BM-23-EVB

BM20/23 Bluetooth® Stereo Audio Module Introduction The BM20/23 stereo audio module is a Bluetooth v5.0 (BDR/EDR) audio module for designers to add wireless audio and voice applications to their products. This Bluetooth SIG-certified module provides a complete wireless solution with Bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package. This stereo module contains a built-in Li-Ion charger and a digital audio interface (BM23). It supports HSP, HFP, SPP, A2DP, and AVRCP profiles. Both AAC and SBC Codecs are supported for A2DP. Note:  The customers must connect their own external analog Codec/DSP/amplifier and MCU for audio output. Figure 1. BM20 and BM23 Module BM20 BM23 Features • • • • Qualified for Bluetooth v5.0 Specification – HFP v1.6, HSP v1.1, A2DP v1.2, AVRCP v1.5, SPP v1.0, PBAP v1.0 – Bluetooth Classic, Basic Rate/Enhanced Data Rate (BDR/EDR) On-Board Embedded Bluetooth Stack Easy to Configure with Windows Graphical User Interface (GUI) or Direct by Microcontroller Unit (MCU) Compact Surface Mount Module: – 29 x 15 x 2.5 mm – Castellated surface mount pads © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 1 BM20/23 • • • • • • • Integrated 3V and 1.8V Configurable Switching Regulator and LDO Built-in Lithium-ion Battery Charger (up to 350 mA) Built-in ADC for Battery Monitor and Voltage Sense Audio-In/Out – BM23 supports digital audio I2S format – BM20 supports analog audio output Transparent Universal Asynchronous Receiver/Transmitter (UART) Mode for Seamless Serial Data Over UART Interface Integrated Crystal Oscillator and Matching Circuitry Secure AES128 Encryption RF/Analog • • • Frequency Spectrum: 2.402 GHz to 2.480 GHz Receive Sensitivity: -91 dB (π/4 DQPSK) Transmitter Output Power: +4 dBm (maximum) for Class 2 Audio processor • • • • • • Support 64 Kbps A-Law, μ-Law PCM format/Continuous Variable Slope Delta Modulation (CVSD) for SCO Channel Operation Noise Reduction (NR) and Acoustic Echo Cancellation (ACE) Sub-Band Coding (SBC) and Optional Advanced Audio Coding (AAC) Decoding Packet Loss Concealment (PLC) Four Languages (Chinese/ English/ Spanish/ French) Voice Prompts Support (20 events for each language) using the IS20XXS_UI tool Serial Copy Management System (SCMS-T) Content Protection Audio Codec • • 20-Bit Digital-to-Analog Converter (DAC) and 16-bit Analog-to-Digital Converter (ADC) Codec 98 dB Signal-to-Noise ratio (SNR) DAC Playback Peripherals • • • • • One Line-in Port for External Audio Input Two LED Drivers One UART Interface Multiple I/O Pins for Control and Status High-Speed HCI-UART Interface (supports up to 921,600 bps) Antenna • PCB Antenna Compliance • Bluetooth Special Interest Group (SIG) Certified: – BM20 QDID: 121137 – BM23 QDID: 121137 © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 2 BM20/23 • BM20/23 modules have been granted modular approval from various countries. For additional details, refer to 9. Certification Notices. • RoHS Compliant Operating Conditions • • Operating Voltage: 3.0V to 4.2V Temperature Range: -20°C to 70°C Applications • • Bluetooth Sound Bar Bluetooth Stereo Speaker Phone © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 3 BM20/23 Table of Contents Introduction.....................................................................................................................................................1 Features......................................................................................................................................................... 1 RF/Analog............................................................................................................................................... 2 Audio processor ..................................................................................................................................... 2 Audio Codec............................................................................................................................................2 Peripherals.............................................................................................................................................. 2 Antenna...................................................................................................................................................2 Compliance............................................................................................................................................. 2 Operating Conditions.............................................................................................................................. 3 Applications.............................................................................................................................................3 1. Device Overview..................................................................................................................................... 6 1.1. 2. Interface Description.................................................................................................................... 6 Application Information..........................................................................................................................13 2.1. 2.2. 2.3. 2.4. 2.5. Operation with External MCU.....................................................................................................13 I2S Mode Application..................................................................................................................18 RESET (RST_N)........................................................................................................................ 19 Status LED (LED1, LED2)..........................................................................................................19 External Configuration................................................................................................................19 3. Electrical Characteristics.......................................................................................................................21 4. Printed Antenna Information................................................................................................................. 26 4.1. 4.2. 5. Module Radiation Pattern...........................................................................................................26 Module Placement Rules........................................................................................................... 27 Reference Circuit.................................................................................................................................. 29 5.1. 5.2. BM20 Reference Circuit............................................................................................................. 29 BM23 Reference circuit.............................................................................................................. 31 6. Physical Dimensions............................................................................................................................. 34 7. Reflow Profile........................................................................................................................................ 38 7.1. 7.2. Soldering Recommendations..................................................................................................... 38 Packing and Storage Information............................................................................................... 38 8. Ordering Information............................................................................................................................. 40 9. Certification Notices.............................................................................................................................. 41 9.1. 9.2. 9.3. 9.4. 9.5. 9.6. 9.7. United States..............................................................................................................................41 Canada.......................................................................................................................................43 Europe........................................................................................................................................44 Japan..........................................................................................................................................46 Korea..........................................................................................................................................47 Taiwan........................................................................................................................................ 47 China.......................................................................................................................................... 48 © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 4 BM20/23 9.8. 9.9. 9.10. 9.11. Brazil.......................................................................................................................................... 49 Mexico........................................................................................................................................ 49 Argentina.................................................................................................................................... 50 Other Regulatory Jurisdictions................................................................................................... 50 10. Document Revision History...................................................................................................................51 The Microchip Website.................................................................................................................................52 Product Change Notification Service............................................................................................................52 Customer Support........................................................................................................................................ 52 Microchip Devices Code Protection Feature................................................................................................ 52 Legal Notice................................................................................................................................................. 52 Trademarks.................................................................................................................................................. 53 Quality Management System....................................................................................................................... 53 Worldwide Sales and Service.......................................................................................................................54 © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 5 BM20/23 Device Overview 1. Device Overview The BM20 and BM23 stereo module is built around the IS2020S and IS2023S SoCs, respectively, which integrates the Bluetooth radio transceiver, a Power Management Unit (PMU), and a Digital Signal Processor (DSP). The following figure illustrates a typical example of the BM20 module that operates as an independent system or when connected to an MCU. Figure 1-1. BM20 Typical Application The following figure illustrates a typical example of the BM23 module connected to an external MCU and a DSP/ Codec. Figure 1-2. BM23 Typical Application 1.1 Interface Description The following figure illustrates the pin diagram of the BM20 module. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 6 BM20/23 Device Overview Figure 1-3. BM20 Module Pin Diagram The following table provides the pin description of the BM20 module. Table 1-1. BM20 Module Pin Description Pin No. 1 Name P0_0 Pin type I/O Description I/O pin, default pull-high input (Note 1) • • 2 EAN I Slide switch detector, active-low UART TX_IND, active-low Embedded ROM/External Flash enable H: Embedded; L: External Flash 3 P3_0 I I/O pin, default pull-high input (Note 1) Line-in Detector (default), active-low 4 P2_0 I I/O pin, default pull-high input System Configuration, H: Application L: Base band (Test Mode) © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 7 BM20/23 Device Overview ...........continued Pin No. 5 Name P1_5 Pin type I/O Description I/O pin, default pull-high input (Note 1) • • • • 6 P0_4 I/O NFC detection pin, active low Out_Ind_0 Slide Switch Detector, active low Buzzer Signal Output I/O pin, default pull-high input (Note 1) • • NFC detection pin, active low Out_Ind_0 7 SPKR O Right-channel, analog headphone output 8 AOHPM O Headphone common mode output/sense input 9 SPKL O Left-channel, analog headphone output 10 VDDA P Positive power supply/reference voltage for Codec, no need to add power to this pin 11 MIC1_P I MIC 1 mono differential analog positive input 12 MIC1_N I MIC 1 mono differential analog negative input 13 MIC_BIAS P Electric microphone biasing voltage 14 AIR I Right-channel, single-ended analog input 15 AIL I Left-channel, single-ended analog input 16 RST I System Reset pin, Low: reset 17 VCC_RF P 1.28V RF LDO output, no need to add power to this pin 18 P0_1 I/O I/O pin, default pull-high input (Note 1) • • FWD key, when Class 2 RF (default), active-low Class 1 Tx Control signal of external RF T/R switch, active-high 19 VDD_IO P Power output, no need to add power to this pin 20 ADAP_IN P 5V Power adapter input 21 BAT_IN P 3.0V to 4.2V Li-Ion battery input 22 NC - No connection 23 GND P Ground pin 24 SYS_PWR P System power output BAT mode: 3.0 to 4.2V Adapter mode: 4.0V 25 BK_OUT P 26 MFB I 27 LED1 I LED driver 1 28 LED2 I LED driver 2 © 2019 Microchip Technology Inc. 1.8V Buck output, no need to add power to this pin • • Power key in off mode UART_RX_IND: MCU used to wake-up Bluetooth (Note 1) Datasheet DS70005406B-page 8 BM20/23 Device Overview ...........continued Pin No. 29 Name P2_4 Pin type I Description I/O pin, default pull-high input System Configuration L: Boot Mode with P2_0 low combination 30 P0_2 I I/O pin, default pull-high input (Note 1) Play/Pause key (default), active-low 31 P0_3 I/O I/O pin, default pull-high input (Note 1) • • • • REV key (default), active low Buzzer Signal Output Out_Ind_1 Class1 Rx control signal of external RF T/R switch, active-high 32 HCI_TXD O HCI-UART data output 33 HCI_RXD I HCI-UART data input 34 P0_5 I I/O pin, default pull-high input (Note 1) Volume down (default), active-low 35 P2_7 I I/O pin, default pull-high input (Note 1) Volume up key (default), active-low 36 P2_4 I I/O pin, default pull-high input System Configuration, L: Boot Mode with P2_0 low combination 37 GND P Ground pin 38 NC - No Connection 39 NC - No Connection 40 NC - No Connection • • • • I: Input pin O: Output pin I/O: Input/Output pin P: Power pin Note:  All I/O pins can be configured using the IS20XXS_UI tool. The following figure illustrates the pin diagram of the BM23 module. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 9 BM20/23 Device Overview Figure 1-4. BM23 Module Pin Diagram Table 1-2. BM23 Pin Description Pin No. Name Pin Type Description 1 P0_0 I/O 2 RFS0 I/O I2S interface: DAC Left/Right clock 3 TFS0 I/O I2S interface: ADC Left/Right clock 4 SLK0 I/O I2S interface: Bit clock 5 DR0 I I2S interface: DAC Digital Left/Right data 6 DT0 O I2S interface: ADC Digital Left/Right data 7 P0_4 I/O I/O pin, default pull-high input © 2019 Microchip Technology Inc. • • I/O pin, default pull-high input (Note 1) UART TX_IND Datasheet DS70005406B-page 10 BM20/23 Device Overview ...........continued Pin No. 8 Name EAN Pin Type I Description Embedded ROM/External Flash enable High: ROM mode; Low: External Flash mode 9 MIC1_P I MIC 1 mono differential analog positive input 10 MIC1_N I MIC 1 mono differential analog negative input 11 MIC_BIAS P Power output, microphone biasing voltage 12 VDDA P Power output, reserve for external capacitance to fine tune audio frequency 13 AIR I Right-channel, stereo analog line-in 14 AIL I Left-channel, stereo analog line-in 15 GND P Ground 16 RST I System Reset pin, active when rising edge 17 NC - - 18 NC - - 19 VDDIO P Power output, VDDIO pin, no need to add power to this pin 20 P1_5 I/O I/O pin, default pull-high input 21 P0_1 I/O I/O pin, default pull-high input 22 ADAP_IN P 5V power adapter input 23 BAT_IN P 3.3V to 4.2V Li-Ion battery input 24 NC - - 25 SYS_PWR P System Power Output BAT mode: 3.3 to 4.2V Adapter mode: 4.0V 26 BK_OUT P 1.8V power output, no need to add power to this pin 27 MFB P 28 LED1 P LED driver 1 and maximum 4 mA 29 LED2 P LED driver 2 and maximum 4 mA 30 P2_4 I I/O pin, default pull-high input • • Power key, when in Off mode UART_RX_IND: MCU used to wake up Bluetooth System Configuration, L– Boot Mode with P2_0 low combination 31 P0_2 I/O I/O pin, default pull-high input 32 P0_3 I/O I/O pin, default pull-high input 33 HCI_TXD O HCI-UART data output 34 HCI_RXD I HCI-UART data input © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 11 BM20/23 Device Overview ...........continued Pin No. Name Pin Type Description 35 P0_5 I/O I/O pin, default pull-high input 36 P2_7 I/O I/O pin, default pull-high input 37 P2_0 I/O I/O pin, default pull-high input 38 P3_0 I/O I/O pin, default pull-high input 39 P2_0 I I/O pin, default pull-high input System Configuration, H: Application L: Base band (Test Mode) 40 GND P Ground 41 NC - - 42 NC - - 43 NC - - • • • • I: Input pin O: Output pin I/O: Input/Output pin P: Power pin Note:  All I/O pins can be configured using the IS20XXS_UI tool. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 12 BM20/23 Application Information 2. Application Information 2.1 Operation with External MCU The BM20/23 stereo module supports a UART command set to make an external MCU control the module. The following figure illustrates the interface between the BM20/23 module and an external MCU. Figure 2-1. Interface between MCU and BM20/23 Module The MCU controls the module by the UART interface and wakes up the module by the PWR pin. The stereo module provides a wake-up MCU function that connects to P0_0 pin of the module. Refer to the UART Command Set document for a list of functions the BM20/23 module supports and how to use the UI tool to configure the UART and UART Command Set tool. For a more detailed description, refer to the UART_CommandSet_v154 document and the IS20XXS_UI tool. A UART control signal timing sequence is illustrated in the following figure. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 13 Power- BK_OUT/LDO31_VO RST_N MCU sends UART command (BM2x UART_RX) Bluetooth response UART state (BM2x UART_TX) idle MFB (PWR) on/initial ≈ ≈ ≈ ≈ ≈ MCU state SYS_PWR BAT_IN 1 ms ≈ 400 ms Power-on any Power-on ACK 20 ms 10 ms UART Command ACK ≈ ≈ ≈ ≈ ≈ ≈≈ ≈ ≈ © 2019 Microchip Technology Inc. ≈ Figure 2-2. Power ON/OFF Sequence off UART Command MCU sends power- Power-on ACK 2s Power-off > 1s idle low level connections to MCU Bluetooth and Keep all BM20/23 Application Information Datasheet DS70005406B-page 14 BM20/23 Application Information A timing sequence of Rx indication after power-on is illustrated in the following figure. Figure 2-3. Timing Sequence of Rx Indication After Power-On A timing sequence of Rx indication after power-off is illustrated in the following figure. Figure 2-4. Timing Sequence of Rx Indication After Power-Off A timing sequence of power-on (Nack) is illustrated in the following figure. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 15 Power- BM62/64 response UART state (BM2x UART_TX) Datasheet 400 ms Power-on 20 ms 10 ms NACK Set “Power-on Directly” boot RST_N MCU sends UART command (BM2x RT_RX) BK_OUT/LDO31_VO idle MFB (PWR) on/initial 200 ms Power-on ACK any UART Wait Maximum: 5 times (1s) Retry, if ACK is not received Command ACK ≈ ≈ ≈ ≈ ≈ ≈ ≈ ≈ MCU state SYS_PWR BAT_IN 1 ms ≈ ≈ ≈ ≈≈ ≈ ≈ © 2019 Microchip Technology Inc. ≈ Figure 2-5. Timing Sequence of Power-On (Nack) BM20/23 Application Information DS70005406B-page 16 BM20/23 Application Information If the module is hanged, the reset timing sequence must be as illustrated in the following figure. Figure 2-6. Reset Timing Sequence if Module is Hanged If the MCU sends a UART Command and Bluetooth does not respond within X-ms, then the MCU sends a reset signal to BT to perform the hardware reset. A timing sequence of power drop protection is illustrated in the following figure. Figure 2-7. Timing Sequence of Power Drop Protection If the Bluetooth BAT uses an adapter that translates voltage by LDO, it is recommended to use “Reset IC” to avoid power-off suddenly. The Rest IC output pin must be “Open Drain” with a delay time ≦ 10 ms and the recommended part is TCM809SVNB713 or G691L263T73. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 17 BM20/23 Application Information 2.2 I2S Mode Application The BM23 module provides an I2S digital audio signal interface to connect with an external Codec/DSP. It provides 8, 44.1 and 48 kHz sampling rates for 16-bit and 24-bit data formats. The I2S setting can be configured by using the UI and DSP tools. The external Codec/DSP is connected to SLK0, RFS0, TFS0, DR0, and DT0 (pins 4, 2, 3, 5, and 6 respectively). The I2S signal connection between the BM23 and external DSP is illustrated in the following figure. Figure 2-8. Master Mode Reference Connection The Slave mode reference connection is shown in the following figure. Figure 2-9. Slave Mode Reference Connection Note:  1. For 002 version chip or module, the system must connect line 1 in the above figure. 2. For other version chip or module, the system must connect line 2 in the above figure. For Master or Slave mode setting, use the DSP Configuration Tool to set up the system. The following figures illustrate the clock and data timing diagram. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 18 BM20/23 Application Information Figure 2-10. Timing for I2S Modes (both Master and Slave) The following figures illustrate the timing diagram in the PCM modes. Figure 2-11. Timing Diagram for PCM Modes (Master/Slave) 2.3 RESET (RST_N) RST is the module reset pin, which is in Active-Low state. To reset the module, the RST_N pin must hold LOW for at least 63 ns. 2.4 Status LED (LED1, LED2) The status LED provides the following status indications: • • • • • • • Standby Inquiry Link Link Back Low Battery Page Battery Charging Note:  Each LED flashing sequence and brightness status indications are configurable by the UI tool. 2.5 External Configuration The BM20/23 stereo module can be configured and the firmware programmed using an external configuration and programming tool available from Microchip. The following figure illustrates the configuration and firmware programming interface on BM23. It is recommended to include a pin header on the main PCB for development. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 19 BM20/23 Application Information Figure 2-12. External Programming Header Connections Configuration and firmware programming modes are entered according to the system configuration I/O pins as shown in the following table. Pins P20, P24 and EAN contain internal pull-up. Table 2-1. System Configuration Settings P20 P24 EAN Operational Mode High High High APP mode (Normal operation) Low High High APP mode (Normal operation) Low Low High Write Flash (Firmware programming, if flash build-in in chip) © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 20 BM20/23 Electrical Characteristics 3. Electrical Characteristics The following table provides the absolute maximum specification conditions of the BM20/23 module. Table 3-1. Absolute Maximum Specification Symbol Parameter Min. Max. Unit BAT_IN Input voltage for battery 0 4.3 V ADAP_IN Input voltage for adapter 0 7.0 V TSTORE Storage temperature -65 +150 ºC TOPERATION Operation temperature -20 +70 ºC The following table provides the recommended operating condition of the BM20/23 module. Table 3-2. Recommended Operating Condition Symbol Parameter Min. Typical Max. Unit BAT_IN Input voltage for battery 3 3.7 4.2 V ADAP_IN Input voltage for adapter 4.5 5 5.5 V TOPERATION Operation temperature -20 +25 +70 ºC Note:  The absolute and recommended operating condition tables reflect typical usage for device. CAUTION Stresses listed under Absolute Maximum Ratings cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions and those indicated in the operation listings of this specification, is not implied. Exposure to maximum rating conditions for extended periods affects the device reliability. The parameters of the I/O and reset level are shown in the following table. Table 3-3. I/O and Reset Level Parameter Min. I/O supply voltage (VDD_IO) Typ. Max. Units 2.7 - 3.3 V VIL input logic levels low ‐0.3 - 0.8 V VIH input logic levels high 2.0 - 3.6 V VOL output logic levels low - - 0.4 V VOH output logic levels high 2.4 - - V - 1.6 - V I/O Voltage Levels RESET VTH,RES threshold voltage Note:  1. VDD_IO voltage is programmable by EEPROM parameters. 2. These parameters are characterized but not tested in manufacturing. The parameters of the battery charger are shown in the following table. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 21 BM20/23 Electrical Characteristics Table 3-4. Battery Charger Parameter Min Typical Max Unit ADAP_IN input voltage 4.5 5.0 5.5 V Supply current to charger only - 3 4.5 mA 170 200 240 mA 160 180 240 mA 330 350 420 mA 180 220 270 mA Trickle charge voltage threshold - 3 - V Battery charge termination current, - 10 - % Maximum battery Headroom > 0.7V Fast charge current (ADAP_IN=5V) Note: ENX2=0 Headroom = 0.3V (ADAP_IN=4.5V) Maximum battery Headroom > 0.7V Fast charge current (ADAP_IN=5V) Note: ENX2=1 Headroom = 0.3V (ADAP_IN=4.5V) (% of fast charge current) Note:  1. Headroom = VADAP_IN – VBAT 2. ENX2 is not allowed to be enabled, when VADAP_IN – VBAT > 2V 3. These parameters are characterized but not tested in manufacturing The parameters of the LED driver are shown in the following table. Table 3-5. LED driver Parameter Min Typical Max Unit Open-drain voltage - - 3.6 V Programmable current range 0 - 5.25 mA Intensity control - 16 - Step Current step - 0.35 - mA Power down open-drain current - - 1 μA Shutdown current - - 1 μA Note:  1. Test condition: SAR_VDD = 1.8V, temperature = 25 ºC. 2. These parameters are characterized but not tested in manufacturing. The parameters of the audio Codec ADC are provided in the following table. T= 25ºC, Vdd = 3.0V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz. Table 3-6. Audio Codec ADC Parameter (Condition) Min. Typ. Max. Unit Resolution - - 16 Bits Output sample rate 8 - 48 kHz © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 22 BM20/23 Electrical Characteristics ...........continued Parameter (Condition) Min. Signal-to-Noise Ratio Note: 1 Typ. 88 Max. Unit - dB 4.85 dB (SNR at MIC or Line-in mode) Digital gain -54 Digital gain resolution - 2 to 6 - dB MIC boost gain - 20 - dB Analog gain - - 60 dB Analog gain resolution - 2.0 - dB Input full-scale at maximum gain (differential) - 4 - mV rms Input full-scale at minimum gain (differential) - 800 - mV rms 3 dB bandwidth - 20 - kHz Microphone mode (input impedance) - 24 - kOhm THD+N (microphone input) at 30 mV/rms input - 0.02 - % Note:  1. fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 1%, 150 mVpp input. 2. These parameters are characterized but not tested in manufacturing. The parameters of the audio Codec DAC are provided in the following table. T = 25℃, Vdd = 3.0V, 1 kHz sine wave input, Bandwidth = 20 Hz to 20 kHz Table 3-7. Audio Codec DAC Parameter Min. Typ. Max. Unit Over-sampling rate - 128 - fs Resolution 16 - 20 Bits Output sample rate 8 - 48 kHz 96 - dB 98 - dB Signal-to-Noise Ratio (Note: 1) (SNR at Capless mode) for 48 kHz Signal-to-Noise Ratio (Note: 1) (SNR at Single-Ended mode) for 48 kHz Digital gain -54 - 4.85 dB Digital gain resolution - 2 to 6 - dB Analog gain -28 - 3 dB Analog gain resolution - 1 - dB Output voltage full-scale swing (AVDD=2.8V) (Note: 3) - 742.5 - mV/rms Maximum output power (16 Ohm load) - 34.5 - mW © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 23 BM20/23 Electrical Characteristics ...........continued Parameter Min. Typ. Max. Unit Maximum output power (32 Ohm load) - 17.2 - mW Allowed load (Resistive) 8 16 O.C. Ω Allowed load (Capacitive) - - 500 pF THD+N (16 Ohm load) - - 0.05 % Signal-to-Noise Ratio (SNR at 16 Ohm load) - - 96 dB Note:  1. fin = 1 kHz, B/W = 20 Hz to 20 kHz, A-weighted, THD+N < 0.01%, 0 dBFS signal, Load = 100 kOhm. 2. These parameters are characterized but not tested in manufacturing. 3. Vdd and AVDD are generated by internal LDO. The parameters of the transmitter section for BDR and EDR are shown in the following table. Test condition: VCC_RF= 1.28V, temperature=25ºC. Table 3-8. Transmitter section for BDR and EDR Parameter Min. Typ. Bluetooth specifications Max. Unit Maximum RF transmit power (BM20 - - - -6 to 4 dB Maximum RF transmit power (BM23) - 2 - -6 to 4 - EDR/BDR -4 -1.2 1 -4 to 1 dB Relative transmit power Note:  The RF Transmit power is calibrated during production using MP Tool software and MT8852 Bluetooth Test equipment. The parameters of the receiver section for BDR and EDR are shown in the following table. Test condition: VCC_RF = 1.28V, temperature = 25ºC. Table 3-9. Receiver Section for BDR and EDR Parameters Modulation Min. Typ. Max. Bluetooth Specification Unit Sensitivity at 0.1% BER GFSK - -90 - ≤-70 dBm Sensitivity at 0.01% BER π/4 DQPSK - -91 - ≤-70 dBm 8DPSK - -82 - ≤-70 dBm Note:  These parameters are characterized but not tested in manufacturing. The parameters of system current consumption of analog audio output are shown in the following table. Test condition: BAT_IN = 3.8V, link with HTC EYE cell phone; distance between cell phone and EVB is 30 cm. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 24 BM20/23 Electrical Characteristics Table 3-10. System Current Consumption of Analog Audio Output System Status Typ. Max. Unit System off mode 2 5 µA Standby mode 0.8 - mA Linked mode 0.4 - mA SCO link 7.8 - mA A2DP link (Vp-p = 200 mV; 1k tone signal) 10.7 - mA Note:  Use BM20 EVB as a test platform. The parameters of system current consumption of digital audio output are shown in the following table. Test condition: BAT_IN = 3.8V, link with HTC M8 cell phone; distance between cell phone and EVB is 30 cm; I2S signal link with YAMAHA YDA174 EVB. Table 3-11. System Current Consumption of Digital Audio Output System status Typ Max Unit System Off mode 2 5 µA Standby mode 0.4 - mA Linked mode 0.4 - mA SCO link 9.3 - mA A2DP link (1k tone signal) 11.7 - mA Note:  Use BM23 EVB as a test platform. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 25 BM20/23 Printed Antenna Information 4. Printed Antenna Information 4.1 Module Radiation Pattern The stereo module contains a PCB printed antenna. The PCB printed antenna radiation pattern is illustrated in the following figure. Figure 4-1. Antenna Keep Out Area Examples © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 26 BM20/23 Printed Antenna Information Figure 4-2. PCB Antenna 3D Radiation Pattern at 2441 MHZ The following table provides the details of BM2X PCB Antenna characteristics. Table 4-1. BM2x PCB Antenna Characteristics Parameter 4.2 Values Frequency 2400 MHz to 2480 MHz Peak Gain 1.927 dBi Efficiency 73.41% Module Placement Rules On the main PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in the below figure. A low‐impedance ground plane will ensure the best radio performance (best range, lowest noise). The ground plane can be extended beyond the minimum recommended as needed for the main PCB EMC noise reduction. For the best range performance, keep all external metal at least 15 mm away from the ceramic chip antenna. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 27 BM20/23 Printed Antenna Information Figure 4-3. Module Placement Examples Figure 4-4. GND Plane on Main Application Board © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 28 BM20/23 Reference Circuit 5. Reference Circuit This section provides the reference schematics of BM20 and BM23 modules. 5.1 BM20 Reference Circuit The following figures illustrate the reference schematics of the BM20 module. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 29 BM20/23 Reference Circuit Figure 5-1. BM20 Reference Circuit © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 30 BM20/23 Reference Circuit Figure 5-2. BM20 Reference Circuit 5.2 BM23 Reference circuit The following figures illustrate the reference circuit of the BM23 module. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 31 BM20/23 Figure 5-3. BM23 Reference circuit Reference Circuit © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 32 BM20/23 Figure 5-4. BM23 Reference circuit Reference Circuit © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 33 BM20/23 Physical Dimensions 6. Physical Dimensions The following figure shows the PCB dimension of BM20 module. Figure 6-1. BM20 Module PCB dimension Top View Side View Bottom View PCB dimension: • • • X: 15.0 mm Y: 29.0 mm Tolerances: 0.25 mm The following figure shows the PCB dimension of BM23 module. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 34 BM20/23 Physical Dimensions Figure 6-2. BM23 Module PCB dimension Top View Side View Bottom View PCB dimension: • • • X: 15.0 mm Y: 29.0 mm Tolerances: 0.25 mm The following figure provides the recommended PCB footprint of the BM20 module. © 2019 Microchip Technology Inc. Datasheet DS70005406B-page 35 BM20/23 Physical Dimensions Top View >+30.0 +30.0