DM160220

MTCH101 Single-Channel Proximity Detector Features: Package Type • Capacitive Proximity Detection System: - High Signal to Noise Ratio (SNR) - Adjustable sensitivity - Noise rejection filters - Automatic Environmental Compensation - Wide range of sensor shape and size support - Stuck Release Mechanism • No External Components • Low-Power mode • Response Time Down to 75 ms • Wide Operative Voltage: - 2.0V to 5.5V • Operating Temperature: - -40°C to +85°C The device is available in 6-lead SOT-23 packaging (see Figure 1). FIGURE 1: 6-PIN DIAGRAM MTI 1 Vss 2 MTSA 3 MTCH101 SOT-23 6 MTPM 5 VDD 4 MTO Applications: • • • • • • Light Switch Portable Device Enabler White Goods and Appliances Office Equipment and Toys Display and Keypad Backlighting Activation SAR Compliant Application  2012-2021 Microchip Technology Inc. TABLE 1: I/O 6-PIN SOT-23 PINOUT DESCRIPTION 6-Pin SOT-23 Description MTI 1 Proximity Sensor Input VSS 2 Ground MTSA 3 Sensitivity Adjust Input MTO 4 Detect Output (Active-Low) VDD 5 Power Supply Input MTPM 6 Low-Power mode Select (Active-Low) Preliminary DS40001664C-page 1 MTCH101 Table of Contents 1.0 Device Overview ........................................................................................................................................................................ 3 2.0 Typical Circuit ............................................................................................................................................................................ 4 3.0 Sensitivity Adjustment............................................................................................................................................................... 5 4.0 Power Mode............................................................................................................................................................................... 6 5.0 Reset.......................................................................................................................................................................................... 7 6.0 Interface with the Host ............................................................................................................................................................... 8 7.0 Detection Distance..................................................................................................................................................................... 9 8.0 Electrical Characteristics.......................................................................................................................................................... 10 9.0 Packaging Information ............................................................................................................................................................. 12 Index ........................................................................................................... ........................................................................................ 16 The Microchip Web Site ....................................................................................................................................................................... 17 Customer Change Notification Service ................................................................................................................................................ 17 Customer Support ................................................................................................................................................................................ 17 Product Identification System .............................................................................................................................................................. 18 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS40001664C-page 2 Preliminary  2012-2021 Microchip Technology Inc. MTCH101 1.0 DEVICE OVERVIEW The MTCH101 provides an easy way to add proximity or touch detection to any human interface application. The device integrates a single-channel capacitive proximity detection, which can work through plastic, glass or wood-front panel. It also supports a wide range of conductive materials as sensor, such as copper pad on PCB, silver or carbon printing on plastic, Indium Tin Oxide (ITO) pad, wire/cable, etc. On-board adjustable sensitivity and power mode selection allow the user to configure the device at run time easily. An active-low output will communicate the state of the sensor to a host MCU, or drive an indication LED (see Figure 1-1). FIGURE 1-1: BLOCK DIAGRAM Proximity Scan Driver Proximity Sensor ADC MTCH101  2012-2021 Microchip Technology Inc. Power Mode Control Proximity Decoding Data Filtering State Output Host/ Discrete Components Sensitivity Adjust Preliminary DS40001664C-page 3 MTCH101 2.0 TYPICAL CIRCUIT The MTCH101 can work either as a stand-alone device to control a LED (see Figure 2-1) to indicate touch/ proximity, or work with host MCU (see Figure 2-2). FIGURE 2-1: TYPICAL CIRCUIT AS STAND-ALONE Proximity Sensor VDD MTCH101 R3 1 R5 MTI MTPM 4.7k VDD VDD 2 VSS VDD R4 3 MTSA MTO VDD 5 C1 0.1 µF R1 R6 1k 4 10k R2 FIGURE 2-2: 10k 6 TYPICAL CIRCUIT WITH HOST MCU Proximity Sensor Host MTCH101 R1 1 MTI MTPM 6 VDD 5 VSS R2 3 Digital output 10k 4.7k 2 R3 MTSA VDD MTO C1 0.1 µF 4 VDD R4 4.7k Digital input 10k DAC output DS40001664C-page 4 Preliminary  2012-2021 Microchip Technology Inc. MTCH101 3.0 SENSITIVITY ADJUSTMENT FIGURE 3-3: The sensitivity of the system determines how far and fast it can respond to proximity or touch. The MTCH101 provides the MTSA pin to adjust the sensitivity, and the voltage on this pin will determine the sensitivity. VDD voltage will give the lowest sensitivity, while GND voltage will give the highest sensitivity. The device will sample the voltage on the MTSA pin after each scan, so it does not only support setting a fixed sensitivity by a resistor ladder, but it also allows adjusting the sensitivity dynamically, while the device is running. A Digital-to-Analog Converter (DAC) controlled by the host, or a hardware potentiometer can be used to adjust the sensitivity. See typical circuit in Figure 3-1 to Figure 3-4. FIGURE 3-1: SENSITIVITY CONTROLLED BY HOST USING DAC   Host DAC R2 MTSA 1 0k FIGURE 3-4: FIXED SENSITIVITY USING RESISTOR LADDER SENSITIVITY CONTROLLED BY HOST USING PWM VDD Host R1 R R3 PWM MTSA 10k R2 MTSA C Note: Both R1 and R2 are recommended to be greater than 100K for lower power consumption. FIGURE 3-2: HARDWARE SENSITIVITY ADJUST USING POTENTIOMETER Note 1: Application Note AN538, “Using PWM to Generate Analog Output” has details about how to choose appropriate R and C values. VDD R2 R1 MTSA 10k  2012-2021 Microchip Technology Inc. Preliminary DS40001664C-page 5 MTCH101 4.0 POWER MODE The MTCH101 has two power mode options: Normal mode and Low-Power mode. The state of the MTPM pin determines the power mode. 4.1 Normal Mode Option The device will run in Normal mode if the MTPM pin is set high and no proximity or touch is detected. In this mode, after an active scan, sleep time is between 69 and 105 ms, as shown in Figure 4-1. The sleep time depends on the VDD voltage, the lower the voltage, the more time it will be in the Idle state. FIGURE 4-1: NORMAL MODE Active Sleep: 69~105 ms Scan MTI 4.2 Low-Power Mode Option The device will run in Low-Power mode if the MTPM pin is set low and no proximity or touch is detected. In this mode, after an active scan, sleep time is between 572 and 845 ms, as shown in Figure 4-2. As in Normal mode, the sleep time depends on the VDD voltage, the lower the voltage, the more time it will be in the Idle state. FIGURE 4-2: Active Scan LOW-POWER MODE Sleep: 572~845 ms MTI Note: If the device makes a proximity or touch detection, it will automatically perform active scans continually. Once the device releases from its proximity-detected state, it will return to the power mode set by the MTPM pin. DS40001664C-page 6 Preliminary  2012-2021 Microchip Technology Inc. MTCH101 5.0 RESET 5.2 The MTCH101 can be stuck in a proximity-detected state in some cases, such as sudden temperature change, or higher dielectric materials (metal, wood or glass) present near the sensor. Two methods can be used to release the proximity-detected state without repowering the device. Reset by Touch and Release A stuck release mechanism is implemented for this device. When the device is stuck in a proximity-detected state, the user can touch the sensor pad and then release. This action will release the proximity-detected state (see Figure 5-2). FIGURE 5-2: 5.1 Reset by the MTPM pin Changing the state of the MTPM pin, either from low-to-high or from high-to-low, will reset the proximity detection system and release the detection state. If the device needs to keep the same power mode, then a pulse, which holds at least 4.5 ms, can be used to reset the device (see Figure 5-1). This reset method can be used at anytime during the operation, not only when the state is stuck in a proximity-detected state. FIGURE 5-1: RESET BY TOUCH AND RELEASE Finger touches the sensor pad RESET PULSE DURATION REQUIREMENT >4.5 ms Finger releases MTPM Low-Power mode >4.5 ms Normal mode MTPM Note: In non-detected state, because the device goes to Sleep for a certain time, the Reset pulse duration should be 4.5 ms plus the Sleep time.  2012-2021 Microchip Technology Inc. Preliminary DS40001664C-page 7 MTCH101 6.0 INTERFACE WITH THE HOST The MTO pin can be considered as an open drain output. A pull-up resistor (usually 3.3k~10 k) is needed to interface with a host. The pull-up voltage can be any voltage lower than VDD. This allows a simple interface with a lower VDD host device (see Figure 6-1). FIGURE 6-1: INTERFACE WITH THE HOST 10k MTO DS40001664C-page 8 R Host Digital Input Preliminay  2012-2021 Microchip Technology Inc. MTCH101 7.0 DETECTION DISTANCE FIGURE 7-1: DISTANCE vs. SENSOR AREA 7 Distance (inch) 6 5 4 3 2 1 0 1 1.5 2 2.5 3 Round Pad Diameter (inch) Note: The tested sensors are round solid pads on FR4 PCB. No ground plane was near the sensor, as this would give the maximum detection distance.  2012-2021 Microchip Technology Inc. Preliminary DS40001664C-page 9 MTCH101 8.0 ELECTRICAL CHARACTERISTICS 8.1 Absolute Maximum Ratings(†) Ambient temperature under bias ..........................................................................................................-40°C to +125°C Storage temperature ............................................................................................................................-65°C to +150°C Voltage on pins with respect to VSS on VDD pin ....................................................................................................................................0 to +6.5V on all other pins .......................................................................................................... -0.3V to (VDD + 0.3V) Max. current out of VSS pin .....................................................................................................................................80 mA into VDD pin ........................................................................................................................................80 mA Input clamp current, IIK (VI < 0 or VI > VDD) 20 mA Output clamp current, IOK (VO < 0 or VO > VDD) 20 mA Max. output current sunk by any I/O pin ............................................................................................................................25 mA sourced by any I/O pin .......................................................................................................................25 mA †NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 8.2 Standard Operating Conditions The standard operating conditions for any device are defined as: Operating Voltage: Operating Temperature: VDDMIN VDD VDDMAX TA_MIN TA TA_MAX VDD — Operating Supply Voltage(1) VDDMIN ......................................................................................................................................... +2.0V VDDMAX ........................................................................................................................................ +5.5V TA — Operating Ambient Temperature Range Industrial Temperature TA_MIN .......................................................................................................................................... -40°C TA_MAX ........................................................................................................................................ +85°C Note 1: See Parameter D001 in Table 8-1. DS40001664C-page 10 Preliminary  2012-2021 Microchip Technology Inc. MTCH101 The tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. Note: 8.3 DC Characteristics TABLE 8-1: MTCH101 (INDUSTRIAL) DC CHARACTERISTICS Param Sym. No. Standard Operating Conditions (unless otherwise specified) Characteristic Min. Typ† Max. Units D001 VDD Supply Voltage 2.0 — 5.5 V D002 VPOR VDD Start Voltage to ensure Power-on-Reset — Vss — V D003 SVDD VDD Rise Rate to ensure Power-on Reset 0.05* — — V/ms * Conditions These parameters are characterized but not tested. † Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. TABLE 8-2: RESPONSE TIME AND CURRENT CONSUMPTION Power Mode Typical Current (µA) Highest Sensitivity Response Time (ms) Lowest Sensitivity Response Time (ms) Typical Max. Typical Max. 120 100 150 210 260 Low-Power mode 30 790 890 900 1000 Normal mode 200 80 130 190 240 Low-Power mode 54 640 740 750 850 Normal mode 340 76 119 190 220 Low-Power mode 97 530 620 640 730 Normal mode  2012-2021 Microchip Technology Inc. Preliminary Conditions VDD = 2.0V VDD = 3.3V VDD = 5.0V DS40001664C-page 11 MTCH101 9.0 PACKAGING INFORMATION 9.1 Package Marking Information 6-Lead SOT-23 Example 20JR XXNN Legend: XX...X Y YY WW NNN e3 * Note: * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Standard PIC® device marking consists of Microchip part number, year code, week code, and traceability code. For PIC device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price. DS40001664C-page 12 Preliminary  2012-2021 Microchip Technology Inc. MTCH101 9.2 Package Details The following sections give the technical details of the packages. /HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>627@ 1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ b 4 N E E1 PIN 1 ID BY LASER MARK 1 2 3 e e1 D A A2 c φ L A1 L1 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$;  3LWFK H %6& 2XWVLGH/HDG3LWFK H %6& 2YHUDOO+HLJKW $  ± 0ROGHG3DFNDJH7KLFNQHVV $  ±   6WDQGRII $  ±  2YHUDOO:LGWK (  ±  0ROGHG3DFNDJH:LGWK (  ±  2YHUDOO/HQJWK '  ±  )RRW/HQJWK /  ±  )RRWSULQW /  ±  )RRW$QJOH  ƒ ± ƒ /HDG7KLFNQHVV F  ±  /HDG:LGWK E  ±  1RWHV  'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH  'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(