DSA1001/3/4
1.8V-3.3V Low-Power Precision CMOS Oscillators for Automotive
Features
General Description
• Automotive AEC-Q100 Qualified
• Frequency Range: 1 MHz to 150 MHz
• Exceptional Stability over Temperature
- ±20 ppm, ±25 ppm, ±50 ppm
• Operating Voltage
- 1.7 to 3.6V
• Operating Temperature Range
- Automotive Grade 2: –40°C to 105°C
- Automotive Grade 3: –40°C to 85°C
• Low Operating and Standby Current
- 6 mA Operating (1 MHz)
- 15 µA Standby (Max.)
• Ultra Miniature Footprint
- 2.5 mm x 2.0 mm x 0.85 mm
- 3.2 mm x 2.5 mm x 0.85 mm
- 5.0 mm x 3.2 mm x 0.85 mm
• MIL-STD 883 Shock and Vibration Resistant
• Pb Free, RoHS, Reach SVHC Compliant
The DSA1001/3/4 is a silicon MEMS based CMOS
family of oscillators that offers excellent jitter and
stability performance over a wide range of supply
voltages and temperatures. The device operates from
1 MHz to 150 MHz with supply voltages between 1.8 to
3.3 volts and temperature ranges up to –40°C to
105°C.
Applications
• Automotive Infotainment
• Automotive ADAS
• Automotive Camera Module
The DSA1001/3/4 incorporate an all silicon resonator
that is extremely robust and nearly immune to stress
related fractures, common to crystal based oscillators.
Without sacrificing the performance and stability
required of today’s systems, a crystal-less design
allows for a higher level of reliability, making the
DSA1001/3/4 ideal for rugged, industrial, and portable
applications where stress, shock, and vibration can
damage quartz crystal based systems.
Available in industry standard packages, the
DSA1001/3/4 can be “dropped-in” to the same PCB
footprint as standard crystal oscillators.
The DSA1003 and DSA1004 have the same
functionality and performance as the DSA1001, but
feature higher output drives of 25 pF and 40 pF,
respectively.
Package Types
DSA1001/3/4
CDFN/VDFN
(Top View)
Benefits
• Replace High Temperature Crystals and Quartz
Oscillators
• Pin for Pin “Drop-In” Replacement for Industry
Standard Oscillators
• Semiconductor Level Reliability, Significantly
Higher than Quartz
• Longer Battery Life/Reduced Power Consumption
• Compact Plastic Package
• Cost Effective
STANDBY#
GND
2018 - 2021 Microchip Technology Inc. and its subsidiaries
1
2
4
VDD
3
OUT
DS20005889B-page 1
DSA1001/3/4
Block Diagram
VDD
RESONATOR
OUTPUT
VCO
PFD
FRAC
-N
FRAC-N
PLL
STANDBY#
GND
(PIN1)
DS20005889B-page 2
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage (VIN) ............................................................................................................................–0.3V to VDD + 0.3V
ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM
Recommended Operating Conditions
Supply Voltage (VDD) ................................................................................................................................ +1.7V to +3.6V
Output Load (ZL) ............................................................................................................................. R > 10 kΩ, C ≤ 15 pF
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters
Frequency
Frequency Tolerance
Sym.
Min.
Typ.
Max.
Units
F0
1
—
150
MHz
Single Frequency
—
—
±20
—
—
±25
ppm
—
—
±50
Includes frequency variations
due to initial tolerance,
temperature and power supply
voltage
1 year @ +25°C
Δf
Conditions
Aging
Δf
—
—
±5
ppm
Supply Current, Standby
IDD
—
—
15
µA
T = +25°C
Output Startup Time
(Note 1)
tSU
—
1.0
1.3
ms
T = +25°C
Output Disable Time
tDA
—
20
100
ns
—
SYM
45
—
55
%
—
Input Logic Level High
VIH
0.75 x VDD
—
—
V
—
Input Logic Level Low
VIL
—
—
0.25 x VDD
V
—
—
6.0
6.3
—
6.5
7.1
—
7.2
8.5
—
8.3
11.9
0.8 x VDD
—
—
V
–6 mA, DSA1004, CL = 40 pF
0.8 x VDD
—
—
V
–6 mA, DSA1003, CL = 25 pF
0.8 x VDD
—
—
V
–4 mA, DSA1001, CL = 15 pF
—
—
0.2 x VDD
V
6 mA, DSA1004, CL = 40 pF
—
—
0.2 x VDD
V
6 mA, DSA1003, CL = 25 pF
—
—
0.2 x VDD
V
6 mA, DSA1001, CL = 15 pF
Output Duty Cycle
VDD = 1.8V
Supply Current, No Load
Output Logic Level High
Output Logic Level Low
IDD
VOH
VOL
1 MHz
mA
27 MHz
70 MHz
CL = 0 pF,
RL = ∞,
T = +25°C
150 MHz
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 3
DSA1001/3/4
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters
Output Transition Rise
Time
Output Transition Fall
Time
Jitter, Max.
Cycle-to-Cycle
Period Jitter
Sym.
Min.
Typ.
Max.
—
1.4
3.0
—
1.5
3.0
—
1.8
3.0
DSA1004,
CL = 40 pF
—
1.0
3.0
DSA1001,
CL = 15 pF
—
1.1
3.0
—
1.2
3.0
JCC
—
60
—
ps
f = 100 MHz (Note 2)
JP
—
10
15
psRMS
f = 100 MHz (Note 2)
—
6.0
6.4
—
6.7
7.5
—
7.7
9.4
—
9.6
13.9
0.9 x VDD
—
—
V
–6 mA, DSA1004, CL = 40 pF
0.8 x VDD
—
—
V
–6 mA, DSA1003, CL = 25 pF
0.8 x VDD
—
—
V
–4 mA, DSA1001, CL = 15 pF
—
—
0.1 x VDD
V
6 mA, DSA1004, CL = 40 pF
—
—
0.2 x VDD
V
6 mA, DSA1003, CL = 25 pF
—
—
0.2 x VDD
V
4 mA, DSA1001, CL = 15 pF
—
1.0
2.0
—
1.1
2.0
—
1.2
2.0
DSA1004,
CL = 40 pF
—
0.9
2.0
DSA1001,
CL = 15 pF
—
1.0
2.0
—
1.1
2.0
tR
tF
Units
Conditions
DSA1001,
CL = 15 pF
ns
ns
DSA1003,
CL = 25 pF
DSA1003,
CL = 25 pF
T = +25°C,
20% to 80%
T = +25°C,
20% to 80%
DSA1004,
CL = 40 pF
VDD = 2.5V
Supply Current, No Load
Output Logic Level High
Output Logic Level Low
Output Transition Rise
Time
Output Transition Fall
Time
IDD
VOH
VOL
tR
tF
1 MHz
mA
27 MHz
70 MHz
CL = 0 pF,
RL = ∞,
T = +25°C
150 MHz
DSA1001, CL =
15 pF
ns
ns
DSA1003,
CL = 25 pF
DSA1003,
CL = 25 pF
T = +25°C,
20% to 80%
T = +25°C,
20% to 80%
DSA1004,
CL = 40 pF
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
DS20005889B-page 4
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
TABLE 1-1:
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified.
Parameters
Jitter, Max.
Cycle-to-Cycle
Period Jitter
Sym.
Min.
Typ.
Max.
Units
Conditions
JCC
—
50
—
ps
f = 100 MHz (Note 2)
JP
—
5
10
psRMS
f = 100 MHz (Note 2)
—
6.0
6.5
—
6.8
8.0
—
8.2
10.5
—
10.8
16.6
0.9 x VDD
—
—
V
–8 mA, DSA1004, CL = 40 pF
0.9 x VDD
—
—
V
–6 mA, DSA1003, CL = 25 pF
0.8 x VDD
—
—
V
–4 mA, DSA1001, CL = 15 pF
—
—
0.1 x VDD
V
8 mA, DSA1004, CL = 40 pF
—
—
0.1 x VDD
V
6 mA, DSA1003, CL = 25 pF
—
—
0.2 x VDD
V
4 mA, DSA1001, CL = 15 pF
—
1.0
2.0
—
1.1
2.0
—
1.2
2.0
DSA1004,
CL = 40 pF
—
0.9
2.0
DSA1001,
CL = 15 pF
—
1.0
2.0
—
1.1
2.0
JCC
—
50
—
ps
f = 100 MHz (Note 2)
JP
—
5
10
psRMS
f = 100 MHz (Note 2)
VDD = 3.3V
Supply Current, No Load
Output Logic Level High
Output Logic Level Low
Output Transition Rise
Time
Output Transition Fall
Time
Jitter, Max.
Cycle-to-Cycle
Period Jitter
IDD
VOH
VOL
tR
tF
1 MHz
mA
27 MHz
70 MHz
CL = 0 pF,
RL = ∞,
T = +25°C
150 MHz
DSA1001,
CL = 15 pF
ns
ns
DSA1003,
CL = 25 pF
DSA1003,
CL = 25 pF
T = +25°C,
20% to 80%
T = +25°C,
20% to 80%
DSA1004,
CL = 40 pF
Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical
values.
2: Measured over 50k clock cycles.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 5
DSA1001/3/4
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
–40
—
+105
°C
Conditions
Temperature Ranges
Ordering Option L
Operating Temperature Range (T)
TA
–40
—
+85
°C
Ordering Option I
Junction Operating Temperature
TJ
—
—
+150
°C
—
Storage Temperature Range
TA
–55
—
+150
°C
—
Soldering Temperature Range
TS
—
—
+260
°C
40 sec. max
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
DS20005889B-page 6
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Symbol
Description
1
STANDBY#
2
GND
Power supply ground
3
OUT
Oscillator output
4
VDD
Positive power supply
Standby input (Section 4.1 “Standby Function”)
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 7
DSA1001/3/4
3.0
Note:
NOMINAL PERFORMANCE CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 3-1:
Supply Current.
FIGURE 3-4:
Supply Current.
FIGURE 3-2:
Rise Time.
FIGURE 3-5:
Fall Time.
FIGURE 3-3:
Rise Time.
FIGURE 3-6:
Fall Time.
DS20005889B-page 8
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
4.0
OUTPUT WAVEFORM
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
STANDBY#
FIGURE 4-1:
4.1
VIH
VIL
Output Waveform.
Standby Function
Standby# (Pin 1)
Output (Pin 3)
High Level
Output ON
Open (no connect)
Output ON
Low Level
High Impedance
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 9
DSA1001/3/4
5.0
TEST CIRCUIT
IDD
VDD
0.01μF
4
3
1
2
15pF
*VSD
*VSD = Standby# Logic Level Input
FIGURE 5-1:
DS20005889B-page 10
DSA1001/3/4 Test Circuit.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
6.0
BOARD LAYOUT (RECOMMENDED)
Via to GND Layer
C1
VDD
Standby
FIGURE 6-1:
Output
GND
Via to GND Layer
Recommended Board Layout for DSA1001/3/4.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 11
DSA1001/3/4
7.0
SOLDER REFLOW PROFILE
/Se
3C
.
ax
cM
/Se
3C
ReŇow
x.
25°C
FIGURE 7-1:
60-180
Sec
Ma
150°C
60-150
Sec
Sec
217°C
200°C
6C/
Temperature (°C)
cM
ax
.
260°C
20-40
Sec
Cool
Pre heat
Time
8 min max
Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
3°C/sec. max.
Preheat Time 150°C to 200°C
60 to 180 sec.
Time maintained above 217°C
60 to 150 sec.
Peak Temperature
255°C to 260°C
Time within 5°C of Actual Peak
20 to 40 sec.
Ramp-Down Rate
6°C/sec. max.
Time 25°C to Peak Temperature
8 minutes max.
DS20005889B-page 12
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
4-Lead CDFN/VDFN*
Example
XXXXXXX
DCPYYWW
0SSS
0200000
DCP1121
0603
Legend: XX...X
Y
YY
WW
NNN
e3
*
Product code, customer-specific information, or frequency in MHz
without printed decimal point
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 13
DSA1001/3/4
4-Lead VDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern
DS20005889B-page 14
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 15
DSA1001/3/4
DS20005889B-page 16
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
4-Lead VDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern
4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
C
A1
A
SEATING
PLANE
4X
0.08 C
SIDE VIEW
4X b
1
2
0.07
0.05
C A B
C
NOTE 1
L
N
L1
e
BOTTOM VIEW
Microchip Technology Drawing C04-1006A Sheet 1 of 2
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 17
DSA1001/3/4
4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
A
Overall Height
Standoff
A1
Overall Length
D
Overall Width
E
b
Terminal Width
L
Terminal Length
Terminal Pullback
L1
MIN
0.80
0.00
0.85
0.65
MILLIMETERS
NOM
4
2.10 BSC
0.85
0.02
3.20 BSC
2.50 BSC
0.90
0.70
0.10 REF
MAX
0.90
0.05
0.95
0.75
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1006A Sheet 2 of 2
DS20005889B-page 18
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
C
Y
1
2
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X4)
X
Contact Pad Length (X4)
Y
MIN
MILLIMETERS
NOM
2.10 BSC
1.60
MAX
1.00
0.85
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3006A
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 19
DSA1001/3/4
4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern
DS20005889B-page 20
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
APPENDIX A:
REVISION HISTORY
Revision A (March 2018)
• Initial release of data sheet DSA1001/3/4 to
Microchip format data sheet DS20005889A.
Revision B (November 2021)
• Updated the Product Identification System section
to reflect the Automotive Suffix on the part numbers.
• Updated two package options to VDFN and their
drawings to the current MCHP-spec drawings.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 21
DSA1001/3/4
NOTES:
DS20005889B-page 22
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DSA1001/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Part No.
X
X
X
-XXX.XXXX
X
VXX
Device
Package
Temp.
Range
Stability
Frequency
Media
Type
Automotive
Suffix
Device:
DSA1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS
Oscillator for Automotive
Package:
B
C
D
=
=
=
4-Lead 5.0 mm x 3.2 mm VDFN
4-Lead 3.2 mm x 2.5 mm VDFN
4-Lead 2.5 mm x 2.0 mm CDFN
Temperature
Range:
I
L
=
=
–40C to +85C (Automotive Grade 3)
–40C to +105C (Automotive Grade 2)
Stability:
1
2
3
=
=
=
±50 ppm
±25 ppm
±20 ppm
Frequency:
xxx.xxxx
Media Type:
=
T
=
110/Tube
1,000/Reel
Automotive Suffix:
Vxx
Automotive suffix in which “xx” is assigned by
Microchip. Default value is “AO” for the standard
automotive part.
=
= 1 MHz to 150 MHz (user-defined)
Examples:
a) DSA1003BL3-030.0000VAO:
DSA1003, 4-Lead 5.0 mm x 3.2 mm
VDFN, –40°C to +105°C Automotive
Grade 2 Temp. Range, ±20 ppm stability, 30 MHz Output Frequency,
110/Tube, Standard Automotive
b) DSA1004DI1-075.0000TVAO:
DSA1004, 4-Lead 2.5 mm x 2.0 mm
CDFN, –40°C to +85°C Automotive
Grade 3 Temp. Range, ±50 ppm stability, 75 MHz Output Frequency,
1,000/Reel, Standard Automotive
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
Please use the Microchip Clockworks to check AEC-Q100 compliance status and
build the exact part number.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
DS20005889B-page 23
DSA1001/3/4
NOTES:
DS20005889B-page 24
2018 - 2021 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
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IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
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BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
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all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018 - 2021, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2018 - 2021 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-5224-9310-5
DS20005889B-page 25
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DS20005889B-page 26
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