BPW729-1230-27AB95L

Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed and reflowed onto the PCB in the same way as the chip and occupies only a small amount of additional board space. The 1.27mm pitch screw lock socket extends ≈ 6,00 mm beyond the outer ball row with no fixing holes. We aim to solve your requirements - many different terminals and configurations are available. Your custom sets our standards! Please note, we will always request the chip data to ensure we offer a compatible socket. SMT Style Important Note: Please check the ball diameters & heights of your chip prior to ordering the standard E-tec BGA (BPW, BCW) sockets. Any deviation has to be communicated to E-tec in order to check compatibility with the standard socket design and if necessary to obtain a special order code adapted to your chip dimensions. The standard solderball diameters & heights are the following: Pitch ball diameters ball height min/max min/max 0.50mm 0.25mm / 0.35mm 0.15mm / 0.30mm 0.65mm 0.25mm / 0.45mm 0.15mm / 0.30mm 0.75mm 0.25mm / 0.45mm 0.15mm / 0.40mm 0.80mm 0.40mm / 0.55mm 0.25mm / 0.45mm 1.00mm 0.50mm / 0.70mm 0.30mm / 0.50mm 1.27mm & 1.50mm a) plastic chips (BPW) 0.60mm / 1.00mm 0.50mm / 0.70mm b) ceramic chips (BCW) 0.60mm / 1.00mm 0.80mm / 1.00mm If the minimum ball diameter of a given chip falls below the above indications, then a BUW socket will generally be proposed. Mechanical data Specifications 10.000 cycles min. 1.000 cycles min. exceeds MIL-STD-202 Method 208 40 grams max. up to 800 pins = 7cNm or 10 oz-inch as of 800 pins = 7cNm to 10cNm or 10 oz to 14 oz-inch High temp plastic or epoxy FR4 Brass BeCu PCB Pad Layout Ø 0,60mm/.024“ if pitch 1,27mm Ø 0,50mm/.020“ if pitch 1,00mm Ø 0,40mm/.016“ if pitch 0,80mm Ø 0,35mm/.014“ if pitch 0,75mm Ø 0,35mm/.014“ if pitch 0,65mm Ø 0,30mm/.012“ if pitch 0,50mm You may request any specific socket dimension from info@e-tec.com For top view socket dimension pls. ref. to separate catalog page Soldertail Style Soldertail: Ø 0,42mm/.016” Ø 0,29mm/.011” Ø 0,29mm/.011” Ø 0,27mm/.010” Ø 0,27mm/.010” Ø 0,27mm/.010” if pitch 1,27mm if pitch 1,00mm if pitch 0,80mm if pitch 0,75mm if pitch 0,65mm if pitch 0,50mm Contact life Retention System life Solderability Individual contact force Max. torque for retention screws Material PCB Hole Layout PCB solder hole: Ø 0,60mm/.024” Ø 0,50mm/.020” Ø 0,40mm/.016” Ø 0,35mm/.014” Ø 0,35mm/.014” Ø 0,35mm/.014” if pitch 1,27mm if pitch 1,00mm if pitch 0,80mm if pitch 0,75mm if pitch 0,65mm if pitch 0,50mm Insulator (RoHS compliant) Terminal (RoHS compliant) Contact (RoHS compliant) Electrical data Contact resistance < 100 mΩ Current rating 500 mA max. Insulation resistance at 500V DC 100 MΩ if 0.50 to 0.80mm pitch 500 MΩ 1.00mm pitch upwards 500V min. Breakdown voltage at 60 Hz < 1 pF Capacitance < 2 nH Inductance Operating temperature Torque limiting screw driver Solder paste Solder profile −55°C to +125°C ; 260°C for 60 sec. Recommendations The pitch dimension depends on your Ball Grid Array Refer to page “Tools” of this catalog Please use a solder paste w/o any silver! Please refer to our website www.e-tec.com X X W x x x x - x x x x - x x X X 95 Device Type B = Ball Grid L = Land Grid C = Column Grid How to order L optional for locating pegs Device Material C = std. socket for P U ceramic device Pitch 05 06 07 08 = = = = 0,50mm 0,65mm 0,75mm 0,80mm 10 = 1,00mm 12 = 1,27mm 15 = 1,50mm Grid Code Config Code will be given by the factory after receipt of the chip datasheet Plating 95 = tin/gold (tin leadfree) = std. socket for plastic device = socket adapted to small diameter solderballs others on request Nbr of contacts depends on ballcount of chip 30 29 28 70 = = = = Contact Type standard SMT...( „A“ = 1,20mm if 1,27mm pitch; 0,80mm if 1,00mm pitch, 0.60 if 0,80mm pitch; 0,40mm if