DSC63XXB
Ultra-Small, Ultra-Low Power MEMS Oscillator with Spread Spectrum
Features
General Description
• Output Frequency: 1 MHz to 100 MHz LVCMOS
• Spread Spectrum Options:
- Center-Spread: ±0.25%, ±0.5%, ±1.0%,
±1.5%, ±2.0%, ±2.5%
- Down-Spread: –0.25%, –0.5%, –1.0%,
–1.5%, –2.0%, –3.0%
• Ultra-Low Power Consumption: 3 mA (Active),
1 A (Standby)
• Wide Supply Voltage Range: 1.71V ~ 3.63V VDD
• Ultra-Small Package Sizes:
- 1.6 mm 1.2 mm
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
• Wide Temperature Range:
- Automotive: –40°C to +125°C
- Ext. Industrial: –40°C to +105°C
- Industrial: –40°C to +85°C
- Ext. Commercial: –20°C to +70°C
• Excellent Shock and Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTBF than Quartz Oscillators
• Lead Free and RoHS Compliant
• Automotive AEC-Q100 Option Available
The DSC63xxB family of devices is the industry’s
smallest and lowest-power spread-spectrum MEMS
oscillators. Available in three different package sizes
with operating current as low as 3 mA, the smallest
4-pin package is a mere 1.6 mm x 1.2 mm in size. The
devices support up to ±2.5% or –3% spread spectrum
that can achieve up to 15 dB electromagnetic
interference (EMI) reduction. Because of industry
standard package and pin options, customers can
solve last minute EMI problems simply by placing the
new DSC63xxB on their current board layout with no
redesign required.
The DSC63xxB family is available in 1.6 mm x 1.2 mm
and 2.0 mm x 1.6 mm, and 2.5 mm x 2.0 mm
packages. These packages are “drop-in” replacements
for standard 4-pin CMOS quartz crystal oscillators.
Package Types
DSC63XXB
2.5 mm x 2.0 mm VLGA
2.0 mm x 1.6 mm VFLGA
1.6 mm x 1.2 mm VFLGA
(Top View)
OE/STDBY/SSEN
1
4
VDD
GND
2
3
OUT
Applications
•
•
•
•
Flat Panel Display/Monitor
Multi-Function Printer
Digital Signage
Consumer Electronics
2019 Microchip Technology Inc.
DS20006154A-page 1
DSC63XXB
Block Diagram
DSC63XXB
DIGITAL
CONTROL
SUPPLY
REGULATION
VDD
PIN 4
OE/STDBY/SSEN
PIN 1
SST
MEMS
RESONATOR
GND
PIN 2
DS20006154A-page 2
TEMP SENSOR
CONTROL &
COMPENSATION
PLL
VCO
OUTPUT
DIVIDER
DRIVER
OUTPUT
PIN 3
2019 Microchip Technology Inc.
DSC63XXB
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage .......................................................................................................................................... –0.3V to +4.0V
Input Voltage (VIN) ..............................................................................................................................–0.3V to VDD+0.3V
ESD Protection ............................................................................................................ 4 kV HBM, 400V MM, 2 kV CDM
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Voltage
VDD
1.71
—
3.63
V
Note 1
Power Supply Ramp
tPU
0.1
—
100
ms
Note 8
Active Supply Current
IDD
—
3.0
—
mA
fOUT = 27 MHz, VDD = 1.8V, No
Load
—
1
—
—
1.5
—
VDD = 1.8/2.5V, Note 2
Standby Supply Current
ISTBY
Output Duty Cycle
SYM
45
—
55
%
—
Frequency
f0
1
—
100
MHz
—
Frequency Stability
∆f
—
—
±20
±25
±50
ppm
All temp ranges, Note 3
Aging
∆f
—
—
±5
—
—
±1
Startup Time
tSU
—
—
1.5
ms
VIH
0.7 x VDD
—
—
V
Input Logic High, Note 4
VIL
—
—
0.3 x VDD
V
Input Logic Low, Note 4
ns
Note 5
Input Logic Levels
µA
ppm
VDD = 3.3V, Note 2
1st year @ 25°C
Per year after first year
From 90% VDD to valid clock
output, T = 25°C
Output Disable Time
tDA
—
—
200 +
2 Periods
Output Enable Time
tEN
—
—
1
µs
Note 6
OE/STDBY/SSEN Pull-up
Resistor
—
—
300
—
kΩ
If configured, Note 7
Note 1:
2:
3:
4:
5:
6:
7:
8:
Pin 4 VDD should be filtered with 0.1 µF capacitor.
Not including current through pull-up resistor on EN pin (if configured).
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to two periods of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Time to reach 90% of target VDD. Power ramp rise must be monotonic.
2019 Microchip Technology Inc.
DS20006154A-page 3
DSC63XXB
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VDD = 1.8V –5% to 3.3V +10%, TA = –40°C to +125°C.
Parameters
Sym.
VOH
Min.
0.8 x VDD
Typ.
—
Max.
—
Units
V
Output Logic Levels
VOL
—
—
0.2 x VDD
V
—
1
1.5
ns
—
0.5
1.0
ns
—
1.2
2.0
ns
—
0.6
1.2
ns
—
8.5
—
—
7
—
—
50
70
tRX/tFX
Output Transition Time
Rise Time/Fall Time
tRY/tFY
Period Jitter, RMS
Cycle-to-Cycle Jitter
(Peak)
JPER
JCy–Cy
Period Jitter
(Peak-to-Peak)
JPP
Spread Spectrum
Modulation Frequency
fSS
Note 1:
2:
3:
4:
5:
6:
7:
8:
—
35
60
—
70
—
—
60
—
—
33
—
Conditions
Output Logic High, I = 3 mA,
Std. Drive
Output Logic High, I = 6 mA,
High Drive
Output Logic Low, I = –3 mA,
Std. Drive
Output Logic Low, I = –6 mA,
High Drive
DSC61x2
VDD = 1.8V
High Drive,
20% to 80%
CL = 15 pF VDD = 2.5V/3.3V
DSC61x1
VDD = 1.8V
Std Drive,
20% to 80%
CL = 10 pF VDD = 2.5V/3.3V
fOUT =
psRMS 27 MHz,
Spread Off
ps
fOUT =
27 MHz,
Spread Off
ps
fOUT =
27 MHz,
Spread Off
kHz
VDD = 1.8V
VDD = 2.5V/3.3V
VDD = 1.8V
VDD = 2.5V/3.3V
VDD = 1.8V
VDD = 2.5V/3.3V
—
Pin 4 VDD should be filtered with 0.1 µF capacitor.
Not including current through pull-up resistor on EN pin (if configured).
Includes frequency variations due to initial tolerance, temp. and power supply voltage.
Input waveform must be monotonic with rise/fall time < 10 ms
Output Disable time takes up to two periods of the output waveform + 200 ns.
For parts configured with OE, not Standby.
Output is enabled if pad is floated or not connected.
Time to reach 90% of target VDD. Power ramp rise must be monotonic.
DS20006154A-page 4
2019 Microchip Technology Inc.
DSC63XXB
SPREAD SPECTRUM
Ordering Code
Spread Percentage
Spread Type
A
±0.25%
Center-Spread
B
±0.5%
Center-Spread
C
±1.0%
Center-Spread
D
±1.5%
Center-Spread
E
±2.0%
Center-Spread
F
±2.5%
Center-Spread
G
–0.25%
Down-Spread
H
–0.5%
Down-Spread
I
–1.0%
Down-Spread
J
–1.5%
Down-Spread
K
–2.0%
Down-Spread
L
–3.0%
Down-Spread
M
Custom
Center-Spread or Down-Spread
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
TJ
–40
—
+150
°C
—
Storage Ambient Temperature Range
TA
–55
—
+150
°C
—
Soldering Temperature
TS
—
+260
—
°C
40 sec. max.
Temperature Ranges
Junction Operating Temperature
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
2019 Microchip Technology Inc.
DS20006154A-page 5
DSC63XXB
2.0
PIN DESCRIPTIONS
The DSC63xxB is a highly configurable device and can be factory programmed in many different ways to meet the
customer’s needs. Microchip’s ClockWorks® Configurator http://clockworks.microchip.com/Timing/ must be used to
choose the necessary options, create the final part number, data sheet, and order samples. The descriptions of the pins
are listed in Table 2-1.
TABLE 2-1:
DSC63XXB PIN FUNCTION TABLE
Pin Number
Pin Name
1
(Note 1)
STDBY
SSEN
Spread Spectrum Enable: H = Enabled, L = Disabled.
2
GND
Ground.
3
Output
4
VDD
Note 1:
OE
Description
Output Enable: H = Active, L = Disabled (High Impedance).
Standby: H = Device is active, L = Device is in standby (Low Power Mode).
Oscillator clock output.
Power supply: 1.71V to 3.63V.
DSC630xB/1xB/3xB has a 300 kΩ internal pull-up resistor on pin 1. DSC634xB/5xB/7xB has no internal
pull-up resistor on pin 1 and needs an external pull-up or to be driven by another chip.
An explanation of the different options listed in Table 2-1 follows.
2.1
Pin 1
This is a control pin and may be configured to fulfill one
of three different functions. If not actively driven, a
10 kΩ pull-up resistor is recommended.
2.1.1
OUTPUT ENABLE (OE)
Pin 1 may be configured as OE. Oscillator output may
be turned on and off according to the state of this pin.
2.1.2
2.3
Output Buffer Options
The DSC63xx family is available in multiple output
driver configurations.
The standard-drive (63x1) and high-drive (63x2) deliver
respective output currents of greater than 3 mA and
6 mA at 20%/80% of the supply voltage. For heavy
loads of 15 pF or higher, the high-drive option is
recommended.
STDBY
Pin 1 may be configured as Standby. When the pin is
low, both output buffer and PLL will be off and the
device will enter a low power mode.
2.1.3
SPREAD SPECTRUM ENABLE
(SSEN)
This pin, when high, enables spread spectrum
modulation of the clock output. Various levels of
center-spread and down-spread are available. For
more details, see the Spread Spectrum section and the
spread spectrum ordering codes on the Product
Identification System.
2.2
Pins 2 through 4
Pins 2 and 4 are the supply terminals, GND and VDD
respectively. Pin 3 is the clock output, programmable to
Standard and High Drive strength settings. Visit
ClockWorks® Configurator to customize your device.
DS20006154A-page 6
2019 Microchip Technology Inc.
DSC63XXB
3.0
DIAGRAMS
tR
tF
VOH
OUTPUT
VOL
tEN
1/fo
tDA
VIH
ENABLE
FIGURE 3-1:
VIL
Output Waveform.
IDD
VDD
0.1μF
4
3
1
2
CL
VDA
FIGURE 3-2:
Test Circuit.
Via to GND Layer
C1
VDD
Enable
FIGURE 3-3:
Output
GND
Via to GND Layer
Recommended Board Layout.
2019 Microchip Technology Inc.
DS20006154A-page 7
DSC63XXB
4.0
SPREAD SPECTRUM
Spread spectrum is a slow modulation of the clock
frequency over time. The PLL inside the MEMS
oscillator is modulated with a triangular wave at
33 kHz. With such a slow modulation, the peak spectral
energy of both the fundamental and all the harmonics
is spread over a wider frequency range and such an
energy is significantly reduced, thus providing an EMI
reduction. The triangular wave is chosen because of its
flat spectral density.
The DSC63xxB MEMS oscillator family offers several
modulation options: the spreading is either
center-spread or down-spread with respect to the clock
frequency. Center-spread ranges from ±0.25% to
±2.5%, while down-spread ranges from –0.25% to
–3%.
FIGURE 4-2:
DSC6331 Spectrum at
33.333 MHz with Modulation Turned On.
If the clock frequency is 100 MHz and center-spread
with ±1% is chosen, the output clock will range from
99 MHz to 101 MHz. If down-spread with –2% is
chosen, the output clock will range from 98 MHz to
100 MHz.
It is noticeable that the spread spectrum provides a
reduction of about 10 dB from the peak power. Such a
reduction may also be estimated by the following
equation:
Figure 4-1 and Figure 4-2 show a spectrum example of
the DSC6331 with a 33.333 MHz clock, modulated with
center-spread of ±1%.
EQUATION 4-1:
EMI Reduction = 10 Log10 S fc RBW
Where:
S
Peak-to-peak spread percentage (0.01,
this example).
fc
Carrier frequency (33.333 MHz, this
example).
RBW
Resolution bandwidth of the spectrum
analyzer (30 kHz, this example).
The theoretical calculation for this example provides
10.45 dB, which is consistent with the measurement.
FIGURE 4-1:
DSC6331 Spectrum at
33.333 MHz with Modulation Turned Off.
DS20006154A-page 8
Similarly to the fundamental frequency, all the
harmonics are spread and attenuated in similar
fashion. Figure 4-3 shows how the DSC6331
fundamental at 33.333 MHz and its odd harmonics are
attenuated when various types of modulations are
selected. For picture clarity, only the center-spread
options are shown. However, down spread with
corresponding percentage provides the same level of
harmonic attenuation (e.g. center-spread of ±1%
provides the same harmonics attenuation of down
spread with –2%).
2019 Microchip Technology Inc.
DSC63XXB
FIGURE 4-3:
DSC6331 Harmonic Levels with Various Spread Spectrum Options.
2019 Microchip Technology Inc.
DS20006154A-page 9
DSC63XXB
SOLDER REFLOW PROFILE
.
5.0
ax
cm
se
ax
cm
se
3°
C/
Reflow
Pre-Heat
8 minutes max.
FIGURE 5-1:
ax.
25°C
60-180
Seconds
cm
150°C
60-150
Seconds
/se
.
3°
C/
217°C
200°C
6°C
Temperature (°C)
260°C
20-40
Seconds
Cool
Time
Solder Reflow Profile.
MSL 1 @ 260°C refer to JSTD-020C
Ramp-Up Rate (200°C to Peak Temp)
3°C/sec. max.
Preheat Time 150°C to 200°C
60 to 180 sec.
Time maintained above 217°C
60 to 150 sec.
Peak Temperature
255°C to 260°C
Time within 5°C of actual Peak
20 to 40 sec.
Ramp-Down Rate
6°C/sec. max.
Time 25°C to Peak Temperature
8 minutes max.
DS20006154A-page 10
2019 Microchip Technology Inc.
DSC63XXB
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
4-Lead VLGA*
2.5 x 2.0
XXXXXXX
XXXYYWW
SSS
4-Lead VFLGA*
2.0 x 1.6/1.6 x 1.2
XXXX
SSS
Legend: XX...X
Y
YY
WW
SSS
e3
*
Example
0400000
DCP1834
287
Example
011H
502
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
2019 Microchip Technology Inc.
DS20006154A-page 11
DSC63XXB
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
A1
A
C
SEATING
PLANE
4X
(A3)
0.08 C
SIDE VIEW
b2
3X b1
CH
1
2
CH
NOTE 1
0.07
0.03
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1199A Sheet 1 of 2
DS20006154A-page 12
2019 Microchip Technology Inc.
DSC63XXB
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
Terminal Pitch
e1
A
Overall Height
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
E
Overall Width
b1
Terminal Width
b2
Terminal Width
L
Terminal Length
Terminal 1 Index Chamfer
CH
MILLIMETERS
NOM
MAX
4
1.20 BSC
0.75 BSC
0.79
0.89
0.84
0.00
0.05
0.02
0.20 REF
1.60 BSC
1.20 BSC
0.25
0.30
0.35
0.325
0.425
0.375
0.30
0.40
0.35
0.125
MIN
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1199A Sheet 2 of 2
2019 Microchip Technology Inc.
DS20006154A-page 13
DSC63XXB
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E1
X1
G1
4
Y
C
G2
1
2
(CH)
SILK SCREEN
X2
E2
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E1
Contact Pitch
E2
Contact Spacing
C
Contact Width (X3)
X1
Contact Width
X2
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.20 BSC
1.16 BSC
0.75
MAX
0.35
0.43
0.50
0.85
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3199A
DS20006154A-page 14
2019 Microchip Technology Inc.
DSC63XXB
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
2
TOP VIEW
0.05 C
0.10 C
C
A1
A
SEATING
PLANE
4X
(A3)
SIDE VIEW
b2
3X b1
0.07
0.03
CH
1
0.08 C
2
CH
NOTE 1
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1200A Sheet 1 of 2
2019 Microchip Technology Inc.
DS20006154A-page 15
DSC63XXB
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
Terminal Pitch
e1
Overall Height
A
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
Overall Width
E
b1
Terminal Width
Terminal Width
b2
Terminal Length
L
Terminal 1 Index Chamfer
CH
MIN
0.79
0.00
0.30
0.40
0.50
-
MILLIMETERS
NOM
6
1.55 BSC
0.95 BSC
0.84
0.02
0.20 REF
2.00 BSC
1.60 BSC
0.35
0.45
0.55
0.15
MAX
0.89
0.05
0.40
0.50
0.60
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1200A Sheet 2 of 2
DS20006154A-page 16
2019 Microchip Technology Inc.
DSC63XXB
4-Lead Very Thin Fine Pitch Land Grid Array (ASA) - 2.0x1.6 mm Body [VFLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X1
4
Y
G2
C
1
2
(CH)
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Spacing
C
Contact Width (X4)
X1
Contact Width (X2)
X2
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.55 BSC
0.95
MAX
0.50
0.40
0.70
1.05
0.25
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3200A
2019 Microchip Technology Inc.
DS20006154A-page 17
DSC63XXB
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
NOTE 1
E
2X
0.05 C
1
2X
0.05 C
2
TOP VIEW
0.10 C
A1
C
A
SEATING
PLANE
(A3)
4X
SIDE VIEW
0.08 C
4X b1
CH
1
2
CH
NOTE 1
0.07
0.03
C A B
C
e1
e1
2
4X L
N
e
BOTTOM VIEW
Microchip Technology Drawing C04-1202A Sheet 1 of 2
DS20006154A-page 18
2019 Microchip Technology Inc.
DSC63XXB
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Terminal Pitch
e1
Terminal Pitch
Overall Height
A
Standoff
A1
Substrate Thickness (with Terminals) A3
Overall Length
D
Overall Width
E
Terminal Width
b1
Terminal Length
L
Terminal 1 Index Chamfer
CH
MIN
0.79
0.00
0.60
0.60
-
MILLIMETERS
NOM
4
1.65 BSC
1.25 BSC
0.84
0.02
0.20 REF
2.50 BSC
2.00 BSC
0.65
0.65
0.225
MAX
0.89
0.05
0.70
0.70
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1202A Sheet 2 of 2
2019 Microchip Technology Inc.
DS20006154A-page 19
DSC63XXB
4-Lead Very Thin Land Grid Array (AUA) - 2.5x2.0 mm Body [VLGA]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
4
Y
C
G2
1
2
(CH)
G1
SILK SCREEN
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Spacing
C
Contact Width (X4)
X
Contact Pad Length (X6)
Y
Space Between Contacts (X4)
G1
Space Between Contacts (X3)
G2
Contact 1 Index Chamfer
CH
MIN
MILLIMETERS
NOM
1.65 BSC
1.25
MAX
0.70
0.80
0.95
0.45
0.13 X 45° REF
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-3202A
DS20006154A-page 20
2019 Microchip Technology Inc.
DSC63XXB
APPENDIX A:
REVISION HISTORY
Revision A (January 2019)
• Initial creation of DSC63xxB Microchip data sheet
DS20006154A.
2019 Microchip Technology Inc.
DS20006154A-page 19
DSC63XXB
NOTES:
DS20006154A-page 20
2019 Microchip Technology Inc.
DSC63XXB
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
PART NO.
X
X
X
X
X
X
X – XXX.XXXX
X
Device Pin 1 Output Package Temp.
Freq. Spread Revision Frequency Media
Definition Drive
Type
Range Stability Spectrum
Strength
Device:
DSC63:
Pin Definition:
Selection
Pin 1
0
OE
Pull-up
1
STDBY
Pull-up
3
SSEN
Pull-up
4
OE
None
5
STDBY
None
7
SSEN
None
Output Drive
Strength:
1
2
Standard
High
Packages:
J
M
H
=
=
=
4-Lead 2.5 mm x 2.0 mm VLGA
4-Lead 2.0 mm x 1.6 mm VFLGA
4-Lead 1.6 mm x 1.2 mm VFLGA
Temperature
Range:
A
L
I
E
=
=
=
=
–40C to +125C (Automotive)
–40C to +105C (Extended Industrial)
–40C to +85C (Industrial)
–20C to +70C (Extended Commercial)
Frequency
Stability:
1
2
3
=
=
=
± 50 ppm
± 25 ppm
± 20 ppm
Spread Spectrum:
A
B
C
D
E
F
G
H
I
J
K
L
M
=
=
=
=
=
=
=
=
=
=
=
=
=
±0.25% Center-Spread
±0.5% Center-Spread
±1.0% Center-Spread
±1.5% Center-Spread
±2.0% Center-Spread
±2.5% Center-Spread
–0.25% Down-Spread
–0.5% Down-Spread
–1.0% Down-Spread
–1.5% Down-Spread
–2.0% Down-Spread
–3.0% Down-Spread
Custom
Revision:
B
=
Revision B
Frequency:
xxx.xxxx = User-Defined Frequency between
001.0000 MHz and 100.0000 MHz
Media Type:
=
=
T
=
B
=
Note 1:
Ultra-Small, Ultra-Low Power MEMS
Oscillator with Spread Spectrum
Internal Pull-Up Register
a) DSC6312JI2DB-100.0000:
Ultra-Small, Ultra-Low Power MEMS Oscillator with
Spread Spectrum, Pin 1 = STDBY with Internal PullUp, High Drive Strength, 4-Lead 2.5 mm x 2.0 mm
VLGA, Industrial Temperature, ±25 ppm Stability,
±1.5% Center-Spread, Revision B, 100 MHz
Frequency, 140/Tube
b) DSC6301HE1LB-016.0000T:
Ultra-Small, Ultra-Low Power MEMS Oscillator with
Spread Spectrum, Pin 1 = OE with Internal Pull-Up,
Standard Drive Strength, 4-Lead 1.6 mm x 1.2 mm
VFLGA, Extended Commercial Temperature, ±50 ppm
Stability, –3.0% Down-Spread, Revision B, 16 MHz
Frequency, 1,000/Reel
c) DSC6331MI2AB-050.5000B:
Ultra-Small, Ultra-Low Power MEMS Oscillator with
Spread Spectrum, Pin 1 = SSEN with Internal Pull-Up,
Standard Drive Strength, 4-Lead 2.0 mm x 1.6 mm
VFLGA, Industrial Temperature, ±25 ppm Stability,
±0.25% Center-Spread, Revision B, 50.5 MHz
Frequency, 3,000/Reel
Note 1:
Media Type identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with different media options.
140/Tube (J Package Option)
100/Bag (M & H Package Option)
1,000/Reel
3,000/Reel
Please visit Microchip ClockWorks® Configurator Website to configure the part number for customized frequency. http://clockworks.microchip.com/timing/.
2019 Microchip Technology Inc.
DS20006154A-page 21
DSC63XXB
NOTES:
DS20006154A-page 22
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4096-3
== ISO/TS 16949 ==
2019 Microchip Technology Inc.
DS20006154A-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
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Corporate Office
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DS20006154A-page 24
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2019 Microchip Technology Inc.
08/15/18
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