sleep mode.
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Datasheet Complete
40001882A-page 658
32-bit ARM-Based Microcontrollers
32.7
Register Summary
The register mapping depends on the Operating Mode field in the Control A register (CTRLA.MODE).
The register summary is detailed below.
32.7.1
Common Device Summary
Offset
Name
Bit Pos.
0x00
CTRLA
7:0
0x01
Reserved
0x02
SYNCBUSY
7:0
0x03
QOSCTRL
7:0
0x0D
FSMSTATUS
7:0
0x24
0x25
0x26
DESCADD
0x27
0x28
0x29
32.7.2
PADCAL
MODE
RUNSTBY
DQOS[1:0]
ENABLE
SWRST
ENABLE
SWRST
CQOS[1:0]
FSMSTATE[6:0]
7:0
DESCADD[7:0]
15:8
DESCADD[15:8]
23:16
DESCADD[23:16]
31:24
DESCADD[31:24]
7:0
TRANSN[1:0]
15:8
TRANSP[4:0]
TRIM[2:0]
TRANSN[4:2]
Device Summary
Table 32-1. General Device Registers
Offset
Name
0x04
Reserved
0x05
Reserved
0x06
Reserved
0x07
Reserved
0x08
0x09
CTRLB
0x0A
DADD
0x0B
Reserved
0x0C
STATUS
0x0E
Reserved
0x0F
Reserved
0x10
0x11
0x12
0x14
0x15
FNUM
INTENCLR
Reserved
0x17
Reserved
0x19
INTENSET
0x1A
Reserved
0x1B
Reserved
0x1C
0x1D
7:0
NREPLY
15:8
ADDEN
7:0
SPDCONF[1:0]
UPRSM
LPMHDSK[1:0]
GNAK
DETACH
DADD[6:0]
LINESTATE[1:0]
7:0
SPEED[1:0]
FNUM[4:0]
15:8
FNCERR
7:0
RAMACER
FNUM[10:5]
Reserved
0x16
0x18
Bit Pos.
INTFLAG
UPRSM
EORSM
WAKEUP
EORST
SOF
15:8
7:0
LPMSUSP
RAMACER
UPRSM
EORSM
WAKEUP
EORST
SOF
15:8
7:0
SUSPEND
SUSPEND
LPMSUSP
RAMACER
UPRSM
EORSM
WAKEUP
EORST
15:8
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SOF
LPMNYET
SUSPEND
LPMSUSP
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LPMNYET
40001882A-page 659
32-bit ARM-Based Microcontrollers
Offset
Name
0x1E
Reserved
0x1F
Reserved
0x20
0x21
EPINTSMRY
0x22
Reserved
0x23
Reserved
Bit Pos.
7:0
EPINT[7:0]
15:8
EPINT[15:8]
Table 32-2. Device Endpoint Register n
Offset
Name
Bit Pos.
0x1m0
EPCFGn
7:0
0x1m1
Reserved
0x1m2
Reserved
EPTYPE1[1:0]
EPTYPE0[1:0]
0x1m3
Reserved
0x1m4
EPSTATUSCLRn
7:0
BK1RDY
BK0RDY
STALLRQ1
STALLRQ0
CURBK
DTGLIN
DTGLOUT
0x1m5
EPSTATUSSETn
7:0
BK1RDY
BK0RDY
STALLRQ1
STALLRQ0
CURBK
DTGLIN
DTGLOUT
0x1m6
EPSTATUSn
7:0
BK1RDY
BK0RDY
STALLRQ1
STALLRQ0
CURBK
DTGLIN
DTGLOUT
0x1m7
EPINTFLAGn
7:0
STALL1
STALL0
RXSTP
TRFAIL1
TRFAIL0
TRCPT1
TRCPT0
0x1m8
EPINTENCLRn
7:0
STALL1
STALL0
RXSTP
TRFAIL1
TRFAIL0
TRCPT1
TRCPT0
0x1m9
EPINTENSETn
7:0
STALL1
STALL0
RXSTP
TRFAIL1
TRFAIL0
TRCPT1
TRCPT0
0x1mA
Reserved
0x1mB
Reserved
Table 32-3. Device Endpoint n Descriptor Bank 0
Offset
Name
Bit Pos.
0x n0 +
index
0x00
7:0
ADD[7:0]
0x01
15:8
ADD[15:8]
23:16
ADD[23:16]
0x02
ADDR
0x03
31:24
ADD[31:24]
0x04
7:0
BYTE_COUNT[7:0]
0x05
0x06
PCKSIZE
15:8
0x07
31:24
0x08
7:0
0x09
EXTREG
MULTI_PACKET_SIZE[1:0]
BYTE_COUNT[13:8]
23:16
MULTI_PACKET_SIZE[9:2]
AUTO_ZLP
15:8
0x0A
STATUS_BK
7:0
0x0B
Reserved
7:0
0x0C
Reserved
7:0
0x0D
Reserved
7:0
0x0E
Reserved
7:0
0x0F
Reserved
7:0
© 2017 Microchip Technology Inc.
SIZE[2:0]
MULTI_PACKET_SIZE[13:10]
VARIABLE[3:0]
SUBPID[3:0]
VARIABLE[10:4]
ERRORFLOW
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CRCERR
40001882A-page 660
32-bit ARM-Based Microcontrollers
Table 32-4. Device Endpoint n Descriptor Bank 1
Offset
Name
Bit Pos.
0x n0 +
0x10 +
index
0x00
0x01
0x02
7:0
ADDR
ADD[7:0]
15:8
ADD[15:8]
23:16
ADD[23:16]
0x03
31:24
ADD[31:24]
0x04
7:0
BYTE_COUNT[7:0]
0x05
0x06
PCKSIZE
0x07
0x08
15:8
BYTE_COUNT[13:8]
23:16
31:24
Reserved
7:0
0x09
Reserved
15:8
0x0A
STATUS_BK
7:0
0x0B
Reserved
7:0
0x0C
Reserved
7:0
0x0D
Reserved
7:0
0x0E
Reserved
7:0
0x0F
Reserved
7:0
32.7.3
MULTI_PACKET_SIZE[1:0]
MULTI_PACKET_SIZE[9:2]
AUTO_ZLP
SIZE[2:0]
MULTI_PACKET_SIZE[13:10]
ERRORFLOW
CRCERR
Host Summary
Table 32-5. General Host Registers
Offset
Name
0x04
Reserved
0x05
Reserved
0x06
Reserved
0x07
Reserved
0x08
0x09
CTRLB
0x0A
HSOFC
0x0B
Reserved
0x0C
STATUS
0x0E
Reserved
0x0F
Reserved
0x10
0x11
0x12
0x14
0x15
FNUM
FLENHIGH
INTENCLR
0x16
Reserved
0x17
Reserved
0x18
0x19
0x1A
INTENSET
Bit Pos.
7:0
TSTK
TSTJ
SPDCONF[1:0]
15:8
7:0
7:0
L1RESUME
FLENCE
LINESTATE[1:0]
SOFE
SPEED[1:0]
FNUM[4:0]
15:8
FNUM[10:5]
7:0
FLENHIGH[7:0]
RAMACER
UPRSM
DNRSM
WAKEUP
RST
HSOF
15:8
7:0
BUSRESET
FLENC[3:0]
7:0
7:0
RESUME
VBUSOK
RAMACER
UPRSM
DNRSM
WAKEUP
15:8
RST
DDISC
DCONN
DDISC
DCONN
HSOF
Reserved
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32-bit ARM-Based Microcontrollers
Offset
Name
0x1B
Reserved
0x1C
0x1D
INTFLAG
0x1E
Reserved
0x1F
Reserved
0x20
0x21
0x22
PINTSMRY
Bit Pos.
7:0
RAMACER
UPRSM
DNRSM
WAKEUP
RST
HSOF
15:8
DDISC
7:0
PINT[7:0]
15:8
PINT[15:8]
DCONN
Reserved
0x23
Table 32-6. Host Pipe Register n
Offset
Name
Bit Pos.
0x1m0
PCFGn
7:0
0x1m1
Reserved
PTYPE[2:0]
BK
PTOKEN[1:0]
0x1m2
Reserved
0x1m3
BINTERVAL
7:0
0x1m4
PSTATUSCLRn
7:0
BK1RDY
BK0RDY
PFREEZE
CURBK
DTGL
0x1m5
PSTATUSETn
7:0
BK1RDY
BK0RDY
PFREEZE
CURBK
DTGL
0x1m6
PSTATUSn
7:0
BK1RDY
BK0RDY
PFREEZE
CURBK
DTGL
BINTERVAL[7:0]
0x1m7
PINTFLAGn
7:0
STALL
TXSTP
PERR
TRFAIL
TRCPT1
TRCPT0
0x1m8
PINTENCLRn
7:0
STALL
TXSTP
PERR
TRFAIL
TRCPT1
TRCPT0
0x1m9
PINTENSETn
7:0
STALL
TXSTP
PERR
TRFAIL
TRCPT1
TRCPT0
0x1mA
Reserved
0x1mB
Reserved
Table 32-7. Host Pipe n Descriptor Bank 0
Offset
Name
Bit Pos.
0x n0 +
index
0x00
7:0
ADD[7:0]
0x01
15:8
ADD[15:8]
23:16
ADD[23:16]
31:24
ADD[31:24]
0x02
ADDR
0x03
0x04
7:0
0x05
15:8
0x06
PCKSIZE
31:24
0x08
7:0
0x0A
EXTREG
STATUS_BK
0x0B
0x0C
0x0D
0x0E
0x0F
BYTE_COUNT[13:8]
23:16
0x07
0x09
BYTE_COUNT[7:0]
MULTI_PACKET_SIZE[1:0]
MULTI_PACKET_SIZE[9:2]
AUTO_ZLP
SIZE[2:0]
MULTI_PACKET_SIZE[13:10]
VARIABLE[3:0]
SUBPID[3:0]
15:8
VARIABLE[10:4]
7:0
ERRORFLOW
CRCERR
15:8
CTRL_PIPE
STATUS_PIPE
7:0
15:8
7:0
PDADDR[6:0]
PEPMAX[3:0]
ERCNT[2:0]
PEPNUM[3:0]
CRC16ER
TOUTER
PIDER
DAPIDER
DTGLER
15:8
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40001882A-page 662
32-bit ARM-Based Microcontrollers
Table 32-8. Host Pipe n Descriptor Bank 1
Offset
Name
Bit Pos.
0x n0
+0x10
+index
0x00
0x01
0x02
7:0
ADDR
ADD[7:0]
15:8
ADD[15:8]
23:16
ADD[23:16]
0x03
31:24
ADD[31:24]
0x04
7:0
BYTE_COUNT[7:0]
0x05
0x06
PCKSIZE
15:8
31:24
0x08
7:0
0x09
0x0B
MULTI_PACKET_SIZE[13:10]
ERRORFLOW
CRCERR
DAPIDER
DTGLER
15:8
7:0
15:8
32.8
SIZE[2:0]
7:0
0x0D
0x0F
MULTI_PACKET_SIZE[9:2]
AUTO_ZLP
15:8
STATUS_BK
0x0C
0x0E
BYTE_COUNT[13:8]
23:16
0x07
0x0A
MULTI_PACKET_SIZE[1:0
STATUS_PIPE
7:0
ERCNT[2:0]
CRC16ER
TOUTER
PIDER
15:8
Register Description
Registers can be 8, 16, or 32 bits wide. Atomic 8-, 16-, and 32-bit accesses are supported. In addition,
the 8-bit quarters and 16-bit halves of a 32-bit register, and the 8-bit halves of a 16-bit register can be
accessed directly.
Some registers require synchronization when read and/or written. Synchronization is denoted by the
"Read-Synchronized" and/or "Write-Synchronized" property in each individual register description.
Optional write-protection by the Peripheral Access Controller (PAC) is denoted by the "PAC WriteProtection" property in each individual register description.
Some registers are enable-protected, meaning they can only be written when the module is disabled.
Enable-protection is denoted by the "Enable-Protected" property in each individual register description.
Refer to the Register Access Protection, PAC - Peripheral Access Controller and GCLK Synchronization
for details.
Related Links
PAC - Peripheral Access Controller
32.8.1
Communication Device Host Registers
32.8.1.1 Control A
Name: CTRLA
Offset: 0x00
Reset: 0x00
Property: PAC Write-Protection, Write-Synchronised
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32-bit ARM-Based Microcontrollers
Bit
Access
Reset
2
1
0
MODE
7
6
5
4
3
RUNSTDBY
ENABLE
SWRST
R/W
R/W
R/W
R/W
0
0
0
0
Bit 7 – MODE: Operating Mode
This bit defines the operating mode of the USB.
Value
0
1
Description
USB Device mode
USB Host mode
Bit 2 – RUNSTDBY: Run in Standby Mode
This bit is Enable-Protected.
Value
0
1
Description
USB clock is stopped in standby mode.
USB clock is running in standby mode
Bit 1 – ENABLE: Enable
Due to synchronization there is delay from writing CTRLA.ENABLE until the peripheral is enabled/
disabled. The value written to CTRLA.ENABLE will read back immediately and the Synchronization status
enable bit in the Synchronization Busy register (SYNCBUSY.ENABLE) will be set. SYNCBUSY.ENABLE
will be cleared when the operation is complete.
This bit is Write-Synchronized.
Value
0
1
Description
The peripheral is disabled or being disabled.
The peripheral is enabled or being enabled.
Bit 0 – SWRST: Software Reset
Writing a zero to this bit has no effect.
Writing a '1' to this bit resets all registers in the USB, to their initial state, and the USB will be disabled.
Writing a '1' to CTRLA.SWRST will always take precedence, meaning that all other writes in the same
write-operation will be discarded.
Due to synchronization there is a delay from writing CTRLA.SWRST until the reset is complete.
CTRLA.SWRST and SYNCBUSY.SWRST will both be cleared when the reset is complete.
This bit is Write-Synchronized.
Value
0
1
Description
There is no reset operation ongoing.
The reset operation is ongoing.
32.8.1.2 Synchronization Busy
Name: SYNCBUSY
Offset: 0x02
Reset: 0x00
Property:
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32-bit ARM-Based Microcontrollers
Bit
7
6
5
4
3
2
1
0
ENABLE
SWRST
Access
R
R
Reset
0
0
Bit 1 – ENABLE: Synchronization Enable status bit
This bit is cleared when the synchronization of ENABLE register between the clock domains is complete.
This bit is set when the synchronization of ENABLE register between clock domains is started.
Bit 0 – SWRST: Synchronization Software Reset status bit
This bit is cleared when the synchronization of SWRST register between the clock domains is complete.
This bit is set when the synchronization of SWRST register between clock domains is started.
32.8.1.3 QOS Control
Name: QOSCTRL
Offset: 0x03
Reset: 0x05
Property: PAC Write-Protection
Bit
7
6
5
4
3
2
1
DQOS[1:0]
Access
Reset
0
CQOS[1:0]
R/W
R/W
R/W
R/W
0
1
0
1
Bits 3:2 – DQOS[1:0]: Data Quality of Service
These bits define the memory priority access during the endpoint or pipe read/write data operation. Refer
to SRAM Quality of Service.
Bits 1:0 – CQOS[1:0]: Configuration Quality of Service
These bits define the memory priority access during the endpoint or pipe read/write configuration
operation. Refer to SRAM Quality of Service.
32.8.1.4 Finite State Machine Status
Name: FSMSTATUS
Offset: 0x0D
Reset: 0xXXXX
Property: Read only
Bit
7
6
5
4
3
2
1
0
FSMSTATE[6:0]
Access
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
1
Bits 6:0 – FSMSTATE[6:0]: Fine State Machine Status
These bits indicate the state of the finite state machine of the USB controller.
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32-bit ARM-Based Microcontrollers
Value
0x01
0x02
0x04
0x08
0x10
0x20
0x40
Others
Name
OFF (L3)
ON (L0)
SUSPEND (L2)
SLEEP (L1)
DNRESUME
UPRESUME
RESET
Description
Corresponds to the powered-off, disconnected, and disabled state.
Corresponds to the Idle and Active states.
Down Stream Resume.
Up Stream Resume.
USB lines Reset.
Reserved
32.8.1.5 Descriptor Address
Name: DESCADD
Offset: 0x24
Reset: 0x00000000
Property: PAC Write-Protection
Bit
31
30
29
28
27
26
25
24
DESCADD[31:24]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
23
22
21
20
19
18
17
16
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
8
DESCADD[23:16]
Access
DESCADD[15:8]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
DESCADD[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 31:0 – DESCADD[31:0]: Descriptor Address Value
These bits define the base address of the main USB descriptor in RAM. The two least significant bits
must be written to zero.
32.8.1.6 Pad Calibration
The Pad Calibration values must be loaded from the NVM Software Calibration Area into the USB Pad
Calibration register by software, before enabling the USB, to achieve the specified accuracy.
Refer to NVM Software Calibration Area Mapping for further details.
Refer to for further details.
Name: PADCAL
Offset: 0x28
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32-bit ARM-Based Microcontrollers
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
11
10
TRIM[2:0]
Access
TRANSN[4:2]
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
6
5
4
2
1
0
7
3
TRANSN[1:0]
Access
Reset
8
R/W
Reset
Bit
9
TRANSP[4:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
9
8
Bits 14:12 – TRIM[2:0]: Trim bits for DP/DM
These bits calibrate the matching of rise/fall of DP/DM.
Bits 10:6 – TRANSN[4:0]: Trimmable Output Driver Impedance N
These bits calibrate the NMOS output impedance of DP/DM drivers.
Bits 4:0 – TRANSP[4:0]: Trimmable Output Driver Impedance P
These bits calibrate the PMOS output impedance of DP/DM drivers.
32.8.2
Device Registers - Common
32.8.2.1 Control B
Name: CTRLB
Offset: 0x08
Reset: 0x0001
Property: PAC Write-Protection
Bit
15
14
13
12
11
10
LPMHDSK[1:0]
Access
Reset
Bit
7
6
5
4
NREPLY
GNAK
R/W
R/W
R/W
0
0
0
3
2
1
0
UPRSM
DETACH
Access
R
R/W
SPDCONF[1:0]
R/W
R/W
R/W
Reset
0
0
0
0
0
Bits 11:10 – LPMHDSK[1:0]: Link Power Management Handshake
These bits select the Link Power Management Handshake configuration.
Value
0x0
0x1
0x2
0x3
Description
No handshake. LPM is not supported.
ACK
NYET
Reserved
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32-bit ARM-Based Microcontrollers
Bit 9 – GNAK: Global NAK
This bit configures the operating mode of the NAK.
This bit is not synchronized.
Value
0
1
Description
The handshake packet reports the status of the USB transaction
A NAK handshake is answered for each USB transaction regardless of the current endpoint
memory bank status
Bit 4 – NREPLY: No reply excepted SETUP Token
This bit is cleared by hardware when receiving a SETUP packet.
This bit has no effect for any other endpoint but endpoint 0.
Value
0
1
Description
Disable the “NO_REPLY” feature: Any transaction to endpoint 0 will be handled according to
the USB2.0 standard.
Enable the “NO_REPLY” feature: Any transaction to endpoint 0 will be ignored except
SETUP.
Bits 3:2 – SPDCONF[1:0]: Speed Configuration
These bits select the speed configuration.
Value
0x0
0x1
0x2
0x3
Description
FS: Full-speed
LS: Low-speed
Reserved
Reserved
Bit 1 – UPRSM: Upstream Resume
This bit is cleared when the USB receives a USB reset or once the upstream resume has been sent.
Value
0
1
Description
Writing a zero to this bit has no effect.
Writing a one to this bit will generate an upstream resume to the host for a remote wakeup.
Bit 0 – DETACH: Detach
Value
0
1
Description
The device is attached to the USB bus so that communications may occur.
It is the default value at reset. The internal device pull-ups are disabled, removing the device
from the USB bus.
32.8.2.2 Device Address
Name: DADD
Offset: 0x0A
Reset: 0x00
Property: PAC Write-Protection
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Bit
7
6
5
4
3
ADDEN
Access
Reset
2
1
0
DADD[6:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bit 7 – ADDEN: Device Address Enable
This bit is cleared when a USB reset is received.
Value
0
Description
Writing a zero will deactivate the DADD field (USB device address) and return the device to
default address 0.
Writing a one will activate the DADD field (USB device address).
1
Bits 6:0 – DADD[6:0]: Device Address
These bits define the device address. The DADD register is reset when a USB reset is received.
32.8.2.3 Status
Name: STATUS
Offset: 0x0C
Reset: 0x40
Property:
Bit
7
6
5
4
3
LINESTATE[1:0]
2
1
0
SPEED[1:0]
Access
R
R
R/W
R/W
Reset
0
1
0
1
Bits 7:6 – LINESTATE[1:0]: USB Line State Status
These bits define the current line state DP/DM.
LINESTATE[1:0]
USB Line Status
0x0
SE0/RESET
0x1
FS-J or LS-K State
0x2
FS-K or LS-J State
Bits 3:2 – SPEED[1:0]: Speed Status
These bits define the current speed used of the device
.
SPEED[1:0]
SPEED STATUS
0x0
Low-speed mode
0x1
Full-speed mode
0x2
Reserved
0x3
Reserved
32.8.2.4 Device Frame Number
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32-bit ARM-Based Microcontrollers
Name: FNUM
Offset: 0x10
Reset: 0x0000
Property: Read only
Bit
15
14
13
12
11
FNCERR
10
9
8
FNUM[10:5]
Access
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
Bit
7
5
4
3
2
1
0
6
FNUM[4:0]
MFNUM[2:0]
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bit 15 – FNCERR: Frame Number CRC Error
This bit is cleared upon receiving a USB reset.
This bit is set when a corrupted frame number (or micro-frame number) is received.
This bit and the SOF (or MSOF) interrupt bit are updated at the same time.
Bits 13:3 – FNUM[10:0]: Frame Number
These bits are cleared upon receiving a USB reset.
These bits are updated with the frame number information as provided from the last SOF packet even if a
corrupted SOF is received.
Bits 2:0 – MFNUM[2:0]: Micro Frame Number
These bits are cleared upon receiving a USB reset or at the beginning of each Start-of-Frame (SOF
interrupt).
These bits are updated with the micro-frame number information as provided from the last MSOF packet
even if a corrupted MSOF is received.
32.8.2.5 Device Interrupt Enable Clear
This register allows the user to disable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Interrupt Enable Set (INTENSET) register.
Name: INTENCLR
Offset: 0x14
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
11
Access
Reset
© 2017 Microchip Technology Inc.
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10
9
8
LPMSUSP
LPMNYET
R/W
R/W
0
0
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Bit
Access
Reset
7
6
5
4
3
2
RAMACER
UPRSM
EORSM
WAKEUP
EORST
SOF
1
SUSPEND
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Bit 9 – LPMSUSP: Link Power Management Suspend Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Link Power Management Suspend Interrupt Enable bit and disable
the corresponding interrupt request.
Value
0
1
Description
The Link Power Management Suspend interrupt is disabled.
The Link Power Management Suspend interrupt is enabled and an interrupt request will be
generated when the Link Power Management Suspend interrupt Flag is set.
Bit 8 – LPMNYET: Link Power Management Not Yet Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Link Power Management Not Yet interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Link Power Management Not Yet interrupt is disabled.
The Link Power Management Not Yet interrupt is enabled and an interrupt request will be
generated when the Link Power Management Not Yet interrupt Flag is set.
Bit 7 – RAMACER: RAM Access Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the RAM Access interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The RAM Access interrupt is disabled.
The RAM Access interrupt is enabled and an interrupt request will be generated when the
RAM Access interrupt Flag is set.
Bit 6 – UPRSM: Upstream Resume Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Upstream Resume interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Upstream Resume interrupt is disabled.
The Upstream Resume interrupt is enabled and an interrupt request will be generated when
the Upstream Resume interrupt Flag is set.
Bit 5 – EORSM: End Of Resume Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the End Of Resume interrupt Enable bit and disable the corresponding
interrupt request.
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Value
0
1
Description
The End Of Resume interrupt is disabled.
The End Of Resume interrupt is enabled and an interrupt request will be generated when the
End Of Resume interrupt Flag is set.
Bit 4 – WAKEUP: Wake-Up Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Wake Up interrupt Enable bit and disable the corresponding interrupt
request.
Value
0
1
Description
The Wake Up interrupt is disabled.
The Wake Up interrupt is enabled and an interrupt request will be generated when the Wake
Up interrupt Flag is set.
Bit 3 – EORST: End of Reset Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the End of Reset interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The End of Reset interrupt is disabled.
The End of Reset interrupt is enabled and an interrupt request will be generated when the
End of Reset interrupt Flag is set.
Bit 2 – SOF: Start-of-Frame Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Start-of-Frame interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Start-of-Frame interrupt is disabled.
The Start-of-Frame interrupt is enabled and an interrupt request will be generated when the
Start-of-Frame interrupt Flag is set.
Bit 0 – SUSPEND: Suspend Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Suspend Interrupt Enable bit and disable the corresponding interrupt
request.
Value
0
1
Description
The Suspend interrupt is disabled.
The Suspend interrupt is enabled and an interrupt request will be generated when the
Suspend interrupt Flag is set.
32.8.2.6 Device Interrupt Enable Set
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Interrupt Enable Clear (INTENCLR) register.
Name:
INTENSET
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Offset: 0x18
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
11
10
Access
Reset
Bit
Access
Reset
9
8
LPMSUSP
LPMNYET
R/W
R/W
0
0
7
6
5
4
3
2
RAMACER
UPRSM
EORSM
WAKEUP
EORST
SOF
1
SUSPEND
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Bit 9 – LPMSUSP: Link Power Management Suspend Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Link Power Management Suspend Enable bit and enable the
corresponding interrupt request.
Value
0
1
Description
The Link Power Management Suspend interrupt is disabled.
The Link Power Management Suspend interrupt is enabled.
Bit 8 – LPMNYET: Link Power Management Not Yet Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Link Power Management Not Yet interrupt bit and enable the
corresponding interrupt request.
Value
0
1
Description
The Link Power Management Not Yet interrupt is disabled.
The Link Power Management Not Yet interrupt is enabled.
Bit 7 – RAMACER: RAM Access Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the RAM Access Enable bit and enable the corresponding interrupt
request.
Value
0
1
Description
The RAM Access interrupt is disabled.
The RAM Access interrupt is enabled.
Bit 6 – UPRSM: Upstream Resume Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Upstream Resume Enable bit and enable the corresponding interrupt
request.
Value
0
1
Description
The Upstream Resume interrupt is disabled.
The Upstream Resume interrupt is enabled.
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Bit 5 – EORSM: End Of Resume Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the End Of Resume interrupt Enable bit and enable the corresponding
interrupt request.
Value
0
1
Description
The End Of Resume interrupt is disabled.
The End Of Resume interrupt is enabled.
Bit 4 – WAKEUP: Wake-Up Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Wake Up interrupt Enable bit and enable the corresponding interrupt
request.
Value
0
1
Description
The Wake Up interrupt is disabled.
The Wake Up interrupt is enabled.
Bit 3 – EORST: End of Reset Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the End of Reset interrupt Enable bit and enable the corresponding
interrupt request.
Value
0
1
Description
The End of Reset interrupt is disabled.
The End of Reset interrupt is enabled.
Bit 2 – SOF: Start-of-Frame Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Start-of-Frame interrupt Enable bit and enable the corresponding
interrupt request.
Value
0
1
Description
The Start-of-Frame interrupt is disabled.
The Start-of-Frame interrupt is enabled.
Bit 0 – SUSPEND: Suspend Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Suspend interrupt Enable bit and enable the corresponding interrupt
request.
Value
0
1
Description
The Suspend interrupt is disabled.
The Suspend interrupt is enabled.
32.8.2.7 Device Interrupt Flag Status and Clear
Name: INTFLAG
Offset: 0x01C
Reset: 0x0000
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Property:
Bit
15
14
13
12
11
10
Access
Reset
Bit
Access
Reset
9
8
LPMSUSP
LPMNYET
R/W
R/W
0
0
1
0
7
6
5
4
3
2
RAMACER
UPRSM
EORSM
WAKEUP
EORST
SOF
SUSPEND
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Bit 9 – LPMSUSP: Link Power Management Suspend Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB module acknowledge a Link Power Management Transaction (ACK
handshake) and has entered the Suspended state and will generate an interrupt if INTENCLR/
SET.LPMSUSP is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the LPMSUSP Interrupt Flag.
Bit 8 – LPMNYET: Link Power Management Not Yet Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB module acknowledges a Link Power Management Transaction (handshake
is NYET) and will generate an interrupt if INTENCLR/SET.LPMNYET is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the LPMNYET Interrupt Flag.
Bit 7 – RAMACER: RAM Access Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a RAM access underflow error occurs during IN data stage. This bit will generate an
interrupt if INTENCLR/SET.RAMACER is one.
Writing a zero to this bit has no effect.
Bit 6 – UPRSM: Upstream Resume Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB sends a resume signal called “Upstream Resume” and will generate an
interrupt if INTENCLR/SET.UPRSM is one.
Writing a zero to this bit has no effect.
Bit 5 – EORSM: End Of Resume Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB detects a valid “End of Resume” signal initiated by the host and will
generate an interrupt if INTENCLR/SET.EORSM is one.
Writing a zero to this bit has no effect.
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Bit 4 – WAKEUP: Wake Up Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB is reactivated by a filtered non-idle signal from the lines and will generate
an interrupt if INTENCLR/SET.WAKEUP is one.
Writing a zero to this bit has no effect.
Bit 3 – EORST: End of Reset Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a USB “End of Reset” has been detected and will generate an interrupt if
INTENCLR/SET.EORST is one.
Writing a zero to this bit has no effect.
Bit 2 – SOF: Start-of-Frame Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a USB “Start-of-Frame” has been detected (every 1 ms) and will generate an
interrupt if INTENCLR/SET.SOF is one.
The FNUM is updated. In High Speed mode, the MFNUM register is cleared.
Writing a zero to this bit has no effect.
Bit 0 – SUSPEND: Suspend Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a USB “Suspend” idle state has been detected for 3 frame periods (J state for 3 ms)
and will generate an interrupt if INTENCLR/SET.SUSPEND is one.
Writing a zero to this bit has no effect.
32.8.2.8 Endpoint Interrupt Summary
Name: EPINTSMRY
Offset: 0x20
Reset: 0x0000
Property:
Bit
15
14
13
12
11
10
9
8
EPINT[15:8]
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
EPINT[7:0]
Bits 15:0 – EPINT[15:0]: EndPoint Interrupt
The flag EPINT[n] is set when an interrupt is triggered by the EndPoint n. See EPINTFLAGn register in
the device EndPoint section.
This bit will be cleared when no interrupts are pending for EndPoint n.
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32-bit ARM-Based Microcontrollers
32.8.3
Device Registers - Endpoint
32.8.3.1 Device Endpoint Configuration register n
Name: EPCFGn
Offset: 0x100 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
5
4
3
2
EPTYPE1[2:0]
Access
Reset
1
0
EPTYPE0[2:0]
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bits 6:4 – EPTYPE1[2:0]: Endpoint Type for IN direction
These bits contains the endpoint type for IN direction.
Upon receiving a USB reset EPCFGn.EPTYPE1 is cleared except for endpoint 0 which is unchanged.
Value
0x0
0x1
0x2
0x3
0x4
0x5
Description
Bank1 is disabled.
Bank1 is enabled and configured as Control IN.
Bank1 is enabled and configured as Isochronous IN.
Bank1 is enabled and configured as Bulk IN.
Bank1 is enabled and configured as Interrupt IN.
Bank1 is enabled and configured as Dual-Bank OUT
0x6-0x7
(Endpoint type is the same as the one defined in EPTYPE0)
Reserved
Bits 2:0 – EPTYPE0[2:0]: Endpoint Type for OUT direction
These bits contains the endpoint type for OUT direction.
Upon receiving a USB reset EPCFGn.EPTYPE0 is cleared except for endpoint 0 which is unchanged.
Value
0x0
0x1
0x2
0x3
0x4
0x5
Description
Bank0 is disabled.
Bank0 is enabled and configured as Control SETUP / Control OUT.
Bank0 is enabled and configured as Isochronous OUT.
Bank0 is enabled and configured as Bulk OUT.
Bank0 is enabled and configured as Interrupt OUT.
Bank0 is enabled and configured as Dual Bank IN
0x6-0x7
(Endpoint type is the same as the one defined in EPTYPE1)
Reserved
32.8.3.2 EndPoint Status Clear n
Name: EPSTATUSCLRn
Offset: 0x104 + (n * 0x20)
Reset: 0x00
Property: PAC Write-Protection
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Bit
7
6
5
4
2
1
0
BK1RDY
BK0RDY
STALLRQ1
STALLRQ0
3
CURBK
DTGLIN
DTGLOUT
Access
W
W
W
W
W
W
W
Reset
0
0
0
0
0
0
0
Bit 7 – BK1RDY: Bank 1 Ready Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear EPSTATUS.BK1RDY bit.
Bit 6 – BK0RDY: Bank 0 Ready Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear EPSTATUS.BK0RDY bit.
Bit 5 – STALLRQ1: STALL bank 1 Request Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear EPSTATUS.STALLRQ1 bit.
Bit 4 – STALLRQ0: STALL bank 0 Request Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear EPSTATUS.STALLRQ0 bit.
Bit 2 – CURBK: Current Bank Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear EPSTATUS.CURBK bit.
Bit 1 – DTGLIN: Data Toggle IN Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear EPSTATUS.DTGLIN bit.
Bit 0 – DTGLOUT: Data Toggle OUT Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the EPSTATUS.DTGLOUT bit.
32.8.3.3 EndPoint Status Set n
Name: EPSTATUSSETn
Offset: 0x105 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
5
4
2
1
0
BK1RDY
BK0RDY
STALLRQ1
STALLRQ0
3
CURBK
DTGLIN
DTGLOUT
Access
W
W
W
W
W
W
W
Reset
0
0
0
0
0
0
0
Bit 7 – BK1RDY: Bank 1 Ready Set
Writing a zero to this bit has no effect.
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32-bit ARM-Based Microcontrollers
Writing a one to this bit will set EPSTATUS.BK1RDY bit.
Bit 6 – BK0RDY: Bank 0 Ready Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set EPSTATUS.BK0RDY bit.
Bit 5 – STALLRQ1: STALL Request bank 1 Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set EPSTATUS.STALLRQ1 bit.
Bit 4 – STALLRQ0: STALL Request bank 0 Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set EPSTATUS.STALLRQ0 bit.
Bit 2 – CURBK: Current Bank Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set EPSTATUS.CURBK bit.
Bit 1 – DTGLIN: Data Toggle IN Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set EPSTATUS.DTGLIN bit.
Bit 0 – DTGLOUT: Data Toggle OUT Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set the EPSTATUS.DTGLOUT bit.
32.8.3.4 EndPoint Status n
Name: EPSTATUSn
Offset: 0x106 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
2
1
0
BK1RDY
BK0RDY
5
STALLRQ
4
3
CURBK
DTGLIN
DTGLOUT
Access
R
R
R
R
R
R
Reset
0
0
0
0
0
0
Bit 7 – BK1RDY: Bank 1 is ready
For Control/OUT direction Endpoints, the bank is empty.
Writing a one to the bit EPSTATUSCLR.BK1RDY will clear this bit.
Writing a one to the bit EPSTATUSSET.BK1RDY will set this bit.
Value
0
1
Description
The bank number 1 is not ready : For IN direction Endpoints, the bank is not yet filled in.
The bank number 1 is ready: For IN direction Endpoints, the bank is filled in. For
Control/OUT direction Endpoints, the bank is full.
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Bit 6 – BK0RDY: Bank 0 is ready
Writing a one to the bit EPSTATUSCLR.BK0RDY will clear this bit.
Writing a one to the bit EPSTATUSSET.BK0RDY will set this bit.
Value
0
1
Description
The bank number 0 is not ready : For IN direction Endpoints, the bank is not yet filled in. For
Control/OUT direction Endpoints, the bank is empty.
The bank number 0 is ready: For IN direction Endpoints, the bank is filled in. For
Control/OUT direction Endpoints, the bank is full.
Bit 4 – STALLRQ: STALL bank x request
Writing a zero to the bit EPSTATUSCLR.STALLRQ will clear this bit.
Writing a one to the bit EPSTATUSSET.STALLRQ will set this bit.
This bit is cleared by hardware when receiving a SETUP packet.
Value
0
1
Description
Disable STALLRQx feature.
Enable STALLRQx feature: a STALL handshake will be sent to the host in regards to bank x.
Bit 2 – CURBK: Current Bank
Writing a zero to the bit EPSTATUSCLR.CURBK will clear this bit.
Writing a one to the bit EPSTATUSSET.CURBK will set this bit.
Value
0
1
Description
The bank0 is the bank that will be used in the next single/multi USB packet.
The bank1 is the bank that will be used in the next single/multi USB packet.
Bit 1 – DTGLIN: Data Toggle IN Sequence
Writing a zero to the bit EPSTATUSCLR.DTGLINCLR will clear this bit.
Writing a one to the bit EPSTATUSSET.DTGLINSET will set this bit.
Value
0
1
Description
The PID of the next expected IN transaction will be zero: data 0.
The PID of the next expected IN transaction will be one: data 1.
Bit 0 – DTGLOUT: Data Toggle OUT Sequence
Writing a zero to the bit EPSTATUSCLR.DTGLOUTCLR will clear this bit.
Writing a one to the bit EPSTATUSSET.DTGLOUTSET will set this bit.
Value
0
1
Description
The PID of the next expected OUT transaction will be zero: data 0.
The PID of the next expected OUR transaction will be one: data 1.
32.8.3.5 Device EndPoint Interrupt Flag n
Name: EPINTFLAGn
Offset: 0x107 + (n x 0x20)
Reset: 0x00
Property:
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Bit
7
6
Access
Reset
5
4
STALL
RXSTP
3
TRFAIL
2
1
TRCPT
0
R/W
R/W
R/W
R/W
0
0
0
0
Bit 5 – STALL: Transmit Stall x Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Transmit Stall occurs and will generate an interrupt if EPINTENCLR/SET.STALL is
one.
EPINTFLAG.STALL is set for a single bank OUT endpoint or double bank IN/OUT endpoint when current
bank is "0".
Writing a zero to this bit has no effect.
Writing a one to this bit clears the STALL Interrupt Flag.
Bit 4 – RXSTP: Received Setup Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Received Setup occurs and will generate an interrupt if EPINTENCLR/SET.RXSTP
is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the RXSTP Interrupt Flag.
Bit 2 – TRFAIL: Transfer Fail x Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a transfer fail occurs and will generate an interrupt if EPINTENCLR/SET.TRFAIL is
one.
EPINTFLAG.TRFAIL is set for a single bank OUT endpoint or double bank IN/OUT endpoint when current
bank is "0".
Writing a zero to this bit has no effect.
Writing a one to this bit clears the TRFAIL Interrupt Flag.
Bit 0 – TRCPT: Transfer Complete x interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Transfer complete occurs and will generate an interrupt if EPINTENCLR/
SET.TRCPT is one. EPINTFLAG.TRCPT is set for a single bank OUT endpoint or double bank IN/OUT
endpoint when current bank is "0".
Writing a zero to this bit has no effect.
Writing a one to this bit clears the TRCPT0 Interrupt Flag.
32.8.3.6 Device EndPoint Interrupt Enable n
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Endpoint Interrupt Enable Set (EPINTENSET) register.
Name: EPINTENCLRn
Offset: 0x108 + (n x 0x20)
Reset: 0x00
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Property: PAC Write-Protection
Bit
7
6
Access
Reset
5
4
STALL
RXSTP
3
TRFAIL
2
1
TRCPT
0
R/W
R/W
R/W
R/W
0
0
0
0
Bit 5 – STALL: Transmit STALL x Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Transmit Stall x Interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Transmit Stall x interrupt is disabled.
The Transmit Stall x interrupt is enabled and an interrupt request will be generated when the
Transmit Stall x Interrupt Flag is set.
Bit 4 – RXSTP: Received Setup Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Received Setup Interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Received Setup interrupt is disabled.
The Received Setup interrupt is enabled and an interrupt request will be generated when the
Received Setup Interrupt Flag is set.
Bit 2 – TRFAIL: Transfer Fail x Interrupt Enable
The user should look into the descriptor table status located in ram to be informed about the error
condition : ERRORFLOW, CRC.
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Transfer Fail x Interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Transfer Fail bank x interrupt is disabled.
The Transfer Fail bank x interrupt is enabled and an interrupt request will be generated when
the Transfer Fail x Interrupt Flag is set.
Bit 0 – TRCPT: Transfer Complete x interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Transfer Complete x interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Transfer Complete bank x interrupt is disabled.
The Transfer Complete bank x interrupt is enabled and an interrupt request will be generated
when the Transfer Complete x Interrupt Flag is set.
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32.8.3.7 Device Interrupt EndPoint Set n
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Endpoint Interrupt Enable Set (EPINTENCLR) register. This
register is cleared by USB reset or when EPEN[n] is zero.
Name: EPINTENSETn
Offset: 0x109 + (n x 0x20)
Reset: 0x0000
Property: PAC Write-Protection
Bit
7
6
Access
Reset
5
4
STALL
RXSTP
3
TRFAIL
2
1
TRCPT
0
R/W
R/W
R/W
R/W
0
0
0
0
Bit 5 – STALL: Transmit Stall x Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Transmit bank x Stall interrupt.
Value
0
1
Description
The Transmit Stall x interrupt is disabled.
The Transmit Stall x interrupt is enabled.
Bit 4 – RXSTP: Received Setup Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Received Setup interrupt.
Value
0
1
Description
The Received Setup interrupt is disabled.
The Received Setup interrupt is enabled.
Bit 2 – TRFAIL: Transfer Fail bank x Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Transfer Fail interrupt.
Value
0
1
Description
The Transfer Fail interrupt is disabled.
The Transfer Fail interrupt is enabled.
Bit 0 – TRCPT: Transfer Complete bank x interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Transfer Complete x interrupt.
0.2.4 Device Registers - Endpoint RAM
Value
0
1
Description
The Transfer Complete bank x interrupt is disabled.
The Transfer Complete bank x interrupt is enabled.
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32.8.4
Device Registers - Endpoint RAM
32.8.4.1 Endpoint Descriptor Structure
Data Buffers
EPn BK1
EPn BK0
Endpoint
descriptors
Reserved
Bank1
Reserved
PCKSIZE
ADDR
(2 x 0xn0) + 0x10
Reserved
STATUS_BK
Bank0
EXTREG
PCKSIZE
ADDR
2 x 0xn0
Reserved
+0x01B
+0x01A
+0x018
+0x014
+0x010
+0x00B
+0x00A
+0x008
+0x004
+0x000
STATUS_BK
Descriptor E0
Bank1
Reserved
PCKSIZE
ADDR
Bank0
Reserved
STATUS_BK
EXTREG
PCKSIZE
ADDR
Growing Memory Addresses
Descriptor En
STATUS_BK
DESCADD
32.8.4.2 Address of Data Buffer
Name: ADDR
Offset: 0x00 & 0x10
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Reset: 0xxxxxxxx
Property: NA
Bit
31
30
29
28
27
26
25
24
R/W
R/W
R/W
R/W
x
x
R/W
R/W
R/W
R/W
x
x
x
x
x
x
23
22
21
20
19
18
17
16
ADDR[31:24]
Access
Reset
Bit
ADDR[23:16]
Access
Reset
Bit
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
x
x
x
x
x
x
x
x
15
14
13
12
11
10
9
8
ADDR[15:8]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
x
x
x
x
x
x
x
x
Bit
7
6
5
4
3
2
1
0
ADDR[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
x
x
x
x
x
x
x
x
Bits 31:0 – ADDR[31:0]: Data Pointer Address Value
These bits define the data pointer address as an absolute word address in RAM. The two least significant
bits must be zero to ensure the start address is 32-bit aligned.
32.8.4.3 Packet Size
Name: PCKSIZE
Offset: 0x04 & 0x14
Reset: 0xxxxxxxxx
Property: NA
Bit
31
30
AUTO_ZLP
Access
Reset
Bit
29
28
27
SIZE[2:0]
26
25
24
MULTI_PACKET_SIZE[13:10]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
x
0
0
x
0
0
0
0
23
22
21
20
19
18
17
16
MULTI_PACKET_SIZE[9:2]
Access
Reset
Bit
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
15
14
13
12
11
10
9
8
MULTI_PACKET_SIZE[1:0]
Access
Reset
BYTE_COUNT[13:8]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
x
0
0
0
0
0
0
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Bit
7
6
5
4
3
2
1
0
BYTE_COUNT[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
x
Bit 31 – AUTO_ZLP: Automatic Zero Length Packet
This bit defines the automatic Zero Length Packet mode of the endpoint.
When enabled, the USB module will manage the ZLP handshake by hardware. This bit is for IN endpoints
only. When disabled the handshake should be managed by firmware.
Value
0
1
Description
Automatic Zero Length Packet is disabled.
Automatic Zero Length Packet is enabled.
Bits 30:28 – SIZE[2:0]: Endpoint size
These bits contains the maximum packet size of the endpoint.
Value
Description
0x0
8 Byte
0x1
16 Byte
0x2
32 Byte
0x3
64 Byte
0x4
128 Byte(1)
0x5
256 Byte(1)
0x6
512 Byte(1)
0x7
1023 Byte(1)
(1) for Isochronous endpoints only.
Bits 27:14 – MULTI_PACKET_SIZE[13:0]: Multiple Packet Size
These bits define the 14-bit value that is used for multi-packet transfers.
For IN endpoints, MULTI_PACKET_SIZE holds the total number of bytes sent. MULTI_PACKET_SIZE
should be written to zero when setting up a new transfer.
For OUT endpoints, MULTI_PACKET_SIZE holds the total data size for the complete transfer. This value
must be a multiple of the maximum packet size.
Bits 13:0 – BYTE_COUNT[13:0]: Byte Count
These bits define the 14-bit value that is used for the byte count.
For IN endpoints, BYTE_COUNT holds the number of bytes to be sent in the next IN transaction.
For OUT endpoint or SETUP endpoints, BYTE_COUNT holds the number of bytes received upon the last
OUT or SETUP transaction.
32.8.4.4 Extended Register
Name:
EXTREG
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Offset: 0x08
Reset: 0xxxxxxxx
Property: NA
Bit
15
14
13
12
11
10
9
8
VARIABLE[10:4]
Access
Reset
Bit
7
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
6
5
4
3
2
1
0
VARIABLE[3:0]
Access
Reset
SUBPID[3:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
x
0
0
0
x
Bits 14:4 – VARIABLE[10:0]: Variable field send with extended token
These bits define the VARIABLE field of a received extended token. These bits are updated when the
USB has answered by an handshake token ACK to a LPM transaction. See Section 2.1.1 Protocol
Extension Token in the reference document “ENGINEERING CHANGE NOTICE, USB 2.0 Link Power
Management Addendum”.
To support the USB2.0 Link Power Management addition the VARIABLE field should be read as
described below.
VARIABLES
Description
VARIABLE[3:0]
bLinkState (1)
VARIABLE[7:4]
BESL (2)
VARIABLE[8]
bRemoteWake (1)
VARIABLE[10:9]
Reserved
1.
2.
For a definition of LPM Token bRemoteWake and bLinkState fields, refer to "Table 2-3 in the
reference document ENGINEERING CHANGE NOTICE, USB 2.0 Link Power Management
Addendum".
For a definition of LPM Token BESL field, refer to "Table 2-3 in the reference document
ENGINEERING CHANGE NOTICE, USB 2.0 Link Power Management Addendum" and "Table XX1 in Errata for ECN USB 2.0 Link Power Management.
Bits 3:0 – SUBPID[3:0]: SUBPID field send with extended token
These bits define the SUBPID field of a received extended token. These bits are updated when the USB
has answered by an handshake token ACK to a LPM transaction. See Section 2.1.1 Protocol Extension
Token in the reference document “ENGINEERING CHANGE NOTICE, USB 2.0 Link Power Management
Addendum”.
32.8.4.5 Device Status Bank
Name: STATUS_BK
Offset: 0x0A & 0x1A
Reset: 0xxxxxxxx
Property: NA
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Bit
7
6
5
4
3
2
Access
Reset
1
0
ERRORFLOW
CRCERR
R/W
R/W
x
x
Bit 1 – ERRORFLOW: Error Flow Status
This bit defines the Error Flow Status.
This bit is set when a Error Flow has been detected during transfer from/towards this bank.
For OUT transfer, a NAK handshake has been sent.
For Isochronous OUT transfer, an overrun condition has occurred.
For IN transfer, this bit is not valid. EPSTATUS.TRFAIL0 and EPSTATUS.TRFAIL1 should reflect the flow
errors.
Value
0
1
Description
No Error Flow detected.
A Error Flow has been detected.
Bit 0 – CRCERR: CRC Error
This bit defines the CRC Error Status.
This bit is set when a CRC error has been detected in an isochronous OUT endpoint bank.
0.2.5 Host Registers - Common
Value
0
1
32.8.5
Description
No CRC Error.
CRC Error detected.
Host Registers - Common
32.8.5.1 Control B
Name: CTRLB
Offset: 0x08
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
Access
Reset
Bit
7
6
5
4
11
10
9
8
L1RESUME
VBUSOK
BUSRESET
SOFE
R/W
R/W
R/W
R/W
0
0
0
0
3
2
1
0
SPDCONF[1:0]
Access
Reset
RESUME
R/W
R/W
R/W
0
0
0
Bit 11 – L1RESUME: Send USB L1 Resume
Writing 0 to this bit has no effect.
1: Generates a USB L1 Resume on the USB bus. This bit should only be set when the Start-of-Frame
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generation is enabled (SOFE bit set). The duration of the USB L1 Resume is defined by the
EXTREG.VARIABLE[7:4] bits field also known as BESL (See LPM ECN).See also EXTREG Register.
This bit is cleared when the USB L1 Resume has been sent or when a USB reset is requested.
Bit 10 – VBUSOK: VBUS is OK
This notifies the USB HOST that USB operations can be started. When this bit is zero and even if the
USB HOST is configured and enabled, HOST operation is halted. Setting this bit will allow HOST
operation when the USB is configured and enabled.
Value
0
1
Description
The USB module is notified that the VBUS on the USB line is not powered.
The USB module is notified that the VBUS on the USB line is powered.
Bit 9 – BUSRESET: Send USB Reset
Value
0
1
Description
Reset generation is disabled. It is written to zero when the USB reset is completed or when a
device disconnection is detected. Writing zero has no effect.
Generates a USB Reset on the USB bus.
Bit 8 – SOFE: Start-of-Frame Generation Enable
Value
0
1
Description
The SOF generation is disabled and the USB bus is in suspend state.
Generates SOF on the USB bus in full speed and keep it alive in low speed mode. This bit is
automatically set at the end of a USB reset (INTFLAG.RST) or at the end of a downstream
resume (INTFLAG.DNRSM) or at the end of L1 resume.
Bits 3:2 – SPDCONF[1:0]: Speed Configuration for Host
These bits select the host speed configuration as shown below
Value
0x0
0x1
0x2
0x3
Description
Low and Full Speed capable
Reserved
Reserved
Reserved
Bit 1 – RESUME: Send USB Resume
Writing 0 to this bit has no effect.
1: Generates a USB Resume on the USB bus.
This bit is cleared when the USB Resume has been sent or when a USB reset is requested.
32.8.5.2 Host Start-of-Frame Control
During a very short period just before transmitting a Start-of-Frame, this register is locked. Thus, after
writing, it is recommended to check the register value, and write this register again if necessary. This
register is cleared upon a USB reset.
Name: HSOFC
Offset: 0x0A
Reset: 0x00
Property: PAC Write-Protection
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Bit
7
6
5
4
3
2
FLENCE
Access
Reset
1
0
FLENC[3:0]
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
Bit 7 – FLENCE: Frame Length Control Enable
When this bit is '1', the time between Start-of-Frames can be tuned by up to +/-0.06% using FLENC[3:0].
Note: In Low Speed mode, FLENCE must be '0'.
Value
0
1
Description
Start-of-Frame is generated every 1ms.
Start-of-Frame generation depends on the signed value of FLENC[3:0].
USB Start-of-Frame period equals 1ms + (FLENC[3:0]/12000)ms
Bits 3:0 – FLENC[3:0]: Frame Length Control
These bits define the signed value of the 4-bit FLENC that is added to the Internal Frame Length when
FLENCE is '1'. The internal Frame length is the top value of the frame counter when FLENCE is zero.
32.8.5.3 Status
Name: STATUS
Offset: 0x0C
Reset: 0x00
Property: Read only
Bit
7
6
5
4
3
LINESTATE[1:0]
2
1
0
SPEED[1:0]
Access
R
R
R/W
R/W
Reset
0
0
0
0
Bits 7:6 – LINESTATE[1:0]: USB Line State Status
These bits define the current line state DP/DM.
LINESTATE[1:0]
USB Line Status
0x0
SE0/RESET
0x1
FS-J or LS-K State
0x2
FS-K or LS-J State
Bits 3:2 – SPEED[1:0]: Speed Status
These bits define the current speed used by the host.
SPEED[1:0]
Speed Status
0x0
Full-speed mode
0x1
Low-speed mode
0x2
Reserved
0x3
Reserved
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32.8.5.4 Host Frame Number
Name: FNUM
Offset: 0x10
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
11
10
9
8
R/W
R/W
R/W
0
R/W
R/W
R/W
0
0
0
0
0
5
4
3
2
1
0
FNUM[10:5]
Access
Reset
Bit
7
6
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
FNUM[4:0]
Access
Reset
Bits 13:3 – FNUM[10:0]: Frame Number
These bits contains the current SOF number.
These bits can be written by software to initialize a new frame number value. In this case, at the next
SOF, the FNUM field takes its new value.
As the FNUM register lies across two consecutive byte addresses, writing byte-wise (8-bits) to the FNUM
register may produce incorrect frame number generation. It is recommended to write FNUM register
word-wise (32-bits) or half-word-wise (16-bits).
32.8.5.5 Host Frame Length
Name: FLENHIGH
Offset: 0x12
Reset: 0x00
Property: Read-Only
Bit
7
6
5
4
3
2
1
0
FLENHIGH[7:0]
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bits 7:0 – FLENHIGH[7:0]: Frame Length
These bits contains the 8 high-order bits of the internal frame counter.
Table 32-9. Counter Description vs. Speed
Host Register
Description
STATUS.SPEED
Full Speed
With a USB clock running at 12MHz, counter length is 12000 to ensure a SOF
generation every 1 ms.
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32.8.5.6 Host Interrupt Enable Register Clear
This register allows the user to disable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Interrupt Enable Set (INTENSET) register.
Name: INTENCLR
Offset: 0x14
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
11
10
Access
Reset
Bit
Access
Reset
7
6
5
4
3
2
RAMACER
UPRSM
DNRSM
WAKEUP
RST
HSOF
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
9
8
DDISC
DCONN
R/W
R/W
0
0
1
0
Bit 9 – DDISC: Device Disconnection Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Device Disconnection interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Device Disconnection interrupt is disabled.
The Device Disconnection interrupt is enabled and an interrupt request will be generated
when the Device Disconnection interrupt Flag is set.
Bit 8 – DCONN: Device Connection Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Device Connection interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Device Connection interrupt is disabled.
The Device Connection interrupt is enabled and an interrupt request will be generated when
the Device Connection interrupt Flag is set.
Bit 7 – RAMACER: RAM Access Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the RAM Access interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The RAM Access interrupt is disabled.
The RAM Access interrupt is enabled and an interrupt request will be generated when the
RAM Access interrupt Flag is set.
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Bit 6 – UPRSM: Upstream Resume from Device Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Upstream Resume interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Upstream Resume interrupt is disabled.
The Upstream Resume interrupt is enabled and an interrupt request will be generated when
the Upstream Resume interrupt Flag is set.
Bit 5 – DNRSM: Down Resume Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Down Resume interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Down Resume interrupt is disabled.
The Down Resume interrupt is enabled and an interrupt request will be generated when the
Down Resume interrupt Flag is set.
Bit 4 – WAKEUP: Wake Up Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Wake Up interrupt Enable bit and disable the corresponding interrupt
request.
Value
0
1
Description
The Wake Up interrupt is disabled.
The Wake Up interrupt is enabled and an interrupt request will be generated when the Wake
Up interrupt Flag is set.
Bit 3 – RST: BUS Reset Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Bus Reset interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Bus Reset interrupt is disabled.
The Bus Reset interrupt is enabled and an interrupt request will be generated when the Bus
Reset interrupt Flag is set.
Bit 2 – HSOF: Host Start-of-Frame Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Host Start-of-Frame interrupt Enable bit and disable the
corresponding interrupt request.
Value
0
1
Description
The Host Start-of-Frame interrupt is disabled.
The Host Start-of-Frame interrupt is enabled and an interrupt request will be generated when
the Host Start-of-Frame interrupt Flag is set.
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32.8.5.7 Host Interrupt Enable Register Set
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Interrupt Enable Clear (INTENCLR) register.
Name: INTENSET
Offset: 0x18
Reset: 0x0000
Property: PAC Write-Protection
Bit
15
14
13
12
11
10
Access
Reset
Bit
Access
Reset
7
6
5
4
3
2
RAMACER
UPRSM
DNRSM
WAKEUP
RST
HSOF
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
9
8
DDISC
DCONN
R/W
R/W
0
0
1
0
Bit 9 – DDISC: Device Disconnection Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Device Disconnection interrupt bit and enable the DDSIC interrupt.
Value
0
1
Description
The Device Disconnection interrupt is disabled.
The Device Disconnection interrupt is enabled.
Bit 8 – DCONN: Device Connection Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Device Connection interrupt bit and enable the DCONN interrupt.
Value
0
1
Description
The Device Connection interrupt is disabled.
The Device Connection interrupt is enabled.
Bit 7 – RAMACER: RAM Access Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the RAM Access interrupt bit and enable the RAMACER interrupt.
Value
0
1
Description
The RAM Access interrupt is disabled.
The RAM Access interrupt is enabled.
Bit 6 – UPRSM: Upstream Resume from the device Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Upstream Resume interrupt bit and enable the UPRSM interrupt.
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Value
0
1
Description
The Upstream Resume interrupt is disabled.
The Upstream Resume interrupt is enabled.
Bit 5 – DNRSM: Down Resume Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Down Resume interrupt Enable bit and enable the DNRSM interrupt.
Value
0
1
Description
The Down Resume interrupt is disabled.
The Down Resume interrupt is enabled.
Bit 4 – WAKEUP: Wake Up Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Wake Up interrupt Enable bit and enable the WAKEUP interrupt
request.
Value
0
1
Description
The WakeUp interrupt is disabled.
The WakeUp interrupt is enabled.
Bit 3 – RST: Bus Reset Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Bus Reset interrupt Enable bit and enable the Bus RST interrupt.
Value
0
1
Description
The Bus Reset interrupt is disabled.
The Bus Reset interrupt is enabled.
Bit 2 – HSOF: Host Start-of-Frame Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Host Start-of-Frame interrupt Enable bit and enable the HSOF
interrupt.
Value
0
1
Description
The Host Start-of-Frame interrupt is disabled.
The Host Start-of-Frame interrupt is enabled.
32.8.5.8 Host Interrupt Flag Status and Clear
Name: INTFLAG
Offset: 0x1C
Reset: 0x0000
Property:
Bit
15
14
13
12
11
Access
Reset
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10
9
8
DDISC
DCONN
R/W
R/W
0
0
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Bit
Access
Reset
7
6
5
4
3
2
RAMACER
UPRSM
DNRSM
WAKEUP
RST
HSOF
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
1
0
Bit 9 – DDISC: Device Disconnection Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the device has been removed from the USB Bus and will generate an interrupt if
INTENCLR/SET.DDISC is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the DDISC Interrupt Flag.
Bit 8 – DCONN: Device Connection Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a new device has been connected to the USB BUS and will generate an interrupt if
INTENCLR/SET.DCONN is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the DCONN Interrupt Flag.
Bit 7 – RAMACER: RAM Access Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a RAM access error occurs during an OUT stage and will generate an interrupt if
INTENCLR/SET.RAMACER is one.
Writing a zero to this bit has no effect.
Bit 6 – UPRSM: Upstream Resume from the Device Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB has received an Upstream Resume signal from the Device and will
generate an interrupt if INTENCLR/SET.UPRSM is one.
Writing a zero to this bit has no effect.
Bit 5 – DNRSM: Down Resume Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when the USB has sent a Down Resume and will generate an interrupt if INTENCLR/
SET.DRSM is one.
Writing a zero to this bit has no effect.
Bit 4 – WAKEUP: Wake Up Interrupt Flag
This flag is cleared by writing a one.
This flag is set when:
l The host controller is in suspend mode (SOFE is zero) and an upstream resume from the device is
detected.
l The host controller is in suspend mode (SOFE is zero) and an device disconnection is detected.
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l The host controller is in operational state (VBUSOK is one) and an device connection is detected.
In all cases it will generate an interrupt if INTENCLR/SET.WAKEUP is one.
Writing a zero to this bit has no effect.
Bit 3 – RST: Bus Reset Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Bus “Reset” has been sent to the Device and will generate an interrupt if
INTENCLR/SET.RST is one.
Writing a zero to this bit has no effect.
Bit 2 – HSOF: Host Start-of-Frame Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a USB “Host Start-of-Frame” in Full Speed/High Speed or a keep-alive in Low
Speed has been sent (every 1 ms) and will generate an interrupt if INTENCLR/SET.HSOF is one.
The value of the FNUM register is updated.
Writing a zero to this bit has no effect.
32.8.5.9 Pipe Interrupt Summary
Name: PINTSMRY
Offset: 0x20
Reset: 0x0000
Property: Read-only
Bit
15
14
13
12
11
10
9
8
PINT[15:8]
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
PINT[7:0]
Bits 15:0 – PINT[15:0]
The flag PINT[n] is set when an interrupt is triggered by the pipe n. See PINTFLAG register in the Host
Pipe Register section.
This bit will be cleared when there are no interrupts pending for Pipe n.
Writing to this bit has no effect.
32.8.6
Host Registers - Pipe
32.8.6.1 Host Pipe n Configuration
Name: PCFGn
Offset: 0x100 + (n x 0x20)
Reset: 0x00
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Property: PAC Write-Protection
Bit
7
6
5
4
3
2
PTYPE[2:0]
Access
Reset
1
BK
0
PTOKEN[1:0]
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bits 5:3 – PTYPE[2:0]: Type of the Pipe
These bits contains the pipe type.
PTYPE[2:0]
Description
0x0
Pipe is disabled
0x1
Pipe is enabled and configured as CONTROL
0x2
Pipe is enabled and configured as ISO
0x3
Pipe is enabled and configured as BULK
0x4
Pipe is enabled and configured as INTERRUPT
0x5
Pipe is enabled and configured as EXTENDED
0x06-0x7
Reserved
These bits are cleared upon sending a USB reset.
Bit 2 – BK: Pipe Bank
This bit selects the number of banks for the pipe.
For control endpoints writing a zero to this bit is required as only Bank0 is used for Setup/In/Out
transactions.
This bit is cleared when a USB reset is sent.
BK(1)
Description
0x0
Single-bank endpoint
0x1
Dual-bank endpoint
1.
Bank field is ignored when PTYPE is configured as EXTENDED.
Value
0
1
Description
A single bank is used for the pipe.
A dual bank is used for the pipe.
Bits 1:0 – PTOKEN[1:0]: Pipe Token
These bits contains the pipe token.
PTOKEN[1:0](1)
Description
0x0
SETUP(2)
0x1
IN
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PTOKEN[1:0](1)
Description
0x2
OUT
0x3
Reserved
1.
2.
PTOKEN field is ignored when PTYPE is configured as EXTENDED.
Available only when PTYPE is configured as CONTROL
Theses bits are cleared upon sending a USB reset.
32.8.6.2 Interval for the Bulk-Out/Ping Transaction
Name: BINTERVAL
Offset: 0x103 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
5
4
3
2
1
0
BINTERVAL[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 7:0 – BINTERVAL[7:0]: BINTERVAL
These bits contains the Ping/Bulk-out period.
These bits are cleared when a USB reset is sent or when PEN[n] is zero.
BINTERVAL Description
=0
Multiple consecutive OUT token is sent in the same frame until it is acked by the
peripheral
>0
One OUT token is sent every BINTERVAL frame until it is acked by the peripheral
Depending from the type of pipe the desired period is defined as:
PTYPE
Description
Interrupt
1 ms to 255 ms
Isochronous
2^(Binterval) * 1 ms
Bulk or control
1 ms to 255 ms
EXT LPM
bInterval ignored. Always 1 ms when a NYET is received.
32.8.6.3 Pipe Status Clear n
Name: PSTATUSCLR
Offset: 0x104 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
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Bit
7
6
BK1RDY
BK0RDY
5
PFREEZE
4
3
CURBK
2
1
DTGL
0
Access
W
W
W
W
W
Reset
0
0
0
0
0
Bit 7 – BK1RDY: Bank 1 Ready Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear PSTATUS.BK1RDY bit.
Bit 6 – BK0RDY: Bank 0 Ready Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear PSTATUS.BK0RDY bit.
Bit 4 – PFREEZE: Pipe Freeze Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear PSTATUS.PFREEZE bit.
Bit 2 – CURBK: Current Bank Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear PSTATUS.CURBK bit.
Bit 0 – DTGL: Data Toggle Clear
Writing a zero to this bit has no effect.
Writing a one to this bit will clear PSTATUS.DTGL bit.
32.8.6.4 Pipe Status Set Register n
Name: PSTATUSSET
Offset: 0x105 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
5
4
3
2
1
0
BK1RDY
BK0RDY
PFREEZE
CURBK
DTGL
Access
W
W
W
W
W
Reset
0
0
0
0
0
Bit 7 – BK1RDY: Bank 1 Ready Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set the bit PSTATUS.BK1RDY.
Bit 6 – BK0RDY: Bank 0 Ready Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set the bit PSTATUS.BK0RDY.
Bit 4 – PFREEZE: Pipe Freeze Set
Writing a zero to this bit has no effect.
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Writing a one to this bit will set PSTATUS.PFREEZE bit.
Bit 2 – CURBK: Current Bank Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set PSTATUS.CURBK bit.
Bit 0 – DTGL: Data Toggle Set
Writing a zero to this bit has no effect.
Writing a one to this bit will set PSTATUS.DTGL bit.
32.8.6.5 Pipe Status Register n
Name: PSTATUS
Offset: 0x106 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
BK1RDY
BK0RDY
5
PFREEZE
4
3
CURBK
2
1
DTGL
0
Access
R
R
R
R
R
Reset
0
0
0
0
0
Bit 7 – BK1RDY: Bank 1 is ready
Writing a one to the bit EPSTATUSCLR.BK1RDY will clear this bit.
Writing a one to the bit EPSTATUSSET.BK1RDY will set this bit.
This bank is not used for Control pipe.
Value
0
1
Description
The bank number 1 is not ready: For IN the bank is empty. For Control/OUT the bank is not
yet fill in.
The bank number 1 is ready: For IN the bank is filled full. For Control/OUT the bank is filled
in.
Bit 6 – BK0RDY: Bank 0 is ready
Writing a one to the bit EPSTATUSCLR.BK0RDY will clear this bit.
Writing a one to the bit EPSTATUSSET.BK0RDY will set this bit.
This bank is the only one used for Control pipe.
Value
0
1
Description
The bank number 0 is not ready: For IN the bank is not empty. For Control/OUT the bank is
not yet fill in.
The bank number 0 is ready: For IN the bank is filled full. For Control/OUT the bank is filled
in.
Bit 4 – PFREEZE: Pipe Freeze
Writing a one to the bit EPSTATUSCLR.PFREEZE will clear this bit.
Writing a one to the bit EPSTATUSSET.PFREEZE will set this bit.
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This bit is also set by the hardware:
•
When a STALL handshake has been received.
•
After a PIPE has been enabled (rising of bit PEN.N).
•
When an LPM transaction has completed whatever handshake is returned or the transaction was
timed-out.
•
When a pipe transfer was completed with a pipe error. See PINTFLAG register.
When PFREEZE bit is set while a transaction is in progress on the USB bus, this transaction will be
properly completed. PFREEZE bit will be read as “1” only when the ongoing transaction will have been
completed.
Value
0
1
Description
The Pipe operates in normal operation.
The Pipe is frozen and no additional requests will be sent to the device on this pipe address.
Bit 2 – CURBK: Current Bank
Value
0
1
Description
The bank0 is the bank that will be used in the next single/multi USB packet.
The bank1 is the bank that will be used in the next single/multi USB packet.
Bit 0 – DTGL: Data Toggle Sequence
Writing a one to the bit EPSTATUSCLR.DTGL will clear this bit.
Writing a one to the bit EPSTATUSSET.DTGL will set this bit.
This bit is toggled automatically by hardware after a data transaction.
This bit will reflect the data toggle in regards of the token type (IN/OUT/SETUP).
Value
0
1
Description
The PID of the next expected transaction will be zero: data 0.
The PID of the next expected transaction will be one: data 1.
32.8.6.6 Host Pipe Interrupt Flag Register
Name: PINTFLAG
Offset: 0x107 + (n x 0x20)
Reset: 0x00
Property:
Bit
7
6
Access
Reset
5
4
3
2
1
0
STALL
TXSTP
PERR
TRFAIL
TRCPT
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
Bit 5 – STALL: STALL Received Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a stall occurs and will generate an interrupt if PINTENCLR/SET.STALL is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the STALL Interrupt Flag.
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Bit 4 – TXSTP: Transmitted Setup Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Transfer Complete occurs and will generate an interrupt if PINTENCLR/
SET.TXSTP is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the TXSTP Interrupt Flag.
Bit 3 – PERR: Pipe Error Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a pipe error occurs and will generate an interrupt if PINTENCLR/SET.PERR is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the PERR Interrupt Flag.
Bit 2 – TRFAIL: Transfer Fail Interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Transfer Fail occurs and will generate an interrupt if PINTENCLR/SET.TRFAIL is
one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the TRFAIL Interrupt Flag.
Bit 0 – TRCPT: Transfer Complete x interrupt Flag
This flag is cleared by writing a one to the flag.
This flag is set when a Transfer complete occurs and will generate an interrupt if PINTENCLR/
SET.TRCPT is one. PINTFLAG.TRCPT is set for a single bank IN/OUT pipe or a double bank IN/OUT
pipe when current bank is 0.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the TRCPT Interrupt Flag.
32.8.6.7 Host Pipe Interrupt Clear Register
This register allows the user to disable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Pipe Interrupt Enable Set (PINTENSET) register.
This register is cleared by USB reset or when PEN[n] is zero.
Name: PINTENCLR
Offset: 0x108 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
Access
Reset
© 2017 Microchip Technology Inc.
5
4
3
2
STALL
TXSTP
PERR
TRFAIL
TRCPT
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
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Bit 5 – STALL: Received Stall Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Received Stall interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The received Stall interrupt is disabled.
The received Stall interrupt is enabled and an interrupt request will be generated when the
received Stall interrupt Flag is set.
Bit 4 – TXSTP: Transmitted Setup Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Transmitted Setup interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Transmitted Setup interrupt is disabled.
The Transmitted Setup interrupt is enabled and an interrupt request will be generated when
the Transmitted Setup interrupt Flag is set.
Bit 3 – PERR: Pipe Error Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Pipe Error interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Pipe Error interrupt is disabled.
The Pipe Error interrupt is enabled and an interrupt request will be generated when the Pipe
Error interrupt Flag is set.
Bit 2 – TRFAIL: Transfer Fail Interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Transfer Fail interrupt Enable bit and disable the corresponding
interrupt request.
Value
0
1
Description
The Transfer Fail interrupt is disabled.
The Transfer Fail interrupt is enabled and an interrupt request will be generated when the
Transfer Fail interrupt Flag is set.
Bit 0 – TRCPT: Transfer Complete Bank x interrupt Disable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Transfer Complete interrupt Enable bit x and disable the
corresponding interrupt request.
Value
0
1
Description
The Transfer Complete Bank x interrupt is disabled.
The Transfer Complete Bank x interrupt is enabled and an interrupt request will be
generated when the Transfer Complete interrupt x Flag is set.
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32.8.6.8 Host Interrupt Pipe Set Register
This register allows the user to enable an interrupt without doing a read-modify-write operation. Changes
in this register will also be reflected in the Pipe Interrupt Enable Set (PINTENCLR) register.
This register is cleared by USB reset or when PEN[n] is zero.
Name: PINTENSET
Offset: 0x109 + (n x 0x20)
Reset: 0x00
Property: PAC Write-Protection
Bit
7
6
Access
Reset
5
4
3
2
STALL
TXSTP
PERR
TRFAIL
1
TRCPT
0
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
Bit 5 – STALL: Stall Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Stall interrupt.
Value
0
1
Description
The Stall interrupt is disabled.
The Stall interrupt is enabled.
Bit 4 – TXSTP: Transmitted Setup Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Transmitted Setup interrupt.
Value
0
1
Description
The Transmitted Setup interrupt is disabled.
The Transmitted Setup interrupt is enabled.
Bit 3 – PERR: Pipe Error Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Pipe Error interrupt.
Value
0
1
Description
The Pipe Error interrupt is disabled.
The Pipe Error interrupt is enabled.
Bit 2 – TRFAIL: Transfer Fail Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will enable the Transfer Fail interrupt.
Value
0
1
Description
The Transfer Fail interrupt is disabled.
The Transfer Fail interrupt is enabled.
Bit 0 – TRCPT: Transfer Complete x interrupt Enable
Writing a zero to this bit has no effect.
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Writing a one to this bit will enable the Transfer Complete interrupt Enable bit x.
0.2.7 Host Registers - Pipe RAM
Value
0
1
Description
The Transfer Complete x interrupt is disabled.
The Transfer Complete x interrupt is enabled.
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32.8.7
Host Registers - Pipe RAM
32.8.7.1 Pipe Descriptor Structure
Data Buffers
Pn BK1
Pn BK0
Pipe descriptors
Reserved
STATUS _PIPE
Bank1
CTRL_BK
Reserved
Descriptor Pn
Reserved
PCKSIZE
ADDR
(2 x 0xn0) + 0x10
Reserved
STATUS _PIPE
Bank0
CTRL_PIPE
STATUS_BK
EXTREG
PCKSIZE
Reserved
STATUS _PIPE
Bank1
CTRL_BK
Reserved
Descriptor P0
Reserved
PCKSIZE
ADDR
Reserved
STATUS _PIPE
Bank0
CTRL_PIPE
STATUS_BK
EXTREG
PCKSIZE
ADDR
2 x 0xn0
+0x01F
+0x01E
+0x01C
+0x01A
+0x018
+0x014
+0x010
+0x00F
+0x00E
+0x00C
+0x00A
+0x008
+0x004
+0x000
Growing Memory Addresses
ADDR
DESCADD
32.8.7.2 Address of the Data Buffer
Name: ADDR
Offset: 0x00 & 0x10
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Reset: 0xxxxxxxx
Property: NA
Bit
31
30
29
28
27
26
25
24
R/W
R/W
R/W
R/W
Reset
0
0
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bit
23
22
21
20
19
18
17
16
ADDR[31:24]
Access
ADDR[23:16]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
8
ADDR[15:8]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
ADDR[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
x
Bits 31:0 – ADDR[31:0]: Data Pointer Address Value
These bits define the data pointer address as an absolute double word address in RAM. The two least
significant bits must be zero to ensure the descriptor is 32-bit aligned.
32.8.7.3 Packet Size
Name: PCKSIZE
Offset: 0x04 & 0x14
Reset: 0xxxxxxxx
Property: NA
Bit
31
30
AUTO_ZLP
Access
Reset
Bit
29
28
27
SIZE[2:0]
26
25
24
MULTI_PACKET_SIZE[13:10]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
x
0
0
x
0
0
0
0
23
22
21
20
19
18
17
16
MULTI_PACKET_SIZE[9:2]
Access
Reset
Bit
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
15
14
13
12
11
10
9
8
MULTI_PACKET_SIZE[1:0]
Access
Reset
BYTE_COUNT[5:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
x
0
0
0
0
0
x
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Bit
7
6
5
4
3
2
1
0
Access
Reset
Bit 31 – AUTO_ZLP: Automatic Zero Length Packet
This bit defines the automatic Zero Length Packet mode of the pipe.
When enabled, the USB module will manage the ZLP handshake by hardware. This bit is for OUT pipes
only. When disabled the handshake should be managed by firmware.
Value
0
1
Description
Automatic Zero Length Packet is disabled.
Automatic Zero Length Packet is enabled.
Bits 30:28 – SIZE[2:0]: Pipe size
These bits contains the size of the pipe.
Theses bits are cleared upon sending a USB reset.
SIZE[2:0]
Description
0x0
8 Byte
0x1
16 Byte
0x2
32 Byte
0x3
64 Byte
0x4
128 Byte(1)
0x5
256 Byte(1)
0x6
512 Byte(1)
0x7
1024 Byte in HS mode(1)
1023 Byte in FS mode(1)
1. For Isochronous pipe only.
Bits 27:14 – MULTI_PACKET_SIZE[13:0]: Multi Packet IN or OUT size
These bits define the 14-bit value that is used for multi-packet transfers.
For IN pipes, MULTI_PACKET_SIZE holds the total number of bytes sent. MULTI_PACKET_SIZE should
be written to zero when setting up a new transfer.
For OUT pipes, MULTI_PACKET_SIZE holds the total data size for the complete transfer. This value must
be a multiple of the maximum packet size.
Bits 13:8 – BYTE_COUNT[5:0]: Byte Count
These bits define the 14-bit value that contains number of bytes sent in the last OUT or SETUP
transaction for an OUT pipe, or of the number of bytes to be received in the next IN transaction for an
input pipe.
32.8.7.4 Extended Register
Name:
EXTREG
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Offset: 0x08
Reset: 0xxxxxxxx
Property: NA
Bit
15
14
13
12
11
10
9
8
VARIABLE[10:4]
Access
Reset
Bit
7
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
6
5
4
3
2
1
0
VARIABLE[3:0]
Access
Reset
SUBPID[3:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
x
0
0
0
x
Bits 14:4 – VARIABLE[10:0]: Variable field send with extended token
These bits define the VARIABLE field sent with extended token. See “Section 2.1.1 Protocol Extension
Token in the reference document ENGINEERING CHANGE NOTICE, USB 2.0 Link Power Management
Addendum.”
To support the USB2.0 Link Power Management addition the VARIABLE field should be set as described
below.
VARIABLE
Description
VARIABLE[3:0]
bLinkState(1)
VARIABLE[7:4]
BESL (See LPM ECN)(2)
VARIABLE[8]
bRemoteWake(1)
VARIABLE[10:9]
Reserved
(1) for a definition of LPM Token bRemoteWake and bLinkState fields, refer to "Table 2-3 in the reference
document ENGINEERING CHANGE NOTICE, USB 2.0 Link Power Management Addendum"
(2) for a definition of LPM Token BESL field, refer to "Table 2-3 in the reference document ENGINEERING
CHANGE NOTICE, USB 2.0 Link Power Management Addendum" and "Table X-X1 in Errata for ECN USB 2.0
Link Power Management.
Bits 3:0 – SUBPID[3:0]: SUBPID field send with extended token
These bits define the SUBPID field sent with extended token. See “Section 2.1.1 Protocol Extension
Token in the reference document ENGINEERING CHANGE NOTICE, USB 2.0 Link Power Management
Addendum”.
To support the USB2.0 Link Power Management addition the SUBPID field should be set as described in
“Table 2.2 SubPID Types in the reference document ENGINEERING CHANGE NOTICE, USB 2.0 Link
Power Management Addendum”.
32.8.7.5 Host Status Bank
Name: STATUS_BK
Offset: 0x0A & 0x1A
Reset: 0xxxxxxxx
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Property: NA
Bit
7
6
5
4
3
2
Access
1
0
ERRORFLOW
CRCERR
R/W
R/W
x
x
Reset
Bit 1 – ERRORFLOW: Error Flow Status
This bit defines the Error Flow Status.
This bit is set when a Error Flow has been detected during transfer from/towards this bank.
For IN transfer, a NAK handshake has been received. For OUT transfer, a NAK handshake has been
received. For Isochronous IN transfer, an overrun condition has occurred. For Isochronous OUT transfer,
an underflow condition has occurred.
Value
0
1
Description
No Error Flow detected.
A Error Flow has been detected.
Bit 0 – CRCERR: CRC Error
This bit defines the CRC Error Status.
This bit is set when a CRC error has been detected in an isochronous IN endpoint bank.
Value
0
1
Description
No CRC Error.
CRC Error detected.
32.8.7.6 Host Control Pipe
Name: CTRL_PIPE
Offset: 0x0C
Reset: 0xXXXX
Property: PAC Write-Protection, Write-Synchronized, Read-Synchronized
Bit
15
14
13
12
11
10
R/W
Reset
Bit
9
8
R/W
R/W
R/W
R/W
R/W
0
0
0
x
R/W
R/W
0
0
0
x
7
6
5
4
3
2
1
0
R/W
R/W
R/W
0
0
0
R/W
R/W
R/W
R/W
0
0
0
x
PERMAX[3:0]
Access
PEPNUM[3:0]
PDADDR[6:0]
Access
Reset
Bits 15:12 – PERMAX[3:0]: Pipe Error Max Number
These bits define the maximum number of error for this Pipe before freezing the pipe automatically.
Bits 11:8 – PEPNUM[3:0]: Pipe EndPoint Number
These bits define the number of endpoint for this Pipe.
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32-bit ARM-Based Microcontrollers
Bits 6:0 – PDADDR[6:0]: Pipe Device Address
These bits define the Device Address for this pipe.
32.8.7.7 Host Status Pipe
Name: STATUS_PIPE
Offset: 0x0E & 0x1E
Reset: 0xxxxxxxx
Property: PAC Write-Protection, Write-Synchronized, Read-Synchronized
Bit
15
14
13
12
11
10
9
8
Bit
7
6
5
4
3
2
1
0
CRC16ER
TOUTER
PIDER
DAPIDER
DTGLER
Access
R
R
R
R
R
R/W
R/W
R/W
Reset
0
0
x
x
x
x
x
x
Access
Reset
ERCNT[2:0]
Bits 7:5 – ERCNT[2:0]: Pipe Error Counter
These bits define the number of errors detected on the pipe.
Bit 4 – CRC16ER: CRC16 ERROR
This bit defines the CRC16 Error Status.
This bit is set when a CRC 16 error has been detected during a IN transactions.
Value
0
1
Description
No CRC 16 Error detected.
A CRC 16 error has been detected.
Bit 3 – TOUTER: TIME OUT ERROR
This bit defines the Time Out Error Status.
This bit is set when a Time Out error has been detected during a USB transaction.
Value
0
1
Description
No Time Out Error detected.
A Time Out error has been detected.
Bit 2 – PIDER: PID ERROR
This bit defines the PID Error Status.
This bit is set when a PID error has been detected during a USB transaction.
Value
0
1
Description
No PID Error detected.
A PID error has been detected.
Bit 1 – DAPIDER: Data PID ERROR
This bit defines the PID Error Status.
This bit is set when a Data PID error has been detected during a USB transaction.
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32-bit ARM-Based Microcontrollers
Value
0
1
Description
No Data PID Error detected.
A Data PID error has been detected.
Bit 0 – DTGLER: Data Toggle Error
This bit defines the Data Toggle Error Status.
This bit is set when a Data Toggle Error has been detected.
Value
0
1
Description
No Data Toggle Error.
Data Toggle Error detected.
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33.
ADC – Analog-to-Digital Converter
33.1
Overview
The Analog-to-Digital Converter (ADC) converts analog signals to digital values. The ADC has 12-bit
resolution, and is capable of converting up to 350ksps. The input selection is flexible, and both differential
and single-ended measurements can be performed. An optional gain stage is available to increase the
dynamic range. In addition, several internal signal inputs are available. The ADC can provide both signed
and unsigned results.
ADC measurements can be started by either application software or an incoming event from another
peripheral in the device. ADC measurements can be started with predictable timing, and without software
intervention.
Both internal and external reference voltages can be used.
An integrated temperature sensor is available for use with the ADC. The bandgap voltage as well as the
scaled I/O and core voltages can also be measured by the ADC.
The ADC has a compare function for accurate monitoring of user-defined thresholds, with minimum
software intervention required.
The ADC may be configured for 8-, 10- or 12-bit results, reducing the conversion time. ADC conversion
results are provided left- or right-adjusted, which eases calculation when the result is represented as a
signed value. It is possible to use DMA to move ADC results directly to memory or peripherals when
conversions are done.
33.2
Features
•
•
•
•
•
•
•
•
•
8-, 10- or 12-bit resolution
Up to 350,000 samples per second (350ksps)
Differential and single-ended inputs
– Up to 32 analog input
– 25 positive and 10 negative, including internal and external
Five internal inputs
– Bandgap
– Temperature sensor
– DAC
– Scaled core supply
– Scaled I/O supply
1/2x to 16x gain
Single, continuous and pin-scan conversion options
Windowing monitor with selectable channel
Conversion range:
– Vref [1v to VDDANA - 0.6V]
– ADCx * GAIN [0V to -Vref ]
Built-in internal reference and external reference options
– Four bits for reference selection
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32-bit ARM-Based Microcontrollers
•
•
•
•
•
33.3
Event-triggered conversion for accurate timing (one event input)
Optional DMA transfer of conversion result
Hardware gain and offset compensation
Averaging and oversampling with decimation to support, up to 16-bit result
Selectable sampling time
Block Diagram
Figure 33-1. ADC Block Diagram
CTRLA
WINCTRL
AVGCTRL
WINLT
SAMPCTRL
WINUT
EVCTRL
OFFSETCORR
SWTRIG
GAINCORR
INPUTCTRL
ADC0
...
ADCn
INT.SIG
ADC
POST
PROCESSING
RESULT
ADC0
...
ADCn
INT.SIG
INT1V
CTRLB
INTVCC
VREFA
VREFB
PRESCALER
REFCTRL
33.4
Signal Description
Signal Name
Type
Description
VREFA
Analog input
External reference voltage A
VREFB
Analog input
External reference voltage B
ADC[19..0](1)
Analog input
Analog input channels
Note: Refer to Configuration Summary for details on exact number of analog input channels.
Note: Refer to I/O Multiplexing and Considerations for details on the pin mapping for this peripheral.
One signal can be mapped on several pins.
Related Links
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I/O Multiplexing and Considerations
Configuration Summary
33.5
Product Dependencies
In order to use this peripheral, other parts of the system must be configured correctly, as described below.
33.5.1
I/O Lines
Using the ADC's I/O lines requires the I/O pins to be configured using the port configuration (PORT).
Related Links
PORT - I/O Pin Controller
33.5.2
Power Management
The ADC will continue to operate in any sleep mode where the selected source clock is running. The
ADC’s interrupts can be used to wake up the device from sleep modes. Events connected to the event
system can trigger other operations in the system without exiting sleep modes.
Related Links
PM – Power Manager
33.5.3
Clocks
The ADC bus clock (CLK_APB_ADCx) can be enabled in the Main Clock, which also defines the default
state.
The ADC requires a generic clock (GCLK_ADC). This clock must be configured and enabled in the
Generic Clock Controller (GCLK) before using the ADC.
A generic clock is asynchronous to the bus clock. Due to this asynchronicity, writes to certain registers will
require synchronization between the clock domains. Refer to Synchronization for further details.
Related Links
Peripheral Clock Masking
GCLK - Generic Clock Controller
33.5.4
DMA
The DMA request line is connected to the DMA Controller (DMAC). Using the ADC DMA requests
requires the DMA Controller to be configured first.
Related Links
DMAC – Direct Memory Access Controller
33.5.5
Interrupts
The interrupt request line is connected to the interrupt controller. Using the ADC interrupt requires the
interrupt controller to be configured first.
Related Links
Nested Vector Interrupt Controller
33.5.6
Events
The events are connected to the Event System.
Related Links
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32-bit ARM-Based Microcontrollers
EVSYS – Event System
33.5.7
Debug Operation
When the CPU is halted in debug mode the ADC will halt normal operation. The ADC can be forced to
continue operation during debugging.
33.5.8
Register Access Protection
All registers with write-access are optionally write-protected by the peripheral access controller (PAC),
except the following register:
•
Interrupt Flag Status and Clear (INTFLAG) register
Optional write-protection by the Peripheral Access Controller (PAC) is denoted by the "PAC WriteProtection" property in each individual register description.
PAC write-protection does not apply to accesses through an external debugger.
Related Links
PAC - Peripheral Access Controller
33.5.9
Analog Connections
I/O-pins AIN0 to AIN19 as well as the VREFA/VREFB reference voltage pin are analog inputs to the ADC.
33.5.10 Calibration
The BIAS and LINEARITY calibration values from the production test must be loaded from the NVM
Software Calibration Area into the ADC Calibration register (CALIB) by software to achieve specified
accuracy.
Related Links
NVM Software Calibration Area Mapping
33.6
Functional Description
33.6.1
Principle of Operation
By default, the ADC provides results with 12-bit resolution. 8-bit or 10-bit results can be selected in order
to reduce the conversion time.
The ADC has an oversampling with decimation option that can extend the resolution to 16 bits. The input
values can be either internal (e.g., internal temperature sensor) or external (connected I/O pins). The user
can also configure whether the conversion should be single-ended or differential.
33.6.2
Basic Operation
33.6.2.1 Initialization
Before enabling the ADC, the asynchronous clock source must be selected and enabled, and the ADC
reference must be configured. The first conversion after the reference is changed must not be used. All
other configuration registers must be stable during the conversion. The source for GCLK_ADC is selected
and enabled in the System Controller (SYSCTRL). Refer to SYSCTRL – System Controller for more
details.
When GCLK_ADC is enabled, the ADC can be enabled by writing a one to the Enable bit in the Control
Register A (CTRLA.ENABLE).
Related Links
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32-bit ARM-Based Microcontrollers
SYSCTRL – System Controller
33.6.2.2 Enabling, Disabling and Reset
The ADC is enabled by writing a '1' to the Enable bit in the Control A register (CTRLA.ENABLE). The
ADC is disabled by writing CTRLA.ENABLE=0. The ADC is reset by writing a '1' to the Software Reset bit
in the Control A register (CTRLA.SWRST). All registers in the ADC, except DBGCTRL, will be reset to
their initial state, and the ADC will be disabled.
The ADC must be disabled before it is reset.
33.6.2.3 Operation
In the most basic configuration, the ADC samples values from the configured internal or external sources
(INPUTCTRL register). The rate of the conversion depends on the combination of the GCLK_ADCx
frequency and the clock prescaler.
To convert analog values to digital values, the ADC needs to be initialized first, as described in
Initialization. Data conversion can be started either manually by setting the Start bit in the Software
Trigger register (SWTRIG.START=1), or automatically by configuring an automatic trigger to initiate the
conversions. A free-running mode can be used to continuously convert an input channel. When using
free-running mode the first conversion must be started, while subsequent conversions will start
automatically at the end of previous conversions.
The automatic trigger can be configured to trigger on many different conditions.
The result of the conversion is stored in the Result register (RESULT) overwriting the result from the
previous conversion.
To avoid data loss if more than one channel is enabled, the conversion result must be read as soon as it
is available (INTFLAG.RESRDY). Failing to do so will result in an overrun error condition, indicated by the
OVERRUN bit in the Interrupt Flag Status and Clear register (INTFLAG.OVERRUN). When the RESRDY
interrupt flag is set, the new result has been synchronized to the RESULT register.
To enable one of the available interrupts sources, the corresponding bit in the Interrupt Enable Set
register (INTENSET) must be written to '1'.
33.6.3
Prescaler
The ADC is clocked by GCLK_ADC. There is also a prescaler in the ADC to enable conversion at lower
clock rates.
Refer to CTRLB for details on prescaler settings.
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32-bit ARM-Based Microcontrollers
Figure 33-2. ADC Prescaler
DIV512
DIV256
DIV128
DIV64
DIV32
DIV8
DIV16
9-BIT PRESCALER
DIV4
GCLK_ADC
CTRLB.PRESCALER[2:0]
CLK_ADC
The propagation delay of an ADC measurement depends on the selected mode and is given by:
•
Single-shot mode:
•
PropagationDelay =
Free-running mode:
1+
PropagationDelay =
Table 33-1. Delay Gain
Resolution
2
+ DelayGain
�CLK+ − ADC
Resolution
2
+ DelayGain
�CLK+ − ADC
Delay Gain (in CLK_ADC Period)
INTPUTCTRL.GAIN[3:0] Free-running mode
Name
33.6.4
Single shot mode
Differential
Mode
Single-Ended Differential
Mode
mode
Single-Ended
mode
1X
0x0
0
0
0
1
2X
0x1
0
1
0.5
1.5
4X
0x2
1
1
1
2
8X
0x3
1
2
1.5
2.5
16X
0x4
2
2
2
3
Reserved 0x5 ... 0xE
Reserved
Reserved
Reserved
Reserved
DIV2
0
1
0.5
1.5
0xF
ADC Resolution
The ADC supports 8-bit, 10-bit or 12-bit resolution. Resolution can be changed by writing the Resolution
bit group in the Control B register (CTRLB.RESSEL). By default, the ADC resolution is set to 12 bits.
33.6.5
Differential and Single-Ended Conversions
The ADC has two conversion options: differential and single-ended:
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32-bit ARM-Based Microcontrollers
•
If the positive input may go below the negative input, the differential mode should be used in order
to get correct results.
If the positive input is always positive, the single-ended conversion should be used in order to
have full 12-bit resolution in the conversion.
•
The negative input must be connected to ground. This ground could be the internal GND, IOGND or an
external ground connected to a pin. Refer to the Control B (CTRLB) register for selection details.
If the positive input may go below the negative input, creating some negative results, the differential mode
should be used in order to get correct results. The differential mode is enabled by setting DIFFMODE bit
in the Control B register (CTRLB.DIFFMODE). Both conversion types could be run in single mode or in
free-running mode. When the free-running mode is selected, an ADC input will continuously sample the
input and performs a new conversion. The INTFLAG.RESRDY bit will be set at the end of each
conversion.
Related Links
CTRLB
33.6.5.1 Conversion Timing
The following figure shows the ADC timing for one single conversion. A conversion starts after the
software or event start are synchronized with the GCLK_ADC clock. The input channel is sampled in the
first half CLK_ADC period.
Figure 33-3. ADC Timing for One Conversion in Differential Mode without Gain
1
2
3
4
5
6
7
8
CLK_ ADC
START
SAMPLE
INT
Converting Bit
MS B
10
9
8
7
6
5
4
3
2
1
LS B
The sampling time can be increased by using the Sampling Time Length bit group in the Sampling Time
Control register (SAMPCTRL.SAMPLEN). As example, the next figure is showing the timing conversion.
Figure 33-4. ADC Timing for One Conversion in Differential Mode without Gain, but with Increased
Sampling Time
1
2
3
4
5
6
7
8
9
10
11
CLK_ ADC
START
SAMPLE
INT
Converting Bit
© 2017 Microchip Technology Inc.
MS B
10
9
8
7
6
Datasheet Complete
5
4
3
2
1
LS B
40001882A-page 720
32-bit ARM-Based Microcontrollers
Figure 33-5. ADC Timing for Free Running in Differential Mode without Gain
2
1
3
4
5
6
7
9
8
10
11
12
13
6
4
2
0
14
15
16
8
6
CLK_ ADC
START
SAMPLE
INT
Converting Bit
11
10
9
8
7
6
5
4
3
2
1
0
11
10
9
8
7
5
3
1
11
10
9
7
5
Figure 33-6. ADC Timing for One Conversion in Single-Ended Mode without Gain
1
2
3
4
5
6
7
8
9
10
11
CLK_ADC
START
SAMPLE
AMPLIFY
INT
Converting Bit
MS B
10
9
8
7
6
5
4
3
2
1
LS B
Figure 33-7. ADC Timing for Free Running in Single-Ended Mode without Gain
2
1
3
4
5
6
7
9
8
10
11
12
13
14
9
7
5
3
1
15
16
CLK_ADC
START
SAMPLE
AMPLIFY
INT
Converting Bit
33.6.6
11
10
9
8
7
6
5
4
3
2
1
0
11
10
8
6
4
2
0
11
10
Accumulation
The result from multiple consecutive conversions can be accumulated. The number of samples to be
accumulated is specified by the Number of Samples to be Collected field in the Average Control register
(AVGCTRL.SAMPLENUM). When accumulating more than 16 samples, the result will be too large to
match the 16-bit RESULT register size. To avoid overflow, the result is right shifted automatically to fit
within the available register size. The number of automatic right shifts is specified in the table below.
Note: To perform the accumulation of two or more samples, the Conversion Result Resolution field in
the Control B register (CTRLB.RESSEL) must be set.
Table 33-2. Accumulation
Number of
Accumulated
Samples
AVGCTRL.
SAMPLENUM
Intermediate
Number of
Result Precision Automatic
Right Shifts
Final Result
Precision
Automatic
Division
Factor
1
0x0
12 bits
0
12 bits
0
2
0x1
13 bits
0
13 bits
0
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32-bit ARM-Based Microcontrollers
33.6.7
Number of
Accumulated
Samples
AVGCTRL.
SAMPLENUM
Intermediate
Number of
Result Precision Automatic
Right Shifts
Final Result
Precision
Automatic
Division
Factor
4
0x2
14 bits
0
14 bits
0
8
0x3
15 bits
0
15 bits
0
16
0x4
16 bits
0
16 bits
0
32
0x5
17 bits
1
16 bits
2
64
0x6
18 bits
2
16 bits
4
128
0x7
19 bits
3
16 bits
8
256
0x8
20 bits
4
16 bits
16
512
0x9
21 bits
5
16 bits
32
1024
0xA
22 bits
6
16 bits
64
Reserved
0xB - 0xF
12 bits
12 bits
0
Averaging
Averaging is a feature that increases the sample accuracy, at the cost of a reduced sampling rate. This
feature is suitable when operating in noisy conditions.
Averaging is done by accumulating m samples, as described in Accumulation, and dividing the result by
m. The averaged result is available in the RESULT register. The number of samples to be accumulated is
specified by writing to AVGCTRL.SAMPLENUM.
The division is obtained by a combination of the automatic right shift described above, and an additional
right shift that must be specified by writing to the Adjusting Result/Division Coefficient field in AVGCTRL
(AVGCTRL.ADJRES).
Note: To perform the averaging of two or more samples, the Conversion Result Resolution field in the
Control B register (CTRLB.RESSEL) must be set to '1'.
Averaging AVGCTRL.SAMPLENUM samples will reduce the un-averaged sampling rate by a factor
1
.
AVGCTRL.SAMPLENUM
When the averaged result is available, the INTFLAG.RESRDY bit will be set.
Table 33-3. Averaging
Number of
Accumulated
Samples
AVGCTRL.
SAMPLENUM
Intermediate
Result
Precision
Number of
Automatic
Right Shifts
Division
Factor
AVGCTRL.ADJRES Total
Number
of Right
Shifts
Final Result
Precision
Automatic
Division
Factor
1
0x0
12 bits
0
1
0x0
12 bits
0
2
0x1
13
0
2
0x1
1
12 bits
0
4
0x2
14
0
4
0x2
2
12 bits
0
8
0x3
15
0
8
0x3
3
12 bits
0
16
0x4
16
0
16
0x4
4
12 bits
0
32
0x5
17
1
16
0x4
5
12 bits
2
64
0x6
18
2
16
0x4
6
12 bits
4
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32-bit ARM-Based Microcontrollers
33.6.8
Number of
Accumulated
Samples
AVGCTRL.
SAMPLENUM
Intermediate
Result
Precision
Number of
Automatic
Right Shifts
Division
Factor
AVGCTRL.ADJRES Total
Number
of Right
Shifts
Final Result
Precision
Automatic
Division
Factor
128
0x7
19
3
16
0x4
7
12 bits
8
256
0x8
20
4
16
0x4
8
12 bits
16
512
0x9
21
5
16
0x4
9
12 bits
32
1024
0xA
22
6
16
0x4
10
12 bits
64
Reserved
0xB-0xF
12 bits
0
0x0
Oversampling and Decimation
By using oversampling and decimation, the ADC resolution can be increased from 12 bits up to 16 bits,
for the cost of reduced effective sampling rate.
To increase the resolution by n bits, 4n samples must be accumulated. The result must then be rightshifted by n bits. This right-shift is a combination of the automatic right-shift and the value written to
AVGCTRL.ADJRES. To obtain the correct resolution, the ADJRES must be configured as described in the
table below. This method will result in n bit extra LSB resolution.
Table 33-4. Configuration Required for Oversampling and Decimation
Result
Number of
Resolution Samples to
Average
33.6.9
AVGCTRL.SAMPLENUM[3:0]
Number of
Automatic
Right Shifts
AVGCTRL.ADJRES[2:0]
13 bits
41 = 4
0x2
0
0x1
14 bits
42 = 16
0x4
0
0x2
15 bits
43 = 64
0x6
2
0x1
16 bits
44 = 256
0x8
4
0x0
Window Monitor
The window monitor feature allows the conversion result in the RESULT register to be compared to
predefined threshold values. The window mode is selected by setting the Window Monitor Mode bits in
the Window Monitor Control register (WINCTRL.WINMODE[2:0]). Threshold values must be written in the
Window Monitor Lower Threshold register (WINLT) and Window Monitor Upper Threshold register
(WINUT).
If differential input is selected, the WINLT and WINUT are evaluated as signed values. Otherwise they are
evaluated as unsigned values. The significant WINLT and WINUT bits are given by the precision selected
in the Conversion Result Resolution bit group in the Control B register (CTRLB.RESSEL). This means
that e.g. in 8-bit mode, only the eight lower bits will be considered. In addition, in differential mode, the
eighth bit will be considered as the sign bit, even if the ninth bit is zero.
The INTFLAG.WINMON interrupt flag will be set if the conversion result matches the window monitor
condition.
33.6.10 Offset and Gain Correction
Inherent gain and offset errors affect the absolute accuracy of the ADC.
The offset error is defined as the deviation of the actual ADC transfer function from an ideal straight line
at zero input voltage. The offset error cancellation is handled by the Offset Correction register
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32-bit ARM-Based Microcontrollers
(OFFSETCORR). The offset correction value is subtracted from the converted data before writing the
Result register (RESULT).
The gain error is defined as the deviation of the last output step’s midpoint from the ideal straight line,
after compensating for offset error. The gain error cancellation is handled by the Gain Correction register
(GAINCORR).
To correct these two errors, the Digital Correction Logic Enabled bit in the Control B register
(CTRLB.CORREN) must be set to ''.
Offset and gain error compensation results are both calculated according to:
Result = Conversion value+ − OFFSETCORR ⋅ GAINCORR
The correction will introduce a latency of 13 CLK_ADC clock cycles. In free running mode this latency is
introduced on the first conversion only, since its duration is always less than the propagation delay. In
single conversion mode this latency is introduced for each conversion.
Figure 33-8. ADC Timing Correction Enabled
START
CONV0
CONV1
CONV2
CORR0
CORR1
CONV3
CORR2
CORR3
33.6.11 DMA Operation
The ADC generates the following DMA request:
•
Result Conversion Ready (RESRDY): the request is set when a conversion result is available and
cleared when the RESULT register is read. When the averaging operation is enabled, the DMA
request is set when the averaging is completed and result is available.
33.6.12 Interrupts
The ADC has the following interrupt sources:
•
Result Conversion Ready: RESRDY
•
Window Monitor: WINMON
•
Overrun: OVERRUN
Each interrupt source has an interrupt flag associated with it. The interrupt flag in the Interrupt Flag Status
and Clear (INTFLAG) register is set when the interrupt condition occurs. Each interrupt can be
individually enabled by writing a one to the corresponding bit in the Interrupt Enable Set (INTENSET)
register, and disabled by writing a one to the corresponding bit in the Interrupt Enable Clear (INTENCLR)
register. An interrupt request is generated when the interrupt flag is set and the corresponding interrupt is
enabled. The interrupt request remains active until the interrupt flag is cleared, the interrupt is disabled, or
the ADC is reset. An interrupt flag is cleared by writing a one to the corresponding bit in the INTFLAG
register. Each peripheral can have one interrupt request line per interrupt source or one common interrupt
request line for all the interrupt sources. This is device dependent.
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32-bit ARM-Based Microcontrollers
Refer to Nested Vector Interrupt Controller for details. The user must read the INTFLAG register to
determine which interrupt condition is present.
Related Links
Nested Vector Interrupt Controller
33.6.13 Events
The ADC can generate the following output events:
•
Result Ready (RESRDY): Generated when the conversion is complete and the result is available.
•
Window Monitor (WINMON): Generated when the window monitor condition match.
Setting an Event Output bit in the Event Control Register (EVCTRL.xxEO=1) enables the corresponding
output event. Clearing this bit disables the corresponding output event. Refer to the Event System
chapter for details on configuring the event system.
The peripheral can take the following actions on an input event:
•
Start conversion (START): Start a conversion.
•
Conversion flush (FLUSH): Flush the conversion.
Setting an Event Input bit in the Event Control register (EVCTRL.xxEI=1) enables the corresponding
action on input event. Clearing this bit disables the corresponding action on input event.
Note: If several events are connected to the ADC, the enabled action will be taken on any of the
incoming events. The events must be correctly routed in the Event System.
Related Links
EVSYS – Event System
33.6.14 Sleep Mode Operation
The Run in Standby bit in the Control A register (CTRLA.RUNSTDBY) controls the behavior of the ADC
during standby sleep mode. When CTRLA.RUNSTDBY=0, the ADC is disabled during sleep, but
maintains its current configuration. When CTRLA.RUNSTDBY=1, the ADC continues to operate during
sleep. Note that when CTRLA.RUNSTDBY=0, the analog blocks are powered off for the lowest power
consumption. This necessitates a start-up time delay when the system returns from sleep.
When CTRLA.RUNSTDBY=1, any enabled ADC interrupt source can wake up the CPU. While the CPU
is sleeping, ADC conversion can only be triggered by events.
33.6.15 Synchronization
Due to asynchronicity between the main clock domain and the peripheral clock domains, some registers
need to be synchronized when written or read.
When executing an operation that requires synchronization, the Synchronization Busy bit in the Status
register (STATUS.SYNCBUSY) will be set immediately, and cleared when synchronization is complete.
The Synchronization Ready interrupt can be used to signal when synchronization is complete.
If an operation that requires synchronization is executed while STATUS.SYNCBUSY=1, the bus will be
stalled. All operations will complete successfully, but the CPU will be stalled and interrupts will be pending
as long as the bus is stalled.
The following bits are synchronized when written:
•
•
Software Reset bit in the Control A register (CTRLA.SWRST)
Enable bit in the Control A register (CTRLA.ENABLE)
The following registers are synchronized when written:
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32-bit ARM-Based Microcontrollers
•
•
•
•
•
Control B (CTRLB)
Software Trigger (SWTRIG)
Window Monitor Control (WINCTRL)
Input Control (INPUTCTRL)
Window Upper/Lower Threshold (WINUT/WINLT)
Required write-synchronization is denoted by the "Write-Synchronized" property in the register
description.
The following registers are synchronized when read:
•
•
Software Trigger (SWTRIG)
Input Control (INPUTCTRL)
Required read-synchronization is denoted by the "Read-Synchronized" property in the register
description.
Related Links
Register Synchronization
33.7
Offset
Register Summary
Name
Bit
Pos.
0x00
CTRLA
7:0
0x01
REFCTRL
7:0
0x02
AVGCTRL
7:0
0x03
SAMPCTRL
7:0
0x04
0x05
0x06
CTRLB
RUNSTDBY
REFCOMP
ENABLE
SWRST
REFSEL[3:0]
ADJRES[2:0]
SAMPLENUM[3:0]
SAMPLEN[5:0]
7:0
RESSEL[1:0]
CORREN
FREERUN
LEFTADJ
15:8
PRESCALER[2:0]
7:0
WINMODE[2:0]
7:0
START
DIFFMODE
Reserved
0x07
Reserved
0x08
WINCTRL
0x09
...
Reserved
0x0B
0x0C
SWTRIG
FLUSH
0x0D
...
Reserved
0x0F
0x10
7:0
MUXPOS[4:0]
0x11
15:8
MUXNEG[4:0]
0x12
INPUTCTRL
0x13
0x14
23:16
INPUTOFFSET[3:0]
INPUTSCAN[3:0]
31:24
EVCTRL
GAIN[3:0]
7:0
WINMONEO RESRDYEO
SYNCEI
STARTEI
0x15
Reserved
0x16
INTENCLR
7:0
SYNCRDY
WINMON
OVERRUN
RESRDY
0x17
INTENSET
7:0
SYNCRDY
WINMON
OVERRUN
RESRDY
0x18
INTFLAG
7:0
SYNCRDY
WINMON
OVERRUN
RESRDY
0x19
STATUS
7:0
SYNCBUSY
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Offset
Name
Bit
Pos.
0x1A
RESULT
0x1B
0x1C
WINLT
0x1D
0x1E
Reserved
0x1F
Reserved
0x20
WINUT
0x21
0x22
Reserved
0x23
Reserved
0x24
GAINCORR
0x25
0x26
OFFSETCORR
0x27
0x28
CALIB
0x29
0x2A
DBGCTRL
33.8
7:0
RESULT[7:0]
15:8
RESULT[15:8]
7:0
WINLT[7:0]
15:8
WINLT[15:8]
7:0
WINUT[7:0]
15:8
WINUT[15:8]
7:0
GAINCORR[7:0]
15:8
GAINCORR[11:8]
7:0
OFFSETCORR[7:0]
15:8
OFFSETCORR[11:8]
7:0
LINEARITY_CAL[7:0]
15:8
BIAS_CAL[2:0]
7:0
DBGRUN
Register Description
Registers can be 8, 16 or 32 bits wide. Atomic 8-, 16- and 32-bit accesses are supported. In addition, the
8-bit quarters and 16-bit halves of a 32-bit register and the 8-bit halves of a 16-bit register can be
accessed directly.
Some registers are optionally write-protected by the Peripheral Access Controller (PAC). Write-protection
is denoted by the Write-Protected property in each individual register description.
Some registers require synchronization when read and/or written. Synchronization is denoted by the
Write-Synchronized or the Read-Synchronized property in each individual register description.
Some registers are enable-protected, meaning they can be written only when the ADC is disabled.
Enable-protection is denoted by the Enable-Protected property in each individual register description.
33.8.1
Control A
Name: CTRLA
Offset: 0x00
Reset: 0x00
Property: Write-Protected
Bit
7
6
5
4
3
Access
Reset
2
1
0
RUNSTDBY
ENABLE
SWRST
R/W
R/W
R/W
0
0
0
Bit 2 – RUNSTDBY: Run in Standby
This bit indicates whether the ADC will continue running in standby sleep mode or not:
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Value
0
1
Description
The ADC is halted during standby sleep mode.
The ADC continues normal operation during standby sleep mode.
Bit 1 – ENABLE: Enable
Due to synchronization, there is a delay from writing CTRLA.ENABLE until the peripheral is enabled/
disabled. The value written to CTRL.ENABLE will read back immediately and the Synchronization Busy
bit in the Status register (STATUS.SYNCBUSY) will be set. STATUS.SYNCBUSY will be cleared when
the operation is complete.
Value
0
1
Description
The ADC is disabled.
The ADC is enabled.
Bit 0 – SWRST: Software Reset
Writing a zero to this bit has no effect.
Writing a one to this bit resets all registers in the ADC, except DBGCTRL, to their initial state, and the
ADC will be disabled.
Writing a one to CTRL.SWRST will always take precedence, meaning that all other writes in the same
write-operation will be discarded.
Due to synchronization, there is a delay from writing CTRLA.SWRST until the reset is complete.
CTRLA.SWRST and STATUS.SYNCBUSY will both be cleared when the reset is complete.
Value
0
1
33.8.2
Description
There is no reset operation ongoing.
The reset operation is ongoing.
Reference Control
Name: REFCTRL
Offset: 0x01
Reset: 0x00
Property: Write-Protected
Bit
7
6
5
4
3
2
REFCOMP
Access
Reset
1
0
REFSEL[3:0]
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
Bit 7 – REFCOMP: Reference Buffer Offset Compensation Enable
The accuracy of the gain stage can be increased by enabling the reference buffer offset compensation.
This will decrease the input impedance and thus increase the start-up time of the reference.
Value
0
1
Description
Reference buffer offset compensation is disabled.
Reference buffer offset compensation is enabled.
Bits 3:0 – REFSEL[3:0]: Reference Selection
These bits select the reference for the ADC.
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Table 33-5. Reference Selection
REFSEL[3:0]
Name
Description
0x0
INT1V
1.0V voltage reference
0x1
INTVCC0
1/1.48 VDDANA
0x2
INTVCC1
1/2 VDDANA (only for VDDANA > 2.0V)
0x3
VREFA
External reference
0x4
VREFB
External reference
0x5-0xF
33.8.3
Reserved
Average Control
Name: AVGCTRL
Offset: 0x02
Reset: 0x00
Property: Write-Protected
Bit
7
6
5
4
3
ADJRES[2:0]
Access
Reset
2
1
0
SAMPLENUM[3:0]
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
Bits 6:4 – ADJRES[2:0]: Adjusting Result / Division Coefficient
These bits define the division coefficient in 2n steps.
Bits 3:0 – SAMPLENUM[3:0]: Number of Samples to be Collected
These bits define how many samples should be added together.The result will be available in the Result
register (RESULT). Note: if the result width increases, CTRLB.RESSEL must be changed.
SAMPLENUM[3:0]
Name
Description
0x0
1
1 sample
0x1
2
2 samples
0x2
4
4 samples
0x3
8
8 samples
0x4
16
16 samples
0x5
32
32 samples
0x6
64
64 samples
0x7
128
128 samples
0x8
256
256 samples
0x9
512
512 samples
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SAMPLENUM[3:0]
Name
Description
0xA
1024
1024 samples
0xB-0xF
33.8.4
Reserved
Sampling Time Control
Name: SAMPCTRL
Offset: 0x03
Reset: 0x00
Property: Write-Protected
Bit
7
6
5
4
3
2
1
0
SAMPLEN[5:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bits 5:0 – SAMPLEN[5:0]: Sampling Time Length
These bits control the ADC sampling time in number of half CLK_ADC cycles, depending of the prescaler
value, thus controlling the ADC input impedance. Sampling time is set according to the equation:
Sampling time = SAMPLEN+1 ⋅
33.8.5
Control B
CLKADC
2
Name: CTRLB
Offset: 0x04
Reset: 0x0000
Property: Write-Protected, Write-Synchronized
Bit
15
14
13
12
11
10
9
8
PRESCALER[2:0]
Access
Reset
Bit
7
6
5
4
RESSEL[1:0]
Access
Reset
R/W
R/W
R/W
0
0
0
3
2
1
0
CORREN
FREERUN
LEFTADJ
DIFFMODE
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
Bits 10:8 – PRESCALER[2:0]: Prescaler Configuration
These bits define the ADC clock relative to the peripheral clock.
PRESCALER[2:0]
Name
Description
0x0
DIV4
Peripheral clock divided by 4
0x1
DIV8
Peripheral clock divided by 8
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PRESCALER[2:0]
Name
Description
0x2
DIV16
Peripheral clock divided by 16
0x3
DIV32
Peripheral clock divided by 32
0x4
DIV64
Peripheral clock divided by 64
0x5
DIV128
Peripheral clock divided by 128
0x6
DIV256
Peripheral clock divided by 256
0x7
DIV512
Peripheral clock divided by 512
Bits 5:4 – RESSEL[1:0]: Conversion Result Resolution
These bits define whether the ADC completes the conversion at 12-, 10- or 8-bit result resolution.
RESSEL[1:0]
Name
Description
0x0
12BIT
12-bit result
0x1
16BIT
For averaging mode output
0x2
10BIT
10-bit result
0x3
8BIT
8-bit result
Bit 3 – CORREN: Digital Correction Logic Enabled
Value
0
1
Description
Disable the digital result correction.
Enable the digital result correction. The ADC conversion result in the RESULT register is
then corrected for gain and offset based on the values in the GAINCAL and OFFSETCAL
registers. Conversion time will be increased by X cycles according to the value in the Offset
Correction Value bit group in the Offset Correction register.
Bit 2 – FREERUN: Free Running Mode
Value
0
1
Description
The ADC run is single conversion mode.
The ADC is in free running mode and a new conversion will be initiated when a previous
conversion completes.
Bit 1 – LEFTADJ: Left-Adjusted Result
Value
0
1
Description
The ADC conversion result is right-adjusted in the RESULT register.
The ADC conversion result is left-adjusted in the RESULT register. The high byte of the 12bit result will be present in the upper part of the result register. Writing this bit to zero
(default) will right-adjust the value in the RESULT register.
Bit 0 – DIFFMODE: Differential Mode
Value
0
1
Description
The ADC is running in singled-ended mode.
The ADC is running in differential mode. In this mode, the voltage difference between the
MUXPOS and MUXNEG inputs will be converted by the ADC.
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33.8.6
Window Monitor Control
Name: WINCTRL
Offset: 0x08
Reset: 0x00
Property: Write-Protected, Write-Synchronized
Bit
7
6
5
4
3
2
1
0
WINMODE[2:0]
Access
R/W
R/W
R/W
0
0
0
Reset
Bits 2:0 – WINMODE[2:0]: Window Monitor Mode
These bits enable and define the window monitor mode.
WINMODE[2:0]
Name
Description
0x0
DISABLE
No window mode (default)
0x1
MODE1
Mode 1: RESULT > WINLT
0x2
MODE2
Mode 2: RESULT < WINUT
0x3
MODE3
Mode 3: WINLT < RESULT < WINUT
0x4
MODE4
Mode 4: !(WINLT < RESULT < WINUT)
0x5-0x7
33.8.7
Reserved
Software Trigger
Name: SWTRIG
Offset: 0x0C
Reset: 0x00
Property: Write-Protected, Write-Synchronized
Bit
7
6
5
4
3
Access
Reset
2
1
0
START
FLUSH
R/W
R/W
0
0
Bit 1 – START: ADC Start Conversion
Writing this bit to zero will have no effect.
Value
0
1
Description
The ADC will not start a conversion.
The ADC will start a conversion. The bit is cleared by hardware when the conversion has
started. Setting this bit when it is already set has no effect.
Bit 0 – FLUSH: ADC Conversion Flush
After the flush, the ADC will resume where it left off; i.e., if a conversion was pending, the ADC will start a
new conversion.
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Writing this bit to zero will have no effect.
Value
0
1
Description
No flush action.
"Writing a '1' to this bit will flush the ADC pipeline. A flush will restart the ADC clock on the
next peripheral clock edge, and all conversions in progress will be aborted and lost. This bit
will be cleared after the ADC has been flushed.
After the flush, the ADC will resume where it left off; i.e., if a conversion was pending, the
ADC will start a new conversion.
33.8.8
Input Control
Name: INPUTCTRL
Offset: 0x10
Reset: 0x00000000
Property: Write-Protected, Write-Synchronized
Bit
31
30
29
28
27
26
25
24
GAIN[3:0]
Access
R/W
R/W
R/W
R/W
0
0
0
0
20
19
18
17
16
Reset
Bit
23
22
21
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
15
14
13
12
11
10
9
8
INPUTOFFSET[3:0]
Access
INPUTSCAN[3:0]
MUXNEG[4:0]
Access
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
4
3
2
1
0
Reset
Bit
7
6
5
MUXPOS[4:0]
Access
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
Reset
Bits 27:24 – GAIN[3:0]: Gain Factor Selection
These bits set the gain factor of the ADC gain stage.
GAIN[3:0]
Name
Description
0x0
1X
1x
0x1
2X
2x
0x2
4X
4x
0x3
8X
8x
0x4
16X
16x
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GAIN[3:0]
Name
Description
0x5-0xE
Reserved
0xF
DIV2
1/2x
Bits 23:20 – INPUTOFFSET[3:0]: Positive Mux Setting Offset
The pin scan is enabled when INPUTSCAN != 0. Writing these bits to a value other than zero causes the
first conversion triggered to be converted using a positive input equal to MUXPOS + INPUTOFFSET.
Setting this register to zero causes the first conversion to use a positive input equal to MUXPOS.
After a conversion, the INPUTOFFSET register will be incremented by one, causing the next conversion
to be done with the positive input equal to MUXPOS + INPUTOFFSET. The sum of MUXPOS and
INPUTOFFSET gives the input that is actually converted.
Bits 19:16 – INPUTSCAN[3:0]: Number of Input Channels Included in Scan
This register gives the number of input sources included in the pin scan. The number of input sources
included is INPUTSCAN + 1. The input channels included are in the range from MUXPOS +
INPUTOFFSET to MUXPOS + INPUTOFFSET + INPUTSCAN.
The range of the scan mode must not exceed the number of input channels available on the device.
Bits 12:8 – MUXNEG[4:0]: Negative Mux Input Selection
These bits define the Mux selection for the negative ADC input. selections.
Value
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08-0x1
7
0x18
0x19
0x1A-0x1
F
Name
PIN0
PIN1
PIN2
PIN3
PIN4
PIN5
PIN6
PIN7
Reserved
Description
ADC AIN0 pin
ADC AIN1 pin
ADC AIN2 pin
ADC AIN3 pin
ADC AIN4 pin
ADC AIN5 pin
ADC AIN6 pin
ADC AIN7 pin
GND
IOGND
Reserved
Internal ground
I/O ground
Note: 1. Only available in SAM R21G.
Bits 4:0 – MUXPOS[4:0]: Positive Mux Input Selection
These bits define the Mux selection for the positive ADC input. The following table shows the possible
input selections. If the internal bandgap voltage or temperature sensor input channel is selected, then the
Sampling Time Length bit group in the SamplingControl register must be written.
MUXPOS[4:0]
Group configuration
Description
0x00
PIN0
ADC AIN0 pin
0x01
PIN1
ADC AIN1 pin
0x02
PIN2
ADC AIN2 pin
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MUXPOS[4:0]
Group configuration
Description
0x03
PIN3
ADC AIN3 pin
0x04
PIN4
ADC AIN4 pin
0x05
PIN5
ADC AIN5 pin
0x06
PIN6
ADC AIN6 pin
0x07
PIN7
ADC AIN7 pin
0x08
PIN8
ADC AIN8 pin
0x09
PIN9
ADC AIN9 pin
0x0A
PIN10
ADC AIN10 pin
0x0B
PIN11
ADC AIN11 pin
0x0C
PIN12
ADC AIN12 pin
0x0D
PIN13
ADC AIN13 pin
0x0E
PIN14
ADC AIN14 pin
0x0F
PIN15
ADC AIN15 pin
0x10
PIN16
ADC AIN16 pin
0x11
PIN17
ADC AIN17 pin
0x12
PIN18
ADC AIN18 pin
0x13
PIN19
ADC AIN19 pin
0x14-0x17
Reserved
0x18
TEMP
Temperature reference
0x19
BANDGAP
Bandgap voltage
0x1A
SCALEDCOREVCC
1/4 scaled core supply
0x1B
SCALEDIOVCC
1/4 scaled I/O supply
0x1C
DAC
DAC output
0x1D-0x1F
33.8.9
Reserved
Event Control
Name: EVCTRL
Offset: 0x14
Reset: 0x00
Property: Write-Protected
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Bit
7
6
Access
Reset
5
4
1
0
WINMONEO
RESRDYEO
3
2
SYNCEI
STARTEI
R/W
R/W
R/W
R/W
0
0
0
0
Bit 5 – WINMONEO: Window Monitor Event Out
This bit indicates whether the Window Monitor event output is enabled or not and an output event will be
generated when the window monitor detects something.
Value
0
1
Description
Window Monitor event output is disabled and an event will not be generated.
Window Monitor event output is enabled and an event will be generated.
Bit 4 – RESRDYEO: Result Ready Event Out
This bit indicates whether the Result Ready event output is enabled or not and an output event will be
generated when the conversion result is available.
Value
0
1
Description
Result Ready event output is disabled and an event will not be generated.
Result Ready event output is enabled and an event will be generated.
Bit 1 – SYNCEI: Synchronization Event In
Value
0
1
Description
A flush and new conversion will not be triggered on any incoming event.
A flush and new conversion will be triggered on any incoming event.
Bit 0 – STARTEI: Start Conversion Event In
Value
0
1
Description
A new conversion will not be triggered on any incoming event.
A new conversion will be triggered on any incoming event.
33.8.10 Interrupt Enable Clear
Name: INTENCLR
Offset: 0x16
Reset: 0x00
Property: Write-Protected
Bit
7
6
Access
Reset
5
4
3
2
1
0
SYNCRDY
WINMON
OVERRUN
RESRDY
R/W
R/W
R/W
R/W
0
0
0
0
Bit 3 – SYNCRDY: Synchronization Ready Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Synchronization Ready Interrupt Enable bit and the corresponding
interrupt request.
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32-bit ARM-Based Microcontrollers
Value
0
1
Description
The Synchronization Ready interrupt is disabled.
The Synchronization Ready interrupt is enabled, and an interrupt request will be generated
when the Synchronization Ready interrupt flag is set.
Bit 2 – WINMON: Window Monitor Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Window Monitor Interrupt Enable bit and the corresponding interrupt
request.
Value
0
1
Description
The window monitor interrupt is disabled.
The window monitor interrupt is enabled, and an interrupt request will be generated when the
Window Monitor interrupt flag is set.
Bit 1 – OVERRUN: Overrun Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Overrun Interrupt Enable bit and the corresponding interrupt request.
Value
0
1
Description
The Overrun interrupt is disabled.
The Overrun interrupt is enabled, and an interrupt request will be generated when the
Overrun interrupt flag is set.
Bit 0 – RESRDY: Result Ready Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will clear the Result Ready Interrupt Enable bit and the corresponding interrupt
request.
Value
0
1
Description
The Result Ready interrupt is disabled.
The Result Ready interrupt is enabled, and an interrupt request will be generated when the
Result Ready interrupt flag is set.
33.8.11 Interrupt Enable Set
Name: INTENSET
Offset: 0x17
Reset: 0x00
Property: Write-Protected
Bit
7
6
Access
Reset
5
4
3
2
1
0
SYNCRDY
WINMON
OVERRUN
RESRDY
R/W
R/W
R/W
R/W
0
0
0
0
Bit 3 – SYNCRDY: Synchronization Ready Interrupt Enable
Writing a zero to this bit has no effect.
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32-bit ARM-Based Microcontrollers
Writing a one to this bit will set the Synchronization Ready Interrupt Enable bit, which enables the
Synchronization Ready interrupt.
Value
0
1
Description
The Synchronization Ready interrupt is disabled.
The Synchronization Ready interrupt is enabled.
Bit 2 – WINMON: Window Monitor Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Window Monitor Interrupt bit and enable the Window Monitor interrupt.
Value
0
1
Description
The Window Monitor interrupt is disabled.
The Window Monitor interrupt is enabled.
Bit 1 – OVERRUN: Overrun Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Overrun Interrupt bit and enable the Overrun interrupt.
Value
0
1
Description
The Overrun interrupt is disabled.
The Overrun interrupt is enabled.
Bit 0 – RESRDY: Result Ready Interrupt Enable
Writing a zero to this bit has no effect.
Writing a one to this bit will set the Result Ready Interrupt bit and enable the Result Ready interrupt.
Value
0
1
Description
The Result Ready interrupt is disabled.
The Result Ready interrupt is enabled.
33.8.12 Interrupt Flag Status and Clear
Name: INTFLAG
Offset: 0x18
Reset: 0x00
Property:
Bit
7
6
5
4
Access
Reset
3
2
1
0
SYNCRDY
WINMON
OVERRUN
RESRDY
R/W
R/W
R/W
R/W
0
0
0
0
Bit 3 – SYNCRDY: Synchronization Ready
This flag is cleared by writing a one to the flag.
This flag is set on a one-to-zero transition of the Synchronization Busy bit in the Status register
(STATUS.SYNCBUSY), except when caused by an enable or software reset, and will generate an
interrupt request if INTENCLR/SET.SYNCRDY is one.
Writing a zero to this bit has no effect.
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32-bit ARM-Based Microcontrollers
Writing a one to this bit clears the Synchronization Ready interrupt flag.
Bit 2 – WINMON: Window Monitor
This flag is cleared by writing a one to the flag or by reading the RESULT register.
This flag is set on the next GCLK_ADC cycle after a match with the window monitor condition, and an
interrupt request will be generated if INTENCLR/SET.WINMON is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the Window Monitor interrupt flag.
Bit 1 – OVERRUN: Overrun
This flag is cleared by writing a one to the flag.
This flag is set if RESULT is written before the previous value has been read by CPU, and an interrupt
request will be generated if INTENCLR/SET.OVERRUN is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the Overrun interrupt flag.
Bit 0 – RESRDY: Result Ready
This flag is cleared by writing a one to the flag or by reading the RESULT register.
This flag is set when the conversion result is available, and an interrupt will be generated if INTENCLR/
SET.RESRDY is one.
Writing a zero to this bit has no effect.
Writing a one to this bit clears the Result Ready interrupt flag.
33.8.13 Status
Name: STATUS
Offset: 0x19
Reset: 0x00
Property:
Bit
7
6
5
4
3
2
1
0
SYNCBUSY
Access
R
Reset
0
Bit 7 – SYNCBUSY: Synchronization Busy
This bit is cleared when the synchronization of registers between the clock domains is complete.
This bit is set when the synchronization of registers between clock domains is started.
33.8.14 Result
Name: RESULT
Offset: 0x1A
Reset: 0x0000
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32-bit ARM-Based Microcontrollers
Property: Read-Synchronized
Bit
15
14
13
12
11
10
9
8
RESULT[15:8]
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
Access
R
R
R
R
R
R
R
R
Reset
0
0
0
0
0
0
0
0
RESULT[7:0]
Bits 15:0 – RESULT[15:0]: Result Conversion Value
These bits will hold up to a 16-bit ADC result, depending on the configuration.
In single conversion mode without averaging, the ADC conversion will produce a 12-bit result, which can
be left- or right-shifted, depending on the setting of CTRLB.LEFTADJ.
If the result is left-adjusted (CTRLB.LEFTADJ), the high byte of the result will be in bit position [15:8],
while the remaining 4 bits of the result will be placed in bit locations [7:4]. This can be used only if an 8-bit
result is required; i.e., one can read only the high byte of the entire 16-bit register.
If the result is not left-adjusted (CTRLB.LEFTADJ) and no oversampling is used, the result will be
available in bit locations [11:0], and the result is then 12 bits long.
If oversampling is used, the result will be located in bit locations [15:0], depending on the settings of the
Average Control register (AVGCTRL).
33.8.15 Window Monitor Lower Threshold
Name: WINLT
Offset: 0x1C
Reset: 0x0000
Property: Write-Protected, Write-Synchronized
Bit
15
14
13
12
11
10
9
8
WINLT[15:8]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
WINLT[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 15:0 – WINLT[15:0]: Window Lower Threshold
If the window monitor is enabled, these bits define the lower threshold value.
33.8.16 Window Monitor Upper Threshold
Name:
WINUT
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32-bit ARM-Based Microcontrollers
Offset: 0x20
Reset: 0x0000
Property: Write-Protected, Write-Synchronized
Bit
15
14
13
12
11
10
9
8
WINUT[15:8]
Access
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Reset
0
0
0
0
0
0
0
0
Bit
7
6
5
4
3
2
1
0
WINUT[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
9
8
Bits 15:0 – WINUT[15:0]: Window Upper Threshold
If the window monitor is enabled, these bits define the upper threshold value.
33.8.17 Gain Correction
Name: GAINCORR
Offset: 0x24
Reset: 0x0000
Property: Write-Protected
Bit
15
14
13
12
11
10
R/W
R/W
R/W
R/W
0
0
0
0
3
2
1
0
GAINCORR[11:8]
Access
Reset
Bit
7
6
5
4
GAINCORR[7:0]
Access
Reset
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
0
0
0
0
0
0
0
0
Bits 11:0 – GAINCORR[11:0]: Gain Correction Value
If the CTRLB.CORREN bit is one, these bits define how the ADC conversion result is compensated for
gain error before being written to the result register. The gain-correction is a fractional value, a 1-bit
integer plusan 11-bit fraction, and therefore 1/2 1.6V, IOL maxI
-
0.1*VDD 0.2*VDD
VOH
Output high-level VDD>1.6V, IOH maxII
voltage
0.8*VDD
0.9*VDD -
VIH
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32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
IOL
VDD=1.62V-3V,
PORT.PINCFG.DRVSTR=0
-
-
1
mA
VDD=3V-3.63V,
PORT.PINCFG.DRVSTR=0
-
-
2.5
VDD=1.62V-3V,
PORT.PINCFG.DRVSTR=1
-
-
3
VDD=3V-3.63V,
PORT.PINCFG.DRVSTR=1
-
-
10
Output high-level VDD=1.62V-3V,
current
PORT.PINCFG.DRVSTR=0
-
-
0.70
VDD=3V-3.63V,
PORT.PINCFG.DRVSTR=0
-
-
2
VDD=1.62V-3V,
PORT.PINCFG.DRVSTR=1
-
-
2
VDD=3V-3.63V,
PORT.PINCFG.DRVSTR=1
-
-
7
PORT.PINCFG.DRVSTR=0load =
5pF, VDD = 3.3V
-
-
15
PORT.PINCFG.DRVSTR=1load =
20pF, VDD = 3.3V
-
-
15
PORT.PINCFG.DRVSTR=0load =
5pF, VDD = 3.3V
-
-
15
PORT.PINCFG.DRVSTR=1load =
20pF, VDD = 3.3V
-
-
15
Pull-up resistors disabled
-1
+/-0.015 1
IOH
tRISE
tFALL
ILEAK
Output low-level
current
Rise time(1)
Fall time(1)
Input leakage
current
ns
ns
μA
Note: 1. These values are based on simulation. These values are not covered by test limits in
production or characterization.
37.8.2
I2C Pins
Refer to I/O Multiplexing and Considerations to get the list of I2C pins.
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32-bit ARM-Based Microcontrollers
Table 37-15. I2C Pins Characteristics in I2C configuration
Symbol Parameter
Condition
Min.
Typ. Max.
Units
kΩ
RPULL
Pull-up - Pull-down resistance I
20
40
60
VIL
Input low-level voltage
VDD=1.62V-2.7VI
-
-
0.25*VDD V
VDD=2.7V-3.63V
-
-
0.3*VDD
VDD=1.62V-2.7V
0.7*VDD
-
-
VDD=2.7V-3.63VI
0.55*VDD -
-
0.08*VDD -
-
VDD> 2.0V,
IOL=3mA
-
-
0.4
VDD≤2.0V
, IOL=2mA
-
-
0.2*VDD
VOL =0.4V
Standard, Fast and HS
Modes
3
VOL =0.4V
Fast Mode +
20
-
-
VOL =0.6V
6
-
-
I
-
-
3.4
VIH
Input high-level voltage
VHYS
Hysteresis of Schmitt trigger
inputs
VOL
Output low-level voltage
IOL
fSCL
Output low-level current
SCL clock frequency
mA
MHz
I2C pins timing characteristics can be found in SERCOM in I2C Mode Timing.
37.8.3
XOSC Pin
XOSC pins behave as normal pins when used as normal I/Os. Refer to table Normal I/O Pins.
37.8.4
XOSC32 Pin
XOSC32 pins behave as normal pins when used as normal I/Os. Refer to table Normal I/O Pins.
37.8.5
External Reset Pin
Reset pin has the same electrical characteristics as normal I/O pins. Refer to table Normal I/O Pins.
37.9
Injection Current
Stresses beyond those listed in the table below may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or other conditions beyond those
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Table 37-16. Injection Current(1,2)
Symbol
Description
min
max
Unit
Iinj1 (3)
IO pin injection current
-1
+1
mA
Iinj2 (4)
IO pin injection current
-15
+15
mA
Iinjtotal
Sum of IO pins injection current
-45
+45
mA
1.
2.
3.
Injecting current may have an effect on the accuracy of Analog blocks
Injecting current on Backup IOs is not allowed
Conditions for Vpin: Vpin < GND-0.6V or 3.6V 0.2*VDDANA - 0.1V
4. The ADC channels on pins PA08, PA09, PA10, PA11 are powered from the VDDIO power supply.
The ADC performance of these pins will not be the same as all the other ADC channels on pins
powered from the VDDANA power supply.
5. The gain accuracy represents the gain error expressed in percent. Gain accuracy (%) = (Gain Error
in V x 100) / (2*Vref/GAIN)
Table 37-25. Single-Ended Mode (Device Variant A)
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
ENOB
Effective Number of Bits
With gain compensation
-
9.5
9.8
Bits
TUE
Total Unadjusted Error
1x gain
-
10.5
14.0
LSB
INL
Integral Non-Linearity
1x gain
1.0
1.6
3.5
LSB
DNL
Differential Non-Linearity
1x gain
+/-0.5
+/-0.6
+/-0.95 LSB
Gain Error
Ext. Ref. 1x
-5.0
0.7
+5.0
Gain Accuracy(4)
Ext. Ref. 0.5x
+/-0.2
+/-0.34 +/-0.4
Ext. Ref. 2x to 16X
+/-0.01 +/-0.1
+/-0.2
%
Offset Error
Ext. Ref. 1x
-5.0
1.5
+5.0
mV
SFDR
Spurious Free Dynamic Range
63.1
65.0
67.0
dB
SINAD
Signal-to-Noise and Distortion
1x gain
FCLK_ADC = 2.1MHz
47.5
59.5
61.0
dB
48.0
60.0
64.0
dB
-65.4
-63.0
-62.1
dB
-
1.0
-
mV
SNR
THD
Signal-to-Noise Ratio
Total Harmonic Distortion
Noise RMS
FIN = 40kHz
AIN = 95%FSR
T = 25°C
mV
%
Table 37-26. Single-Ended Mode (Device Variant B and C)
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
ENOB
Effective Number of Bits
With gain compensation
-
9.7
10.1
Bits
TUE
Total Unadjusted Error
1x gain
-
7.9
15.0
LSB
INL
Integral Non-Linearity
1x gain
1.4
2.6
4.5
LSB
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32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max.
DNL
Differential Non-Linearity
1x gain
+/-0.6
+/-0.7
+/-0.95 LSB
Gain Error
Ext. Ref. 1x
-5.0
0.6
+5.0
Gain Accuracy(4)
Ext. Ref. 0.5x
+/-0.2
+/-0.37 +/-0.55 %
Ext. Ref. 2x to 16X
+/-0.01 +/-0.1
+/-0.2
%
Offset Error
Ext. Ref. 1x
-5.0
0.6
+5.0
mV
SFDR
Spurious Free Dynamic Range
63.0
68.0
71.0
dB
SINAD
Signal-to-Noise and Distortion
1x gain
FCLK_ADC = 2.1MHz
55.0
60.1
63.0
dB
54.0
61.0
64.0
dB
-70.8
-68.0
-65.0
dB
-
1.0
-
mV
SNR
THD
Signal-to-Noise Ratio
Total Harmonic Distortion
Noise RMS
FIN = 40kHz
AIN = 95%FSR
T = 25°C
Units
mV
Note:
1. Maximum numbers are based on characterization and not tested in production, and for 5% to 95%
of the input voltage range.
2. Respect the input common mode voltage through the following equations (where VCM_IN is the
Input channel common mode voltage) for all VIN:
– VCM_IN < 0.7*VDDANA + VREF/4 – 0.75V
– VCM_IN > VREF/4 – 0.3*VDDANA - 0.1V
3. The ADC channels on pins PA08, PA09, PA10, PA11 are powered from the VDDIO power supply.
The ADC performance of these pins will not be the same as all the other ADC channels on pins
powered from the VDDANA power supply.
4. The gain accuracy represents the gain error expressed in percent. Gain accuracy (%) = (Gain Error
in V x 100) / (Vref/GAIN)
37.10.4.1 Performance with the Averaging Digital Feature
Averaging is a feature which increases the sample accuracy. ADC automatically computes an average
value of multiple consecutive conversions. The numbers of samples to be averaged is specified by the
Number-of-Samples-to-be-collected bit group in the Average Control register
(AVGCTRL.SAMPLENUM[3:0]) and the averaged output is available in the Result register (RESULT).
Table 37-27. Averaging Feature (Devcie Variant A)
Average
Number
Conditions
SNR
(dB)
SINAD
(dB)
SFDR
(dB)
ENOB
(bits)
1
In differential mode, 1x gain,
VDDANA=3.0V, VREF=1.0V, 350kSps at
25°C
66.0
65.0
72.8
9.75
67.6
65.8
75.1
10.62
32
69.7
67.1
75.3
10.85
128
70.4
67.5
75.5
10.91
8
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Table 37-28. Averaging Feature (Device Variant B and C)
Average
Number
Conditions
SNR
(dB)
SINAD
(dB)
SFDR
(dB)
ENOB
(bits)
1
In differential mode, 1x gain,
VDDANA=3.0V, VREF=1.0V, 350kSps at
25°C
66.0
65.0
72.8
10.5
67.6
65.8
75.1
10.62
32
69.7
67.1
75.3
10.85
128
70.4
67.5
75.5
10.91
8
37.10.4.2 Performance with the hardware offset and gain correction
Inherent gain and offset errors affect the absolute accuracy of the ADC. The offset error cancellation is
handled by the Offset Correction register (OFFSETCORR) and the gain error cancellation, by the Gain
Correction register (GAINCORR). The offset and gain correction value is subtracted from the converted
data before writing the Result register (RESULT).
Table 37-29. Offset and Gain correction feature
Gain
Factor
Conditions
Offset
Error (mV)
0.5x
1x
In differential mode, 1x gain, VDDANA=3.0V, 0.25
VREF=1.0V, 350kSps at 25°C
0.20
2x
Gain Error Total Unadjusted
(mV)
Error (LSB)
1.0
2.4
0.10
1.5
0.15
-0.15
2.7
8x
-0.05
0.05
3.2
16x
0.10
-0.05
6.1
37.10.4.3 Inputs and Sample and Hold Acquisition Times
The analog voltage source must be able to charge the sample and hold (S/H) capacitor in the ADC in
order to achieve maximum accuracy. Seen externally the ADC input consists of a resistor (�SAMPLE) and a
capacitor (�SAMPLE). In addition, the source resistance (�SOURCE) must be taken into account when
calculating the required sample and hold time. The next figure shows the ADC input channel equivalent
circuit.
Figure 37-5. ADC Input
VDDANA/2
Analog Input
AINx
RSOURCE
CSAMPLE
RSAMPLE
VIN
To achieve n bits of accuracy, the �SAMPLE capacitor must be charged at least to a voltage of
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�CSAMPLE ≥ �
IN
�+1
× 1 + − 2−
The minimum sampling time �SAMPLEHOLD for a given �SOURCEcan be found using this formula:
�SAMPLEHOLD ≥ �SAMPLE + �
SOURCE
× �SAMPLE × � + 1 × ln 2
for a 12 bits accuracy: �SAMPLEHOLD ≥ �SAMPLE + �
SOURCE
where
�SAMPLEHOLD =
× �SAMPLE × 9.02
1
2 × �ADC
37.10.5 Digital to Analog Converter (DAC) Characteristics
Table 37-30. Operating Conditions(1)
Symbol Parameter
Conditions
Min. Typ.
Max.
Units
VDDANA
Analog supply voltage
1.62 -
3.63
V
AVREF
External reference voltage
1.0
-
VDDANA-0.6
V
Internal reference voltage 1
-
1
-
V
Internal reference voltage 2
-
VDDANA -
V
Linear output voltage range
0.05 -
VDDANA-0.05
V
Minimum resistive load
5
-
-
kΩ
Maximum capacitance load
-
-
100
pF
-
160
230
μA
IDD
DC supply current(2)
Voltage pump disabled
1. These values are based on specifications otherwise noted.
2. These values are based on characterization. These values are not covered by test limits in production.
Table 37-31. Clock and Timing(1)
Symbol
Parameter
Conditions
Conversion rate
Cload=100pF
Rload > 5kΩ
Startup time
Min.
Typ.
Max.
Units
Normal mode
-
-
350
ksps
For ΔDATA=+/-1
-
-
1000
VDDNA > 2.6V
-
-
2.85
μs
VDDNA < 2.6V
-
-
10
μs
1. These values are based on simulation. These values are not covered by test limits in production or
characterization.
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Table 37-32. Accuracy Characteristics(1) (Device Variant A)
Symbol
Parameter
RES
Input resolution
INL
Integral non-linearity
Conditions
VREF= Ext 1.0V
VREF = VDDANA
VREF= INT1V
DNL
Differential non-linearity
VREF= Ext 1.0V
VREF= VDDANA
VREF= INT1V
Min.
Typ.
Max.
Units
-
-
10
Bits
VDD = 1.6V
0.75
1.1
2.5
LSB
VDD = 3.6V
0.6
1.2
1.5
VDD = 1.6V
1.4
2.2
2.5
VDD = 3.6V
0.9
1.4
1.5
VDD = 1.6V
0.75
1.3
1.5
VDD = 3.6V
0.8
1.2
1.5
VDD = 1.6V
+/-0.9
+/-1.2
+/-1.5
VDD = 3.6V
+/-0.9
+/-1.1
+/-1.2
VDD = 1.6V
+/-1.1
+/-1.5
+/-1.7
VDD = 3.6V
+/-1.0
+/-1.1
+/-1.2
VDD = 1.6V
+/-1.1
+/-1.4
+/-1.5
VDD = 3.6V
+/-1.0
+/-1.5
+/-1.6
LSB
Gain error
Ext. VREF
+/-1.5
+/-5
+/-10
mV
Offset error
Ext. VREF
+/-2
+/-3
+/-6
mV
Table 37-33. Accuracy Characteristics(1) (Device Variant B and C)
Symbol
Parameter
RES
Input resolution
INL
Integral non-linearity
Conditions
VREF= Ext 1.0V
VREF = VDDANA
VREF= INT1V
DNL
Differential non-linearity
VREF= Ext 1.0V
VREF= VDDANA
VREF= INT1V
© 2017 Microchip Technology Inc.
Min.
Typ.
Max.
Units
-
-
10
Bits
VDD = 1.6V
0.7
0.75
2
LSB
VDD = 3.6V
0.6
0.65
1.5
VDD = 1.6V
0.6
0.85
2
VDD = 3.6V
0.5
0.8
1.5
VDD = 1.6V
0.5
0.75
1.5
VDD = 3.6V
0.7
0.8
1.5
VDD = 1.6V
+/-0.3
+/-0.4
+/-1.0
VDD = 3.6V
+/-0.25 +/-0.4
VDD = 1.6V
+/-0.4
+/-0.55 +/-1.5
VDD = 3.6V
+/-0.2
+/-0.3
+/-0.75
VDD = 1.6V
+/-0.5
+/-0.7
+/-1.5
VDD = 3.6V
+/-0.4
+/-0.7
+/-1.5
Datasheet Complete
LSB
+/-0.75
40001882A-page 810
32-bit ARM-Based Microcontrollers
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
Gain error
Ext. VREF
+/-0.5
+/-5
+/-10
mV
Offset error
Ext. VREF
+/-2
+/-1.5
+/-8
mV
Note: 1. All values measured using a conversion rate of 350ksps.
37.10.6 Analog Comparator Characteristics
Table 37-34. Electrical and Timing (Device Variant A)
Symbol Parameter
Min.
Typ.
Max.
Positive input voltage
range
0
-
VDDANA V
Negative input voltage
range
0
-
VDDANA
Hysteresis = 0, Fast mode
-15
0.0
+15
mV
Hysteresis = 0, Low power mode
-25
0.0
+25
mV
Hysteresis = 1, Fast mode
20
50
80
mV
Hysteresis = 1, Low power mode
15
40
75
mV
Changes for VACM=VDDANA/2
100mV overdrive, Fast mode
-
60
116
ns
Changes for VACM=VDDANA/2
100mV overdrive, Low power mode
225
370
ns
Enable to ready delay
Fast mode
-
1
2
μs
Enable to ready delay
Low power mode
-
12
19
μs
INL(3)
-1.4
0.75
+1.4
LSB
DNL(3)
-0.9
0.25
+0.9
LSB
Offset Error (1)(2)
-0.200 0.260 +0.920 LSB
Gain Error (1)(2)
-0.89
0.215 0.89
LSB
Min.
Typ.
Max.
Units
Positive input voltage
range
0
-
VDDANA V
Negative input voltage
range
0
-
VDDANA
Hysteresis = 0, Fast mode
-15
0.0
+15
mV
Hysteresis = 0, Low power mode
-25
0.0
+25
mV
Offset
Hysteresis
Propagation delay
tSTARTUP Startup time
VSCALE
Conditions
Units
Table 37-35. Electrical and Timing (Device Variant B and C)
Symbol Parameter
Offset
© 2017 Microchip Technology Inc.
Conditions
Datasheet Complete
40001882A-page 811
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
Hysteresis = 1, Fast mode
20
50
85
mV
Hysteresis = 1, Low power mode
15
40
75
mV
Changes for VACM=VDDANA/2
100mV overdrive, Fast mode
-
90
180
ns
Changes for VACM=VDDANA/2
100mV overdrive, Low power mode
282
520
ns
Enable to ready delay
Fast mode
-
1
2.6
μs
Enable to ready delay
Low power mode
-
14
22
μs
INL(3)
-1.4
0.75
+1.4
LSB
DNL(3)
-0.9
0.25
+0.9
LSB
Offset Error (1)(2)
-0.200 0.260 +0.920 LSB
Gain Error (1)(2)
-0.89
Hysteresis
Propagation delay
tSTARTUP Startup time
VSCALE
0.215 0.89
LSB
Note:
1. According to the standard equation V(X)=VLSB*(X+1); VLSB=VDDANA/64
2. Data computed with the Best Fit method
3. Data computed using histogram
37.10.7 Internal 1.1V Bandgap Reference Characteristics
Table 37-36. Bandgap and Internal 1.1V reference characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
INT1V
Internal 1.1V Bandgap
reference
After calibration at T= 25°C,
over [-40, +85]C
1.08
1.1
1.12
V
Over voltage at 25°C
1.09
1.1
1.11
V
37.10.8 Temperature Sensor Characteristics
37.10.8.1 Temperature Sensor Characteristics
Table 37-37. Temperature Sensor Characteristics(1) (Device Variant A)
Symbol Parameter
Temperature sensor
output voltage
Conditions
Min. Typ.
T= 25°C, VDDANA = 3.3V
-
0.667 -
V
2.3
2.4
mV/°C
Temperature sensor
slope
© 2017 Microchip Technology Inc.
Datasheet Complete
Max. Units
2.5
40001882A-page 812
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min. Typ.
Max. Units
Variation over VDDANA
voltage
VDDANA=1.62V to 3.6V
-1.7 1
3.7
mV/V
Temperature Sensor
accuracy
Using the method described in the
Software-based Refinement of the Actual
Temperature
-10
10
°C
-
Table 37-38. Temperature Sensor Characteristics(1) (Device Variant B and C)
Symbol Parameter
Temperature sensor
output voltage
Conditions
Min. Typ.
T= 25°C, VDDANA = 3.3V
-
Temperature sensor
slope
Max. Units
0.688 -
V
2.06 2.16
2.26 mV/°C
Variation over VDDANA
voltage
VDDANA=1.62V to 3.6V
-0.4 1.4
3
mV/V
Temperature Sensor
accuracy
Using the method described in the
Software-based Refinement of the Actual
Temperature
-10
10
°C
-
Note: 1. These values are based on characterization. These values are not covered by test limits in
production.
37.10.8.2 Software-based Refinement of the Actual Temperature
The temperature sensor behavior is linear but depends on several parameters such as the internal
voltage reference, which itself depends on the temperature. To take this into account, each device
contains a Temperature Log row with data measured and written during the production tests. These
calibration values should be read by software to infer the most accurate temperature readings possible.
This Software Temperature Log row can be read at address 0x00806030
This section specifies the Temperature Log row content and explains how to refine the temperature
sensor output using the values in the Temperature Log row.
Temperature Log Row
All values in this row were measured in the following conditions:
•
VDDIN = VDDIO = VDDANA = 3.3V
•
ADC Clock speed = 1MHz
•
ADC mode: Free running mode, ADC averaging mode with 4 averaged samples
•
ADC voltage reference = 1.0V internal reference (INT1V)
•
ADC input = Temperature sensor
Table 37-39. Temperature Log Row Content
Bit position Name
Description
7:0
ROOM_TEMP_VAL_INT
Integer part of room temperature in °C
11:8
ROOM_TEMP_VAL_DEC Decimal part of room temperature
19:12
HOT_TEMP_VAL_INT
© 2017 Microchip Technology Inc.
Integer part of hot temperature in °C
Datasheet Complete
40001882A-page 813
32-bit ARM-Based Microcontrollers
Bit position Name
Description
23:20
HOT_TEMP_VAL_DEC
Decimal part of hot temperature
31:24
ROOM_INT1V_VAL
2’s complement of the internal 1V reference drift at room
temperature (versus a 1.0 centered value)
39:32
HOT_INT1V_VAL
2’s complement of the internal 1V reference drift at hot
temperature (versus a 1.0 centered value)
51:40
ROOM_ADC_VAL
12-bit ADC conversion at room temperature
63:52
HOT_ADC_VAL
12-bit ADC conversion at hot temperature
The temperature sensor values are logged during test production flow for Room and Hot insertions:
•
•
ROOM_TEMP_VAL_INT and ROOM_TEMP_VAL_DEC contains the measured temperature at
room insertion (e.g. for ROOM_TEMP_VAL_INT=25 and ROOM_TEMP_VAL_DEC=2, the
measured temperature at room insertion is 25.2°C).
HOT_TEMP_VAL_INT and HOT_TEMP_VAL_DEC contains the measured temperature at hot
insertion (e.g. for HOT_TEMP_VAL_INT=83 and HOT_TEMP_VAL_DEC=3, the measured
temperature at room insertion is 83.3°C).
The temperature log row also contains the corresponding 12-bit ADC conversions of both Room and Hot
temperatures:
•
•
ROOM_ADC_VAL contains the 12-bit ADC value corresponding to (ROOM_TEMP_VAL_INT,
ROOM_TEMP_VAL_DEC)
HOT_ADC_VAL contains the 12-bit ADC value corresponding to (HOT_TEMP_VAL_INT,
HOT_TEMP_VAL_DEC)
The temperature log row also contains the corresponding 1V internal reference of both Room and Hot
temperatures:
•
•
•
ROOM_INT1V_VAL is the 2’s complement of the internal 1V reference value corresponding to
(ROOM_TEMP_VAL_INT, ROOM_TEMP_VAL_DEC)
HOT_INT1V_VAL is the 2’s complement of the internal 1V reference value corresponding to
(HOT_TEMP_VAL_INT, HOT_TEMP_VAL_DEC)
ROOM_INT1V_VAL and HOT_INT1V_VAL values are centered around 1V with a 0.001V step. In
other words, the range of values [0,127] corresponds to [1V, 0.873V] and the range of values [-1,
-127] corresponds to [1.001V, 1.127V]. INT1V == 1 - (VAL/1000) is valid for both ranges.
Using Linear Interpolation
For concise equations, we will use the following notations:
•
(ROOM_TEMP_VAL_INT, ROOM_TEMP_VAL_DEC) is denoted tempR
•
(HOT_TEMP_VAL_INT, HOT_TEMP_VAL_DEC) is denoted tempH
•
ROOM_ADC_VAL is denoted ADCR, its conversion to Volt is denoted VADCR
•
HOT_ADC_VAL is denoted ADCH, its conversion to Volt is denoted VADCH
•
ROOM_INT1V_VAL is denoted INT1VR
•
HOT_INT1V_VAL is denoted INT1VH
Using the (tempR, ADCR) and (tempH, ADCH) points, using a linear interpolation we have the following
equation:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 814
32-bit ARM-Based Microcontrollers
�ADC + − �ADCR
�ADCH + − �ADCR
=
temp+ − temp�
temp� + − temp�
Given a temperature sensor ADC conversion value ADCm, we can infer a coarse value of the
temperature tempC as:
temp� = temp� +
ADC� ⋅
[Equation 1]
1
212 + − 1
ADC� ⋅
+ − ADC� ⋅
INT1��
212 + − 1
INT1��
212 + − 1
+ − ADC� ⋅
⋅ temp� + − temp�
INT1��
12
2 + −1
Note:
1. In the previous expression, we have added the conversion of the ADC register value to be
expressed in V.
2. This is a coarse value because we assume INT1V=1V for this ADC conversion.
Using the (tempR, INT1VR) and (tempH, INT1VH) points, using a linear interpolation we have the following
equation:
INT1� + − INT1��
INT1�� + − INT1��
=
temp+ − temp�
temp� + − temp�
Then using the coarse temperature value, we can infer a closer to reality INT1V value during the ADC
conversion as:
INT1�� = INT1�� +
INT1�� + − INT1�� ⋅ temp� + − temp�
temp� + − temp�
Back to [Equation 1], if we replace INT1V=1V by INT1V = INT1Vm, we can deduce a finer temperature
value as:
temp� = temp� +
ADC� ⋅
[Equation 1bis]
© 2017 Microchip Technology Inc.
INT1��
212 + − 1
ADC� ⋅
+ − ADC� ⋅
INT1��
212 + − 1
INT1��
212 + − 1
+ − ADC� ⋅
⋅ temp� ⋅ temp�
INT1��
12
2 + −1
Datasheet Complete
40001882A-page 815
32-bit ARM-Based Microcontrollers
37.11
NVM Characteristics
Table 37-40. Maximum Operating Frequency
VDD range
NVM Wait States
Maximum Operating Frequency
Units
1.62V to 2.7V
0
14
MHz
1
28
2
42
3
48
0
24
1
48
2.7V to 3.63V
Note that on this flash technology, a max number of 8 consecutive write is allowed per row. Once this
number is reached, a row erase is mandatory.
Table 37-41. Flash Endurance and Data Retention
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
RetNVM25k
Retention after up to 25k
Average ambient 55°C
10
50
-
Years
RetNVM2.5k
Retention after up to 2.5k
Average ambient 55°C
20
100
-
Years
RetNVM100
Retention after up to 100
Average ambient 55°C
25
>100
-
Years
CycNVM
Cycling Endurance(1)
-40°C < Ta < 85°C
25k
150k
-
Cycles
1. An endurance cycle is a write and an erase operation.
Table 37-42. EEPROM Emulation(1) Endurance and Data Retention
Symbol
Parameter
Conditions
Min.
Typ.
Max. Units
RetEEPROM100k
Retention after up to 100k
Average ambient 55°C
10
50
-
Years
RetEEPROM10k
Retention after up to 10k
Average ambient 55°C
20
100
-
Years
CycEEPROM
Cycling Endurance(2)
-40°C < Ta < 85°C
100k 600k -
Cycles
1. The EEPROM emulation is a software emulation described in the App note AT03265.
2. An endurance cycle is a write and an erase operation.
Table 37-43. NVM Characteristics (Device Variant A)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
tFPP
Page programming time
-
-
-
2.5
ms
tFRE
Row erase time
-
-
-
6
ms
tFCE
DSU chip erase time (CHIP_ERASE)
-
-
-
240
ms
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 816
32-bit ARM-Based Microcontrollers
Table 37-44. NVM Characteristics (Device Variant B and C)
37.12
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
tFPP
Page programming time
-
-
-
2.5
ms
tFRE
Row erase time
-
-
-
1.2
ms
tFCE
DSU chip erase time (CHIP_ERASE)
-
-
-
240
ms
Oscillators Characteristics
37.12.1 Crystal Oscillator (XOSC) Characteristics
37.12.1.1 Digital Clock Characteristics
The following table describes the characteristics for the oscillator when a digital clock is applied on XIN.
Table 37-45. Digital Clock Characteristics
Symbol
Parameter
fCPXIN
XIN clock frequency
Conditions
Min.
Typ.
Max.
Units
-
-
32
MHz
37.12.1.2 Crystal Oscillator Characteristics
The following table describes the characteristics for the oscillator when a crystal is connected between
XIN and XOUT . The user must choose a crystal oscillator where the crystal load capacitance CL is within
the range given in the table. The exact value of CL can be found in the crystal datasheet. The capacitance
of the external capacitors (CLEXT) can then be computed as follows:
CLEXT = 2 CL + − CSTRAY − CSHUNT
where CSTRAY is the capacitance of the pins and PCB, CSHUNT is the shunt capacitance of the crystal.
Table 37-46. Crystal Oscillator Characteristics
Symbol Parameter
fOUT
Crystal oscillator frequency
ESR
Crystal Equivalent Series
Resistance
Safety Factor = 3
The AGC doesn’t have any
noticeable impact on these
measurements.
CXIN
Conditions
Min. Typ. Max.
Units
0.4
-
32
MHz
f = 0.455 MHz, CL = 100pF
XOSC.GAIN = 0
-
-
5.6K
Ω
f = 2MHz, CL = 20pF
XOSC.GAIN = 0
-
-
416
f = 4MHz, CL = 20pF
XOSC.GAIN = 1
-
-
243
f = 8 MHz, CL = 20pF
XOSC.GAIN = 2
-
-
138
f = 16 MHz, CL = 20pF
XOSC.GAIN = 3
-
-
66
f = 32MHz, CL = 18pF
XOSC.GAIN = 4
-
-
56
-
5.9
-
Parasitic capacitor load
© 2017 Microchip Technology Inc.
Datasheet Complete
pF
40001882A-page 817
32-bit ARM-Based Microcontrollers
Symbol Parameter
CXOUT
Conditions
Min. Typ. Max.
Units
-
3.2
-
pF
f = 2MHz, CL = 20pF, AGC off
27
65
85
μA
f = 2MHz, CL = 20pF, AGC on
14
52
73
f = 4MHz, CL = 20pF, AGC off
61
117
150
f = 4MHz, CL = 20pF, AGC on
23
74
100
f = 8MHz, CL = 20pF, AGC off
131
226
296
f = 8MHz, CL = 20pF, AGC on
56
128
172
f = 16MHz, CL = 20pF, AGC off 305
502
687
f = 16MHz, CL = 20pF, AGC on 116
307
552
Parasitic capacitor load
Current Consumption
f = 32MHz, CL = 18pF, AGC off 1031 1622 2200
tSTARTUP Start-up time
f = 32MHz, CL = 18pF, AGC on 278
615
1200
f = 2MHz, CL = 20pF,
XOSC.GAIN = 0, ESR = 600Ω
14K
48K
f = 4MHz, CL = 20pF,
XOSC.GAIN = 1, ESR = 100Ω
6800 19.5K
f = 8 MHz, CL = 20pF,
XOSC.GAIN = 2, ESR = 35Ω
-
5550 13K
f = 16 MHz, CL = 20pF,
XOSC.GAIN = 3, ESR = 25Ω
-
6750 14.5K
f = 32MHz, CL = 18pF,
XOSC.GAIN = 4, ESR = 40Ω
-
5.3K 9.6K
cycles
Figure 37-6. Oscillator Connection
Xin
C LEXT
Crystal
LM
C SHUNT
RM
C STRAY
CM
C LEXT
© 2017 Microchip Technology Inc.
Datasheet Complete
Xout
40001882A-page 818
32-bit ARM-Based Microcontrollers
37.12.2 External 32 kHz Crystal Oscillator (XOSC32K) Characteristics
37.12.2.1 Digital Clock Characteristics
The following table describes the characteristics for the oscillator when a digital clock is applied on XIN32
pin.
Table 37-47. Digital Clock Characteristics
Symbol
Parameter
fCPXIN32
Conditions
Min.
Typ.
Max.
Units
XIN32 clock frequency
-
32.768
-
kHz
XIN32 clock duty cycle
-
50
-
%
Crystal Oscillator Characteristics
Figure 37-6 and the equation in also applies to the 32 kHz oscillator connection. The user must choose a
crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact
value of CL can be found in the crystal datasheet.
Table 37-48. 32kHz Crystal Oscillator Characteristics (Device Variant A)
Symbol Parameter
fOUT
Conditions
Crystal oscillator frequency
tSTARTUP Startup time
ESRXTAL = 39.9 kΩ, CL
= 12.5 pF
Min. Typ.
Max. Units
-
32768 -
Hz
-
28K
30K
cycles
CL
Crystal load capacitance
-
-
12.5 pF
CSHUNT
Crystal shunt capacitance
-
0.1
-
CXIN32
Parasitic capacitor load
-
3.1
-
CXOUT32 Parasitic capacitor load
-
3.3
-
IXOSC32K Current consumption
-
1.22
2.19 µA
-
-
141
ESR
Crystal equivalent series resistance
f=32.768kHz
, Safety Factor = 3
CL=12.5pF
kΩ
Table 37-49. 32kHz Crystal Oscillator Characteristics (Device Variant B and C)
Symbol Parameter
fOUT
Conditions
Crystal oscillator frequency
tSTARTUP Startup time
ESRXTAL = 39.9 kΩ, CL
= 12.5 pF
Min. Typ.
Max. Units
-
32768 -
Hz
-
28K
30K
cycles
CL
Crystal load capacitance
-
-
12.5 pF
CSHUNT
Crystal shunt capacitance
-
0.1
-
CXIN32
Parasitic capacitor load
-
3.2
-
CXOUT32 Parasitic capacitor load
-
3.7
-
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 819
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
IXOSC32K Current consumption
ESR
Crystal equivalent series resistance
f=32.768kHz
, Safety Factor = 3
CL=12.5pF
Min. Typ.
Max. Units
-
1.22
2.19 µA
-
-
100
kΩ
37.12.3 Digital Frequency Locked Loop (DFLL48M) Characteristics
Table 37-50. DFLL48M Characteristics - Open Loop Mode(1)
Symbol Parameter
Conditions
Min. Typ. Max. Units
fOUT
Output frequency
DFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
47
48
IDFLL
Power consumption
on VDDIN
IDFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
-
403 453
μA
DFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
7
8
μs
tSTARTUP Start-up time
49
9
MHz
fOUT within 90 % of final value
Note: 1. DFLL48M in Open loop after calibration at room temperature.
Table 37-51. DFLL48M Characteristics - Closed Loop Mode(1) (Device Variant A)
Symbol Parameter
Conditions
Min.
fOUT
Average Output
frequency
fREF = XTAL, 32 .768kHz, 100ppm
DFLLMUL = 1464
47.963 47.972 47.981 MHz
fREF
Reference
frequency
Jitter
Cycle to Cycle
jitter
© 2017 Microchip Technology Inc.
fREF = XTAL, 32 .768kHz, 100ppm
DFLLMUL = 1464
Datasheet Complete
Typ.
Max.
Units
0.732
32.768 33
kHz
-
-
ns
0.42
40001882A-page 820
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
IDFLL
Power
consumption on
VDDIN
fREF = XTAL, 32 .768kHz, 100ppm
DFLLMUL = 1464
-
425
482
μA
tLOCK
Lock time
fREF = XTAL, 32 .768kHz, 100ppm
DFLLMUL = 1464
DFLLVAL.COARSE = DFLL48M
COARSE CAL
100
200
500
μs
DFLLVAL.FINE = 512
DFLLCTRL.BPLCKC = 1
DFLLCTRL.QLDIS = 0
DFLLCTRL.CCDIS = 1
DFLLMUL.FSTEP = 10
Table 37-52. DFLL48M Characteristics - Closed Loop Mode(1) (Device Variant B and C)
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
fOUT
Average Output
frequency
fREF = 32 .768kHz
47.963 47.972 47.981 MHz
fREF
Reference
frequency
Jitter
Cycle to Cycle jitter
IDFLL
tLOCK
0.732
32.768 33
kHz
fREF = 32 .768kHz
-
-
0.42
ns
Power consumption
on VDDIN
fREF =32 .768kHz
-
403
453
μA
Lock time
fREF = 32 .768kHz
DFLLVAL.COARSE = DFLL48M
COARSE CAL
-
200
500
μs
DFLLVAL.FINE = 512
DFLLCTRL.BPLCKC = 1
DFLLCTRL.QLDIS = 0
DFLLCTRL.CCDIS = 1
DFLLMUL.FSTEP = 10
1.
To insure that the device stays within the maximum allowed clock frequency, any reference clock
for DFLL in close loop must be within a 2% error accuracy.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 821
32-bit ARM-Based Microcontrollers
37.12.4 32.768kHz Internal oscillator (OSC32K) Characteristics
Table 37-53. 32kHz RC Oscillator Characteristics
Symbol Parameter
Conditions
Min.
fOUT
Calibrated against a 32.768kHz
reference at 25°C, over [-40, +85]C,
over [1.62, 3.63]V
28.508 32.768 34.734 kHz
Calibrated against a 32.768kHz
reference at 25°C, at VDD=3.3V
32.276 32.768 33.260
Calibrated against a 32.768kHz
reference at 25°C, over [1.62, 3.63]V
31.457 32.768 34.079
IOSC32K
Output frequency
Current consumption
Typ.
Max.
Units
-
0.67
1.31
μA
tSTARTUP Start-up time
-
1
2
cycle
Duty
-
50
-
%
Typ.
Max.
Units
Duty Cycle
37.12.5 Ultra Low Power Internal 32kHz RC Oscillator (OSCULP32K) Characteristics
Table 37-54. Ultra Low Power Internal 32kHz RC Oscillator Characteristics
Symbol
Parameter
Conditions
Min.
fOUT
Output frequency Calibrated against a 32.768kHz
25.559 32.768 38.011 kHz
reference at 25°C, over [-40, +85]C,
over [1.62, 3.63]V
Calibrated against a 32.768kHz
reference at 25°C, at VDD=3.3V
31.293 32.768 34.570
Calibrated against a 32.768kHz
reference at 25°C, over [1.62,
3.63]V
31.293 32.768 34.570
iOSCULP32K(1)(2)
-
-
125
nA
tSTARTUP
Start-up time
-
10
-
cycles
Duty
Duty Cycle
-
50
-
%
Notes: 1. These values are based on simulation. These values are not covered by test limits in production
or characterization.
2. This oscillator is always on.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
37.12.6 8MHz RC Oscillator (OSC8M) Characteristics
Table 37-55. Internal 8MHz RC Oscillator Characteristics
Symbol
Parameter
Conditions
fOUT
Output frequency
Calibrated against a 8MHz reference at 7.8
25°C, over [-40, +85]C, over [1.62,
3.63]V
TempCo
Min. Typ. Max. Units
8
8.16 MHz
Calibrated against a 8MHz reference at 7.94 8
25°C, at VDD=3.3V
8.06
Calibrated against a 8MHz reference at 7.92 8
25°C, over [1.62, 3.63]V
8.08
Frequency vs.
Temperature drift
SupplyCo Frequency vs. Supply
drift
-1.2
1
%
-2
2
%
IOSC8M
Current consumption
IDLE2 on OSC32K versus IDLE2 on
calibrated OSC8M enabled at 8MHz
(FRANGE=1, PRESC=0)
64
μA
tSTARTUP
Startup time
-
2.1
3
μs
Duty
Duty cycle
-
50
-
%
37.12.7 Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics
Table 37-56. FDPLL96M Characteristics(1) (Device Variant A)
Symbol
Parameter
fIN
Input frequency
32
-
2000 KHz
fOUT
Output frequency
48
-
96
MHz
IFDPLL96M
Current consumption
fIN= 32 kHz, fOUT= 48 MHz
-
500
700
μA
fIN= 32 kHz, fOUT= 96 MHz
-
900
1200
fIN= 32 kHz, fOUT= 48 MHz
-
1.5
2.0
fIN= 32 kHz, fOUT= 96 MHz
-
3.0
10.0
fIN= 2 MHz, fOUT= 48 MHz
-
1.3
2.0
fIN= 2 MHz, fOUT= 96 MHz
-
3.0
7.0
After start-up, time to get lock signal.
fIN= 32 kHz, fOUT= 96 MHz
-
1.3
2
ms
fIN= 2 MHz, fOUT= 96 MHz
-
25
50
μs
40
50
60
%
Jp
tLOCK
Duty
Period jitter
Lock Time
Conditions
Duty cycle
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Min. Typ. Max. Units
%
40001882A-page 823
32-bit ARM-Based Microcontrollers
Table 37-57. FDPLL96M Characteristics(1) (Device Variant B / Die Revision E)
Symbol
Parameter
fIN
Input frequency
32
-
2000 KHz
fOUT
Output frequency
48
-
96
MHz
IFDPLL96M
Current consumption
fIN= 32 kHz, fOUT= 48 MHz
-
500
700
μA
fIN= 32 kHz, fOUT= 96 MHz
-
900
1200
fIN= 32 kHz, fOUT= 48 MHz
-
1.5
2.1
fIN= 32 kHz, fOUT= 96 MHz
-
4.0
10.0
fIN= 2 MHz, fOUT= 48 MHz
-
1.6
2.2
fIN= 2 MHz, fOUT= 96 MHz
-
4.6
10.2
After start-up, time to get lock signal.
fIN= 32 kHz, fOUT= 96 MHz
-
1.2
2
ms
fIN= 2 MHz, fOUT= 96 MHz
-
25
50
μs
40
50
60
%
Jp
tLOCK
Duty
Period jitter
Lock Time
Conditions
Duty cycle
Min. Typ. Max. Units
%
Table 37-58. FDPLL96M Characteristics(1) (Device Variant B and C / Die Revision F)
Symbol
Parameter
fIN
Input frequency
32
-
2000 KHz
fOUT
Output frequency
48
-
96
MHz
IFDPLL96M
Current consumption
fIN= 32 kHz, fOUT= 48 MHz
-
500
-
μA
fIN= 32 kHz, fOUT= 96 MHz
-
900
-
fIN= 32 kHz, fOUT= 48 MHz
-
2.2
3.0
fIN= 32 kHz, fOUT= 96 MHz
-
3.7
9.0
fIN= 2 MHz, fOUT= 48 MHz
-
2.2
3.0
fIN= 2 MHz, fOUT= 96 MHz
-
4.4
9.7
After start-up, time to get lock signal.
fIN= 32 kHz, fOUT= 96 MHz
-
1.0
2
ms
fIN= 2 MHz, fOUT= 96 MHz
-
22
50
μs
40
50
60
%
Jp
tLOCK
Duty
Period jitter
Lock Time
Conditions
Duty cycle
Min. Typ. Max. Units
%
Note:
1. All values have been characterized with FILTSEL[1/0] as default value.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
37.13
PTC Typical Characteristics
37.13.1 Device Variant A
Figure 37-7. Power Consumption [μA]
1 sensor, noise countermeasures disabled, f=48MHz, Vcc=3.3V
140
120
100
80
Scan rate 10ms
60
Scan rate 50ms
40
Scan rate 100ms
Scan rate 200ms
20
0
1
2
4
8
16
32
64
Sample averaging
Figure 37-8. Power Consumption [μA]
1 sensor, noise countermeasures Enabled, f=48MHz, Vcc=3.3V
200
180
160
140
120
Scan rate 10ms
100
80
Scan rate 50ms
60
Scan rate 100ms
40
Scan rate 200ms
20
0
1
2
4
8
16
32
64
Sample averaging
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32-bit ARM-Based Microcontrollers
Figure 37-9. Power Consumption [μA]
10 sensors, noise countermeasures disabled, f=48MHz, Vcc=3.3V
1200
1000
800
Scan rate 10ms
600
Scan rate 50ms
Scan rate 100ms
400
Scan rate 200ms
200
Linear (Scan rate 50ms)
0
1
2
4
8
16
32
64
Sample averaging
Figure 37-10. Power Consumption [μA]
10 sensors, noise countermeasures Enabled, f=48MHz, Vcc=3.3V
900
800
700
600
500
Scan rate 10ms
400
Scan rate 50ms
300
Scan rate 100ms
200
Scan rate 200ms
100
0
1
2
4
8
16
32
64
Sample averaging
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Figure 37-11. Power Consumption [μA]
100 sensors, noise countermeasures disabled, f=48MHz, Vcc=3.3V
5000
4500
4000
3500
3000
Scan rate 10ms
2500
2000
Scan rate 50ms
1500
Scan rate 100ms
1000
Scan rate 200ms
500
0
1
2
4
8
16
32
64
Sample averaging
Figure 37-12. Power Consumption [μA]
100 sensors, noise countermeasures Enabled, f=48MHz, Vcc=3.3V
1800
1600
1400
1200
1000
Scan rate 10ms
800
Scan rate 50ms
600
Scan rate 100ms
400
Scan rate 200ms
200
0
1
2
4
8
16
32
64
Sample averaging
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40001882A-page 827
32-bit ARM-Based Microcontrollers
Figure 37-13. CPU Utilization
80 %
70 %
60 %
50 %
Channel count 1
40 %
Channel count 10
30 %
Channel count 100
20 %
10 %
0%
10
50
100
200
37.13.2 Device Variant B and C
VCC = 3.3C and fCPU = 48MHz for the following PTC measurements.
/ PTC_GCLK
= 4MHz / FREQ_MODE_NONE
Figure 37-14. 1 Sensor / PTC_GCLK1Key
= 4MHz
/ FREQ_MODE_NONE
1
2
4
8
16
32
64
Sample Averaging
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32-bit ARM-Based Microcontrollers
/ PTC_GCLK = 2MHz / FREQ_MODE_HOP
Figure 37-15. 1 Sensor / PTC_GCLK1Key
= 2MHz
/ FREQ_MODE_HOP
1
2
4
8
16
32
64
Sample Averaging
10Keys
/ PTC_GCLK
= 4MHz / FREQ_MODE_NONE
Figure 37-16. 10 Sensor / PTC_GCLK
= 4MHz
/ FREQ_MODE_NONE
1
2
4
8
16
32
64
Sample Averaging
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32-bit ARM-Based Microcontrollers
10Keys
/ PTC_GCLK
= 2MHz / FREQ_MODE_HOP
Figure 37-17. 10 Sensor / PTC_GCLK
= 2MHz
/ FREQ_MODE_HOP
1
2
4
8
16
32
64
Sample Averaging
100 Keys
/ PTC_GCLK
= 4MHz / FREQ_MODE_NONE
Figure 37-18. 100 Sensor / PTC_GCLK
= 4MHz
/ FREQ_MODE_NONE
1
2
4
8
16
32
64
Sample Averaging
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32-bit ARM-Based Microcontrollers
Figure 37-19. 100 Sensor / PTC_GCLK
= 2MHz
/ FREQ_MODE_HOP
100 Keys
/ PTC_GCLK
= 2MHz / FREQ_MODE_HOP
1
2
4
8
16
32
64
Sample Averaging
37.14
USB Characteristics
The USB on-chip buffers comply with the Universal Serial Bus (USB) v2.0 standard. All AC parameters
related to these buffers can be found within the USB 2.0 electrical specifications.
The USB interface is USB-IF certified:
- TID 40001583 - Peripheral Silicon > Low/Full Speed > Silicon Building Blocks
- TID 120000272 - Embedded Hosts > Full Speed
Electrical configuration required to be USB compliance:
- The CPU frequency must be higher 8MHz when USB is active (No constraint for USB suspend mode)
- The operating voltages must be 3.3V (Min. 3.0V, Max. 3.6V).
- The GCLK_USB frequency accuracy source must be less than:
- In USB device mode, 48MHz +/-0.25%
- In USB host mode, 48MHz +/-0.05%
Table 37-59. GCLK_USB Clock Setup Recommendations
Clock setup
DFLL48M
FDPLL96M
USB Device
USB Host
Open loop
No
No
Closed loop, any internal OSC source
No
No
Closed loop, any external XOSC source
Yes
No
Closed loop, USB SOF source (USB recovery mode)(1)
Yes(2)
N/A
Any internal OSC source (32K, 8M, ... )
No
No
Any external XOSC source (< 1MHz)
Yes
No
Any external XOSC source (> 1MHz)
Yes(3)
Yes
© 2017 Microchip Technology Inc.
Datasheet Complete
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32-bit ARM-Based Microcontrollers
Notes: 1. When using DFLL48M in USB recovery mode, the Fine Step value must be Ah to guarantee a
USB clock at +/-0.25% before 11ms after a resume.
2. Very high signal quality and crystal less. It is the best setup for USB Device mode.
3. FDPLL lock time is short when the clock frequency source is high (> 1MHz). Thus, FDPLL and external
OSC can be stopped during USB suspend mode to reduce consumption and guarantee a USB wake-up
time (See TDRSMDN in USB specification).
37.15
Timing Characteristics
37.15.1 External Reset
Table 37-60. External Reset Characteristics
Symbol
Parameter
Condition
tEXT
Minimum reset pulse width
Min.
Typ.
Max.
Units
10
-
-
ns
37.15.2 SERCOM in SPI Mode Timing
Figure 37-20. SPI Timing Requirements in Master Mode
SS
tSCKR
tMOS
tSCKF
SCK
(CPOL = 0)
tSCKW
SCK
(CPOL = 1)
tSCKW
tMIS
MISO
(Data Input)
tMIH
tSCK
MSB
LSB
tMOH
tMOH
MOSI
(Data Output)
MSB
LSB
Figure 37-21. SPI Timing Requirements in Slave Mode
SS
tSSS
tSCKR
tSCKF
tSSH
SCK
(CPOL = 0)
tSSCKW
SCK
(CPOL = 1)
tSSCKW
tSIS
MOSI
(Data Input)
tSIH
MSB
tSOSSS
MISO
(Data Output)
© 2017 Microchip Technology Inc.
tSSCK
LSB
tSOS
tSOSSH
MSB
LSB
Datasheet Complete
40001882A-page 832
32-bit ARM-Based Microcontrollers
Table 37-61. SPI Timing Characteristics and Requirements(1)
Symbo Parameter
l
Conditions
tSCK
SCK period
Master
tSCKW
SCK high/low width
Master
-
0.5*tSCK
-
tSCKR
SCK rise time(2)
Master
-
-
-
tSCKF
SCK fall time(2)
Master
-
-
-
tMIS
MISO setup to SCK
Master
-
21
-
tMIH
MISO hold after SCK Master
-
13
-
tMOS
MOSI setup SCK
Master
-
tSCK/2 - 3
-
tMOH
MOSI hold after SCK Master
-
3
-
tSSCK
Slave SCK Period
Slave
1*tCLK_APB -
-
tSSCKW
SCK high/low width
Slave
0.5*tSSCK
-
-
tSSCKR
SCK rise time(2)
Slave
-
-
-
tSSCKF
SCK fall time(2)
Slave
-
-
-
tSIS
MOSI setup to SCK
Slave
tSSCK/2 - 9 -
-
tSIH
MOSI hold after SCK Slave
tSSCK/2 - 3 -
-
tSSS
SS setup to SCK
PRELOADEN
=1
2*tCLK_APB + tSOS
-
PRELOADEN
=0
tSOS+7
-
-
Slave
Min.
Typ.
Max.
84
Units
ns
tSSH
SS hold after SCK
Slave
tSIH - 4
-
-
tSOS
MISO setup SCK
Slave
-
tSSCK/2 18
-
tSOH
MISO hold after SCK Slave
-
18
-
tSOSS
MISO setup after SS
low
Slave
-
18
-
tSOSH
MISO hold after SS
high
Slave
-
10
-
Notes: 1. These values are based on simulation. These values are not covered by test limits in
production.
2. See I/O Pin Characteristics
37.15.3 SERCOM in I2C Mode Timing
This section describes the requirements for devices connected to the I2C Interface Bus.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Figure 37-22. I2C Interface Bus Timing
tOF
tHIGH
tLOW
tR
tLOW
SCL
tS U;S TA
tHD;S TA
tHD;DAT
tS U;DAT
SDA
tS U;S TO
tBUF
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32-bit ARM-Based Microcontrollers
Table 37-62. I2C Interface Timing (Device Variant A)
Symbol Parameter
tR
tOF
Rise time for both SDA
and SCL
Output fall time from
VIHmin to VILmax
Conditions
Min.
Typ. Max. Units
Standard /
Fast Mode
ICb(2) = 400pF
-
215 300
Fast
Mode +
ICb(2) = 550pF
60
100
High Speed
Mode
ICb(2) = 100pF
20
40
Standard /
Fast Mode
10pF < Cb(2) < 400pF
20.0 50.0
Fast
Mode +
10pF < Cb(2) < 550pF
15.0 50.0
High Speed
Mode
10pF < Cb(2) < 100pF
10.0 40.0
tHD;STA
Hold time (repeated)
START condition
fSCL > 100kHz, Master tLOW-9 -
-
tLOW
Low period of SCL Clock
fSCL > 100kHz
113
-
-
tBUF
Bus free time between a
STOP and a START
condition
fSCL > 100kHz
tLOW
-
-
tSU;STA
Setup time for a repeated
START condition
fSCL > 100kHz, Master tLOW+7 -
-
tHD;DAT
Data hold time
fSCL > 100kHz, Master 9
-
12
tSU;DAT
Data setup time
fSCL > 100kHz, Master 104
-
-
tSU;STO
Setup time for STOP
condition
fSCL > 100kHz, Master tLOW+9 -
-
tSU;DAT;rx Data setup time (receive
mode)
fSCL > 100kHz, Slave
51
-
56
tHD;DAT;tx Data hold time (send
mode)
fSCL > 100kHz, Slave
71
90
138
© 2017 Microchip Technology Inc.
Datasheet Complete
ns
40001882A-page 835
32-bit ARM-Based Microcontrollers
Table 37-63. I2C Interface Timing (Device Variant B and C)
Symbol Parameter
tR
tOF
Rise time for both SDA
and SCL
Output fall time from
VIHmin to VILmax
Conditions
Min.
Typ. Max. Units
Standard /
Fast Mode
Cb(2) = 400pF
-
230 350
Fast
Mode +
Cb(2) = 550pF
60
100
High Speed
Mode
Cb(2) = 100pF
30
60
Standard /
Fast Mode
10pF < Cb(2) < 400pF
25
50
Fast
Mode +
10pF < Cb(2) < 550pF
20
30
High Speed
Mode
10pF < Cb(2) < 100pF
10
20
tHD;STA
Hold time (repeated)
START condition
fSCL > 100kHz, Master tLOW-9 -
-
tLOW
Low period of SCL Clock
fSCL > 100kHz
113
-
-
tBUF
Bus free time between a
STOP and a START
condition
fSCL > 100kHz
tLOW
-
-
tSU;STA
Setup time for a repeated
START condition
fSCL > 100kHz, Master tLOW+7 -
-
tHD;DAT
Data hold time
fSCL > 100kHz, Master 9
-
12
tSU;DAT
Data setup time
fSCL > 100kHz, Master 104
-
-
tSU;STO
Setup time for STOP
condition
fSCL > 100kHz, Master tLOW+9 -
-
tSU;DAT;rx Data setup time (receive
mode)
fSCL > 100kHz, Slave
51
-
56
tHD;DAT;tx Data hold time (send
mode)
fSCL > 100kHz, Slave
71
90
138
ns
1. These values are based on simulation. These values are not covered by test limits in production.
2. Cb = Capacitive load on each bus line. Otherwise noted, value of Cb set to 20pF.
© 2017 Microchip Technology Inc.
Datasheet Complete
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32-bit ARM-Based Microcontrollers
37.15.4 SWD Timing
Figure 37-23. SWD Interface Signals
Read Cycle
From debugger to
SWDIO pin
Stop
Park
Tri State
Thigh
Tos
Data
Data
Parity
Start
Tlow
From debugger to
SWDCLK pin
SWDIO pin to
debugger
Tri State
Acknowledge
Tri State
Write Cycle
From debugger to
SWDIO pin
Stop
Park
Tri State
Tis
Start
Tih
From debugger to
SWDCLK pin
SWDIO pin to
debugger
Tri State
Acknowledge
Data
Data
Parity
Tri State
Table 37-64. SWD Timings(1)
Symbol Parameter
Conditions
Min. Max.
Units
Thigh
SWDCLK High period
10
500000 ns
Tlow
SWDCLK Low period
VVDDIO from 3.0 V to 3.6 V, maximum
external capacitor = 40 pF
10
500000
Tos
SWDIO output skew to
falling edge SWDCLK
-5
5
Tis
Input Setup time required
between SWDIO
4
-
Tih
Input Hold time required
between SWDIO and
rising edge SWDCLK
1
-
Note: 1. These values are based on simulation. These values are not covered by test limits in production
or characterization.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
37.15.5 I2S Timing
Figure 37-24. I2S Timing Master Mode
Master mode: SCK, FS and MCK are output
MCK output
tM_SCKOR
SCK output
FS output
tM_SCKOF
tM_FSOH
tM_SDIS
tM_SCKO
tM_SDOH
tM_SDIH
tM_FSOV
tM_SDOV
SD output
LSB right ch.
MSB left ch.
SD input
Figure 37-25. I2S Timing Slave Mode
Slave mode: SCK and FS are input
tS_FSIH
SCK input
tS_SCKI
tS_FSIS
FS input
tS_SDIS
tS_SDOH
tS_SDIH
tS_SDOV
SD output
LSB rignt ch.
MSB left ch.
SD input
Figure 37-26. I2S Timing PDM2 Mode
PDM2 mode
tPDM2RS tPDM2RH
tPDM2LS
tPDM2LH
SCK input
SD input
Left
Right
Left
Right
Left
Right
Table 37-65. I2S Timing Characteristics and Requirements (Device Variant A)
Name
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max Min. Typ. Max.
tM_MCKOR
I2S MCK rise time(3) Master mode /
Capacitive load CL = 15
pF
9.2
4.7
ns
tM_MCKOF
I2S MCK fall time(3)
11.5
5.3
ns
dM_MCKO
I2S MCK duty cycle Master mode
50
%
© 2017 Microchip Technology Inc.
Master mode /
Capacitive load CL = 15
pF
45.4
Datasheet Complete
50
45.4
40001882A-page 838
32-bit ARM-Based Microcontrollers
Name
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max Min. Typ. Max.
dM_MCKI
I2S MCK duty cycle Master mode, pin is
input (1b)
tM_SCKOR
I2S SCK rise time(3) Master mode /
Capacitive load CL = 15
pF
tM_SCKOF
I2S SCK fall time(3)
Master mode /
Capacitive load CL = 15
pF
dM_SCKO
I2S SCK duty cycle
Master mode
fM_SCKO,1/
tM_SCKO
I2S SCK frequency
Master mode,Supposing
external device
response delay is 30ns
fS_SCKI,1/
tS_SCKI
I2S SCK frequency
Slave mode,Supposing
external device
response delay is 30ns
dS_SCKO
I2S SCK duty cycle
Slave mode
tM_FSOV
FS valid time
Master mode
tM_FSOH
FS hold time
Master mode
-0.9
-0.9
ns
tS_FSIS
FS setup time
Slave mode
2.3
1.5
ns
tS_FSIH
FS hold time
Slave mode
0
0
ns
tM_SDIS
Data input setup
time
Master mode
34.7
24.5
ns
tM_SDIH
Data input hold time Master mode
-8.2
-8.2
ns
tS_SDIS
Data input setup
time
Slave mode
4.6
3.9
ns
tS_SDIH
Data input hold time Slave mode
1.2
1.2
ns
tM_SDOV
Data output valid
time
Master transmitter
tM_SDOH
Data output hold
time
Master transmitter
tS_SDOV
Data output valid
time
Slave transmitter
tS_SDOH
Data output hold
time
Slave transmitter
tPDM2LS
Data input setup
time
Master mode PDM2 Left 34.7
tPDM2LH
Data input hold time Master mode PDM2 Left
© 2017 Microchip Technology Inc.
50
45.6
50
9
4.6
ns
9.7
4.5
ns
50
%
8
9.5
MHz
14.4
14.8
MHz
50
45.6
50
50
4.1
-0.5
4.8
-0.5
36.2
-8.2
Datasheet Complete
%
4
5.6
36
%
ns
ns
ns
25.9
ns
25.7
ns
24.5
ns
-8.2
ns
40001882A-page 839
32-bit ARM-Based Microcontrollers
Name
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max Min. Typ. Max.
tPDM2RS
Data input setup
time
Master mode PDM2
Right
30.5
20.9
ns
tPDM2RH
Data input hold time Master mode PDM2
Right
-6.7
-6.7
ns
Table 37-66. 2S Timing Characteristics and Requirements (Device Variant B and C)
Name
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max. Min. Typ. Max.
tM_MCKOR
I2S MCK rise time(3)
Master mode /
Capacitive load CL =
15 pF
9.2
4.7
ns
tM_MCKOF
I2S MCK fall time(3)
Master mode /
Capacitive load CL =
15 pF
11.6
5.4
ns
dM_MCKO
I2S MCK duty cycle
Master mode
50
%
dM_MCKI
I2S MCK duty cycle
Master mode, pin is
input (1b)
tM_SCKOR
I2S SCK rise time(3)
Master mode /
Capacitive load CL =
15 pF
9
4.6
ns
tM_SCKOF
I2S SCK fall time(3)
Master mode /
Capacitive load CL =
15 pF
9.7
4.6
ns
dM_SCKO
I2S SCK duty cycle
Master mode
50
%
fM_SCKO, 1/
tM_SCKO
I2S SCK frequency
Master mode,
Supposing external
device response
delay is 30ns
7.8
9.2
MHz
fS_SCKI, 1/
tS_SCKI
I2S SCK frequency
Slave mode,
Supposing external
device response
delay is 30ns
12.8
13
MHz
dS_SCKO
I2S SCK duty cycle
Slave mode
tM_FSOV
FS valid time
Master mode
tM_FSOH
FS hold time
Master mode
-0.1
-0.1
ns
tS_FSIS
FS setup time
Slave mode
6
5.3
ns
tS_FSIH
FS hold time
Slave mode
0
0
ns
tM_SDIS
Data input setup time Master mode
36
25.9
ns
© 2017 Microchip Technology Inc.
47.1
50
47.3
50
47
50
50
47.2
50
50
2.4
Datasheet Complete
%
%
1.9
ns
40001882A-page 840
32-bit ARM-Based Microcontrollers
Name
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max. Min. Typ. Max.
tM_SDIH
Data input hold time
tS_SDIS
-8.2
-8.2
ns
Data input setup time Slave mode
9.1
8.3
ns
tS_SDIH
Data input hold time
3.8
3.7
ns
tM_SDOV
Data output valid time Master transmitter
tM_SDOH
Data output hold time Master transmitter
tS_SDOV
Data output valid time Slave transmitter
tS_SDOH
Data output hold time Slave transmitter
29.1
18.9
ns
tPDM2LS
Data input setup time Master mode PDM2
Left
35.5
25.3
ns
tPDM2LH
Data input hold time
Master mode PDM2
Left
-8.2
-8.2
ns
tPDM2RS
Data input setup time Master mode PDM2
Right
30.6
21.1
ns
tPDM2RH
Data input hold time
-7
-7
ns
1.
2.
3.
Master mode
Slave mode
Master mode PDM2
Right
2.5
-0.1
1.9
-0.1
ns
ns
29.8
19.7
ns
All timing characteristics given for 15pF capacitive load.
These values are based on simulations and not covered by test limits in production.
See I/O Pin Characteristics
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 841
32-bit ARM-Based Microcontrollers
38.
Packaging Information
38.1
Thermal Considerations
Related Links
Junction Temperature
38.1.1
Thermal Resistance Data
The following Table summarizes the thermal resistance data depending on the package.
Table 38-1. Thermal Resistance Data
38.1.2
Package Type
θJA
θJC
32-pin TQFP
64.7°C/W
23.1°C/W
48-pin TQFP
63.6°C/W
12.2°C/W
64-pin TQFP
60.9°C/W
12.2°C/W
32-pin QFN
40.9°C/W
15.2°C/W
48-pin QFN
32.0°C/W
10.9°C/W
64-pin QFN
32.5°C/W
10.7°C/W
35-ball WLCSP
41.8°C/W
2.26°C/W
Junction Temperature
The average chip-junction temperature, TJ, in °C can be obtained from the following:
1.
2.
TJ = TA + (PD x θJA)
TJ = TA + (PD x (θHEATSINK + θJC))
where:
•
•
•
•
•
θJA = Package thermal resistance, Junction-to-ambient (°C/W), see Thermal Resistance Data
θJC = Package thermal resistance, Junction-to-case thermal resistance (°C/W), see Thermal
Resistance Data
θHEATSINK = Thermal resistance (°C/W) specification of the external cooling device
PD = Device power consumption (W)
TA = Ambient temperature (°C)
From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling
device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be
used to compute the resulting average chip-junction temperature TJ in °C.
Related Links
Thermal Considerations
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32-bit ARM-Based Microcontrollers
38.2
Package Drawings
38.2.1
64 pin TQFP
Table 38-2. Device and Package Maximum Weight
300
mg
Table 38-3. Package Characteristics
Moisture Sensitivity Level
MSL3
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32-bit ARM-Based Microcontrollers
Table 38-4. Package Reference
38.2.2
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
64 pin QFN
Note: The exposed die attach pad is not connected electrically inside the device.
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32-bit ARM-Based Microcontrollers
Table 38-5. Device and Package Maximum Weight
200
mg
Table 38-6. Package Charateristics
Moisture Sensitivity Level
MSL3
Table 38-7. Package Reference
38.2.3
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
64-ball UFBGA
Table 38-8. Device and Package Maximum Weight
27.4
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mg
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32-bit ARM-Based Microcontrollers
Table 38-9. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 38-10. Package Reference
38.2.4
JEDEC Drawing Reference
MO-220
JESD97 Classification
E8
48 pin TQFP
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32-bit ARM-Based Microcontrollers
Table 38-11. Device and Package Maximum Weight
140
mg
Table 38-12. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 38-13. Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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32-bit ARM-Based Microcontrollers
38.2.5
48 pin QFN
Note: The exposed die attach pad is not connected electrically inside the device.
Table 38-14. Device and Package Maximum Weight
140
mg
Table 38-15. Package Characteristics
Moisture Sensitivity Level
MSL3
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32-bit ARM-Based Microcontrollers
Table 38-16. Package Reference
38.2.6
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
45-ball WLCSP
Table 38-17. Device and Package Maximum Weight
7.3
mg
Table 38-18. Package Characteristics
Moisture Sensitivity Level
MSL1
Table 38-19. Package Reference
JEDEC Drawing Reference
MO-220
JESD97 Classification
E1
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
38.2.7
32 pin TQFP
Table 38-20. Device and Package Maximum Weight
100
mg
Table 38-21. Package Charateristics
Moisture Sensitivity Level
MSL3
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32-bit ARM-Based Microcontrollers
Table 38-22. Package Reference
38.2.8
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
32 pin QFN
Note: The exposed die attach pad is connected inside the device to GND and GNDANA.
Table 38-23. Device and Package Maximum Weight
90
© 2017 Microchip Technology Inc.
mg
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32-bit ARM-Based Microcontrollers
Table 38-24. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 38-25. Package Reference
38.2.9
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
35 ball WLCSP (Device Variant B)
Table 38-26. Device and Package Maximum Weight
6.2
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mg
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32-bit ARM-Based Microcontrollers
Table 38-27. Package Characteristics
Moisture Sensitivity Level
MSL1
Table 38-28. Package Reference
JEDEC Drawing Reference
MO-220
JESD97 Classification
E1
38.2.10 35 ball WLCSP (Device Variant C)
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32-bit ARM-Based Microcontrollers
Table 38-29. Device and Package Maximum Weight
6.22
mg
Table 38-30. Package Characteristics
Moisture Sensitivity Level
MSL1
Table 38-31. Package Reference
38.3
JEDEC Drawing Reference
N/A
JESD97 Classification
e1
Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Table 38-32.
Profile Feature
Green Package
Average Ramp-up Rate (217°C to peak)
3°C/s max.
Preheat Temperature 175°C ±25°C
150-200°C
Time Maintained Above 217°C
60-150s
Time within 5°C of Actual Peak Temperature
30s
Peak Temperature Range
260°C
Ramp-down Rate
6°C/s max.
Time 25°C to Peak Temperature
8 minutes max.
A maximum of three reflow passes is allowed per component.
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32-bit ARM-Based Microcontrollers
39.
Schematic Checklist
39.1
Introduction
This chapter describes a common checklist which should be used when starting and reviewing the
schematics for a SAM D21 design. This chapter illustrates a recommended power supply connection,
how to connect external analog references, programmer, debugger, oscillator and crystal.
39.1.1
Operation in Noisy Environment
If the device is operating in an environment with much electromagnetic noise it must be protected from
this noise to ensure reliable operation. In addition to following best practice EMC design guidelines, the
recommendations listed in the schematic checklist sections must be followed. In particular placing
decoupling capacitors very close to the power pins, a RC-filter on the RESET pin, and a pull-up resistor
on the SWCLK pin is critical for reliable operations. It is also relevant to eliminate or attenuate noise in
order to avoid that it reaches supply pins, I/O pins and crystals.
39.2
Power Supply
The SAM D21 supports a single power supply from 1.62V - 3.63V.
39.2.1
Power Supply Connections
Figure 39-1. Power Supply Schematic
Close to device
(for every pin)
1.62V-3.63V
VDDANA
10µF
100nF
GNDANA
VDDIO
100nF
VDDIN
100nF
10µF
VDDCORE
1µF
GND
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32-bit ARM-Based Microcontrollers
Table 39-1. Power Supply Connections, VDDCORE From Internal Regulator
Signal Name Recommended Pin Connection
Description
VDDIO
Digital supply voltage
1.62V - 3.63V
Decoupling/filtering capacitors 100nF(1)(2) and 10μF(1)
Decoupling/filtering inductor 10μH(1)(3)
VDDANA
1.62V - 3.63V
Decoupling/filtering capacitors 100nF(1)(2) and 10μF(1)
Analog supply voltage
Ferrite bead(4) prevents the VDD noise interfering the
VDDANA
VDDCORE
1.6V to 1.8V
Decoupling/filtering capacitor 1μF(1)(2)
Core supply voltage / external
decoupling pin
GND
Ground
GNDANA
Ground for the analog power
domain
Note:
1. These values are only given as typical examples.
2. Decoupling capacitor should be placed close to the device for each supply pin pair in the signal
group, low ESR caps should be used for better decoupling.
3. An inductor should be added between the external power and the VDD for power filtering.
4. Ferrite bead has better filtering performance than the common inductor at high frequencies. It can
be added between VDD and VDDANA for preventing digital noise from entering the analog power
domain. The bead should provide enough impedance (e.g. 50Ω at 20MHz and 220Ω at 100MHz)
for separating the digital power from the analog power domain. Make sure to select a ferrite bead
designed for filtering applications with a low DC resistance to avoid a large voltage drop across the
ferrite bead.
39.3
External Analog Reference Connections
The following schematic checklist is only necessary if the application is using one or more of the external
analog references. If the internal references are used instead, the following circuits are not necessary.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Figure 39-2. External Analog Reference Schematic With Two References
Close to device
(for every pin)
AREFA
EXTERNAL
REFERENCE 1
4.7µF
100nF
GND
AREFB
EXTERNAL
REFERENCE 2
4.7µF
100nF
GND
Figure 39-3. External Analog Reference Schematic With One Reference
Close to device
(for every pin)
AREFA
EXTERNAL
REFERENCE
4.7µF
100nF
GND
AREFB
100nF
GND
Table 39-2. External Analog Reference Connections
Signal Name
Recommended Pin Connection
Description
AREFx
1.0V to VDDANA - 0.6V for ADC
External reference from AREFx pin on
the analog port
1.0V to VDDANA- 0.6V for DAC
Decoupling/filtering capacitors
100nF(1)(2) and 4.7μF(1)
GND
1.
2.
Ground
These values are given as a typical example.
Decoupling capacitor should be placed close to the device for each supply pin pair in the signal
group.
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32-bit ARM-Based Microcontrollers
39.4
External Reset Circuit
The external reset circuit is connected to the RESET pin when the external reset function is used. If the
external reset function has been disabled, the circuit is not necessary. The reset switch can also be
removed, if the manual reset is not necessary. The RESET pin itself has an internal pull-up resistor,
hence it is optional to also add an external pull-up resistor.
Figure 39-4. External Reset Circuit Example Schematic
VDD
10kΩ
330Ω
RESET
100nF
GND
A pull-up resistor makes sure that the reset does not go low unintended causing a device reset. An
additional resistor has been added in series with the switch to safely discharge the filtering capacitor, i.e.
preventing a current surge when shorting the filtering capacitor which again causes a noise spike that can
have a negative effect on the system.
Table 39-3. Reset Circuit Connections
Signal Name
Recommended Pin Connection
Description
RESET
Reset low level threshold voltage
VDDIO = 1.6V - 2.0V: Below 0.33 * VDDIO
Reset pin
VDDIO = 2.7V - 3.6V: Below 0.36 * VDDIO
Decoupling/filter capacitor 100nF(1)
Pull-up resistor 10kΩ(1)(2)
Resistor in series with the switch 330Ω(1)
1.
2.
These values are given as a typical example.
The SAM D21 features an internal pull-up resistor on the RESET pin, hence an external pull-up is
optional.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
39.5
Clocks and Crystal Oscillators
The SAM D21 can be run from internal or external clock sources, or a mix of internal and external
sources. An example of usage will be to use the internal 8MHz oscillator as source for the system clock,
and an external 32.768kHz watch crystal as clock source for the Real-Time counter (RTC).
39.5.1
External Clock Source
Figure 39-5. External Clock Source Example Schematic
External
Clock
XIN
XOUT/GPIO
NC/GPIO
Table 39-4. External Clock Source Connections
39.5.2
Signal Name
Recommended Pin Connection
Description
XIN
XIN is used as input for an external clock signal
Input for inverting oscillator pin
XOUT/GPIO
Can be left unconnected or used as normal GPIO
Crystal Oscillator
Figure 39-6. Crystal Oscillator Example Schematic
XIN
15pF
XOUT
15pF
The crystal should be located as close to the device as possible. Long signal lines may cause too high
load to operate the crystal, and cause crosstalk to other parts of the system.
Table 39-5. Crystal Oscillator Checklist
Signal Name
Recommended Pin Connection
Description
XIN
Load capacitor 15pF(1)(2)
External crystal between 0.4 to 30MHz
XOUT
Load capacitor 15pF(1)(2)
1.
2.
39.5.3
These values are given only as typical example.
Decoupling capacitor should be placed close to the device for each supply pin pair in the signal
group.
External Real Time Oscillator
The low frequency crystal oscillator is optimized for use with a 32.768kHz watch crystal. When selecting
crystals, load capacitance and crystal’s Equivalent Series Resistance (ESR) must be taken into
consideration. Both values are specified by the crystal vendor.
© 2017 Microchip Technology Inc.
Datasheet Complete
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32-bit ARM-Based Microcontrollers
The SAM D21 oscillator is optimized for very low power consumption, hence close attention should be
made when selecting crystals, see the table below for maximum ESR recommendations on 9pF and
12.5pF crystals.
The Low-frequency Crystal Oscillator provides an internal load capacitance of typical values available in
Table , 32kHz Crystal Oscillator Characteristics. This internal load capacitance and PCB capacitance can
allow to use a Crystal inferior to 12.5pF load capacitance without external capacitors as shown in the
following figure.
Table 39-6. Maximum ESR Recommendation for 32.768kHz Crystal
Crystal CL (pF)
Max ESR [kΩ]
12.5
313
Note: Maximum ESR is typical value based on characterization. These values are not covered by test
limits in production.
Figure 39-7. External Real Time Oscillator without Load Capacitor
XIN32
32.768kHz
XOUT32
However, to improve Crystal accuracy and Safety Factor, it can be recommended by crystal datasheet to
add external capacitors as shown in the next figure.
To find suitable load capacitance for a 32.768kHz crystal, consult the crystal datasheet.
Figure 39-8. External Real Time Oscillator with Load Capacitor
XIN32
22pF
32.768kHz
XOUT32
22pF
Table 39-7. External Real Time Oscillator Checklist
Signal Name
Recommended Pin Connection
Description
XIN32
Load capacitor 22pF(1)(2)
Timer oscillator input
XOUT32
Load capacitor 22pF(1)(2)
Timer oscillator output
1.
2.
These values are given only as typical examples.
Decoupling capacitor should be placed close to the device for each supply pin pair in the signal
group.
Note: In order to minimize the cycle-to-cycle jitter of the external oscillator, keep the neighboring pins as
steady as possible. For neighboring pin details, refer to the Oscillator Pinout section.
Related Links
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32-bit ARM-Based Microcontrollers
Oscillator Pinout
Oscillators Characteristics
Calculating the Correct Crystal Decoupling Capacitor
In order to calculate correct load capacitor for a given crystal one can use the model shown in the next
figure which includes internal capacitors CLn, external parasitic capacitance CELn and external load
capacitance CPn.
CL1
XIN
CEL1
CP1
CL2
Internal
Figure 39-9. Crystal Circuit With Internal, External and Parasitic Capacitance
XOUT
External
39.5.4
CP2
CEL2
Using this model the total capacitive load for the crystal can be calculated as shown in the equation
below:
�tot =
��1 + ��1 + �EL1 ��2 + ��2 + �EL2
��1 + ��1 + �EL1 + ��2 + ��2 + �EL2
where Ctot is the total load capacitance seen by the crystal, this value should be equal to the load
capacitance value found in the crystal manufacturer datasheet.
The parasitic capacitance CELn can in most applications be disregarded as these are usually very small. If
accounted for the value is dependent on the PCB material and PCB layout.
For some crystal the internal capacitive load provided by the device itself can be enough. To calculate the
total load capacitance in this case. CELn and CPn are both zero, CL1 = CL2 = CL, and the equation reduces
to the following:
�tot =
��
2
The next table shows the device equivalent internal pin capacitance.
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32-bit ARM-Based Microcontrollers
Table 39-8. Equivalent Internal Pin Capacitance
39.6
Symbol
Value
Description
CXIN32
3.05pF
Equivalent internal pin capacitance
CXOUT32
3.29pF
Equivalent internal pin capacitance
Unused or Unconnected Pins
For unused pins the default state of the pins for the will give the lowest current leakage. There is thus no
need to do any configuration of the unused pins in order to lower the power consumption.
39.7
Programming and Debug Ports
For programming and/or debugging the SAM D21 the device should be connected using the Serial Wire
Debug, SWD, interface. Currently the SWD interface is supported by several Atmel and third party
programmers and debuggers, like the SAM-ICE, JTAGICE3 or SAM D21 Xplained Pro (SAM D21
evaluation kit) Embedded Debugger.
Refer to the SAM-ICE, JTAGICE3 or SAM D21 Xplained Pro user guides for details on debugging and
programming connections and options. For connecting to any other programming or debugging tool, refer
to that specific programmer or debugger’s user guide.
The SAM D21 Xplained Pro evaluation board for the SAM D21 supports programming and debugging
through the onboard embedded debugger so no external programmer or debugger is needed.
Note that a pull-up resistor on the SWCLK pin is critical for reliable operations. Refer to related link for
more information.
Figure 39-10. SWCLK Circuit Connections
VDD
1kΩ
SWCLK
Table 39-9. SWCLK Circuit Connections
Pin Name
Description
Recommended Pin Connection
SWCLK
Serial wire clock pin
Pull-up resistor 1kΩ
Related Links
Operation in Noisy Environment
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32-bit ARM-Based Microcontrollers
39.7.1
Cortex Debug Connector (10-pin)
For debuggers and/or programmers that support the Cortex Debug Connector (10-pin) interface the
signals should be connected as shown in the figure below with details described in the next table.
Figure 39-11. Cortex Debug Connector (10-pin)
VDD
Cortex Debug Connector
(10-pin)
VTref
1
SWDIO
GND
SWDCLK
GND
NC
NC
NC
NC
nRESET
RESET
SWCLK
SWDIO
GND
Table 39-10. Cortex Debug Connector (10-pin)
Header Signal
Name
Description
Recommended Pin
Connection
SWDCLK
Serial wire clock pin
Pull-up resistor 1kΩ
SWDIO
Serial wire bidirectional data pin
RESET
Target device reset pin, active low
Refer to External Reset Circuit.
39.7.2
VTref
Target voltage sense, should be connected to the
device VDD
GND
Ground
10-pin JTAGICE3 Compatible Serial Wire Debug Interface
The JTAGICE3 debugger and programmer does not support the Cortex Debug Connector (10-pin)
directly, hence a special pinout is needed to directly connect the SAM D21 to the JTAGICE3, alternatively
one can use the JTAGICE3 squid cable and manually match the signals between the JTAGICE3 and
SAM D21. The following figure describes how to connect a 10-pin header that support connecting the
JTAGICE3 directly to the SAM D21 without the need for a squid cable.
To connect the JTAGICE3 programmer and debugger to the SAM D21, one can either use the JTAGICE3
squid cable, or use a 10-pin connector as shown in the figure below with details given in the next table to
connect to the target using the JTAGICE3 50 mil cable directly.
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32-bit ARM-Based Microcontrollers
Figure 39-12. 10-pin JTAGICE3 Compatible Serial Wire Debug Interface
10-pin JTAGICE3 Compatible
VDD
Serial Wire Debug Header
SWDCLK
1
NC
SWDIO
GND
RESET
VTG
RESET
NC
NC
NC
NC
SWCLK
SWDIO
GND
Table 39-11. 10-pin JTAGICE3 Compatible Serial Wire Debug Interface
39.7.3
Header Signal Name
Description
SWDCLK
Serial wire clock pin
SWDIO
Serial wire bidirectional data pin
RESET
Target device reset pin, active low
VTG
Target voltage sense, should be connected to the device VDD
GND
Ground
20-pin IDC JTAG Connector
For debuggers and/or programmers that support the 20-pin IDC JTAG Connector, e.g. the SAM-ICE, the
signals should be connected as shown in the next figure with details described in the table.
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32-bit ARM-Based Microcontrollers
Figure 39-13. 20-pin IDC JTAG Connector
VDD
20-pin IDC JTAG Connector
VCC
NC
1
NC
GND
NC
GND
SWDIO
GND
SWDCLK
GND
NC
GND
NC
GND*
nRESET
GND*
NC
GND*
NC
GND*
RESET
SWCLK
SWDIO
GND
Table 39-12. 20-pin IDC JTAG Connector
Header Signal Name Description
39.8
SWDCLK
Serial wire clock pin
SWDIO
Serial wire bidirectional data pin
RESET
Target device reset pin, active low
VCC
Target voltage sense, should be connected to the device VDD
GND
Ground
GND*
These pins are reserved for firmware extension purposes. They can be left open
or connected to GND in normal debug environment. They are not essential for
SWD in general.
USB Interface
The USB interface consists of a differential data pair (D+/D-) and a power supply (VBUS, GND). Refer to
the Electrical Characteristics for operating voltages which will allow USB operation.
Table 39-13. USB Interface Checklist
Signal
Name
D+
Recommended Pin Connection
•
•
D-
•
The impedance of the pair should be matched on the PCB to
minimize reflections.
USB differential tracks should be routed with the same
characteristics (length, width, number of vias, etc.)
Signals should be routed as parallel as possible, with a
minimum number of angles and vias
© 2017 Microchip Technology Inc.
Datasheet Complete
Description
USB full speed / low
speed positive data
upstream pin
USB full speed / low
speed negative data
upstream pin
40001882A-page 865
32-bit ARM-Based Microcontrollers
Figure 39-14. Low Cost USB Interface Example Schematic
USB
Connector
VBUS
D+
DGND
VBUS
USB
Differential
Data Line Pair
USB_D+
USB_D-
Shield
GND (Board)
It is recommended to increase ESD protection on the USB D+, D-, and VBUS lines using dedicated
transient suppressors. These protections should be located as close as possible to the USB connector to
reduce the potential discharge path and reduce discharge propagation within the entire system.
The USB FS cable includes a dedicated shield wire that should be connected to the board with caution.
Special attention should be paid to the connection between the board ground plane and the shield from
the USB connector and the cable.
Tying the shield directly to ground would create a direct path from the ground plane to the shield, turning
the USB cable into an antenna. To limit the USB cable antenna effect, it is recommended to connect the
shield and ground through an RC filter.
Figure 39-15. Protected USB Interface Example Schematic
VBUS
USB Transient
protection
USB
Connector
USB
Differential
Data Line Pair
VBUS
D+
DGND
RC Filter
(GND/Shield
Connection)
© 2017 Microchip Technology Inc.
USB_D-
4.5nF
1MO
Shield
USB_D+
GND (Board)
Datasheet Complete
40001882A-page 866
32-bit ARM-Based Microcontrollers
40.
Errata
40.1
Device Variant A
The device variant (last letter of the ordering number) is independent of the die revision
(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks
evolution of the die.
40.1.1
Die Revision A
40.1.1.1 Device
1 – When VDDIN is lower than the POR threshold during power rise or
fall, an internal pull-up resistor is enabled on pins with PTC
functionality (see PORT Function Multiplexing). Note that this behavior
will be present even if PTC functionality is not enabled on the pin. The
POR level is defined in the “Power-On Reset (POR) Characteristics”
chapter.
Errata reference: 12117
Fix/Workaround:
Use a pin without PTC functionality if the pull-up could damage your
application during power up.
2 – In single shot mode and at 125°C, the ADC conversions have
linearity errors.
Errata reference: 13277
Fix/Workaround:
- Workaround 1: At 125°C, do not use the ADC in single shot mode; use the
ADC in free running mode only.
- Workaround 2: At 125°C, use the ADC in single shot mode only with
VDDANA > 3V.
3 – TCC0/WO[6] on PA16 and TCC0/WO[7] on PA17 are not available.
Errata reference: 11622
Fix/Workaround:
None
4 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
5 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 867
32-bit ARM-Based Microcontrollers
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
6 – In I2C Slave mode, writing the CTRLB register when in the AMATCH
or DRDY interrupt service routines can cause the state machine to
reset.
Errata reference: 13574
Fix/Workaround:
Write CTRLB.ACKACT to 0 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Write CTRLB.ACKACT to 1 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Otherwise, only write to CTRLB in the AMATCH or DRDY interrupts if it is to
close out a transaction.
When not closing a transaction, clear the AMATCH interrupt by writing a 1 to
its bit position instead of using CTRLB.CMD. The DRDY interrupt is
automatically cleared by reading/writing to the DATA register in smart mode.
If not in smart mode, DRDY should be cleared by writing a 1 to its bit
position.
Code replacements examples:
Current:
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Current:
SERCOM - CTRLB.reg &= ~SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Current:
/* ACK or NACK address */
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_CMD(0x3);
Change to:
// CMD=0x3 clears all interrupts, so to keep the result similar,
// PREC is cleared if it was set.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 868
32-bit ARM-Based Microcontrollers
if (SERCOM - INTFLAG.bit.PREC) SERCOM - INTFLAG.reg =
SERCOM_I2CS_INTFLAG_PREC;
SERCOM - INTFLAG.reg = SERCOM_I2CS_INTFLAG_AMATCH;
7 – PA24 and PA25 cannot be used as input when configured as GPIO
with continuous sampling (cannot be read by PORT).
Errata reference: 12005
Fix/Workaround:
- Use PA24 and PA25 for peripherals or only as output pins.
- Or configure PA31 to PA24 for on-demand sampling (CTRL[31:24] all
zeroes) and access the IN register through the APB (not the IOBUS), to
allow waiting for on-demand sampling.
8 – The SYSTICK calibration value is incorrect.
Errata reference: 14154
Fix/Workaround:
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
9 – In Standby, Idle1 and Idle2 sleep modes the device might not wake
up from sleep. An External Reset, Power on Reset or Watch Dog Reset
will start the device again.
Errata reference: 13140
Fix/Workaround:
the SLEEPPRM bits in the NVMCTRL.CTRLB register must be written to 3
(NVMCTRL - CTRLB.bit.SLEEPPRM = 3) to ensure correct operation of the
device. The average power consumption of the device will increase with
20uA compared to numbers in the electrical characteristics chapter.
10 – While the internal startup is not completed, PA07 pin is driven low
by the chip. Then as all the other pins it is configured as an High
Impedance pin.
Errata reference: 12118
Fix/Workaround:
None
11 – Digital pin outputs from Timer/Counters, AC (Analog Comparator),
GCLK (Generic Clock Controller), and SERCOM (I2C and SPI) do not
change value during standby sleep mode.
Errata reference: 12537
Fix/Workaround:
Set the voltage regulator in Normal mode before entering STANDBY sleep
mode in order to keep digital pin output enabled. This is done by setting the
RUNSTDBY bit in the VREG register.
12 – The I2S is non-functional.
Errata reference: 12275
Fix/Workaround:
None
13 – Pulldown functionality is not available on GPIO pin PA24 and PA25
Errata reference: 13883
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 869
32-bit ARM-Based Microcontrollers
Fix/Workaround:
None
14 – The voltage regulator in low power mode is not functional at
temperatures above 85C.
Errata reference: 12291
Fix/Workaround:
Enable normal mode on the voltage regulator in standby sleep mode.
Example code:
// Set the voltage regulator in normal mode configuration in standby sleep
mode
SYSCTRL->VREG.bit.RUNSTDBY = 1;
15 – If the external XOSC32K is broken, neither the external pin RST
nor the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
Errata reference: 12164
Fix/Workaround:
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
40.1.1.2 DSU
1 – If a debugger has issued a DSU Cold-Plugging procedure and then
released the CPU from the resulting ""CPU Reset Extension"", the CPU
will be held in ""CPU Reset Extension"" after any upcoming reset
event.
Errata reference: 12015
Fix/workaround:
The CPU must be released from the ""CPU Reset Extension"" either by
writing a one in the DSU STATUSA.CRSTEXT register or by applying an
external reset with SWCLK high or by power cycling the device.
2 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
Do not use the ""Pause-on-Error"" feature.
40.1.1.3 PM
1 – In debug mode, if a watchdog reset occurs, the debug session is
lost.
Errata reference: 12196
Fix/Workaround:
A new debug session must be restart after a watchdog reset.
40.1.1.4 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 870
32-bit ARM-Based Microcontrollers
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.1.1.5 XOSC32K
1 – The automatic amplitude control of the XOSC32K does not work.
Errata reference: 10933
Fix/Workaround:
Use the XOSC32K with Automatic Amplitude control disabled
(XOSC32K.AAMPEN = 0)
40.1.1.6 FDPLL
1 – The lock flag (DPLLSTATUS.LOCK) may clear randomly. When the
lock flag randomly clears, DPLLLCKR and DPLLLCKF interrupts will
also trigger, and the DPLL output is masked.
Errata reference: 11791
Fix/Workaround:
Set DPLLCTRLB.LBYPASS to 1 to disable masking of the DPLL output by
the lock status.
2 – FDPLL lock time-out values are different from the parameters in the
datasheet.
Errata reference: 12145
Fix/Workaround:
The time-out values are:
- DPLLCTRLB.LTIME[2:0] = 4 : 10ms
- DPLLCTRLB.LTIME[2:0] = 5 : 10ms
- DPLLCTRLB.LTIME[2:0] = 6 : 11ms
- DPLLCTRLB.LTIME[2:0] = 7 : 11ms
3 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 871
32-bit ARM-Based Microcontrollers
40.1.1.7 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
Fix/Workaround:
Add a NOP instruction between each write to CRCDATAIN register.
40.1.1.8 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.1.1.9 NVMCTRL
1 – Default value of MANW in NVM.CTRLB is 0.
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
2 – When external reset is active it causes a high leakage current on
VDDIO.
Errata reference: 13446
Fix/Workaround:
Minimize the time external reset is active.
3 – When the part is secured and EEPROM emulation area configured
to none, the CRC32 is not executed on the entire flash area but up to
the on-chip flash size minus half a row.
Errata reference: 11988
Fix/Workaround:
When using CRC32 on a protected device with EEPROM emulation area
configured to none, compute the reference CRC32 value to the full chip flash
size minus half row.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 872
32-bit ARM-Based Microcontrollers
40.1.1.10 SERCOM
1 – The I2C Slave SCL Low Extend Time-out (CTRLA.SEXTTOEN) and
Master SCL Low Extend Time-out (CTRLA.MEXTTOEN) cannot be used
if SCL Low Time-out (CTRLA.LOWTOUT) is disabled. When
SCTRLA.LOWTOUT=0, the GCLK_SERCOM_SLOW is not requested.
Errata reference: 12003
Fix/Workaround:
To use the Master or Slave SCL low extend time-outs, enable the SCL Low
Time-out (CTRLA.LOWTOUT=1).
2 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
3 – If the SERCOM is enabled in SPI mode with SSL detection enabled
(CTRLB.SSDE) and CTRLB.RXEN=1, an erroneous slave select low
interrupt (INTFLAG.SSL) can be generated.
Errata reference: 13369
Fix/Workaround:
Enable the SERCOM first with CTRLB.RXEN=0. In a subsequent write, set
CTRLB.RXEN=1.
4 – In TWI master mode, an ongoing transaction should be stalled
immediately when DBGCTRL.DBGSTOP is set and the CPU enters
debug mode. Instead, it is stopped when the current byte transaction is
completed and the corresponding interrupt is triggered if enabled.
Errata reference: 12499
Fix/Workaround:
In TWI master mode, keep DBGCTRL.DBGSTOP=0 when in debug mode.
40.1.1.11 TC
1 – Spurious TC overflow and Match/Capture events may occur.
Errata reference: 13268
Fix/Workaround:
Do not use the TC overflow and Match/Capture events. Use the
corresponding Interrupts instead.
40.1.1.12 TCC
1 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
2 – The TCC interrupts FAULT1, FAULT0, FAULTB, FAULTA, DFS,
ERR,and CNT cannot wake up the chip from standby mode.
Errata reference: 11951
Fix/Workaround:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 873
32-bit ARM-Based Microcontrollers
Do not use the TCC interrupts FAULT1, FAULT0, FAULTB, FAULTA, DFS,
ERR, or CNT to wake up the chip from standby mode.
3 – If the OVF flag in the INTFLAG register is already set when enabling
the DMA, this will trigger an immediate DMA transfer and overwrite the
current buffered value in the TCC register.
Errata reference: 12127
Fix/Workaround:
None
4 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
5 – In RAMP 2 mode with Fault keep, qualified and restart:
If a fault occurred at the end of the period during the qualified state, the
switch to the next ramp can have two restarts.
Errata reference: 13262
Fix/Workaround:
Avoid faults few cycles before the end or the beginning of a ramp.
6 – With blanking enabled, a recoverable fault that occurs during the
first increment of a rising TCC is not blanked.
Errata reference: 12519
Fix/Workaround:
None
7 – In Dual slope mode a Retrigger Event does not clear the TCC
counter.
Errata reference: 12354
Fix/Workaround:
None
8 – In two ramp mode, two events will be generated per cycle, one on
each ramp’s end. EVCTRL.CNTSEL.END cannot be used to identify the
end of a double ramp cycle.
Errata reference: 12224
Fix/Workaround:
None
9 – If an input event triggered STOP action is performed at the same
time as the counter overflows, the first pulse width of the subsequent
counter start can be altered with one prescaled clock cycle.
Errata reference: 12107
Fix/Workaround:
None
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 874
32-bit ARM-Based Microcontrollers
10 – When the RUNSTDBY bit is written after the TCC is enabled, the
respective TCC APB bus is stalled and the RUNDSTBY bit in the TCC
CTRLA register is not enabled-protected.
Errata reference: 12477
Fix/Workaround:
None.
11 – TCC fault filtering on inverted fault is not working.
Errata reference: 12512
Fix/Workaround:
Use only non-inverted faults.
12 – When waking up from the STANDBY power save mode, the
SYNCBUSY.CTRLB, SYNCBUSY.STATUS, SYNCBUSY.COUNT,
SYNCBUSY.PATT, SYNCBUSY.WAVE, SYNCBUSY.PER and
SYNCBUSY.CCx bits may be locked to 1.
Errata reference: 12227
Fix/Workaround:
After waking up from STANDBY power save mode, perform a software reset
of the TCC if you are using the SYNCBUSY.CTRLB, SYNCBUSY.STATUS,
SYNCBUSY.COUNT, SYNCBUSY.PATT, SYNCBUSY.WAVE,
SYNCBUSY.PER or SYNCBUSY.CCx bits
13 – When the Peripheral Access Controller (PAC) protection is
enabled, writing to WAVE or WAVEB registers will not cause a
hardware exception.
Errata reference: 11468
Fix/Workaround:
None
14 – If the MCx flag in the INTFLAG register is set when enabling the
DMA, this will trigger an immediate DMA transfer and overwrite the
current buffered value in the TCC register.
Errata reference: 12155
Fix/Workaround:
None
40.1.1.13 USB
1 – The FLENC register negative sign management is not correct.
Errata reference: 11472
Fix/Workaround:
The following rule must be used for negative values:
- FLENC 8h is equal to 0 decimal.
- FLENC 9h to Fh are equal to -1 to -7 decimal instead of -7 to -1.
40.1.1.14 PTC
1 – WCOMP interrupt flag is not stable. The WCOMP interrupt flag will
not always be set as described in the datasheet.
Errata reference: 12860
Fix/Workaround:
Do not use the WCOMP interrupt. Use the WCOMP event.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 875
32-bit ARM-Based Microcontrollers
40.1.2
Die Revision B
40.1.2.1 Device
1 – When VDDIN is lower than the POR threshold during power rise or
fall, an internal pull-up resistor is enabled on pins with PTC
functionality (see PORT Function Multiplexing). Note that this behavior
will be present even if PTC functionality is not enabled on the pin. The
POR level is defined in the “Power-On Reset (POR) Characteristics”
chapter.
Errata reference: 12117
Fix/Workaround:
Use a pin without PTC functionality if the pull-up could damage your
application during power up.
2 – The I2S is non-functional in the slave mode (i.e. when (FSSEL=1,
SCKSEL=1).
Errata reference: 13407
Fix/Workaround:
None. FSSEL and SCKSEL must be 0.
3 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
4 – The software reset SWRST does not properly propagate inside the
I2S module. As a consequence, the slave mode may not be
reconfigured correctly and may result in unexpected behavior of the
SYNCBUSY register.
Errata reference: 12848
Fix/workaround:
None.
5 – PA24 and PA25 cannot be used as input when configured as GPIO
with continuous sampling (cannot be read by PORT).
Errata reference: 12005
Fix/Workaround:
- Use PA24 and PA25 for peripherals or only as output pins.
- Or configure PA31 to PA24 for on-demand sampling (CTRL[31:24] all
zeroes) and access the IN register through the APB (not the IOBUS), to
allow waiting for on-demand sampling.
6 – Rx serializer in the RIGHT Data Slot Formatting Adjust mode
(SERCTRL.SLOTADJ clear) does not work when the slot size is not 32
bits.
Errata reference: 13411
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.SLOTADJ RIGHT must be used
with CLKCTRL.SLOTSIZE 32.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 876
32-bit ARM-Based Microcontrollers
7 – Depending CPU clock/ I2S clock ratio, the SYNCBUSY.CKEN0 flag
occasionally stuck at 1 when starting a new audio stream with
CTRLA.SWRST=1, then CTRLA.ENABLE=1, then CTRLA.CKEN0=1
Errata reference: 13408
Fix/Workaround:
Disable the IP by writing 0 to CTRLA.ENABLE before resetting it
(CTRLA.SWRST=1).
8 – While the internal startup is not completed, PA07 pin is driven low
by the chip. Then as all the other pins it is configured as an High
Impedance pin.
Errata reference: 12118
Fix/Workaround:
None
9 – Pulldown functionality is not available on GPIO pin PA24 and PA25
Errata reference: 13883
Fix/Workaround:
None
10 – If the external XOSC32K is broken, neither the external pin RST
nor the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
Errata reference: 12164
Fix/Workaround:
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
11 – In single shot mode and at 125°C, the ADC conversions have
linearity errors.
Errata reference: 13277
Fix/Workaround:
- Workaround 1: At 125°C, do not use the ADC in single shot mode; use the
ADC in free running mode only.
- Workaround 2: At 125°C, use the ADC in single shot mode only with
VDDANA > 3V.
12 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
13 – The PDM2 mode (i.e. when using two PDM microphones) does not
work.
Errata reference: 13410
Fix/Workaround:
None. Only one PDM microphone can be connected. Thus, the I2S
controller should be configured in normal Receive mode with one slot.
14 – In I2C Slave mode, writing the CTRLB register when in the
AMATCH or DRDY interrupt service routines can cause the state
machine to reset.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 877
32-bit ARM-Based Microcontrollers
Errata reference: 13574
Fix/Workaround:
Write CTRLB.ACKACT to 0 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Write CTRLB.ACKACT to 1 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Otherwise, only write to CTRLB in the AMATCH or DRDY interrupts if it is to
close out a transaction.
When not closing a transaction, clear the AMATCH interrupt by writing a 1 to
its bit position instead of using CTRLB.CMD. The DRDY interrupt is
automatically cleared by reading/writing to the DATA register in smart mode.
If not in smart mode, DRDY should be cleared by writing a 1 to its bit
position.
Code replacements examples:
Current:
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Current:
SERCOM - CTRLB.reg &= ~SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Current:
/* ACK or NACK address */
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_CMD(0x3);
Change to:
// CMD=0x3 clears all interrupts, so to keep the result similar,
// PREC is cleared if it was set.
if (SERCOM - INTFLAG.bit.PREC) SERCOM - INTFLAG.reg =
SERCOM_I2CS_INTFLAG_PREC;
SERCOM - INTFLAG.reg = SERCOM_I2CS_INTFLAG_AMATCH;
15 – The SYSTICK calibration value is incorrect.
Errata reference: 14154
Fix/Workaround:
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
16 – In Standby, Idle1 and Idle2 sleep modes the device might not wake
up from sleep. An External Reset, Power on Reset or Watch Dog Reset
will start the device again.
Errata reference: 13140
Fix/Workaround:
the SLEEPPRM bits in the NVMCTRL.CTRLB register must be written to 3
(NVMCTRL - CTRLB.bit.SLEEPPRM = 3) to ensure correct operation of the
device. The average power consumption of the device will increase with
20uA compared to numbers in the electrical characteristics chapter.
17 – Digital pin outputs from Timer/Counters, AC (Analog Comparator),
GCLK (Generic Clock Controller), and SERCOM (I2C and SPI) do not
change value during standby sleep mode.
Errata reference: 12537
Fix/Workaround:
Set the voltage regulator in Normal mode before entering STANDBY sleep
mode in order to keep digital pin output enabled. This is done by setting the
RUNSTDBY bit in the VREG register.
18 – The voltage regulator in low power mode is not functional at
temperatures above 85C.
Errata reference: 12291
Fix/Workaround:
Enable normal mode on the voltage regulator in standby sleep mode.
Example code:
// Set the voltage regulator in normal mode configuration in standby sleep
mode
SYSCTRL->VREG.bit.RUNSTDBY = 1;
40.1.2.2 DSU
1 – If a debugger has issued a DSU Cold-Plugging procedure and then
released the CPU from the resulting ""CPU Reset Extension"", the CPU
will be held in ""CPU Reset Extension"" after any upcoming reset
event.
Errata reference: 12015
Fix/workaround:
The CPU must be released from the ""CPU Reset Extension"" either by
writing a one in the DSU STATUSA.CRSTEXT register or by applying an
external reset with SWCLK high or by power cycling the device.
2 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
Do not use the ""Pause-on-Error"" feature.
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32-bit ARM-Based Microcontrollers
40.1.2.3 PM
1 – In debug mode, if a watchdog reset occurs, the debug session is
lost.
Errata reference: 12196
Fix/Workaround:
A new debug session must be restart after a watchdog reset.
40.1.2.4 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.1.2.5 XOSC32K
1 – The automatic amplitude control of the XOSC32K does not work.
Errata reference: 10933
Fix/Workaround:
Use the XOSC32K with Automatic Amplitude control disabled
(XOSC32K.AAMPEN = 0)
40.1.2.6 FDPLL
1 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
40.1.2.7 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
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This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
Fix/Workaround:
Add a NOP instruction between each write to CRCDATAIN register.
40.1.2.8 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.1.2.9 NVMCTRL
1 – Default value of MANW in NVM.CTRLB is 0.
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
2 – When external reset is active it causes a high leakage current on
VDDIO.
Errata reference: 13446
Fix/Workaround:
Minimize the time external reset is active.
3 – When the part is secured and EEPROM emulation area configured
to none, the CRC32 is not executed on the entire flash area but up to
the on-chip flash size minus half a row.
Errata reference: 11988
Fix/Workaround:
When using CRC32 on a protected device with EEPROM emulation area
configured to none, compute the reference CRC32 value to the full chip flash
size minus half row.
40.1.2.10 SERCOM
1 – The I2C Slave SCL Low Extend Time-out (CTRLA.SEXTTOEN) and
Master SCL Low Extend Time-out (CTRLA.MEXTTOEN) cannot be used
if SCL Low Time-out (CTRLA.LOWTOUT) is disabled. When
SCTRLA.LOWTOUT=0, the GCLK_SERCOM_SLOW is not requested.
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32-bit ARM-Based Microcontrollers
Errata reference: 12003
Fix/Workaround:
To use the Master or Slave SCL low extend time-outs, enable the SCL Low
Time-out (CTRLA.LOWTOUT=1).
2 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
3 – If the SERCOM is enabled in SPI mode with SSL detection enabled
(CTRLB.SSDE) and CTRLB.RXEN=1, an erroneous slave select low
interrupt (INTFLAG.SSL) can be generated.
Errata reference: 13369
Fix/Workaround:
Enable the SERCOM first with CTRLB.RXEN=0. In a subsequent write, set
CTRLB.RXEN=1.
4 – In TWI master mode, an ongoing transaction should be stalled
immediately when DBGCTRL.DBGSTOP is set and the CPU enters
debug mode. Instead, it is stopped when the current byte transaction is
completed and the corresponding interrupt is triggered if enabled.
Errata reference: 12499
Fix/Workaround:
In TWI master mode, keep DBGCTRL.DBGSTOP=0 when in debug mode.
40.1.2.11 TC
1 – Spurious TC overflow and Match/Capture events may occur.
Errata reference: 13268
Fix/Workaround:
Do not use the TC overflow and Match/Capture events. Use the
corresponding Interrupts instead.
40.1.2.12 TCC
1 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
2 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
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32-bit ARM-Based Microcontrollers
3 – In RAMP 2 mode with Fault keep, qualified and restart:
If a fault occurred at the end of the period during the qualified state, the
switch to the next ramp can have two restarts.
Errata reference: 13262
Fix/Workaround:
Avoid faults few cycles before the end or the beginning of a ramp.
4 – With blanking enabled, a recoverable fault that occurs during the
first increment of a rising TCC is not blanked.
Errata reference: 12519
Fix/Workaround:
None
5 – In Dual slope mode a Retrigger Event does not clear the TCC
counter.
Errata reference: 12354
Fix/Workaround:
None
6 – In two ramp mode, two events will be generated per cycle, one on
each ramp’s end. EVCTRL.CNTSEL.END cannot be used to identify the
end of a double ramp cycle.
Errata reference: 12224
Fix/Workaround:
None
7 – If an input event triggered STOP action is performed at the same
time as the counter overflows, the first pulse width of the subsequent
counter start can be altered with one prescaled clock cycle.
Errata reference: 12107
Fix/Workaround:
None
8 – When the RUNSTDBY bit is written after the TCC is enabled, the
respective TCC APB bus is stalled and the RUNDSTBY bit in the TCC
CTRLA register is not enabled-protected.
Errata reference: 12477
Fix/Workaround:
None.
9 – TCC fault filtering on inverted fault is not working.
Errata reference: 12512
Fix/Workaround:
Use only non-inverted faults.
10 – When waking up from the STANDBY power save mode, the
SYNCBUSY.CTRLB, SYNCBUSY.STATUS, SYNCBUSY.COUNT,
SYNCBUSY.PATT, SYNCBUSY.WAVE, SYNCBUSY.PER and
SYNCBUSY.CCx bits may be locked to 1.
Errata reference: 12227
Fix/Workaround:
After waking up from STANDBY power save mode, perform a software reset
of the TCC if you are using the SYNCBUSY.CTRLB, SYNCBUSY.STATUS,
SYNCBUSY.COUNT, SYNCBUSY.PATT, SYNCBUSY.WAVE,
SYNCBUSY.PER or SYNCBUSY.CCx bits
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11 – When the Peripheral Access Controller (PAC) protection is
enabled, writing to WAVE or WAVEB registers will not cause a
hardware exception.
Errata reference: 11468
Fix/Workaround:
None
12 – If the MCx flag in the INTFLAG register is set when enabling the
DMA, this will trigger an immediate DMA transfer and overwrite the
current buffered value in the TCC register.
Errata reference: 12155
Fix/Workaround:
None
40.1.2.13 PTC
1 – WCOMP interrupt flag is not stable. The WCOMP interrupt flag will
not always be set as described in the datasheet.
Errata reference: 12860
Fix/Workaround:
Do not use the WCOMP interrupt. Use the WCOMP event.
40.1.3
Die Revision C
40.1.3.1 Device
1 – When VDDIN is lower than the POR threshold during power rise or
fall, an internal pull-up resistor is enabled on pins with PTC
functionality (see PORT Function Multiplexing). Note that this behavior
will be present even if PTC functionality is not enabled on the pin. The
POR level is defined in the “Power-On Reset (POR) Characteristics”
chapter.
Errata reference: 12117
Fix/Workaround:
Use a pin without PTC functionality if the pull-up could damage your
application during power up.
2 – In single shot mode and at 125°C, the ADC conversions have
linearity errors.
Errata reference: 13277
Fix/Workaround:
- Workaround 1: At 125°C, do not use the ADC in single shot mode; use the
ADC in free running mode only.
- Workaround 2: At 125°C, use the ADC in single shot mode only with
VDDANA > 3V.
3 – In the table ""NVM User Row Mapping"", the WDT Window bitfield
default value on silicon is not as specified in the datasheet. The
datasheet defines the default value as 0x5, while it is 0xB on silicon.
Errata reference: 13951
Fix/Workaround:
None.
4 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
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32-bit ARM-Based Microcontrollers
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
5 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
6 – In I2C Slave mode, writing the CTRLB register when in the AMATCH
or DRDY interrupt service routines can cause the state machine to
reset.
Errata reference: 13574
Fix/Workaround:
Write CTRLB.ACKACT to 0 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Write CTRLB.ACKACT to 1 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Otherwise, only write to CTRLB in the AMATCH or DRDY interrupts if it is to
close out a transaction.
When not closing a transaction, clear the AMATCH interrupt by writing a 1 to
its bit position instead of using CTRLB.CMD. The DRDY interrupt is
automatically cleared by reading/writing to the DATA register in smart mode.
If not in smart mode, DRDY should be cleared by writing a 1 to its bit
position.
Code replacements examples:
Current:
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Current:
SERCOM - CTRLB.reg &= ~SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
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32-bit ARM-Based Microcontrollers
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Current:
/* ACK or NACK address */
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_CMD(0x3);
Change to:
// CMD=0x3 clears all interrupts, so to keep the result similar,
// PREC is cleared if it was set.
if (SERCOM - INTFLAG.bit.PREC) SERCOM - INTFLAG.reg =
SERCOM_I2CS_INTFLAG_PREC;
SERCOM - INTFLAG.reg = SERCOM_I2CS_INTFLAG_AMATCH;
7 – PA24 and PA25 cannot be used as input when configured as GPIO
with continuous sampling (cannot be read by PORT).
Errata reference: 12005
Fix/Workaround:
- Use PA24 and PA25 for peripherals or only as output pins.
- Or configure PA31 to PA24 for on-demand sampling (CTRL[31:24] all
zeroes) and access the IN register through the APB (not the IOBUS), to
allow waiting for on-demand sampling.
8 – Rx serializer in the RIGHT Data Slot Formatting Adjust mode
(SERCTRL.SLOTADJ clear) does not work when the slot size is not 32
bits.
Errata reference: 13411
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.SLOTADJ RIGHT must be used
with CLKCTRL.SLOTSIZE 32.
9 – The SYSTICK calibration value is incorrect.
Errata reference: 14154
Fix/Workaround:
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
10 – In Standby, Idle1 and Idle2 sleep modes the device might not wake
up from sleep. An External Reset, Power on Reset or Watch Dog Reset
will start the device again.
Errata reference: 13140
Fix/Workaround:
the SLEEPPRM bits in the NVMCTRL.CTRLB register must be written to 3
(NVMCTRL - CTRLB.bit.SLEEPPRM = 3) to ensure correct operation of the
device. The average power consumption of the device will increase with
20uA compared to numbers in the electrical characteristics chapter.
11 – While the internal startup is not completed, PA07 pin is driven low
by the chip. Then as all the other pins it is configured as an High
Impedance pin.
Errata reference: 12118
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32-bit ARM-Based Microcontrollers
Fix/Workaround:
None
12 – Pulldown functionality is not available on GPIO pin PA24 and PA25
Errata reference: 13883
Fix/Workaround:
None
13 – The voltage regulator in low power mode is not functional at
temperatures above 85C.
Errata reference: 12291
Fix/Workaround:
Enable normal mode on the voltage regulator in standby sleep mode.
Example code:
// Set the voltage regulator in normal mode configuration in standby sleep
mode
SYSCTRL->VREG.bit.RUNSTDBY = 1;
14 – If the external XOSC32K is broken, neither the external pin RST
nor the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
Errata reference: 12164
Fix/Workaround:
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
40.1.3.2 DSU
1 – If a debugger has issued a DSU Cold-Plugging procedure and then
released the CPU from the resulting ""CPU Reset Extension"", the CPU
will be held in ""CPU Reset Extension"" after any upcoming reset
event.
Errata reference: 12015
Fix/workaround:
The CPU must be released from the ""CPU Reset Extension"" either by
writing a one in the DSU STATUSA.CRSTEXT register or by applying an
external reset with SWCLK high or by power cycling the device.
2 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
Do not use the ""Pause-on-Error"" feature.
40.1.3.3 PM
1 – In debug mode, if a watchdog reset occurs, the debug session is
lost.
Errata reference: 12196
Fix/Workaround:
A new debug session must be restart after a watchdog reset.
40.1.3.4 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
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32-bit ARM-Based Microcontrollers
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.1.3.5 XOSC32K
1 – The automatic amplitude control of the XOSC32K does not work.
Errata reference: 10933
Fix/Workaround:
Use the XOSC32K with Automatic Amplitude control disabled
(XOSC32K.AAMPEN = 0)
40.1.3.6 FDPLL
1 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
40.1.3.7 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
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32-bit ARM-Based Microcontrollers
Fix/Workaround:
Add a NOP instruction between each write to CRCDATAIN register.
40.1.3.8 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.1.3.9 NVMCTRL
1 – Default value of MANW in NVM.CTRLB is 0.
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
2 – When external reset is active it causes a high leakage current on
VDDIO.
Errata reference: 13446
Fix/Workaround:
Minimize the time external reset is active.
3 – When the part is secured and EEPROM emulation area configured
to none, the CRC32 is not executed on the entire flash area but up to
the on-chip flash size minus half a row.
Errata reference: 11988
Fix/Workaround:
When using CRC32 on a protected device with EEPROM emulation area
configured to none, compute the reference CRC32 value to the full chip flash
size minus half row.
40.1.3.10 I2S
1 – I2S RX serializer in LSBIT mode (SERCTRL.BITREV set) only works
when the slot size is 32 bits.
Errata reference: 13320
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.BITREV LSBIT must be used with
CLKCTRL.SLOTSIZE 32.
40.1.3.11 SERCOM
1 – The I2C Slave SCL Low Extend Time-out (CTRLA.SEXTTOEN) and
Master SCL Low Extend Time-out (CTRLA.MEXTTOEN) cannot be used
if SCL Low Time-out (CTRLA.LOWTOUT) is disabled. When
SCTRLA.LOWTOUT=0, the GCLK_SERCOM_SLOW is not requested.
Errata reference: 12003
Fix/Workaround:
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
To use the Master or Slave SCL low extend time-outs, enable the SCL Low
Time-out (CTRLA.LOWTOUT=1).
2 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
3 – If the SERCOM is enabled in SPI mode with SSL detection enabled
(CTRLB.SSDE) and CTRLB.RXEN=1, an erroneous slave select low
interrupt (INTFLAG.SSL) can be generated.
Errata reference: 13369
Fix/Workaround:
Enable the SERCOM first with CTRLB.RXEN=0. In a subsequent write, set
CTRLB.RXEN=1.
4 – In TWI master mode, an ongoing transaction should be stalled
immediately when DBGCTRL.DBGSTOP is set and the CPU enters
debug mode. Instead, it is stopped when the current byte transaction is
completed and the corresponding interrupt is triggered if enabled.
Errata reference: 12499
Fix/Workaround:
In TWI master mode, keep DBGCTRL.DBGSTOP=0 when in debug mode.
40.1.3.12 TC
1 – Spurious TC overflow and Match/Capture events may occur.
Errata reference: 13268
Fix/Workaround:
Do not use the TC overflow and Match/Capture events. Use the
corresponding Interrupts instead.
40.1.3.13 TCC
1 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
2 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
3 – In RAMP 2 mode with Fault keep, qualified and restart:
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If a fault occurred at the end of the period during the qualified state, the
switch to the next ramp can have two restarts.
Errata reference: 13262
Fix/Workaround:
Avoid faults few cycles before the end or the beginning of a ramp.
4 – With blanking enabled, a recoverable fault that occurs during the
first increment of a rising TCC is not blanked.
Errata reference: 12519
Fix/Workaround:
None
5 – In Dual slope mode a Retrigger Event does not clear the TCC
counter.
Errata reference: 12354
Fix/Workaround:
None
6 – In two ramp mode, two events will be generated per cycle, one on
each ramp’s end. EVCTRL.CNTSEL.END cannot be used to identify the
end of a double ramp cycle.
Errata reference: 12224
Fix/Workaround:
None
7 – If an input event triggered STOP action is performed at the same
time as the counter overflows, the first pulse width of the subsequent
counter start can be altered with one prescaled clock cycle.
Errata reference: 12107
Fix/Workaround:
None
8 – When the RUNSTDBY bit is written after the TCC is enabled, the
respective TCC APB bus is stalled and the RUNDSTBY bit in the TCC
CTRLA register is not enabled-protected.
Errata reference: 12477
Fix/Workaround:
None.
9 – TCC fault filtering on inverted fault is not working.
Errata reference: 12512
Fix/Workaround:
Use only non-inverted faults.
10 – When waking up from the STANDBY power save mode, the
SYNCBUSY.CTRLB, SYNCBUSY.STATUS, SYNCBUSY.COUNT,
SYNCBUSY.PATT, SYNCBUSY.WAVE, SYNCBUSY.PER and
SYNCBUSY.CCx bits may be locked to 1.
Errata reference: 12227
Fix/Workaround:
After waking up from STANDBY power save mode, perform a software reset
of the TCC if you are using the SYNCBUSY.CTRLB, SYNCBUSY.STATUS,
SYNCBUSY.COUNT, SYNCBUSY.PATT, SYNCBUSY.WAVE,
SYNCBUSY.PER or SYNCBUSY.CCx bits
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
11 – When the Peripheral Access Controller (PAC) protection is
enabled, writing to WAVE or WAVEB registers will not cause a
hardware exception.
Errata reference: 11468
Fix/Workaround:
None
12 – If the MCx flag in the INTFLAG register is set when enabling the
DMA, this will trigger an immediate DMA transfer and overwrite the
current buffered value in the TCC register.
Errata reference: 12155
Fix/Workaround:
None
40.1.3.14 PTC
1 – WCOMP interrupt flag is not stable. The WCOMP interrupt flag will
not always be set as described in the datasheet.
Errata reference: 12860
Fix/Workaround:
Do not use the WCOMP interrupt. Use the WCOMP event.
40.1.4
Die Revision D
40.1.4.1 Device
1 – In single shot mode and at 125°C, the ADC conversions have
linearity errors.
Errata reference: 13277
Fix/Workaround:
- Workaround 1: At 125°C, do not use the ADC in single shot mode; use the
ADC in free running mode only.
- Workaround 2: At 125°C, use the ADC in single shot mode only with
VDDANA > 3V.
2 – In the table ""NVM User Row Mapping"", the WDT Window bitfield
default value on silicon is not as specified in the datasheet. The
datasheet defines the default value as 0x5, while it is 0xB on silicon.
Errata reference: 13951
Fix/Workaround:
None.
3 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
4 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
5 – In I2C Slave mode, writing the CTRLB register when in the AMATCH
or DRDY interrupt service routines can cause the state machine to
reset.
Errata reference: 13574
Fix/Workaround:
Write CTRLB.ACKACT to 0 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Write CTRLB.ACKACT to 1 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Otherwise, only write to CTRLB in the AMATCH or DRDY interrupts if it is to
close out a transaction.
When not closing a transaction, clear the AMATCH interrupt by writing a 1 to
its bit position instead of using CTRLB.CMD. The DRDY interrupt is
automatically cleared by reading/writing to the DATA register in smart mode.
If not in smart mode, DRDY should be cleared by writing a 1 to its bit
position.
Code replacements examples:
Current:
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Current:
SERCOM - CTRLB.reg &= ~SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Current:
/* ACK or NACK address */
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_CMD(0x3);
Change to:
// CMD=0x3 clears all interrupts, so to keep the result similar,
// PREC is cleared if it was set.
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32-bit ARM-Based Microcontrollers
if (SERCOM - INTFLAG.bit.PREC) SERCOM - INTFLAG.reg =
SERCOM_I2CS_INTFLAG_PREC;
SERCOM - INTFLAG.reg = SERCOM_I2CS_INTFLAG_AMATCH;
6 – PA24 and PA25 cannot be used as input when configured as GPIO
with continuous sampling (cannot be read by PORT).
Errata reference: 12005
Fix/Workaround:
- Use PA24 and PA25 for peripherals or only as output pins.
- Or configure PA31 to PA24 for on-demand sampling (CTRL[31:24] all
zeroes) and access the IN register through the APB (not the IOBUS), to
allow waiting for on-demand sampling.
7 – Rx serializer in the RIGHT Data Slot Formatting Adjust mode
(SERCTRL.SLOTADJ clear) does not work when the slot size is not 32
bits.
Errata reference: 13411
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.SLOTADJ RIGHT must be used
with CLKCTRL.SLOTSIZE 32.
8 – The SYSTICK calibration value is incorrect.
Errata reference: 14154
Fix/Workaround:
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
9 – While the internal startup is not completed, PA07 pin is driven low
by the chip. Then as all the other pins it is configured as an High
Impedance pin.
Errata reference: 12118
Fix/Workaround:
None
10 – Pulldown functionality is not available on GPIO pin PA24 and PA25
Errata reference: 13883
Fix/Workaround:
None
11 – The voltage regulator in low power mode is not functional at
temperatures above 85C.
Errata reference: 12291
Fix/Workaround:
Enable normal mode on the voltage regulator in standby sleep mode.
Example code:
// Set the voltage regulator in normal mode configuration in standby sleep
mode
SYSCTRL->VREG.bit.RUNSTDBY = 1;
12 – If the external XOSC32K is broken, neither the external pin RST
nor the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
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32-bit ARM-Based Microcontrollers
Errata reference: 12164
Fix/Workaround:
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
40.1.4.2 DSU
1 – If a debugger has issued a DSU Cold-Plugging procedure and then
released the CPU from the resulting ""CPU Reset Extension"", the CPU
will be held in ""CPU Reset Extension"" after any upcoming reset
event.
Errata reference: 12015
Fix/workaround:
The CPU must be released from the ""CPU Reset Extension"" either by
writing a one in the DSU STATUSA.CRSTEXT register or by applying an
external reset with SWCLK high or by power cycling the device.
2 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
Do not use the ""Pause-on-Error"" feature.
40.1.4.3 PM
1 – In debug mode, if a watchdog reset occurs, the debug session is
lost.
Errata reference: 12196
Fix/Workaround:
A new debug session must be restart after a watchdog reset.
40.1.4.4 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.1.4.5 XOSC32K
1 – The automatic amplitude control of the XOSC32K does not work.
Errata reference: 10933
Fix/Workaround:
Use the XOSC32K with Automatic Amplitude control disabled
(XOSC32K.AAMPEN = 0)
40.1.4.6 FDPLL
1 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
40.1.4.7 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
Fix/Workaround:
Add a NOP instruction between each write to CRCDATAIN register.
40.1.4.8 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.1.4.9 NVMCTRL
1 – Default value of MANW in NVM.CTRLB is 0.
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32-bit ARM-Based Microcontrollers
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
2 – When external reset is active it causes a high leakage current on
VDDIO.
Errata reference: 13446
Fix/Workaround:
Minimize the time external reset is active.
3 – When the part is secured and EEPROM emulation area configured
to none, the CRC32 is not executed on the entire flash area but up to
the on-chip flash size minus half a row.
Errata reference: 11988
Fix/Workaround:
When using CRC32 on a protected device with EEPROM emulation area
configured to none, compute the reference CRC32 value to the full chip flash
size minus half row.
40.1.4.10 I2S
1 – I2S RX serializer in LSBIT mode (SERCTRL.BITREV set) only works
when the slot size is 32 bits.
Errata reference: 13320
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.BITREV LSBIT must be used with
CLKCTRL.SLOTSIZE 32.
40.1.4.11 SERCOM
1 – The I2C Slave SCL Low Extend Time-out (CTRLA.SEXTTOEN) and
Master SCL Low Extend Time-out (CTRLA.MEXTTOEN) cannot be used
if SCL Low Time-out (CTRLA.LOWTOUT) is disabled. When
SCTRLA.LOWTOUT=0, the GCLK_SERCOM_SLOW is not requested.
Errata reference: 12003
Fix/Workaround:
To use the Master or Slave SCL low extend time-outs, enable the SCL Low
Time-out (CTRLA.LOWTOUT=1).
2 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
3 – If the SERCOM is enabled in SPI mode with SSL detection enabled
(CTRLB.SSDE) and CTRLB.RXEN=1, an erroneous slave select low
interrupt (INTFLAG.SSL) can be generated.
Errata reference: 13369
Fix/Workaround:
Enable the SERCOM first with CTRLB.RXEN=0. In a subsequent write, set
CTRLB.RXEN=1.
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32-bit ARM-Based Microcontrollers
4 – In TWI master mode, an ongoing transaction should be stalled
immediately when DBGCTRL.DBGSTOP is set and the CPU enters
debug mode. Instead, it is stopped when the current byte transaction is
completed and the corresponding interrupt is triggered if enabled.
Errata reference: 12499
Fix/Workaround:
In TWI master mode, keep DBGCTRL.DBGSTOP=0 when in debug mode.
40.1.4.12 TC
1 – Spurious TC overflow and Match/Capture events may occur.
Errata reference: 13268
Fix/Workaround:
Do not use the TC overflow and Match/Capture events. Use the
corresponding Interrupts instead.
40.1.4.13 TCC
1 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
2 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
3 – In RAMP 2 mode with Fault keep, qualified and restart:
If a fault occurred at the end of the period during the qualified state, the
switch to the next ramp can have two restarts.
Errata reference: 13262
Fix/Workaround:
Avoid faults few cycles before the end or the beginning of a ramp.
4 – With blanking enabled, a recoverable fault that occurs during the
first increment of a rising TCC is not blanked.
Errata reference: 12519
Fix/Workaround:
None
5 – In Dual slope mode a Retrigger Event does not clear the TCC
counter.
Errata reference: 12354
Fix/Workaround:
None
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
6 – In two ramp mode, two events will be generated per cycle, one on
each ramp’s end. EVCTRL.CNTSEL.END cannot be used to identify the
end of a double ramp cycle.
Errata reference: 12224
Fix/Workaround:
None
7 – If an input event triggered STOP action is performed at the same
time as the counter overflows, the first pulse width of the subsequent
counter start can be altered with one prescaled clock cycle.
Errata reference: 12107
Fix/Workaround:
None
8 – When the RUNSTDBY bit is written after the TCC is enabled, the
respective TCC APB bus is stalled and the RUNDSTBY bit in the TCC
CTRLA register is not enabled-protected.
Errata reference: 12477
Fix/Workaround:
None.
9 – TCC fault filtering on inverted fault is not working.
Errata reference: 12512
Fix/Workaround:
Use only non-inverted faults.
10 – When waking up from the STANDBY power save mode, the
SYNCBUSY.CTRLB, SYNCBUSY.STATUS, SYNCBUSY.COUNT,
SYNCBUSY.PATT, SYNCBUSY.WAVE, SYNCBUSY.PER and
SYNCBUSY.CCx bits may be locked to 1.
Errata reference: 12227
Fix/Workaround:
After waking up from STANDBY power save mode, perform a software reset
of the TCC if you are using the SYNCBUSY.CTRLB, SYNCBUSY.STATUS,
SYNCBUSY.COUNT, SYNCBUSY.PATT, SYNCBUSY.WAVE,
SYNCBUSY.PER or SYNCBUSY.CCx bits
11 – When the Peripheral Access Controller (PAC) protection is
enabled, writing to WAVE or WAVEB registers will not cause a
hardware exception.
Errata reference: 11468
Fix/Workaround:
None
12 – If the MCx flag in the INTFLAG register is set when enabling the
DMA, this will trigger an immediate DMA transfer and overwrite the
current buffered value in the TCC register.
Errata reference: 12155
Fix/Workaround:
None
40.1.4.14 PTC
1 – WCOMP interrupt flag is not stable. The WCOMP interrupt flag will
not always be set as described in the datasheet.
Errata reference: 12860
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Fix/Workaround:
Do not use the WCOMP interrupt. Use the WCOMP event.
40.2
Device Variant B
The device variant (last letter of the ordering number) is independent of the die revision
(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks
evolution of the die.
40.2.1
Die Revision E
40.2.1.1 Device
1 – The SYSTICK calibration value is incorrect.
Errata reference: 14155
Fix/Workaround:
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
2 – Pulldown functionality is not available on GPIO pin PA24 and PA25
Errata reference: 15051
Fix/Workaround:
None
3 – The TCC interrupt flags
INTFLAG.ERR,INTFLAG.DFS,INTFLAG.UFS,INTFLAG.CNT,
INTFLAG.FAULTA,INTFLAG.FAULTB, INTFLAG.FAULT0,
INTFLAG.FAULT1 are not always properly set when using
asynchronous TCC features.
Errata reference: 15179
Fix/Workaround:
Do not use these flags when using asynchronous TCC features.
4 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
5 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
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6 – In I2C Slave mode, writing the CTRLB register when in the AMATCH
or DRDY interrupt service routines can cause the state machine to
reset.
Errata reference: 13574
Fix/Workaround:
Write CTRLB.ACKACT to 0 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Write CTRLB.ACKACT to 1 using the following sequence:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Otherwise, only write to CTRLB in the AMATCH or DRDY interrupts if it is to
close out a transaction.
When not closing a transaction, clear the AMATCH interrupt by writing a 1 to
its bit position instead of using CTRLB.CMD. The DRDY interrupt is
automatically cleared by reading/writing to the DATA register in smart mode.
If not in smart mode, DRDY should be cleared by writing a 1 to its bit
position.
Code replacements examples:
Current:
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = SERCOM_I2CS_CTRLB_ACKACT;
// Re-enable interrupts if applicable.
Current:
SERCOM - CTRLB.reg &= ~SERCOM_I2CS_CTRLB_ACKACT;
Change to:
// If higher priority interrupts exist, then disable so that the
// following two writes are atomic.
SERCOM - STATUS.reg = 0;
SERCOM - CTRLB.reg = 0;
// Re-enable interrupts if applicable.
Current:
/* ACK or NACK address */
SERCOM - CTRLB.reg |= SERCOM_I2CS_CTRLB_CMD(0x3);
Change to:
// CMD=0x3 clears all interrupts, so to keep the result similar,
// PREC is cleared if it was set.
if (SERCOM - INTFLAG.bit.PREC) SERCOM - INTFLAG.reg =
SERCOM_I2CS_INTFLAG_PREC;
SERCOM - INTFLAG.reg = SERCOM_I2CS_INTFLAG_AMATCH;
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7 – If the external XOSC32K is broken, neither the external pin RST nor
the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
Errata reference: 12164
Fix/Workaround:
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
40.2.1.2 DSU
1 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
Do not use the ""Pause-on-Error"" feature.
40.2.1.3 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.2.1.4 FDPLL
1 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
40.2.1.5 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
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32-bit ARM-Based Microcontrollers
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
Fix/Workaround:
Add a NOP instruction between each write to CRCDATAIN register.
40.2.1.6 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.2.1.7 NVMCTRL
1 – The NVMCTRL.INTFLAG.READY bit is not updated after a
RWWEEER command and will keep holding a 1 value. If a new
RWWEEER command is issued it can be accepted even if the previous
RWWEEER command is ongoing. The ongoing NVM RWWEER will be
aborted, the content of the row under erase will be unpredictable.
Errata reference: 13588
Fix/Workaround:
Perform a dummy write to the page buffer right before issuing a RWWEEER
command. This will make the INTFLAG.READY bit behave as expected.
2 – Default value of MANW in NVM.CTRLB is 0.
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
3 – When external reset is active it causes a high leakage current on
VDDIO.
Errata reference: 13446
Fix/Workaround:
Minimize the time external reset is active.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 903
32-bit ARM-Based Microcontrollers
40.2.1.8 I2S
1 – I2S RX serializer in LSBIT mode (SERCTRL.BITREV set) only works
when the slot size is 32 bits.
Errata reference: 13320
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.BITREV LSBIT must be used with
CLKCTRL.SLOTSIZE 32.
40.2.1.9 SERCOM
1 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
2 – If the SERCOM is enabled in SPI mode with SSL detection enabled
(CTRLB.SSDE) and CTRLB.RXEN=1, an erroneous slave select low
interrupt (INTFLAG.SSL) can be generated.
Errata reference: 13369
Fix/Workaround:
Enable the SERCOM first with CTRLB.RXEN=0. In a subsequent write, set
CTRLB.RXEN=1.
40.2.1.10 TCC
1 – When a capture is done using PWP or PPW mode, CC0 and CC1 are
always fill with the period. It is not possible to get the pulse width.
Errata reference: 14475
Fix/Workaround:
Use the PWP feature on TC instead of TCC
2 – FCTRLX.CAPTURE[CAPTMARK] does not work as described in the
datasheet. CAPTMARK cannot be used to identify captured values
triggered by fault inputs source A or B on the same channel.
Errata reference: 13316
Fix/Workaround:
Use two different channels to timestamp FaultA and FaultB.
3 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
4 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 904
32-bit ARM-Based Microcontrollers
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
5 – In RAMP 2 mode with Fault keep, qualified and restart:
If a fault occurred at the end of the period during the qualified state, the
switch to the next ramp can have two restarts.
Errata reference: 13262
Fix/Workaround:
Avoid faults few cycles before the end or the beginning of a ramp.
40.2.2
Die Revision F
40.2.2.1 Device
1 – The SYSTICK calibration value is incorrect.
Errata reference: 14155
Fix/Workaround:
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
2 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
3 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
4 – If the external XOSC32K is broken, neither the external pin RST nor
the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
Errata reference: 12164
Fix/Workaround:
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
40.2.2.2 DSU
1 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 905
32-bit ARM-Based Microcontrollers
Do not use the ""Pause-on-Error"" feature.
40.2.2.3 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.2.2.4 FDPLL
1 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
40.2.2.5 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
Fix/Workaround:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 906
32-bit ARM-Based Microcontrollers
Add a NOP instruction between each write to CRCDATAIN register.
40.2.2.6 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.2.2.7 NVMCTRL
1 – Default value of MANW in NVM.CTRLB is 0.
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
40.2.2.8 I2S
1 – I2S RX serializer in LSBIT mode (SERCTRL.BITREV set) only works
when the slot size is 32 bits.
Errata reference: 13320
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.BITREV LSBIT must be used with
CLKCTRL.SLOTSIZE 32.
40.2.2.9 SERCOM
1 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
40.2.2.10 TCC
1 – FCTRLX.CAPTURE[CAPTMARK] does not work as described in the
datasheet. CAPTMARK cannot be used to identify captured values
triggered by fault inputs source A or B on the same channel.
Errata reference: 13316
Fix/Workaround:
Use two different channels to timestamp FaultA and FaultB.
2 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 907
32-bit ARM-Based Microcontrollers
3 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
40.3
Device Variant C
The device variant (last letter of the ordering number) is independent of the die revision
(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks
evolution of the die.
40.3.1
Die Revision F
40.3.1.1 Device
1 – The SYSTICK calibration value is incorrect.
Errata reference: 14155
Fix/Workaround:
The correct SYSTICK calibration value is 0x40000000. This value should not
be used to initialize the Systick RELOAD value register, which should be
initialized instead with a value depending on the main clock frequency and
on the tick period required by the application. For a detailed description of
the SYSTICK module, refer to the official ARM Cortex-M0+ documentation.
2 – On pin PA24 and PA25 the pull-up and pull-down configuration is
not disabled automatically when alternative pin function is enabled
except for USB.
Errata reference: 12368
Fix/Workaround:
For pin PA24 and PA25, the GPIO pull-up and pull-down must be disabled
before enabling alternative functions on them.
3 – If APB clock is stopped and GCLK clock is running, APB read
access to read-synchronized registers will freeze the system. The CPU
and the DAP AHB-AP are stalled, as a consequence debug operation is
impossible.
Errata reference: 10416
Fix/Workaround:
Do not make read access to read-synchronized registers when APB clock is
stopped and GCLK is running. To recover from this situation, power cycle the
device or reset the device using the RESETN pin.
4 – If the external XOSC32K is broken, neither the external pin RST nor
the GCLK software reset can reset the GCLK generators using
XOSC32K as source clock.
Errata reference: 12164
Fix/Workaround:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 908
32-bit ARM-Based Microcontrollers
Do a power cycle to reset the GCLK generators after an external XOSC32K
failure.
40.3.1.2 DSU
1 – The MBIST ""Pause-on-Error"" feature is not functional on this
device.
Errata reference: 14324
Fix/Workaround:
Do not use the ""Pause-on-Error"" feature.
40.3.1.3 DFLL48M
1 – The DFLL clock must be requested before being configured
otherwise a write access to a DFLL register can freeze the device.
Errata reference: 9905
Fix/Workaround:
Write a zero to the DFLL ONDEMAND bit in the DFLLCTRL register before
configuring the DFLL module.
2 – The DFLL status bits in the PCLKSR register during the USB clock
recovery mode can be wrong after a USB suspend state.
Errata reference: 11938
Fix/Workaround:
Do not monitor the DFLL status bits in the PCLKSR register during the USB
clock recovery mode.
3 – If the DFLL48M reaches the maximum or minimum COARSE or
FINE calibration values during the locking sequence, an out of bounds
interrupt will be generated. These interrupts will be generated even if
the final calibration values at DFLL48M lock are not at maximum or
minimum, and might therefore be false out of bounds interrupts.
Errata reference: 10669
Fix/Workaround:
Check that the lockbits: DFLLLCKC and DFLLLCKF in the SYSCTRL
Interrupt Flag Status and Clear register (INTFLAG) are both set before
enabling the DFLLOOB interrupt.
40.3.1.4 FDPLL
1 – When changing on-the-fly the FDPLL ratio in DPLLnRATIO register,
STATUS.DPLLnLDRTO will not be set when the ratio update will be
completed.
Errata reference: 15753
Fix/Workaround:
Wait for the interruption flag INTFLAG.DPLLnLDRTO instead.
40.3.1.5 DMAC
1 – When at least one channel using linked descriptors is already
active, enabling another DMA channel (with or without linked
descriptors) can result in a channel Fetch Error (FERR) or an incorrect
descriptor fetch.
This happens if the channel number of the channel being enabled is
lower than the channel already active.
Errata reference: 15683
Fix/Workaround:
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 909
32-bit ARM-Based Microcontrollers
When enabling a DMA channel while other channels using linked descriptors
are already active, the channel number of the new channel enabled must be
greater than the other channel numbers.
2 – If data is written to CRCDATAIN in two consecutive instructions, the
CRC computation may be incorrect.
Errata reference: 13507
Fix/Workaround:
Add a NOP instruction between each write to CRCDATAIN register.
40.3.1.6 EIC
1 – When the EIC is configured to generate an interrupt on a low level
or rising edge or both edges (CONFIGn.SENSEx) with the filter enabled
(CONFIGn.FILTENx), a spurious flag might appear for the dedicated pin
on the INTFLAG.EXTINT[x] register as soon as the EIC is enabled using
CTRLA ENABLE bit.
Errata reference: 15341
Fix/Workaround:
Clear the INTFLAG bit once the EIC enabled and before enabling the
interrupts.
40.3.1.7 NVMCTRL
1 – Default value of MANW in NVM.CTRLB is 0.
This can lead to spurious writes to the NVM if a data write is done
through a pointer with a wrong address corresponding to NVM area.
Errata reference: 13134
Fix/Workaround:
Set MANW in the NVM.CTRLB to 1 at startup
40.3.1.8 I2S
1 – I2S RX serializer in LSBIT mode (SERCTRL.BITREV set) only works
when the slot size is 32 bits.
Errata reference: 13320
Fix/Workaround:
In SERCTRL.SERMODE RX, SERCTRL.BITREV LSBIT must be used with
CLKCTRL.SLOTSIZE 32.
40.3.1.9 SERCOM
1 – In USART autobaud mode, missing stop bits are not recognized as
inconsistent sync (ISF) or framing (FERR) errors.
Errata reference: 13852
Fix/Workaround:
None
40.3.1.10 TCC
1 – FCTRLX.CAPTURE[CAPTMARK] does not work as described in the
datasheet. CAPTMARK cannot be used to identify captured values
triggered by fault inputs source A or B on the same channel.
Errata reference: 13316
Fix/Workaround:
Use two different channels to timestamp FaultA and FaultB.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 910
32-bit ARM-Based Microcontrollers
2 – Using TCC in dithering mode with external retrigger events can lead
to unexpected stretch of right aligned pulses, or shrink of left aligned
pulses.
Errata reference: 15625
Fix/Workaround:
Do not use retrigger events/actions when TCC is configured in dithering
mode.
3 – Advance capture mode (CAPTMIN CAPTMAX LOCMIN LOCMAX
DERIV0) doesn’t work if an upper channel is not in one of these mode.
Example: when CC[0]=CAPTMIN, CC[1]=CAPTMAX, CC[2]=CAPTEN,
and CC[3]=CAPTEN, CAPTMIN and CAPTMAX won’t work.
Errata reference: 14817
Fix/Workaround:
Basic capture mode must be set in lower channel and advance capture
mode in upper channel.
Example: CC[0]=CAPTEN , CC[1]=CAPTEN , CC[2]=CAPTMIN,
CC[3]=CAPTMAX
All capture will be done as expected.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 911
32-bit ARM-Based Microcontrollers
41.
Conventions
41.1
Numerical Notation
Table 41-1. Numerical Notation
41.2
Symbol
Description
165
Decimal number
0b0101
Binary number (example 0b0101 = 5 decimal)
'0101'
Binary numbers are given without prefix if
unambiguous.
0x3B24
Hexadecimal number
X
Represents an unknown or don't care value
Z
Represents a high-impedance (floating) state for
either a signal or a bus
Memory Size and Type
Table 41-2. Memory Size and Bit Rate
41.3
Symbol
Description
KB (kbyte)
kilobyte (210 = 1024)
MB (Mbyte)
megabyte (220 = 1024*1024)
GB (Gbyte)
gigabyte (230 = 1024*1024*1024)
b
bit (binary '0' or '1')
B
byte (8 bits)
1kbit/s
1,000 bit/s rate (not 1,024 bit/s)
1Mbit/s
1,000,000 bit/s rate
1Gbit/s
1,000,000,000 bit/s rate
word
32 bit
half-word
16 bit
Frequency and Time
Symbol
Description
kHz
1kHz = 103Hz = 1,000Hz
KHz
1KHz = 1,024Hz, 32KHz = 32,768Hz
MHz
106 = 1,000,000Hz
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 912
32-bit ARM-Based Microcontrollers
41.4
Symbol
Description
GHz
109 = 1,000,000,000Hz
s
second
ms
millisecond
µs
microsecond
ns
nanosecond
Registers and Bits
Table 41-3. Register and Bit Mnemonics
Symbol
Description
R/W
Read/Write accessible register bit. The user can read from and write to this bit.
R
Read-only accessible register bit. The user can only read this bit. Writes will be
ignored.
W
Write-only accessible register bit. The user can only write this bit. Reading this bit will
return an undefined value.
BIT
Bit names are shown in uppercase. (Example ENABLE)
FIELD[n:m]
A set of bits from bit n down to m. (Example: PINA[3:0] = {PINA3, PINA2, PINA1,
PINA0}
Reserved
Reserved bits are unused and reserved for future use. For compatibility with future
devices, always write reserved bits to zero when the register is written. Reserved bits
will always return zero when read.
PERIPHERALi If several instances of a peripheral exist, the peripheral name is followed by a number
to indicate the number of the instance in the range 0-n. PERIPHERAL0 denotes one
specific instance.
Reset
Value of a register after a power reset. This is also the value of registers in a peripheral
after performing a software reset of the peripheral, except for the Debug Control
registers.
SET/CLR
Registers with SET/CLR suffix allows the user to clear and set bits in a register without
doing a read-modify-write operation. These registers always come in pairs. Writing a
one to a bit in the CLR register will clear the corresponding bit in both registers, while
writing a one to a bit in the SET register will set the corresponding bit in both registers.
Both registers will return the same value when read. If both registers are written
simultaneously, the write to the CLR register will take precedence.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 913
32-bit ARM-Based Microcontrollers
42.
Acronyms and Abbreviations
The below table contains acronyms and abbreviations used in this document.
Table 42-1. Acronyms and Abbreviations
Abbreviation
Description
AC
Analog Comparator
ADC
Analog-to-Digital Converter
ADDR
Address
AES
Advanced Encryption Standard
AHB
AMBA Advanced High-performance Bus
®
AMBA
Advanced Microcontroller Bus Architecture
APB
AMBA Advanced Peripheral Bus
AREF
Analog reference voltage
BLB
Boot Lock Bit
BOD
Brown-out detector
CAL
Calibration
CC
Compare/Capture
CCL
Configurable Custom Logic
CLK
Clock
CRC
Cyclic Redundancy Check
CTRL
Control
DAC
Digital-to-Analog Converter
DAP
Debug Access Port
DFLL
Digital Frequency Locked Loop
DMAC
DMA (Direct Memory Access) Controller
DSU
Device Service Unit
EEPROM
Electrically Erasable Programmable Read-Only Memory
EIC
External Interrupt Controller
EVSYS
Event System
GCLK
Generic Clock Controller
GND
Ground
GPIO
General Purpose Input/Output
I2C
Inter-Integrated Circuit
IF
Interrupt flag
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 914
32-bit ARM-Based Microcontrollers
Abbreviation
Description
INT
Interrupt
MBIST
Memory built-in self-test
MEM-AP
Memory Access Port
MTB
Micro Trace Buffer
NMI
Non-maskable interrupt
NVIC
Nested Vector Interrupt Controller
NVM
Non-Volatile Memory
NVMCTRL
Non-Volatile Memory Controller
OSC
Oscillator
PAC
Peripheral Access Controller
PC
Program Counter
PER
Period
PM
Power Manager
POR
Power-on reset
PORT
I/O Pin Controller
PTC
Peripheral Touch Controller
PWM
Pulse Width Modulation
RAM
Random-Access Memory
REF
Reference
RTC
Real-Time Counter
RX
Receiver/Receive
SERCOM
™
Serial Communication Interface
SMBus
System Management Bus
SP
Stack Pointer
SPI
Serial Peripheral Interface
SRAM
Static Random-Access Memory
SUPC
Supply Controller
SWD
Serial Wire Debug
TC
Timer/Counter
TCC
Timer/Counter for Control Applications
TRNG
True Random Number Generator
TX
Transmitter/Transmit
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 915
32-bit ARM-Based Microcontrollers
Abbreviation
Description
ULP
Ultra-low power
USART
Universal Synchronous and Asynchronous Serial Receiver and Transmitter
USB
Universal Serial Bus
VDD
Common voltage to be applied to VDDIO, VDDIN and VDDANA
VDDIN
Digital supply voltage
VDDIO
Digital supply voltage
VDDANA
Analog supply voltage
VREF
Voltage reference
WDT
Watchdog Timer
XOSC
Crystal Oscillator
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 916
32-bit ARM-Based Microcontrollers
43.
Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The referring
revision in this section are referring to the document revision.
43.1
Rev. A – 01/2017
General
•
•
•
•
Template: Updated from Atmel to Microchip template.
Document number: Changed from the Atmel 42181 to Microchip xxxxx.
Document revision letter reset to A.
ISBN number added.
Electrical
Characteristics
•
•
Die Revision F final characterization added.
Power Consumption: Added Standby typical numbers for Device Variant C /
Die Revision F.
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics: Added
characterization data for Device Variant C / Die Revision F.
•
43.2
Errata
•
New errata added:
– B
– Device Variant A: Errata reverence 15625, 15683, 15753 added.
– Device Variant B: Errata reverence 15625, 15683, 15753 added.
– Device Variant C: Errata reverence 15625, 15683, 15753 added.
Appendix A.
Electrical
Characteristics at
125°C
•
•
Die Revision F final characterization is preliminary.
Power Consumption: Added Standby typical numbers for Device Variant C /
Die Revision F.
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics: Added
characterization data for Device Variant C / Die Revision F.
•
Rev. O – 12/2016
General
•
Introduced Device Variant C.
Electrical
Characteristics
•
•
Die Revision F characterization is preliminary.
Power Consumption: Added Standby typical numbers for Device Variant
C / Die Revision F.
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics:
Added characterization data for Device Variant C / Die Revision F.
•
Appendix A. Electrical
Characteristics at
125°C
•
•
•
© 2017 Microchip Technology Inc.
Die Revision F characterization is preliminary.
Power Consumption: Added Standby typical numbers for Device Variant
C / Die Revision F.
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics:
Added characterization data for Device Variant C / Die Revision F.
Datasheet Complete
40001882A-page 917
32-bit ARM-Based Microcontrollers
43.3
43.4
Rev. N – 10/2016
I/O Multiplexing and
Considerations
•
Multiplexed Signals: Updated table note 6 with information on
PA24 and PA25.
Memories
•
NVM User Row Mapping: Added BOOTPROT default value for
WLCSP.
TC – Timer/Counter
•
•
Clocks: Corrected TC instance numbers.
Counter Mode: Corrected TC instance numbers.
Electrical Characteristics
•
Normal I/O Pins: Added condition to Pull-up - Pull-down
resistance.
Rev. M – 09/2016
Configuration
Summary
•
Added information on number of pins for the SAM D21G WLCSP pakcage
option. SAM D21G is offered in 48 pin packages, while the WLCSP has 45
pins.
Ordering
Information
•
Added information to the pin count explanation. For the The G letter indicates
48 pin packages, while the WLCSP option is 45 pins.
ATSAMD21E18A-MFUT corrected to ATSAMD21E18A-MFT.
Device Identification:
– Removed C variants.
– Added device identification values for the devices in WLCSP packages.
These have separate device id's compared to the other package
options.
•
•
WDT – Watchdog
Timer
43.5
•
Debug Operation: Removed the sentence "This peripheral can be forced to
continue operation during debugging." The WDT can not be forced to
continue operation in debug mode.
Rev. L – 09/2016
Configuration Summary
•
Added information on number of pins for the WLCSP pakcage. SAM
D21E is offered in 32 pin packages, while the WLCSP has 35 pins.
DSU - Device Service Unit
•
Testing of On-Board Memories MBIST: Updated description.
Clock System
•
Disabling a Peripheral: New section added.
SYSCTRL – System
Controller
•
XOSC.AMPGC bit description updated.
EIC – External Interrupt
Controller
•
Interrupts: Added note explaining how it works when the same
external interrupt (EXTINT) is common on sevral pins.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 918
32-bit ARM-Based Microcontrollers
EVSYS – Event System
•
CTRL.SWRST: Added recommendation when doing a software
reset.
SERCOM I2C – SERCOM
Inter-Integrated Circuit
•
Corrected cross references in the Master CTRLA.SCLSM and Slave
CTRLASCLSM bits.
TCC – Timer/Counter for
Control Applications
•
Value 0 in CAPTMIN mode is captured only in down-counting mode.
ADC – Analog-to-Digital
Converter
•
Differential and Single-Ended Conversions: Corrected register
reference from INPUTCTRL.DIFFMODE to CTRLB.DIFFMODE.
RESULT: Corrected description. Reference to "single-ended mode"
corrected to "single conversion mode".
•
Electrical Characteristics
•
•
•
43.6
Absolute Maximum Ratings: Add ESD warnings.
I2S Timing: fM_SCKO and fM_SCKI values for VDD=1.8V moved from
the minimum to maximum column.
XOSC32K Crystal Oscillator Characteristics: Removed conditions
from the parasitic capacitor loads CXIN32 and CXOUT32. The
difference between package types is so small that it can be ingored.
Schematic Checklist
•
External Real Time Oscillator: Added note on how to minimize jitter.
Appendix A. Electrical
Characteristics at 125°C
•
Maximum Clock Frequencies: Corrected heading of Table 44-7 say
"Device Variant B".
Rev. K – 09/2016
Ordering Information
•
•
SAM D21E: Added Device Variant C ordering codes.
Device Identification: Added Device Variant C to Table 3-8.
I/O Multiplexing and
Considerations
•
The section is reorgnaized:
– SERCOM I2C Pins: Replaces the "Type" column in Multiplexed
Signals.
– GPIO Clusters: Moved from Absolute Maximum Ratings.
– TCC Configurations: Moved from the TCC Overview.
PM – Power Manager
•
APBCMASK updated.
DSU - Device Service
Unit
•
System Services Availability when Accessed Externally: MBIST not
available when device is operated from external address range and
device is protected.
RTC – Real-Time
Counter
•
Clock/Calendar (Mode 2): Example added on how the clock counter
works in calendar mode.
TC – Timer/Counter
•
CTRLA.WAVEGEN[1:0]: Name column updated.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 919
32-bit ARM-Based Microcontrollers
TCC – Timer/Counter for
Control Applications
•
Non-Recoverable Faults: Removed references to Update Fault State
(UFS).
Removed the UFS bit from the INTENCLR, INTENSET, INTFLAG and
STATUS registers.
Removed RAMP2C from the WAVE.WAVE[2:0]=0x3
•
•
Electrical Characteristics
•
•
Absolute Maximum Ratings: Updated VPIN minimum and maximum
values. (Related to the new Injection Current definition section)
Supply Characteristics: Corrected supply rise rates units from V/s to V/
μs.
Power Consumption: Added power consumption numbers for Device
Variant C.
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics:
Added characterization data for Device Variant C.
Added Injection Current section.
Packaging Information
•
Added 35 ball WLCSP (Device Variant C) package outline drawing.
Errata
•
Added errata for Device Variant C.
Appendix A. Electrical
Characteristics at 125°C
•
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics:
Added characterization data for Device Variant C.
Absolute Maximum Ratings: Updated VPIN minimum and maximum
values. (Related to the new Injection Current definition section)
•
•
•
•
43.7
Rev. J – 07/2016
Ordering Information
•
SAM D21E: Added ATSAMD21E15B-UUT.
TC – Timer/Counter
•
EVCTRL:EVACT[2:0] bit description updated: Time stamp capture and
pusle width capture removed
TCC – Timer/Counter for
Control Applications
•
•
Additional Features: Removed "Time-Stamp Capture" section.
EVCTRL:EVACT0[2:0] bit description updated: "Capture Overflow
times (Max value)" option removed (Related to Time-Stamp Capture).
Errata
•
Cleaned up errata section: Split between device variant A and B.
.
43.8
Rev. I – 03/2016
Configuration Summary
Updated value for Waveform output channels per TCC to 8/4/2.
I/O Multiplexing and Considerations
Added Note.6 for Table 7-1
Memories
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 920
32-bit ARM-Based Microcontrollers
Table 10-1: Updated start address in Internal RWW section to from 0x00010000 to
0x00400000.
NVMCTRL – Non-Volatile Memory Controller
Updated value from "NVM Base Address + 0x00010000" to "NVM Base Address +
0x00400000"in Figure 22-3
SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiver and Transmitter
Updated equation and added error calculation explained w/example in section
Asynchronous Operational Range
TCC – Timer/Counter for Control Applications:
Register Summary: Remove INTENCLR.SYNCRDY. Add MC0 (located in bit 0) for
INTENSET and INTFLAG, and left shift MC1, MC2 and MC3 for one bit. Therefore,
MC0/1/2/3 are located in bit 0/1/2/3.
Electrical Characteristics
Updated unit from 's' to 'us' in the following tables:
•
•
•
•
•
•
•
•
•
•
•
•
Table 44-11
Table 44-12
Table 44-24
Table 44-25
Table 44-38
Table 44-39
Table 44-40
Table 44-41
Table 44-46
Table 44-47
Table 44-48
Table 44-49
Update value and condition for Table 44-40 and Table 44-41
Packaging Information
Updated section 32 pin QFN.
43.9
Rev. H – 01/2016
DMAC – Direct Memory Access Controller
Updated bit description of the PRICTRL0.LVLPRIn [n=3..0].
NVMCTRL – Non-Volatile Memory Controller
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 921
32-bit ARM-Based Microcontrollers
Updated description in NVM Write: Removed reference to default NWM CTRLB.MANW
default value.
Updated reset value for CTRLB.MANW from 0 to 1. Note that this change is only
applicable for Device Variant B. Device Variant A will continue to have MANW bit reset
value 0.
Updated reset value of the CTRLB register from 0x00000000 to 0x00000080.
Note that this change is change is only applicable for Device Variant B. Device Variant A
will continue to have CTRLB register reset value 0x00000000.
DSU - Device Service Unit
Bit CTRL.CRC is write-only.
USB – Universal Serial Bus:
Register HSOFC.FLENCE description updated.
USB Device Registers - Common: Bit description of CTRLB.SPDCONF[1:0] updated.
Packaging Information
Updated values in Thermal Resistance Data.
Corrected junction temperature equations: TC updated to TJ.
Updated package drawing for 35 ball WLCSP (Device Variant B): GPC corrected from
GJP to GJR. No other changes.
Schematic Checklist
Added Operation in Noisy Environment.
Updated section Programming and Debug Ports.
Updated recommended pin connection in 10-pin JTAGICE3 Compatible Serial Wire Debug
Interface: Pull-up resistor value on SWCLK pin changed from 10kΩ to 1kΩ.
VDDCORE decoupling capacitor value updated from 100nF to 1μF in Power Supply
Connections
43.10
Rev. G – 09/2015
SYSCTRL – System Controller:
Updated description in Drift Compensation.
Electrical Characteristics:
Removed note from Table 37-51 and Table 37-52.
Packaging Information:
Package drawing updated 45-ball WLCSP.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 922
32-bit ARM-Based Microcontrollers
Appendix A. Electrical Characteristics at 125°C:
Removed note from:Table 44-40 and Table 44-41.
Updated power consumption units in Table 44-8.
43.11
Rev. F – 07/2015
Ordering Information
Added ATSAMD21E15B-UUT and ATSAMD21E16B-UUT ordering codes (WLCSP35
package option).
Block Diagram
Updated system block diagram.
Pinout
Added pinout figure for WLCSP35.
Product Mapping
Updated Internal RWW section to start address from 0x00010000 to 0x00400000.
ADC – Analog-to-Digital Converter
References to AREFA and AREFB replaced with VREFA and VREFB respectively.
Electrical Characteristics
Added GPIO cluster note to 'Absolute Maximum Ratings.
Added I2S Timing.
Updated BOD33 characteristics.
Added characterization data for Device Variant B.
Packaging Information
Updated ΘJC value from 3.1 to 15.0 °C/W for 32-pin QFN package in Thermal Resistance
Data.
Added package drawing for 35 ball WLCSP (Device Variant B).
Schematic Checklist
Power Supply Connections:
VDDCORE decoupling capacitor value updated from 100nF to 1μF.
References to AREFA and AREFB replaced with VREFA and VREFB respectively.
Appendix A. Electrical Characteristics at 125°C
Added I2S Timing.
Updated BOD33 characteristics.
Added characterization data for Device Variant B.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 923
32-bit ARM-Based Microcontrollers
43.12
Rev. E – 02/2015
Description:
CoreMark score updated from 2.14 to 2.46 CoreMark/MHz.
Ordering Information:
Added Ordering codes for Device Variant B.
Added 125°C ordering codes for QFN and TQFP package options: SAM D21E, SAM
D21G and SAM D21J.
Added WLCSP package option for SAM D21G.
Added UFBGA package option for SAM D21J.
Pinout:
Added pinout figures for UFBGA64 and WLCSP45.
Product Mapping:
Updated Product Mapping figure with Internal RWW section block for Device Variant B.
Memories:
Physical Memory Map: Added start address for Internal Read While Write (RWW) section
for Device Variant B.
Processor And Architecture:
Cortex M0+ Configuration: Removed green connection dots between DMAC Data and
AHB-APB Bridge A and Bridge B.
NVMCTRL – Non-Volatile Memory Controller:
Introducing Read While Write (RWW) feature for Device Variant B.
Updated and New sections:
Overview
Features
Block Diagram
NVM Read
RWWEE Read
NVM Write
Erase Row
Memory Organization: Figure 22-2 updated.
Register Summary and Register Description: PARAM: Added RWWEEP[12:0] bits for
Device Variant B.
PORT - I/O Pin Controller:
© 2017 Microchip Technology Inc.
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40001882A-page 924
32-bit ARM-Based Microcontrollers
I/O Pin Configuration: Removed reference to “open-drain”.
Access for DRVSTR bit in Pin Configuration n register (PINCFGn.DRVCTR) updated from
W to R/W.
SYSCTRL – System Controller:
Removed references to XOSC32K and OSC32 1kHz clock output option:
- XOSC32K: 32kHz External Crystal Oscillator (XOSC32K) Operation
- OSC32K: 32kHz Internal Oscillator (OSC32K) Operation
1kHz Output Enable (EN1K) bit set as reserved bit:
- Bit 4 in XOSC32K
- Bit 3 in OSC32K
Electrical Characteristics:
Brown-Out Detectors Characteristics: Added Figure 37-3 and Figure 37-4 and updated
conditions in Table 37-20 and Table 37-21.
Packaging Information:
Added 64-ball UFBGA and 45-ball WLCSP package drawings.
Schematic Checklist
Updated description in Unused or Unconnected Pins.
Errata:
Device Variant A:
- Updated errata for revision A: Added Errata Reference 12291, 13507, 13574.
- Updated errata for revision B: Added Errata Reference 12291, 13507, 13574.
- Updated errata for revision C: Added Errata Reference 12291, 13507, 13574, 13951.
- Added errata for revision D.
Device Variant B:
- Added errata for revision E (Only available for SAMD21x15/16).
Appendix A. Electrical Characteristics at 125°C:
Electrical characteristics for 125°C added.
43.13
Rev. D – 09/2014
Block Diagram
NVM Controller bus connection changed from Master to Slave.
Clock System
Register Synchronization updated by splitting the section into Common Synchronizer
Register Synchronization and Distributed Synchronizer Register Synchronization.
Electrical Characteristics
© 2017 Microchip Technology Inc.
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40001882A-page 925
32-bit ARM-Based Microcontrollers
Analog-to-Digital (ADC) characteristics: Added note defining gain accuracy parameter in:
- ADC Differential Mode, Table 37-23
- ADC Single-Ended Mode, Table 37-25
Errata
Updated errata for revision A, B and C: Added Errata Reference 13140, 12860.
43.14
Rev. C – 07/2014
Electrical Characteristics
Updated condition for Rise time for both SDA and SCL (tR) in High Speed Mode: Cb
changed from 1000pF to 100pF in Table 37-15.
Errata
Errata for revision C and E added.
43.15
Rev. B – 07/2014
General:
Introduced the new product family name: Atmel | SMART
Removed references to Clock Failure Detection.
Sub sections within chapters might been moved to other location within the chapter.
Typo corrections.
Configuration Summary
Added 32KB Flash and 4KB SRAM options to SAM D21J and SAM D21G.
Ordering Information
Added Tray to Carrier Type option for SAM D21E, SAMD 21G and SAMD21J ordering codes.
I/O Multiplexing and Considerations:
Updated REF function on PA03 and PA04 in Table 7-1:
PA03: DAC/VREFP changed to DAC/VREFA.
PA04: ADC VREFP changed to ADC/VREFB.
Updated COM function on PA30 and PA31:
PA30: CORTEX_M0P/SWCLK changed to SWCKL.
PA31: Added SWDIO.
Memories
Added a second note to Table 10-2.
Added Figure 10-1 Calibration and Auxiliary Space.
Added default values for fuses in Table 10-4 NVM User Row Mapping.
Processor And Architecture
© 2017 Microchip Technology Inc.
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40001882A-page 926
32-bit ARM-Based Microcontrollers
MTB renamed from “Memory Trace Buffer” to “Micro Trace Buffer”.
DSU - Device Service Unit
Updated description of Starting CRC32 Calculation.
Updated title of Table 13-6.
Added Device Selection table to Device Selection bit description the Device Identification register
(DID.DEVSEL).
GCLK - Generic Clock Controller
Signal names updated in Device Clocking Diagram, Block Diagram.
PM – Power Manager
Added figure Figure 16-2.
Register Summary:
Removed CFD bit from INTENCLR, INTENSET and INTFLAG.
Added PTC bit to APBCMASK register.
Register Description:
AHB Mask register (AHBMASK): Full bit names updated.
APBC Mask register (APBCMASK.PTC): Added PTC to bit 19.
CFD bit removed from INTENCLR, INTENSET and INTFLAG.
SYSCTRL – System Controller
Updated description of 8MHz Internal Oscillator (OSC8M) Operation.
FDPLL96M section reorganized and more integrated in the SYSCTRL chapter: Features, Signal
Description and Product Dependencies sub sections removed and integrated with the corresponding
sections in SYSCTRL.
Register Summary: Added VREG register on address 0x3C - 0x3D.
Register Description:
Updated reset values in OSC8M.
Updated CALIB[11:0] bit description in OSC8M.
Updated LBYPASS bit description in DPLLCTRLB.
WDT – Watchdog Timer
Updated description in Principle of Operation: Introducing the bits used in Table 18-1.
Updated description in Initialization.
Updated description in Normal Mode.
Updated description in Window Mode.
Updated description in Interrupts.
WEN bit description in the Control register (CTRL.WEN) updated with information on enable-protection.
RTC – Real-Time Counter
© 2017 Microchip Technology Inc.
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40001882A-page 927
32-bit ARM-Based Microcontrollers
Periodic Events: Bit names updated fro, PERx to PEREOx in example, Figure 19-4.
CLOCK.HOUR[4:0]: Updated Table 19-4
Mode 0 and Mode 2: CMPx bit renamed to CMP0 since only one CMP0 is available.
Bit description of CLOCK.HOUR[4:0]: Updated Table 19-4
ALARMn register renamed to ALARM0.
DMAC – Direct Memory Access Controller
Updated block diagram, Block Diagram.
General updated description.
EIC – External Interrupt Controller
Register Summary and Register Description:
EVCTRL register: Added bits EXTINTO17 and EXTINTO16 in bit position 17 and 16 respectively.
INTENCLR, INTENSET, INTENFLAG registers: Added bits EXTINT17 and EXTINT16 in bit position 17
and 16 respectively.
WAKEUP register: Added bits WAKEUPEN17 and WAKEUPEN16 in bit position 17 and 16 respectively.
CONFIG2 register added, CONFIG0 and CONFIG1 registers updated: Added bits FILTEN0...31 and
SENSE0...31.
NVMCTRL – Non-Volatile Memory Controller
CTRLB register: Removed table from NVM Read Wait States description (RWS[3:0])
PORT - I/O Pin Controller
Instances of the term “pad” replaced with “pin”.
Instances of the term “bundle” replaced with “group” and “interface”.
Basic Operation description updated.
Peripheral Multiplexing n (PMUX0) register: Offset formula updated.
EVSYS – Event System
Updated information in Features.
Power Management updated: Description of on how event generators can generate an event when the
system clock is stopped moved to Sleep Mode Operation.
Clocks updated: Renamed EVSYS channel dedicated generic clock from GCLK_EVSYS_x to
GCLK_EVSYS_CHANNELx.
Updated description in Principle of Operation.
Updated description in sub sections of Basic Operation.
Updated description in The Overrun Channel n Interrupt.
Channel x Overrun bit description in INTFLAG updated.
SERCOM USART – SERCOM Universal Synchronous and Asynchronous Receiver and Transmitter
Updated description in Break Character Detection and Auto-Baud.
Updated description in Start-of-Frame Detection.
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
I2S - Inter-IC Sound Controller
Introducing Frame Synch Clock.
Signal Description: Added separate tables for Master-, Slave- and Controller mode.
Updated description in Debug Operation and Register Access Protection.
Updated description in Principle of Operation.
Updated description in sub sections of Basic Operation.
Updated formula in MCKn Clock Frequency.
Updated formulas in Relation Between MCKn, SCKn, and Sampling Frequency fs.
Updated description in PDM Reception.
Section on MONO removed and information included in Basic Operation.
Updated property of Control A (CTRLA) register: Added Write-Synchronized
TCC – Timer/Counter for Control Applications
Updated description in Principle of Operation.
Updated description in sub sections of Basic Operation.
Updated description in sub sections of Additional Features.
Updated description in Synchronization.
Lock Update (LUPD) bit description updated in Control B Clear (CTRLBCLR) register.
Compare Channel Buffer x Busy (CCBx) bit description updated in Synchronization Busy (SYNCBUSY)
register.
Event Control (EVCTRL) register property updated: Removed Enable-Protected.
Interrupt Enable Clear (INTENCLR), Interrupt Enable Set (INTENSET) and Interrupt Flag Status and
Clear (INTFLAG) registers: Updated bit description of FAULT0, FAULT1, FAULTA and FAULTB.
STATUS register bit descriptions updated.
Wave Control (WAVE) register property updated: Removed Read-Synchronized.
Pattern Buffer (PATTB) register: Updated property and bit description.
Waveform Control Buffer (WAVEB) register: Updated property and bit descriptions.
USB – Universal Serial Bus
Removed figures: Setup Transaction Overview, OUT Single Bank Transaction Overview, IN Single Bank
Transaction Overview and USB Host Communication Flow.
Updated description and graphics in sub sections of USB Device Operations.
Updated description in sub sections of Host Operations.
Pad Calibration (PADCAL) register: Access updated.
Upgraded bit descriptions.
Pipe Descriptor Structure: Updated register reset values.
ADC – Analog-to-Digital Converter
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
Register Description:
REFCTRL bit selection names updated from AREFA / AREFB to VREFA / VREFB in Table 33-5
DAC – Digital-to-Analog Converter
Updated block diagram and signal description: VREFP replaced with VREFB.
Electrical Characteristics
© 2017 Microchip Technology Inc.
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40001882A-page 930
32-bit ARM-Based Microcontrollers
Updated VDD max from 3.63V to 3.63V in Absolute Maximum Ratings.
Updated VDDIN pin from 57 to 56 in GPIO Clusters.
Power Consumption: Updated Max values for STANDBY from 190.6μA and 197.3μA to 100μA in Table
37-7.
Added Peripheral Power Consumption.
I/O Pin Characteristics: tRISE and tFALL updated with different load conditions depending on the
DVRSTR value in .
I/O Pin Characteristics: Correct typo IOL and IOH Max values inverted between
PORT.PINCFG.DRVSTR=0 and 1, tRISE and tFALL updated with different load conditions depending
on the DVRSTR value in Table 37-14.
Analog Characteristics: Removed note from Table 37-18.
Analog-to-Digital (ADC) characteristics: Added Max DC supply current (IDD), RSAMPLE maximum value
changed from 2.8kW to 3.5kW, Conversion time Typ value change to Min Value in Table 37-22.
Digital to Analog Converter (DAC) Characteristics: Added Max DC supply current (IDD) in Table 37-30.
Analog Comparator Characteristics: Added Min and Max values for VSCALE INL, DNL, Offset Error and
Gain Error in Table 37-34.
Internal 1.1V Bandgap Reference Characteristics: Added Min and Max values, removed accuracy row in
Table 37-36.
SERCOM in I2C Mode Timing: Add Typical values for tR in Table 37-62.
Removed Asynchronous Watchdog Clock Characterization.
32.768kHz Internal oscillator (OSC32K) Characteristics: Added Max current consumption (IOSC32K) in
Table 37-53.
Updated Crystal Oscillator Characteristics (XOSC32K) ESR maximum values, Crystal Oscillator
Characteristics.
Updated Crystal Oscillator Characteristics (XOSC) ESR maximum value, Crystal Oscillator
Characteristics from 348kΩ to 141kΩ.
Digital Frequency Locked Loop (DFLL48M) Characteristics: Updated presentation, now separating
between Open- and Closed Loop Modes. Added fREF Min and Max values to Table 37-50.
Updated typical Startup time ( tSTARTUP) from 6.1µs to 8µs in Table 37-51.
Updated typical Fine lock time (tLFINE) from 700µs to 600µs in Table 37-51.
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics: Added Current consumption
(IFDPLL96M), Period Jitter (Jp), Lock time (tLOCK), Duty cycles parameters in Table 37-56.
Added USB Characteristics.
Timing Characteristics: Added SCK period (tSCK) Typ value in Table 37-60.
Errata
Errata for revision B added.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 931
32-bit ARM-Based Microcontrollers
43.16
Rev. A - 02/2014
Initial revision
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
44.
Appendix A. Electrical Characteristics at 125°C
44.1
Disclaimer
All typical values are measured at T = 25°C unless otherwise specified. All minimum and maximum
values are valid across operating temperature and voltage unless otherwise specified.
44.2
Absolute Maximum Ratings
Stresses beyond those listed in the table below may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or other conditions beyond those
indicated in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
Table 44-1. Absolute Maximum Ratings (Device Variant A)
Symbol
Parameter
VDD
Condition
Min.
Max.
Units
Power supply voltage
0
3.8
V
IVDD
Current into a VDD pin
-
28(1)
mA
IGND
Current out of a GND pin
-
39(1)
mA
VPIN
Pin voltage with respect to GND and VDD
GND-0.6V
VDD+0.6V
V
Tstorage
Storage temperature
-60
150
°C
Note:
1. Maximum source current is 14mA and maximum sink current is 19.5mA per cluster. A cluster is a
group of GPIOs, see related links. Also note that each VDD/GND pair is connected to 2 clusters so
current consumption through the pair will be a sum of the clusters source/sink currents.
Table 44-2. Absolute Maximum Ratings (Device Variant B)
Symbol
Parameter
VDD
Condition
Min.
Max.
Units
Power supply voltage
0
3.8
V
IVDD
Current into a VDD pin
-
92(1)
mA
IGND
Current out of a GND pin
-
130(1)
mA
VPIN
Pin voltage with respect to GND and VDD
GND-0.6V
VDD+0.6V
V
Tstorage
Storage temperature
-60
150
°C
Note: 1. Maximum source current is 46mA and maximum sink current is 65mA per cluster. A cluster is a
group of GPIOs, see related links. Also note that each VDD/GND pair is connected to 2 clusters so current
consumption through the pair will be a sum of the clusters source/sink currents.
Related Links
GPIO Clusters
© 2017 Microchip Technology Inc.
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32-bit ARM-Based Microcontrollers
44.3
General Operating Ratings
The device must operate within the ratings in order for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 44-3. General Operating Conditions
Symbol
Parameter
VDD
Condition
Min.
Typ.
Max.
Units
Power supply voltage
1.62(1)
3.3
3.63
V
VDDANA
Analog supply voltage
1.62(1)
3.3
3.63
V
TA
Temperature range
-40
25
85
°C
TJ
Junction temperature
-
-
145
°C
Note:
Notes: 1. With BOD33 disabled. If the BOD33 is enabled, check Table 37-20.
44.4
Maximum Clock Frequencies
Table 44-4. Maximum GCLK Generator Output Frequencies (Device Variant A)
Symbol
Description
Conditions
Max.
Units
fGCLKGEN0 / fGCLK_MAIN
fGCLKGEN1
GCLK Generator Output Frequency
Undivided
96
MHz
Divided
32
MHz
fGCLKGEN2
fGCLKGEN3
fGCLKGEN4
fGCLKGEN5
fGCLKGEN6
fGCLKGEN7
fGCLKGEN8
Table 44-5. Maximum Peripheral Clock Frequencies (Device Variant A)
Symbol
Description
Max.
Units
fCPU
CPU clock frequency
32
MHz
fAHB
AHB clock frequency
32
MHz
fAPBA
APBA clock frequency
32
MHz
fAPBB
APBB clock frequency
32
MHz
fAPBC
APBC clock frequency
32
MHz
fGCLK_DFLL48M_REF
DFLL48M Reference clock frequency
33
KHz
fGCLK_DPLL
FDPLL96M Reference clock frequency
2
MHz
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32-bit ARM-Based Microcontrollers
Symbol
Description
Max.
Units
fGCLK_DPLL_32K
FDPLL96M 32k Reference clock frequency
32
KHz
fGCLK_WDT
WDT input clock frequency
48
MHz
fGCLK_RTC
RTC input clock frequency
48
MHz
fGCLK_EIC
EIC input clock frequency
48
MHz
fGCLK_USB
USB input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_0
EVSYS channel 0 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_1
EVSYS channel 1 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_2
EVSYS channel 2 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_3
EVSYS channel 3 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_4
EVSYS channel 4 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_5
EVSYS channel 5 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_6
EVSYS channel 6 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_7
EVSYS channel 7 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_8
EVSYS channel 8 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_9
EVSYS channel 9 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_10
EVSYS channel 10 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_11
EVSYS channel 11 input clock frequency
48
MHz
fGCLK_SERCOMx_SLOW
Common SERCOM slow input clock frequency
48
MHz
fGCLK_SERCOM0_CORE
SERCOM0 input clock frequency
48
MHz
fGCLK_SERCOM1_CORE
SERCOM1 input clock frequency
48
MHz
fGCLK_SERCOM2_CORE
SERCOM2 input clock frequency
48
MHz
fGCLK_SERCOM3_CORE
SERCOM3 input clock frequency
48
MHz
fGCLK_SERCOM4_CORE
SERCOM4 input clock frequency
48
MHz
fGCLK_SERCOM5_CORE
SERCOM5 input clock frequency
48
MHz
fGCLK_TCC0, GCLK_TCC1
TCC0, TCC1 input clock frequency
80
MHz
fGCLK_TCC2, GCLK_TC3
TCC2, TC3 input clock frequency
80
MHz
fGCLK_TC4, GCLK_TC5
TC4, TC5 input clock frequency
48
MHz
fGCLK_TC6, GCLK_TC7
TC6, TC7 input clock frequency
48
MHz
fGCLK_ADC
ADC input clock frequency
48
MHz
fGCLK_AC_DIG
AC digital input clock frequency
48
MHz
fGCLK_AC_ANA
AC analog input clock frequency
64
KHz
fGCLK_DAC
DAC input clock frequency
350
KHz
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32-bit ARM-Based Microcontrollers
Symbol
Description
Max.
Units
fGCLK_PTC
PTC input clock frequency
48
MHz
fGCLK_I2S_0
I2S serializer 0 input clock frequency
13
MHz
fGCLK_I2S_1
I2S serializer 1 input clock frequency
13
MHz
Table 44-6. Maximum GCLK Generator Output Frequencies (Device Variant B)
Symbol
Description
Conditions
Max.
Units
fGCLKGEN0 / fGCLK_MAIN
fGCLKGEN1
GCLK Generator Output Frequency
Undivided
96
MHz
Divided
48
MHz
fGCLKGEN2
fGCLKGEN3
fGCLKGEN4
fGCLKGEN5
fGCLKGEN6
fGCLKGEN7
fGCLKGEN8
Table 44-7. Maximum Peripheral Clock Frequencies (Device Variant B)
Symbol
Description
Max.
Units
fCPU
CPU clock frequency
48
MHz
fAHB
AHB clock frequency
48
MHz
fAPBA
APBA clock frequency
48
MHz
fAPBB
APBB clock frequency
48
MHz
fAPBC
APBC clock frequency
48
MHz
fGCLK_DFLL48M_REF
DFLL48M Reference clock frequency
33
KHz
fGCLK_DPLL
FDPLL96M Reference clock frequency
2
MHz
fGCLK_DPLL_32K
FDPLL96M 32k Reference clock frequency
32
KHz
fGCLK_WDT
WDT input clock frequency
48
MHz
fGCLK_RTC
RTC input clock frequency
48
MHz
fGCLK_EIC
EIC input clock frequency
48
MHz
fGCLK_USB
USB input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_0
EVSYS channel 0 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_1
EVSYS channel 1 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_2
EVSYS channel 2 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_3
EVSYS channel 3 input clock frequency
48
MHz
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32-bit ARM-Based Microcontrollers
44.5
Symbol
Description
Max.
Units
fGCLK_EVSYS_CHANNEL_4
EVSYS channel 4 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_5
EVSYS channel 5 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_6
EVSYS channel 6 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_7
EVSYS channel 7 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_8
EVSYS channel 8 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_9
EVSYS channel 9 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_10
EVSYS channel 10 input clock frequency
48
MHz
fGCLK_EVSYS_CHANNEL_11
EVSYS channel 11 input clock frequency
48
MHz
fGCLK_SERCOMx_SLOW
Common SERCOM slow input clock frequency
48
MHz
fGCLK_SERCOM0_CORE
SERCOM0 input clock frequency
48
MHz
fGCLK_SERCOM1_CORE
SERCOM1 input clock frequency
48
MHz
fGCLK_SERCOM2_CORE
SERCOM2 input clock frequency
48
MHz
fGCLK_SERCOM3_CORE
SERCOM3 input clock frequency
48
MHz
fGCLK_SERCOM4_CORE
SERCOM4 input clock frequency
48
MHz
fGCLK_SERCOM5_CORE
SERCOM5 input clock frequency
48
MHz
fGCLK_TCC0, GCLK_TCC1
TCC0, TCC1 input clock frequency
96
MHz
fGCLK_TCC2, GCLK_TC3
TCC2, TC3 input clock frequency
48
MHz
fGCLK_TC4, GCLK_TC5
TC4, TC5 input clock frequency
96
MHz
fGCLK_TC6, GCLK_TC7
TC6, TC7 input clock frequency
48
MHz
fGCLK_ADC
ADC input clock frequency
48
MHz
fGCLK_AC_DIG
AC digital input clock frequency
48
MHz
fGCLK_AC_ANA
AC analog input clock frequency
64
KHz
fGCLK_DAC
DAC input clock frequency
350
KHz
fGCLK_PTC
PTC input clock frequency
48
MHz
fGCLK_I2S_0
I2S serializer 0 input clock frequency
13
MHz
fGCLK_I2S_1
I2S serializer 1 input clock frequency
13
MHz
Power Consumption
The values in this section are measured values of power consumption under the following conditions,
except where noted:
•
•
Operating conditions
– VVDDIN = 3.3 V
Wake up time from sleep mode is measured from the edge of the wakeup signal to the execution of
the first instruction fetched in flash.
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32-bit ARM-Based Microcontrollers
•
•
•
•
•
•
•
•
Oscillators
– XOSC (crystal oscillator) stopped
– XOSC32K (32 kHz crystal oscillator) running with external 32kHz crystal
– DFLL48M using XOSC32K as reference and running at 48 MHz
Clocks
– DFLL48M used as main clock source, except otherwise specified
– CPU, AHB clocks undivided
– APBA clock divided by 4
– APBB and APBC bridges off
The following AHB module clocks are running: NVMCTRL, APBA bridge
– All other AHB clocks stopped
The following peripheral clocks running: PM, SYSCTRL, RTC
– All other peripheral clocks stopped
I/Os are inactive with internal pull-up
CPU is running on flash with 1 wait states
Cache enabled
BOD33 disabled
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32-bit ARM-Based Microcontrollers
Table
44-8. Current Consumption
•
Mode
Conditions
TA
Typ.
Max.
Units
ACTIVE
CPU running a While(1) algorithm
125°C 3.75
4.12
mA
CPU running a While(1) algorithm
VDDIN=1.8V,
CPU is running on Flash with 3
wait states
125°C 3.77
4.13
CPU running a While(1) algorithm, 125°C 62*freq +
CPU is
228
running on Flash with 3 wait states
with
GCLKIN as reference
62*freq +
302
μA
(with freq
in MHz)
CPU running a Fibonacci
algorithm
125°C 4.85
5.29
mA
CPU running a Fibonacci
algorithm
VDDIN=1.8V, CPU is running on
flash with 3
wait states
125°C 4.87
5.29
CPU running a Fibonacci
125°C 88*freq +
algorithm, CPU is
424
running on Flash with 3 wait states
with
GCLKIN as reference
88*freq +
486
μA
(with freq
in MHz)
CPU running a CoreMark
algorithm
125°C 6.70
7.30
mA
CPU running a CoreMark
algorithm
VDDIN=1.8V, CPU is running on
flash with 3
wait states
125°C 5.98
6.41
CPU running a CoreMark
125°C 108*freq +
algorithm, CPU is
426
running on Flash with 3 wait states
with
GCLKIN as reference
108*freq +
492
μA
(with freq
in MHz)
IDLE0
Default operating conditions
125°C 2.40
2.69
mA
IDLE1
Default operating conditions
125°C 1.79
2.05
IDLE2
Default operating conditions
125°C 1.50
1.76
STANDBY
XOSC32K running
, RTC running at 1kHz(1)
125°C 348.0
850.0
125°C 346.0
848.0
(Device Variant B,
Die Revision E)
XOSC32K and RTC stopped(1)
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μA
40001882A-page 939
32-bit ARM-Based Microcontrollers
Mode
Conditions
TA
STANDBY
XOSC32K running
, RTC running at 1kHz(1)
XOSC32K and RTC stopped(1)
(Device Variant B
and C, Die
Revision F)
Typ.
Max.
Units
125°C 294.0
782.0
μA
125°C 292.0
780.0
Note:
1. Measurements were done with SYSCTRL->VREG.bit.RUNSTDBY = 1
Table 44-9. Wake-up Time (SAMD21)
Mode
Conditions
TA
Min. Typ. Max. Units
IDLE0
OSC8M used as main clock source, Cache disabled
125°C 3.9
IDLE1
OSC8M used as main clock source, Cache disabled
125°C 13.5 14.9 16.4
IDLE2
OSC8M used as main clock source, Cache disabled
125°C 14.4 15.8 17.2
STANDBY
OSC8M used as main clock source, Cache disabled
125°C 19.2 20.6 22.1
4.0
4.1
μs
Figure 44-1. Measurement Schematic
VDDIN
VDDANA
VDDIO
Amp 0
VDDCORE
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32-bit ARM-Based Microcontrollers
44.6
Analog Characteristics
44.6.1
Power-On Reset (POR) Characteristics
Table 44-10. POR Characteristics
Symbol Parameter
Conditions
Min. Typ. Max. Units
VPOT+
Voltage threshold on VDD rising
VDD falls at 1V/ms or slower
1.27 1.45 1.58
V
VPOT-
Voltage threshold on VDD falling
0.72 0.99 1.32
V
VDD
Figure 44-2. POR Operating Principle
VPOT+
VPOT-
Reset
Time
44.6.2
Brown-Out Detectors Characteristics
44.6.2.1 BOD33
Table 44-11. BOD33 Characteristics (Device Variant A)
Symbol
Parameter
Conditions
Temp.
Step size, between
adjacent values in
BOD33.LEVEL
Min. Typ.
Max. Units
-
34
-
mV
170
mV
VHYST
VBOD+ - VBOD-
Hysteresis ON
35
-
tDET
Detection time
Time with VDDANA <
VTH
necessary to generate
a
reset signal
-
0.9(1) -
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μs
40001882A-page 941
32-bit ARM-Based Microcontrollers
Symbol
Parameter
Conditions
Temp.
Min. Typ.
Max. Units
IBOD33
Current consumption
Continuous mode
25°C
-
25
48
-40 to
125°C
-
-
50
25°C
-
0.034 0.21
-40 to
125°C
--
-
25°C
-
0.132 0.38 μA
-40 to
125°C
-
-
-
1.2(1) -
Sampling mode
ISbyBOD33 Current consumption in
Standby mode
Sampling mode
tSTARTUP Start-up time
μA
2.29
1.62
μs
Note: 1. These values are based on simulation. These values are not covered by test limits in
production or characterization.
Table 44-12. BOD33 Characteristics (Device Variant B)
Symbol
Parameter
Conditions
Temp.
Step size, between
adjacent values in
BOD33.LEVEL
Min. Typ. Max. Units
-
34
-
mV
170
mV
VHYST
VBOD+ - VBOD-
Hysteresis ON
35
-
tDET
Detection time
Time with VDDANA <
VTH
necessary to generate
a
reset signal
-
0.9(1) -
μs
IBOD33
Current consumption
Continuous mode
25°C
-
25
48
μA
-40 to
125°C
-
-
52
25°C
-
0.03
0.21
-40 to
125°C
--
-
2.91
25°C
-
0.13
0.38 μA
-40 to
125°C
-
-
1.7
-
2.2(1) -
Sampling mode
ISbyBOD33 Current consumption in
Standby mode
Sampling mode
tSTARTUP Start-up time
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μs
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32-bit ARM-Based Microcontrollers
44.6.3
Analog-to-Digital (ADC) characteristics
Table 44-13. Operating Conditions (Device Variant A)
Symbol
Parameter
RES
fCLK_ADC
Min.
Typ.
Max.
Units
Resolution
8
-
12
bits
ADC Clock frequency
30
-
2100
kHz
5
-
300
ksps
5
-
350
ksps
0.5
-
-
cycles
-
6
-
cycles
Voltage reference
range
1.0
-
VDDANA-0.6
V
Internal 1V reference
-
1.0
-
V
-
VDDANA/
1.48
-
V
Sample rate(1)
Conditions
Single shot (with
VDDANA > 3.0V)
(4)
Free running
Sampling time(1)
Conversion time(1)
VREF
VREFINT1V
1x Gain
(2)
VREFINTVCC0
Internal ratiometric
reference 0(2)
VREFINTVCC0
Internal ratiometric
reference 0(2) error
2.0V <
VDDANA2.0V
-
VDDANA/2
-
V
VREFINTVCC1
Internal ratiometric
reference 1(2) error
2.0V <
VDDANA 3.0V (cf. ADC errata)
Table 44-14. Operating Conditions (Device Variant B)
Symbol
Parameter
RES
fCLK_ADC
Min.
Typ.
Max.
Units
Resolution
8
-
12
bits
ADC Clock frequency
30
-
2100
kHz
Conversion speed
10
1000
ksps
Sample rate(1)
Conditions
Single shot
5
-
300
ksps
Free running
5
-
350
ksps
0.5
-
-
cycles
6
-
-
cycles
Sampling time(1)
Conversion time(1)
1x Gain
VREF
Voltage reference
range
1.0
-
VDDANA-0.6
V
VREFINT1V
Internal 1V reference
-
1.0
-
V
VREFINTVCC0
Internal ratiometric
reference 0(2)
-
VDDANA/
1.48
-
V
VREFINTVCC0
Internal ratiometric
reference 0(2) error
2.0V <
VDDANA2.0V
-
VDDANA/2
-
V
VREFINTVCC1
Internal ratiometric
reference 1(2) error
2.0V <
VDDANA VREF/4
– VCM_IN < 0.95*VDDANA + VREF/4 – 0.75V
– VCM_IN > VREF/4 -0.05*VDDANA -0.1V
1.2.
If |VIN| < VREF/4
– VCM_IN < 1.2*VDDANA - 0.75V
– VCM_IN > 0.2*VDDANA - 0.1V
4. The ADC channels on pins PA08, PA09, PA10, PA11 are powered from the VDDIO power supply.
The ADC performance of these pins will not be the same as all the other ADC channels on pins
powered from the VDDANA power supply.
5. The gain accuracy represents the gain error expressed in percent. Gain accuracy (%) = (Gain Error
in V x 100) / (2*Vref/GAIN)
Table 44-17. Single-Ended Mode (Device Variant A)
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
ENOB
Effective Number of Bits
With gain compensation
-
9.5
9.8
Bits
TUE
Total Unadjusted Error
1x gain
-
10.5
14.0
LSB
INL
Integral Non-Linearity
1x gain
1.0
1.6
7.5
LSB
DNL
Differential Non-Linearity
1x gain
+/-0.5
+/-0.6
+/-0.95 LSB
Gain Error
Ext. Ref. 1x
-10.0
0.7
+10.0
Gain Accuracy(4)
Ext. Ref. 0.5x
+/-0.1
+/-0.34 +/-0.4
Ext. Ref. 2x to 16X
+/-0.01 +/-0.1
+/-0.15 %
Ext. Ref. 1x
-5.0
+10.0
Offset Error
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1.5
mV
%
mV
40001882A-page 946
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
SFDR
Spurious Free Dynamic Range
63.1
65.0
66.5
dB
SINAD
Signal-to-Noise and Distortion
1x Gain
FCLK_ADC = 2.1MHz
50.7
59.5
61.0
dB
49.9
60.0
64.0
dB
-65.4
-63.0
-62.1
dB
-
1.0
-
mV
SNR
THD
Signal-to-Noise Ratio
Total Harmonic Distortion
Noise RMS
FIN = 40kHz
AIN = 95%FSR
T = 25°C
Table 44-18. Single-Ended Mode (Device Variant B)
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
ENOB
Effective Number of Bits
With gain compensation
-
9.7
10.1
Bits
TUE
Total Unadjusted Error
1x gain
-
7.9
40.0
LSB
INL
Integral Non-Linearity
1x gain
1.4
2.6
6.0
LSB
DNL
Differential Non-Linearity
1x gain
+/-0.6
+/-0.7
+/-0.95 LSB
Gain Error
Ext. Ref. 1x
-5.0
0.6
+5.0
Gain Accuracy(4)
Ext. Ref. 0.5x
+/-0.1
+/-0.37 +/-0.55 %
Ext. Ref. 2x to 16X
+/-0.01 +/-0.1
+/-0.2
%
Offset Error
Ext. Ref. 1x
-5.0
0.6
+10.0
mV
SFDR
Spurious Free Dynamic Range
63.0
68.0
68.7
dB
SINAD
Signal-to-Noise and Distortion
1x Gain
FCLK_ADC = 2.1MHz
55.0
60.1
62.5
dB
54.0
61.0
64.0
dB
-69.0
-68.0
-65.0
dB
-
1.0
-
mV
SNR
THD
Signal-to-Noise Ratio
Total Harmonic Distortion
Noise RMS
FIN = 40kHz
AIN = 95%FSR
T = 25°C
mV
Note:
1. Maximum numbers are based on characterization and not tested in production, and for 5% to 95%
of the input voltage range.
2. Respect the input common mode voltage through the following equations (where VCM_IN is the
Input channel common mode voltage) for all VIN:
– VCM_IN < 0.7*VDDANA + VREF/4 – 0.75V
– VCM_IN > VREF/4 – 0.3*VDDANA - 0.1V
3. The ADC channels on pins PA08, PA09, PA10, PA11 are powered from the VDDIO power supply.
The ADC performance of these pins will not be the same as all the other ADC channels on pins
powered from the VDDANA power supply.
4. The gain accuracy represents the gain error expressed in percent. Gain accuracy (%) = (Gain Error
in V x 100) / (Vref/GAIN)
44.6.4
Inputs and Sample and Hold Acquisition Times
The analog voltage source must be able to charge the sample and hold (S/H) capacitor in the ADC in
order to achieve maximum accuracy. Seen externally the ADC input consists of a resistor (�SAMPLE) and a
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40001882A-page 947
32-bit ARM-Based Microcontrollers
capacitor (�SAMPLE). In addition, the source resistance (�SOURCE) must be taken into account when
calculating the required sample and hold time. The next figure shows the ADC input channel equivalent
circuit.
Figure 44-3. ADC Input
VDDANA/2
Analog Input
AINx
CSAMPLE
RSOURCE
RSAMPLE
VIN
To achieve n bits of accuracy, the �SAMPLE capacitor must be charged at least to a voltage of
�CSAMPLE ≥ �
IN
�+1
× 1 + − 2−
The minimum sampling time �SAMPLEHOLD for a given �SOURCEcan be found using this formula:
�SAMPLEHOLD ≥ �SAMPLE + �
SOURCE
× �SAMPLE × � + 1 × ln 2
for a 12 bits accuracy: �SAMPLEHOLD ≥ �SAMPLE + �
where
44.6.5
�SAMPLEHOLD =
SOURCE
× �SAMPLE × 9.02
1
2 × �ADC
Digital to Analog Converter (DAC) Characteristics
Table 44-19. Operating Conditions(1)(Device Variant A)
Symbol Parameter
Conditions
Min. Typ.
Max.
Units
VDDANA
Analog supply voltage
1.62 -
3.63
V
AVREF
External reference voltage
1.0
-
VDDANA-0.6
V
Internal reference voltage 1
-
1
-
V
Internal reference voltage 2
-
VDDANA -
V
Linear output voltage range
0.05 -
VDDANA-0.05
V
Minimum resistive load
5
-
-
kΩ
Maximum capacitance load
-
-
100
pF
-
160
242
μA
IDD
DC supply current(2)
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Voltage pump disabled
Datasheet Complete
40001882A-page 948
32-bit ARM-Based Microcontrollers
Table 44-20. Operating Conditions(1)(Device Variant B)
Symbol Parameter
Conditions
Min. Typ.
Max.
Units
VDDANA
Analog supply voltage
1.62 -
3.63
V
AVREF
External reference voltage
1.0
-
VDDANA-0.6
V
Internal reference voltage 1
-
1
-
V
Internal reference voltage 2
-
VDDANA -
V
Linear output voltage range
0.05 -
VDDANA-0.05
V
Minimum resistive load
5
-
-
kΩ
Maximum capacitance load
-
-
100
pF
-
160
283
μA
IDD
DC supply current(2)
Voltage pump disabled
1. These values are based on specifications otherwise noted.
2. These values are based on characterization. These values are not covered by test limits in production.
Table 44-21. Clock and Timing(1)
Symbol
Parameter
Conditions
Conversion rate
Cload=100pF
Rload > 5kΩ
Startup time
Min.
Typ.
Max.
Units
Normal mode
-
-
350
ksps
For ΔDATA=+/-1
-
-
1000
VDDNA > 2.6V
-
-
2.85
μs
VDDNA < 2.6V
-
-
10
μs
Note: 1. These values are based on simulation. These values are not covered by test limits in production
or characterization.
Table 44-22. Accuracy Characteristics(1)(Device Variant A)
Symbol
Parameter
RES
Input resolution
INL
Integral non-linearity
Conditions
VREF= Ext 1.0V
VREF = VDDANA
VREF= INT1V
© 2017 Microchip Technology Inc.
Min.
Typ.
Max.
Units
-
-
10
Bits
VDD = 1.6V
0.75
1.1
2.0
LSB
VDD = 3.6V
0.6
1.2
2.5
VDD = 1.6V
1.4
2.2
3.5
VDD = 3.6V
0.9
1.4
1.5
VDD = 1.6V
0.75
1.3
2.5
VDD = 3.6V
0.8
1.2
1.5
Datasheet Complete
40001882A-page 949
32-bit ARM-Based Microcontrollers
Symbol
Parameter
Conditions
DNL
Differential non-linearity
VREF= Ext 1.0V
VREF= VDDANA
VREF= INT1V
Min.
Typ.
Max.
Units
VDD = 1.6V
+/-0.9
+/-1.2
+/-2.0
LSB
VDD = 3.6V
+/-0.9
+/-1.1
+/-1.5
VDD = 1.6V
+/-1.1
+/-1.7
+/-3.0
VDD = 3.6V
+/-1.0
+/-1.1
+/-1.6
VDD = 1.6V
+/-1.1
+/-1.4
+/-2.5
VDD = 3.6V
+/-1.0
+/-1.5
+/-1.8
Gain error
Ext. VREF
+/-1.0
+/-5
+/-10
mV
Offset error
Ext. VREF
+/-2
+/-3
+/-8
mV
Table 44-23. Accuracy Characteristics(1)(Device Variant B)
Symbol
Parameter
RES
Input resolution
INL
Integral non-linearity
Conditions
VREF= Ext 1.0V
VREF = VDDANA
VREF= INT1V
DNL
Differential non-linearity
VREF= Ext 1.0V
VREF= VDDANA
VREF= INT1V
Min.
Typ.
Max.
Units
-
-
10
Bits
VDD = 1.6V
0.7
0.75
2.0
LSB
VDD = 3.6V
0.6
0.65
1.5
VDD = 1.6V
0.6
0.85
2.0
VDD = 3.6V
0.5
0.8
1.5
VDD = 1.6V
0.5
0.75
1.5
VDD = 3.6V
0.7
0.8
1.5
VDD = 1.6V
+/-0.3
+/-0.4
+/-1.0
VDD = 3.6V
+/-0.25 +/-0.4
VDD = 1.6V
+/-0.4
+/-0.55 +/-1.5
VDD = 3.6V
+/-0.2
+/-0.3
+/-0.75
VDD = 1.6V
+/-0.5
+/-0.7
+/-1.5
VDD = 3.6V
+/-0.4
+/-0.7
+/-1.5
LSB
+/-0.75
Gain error
Ext. VREF
+/-0.5
+/-5
+/-12
mV
Offset error
Ext. VREF
+/-2
+/-1.5
+/-8
mV
1. All values measured using a conversion rate of 350ksps.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 950
32-bit ARM-Based Microcontrollers
44.6.6
Analog Comparator Characteristics
Table 44-24. Electrical and Timing (Device Variant A)
Symbol Parameter
Min.
Typ.
Max.
Positive input voltage
range
0
-
VDDANA V
Negative input voltage
range
0
-
VDDANA
Hysteresis = 0, Fast mode
-15
0.0
+15
mV
Hysteresis = 0, Low power mode
-25
0.0
+25
mV
Hysteresis = 1, Fast mode
20
50
83
mV
Hysteresis = 1, Low power mode
15
40
75
mV
Changes for VACM=VDDANA/2
100mV overdrive, Fast mode
-
60
116
ns
Changes for VACM=VDDANA/2
100mV overdrive, Low power mode
225
370
ns
Enable to ready delay
Fast mode
-
1
2
μs
Enable to ready delay
Low power mode
-
12
19
μs
INL(3)
-
0.75
+1.58
LSB
DNL(3)
-
0.25
+0.95
LSB
Offset Error (1)(2)
-0.200 0.260 +1.035 LSB
Gain Error (1)(2)
0.55
1.2
2.0
LSB
Min.
Typ.
Max.
Units
Positive input voltage
range
0
-
VDDANA V
Negative input voltage
range
0
-
VDDANA
Hysteresis = 0, Fast mode
-15
0.0
+15
mV
Hysteresis = 0, Low power mode
-25
0.0
+25
mV
Hysteresis = 1, Fast mode
20
50
90
mV
Hysteresis = 1, Low power mode
15
40
75
mV
Changes for VACM=VDDANA/2
100mV overdrive, Fast mode
-
90
180
ns
282
520
ns
Offset
Hysteresis
Propagation delay
tSTARTUP Startup time
VSCALE
Conditions
Units
Table 44-25. Electrical and Timing (Device Variant B)
Symbol Parameter
Offset
Hysteresis
Propagation delay
Conditions
Changes for VACM=VDDANA/2
100mV overdrive, Low power mode
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 951
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max.
Units
tSTARTUP Startup time
Enable to ready delay
Fast mode
-
1
2.6
μs
Enable to ready delay
Low power mode
-
14
22
μs
INL(3)
-
0.75
+1.58
LSB
DNL(3)
-
0.25
+0.95
LSB
Offset Error (1)(2)
-0.200 0.260 +1.035 LSB
Gain Error (1)(2)
0.55
VSCALE
1.2
2.0
LSB
Note:
1. According to the standard equation V(X)=VLSB*(X+1); VLSB=VDDANA/64
2. Data computed with the Best Fit method
3. Data computed using histogram
44.6.7
Temperature Sensor Characteristics
Table 44-26. Temperature Sensor Characteristics(1)(Device Variant A)
Symbol Parameter
Temperature sensor
output voltage
Conditions
Min. Typ.
T= 25°C, VDDANA = 3.3V
-
0.667 -
V
2.2
2.4
2.7
mV/°C
1
14
mV/V
Temperature sensor
slope
Max. Units
Variation over VDDANA
voltage
VDDANA=1.62V to 3.6V
-9
Temperature Sensor
accuracy
Using the method described in the
Software-based Refinement of the Actual
Temperature
-13.0 -
13.0 °C
Conditions
Min. Typ.
Max. Units
T= 25°C, VDDANA = 3.3V
-
Table 44-27. Temperature Sensor Characteristics(1)(Device Variant B)
Symbol Parameter
Temperature sensor
output voltage
Temperature sensor
slope
0.688 -
V
2.06 2.16
2.26 mV/°C
3
Variation over VDDANA
voltage
VDDANA=1.62V to 3.6V
-0.4
1.4
Temperature Sensor
accuracy
Using the method described in the
Software-based Refinement of the Actual
Temperature
-13.0 -
mV/V
13.0 °C
Note: 1. These values are based on characterization. These values are not covered by test limits in
production.
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 952
32-bit ARM-Based Microcontrollers
44.7
NVM Characteristics
Table 44-28. Maximum Operating Frequency
VDD range
NVM Wait States
Maximum Operating Frequency
Units
1.62V to 2.7V
0
14
MHz
1
28
2
40
0
24
1
40
2.7V to 3.63V
Note that on this flash technology, a max number of 8 consecutive write is allowed per row. Once this
number is reached, a row erase is mandatory.
Table 44-29. Flash Endurance and Data Retention
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
RetNVM25k
Retention after up to 25k
Average ambient 55°C
10
50
-
Years
RetNVM2.5k
Retention after up to 2.5k
Average ambient 55°C
20
100
-
Years
RetNVM100
Retention after up to 100
Average ambient 55°C
25
>100
-
Years
CycNVM
Cycling Endurance(1)
-40°C < Ta < 85°C
25k
150k
-
Cycles
Note: 1. An endurance cycle is a write and an erase operation.
Table 44-30. EEPROM Emulation(1) Endurance and Data Retention
Symbol
Parameter
Conditions
Min.
Typ.
Max. Units
RetEEPROM100k
Retention after up to 100k
Average ambient 55°C
10
50
-
Years
RetEEPROM10k
Retention after up to 10k
Average ambient 55°C
20
100
-
Years
CycEEPROM
Cycling Endurance(2)
-40°C < Ta < 85°C
100k 600k -
Cycles
Notes: 1. The EEPROM emulation is a software emulation described in the App note AT03265.
2. An endurance cycle is a write and an erase operation.
Table 44-31. NVM Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
tFPP
Page programming time
-
-
-
2.5
ms
tFRE
Row erase time
-
-
-
6
ms
tFCE
DSU chip erase time (CHIP_ERASE)
-
-
-
240
ms
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 953
32-bit ARM-Based Microcontrollers
44.8
Oscillators Characteristics
44.8.1
Crystal Oscillator (XOSC) Characteristics
44.8.1.1 Digital Clock Characteristics
The following table describes the characteristics for the oscillator when a digital clock is applied on XIN.
Table 44-32. Digital Clock Characteristics
Symbol
Parameter
fCPXIN
XIN clock frequency
Conditions
Min.
Typ.
Max.
Units
-
-
32
MHz
44.8.1.2 Crystal Oscillator Characteristics
The following table describes the characteristics for the oscillator when a crystal is connected between
XIN and XOUT . The user must choose a crystal oscillator where the crystal load capacitance CL is within
the range given in the table. The exact value of CL can be found in the crystal datasheet. The capacitance
of the external capacitors (CLEXT) can then be computed as follows:
CLEXT = 2 CL + − CSTRAY − CSHUNT
where CSTRAY is the capacitance of the pins and PCB, CSHUNT is the shunt capacitance of the crystal.
Table 44-33. Crystal Oscillator Characteristics (Device Variant A)
Symbol Parameter
fOUT
Crystal oscillator frequency
ESR
Crystal Equivalent Series
Resistance
Safety Factor = 3
The AGC doesn’t have any
noticeable impact on these
measurements.
Conditions
Min. Typ. Max.
Units
0.4
-
32
MHz
f = 0.455 MHz, CL = 100pF
XOSC.GAIN = 0
-
-
5.6K
Ω
f = 2MHz, CL = 20pF
XOSC.GAIN = 0
-
-
416
f = 4MHz, CL = 20pF
XOSC.GAIN = 1
-
-
243
f = 8 MHz, CL = 20pF
XOSC.GAIN = 2
-
-
138
f = 16 MHz, CL = 20pF
XOSC.GAIN = 3
-
-
66
f = 32MHz, CL = 18pF
XOSC.GAIN = 4
-
-
56
CXIN
Parasitic capacitor load
-
5.9
-
pF
CXOUT
Parasitic capacitor load
-
3.2
-
pF
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 954
32-bit ARM-Based Microcontrollers
Symbol Parameter
Current Consumption
Conditions
Min. Typ. Max.
Units
f = 2MHz, CL = 20pF, AGC off
27
65
90
μA
f = 2MHz, CL = 20pF, AGC on
14
52
79
f = 4MHz, CL = 20pF, AGC off
61
117
161
f = 4MHz, CL = 20pF, AGC on
23
74
110
f = 8MHz, CL = 20pF, AGC off
131
226
319
f = 8MHz, CL = 20pF, AGC on
56
128
193
f = 16MHz, CL = 20pF, AGC off 305
502
742
f = 16MHz, CL = 20pF, AGC on 116
307
627
f = 32MHz, CL = 18pF, AGC off 1031 1622 2344
tSTARTUP Start-up time
f = 32MHz, CL = 18pF, AGC on 278
615
1422
f = 2MHz, CL = 20pF,
XOSC.GAIN = 0, ESR = 600Ω
14K
48K
f = 4MHz, CL = 20pF,
XOSC.GAIN = 1, ESR = 100Ω
6800 19.5K
f = 8 MHz, CL = 20pF,
XOSC.GAIN = 2, ESR = 35Ω
-
5550 13K
f = 16 MHz, CL = 20pF,
XOSC.GAIN = 3, ESR = 25Ω
-
6750 14.5K
f = 32MHz, CL = 18pF,
XOSC.GAIN = 4, ESR = 40Ω
-
5.3K 9.6K
cycles
Table 44-34. Crystal Oscillator Characteristics (Device Variant B)
Symbol Parameter
fOUT
Crystal oscillator frequency
ESR
Crystal Equivalent Series
Resistance
Safety Factor = 3
The AGC doesn’t have any
noticeable impact on these
measurements.
CXIN
Conditions
Min. Typ. Max.
Units
0.4
-
32
MHz
f = 0.455 MHz, CL = 100pF
XOSC.GAIN = 0
-
-
5.6K
Ω
f = 2MHz, CL = 20pF
XOSC.GAIN = 0
-
-
416
f = 4MHz, CL = 20pF
XOSC.GAIN = 1
-
-
243
f = 8 MHz, CL = 20pF
XOSC.GAIN = 2
-
-
138
f = 16 MHz, CL = 20pF
XOSC.GAIN = 3
-
-
66
f = 32MHz, CL = 18pF
XOSC.GAIN = 4
-
-
56
-
5.9
-
Parasitic capacitor load
© 2017 Microchip Technology Inc.
Datasheet Complete
pF
40001882A-page 955
32-bit ARM-Based Microcontrollers
Symbol Parameter
CXOUT
Conditions
Min. Typ. Max.
Units
-
3.2
-
pF
f = 2MHz, CL = 20pF, AGC off
27
65
90
μA
f = 2MHz, CL = 20pF, AGC on
14
52
79
f = 4MHz, CL = 20pF, AGC off
61
117
160
f = 4MHz, CL = 20pF, AGC on
23
74
110
f = 8MHz, CL = 20pF, AGC off
131
226
319
f = 8MHz, CL = 20pF, AGC on
56
128
193
f = 16MHz, CL = 20pF, AGC off 305
502
741
f = 16MHz, CL = 20pF, AGC on 116
307
626
Parasitic capacitor load
Current Consumption
f = 32MHz, CL = 18pF, AGC off 1031 1622 2344
tSTARTUP Start-up time
f = 32MHz, CL = 18pF, AGC on 278
615
1400
f = 2MHz, CL = 20pF,
XOSC.GAIN = 0, ESR = 600Ω
14K
48K
f = 4MHz, CL = 20pF,
XOSC.GAIN = 1, ESR = 100Ω
6800 19.5K
f = 8 MHz, CL = 20pF,
XOSC.GAIN = 2, ESR = 35Ω
-
5550 13K
f = 16 MHz, CL = 20pF,
XOSC.GAIN = 3, ESR = 25Ω
-
6750 14.5K
f = 32MHz, CL = 18pF,
XOSC.GAIN = 4, ESR = 40Ω
-
5.3K 9.6K
cycles
Figure 44-4. Oscillator Connection
Xin
C LEXT
Crystal
LM
C SHUNT
RM
C STRAY
CM
C LEXT
© 2017 Microchip Technology Inc.
Datasheet Complete
Xout
40001882A-page 956
32-bit ARM-Based Microcontrollers
44.8.2
External 32 kHz Crystal Oscillator (XOSC32K) Characteristics
44.8.2.1 Digital Clock Characteristics
The following table describes the characteristics for the oscillator when a digital clock is applied on XIN32
pin.
Table 44-35. Digital Clock Characteristics
Symbol
Parameter
fCPXIN32
Conditions
Min.
Typ.
Max.
Units
XIN32 clock frequency
-
32.768
-
kHz
XIN32 clock duty cycle
-
50
-
%
44.8.2.2 Crystal Oscillator Characteristics
Figure 37-6 and the equation in also applies to the 32 kHz oscillator connection. The user must choose a
crystal oscillator where the crystal load capacitance CL is within the range given in the table. The exact
value of CL can be found in the crystal datasheet.
Table 44-36. 32kHz Crystal Oscillator Characteristics (Device Variant A)
Symbol Parameter
fOUT
Conditions
Crystal oscillator frequency
tSTARTUP Startup time
ESRXTAL = 39.9 kΩ, CL =
12.5 pF
Min. Typ.
Max. Units
-
32768 -
Hz
-
28K
31K
cycles
CL
Crystal load capacitance
-
-
12.5 pF
CSHUNT
Crystal shunt capacitance
-
0.1
-
CXIN32
Parasitic capacitor load
-
3.1
-
CXOUT32 Parasitic capacitor load
-
3.3
-
IXOSC32K Current consumption
-
1.22
2.44 µA
ESR
-
-
141
TQFP64/48/32 packages
Crystal equivalent series resistance CL=12.5pF
f=32.768kHz
, Safety Factor = 3
kΩ
Table 44-37. 32kHz Crystal Oscillator Characteristics (Device Variant B)
Symbol Parameter
fOUT
Conditions
Crystal oscillator frequency
tSTARTUP Startup time
ESRXTAL = 39.9 kΩ, CL =
12.5 pF
Min. Typ.
Max. Units
-
32768 -
Hz
-
28K
30K
cycles
CL
Crystal load capacitance
-
-
12.5 pF
CSHUNT
Crystal shunt capacitance
-
0.1
-
CXIN32
Parasitic capacitor load
-
3.2
-
-
3.7
-
TQFP64/48/32 packages
CXOUT32 Parasitic capacitor load
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 957
32-bit ARM-Based Microcontrollers
Symbol Parameter
44.8.3
Conditions
Min. Typ.
Max. Units
IXOSC32K Current consumption
-
1.22
2.2
µA
ESR
-
-
100
kΩ
Crystal equivalent series resistance CL=12.5pF
f=32.768kHz
, Safety Factor = 3
Digital Frequency Locked Loop (DFLL48M) Characteristics
Table 44-38. DFLL48M Characteristics - Open Loop Mode(1), Device Variant A
Symbol Parameter
Conditions
Min. Typ. Max. Units
fOUT
Output frequency
IDFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
47
48
IDFLL
Power consumption
on VDDIN
IDFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
-
403 457
μA
DFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
7
8
μs
tSTARTUP Start-up time
49
9
MHz
fOUT within 90 % of final value
Table 44-39. DFLL48M Characteristics - Open Loop Mode(1), Device Variant B
Symbol Parameter
Conditions
Min. Typ. Max. Units
fOUT
Output frequency
IDFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
47
48
IDFLL
Power consumption
on VDDIN
IDFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
-
403 453
μA
DFLLVAL.COARSE = DFLL48M COARSE
CAL
DFLLVAL.FINE = 512
-
8
μs
tSTARTUP Start-up time
49
9
MHz
fOUT within 90 % of final value
Note: 1. DFLL48M in Open loop after calibration at room temperature.
Table 44-40. DFLL48M Characteristics - Closed Loop Mode(1), Device Variant A
Symbol Parameter
Conditions
Min.
fOUT
Average Output
frequency
fREF = 32 .768kHz
47.76 48
fREF
Reference frequency
Jitter
Cycle to Cycle jitter
© 2017 Microchip Technology Inc.
fREF = 32 .768kHz
Datasheet Complete
Typ.
Max. Units
48.24 MHz
0.732 32.768 33
kHz
-
ns
-
1.04
40001882A-page 958
32-bit ARM-Based Microcontrollers
Symbol Parameter
Conditions
Min.
Typ.
Max. Units
IDFLL
Power consumption
on VDDIN
fREF = 32 .768kHz
-
425
482
μA
tLOCK
Lock time
fREF = 32 .768kHz
DFLLVAL.COARSE = DFLL48M
COARSE CAL
100
200
500
μs
DFLLVAL.FINE = 512
DFLLCTRL.BPLCKC = 1
DFLLCTRL.QLDIS = 0
DFLLCTRL.CCDIS = 1
DFLLMUL.FSTEP = 10
Table 44-41. DFLL48M Characteristics - Closed Loop Mode(1), Device Variant B
Symbol Parameter
Conditions
Min.
Typ.
fOUT
Average Output
frequency
fREF = 32 .768kHz
47.76 48
fREF
Reference frequency
Jitter
Cycle to Cycle jitter
IDFLL
tLOCK
Max. Units
48.24 MHz
0.732 32.768 33
kHz
fREF = 32 .768kHz
-
-
0.42
ns
Power consumption
on VDDIN
fREF = 32 .768kHz
-
403
453
μA
Lock time
fREF = 32 .768kHz
DFLLVAL.COARSE = DFLL48M
COARSE CAL
-
200
500
μs
DFLLVAL.FINE = 512
DFLLCTRL.BPLCKC = 1
DFLLCTRL.QLDIS = 0
DFLLCTRL.CCDIS = 1
DFLLMUL.FSTEP = 10
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 959
32-bit ARM-Based Microcontrollers
44.8.4
32.768kHz Internal oscillator (OSC32K) Characteristics
Table 44-42. 32kHz RC Oscillator Characteristics (Device Variant A)
Symbol Parameter
Conditions
Min.
fOUT
Calibrated against a 32.768kHz
reference at 25°C, over [-40, +85]C,
over [1.62, 3.63]V
28.508 32.768 35.389 kHz
Calibrated against a 32.768kHz
reference at 25°C, at VDD=3.3V
32.276 32.768 33.260
Calibrated against a 32.768kHz
reference at 25°C, over [1.62, 3.63]V
31.457 32.768 34.079
IOSC32K
Output frequency
Current consumption
Typ.
Max.
Units
-
0.79
1.80
μA
tSTARTUP Start-up time
-
1
2
cycle
Duty
-
50
-
%
Typ.
Max.
Units
Duty Cycle
Table 44-43. 32kHz RC Oscillator Characteristics (Device Variant B)
Symbol Parameter
Conditions
Min.
fOUT
Calibrated against a 32.768kHz
reference at 25°C, over [-40, +85]C,
over [1.62, 3.63]V
28.508 32.768 35.389 kHz
Calibrated against a 32.768kHz
reference at 25°C, at VDD=3.3V
32.276 32.768 33.260
Calibrated against a 32.768kHz
reference at 25°C, over [1.62, 3.63]V
31.457 32.768 34.079
IOSC32K
44.8.5
Output frequency
Current consumption
-
0.67
2.80
μA
tSTARTUP Start-up time
-
1
2
cycle
Duty
-
50
-
%
Duty Cycle
Ultra Low Power Internal 32kHz RC Oscillator (OSCULP32K) Characteristics
Table 44-44. Ultra Low Power Internal 32kHz RC Oscillator Characteristics (Device Variant A)
Symbol
Parameter
Conditions
fOUT
Output frequency Calibrated against a 32.768kHz
25.559 32.768 40.305 kHz
reference at 25°C, over [-40, +85]C,
over [1.62, 3.63]V
Typ.
Max.
Calibrated against a 32.768kHz
reference at 25°C, at VDD=3.3V
31.293 32.768 34.570
Calibrated against a 32.768kHz
reference at 25°C, over [1.62,
3.63]V
31.293 32.768 34.570
iOSCULP32K(1)(2)
© 2017 Microchip Technology Inc.
Min.
-
Datasheet Complete
-
180
Units
nA
40001882A-page 960
32-bit ARM-Based Microcontrollers
Symbol
Parameter
tSTARTUP
Duty
Conditions
Min.
Typ.
Max.
Units
Start-up time
-
10
-
cycles
Duty Cycle
-
50
-
%
Table 44-45. Ultra Low Power Internal 32kHz RC Oscillator Characteristics (Device Variant B)
Symbol Parameter
fOUT
Duty
Conditions
Min.
Output frequency Calibrated against a 32.768kHz reference
at 25°C, over [-40, +85]C, over [1.62,
3.63]V
Typ.
Max.
25.559 32.768 40.305 kHz
Calibrated against a 32.768kHz reference
at 25°C, at VDD=3.3V
31.293 32.768 34.570
Calibrated against a 32.768kHz reference
at 25°C, over [1.62, 3.63]V
31.293 32.768 34.570
Duty Cycle
Units
-
50
-
%
Note:
1. These values are based on simulation. These values are not covered by test limits in production or
characterization.
2. This oscillator is always on.
44.8.6
8MHz RC Oscillator (OSC8M) Characteristics
Table 44-46. Internal 8MHz RC Oscillator Characteristics (Device Variant A)
Symbol Parameter
Conditions
fOUT
Calibrated against a 8MHz reference at 25°C, 7.54 8
over [-40, +85]°C, over [1.62, 3.63]V
8.19 MHz
Calibrated against a 8MHz reference at 25°C, 7.94 8
at VDD=3.3V
8.06
Calibrated against a 8MHz reference at 25°C, 7.92 8
over [1.62, 3.63]V
8.08
IOSC8M
Output frequency
Min. Typ. Max. Units
Current consumption IIDLEIDLE2 on OSC32K versus IDLE2 on
calibrated OSC8M enabled at 8MHz
(FRANGE=1, PRESC=0)
64
100
μA
tSTARTUP Startup time
-
2.1
3
μs
Duty
-
50
-
%
Duty cycle
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 961
32-bit ARM-Based Microcontrollers
Table 44-47. Internal 8MHz RC Oscillator Characteristics (Device Variant B)
Symbol Parameter
Conditions
fOUT
Calibrated against a 8MHz reference at 25°C, 7.54 8
over [-40, +85]°C, over [1.62, 3.63]V
8.19 MHz
Calibrated against a 8MHz reference at 25°C, 7.94 8
at VDD=3.3V
8.06
Calibrated against a 8MHz reference at 25°C, 7.92 8
over [1.62, 3.63]V
8.06
IOSC8M
44.8.7
Output frequency
Min. Typ. Max. Units
Current consumption IIDLEIDLE2 on OSC32K versus IDLE2 on
calibrated OSC8M enabled at 8MHz
(FRANGE=1, PRESC=0)
64
96
μA
tSTARTUP Startup time
-
2.4
3.3
μs
Duty
-
50
-
%
Duty cycle
Fractional Digital Phase Locked Loop (FDPLL96M) Characteristics
Table 44-48. FDPLL96M Characteristics(1) (Device Variant A)
Symbol
Parameter
fIN
Input frequency
32
-
2000 KHz
fOUT
Output frequency
48
-
96
MHz
IFDPLL96M
Current consumption
fIN= 32 kHz, fOUT= 48 MHz
-
500
700
μA
fIN= 32 kHz, fOUT= 96 MHz
-
900
1200
fIN= 32 kHz, fOUT= 48 MHz
-
1.5
2.0
fIN= 32 kHz, fOUT= 96 MHz
-
3.0
10.0
fIN= 2 MHz, fOUT= 48 MHz
-
1.3
2.0
fIN= 2 MHz, fOUT= 96 MHz
-
3.0
7.0
After start-up, time to get lock signal.
fIN= 32 kHz, fOUT= 96 MHz
-
1.3
2
ms
fIN= 2 MHz, fOUT= 96 MHz
-
25
50
μs
40
50
60
%
Jp
tLOCK
Duty
Period jitter
Lock Time
Conditions
Duty cycle
Min. Typ. Max. Units
%
Table 44-49. FDPLL96M Characteristics(1) (Device Variant B, Die Revision E)
Symbol
Parameter
fIN
Input frequency
32
-
2000 KHz
fOUT
Output frequency
48
-
96
MHz
IFDPLL96M
Current consumption
fIN= 32 kHz, fOUT= 48 MHz
-
500
740
μA
fIN= 32 kHz, fOUT= 96 MHz
-
900
1262
© 2017 Microchip Technology Inc.
Conditions
Datasheet Complete
Min. Typ. Max. Units
40001882A-page 962
32-bit ARM-Based Microcontrollers
Symbol
Parameter
Conditions
Min. Typ. Max. Units
Jp
Period jitter
fIN= 32 kHz, fOUT= 48 MHz
-
1.5
2.5
fIN= 32 kHz, fOUT= 96 MHz
-
4.0
10.5
fIN= 2 MHz, fOUT= 48 MHz
-
1.6
2.5
fIN= 2 MHz, fOUT= 96 MHz
-
4.6
11.0
After start-up, time to get lock signal.
fIN= 32 kHz, fOUT= 96 MHz
-
1.2
2
ms
fIN= 2 MHz, fOUT= 96 MHz
-
25
50
μs
40
50
60
%
tLOCK
Duty
Lock Time
Duty cycle
%
Table 44-50. FDPLL96M Characteristics(1) (Device Variant B and C, Die Revision F)
Symbol
Parameter
fIN
Input frequency
32
-
2000 KHz
fOUT
Output frequency
48
-
96
MHz
IFDPLL96M
Current consumption
fIN= 32 kHz, fOUT= 48 MHz
-
500
-
μA
fIN= 32 kHz, fOUT= 96 MHz
-
900
-
fIN= 32 kHz, fOUT= 48 MHz
-
2.1
3.2
fIN= 32 kHz, fOUT= 96 MHz
-
3.8
9.2
fIN= 2 MHz, fOUT= 48 MHz
-
2.2
3.4
fIN= 2 MHz, fOUT= 96 MHz
-
5.0
10.5
After start-up, time to get lock signal.
fIN= 32 kHz, fOUT= 96 MHz
-
1.2
2
ms
fIN= 2 MHz, fOUT= 96 MHz
-
25
50
μs
40
50
60
%
Jp
tLOCK
Duty
Period jitter
Lock Time
Conditions
Duty cycle
Min. Typ. Max. Units
%
Note:
1. All values have been characterized with FILTSEL[1/0] as default value.
44.8.8
USB Characteristics
The USB shares the same characteristics as in the -40°C to 85°C.
44.9
Timing Characteristics
44.9.1
SERCOM in SPI Mode Timing
Data are not available in this current datasheet revision
44.9.2
SERCOM in I2C Mode Timing
Data are not available in this current datasheet revision
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 963
32-bit ARM-Based Microcontrollers
44.9.3
I2S Timing
Figure 44-5. I2S Timing Master Mode
Master mode: SCK, FS and MCK are output
MCK output
tM_SCKOR
SCK output
FS output
tM_SCKOF
tM_FSOH
tM_SDIS
tM_SDIH
tM_SCKO
tM_SDOH
tM_FSOV
tM_SDOV
SD output
LSB right ch.
MSB left ch.
SD input
Figure 44-6. I2S Timing Slave Mode
Slave mode: SCK and FS are input
tS_FSIH
SCK input
tS_SCKI
tS_FSIS
FS input
tS_SDIS
tS_SDOH
tS_SDIH
tS_SDOV
SD output
LSB rignt ch.
MSB left ch.
SD input
Figure 44-7. I2S Timing PDM2 Mode
PDM2 mode
tPDM2RS tPDM2RH
tPDM2LS
tPDM2LH
SCK input
SD input
Left
Right
Left
Right
Left
Right
Table 44-51. I2S Timing Characteristics and Requirements (Device Variant A)
Symbol
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max. Min. Typ. Max
tM_MCKOR
I2S MCK rise time(3)
Master mode /
Capacitive load CL =
15 pF
10
4.7
ns
tM_MCKOF
I2S MCK fall time(3)
Master mode /
Capacitive load CL =
15 pF
12.1
5.3
ns
dM_MCKO
I2S MCK duty cycle
Master mode
50
%
© 2017 Microchip Technology Inc.
45.4
Datasheet Complete
50
45.4
40001882A-page 964
32-bit ARM-Based Microcontrollers
Symbol
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max. Min. Typ. Max
dM_MCKI
I2S MCK duty cycle
Master mode, pin is
input (1b)
tM_SCKOR
I2S SCK rise time(2)
Master mode /
Capacitive load CL =
15 pF
9.7
4.6
ns
tM_SCKOF
I2S SCK fall time(3)
Master mode /
Capacitive load CL =
15 pF
10.2
4.5
ns
dM_SCKO
I2S SCK duty cycle
Master mode
50
%
fM_SCKO, 1/
tM_SCKO
I2S SCK frequency
Master mode,
Supposing external
device response
delay is 30ns
7.8
9.5
MHz
fS_SCKI, 1/
tS_SCKI
I2S SCK frequency
Slave mode,
Supposing external
device response
delay is 30ns
14.4
14.8 MHz
dS_SCKO
I2S SCK duty cycle
Slave mode
tM_FSOV
FS valid time
Master mode
tM_FSOH
FS hold time
Master mode
-0.9
-0.9
ns
tS_FSIS
FS setup time
Slave mode
2.3
1.5
ns
tS_FSIH
FS hold time
Slave mode
0
0
ns
tM_SDIS
Data input setup time Master mode
36.2
24.5
ns
tM_SDIH
Data input hold time
-8.2
-8.2
ns
tS_SDIS
Data input setup time Slave mode
4.8
3.9
ns
tS_SDIH
Data input hold time
1.2
1.2
ns
tM_SDOV
Data output valid time Master transmitter
tM_SDOH
Data output hold time Master transmitter
tS_SDOV
Data output valid time Slave transmitter
tS_SDOH
Data output hold time Slave transmitter
37.6
25.7
ns
tPDM2LS
Data input setup time Master mode PDM2
Left
36.2
24.5
ns
tPDM2LH
Data input hold time
-8.2
-8.2
ns
© 2017 Microchip Technology Inc.
Master mode
Slave mode
Master mode PDM2
Left
50
45.6
50
50
45.6
50
50
4.1
-0.5
%
4
5.9
4.8
-0.5
37.8
Datasheet Complete
%
ns
ns
ns
25.9
ns
40001882A-page 965
32-bit ARM-Based Microcontrollers
Symbol
Description
Mode
VDD=1.8V
VDD=3.3V
Units
Min. Typ. Max. Min. Typ. Max
tPDM2RS
Data input setup time Master mode PDM2
Right
31.9
20.9
ns
tPDM2RH
Data input hold time
-6.7
-6.7
ns
1.
2.
3.
Master mode PDM2
Right
All timing characteristics given for 15pF capacitive load.
These values are based on simulations and not covered by test limits in production.
See I/O Pin Characteristics.
Table 44-52. I2S Timing Characteristics and Requirements (Device Variant B)
Name
Description
Mode
VDD=1.8V
Min.
VDD=3.3V
Typ. Max. Min.
Units
Typ. Max.
tM_MCKOR
I2S MCK rise
time(3)
Master mode /
Capacitive load
CL = 15 pF
9.9
4.7
ns
tM_MCKOF
I2S MCK fall
time(3)
Master mode /
Capacitive load
CL = 15 pF
12.3
5.4
ns
dM_MCKO
I2S MCK duty
cycle
Master mode
50
%
dM_MCKI
I2S MCK duty
cycle
Master mode,
pin is input (1b)
tM_SCKOR
I2S SCK rise
time(3)
Master mode /
Capacitive load
CL = 15 pF
9.7
4.6
ns
tM_SCKOF
I2S SCK fall
time(3)
Master mode /
Capacitive load
CL = 15 pF
10.3
4.6
ns
dM_SCKO
I2S SCK duty
cycle
Master mode
50
%
46.9
50
47.3
50
46.9
50
50
47.2
%
fM_SCKO, 1/ I2S SCK
tM_SCKO
frequency
Master mode,
Supposing
external device
response delay
is 30ns
7.7
9.2
MHz
fS_SCKI, 1/
tS_SCKI
Slave mode,
Supposing
external device
response delay
is 30ns
12.7
13
MHz
I2S SCK
frequency
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 966
32-bit ARM-Based Microcontrollers
dS_SCKO
I2S SCK duty
cycle
Slave mode
tM_FSOV
FS valid time
Master mode
tM_FSOH
FS hold time
Master mode
-0.1
-0.1
ns
tS_FSIS
FS setup time
Slave mode
6.2
5.3
ns
tS_FSIH
FS hold time
Slave mode
0
0
ns
tM_SDIS
Data input setup
time
Master mode
37.4
25.9
ns
tM_SDIH
Data input hold
time
Master mode
-8.2
-8.2
ns
tS_SDIS
Data input setup
time
Slave mode
9.2
8.3
ns
tS_SDIH
Data input hold
time
Slave mode
3.8
3.7
ns
tM_SDOV
Data output valid Master
time
transmitter
tM_SDOH
Data output hold Master
time
transmitter
tS_SDOV
Data output valid Slave
time
transmitter
tS_SDOH
Data output hold Slave
time
transmitter
30.6
18.9
ns
tPDM2LS
Data input setup
time
Master mode
PDM2 Left
36.9
25.3
ns
tPDM2LH
Data input hold
time
Master mode
PDM2 Left
-8.2
-8.2
ns
tPDM2RS
Data input setup
time
Master mode
PDM2 Right
31.9
21.1
ns
tPDM2RH
Data input hold
time
Master mode
PDM2 Right
-7
-7
ns
1.
2.
3.
50
50
2.6
1.9
2.7
-0.1
%
1.9
-0.1
ns
ns
ns
31.2
19.7 ns
All timing characteristics given for 15pF capacitive load.
These values are based on simulations and not covered by test limits in production.
See I/O Pin Characteristics
© 2017 Microchip Technology Inc.
Datasheet Complete
40001882A-page 967
32-bit ARM-Based Microcontrollers
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Datasheet Complete
40001882A-page 968
32-bit ARM-Based Microcontrollers
SAMD 21 E 15 A - M U T
Product Family
Package Carrier
SAMD = General Purpose Microcontroller
No character = Tray (Default)
T = Tape and Reel
Product Series
21 = Cortex M0 + CPU, Basic Feature Set
+ DMA + USB
Package Grade
Pin Count
U = -40 - 85 C Matte Sn Plating
F = -40 - 125 C Matte Sn Plating
O
O
E = 32 Pins (35 Pins for WLCSP)
G = 48 Pins (45 Pins for WLCSP)
J = 64 Pins
Package Type
Flash Memory Density
A = TQFP
M = QFN
U = WLCSP
C = UFBGA
18 = 256KB
17 = 128KB
16 = 64KB
15 = 32KB
Device Variant
A = Default Variant
B = Added RWW support for 32KB and 64KB memory options
C = Silicon revision F for WLCSP35 package option.
Note:
1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used
for ordering purposes and is not printed on the device package. Check with your Microchip Sales
Office for package availability with the Tape and Reel option.
2. Small form-factor packaging options may be available. Please check http://www.microchip.com/
packaging for small-form factor package availability, or contact your local Sales Office.
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip devices:
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•
•
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the
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There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside the
operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is
engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the
code protection features of our products. Attempts to break Microchip’s code protection feature may be a
violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software
or other copyrighted work, you may have a right to sue for relief under that Act.
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Datasheet Complete
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32-bit ARM-Based Microcontrollers
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ISBN: 978-1-5224-1346-2
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32-bit ARM-Based Microcontrollers
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Spain - Madrid
Raleigh, NC
Fax: 86-755-8203-1760
Tel: 886-7-213-7830
Tel: 34-91-708-08-90
Tel: 919-844-7510
China - Wuhan
Taiwan - Taipei
Fax: 34-91-708-08-91
New York, NY
Tel: 86-27-5980-5300
Tel: 886-2-2508-8600
Sweden - Gothenberg
Tel: 631-435-6000
Fax: 86-27-5980-5118
Fax: 886-2-2508-0102
Tel: 46-31-704-60-40
San Jose, CA
China - Xian
Thailand - Bangkok
Sweden - Stockholm
Tel: 408-735-9110
Tel: 86-29-8833-7252
Tel: 66-2-694-1351
Tel: 46-8-5090-4654
Tel: 408-436-4270
Fax: 86-29-8833-7256
Fax: 66-2-694-1350
UK - Wokingham
Canada - Toronto
Tel: 44-118-921-5800
Tel: 905-695-1980
Fax: 44-118-921-5820
Fax: 905-695-2078
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Datasheet Complete
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