SMART ARM-based Microcontroller
SAM L21E / SAM L21G / SAM L21J Summary
DATASHEET SUMMARY
Introduction
®
Atmel | SMART SAM L21 is a series of Ultra low-power microcontrollers
®
®
using the 32-bit ARM Cortex -M0+ processor at max. 48MHz (2.46
®
CoreMark /MHz) and up to 256KB Flash and 40KB of SRAM in a 32, 48,
and 64 pin package. The sophisticated power management technologies,
such as power domain gating, SleepWalking, Ultra low-power peripherals
and more, allow for very low current consumptions. The highly configurable
peripherals include a touch controller supporting capacitive interfaces with
proximity sensing.
Features
This is a summary document. A
complete document is available
on our Web site at
www.atmel.com
•
Processor
– ARM Cortex-M0+ CPU running at up to 48MHz
• Single-cycle hardware multiplier
• Micro Trace Buffer
•
Memories
– 32/64/128/256KB in-system self-programmable Flash
– 1/2/4/8KB Flash Read-While-Write section
– 4/8/16/32KB SRAM Main Memory
– 2/4/8/8KB SRAM Low power Memory
•
System
– Power-on reset (POR) and brown-out detection (BOD)
– Internal and external clock options
– External Interrupt Controller (EIC)
– 16 external interrupts
– One non-maskable interrupt
– Two-pin Serial Wire Debug (SWD) programming, test and
debugging interface
•
Low Power
– Idle, Standby, Backup, and Off sleep modes
– SleepWalking peripherals
Atmel-42385J-SAM L21_Datasheet_Summary-06/2016
–
–
–
–
•
Peripherals
– 16-channel Direct Memory Access Controller (DMAC)
– 12-channel Event System
– Up to five 16-bit Timer/Counters (TC) including one low-power TC, each configurable as:
–
–
–
–
–
–
–
–
–
–
–
–
–
–
•
Static and Dynamic Power Gating Architecture
Battery backup support
Two Performance Levels
Embedded Buck/LDO regulator supporting on-the-fly selection
• 16-bit TC with two compare/capture channels
• 8-bit TC with two compare/capture channels
• 32-bit TC with two compare/capture channels, by using two TCs
Two 24-bit and one 16-bit Timer/Counters for Control (TCC), with extended functions:
• Up to four compare channels with optional complementary output
• Generation of synchronized pulse width modulation (PWM) pattern across port pins
• Deterministic fault protection, fast decay and configurable dead-time between
complementary output
• Dithering that increase resolution with up to 5 bit and reduce quantization error
32-bit Real Time Counter (RTC) with clock/calendar function
Watchdog Timer (WDT)
CRC-32 generator
One full-speed (12Mbps) Universal Serial Bus (USB) 2.0 interface
• Embedded host and device function
• Eight endpoints
Up to six Serial Communication Interfaces (SERCOM) including one low-power SERCOM,
each configurable to operate as either:
• USART with full-duplex and single-wire half-duplex configuration
• I2C up to 3.4MHz
• SPI
• LIN slave
One AES encryption engine
One True Random Generator (TRNG)
One Configurable Custom Logic (CCL)
One 12-bit, 1MSPS Analog-to-Digital Converter (ADC) with up to 20 channels
• Differential and single-ended input
• Automatic offset and gain error compensation
• Oversampling and decimation in hardware to support 13-, 14-, 15-, or 16-bit resolution
Two 12-bit, 1MSPS Dual Output Digital-to-Analog Converter (DAC)
Two Analog Comparators (AC) with window compare function
Three Operational Amplifiers (OPAMP)
Peripheral Touch Controller (PTC)
• 169-Channel capacitive touch and proximity sensing
• Wake-up on touch in standby mode
Oscillators
– 32.768kHz crystal oscillator (XOSC32K)
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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•
–
–
–
–
–
–
I/O
–
0.4-32MHz crystal oscillator (XOSC)
32.768kHz internal oscillator (OSC32K)
32.768kHz ultra-low-power internal oscillator (OSCULP32K)
16/12/8/4MHz high-accuracy internal oscillator (OSC16M)
48MHz Digital Frequency Locked Loop (DFLL48M)
96MHz Fractional Digital Phased Locked Loop (FDPLL96M)
Up to 51 programmable I/O pins
•
•
Easy migration from SAM D family
Packages
– 64-pin TQFP, QFN, WLCSP
– 48-pin TQFP, QFN
– 32-pin TQFP, QFN
•
Operating Voltage
– 1.62V – 3.63V
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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Table of Contents
Introduction......................................................................................................................1
1. Description.................................................................................................................5
Features.......................................................................................................................... 1
2. Configuration Summary............................................................................................. 7
3. Ordering Information................................................................................................10
3.1.
3.2.
3.3.
3.4.
SAM L21J...................................................................................................................................10
SAM L21G.................................................................................................................................. 11
SAM L21E...................................................................................................................................11
Device Identification....................................................................................................................11
4. Block Diagram......................................................................................................... 13
5. Pinout.......................................................................................................................15
5.1.
5.2.
5.3.
5.4.
SAM L21J...................................................................................................................................15
SAM L21J WLCSP64................................................................................................................. 16
SAM L21G..................................................................................................................................17
SAM L21E.................................................................................................................................. 18
6. Product Mapping......................................................................................................19
7. Processor and Architecture..................................................................................... 20
7.1.
7.2.
7.3.
7.4.
Cortex M0+ Processor................................................................................................................20
Nested Vector Interrupt Controller..............................................................................................21
Micro Trace Buffer...................................................................................................................... 23
High-Speed Bus System............................................................................................................ 24
8. Packaging Information............................................................................................. 29
8.1.
8.2.
8.3.
Thermal Considerations............................................................................................................. 29
Package Drawings......................................................................................................................30
Soldering Profile......................................................................................................................... 39
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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1.
Description
®
®
®
Atmel | SMART SAM L21 is a series of Ultra low-power microcontrollers using the 32-bit ARM Cortex M0+ processor, and ranging from 32- to 64-pins with up to 256KB Flash and 40KB of SRAM. The SAM
®
L21 devices operate at a maximum frequency of 48MHz and reach 2.46 CoreMark /MHz. They are
designed for simple and intuitive migration with identical peripheral modules, hex compatible code,
identical linear address map and pin compatible migration paths between all devices in the product
series. All devices include intelligent and flexible peripherals, Atmel Event System for inter-peripheral
signaling, and support for capacitive touch button, slider and wheel user interfaces.
The Atmel SAM L21 devices provide the following features: In-system programmable Flash, 16-channel
direct memory access (DMA) controller, 12-channel Event System, programmable interrupt controller, up
to 51 programmable I/O pins, 32-bit real-time clock and calendar, up to five 16-bit Timer/Counters (TC)
and three Timer/Counters for Control (TCC) where each TC/TCC can be configured to perform frequency
and waveform generation, accurate program execution timing or input capture with time and frequency
measurement of digital signals. The TCs can operate in 8- or 16-bit mode, selected TCs can be cascaded
to form a 32-bit TC, and three timer/counters have extended functions optimized for motor, lighting and
other control applications. Two TCC can operate in 24-bit mode, the third TCC can operate in 16-bit
mode. The series provide one full-speed USB 2.0 embedded host and device interface; up to six Serial
Communication Modules (SERCOM) that each can be configured to act as an USART, UART, SPI, I2C up
to 3.4MHz, SMBus, PMBus, and LIN slave; up to twenty channel 1MSPS 12-bit ADC with programmable
gain and optional oversampling and decimation supporting up to 16-bit resolution, two 12-bit 1MSPS
DACs, two analog comparators with window mode, three independent cascadable OPAMPs supporting
internal connection with others analog features, Peripheral Touch Controller supporting up to 192 buttons,
sliders, wheels and proximity sensing; programmable Watchdog Timer, brown-out detector and power-on
reset and two-pin Serial Wire Debug (SWD) program and debug interface.
All devices have accurate and low-power external and internal oscillators. All oscillators can be used as a
source for the system clock. Different clock domains can be independently configured to run at different
frequencies, enabling power saving by running each peripheral at its optimal clock frequency, and thus
maintaining a high CPU frequency while reducing power consumption.
The SAM L21 devices have four software-selectable sleep modes, idle, standby, backup and off. In idle
mode the CPU is stopped while all other functions can be kept running. In standby all clocks and
functions are stopped except those selected to continue running. In this mode all RAMs and logic
contents are retained. The device supports SleepWalking. This feature allows the peripheral to wake up
from sleep based on predefined conditions, and thus allows some internal operation like DMA transfer
and/or the CPU to wake up only when needed, e.g. when a threshold is crossed or a result is ready. The
Event System supports synchronous and asynchronous events, allowing peripherals to receive, react to
and send events even in standby mode.
The SAM L21 devices have two software-selectable performance levels (PL0 and PL2) allowing the user
to scale the lowest core voltage level that will support the operating frequency. To further minimize
consumption, specifically leakage dissipation, the SAM L21 devices utilizes power domain gating
technique with retention to turn off some logic area while keeping its logic state. This technique is fully
handled by hardware.
The Flash program memory can be reprogrammed in-system through the SWD interface. The same
interface can be used for nonintrusive on-chip debugging of application code. A boot loader running in the
device can use any communication interface to download and upgrade the application program in the
Flash memory.
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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The Atmel SAM L21 devices are supported with a full suite of programs and system development tools,
including C compilers, macro assemblers, program debugger/simulators, programmers and evaluation
kits.
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2.
Configuration Summary
SAM L21J
SAM L21G
SAM L21E
Pins
64
48
32
General Purpose I/Opins (GPIOs)
51
37
25
Flash
256/128/64KB
256/128/64KB
256/128/64/32KB
Flash RWW section
8/4/2KB
8/4/2KB
8/4/2/1KB
System SRAM
32/16/8KB
32/16/8KB
32/16/8/4KB
Low Power SRAM
8/8/4KB
8/8/4KB
8/8/4/2KB
Timer Counter (TC)
instances(1)
5
3
3
Waveform output
channels per TC
instance
2
2
2
Timer Counter for
3
Control (TCC) instances
3
3
Waveform output
channels per TCC
8/4/2
8/4/2
6/4/2
DMA channels
16
16
16
USB interface
1
1
1
AES engine
1
1
1
Configurable Custom
Logic (CCL) (LUTs)
4
4
4
True Random Generator 1
(TRNG)
1
1
Serial Communication
Interface (SERCOM)
instances
6
6
6
Analog-to-Digital
Converter (ADC)
channels
20
14
10
Analog Comparators
(AC)
2
2
2
Digital-to-Analog
Converter (DAC)
channels
2
2
2
Operational Amplifier
(OPAMP)
3
3
3
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SAM L21J
SAM L21G
SAM L21E
Real-Time Counter
(RTC)
Yes
Yes
Yes
RTC alarms
1
1
1
RTC compare values
One 32-bit value or
One 32-bit value or
One 32-bit value or
two 16-bit values
two 16-bit values
two 16-bit values
External Interrupt lines
16
16
16
Peripheral Touch
Controller (PTC)
channels (X- x Y-Lines)
for mutual capacitance
169 (13x13)
81 (9x9)
42 (7x6)
Peripheral Touch
Controller (PTC)
channels for self
capacitance (Y-Lines
only) (3)
16
10
7
Maximum CPU
frequency
48MHz
Packages
QFN
QFN
QFN
TQFP
TQFP
TQFP
(2)
WLCSP(4)
Oscillators
32.768kHz crystal oscillator (XOSC32K)
0.4-32MHz crystal oscillator (XOSC)
32.768kHz internal oscillator (OSC32K)
32KHz ultra-low-power internal oscillator (OSCULP32K)
16/12/8/4MHz high-accuracy internal oscillator (OSC16M)
48MHz Digital Frequency Locked Loop (DFLL48M)
96MHz Fractional Digital Phased Locked Loop (FDPLL96M)
Event System channels
12
12
12
SW Debug Interface
Yes
Yes
Yes
Watchdog Timer (WDT)
Yes
Yes
Yes
Note:
1. For SAM L21E and SAM L21G, only TC0, TC1 and TC4 are available.
2. The number of X- and Y-lines depends on the configuration of the device, as some I/O lines can be
configured as either X-lines or Y-lines. Refer to Multiplexed Signals for details. The number in the
Configuration Summary is the maximum number of channels that can be obtained.
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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3.
4.
The number of Y-lines depends on the configuration of the device, as some I/O lines can be
configured as either X-lines or Y-lines. The number given here is the maximum number of Y-lines
that can be obtained.
WLCSP parts are programmed with a specific SPI bootloader. Refer to Application Note AT09002
for details.
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3.
Ordering Information
SAML 21 E 15 B - M U T
Product Family
Package Carrier
SAML = Low Power ULP Microcontroller
T = Tape and Reel
Product Series
21 = Cortex M0 + CPU, Advanced Feature Set
+ DMA + USB
Package Grade
U = 40 - 85 C Matte Sn Plating
O
Pin Count
Package Type
E = 32 Pins
G = 48 Pins
J = 64 Pins
A = TQFP
M = QFN
U = WLCSP
Flash Memory Density
18 = 256KB
17 = 128KB
16 = 64KB
15 = 32KB
Device Variant
A = Engineering Samples Only
B = Released to Production
Note: The device variant (last letter of the ordering number) is independent of the die revision
(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks
evolution of the die.
3.1.
SAM L21J
Table 3-1. SAM L21J Ordering Codes
Ordering Code
ATSAML21J16B-AUT
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
64K
8K
TQFP64
Tape & Reel
ATSAML21J16B-MUT
ATSAML21J17B-AUT
QFN64
128K
16K
TQFP64
ATSAML21J17B-MUT
QFN64
ATSAML21J17B-UUT
WLCSP64
ATSAML21J18B-AUT
256K
32K
TQFP64
ATSAML21J18B-MUT
QFN64
ATSAML21J18B-UUT
WLCSP64
Tape & Reel
Tape & Reel
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3.2.
SAM L21G
Table 3-2. SAM L21G Ordering Codes
Ordering Code
ATSAML21G16B-AUT
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
64K
8K
TQFP48
Tape & Reel
ATSAML21G16B-MUT
ATSAML21G17B-AUT
QFN48
128K
16K
TQFP48
ATSAML21G17B-MUT
ATSAML21G18B-AUT
QFN48
256K
32K
TQFP48
ATSAML21G18B-MUT
3.3.
Tape & Reel
Tape & Reel
QFN48
SAM L21E
Table 3-3. SAM L21E
Ordering Code
ATSAML21E15B-AUT
FLASH (bytes)
SRAM (bytes)
Package
Carrier Type
32K
4K
TQFP32
Tape & Reel
ATSAML21E15B-MUT
ATSAML21E16B-AUT
QFN32
64K
8K
TQFP32
ATSAML21E16B-MUT
ATSAML21E17B-AUT
QFN32
128K
16K
TQFP32
ATSAML21E17B-MUT
ATSAML21E18B-AUT
Tape & Reel
QFN32
256K
32K
TQFP32
ATSAML21E18B-MUT
3.4.
Tape & Reel
Tape & Reel
QFN32
Device Identification
The DSU - Device Service Unit peripheral provides the Device Selection bits in the Device Identification
register (DID.DEVSEL) in order to identify the device by software. The SAM L21 variants have a reset
value of DID=0x1081drxx, with the LSB identifying the die number ('d'), the die revision ('r') and the device
selection ('xx').
Table 3-4. SAM L21 Device Identification Values
DEVSEL (DID[7:0])
Device
0x00
SAML21J18A
0x01
SAML21J17A
0x02
SAML21J16A
0x03-0x04
Reserved
0x05
SAML21G18A
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DEVSEL (DID[7:0])
Device
0x06
SAML21G17A
0x07
SAML21G16A
0x08-0x09
Reserved
0x0A
SAML21E18A
0x0B
SAML21E17A
0x0C
SAML21E16A
0x0D
SAML21E15A
0x0E
Reserved
0x0F
SAML21J18B
0x10
SAML21J17B
0x11
SAML21J16B
0x12-0x13
Reserved
0x14
SAML21G18B
0x15
SAML21G17B
0x16
SAML21G16B
0x17-0x18
Reserved
0x19
SAML21E18B
0x1A
SAML21E17B
0x1B
SAML21E16B
0x1C
SAML21E15B
0x1D-0xFF
Reserved
Note: The device variant (last letter of the ordering number) is independent of the die revision
(DSU.DID.REVISION): The device variant denotes functional differences, whereas the die revision marks
evolution of the die.
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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IOBUS
SWCLK
CORTEX-M0+
PROCESSOR
Fmax 48 MHz
SERIAL
WIRE
EVENT
SWDIO
MEMORY
TRACE BUFFER
Block Diagram
DEVICE
SERVICE
UNIT
256/128/64/32KB
NVM
32/16/8/4KB
RAM
NVM
CONTROLLER
Cache
SRAM
CONTROLLER
S
M
M
S
S
HIGH SPEED
BUS MATRIX
S
S
M
M
S
DP
USB FS
DEVICE
MINI-HOST
DM
SOF 1KHZ
8/8/4/2KB
RAM
AHB-APB
BRIDGE B
S
LP SRAM
CONTROLLER
S
LOW POWER
BUS MATRIX
PERIPHERAL
ACCESS
CONTROLLER
S
DMA
M
S
S
EVENT
AHB-APB
BRIDGE D
AHB-APB
BRIDGE C
DMA
56xxSERCOM
SERCOM
MAIN CLOCKS
CONTROLLER
OSCILLATORS CONTROLLER
OSC16M
XIN
XOUT
XOSC
GCLK_IO[7..0]
FDPLL96M
GENERIC CLOCK
CONTROLLER
WO0
4 x TIMER / COUNTER
EVENT 8 x Timer Counter
WO1
DMA
WO0
WO1
(2)
WOn
DMA
DMA
WATCHDOG
TIMER
EXTINT[15..0]
NMI
DMA
3x TIMER / COUNTER
FOR CONTROL
EVENT
EVENT SYSTEM
DFLL48M
EXTERNAL INTERRUPT
CONTROLLER
TIMER / COUNTER
OSCULP32K
OSC32K
20-CHANNEL
12-bit ADC 1MSPS
EVENT
SUPPLY CONTROLLER
BOD33
DMA
EVENT
VREF
VREG
EVENT
RESET
EXTWAKEx
VOUT[1..0]
VREFA
PAD0
PAD1
PAD2
PAD3
WO0
DMA
OSC32K CONTROLLER
XOSC32K
TRNG
Dual Channels
12-bit DAC 1MSPS
EVENT
SERCOM
XIN32
XOUT32
AES
DMA
POWER
MANAGER
PAD0
PAD1
PAD2
PAD3
EVENT
AHB-APB
BRIDGE A
PORT
AHB-APB
BRIDGE E
PORT
4.
2 ANALOG
COMPARATORS
PERIPHERAL
TOUCH
CONTROLLER
WO1
AIN[19..0]
VREFA
VREFB
AIN[3..0]
X[15..0]
Y[15..0]
OA_NEG
RESET
CONTROLLER
3 x OPAMP
REAL TIME
COUNTER
4 x CCL
OA_POS
OA_OUT
IN[2..0]
EVENT
OUT
EVENT
Note:
1. Some products have different number of SERCOM instances, Timer/Counter instances, PTC
signals and ADC signals.
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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2.
The three TCC instances have different configurations, including the number of Waveform Output
(WO) lines.
Atmel SAM L21E / SAM L21G / SAM L21J Summary [DATASHEET]
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Pinout
5.1.
SAM L21J
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PB03
PB02
PB01
PB00
PB31
PB30
PA31
PA30
VDDIN
VSW
GND
VDDCORE
RESET
PA27
PB23
PB22
5.
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
VDDIO
GND
PA25
PA24
PA23
PA22
PA21
PA20
PB17
PB16
PA19
PA18
PA17
PA16
VDDIO
GND
25
26
27
28
29
30
31
32
24
17
18
19
20
21
22
23
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PA08
PA09
PA10
PA11
VDDIO
GND
PB10
PB11
PB12
PB13
PB14
PB15
PA12
PA13
PA14
PA15
PA00
PA01
PA02
PA03
PB04
PB05
GNDANA
VDDANA
PB06
PB07
PB08
PB09
PA04
PA05
PA06
PA07
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED INPUT/OUTPUT SUPPLY
RESET PIN
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5.2.
SAM L21J WLCSP64
8
R
Q
P
N
M
L
K
J
H
G
F
E
D
C
B
A
7
PA16
6
5
PB16
PA13
PB13
PB10
PB08
PB30
PB06
PA00
PA02
PB01
PA01
GNDANA
VDDANA
PB31
PB04
PA06
PB07
PA30
PB00
PA07
PA04
GND
VDDIN
PB05
PB09
PA05
PA31
PB11
PA09
VDDCORE
VSW
PB02
PA10
PA08
PB23
PB12
GND
RESET
PA27
PB17
VDDIO
PA11
PA24
VDDIO
PB14
PB22
GND
PA21
PB15
1
PA25
PA19
GND
PA12
2
VDDIO
PA23
PA18
PA14
3
PA22
PA20
PA17
PA15
4
PA03
PB03
REGULATED INPUT/OUPUT SUPPLY
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48
47
46
45
44
43
42
41
40
39
38
37
PB03
PB02
PA31
PA30
VDDIN
VSW
GND
VDDCORE
RESET
PA27
PB23
PB22
SAM L21G
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
VDDIO
GND
PA25
PA24
PA23
PA22
PA21
PA20
PA19
PA18
PA17
PA16
13
14
15
16
17
18
19
20
21
22
23
24
PA00
PA01
PA02
PA03
GNDANA
VDDANA
PB08
PB09
PA04
PA05
PA06
PA07
PA08
PA09
PA10
PA11
VDDIO
GND
PB10
PB11
PA12
PA13
PA14
PA15
5.3.
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED INPUT/OUTPUT SUPPLY
RESET PIN
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32
31
30
29
28
27
26
25
PA31
PA30
VDDIN
VSW
GND
VDDCORE
RESET
PA27
SAM L21E
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
PA25
PA24
PA23
PA22
PA19
PA18
PA17
PA16
9
10
11
12
13
14
15
16
PA00
PA01
PA02
PA03
PA04
PA05
PA06
PA07
VDDANA
GND
PA08
PA09
PA10
PA11
PA14
PA15
5.4.
DIGITAL PIN
ANALOG PIN
OSCILLATOR
GROUND
INPUT SUPPLY
REGULATED INPUT/OUTPUT SUPPLY
RESET PIN
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6.
Product Mapping
Figure 6-1. Atmel SAM L21 Product Mapping
Global Memory Space
0x00000000
Code
0x40000000
0x00000000
Internal Flash
Code
0x20000000
0x00400000
SRAM
Undefined
0x40000800
Reserved
SRAM
0x20000000
0x40000000
0x43000000
Reserved
SRAM
Low Power
0x40002400
AHB-APB
0x40000000
0x60000200
AHB-APB
Bridge A
System
Reserved
Reserved
0x42000000
AHB-APB
Bridge C
SCS
Reserved
0x43000000
AHB-APB
Bridge D
ROMTable
Reserved
0x41004000
0x41006000
0x41008000
0x41FFFFFF
RSTC
OSCCTRL
OSC32KCTRL
SUPC
GCLK
WDT
RTC
EIC
PORT
Reserved
0x40FFFFFF
USB
AHB-APB Bridge D
0x43000000
0x43000400
0x43000800
AHB-APB
Bridge E
AHB-APB Bridge E
0x43001400
DSU
0x44000000
NVMCTRL
0x44000400
MTB
0x44000800
Reserved
0x44FFFFFF
0x42000000
0x42000400
0x42000800
0x42000C00
0x42001000
SERCOM0
SERCOM1
SERCOM2
SERCOM3
SERCOM4
0x42001400
TCC0
0x42001800
TCC1
0x42001C00
TCC2
TC0
0x42002400
0x43000C00
0x44FFFFFF
AHB-APB Bridge C
0x42002000
0x44000000
AHB-APB Bridge B
0x41002000
0x40002C00
MCLK
AHB-APB
Bridge B
System
0x41000000
0x40002800
PM
0x41000000
0xFFFFFFFF
0xFFFFFFFF
0x40002000
0x30002000
Undefined
0xE0100000
0x40001800
0x40001C00
0x60000000
0xE00FF000
0x40001000
0x20008000
0x30000000
0xE000F000
0x40000C00
0x40001400
Internal SRAM
Peripherals
0xE000E000
0x40000400
0x1FFFFFFF
0x22008000
0xE0000000
AHB-APB Bridge A
0x43001000
PAC
0x43001800
DMAC
0x43001C00
Reserved
0x43002000
EVSYS
0x42002C00
SERCOM5
0x42003000
TC4
0x42003400
ADC
0x42003800
AC
0x42003C00
PTC
TC1
0x42002800
TC2
TC3
DAC
AES
0x42FFFFFF
TRNG
Reserved
OPAMP
CCL
Reserved
0x43FFFFFF
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7.
Processor and Architecture
7.1.
Cortex M0+ Processor
®
™
The Atmel SAM L21 implements the ARM Cortex -M0+ processor, based on the ARMv6 Architecture
®
and Thumb -2 ISA. The Cortex M0+ is 100% instruction set compatible with its predecessor, the CortexM0 core, and upward compatible to Cortex-M3 and M4 cores. The implemented ARM Cortex-M0+ is
revision r0p1. For more information refer to http://www.arm.com
7.1.1.
Cortex M0+ Configuration
Table 7-1. Cortex M0+ Configuration in Atmel SAM L21
Features
Cortex M0+ options
Atmel SAM L21 configuration
Interrupts
External interrupts 0-32
29
Data endianness
Little-endian or big-endian
Little-endian
SysTick timer
Present or absent
Present
Number of watchpoint
comparators
0, 1, 2
2
Number of breakpoint
comparators
0, 1, 2, 3, 4
4
Halting debug support
Present or absent
Present
Multiplier
Fast or small
Fast (single cycle)
Single-cycle I/O port
Present or absent
Present
Wake-up interrupt controller
Supported or not supported
Not supported
Vector Table Offset Register
Present or absent
Present
Unprivileged/Privileged support
Present or absent
Absent - All software run in
privileged mode only
Memory Protection Unit
Not present or 8-region
Not present
Reset all registers
Present or absent
Absent
Instruction fetch width
16-bit only or mostly 32-bit
32-bit
The ARM Cortex-M0+ core has two bus interfaces:
•
•
7.1.1.1.
Single 32-bit AMBA-3 AHB-Lite system interface that provides connections to peripherals and all
system memory including Flash memory and RAM
Single 32-bit I/O port bus interfacing to the PORT with 1-cycle loads and stores
Cortex M0+ Peripherals
•
•
System Control Space (SCS)
– The processor provides debug through registers in the SCS. Refer to the Cortex-M0+
Technical Reference Manual for details (http://www.arm.com)
Nested Vectored Interrupt Controller (NVIC)
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–
•
•
•
External interrupt signals connect to the NVIC, and the NVIC prioritizes the interrupts.
Software can set the priority of each interrupt. The NVIC and the Cortex-M0+ processor core
are closely coupled, providing low latency interrupt processing and efficient processing of late
arriving interrupts. Refer to the Cortex-M0+ Technical Reference Manual for details (http://
www.arm.com).
Note: When the CPU frequency is much higher than the APB frequency it is recommended
to insert a memory read barrier after each CPU write to registers mapped on the APB. Failing
to do so in such conditions may lead to unexpected behavior such as e.g. re-entering a
peripheral interrupt handler just after leaving it.
System Timer (SysTick)
– The System Timer is a 24-bit timer clocked by CLK_CPU that extends the functionality of both
the processor and the NVIC. Refer to the Cortex-M0+ Technical Reference Manual for details
(http://www.arm.com).
System Control Block (SCB)
– The System Control Block provides system implementation information, and system control.
This includes configuration, control, and reporting of the system exceptions. Refer to the
Cortex-M0+ Devices Generic User Guide for details (http://www.arm.com)
Micro Trace Buffer (MTB)
– The CoreSight MTB-M0+ (MTB) provides a simple execution trace capability to the CortexM0+ processor. Refer to section MTB-Micro Trace Buffer and the CoreSight MTB-M0+
Technical Reference Manual for details (http://www.arm.com).
Related Links
Nested Vector Interrupt Controller on page 21
7.1.1.2.
Cortex M0+ Address Map
Table 7-2. Cortex-M0+ Address Map
7.1.1.3.
Address
Peripheral
0xE000E000
System Control Space (SCS)
0xE000E010
System Timer (SysTick)
0xE000E100
Nested Vectored Interrupt Controller (NVIC)
0xE000ED00
System Control Block (SCB)
0x41006000
Micro Trace Buffer (MTB)
I/O Interface
®
™
The device allows direct access to PORT registers. Accesses to the AMBA AHB-Lite and the single
cycle I/O interface can be made concurrently, so the Cortex M0+ processor can fetch the next instructions
while accessing the I/Os. This enables single cycle I/O access to be sustained for as long as necessary.
7.2.
Nested Vector Interrupt Controller
7.2.1.
Overview
The Nested Vectored Interrupt Controller (NVIC) in the SAM L21 supports 32 interrupt lines with four
different priority levels. For more details, refer to the Cortex-M0+ Technical Reference Manual (http://
www.arm.com).
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7.2.2.
Interrupt Line Mapping
Each of the 28 interrupt lines is connected to one peripheral instance, as shown in the table below. Each
peripheral can have one or more interrupt flags, located in the peripheral’s Interrupt Flag Status and Clear
(INTFLAG) register.
An interrupt flag is set when the interrupt condition occurs. Each interrupt in the peripheral can be
individually enabled by writing a 1 to the corresponding bit in the peripheral’s Interrupt Enable Set
(INTENSET) register, and disabled by writing 1 to the corresponding bit in the peripheral’s Interrupt
Enable Clear (INTENCLR) register.
An interrupt request is generated from the peripheral when the interrupt flag is set and the corresponding
interrupt is enabled.
The interrupt requests for one peripheral are ORed together on system level, generating one interrupt
request for each peripheral. An interrupt request will set the corresponding interrupt pending bit in the
NVIC interrupt pending registers (SETPEND/CLRPEND bits in ISPR/ICPR).
For the NVIC to activate the interrupt, it must be enabled in the NVIC interrupt enable register (SETENA/
CLRENA bits in ISER/ICER). The NVIC interrupt priority registers IPR0-IPR7 provide a priority field for
each interrupt.
Table 7-3. Interrupt Line Mapping
Peripheral source
NVIC line
EIC NMI – External Interrupt Controller
NMI
PM – Power Manager
0
MCLK - Main Clock
OSCCTRL - Oscillators Controller
OSC32KCTRL - 32KHz Oscillators Controller
SUPC - Supply Controller
PAC - Protecion Access Controller
WDT – Watchdog Timer
1
RTC – Real Time Counter
2
EIC – External Interrupt Controller
3
NVMCTRL – Non-Volatile Memory Controller
4
DMAC - Direct Memory Access Controller
5
USB - Universal Serial Bus
6
EVSYS – Event System
7
SERCOM0 – Serial Communication Interface 0
8
SERCOM1 – Serial Communication Interface 1
9
SERCOM2 – Serial Communication Interface 2
10
SERCOM3 – Serial Communication Interface 3
11
SERCOM4 – Serial Communication Interface 4
12
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Peripheral source
NVIC line
SERCOM5 – Serial Communication Interface 5
13
TCC0 – Timer Counter for Control 0
14
TCC1 – Timer Counter for Control 1
15
TCC2 – Timer Counter for Control 2
16
TC0 – Timer Counter 0
17
TC1 – Timer Counter 1
18
TC2 – Timer Counter 2
19
TC3 – Timer Counter 3
20
TC4 – Timer Counter 4
21
ADC – Analog-to-Digital Converter
22
AC – Analog Comparator
23
DAC – Digital-to-Analog Converter
24
PTC – Peripheral Touch Controller
25
AES - Advanced Encrytpion Standard module
26
TRNG - True Random Number Generator
27
7.3.
Micro Trace Buffer
7.3.1.
Features
•
•
•
•
7.3.2.
Program flow tracing for the Cortex-M0+ processor
MTB SRAM can be used for both trace and general purpose storage by the processor
The position and size of the trace buffer in SRAM is configurable by software
CoreSight compliant
Overview
When enabled, the MTB records the changes in program flow that are reported by the Cortex-M0+
processor over the execution trace interface. This interface is shared between the Cortex-M0+ processor
and the CoreSight MTB-M0+. The information is stored by the MTB in the SRAM as trace packets. An offchip debugger can extract the trace information using the Debug Access Port to read the trace
information from the SRAM. The debugger can then reconstruct the program flow from this information.
The MTB stores trace information into the SRAM and gives the processor access to the SRAM
simultaneously. The MTB ensures that trace write accesses have priority over processor accesses.
An execution trace packet consists of a pair of 32-bit words that the MTB generates when it detects a
non-sequential change of the program pounter (PC) value. A non-sequential PC change can occur during
branch instructions or during exception entry. See the CoreSight MTB-M0+ Technical Reference Manual
for more details on the MTB execution trace packet format.
Tracing is enabled when the MASTER.EN bit in the Master Trace Control Register is 1. There are various
ways to set the bit to 1 to start tracing, or to 0 to stop tracing. See the CoreSight Cortex-M0+ Technical
Reference Manual for more details on the Trace start and stop and for a detailed description of the MTB’s
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MASTER register. The MTB can be programmed to stop tracing automatically when the memory fills to a
specified watermark level or to start or stop tracing by writing directly to the MASTER.EN bit. If the
watermark mechanism is not being used and the trace buffer overflows, then the buffer wraps around
overwriting previous trace packets.
The base address of the MTB registers is 0x41006000; this address is also written in the CoreSight ROM
Table. The offset of each register from the base address is fixed and as defined by the CoreSight MTBM0+ Technical Reference Manual. The MTB has four programmable registers to control the behavior of
the trace features:
•
POSITION: Contains the trace write pointer and the wrap bit
•
•
•
MASTER: Contains the main trace enable bit and other trace control fields
FLOW: Contains the WATERMARK address and the AUTOSTOP and AUTOHALT control bits
BASE: Indicates where the SRAM is located in the processor memory map. This register is
provided to enable auto discovery of the MTB SRAM location by a debug agent
See the CoreSight MTB-M0+ Technical Reference Manual for a detailed description of these registers.
7.4.
High-Speed Bus System
7.4.1.
Features
High-Speed Bus Matrix has the following features:
•
•
•
•
Symmetric crossbar bus switch implementation
Allows concurrent accesses from different masters to different slaves
32-bit data bus
Operation at a one-to-one clock frequency with the bus masters
H2LBRIDGE has the following features:
•
LP clock division support
•
Write: Posted-write FIFO of 3 words, no bus stall until it is full
•
Write: 1 cycle bus stall when full when LP clock is not divided
•
2 stall cycles on read when LP clock is not divided
•
Ultra low latency mode:
– Suitable when the HS clock frequency is not above half the maximum device clock frequency
– Removes all intrinsic bridge stall cycles (except those needed for LP clock ratio adaptation)
– Enabled by writing a '1' in 0x41008120 using a 32-bit write access
L2HBRIDGE has the following features:
•
LP clock division support
•
Write: Posted-write FIFO of 1 word, no bus stall until it is full
•
Write: 1 cycle bus stall when full when LP clock is not divided
•
2 stall cycles on read when LP clock is not divided
•
ultra low latency mode:
– Suitable when the HS clock frequency is not above half the maximum device clock frequency
– Removes all intrinsic bridge stall cycles (except those needed for LP clock ratio adaptation)
– Enabled by writing a '1' in 0x41008120 using a 32-bit write access
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Figure 7-1. High-Speed Bus System Components
M M
H2LBRIDGES S
M M
M H2LBRIDGEM
H2LBRIDGE
HMATRIXLP
HMATRIXHS
L2HBRIDGES M
S S S S S
S L2HBRIDGES
S S S S S S S S
Configuration
Figure 7-2. Master-Slave Relations High-Speed Bus Matrix
High-Speed Bus
MASTERS
CM0+
0
DSU
1
L2HBRIDGEM
2
Internal Flash
HS SRAM PORT 0
HS SRAM PORT 1
AHB-APB Bridge B
H2LBRIDGES
High-Speed Bus SLAVES
0
1
2
3
4
Figure 7-3. Master-Slave Relations Low-Power Bus Matrix
H2LBRIDGEM
0
DMAC
2
AHB-APB Bridge A
AHB-APB Bridge C
AHB-APB Bridge D
AHB-APB Bridge E
LP SRAM PORT 2
LP SRAM PORT 1
L2HBRIDGES
HS SRAM PORT 2
Low-Power Bus SLAVES
Low-Power Bus
MASTERS
7.4.2.
L2HBRIDGE
0
1
2
3
5
7
8
9
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Table 7-4. High-Speed Bus Matrix Masters
High-Speed Bus Matrix Masters
Master ID
CM0+ - Cortex M0+ Processor
0
DSU - Device Service Unit
1
L2HBRIDGEM - Low-Power to High-Speed bus
matrix AHB to AHB bridge
2
Table 7-5. High-Speed Bus Matrix Slaves
High-Speed Bus Matrix Slaves
Slave ID
Internal Flash Memory
0
HS SRAM Port 0 - CM0+ Access
1
HS SRAM Port 1 - DSU Access
2
AHB-APB Bridge B
3
H2LBRIDGES - High-Speed to Low-Power bus
matrix AHB to AHB bridge
4
Table 7-6. Low-Power Bus Matrix Masters
Low-Power Bus Matrix Masters
Master ID
H2LBRIDGEM - High-Speed to Low-Power bus
matrix AHB to AHB bridge
0
DMAC - Direct Memory Access Controller - Data
Access
2
Table 7-7. Low-Power Bus Matrix Slaves
7.4.3.
Low-Power Bus Matrix Slaves
Slave ID
AHB-APB Bridge A
0
AHB-APB Bridge C
1
AHB-APB Bridge D
2
AHB-APB Bridge E
3
LP SRAM Port 2- H2LBRIDGEM access
5
LP SRAM Port 1- DMAC access
7
L2HBRIDGES - Low-Power to High-Speed bus
matrix AHB to AHB bridge
8
HS SRAM Port 2- HMATRIXLP access
9
SRAM Quality of Service
To ensure that masters with latency requirements get sufficient priority when accessing RAM, priority
levels can be assigned to the masters for different types of access.
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The Quality of Service (QoS) level is independently selected for each master accessing the RAM. For any
access to the RAM, the RAM also receives the QoS level. The QoS levels and their corresponding bit
values for the QoS level configuration are shown in the following table.
Table 7-8. Quality of Service
Value
Name
Description
0x0
DISABLE
Background (no sensitive
operation)
0x1
LOW
Sensitive Bandwidth
0x2
MEDIUM
Sensitive Latency
0x3
HIGH
Critical Latency
If a master is configured with QoS level DISABLE (0x0) or LOW (0x1) there will be a minimum latency of
one cycle for the RAM access.
The priority order for concurrent accesses are decided by two factors. First, the QoS level for the master
and second, a static priority given by the port ID. The lowest port ID has the highest static priority. See the
tables below for details.
The MTB has a fixed QoS level HIGH (0x3).
The CPU QoS level can be written/read, using 32-bit access only, at address 0x41008114 bits [1:0]. Its
reset value is 0x3.
Refer to different master QOSCTRL registers for configuring QoS for the other masters (USB, DMAC).
Table 7-9. HS SRAM Port Connections QoS
HS SRAM Port Connection Port ID
Connection Type QoS
default QoS
MTB - Micro Trace Buffer
4
Direct
STATIC-3
0x3
USB - Universal Serial Bus
3
Direct
IP-QOSCTRL
0x3
HMATRIXLP - Low-Power
Bus Matrix
2
Bus Matrix
0x44000934(1), bits[1:0]
0x2
DSU - Device Service Unit
1
Bus Matrix
0x4100201C(1)
0x2
CM0+ - Cortex M0+
Processor
0
Bus Matrix
0x41008114(1), bits[1:0]
0x3
Note:
1. Using 32-bit access only.
Table 7-10. LP SRAM Port Connections QoS
LP SRAM Port Connection Port ID
Connection Type QoS
default QoS
DMAC - Direct Memory
Access Controller - WriteBack Access
5, 6
Direct
IP-QOSCTRL.WRBQOS
0x2
DMAC - Direct Memory
Access Controller - Fetch
Access
3, 4
Direct
IP-QOSCTRL.FQOS
0x2
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LP SRAM Port Connection Port ID
Connection Type QoS
default QoS
H2LBRIDGEM - HS to LP
bus matrix AHB to AHB
bridge
2
Bus Matrix
0x44000924(1), bits[1:0]
0x2
DMAC - Direct Memory
Access Controller - Data
Access
1
Bus Matrix
IP-QOSCTRL.DQOS
0x2
Note:
1. Using 32-bit access only.
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8.
Packaging Information
8.1.
Thermal Considerations
8.1.1.
Thermal Resistance Data
The following table summarizes the thermal resistance data depending on the package.
Table 8-1. Thermal Resistance Data
Package Type
θJA
θJC
32-pin TQFP
68°C/W
25.8°C/W
48-pin TQFP
78.8°C/W
12.3°C/W
64-pin TQFP
66.7°C/W
11.9°C/W
32-pin QFN
37.2°C/W
3.1°C/W
48-pin QFN
31.6°C/W
10.3°C/W
64-pin QFN
32.2°C/W
10.1°C/W
64-pin WLCSP
36.8°C/W
5.0°C/W
Related Links
Junction Temperature on page 29
8.1.2.
Junction Temperature
The average chip-junction temperature, TJ, in °C can be obtained from the following:
1.
2.
TJ = TA + (PD x θJA)
TJ = TA + (PD x (θHEATSINK + θJC))
where:
•
•
•
•
•
θJA = Package thermal resistance, Junction-to-ambient (°C/W), see Thermal Resistance Data
θJC = Package thermal resistance, Junction-to-case thermal resistance (°C/W), see Thermal
Resistance Data
θHEATSINK = Thermal resistance (°C/W) specification of the external cooling device
PD = Device power consumption (W)
TA = Ambient temperature (°C)
From the first equation, the user can derive the estimated lifetime of the chip and decide if a cooling
device is necessary or not. If a cooling device is to be fitted on the chip, the second equation should be
used to compute the resulting average chip-junction temperature TJ in °C.
Related Links
Thermal Resistance Data on page 29
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8.2.
Package Drawings
8.2.1.
64-Ball WLCSP
Table 8-2. Device and Package Maximum Weight
10
mg
Table 8-3. Package Characteristics
Moisture Sensitivity Level
MSL1
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Table 8-4. Package Reference
8.2.2.
JEDEC Drawing Reference
N/A
JESD97 Classification
E1
64 pin TQFP
Table 8-5. Device and Package Maximum Weight
300
mg
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Table 8-6. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-7. Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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8.2.3.
64 pin QFN
Note: The exposed die attach pad is not connected electrically inside the device.
Table 8-8. Device and Package Maximum Weight
200
mg
Table 8-9. Package Charateristics
Moisture Sensitivity Level
MSL3
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Table 8-10. Package Reference
8.2.4.
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
48 pin TQFP
Table 8-11. Device and Package Maximum Weight
140
mg
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Table 8-12. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-13. Package Reference
8.2.5.
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
48 pin QFN
Note: The exposed die attach pad is not connected electrically inside the device.
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Table 8-14. Device and Package Maximum Weight
140
mg
Table 8-15. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-16. Package Reference
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
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8.2.6.
32 pin TQFP
Table 8-17. Device and Package Maximum Weight
100
mg
Table 8-18. Package Charateristics
Moisture Sensitivity Level
MSL3
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Table 8-19. Package Reference
8.2.7.
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
32 pin QFN
Note: The exposed die attach pad is connected inside the device to GND and GNDANA.
Table 8-20. Device and Package Maximum Weight
90
mg
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Table 8-21. Package Characteristics
Moisture Sensitivity Level
MSL3
Table 8-22. Package Reference
8.3.
JEDEC Drawing Reference
MO-220
JESD97 Classification
E3
Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Table 8-23.
Profile Feature
Green Package
Average Ramp-up Rate (217°C to peak)
3°C/s max.
Preheat Temperature 175°C ±25°C
150-200°C
Time Maintained Above 217°C
60-150s
Time within 5°C of Actual Peak Temperature
30s
Peak Temperature Range
260°C
Ramp-down Rate
6°C/s max.
Time 25°C to Peak Temperature
8 minutes max.
A maximum of three reflow passes is allowed per component.
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