BPW456-1270-26AB11

Ball / Land Grid Array Sockets Screw Lock Type EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following pages. Many more exist and your exact requirements can easily be added to our extensive product library. The SMT socket is simply placed and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with no fixing holes. We aim to solve your requirements - many different terminals and configurations are available. Your custom sets our standards! Please note, we will always request the chip data to ensure we offer a compatible socket. SMT Style Important Note: Please check the ball diameters & heights of your chip prior to ordering the standard E-tec BGA (BPW/BCW) sockets. Any deviation has to be communicated to E-tec in order to check compatibility with the standard socket design and if necessary to obtain a special order code adapted to your chip dimensions. The standard solderball diameters & heights are the following: Pitch 0.50mm 0.65mm 0.75mm & 0.80mm 1.00mm Ø 0,70mm/.028“ if pitch 1,27mm Ø 0,60mm/.023“ if pitch 1,00mm Ø 0,50mm/.019“ if pitch 0,80mm Ø 0,30mm/.012“ if pitch 0,50mm dimensions if BGA Socket pitch 1,27mm with contact type 30 Coplanarity 0,10mm/.004” PCB Pad Layout ball diameters min/max 0.25mm / 0.35mm 0.25mm / 0.50mm 0.40mm / 0.55mm 0.50mm / 0.70mm ball height min/max 0.15mm / 0.30mm 0.15mm / 0.30mm 0.25mm / 0.45mm 0.30mm / 0.50mm 0.50mm / 0.70mm 0.80mm / 1.00mm 1.27mm & 1.50mm a) plastic chips (BPW) 0.60mm / 1.00mm b) ceramic chips (BCW) 0.60mm / 1.00mm Specifications Soldertail Style Mechanical data Soldertail: Ø 0,45mm/.017” Ø 0,29mm/.011” Ø 0,29mm/.011” Ø 0,25mm/.010” if pitch 1,27mm if pitch 1,00mm if pitch 0,80mm if pitch 0,50mm Contact life Retention System life Solderability Individual contact force Max. torque for retention screws 10.000 cycles min. 1.000 cycles min. exceeds MIL-STD-202 Method 208 40 grams max. up to 800 pins = 7cN per meter or 10 oz per inch as of 800 pins = 7cN to 10cN per meter or 10 oz to 14 oz per inch Glass Epoxy FR 4 Brass BeCu Material PCB Hole Layout PCB solder hole: Ø 0,60mm/.024” Ø 0,50mm/.020” Ø 0,40mm/.016” Ø 0,35mm/.014” if pitch 1,27mm if pitch 1,00mm if pitch 0,80mm if pitch 0,50mm Insulator Terminal Contact Electrical data Contact resistance < 100 mΩ Current rating 500 mA max. Insulation resistance at 500V DC 100 MΩ if 0.50 to 0.80mm pitch 500 MΩ 1.00mm pitch upwards 500V min. Breakdown voltage at 60 Hz < 1 pF Capacitance < 2 nH Inductance Operating temperature Torque limiting screw driver Solder paste Solder profile −55°C to +130°C ; 220°C for 10 sec. Recommendations The pitch dimension depends on your Ball Grid Array Refer to page “Tools” of this catalog Please use a solderpaste w/o any silver! Please refer to our website www.e-tec.ch X X W xxxx - xx xx - xx XX xx How to order Device Type B = Ball Grid L = Land Grid C = Column Grid Device Material C P = Ceramic = Plastic 05 06 07 08 = = = = Pitch 0,50mm 0,65mm 0,75mm 0,80mm 10 = 1,00mm 12 = 1,27mm 15 = 1,50mm Grid Code Config Code please refer to the footprint pages 38 to 45 will be given by the factory after receipt of the chip datasheet Plating 01 = tin/gold Nbr of contacts please refer to the footprint pages 38 to 45 30 29 28 70 65 = = = = = Contact Type standard SMT… ( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm, 0.60 if 0,80mm pitch; 0,40mm if 0,50mm pitch ) raised SMT….....( „A“ = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm; 2,80mm if 0,80mm pitch, 2.30mm if 0.50mm pitch ) special raised SMT - only for 1.00 & 0.80mm pitch…..... ( „A“ = 4,50mm ) standard solder tail………...….( „A“ = 3.30 if 1.27mm pitch, 2.80 if 1.00mm or 0.80mm pitch, 2,30mm if 0.50mm pitch ) special short solder tail - only for 1,27mm pitch………...( „A“ = 2,80mm ) 34