DSA1001DI2-100.0000T

DSA1001/3/4 1.8V-3.3V Low-Power Precision CMOS Oscillators for Automotive Features General Description • Automotive AEC-Q100 Qualified • Frequency Range: 1 MHz to 150 MHz • Exceptional Stability over Temperature - ±20 ppm, ±25 ppm, ±50 ppm • Operating Voltage - 1.7 to 3.6V • Operating Temperature Range - Automotive Grade 2: –40°C to 105°C - Automotive Grade 3: –40°C to 85°C • Low Operating and Standby Current - 6 mA Operating (1 MHz) - 15 µA Standby (Max.) • Ultra Miniature Footprint - 2.5 mm x 2.0 mm x 0.85 mm - 3.2 mm x 2.5 mm x 0.85 mm - 5.0 mm x 3.2 mm x 0.85 mm • MIL-STD 883 Shock and Vibration Resistant • Pb Free, RoHS, Reach SVHC Compliant The DSA1001/3/4 is a silicon MEMS based CMOS family of oscillators that offers excellent jitter and stability performance over a wide range of supply voltages and temperatures. The device operates from 1 MHz to 150 MHz with supply voltages between 1.8 to 3.3 volts and temperature ranges up to –40°C to 105°C. Applications • Automotive Infotainment • Automotive ADAS • Automotive Camera Module The DSA1001/3/4 incorporate an all silicon resonator that is extremely robust and nearly immune to stress related fractures, common to crystal based oscillators. Without sacrificing the performance and stability required of today’s systems, a crystal-less design allows for a higher level of reliability, making the DSA1001/3/4 ideal for rugged, industrial, and portable applications where stress, shock, and vibration can damage quartz crystal based systems. Available in industry standard packages, the DSA1001/3/4 can be “dropped-in” to the same PCB footprint as standard crystal oscillators. The DSA1003 and DSA1004 have the same functionality and performance as the DSA1001, but feature higher output drives of 25 pF and 40 pF, respectively. Package Types DSA1001/3/4 CDFN/VDFN (Top View) Benefits • Replace High Temperature Crystals and Quartz Oscillators • Pin for Pin “Drop-In” Replacement for Industry Standard Oscillators • Semiconductor Level Reliability, Significantly Higher than Quartz • Longer Battery Life/Reduced Power Consumption • Compact Plastic Package • Cost Effective STANDBY# GND  2018 - 2021 Microchip Technology Inc. and its subsidiaries 1 2 4 VDD 3 OUT DS20005889B-page 1 DSA1001/3/4 Block Diagram VDD RESONATOR OUTPUT VCO PFD FRAC -N FRAC-N PLL STANDBY# GND (PIN1) DS20005889B-page 2  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage (VIN) ............................................................................................................................–0.3V to VDD + 0.3V ESD Protection ....................................................................................................... 4 kV HBM, ±200V MM, 1.5 kV CDM Recommended Operating Conditions Supply Voltage (VDD) ................................................................................................................................ +1.7V to +3.6V Output Load (ZL) ............................................................................................................................. R > 10 kΩ, C ≤ 15 pF † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. Parameters Frequency Frequency Tolerance Sym. Min. Typ. Max. Units F0 1 — 150 MHz Single Frequency — — ±20 — — ±25 ppm — — ±50 Includes frequency variations due to initial tolerance, temperature and power supply voltage 1 year @ +25°C Δf Conditions Aging Δf — — ±5 ppm Supply Current, Standby IDD — — 15 µA T = +25°C Output Startup Time (Note 1) tSU — 1.0 1.3 ms T = +25°C Output Disable Time tDA — 20 100 ns — SYM 45 — 55 % — Input Logic Level High VIH 0.75 x VDD — — V — Input Logic Level Low VIL — — 0.25 x VDD V — — 6.0 6.3 — 6.5 7.1 — 7.2 8.5 — 8.3 11.9 0.8 x VDD — — V –6 mA, DSA1004, CL = 40 pF 0.8 x VDD — — V –6 mA, DSA1003, CL = 25 pF 0.8 x VDD — — V –4 mA, DSA1001, CL = 15 pF — — 0.2 x VDD V 6 mA, DSA1004, CL = 40 pF — — 0.2 x VDD V 6 mA, DSA1003, CL = 25 pF — — 0.2 x VDD V 6 mA, DSA1001, CL = 15 pF Output Duty Cycle VDD = 1.8V Supply Current, No Load Output Logic Level High Output Logic Level Low IDD VOH VOL 1 MHz mA 27 MHz 70 MHz CL = 0 pF, RL = ∞, T = +25°C 150 MHz Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 2: Measured over 50k clock cycles.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 3 DSA1001/3/4 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. Parameters Output Transition Rise Time Output Transition Fall Time Jitter, Max. Cycle-to-Cycle Period Jitter Sym. Min. Typ. Max. — 1.4 3.0 — 1.5 3.0 — 1.8 3.0 DSA1004, CL = 40 pF — 1.0 3.0 DSA1001, CL = 15 pF — 1.1 3.0 — 1.2 3.0 JCC — 60 — ps f = 100 MHz (Note 2) JP — 10 15 psRMS f = 100 MHz (Note 2) — 6.0 6.4 — 6.7 7.5 — 7.7 9.4 — 9.6 13.9 0.9 x VDD — — V –6 mA, DSA1004, CL = 40 pF 0.8 x VDD — — V –6 mA, DSA1003, CL = 25 pF 0.8 x VDD — — V –4 mA, DSA1001, CL = 15 pF — — 0.1 x VDD V 6 mA, DSA1004, CL = 40 pF — — 0.2 x VDD V 6 mA, DSA1003, CL = 25 pF — — 0.2 x VDD V 4 mA, DSA1001, CL = 15 pF — 1.0 2.0 — 1.1 2.0 — 1.2 2.0 DSA1004, CL = 40 pF — 0.9 2.0 DSA1001, CL = 15 pF — 1.0 2.0 — 1.1 2.0 tR tF Units Conditions DSA1001, CL = 15 pF ns ns DSA1003, CL = 25 pF DSA1003, CL = 25 pF T = +25°C, 20% to 80% T = +25°C, 20% to 80% DSA1004, CL = 40 pF VDD = 2.5V Supply Current, No Load Output Logic Level High Output Logic Level Low Output Transition Rise Time Output Transition Fall Time IDD VOH VOL tR tF 1 MHz mA 27 MHz 70 MHz CL = 0 pF, RL = ∞, T = +25°C 150 MHz DSA1001, CL = 15 pF ns ns DSA1003, CL = 25 pF DSA1003, CL = 25 pF T = +25°C, 20% to 80% T = +25°C, 20% to 80% DSA1004, CL = 40 pF Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 2: Measured over 50k clock cycles. DS20005889B-page 4  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VDD = 1.8 to 3.3V; TA = +85°C unless otherwise specified. Parameters Jitter, Max. Cycle-to-Cycle Period Jitter Sym. Min. Typ. Max. Units Conditions JCC — 50 — ps f = 100 MHz (Note 2) JP — 5 10 psRMS f = 100 MHz (Note 2) — 6.0 6.5 — 6.8 8.0 — 8.2 10.5 — 10.8 16.6 0.9 x VDD — — V –8 mA, DSA1004, CL = 40 pF 0.9 x VDD — — V –6 mA, DSA1003, CL = 25 pF 0.8 x VDD — — V –4 mA, DSA1001, CL = 15 pF — — 0.1 x VDD V 8 mA, DSA1004, CL = 40 pF — — 0.1 x VDD V 6 mA, DSA1003, CL = 25 pF — — 0.2 x VDD V 4 mA, DSA1001, CL = 15 pF — 1.0 2.0 — 1.1 2.0 — 1.2 2.0 DSA1004, CL = 40 pF — 0.9 2.0 DSA1001, CL = 15 pF — 1.0 2.0 — 1.1 2.0 JCC — 50 — ps f = 100 MHz (Note 2) JP — 5 10 psRMS f = 100 MHz (Note 2) VDD = 3.3V Supply Current, No Load Output Logic Level High Output Logic Level Low Output Transition Rise Time Output Transition Fall Time Jitter, Max. Cycle-to-Cycle Period Jitter IDD VOH VOL tR tF 1 MHz mA 27 MHz 70 MHz CL = 0 pF, RL = ∞, T = +25°C 150 MHz DSA1001, CL = 15 pF ns ns DSA1003, CL = 25 pF DSA1003, CL = 25 pF T = +25°C, 20% to 80% T = +25°C, 20% to 80% DSA1004, CL = 40 pF Note 1: tSU is time to stable output frequency after VDD is applied. tSU and tEN (after EN is asserted) are identical values. 2: Measured over 50k clock cycles.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 5 DSA1001/3/4 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units –40 — +105 °C Conditions Temperature Ranges Ordering Option L Operating Temperature Range (T) TA –40 — +85 °C Ordering Option I Junction Operating Temperature TJ — — +150 °C — Storage Temperature Range TA –55 — +150 °C — Soldering Temperature Range TS — — +260 °C 40 sec. max Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. DS20005889B-page 6  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin Number Symbol Description 1 STANDBY# 2 GND Power supply ground 3 OUT Oscillator output 4 VDD Positive power supply Standby input (Section 4.1 “Standby Function”)  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 7 DSA1001/3/4 3.0 Note: NOMINAL PERFORMANCE CHARACTERISTICS The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 3-1: Supply Current. FIGURE 3-4: Supply Current. FIGURE 3-2: Rise Time. FIGURE 3-5: Fall Time. FIGURE 3-3: Rise Time. FIGURE 3-6: Fall Time. DS20005889B-page 8  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 4.0 OUTPUT WAVEFORM tR tF VOH OUTPUT VOL tEN 1/fo tDA STANDBY# FIGURE 4-1: 4.1 VIH VIL Output Waveform. Standby Function Standby# (Pin 1) Output (Pin 3) High Level Output ON Open (no connect) Output ON Low Level High Impedance  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 9 DSA1001/3/4 5.0 TEST CIRCUIT IDD VDD 0.01μF 4 3 1 2 15pF *VSD *VSD = Standby# Logic Level Input FIGURE 5-1: DS20005889B-page 10 DSA1001/3/4 Test Circuit.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 6.0 BOARD LAYOUT (RECOMMENDED) Via to GND Layer C1 VDD Standby FIGURE 6-1: Output GND Via to GND Layer Recommended Board Layout for DSA1001/3/4.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 11 DSA1001/3/4 7.0 SOLDER REFLOW PROFILE /Se 3C . ax cM /Se 3C ReŇow x. 25°C FIGURE 7-1: 60-180 Sec Ma 150°C 60-150 Sec Sec 217°C 200°C 6C/ Temperature (°C) cM ax . 260°C 20-40 Sec Cool Pre heat Time 8 min max Solder Reflow Profile. MSL 1 @ 260°C refer to JSTD-020C Ramp-Up Rate (200°C to Peak Temp) 3°C/sec. max. Preheat Time 150°C to 200°C 60 to 180 sec. Time maintained above 217°C 60 to 150 sec. Peak Temperature 255°C to 260°C Time within 5°C of Actual Peak 20 to 40 sec. Ramp-Down Rate 6°C/sec. max. Time 25°C to Peak Temperature 8 minutes max. DS20005889B-page 12  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 8.0 PACKAGING INFORMATION 8.1 Package Marking Information 4-Lead CDFN/VDFN* Example XXXXXXX DCPYYWW 0SSS 0200000 DCP1121 0603 Legend: XX...X Y YY WW NNN e3 * Product code, customer-specific information, or frequency in MHz without printed decimal point Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 13 DSA1001/3/4 4-Lead VDFN 5.0 mm x 3.2 mm Package Outline & Recommended Land Pattern DS20005889B-page 14  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 15 DSA1001/3/4 DS20005889B-page 16  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 4-Lead VDFN 3.2 mm x 2.5 mm Package Outline & Recommended Land Pattern 4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.05 C 1 2X 2 TOP VIEW 0.05 C 0.10 C C A1 A SEATING PLANE 4X 0.08 C SIDE VIEW 4X b 1 2 0.07 0.05 C A B C NOTE 1 L N L1 e BOTTOM VIEW Microchip Technology Drawing C04-1006A Sheet 1 of 2  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 17 DSA1001/3/4 4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 Overall Length D Overall Width E b Terminal Width L Terminal Length Terminal Pullback L1 MIN 0.80 0.00 0.85 0.65 MILLIMETERS NOM 4 2.10 BSC 0.85 0.02 3.20 BSC 2.50 BSC 0.90 0.70 0.10 REF MAX 0.90 0.05 0.95 0.75 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-1006A Sheet 2 of 2 DS20005889B-page 18  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 4-Lead Very Thin Plastic Dual Flatpack No-Lead (H4A) - 3.2x2.5 mm Body [VDFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X 4 C Y 1 2 SILK SCREEN E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X4) X Contact Pad Length (X4) Y MIN MILLIMETERS NOM 2.10 BSC 1.60 MAX 1.00 0.85 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-3006A  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 19 DSA1001/3/4 4-Lead CDFN 2.5 mm x 2.0 mm Package Outline & Recommended Land Pattern DS20005889B-page 20  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 APPENDIX A: REVISION HISTORY Revision A (March 2018) • Initial release of data sheet DSA1001/3/4 to Microchip format data sheet DS20005889A. Revision B (November 2021) • Updated the Product Identification System section to reflect the Automotive Suffix on the part numbers. • Updated two package options to VDFN and their drawings to the current MCHP-spec drawings.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 21 DSA1001/3/4 NOTES: DS20005889B-page 22  2018 - 2021 Microchip Technology Inc. and its subsidiaries DSA1001/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. Part No. X X X -XXX.XXXX X VXX Device Package Temp. Range Stability Frequency Media Type Automotive Suffix Device: DSA1001/3/4: 1.8V - 3.3V Low-Power Precision CMOS Oscillator for Automotive Package: B C D = = = 4-Lead 5.0 mm x 3.2 mm VDFN 4-Lead 3.2 mm x 2.5 mm VDFN 4-Lead 2.5 mm x 2.0 mm CDFN Temperature Range: I L = = –40C to +85C (Automotive Grade 3) –40C to +105C (Automotive Grade 2) Stability: 1 2 3 = = = ±50 ppm ±25 ppm ±20 ppm Frequency: xxx.xxxx Media Type: = T = 110/Tube 1,000/Reel Automotive Suffix: Vxx Automotive suffix in which “xx” is assigned by Microchip. Default value is “AO” for the standard automotive part. = = 1 MHz to 150 MHz (user-defined) Examples: a) DSA1003BL3-030.0000VAO: DSA1003, 4-Lead 5.0 mm x 3.2 mm VDFN, –40°C to +105°C Automotive Grade 2 Temp. Range, ±20 ppm stability, 30 MHz Output Frequency, 110/Tube, Standard Automotive b) DSA1004DI1-075.0000TVAO: DSA1004, 4-Lead 2.5 mm x 2.0 mm CDFN, –40°C to +85°C Automotive Grade 3 Temp. Range, ±50 ppm stability, 75 MHz Output Frequency, 1,000/Reel, Standard Automotive Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. Please use the Microchip Clockworks to check AEC-Q100 compliance status and build the exact part number.  2018 - 2021 Microchip Technology Inc. and its subsidiaries DS20005889B-page 23 DSA1001/3/4 NOTES: DS20005889B-page 24  2018 - 2021 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. 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Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 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