0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
DV102014

DV102014

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    -

  • 描述:

    PCAPWITH3DGESTIC(R)SENSING

  • 数据手册
  • 价格&库存
DV102014 数据手册
DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide  2016 Microchip Technology Inc. DS40001834A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS40001834A-page 2 Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0316-6  2016 Microchip Technology Inc. Object of Declaration: DV102014 Projected Capacitive with 3D GestIC® Sensing Development Kit  2016 Microchip Technology Inc. DS40001834A-page 3 Digital Power Starter Kit User’s Guide NOTES: DS40001834A-page 4  2016 Microchip Technology Inc. DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH 3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE Table of Contents Preface ........................................................................................................................... 7 Chapter 1. Overview 1.1 Introduction ................................................................................................... 13 1.2 Working Principle ......................................................................................... 13 Chapter 2. Getting Started 2.1 Setup ............................................................................................................ 16 2.2 Troubleshooting ............................................................................................ 25 Appendix A. Schematics A.1 2D and 3D Boards ....................................................................................... 27 A.2 Demonstrator Cross-Section Example ......................................................... 28 Worldwide Sales and Service .................................................................................... 31  2016 Microchip Technology Inc. DS40001834A-page 5 DV102014 Projected Capacitive Multi-touch with 3D GestIC® Sensing Development Kit User’s Guide NOTES: DS40001834A-page 6  2016 Microchip Technology Inc. DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH 3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/ or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit. Topics discussed in this chapter include: • • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Website Development Systems Customer Change Notification Service Customer Support Revision History DOCUMENT LAYOUT This user’s guide provides important details for using the projected capacitive 2D and 3D GestIC Sensing assembly as quick as possible. The document is organized as follows: • Chapter 1. “Overview” – provides details on the kit contents, theory of operation and the block diagram. • Chapter 2. “Getting Started” – includes information on the hardware and software setup, first-time parameterization and overview of the GUI. • Appendix A. “Schematics” – includes reference material for the schematics, recommendations for adding a display and details about the PCAP touch screen.  2016 Microchip Technology Inc. DS40001834A-page 7 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New Represents Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user DS40001834A-page 8 Examples File>Save Press , #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... }  2016 Microchip Technology Inc. Preface WARRANTY REGISTRATION Please complete the enclosed Warranty Registration Card and mail it promptly. Sending in the Warranty Registration Card entitles users to receive new product updates. Interim software releases are available at the Microchip website. RECOMMENDED READING This user’s guide describes how to configure the DV102014 Projected Capacitive with 3D GestIC assembly. Other useful documents are listed below. The following documents are available and recommended as supplemental reference resources: MTCH6303 Projected Capacitive Touch Controller Data Sheet (DS40001803) This data sheet provides specific information about the features and adjustable parameters of the MTCH6303, useful for configuring and tuning your application. MGC3030/3130 3D Tracking and Gesture Controller Data Sheet (DS40001667) This document provides specific information about the features and adjustable parameters of the MGC3130, useful for configuring and tuning your application. MTCH650/2 Programmable Voltage Boost with Built-in Level Shifters and Serial Interface with Output Enable (DS40001749) This document provides information to configure the MTCH652 in your application. For the 2D-3D AUREA Utility software application and more information about Microchip’s human interface portfolio, visit: www.microchip.com/DV102014. To obtain any of Microchip’s documents, visit the Microchip website at www.microchip.com.  2016 Microchip Technology Inc. DS40001834A-page 9 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide THE MICROCHIP WEBSITE Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com, click on Customer Change Notification and follow the registration instructions. The Development Systems product group categories are: • Compilers – The latest information on Microchip C compilers, assemblers, linkers and other language tools. These include all MPLAB C compilers; all MPLAB assemblers (including MPASM™ assembler); all MPLAB linkers (including MPLINK™ object linker); and all MPLAB librarians (including MPLIB™ object librarian). • Emulators – The latest information on Microchip in-circuit emulators.This includes the MPLAB REAL ICE™ and MPLAB ICE 2000 in-circuit emulators. • In-Circuit Debuggers – The latest information on the Microchip in-circuit debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit™ 3 debug express. • MPLAB® IDE – The latest information on Microchip MPLAB IDE, the Windows® Integrated Development Environment for development systems tools. This list is focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and MPLAB SIM simulator, as well as general editing and debugging features. • Programmers – The latest information on Microchip programmers. These include production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included are non-production development programmers such as PICSTART® Plus and PICkit 2 and 3. DS40001834A-page 10  2016 Microchip Technology Inc. Preface CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support. REVISION HISTORY Revision A (February 2016) Initial release of this document.  2016 Microchip Technology Inc. DS40001834A-page 11 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide NOTES: DS40001834A-page 12  2016 Microchip Technology Inc. DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH 3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE Chapter 1. Overview 1.1 INTRODUCTION Microchip’s DV102014 development kit builds a complete reference system for evaluation and design of 2D multi-touch and 3D gesture human-machine interfaces. This combination enables user command input with multi-touch detection on surfaces as well as natural hand movements in free space. The kit content is described below: • 2D/3D Electronics Board with Microchip parts: - MTCH6303 2D PCAP (Projected Capacitive) controller - MGC3130 3D GestIC® controller - MTCH652 high-voltage driver • 2D/3D Sensor Module - 8" PCAP touch screen - 3D Printed Circuit Board (PCB) electrodes • Micro-USB cable 1.2 WORKING PRINCIPLE This combined 2D/3D technology solution uses Microchip’s MTCH6303 2D PCAP Controller, the MGC3130 3D GestIC Controller, and the MTCH652 High-Voltage Driver. The system works in Time-Multiplex mode that dynamically detects 2D and 3D operations. FIGURE 1-1: BLOCK DIAGRAM 2D RX I2C TS MCLR Mode 2D3D Sync (1 ms) USB I2C MGC3130 MTCH6303 3D RX 3D: North 3D TX PWM SPI OE 2D3D TX OSCIN MTCH652 3D: West 2D TX Touchscreen 3D: East HOST 3D: South  2016 Microchip Technology Inc. DS40001834A-page 13 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide NOTES: DS40001834A-page 14  2016 Microchip Technology Inc. DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH 3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE Chapter 2. Getting Started Follow the following steps to get started: 1. Download and install the 2D/3D design-in utility AUREA 2.x to your Windows® 7/8/10 PC from www.microchip.com/DV102014. 2. Connect the micro-USB cable to the 2D/3D Electronics Board and your PC, as shown in Figure 2-1. FIGURE 2-1: BACKSIDE VIEW 3. Carefully turn the assembled hardware over and lay on a flat table surface. The six stand-offs support the hardware, creating a flat level touch surface. FIGURE 2-2:  2016 Microchip Technology Inc. TOPSIDE VIEW DS40001834A-page 15 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide 2.1 SETUP 1. Launch the Aurea 2.x Software Utility, (note the green check on the USB symbol to indicate a successful connection ). 2. Navigate to the Setup tab and select 3D Parameterization (see Figure 2-3). FIGURE 2-3: DS40001834A-page 16 SETUP TAB  2016 Microchip Technology Inc. Getting Started 3. Select Start Autoparameterization (this step automatically optimizes the settings for the development kit by pushing the Autoparameterization button). FIGURE 2-4: AUTOPARAMETERIZE  2016 Microchip Technology Inc. DS40001834A-page 17 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide 4. The signals can be noticed in Figure 2-5 coming together and running through the center of the graph on the sample point (the dotted vertical line on the right side). 5. Once this happens, click Flash to save the new automatically-tuned parameters. FIGURE 2-5: DS40001834A-page 18 FLASH NEW SETTINGS  2016 Microchip Technology Inc. Getting Started 6. The Flash button will display a green check mark; exit this screen using the Exit button. FIGURE 2-6: EXIT AUTOPARAMETERIZATION  2016 Microchip Technology Inc. DS40001834A-page 19 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide 7. Navigate to the Colibri Suite tab to demonstrate 2D and 3D capabilities, as briefly described below. See the utility documentation for a more detailed introduction to the various built-in features. FIGURE 2-7: DS40001834A-page 20 COLIBRI SUITE TAB  2016 Microchip Technology Inc. Getting Started 8. The Colibri Suite tab allows the user to turn on/off the 2D and 3D gesture reporting. These controls are found on the left side of the program and help simulate the conditions and features of the user’s application. Gestures that are performed by the user are seen in the Gesture output window in the bottom right corner. FIGURE 2-8: COLIBRI SUITE – 2D AND 3D GESTURES  2016 Microchip Technology Inc. DS40001834A-page 21 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide 9. Real-time position data is provided in the other three windows. The Auto-default setting presents the real-time 2D or 3D data transmitted by the electronics. Selecting 2D or 3D will limit the output window visualization to the desired setting. FIGURE 2-9: DS40001834A-page 22 COLIBRI SUITE – 2D AND 3D DATA  2016 Microchip Technology Inc. Getting Started 10. Use your finger(s) to draw a circle on the touch screen surface area inside the black borders and verify that the points in the top center 2D Measurement window follow your circular motion. FIGURE 2-10: COLIBRI SUITE – 2D TEST  2016 Microchip Technology Inc. DS40001834A-page 23 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide 11. Use your hand to swipe left to right over the 2D/3D sensor module. Verify that the red gesture arrows follow your movements in the bottom right Gestures window. The hand distance should be ~10 cm (up to 20 cm) above the sensor. Always check that the desired gesture is actually activated in the 2D and/or 3D overview on the left side of the screen. FIGURE 2-11: DS40001834A-page 24 COLIBRI SUITE – 3D TEST  2016 Microchip Technology Inc. Getting Started 2.2 TROUBLESHOOTING • In case of problems, make sure the 2D/3D electronics board connection is secure; a loose connection may result in poor performance (see Figure 2-12). • Check the AUREA HTML documentation for the latest news on the available code updates for the MTCH6303 and MGC3130 devices. FIGURE 2-12: TROUBLESHOOTING – CHECK CONNECTIONS • References: additional information about Microchip’s 2D and 3D electronic solutions may be found on the Microchip website at: - MTCH6303 – 2D PCAP touch controller www.microchip.com/mtch6303 - MGC3130 – 3D GestIC® controller www.microchip.com/mgc3130 - MTCH652 – High-voltage driver www.microchip.com/mtch652  2016 Microchip Technology Inc. DS40001834A-page 25 DV102014 Projected Capacitive Multi-Touch with 3D GestIC® Sensing Development Kit User’s Guide NOTES: DS40001834A-page 26  2016 Microchip Technology Inc. DV102014 PROJECTED CAPACITIVE MULTI-TOUCH WITH 3D GestIC® SENSING DEVELOPMENT KIT USER’S GUIDE Appendix A. Schematics A.1 2D AND 3D BOARDS FIGURE A-1: 2D/3D ELECTRONICS BOARD – DIMENSIONS (mm) Full schematics, BOM and gerbers are available on the DV102014 Development Kit website www.microchip.com/DV102014.  2016 Microchip Technology Inc. DS40001834A-page 27 Schematics FIGURE A-2: 3D PCB ELECTRODES – DIMENSIONS (mm) The 3D electrode consists of 2 parts: a) inner frame = electrodes b) outer frame = mounting frame * Optional feature: 12 break-away points for removing mounting frame A.2 DEMONSTRATOR CROSS-SECTION EXAMPLE When building up a demo, the following mechanical setup can be used: FIGURE A-3: MECHANICAL SETUP WITH DISPLAY 2-component Epoxy glue Double adhesive GIC-El Coverglass Touchpanel-Stackup GIC-El Display PCB Full schematics, BOM and gerbers are available on the DV102014 Development Kit website www.microchip.com/DV102014. DS40001834A-page 28  2016 Microchip Technology Inc. DV102014 SCHEMATIC USB Connector + Power Supply Touchpanel Interface Series Resistors for Touch-RX-Channels VBUS 6 5 4 R1 10R 0603 5% VBUS054B-HS3-GS08 10R 0603 5% R3 VIN C1 VOUT GND 2 1 10uF 25V 0805 D- D1 VDD C2 GND GND GND LD1 47uF 6.3V 0805 D+ 1 2 3 USB MICRO-AB Female MCP1703T-3302E/CB 3 VUSB FB1 J2 U1 FERRITE 12A 0.05R SMD 0603 1 VBUS 2 D3 D+ 4 ID 5 GND GND BLUE PGC/RX15 PGD/RX16 RX17 RX18 R4 1.8k 0603 1% 4 3 2 1 5 6 7 8 SRX15 SRX16 SRX17 SRX18 RX19 RX20 RX21 RX22 GND 4 3 2 1 5 6 7 8 SRX19 SRX20 SRX21 SRX22 Touch Controller U2 5 6 7 8 SRX23 SRX24 SRX25 SRX26 VDD 7 10k 0603 5% VUSB 34 VDD C3 0.1uF 25V 0603 35 VDD MCLR VUSB3V3 57 VDD 26 VDD 38 VDD 10 VDD GND 19 20 AVDD AVSS 9 VSS 25 VSS 41 VSS C4 10uF 25V 0805 56 65 16 15 14 13 12 11 17 18 21 22 23 24 27 28 29 30 PGD/RX16 PGC/RX15 RX14 RX13 RX12 RX11 RX17 RX18 RX19 RX20 RX21 RX22 RX23 RX24 RX25 RX26 40 OSC2/CLKO/RC15 48 SOSCO/RPC14/T1CK/RC14 47 SOSCI/RPC13/RC13 39 OSC1/CLKI/RC12 OSC2 COMM_SEL MGC_Sync OSC1 PGED1/VREF+/CVREF+/AN0/RPB0/PMA6/RB0 PGEC1/VREF-/CVREF-/AN1/RPB1/CTED12/RB1 PGEC3/AN2/C2INB/RPB2/CTED13/RB2 PGED3/AN3/C2INA/RPB3/RB3 AN4/C1INB/RB4 AN5/C1INA/RPB5/VBUSON/RB5 PGEC2/AN6/RPB6/RB6 PGED2/AN7/RPB7/CTED3/RB7 AN8/RPB8/CTED10/RB8 AN9/RPB9/CTED4/PMA7/RB9 TMS/CVREFOUT/AN10/RPB10/CTED11/PMA13/RB10 TDO/AN11/PMA12/RB11 TCK/AN12/PMA11/RB12 TDI/AN13/PMA10/RB13 AN14/RPB14/CTED5/PMA1/RB14 AN15/RPB15/OCFB/CTED6/PMA0/RB15 VBUS VCAP Thermal Pad 1k 0804 5% 37 D+ 36 D- UART_TX UART_RX RPD11/PMCS1/RD11 RPD10/SCL1/PMCS2/RD10 RPD9/SDA1/RD9 RPD8/RTCC/RD8 RD7 RD6 RPD5/PMRD/RD5 RPD4/PMWR/RD4 AN26/RPD3/RD3 AN25/RPD2/SCK1/RD2 AN24/RPD1/RD1 RPD0/INT0/RD0 58 RPF0/RF0 59 TRCLK/RPF1/RF1 33 USBID/RPF3/RF3 31 RPF4/SDA2/PMA9/RF4 32 RPF5/SCL2/PMA8/RF5 SDA SCL RX10 RX9 RX8 RX7 AN27/PMD7/RE7 AN23/PMD6/RE6 AN22/RPE5/PMD5/RE5 AN21/PMD4/RE4 TRD3/RPE3/CTPLS/PMD3/RE3 TRD2/AN20/PMD2/RE2 TRD1/PMD1/RE1 TRD0/PMD0/RE0 8 AN19/C2INC/RPG9/PMA2/RG9 6 AN18/C2IND/RPG8/PMA3/RG8 5 AN17/C1INC/RPG7/PMA4/RG7 4 AN16/C1IND/RPG6/SCK2/PMA5/RG6 45 44 43 42 55 54 53 52 51 50 49 46 3 2 1 64 63 62 61 60 RX8 RX9 RX10 4 3 2 1 RX11 RX12 RX13 RX14 4 3 2 1 5 6 7 8 SRX4 SRX5 SRX6 SRX7 5 6 7 8 SRX8 SRX9 SRX10 5 6 7 8 SRX11 SRX12 SRX13 SRX14 SRX26 SRX25 SRX24 SRX23 SRX22 SRX21 SRX20 SRX19 SRX18 SRX17 SRX16 SRX15 SRX14 SRX13 SRX12 SRX11 SRX10 SRX9 SRX8 SRX7 SRX6 SRX5 SRX4 SRX3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 TX0 TX1 TX2 TX3 TX4 TX5 TX6 TX7 TX8 TX9 TX10 TX11 TX12 TX13 TX14 TX15 TX16 TX17 TX18 SRX0 SRX1 SRX2 X1 FFC/FPC 50P Female C8 18pF 50V 0603 18pF 50V 0603 GND GND VDD VDD 25 VDD 24 VSS L1 3 2.2uH BOOST_OE1 BOOST_LE1 BOOST_DIN BOOST_CLK BOOST_PWM GND 0603 R13 DNP 0R 26 29 GND R12 0R GND 0.1uF 25V 0603 1uF 50V 0805 VUSB VPP C5 C6 C7 GND MNT I2C Port PCAP Voltage Booster BOOST_DIN MGC_SCL MGC_SDA MGC_TS BOOST_LE2 BOOST_LE1 BOOST_OE2 BOOST_OE1 RX1 BOOST_CLK RX0 BOOST_PWM GND R11 8MHz D+ D- GND 4 3 2 1 SRX0 SRX1 SRX2 SRX3 R9 R10 MCLR R7 4 3 2 1 RX4 RX5 RX6 RX7 GND 5 6 7 8 R6 R8 RX23 RX24 RX25 RX26 4 3 2 1 R2 R5 GND RX0 RX1 RX2 RX3 0603 EX_PAD LC 11 OE 12 LE 13 DIN 14 CLK 10 OSCIN 100k 0603 5% C10 0.1uF 25V 0603 GND OUT00 OUT01 OUT02 OUT03 OUT04 OUT05 OUT06 OUT07 OUT08 OUT09 OUT10 OUT11 OUT12 OUT13 OUT14 OUT15 OUT16 OUT17 OUT18 R14 C9 RX6 RX5 RX4 RX3 IRQ RX2 MGC_MCLR MGC_Mode VPP 1uF 50V 0805 J3 IRQ VDD TX16 TX15 TX14 TX13 TX12 TX11 TX10 TX9 TX8 TX7 TX6 TX5 TX4 TX3 TX2 TX1 TX0 TX18 TX17 SDA SCL MCLR GND 1 2 3 4 5 6 HDR-2.54 Male 1x6 ICSPŒ J4 MCLR VDD PGD/RX16 PGC/RX15 GND U3 MTCH652 QFN-28 GND GND 7 6 5 4 2 1 28 27 23 22 21 20 19 18 17 16 15 9 8 1 2 3 4 5 6 DNP HDR-1.27 Male 1x6 GestICElectrodeConnector C11 12pF GIC_RX0 MTCH6303-I/RG R16 MOV1 GND 5V 0402 MOV2 J7 5V 0402 1 2 3 4 5 J1 0  2016 Microchip Technology Inc. FIGURE A-4: 10k GestICŠChipandElectrodeConnector C20 BOOST_OE1 J6 12pF VDD MGC_MCLR keep PIC in Reset, when connecting with I2C bridge (J4: MCLR-GND) VDD_GestIC C13 0.1uF 25V 0603 C14 C15 0.1uF 25V 0603 0.1uF 25V 0603 C16 0.1uF 25V 0603 VDD C17 0.1uF 25V 0603 R20 1.8k 0603 1% J9 DNP Pin 10,26,38,57,19 1 2 3 4 5 6 GND R21 1.8k 0603 1% R22 10k 0603 5% R32 R23 24 28 VDD_GestIC 0R 0603 0.1uF 25V 0603 C12 10k 0603 5% MGC_TS HDR-1.27 Male 1x6 C18 C19 VDD_GestIC 4.7uF 10V 0603 4.7uF 10V 0603 *NO STUFF* 20 SI0 21 SI1 22 SI2 23 SI3 2 VINDS 1 VCAPS 12 EIO0 13 EIO1 14 EIO2 19 EIO3 16 NC 17 NC 18 NC 26 NC NC3 NC2 NC1 GND 25 4 RX0 5 RX1 6 RX2 7 RX3 8 RX4 IS2 15 10k R18 DNP 0R 0603 GIC_RX0 GIC_RX1 GIC_RX2 GIC_RX3 MGC_SDA MGC_SCL SI2 MGC_Sync R19 0R 0603 C21 GND 12pF GIC_RX2 MGC_TS EIO1 MGC_Mode EIO3 10k 12pF IS2 BOOST_LE2 TP2 BOOST_CLK TP3 BOOST_LE1 TP4 MGC_Sync TP5 BOOST_OE1 TP6 MGC_Mode SI2 TP8 TP9 BOOST_PWM TP10 TP11 GND GND VDD EIO1 R30 IS2 10k 0603 5% R28 DNP 0R 0603 MOV3 GestIC Interface Selection 10k 0603 5% GND COMM_SEL 5V 0402 GND 5V 0402 MOV5 5V 0402 GND DNP: Do Not Populate GND R29 0R 0603 MOV4 R31 J8, J10, J11: Improve mechanical stability COMM_SEL: J8 GND -> USB communciation VDD -> I2C communciation 3 2 1 3 2 1 HDR-2.54 Female 1x3 HDR-2.54 Female 1x3 J10 J11 1 2 DS40001834A-page 29 BOOST_OE2 TP1 TP12 R25 10k Communication Select TP7 R24 C22 GIC_RX3 Test Points EIO3 R17 HDR-2.54 Female 1x2 Schematics GND GND TXD VDD 9 VCAPA 11 VCAPD GND MGC_SDA MGC_SCL MGC_MCLR MCLR 27 VSS1 3 VSS2 10 VSS3 29 EPAD GIC_RX1 33k 0603 5% U4 MGC3130 GestICŠInterface 1 2 3 4 5 R15 PICŠDecouplingCaps DNP 2D 8” PROJECTED CAPACITIVE TOUCH PANEL – PART NUMBER TXP080BA02  2016 Microchip Technology Inc. The downloadable PDF is available on the DV102014 development kit website www.microchip.com/DV102014. DV102014 Projected Capacitive Multi-touch with 3D GestIC® Sensing Development Kit User’s Guide DS40001834A-page 30 FIGURE A-5: Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 India - Pune Tel: 91-20-3019-1500 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Venice Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 07/14/15  2016 Microchip Technology Inc. DS40001834A-page 31
DV102014 价格&库存

很抱歉,暂时无法提供与“DV102014”相匹配的价格&库存,您可以联系我们找货

免费人工找货