BPW272-1270-20AC11

Ball / Land Grid Array Sockets Screw Lock Type EP patents 0829188, 0897655 Patents pending in other countries. E-tec the Swiss connection E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards contacts with even larger parts currently in design. Some of the existing patterns are shown on the following pages, many more exist and your exact requirements can easily be added to our extensive product library. The SMD socket is simply placed and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional board space. The screw lock socket extends ≈ 6,00 mm beyond the outer ballrow with no fixing holes. We aim to solve your requirements - many different terminals and configurations are available. Your custom sets our standards! Please note, we will always request the chip data to ensure we offer a compatible socket. SMT Style PCB Pad Layout Ø 0,70mm/.028“ if pitch 1,27mm Ø 0,60mm/.023“ if pitch 1,00mm Ø 0,50mm/.019“ if pitch 0,80mm dimensions if BGA Socket pitch 1,27mm with contact type 30 Soldertail Style Soldertail: Ø 0,45mm/.017“ if pitch 1,27mm Ø 0,45mm/.017“ if pitch 1,00mm Ø 0,40mm/.015“ if pitch 0,80mm Specifications Mechanical data Contact life Retention System life Solderability Individual contact force Max. torque for retention screws 100000 cycles min. 100 cycles min. exceeds MIL-STD-202 Method 208 40 grams max. 7 cN per meter, or 10oz per inch Glass Epoxy FR 4 Brass BeCu < 30 mΩ 1 A max. >104 MΩ 1 KV min. < 5 nH −55°C to +130°C ; 220°C for 10 sec. PCB Hole Layaut PCB Hole: Ø 0,60mm/.024“ if pitch 1,27mm Ø 0,60mm/.024“ if pitch 1,00mm Ø 0,55mm/.021“ if pitch 0,80mm Material Insulator Terminal Contact Electrical data Contact resistance Current rating Insulation resistance at 500V DC Breakdown voltage at 60 Hz Inductance The pitch dimension depends on your Ball Grid Array Operating temperature How to order X X W xxxx - xx xx - xx XX xx Device Type B = Ball Grid L = Land Grid C = Column Grid Device Material C P = = Ceramic Plastic Pitch 07 08 10 12 15 = = = = = 0,75mm 0,80mm 1,00mm 1,27mm 1,50mm Grid Code Config Code please refer to the footprint pages 42 to 50 will be given by the factory after receipt of the chip datasheet Plating 01 = tin/gold Nbr of contacts refer to the next pages Contact Type 30 = standard SMD 29 = raised SMD 70 = solder tail ( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm & 0,80mm pitch ) ( „A“ = 5,00mm; other dim. on request ) ( „A“ = 3,30mm if 1,27mm pitch; 2,80mm if 1,00mm & 0,80mm pitch ) 38