BM78
Bluetooth® Dual Mode Module
Features
• Bluetooth Classic (BR/EDR) and Low Energy (LE)
• Certified to FCC, ISED, MIC, KCC, SRRC and
NCC Radio Regulations
• Radio Equipment Directive (RED) Assessed
Radio Module
• Bluetooth 5.0 Certified
• Transparent UART mode for Seamless Serial
Data over UART Interface
• Easy to Configure with User Interface (UI) Tool, a
Windows®-based Utility or Directly by MCUs
• Firmware can be Upgraded in the Field over
UART (Flash version only)
• Integral Chip Antenna (BM78SPPS5MC2/NC2) or
External Antenna (BM78SPP05MC2/NC2)
• Integrated Crystal, Internal Voltage Regulator and
Matching Circuitry
• Configurable I/O Pins for Control and Status
• Supports Apple® iPod® Accessory Protocol
(iAP2), (only BM78SPPx5MC2)
• Supports Bluetooth Low Energy Secure
Connections
• Supports Bluetooth Low Energy Data Packet
Length Extension
• Small and Compact Surface Mount Module
• Castellated Surface Mount Pads for Easy and
Reliable Host PCB Mounting
• Ideal for Portable Battery-Operated Devices
• One LED Driver with 16-Step Brightness Control
RF/Analog
• Frequency Spectrum: 2.402 GHz to 2.480 GHz
• Receive Sensitivity: -90 dBm (BR/EDR),
-92 dBm (LE)
• Class 2 Output Power (+1.5 dBm typical)
Data Throughput
FIGURE 1:
BM78 MODULE
MAC/Baseband/Higher Layer
• Secure AES128 Encryption
• Bluetooth 3.0: GAP, SPP, SDP, RFCOMM and
L2CAP
• Bluetooth Profiles: GAP, GATT, ATT, SMP and
L2CAP
Operating Conditions
• Operating Voltage Range: 3.3V to 4.2V
• Operating Temperature: -20ºC to +70ºC
Applications
•
•
•
•
•
•
Internet of Things (IoT)
Secure Payment
Home and Security
Health and Fitness
Industrial and Data Logger
LED Lighting (16 configurations)
Data Throughput at 1 Mbps UART Baud Rate:
• BR/EDR: up to 32 Kbytes/s
• LE: up to 7 Kbytes/s
Data Throughput at 115200 bps UART Baud Rate:
• BR/EDR: up to 10 Kbytes/s
• LE: up to 6 Kbytes/s
2016-2022 Microchip Technology Inc.
DS60001380E-Page 1
BM78
General Description
The BM78 module is a fully certified Bluetooth module for
customers to easily add Dual mode Bluetooth wireless
capability to their products. The BM78 module is built
around Microchip’s IS1678 Bluetooth Dual mode SoC,
and it is available in ROM-based (BM78SPPX5NC2) and
Flash-based (BM78SPPX5MC2) versions. Refer to
Section 9.0 “Ordering Information” for additional
information on the BM78 Stock Keeping Units (SKUs).
2016-2022 Microchip Technology Inc.
The BM78 module bridges the customer products to
smart phones or tablets for convenient data transfer, control, access to cloud applications and delivering the local
connectivity for IoT. The BM78 module supports GAP,
SDP, SPP and GATT profiles. Data transfer is achieved
through the Bluetooth link by sending or receiving data
through Transparent UART mode, making it easy to integrate with any microprocessor or microcontroller with the
UART interface. It also enables an easy configuration by
using a UI tool, a Windows-based utility, or directly
through UART by MCUs.
DS60001380E-Page 2
BM78
Table of Contents
1.0 System Overview ...................................................................................................................................................... 4
2.0 Application Information ............................................................................................................................................. 9
3.0 Operating Modes .................................................................................................................................................... 22
4.0 Electrical Characteristics......................................................................................................................................... 25
5.0 Radio Characteristics .............................................................................................................................................. 29
6.0 Physical Dimensions ............................................................................................................................................... 30
7.0 Reflow Profile Module ............................................................................................................................................. 36
8.0 Module Placement Guidelines ................................................................................................................................ 37
9.0 Ordering Information ............................................................................................................................................... 40
Appendix A: Certification Notices.................................................................................................................................. 41
Appendix B: Revision History........................................................................................................................................ 47
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
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Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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2016-2022 Microchip Technology Inc.
DS60001380E-Page 3
BM78
1.0
SYSTEM OVERVIEW
The BM78SPPS5MC2/NC2 is a complete and fully
regulatory certified module with an integral
ceramic chip antenna and RF shield. The
BM78SPP05MC2/NC2 is a low-cost alternative with
RF-out pin (for external antenna) and no RF shield. The
integrator is responsible for the antenna, antenna
matching and regulatory certifications.
The BM78 module is a fully certified, embedded 2.4 GHz
Bluetooth (BR/EDR/LE) wireless module. It includes an
on-board Bluetooth stack, power management subsystem, 2.4 GHz transceiver and RF power amplifier.
Customers can embed Bluetooth functionality into any
application using the BM78 module.
The BM78 module is a small, compact and
surface-mounted module with castellated pads for easy
and reliable host PCB mounting. It is compatible with
standard pick-and-place equipment and can independently maintain a low-power wireless connection.
Low-power usage and flexible power management
maximize the lifetime of the BM78 module in battery
operated devices. A wide operating temperature range
enables its applications in indoor and outdoor environments. The following figure illustrates the internal block
diagram of the BM78 module.
The BM78 module enables rapid product development
and faster time to market, and it is designed to provide
integrators with the following features:
•
•
•
•
•
Simple integration and programming
Reduced development time
Superior wireless module with low-cost system
Interoperability with Bluetooth host
Wide range of applications
FIGURE 1-1:
INTERNAL BLOCK DIAGRAM OF BM78 MODULE
BM78 Bluetooth® Dual Mode Module
(Only BM78SPPS5MC2/NC2)
Antenna
PMU
BAT_ IN
SW_ BTN
LDO33_O
BAT_ DET
Matching
SW_ BTN
LDO3V3_OUT
IS1678 S/SM
LDO18_O
LDO1V8_OUT
VDD_IO
RST_N
Bluetooth
Baseband
and RF
16 MHz
Crystal
VDDIO
MCU
RST_N
Core
320 KB ROM
WAKE_UP
WAKE_UP
28 KB SRAM
GPIO
LED Driver
LED1
4 Mbit Flash
(IS1678SM Only)
TXD
RXD
SCL
I2C
UART
HOST
MCU
RTS
SDA
CTS
EEPROM
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DS60001380E-Page 4
BM78
The following table provides a description of the
various pins of the BM78SPPx5MC2/NC2 module.
TABLE 1-1:
PIN DESCRIPTION
S5 Pin
05 Pin
Symbol
Type
Description
1
—
GND
Power
2
—
GND
Power
Ground reference
3
1
GND
Power
Ground reference
4
2
BAT_IN
Power
Battery input (3.3V to 4.2V),
Main positive supply input,
Connect to 10 μF (X5R/X7R) capacitor
5
3
SW_BTN
DI
6
4
LDO33_O
Power
Internal 3.3V LDO output, cannot source more than
50 mA
7
5
VDD_IO
Power
I/O positive supply input, internal use only, do not
connect to other devices
8
6
LDO18_O
Power
Internal 1.8V LDO output, internal use only, do not
connect to other devices
Ground reference
Software Power Button H: Power On
L: Power Off
9
7
WAKE_UP
DI
10
8
PMULDO_O
Power
Wake-up from Sleep mode (active-low) (internal pull-up)
11
9
P0_4
DO
12
10
P1_5
DO
Status Indication pin, refer to Table 2-4
13
11
P1_2/SCL
DO
I2C SCL
14
12
P1_3/SDA
DIO
I2C SDA
15
13
P1_7
DIO
Configurable control or Indication pin or
UART CTS (input)
16
14
P0_5
DIO
Configurable control or Indication pin
17
15
P0_0
DIO
Configurable control or Indication pin or
UART RTS (output)
18
16
P2_0
DI
Power Management Unit (PMU) output, internal use
only, do not connect to other devices
Status Indication pin, refer to Table 2-4
System configuration pin along with P2_4 and EAN
pins, used to set the BM78 module in any one of the
following three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to download the firmware into
the module)
Refer to Table 2-1.
19
17
P2_4
DI
A = Analog
D = Digital
I = Input
System configuration pin along with P2_0 and EAN
pins, used to set the BM78 module in any one of the
following three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to download the firmware into
the module)
Refer to Table 2-1.
Legend:
2016-2022 Microchip Technology Inc.
O = Output
DS60001380E-Page 5
BM78
TABLE 1-1:
PIN DESCRIPTION (CONTINUED)
S5 Pin
05 Pin
Symbol
Type
Description
20
18
EAN
DI
External address bus negative,
System configuration pin along with P2_0 and P2_4
pins used to set the module in any of the three modes:
• Application mode (for normal operation)
• Test mode (to change EEPROM values)
• Write Flash mode (to download the firmware into
the module)
Refer to Flash/ROM variant type BM78 configuration
settings listed in Table 2-1.
21
19
RST_N
DI
Module Reset (active-low) (internal pull-up),
Apply a pulse of at least 63 ns
22
20
HCI_RXD
DI
UART data input
23
21
HCI_TXD
DO
UART data output
24
22
P3_1
DIO
Configurable control or Indication pin
(Internally pulled up if configured as an input)
25
23
P3_2
DIO
Configurable control or Indication pin
(Internally pulled up if configured as an input)
26
24
P3_3
DIO
Configurable control or Indication pin
(Internally pulled up if configured as an input)
27
25
P3_4
DIO
Configurable control or Indication pin
(Internally pulled up if configured as an input)
28
26
P3_6
DIO
Do not connect
29
27
P3_7
DIO
Configurable control or Indication pin
(Internally pulled up if configured as an input)
30
28
LED1
DO
31
29
GND
Power
LED driver, connect to LDO33_0
Ground reference
—
30
BT_RF
AIO
32
—
GND
Power
Ground reference
33
—
GND
Power
Ground reference
A = Analog
D = Digital
I = Input
Legend:
2016-2022 Microchip Technology Inc.
External antenna connection (50 Ohm)
O = Output
DS60001380E-Page 6
BM78
The following figures illustrate the pin diagrams of the
BM78SPPS5MC2/NC2 and BM78SPP05MC2/NC2
modules.
FIGURE 1-2:
BM78SPPS5MC2/NC2 PIN DIAGRAM
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DS60001380E-Page 7
BM78
FIGURE 1-3:
BM78SPP05MC2/NC2 PIN DIAGRAM
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DS60001380E-Page 8
BM78
2.0
APPLICATION INFORMATION
2.1
System Configuration
The system configuration I/O pins, P2_0, P2_4 and
EAN, are used to set the Configuration and Firmware
Programming modes.
Each of these pins has internal pull-up and allows configuration settings and firmware update from the UART.
The following table provides the system configuration
settings.
TABLE 2-1:
SYSTEM CONFIGURATION SETTINGS
Module
P2_0
BM78SPPX5NC2 (ROM Variant)
BM78SPPX5MC2 (Flash Variant)
2.2
P2_4
EAN
Operational Mode
Low
High
High
Test mode (Write EEPROM)
High
High
High
APP mode (Normal operation)
Low
Low
High
Write Flash
Low
High
Low
Test mode (Write EEPROM)
High
High
Low
APP mode (Normal operation)
Control and Indication I/O Pins
The I/O pins, P0_0, P0_5, P1_7, P3_1, P3_2, P3_3,
P3_4 and P3_7’ are configurable control and indication
pins. The control signals are input to the BM78 module
and the indication signals are output from the BM78
module. The following table provides default I/O pin configuration details.
TABLE 2-2:
CONTROL AND INDICATION I/O PIN ASSIGNMENTS
PIN Symbol
Note 1:
2:
Default Configuration
(1,2)
P0_0
UART_RTS
P0_5
N/C
P1_7
UART_CTS(1,2)
P3_1
INQUIRY CONTROL
P3_2
LINK_DROP_CONTROL (DISCONNECT)
P3_3
UART_RX_IND
P3_4
PAIRING_KEY
P3_7
LOW_BATTERY_IND
The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7.
The RTS and CTS pins can be configured as GPIOs if flow control is disabled.
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DS60001380E-Page 9
BM78
The following table provides the configurable functions
and descriptions of I/O pins.
TABLE 2-3:
CONFIGURABLE FUNCTIONS AND DESCRIPTIONS
Function Name
Description
Low Battery Indication
This function, when assigned to a pin, ensures the output goes low when the
battery level is below a specified level. The UI tool can set the battery level.
RSSI Indication
When assigned to a pin, this function can be used to indicate the quality of the
link based on the Received Signal Strength Indicator (RSSI) level. If the RSSI
level is lower than the specified values, then the RSSI indication pin goes low.
Link Drop Control
When assigned to a pin, this function can be used to force the module to drop
the current Bluetooth® Low Energy (BLE) link with a peer device. Pulling the
Link Drop pin low will force the disconnect. The pin needs to be pulled low for at
least 10 ms.
UART RX Indication
When assigned to a pin, this function enables communication with the UART
when the module is in Low-Power mode. When not in Low-Power mode, the
module runs on a 16 MHz clock. If the user intends to provide data or commands through UART in the Low-Power mode, then the UART_RX_IND pin
needs to be pulled low and the user has to wait at least 5 ms before sending the
data. Pulling the UART_RX_IND pin low allows the module to operate the
16 MHz clock and to enable UART.
Pairing Key
When assigned to a pin, this function can be used to force the module to enter
Standby mode. The pin needs to be pulled down for at least 160 ms.
Inquiry Control
When assigned to a pin, this function forces the module to enter Inquiry mode
(Bluetooth Classic). The pin must be pulled low for at least 240 ms for the
device to enter Inquiry mode.
Profile_IND
When assigned to a pin, this function can be used to indicate whether the
current connection is in Basic Data Rate (BDR)/Enhanced Data Rate (EDR)
(Bluetooth Classic) or in BLE. If the Profile_IND pin is high, then the current
connection is the BDR/EDR connection. If low, then the current connection is a
BLE connection. This pin is valid only for Link state.
2.3
Status Indication I/O Pins
The I/O pins, P1_5 and P0_4, are status indicator pins:
STATUS_IND_1 and STATUS_IND_2. Both the pins
provide status indication to host MCUs. The following
table provides status indication of the P1_5 and P0_4
pins.
TABLE 2-4:
STATUS INDICATION
P1_5/STATUS_IND_1
P0_4/STATUS_IND_2
H
H
Power-on (default setting) and Deep Sleep state.
HH status should be stable for at least 500 ms.
H
L
Access state.
L
H
Link state (UART data transmitting).
L
L
Link state (no UART data transmitted).
L = Low
H = High
Legend:
2016-2022 Microchip Technology Inc.
Indication
DS60001380E-Page 10
BM78
2.4
Power Tree
The following figure illustrates the power tree diagram
of the BM78 module.
FIGURE 2-1:
POWER TREE DIAGRAM
BAT_IN
3.3V to 4.2V
PMULDO
o
SW_BTN
PMU Logic
LDO33
2016-2022 Microchip Technology Inc.
LDO18_EN
3.3V
LDO18
1.8V
VDD_IO
LED
EEPROM
DS60001380E-Page 11
BM78
2.5
Software Power Button (SW_BTN)
The Software power button (SW_BTN) input pin
powers the BM78 module on (high) or off (low) into the
S4 mode. The S4 mode is the Deep Sleep mode and
the S2 mode is the Sleep mode. The S4 mode can only
be triggered by the SW_BTN pin and the power
consumption is lower in the S4 mode.
FIGURE 2-2:
Note 1:
2:
3:
4:
The following figures illustrate the waveforms of the
BM78 module in the high and low status, that is access
and link status.
SW_BTN TIMING (HIGH) AT APPLICATION MODE
MCU can send UART command, refer to Table 2-4.
Time duration (475 ms) is for reference purposes only; the host MCU must check the status pin.
Reset pin is not connected.
The timing data correspond to the BM78SPPX5NC2 (ROM variant) module.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 12
BM78
FIGURE 2-3:
SW_BTN TIMING AT ACCESS STATES
Note 1: Reset pin is not connected.
2: Data correspond to the BM78SPPX5NC2 (ROM variant) module.
FIGURE 2-4:
Note 1:
2:
SW_BTN TIMING (LOW) AT LINK STATES
Time duration (830 ms) is a typical value measured on iPhone® 6, which can vary from one
smartphone to another.
Reset pin is not connected.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 13
BM78
2.6
WAKE-UP
The WAKE_UP input pin wakes the BM78 module from
Sleep mode. The WAKE_UP pin is active-low and
places the module from Sleep mode (S2) to Standby
mode. The following figure illustrates the timing diagram of the BM78 module in the Wake-up mode.
FIGURE 2-5:
WAKE-UP TIME
Note 1: Time duration (85 ms) is for reference purposes only; the host MCU must check the status pin.
2: Refer to Table 2-4 for the status of the P0_4/P1_5 pin.
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DS60001380E-Page 14
BM78
2.7
External Reset
The BM78 module provides a Watchdog Timer (WDT)
to reset the chip. It has an integrated Power-on Reset
(POR) circuit that resets all circuits to a known
Power-on state. This action can also be driven by an
external Reset signal, which is used to externally con-
FIGURE 2-6:
Note 1:
2:
3:
4:
trol the device by forcing it into a POR state. The
RST_N signal input is active-low and connection is not
required in most of the applications.
The following figure illustrates the timing diagram of the
BM78 module when it is in the Reset (RST_N is set to
active-low) state.
TIMING WAVEFORMS ON RESET
Auto-Pattern mode can use the external Reset signal. For more details on the Auto Pattern mode,
refer to Section 3.0 “Operating Modes”.
The RST_N state trigger must be greater than 63 ns.
Manual Pattern mode can use the external Reset signal and Reset command. For more details on
the Manual Pattern mode, refer to Section 3.0 “Operating Modes” and “IS1678 UART Command
Set User Guide”.
Time duration (350 ms) is for reference purposes only; the host MCU must check the status pin.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 15
BM78
2.8
LED Driver
The BM78 module has a dedicated LED driver and the
LED (LED1) can be connected directly with the BM78
module using this driver; see The following figure.
The maximum current sourcing for the LED is 5 mA and
it provides 16 options (steps) to trim the brightness.
The LED brightness can be configured using the UI
tool, a Windows-based utility.
FIGURE 2-7:
The following are status indications of the LED. Each
indication is a configurable flashing sequence:
•
•
•
•
•
Standby
Link Back
Low Battery
Inquiry
Link
LED DRIVER
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DS60001380E-Page 16
BM78
2.9
Host MCU Interface Over UART
The following figure illustrates the UART interface with
the host MCU and power scheme using 3.3V to the
VDD. Battery power is applied to the BAT_IN pin. From
the LDO33_O pin, voltage can be routed to the
FIGURE 2-8:
VDD_IO pin and external circuitry, including the MCU.
This power scheme ensures that the BM78 module and
MCU I/O voltages are compatible.
Note:
The internal 3.3V LDO current source
must not exceed the maximum value of
50 mA.
POWER AND MCU INTERFACE EXAMPLE FOR BM78 MODULE
Note 1: Ensure that VDD_IO and MCU VDD voltages are compatible.
2: The control and indication ports are configurable.
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DS60001380E-Page 17
Reference Circuit
BM78
The following figures illustrate the reference schematic of the power supply
design implemented for the BM78 module.
FIGURE 2-9:
BM78SPP05MC2/NC2 REFERENCE CIRCUIT
ANT1
ANT-ISSC
1
DS60001380E-Page 18
2.10
TP1
RF-TP5
FP1
FP-BM77SPP
1
GND
L1
1nH
BT_RF
30
RF
LDO33_O
WAKEUP
2016-2022 Microchip Technology Inc.
P1_7
P0_5
P0_0
P2_0
P2_4
EAN
RST_N
LED
P3_7
P3_6
P3_4
P3_3
P3_2
P3_1
TXD
RXD
C1
NP-0402
C2
NP-0402
1
29
28
27
26
25
24
23
22
21
20
2
GND
LED1
P3_7
P3_6
P3_4
P3_3
P3_2
P3_1
HCI_TXD
HCI_RXD
2
BAT_IN
SW_BTN
LDO33_O
VDD_IO
LDO18_O
WAKEUP
PMULDO_O
P0_4
P1_5
P1_2 /SCL
P1_3 /SDA
13
14
15
16
17
18
19
P0_4
P1_5
P1_2
P1_3
2
3
4
5
6
7
8
9
10
11
12
P1_7
P0_5
P0_0
P2_0
P2_4
EAN
RST_N
C3
10μ/16V
SW_BTN
1
BAT_IN
Matching Circuit
2016-2022 Microchip Technology Inc.
FIGURE 2-10:
BM78SPP05MC2/NC2 REFERENCE CIRCUIT
RESET
SW_BTN
SW1
4
5
6
R1
20K/1%
4
1
5
2
6
3
P3_7
P3_4
P3_3
P3_2
P3_1
P0_5
P0_0
P1_7
SW2
1
1
1
RST_N
2
2
TS08M-PF
2
SW_BTN
3
BAT_IN
WAKE-UP
PS-5177
MCU
1
WAKEUP
2
Status_IND
P0_0
P1_7
UART CTS / RTS
TXD
RXD
UART TXD / RXD
TS08M-PF
External I2C Device
WAKEUP
SW_BTN
C4
1μ/10V
CN1
5
4
3
2
1
P3_6
R2
10K/1%
2
1
RST_N
P1_3
CONN1X5
LED
R3
10K/1%
2
P0_4
P1_5
SW3
Push-on : pin 2-3
Push-off : pin 1-2
LDO33_O
Functional GPIO
1
P1_2
D1
LED
2
1
LDO33_O
LED-B
TP2 TP-2
TP3 TP-2
TP5 TP-2
TP6 TP-2
P2_4
TP8 TP-2
TP7 TP-2
RXD
TP9 TP-2
EAN
SW_BTN
RST_N
TP10TP-2
TXD
BM78
DS60001380E-Page 19
Test PIN
TP4 TP-2
BAT_IN
P2_0
BM78SPPS5MC2/NC2 REFERENCE CIRCUIT
BM78
DS60001380E-Page 20
FIGURE 2-11:
FP1
FP-BM78SPPA
1
2
3
BAT_IN
C3
10μ/16V
SW_BTN
LDO33_O
WAKEUP
G
G
G
33
32
GND
BAT_IN
SW_BTN
LDO33_O
VDD_IO
LDO18_O
WAKEUP
PMULDO_O
P0_4
P1_5
P12 / SCL
P13 / SDA
GND
LED1
P3_7
P3_6
P3_4
P3_3
P3_2
P3_1
HCI_TXD
HCI_RXD
2016-2022 Microchip Technology Inc.
P1_7
P0_5
P0_0
P2_0
P2_4
EAN
RST_N
15
16
17
18
19
20
21
P1_7
P0_5
P0_0
P2_0
P2_4
EAN
RST_N
P0_4
P1_5
P1_2
P1_3
4
5
6
7
8
9
10
11
12
13
14
G
31
30
29
28
27
26
25
24
23
22
LED
P3_7
P3_6
P3_4
P3_3
P3_2
P3_1
TXD
RXD
2016-2022 Microchip Technology Inc.
FIGURE 2-12:
BM78SPPS5MC2/NC2 REFERENCE CIRCUIT
RESET
SW_BTN
SW1
4
5
6
R1
20K/1%
4
1
5
2
6
3
P3_7
P3_4
P3_3
P3_2
P3_1
P0_5
P0_0
P1_7
SW2
1
1
1
RST_N
2
2
TS08M-PF
2
SW_BTN
3
BAT_IN
WAKE-UP
PS-5177
MCU
WAKEUP
1
2
Status_IND
P0_0
P1_7
UART CTS / RTS
TXD
RXD
UART TXD / RXD
TS08M-PF
External I2C Device
WAKEUP
SW_BTN
C4
1μ/10V
CN1
5
4
3
2
1
P3_6
R2
10K/1%
2
1
RST_N
P1_3
CONN1X5
LED
R3
10K/1%
2
P0_4
P1_5
SW3
Push-on : pin 2-3
Push-off : pin 1-2
LDO33_O
Functional GPIO
1
D1
P1_2
LED
2
1
LDO33_O
LED-B
TP2 TP-2
TP3 TP-2
TP5 TP-2
TP6 TP-2
P2_4
TP8 TP-2
TP7 TP-2
RXD
TP9 TP-2
EAN
SW_BTN
RST_N
TP10TP-2
TXD
BM78
DS60001380E-Page 21
Test PIN
TP4 TP-2
BAT_IN
P2_0
BM78
3.0
OPERATING MODES
The BM78 module allows the user to operate the
module in two distinct modes:
• Auto-Pattern mode
• Manual Pattern mode
Note:
The Auto-Pattern mode and the Manual Pattern mode
use different state machines. The BM78 module can be
operated in either of these modes by setting the value
in the EEPROM memory location. The BM78 module is
in Auto-Pattern mode by default. To modify the
EEPROM values, the module must be placed in the
“Write EEPROM and Test mode” through the pins,
P2_0, P2_4 and EAN.
FIGURE 3-1:
The UI tool provides an easy Windows Graphical User
Interface (GUI) to set or modify the EEPROM settings
on the BM78 module.
The UI tool is available for download from
the Microchip website at:
www.microchip.com/BM78.
The following figure illustrates the basic algorithm, followed by the BM78 module during start-up, in deciding
which state machine to be used for operation.
OPERATING MODE CONFIGURATION
Is Auto-Pattern
turned on?
2016-2022 Microchip Technology Inc.
DS60001380E-Page 22
BM78
3.1
Auto-Pattern Mode
The Auto-Pattern mode is a state machine in which the
Bluetooth related operations are automated. It is
primarily used to connect the module to a peer device
and create a data pipe with the peer device through the
Transparent UART mode, thus providing a “cable
replacement” solution. Also, the BM78 module allows
FIGURE 3-2:
the user to enter some configuration commands in the
Auto-Pattern mode. For more details on the list of
configuration commands that can be used in
Auto-Pattern mode, refer to the “IS1678 UART
Command Set User Guide”.
The following figure illustrates the basic state machine
in the Auto-Pattern mode.
AUTO-PATTERN MODE
Deep Sleep state
To evaluate and test the BM78 module in Auto-Pattern
mode, download and install the Auto-Pattern tool
(Windows-based GUI emulation tool), which is
available on the Microchip website. This tool
implements
the
communication
protocol
for
Auto-Pattern mode. It also provides a fast and easy
way to test the functions and options available in the
Auto-Pattern mode.
2016-2022 Microchip Technology Inc.
Note:
The Auto-Pattern tool and “IS1678 UART
Command Set User Guide” are available
for download from the Microchip website
at: www.microchip.com/BM78.
DS60001380E-Page 23
BM78
3.2
Manual Pattern
The Manual Pattern mode provides full control of the
BM78 module to the user and the module operates only
based on the commands from the user or host MCU.
FIGURE 3-3:
The following figure illustrates the state machine followed by the BM78 module in the Manual Pattern
mode.
STATE CHANGES BY MCU IN MANUAL PATTERN
The Manual Pattern mode also allows the Transparent
UART mode. There is a small difference in the protocols followed in the Manual Pattern mode and the
Auto-Pattern mode. For more details on the protocol
differences, refer to the “IS1678 UART Command Set
User Guide”.
To evaluate and test the BM78 module in Manual Pattern mode, download and install the Manual Pattern tool
(Windows-based GUI emulation tool), which is available
from the Microchip website. This tool implements the
2016-2022 Microchip Technology Inc.
communication protocol for Manual Pattern mode. It
also provides a fast and easy way to test the functions
and options available in the Manual Pattern mode.
Note:
The Manual Pattern tool and “IS1678
UART Command Set User Guide” are
available for download from the Microchip
website at: www.microchip.com/BM78.
DS60001380E-Page 24
BM78
4.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the electrical characteristics of the BM78 module. Additional information will
be provided in future revisions of this document as it becomes available.
Absolute maximum ratings for the BM78 module are listed below. Exposure to these maximum rating conditions for
extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above
the parameters indicated in the operation listings of this specification, is not implied.
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. .-20°C to +70°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Maximum output current sink by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin.....................................................................................................12 mA
Note:
Stresses listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only. The functional operation of the device at those or any other conditions, and those
indicated in the operation listings of this specification, is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 25
BM78
The following tables provide the recommended operating conditions and the electrical specifications of the
BM78 module.
TABLE 4-1:
RECOMMENDED OPERATING CONDITIONS
Rating
Min.
Typical
Max.
Ambient Operating Temperature Range
-20ºC
+25ºC
+70ºC
Relative Humidity (Operating)
10%
—
90%
Relative Humidity (Storage)
10%
—
90%
ESD
HBM
—
±2 KV
—
MM
—
±200V
—
HTOL (Note 1)
—
1000 hrs
—
3.3V
—
4.2V
Supply Voltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR
1.8V
1.9V
2.1V
SW_BTN
3.3V
—
4.2V
Supply Voltage: BAT_IN
LED1
—
—
3.6V
Reset VTHRES Threshold Voltage
—
1.6V
—
VIL Input Logic Levels Low
-0.3V
—
0.8V
VIH Input Logic Levels High
2.0V
—
3.6V
VOL Output Logic Levels Low (IOL = 12 mA)
—
—
0.4V
VOH Output Logic Levels High (IOH = 12 mA)
2.4V
—
—
RF Continuous Tx Mode
—
—
43 mA
RF Continuous Rx Mode
—
—
37 mA
Note 1:
HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V.
TABLE 4-2:
3.3V LDO ELECTRICAL PARAMETERS(1,2)
Parameter
Operating Temperature
Min.
Typical
Max.
Unit
-20
—
+70
ºC
Output Current (VIN = 3.6V/load regulation with 100 mV drop)
—
100
—
mA
Quiescent Current (VIN = 3.6V)
—
150
—
μA
Min.
Typical
Max.
Unit
Operating Temperature
-20
—
+70
ºC
Output Current (VIN = 3.6V/load regulation with 0.3 mV drop)
—
100
—
μA
Quiescent Current (VIN = 3.6V)
—
120
—
μA
Note 1:
2:
With 10 μF capacitor at LDO33_O as the condition for IP verification.
Output voltage can be calibrated using the MP tool.
TABLE 4-3:
PMU LDO(1,2)
Parameter
Note 1:
2:
With 1 μF capacitor at PMULDO_O as the condition for IP verification.
Output voltage can be calibrated by using the MP tool.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 26
BM78
TABLE 4-4:
SAR-ADC AND BATTERY VOLTAGE DETECTOR
Parameter
Min.
Typical
Max.
Unit
Operating Temperature
-20
—
+70
ºC
AVDD_SAR Power Supply
—
1.8
—
V
SAR_BAT Detection (Note 1)
3.3
—
4.2
V
Resolution
—
10
—
bit
Operating Current (including band gap)
—
—
1
mA
Deep Sleep Current
—
—
1
μA
Typical
Max.
Unit
Note 1:
SAR_BAT is connected with BAT_IN internally for battery voltage detection.
TABLE 4-5:
INTENSITY CONTROLLABLE LED DRIVER
Parameter
Min.
Operating Temperature
-20
—
+70
ºC
Open-Drain Voltage
—
—
3.6
V
Current Step
—
0.3
—
mA
Programmable Current Range
0
—
5
mA
Intensity Control
—
16
—
step
Power-Down Open-Drain Current
—
—
1
μA
Deep Sleep Current
—
—
1
μA
TABLE 4-6:
POWER CONSUMPTION – CLASSIC(1,2)
Test Condition
Current Consumption (avg.) (mA)
Remarks
Standby Mode
2.543
—
Deep Sleep Mode
0.187
Connected+Sniff, Central
(no data)
0.541
No data were transmitted,
Sniff interval = 500 ms
Connected+Sniff, Peripheral
(no data)
0.551
No data were transmitted,
Sniff interval = 500 ms
Data, Central
10.67
Data transmitted at 115200 bps,
block size = 500
Note 1:
2:
—
Classic BR/EDR and RX_IND functions are enabled.
The data correspond to the BM78SPPX5NC2 (ROM variant).
2016-2022 Microchip Technology Inc.
DS60001380E-Page 27
BM78
TABLE 4-7:
POWER CONSUMPTION – LOW ENERGY(1,2)
Test Condition
Deep Sleep Mode
LE Fast Advertising
Current Consumption
(avg.) (mA)
Remarks
0.13
—
1.21
LE fast advertising interval = 100 ms
0.88
LE fast advertising interval = 160 ms
0.48
LE fast advertising interval = 500 ms
1.72
LE fast advertising interval = 100 ms + Beacon 100 ms
0.62
LE fast advertising interval = 500 ms + Beacon 500 ms
0.39
LE reduced power advertising interval = 961 ms
1.00
LE reduced power advertising
interval = 961 ms + Beacon 100 ms
0.51
LE Reduced Power advertising
interval = 961 ms+Beacon 500 ms
Connected (No data)
0.39
Connection interval = 1500 ms
0.43
Connection interval = 600 ms
Connected (iPhone® 6 to module)
0.45
Connection interval = 500 ms
Reduced Power Advertising
Connected (module to iPhone 6)
Note 1:
2:
0.60
Connection interval = 200 ms
6.6
Connection interval = 500 ms
7.0
Connection interval = 200 ms
Low energy, RX_IND function is enabled.
The data correspond to the BM78SPPX5NC2 (ROM variant).
2016-2022 Microchip Technology Inc.
DS60001380E-Page 28
BM78
5.0
RADIO CHARACTERISTICS
The following table provides the transmitter
performance characteristics of the BM78 module.
TABLE 5-1:
TRANSMITTER PERFORMANCE(1,2)
Min.
Typical
Max.
Bluetooth®
Specification
BDR Power
—
1.5
—
-6 ~ +4
EDR (2M/3M) Power
—
-1
—
-6 ~ +4
LE Power
—
0.5
—
-20 ~ +10
Basic Data Rate
Note 1:
2:
Unit
dBm
The RF transmit power can be calibrated during production by using the MP tool and the MT8852
Bluetooth test equipment.
Test condition: VCC RF = 1.80V, temperature = +25ºC.
The following table provides the receiver performance characteristics of the BM78 module.
TABLE 5-2:
RECEIVER PERFORMANCE
Basic Data Rate
Min.
Typical
Max.
BDR Sensitivity
—
-90
—
EDR 2M Sensitivity
—
-90
—
EDR 3M Sensitivity
—
-82
—
LE Sensitivity
—
-92
—
Note:
Bluetooth®
Specification
Unit
≤-70
dBm
Test condition: VCC RF = 1.80V, temperature = +25ºC.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 29
BM78
6.0
PHYSICAL DIMENSIONS
The following figure illustrates the physical dimensions
of the BM78SPPS5MC2/NC2 module.
FIGURE 6-1:
BM78SPPS5MC2/NC2 MODULE DIMENSIONS
2016-2022 Microchip Technology Inc.
DS60001380E-Page 30
BM78
The following figure illustrates the recommended host PCB footprint.
FIGURE 6-2:
BM78SPPS5MC2/NC2 RECOMMENDED PCB FOOTPRINT
2016-2022 Microchip Technology Inc.
DS60001380E-Page 31
BM78
The following figure illustrates the recommendations
for mounting the BM78SPPS5MC2/NC2 on the host
PCB, and shows the minimum ground plane area to the
left and right of the module for the best antenna performance.
Avoid the top copper layer near the test pin area. When
designing the host PCB, the areas under the antenna
should not contain any top, inner or bottom copper
FIGURE 6-3:
layer. A low-impedance ground plane will ensure best
radio performance (best range and lowest noise). The
ground plane can be extended beyond the minimum
recommended, as needed for host PCB EMC noise
reduction. For best range performance, keep all external metal at least 31 mm away from the ceramic chip
antenna.
BM78SPPS5MC2/NC2 HOST PCB MOUNTING SUGGESTION
2016-2022 Microchip Technology Inc.
DS60001380E-Page 32
BM78
The following figure illustrates the physical dimensions
of the BM78SPP05MC2/NC2 module.
FIGURE 6-4:
BM78SPP05MC2/NC2 MODULE DIMENSIONS
2016-2022 Microchip Technology Inc.
DS60001380E-Page 33
BM78
The following figure illustrates the recommended host
PCB footprint.
FIGURE 6-5:
BM78SPP05MC2/NC2 RECOMMENDED PCB FOOTPRINT
2016-2022 Microchip Technology Inc.
DS60001380E-Page 34
BM78
The following figure illustrates the recommended
mounting details for the BM78SPP05MC2/NC2 module
and recommended layout of the host PCB.
A low-impedance ground plane will ensure best radio
performance (best range, lowest noise). The pin 30
(BT_RF) is a 50 Ohm connection to an external
antenna connector, PCB trace antenna or component
(ceramic chip) antenna through a host PCB with
FIGURE 6-6:
50 Ohm impedance and micro-strip trace. This trace
can be extended to include passive parts for antenna
attenuation padding, impedance matching or to provide
test posts. It is recommended that the micro-strip trace
must be as short as possible for minimum loss and
better impedance matching. If the micro-strip trace is
longer, it must be a 50 Ohm impedance.
BM78SPP05MC2/NC2 HOST PCB MOUNTING SUGGESTION
2016-2022 Microchip Technology Inc.
DS60001380E-Page 35
BM78
7.0
REFLOW PROFILE MODULE
The BM78 module is assembled using a standard
lead-free reflow profile, IPC/JEDEC J-STD-020. The
BM78 module can be soldered to the host PCB by
using the standard leaded and lead-free solder reflow
profiles.
To avoid damage to the module, follow these
recommendations:
• Refer to AN233 “Solder Reflow Recommendation” application note (DS00233) for the soldering
reflow recommendations.
• The peak temperature should not exceed (TP) of
+250ºC.
• Use no-clean flux solder paste.
• Do not wash the module as moisture can be
trapped under the shield.
• Use only one flow. If the PCB requires multiple
flows, apply the module on the final flow.
FIGURE 7-1:
• Standard: IPC/JEDEC J-STD-020:
- Condition: Preheat:+150ºC to +200ºC for
60 to 120 seconds
- Average ramp-up rate (+217ºC to peak):
+3ºC/sec max
- Temperature maintained above +217ºC:
60 to 150 seconds
- Time within +5ºC of peak temperature:
30 to 40 seconds
- Peak temperature: +260ºC with +5/0ºC tolerance
- Ramp-down rate (peak to +217ºC):
+6ºC/sec max
- Time within +25ºC to peak temperature:
8 minutes max
- Cycle interval: 5 minutes
The following figure illustrates the reflow profile of the
BM78 module.
REFLOW PROFILE
2016-2022 Microchip Technology Inc.
DS60001380E-Page 36
BM78
8.0
MODULE PLACEMENT GUIDELINES
For a Bluetooth wireless product, the antenna placement affects the performance of the whole system. The
antenna requires free space to radiate the RF signal
and it cannot be surrounded by the ground plane.
Microchip recommends that the areas underneath the
antenna on the host PCB do not contain copper on the
top, inner or bottom layer.
The ground plane can be extended beyond the minimum recommendation, as required for the main PCB
EMC noise reduction. For the best range performance,
keep all external metal at least 15 mm away from the
ceramic chip antenna.
The following figure illustrates an example of good and
poor module placement on a host PCB with the ground
plane.
FIGURE 8-1:
TABLE 8-1:
MODULE PLACEMENT EXAMPLES
RECOMMENDED ANTENNA
Description
Manufacturer Part Number
Manufacturer
ANT ANT3216A063R2400A, PIFA, 2.4 GHz, L3.2W1.6
ANT3216A063R2400A
Yageo Corp.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 37
BM78
The following figure illustrates the BM78 module
mounted on the BM78 Evaluation Board (EVB). It also
shows the recommended keep out area for the
antenna.
FIGURE 8-2:
Note:
KEEP OUT AREA RECOMMENDED FOR ANTENNA
For additional information on free space
for antenna placement design, refer to the
antenna manufacturer’s design rule
document.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 38
BM78
8.1
BM78SPPS5MC2/NC2 Ceramic
Chip Antenna
The BM78SPPS5MC2/NC2 contains an integral
ceramic chip antenna. The following figure illustrates
the antenna radiation pattern of the ceramic chip
antenna on the BM78SPPS5MC2/NC2.
FIGURE 8-3:
TABLE 8-2:
BM78SPPS5MC2/NC2 ANTENNA RADIATION PATTERN
ANTENNA RADIATION
PATTERN DETAILS
Parameter
Values
Frequency
2450 MHz
Peak Gain
1.63 dBi
Efficiency
71.55%
2016-2022 Microchip Technology Inc.
DS60001380E-Page 39
2016-2022 Microchip Technology Inc.
9.0
ORDERING INFORMATION
The following table provides the various SKUs of the BM78 module.
TABLE 9-1:
BM78 MODULE SKUs
Device
Microchip IC
BM78SPPS5MC2
IS1678SM-151
BM78SPP05MC2
IS1678SM-151
BM78SPPS5NC2
IS1678S-152
BM78SPP05NC2
IS1678S-152
BM78SPPS5MC2
IS1678SM-152
BM78SPP05MC2
IS1678SM-152
Note:
Antenna
Description
On-Board Bluetooth® Dual mode, Class 2, Flash variant
External
Shield
Yes
Bluetooth Dual mode, Class 2, Flash variant
No
On-Board Bluetooth Dual mode, Class 2, ROM variant
Yes
External
Bluetooth Dual mode, Class 2, ROM variant
On-Board Bluetooth Dual mode, Class 2, Flash variant,
Firmware Rev 1.35
External
Bluetooth Dual mode, Class 2, Flash variant,
Firmware Rev 1.35
No
Yes
No
Regulatory Certification
Ordering Number
FCC, ISED, CE, MIC, KCC, BM78SPPS5MC2-0002AA
NCC, SRRC
No
BM78SPP05MC2-0002AA
FCC, ISED, CE, MIC, KCC, BM78SPPS5NC2-0002AA
NCC, SRRC
No
BM78SPP05NC2-0002AA
FCC, ISED, CE, MIC, KCC, BM78SPPS5MC2-0004AA
NCC, SRRC
No
BM78SPP05MC2-0004AA
The BM78 module can be purchased through a Microchip representative. Contact the Microchip sales office for information on Bluetooth v5.0 ROM variants
of the BM78 module. Visit www.microchip.com for current pricing and a list of distributors for the product.
BM78
DS60001380E-Page 40
BM78
APPENDIX A:
CERTIFICATION
NOTICES
The BM78 module (BM78SPPS5MC2) has received
regulatory approval for the following countries:
• Bluetooth SIG/QDID: 110108
• United States/FCC ID: A8TBM78ABCDEFGH
• Canada:
- IC: 12246A-BM78SPPS5M2
- HVIN: BM78SPPS5M2
- PMN: Bluetooth Module
• Europe/CE
• Japan/MIC: 202-SMD070
• Korea/KCC: MSIP-CRM-mcp-BM78SPPS5MC2
• Taiwan/NCC No: CCAN15LP0510T4
• China/SRRC: CMIIT ID: 2015DJ7133
The BM78 ROM module (BM78SPPS5NC2) will cover
regulatory approval for the following countries:
• Bluetooth SIG/QDID: 110108
• United States/FCC ID: A8TBM78ABCDEFGH
• Canada:
- IC: 12246A-BM78SPPS5M2
- HVIN: BM78SPPS5M2
- PMN: BM78SPPS5NC2
• Europe/CE
• Japan/MIC: 202-SMD070
• Korea/KCC: MSIP-CRM-mcp-BM78SPPS5MC2
• Taiwan/NCC No: CCAN18LP0800T1
• China/SRRC: CMIIT ID: 2018DJ3812
A.1
Regulatory Approval
This section outlines the regulatory information for the
BM78 module for the following countries:
•
•
•
•
•
•
•
•
United States
Canada
Europe
Japan
Korea
Taiwan
China
Other Regulatory Jurisdictions
A.1.1
UNITED STATES
The BM78/BM78 ROM module has received Federal
Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators”
single modular approval in accordance with
Part 15.212 Modular Transmitter approval. Single
modular transmitter approval is defined as a complete
RF transmission sub-assembly, designed to be incorporated into another device that must demonstrate
compliance with FCC rules and policies, independent
of any host. A transmitter with a modular grant can be
installed in different end-use products (referred to as a
host, host product or host device) by the grantee or
other equipment manufacturer; then the host product
may not require additional testing or equipment authorization for the transmitter function provided by that
specific module or limited module device.
The user must comply with all of the instructions provided by the grantee, which indicate installation and/or
operating conditions necessary for compliance.
The host product itself is required to comply with all
applicable FCC equipment authorization regulations,
requirements and equipment functions that are not
associated with the transmitter module portion. For
example, compliance must be demonstrated to regulations for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification, or
Declaration of Conformity) (e.g., Bluetooth and Wi-Fi
transmitter modules may also contain digital logic
functions).
A.1.2
LABELING AND USER
INFORMATION REQUIREMENTS
The BM78/BM78 ROM module has been labeled with
its own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring to
the enclosed module. This exterior label can use
wording as follows:
Contains Transmitter Module
FCC ID: A8TBM78ABCDEFGH
or
Contains FCC ID:A8TBM78ABCDEFGH
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 41
BM78
A user’s manual for the product must include the following
statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment
and receiver
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is
connected
• Consult the dealer or an experienced radio/TV
technician for help
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748, available at the FCC Office of
Engineering and Technology (OET) Laboratory
Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm.
A.1.3
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted.
This grant is valid only when the module is sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certification and must not be co-located or operating in
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multitransmitter product procedures.
2016-2022 Microchip Technology Inc.
A.1.4
APPROVED ANTENNAS
To maintain modular approval in the United States, only
the antenna types that have been tested shall be used.
It is permissible to use different antennas, provided the
same antenna type, antenna gain (equal to or less
than), with similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies).
For BM78, the approval is received using the antenna
listed in Table 8-1.
A.1.5
HELPFUL WEBSITES
Federal Communications Commission (FCC):
http://www.fcc.gov
FCC Office of Engineering and Technology (OET)
Laboratory Division Knowledge Database (KDB):
http://apps.fcc.gov/oetcf/kdb/index.cfm
A.2
Canada
The BM78/BM78 ROM module has been certified for
use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry
Canada) Radio Standards Procedure (RSP) RSP-100,
Radio Standards Specification (RSS) RSS-Gen and
RSS-247. Modular approval permits the installation of
a module in a host device without the need to recertify
the device.
A.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements (from RSP-100, Issue 12,
Section 5): The host product shall be properly labeled
to identify the module within the host device.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host product;
otherwise, the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word “Contains”, or similar wording expressing
the same meaning, as follows:
Contains IC: 12246A-BM78SPPS5M2
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, March 2019):
User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a conspicuous location in the user manual or alternatively, on the
device or both:
DS60001380E-Page 42
BM78
This device contains license-exempt transmitter(s)/
receiver(s) that comply with Innovation, Science and
Economic Development Canada’s license-exempt
RSS(s). Operation is subject to the following two
conditions:
1. This device may not cause interference;
2. This device must accept any interference,
including interference that may cause undesired
operation of the device.
L’émetteur/récepteur exempt de licence contenu
dans le présent appareil est conforme aux CNR
d’Innovation, Sciences et Développement
économique Canada applicables aux appareils radio
exempts de licence. L’exploitation est autorisée aux
deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage
est susceptible d’en compromettre le
fonctionnement.
Transmitter Antenna (from Section 6.8 RSS-GEN,
Issue 5, March 2019): User manuals, for transmitters
shall display the following notice in a conspicuous
location:
This radio transmitter [IC: 12246A-BM78SPPS5M2]
has been approved by Innovation, Science and Economic Development Canada to operate with the
antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in
this list that have a gain greater than the maximum
gain indicated for any type listed are strictly prohibited
for use with this device.
Le présent émetteur radio
[IC: 12246A-BM78SPPS5M2] a été approuvé par
Innovation, Sciences et Développement économique
Canadapour fonctionner avec les types d’antenne
énumérés cidessous et ayant un gain admissible
maximal Les types d’antenne non inclus dans cette
liste, et dont le gain est supérieur au gain maximal
indiqué pour tout type figurant sur la liste, sont
strictement interdits pour l’exploitation de l’émetteur.
Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for
use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for
each.
A.2.2
RF EXPOSURE
All transmitters regulated by the Innovation, Science
and Economic Development Canada (ISED) must
comply with RF exposure requirements listed in
RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio Communication Apparatus (All
Frequency Bands).
2016-2022 Microchip Technology Inc.
This transmitter is restricted for use with a specific
antenna tested in this application for certification, and
must not be co-located or operating in conjunction with
any other antenna or transmitters, except in
accordance with Innovation, Science and Economic
Development Canada multitransmitter guidelines.
The device operates at an output power level which is
within the ISED SAR test exemption limits at any user
distance.
A.2.3
APPROVED ANTENNAS
For BM78, the approval is received using the antenna
listed in Table 8-1.
A.2.4
HELPFUL WEBSITES
Innovation, Science and Economic Development
Canada (ISED): http://www.ic.gc.ca/.
A.3
Europe
The BM78/BM78 ROM module is Radio Equipment
Directive (RED) assessed, CE marked, and has been
manufactured and tested with the intention of being
integrated into a final product.
The BM78/BM78 ROM module has been tested to RED
2014/53/EU Essential Requirements mentioned in the
following European Compliance table.
TABLE 0-1:
EUROPEAN COMPLIANCE
Certification
Standards
Safety
EN 62368
Health
EN 62311
Electromagnetic
Compatibility (EMC)
EN 301 489-1
Radio
EN300 328
Article
3.1(a)
3.1(b)
EN 301 489-17
3.2
The ETSI provides guidance on modular devices in
“Guide to the application of harmonised standards covering Article 3.1(b) and Article 3.2 of the Directive
2014/53/EU RED to multi-radio and combined radio
and non-radio equipment” document available at:
http://www.etsi.org/deliver/etsi_eg/203300_203399/20
3367/01.01.01_60/eg_203367v010101p.pdf.
Note:
To maintain conformance to the standards
listed in the preceding European Compliance table, the module shall be installed in
accordance with the installation instructions in this data sheet and shall not be
modified. When integrating a radio module
into a completed product, the integrator
becomes the manufacturer of the final
product and is therefore, responsible for
demonstrating compliance of the final
product with the essential requirements
against the RED.
DS60001380E-Page 43
BM78
A.3.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM78/BM78 ROM module must follow CE marking
requirements.
A.3.2
CONFORMITY ASSESSMENT
From ETSI Guidance Note EG 203367, Section 6.1,
non-radio products are combined with a radio product:
If the manufacturer of the combined equipment installs
the radio product in a host non-radio product in equivalent assessment conditions (i.e., host equivalent to the
one used for the assessment of the radio product) and
according to the installation instructions for the radio
product, then no additional assessment of the
combined equipment against Article 3.2 of the RED is
required.
A.3.3
APPROVED ANTENNAS
A.4
Japan
The BM78/BM78 ROM module has received type
certification, and is labeled with its own technical conformity mark and certification number as required to
conform to the technical standards regulated by the
Ministry of Internal Affairs and Communications (MIC)
of Japan pursuant to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification, provided installation instructions are followed and no modifications of
the module are allowed. Additional testing may be
required.
If the host product is subject to electrical appliance
safety (for example, powered from an AC mains), the
host product may require Product Safety Electrical
Appliance and Material (PSE) testing. The integrator
must contact their conformance laboratory to
determine if this testing is required
For BM78/BM78 ROM, the approval is received using
the antenna shown in Table 8-1.
• There is a voluntary Electromagnetic Compatibility
(EMC) test for the host product administered by
VCCI: http://www.vcci.jp/vcci_e/index.html
A.3.3.1
A.4.1
Simplified EU Declaration of
Conformity
Hereby, Microchip Technology Inc. declares that the
radio equipment type BM78/BM78 ROM is in compliance
with Directive 2014/53/EU.
The full text of the EU declaration of conformity for this
product is available at:
https://www.microchip.com/wwwproducts/en/BM78
(available under Documents > Certifications).
A.3.4
HELPFUL WEBSITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD) in
Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be
downloaded from the European Radio Communications
Committee (ECC) at:
http://www.ecodocdb.dk/.
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the BM78
module must follow Japan marking requirements. The
integrator of the module must refer to the labeling
requirements for Japan available at the Ministry of
Internal Affairs and Communications (MIC) website.
The BM78 module is labeled with its own technical conformity mark and certification number. The final product
in which this module is being used must have a label
referring to the type certified module inside:
202-SMD070
Additional helpful websites are:
A.4.2
• Radio Equipment Directive (2014/53/EU):
https://ec.europa.eu/growth/single-market/
european-standards/harmonised-standards/red_en
• European Conference of Postal and
Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards
Institute (ETSI): http://www.etsi.org
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
HELPFUL WEBSITES
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
The Radio Equipment Directive Compliance Association
(REDCA): http://www.redca.eu/
2016-2022 Microchip Technology Inc.
DS60001380E-Page 44
BM78
A.5
Korea
The BM78/BM78 ROM module has received certification of conformity in accordance with the Radio Waves
Act. Integration of this module into a final product does
not require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
A.5.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM78/BM78 ROM module must follow KC marking
requirements. The integrator of the module must refer
to the labeling requirements for Korea available on the
Korea Communications Commission (KCC) website.
The BM78 module is labeled with its own KC mark. The
final product requires the KC mark and certificate
number of the module:
For the BM78 ROM module, due to limited module size,
the NCC mark and ID are displayed in the data sheet
and/or packaging and cannot be displayed on the
module label:
CCAN18LP0800T1
The user’s manual must contain the below warning (for
RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許
可，
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
MSIP-CRM-mcp-BM78SPPS5MC2
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時
方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
A.5.2
HELPFUL WEBSITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
National Radio Research Agency (RRA):
http://rra.go.kr
A.6.2
A.6
National Communications Commission (NCC):
http://www.ncc.gov.tw
Taiwan
The BM78/BM78 ROM module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance approval
in their product must contact Microchip Technology Inc.
sales or distribution partners to obtain a Letter of
Authority.
Integration of this module into a final product does not
require additional radio certification, provided installation instructions are followed and no modifications of
the module are allowed.
A.6.1
LABELING AND USER
INFORMATION REQUIREMENTS
For the BM78 module, due to limited module size, the
NCC mark and ID are displayed in the data sheet
and/or packaging and cannot be displayed on the
module label:
A.7
HELPFUL WEBSITES
China
The BM78/BM78 ROM module has received certification of conformity in accordance with the China MIIT
Notice 2014-01 of State Radio Regulation Committee
(SRRC) certification scheme. Integration of this module
into a final product does not require additional radio
certification, provided installation instructions are followed and no modifications of the module are allowed.
Refer to SRRC certificate available in the BM78
product page for expiry date.
A.7.1
LABELING AND USER
INFORMATION REQUIREMENTS
The BM78 module is labeled with its own CMIIT ID as
follows:
CMIIT ID: 2015DJ7133
CCAN15LP0510T4
2016-2022 Microchip Technology Inc.
DS60001380E-Page 45
BM78
When the host system is using an approved Full
Modular Approval (FMA) radio: The host must bear a
label containing the statement “This device contains
SRRC approved Radio module CMIIT ID:
2015DJ7133”.
The BM78 ROM module is labeled with its own CMIIT
ID as follows:
CMIIT ID: 2018DJ3812
When the host system is using an approved Full
Modular Approval (FMA) radio: The host must bear a
label containing the statement “This device contains
SRRC approved Radio module CMIIT ID:
2018DJ3812”.
A.8
UKCA (UK Conformity Assessed)
A.8.2
UKCA DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type BM78/BM78 ROM module is in
compliance with the Radio Equipment Regulations
2017.
The full text of the UKCA declaration of conformity for
this product is available (under Documents > Certifications) at:
• https://www.microchip.com/en-us/product/BM78
A.8.3
APPROVED ANTENNAS
The testing of the BM78/BM78 ROM module was performed with the antennas listed in Table 8-2.
A.8.4
HELPFUL WEB SITES
The BM78/BM78 ROM module is a UK conformity
assessed radio module that meets all the essential
requirements according to CE RED requirements.
For more information on the UKCA regulatory approvals, refer to the https://www.gov.uk/guidance/placing-manufactured-goods-on-the-market-in-great-britai
n.
A.8.1
A.9
LABELING REQUIREMENTS FOR
MODULE AND USER’S
REQUIREMENTS
The label on the final product that contains the
BM78/BM78 ROM module must follow the UKCA marking requirements.
Other Regulatory Information
• For information on the other country jurisdictions
covered, refer to:
http://www.microchip.com/design-centers/
wireless-connectivity.
• Should other regulatory jurisdiction certification be
required by the customer, or the customer needs to
recertify the module for other reasons, contact
Microchip for the required utilities and documentation.
The UKCA mark above is printed on the module itself
or on the packing label.
Additional details for the label requirement are available at:
https://www.gov.uk/guidance/using-the-ukca-marking#check-whether-you-need-to-use-the-new-ukca-m
arking.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 46
BM78
APPENDIX B:
REVISION HISTORY
Revision E (July 2022)
TABLE E-1:
MAJOR SECTION UPDATES
Section
Update Description
A.8 “UKCA (UK Conformity Assessed)”
Added UKCA regulatory approval information.
Revision D (March 2021)
Note:
• Updated Table 1-1.
• Updated A.2.1 “Labeling and User Information
Requirements” and A.3 “Europe”.
• Added A.4.1 “Labeling and User Information
Requirements” and A.2.3 “Approved
Antennas”.
• Updated with the new terminologies. For more
details, see the following note.
TABLE D-2:
Microchip is aware that some terminologies
used in the technical documents and existing software codes of this product are
outdated and unsuitable. This document
may use these new terminologies, which
may or may not reflect on the source codes,
software GUIs and the documents referenced within this document. The following
table shows the relevant terminology
changes made in this document.
TERMINOLOGY RELATED CHANGES
Old Terminology
New Terminology
Description
Master
Central
Table 4-6 updated with new terminology change.
Slave
Peripheral
Table 4-6 updated with new terminology change.
Revision C (February 2020)
Revision B (April 2019)
This revision includes the following minor update:
Updated Figure 6-1.
This revision includes the following changes and minor
updates to text and formatting, which were incorporated throughout the document.
TABLE B-1:
MAJOR SECTION UPDATES
Section
Update Description
Document
Updated Bluetooth version from 4.2 to 5.0.
“Features”
• Updated certification information.
• Updated Figure 1.
“Data Throughput”
Updated Kbytes/s.
1.0“System Overview”
Updated Table 1-1, Figure 1-1 and Figure 1-3.
2.0“Application Information”
Added Table 2-3. Updated Table 2-2, Figure 2-1 and Figure 2-8.
3.0“Operating Modes”
Updated this section.
4.0“Electrical Characteristics”
Updated Storage temperature.
6.0“Physical Dimensions”
Updated Figure 6-1, Figure 6-2, Figure 6-4 and Figure 6-5.
8.0“Module Placement Guidelines”
Updated Figure 8-1.
9.0“Ordering Information”
Updated Table 9-1 with certification information and added two part
numbers.
Appendix A:“Certification Notices”
Updated this section.
Revision A (January 2016)
• This is the initial released version of this
document.
2016-2022 Microchip Technology Inc.
DS60001380E-Page 47
BM78
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CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This website is used as a means
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Users of Microchip products can receive assistance
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Microchip’s customer notification service helps keep
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To register, access the Microchip website at
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registration instructions.
2016-2022 Microchip Technology Inc.
DS60001380E-page 48
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable" Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
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IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
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2016-2022 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-6683-0558-4
DS60001380E-page 49
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Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Israel - Ra’anana
Tel: 972-9-744-7705
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS60001380E-page 50
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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09/14/21
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