EMC1428-1-AP-TR

EMC1428 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones PRODUCT FEATURES Data Sheet General Description Features The EMC1428 is a high accuracy, low cost, System Management Bus (SMBus) temperature sensor. Advanced features such as Resistance Error Correction (REC), Beta Compensation (to CPU diodes requiring the BJT or transistor model) and automatic diode type detection combine to provide a robust solution for complex environmental monitoring applications.  — triggers dedicated SYS_SHDN pin — hardware configured range 65°C to 127°C in 1°C steps — cannot be disabled or modified by software    Additionally, the EMC1428 provides a hardware programmable system shutdown feature that is programmed at part power-up via a single TRIP_SET voltage channel that cannot be masked or corrupted through the SMBus. The EMC1428 provides ±1° accuracy for external diode temperatures and ±2°C accuracy for the internal diode temperature. The device monitors up to eight temperature channels (up to seven external and one internal). Applications     Hardware Thermal Shutdown Supports diodes requiring the BJT or transistor model Resistance Error Correction (up to 100 Ohms) Up to seven External Temperature Monitors — — — — ±1°C Accuracy (60°C < TDIODE < 100°C) 0.125°C Resolution Supports up to 2.2nF filter capacitor Anti-parallel diodes for extra diode support and compact design  Internal Temperature Monitor  3.3V Supply Voltage Available in a 16-pin 4mm x 4mm QFN RoHS Compliant package Programmable temperature limits for ALERT — ±2°C accuracy   Notebook Computers Desktop Computers Industrial Embedded Applications Block Diagram  2014 Microchip Technology Inc. DS20005275A-page 1 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet ORDER NUMBERS: DIODE MODES SUPPORTED SMBUS ADDRESS Up to 7 external diodes. “Hottest Of” temperature comparison. Hardware set Critical / Thermal shutdown, ALERT output Intel CPU and 3904 1001_100(r/w) 16-pin QFN (RoHS Compliant) Up to 7 external diodes. “Hottest Of” temperature comparison. Hardware set Critical / Thermal shutdown, ALERT output Intel CPU and 3904 1001_101(r/w) 16-pin QFN (RoHS Compliant) Up to 7 external diodes. “Hottest Of” temperature comparison. Hardware set Critical / Thermal shutdown, ALERT output Intel CPU and 3904 Selected by pull-up resistor on SYS_SHDN pin ORDERING NUMBER PACKAGE FEATURES EMC1428-1-AP-TR 16-pin QFN (RoHS Compliant) EMC1428-6-AP-TR EMC1428-7-AP-TRCB7 Reel Size is 4,000 pieces This product meets the halogen maximum concentration values per IEC61249-2-21 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Web site; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are using. Customer Notification System Register on our web site at www.microchip.com to receive the most current information on all of our products. DS20005275A-page 2  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table of Contents Chapter 1 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Chapter 2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 SMBus Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Chapter 3 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.1 System Management Bus Interface Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Write Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Read Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Send Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Receive Byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 Alert Response Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.7 SMBus Address. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 SMBus Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 12 13 13 13 13 14 14 Chapter 4 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.1 ALERT Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.1 ALERT Pin Interrupt Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1.2 ALERT Pin Comparator Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 SYS_SHDN Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 TRIP_SET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.4 Consecutive Alerts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 Temperature Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.1 Resistance Error Correction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.2 Beta Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.3 Digital Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.4 “Hottest Of” Comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.5 Conversion Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5.6 Dynamic Averaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.6 Diode Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.6.1 Diode Faults. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 16 16 17 19 19 20 20 20 20 21 21 21 22 Chapter 5 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 Data Read Interlock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 Temperature Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 Conversion Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.6 Limit Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.7 Therm Hysteresis Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.8 Therm Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.9 External Diode Fault Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.10 TRIP_SET Reading Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.11 Software Thermal Shutdown Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.12 Hardware Critical / Thermal Shutdown Limit Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.13 Channel Interrupt Mask Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  2014 Microchip Technology Inc. 28 28 30 30 31 32 35 35 36 36 36 37 37 DS20005275A-page 3 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 5.14 Consecutive ALERT Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.15 Beta Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.16 Hottest Temperature Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.17 Hottest Temperature Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.18 High Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.19 Low Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.20 THERM Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.21 REC Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.22 Hottest Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.23 Channel Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.24 Filter Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.25 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.26 Manufacturer ID Register (FEh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.27 Revision Register (FFh). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 40 41 41 42 43 43 44 44 45 46 46 46 47 Chapter 6 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 6.1 EMC1428 Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 6.2 Package Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 6.2.1 EMC1428-X-AP (16-Pin QFN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Chapter 7 Data Sheet Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 DS20005275A-page 4  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet List of Figures Figure 1.1 Figure 3.1 Figure 4.1 Figure 4.2 Figure 4.3 Figure 4.4 Figure 6.1 Figure 6.2 Figure 6.3 EMC1428 Pin Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 SMBus Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 System Diagram for EMC1428 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Block Diagram of Hardware Thermal Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Vset Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Diode Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 16-Pin QFN 4mm x 4mm Package Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 16-Pin QFN 4mm x 4mm Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 16-Pin QFN 4mm x 4mm PCB Footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  2014 Microchip Technology Inc. DS20005275A-page 5 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet List of Tables Table 1.1 EMC1428 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 1.2 Pin Type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 2.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 2.2 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 2.3 SMBus Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 3.1 Protocol Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 3.2 Write Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Table 3.3 Read Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 3.4 Send Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 3.5 Receive Byte Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Table 3.6 Alert Response Address Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 3.7 Address Select Decode on SYS_SHDN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 4.1 VTRIP Resistor Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 4.2 Supply Current vs. Conversion Rate for EMC1428 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Table 5.1 Register Set in Hexadecimal Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 5.2 Temperature Data Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 5.3 Temperature Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 5.4 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 5.5 Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Table 5.6 Conversion Rate Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 5.7 Conversion Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Table 5.8 Maximum Conversion Rate Per Temperature Channels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 5.9 Temperature Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 5.10 Therm Hysteresis Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 5.11 Therm Limit Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Table 5.12 External Diode Fault Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 5.13 TRIP_SET Reading Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 5.14 Software Thermal Shutdown Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Table 5.15 Hardware Thermal Shutdown Limit Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Table 5.16 Channel Interrupt Mask Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Table 5.17 Consecutive ALERT Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Table 5.18 Consecutive Alert Settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Table 5.19 Beta Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 5.20 Beta Compensation Look Up Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Table 5.21 Hottest Temperature Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 5.22 Hottest Temperature Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Table 5.23 High Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table 5.24 Low Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 5.25 THERM Limit Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table 5.26 REC Configuration Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 5.27 Hottest Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table 5.28 Channel Configuration Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Table 5.29 Filter Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table 5.30 Product ID Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table 5.31 Manufacturer ID Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table 5.32 Revision Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 7.1 Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 DS20005275A-page 6  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 1 Pin Description Figure 1.1 EMC1428 Pin Diagram Table 1.1 EMC1428 Pin Description PIN NUMBER NAME FUNCTION TYPE 1 DP1 DP1 - External Diode 1 positive (anode) connection. AIO 2 DN1 External Diode 1 negative (cathode) connection. AIO 3 DP2 / DN3 External Diode 2 positive (anode) connection and External Diode 3 negative (cathode) connection AIO 4 DN2 / DP3 External diode 2 negative (cathode) connection and External Diode 3 positive (anode) connection AIO 5 TRIP_SET Voltage input to set Critical / Thermal Shutdown temperature AIO  2014 Microchip Technology Inc. DS20005275A-page 7 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 1.1 EMC1428 Pin Description (continued) PIN NUMBER NAME FUNCTION TYPE 6 SYS_SHDN Active low System Shutdown output signal - requires pull-up resistor EMC1428-7 - The pull-up resistor is used to determine SMBus address OD (5V) 7 ALERT Active low interrupt - requires pull-up resistor OD (5V) 8 GND Ground Connection Power 9 DN4 / DP5 External diode 4 negative (cathode) connection and External Diode 5 positive (anode) connection AIO 10 DP4 / DN5 External Diode 4 positive (anode) connection and External Diode 5 negative (cathode) connection AIO 11 SMDATA SMBus Data input/output - requires pull-up resistor DIOD (5V) 12 SMCLK SMBus Clock input - requires pull-up resistor DI (5V) 13 N/C Not used - connect to Ground - see EMC1428 Anomaly Sheet n/a 14 DN6 / DP7 External diode 6 negative (cathode) connection and External Diode 7 positive (anode) connection AIO 15 DP6 / DN7 External Diode 6 positive (anode) connection and External Diode 7 negative (cathode) connection AIO 16 VDD Power supply Power The pin types are described below. All pins labelled (5V) are 5V tolerant. APPLICATION NOTE: For the 5V tolerant pins that have a pull-up resistor, the voltage difference between VDD and the pull-up voltage must never exceed 3.6V. Table 1.2 Pin Type PIN TYPE Power FUNCTION Used to supply either VDD or GND to the device DI 5V tolerant digital input OD 5V tolerant Open drain digital output. Requires a pull-up resistor DIOD AIO DS20005275A-page 8 5V tolerant bi-directional digital input / open-drain output. Requires a pull-up resistor. Analog input / output used for external diodes or analog inputs  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 2 Electrical Specifications 2.1 Absolute Maximum Ratings Table 2.1 Absolute Maximum Ratings DESCRIPTION RATING UNIT Supply Voltage (VDD) -0.3 to 4.0 V Voltage on 5V tolerant pins (V5VT_pin) -0.3 to 5.5 V Voltage on 5V tolerant pins (|V5VT_pin - VDD|) (see Note 2.1) -0.3 to 3.6 V -0.3 to VDD +0.3 V Operating Temperature Range -40 to +125 °C Storage Temperature Range -55 to +150 °C Voltage on any other pin to Ground Lead Temperature Range Refer to JEDEC Spec. J-STD020 Package Thermal Characteristics for QFN-16 Thermal Resistance (j-a) ESD Rating, All pins HBM 50 °C/W 2000 V Note: Stresses at or above those listed could cause permanent damage to the device. This is a stress rating only and functional operation of the device at any other condition above those indicated in the operation sections of this specification is not implied. When powering this device from laboratory or system power supplies, it is important that the Absolute Maximum Ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when the AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. If this possibility exists, it is suggested that a clamp circuit be used. Note 2.1 2.2 For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed 3.6V when the device is unpowered. Electrical Specifications Table 2.2 Electrical Specifications VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values at TA = 27°C unless otherwise noted. CHARACTERISTIC SYMBOL MIN TYP MAX UNITS CONDITIONS DC Power Supply Voltage VDD  2014 Microchip Technology Inc. 3.0 3.3 3.6 V DS20005275A-page 9 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 2.2 Electrical Specifications (continued) VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values at TA = 27°C unless otherwise noted. CHARACTERISTIC SYMBOL MIN TYP MAX UNITS CONDITIONS Supply Current IDD 450 600 uA 1 conversion / sec, dynamic averaging disabled Supply Current IDD 900 1200 uA 4 conversions / sec, dynamic averaging enabled Internal Temperature Monitor Temperature Accuracy ±0.25 Temperature Resolution ±1 °C 0°C < TA < 100°C ±2 °C -40°C < TA < 125°C 0.125 °C External Temperature Monitor Temperature Accuracy Temperature Resolution ±0.25 ±1 °C +40°C < TDIODE < +110°C 0°C < TA < 110°C ±0.5 ±2 °C -40°C < TDIODE < 127°C 0.125 °C ms default settings 2.7 nF Connected across external diode 100  In series with DP and DN lines Conversion Time all Channels tCONV 190 Capacitive Filter CFILTER 2.2 Resistance Error Correction RSERIES TRIP_SET Measurement Decoded Temperature Accuracy TSET 0.5 °C RSET = 1% resistor (see Note 2.2) ALERT and SYS_SHDN pins Output Low Voltage VOL 0.4 V ISINK = 8mA Leakage Current ILEAK ±5 uA powered or unpowered TA < 85°C pull-up voltage < 3.6V Power Up Timing First conversion ready tCONV_f 300 ms Time after power up before all channels updated with valid data SMBus delay tSMB_d 15 ms Delay before SMBus communications should be sent by host Note 2.2 DS20005275A-page 10 If a 1% resistor is used for RSET, then it is guaranteed to decode as shown in Table 4.1.  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 2.3 SMBus Electrical Characteristics Table 2.3 SMBus Electrical Specifications VDD = 3.0V to 3.6V, TA = -40°C to 125°C, all typical values are at TA = 27°C unless otherwise noted. CHARACTERISTIC SYMBOL MIN TYP MAX UNITS CONDITIONS SMBus Interface Input High Voltage VIH 2.0 VDD V 5V Tolerant Input Low Voltage VIL -0.3 0.8 V 5V Tolerant Input High/Low Current IIH / IIL ±5 uA Powered or unpowered TA < 85°C Hysteresis Input Capacitance CIN Output Low Sink Current IOL 8.2 420 mV 5 pF 15 mA SMDATA = 0.4V SMBus Timing Clock Frequency fSMB Spike Suppression tSP Bus free time Start to Stop tBUF 1.3 us Hold Time: Start tHD:STA 0.6 us Setup Time: Start tSU:STA 0.6 us Setup Time: Stop tSU:STP 0.6 us Data Hold Time tHD:DAT 0.3 us Data Setup Time tSU:DAT 100 ns Clock Low Period tLOW 1.3 us Clock High Period tHIGH 0.6 us Clock/Data Fall time tFALL 300 ns Min = 20+0.1CLOAD ns Clock/Data Rise time tRISE 300 ns Min = 20+0.1CLOAD ns fSMB > 100kHz Clock/Data Rise time tRISE 1000 ns Min = 20+0.1CLOAD ns fSMB < 100kHz Capacitive Load CLOAD 400 pF per bus line  2014 Microchip Technology Inc. 10 400 kHz 50 ns DS20005275A-page 11 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 3 System Management Bus Interface Protocol 3.1 System Management Bus Interface Protocol The EMC1428 communicate with a host controller, such as a Microchip SIO, through the SMBus. The SMBus is a two-wire serial communication protocol between a computer host and its peripheral devices. A detailed timing diagram is shown in Figure 3.1. Figure 3.1 SMBus Timing Diagram The EMC1428 are SMBus 2.0 compatible and support Send Byte, Read Byte, Write Byte, Receive Byte, and the Alert Response Address as valid protocols as shown below. All of the below protocols use the convention in Table 3.1. Table 3.1 Protocol Format DATA SENT TO DEVICE DATA SENT TO THE HOST Attempting to communicate with the EMC1428 SMBus interface with an invalid slave address or invalid protocol will result in no response from the device and will not affect its register contents. Stretching of the SMCLK signal is supported, provided other devices on the SMBus control the timing. 3.2 Write Byte The Write Byte is used to write one byte of data to the registers as shown below Table 3.2: Table 3.2 Write Byte Protocol START SLAVE ADDRESS WR ACK REGISTER ADDRESS ACK REGISTER DATA ACK STOP 1 -> 0 1001_100 0 0 XXh 0 XXh 0 0 -> 1 DS20005275A-page 12  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 3.3 Read Byte The Read Byte protocol is used to read one byte of data from the registers as shown in Table 3.3. Table 3.3 Read Byte Protocol START SLAVE ADDRESS WR ACK REGISTER ADDRESS ACK START SLAVE ADDRESS RD ACK REGISTER DATA NACK STOP 1-> 0 1001_100 0 0 XXh 0 0 -> 1 1001_100 1 0 XXh 1 0 -> 1 3.4 Send Byte The Send Byte protocol is used to set the internal address register pointer to the correct address location. No data is transferred during the Send Byte protocol as shown in Table 3.4. Table 3.4 Send Byte Protocol START SLAVE ADDRESS WR ACK REGISTER ADDRESS ACK STOP 1 -> 0 1001_100 0 0 XXh 0 1 -> 0 3.5 Receive Byte The Receive Byte protocol is used to read data from a register when the internal register address pointer is known to be at the right location (e.g. set via Send Byte). This is used for consecutive reads of the same register as shown in Table 3.5. Table 3.5 Receive Byte Protocol START SLAVE ADDRESS RD ACK REGISTER DATA NACK STOP 1 -> 0 1001_100 1 0 XXh 1 1 -> 0 3.6 Alert Response Address The ALERT output can be used as a processor interrupt or as an SMBus Alert. When it detects that the ALERT pin is asserted, the host will send the Alert Response Address (ARA) to the general address of 000_1100b. All devices with active interrupts will respond with their client address as shown in Table 3.6.  2014 Microchip Technology Inc. DS20005275A-page 13 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 3.6 Alert Response Address Protocol START ALERT RESPONSE ADDRESS RD ACK DEVICE ADDRESS NACK STOP 1 -> 0 0001_100 1 0 1001_1000 1 1 -> 0 The EMC1428 will respond to the ARA in the following way: 1. Send Slave Address and verify that full slave address was sent (i.e. the SMBus communication from the device was not prematurely stopped due to a bus contention event). 2. Set the MASK bit to clear the ALERT pin. APPLICATION NOTE: The ARA does not clear the Status Register and if the MASK bit is cleared prior to the Status Register being cleared, the ALERT pin will be reasserted. 3.7 SMBus Address The EMC1428-1 devices respond to the 7-bit slave address 1001_100xb. The EMC1428-6 will respond to the 7-bit slave address 1001_101xb. The EMC1428-7 slave address is determined at power up via the pull-up resistor on the SYS_SHDN pin as shown in Table 3.7. Table 3.7 Address Select Decode on SYS_SHDN Pin PULL UP RESISTOR SMBUS ADDRESS 4.7k Ohm ±5% 1001_000xb 6.8k Ohm ±5% 1001_001xb 10k Ohm ±5% 1001_010xb 15k Ohm ±5% 1001_011xb 22k Ohm ±5% 1001_100xb 33k Ohm ±5% 1001_101xb Note: Other addresses are available. Contact Microchip for more information. 3.8 SMBus Timeout The EMC1428 support SMBus Timeout. If the clock line is held low for longer than 30ms, the device will reset its SMBus protocol. This function can be enabled by setting the TIMEOUT bit in the Consecutive Alert Register (see Section 5.14). DS20005275A-page 14  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 4 Product Description The EMC1428 is an SMBus temperature sensor with Hardware Critical / Thermal Shutdown support. The EMC1428 monitors up to seven (7) external diodes and one internal diode. Thermal management is performed in cooperation with a host device. This consists of the host reading the temperature data of both the external and internal temperature diodes of the EMC1428 and using that data to control the speed of one or more fans. The EMC1428 device has two levels of monitoring. The first provides a maskable ALERT signal to the host when measured temperatures meet or exceed user programmable limits. This allows the EMC1428 to be used as an independent thermal watchdog to warn the host of temperature hot spots without constant monitoring by the host. The second level of monitoring asserts the SYS_SHDN pin when the External Diode 1 temperature meets or exceeds a hardware specified threshold temperature. Additionally, any of the external diode channels can be configured to assert the SYS_SHDN pin when the measured temperature meets or exceeds user programmable limits. Because the EMC1428 automatically corrects for temperature errors due to series resistance in temperature diode lines, there is greater flexibility in where external diodes are positioned and better measurement accuracy than previously available devices without resistance error correction. As well, the automatic beta detection feature means that there is no need to program the device according to which type of diode is present. Therefore, the device can power up ready to operate for any system configuration including those diodes that require the BJT or transistor model. Figure 4.1 shows a system level block diagram of the EMC1428. . Figure 4.1 System Diagram for EMC1428  2014 Microchip Technology Inc. DS20005275A-page 15 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 4.1 ALERT Output The ALERT pin is an open drain output and has two modes of operation: interrupt mode and comparator Mode. The mode of the ALERT output is selected via the ALERT / COMP bit in the Configuration Register. 4.1.1 ALERT Pin Interrupt Mode When configured to operate in interrupt mode, the ALERT pin asserts low when an out of limit measurement (> high limit or < low limit) is detected on any diode or when a diode fault is detected. The ALERT pin will remain asserted as long as an out-of-limit condition remains. Once the out-of-limit condition has been removed, the ALERT pin will remain asserted until the appropriate status bits are cleared. Each channel is subject to the fault queue (see Section 5.14). The ALERT pin can be masked by setting the MASK bit. Once the ALERT pin has been masked, it will be de-asserted and remain de-asserted until the MASK bit is cleared by the user. Any interrupt conditions that occur while the ALERT pin is masked will update the Status Register normally. The ALERT pin is used as an interrupt signal or as an SMBus Alert signal that allows an SMBus slave to communicate an error condition to the master. One or more ALERT outputs can be hard-wired together. 4.1.2 ALERT Pin Comparator Mode When the ALERT pin is configured to operate in comparator mode it will be asserted if any of the measured temperatures meets or exceeds the respective high limit or drops below the respective low limit. The ALERT pin will remain asserted until all temperatures drop below the corresponding high limit minus the THERM Hysteresis value. When the ALERT pin is asserted in comparator mode, the corresponding status bits will be set. Reading these bits will not clear them until the ALERT pin is deasserted. Once the ALERT pin is deasserted, the status bits will be automatically cleared. The MASK bit will not block the ALERT pin in this mode, however the individual channel masks (see Section 5.13) will prevent the respective channel from asserting the ALERT pin. In addition, each channel is subject to the fault queue (see Section 5.14). 4.2 SYS_SHDN Output The SYS_SHDN output is asserted independently of the ALERT output and cannot be masked. If the External Diode 1 temperature exceeds the Hardware Critical / Thermal Shutdown Limit for the programmed number of consecutive measurements, then the SYS_SHDN pin is asserted. The Hardware Critical / Thermal Shutdown Limit is defined by the TRIP_SET pin as described in Section 4.3. In addition to External Diode 1 channel triggering the SYS_SHDN pin when the measured temperature exceeds to the Hardware Critical / Thermal Shutdown Limit, each of the temperature measurement channels can be configured to assert the SYS_SHDN pin when they exceed the corresponding THERM Limit. When the SYS_SHDN pin is asserted, it will not release until the External Diode 1 temperature drops below the Hardware Thermal Shutdown Limit minus 10°C and all other measured temperatures drop below the THERM Limit minus the THERM Hysteresis value (when linked to SYS_SHDN). DS20005275A-page 16  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet The External Diode 1 channel and any software enabled channels are subject to the fault queue such that the error must exceed the threshold for one to four consecutive measurements before the SYS_SHDN pin is asserted. Figure 4.2 shows a block diagram of the interaction between the input channels and the SYS_SHDN pin. Figure 4.2 Block Diagram of Hardware Thermal Shutdown 4.3 TRIP_SET Pin The EMC1428’s TRIP_SET pin is an input to the Critical / Thermal Shutdown logic block which sets the Critical / Thermal shutdown temperature. The system designer creates a voltage level at this input through a simple resistor connected to GND as shown in Figure 4.3. The value of this resistor is used to create an input voltage on the TRIP_SET pin which is translated into a temperature ranging from 65°C to 127°C as enumerated in Table 4.1. APPLICATION NOTE: Current only flows when the TRIP_SET pin is being monitored. At all other times, the internal reference voltage is removed and the TRIP_SET pin will be pulled down to ground. APPLICATION NOTE: The TRIP_SET pin circuitry is designed to use a 1% resistor externally. Using a 1% resistor will result in the Thermal / Critical Shutdown temperature being decoded correctly. If a 5% resistor is used, then the Thermal / Critical Shutdown temperature may be decoded with as much as ±1°C error. APPLICATION NOTE: Note that an open condition on the TRIP_SET pin will be decoded as a minimum temperature threshold level.  2014 Microchip Technology Inc. DS20005275A-page 17 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Figure 4.3 Vset Circuit Table 4.1 VTRIP Resistor Settings TEMP (°C) RSET() TEMP (°C) RSET() 65 0.0 97 1240.0 66 28.7 98 1330.0 67 48.7 99 1400.0 68 69.8 100 1500.0 69 90.9 101 1580.0 70 113.0 102 1690.0 71 137.0 103 1820.0 72 158.0 104 1960.0 73 182.0 105 2050.0 74 210.0 106 2210.0 75 237.0 107 2370.0 76 261.0 108 2550.0 77 294.0 108 2740.0 78 324.0 110 2940.0 79 348.0 111 3160.0 80 383.0 112 3480.0 DS20005275A-page 18  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 4.1 VTRIP Resistor Settings (continued) 4.4 TEMP (°C) RSET() TEMP (°C) RSET() 81 412.0 113 3740.0 82 453.0 114 4120.0 83 487.0 115 4530.0 84 523.0 116 4990.0 85 562.0 117 5490.0 86 604.0 118 6040.0 87 649.0 119 6810.0 88 698.0 120 7870.0 89 750.0 121 9090.0 90 787.0 122 10700.0 91 845.0 123 12700.0 92 909.0 124 15800.0 93 953.0 125 20500.0 94 1020.0 126 29400.0 95 1100.0 127 49900.0 96 1150.0 65 Open Consecutive Alerts The EMC1428 contains multiple consecutive alert counters. One set of counters applies to the ALERT pin and the second set of counters applies to the SYS_SHDN pin. Each temperature measurement channel has a separate consecutive alert counter for each of the interrupt conditions (High, Low, Diode fault). All counters are user programmable and determine the number of consecutive measurements that a temperature channel(s) must be out-of-limit or reporting a diode fault before the corresponding status bit is set or pin is asserted. See Section 5.14 for more details on the consecutive alert function. 4.5 Temperature Monitoring The EMC1428 can monitor the temperature of up to seven (7) externally connected diodes as well as the internal or ambient temperature. Each channel is configured with the following features enabled or disabled based on user settings and system requirements. APPLICATION NOTE: When measuring a 45nm CPU diode, the reported temperature has an error of approximately +1.5C at 100°C. This error is related to non-perfect ideality in the CPU diode.  2014 Microchip Technology Inc. DS20005275A-page 19 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 4.5.1 Resistance Error Correction The EMC1428 includes active Resistance Error Correction to remove the effect of up to 100 ohms of series resistance. Without this automatic feature, voltage developed across the parasitic resistance in the remote diode path causes the temperature to read higher than the true temperature is. The error induced by parasitic resistance is approximately +0.7°C per ohm. Sources of series resistance include bulk resistance in the remote temperature transistor junctions, series resistance in the CPU, and resistance in the printed circuit board traces and package leads. Resistance error correction in the EMC1428 eliminates the need to characterize and compensate for parasitic resistance in the remote diode path. 4.5.2 Beta Compensation The forward current gain, or beta, of a transistor is not constant as emitter currents change. As well, it is not constant over changes in temperature. The variation in beta causes an error in temperature reading that is proportional to absolute temperature. Compensating for this error is also known as implementing the BJT or transistor model for temperature measurement. For discrete transistors configured with the collector and base shorted together, the beta is generally sufficiently high such that the percent change in beta variation is very small. For example, a 10% variation in beta for two forced emitter currents with a transistor whose ideal beta is 50 would contribute approximately 0.25°C error at 100°C. However for substrate transistors where the base-emitter junction is used for temperature measurement and the collector is tied to the substrate, the proportional beta variation will cause large error. For example, a 10% variation in beta for two forced emitter currents with a transistor whose ideal beta is 0.5 would contribute approximately 8.25°C error at 100°C. The Beta Compensation circuitry in the EMC1428 corrects for this beta variation to eliminate any error which would normally be induced. It automatically detects the appropriate beta setting to use. 4.5.3 Digital Averaging To reduce the effect of noise and temperature spikes on the reported temperature, all of the external diode channels use digital averaging. This averaging acts as a running average using the previous four measured values. The default setting is to have digital averaging disabled for all channels. It can be enabled for each channel individually by the Filter Control Register (see Section 5.24). 4.5.4 “Hottest Of” Comparison At the end of every measurement cycle, the EMC1428 compares all of the user selectable External Diode channels to determine which of these channels is reporting the hottest temperature. The hottest temperature is stored in the Hottest Temperature Registers and the appropriate status bit in the Hottest Status Register is set. As an optional feature, the EMC1428 can also flag an event if the hottest temperature channel changes. For example, suppose that External Diode channels 1, 3, and 4 are programmed to be compared in the “Hottest Of” Comparison. If the External Diode 1 channel reports the hottest temperature of the three, its temperature is copied into the Hottest Temperature Registers (in addition to the External Diode 1 Temperature registers) and it is flagged in the Hottest Status bit. If, on the next measurement, the External Diode 3 channel temperature has increased such that it is now the hottest temperature, the EMC1428 can flag this event as an interrupt condition and assert the ALERT pin. DS20005275A-page 20  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 4.5.5 Conversion Rates The EMC1428 may be configured for different conversion rates based on the system requirements. The conversion rate is configured as described in Section 5.5. The default conversion rate is 4 conversions per second. Other available conversion rates are shown in Table 5.7. 4.5.6 Dynamic Averaging Dynamic averaging causes the EMC1428 to measure the external diode channels for an extended time based on the selected conversion rate. This functionality can be disabled for increased power savings at the lower conversion rates (see Section 5.5). When dynamic averaging is enabled, the device will automatically adjust the sampling and measurement time for the external diode channels. This allows the device to average 2x or 4x longer than the normal 11 bit operation (nominally 21ms per channel) while still maintaining the selected conversion rate. The benefits of dynamic averaging are improved noise rejection due to the longer integration time as well as less random variation of the temperature measurement. When enabled, the dynamic averaging will affect the average supply current based on the chosen conversion rate as shown in Table 4.2 for EMC1428. Table 4.2 Supply Current vs. Conversion Rate for EMC1428 AVERAGE SUPPLY CURRENT AVERAGING FACTOR (BASED ON 11-BIT OPERATION) CONVERSION RATE DYNAMIC AVERAGING ENABLED (DEFAULT) DYNAMIC AVERAGING DISABLED DYNAMIC AVERAGING ENABLED (DEFAULT) DYNAMIC AVERAGING DISABLED 1 / sec 715uA 450uA 4x 1x 2 / sec 750uA 550uA 2x 1x 4 / sec (default) 900uA 815uA 1x 1x Continuous (see Table 5.8) 950uA 950uA 0.5x 0.5x 4.6 Diode Connections The diode connection for the External Diode 1 channel is determined based on the selected device. For the EMC1428, this channel can support a diode-connected transistor (such as a 2N3904) or a substrate transistor (such as those found in an CPU or GPU) as shown in Figure 4.4. Anti-parallel diodes are not supported on the External Diode 1 channel.  2014 Microchip Technology Inc. DS20005275A-page 21 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Figure 4.4 Diode Connections 4.6.1 Diode Faults The EMC1428 actively detects an open and short condition on each measurement channel. When a diode fault is detected, the temperature data MSByte is forced to a value of 80h and the FAULT bit is set in the Status Register. When an external diode channel is configured to operate in APD mode, the circuitry will detect independent open fault conditions, however a short condition will be shared between the APD channels. DS20005275A-page 22  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 5 Register Description The registers shown in Table 5.1 are accessible through the SMBus. An entry of ‘-’ indicates that the bit is not used and will always read ‘0’. Table 5.1 Register Set in Hexadecimal Order REGISTER ADDRESS R/W REGISTER NAME FUNCTION DEFAULT VALUE PAGE 00h R Internal Diode Data High Byte Stores the integer data for the Internal Diode 00h Page 28 01h R External Diode 1 Data High Byte Stores the integer data for the External Diode 1 00h Page 28 02h R-C Status Stores the status bits for the Internal Diode and External Diodes 00h Page 30 03h R/W Configuration Controls the general operation of the device (mirrored at address 09h) 00h Page 30 04h R/W Conversion Rate Controls the conversion rate for updating temperature data (mirrored at address 0Ah) 06h (4/sec) Page 31 05h R/W Internal Diode High Limit Stores the 8-bit high limit for the Internal Diode (mirrored at address 0Bh) 55h (85°C) Page 32 06h R/W Internal Diode Low Limit Stores the 8-bit low limit for the Internal Diode (mirrored at address 0Ch) 00h (0°C) Page 32 07h R/W External Diode 1 High Limit High Byte Stores the integer portion of the high limit for the External Diode 1 (mirrored at register 0Dh) 55h (85°C) Page 32 08h R/W External Diode 1 Low Limit High Byte Stores the integer portion of the low limit for the External Diode 1 (mirrored at register 0Eh) 00h (0°C) Page 32 09h R/W Configuration Controls the general operation of the device (mirrored at address 03h) 00h Page 30 0Ah R/W Conversion Rate Controls the conversion rate for updating temperature data (mirrored at address 04h) 06h (4/sec) Page 31 0Bh R/W Internal Diode High Limit Stores the 8-bit high limit for the Internal Diode (mirrored at address 05h) 55h (85°C) Page 32 0Ch R/W Internal Diode Low Limit Stores the 8-bit low limit for the Internal Diode (mirrored at address 06h) 00h (0°C) Page 32  2014 Microchip Technology Inc. DS20005275A-page 23 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.1 Register Set in Hexadecimal Order (continued) REGISTER ADDRESS R/W REGISTER NAME FUNCTION 0Dh R/W External Diode 1 High Limit High Byte Stores the integer portion of the high limit for the External Diode 1 (mirrored at register 07h) 55h (85°C) Page 32 0Eh R/W External Diode 1 Low Limit High Byte Stores the integer portion of the low limit for the External Diode 1 (mirrored at register 08h) 00h (0°C) Page 32 10h R External Diode 1 Data Low Byte Stores the fractional data for the External Diode 1 00h Page 28 13h R/W External Diode 1 High Limit Low Byte Stores the fractional portion of the high limit for the External Diode 1 00h Page 32 14h R/W External Diode 1 Low Limit Low Byte Stores the fractional portion of the low limit for the External Diode 1 00h Page 32 15h R/W External Diode 2 High Limit High Byte Stores the integer portion of the high limit for External Diode 2 55h (85°C) Page 32 16h R/W External Diode 2 Low Limit High Byte Stores the integer portion of the low limit for External Diode 2 00h (0°C) Page 32 17h R/W External Diode 2 High Limit Low Byte Stores the fractional portion of the high limit External Diode 2 00h Page 32 18h R/W External Diode 2 Low Limit Low Byte Stores the fractional portion of the low limit for External Diode 2 00h Page 32 19h R/W External Diode 1 THERM Limit Stores the 8-bit critical temperature limit for the External Diode 1 55h (85°C) Page 35 1Ah R/W External Diode 2 THERM Limit Stores the 8-bit critical temperature limit for External Diode 2 55h (85°C) Page 35 1Bh R-C External Diode Fault Stores status bits indicating which external diode detected a diode fault 00h Page 36 1Ch R TRIP_SET Voltage Voltage measured on the TRIP_SET pin to determine the Critical / Thermal shutdown threshold 00h Page 36 1Dh R/W SYS_SHDN Configuration Controls which software channels, if any, are linked to the SYS_SHDN pin 00h Page 36 1Eh R Hardware Thermal Shutdown Limit When read, returns the selected Hardware Thermal Shutdown Limit N/A Page 37 1Fh R/W Interrupt Mask Register Controls the masking of individual channels F0h Page 37 20h R/W Internal Diode THERM Limit Stores the 8-bit critical temperature limit for the Internal Diode 55h (85°C) Page 35 DS20005275A-page 24 DEFAULT VALUE PAGE  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.1 Register Set in Hexadecimal Order (continued) REGISTER ADDRESS R/W REGISTER NAME FUNCTION DEFAULT VALUE 21h R/W THERM Hysteresis Stores the 8-bit hysteresis value that applies to all THERM limits 0Ah (10°C) Page 35 22h R/W Consecutive ALERT Controls the number of out-of-limit conditions that must occur before the status bit is asserted 70h Page 38 23h R External Diode 2 Data High Byte Stores the integer data for External Diode 2 00h Page 28 24h R External Diode 2 Data Low Byte Stores the fractional data for External Diode 2 00h Page 28 25h R External Diode 1 Beta Configuration Stores the Beta Compensation circuitry settings for External Diode 1 08h Page 40 26h R/W External Diode 2 Beta Configuration Stores the Beta Compensation circuitry settings for External Diode 2 08h Page 40 29h R Internal Diode Data Low Byte Stores the fractional data for the Internal Diode 00h Page 28 2Ah R External Diode 3 High Byte Stores the integer data for External Diode 3 00h Page 28 2Bh R External Diode 3 Low Byte Stores the fractional data for External Diode 3 00h Page 28 2Ch R/W External Diode 3 High Limit High Byte Stores the integer portion of the high limit for External Diode 3 55h (85°C) Page 32 2Dh R/W External Diode 3 Low Limit High Byte Stores the integer portion of the low limit for External Diode 3 00h (0°C) Page 32 2Eh R/W External Diode 3 High Limit Low Byte Stores the fractional portion of the high limit for External Diode 3 00h Page 32 2Fh R/W External Diode 3 Low Limit Low Byte Stores the fractional portion of the low limit for External Diode 3 00h Page 32 30h R/W External Diode 3 THERM Limit Stores the 8-bit critical temperature limit for External Diode 3 55h (85°C) Page 35 32h R Hottest Diode High Byte Stores the integer data for the hottest temperature 00h Page 41 33h R Hottest Diode Low Byte Stores the fractional data for the hottest temperature 00h Page 41 34h R-C Hottest Status Status bits indicating which external diode is hottest 00h Page 41 35h R-C High Limit Status Status bits for the High Limits 00h Page 42 36h R-C Low Limit Status Status bits for the Low Limits 00h Page 43  2014 Microchip Technology Inc. PAGE DS20005275A-page 25 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.1 Register Set in Hexadecimal Order (continued) REGISTER ADDRESS R/W REGISTER NAME FUNCTION DEFAULT VALUE PAGE 37h R THERM Limit Status Status bits for the THERM Limits 00h Page 43 39h R/W REC Configuration Controls REC for all channels 00h Page 44 3Ah R/W Hottest Config Controls which external diode channels are used in the “hottest of “comparison 00h Page 44 3Bh R/W Channel Config Controls which channels are enabled 00h Page 45 40h R/W Filter Control Controls the digital filter setting for the External Diode 1 channel 00h Page 46 41h R External Diode 4 Data High Byte Stores the integer data for the External Diode 4 channel 00h Page 28 42h R External Diode 4 Data Low Byte Stores the fractional data for the External Diode 4 channel 00h Page 28 43h R External Diode 5 Data High Byte Stores the integer data for the External Diode 5 channel 00h Page 28 44h R External Diode 5 Data Low Byte Stores the fractional data for the External Diode 5 channel 00h Page 28 45h R External Diode 6 Data High Byte Stores the integer data for the External Diode 6 channel 00h Page 28 46h R External Diode 6 Data Low Byte Stores the fractional data for the External Diode 6 channel 00h Page 28 47h R External Diode 7 Data High Byte Stores the integer data for the External Diode 7 channel 00h Page 28 48h R External Diode 7 Data Low Byte Stores the fractional data for the External Diode 7 channel 00h Page 28 50h R/W External Diode 4 High Limit High Byte Stores the integer data for the high limit for the External Diode 4 channel 55h (85°C) Page 32 51h R/W External Diode 4 Low Limit High Byte Stores the integer data for the low limit for the External Diode 4 channel 00h (0°C) Page 32 52h R/W External Diode 4 HIgh Limit Low Byte Stores the fractional data for the low limit for the External Diode 4 channel 00h Page 32 53h R/W External Diode 4 Low Limit Low Byte Stores the fractional data for the low limit for the External Diode 4 channel 00h Page 32 54h R/W External Diode 5 High Limit High Byte Stores the integer data for the high limit for the External Diode 5 channel 55h (85°C) Page 32 DS20005275A-page 26  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.1 Register Set in Hexadecimal Order (continued) REGISTER ADDRESS R/W REGISTER NAME FUNCTION 55h R/W External Diode 5 Low Limit High Byte Stores the integer data for the low limit for the External Diode 5 channel 00h (0°C) Page 32 56h R/W External Diode 5 HIgh Limit Low Byte Stores the fractional data for the low limit for the External Diode 5 channel 00h Page 32 57h R/W External Diode 5 Low Limit Low Byte Stores the fractional data for the low limit for the External Diode 5 channel 00h Page 32 58h R/W External Diode 6 High Limit High Byte Stores the integer data for the high limit for the External Diode 6 channel 55h (85°C) Page 32 59h R/W External Diode 6 Low Limit High Byte Stores the integer data for the low limit for the External Diode 6 channel 00h (0°C) Page 32 5Ah R/W External Diode 6 HIgh Limit Low Byte Stores the fractional data for the low limit for the External Diode 6 channel 00h (0°C) Page 32 5Bh R/W External Diode 6 Low Limit Low Byte Stores the fractional data for the low limit for the External Diode 6 channel 00h (0°C) Page 32 5Ch R/W External Diode 7 High Limit High Byte Stores the integer data for the high limit for the External Diode 7 channel 55h (85°C) Page 32 5Dh R/W External Diode 7 Low Limit High Byte Stores the integer data for the low limit for the External Diode 7 channel 00h (0°C) Page 32 5Eh R/W External Diode 7 HIgh Limit Low Byte Stores the fractional data for the low limit for the External Diode 7 channel 00h Page 32 5Fh R/W External Diode 7 Low Limit Low Byte Stores the fractional data for the low limit for the External Diode 7 channel 00h Page 32 64h R/W External Diode 4 THERM Limit Stores the 8-bit critical temperature limit for External Diode 4 55h (85°C) Page 32 65h R/W External Diode 5 THERM Limit Stores the 8-bit critical temperature limit for External Diode 5 55h (85°C) Page 32 66h R/W External Diode 6 THERM Limit Stores the 8-bit critical temperature limit for External Diode 6 55h (85°C) Page 32 67h R/W External Diode 7 THERM Limit Stores the 8-bit critical temperature limit for External Diode 7 55h (85°C) Page 32  2014 Microchip Technology Inc. DEFAULT VALUE PAGE DS20005275A-page 27 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.1 Register Set in Hexadecimal Order (continued) REGISTER ADDRESS R/W REGISTER NAME FUNCTION DEFAULT VALUE PAGE 71h R/W External Diode 4 Beta Configuration Stores the Beta Compensation circuitry settings for External Diode 4 08h Page 40 72h R/W External Diode 6 Beta Configuration Stores the Beta Compensation circuitry settings for External Diode 6 08h Page 40 FDh R Product ID EMC1428 Stores a fixed value that identifies each product 29h Page 46 FEh R Manufacturer ID Stores a fixed value that represents Microchip 5Dh Page 46 FFh R Revision Stores a fixed value that represents the revision number 01h Page 47 5.1 Data Read Interlock When any temperature channel high byte register is read, the corresponding low byte is copied into an internal ‘shadow’ register. The user is free to read the low byte at any time and be guaranteed that it will correspond to the previously read high byte. Regardless if the low byte is read or not, reading from the same high byte register again will automatically refresh this stored low byte data. 5.2 Temperature Data Registers Table 5.2 Temperature Data Registers ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 00h R Internal Diode High Byte Sign 64 32 16 8 4 2 1 00h 29h R Internal Diode Low Byte 0.5 0.25 0.125 - - - - - 00h 01h R External Diode 1 High Byte Sign 64 32 16 8 4 2 1 00h 10h R External Diode 1 Low Byte 0.5 0.25 0.125 - - - - - 00h 23h R External Diode 2 High Byte Sign 64 32 16 8 4 2 1 00h 24h R External Diode 2 Low Byte 0.5 0.25 0.125 - - - - - 00h 2Ah R External Diode 3 High Byte Sign 64 32 16 8 4 2 1 00h 2Bh R External Diode 3 Low Byte 0.5 0.25 0.125 - - - - - 00h DS20005275A-page 28  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.2 Temperature Data Registers (continued) ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 41h R External Diode 4 High Byte Sign 64 32 16 8 4 2 1 00h 42h R External Diode 4 Low Byte 0.5 0.25 0.125 - - - - - 00h 43h R External Diode 5 High Byte Sign 64 32 16 8 4 2 1 00h 44h R External Diode 5 Low Byte 0.5 0.25 0.125 - - - - - 00h 45h R External Diode 6 High Byte Sign 64 32 16 8 4 2 1 00h 46h R External Diode 6 Low Byte 0.5 0.25 0.125 - - - - - 00h 47h R External Diode 7 High Byte Sign 64 32 16 8 4 2 1 00h 48h R External Diode 7 Low Byte 0.5 0.25 0.125 - - - - - 00h All temperatures are stored as an 11-bit value with the high byte representing the integer value and the low byte representing the fractional value left justified to occupy the MSBits. The data format is standard 2’s complement from -64°C to 127.875°C as shown in Table 5.3. Table 5.3 Temperature Data Format BINARY HEX (AS READ BY REGISTERS) Diode Fault 1000_0000_000b 80_00h -64 1100_0000_000b C0_00h -63.875 1100_0000_001b C0_20h -1 1111_1111_000b FF_00h -0.125 1111_1111_111b FF_E0h 0 0000_0000_000b 00_00h 0.125 0000_0000_001b 00_20h 1 0000_0001_000b 01_00h 63 0011_1111_000b 3F_00h 64 0100_0000_000b 40_00h 127 0111_1111_000b 7F_00h 127.875 0111_1111_111b 7F_E0h TEMPERATURE (°C)  2014 Microchip Technology Inc. DS20005275A-page 29 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 5.3 Status Register Table 5.4 Status Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 02h R Status BUSY HOT TEST - HIGH LOW FAULT SW_ SYS HWSD 00h The Status Register reports general error conditions. To identify specific channels, refer to Section 5.9, Section 5.18, Section 5.19, and Section 5.20. The individual Status Register bits (except HOTTEST) are cleared when the appropriate High Limit, Low Limit, or THERM Limit register has been read or cleared. Bit 7 - BUSY - This bit indicates that the ADC is currently converting. This bit does not cause the ALERT pin to be asserted. Bit 6 - HOTTEST - This bit is set if the REM_HOT bit (see Section 5.23) is set and the hottest channel changes. This bit is cleared when the register is read. Bit 4 - HIGH - This bit is set when any of the temperature channels meets or exceeds its programmed high limit. See the High Limit Status Register for specific channel information (Section 5.18). When set, this bit will assert the ALERT pin. Bit 3 - LOW - This bit is set when any of the temperature channels drops below its programmed low limit. See the Low Limit Status Register for specific channel information (Section 5.19). When set, this bit will assert the ALERT pin. Bit 2 - FAULT - This bit is asserted when a diode fault is detected on any of the external diode channels. See the External Diode Fault Register for specific channel information (Section 5.9). When set, this bit will assert the ALERT pin. Bit 1 - SW_SYS - This bit is set when any of the external diode channels meet or exceed the respected THERM Limits. See the Therm Status Register for specific channel information (Section 5.20) Bit 0 - HWSD - This bit is set when the External Diode 1 Temperature meets or exceeds the Hardware Critical / Thermal Shutdown Limit. When set, this bit will assert the SYS_SHDN pin. This bit is cleared when read if the SYS_SHDN pin has been released. 5.4 Configuration Register Table 5.5 Configuration Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 03h R/W Config MASK_ ALL - ALERT/ COMP - - - DAVG_ DIS - 00h 09h The Configuration Register controls the basic operation of the device. This register is fully accessible at either address. DS20005275A-page 30  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Bit 7 - MASK_ALL - Masks the ALERT pin from asserting.  ‘0’ (default) - The ALERT pin is not masked. If any of the appropriate status bits are set the ALERT pin will be asserted.  ‘1’ - The ALERT pin is masked. It will not be asserted for any interrupt condition. The Status Registers will be updated normally. Bit 5 - ALERT/COMP - Controls the operation of the ALERT pin.  ‘0’ (default) - The ALERT pin acts as described in Section 4.1.1.  ‘1’ - The ALERT pin acts in comparator mode as described in Section 4.1.2. In this mode the MASK_ALL bit is ignored. Bit 1 - DAVG_DIS - Disables the dynamic averaging feature on all temperature channels (see Section 4.5.6). 5.5  ‘0’ (default) - The dynamic averaging feature is enabled. All temperature channels will be converted with an averaging factor that is based on the conversion rate as shown in Table 4.2.  ‘1’ - The dynamic averaging feature is disabled. All temperature channels will be converted with a maximum averaging factor of 1x (equivalent to 11-bit conversion). For higher conversion rates (i.e. more conversions per second), this averaging factor will be reduced as shown in Table 4.2. Conversion Rate Register Table 5.6 Conversion Rate Register ADDR R/W REGISTER B7 B6 B5 B4 04h R/W Conversion Rate - - - - B3 B2 B1 B0 CONV[2:0] DEFAULT 06h (4/sec) 0Ah The Conversion Rate Register controls how often the temperature measurement channels are updated and compared against the limits. This register is fully accessible at either address. Bits 3-0 - CONV[3:0] - Determines the conversion rate as shown in Table 5.7. Table 5.7 Conversion Rate CONV[2:0] 2 1 0 CONVERSIONS / SECOND 1 0 0 1 1 0 1 2 1 1 0 4 (default) 1 1 1 Continuous All Others 4 The actual conversion rate for Continuous conversions will depend on the number of diode channels enabled and is shown in Table 5.8.  2014 Microchip Technology Inc. DS20005275A-page 31 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.8 Maximum Conversion Rate Per Temperature Channels NUMBER OF EXTERNAL DIODE CHANNELS MAX CONVERSION RATE 4 12 / sec 5 11 / sec 6 10 / sec 7 9 / sec 5.6 Limit Registers Table 5.9 Temperature Limit Registers ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 05h R/W Internal Diode High Limit Sign 64 32 16 8 4 2 1 55h (85°C) R/W Internal Diode Low Limit Sign 64 32 16 8 4 2 1 00h (0°C) R/W External Diode 1 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 13h R/W External Diode 1 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 08h R/W External Diode 1 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C) 14h R/W External Diode 1 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 15h R/W External Diode 2 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 16h R/W External Diode 2 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C) 0Bh 06h 0Ch 07h 0Dh 0Eh DS20005275A-page 32  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.9 Temperature Limit Registers (continued) ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 17h R/W External Diode 2 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 18h R/W External Diode 2 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 2Ch R/W External Diode 3 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 2Dh R/W External Diode 3 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C) 2Eh R/W External Diode 3 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 2Fh R/W External Diode 3 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 50h R/W External Diode 4 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 51h R/W External Diode 4 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C) 52h R/W External Diode 4 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 53h R/W External Diode 4 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 54h R/W External Diode 5 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 55h R/W External Diode 5 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C)  2014 Microchip Technology Inc. DS20005275A-page 33 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.9 Temperature Limit Registers (continued) ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 56h R/W External Diode 5 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 57h R/W External Diode 5 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 58h R/W External Diode 6 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 59h R/W External Diode 6 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C) 5Ah R/W External Diode 6 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 5Bh R/W External Diode 6 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 5Ch R/W External Diode 7 High Limit High Byte Sign 64 32 16 8 4 2 1 55h (85°C) 5Dh R/W External Diode 7 Low Limit High Byte Sign 64 32 16 8 4 2 1 00h (0°C) 5Eh R/W External Diode 7 High Limit Low Byte 0.5 0.25 0.125 - - - - - 00h 5Fh R/W External Diode 7 Low Limit Low Byte 0.5 0.25 0.125 - - - - - 00h The device contains both high and low limits for all temperature channels. If the measured temperature meets or exceeds the high limit, then the corresponding status bit is set and the ALERT pin is asserted. Likewise, if the measured temperature is less than the low limit, the corresponding status bit is set and the ALERT pin is asserted. The limit registers with multiple addresses are fully accessible at either address. DS20005275A-page 34  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 5.7 Therm Hysteresis Register Table 5.10 Therm Hysteresis Register ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 21h R/W THERM Hysteresis - 64 32 16 8 4 2 1 0Ah (10°C) The THERM Hysteresis is used in conjunction with the THERM Limit Registers to assert the SYS_SHDN pin. In addition, the THERM Hysteresis Register is used with the High Limit Registers when the ALERT pin is configured to act as a comparator (see Section 4.1.2). 5.8 Therm Limit Registers Table 5.11 Therm Limit Registers ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 19h R/W External Diode 1 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 1Ah R/W External Diode 2 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 20h R/W Internal Diode THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 30h R/W External Diode 3 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 64h R/W External Diode 4 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 65h R/W External Diode 5 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 66h R/W External Diode 6 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) 67h R/W External Diode 7 THERM Limit Sign 64 32 16 8 4 2 1 55h (85°C) The THERM Limit Registers are used to set the threshold for the software inputs to the Critical / Thermal Shutdown circuitry. If the measured channel is linked to the Critical / Thermal Shutdown circuitry and meets or exceeds this limit, then the SYS_SHDN pin will be asserted.  2014 Microchip Technology Inc. DS20005275A-page 35 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 5.9 External Diode Fault Register Table 5.12 External Diode Fault Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 1Bh R-C External Diode Fault E7FLT E6FLT E5FLT E4FLT E3FLT E2FLT E1FLT - 00h The External Diode Fault Register indicates which of the external diodes caused the FAULT bit in the Status Register to be set. These bits are cleared when read if the error condition has been removed. Bit 7 - E7FLT - This bit is set if the External Diode 7 channel reported a diode fault. Bit 6 - E6FLT - This bit is set if the External Diode 6 channel reported a diode fault. Bit 5 - E5FLT - This bit is set if the External Diode 5 channel reported a diode fault. Bit 4 - E4FLT - This bit is set if the External Diode 4 channel reported a diode fault. Bit 3 - E3FLT - This bit is set if the External Diode 3 channel reported a diode fault. Bit 2 - E2FLT - This bit is set if the External Diode 2 channel reported a diode fault. Bit 1 - E1FLT - This bit is set if the External Diode 1 channel reported a diode fault. 5.10 TRIP_SET Reading Register Table 5.13 TRIP_SET Reading Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 1Ch R TRIP_SET Reading 752.9 376.5 188.2 94.12 47.1 23.53 11.76 5.88 00h The TRIP_SET Reading Register stores the voltage measured on the TRIP_SET pin. The bit weighting represents mV above 0V. 5.11 Software Thermal Shutdown Configuration Register Table 5.14 Software Thermal Shutdown Configuration Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 1Dh R/W Software Thermal Shutdown Configuration E7 SYS E6 SYS E5 SYS E4 SYS E3 SYS E2 SYS E1 SYS INT SYS 00h The Software Thermal Shutdown Configuration Register controls whether any of the software channels will assert the SYS_SHDN pin. If a channel is enabled, the temperature is compared against the DS20005275A-page 36  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet corresponding THERM Limit. If the measured temperature meets or exceeds the THERM Limit, then the SYS_SHDN pin is asserted. This functionality is in addition to the Hardware Shutdown circuitry. Bits 7-1 - ExSYS - configures the External Diode X channel to assert the SYS_SHDN pin based on it’s respective THERM Limit (see Section 5.20 for details on the ExTHERM status bits).  ‘0’ (default) - the External Diode X channel is not linked to the SYS_SHDN pin. If the temperature meets or exceeds it’s THERM Limit, the ExTHERM status bit is set but the SYS_SHDN pin is not asserted.  ‘1’ - the External Diode X channel is linked to the SYS_SHDN pin. If the temperature meets or exceeds it’s THERM Limit, the ExTHERM status bit is set and the SYS_SHDN pin is asserted. It will remain asserted until the temperature drops below it’s THERM Limit minus the THERM Hysteresis. Bit 0 - INTSYS - configures the Internal Diode channel to assert the SYS_SHDN pin based on it’s respective THERM Limit (see Section 5.20 for details on the ITHERM status bit). 5.12  ‘0’ (default) - the Internal Diode channel is not linked to the SYS_SHDN pin. If the temperature meets or exceeds it’s THERM Limit, the ITHERM status bit is set but the SYS_SHDN pin is not asserted.  ‘1’ - the Internal Diode channel is linked to the SYS_SHDN pin. If the temperature meets or exceeds it’s THERM Limit, the ITHERM status bit is set and the SYS_SHDN pin is asserted. It will remain asserted until the temperature drops below it’s THERM Limit minus the THERM Hysteresis. Hardware Critical / Thermal Shutdown Limit Register Table 5.15 Hardware Thermal Shutdown Limit Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 1Eh R Hardware Thermal Shutdown Limit - 64 32 16 8 4 2 1 N/A This read only register returns the Hardware Thermal Shutdown Limit selected by the TRIP_SET voltage. The data represents the hardware set temperature in °C. See Table 5.2 for the data format. When the External Diode 1 Temperature meets or exceeds this limit, the SYS_SHDN pin is asserted and will remain asserted until the External Diode 1 Temperature drops below this limit minus 10°C. 5.13 Channel Interrupt Mask Register Table 5.16 Channel Interrupt Mask Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 1Fh R/W Channel Mask E7_ MSK E6_ MSK E5_ MSK E4_ MSK E3_ MSK E2_ MSK E1_ MSK INT_ MSK F0h The Channel Interrupt Mask Register controls individual channel masking. When a channel is masked, the ALERT pin will not be asserted when the masked channel reads a diode fault or out of limit error. The channel mask does not mask the SYS_SHDN pin.  2014 Microchip Technology Inc. DS20005275A-page 37 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Bits 7-4 - Ex_MSK - Prevents the ALERT pin from being asserted when the External Diode X channel is out of limit or reports a diode fault. If the EXT6_APD bit is not set (see Section 5.23), then the EXT7_MSK bit is ignored. Likewise, if the EXT4_APD bit is not set, then the EXT5_MSK bit is ignored.  ‘0’ - The External Diode X channel will cause the ALERT pin to be asserted if it is out of limit or reports a diode fault.  ‘1’ (default) - The External Diode X channel will not cause the ALERT pin to be asserted if it is out of limit or reports a diode fault. Bits 3-1- Ex_MSK - Prevents the ALERT pin from being asserted when the External Diode X channel is out of limit or reports a diode fault. If the EXT2_APD bit is not set (see Section 5.23), then the EXT3_MSK bit is ignored.  ‘0’ - (default) The External Diode X channel will cause the ALERT pin to be asserted if it is out of limit or reports a diode fault.  ‘1’ - The External Diode X channel will not cause the ALERT pin to be asserted if it is out of limit or reports a diode fault. Bit 0 - INT_MSK- Prevents the ALERT pin from being asserted when the Internal Diode temperature is out of limit. 5.14  ‘0’ (default) - The Internal Diode channel will cause the ALERT pin to be asserted if it is out of limit.  ‘1’ - The Internal Diode channel will not cause the ALERT pin to be asserted if it is out of limit. Consecutive ALERT Register Table 5.17 Consecutive ALERT Register ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 22h R/W Consecutive ALERT TIME OUT CTHE RM2 CTHE RM1 CTHE RM0 CAL RT2 CAL RT1 CAL RT0 - 70h The Consecutive ALERT Register determines how many times an out-of-limit error or diode fault must be detected in consecutive measurements before the interrupt status registers are asserted. Each out of limit error and diode fault condition has its own counter associated with it. Each counter is incremented whenever the corresponding channel exceeds the appropriate limit. Additionally, each counter is reset if the condition has been removed. (i.e. if External Diode 1 exceeds its high limit, it will increment the high counter. If, on the next measurement, it experiences a diode fault, the high limit counter will be reset and the diode fault counter will be incremented). When the ALERT pin is configured as an interrupt and the consecutive alert counter reaches its programmed value then the STATUS bit(s) for that channel and the error condition will be set to ‘1’ and the ALERT pin will be asserted. Measurements will continue normally. When the ALERT pin is configured as a comparator, the consecutive alert counter will ignore diode fault and low limit errors and only increment if the measured temperature meets or exceeds the High Limit. Additionally, once the consecutive alert counter reaches the programmed limit, the ALERT pin will be asserted, but the counter will not be reset. It will remain set until the temperature drops below the High Limit minus the THERM Hysteresis value. For example, if the CALRT[2:0] bits are set for 4 consecutive alerts on an EMC1428 device, the high limits are set at 70°C, and none of the channels are masked, then the status bits will be asserted after the following four measurements: DS20005275A-page 38  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 1. Internal Diode reads 71°C and both external diodes read 69°C. Consecutive alert counter for INT is incremented to 1. 2. Both the Internal Diode and the External Diode 1 read 71°C and External Diode 2 reads 68°C. Consecutive alert counter for INT is incremented to 2 and for EXT1 is set to 1. 3. The External Diode 1 reads 71°C and both the Internal Diode and External Diode 2 read 69°C. Consecutive alert counter for INT and EXT2 are cleared and EXT1 is incremented to 2. 4. The Internal Diode reads 71°C and both external diodes read 71°C. Consecutive alert counter for INT is set to 1, EXT2 is set to 1, and EXT1 is incremented to 3. 5. The Internal Diode reads 71°C and both the external diodes read 71°C. Consecutive alert counter for INT is incremented to 2, EXT2 is set to 2, and EXT1 is incremented to 4. The HIGH status bit are set for EXT1 and the ALERT pin is asserted. The EXT1 counter is reset to 0 and all other counters hold the last value until the next temperature measurement. Bit 7 - TIMEOUT - Determines whether the SMBus Timeout function is enabled.  ‘0’ (default) - The SMBus Timeout feature is disabled. The SMCLK line can be held low indefinitely without the device resetting its SMBus protocol.  ‘1’ - The SMBus Timeout feature is enabled. If the SMCLK line is held low for more than 30ms, then the device will reset the SMBus protocol. Bits 6-4 CTHRM[2:0] - Determines the number of consecutive measurements that must exceed the corresponding THERM Limit and Hardware Thermal Shutdown Limit before the SYS_SHDN pin is asserted. All temperature channels use this value to set the respective counters. The consecutive THERM counter is incremented whenever any of the measurements exceed the corresponding THERM Limit or if the External Diode 1 measurement meets or exceeds the Hardware Thermal Shutdown Limit. If the temperature drops below the THERM limit or Hardware Thermal Shutdown Limit, then the counter is reset. If the programmed number of consecutive measurements exceed the THERM Limit or Hardware Thermal Shutdown Limit, and the appropriate channel is linked to the SYS_SHDN pin, then the SYS_SHDN pin will be asserted low. Once the SYS_SHDN pin is asserted, the consecutive THERM counter will not reset until the corresponding temperature drops below the appropriate limit minus the corresponding hysteresis. The bits are decoded as shown in Table 5.18. The default setting is 4 consecutive out of limit conversions. Bits 3-1 - CALRT[2:0] - Determine the number of consecutive measurements that must have an out of limit condition or diode fault before the STATUS bits is asserted. All temperature channels use this value to set the respective counters. The bits are decoded as shown in Table 5.18. The default setting is 1 consecutive out of limit conversion. APPLICATION NOTE: If one of the fault queues is not cleared and the CALRT[2:0] (or CTHRM[2:0]) bits are updated, the update won’t take affect until fault queue is cleared. All the fault queues are independent so those that are empty will be updated immediately. Table 5.18 Consecutive Alert Settings 2 1 0 NUMBER OF CONSECUTIVE OUT OF LIMIT MEASUREMENTS 0 0 0 1 (default for CALRT[2:0]) 0 0 1 2  2014 Microchip Technology Inc. DS20005275A-page 39 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.18 Consecutive Alert Settings (continued) 2 1 0 NUMBER OF CONSECUTIVE OUT OF LIMIT MEASUREMENTS 0 1 1 3 1 1 1 4 (default for CTHRM[2:0]) All Others 5.15 1 (CALRT[2:0]), 4 (CTHRM[2:0]) Beta Configuration Register Table 5.19 Beta Configuration Register ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 25h R External Diode 1 Beta Configuration - - - - AUTO1 BETA1[2:0] 08h 26h R/W External Diode 2 Beta Configuration - - - - AUTO2 BETA2[2:0] 08h 71h R/W External Diode 4 Beta Configuration - - - - AUTO4 BETA4[2:0] 08h 72h R/W External Diode 6 Beta Configuration - - - - AUTO6 BETA6[2:0] 07h These registers are used to set the Beta Compensation factor that is used for the External Diode channels. Bit 3 - AUTOx - Enables the Beta Compensation factor autodetection function.  ‘0’ - The Beta Compensation Factor autodetection circuitry is disabled. The External Diode will always use the Beta Compensation factor set by the BETAx[2:0] bits.  ‘1’ (default) - The Beta Compensation factor autodetection circuitry is enabled. At the beginning of every conversion, the optimal Beta Compensation factor setting will be determined and applied. The BETAx[2:0] bits will be automatically updated to indicate the current setting. Bit 2-0 - BETAx[2:0] - These bits always reflect the current beta configuration settings. These bits will be updated automatically and writing to these bits will have no effect. Table 5.20 Beta Compensation Look Up Table BETAX[2:0] 2 1 0 MINIMUM BETA 0 0 0 < 0.08 0 0 1 < 0.111 0 1 0 < 0.176 DS20005275A-page 40  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Table 5.20 Beta Compensation Look Up Table (continued) BETAX[2:0] 5.16 2 1 0 MINIMUM BETA 0 1 1 < 0.29 1 0 0 < 0.48 1 0 1 < 0.9 1 1 0 < 2.33 1 1 1 Disabled Hottest Temperature Registers Table 5.21 Hottest Temperature Registers ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 32h R Hottest Temperature High Byte Sign 64 32 16 8 4 2 1 80h 33h R Hottest Temperature Low Byte 0.5 0.25 0.125 - - - - - 00h The Hottest Temperature Registers store the measured hottest temperature of all the selected external diode channels (see Section 5.22). If no External diodes are selected then the High Byte Register will read 80h. The data format is the same as the temperature channels. 5.17 Hottest Temperature Status Register Table 5.22 Hottest Temperature Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 34h R Hottest Temperature Status EXT7 EXT6 EXT5 EXT4 EXT3 EXT2 EXT1 INT 00h The Hottest Temperature Status Register flags which external diode temperature is hottest. If multiple temperature channels measure the same temperature and are equal to the hottest temperature, then hottest status will be based on the measurement order. Bit 7 - EXT7 - The External Diode 7 channel is the hottest. Bit 6 - EXT6 - The External Diode 6 channel is the hottest. Bit 4 - EXT5 - The External Diode 5 channel is the hottest.  2014 Microchip Technology Inc. DS20005275A-page 41 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Bit 3 - EXT4 - The External Diode 4 channel is the hottest. Bit 3 - EXT3 - The External Diode 3 channel is the hottest. Bit 2 - EXT2 - The External Diode 2 channel is the hottest. Bit 1 - EXT1 - The External Diode 1 channel is the hottest. Bit 0 - INT - The Internal Diode channel is the hottest. 5.18 High Limit Status Register Table 5.23 High Limit Status Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 35h R-C High Limit Status E7 HIGH E6 HIGH E5 HIGH E4 HIGH E3 HIGH E2 HIGH E1 HIGH I HIGH 00h The High Limit Status Register contains the status bits that are set when a temperature channel high limit is exceeded for a number of consecutive readings as set by the consecutive alert counts (see Section 5.14). If any of these bits are set, then the HIGH status bit in the Status Register is set. Reading from the High Limit Status Register will clear all bits if the error condition has been removed. Reading from the register will also clear the HIGH status bit in the Status Register. The ALERT pin will be set if any of these status bits are set. Bit 7 - E7HIGH - This bit is set when the External Diode 7 channel meets or exceeds its programmed high limit. Bit 6 - E6HIGH - This bit is set when the External Diode 6 channel meets or exceeds its programmed high limit. Bit 5 - E5HIGH - This bit is set when the External Diode 5 channel meets or exceeds its programmed high limit. Bit 4 - E4HIGH - This bit is set when the External Diode 4 channel meets or exceeds its programmed high limit. Bit 3 - E3HIGH - This bit is set when the External Diode 3 channel meets or exceeds its programmed high limit. Bit 2 - E2HIGH - This bit is set when the External Diode 2 channel meets or exceeds its programmed high limit. Bit 1 - E1HIGH - This bit is set when the External Diode 1 channel meets or exceeds its programmed high limit. Bit 0 - IHIGH - This bit is set when the Internal Diode channel meets or exceeds its programmed high limit. DS20005275A-page 42  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 5.19 Low Limit Status Register Table 5.24 Low Limit Status Register ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 36h R-C Low Limit Status E7 LOW E6 LOW E5 LOW E4 LOW E3 LOW E2 LOW E1 LOW ILOW 00h The Low Limit Status Register contains the status bits that are set when a temperature channel drops below the low limit for a number of consecutive readings as set by the consecutive alert counts (see Section 5.14). If any of these bits are set, then the LOW status bit in the Status Register is set. Reading from the Low Limit Status Register will clear all bits if the error condition has been removed. Reading from the register will also clear the LOW status bit in the Status Register. The ALERT pin will be set if any of these status bits are set. Bit 7 - E7LOW - This bit is set when the External Diode 7 channel drops below its programmed low limit. Bit 6 - E6LOW - This bit is set when the External Diode 6 channel drops below its programmed low limit. Bit 5- E5LOW - This bit is set when the External Diode 5 channel drops below its programmed low limit. Bit 4 - E4LOW - This bit is set when the External Diode 4 channel drops below its programmed low limit. Bit 3 - E3LOW - This bit is set when the External Diode 3 channel drops below its programmed low limit. Bit 2 - E2LOW - This bit is set when the External Diode 2 channel drops below its programmed low limit. Bit 1 - E1LOW - This bit is set when the External Diode 1 channel drops below its programmed low limit. Bit 0 - ILOW - This bit is set when the Internal Diode channel drops below its programmed low limit. 5.20 THERM Limit Status Register Table 5.25 THERM Limit Status Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 37h R-C THERM Limit Status E7 THERM E6 THERM E5 THERM E4 THERM E3 THERM E2 THERM E1 THERM I THERM 00h The THERM Limit Status Register contains the status bits that are set when a temperature channel THERM Limit is exceeded for a number of consecutive readings as set by the consecutive therm counts (see Section 5.14). If any of these bits are set, then the THERM status bit in the Status Register is set. Reading from the THERM Limit Status Register will not clear the status bits. Once the temperature drops below the THERM Limit minus the THERM Hysteresis, the corresponding status  2014 Microchip Technology Inc. DS20005275A-page 43 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet bits will be automatically cleared. The THERM bit in the Status Register will be cleared when all individual channel THERM bits are cleared. Bit 7 - E7THERM - This bit is set when the External Diode 7 channel meets or exceeds it’s programmed THERM Limit. Bit 6 - E6THERM - This bit is set when the External Diode 6 channel meets or exceeds it’s programmed THERM Limit. Bit 5 - E5THERM - This bit is set when the External Diode 5 channel meets or exceeds it’s programmed THERM Limit. Bit 4 - E4THERM - This bit is set when the External Diode 4 channel meets or exceeds it’s programmed THERM Limit. Bit 3 - E3THERM - This bit is set when the External Diode 3 channel meets or exceeds it’s programmed THERM Limit. Bit 2 - E2THERM - This bit is set when the External Diode 2 channel meets or exceeds it’s programmed THERM Limit. Bit 1 - E1THERM - This bit is set when the External Diode 1 channel meets or exceeds it’s programmed THERM limit. Bit 0- ITHERM - This bit is set when the Internal Diode channel meets or exceeds it’s programmed THERM limit. 5.21 REC Configuration Register Table 5.26 REC Configuration Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 39h R/W REC Config E7 REC_n E6_ REC_n E5_ REC_n E4_ REC_n E3_ REC_n E2_ REC_n E1_ REC_n - 00h The REC Control Register controls the Resistance Error Correction circuitry for each of the external diode channels. Bits 7 -0- EX_REC_n - Disables the Resistance Error Correction (REC) for the External Diode X channel. 5.22  ‘0’ (default) - REC is enabled.  ‘1’ - REC is disabled. Hottest Configuration Register Table 5.27 Hottest Configuration Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 3Ah R/W Hottest Config E7HOT E6HOT E5HOT E4HOT E3HOT E2HOT E1HOT IHOT 00h DS20005275A-page 44  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet The Hottest Configuration Register determines which External Diode Channels (if any) are compared during the “Hottest Of” comparison that is automatically performed at the end of every conversion cycle. Bits 7 - 0 - ExHOT - Controls whether the External Diode X temperature data is compared during the “Hottest Of” comparison.  ‘0’ (default) - The External Diode X channel is not compared during the “Hottest Of” Comparison.  ‘1’ - The External Diode X channel temperature data is compared to all other indicated channels during the “Hottest Of” Comparison. Bit 0 - IHOT - Controls whether the Internal Diode temperature data is compared during the “Hottest Of” comparison. 5.23  ‘0’ (default) - The Internal Diode channel is not compared during the “Hottest Of” Comparison.  ‘1’ - The Internal Diode channel temperature data is compared to all other indicated channels during the “Hottest Of” Comparison. Channel Configuration Register Table 5.28 Channel Configuration Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 3Bh R/W Channel Config REM_ HOT - - - EXT6_ APD EXT4_ APD EXT2_ APD - 00h The Channel Configuration Register determines which external diode channels are active in the device. Bit 7 - REM_HOT - Enables circuitry that will remember the last temperature channel that was determined to be the Hottest and flag an error if the hottest temperature channel changes.  ‘0’ (default) - The HOTTEST status bit will not be asserted if the hottest temperature channel changes.  ‘1’ - If the hottest temperature channel changes, then the HOTTEST status bit will be asserted. Bit 3 - EXT6_APD - Enables the DP6 / DN7 and DN6 / DP7 pins to support two anti-parallel diode connections versus a single diode connection.  ‘0’ (default) - The DP6 / DN7 and DN6 / DP7 pins do not support two anti-parallel diode connections. The pins will only monitor a single external diode (External Diode 6).  ‘1’ - The DP6 / DN7 and DN6 / DP7 pins support two anti-parallel diode connections (External Diode 6 and External Diode 7). Bit 2 - EXT4_APD - Enables the DP4 / DN5 and DN4 / DP5 pins to support two anti-parallel diode connections versus a single diode connection.  ‘0’ (default) - The DP4 / DN5 and DN4 / DP5 pins do not support two anti-parallel diode connections. The pins will only monitor a single external diode (External Diode 4).  ‘1’ - The DP4 / DN5 and DN4 / DP5 pins support two anti-parallel diode connections (External Diode 4 and External Diode 5).  2014 Microchip Technology Inc. DS20005275A-page 45 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Bit 1 - EXT2_APD- Enables the DP2 / DN3 and DN2 / DP3 pins to support two anti-parallel diode connections versus a single diode connection. 5.24  ‘0’ (default) - The DP2 / DN3 and DN2 / DP3 pins do not support two anti-parallel diode connections. The pins will only monitor a single external diode (External Diode 2).  ‘1’ - The DP2 / DN3 and DN2 / DP3 pins support two anti-parallel diode connections (External Diode 2 and External Diode 3). Filter Control Register Table 5.29 Filter Control Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT 40h R/W Filter Control AVG7_ EN AVG6_ EN AVG5_ EN AVG4_ EN AVG3_ EN AVG2_ EN AVG1_ EN - 00h The Filter Configuration Register controls the digital filter on the external diode channels. Bits 7 - 0 - AVGx_EN- Control the digital averaging that is applied to the External Diode X temperature measurements. 5.25  ‘0’ (default) - Digital Averaging is disabled.  ‘1’ - Digital averaging is enabled as a 4x running average for the External Diode X channel. Product ID Register Table 5.30 Product ID Register ADDR R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT FDh R Product ID 0 0 1 0 1 0 0 1 29h EMC1428 The Product ID Register holds a unique value that identifies the device. 5.26 Manufacturer ID Register (FEh) Table 5.31 Manufacturer ID Register ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT FEh R Manufacturer ID 0 1 0 1 1 1 0 1 5Dh The Manufacturer ID Register holds an 8-bit word that identifies Microchip. DS20005275A-page 46  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet 5.27 Revision Register (FFh) Table 5.32 Revision Register ADDR. R/W REGISTER B7 B6 B5 B4 B3 B2 B1 B0 DEFAULT FFh R Revision 0 0 0 0 0 0 0 1 01h The Revision register contains an 8 bit word that identifies the die revision.  2014 Microchip Technology Inc. DS20005275A-page 47 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 6 Package Information Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging. 6.1 EMC1428 Package Drawing Figure 6.1 16-Pin QFN 4mm x 4mm Package Dimensions DS20005275A-page 48  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Figure 6.2 16-Pin QFN 4mm x 4mm Package Drawing  2014 Microchip Technology Inc. DS20005275A-page 49 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Figure 6.3 16-Pin QFN 4mm x 4mm PCB Footprint 6.2 Package Markings 6.2.1 EMC1428-X-AP (16-Pin QFN) All devices will be marked on the first line of the top side with “1428” and “-X”. On they second line, packages are marked with the Lot Number. On the third line, packages are marked with Functional Revision code “B” and the Country Code (CC). DS20005275A-page 50  2014 Microchip Technology Inc. 1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones Data Sheet Chapter 7 Data Sheet Revision History Table 7.1 Revision History REVISION LEVEL AND DATE REV A SECTION/FIGURE/ENTRY CORRECTION REV A replaces previous SMSC version Rev. 0.70 (04-19-13) Rev. 0.70 (04-19-13) Ordering Number Corrected EMC1428-7 part number, adding -CB7 as a suffix Rev. 0.69 (06-29-09) Table 1.1, "EMC1428 Pin Description" Added “requires external pullup resistor” to SMDATA and SMCLK in function column Table 1.1, "EMC1428 Pin Description" Added the following application note below table: “For the 5V tolerant pins that have a pull-up resistor, the voltage difference between VDD and the pullup voltage must never exceed 3.6V.” Table 2.1, "Absolute Maximum Ratings" Updated voltage limits for 5V tolerant pins with pull-up resistors. Added the following note below table: “For the 5V tolerant pins that have a pull-up resistor, the pull-up voltage must not exceed 3.6V when the device is unpowered.” Updated thetaJA from 40 to 50. Rev. 0.67 (06-16-08)  2014 Microchip Technology Inc. Ordering Information Added EMC1428-7 Section 3.7, "SMBus Address" Added EMC1428-7 Address options DS20005275A-page 51 1°C Multiple Temperature Sensor with Beta Compensation and Hottest of Multiple Zones Data Sheet Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and ZScale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. A more complete list of registered trademarks and common law trademarks owned by Standard Microsystems Corporation (“SMSC”) is available at: www.smsc.com. The absence of a trademark (name, logo, etc.) from the list does not constitute a waiver of any intellectual property rights that SMSC has established in any of its trademarks. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 9781620779552 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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