ATWINC3400-MR210CA

ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 PRELIMINARY DATASHEET Description Atmel® ATWINC3400-MR210 is an IEEE® 802.11 b/g/n RF/Baseband/MAC link controller and Low Energy Bluetooth® 4.0 compliant module optimized for low-power mobile applications. The ATWINC3400-MR210 supports single stream 1x1 802.11n mode providing up to 72Mbps PHY rate. The ATWINC3400-MR210 module features small form factor while fully integrating Power Amplifier, LNA, Switch, Power Management, and Chip Antenna. It also feature an on-chip microcontroller and integrated flash memory for system software. Implemented in 65nm CMOS technology, the ATWINC3400-MR210 offers very low power consumption while simultaneously providing high performance and minimal bill of materials. The ATWINC3400-MR210 utilizes highly optimized 802.11-Bluetooth coexistence protocols. The ATWINC3400-MR210 provides multiple peripheral interfaces including UART, SPI, and I2C. The only external clock sources needed for the ATWINC3400MR210 is a 32.768kHz clock for sleep operation. Features IEEE 802.11  IEEE 802.11 b/g/n RF/PHY/MAC SOC  IEEE 802.11 b/g/n (1x1) for up to 72Mbps PHY rate  Single spatial stream in 2.4GHz ISM band  Integrated PA and T/R switch  Integrated chip antenna  Superior sensitivity and range via advanced PHY signal processing  Advanced equalization and channel estimation  Advanced carrier and timing synchronization  Wi-Fi Direct® and Soft-AP support  Supports IEEE 802.11 WEP, WPA, WPA2 security  Supports China WAPI security  Superior MAC throughput via hardware accelerated two-level A-MSDU/A-MPDU frame aggregation and block acknowledgement  On-chip memory management engine to reduce host load  SPI, I2C, and UART host interfaces Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016  Operating temperature range of -40 to +85°C fast boot options:  Integrated flash memory for system software  SPI flash boot (firmware patches and state variables)  Low-leakage on-chip memory for state variables  Fast AP re-association (150ms)  On-Chip Network Stack to offload MCU: – Integrated network IP stack to minimize host CPU requirements  Network features: TCP, UDP, DHCP, ARP, HTTP, SSL, and DNS Bluetooth Low Energy  Bluetooth 4.0 (BLE) – Bluetooth Certification  QD ID Controller (see declaration D029496)  QD ID Host (see declaration D029497)  High Speed  Class 1 and 2 transmission  Adaptive Frequency Hopping  HCI (Host Control Interface) via high speed UART  Integrated PA and T/R Switch  Superior sensitivity and range  UART host and audio interfaces 2 ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 PRELIMINARY DATASHEET] 2 Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 Ta bl e of Conte nts 1 Ordering Information ................................................................................................... 5 2 Package Information ................................................................................................... 5 3 Block Diagram ............................................................................................................. 6 4 Pinout Information....................................................................................................... 7 5 Power Management ................................................................................................... 10 5.1 5.2 5.3 6 Clocking ................................................................................................................... 13 6.1 6.2 7 Processor ............................................................................................................................................ 14 Memory Subsystem............................................................................................................................. 14 Non-Volatile Memory ........................................................................................................................... 14 WLAN Subsystem ...................................................................................................... 16 8.1 8.2 9 Crystal Oscillation................................................................................................................................ 13 Low Power Oscillator........................................................................................................................... 13 CPU and Memory Subsystem ................................................................................... 14 7.1 7.2 7.3 8 Power Consumption ............................................................................................................................ 10 5.1.1 Description of Device States................................................................................................... 10 5.1.2 Controlling the Device States ................................................................................................. 10 Power-up/down Sequence .................................................................................................................. 11 Digital I/O Pin Behavior During Power-up Sequences......................................................................... 12 MAC 8.1.1 8.1.2 PHY 8.2.1 8.2.2 .............................................................................................................................................. 16 Features ................................................................................................................................. 16 Description.............................................................................................................................. 16 .............................................................................................................................................. 17 Features ................................................................................................................................. 17 Description.............................................................................................................................. 17 Electrical Characteristics .......................................................................................... 18 9.1 9.2 9.3 9.4 9.5 Absolute Maximum Ratings ................................................................................................................. 18 Recommended Operating Conditions ................................................................................................. 18 DC Characteristics .............................................................................................................................. 19 802.11 b/g/n Radio Performance ........................................................................................................ 20 9.4.1 Receiver Performance ............................................................................................................ 20 9.4.2 Transmitter Performance ........................................................................................................ 21 Bluetooth Low Energy (BLE) 4.0 ......................................................................................................... 21 9.5.1 Receiver Performance ............................................................................................................ 21 9.5.2 Transmitter Performance ........................................................................................................ 22 10 External Interfaces .................................................................................................... 23 10.1 I2C Slave Interface .............................................................................................................................. 24 10.1.1 Description.............................................................................................................................. 24 10.1.2 I2C Slave Timing ..................................................................................................................... 24 10.2 I2C Master Interface ............................................................................................................................ 25 10.2.1 Description.............................................................................................................................. 25 10.2.2 I2C Master Timing ................................................................................................................... 25 ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 [PRELIMINARY DATASHEET] Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 3 3 10.3 SPI Slave Interface.............................................................................................................................. 26 10.3.1 Description.............................................................................................................................. 26 10.3.2 SPI Slave Modes .................................................................................................................... 26 10.3.3 SPI Slave Timing .................................................................................................................... 27 10.4 SPI Master Interface............................................................................................................................ 28 10.4.1 Description.............................................................................................................................. 28 10.4.2 SPI Master Timing .................................................................................................................. 28 10.5 UART Interface ................................................................................................................................... 29 10.6 GPIOs .............................................................................................................................................. 29 11 Reference Design ...................................................................................................... 31 12 Package Drawing ....................................................................................................... 33 13 Reflow Profile Information ........................................................................................ 34 13.1 Storage Condition................................................................................................................................ 34 13.1.1 Moisture Barrier Bag Before Opened ..................................................................................... 34 13.1.2 Moisture Barrier Bag Open ..................................................................................................... 34 13.2 Stencil Design ..................................................................................................................................... 34 13.3 Baking Conditions ............................................................................................................................... 34 13.4 Soldering and Reflow Condition .......................................................................................................... 34 13.4.1 Reflow Oven ........................................................................................................................... 34 14 Revision History ........................................................................................................ 36 4 ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 PRELIMINARY DATASHEET] 4 Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 1 Ordering Information Ordering code Package ATWINC3400-MR210CA 2 Description 22 x 15mm With chip antenna Package Information ATWINC3400-MR210 Package Information (1) Table 2-1. Parameter Package Size Pad Count Value Units 22.3774 x 14.7320 mm 36 Total Thickness 2.0874 mm Pad Pitch 1.2040 mm Pad Width 0.8128 mm 4.4 x 4.4 mm Ground Paddle Size Note: 1. Tolerance For details, see Chapter 12 - Package Drawing on page 33. ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 [PRELIMINARY DATASHEET] Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 5 5 3 Block Diagram Figure 3-1. 6 ATWINC3400-MR210 Block Diagram ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 PRELIMINARY DATASHEET] 6 Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 4 Pinout Information This package has an exposed paddle that must be connected to the system board ground. The module pin assignment is shown in Figure 4-1. The ATWINC3400-MR210 pins are described in Table 4-1. Figure 4-1. ATWINC3400-MR210 Pin Assignment ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 [PRELIMINARY DATASHEET] Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 7 7 Table 4-1. Pin # 8 ATWINC3400-MR210 Pin Description Pin name Pin type Description 1 GND GND Ground 2 SPI CFG Digital Input Tie to VDDIO for SPI 3 N/C None No connect 4 N/C None No connect 5 N/C None No connect 6 N/C None No connect 7 RESETN Digital Input Active-Low Hard Reset 8 BT_TXD Digital I/O, Programmable Pull-Up GPIO_16/BLE UART Transmit Data Output 9 BT_RXD Digital I/O, Programmable Pull-Up GPIO_15/BLE UART Receive Data Input 10 BT_RTS Digital I/O, Programmable Pull-Up GPIO_14/BLE UART RTS output/I2C Slave Data 11 BT_CTS Digital I/O, Programmable Pull-Up GPIO_13/BLE UART CTS Input/I2C Slave Clock/WiFi® UART TXD Output 12 VDDIO Power Digital I/O Power Supply 13 GND GND Ground 14 GPIO3 Digital I/O, Programmable Pull-Up GPIO_3/SPI Flash Clock Output 15 GPIO4 Digital I/O, Programmable Pull-Up GPIO_4/SPI Flash SSN Output 16 UART_TXD Digital I/O, Programmable Pull-Up GPIO_5/Wi-Fi UART TXD Output/SPI Flash TX Output (MOSI) 17 UART_RXD Digital I/O, Programmable Pull-Up GPIO_6/Wi-Fi UART RXD Input/SPI Flash RX Input (MISO) 18 VBAT Power Battery Supply for DC/DC Converter AND PA 19 CHIP_EN Analog PMU Enable 20 RTC_CLK Digital I/O, Programmable Pull-Up RTC Clock Input/GPIO_1/Wi-Fi UART RXD Input/Wi-Fi UART TXD Output/BT UART CTS Input 21 GND GND Ground 22 GPIO8 Digital I/O, Programmable Pull-Up GPIO_8/Wi-Fi UART RXD Input/BT UART CTS Input 23 SPI_SCK Digital I/O, Programmable Pull-Up SPI Clock 24 SPI_MISO Digital I/O, Programmable Pull-Up SPI TX Data 25 SPI_SSN Digital I/O, Programmable Pull-Up SPI Slave Select 26 SPI_MOSI Digital I/O, Programmable Pull-Up SPI RX Data 27 GPIO7 Digital I/O, Programmable Pull-Up GPIO_7/Wi-Fi UART TXD output/BT UART RTS Output 28 GND GND Ground 29 GPIO17 Digital I/O, Programmable Pull-Down GPIO_17/ 30 GPIO18 Digital I/O, Programmable Pull-Down GPIO_18 31 GPIO19 Digital I/O, Programmable Pull-Down GPIO_19 ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 PRELIMINARY DATASHEET] 8 Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 Pin # Pin name Pin type Description 32 GPIO20 Digital I/O, Programmable Pull-Down GPIO_20 33 IRQN Digital I/O, Programmable Pull-Up Host Interrupt Request Output/Wi-Fi UART RXD Input/BT UART RTS Output 34 I2C_SDA_M Digital I/O, Programmable Pull-Up GPIO_21/RTC Clock/Wi-Fi UART RXD Input/Wi-Fi UART TXD Output/BT UART RTS Output 35 I2C_SDL_M Digital I/O, Programmable Pull-Up SLEEP Mode Control/Wi-Fi UART TXD output 36 GND GND Ground 49 PADDLE VSS Power Connect to System Board Ground ATWINC3400-MR210 IEEE 802.11 b/g/n Link Controller with Integrated Low Energy Bluetooth 4.0 [PRELIMINARY DATASHEET] Atmel-42535B-ATWINC3400-MR210-IEEE802.11bgn-Link-Ctlr-with-Integrated-Low-Energy-s4.0_Datasheet_032016 9 9 5 Power Management 5.1 Power Consumption 5.1.1 Description of Device States ATWINC3400-MR210 has multiple device states, depending on the state of the 802.11 and BLE subsystems. It is possible for both subsystems to be active at the same time. To simplify the device power consumption breakdown, the following basic states are defined, for which only one subsystem can be active at a time: 5.1.2  WiFi_ON_Transmit - Device is actively transmitting an 802.11 signal  WiFi_ON_Receive - Device is actively receiving an 802.11 signal  BT_ON_Transmit - Device is actively transmitting a BLE signal  BT_ON_Receive - Device is actively receiving a BLE signal  Doze - Device is neither transmitting nor receiving (device state is retained)  Power_Down - Device is powered down with CHIP_EN low and supplies connected Controlling the Device States Table 5-1 shows how to switch between the device states using the following:  CHIP_EN - Module pad #19 used to enable DC/DC Converter  VDDIO - I/O supply voltage from external supply Table 5-1. ATWINC3400-MR210 Device States Power consumption Device state CHIP_EN VDDIO Remarks IVBATT IVDDIO WiFi_ON_Transmit VDDIO On