ATSAMR30-XPRO

ATSAMR30-XPRO SAM R30 Xplained Pro Description The SAM R30 Xplained Pro is a hardware platform designed to evaluate the ATSAMR30G18A SoC. This kit is supported by Atmel Studio, an integrated development platform, which provides predefined application examples.This kit provides easy access to various features of the ATSAMR30G18A SoC, and offers additional peripherals to extend the features of the board and ease the development of custom designs. Figure 1. SAM R30 Xplained Pro Evaluation Kit © 2017 Microchip Technology Inc. User Guide DS50002612A-page 1 ATSAMR30-XPRO Table of Contents Description.......................................................................................................................1 1. Introduction................................................................................................................4 1.1. 1.2. Features....................................................................................................................................... 4 Kit Overview................................................................................................................................. 4 2. Getting Started.......................................................................................................... 6 2.1. Xplained Pro Quick Start.............................................................................................................. 6 3. Xplained Pro.............................................................................................................. 8 3.1. 3.2. 3.3. 3.4. 3.5. Embedded Debugger................................................................................................................... 8 Xplained Pro Analog Module (XAM).............................................................................................9 Hardware Identification System..................................................................................................11 Power Sources........................................................................................................................... 11 Xplained Pro Headers and Connectors......................................................................................12 4. Hardware User Guide..............................................................................................14 4.1. 4.2. 4.3. 4.4. 4.5. Power Distribution...................................................................................................................... 14 Connectors................................................................................................................................. 14 Peripherals................................................................................................................................. 18 Embedded Debugger Implementation........................................................................................19 Kit Modifications......................................................................................................................... 22 5. Agency Certification.................................................................................................26 5.1. 5.2. 5.3. United States (FCC)................................................................................................................... 26 European Union (RED [Radio Equipment Directive]).................................................................26 List of Antennas Tested With This Product.................................................................................27 6. Appendix..................................................................................................................28 6.1. 6.2. Getting Started with IAR.............................................................................................................28 Connecting External Debuggers to an Xplained Pro Board....................................................... 31 7. Hardware Revision History and Known Issues........................................................33 7.1. 7.2. Identifying Product ID and Revision........................................................................................... 33 Hardware Revision..................................................................................................................... 33 7.3. Known Issues............................................................................................................................. 33 8. Document Revision History..................................................................................... 34 The Microchip Web Site................................................................................................ 35 Customer Change Notification Service..........................................................................35 Customer Support......................................................................................................... 35 Microchip Devices Code Protection Feature................................................................. 35 © 2017 Microchip Technology Inc. User Guide DS50002612A-page 2 ATSAMR30-XPRO Legal Notice...................................................................................................................36 Trademarks................................................................................................................... 36 Quality Management System Certified by DNV.............................................................37 Worldwide Sales and Service........................................................................................38 © 2017 Microchip Technology Inc. User Guide DS50002612A-page 3 ATSAMR30-XPRO 1. Introduction 1.1 Features • • Kit Supports 868MHz and 915MHz Dual (Wideband) ISM Band On-Board Embedded Debugger (EDBG): – Auto-ID for board identification in Studio – – – – – 1.2 • • • • • • • One status LED (yellow) One power supply LED (green) Symbolic debug of complex data types including scope information Programming and debugging including power measurements Data Gateway Interface: Serial Peripheral Interface (SPI) bus, Inter-Integrated Circuit (I2C) and four General Purpose Input/Outputs (GPIOs) – Virtual COM Port (CDC) Embedded Current Measurement Circuitry with Data Visualizer Support for Data Visualization Two Mechanical Buttons (User-Configurable Button and RESET Button) Two User LEDs (Soft Orange and Green) ® One QTouch Button USB Interface, Device and Reduced Host Mode Two Xplained Pro Extension Headers Antenna: • – One ceramic chip antenna (Johanson Technology – 0900AT43A0070) – One SMA connector for external antenna Three Possible Power Sources: • – External power – Embedded Debugger (EDBG) USB – TARGET USB Clock Source: • – 32.768 kHz crystal, a clock source for the controller in the SAM R30 device – 16 MHz crystal for the RF die in the SAM R30 device Supported with application examples in the Atmel Software Framework Kit Overview The SAM R30 device is an ARM-based, ultra low-power microcontroller (MCU) equipped with an IEEE® 802.15.4-2003/2006/2011 standard that is compliant with RF interfaces for the sub-1GHz frequency bands, such as 780 MHz (China), 868 MHz (Europe), and 915 MHz (North America). It uses the 32-bit ARM® Cortex®- M0+ processor, which operates at a maximum of 48 MHz (2.46 CoreMark®/MHz) and offers 256KB of Flash and 40KB of SRAM in both 32-pin and 48-pin packages. The SAM R30 device supports the following power managaement techniques to reduce current consumption: • Power Gating • SleepWalking © 2017 Microchip Technology Inc. User Guide DS50002612A-page 4 ATSAMR30-XPRO • Ultra low-power peripherals, etc. The kit is designed to work with the ATSAMR30G18A SoC that supports dual ISM band 868 MHz (Europe) and 915 MHz (North America). Figure 1-1. SAM R30 Xplained Pro Evaluation Kit © 2017 Microchip Technology Inc. User Guide DS50002612A-page 5 ATSAMR30-XPRO 2. Getting Started This chapter describes how to get started with the Xplained Pro evaluation platform and how to find design documentation and other relevant links. 2.1 Xplained Pro Quick Start Steps to start exploring the Xplained Pro platform: 1. Download and install Atmel Studio. 2. Launch Atmel Studio. 3. Connect the DEBUG USB port on the evaluation kit to the computer using a USB cable (StandardA to Micro-B or Micro-AB). The operating system installs the driver software automatically the first time the Xplained Pro evaluation ® ® kit is connected to a PC. This driver supports 32-bit and 64-bit versions of Microsoft Windows XP, ® Windows Vista , Windows 7, Windows 8, Windows 10, and Windows Server 2012. When the Xplained Pro MCU board is powered, the power LED (green) glows and Atmel Studio automatically detects the specific Xplained Pro MCU and extension board(s) that are connected. The kit landing page in Atmel Studio comes with an option to launch Atmel Software Framework (ASF) and Atmel START example application codes for the kit. The SAM R30 device is programmed and debugged by the on-board Embedded Debugger and therefore no external programmer or debugger tool is required. 2.1.1 Design Documentation and Relevant Links The following list contains links to the most relevant documents and software for the SAM R30 Xplained Pro. • • • • • • Xplained products - Xplained evaluation kits are a series of easy-to-use evaluation kits for Microchip microcontrollers and other Microchip products. – Xplained Nano: used for low pin-count devices and provides a minimalistic solution with access to all I/O pins of the target microcontroller. – Xplained Mini: used for medium pin-count devices and adds Arduino Uno compatible header footprint and a prototyping area. – Xplained Pro: used for medium to high pin-count devices that features advanced debugging and standardized extensions for peripheral functions. Note:  All the above kits have on-board programmers/debuggers, which creates a set of low-cost boards for evaluation and demonstration of features and capabilities of different Microchip products. Atmel Studio - Free IDE for development of C/C++ and assembler code for microcontrollers. Microchip sample store - Microchip sample store where you can order samples of devices. EDBG User Guide - User guide containing more information about the on-board Embedded Debugger. ® ® IAR Embedded Workbench for ARM - This is a commercial C/C++ compiler that is available for ® ARM . There is a 30 day evaluation version as well as a code size limited kick-start version available from their website. The code size limit is 16KB for devices with M0, M0+, and M1 cores and 32KB for devices with other cores. ® QTouch tools - A collection of tools to design capacitive touch applications. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 6 ATSAMR30-XPRO • • Data Visualizer - Data Visualizer is a program used for processing and visualizing data. The Data Visualizer can receive data from various sources such as the Embedded Debugger Data Gateway Interface found on Xplained Pro boards and COM Ports. Design Documentation - Package containing CAD source, schematics, BOM, assembly drawings, 3D plots, layer plots etc. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 7 ATSAMR30-XPRO 3. Xplained Pro Xplained Pro is an evaluation platform which contains a series of microcontroller boards (evaluation kits) and extension boards. Atmel Studio is used to program and debug the microcontrollers on these boards. Atmel Studio includes ASF and Atmel START, which has drivers and demo code, and Data Visualizer, which supports data streaming and advanced debugging. Xplained Pro evaluation kits can be connected to a wide range of Xplained Pro extension boards through standardized headers and connectors. Xplained Pro extension boards have identification (ID) chips to uniquely identify which boards are connected to the Xplained Pro evaluation kits. 3.1 Embedded Debugger The SAM R30 Xplained Pro contains an Embedded Debugger (EDBG) for on-board debugging. The EDBG is a USB composite device with the following interfaces: • • • Debugger Virtual COM Port Data Gateway Interface (DGI) The EDBG can program and debug the ATSAMR30G18A with the help of Atmel Studio. The SWD interface is connected between the EDBG and the ATSAMR30G18A on the SAM R30 Xplained Pro. The Virtual COM Port is connected to a UART on the ATSAMR30G18A and provides an easy way to communicate with the target application through terminal software. It offers variable baud rate, parity, and stop bit settings. Note that the settings on the ATSAMR30G18A must match the settings given in the terminal software. Info:  The Virtual COM Port in the EDBG requires the terminal software to set the Data Terminal Ready (DTR) signal to enable the UART pins connected to the ATSAMR30G18A. If the DTR signal is not enabled, the UART pins on the EDBG are kept in tri-state (high-z) to render the COM Port not usable. The DTR signal is automatically set by some terminal software, but it may have to be manually enabled in your terminal. The DGI consists of several physical interfaces for bidirectional communication with the host computer. Communication over the interfaces is bidirectional. It can be used to send event values, and data from the ATSAMR30G18A. Traffic over the interfaces can be timestamped by the EDBG for more accurate tracing of events, but timestamping reduces the maximal data throughput. The Data Visualizer is used to send and receive data through DGI. The EDBG controls two LEDs on the SAM R30 Xplained Pro: a power LED and a status LED. The table below shows how the LEDs are controlled in different operation modes. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 8 ATSAMR30-XPRO Table 3-1. EDBG LED Control Mode Power LED Status LED Normal mode The power LED is on when power is applied to the board. Activity indicator, the LED flashes when any communication happens to the EDBG. Bootloader mode (idle) The power LED and the status LED blink simultaneously. Bootloader mode (firmware upgrade) The power LED and the status LED blink in an alternating pattern. For more details on the EDBG, see the EDBG User Guide. 3.2 Xplained Pro Analog Module (XAM) 3.2.1 Overview The Xplained Pro Analog Module (XAM) extends the embedded debugger with high dynamic range current measurement. This enables power profiling of the target system. Current output Figure 3-1. XAM Block Diagram Calibration circuitry GPIO(s) Control MCU Sync GPIO I2C Calibration ON/OFF GPIO EDBG SPI Clock sync Range selection voltage reference 2.7V SWD AREF 100 Ohm 100 mOhm Pre-amplifier 2x ADC0 ADC1 20x20x S&H ADC 16x GND Active filter with gain Current input GPIO Xplained Pro Analog Module (XAM) The XAM consists of: • • • • Calibration circuitry Voltage reference circuitry Analog front-end: – Shunt resistors with a range selection switch – Pre-amplifier – Two active filters with gain Control MCU © 2017 Microchip Technology Inc. User Guide DS50002612A-page 9 ATSAMR30-XPRO – – – Analog-to-Digital Converter Signal processing Control/communication interface to the EDBG The current measurement front-end is a high side shunt measurement with a pre-amplifier and a second active filter stage with gain as shown in Figure 3-1. The wide dynamic range is achieved by four measurement ranges, which are defined by two shunt resistors and the two parallel second stage active filters with gain. 3.2.2 EDBG Interface The XAM is connected to the EDBG with the following interfaces: • • • • • 3.2.3 I2C: This is used to control and configure the XAM. SPI: Current measurement data is streamed to the EDBG via this interface. This is a unidirectional channel from the XAM to the EDBG. SWD: The MCU in the XAM is programmed via SWD from the EDBG. Clock sync: Signal used to synchronize ADC measurements with the EDBG. Reference clock: Reference clock for the XAM. Sample Rate The raw sampling rate of the XAM is up to 250 kHz and with the default averaging configuration (average of 16 samples), the actual output of the XAM is 16.67 ksps. Info:  The XAM output sample rate is not an integer fraction of the raw sampling. 3.2.4 Measurement Ranges and Accuracy The XAM has four measurement ranges. These are defined by two shunt resistors and two gain stages. Table 3-2. XAM Measurement Ranges and Accuracy Measurement Range Hardware Resolution Accuracy Range 1 Low current shunt and high gain stage 20 nA 1 LSB ±1% Accuracy will decrease below 1μA. Typical accuracy for 300nA is 1 LSB ± 10%. Range 2 Low current shunt and low gain stage 150 nA 1 LSB ±1% Range 3 High current shunt and high gain stage 10 μA 1 LSB ±1% Range 4 High current shunt and low gain stage 100 μA 1 LSB ±1% Accuracy will decrease above 100 mA. Typical accuracy is 1 LSB ±5% at 400 mA. Maximum current is 400 mA. © 2017 Microchip Technology Inc. User Guide Comments DS50002612A-page 10 ATSAMR30-XPRO The ranges are automatically switched by the XAM to achieve the best measurement results and the currently active range is visualized in the Data Visualizer front-end tool. The maximum voltage drop over the shunt resistor is 100 mV, and the XAM switches the range automatically before reaching this limit. 3.3 Hardware Identification System All Xplained Pro extension boards come with an identification chip (ATSHA204A CryptoAuthentication chip) to uniquely identify the boards that are connected to the Xplained Pro evaluation kit. This chip contains information that identifies the extension with its name and some extra data. When an Xplained Pro extension is connected to an Xplained Pro evaluation kit, the information is read and sent to Atmel Studio. The following table shows the data fields stored in the ID chip with example content. Table 3-3. Xplained Pro ID Chip Content 3.4 Data Field Data Type Example Content Manufacturer ASCII string Atmel'\0' Product Name ASCII string Segment LCD1 Xplained Pro'\0' Product Revision ASCII string 02'\0' Product Serial Number ASCII string 1774020200000010’\0’ Minimum Voltage [mV] uint16_t 3000 Maximum Voltage [mV] uint16_t 3600 Maximum Current [mA] uint16_t 30 Power Sources The SAM R30 Xplained Pro kit can be powered by several power sources, as listed in the table below. Table 3-4. Power Sources for SAM R30 Xplained Pro Power Source Voltage Requirements Current Requirements Connector Marking External Power 5V ±2% (±100mV) for USB host operation. 4.3V to 5.5V if a USB host operation is not required. In USB host applications PWR a minimum of 1A is recommended to supply the kit and the USB device. Maximum recommended current is 2A. Embedded debugger USB 4.4V to 5.25V (according 500 mA (according to to USB spec.) USB spec.) DEBUG USB Target USB 4.4V to 5.25V (according 500 mA (according to to USB spec.) USB spec.) TARGET USB The kit automatically detects which power sources are available and chooses which one to use according to the following priority: 1. External power. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 11 ATSAMR30-XPRO 2. 3. Embedded Debugger USB. Target USB. Info:  External power is required when 500mA from a USB connector is not enough to power the board with possible extension boards. A connected USB device in a USB host application might easily exceed this limit. 3.5 Xplained Pro Headers and Connectors 3.5.1 Xplained Pro Standard Extension Header All Xplained Pro kits have one or more dual row, 20-pin, 100-mil extension header. The Xplained Pro MCU boards have male headers, while the Xplained Pro extensions have their female counterparts. All connected pins follow the defined pin description in the table. Info:  All pins are not always connected on all extension headers. The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Pro MCU boards or to access the pins of the target microcontroller on Xplained Pro MCU boards directly. Table 3-5. Xplained Pro Standard Extension Header Pin Number Pin Name Description 1 ID Pin to communicate with the ID chip on an extension board 2 GND Ground 3 ADC(+) Analog-to-Digital Converter; alternatively, a pin for the positive terminal of a differential ADC 4 ADC(-) Analog-to-Digital Converter; alternatively, a pin for the negative terminal of a differential ADC 5 GPIO1 General purpose I/O pin 6 GPIO2 General purpose I/O pin 7 PWM(+) Pulse width modulation; alternatively, a pin for the positive part of a differential PWM 8 PWM(-) Pulse width modulation; alternatively, a pin for the negative part of a differential PWM 9 IRQ/GPIO Interrupt request pin and/or general purpose I/O pin 10 SPI_SS_B/ GPIO Slave select pin for Serial Peripheral Interface (SPI) and/or general purpose I/O pin 11 I2C_SDA Data pin for I2C interface. Always connected, bus type 12 I2C_SCL Clock pin for I2C interface. Always connected, bus type © 2017 Microchip Technology Inc. User Guide DS50002612A-page 12 ATSAMR30-XPRO 3.5.2 Pin Number Pin Name Description 13 UART_RX Receiver pin of target device UART 14 UART_TX Transmitter pin of target device UART 15 SPI_SS_A Slave select for SPI. This pin should preferably not be connected to anything else. 16 SPI_MOSI SPI master out slave in pin. Always connected, bus type 17 SPI_MISO SPI master in slave out pin. Always connected, bus type 18 SPI_SCK SPI clock pin. Always connected, bus type 19 GND Ground pin for extension boards 20 VCC Power pin for extension boards Xplained Pro Power Header The power header can be used to connect external power to the SAM R30 Xplained Pro kit. The kit automatically detects and switches to any external power if supplied. The power header can also be used to supply power to external peripherals or extension boards. Ensure that the total current does not exceed the recommended current limit of the on-board regulator when using the 3.3V pin. Table 3-6. Xplained Pro Power Header Pin Number Pin Name 1 VEXT_P5V0 2 GND 3 VCC_P5V0 Unregulated 5V pin (an output, derived from one of the input sources) 4 VCC_P3V3 Regulated 3.3V pin (an output, used as main power supply for the kit) © 2017 Microchip Technology Inc. Description External 5V input pin Ground pin User Guide DS50002612A-page 13 ATSAMR30-XPRO 4. Hardware User Guide 4.1 Power Distribution The SAM R30 Xplained Pro can be powered by: • EDBG USB • TARGET USB • External (5V) The kit has a power mux which automatically chooses the power source if two or all three of the power sources are available to the kit at the same time. The kit contains: • Two on-board voltage regulators (3.3V): – One for an EDBG and XAM section – Another one for ATSAMR30G18A SoC • IO peripherals • Power Measurement Section (XAM) Figure 4-1. Power Supply Block Diagram 4.2 Connectors The following sections describe the implementation of the relevant connectors and headers on the SAM R30 Xplained Pro and their connection to the ATSAMR30G18A. The following figure shows all the available connectors and jumpers on the SAM R30 Xplained Pro. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 14 ATSAMR30-XPRO Figure 4-2. SAM R30 Xplained Pro Connector Overview 4.2.1 Xplained Pro Extension Headers The SAM R30 Xplained Pro headers EXT1 and EXT3 offer access to the I/O of the MCU in order to expand the board by connecting extensions to the board. These headers are based on the standard extension header specified in the table below. The headers have a pitch of 2.54 mm. Table 4-1. Extension Header EXT1 EXT1 Pin SAM R30 Function Pin Shared Functionality 1 [ID] - - Pin to communicate with the ID chip on an extension board 2 [GND] - - Ground 3 [ADC(+)] PA06 AIN[6] 4 [ADC(-)] PA07 AIN[7] 5 [GPIO1] PA13 GPIO 6 [GPIO2] PA28 GPIO SW0 7 [PWM(+)] PA18 TCC0/WO[2] LED1 8 [PWM(-)] PA19 TCC0/WO[3] LED0 9 [IRQ/GPIO] PA22 EXTINT[6] USB 10 [SPI_SS_B/GPIO] PA23 GPIO SW0 11 [TWI_SDA] PA16 SERCOM1 PAD[0] I²C SDA EXT3 and EDBG I²C 12 [TWI_SCL] PA17 SERCOM1 PAD[1] I²C SCL EXT3 and EDBG I²C 13 [USART_RX] PA05 SERCOM0 PAD[1] UART RX Virtual COM Port 14 [USART_TX] PA04 SERCOM0 PAD[0] UART TX Virtual COM Port 15 [SPI_SS_A] PB03 SERCOM5 PAD[1] SPI SS 16 [SPI_MOSI] PB22 SERCOM5 PAD[2] SPI MOSI © 2017 Microchip Technology Inc. User Guide EXT3 and EDBG SPI DS50002612A-page 15 ATSAMR30-XPRO EXT1 Pin SAM R30 Function Pin Shared Functionality 17 [SPI_MISO] PB02 SERCOM5 PAD[0] SPI MISO EXT3 and EDBG SPI 18 [SPI_SCK] PB23 SERCOM5 PAD[3] SPI SCK EXT3 and EDBG SPI 19 [GND] - - Ground 20 [VCC] - - Power for extension board Table 4-2. Extension Header EXT3 4.2.2 EXT3 Pin SAM R30 Function Pin Shared Functionality 1 [ID] - - Pin to communicate with the ID chip on an extension board 2 [GND] - - Ground 3 [ADC(+)] - - 4 [ADC(-)] - - 5 [GPIO1] PA15 GPIO 6 [GPIO2] - - 7 [PWM(+)] - - 8 [PWM(-)] - - 9 [IRQ/GPIO] - - USB 10 [SPI_SS_B/GPIO] PA08 GPIO EDBG DGI GPIO 11 [TWI_SDA] PA16 SERCOM1 PAD[0] I²C SDA EXT1 and EDBG I²C 12 [TWI_SCL] PA17 SERCOM1 PAD[1] I²C SCL EXT1 and EDBG I²C 13 [USART_RX] - - 14 [USART_TX] - - 15 [SPI_SS_A] PA14 GPIO EDBG DGI GPIO 16 [SPI_MOSI] PB22 SERCOM5 PAD[2] SPI MOSI EXT1 and EDBG SPI 17 [SPI_MISO] PB02 SERCOM5 PAD[0] SPI MISO EXT1 and EDBG SPI 18 [SPI_SCK] PB23 SERCOM5 PAD[3] SPI SCK EXT1 and EDBG SPI 19 [GND] - - Ground 20 [VCC] - - Power for extension board USB A Micro-USB is used for connecting the SAM R30 board (TARGET USB port) with a host PC.To be able to detect when a TARGET USB cable is connected in self-powered mode, a GPIO is used to detect the VBUS voltage on the connector. In USB host mode, VBUS voltage is provided by the kit and cannot identify the connected device, so another GPIO is used to detect the USB ID of the device. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 16 ATSAMR30-XPRO Table 4-3. USB Connections 4.2.3 SAM R30 Pin USB Function Shared Functionality PA07 VBUS Detection EXT1 PA15 USB ID EXT3 PA24 USB D- - PA25 USB D+ - Current Measurement Header An angled 1x2, 100-mil pin header marked with the MCU current measurement is located at the upper edge of the SAM R30 Xplained Pro. All power to the ATSAMR30G18A is exclusively routed through this header (excluding power to headers and peripherals). To measure the power consumption of the device, remove the jumper and replace it with an ammeter. Caution:  Removing the jumper from the pin header while the kit is powered may cause the ATSAMR30G18A to be powered through its I/O pins. This may cause permanent damage to the device. 4.2.4 Cortex Debug Connector ® The SAM R30 Xplained Pro contains a 10-pin 50-mil Cortex Debug Connector that can be used to attach an external debugger to the ATSAMR30G18A SoC. Table 4-4. Cortex Debug Connector Cortex Debug Connector Pin Pin / Net Function 1 VCC_TARGET_P3V3 ATSAMR30G18A voltage 2 PA31 SWD data signal 3 GND Ground 4 PA30 SWD clock signal 5 GND Ground 6 - - 7 - - 8 - - 9 GND Ground 10 RESETN Target reset signal © 2017 Microchip Technology Inc. User Guide Shared Functionality EDBG SWD EDBG SWD DS50002612A-page 17 ATSAMR30-XPRO 4.3 Peripherals 4.3.1 Crystal The SAM R30 Xplained Pro kit contains a 32.768 kHz crystal that can be used as a clock source for the SAM R30 device. A cut-strap next to the crystal is used to measure the oscillator safety factor. This is done by cutting the strap and adding a resistor across the strap. More information about oscillator allowance and safety factor can be found in the AVR4100 application note from Microchip. Info:  The 16 MHz crystal is connected directly to the RF die inside the SAM R30. The clock signal generated by this crystal is routed from the CLKM pin on the RF die to a GCLK I/O pin on the microcontroller. For more information on how the RF die is connected to the microcontroller and how to configure the CLKM pin, see the SAM R30 datasheet. Table 4-5. External 32.768 kHz Crystal Pin on SAM R30 Function PA00 XIN32 PA01 XOUT32 Table 4-6. External 16 MHz Crystal 4.3.2 Pin on SAM R30 Function XTAL1 XIN XTAL2 XOUT Mechanical Buttons The SAM R30 Xplained Pro contains two mechanical buttons. • The RESET button is connected to the SAM R30 reset line: – When the RESET button is pressed, it drives the reset line to ground • Generic user configurable button: – When the user button is pressed, it drives the I/O line to ground note:  There is no pull-up resistor connected to the generic user button. Remember to enable the internal pull-up in the SAM R30 to use the button. Table 4-7. Mechanical Buttons 4.3.3 SAM R30 Pin Silkscreen Text Shared Functionality RESET RESET - PA28 SW0 EXT1 LEDs The SAM R30 Xplained Pro board contain two LEDs. The LEDs can be activated by driving the connected I/O line to ground (GND). © 2017 Microchip Technology Inc. User Guide DS50002612A-page 18 ATSAMR30-XPRO Table 4-8. LED Connections 4.3.4 SAM R30 Pin Function Shared Functionality PA19 LED0 (Color: Soft Orange) EXT3 PA18 LED1 (Color: Green) EXT3 QTouch Button The SAM R30 Xplained Pro board contains a self capacitance button, which can be used as an I/O. This QTouch button is intended to be driven by the built-in Peripheral Touch Controller (PTC) of the device. A zero ohm resistor is added on the board to easily disconnect the on-board touch buttons from the extension header since the I/O lines are shared between the QTouch button and extension header 1 (EXT1). ® ® note:  To get started with QTouch, refer to the QTouch Library and QTouch Composer. Table 4-9. QTouch Connection 4.3.5 SAM R30 Pin Silkscreen Text Shared Functionality PA06 QT BTN1 EXT1 RF The main feature of the SAM R30 Xplained Pro is to show the RF capability of the ATSAMR30G18A SoC. This device has bidirectional 100 ohm differential antenna pins, which are fed through a balun (Johanson Technology, 0896BM15A0032) to create a single 50 ohm unbalanced output/input. This kit has a passive analog RF switch (Skyworks Solutions Inc, AS222-92LF) connected to the unbalanced output of the balun. The switch is driven by the RFCTRL1 and RFCTRL2 pins of the ATSAMR30G18A, which feature Antenna Diversity to enable the device to automatically select the best signal from the two antennas (can also be selected manually). The output of the switch is connected to a ceramic chip antenna (Johanson Technology, 0900AT43A0070) and an SMA connector for external antennas. Table 4-10. RF Connections 4.4 SAM R30Pin RF Shared Functionality RFP RF balanced output (positive) RFN RF balanced output (negative) PA09/RFCTRL1 RF switch control signal (negative) EDBG DGI GPIO PA12/RFCTRL2 RF switch control signal (positive) EDBG DGI GPIO Embedded Debugger Implementation The SAM R30 Xplained Pro contains an Embedded Debugger (EDBG) that can be used to program and debug the ATSAMR30G18A SoC using Serial Wire Debug (SWD). The Embedded Debugger includes a Virtual COM Port interface over UART, Data Gateway Interface over SPI, I2C and four GPIOs. The kit also includes an XAM extension processor to the Embedded Debugger for on-board current measurement. Atmel Studio can be used as a front-end for the Embedded Debugger. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 19 ATSAMR30-XPRO 4.4.1 Serial Wire Debug The Serial Wire Debug (SWD) uses two pins to communicate with the target. For further information on how to use the programming and debugging capabilities of the EDBG, refer to Embedded Debugger. Table 4-11. SWD Connections 4.4.2 SAM R30 Pin Function Shared Functionality PA30 SWD clock Cortex debug connector PA31 SWD data Cortex debug connector Virtual COM Port The Embedded Debugger acts as a Virtual COM Port gateway by using one of the ATSAMR30G18A UARTs. For further information on how to use the Virtual COM Port, refer to Embedded Debugger. Table 4-12. Virtual COM Port Connections 4.4.3 SAM R30 pin Function Shared functionality PA04 SERCOM0 PAD[0] UART TXD (SAM R30 TX line) EXT1 PA05 SERCOM0 PAD[1] UART RXD (SAM R30 RX line) EXT1 Data Gateway Interface The Embedded Debugger features a Data Gateway Interface (DGI) by using either an SPI or I²C. The DGI can be used for sending data from the ATSAMR30G18A to the host PC. For further information on how to use the DGI interface, refer to the Data Visualizer and the EDBG User Guide. Table 4-13. DGI Interface Connections When Using SPI SAM R30 Pin Function Shared Functionality PA27 GPIO/SPI SS (Slave Select) (SAM R30 is Master) - PB02 SERCOM5 PAD[0] SPI MISO (Master In, Slave Out) EXT1 and EXT3 PB22 SERCOM5 PAD[2] SPI MOSI (Master Out, Slave in) EXT1 and EXT3 PB23 SERCOM5 PAD[3] SPI SCK (Clock Out) EXT1 and EXT3 Table 4-14. DGI Interface Connections When Using I²C SAM R30 Pin Function Shared Functionality PA16 SERCOM1 PAD[0] SDA (Data line) EXT1 and EXT3 PA17 SERCOM1 PAD[1] SCL (Clock line) EXT1 and EXT3 Four GPIO lines are connected to the Embedded Debugger. The EDBG can monitor these lines and time stamp pin value changes. This makes it possible to accurately timestamp events in the SAM R30 application code. For further information on how to configure and use the GPIO monitoring features, refer to the Data Visualizer and the EDBG User Guide. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 20 ATSAMR30-XPRO Table 4-15. GPIO Lines Connected to the EDBG 4.4.4 SAM R30 Pin Function Shared Functionality PA08 GPIO0 EXT3 PA09 GPIO1 RFCTRL PA12 GPIO2 RFCTRL PA14 GPIO3 EXT3 XAM Configuration On the SAM R30 Xplained Pro, the MCU and MCU peripherals are powered by its own regulator as shown in Figure 4-3. All other parts of the board, mainly the embedded debugger and Xplained Pro Analog Module (XAM), are powered by a separate regulator. The current consumed by the MCU and the peripherals can be measured by connecting them to the XAM output through jumper settings. Figure 4-3. SAM R30 Xplained Pro XAM Implementation Block Diagram The XAM can be used in any of the following configurations: © 2017 Microchip Technology Inc. User Guide DS50002612A-page 21 ATSAMR30-XPRO 1. 2. 3. 4. 4.5 No current measurement or an external MCU current measurement: The XAM is bypassed, thus the MCU and peripherals are supplied directly by the regulator. Set both jumpers (MCU and I/O) in the "BY-PS(BYPASS)" position. In this configuration, it is also possible to connect an external measurement tool with the Xplained Pro MCU power measurement header to measure MCU current directly instead of using the XAM. MCU current measurement: The XAM measures only the MCU current while the peripherals are supplied directly by the regulator. For this configuration, place the jumper for "I/O" (peripherals) into the "BY-PS(BYPASS)" position and the "MCU" into the "MEAS (MEASURE)" position. Peripherals measurement: The XAM measures only the peripherals current while the MCU is directly supplied by the regulator. For this configuration, place the jumper for "MCU" into the "BYPS(BYPASS)" position and the "I/O" jumper into the "MEAS (MEASURE)" position. MCU and peripherals measurement: In this configuration, both the MCU and peripherals are measured by the XAM. Place both jumpers on the "I/O" and "MCU" headers in the "MEAS (MEASURE)" position. Kit Modifications The SAM R30 Xplained Pro contains several resistors that can be used to disconnect I/O pins of the ATSAMR30G18A SoC from connectors and on-board ICs, and to disconnect power signals. Table 4-16. Zero Ohm Resistors Design Value ator From To Comment R322 0R EDBG SWDIO PA31 SWDIO R323 0R EDBG SWDCLK PA30 SWCLK Debug interface from the EDBG to the ATSAMR30G18A R324 0R EDBG TARGET RESET TARGET MCU RESET R310 0R EDBG SPI SS PA27 GPIO R311 0R EDBG SPI SCK PB23 SPI SCK R312 0R EDBG SPI MOSI PB22 SPI MOSI R313 0R EDBG SPI MISO PB02 SPI MISO R314 0R EDBG DGI SDA PA16 I2C SDA R315 0R EDBG DGI SCL PA17 I2C SCL R316 0R EDBG CDC RX PA04 UART TX R317 0R EDBG CDC TX PA05 UART RX R318 0R EDBG DGI_GPIO0 PA08 GPIO R319 0R EDBG DGI_GPIO1 PA09 GPIO R320 0R EDBG DGI_GPIO2 PA12 GPIO R321 0R EDBG DGI_GPIO3 PA14 GPIO © 2017 Microchip Technology Inc. User Guide EDBG CDC and DGI interfaces to the ATSAMR30G18A DS50002612A-page 22 ATSAMR30-XPRO Design Value ator From To Comment R329 0R TARGET VUSB DETECT PA07 ADC7 Used to detect if a USB cable is connected to the TARGET USB connector. R109 47K VCC_P3V3_CM_IN TARGET VOLTAGE Used in the voltage divider network to detect the target voltage of 3.3V. R325 0R RESET TARGET RESET SENSE Reset sense signal to EDBG, used to detect external resets. Figure 4-4. Assembly Drawing Bottom 4.5.1 Operating at Other Voltages The SAM R30 Xplained Pro board operates at 3.3V by default, but it is also possible to run the board at lower voltages from an external supply. The EDBG is designed to run from a 3.3V supply and won't work on other voltages; therefore, all connections from the EDBG and from the on-board 3.3V regulator to the ATSAMR30G18A SoC should be removed. To completely disconnect the EDBG and the on-board power supply from the ATSAMR30G18A SoC, do the following: • • Remove the two jumpers from the on-board 3-pin current measurement headers (J101 and J102), and connect the two center pins (pin 2) together with a wire or an ammeter as shown in Figure 4-6 Remove R109, R310, R311, R312, R313, R314, R315, R316, R317, R318, R319, R320, R321, R322, R323, R324, R325 and R329. Figure 4-5 shows all components that have to be removed from the bottom side of the PCB for operating at other voltages. To locate the components to be removed, see the assembly drawing in the section above. When the components are removed, the kit can be supplied with a desired voltage through the © 2017 Microchip Technology Inc. User Guide DS50002612A-page 23 ATSAMR30-XPRO pins marked 3V3 (pin 4) and GND (pin 2) on the Xplained Pro power header. To program and debug the ATSAMR30G18A, the 2x5 50-mil Cortex debug connector must be used with an external debugger. Info:  Operating the ATSAMR30G18A SoC at voltages other than 3.3V requires physical modifications on the kit using a soldering iron and an external debugger for programming the ATSAMR30G18A SoC. The on-board current measurement only works at 3.3V. The on-board LED is selected for 3.3V operation; the LED brightness at 1.8V operation is dull. To increase the emitted light level, the value of the series resistor can be lowered. EDBG functionality can be restored by re-soldering the removed components. Caution:  The voltage supplied through the power header is applied directly to the ATSAMR30G18A SoC and the extension headers. Applying a voltage greater than 3.3V may damage the board permanently. Figure 4-5. SAM R30 Xplained Pro EDBG Disconnect © 2017 Microchip Technology Inc. User Guide DS50002612A-page 24 ATSAMR30-XPRO Figure 4-6. SAM R30 Xplained Pro Current Measurement Headers Related Links Xplained Pro Power Header Cortex Debug Connector Connectors © 2017 Microchip Technology Inc. User Guide DS50002612A-page 25 ATSAMR30-XPRO 5. Agency Certification 5.1 United States (FCC) This equipment (SAM R30 Xplained Pro) is for evaluation purposes only and must not be incorporated into any other device or system. Important:  Contains FCC ID:VW4A092722 These devices comply with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) These devices may not cause harmful interference, and (2) These devices must accept any interference received, including interference that may cause undesired operation (FCC 15.19). The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions (FCC 2.1093) requires separate equipment authorization. Important:  Changes or modifications not expressly approved by this company for compliance could void the user's authority to operate this equipment (FCC section 15.21). Important:  This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user must correct the interference at his own expense (FCC section 15.105). 5.2 European Union (RED [Radio Equipment Directive]) The SAM R30 Xplained Pro evaluation kit has been certified for use in European Union countries. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Radio Equipment Directive. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 26 ATSAMR30-XPRO Furthermore, the manufacturer must maintain a copy of the module's documentation and ensure the final product does not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all required standards. Important:  On account of the nature of radio equipment, the height of the CE marking affixed to radio equipment may be lower than 5 mm, provided that it remains visible and legible. More detailed information about CE marking requirements, refer Article 19 of "DIRECTIVE 2014/53/EU OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL" of 16 April 2014. 5.3 List of Antennas Tested With This Product Table 5-1. List of Tested Antennas Antenna number Make Model/part # Peak gain [dBi] Type of antenna Antenna 1 Johanson Technology 0900AT43A0070 -0.5dBi(typ.) Ceramic Chip Antenna Antenna 2 CompoTEK GmbH CTA 868/0/WS/SM/H1 0 dBi External SMA Antenna © 2017 Microchip Technology Inc. User Guide DS50002612A-page 27 ATSAMR30-XPRO 6. Appendix 6.1 Getting Started with IAR ® ® IAR Embedded Workbench for ARM is a proprietary, high-efficiency compiler not based on GCC. The ™ programming and debugging of Xplained Pro kits are supported in IAR Embedded Workbench for ARM using the common CMSIS-DAP interface. Some initial settings have to be set up in the project to get programming and debugging to work. The following steps explain how to set up a project for programming and debugging: 1. 2. 3. 4. 5. 6. Open the project that needs to be configured. Open the OPTIONS dialog for the project. In the General Options category, select the Target tab. Select the "Device" for the project or the "Core" of the device. In the Debugger category, select the Setup tab. Select CMSIS DAP as the driver. In the Debugger category, select the Download tab. Select the Use flash loader(s) option. In the Debugger > CMSIS DAP category, select the Setup tab. Select System (default) as the reset method. In the category Debugger > CMSIS DAP, select the JTAG/SWD tab. Select SWD as the interface and optionally select the SWD speed. Figure 6-1. Select Target Device © 2017 Microchip Technology Inc. User Guide DS50002612A-page 28 ATSAMR30-XPRO Figure 6-2. Select Debugger Figure 6-3. Configure Flash Loader © 2017 Microchip Technology Inc. User Guide DS50002612A-page 29 ATSAMR30-XPRO Figure 6-4. Configure Reset Figure 6-5. Configure Interface © 2017 Microchip Technology Inc. User Guide DS50002612A-page 30 ATSAMR30-XPRO 6.2 Connecting External Debuggers to an Xplained Pro Board The Xplained Pro kits that features a 10-pin 50mil debug connector can use external debug tools like ™ SAM-ICE or Atmel-ICE instead of the built-in EDBG. Evaluation kits with devices using the SWD interface on-board has a connector that is pinout compatible with the Cortex Debug Connector. The SAM-ICE is connected to the debug connector on an Xplained Pro using either an Atmel-ICE adapter, SAM-ICE adapter, or a 10-pin 50-mil header to squid cable. When using a squid cable, see the table and figures below for how to connect the SAM-ICE to the Xplained Pro board. Table 6-1. Squid Cable Connections Squid Cable Pin SAM-ICE Pin 1 (VCC) 1 (VTref) 2 (SWDIO/TMS) 7 (TMS) 3 (GND) 4 (GND) 4 (SWCLK/TCK) 9 (TCK) 5 (GND) 6 (GND) 6 (SWO/TDO) 13 (TDO) (1) 7 (Not used) 8 (Not used) 9 (Not used) 10 (RESET) 15 (RESET) Note:  1. Optional pin; used only when the device functionality supports TDO. Figure 6-6. SAM-ICE using a Squid Cable © 2017 Microchip Technology Inc. User Guide DS50002612A-page 31 ATSAMR30-XPRO Figure 6-7. SAM-ICE using an Atmel-ICE Adapter Important:  If contention with the on-board EDBG occurs, power the Xplained Pro board from another input like the external power header or from the target USB. Physically removing the connection between the EDBG and the debug header by removing 0Ω resistors, where available, or cutting the tracks to the EDBG can also be done. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 32 ATSAMR30-XPRO 7. Hardware Revision History and Known Issues 7.1 Identifying Product ID and Revision The revision and product identifier of the Xplained Pro boards can be found in two ways: either through Atmel Studio or by looking at the sticker on the bottom side of the PCB. When an Xplained Pro MCU board is connected to a computer with Atmel Studio running, an information window with the serial number is shown. The first six digits of the serial number contain the product identifier and revision. Information about connected Xplained Pro extension boards is also shown in the window. The same information can be found on the sticker on the bottom side of the PCB. Most kits have stickers that have the identifier and revision printed in plain text as A09-nnnn\rr, where nnnn is the identifier and rr is the revision. Boards with limited space have a sticker with only a data matrix code, which contains a serial number string. The serial number string has the following format: "nnnnrrssssssssss" n = product identifier r = revision s = serial number The product identifier for the SAM R30 Xplained Pro is A09-2722. 7.2 Hardware Revision Revision 7 of the SAM R30 Xplained Pro is the initial released version to the market. 7.3 Known Issues No known issues. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 33 ATSAMR30-XPRO 8. Document Revision History Revision A - 04/2017 Section Changes Document Initial Release © 2017 Microchip Technology Inc. User Guide DS50002612A-page 34 ATSAMR30-XPRO The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • • • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Customer Change Notification Service Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: • • • • Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 35 ATSAMR30-XPRO • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 36 ATSAMR30-XPRO ISBN: 978-1-5224-1665-4 Quality Management System Certified by DNV ISO/TS 16949 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California ® ® and India. The Company’s quality system processes and procedures are for its PIC MCUs and dsPIC ® DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2017 Microchip Technology Inc. User Guide DS50002612A-page 37 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office Asia Pacific Office China - Xiamen Austria - Wels 2355 West Chandler Blvd. Suites 3707-14, 37th Floor Tel: 86-592-2388138 Tel: 43-7242-2244-39 Chandler, AZ 85224-6199 Tower 6, The Gateway Fax: 86-592-2388130 Fax: 43-7242-2244-393 Tel: 480-792-7200 Harbour City, Kowloon China - Zhuhai Denmark - Copenhagen Fax: 480-792-7277 Hong Kong Tel: 86-756-3210040 Tel: 45-4450-2828 Technical Support: Tel: 852-2943-5100 Fax: 86-756-3210049 Fax: 45-4485-2829 http://www.microchip.com/ Fax: 852-2401-3431 India - Bangalore Finland - Espoo support Australia - Sydney Tel: 91-80-3090-4444 Tel: 358-9-4520-820 Web Address: Tel: 61-2-9868-6733 Fax: 91-80-3090-4123 France - Paris www.microchip.com Fax: 61-2-9868-6755 India - New Delhi Tel: 33-1-69-53-63-20 Atlanta China - Beijing Tel: 91-11-4160-8631 Fax: 33-1-69-30-90-79 Duluth, GA Tel: 86-10-8569-7000 Fax: 91-11-4160-8632 France - Saint Cloud Tel: 678-957-9614 Fax: 86-10-8528-2104 India - Pune Tel: 33-1-30-60-70-00 Fax: 678-957-1455 China - Chengdu Tel: 91-20-3019-1500 Germany - Garching Austin, TX Tel: 86-28-8665-5511 Japan - Osaka Tel: 49-8931-9700 Tel: 512-257-3370 Fax: 86-28-8665-7889 Tel: 81-6-6152-7160 Germany - Haan Boston China - Chongqing Fax: 81-6-6152-9310 Tel: 49-2129-3766400 Westborough, MA Tel: 86-23-8980-9588 Japan - Tokyo Germany - Heilbronn Tel: 774-760-0087 Fax: 86-23-8980-9500 Tel: 81-3-6880- 3770 Tel: 49-7131-67-3636 Fax: 774-760-0088 China - Dongguan Fax: 81-3-6880-3771 Germany - Karlsruhe Chicago Tel: 86-769-8702-9880 Korea - Daegu Tel: 49-721-625370 Itasca, IL China - Guangzhou Tel: 82-53-744-4301 Germany - Munich Tel: 630-285-0071 Tel: 86-20-8755-8029 Fax: 82-53-744-4302 Tel: 49-89-627-144-0 Fax: 630-285-0075 China - Hangzhou Korea - Seoul Fax: 49-89-627-144-44 Dallas Tel: 86-571-8792-8115 Tel: 82-2-554-7200 Germany - Rosenheim Addison, TX Fax: 86-571-8792-8116 Fax: 82-2-558-5932 or Tel: 49-8031-354-560 Tel: 972-818-7423 China - Hong Kong SAR 82-2-558-5934 Israel - Ra’anana Fax: 972-818-2924 Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 972-9-744-7705 Detroit Fax: 852-2401-3431 Tel: 60-3-6201-9857 Italy - Milan Novi, MI China - Nanjing Fax: 60-3-6201-9859 Tel: 39-0331-742611 Tel: 248-848-4000 Tel: 86-25-8473-2460 Malaysia - Penang Fax: 39-0331-466781 Houston, TX Fax: 86-25-8473-2470 Tel: 60-4-227-8870 Italy - Padova Tel: 281-894-5983 China - Qingdao Fax: 60-4-227-4068 Tel: 39-049-7625286 Indianapolis Tel: 86-532-8502-7355 Philippines - Manila Netherlands - Drunen Noblesville, IN Fax: 86-532-8502-7205 Tel: 63-2-634-9065 Tel: 31-416-690399 Tel: 317-773-8323 China - Shanghai Fax: 63-2-634-9069 Fax: 31-416-690340 Fax: 317-773-5453 Tel: 86-21-3326-8000 Singapore Norway - Trondheim Tel: 317-536-2380 Fax: 86-21-3326-8021 Tel: 65-6334-8870 Tel: 47-7289-7561 Los Angeles China - Shenyang Fax: 65-6334-8850 Poland - Warsaw Mission Viejo, CA Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 48-22-3325737 Tel: 949-462-9523 Fax: 86-24-2334-2393 Tel: 886-3-5778-366 Romania - Bucharest Fax: 949-462-9608 China - Shenzhen Fax: 886-3-5770-955 Tel: 40-21-407-87-50 Tel: 951-273-7800 Tel: 86-755-8864-2200 Taiwan - Kaohsiung Spain - Madrid Raleigh, NC Fax: 86-755-8203-1760 Tel: 886-7-213-7830 Tel: 34-91-708-08-90 Tel: 919-844-7510 China - Wuhan Taiwan - Taipei Fax: 34-91-708-08-91 New York, NY Tel: 86-27-5980-5300 Tel: 886-2-2508-8600 Sweden - Gothenberg Tel: 631-435-6000 Fax: 86-27-5980-5118 Fax: 886-2-2508-0102 Tel: 46-31-704-60-40 San Jose, CA China - Xian Thailand - Bangkok Sweden - Stockholm Tel: 408-735-9110 Tel: 86-29-8833-7252 Tel: 66-2-694-1351 Tel: 46-8-5090-4654 Tel: 408-436-4270 Fax: 86-29-8833-7256 Fax: 66-2-694-1350 UK - Wokingham Canada - Toronto Tel: 44-118-921-5800 Tel: 905-695-1980 Fax: 44-118-921-5820 Fax: 905-695-2078 © 2017 Microchip Technology Inc. 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