BM70/71
Bluetooth® Low Energy (BLE) Module
Features
• Qualified for Bluetooth SIG v5.0 core specification
• Certified to FCC, ISED, MIC, KCC, NCC, and
SRRC radio regulations
• Certified by European RED Assessed Radio
module
• Compliant to RoHS
• Supports UART interface
• Supports transparent UART data service of BLE
• The BM70 module supports 3-channel pulsewidth modulation (PWM) and the BM71 module
supports 1-channel PWM
• Supports Precision Temperature Sensor (PTS) for
ambient temperature detection
• Supports 12-bit ADC (ENOB=10 or 8 bits) for
battery and voltage detection
• Provides 8-channel ADC for the BM70 module
and 5-channel ADC for the BM71 module
• Features 18 general purpose I/O (GPIO) pins for
the BM70 module and 9 GPIO pins for the BM71
module
• Features integrated 32 MHZ crystal
• Small and compact surface mount module
• Castellated surface mount pads for easy and
reliable host PCB mounting
FIGURE 1:
BM70 MODULE
FIGURE 2:
BM71 MODULE
RF Features
•
•
•
•
•
ISM band 2.402 GHz to 2.480 GHz operation
Channels: 0 to 39
Receive Sensitivity: typical -90 dBm (LE)
Transmit Power: 0 dBm (typical)
Received Signal Strength Indication (RSSI)
monitor with 1 dB resolution
MAC/Baseband/Higher Layer Features
• Secure AES128 encryption
• GAP, GATT, SMP, L2CAP and integrated public
profile support
• To create custom GATT services, refer to the
“BM70/71 Bluetooth® Low Energy Module User’s
Guide” (DS50002542) for details.
• Configurable role as peripheral/central, client/
server
2015-2019 Microchip Technology Inc.
Antenna
• Chip antenna (BM7xBLES1FC2) range based on
open air measurement and phone-module
connection:
- BM70: up to 50m
- BM71: up to 10m
• External antenna (BM7xBLE01FC2) connection
through RF pad
Power Management
• Two low power modes supported, with wake up
through GPIO or internal timer
• Average current: Tx=3.3 mA and Rx=3.2 mA with
buck at 3.0V VBAT input and 18.75 ms connection
interval, when transmitting full data packets to
achieve a data rate of approximately 8.6 kbps
DS60001372J-Page 1
BM70/71
Operating Conditions
• Operating voltage range: 1.9V to 3.6V
• Operating temperature: -40ºC to +85ºC
Applications
•
•
•
•
•
•
•
Internet of Things (IoT)
Secure Payment
Wearable Devices
Home and Security
Health and Fitness
Beacons
Industrial and Data Logger
General Description
The BM70/71 module offers BLE solutions for embedded applications. It conforms to the Bluetooth 5 core
specification to enhance the throughput and security
for the IoT applications. It also supports beacon
technology to enhance the user experience for the IoT
applications, and enables users to control the cloud
and receive data without opening the application
through a smartphone.
The BM70/71 module has an integrated Bluetooth
stack and is available in different form factors to
optimize space, cost, and RF performance. The poweroptimized design minimizes the current consumption
and extends battery life for portable and wearable
applications.
DS60001372J-Page 2
2015-2019 Microchip Technology Inc.
BM70/71
Table of Contents
1.0 Device Overview .............................................................................................................................................................................. 5
2.0 Application Information .................................................................................................................................................................. 13
3.0 Module Configuration ..................................................................................................................................................................... 25
4.0 Antenna.......................................................................................................................................................................................... 27
5.0 Electrical Characteristics................................................................................................................................................................ 37
6.0 Physical Dimensions ...................................................................................................................................................................... 43
7.0 Soldering Recommendations ......................................................................................................................................................... 51
8.0 Ordering Guide .............................................................................................................................................................................. 53
Appendix A: Certification Notices......................................................................................................................................................... 55
Appendix B: Revision History............................................................................................................................................................... 63
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To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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2015-2019 Microchip Technology Inc.
DS60001372J-Page 3
BM70/71
NOTES:
DS60001372J-Page 4
2015-2019 Microchip Technology Inc.
BM70/71
1.0
DEVICE OVERVIEW
The BM70/71 module is built around Microchip
Technology IS1870/71 BLE Integrated Circuit (IC). The
IS1870/71 IC includes an on board Bluetooth stack, a
power management subsystem, a 2.4 GHz transceiver,
and an RF power amplifier. The user can embed
Bluetooth functionality into any product using the
BM70/71 module.
The BM70/71 module enables the following features:
•
•
•
•
Simple integration and programming
Reduced development time
Superior wireless module with a low-cost system
Interoperability with Apple® iOS and Android™
OS
• A wide range of applications
FIGURE 1-1:
The BM70/71 module can independently maintain a low
power wireless connection. Low power and flexible
power management features maximize the lifetime of the
BM70/71 module in battery-operated devices. A wide
operating temperature range enables its applications in
indoor and outdoor environments.
The BM70/71 module is a small, compact, and
surface-mounted module with castellated pads for easy
and reliable host PCB mounting. The relatively small
form factor of the module is targeted for applications,
such as wearable sports, fitness devices and so on.
1.1
Interface Description
Figure 1-1 and Figure 1-2 illustrate an example of the
BM70/71 module-based system.
BM70 MODULE BLOCK DIAGRAM
Note 1: SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 5
BM70/71
FIGURE 1-2:
BM71 MODULE BLOCK DIAGRAM
Note 1: SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
DS60001372J-Page 6
2015-2019 Microchip Technology Inc.
BM70/71
Figure 1-3 through Figure 1-6 illustrate the pin diagrams
of the BM70/71 module.
FIGURE 1-3:
BM70BLE01FC2 PIN DIAGRAM
FIGURE 1-4:
BM70BLES1FC2 PIN DIAGRAM
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DS60001372J-Page 7
BM70/71
FIGURE 1-5:
BM71BLE01FC2 PIN DIAGRAM
FIGURE 1-6:
BM71BLES1FC2 PIN DIAGRAM
DS60001372J-Page 8
2015-2019 Microchip Technology Inc.
BM70/71
Table 1-1 provides pin descriptions of the BM70/71
module.
TABLE 1-1:
BM70/71 PIN DESCRIPTION
BM70BLE0 BM70BLE BM71BLE BM71BLE
Pin Name
1FC2
S1FC2
01FC2
S1FC2
Type
Description
—
1
—
—
GND
Power
Ground reference
—
2
—
—
GND
Power
Ground reference
1
3
12
13
GND
Power
Ground reference
2
4
11
14
VBAT
Power
Battery input. Voltage range: 1.9V to
3.6V
—
—
10
—
BK_IN
Power
Buck input. Voltage range: 1.9V to 3.6V
3
5
—
—
P2_2
DIO
4
6
—
—
VDD_IO
Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
5
7
—
—
VDD_IO
Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
6
8
—
—
ULPC_O
Power
1.2V programmable ULPC LDO output
for AON-logic and retention memory supply. Internal use only, do not connect to
other devices
7
9
—
—
P2_3
DI
8
10
—
—
BK_O
Power
1.55V buck output. Internal use only, do
not connect to other devices
—
—
13
6
P1_6
DIO
P1_6, when connected to the host MCU,
set the MCU pin connected to P1_6
either high impedance or drive pin to low
during firmware start-up (approximately
22 msec)
—
—
14
5
P1_7
DIO
P1_7
9
11
15
15
P2_7/TX_
IND
DIO
AI
DO
GPIO: P2_7
ADC Input: AD14
TX_IND
10
12
—
—
P1_1
DIO
AI
GPIO: P1_1
ADC Input: AD9
11
13
2
3
P1_2
DIO
AI
GPIO, default pull-high input
AD10
12
14
3
4
P1_3
DIO
AI
GPIO, default pull-high input
AD11
13
15
8
11
P0_0
DIO
AI
DI
GPIO, default pull-high input
AD0
UART flow-control CTS
14
16
—
—
P1_0
DIO
AI
GPIO, default pull-high input
AD8
15
17
6
9
P3_6
DIO
DO
DO
GPIO, default pull-high input
PWM0
UART flow-control RTS
16
18
16
16
P2_0
DI
2015-2019 Microchip Technology Inc.
GPIO, default pull-high input PWM1
GPIO, default pull-high input PWM2
System configuration, default pull-high
input
H: Application mode
L: Test mode
DS60001372J-Page 9
BM70/71
TABLE 1-1:
BM70/71 PIN DESCRIPTION (CONTINUED)
BM70BLE0 BM70BLE BM71BLE BM71BLE
Pin Name
1FC2
S1FC2
01FC2
S1FC2
Type
17
19
—
—
P2_4
DIO
18
20
—
—
NC
—
Legend:
A = Analog
D = Digital
19
21
7
10
RST_N
20
22
5
7
21
23
4
8
22
24
—
23
25
—
24
26
25
27
26
Description
GPIO, default pull-high input
No connection
I = Input
O = Output
DI
Module Reset (active-low) (internal pull
up)
HCI_RXD
DI
HCI UART data input
HCI_TXD
DO
HCI UART data output
—
P3_1
DIO
GPIO: P3_1
—
P3_2
DIO
GPIO: P3_2
—
—
P3_3
DIO
GPIO: P3_3
—
—
P3_4
DIO
GPIO: P3_4
28
—
—
P3_5
DIO
DO
GPIO, default pull-high input
LED1
27
29
—
—
P0_7
DIO
AI
GPIO, default pull-high input
AD7
28
30
9
12
P0_2/LED
DIO
AI
P02
AD2
29
31
17
2
GND
Power
Ground reference
—
32
—
—
GND
Power
Ground reference
30
—
1
—
BT_RF
AI
—
33
—
—
GND
Power
Legend:
External antenna connection (50 Ohm)
Only for BM70BLE01FC2 and
BM71BLE01FC2
No connection for BM71BLES1FC2
Ground reference
A = Analog
D = Digital
I = Input
O = Output
DS60001372J-Page 10
2015-2019 Microchip Technology Inc.
BM70/71
Table 1-2 provides the hardware features of the
BM70/71 module.
Note:
I2C and SPI are accessible using specific
firmware versions that support these
peripheral interfaces. Please refer to the
BM70/71 product page on the Microchip
web site for the latest firmware.
TABLE 1-2:
BM70/71 MODULE HARDWARE FEATURES
Feature/ Modules
BM70BLES1FC2
BM70BLE01FC2
BM71BLES1FC2
BM71BLE01FC2
Module
H/W
Default
IS1870
Firmware
Module
H/W
Default
IS1870
Firmware
Module
H/W
Default
IS1871
Firmware
Module
H/W
Default
IS1871
Firmware
UART
1
1
1
1
1
1
1
1
GPIO (see Note 2)
18
13
18
13
9
4
9
4
12-bit ADC channels
8
6
8
6
5
3
5
3
PWM
3
2
3
2
1
0
1
0
Total pins
33
—
30
—
16
—
17
—
On board antenna with
CAN
Yes
—
—
—
Yes
—
—
—
—
—
Yes
—
—
—
Yes
—
Yes
—
—
—
Yes
—
—
—
12x22x2.4
—
12x15x1.6
—
9x11.5x2.1
—
6x8x1.6
—
Configuration
No Antenna
Government regulatory
RF certified
Size (mm)
Note 1:
2:
The GPIO, ADC and PWM numbers used are based on disabling the LED indication and UART Hardware
flow-control (RTS/CTS) functionality, see Table 1-1.
For a detailed explanation of GPIO, refer to the “BM70/71 Bluetooth® Low Energy Module User’s Guide”
(DS50002542).
2015-2019 Microchip Technology Inc.
DS60001372J-Page 11
BM70/71
Table 1-3 provides the details of the test pads used for
the production test on the bottom of the BM70/71
module. See Figure 1-3 through Figure 1-6 for more
details.
TABLE 1-3:
TEST PADS DETAILS
BM70BLE
01FC2
BM70BLE
S1FC2
BM71BLE
01FC2
BM71BLE
S1FC2
Pin Name
Type
TP-1
TP-1
TP-3
TP-3
VCC_PA
Power
1.55V RF PA LDO
TP-2
TP-2
TP-1
TP-1
CLDO_O
Power
1.2V CLDO output
TP-3
TP-3
TP-2
TP-2
VCC_RF
Power
1.28V RF LDO output
—
—
TP-4
TP-4
ULPC_O
Power
1.2V ULPC LDO output
—
—
TP-5
TP-5
BK_O
Power
1.55V buck output
DS60001372J-Page 12
Description
2015-2019 Microchip Technology Inc.
BM70/71
2.0
APPLICATION INFORMATION
2.1
Reference Schematics
Figure 2-1 through Figure 2-8 illustrate the BM70/71
module reference schematics for the various Stock
Keeping Units (SKUs). The GPIOs are configurable,
and the connection depends on the user’s application
circuit.
It is recommended to use an external Reset IC in all
applications. An example of using this circuit with the
MCP111-195 is illustrated in Figure 2-1, Figure 2-3,
Figure 2-5, and Figure 2-7. This Reset IC prevents the
Flash data corruption, when VBAT drops below 1.9V
(this includes brown-out, power-down, and power-up
conditions).
FIGURE 2-1:
The RF antenna impedance matching circuit in
Figure 2-3 and Figure 2-5 require users to implement
by the selected antenna specification.
For battery-powered applications, it is recommended to
use the following external circuits as illustrated in
Figure 2-2, Figure 2-4, Figure 2-6, and Figure 2-8. The
first circuit (left side) ensures that the LED indicator is
bright enough in applications with VBAT > 3.0V. The
second circuit (right side) provides protection from battery voltage reverse connection.
If a fixed voltage source is applied to VBAT (e.g. 3.3V),
the soft start output is necessary to prevent the inrush
voltage over 3.6V to damage the Flash.
BM70BLES1FC2 REFERENCE CIRCUIT
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DS60001372J-Page 13
BM70/71
FIGURE 2-2:
BM70BLES1FC2 REFERENCE CIRCUIT
FIGURE 2-3:
BM70BLE01FC2 REFERENCE CIRCUIT
DS60001372J-Page 14
2015-2019 Microchip Technology Inc.
BM70/71
FIGURE 2-4:
BM70BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-5:
BM71BLE01FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module. Connect the BK_IN and VBAT trace at C3.
2: The antenna matching component value depends on the user’s antenna and PCB layout.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 15
BM70/71
FIGURE 2-6:
BM71BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-7:
BM71BLES1FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module.
DS60001372J-Page 16
2015-2019 Microchip Technology Inc.
BM70/71
FIGURE 2-8:
BM71BLES1FC2 REFERENCE CIRCUIT - OPTIONAL
2015-2019 Microchip Technology Inc.
DS60001372J-Page 17
BM70/71
2.2
External Configuration and
Programming
Configuration and programming modes can be
configured using the P2_0 pin. Refer to 3.4, System
Configuration for details.
The BM70/71 module can be configured and
programmed using an external configuration and
programming tool. Figure 2-9 illustrates the minimum
signals required for configuring and programming the
module using host PCB.
FIGURE 2-9:
DS60001372J-Page 18
EXTERNAL CONFIGURATION AND PROGRAMMING
2015-2019 Microchip Technology Inc.
BM70/71
2.3
2.3.1
Host MCU Interface
HOST MCU INTERFACE OVER
UART
Figure 2-10 and Figure 2-11 illustrate the interfacing
between the BM70/71 and host MCU using UART.
UART uses Host Control Interface (HCI) to share the
FIGURE 2-10:
communication among the Host MCU and BM70/71
module. The interface also illustrates the power
scheme using a 3.3V Low Drop Out (LDO) regulator
that supplies 3.3V to the BM70/71 (BAT_IN) and MCU
VDD. This power scheme ensures that the BM70/71
module and MCU I/O voltages are compatible.
BM70 MODULE TO MCU INTERFACE
Note 1: Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
2: Control and indication ports are configurable.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 19
BM70/71
FIGURE 2-11:
BM71 MODULE TO MCU INTERFACE
Note 1: Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
2: Control and indication ports are configurable.
3: 10 μF (X5R) and 330 Ohm resistor are required for the BM71 module.
4: BK_IN connect to VBAT for BM71BLE01FC2.
DS60001372J-Page 20
2015-2019 Microchip Technology Inc.
BM70/71
2.3.2
UART READY AFTER EXTERNAL
RESET
In MCU applications, the time between Reset and the
BM70/71 module UART port ready for Test mode and
Application mode, after an external Reset (RST_N)
FIGURE 2-12:
must be notified. Figure 2-12 illustrates the timing
diagram of the BM70/71 module UART port ready for
Test mode and Application mode after Reset.
TIMING DIAGRAM OF BM70/71 MODULE UART READY FOR TEST MODE AFTER
RESET
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DS60001372J-Page 21
BM70/71
2.3.3
UART READY AFTER POWER-ON
RESET
Figure 2-13 illustrates the timing diagram of the BM70
module UART port ready for Test mode and Application mode after Power-on Reset (POR).
cated by the status pins, or by a status report UART
command. This status pin or status report UART
command is sent to inform the MCU that the BM70/71
module is ready for communication.
In Application mode, when the BM70/71 module is
ready to communicate with the host MCU after reset,
the BM70/71 module may have internal status indi-
FIGURE 2-13:
DS60001372J-Page 22
TIMING DIAGRAM OF BM70 MODULE UART READY FOR TEST MODE AFTER
POWER-ON
2015-2019 Microchip Technology Inc.
BM70/71
2.4
Typical Hosted Configuration
Figure 2-14 illustrates the typical hosted configuration
for the BM71 module. It also illustrates an application
using a coin cell battery at VBAT input. For the BM71
FIGURE 2-14:
module, a 10 μF capacitor (X5R/X7R) is applied to the
BAT_IN pin. Only on the BM71 module, the BK_IN pin
of the module must be connected to the BAT_IN pin.
BM71 MODULE TYPICAL HOSTED CONFIGURATION
Note 1: Hardware functions can include ADC and PWM. Refer to “BM70/71 Bluetooth® Low Energy Module
User’s Guide” (DS50002542) for a full description of all possible configurable behavior and hardware.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 23
BM70/71
2.5
Power-Drop Protection
To prevent the BM70/71 module from disruptions,
when the voltage drops to less than 1.9V, an “Open
Drain” Reset chip with a delay time of ≤ 10 ms that triggers Reset at 1.8V output voltage is recommended.
Figure 2-15 illustrates the Reset circuit block diagram.
FIGURE 2-15:
DS60001372J-Page 24
RESET CIRCUIT BLOCK DIAGRAM
2015-2019 Microchip Technology Inc.
BM70/71
urable; refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542) for the full
description.
MODULE CONFIGURATION
The BM70/71 module features and services can be
configured to fit a wide range of application requirements. Refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542) for details of all
device behavior along with information on how to
configure the IS8170/71 IC on the BM70/71 module.
Refer to 3.1“UART Interface” through 3.4“System
Configuration” that describe default behavior of the
BM70/71 module, which can be easily changed.
The BM70/71 module I/O pins are configurable as either
control or indication signal. The control signals are
input to the BM70/71 module and the indication signals
are output from the BM70/71 module. Table 3-1 and
Table 3-2 provide default pin functions of the default
firmware logic in the IS1870/71 IC on the BM70/71
module. For different BM70/71 module application
requirements, the I/O pin assignment is configurable
and can fit a wide range of application requirements.
For additional information related to I/O pin assignment, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542).
UART Interface
The BM70/71 module UART pins, TXD and RXD, are
connected to the UART pins of the host MCU. By
default, the UART characteristics are set to a baud rate
of 115200, with 8-bit data, 1 stop bit, no parity, and no
hardware flow control. These characteristics are config-
If hardware function is enabled,
LED0 is fixed to this pin
If hardware function is enabled,
TX_IND is fixed to this pin
If hardware function is enabled,
UART_CTS is fixed to this pin
If hardware function is enabled,
UART_RTS is fixed to this pin
PAIRING_KEY(1)
UART_RX_IND(1)
LINK_DROP(1)
RSSI_IND(1)
CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 MODULE
LOW_BATTERY_IND(1)
N/C(1)
PINS
TABLE 3-1:
Control and Indication I/O Pins
STATUS1_IND(1)
3.1
3.2
RF_ACTIVE_IND(1)
3.0
P1_0
P3_1
Default
P3_2
Default
P3_3
Default
P3_4
Default
P0_7
Default
P1_1
Default
P2_2
Default
P2_4
Default
P3_5
Default
P3_6
P0_0
P2_7
P0_2
Default
Default
Default
Default
Note 1: These signals are part of the remappable hardware functionality and can be input/output on different GPIO
pins of the module. Refer to the “BM70/71 Bluetooth® Low Energy Module User’s Guide” (DS50002542) for
details.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 25
BM70/71
P1_6
Default
P1_7
Default
P1_2
Default
P1_3
Default
P3_6
Default
P0_0
Default
P2_7
Default
P0_2
3.3
Default
Reset (RST_N)
The Reset input pin (RST_N) is used to reset the
BM70/71 module with an active-low pulse with a minimum pulse width of 63 ns.
TABLE 3-3:
3.4
System Configuration
Table 3-3 provides the system configuration settings of
the P2_0 pin that places the BM70/71 module into various operational modes. The P2_0 pin has an internal
pull up.
SYSTEM CONFIGURATION SETTINGS
P2_0
Note:
If hardware function is enabled,
LED0 is fixed to this pin
If hardware function is enabled,
TX_IND is fixed to this pin
If hardware function is enabled,
UART_CTS is fixed to this pin
If hardware function is enabled,
UART_RTS is fixed to this pin
STATUS2_IND
STATUS1_IND
RF_ACTIVE_IND
PAIRING_KEY
UART_RX_IND
LINK_DROP
CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM71 MODULE
RSSI_IND
LOW_BATTERY_IND
PINS
TABLE 3-2:
Operational Mode
High
Application mode
Low
Test mode (calibration of the IS1870/71 IC), Configuration mode (programming of configuration
parameters for default firmware), Firmware Update mode (programming of internal flash memory of IS1870/71 IC).
For more details and information on the use of these different modes, refer to the “BM70/71 Bluetooth® Low
Energy Module User’s Guide” (DS50002542).
DS60001372J-Page 26
2015-2019 Microchip Technology Inc.
BM70/71
4.0
ANTENNA
4.1
Antenna Characteristics
4.1.1
BM70BLES1FC2 CERAMIC CHIP
ANTENNA
The BM70BLES1FC2 module contains an inbuilt
ceramic chip antenna. Figure 4-1 illustrates the
antenna radiation pattern of the ceramic chip antenna
on the BM70BLES1FC2 module.
FIGURE 4-1:
BM70BLES1FC2 ANTENNA RADIATION PATTERN
Table 4-1 provides the antenna radiation pattern details
of the BM70BLES1FC2 module.
TABLE 4-1:
Parameter
BM70BLES1FC2 ANTENNA
RADIATION PATTERN
DETAILS
Values
Frequency
2450 MHz
Peak Gain
1.63 dBi
Efficiency
71.55%
2015-2019 Microchip Technology Inc.
DS60001372J-Page 27
BM70/71
4.1.2
BM71BLES1FC2 CERAMIC CHIP
ANTENNA
The BM71BLES1FC2 module contains an inbuilt
ceramic chip antenna. Figure 4-2 illustrates the
antenna radiation pattern of the ceramic chip antenna
on the BM71BLES1FC2 module.
FIGURE 4-2:
BM71BLES1FC2 ANTENNA RADIATION PATTERN
Table 4-2 provides the antenna radiation pattern details
of the BM71BLES1FC2 module.
TABLE 4-2:
BM71BLES1FC2 ANTENNA
RADIATION PATTERN
DETAILS
Parameter
Values
Frequency
2442 MHz
Peak Gain
0.1 dBi
Efficiency
42.7%
DS60001372J-Page 28
2015-2019 Microchip Technology Inc.
BM70/71
4.2
Antenna Placement
For a Bluetooth wireless product, the antenna
placement affects the whole system performance. The
antenna requires free space to radiate the RF signals
and it cannot be surrounded by the ground plane.
FIGURE 4-3:
Figure 4-3 illustrates a typical example of good and
poor antenna placement of the BM70BLES1FC2
module on the main application board with the ground
plane.
BM70BLES1FC2 ANTENNA PLACEMENT EXAMPLES
2015-2019 Microchip Technology Inc.
DS60001372J-Page 29
BM70/71
Figure 4-4 illustrates a typical example of good and
poor antenna placement of the BM71BLES1FC2 module on the main application board with the ground
plane.
FIGURE 4-4:
DS60001372J-Page 30
BM71BLES1FC2 ANTENNA PLACEMENT EXAMPLES
2015-2019 Microchip Technology Inc.
BM70/71
4.3
Antenna Considerations
Table 4-3 provides the part number and manufacturer
details of the antenna used on the BM70BLES1FC2
module.
TABLE 4-3:
BM70BLES1FC2 ANTENNA DETAILS
Description
Part Number
Manufacturer
ANT ANT3216A063R2400A PIFA 2.4 GHZ L3.2W1.6
ANT3216A063R2400A
YAGEO
Description
Part Number
Manufacturer
ANT ANT3216LL00R2400A 2.4 GHZ L3.2W1.6
ANT3216LL00R2400A
YAGEO
Table 4-4 provides the part number and manufacturer
details of the antenna used on the BM71BLES1FC2
module.
TABLE 4-4:
BM71BLES1FC2 ANTENNA DETAILS
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DS60001372J-Page 31
BM70/71
4.4
4.4.1
Host PCB Mounting Suggestion
BM70BLES1FC2 HOST PCB
MOUNTING
Figure 4-5 illustrates the host PCB mounting suggestions for the BM70BLES1FC2 module, showing the
minimum ground plane area to the left and right of the
module for best antenna performance.
FIGURE 4-5:
DS60001372J-Page 32
The area under the antenna must not contain any top,
inner or bottom copper layer, while designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recommended as required for the host PCB EMC noise
reduction. For best range performance, keep all
external metal away from the ceramic chip antenna by
a minimum of 30 mm.
BM70BLES1FC2 HOST PCB MOUNTING SUGGESTION
2015-2019 Microchip Technology Inc.
BM70/71
4.4.2
BM70BLE01FC2 HOST PCB
MOUNTING
Figure 4-6 illustrates the mounting suggestions for the
BM70BLE01FC2 module and also shows a connection
to UFL connector. A low-impedance ground plane will
ensure the best radio performance (best range, low
noise).
50 Ohm micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it must
be a 50 Ohm controlled impedance.
The pin 30 (BT_RF) is connected to an external
antenna connector, a PCB trace antenna, or a component (ceramic chip) antenna through a host PCB
FIGURE 4-6:
BM70BLE01FC2 HOST PCB MOUNTING SUGGESTIONS
2015-2019 Microchip Technology Inc.
DS60001372J-Page 33
BM70/71
4.4.3
BM71BLES1FC2 HOST PCB
MOUNTING
Figure 4-7 illustrates the mounting suggestions for the
BM71BLES1FC2 module. It also shows the area
around the antenna, required for the best antenna performance.
FIGURE 4-7:
DS60001372J-Page 34
The area under the antenna must not contain any top,
inner, or bottom copper layer while designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recommended as required for the host PCB EMC noise
reduction. For best range performance, keep all external metal away from the ceramic chip antenna by a
minimum of 30 mm.
BM71BLES1FC2 HOST MOUNTING SUGGESTION
2015-2019 Microchip Technology Inc.
BM70/71
4.4.4
BM71BLE01FC2 HOST PCB
MOUNTING
Figure 4-8 illustrates the mounting suggestions for the
BM71BLE01FC2 module. It also shows a connection to
the UFL connector. A low-impedance ground plane
ensures the best radio performance (best range, low
noise).
FIGURE 4-8:
The pin 1 (BT_RF) is connected to an external antenna
connector, a PCB trace antenna, or a component
(ceramic chip) antenna through a host PCB 50 Ohm
micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it must
be a 50 Ohm controlled impedance.
BM71BLE01FC2 HOST PCB MOUNTING SUGGESTION
2015-2019 Microchip Technology Inc.
DS60001372J-Page 35
BM70/71
NOTES:
DS60001372J-Page 36
2015-2019 Microchip Technology Inc.
BM70/71
5.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the BM70/71 module electrical characteristics. Additional information will be
provided in future revisions of this document as it becomes available.
Absolute Maximum Ratings
Ambient temperature under bias for modules parts ending with 0002...................................................... -20°C to +70°C
Ambient temperature under bias for modules parts ending with 0B0x..................................................... .-40°C to +85°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Voltage of any digital pin ............................................................................................................-0.3V to VDD + 0.3 ≤ 3.9
Maximum output current sink by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin....................................................................................................12 mA
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 37
BM70/71
Table 5-1 provides the recommended operating conditions of the BM70/71 module.
TABLE 5-1:
RECOMMENDED OPERATING CONDITIONS
Symbol
Min.
Typ.
Max.
PMU
VDD (VBAT, BK_IN, AVDD)
1.9V
3.0V
3.6V
RST_N
1.9V
3.0V
3.6V
Other I/O
1.9V
—
3.6V
0.7 VDD
—
VDD
VSS
—
0.3 VDD
0.8 VDD
—
VDD
GPIO
VIH (Input High Voltage)
VIL (Input Low Voltage)
VOH (Output High Voltage) (High drive, 12 mA)
VOL (Output Low Voltage) (High drive, 12 mA)
Pull up resistance
Pull down resistance
VSS
—
0.2 VDD
34 kOhm
48 kOhm
74 kOhm
29 kOhm
47 kOhm
86 kOhm
Supply Current (see Note 1)
Peak Tx mode current at VDD=3V,
Tx=0 dBm, Buck mode
—
10 mA at +25°C
13 mA at
+70°C/+85°C
Peak Rx mode current at VDD=3V,
Buck mode
—
10 mA at +25°C
13 mA at
+70°C/+85°C
“Reduced current consumption” low power mode
current (see Note 2)
—
60 μA at +25°C
“Shutdown” low power mode current (see Note 2)
1.0 μA
—
2.9 μA
Note 1: The current measurements are characterized across a sample of BM70/71 modules at room temperature
(+25°C), unless otherwise noted.
2: For more details on “Reduced current consumption” or “Shutdown” low power modes, refer to the “BM70/71
Bluetooth® Low Energy Module User’s Guide” (DS50002542).
Note:
For more details on “Analog to Digital Converter (ADC) and Precision Temperature Sensor (PTS)
specifications, refer to “IS1870/71 Bluetooth® Low Energy SoC data sheet” (DS60001371).
DS60001372J-Page 38
2015-2019 Microchip Technology Inc.
BM70/71
Table 5-2 provides the RF specifications of the
BM70/71 module.
TABLE 5-2:
RF SPECIFICATIONS
Parameter
Min.
Typ.
Max.
2402 MHz
—
2480 MHz
—
0 dBm
—
-25 dBm
—
3 dBm
Transmitter
Frequency
Output Power
RF Power Control Range
In-band Spurious (N±2)
—
-38.5 dBm
—
In-band Spurious (N±3)
—
-43.25 dBm
—
Modulation Characteristic - Frequency
Deviation (see Note 1)
—
247 kHz
—
Receiver
Frequency
2402 MHz
—
2480 MHz
Sensitivity Level (interference active)
—
-90 dBm
—
Interference
Performance
Co-channel
—
17 dB
—
Adjacent
± 1 MHz
—
0 dB
—
Adjacent
± 2 MHz
—
-25 dB
—
Adjacent >=
± 3 MHz
—
-32 dB
—
—
-37.5 dBm
—
Inter-modulation Characteristic (n=3,4,5)
Maximum Usable Level
0 dBm
Note 1: Tested by transmitting known ‘00001111’b patterns.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 39
BM70/71
5.1
5.1.1
Current Consumption Details
Tx/Rx CURRENT CONSUMPTION
DETAILS
Figure 5-1 illustrates the Tx/Rx peak current
consumption of 12 mA during an advertising event.
However, the average current consumption is only
around 230 μA while advertising at an interval of
approximately 100 ms, see Figure 5-2. This is due to
the “Reduced Current Consumption” Low Power mode
being
enabled
(configuration
parameter
UART_RX_IND). Reducing the current draw to
approximately 60 μA, while not actively transmitting the
FIGURE 5-1:
DS60001372J-Page 40
advertisings packets, refer to the “BM70/71 Bluetooth®
Low Energy Module User’s Guide” (DS50002542) for
more details.
The overall average current consumption is measured
with a 3.3V VBAT input, and is affected by the way the
IS1870/71 IC on the BM70/71 module has been configured to operate. A low average current value can be
achieved by choosing the minimum settings for the
advertising interval and connection interval, which
meet the data throughput requirements of the intended
application. The lower or less frequent the interval time
periods, the lower the overall average current to be
drawn.
TX/RX PEAK CURRENT CONSUMPTION OF AN ADVERTISING EVENT
2015-2019 Microchip Technology Inc.
BM70/71
Figure 5-2 illustrates the oscilloscope screen, captured
when the auto operation and Low Power mode is active
on the BM70/71 module. Refer to the “BM70/71 Bluetooth® Low Energy Module User’s Guide”
(DS50002542) for more details on the auto operation.
FIGURE 5-2:
TX/RX AVERAGE CURRENT CONSUMPTION WHILE BM70/71 MODULE IS
ADVERTISING
For additional information on the current consumption
measurements, test conditions and test environment
setup, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542).This user guide
provides detailed information about the behavior of the
default internal logic of the IS1870/71 IC on the
BM70/71 module.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 41
BM70/71
Table 5-3 provides the average current consumption
measurements for the BM70/71 module in Application
mode.
TABLE 5-3:
BM70/71 APPLICATION MODE CURRENT CONSUMPTION MEASUREMENTS
Test Mode
Advertising (see Note 1,2,3)
Connected (see Note 1,2,4)
Interval [ms]
Average Current Consumption
20
1.061 mA
50
505 μA
100
298 μA
500
113 μA
1000
89 μA
18.75
2.23 mA
50
2.13 mA
100
2.10 mA
500
83 μA
1000
80 μA
Note 1: These measurements are done at an operating temperature of +25°C at 3.3V and are characterized across
a sample of BM70/71 modules.
2: These measurements are taken with version 1.06 firmware, loaded into the module with “Reduced Current
Consumption” Low Power mode enabled. For more details on Low Power modes and current consumption
configuration, refer to “BM70/71 Bluetooth® Low Energy Module User's Guide” (DS50002542).
3: The advertising packet data payload is approximately 15 bytes in length.
4: The amount of data being transmitted between two peer devices can affect the average current measured.
The average current measurements are done with only the necessary Bluetooth packets being exchanged
to keep the connection active at the stated interval.
DS60001372J-Page 42
2015-2019 Microchip Technology Inc.
BM70/71
6.0
PHYSICAL DIMENSIONS
6.1
BM70BLES1FC2
Figure 6-1 illustrates the physical dimensions of the
BM70BLES1FC2 module.
FIGURE 6-1:
BM70BLES1FC2 MODULE DIMENSIONS
2015-2019 Microchip Technology Inc.
DS60001372J-Page 43
BM70/71
Figure 6-2 illustrates the recommended PCB footprint.
Ensure that no top copper layer is near the test pin
area.
FIGURE 6-2:
DS60001372J-Page 44
BM70BLES1FC2 RECOMMENDED PCB FOOTPRINT
2015-2019 Microchip Technology Inc.
BM70/71
6.2
BM70BLE01FC2
Figure 6-3 illustrates the physical dimensions of the BM70BLE01FC2 module.
FIGURE 6-3:
BM70BLE01FC2 MODULE DIMENSIONS
2015-2019 Microchip Technology Inc.
DS60001372J-Page 45
BM70/71
Figure 6-4 illustrates the recommended PCB footprint.
FIGURE 6-4:
DS60001372J-Page 46
BM70BLE01FC2 RECOMMENDED PCB FOOT PRINT
2015-2019 Microchip Technology Inc.
2015-2019 Microchip Technology Inc.
6.3
BM71BLES1FC2
Figure 6-5 illustrates the physical dimensions of the BM71BLES1FC2 module.
FIGURE 6-5:
BM71BLES1FC2 MODULE DIMENSIONS
BM70/71
DS60001372J-Page 47
BM70/71
Figure 6-6 illustrates the recommended PCB footprint. Ensure that no top copper layer is near the test pin area.
FIGURE 6-6:
DS60001372J-Page 48
BM71BLES1FC2 RECOMMENDED PCB FOOTPRINT
2015-2019 Microchip Technology Inc.
2015-2019 Microchip Technology Inc.
6.4
BM71BLE01FC2
Figure 6-7 illustrates the physical dimensions of the BM71BLE01FC2 module.
FIGURE 6-7:
BM71BLE01FC2 MODULE DIMENSIONS
BM70/71
DS60001372J-Page 49
BM70/71
Figure 6-8 illustrates the recommended PCB footprint.
FIGURE 6-8:
DS60001372J-Page 50
BM71BLE01FC2 RECOMMENDED PCB FOOTPRINT
2015-2019 Microchip Technology Inc.
BM70/71
7.0
SOLDERING
RECOMMENDATIONS
The BM70/71 module is assembled using a standard
lead-free, reflow profile, IPC/JEDEC J-STD-020. The
BM70/71 module can be soldered to the host PCB by
using the standard lead or lead-free solder reflow
profiles.
To avoid any damage to the BM70/71 module, follow
these recommendations:
• Refer to the “AN233 Solder Reflow Recommendation” (DS00233) document for the soldering
reflow recommendations
• Do not exceed the peak temperature (TP) of
+260˚C
• Use no-clean flux solder paste
• Do not wash the BM70/71 module, as moisture
can be trapped under the shield
• Use only one flow. If the PCB requires multiple
flows, apply the BM70/71 module on the final flow
Figure 7-1 illustrates the reflow profile of the BM70/71
module.
FIGURE 7-1:
REFLOW PROFILE
2015-2019 Microchip Technology Inc.
DS60001372J-Page 51
BM70/71
NOTES:
DS60001372J-Page 52
2015-2019 Microchip Technology Inc.
2015-2019 Microchip Technology Inc.
8.0
ORDERING GUIDE
Table 8-1 provides the ordering information for the BM70/71 module.
TABLE 8-1:
BM70/71 MODULE ORDERING INFORMATION
Firmware
Version
Antenna
Shield
Pin #
Regulatory
Certification
Regulatory Model
No. (see Note 3)
Bluetooth BLE
module,
(12x15x1.6 mm)
-20°C to +70°C
V1.03
External
No
30
No
N/A
BM70BLE01FC2-00
02AA
BM70
Bluetooth BLE
module,
(12x15x2.4 mm)
-20°C to +70°C
V1.03
On board
Yes
33
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM70BLES1FC2-00
02AA
BM71
Bluetooth BLE
module,
(6x8x1.6 mm)
-20°C to +70°C
V1.06
External
No
17
No
N/A
BM71BLE01FC2-00
02AA
BM71
Bluetooth BLE
module,
(9x11.5x2.1 mm)
-20°C to +70°C
V1.06
On board
Yes
16
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2
BM71BLES1FC2-00
02AA
BM70
Bluetooth BLE
module,
(12x15x1.6 mm)
-40°C to +85°C
V1.06
External
No
30
No
N/A
BM70BLE01FC2-0B
03AA
BM70
Bluetooth BLE
module,
(12x15x2.4 mm)
-40°C to +85°C
V1.06
On board
Yes
33
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM70BLES1FC2-0B
03AA
BM71
Bluetooth BLE
module,
(6x8x1.6 mm)
-40°C to +85°C
V1.06
External
No
17
No
N/A
BM71BLE01FC2-0B
02AA
BM71
Bluetooth BLE
module,
(9x11.5x2.1 mm)
-40°C to +85°C
V1.06
On board
Yes
16
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2
BM71BLES1FC2-0B
02AA
BM70
Bluetooth BLE
module,
(12x15x2.4 mm)
-40°C to +85°C
V1.11
On board
Yes
33
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM70BLES1FC2-0B
04AA
BM71
Bluetooth BLE
module,
(9x11.5x2.1 mm)
-40°C to +85°C
V1.11
On board
Yes
16
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2
BM71BLES1FC2-0B
04AA
Description
BM70
Orderable Part
Number
(see Note 1 and 2)
Note 1: With the introduction of the IS187xSF-202 IC, the PC tools provided by Microchip which change/control Bluetooth operation have been revised.
The correct tool version must be paired with the applicable module/IC part number.
All module parts ending with BM7xBLEX1FC2-0BxxAA must use the PC tools ending with 0BxxAA.
All module parts ending with BM7xBLEX1FC2-0002AA must use the PC tools ending with 0002AA.
2: The numbers listed under “Orderable Part Number” must be used when purchasing a specific module from Microchip.
3: “Regulatory Model No.” column represents the Model No. listed in Microchip's regulatory notices. The extensions used to order/buy a specific version of the
module are listed in the “Orderable Part Number”.
BM70/71
DS60001372J-Page 53
Operating
Temperature
Range
Module
BM70/71
NOTES:
DS60001372J-Page 54
2015-2019 Microchip Technology Inc.
BM70/71
APPENDIX A:
CERTIFICATION
NOTICES
The BM70 module (BM70BLES1FC2) has received the
regulatory approval for the following countries:
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM70ABCDEFGH
• Canada/ISED
- IC: 12246A-BM70BLES1F2
- HVIN: BM70BLES1F2
• Europe/CE
• Japan/MIC: 202-SMD069
• Korea/KCC: MSIP-CRM-mcp-BM70BLES1FC2
• Taiwan/NCC No: CCAN15LP0500T1
• China/SRRC: CMIIT ID: 2015DJ7135
The BM71 module (BM71BLES1FC2) has received the
regulatory approval for the following countries:
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM71S2
• Canada/ISED
- IC: 12246A-BM71S2
- HVIN: BM71BLES1FC2
• Europe/CE
• Japan/MIC: 005-101150
• Korea/KCC: MSIP-CRM-mcp-BM71BLES1FC2
• Taiwan/NCC No: CCAN16LP0010T5
• China/SRRC: CMIIT ID: 2016DJ2787
A.1
United States
The BM70/71 Module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators”
single-modular approval in accordance with Part
15.212 Modular Transmitter approval. Single-modular
transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated
into another device, that must demonstrate compliance
with FCC rules and policies independent of any host. A
transmitter with a modular grant can be installed in different end-use products (referred to as a host, host
product, or host device) by the grantee or other equipment manufacturer, then the host product may not
require additional testing or equipment authorization
for the transmitter function provided by that specific
module or limited module device.
The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
tions for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification, or
Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain
digital logic functions).
A.1.1
LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 module has been labeled with its own FCC
ID number, and if the FCC ID is not visible when the
module is installed inside another device, then the outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label should use the following wording:
For the BM70 module:
Contains Transmitter Module
FCC ID: A8TBM70ABCDEFGH
or
Contains FCC ID: A8TBM70ABCDEFGH
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation
Due to the limited size of the BM71, the FCC Identifier
(FCC ID) is displayed in the datasheet only and it cannot be displayed on the module. Therefore, the FCC ID
must be placed on the outside of the finished product
into which the module is installed must also display a
label referring to the enclosed module.
This exterior label can use wording as follows:
For the BM71 module:
Contains Transmitter Module FCC ID: A8TBM71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation
The host product itself is required to comply with all
other applicable FCC equipment authorizations, regulations, requirements and equipment functions that are
not associated with the transmitter module portion. For
example, compliance must be demonstrated: to regula-
2015-2019 Microchip Technology Inc.
DS60001372I-Page 55
BM70/71
The user's manual for the product must include the following statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment
and receiver
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is connected
• Consult the dealer or an experienced radio/TV
technician for help
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748, which is available at the FCC
Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB)
https://apps.fcc.gov/oetcf/kdb/index.cfm.
A.1.2
RF EXPOSURE
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
https://apps.fcc.gov/oetcf/kdb/index.cfm.
A.2
Canada
The BM70/71 module has been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio
Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-247 and RSS-Gen.
Modular approval permits the installation of a module in
a host device without the need to recertify the device.
A.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the Host product (from
RSP-100-Issue 11, Section 3): The host product shall
be properly labeled to identify the module within the
host device.
On the BM71, due to the limited module size, the IC
identifier is displayed in the data sheet only and it cannot be displayed on the module label.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host device;
otherwise, the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word “Contains”, or similar wording expressing
the same meaning, as follows:
For the BM70 module:
Contains IC: 12246A-BM70BLES1F2
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
For the BM71 module:
Contains IC: 12246A-BM71S2
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 4, November
2014): User manuals for license-exempt radio appara-
From the FCC Grant: Output power listed is conducted.
This grant is valid only when the module is sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certification and must not be co-located or operating in
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multi-transmitter product procedures. This module is
approved for installation into mobile or/and portable
host platforms
A.1.3
HELPFUL WEB SITES
Federal
Communications
http://www.fcc.gov
DS60001372I-Page 56
Commission
(FCC):
2015-2019 Microchip Technology Inc.
BM70/71
tus shall contain the following or equivalent notice in a
conspicuous location in the user manual or alternatively on the device or both:
except in accordance with Innovation, Science and
Economic Development Canada multi-transmitter
guidelines.
This device complies with Industry Canada’s
license-exempt RSS standard(s). Operation is
subject to the following two conditions:
The installation of the transmitter must ensure compliance is demonstrated according to the ISED SAR procedures.
(1) This device may not cause interference, and
A.2.3
(2) This device must accept any interference,
including interference that may cause undesired
operation of the device.
Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/
Le présent appareil est conforme aux CNR
d'Industrie Canada applicables aux appareils
radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes:
A.3
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Guidelines on Transmitter Antenna for License Exempt
Radio Apparatus:
Under Industry Canada regulations, this radio
transmitter may only operate using an antenna of
a type and maximum (or lesser) gain approved for
the transmitter by Industry Canada. To reduce
potential radio interference to other users, the
antenna type and its gain must be so chosen that
the equivalent isotropically radiated power
(e.i.r.p.) is not more than that necessary for successful communication.
Conformément à la réglementation d'Industrie
Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par
Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention
des autres utilisateurs, il faut choisir le type
d'antenne et son gain de sorte que la puissance
isotrope rayonnée équivalente (p.i.r.e.) ne
dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
A.2.2
RF EXPOSURE
All transmitters regulated by the Innovation, Science
and Economic Development Canada (ISED) must
comply with RF exposure requirements listed in
RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
HELPFUL WEB SITES
Europe
The BM70/71 module is an Radio Equipment Directive
(RED) assessed radio module that is CE marked and
has been manufactured and tested with the intention of
being integrated into a final product.
The BM70/71 module has been tested to RED
2004/53/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility
(EMC) (Article 3.1(b)), and Radio (Article 3.2), which
are summarized in the following European Compliance
Testing tables.
The ETSI provides guidance on modular devices in the
“Guide to the application of harmonised standards covering Article 3.1(b) and Article 3.2 of the Directive
2014/53/EU RED to multi-radio and combined radio
and non-radio equipment” document available at
http://www.etsi.org/deliver/etsi_eg/203300_203399/20
3367/01.01.01_60/eg_203367v010101p.pdf.
Note:
A.3.1
To maintain conformance to the testing
listed in Table A-1/Table A-2, the module
shall be installed in accordance with the
installation instructions in this data sheet
and shall not be modified.
When integrating a radio module into a
completed
product,
the
integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements
against the RED.
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow CE marking requirements.
This transmitter is restricted for use with a specific
antenna tested in this application for certification, and
must not be co-located or operating in conjunction with
any other antenna or transmitters within a host device,
2015-2019 Microchip Technology Inc.
DS60001372I-Page 57
BM70/71
TABLE A-1:
EUROPEAN COMPLIANCE TESTING (BM70 MODULE)
Certification
Standards
Article
Safety
EN60950-1:2006/A11:2009/A
1:2010/A12:2011/A2:2013
[3.1(a)]
Health
EN300328 V1.9.1/
EN62479:2010
EMC
EN301489-1 V1.9.2
[3.1(b)]
EN301489-17 V2.2.1
Laboratory
TUV
Rheinland
Taiwan
EN301489-1 V2.1.1
EN301489-17 V2.2.0
Report Number
Date
10051261 003
2016-01-05
10053580 001
2015-12-10
10051137 002
2016-01-08
10051137 003
2017-05-26
EN301489-17 V3.1.1
EN301489-17 V3.2.0
Radio
EN300328 V1.9.1
(3.2)
EN300328 V2.1.1
10053580 001
2015-12-10
50067510 001(1)
2017-10-04
50067510 002
2017-05-26
Note 1: RF reports apply only to modules using the part IS1870SF-202.
TABLE A-2:
EUROPEAN COMPLIANCE TESTING (BM71 MODULE)
Certification
Standards
Article
Safety
EN60950-1:2006/A11:2009/A
1:2010/A12:2011/A2:2013
[3.1(a)]
Health
EN62479:2010
EMC
EN301489-1 V1.9.2
[3.1(b)]
EN301489-17 V2.2.1
Laboratory
TUV
Rheinland
Taiwan
EN301489-1 V2.1.1
EN301489-1 V2.2.0
Report Number
Date
10053210 001
2016-01-07
10053433 001
2015-12-29
10052964 001
2015-10-22
10052964 002
2017-05-26
EN301489-17 V3.1.1
EN301489-17 V3.2.0
Radio
EN300328 V1.9.1
(3.2)
EN300328 V2.1.1
10053433 001
2015-12-29
50067509 001(1)
2017-04-10
50067509 002
2017-05-26
Note 1: RF reports apply only to modules using the part IS1871SF-202.
A.3.2
CONFORMITY ASSESSMENT
From ETSI Guidance Note EG 203367, section 6.1
Non-radio products are combined with a radio product:
If the manufacturer of the combined equipment installs
the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the
one used for the assessment of the radio product) and
according to the installation instructions for the radio
product, then no additional assessment of the combined equipment against article 3.2 of the RED is
required.
The European Compliance Testing listed in Table A-1
and Table A-2 are performed using the integral ceramic
chip antenna.
DS60001372I-Page 58
A.3.2.1
SIMPLIFIED EU DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type BM70/71 is in compliance with
Directive 2014/53/EU.
The full text of the EU declaration of conformity, for this
http://www.microproduct,
is
available
at:
chip.com/design-centers/wireless-connectivity
A.3.3
HELPFUL WEB SITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
2015-2019 Microchip Technology Inc.
BM70/71
can be downloaded from the European Radio Communications Committee (ECC) at: http://www.ecodocdb.dk/.
on the module label. The final product in which this
module is being used must have a label referring to the
type certified module inside:
Additional helpful web sites are:
• Radio Equipment Directive (2014/53/EU):
https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en
• European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Institute (ETSI): http://www.etsi.org
• The Radio Equipment Directive Compliance
Association (REDCA): http://www.redca.eu/
A.4
For the BM71 module, due to the limited module size,
the technical conformity logo and ID are displayed in
the data sheet only and cannot be displayed on the
module label. The final product in which this module is
being used must have a label referring to the type certified module inside:
Japan
The BM70/71 module has received type certification
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
A.4.2
HELPFUL WEB SITES
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
• If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their conformance laboratory to determine if this testing is
required
• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered
by VCCI: http://www.vcci.jp/vcci_e/index.html
A.5
A.4.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow Japan marking requirements. The integrator of the module should refer to the
labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website.
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
Korea
The BM70/71 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
A.5.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow KC marking requirements. The integrator of the module should refer to the
labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The BM70 module is labeled with its own KC mark. The
final product requires the KC mark and certificate number of the module:
For the BM70 module, due to a limited module size, the
technical conformity logo and ID is displayed in the
data sheet and/or packaging and cannot be displayed
2015-2019 Microchip Technology Inc.
DS60001372I-Page 59
BM70/71
On the BM71 module, due to the limited module size
(9.0 mm x 11.5 mm) the KC mark and identifier is displayed in the data sheet only and cannot be displayed
on the module label. The final product requires the KC
mark and certificate number of the module:
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
A.5.2
HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
National Radio Research Agency (RRA):
http://rra.go.kr
A.6
Taiwan
The BM70/71 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product should contact Microchip
Technology sales or distribution partners to obtain a
Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
A.6.1
LABELING AND USER
INFORMATION REQUIREMENTS
For the BM70 module, due to the limited module size,
the NCC mark and ID are displayed in the data sheet
only and cannot be displayed on the module label:
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
A.6.2
HELPFUL WEB SITES
National Communications
http://www.ncc.gov.tw
A.7
Commission
(NCC):
China
The BM70/71 module has received certification of conformity in accordance with the China MIIT Notice
2014-01 of State Radio Regulation Committee (SRRC)
certification scheme. Integration of this module into a
final product does not require additional radio certification, provided installation instructions are followed and
no modifications of the module are allowed.
A.7.1
LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 module is labeled with its own CMIIT ID as
follows:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC
approved Radio module CMIIT ID: 2015DJ7135”.
On the BM71 module, due to the limited module size
(9.0 mm x 11.5 mm) the NCC mark and identifier is displayed in the data sheet only and cannot be displayed
on the module label.
The user's manual should contain following warning
(for RF device) in traditional Chinese:
On the BM71 module, due to the limited module size
(9.0 mm x 11.5 mm) the CMIIT ID is displayed in the
data sheet only and cannot be displayed on the module
label:
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC
approved Radio module CMIIT ID: 2016DJ2787”.
注意 !
DS60001372I-Page 60
2015-2019 Microchip Technology Inc.
BM70/71
A.8
Other Regulatory Information
• For information about other countries’ jurisdictions
not covered here, refer to the http://www.microchip.com/design-centers/wireless-connectivity.
• Should other regulatory jurisdiction certification be
required by the customer, or the customer needs
to recertify the module for other reasons, contact
Microchip for the required utilities and documentation.
2015-2019 Microchip Technology Inc.
DS60001372I-Page 61
BM70/71
NOTES:
DS60001372I-Page 62
2015-2019 Microchip Technology Inc.
BM70/71
APPENDIX B:
REVISION HISTORY
Revision A (October 2015)
This is the initial released version of the document.
Revision B (October 2015)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
TABLE B-1:
MAJOR SECTION UPDATES
Section
“Features”
Update Description
This section is updated with certification informations. The data
from this section has been reformatted and distributed in other sections.
“MAC/Baseband/Higher Layer Features”, • These sections are newly added.
“External antenna (BM7xBLE01FC2) connection through RF pad”, “Operating Conditions”,and FIGURE 2: “BM71 MODULE”
“General Description”
This section was previously placed in chapter 1 and has been
moved here.
1.0 “Device Overview”
Table 1-2, Table 1-4, and Table 1-5 are added.
2.0 “Application Information”
This chapter contains information that was previously located in
Appendix A and Electrical Characteristics.
8.0 “Ordering Guide”
Table 8-1 is updated with Y-axis information and certification information.
Appendix A: “Certification Notices”
This section is updated with images for the Certification Marking
and their numbers. The regulatory information is updated to be the
latest.
5.0 “Electrical Characteristics”
Table 5-3 is added
Revision C (November 2015)
Updated Appendix A: “Certification Notices”.
Revision D (March 2016)
This revision includes the following changes as well as
minor updates to text and formatting incorporated
throughout the document.
TABLE D-1:
MAJOR SECTION UPDATES
Section
Update Description
1.1 “Interface Description”
This section is updated with a note.
Updated Figure 1-1, Figure 1-2, Figure 1-6
2.1 “Reference Schematics”
Figure 2-1 through Figure 2-8, Figure 2-10, Figure 5-1, Figure 5-2,
Figure 2-11, Figure 4-1 and Table 4-1, Table 8-1
“Absolute Maximum Ratings”
Updated this section.
5.1.1 “Tx/Rx current consumption details”
Updated this section with new content.
8.0 “Ordering Guide”
This section is updated with a note.
Appendix A: “Certification Notices”
Content has been updated
2015-2019 Microchip Technology Inc.
DS60001372J-Page 63
BM70/71
Revision E (January 2017)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
TABLE E-1:
MAJOR SECTION UPDATES
Section
Update Description
“Features”
Updated this section.
“MAC/Baseband/Higher Layer Features”
Updated this section.
• “External antenna (BM7xBLE01FC2) con- Updated the average current details.
nection through RF pad”
“Operating Conditions”
Updated the operating temperature details.
1.0 “Device Overview”
Updated Figure 1-1, Figure 1-2, Table 1-1 and Table 1-2
Deleted Table 1-4
2.0 “Application Information”
Updated Figure 2-9 through Figure 2-11 and Figure 2-14
3.0 “Module Configuration”
Added Table 3-2 and updated this section.
4.3 “Antenna Considerations”
Added new section.
5.0 “Electrical Characteristics”
Updated ambient temperature details for part numbers ending with
0002 and 0B0x.
Deleted Table 5-2. Updated Table 5-1, Table 5-3. Added Table 5-2
8.0 “Ordering Guide”
Updated Table 8-1
Appendix A: “Certification Notices”
Updated this section.
Revision F (May 2017)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE F-1:
MAJOR SECTION UPDATES
Section
Update Description
1.0 “Device Overview”
Updated Table 1-1, Figure 1-6
6.0 “Physical dimensions”
Updated Figure 6-5 and Figure 6-6
8.0 “Ordering Guide”
Added Regulatory model information in Table 8-1
Appendix A: “Certification Notices”
Added the report number of “Radio” certification and notes in
Table A-1 and Table A-2
Revision G (January 2018)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE G-1:
MAJOR SECTION UPDATES
Section
Update Description
“Features”
Updated Canada certification information.
1.0 “Device Overview”
Updated the NOTE.
2.0 “Application Information”
Updated 2.1“Reference Schematics”, Figure 2-1, Figure 2-3,
Figure 2-5 and Figure 2-7.
8.0 “Ordering Guide”
Updated Table 8-1 with Canada regulatory certification
information and deleted Microchip IC information.
DS60001372J-Page 64
2015-2019 Microchip Technology Inc.
BM70/71
TABLE G-1:
MAJOR SECTION UPDATES
Section
Appendix A: “Certification Notices”
Update Description
Updated the United States, Canada and Europe certification information.
Updated KDB and ECC URL links.
Revision H (July 2018)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE H-1:
MAJOR SECTION UPDATES
Section
Update Description
Document
Updated Bluetooth Specification.
TABLE 8-1: “BM70/71 Module Ordering
Information”
Updated Ordering Guide for New FW Version.
Appendix A: “Certification Notices”
Updated Regulatory Approval Section.
Revision J (January 2019)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE I-1:
MAJOR SECTION UPDATES
Section
Update Description
Antenna
Added Antenna range values.
TABLE 1-1: “BM70/71 PIN Description”
Updated P1_6 pin.
2015-2019 Microchip Technology Inc.
DS60001372J-Page 65
BM70/71
NOTES:
DS60001372J-Page 66
2015-2019 Microchip Technology Inc.
BM70/71
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2015-2019 Microchip Technology Inc.
DS60001372J-page 67
BM70/71
NOTES:
DS60001372J-page 68
2015-2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4097-0
== ISO/TS 16949 ==
2019 Microchip Technology Inc.
DS60001372J-page 69
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
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Tel: 774-760-0087
Fax: 774-760-0088
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
Dallas
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Tel: 972-818-7423
Fax: 972-818-2924
Detroit
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Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
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Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS60001372J-page 70
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2017 Microchip Technology Inc.
08/15/18
