EVB-LAN9352
Evaluation Board
User’s Guide
2015 Microchip Technology Inc.
DS50002415A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be
superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO
REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
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harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck,
MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and
UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL
ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-773-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS50002415A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2015 Microchip Technology Inc.
Object of Declaration:
2015 Microchip Technology Inc.
DS50002415A-page 3
EVB-LAN9352 Evaluation Board User’s Guide
NOTES:
DS50002415A-page 4
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
The Microchip Web Site ........................................................................................ 9
Development Systems Customer Change Notification Service ............................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................. 10
Chapter 1. Overview
1.1 Introduction ................................................................................................... 11
1.2 References ................................................................................................... 12
1.3 Terms and Abbreviations ............................................................................. 13
Chapter 2. Board Details
2.1 Power ........................................................................................................... 15
2.2 Power-On Reset ........................................................................................... 16
2.3 Clock ............................................................................................................ 16
Chapter 3. Board Configuration
3.1 Strap Options ............................................................................................... 17
3.1.1 GPIO Straps .............................................................................................. 17
3.1.2 GPIO Header ............................................................................................. 17
3.1.3 GPIO 6 & GPIO 7 Input and Output Configurations .................................. 20
3.1.4 External SoC ............................................................................................. 21
3.1.5 HBI/SPI Selection ...................................................................................... 22
3.1.6 HBI Mode Selection ................................................................................... 23
3.1.7 SPI/SQI Mode Selection ............................................................................ 24
3.1.8 I2C Aardvark® Header and SPI Storm Header ......................................... 25
3.1.9 Copper and Fiber Mode Selections ........................................................... 25
3.2 LEDs ............................................................................................................. 27
3.3 Test Points ................................................................................................... 27
3.4 Mechanicals ................................................................................................. 28
Appendix A. EVB-LAN9352 Evaluation Board
A.1 Introduction .................................................................................................. 29
Appendix B. EVB-LAN9352 Evaluation Board Schematics
B.1 Introduction .................................................................................................. 31
Appendix C. Bill of Materials (BOM)
C.1 Introduction .................................................................................................. 39
2015 Microchip Technology Inc.
DS50002415A-page 5
EVB-LAN9352 Evaluation Board User’s Guide
Worldwide Sales and Service .....................................................................................44
DS50002415A-page 6
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
EVB-LAN9352. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
The Microchip Web Site
Development Systems Customer Change Notification Service
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the EVB-LAN9352 Evaluation Board as a
development tool for the LAN9352 evaluation board. The manual layout is as follows:
• Chapter 1. “Overview” – Shows a brief description of the EVB-LAN9352 Evaluation Board.
• Chapter 2. “Board Details” – Includes instructions on how to get started with the
EVB-LAN9352 Evaluation Board.
• Chapter 3. “Board Configuration” – Provides information about the
EVB-LAN9352 Evaluation Board battery charging features.
• Appendix A. “EVB-LAN9352 Evaluation Board” – This appendix shows the
EVB-LAN9352 Evaluation Board.
• Appendix B. “EVB-LAN9352 Evaluation Board Schematics” – This appendix
shows the EVB-LAN9352 Evaluation Board schematics.
• Appendix C. “Bill of Materials (BOM)” – This appendix includes the
EVB-LAN9352 Evaluation Board Bill of Materials (BOM).
2015 Microchip Technology Inc.
DS50002415A-page 7
EVB-LAN9352 Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents code supplied by
user
DS50002415A-page 8
Examples
File>Save
Press ,
var_name [,
var_name...]
void main (void)
{ ...
}
2015 Microchip Technology Inc.
Preface
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest information on Microchip C compilers, assemblers, linkers
and other language tools. These include all MPLAB C compilers; all MPLAB
assemblers (including MPASM assembler); all MPLAB linkers (including MPLINK
object linker); and all MPLAB librarians (including MPLIB object librarian).
• Emulators – The latest information on Microchip in-circuit emulators.This
includes the MPLAB REAL ICE and MPLAB ICE 2000 in-circuit emulators.
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit 3 debug
express.
• MPLAB IDE – The latest information on Microchip MPLAB IDE, the Windows
Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and
MPLAB SIM simulator, as well as general editing and debugging features.
• Programmers – The latest information on Microchip programmers. These include
production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB
ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included
are nonproduction development programmers such as PICSTART Plus and
PIC-kit 2 and 3.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
2015 Microchip Technology Inc.
DS50002415A-page 9
EVB-LAN9352 Evaluation Board User’s Guide
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support
DOCUMENT REVISION HISTORY
Revision A (September 2015)
• Initial Release of this Document.
DS50002415A-page 10
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Chapter 1. Overview
1.1
INTRODUCTION
The LAN9352 is a full-featured, 2-port 10/100 managed Ethernet switch designed for
embedded applications where performance, flexibility, ease of integration and system
cost control are required. The LAN9352 combines all the functions of a 10/100 switch
system, including the Switch Fabric, packet buffers, Buffer Manager, Media Access
Controllers (MACs), PHY transceivers, and host bus interface. IEEE 1588v2 is supported via the integrated IEEE 1588v2 hardware time stamp unit, which supports
end-to-end and peer-to-peer transparent clocks.
The LAN9352 complies with the IEEE 802.3 (full/half-duplex 10BASE-T and
100BASE-TX) Ethernet protocol, IEEE 802.3az Energy Efficient Ethernet (EEE)
(100Mbps only), and 802.1D/802.1Q network management protocol specifications,
enabling compatibility with industry standard Ethernet and Fast Ethernet applications.
100BASE-FX is supported via an external fiber transceiver.
The Host MAC incorporates the essential protocol requirements for operating an Ethernet/IEEE 802.3-compliant node and provides an interface between the Host and the
Switch Fabric (LAN9352). On the front end, the Host MAC interfaces to the Host via 2
sets of FIFOs.
On the back end, the Host MAC interfaces with the 10/100 Ethernet PHYs (Virtual PHY
0, PHY A, PHY B) via an internal SMI (Serial Management Interface) bus. This allows
the Host MAC access to the PHY’s internal registers.
This manual describes the EVB-LAN9352, designed to explore the various features of
LAN9352.
Figure 1-1 displays the EVB-LAN9352 block diagram.
2015 Microchip Technology Inc.
DS50002415A-page 11
EVB-LAN9352 Evaluation Board User’s Guide
FIGURE 1-1:
EVB-LAN9352 BLOCK DIAGRAM
Connector for External
SoC
HBI
I2C
AARDVARK/
SPI storm
Connector
SPI/
SQI
HBI or SPI/SQI
Selection Switches
HBI or
SPI/SQI
Power Supply
Module
5V
2
I C EEPROM
Microchip
LAN9352
Reset
Straps
Jumpers
Fiber
Transceiver
(SFP)
1.2
Crystal
Port 1
Port 2
10/100
Ethernet
Magnetics &
RJ45
10/100
Ethernet
Magnetics &
RJ45
Ethernet
Ethernet
Fiber
Transceiver
(SFP)
REFERENCES
Concepts and material available in the following documents may be helpful when reading this document. Visit www.microchip.com for the latest documentation.
Document
LAN9352 Datasheet
Location
Visit www.microchip.com.
AN8-13 Suggested Mag- http://www.microchip.com/wwwApnetics
pNotes/AppNotes.aspx?appnote=en562793
EVB-LAN9352 Evaluation Board Schematic
DS50002415A-page 12
Visit www.microchip.com.
2015 Microchip Technology Inc.
1.3
TERMS AND ABBREVIATIONS
EVB - Evaluation Board
DNP - Do Not Populate
100BASE-TX - 100 Mbps Fast Ethernet, IEEE802.3u Compliant
GPIO - General Purpose I/O
HBI - Host Bus Interface
SPI - Serial Peripheral Interface
I2C - Inter-Integrated Circuit
EEE - Energy-Efficient Ethernet
SFP - Small Form-factor Pluggable
SoC - System on a Chip
2015 Microchip Technology Inc.
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EVB-LAN9352 Evaluation Board User’s Guide
NOTES:
DS50002415A-page 14
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Chapter 2. Board Details
The following sections describe the various board features, including jumpers, LEDs,
test points, system connections, and switches. A top view of the EVB-LAN9352 is
shown in Figure 2-1.
FIGURE 2-1:
LAN9352 BOARD REV-A
SoC Header
EEPROM
Strap
Power Circuit
Reset
5V Test point
HBI Mode Select
3V3 Test point
Microchip
LAN9352
HBI / SPI Select
Port 1
(with integrated
magnetics & LEDs)
2.1
Port 2
(with integrated
magnetics & LEDs)
POWER
DC 5V is applied through (J1) DC Socket, powered by a +5V external wall adapter.
Switch (SW1) needs to be in the ON position for the 5V to reach the 3.3V regulator.
Glowing of Green LED (D1) indicates successful generation of 3.3V o/p. This power is
supplied to the LAN9352 and it has and internal 1.2 V regulator, which then supplies
power to the internal core logic.
2015 Microchip Technology Inc.
DS50002415A-page 15
EVB-LAN9352 Evaluation Board User’s Guide
2.2
POWER-ON RESET
A power-on reset occurs whenever power is initially applied to the LAN9352 or if the
power is removed and then reapplied to the LAN9352. This event resets all circuitry
within the LAN9352. After initial power-on, the LAN9352 can be reset by pressing the
reset switch (SW2). The reset LED D2 will assert (red) when the LAN9352 is in reset
condition. For stability, a delay of approximately 180ms is added from the +3.3V o/p to
reset release.
2.3
CLOCK
The LAN9352 requires a fixed-frequency 25MHz clock source for use by the internal
clock oscillator and PLL. This is typically provided by attaching a 25MHz crystal to the
OSCI and OSCO pins
Manufacturer: Cardinal Components Inc. and P/N: CSM1Z-A5B2C5-40-25.0D18-F
DS50002415A-page 16
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Chapter 3. Board Configuration
3.1
STRAP OPTIONS
The following tables describe the default settings and jumper descriptions for the
EVB-LAN9352. These defaults are the recommended configurations for evaluation of
the LAN9352. These settings may be changed as needed, however, any deviation from
the defaults settings should be approached with care and knowledge of the schematics
and datasheet. An incorrect jumper setting may disable the board.
3.1.1
GPIO Straps
The GPIO/LED Controller provides 8 configurable general purpose input/output pins,
GPIO [7:0]. These pins can be individually configured to function as inputs, push-pull
outputs or open drain outputs and each is capable of interrupt generation with configurable polarity. Alternatively, 6 GPIO pins can be configured as LED outputs, enabling
these pins to drive Ethernet status LEDs for external indication of various attributes of
the ports. All GPIOs also provide extended 1588 functionality.
Table 3-1 illustrates how the GPIO lines are multiplexed with other signals.
TABLE 3-1:
3.1.2
GPIO STRAPS
GPIO Line
Multiplexed Signals
GPIO 0
LED0/MNGT0/TD0
GPIO 1
LED1/MNGT1/TD1
GPIO 2
LED2/E2PSIZE
GPIO 3
LED3/EEEN
GPIO 4
LED4/1588EN
GPIO 5
LED5/PHYADD
GPIO Header
The GPIO/LED Controller provides 8 configurable general purpose input/output pins, G
J18 is used GPIO Header for probing purpose. Table 3-2 illustrates how the GPIO lines
are multiplexed with other signals.
TABLE 3-2:
2015 Microchip Technology Inc.
GPIO HEADER
GPIO Line
Multiplexed Signals
GPIO 0
J18.1
GPIO 1
J18.2
GPIO 2
J18.3
GPIO 3
J18.4
GPIO 4
J18.5
GPIO 5
J18.6
GPIO 4
J18.7
GPIO 5
J18.8
DS50002415A-page 17
EVB-LAN9352 Evaluation Board User’s Guide
In the context of using the GPIO signals as LED controller, the Jumpers J4-J15 (operated in pairs) are configured as below.
For example, J4 and J7 as a pair set as ‘0’ or ‘1’, decide whether LED0 (D3) is turned
ON or OFF.
Likewise, J6 and J9 as a pair set as ‘0’ or ‘1’, decide whether LED1 (D4) is turned ON
or OFF.
FIGURE 3-1:
LED STRAP CIRCUIT
All strap values are read during power-up and on the rising edge of nRST signal. Once
the strap value is set, the LAN9352 will drive the LEDs high or low for illumination
according to the strap value.
3.1.2.1
GPIO/LED CONFIGURATIONS
GPIO/LED configuration straps are used to configure the LEDs and GPIOs through
jumpers as shown below in Table 3-3.
TABLE 3-3:
GPIO/LED CONFIGURATIONS
Header
Pin Settings
Signal Name
Strap Value
Description
J4 & J7
1-2(default)
GPIO0
/LED0
1
The LED (D3) is set as active
LOW.
0
The LED (D3) is set as active
HIGH.
1
The LED (D4) is set as active
LOW.
0
The LED (D4) is set as active
HIGH.
1
The LED (D5) is set as active
LOW.
0
The LED (D5) is set as active
HIGH.
2 -3
J5 & J8
1-2(default)
GPIO1
/LED1
2 -3
J6 & J9
1-2(default)
2 -3
DS50002415A-page 18
GPIO2
/LED2
2015 Microchip Technology Inc.
TABLE 3-3:
GPIO/LED CONFIGURATIONS (CONTINUED)
Header
Pin Settings
Signal Name
Strap Value
Description
J10 & J13
1-2(default)
GPIO3
/LED3
1
The LED (D6) is set as active
LOW.
0
The LED (D6) is set as active
HIGH.
1
The LED (D7) is set as active
LOW.
0
The LED (D7) is set as active
HIGH.
1
The LED (D8) is set as active
LOW.
0
The LED (D8) is set as active
HIGH.
2 -3
J11 & J14
1-2(default)
GPIO4
/LED4
2 -3
J12 & J15
1-2(default)
GPIO5
/LED5
2 -3
3.1.2.2
HOST INTERFACE MODE STRAP SELECTION
MNGT0 strap along with MNGT1, MNGT2 and MNGT3 configures the host mode
MNGT0 and MNGT1 are multiplexed with GPIO0 and GPIO1 signals whereas MNGT3
and MNGT4 are multiplexed with address lines A3 and A4.
Table 3-4 illustrates the selection of Host mode based on the values of MNGT straps.
TABLE 3-4:
MANAGEMENT STRAP SELECTION
MNGT1
J5 & J8
MNGT0
J4 & J7
MNGT3
J24
MNGT2
J23
0
0
X
X
SPI
0
1
0
0
HBI Multiplexed 1 Phase 8-bit
0
1
0
1
HBI Multiplexed 1 Phase
16-bit (Default)
0
1
1
0
HBI Multiplexed 2 Phase 8-bit
0
1
1
1
HBI Multiplexed 2 Phase
16-bit
1
0
X
X
HBI Indexed 8-bit
1
1
X
X
HBI Indexed 16-bit
3.1.2.3
Host Mode
EEPROM SIZE CONFIGURATION
The EEPROM size configuration strap (Multiplexed with GPIO2/LED2) [J6 & J9] determines the supported EEPROM size range. A low selects 1Kbits (128 x 8) through
16Kbits (2K x 8)_24C16. A high selects 32Kbits (4K x 8) through 512Kbits (64K x 8) or
4Mbits (512K x 8)_24C512 as shown below in Table 3-5.
TABLE 3-5:
EEPROM SIZE CONFIGURATION
Header
Pin Settings
eeprom_size_strap
Value
J6 & J9
1-2 (default)
1
EEPROM size = 32K bits (4k x 8)
through 512K bits (64K x 8)
2 -3
0
EEPROM size = 1K bits (128 x 8)
through 16K bits (2K x 8)
2015 Microchip Technology Inc.
Description
DS50002415A-page 19
EVB-LAN9352 Evaluation Board User’s Guide
3.1.2.4
ENERGY EFFICIENT ETHERNET CONFIGURATION
EEEEN configuration strap (Multiplexed with GPIO3/LED3) is used to configure the
default value of the EEE Enable 2-1 soft-straps (EEE_enable_strap_[2:1]) through
jumpers as shown below in Table 3-6.
Note:
“EEE_enable_strap_1” strap is used for the LAN9352 when in Port 1 internal PHY mode.
TABLE 3-6:
EEEEN CONFIGURATION
Header
Pin Settings
EEE_enable_strap_[2:1]
Value
J10 & J13
1-2 (default)
1
EEE Enable
2 -3
0
EEE Disable
3.1.2.5
Description
1588 ENABLE CONFIGURATION
1588 Enable Strap (Multiplexed with GPIO4/LED4) is used to configure the default
value of the 1588 Enable soft-strap (1588_enable_strap) through jumpers as shown
below in Table 3-7.
TABLE 3-7:
1588 ENABLE CONFIGURATION
Header
Pin Settings
1588_enable_strap
Value
J11 & J14
1-2 (default)
1
1588 Enable
2 -3
0
1588 Disable
3.1.2.6
Description
PHY ADDRESS CONFIGURATION
PHY Address selection strap (Multiplexed with GPIO5/LED5) is used to configure the
default value of the Switch PHY Address Select soft-strap (phy_addr_sel_strap)
through jumpers as shown below in Table 3-8.
TABLE 3-8:
Header
Pin Settings
J12 & J15
3.1.3
PHY ADDRESSING
PHY_ADDR_
SEL_STRAP
Value
VIRTUAL
PHY 0 and 1
Default
Address
Value
PHY A
Default
Address
Value
PHY B
Default
Address
Value
1-2
1
1
2
3
2-3 (default
0
0
1
2
GPIO 6 & GPIO 7 Input and Output Configurations
GPIO 6 & 7 configuration straps are used to configure the default input value of the
GPIO 6 and 7 through jumpers as shown below in Table 3-9 and Table 3-10 respectively.
TABLE 3-9:
Header
J16
J17
DS50002415A-page 20
INPUT CONFIGURATION
Pin Settings
Input
Signal Name
1-2
1
GPIO6
2-3
0
1-2
1
2-3
0
GPIO7
2015 Microchip Technology Inc.
TABLE 3-10:
Header
Pin Settings
Output
Signal Name
J16
2
Push Pull
GPIO6
J17
2
Push Pull
GPIO7
Note:
3.1.4
OUTPUT CONFIGURATION
By default, the jumpers settings for J16 & J17 will be OPEN.
External SoC
Purpose of External SoC is to provide HBI and SPI access to the LAN9352.
TABLE 3-11:
EXTERNAL SOC SETTINGS
Header
Default Pin Settings
Signal Name
J19
1-2 (Short)
VDD_5V
J27
1-2 (Open)
VDD3V3EXP
Refer to this link for a detailed discussion on BeagleBone Black: http://www.newark.com/beagle-bone-accessories?rd=beaglebone&catalogId=15003&langId=-1&storeId=10194
Figure 3-2 shows how BeagleBone Black is mounted on EVB-LAN9352.
2015 Microchip Technology Inc.
DS50002415A-page 21
EVB-LAN9352 Evaluation Board User’s Guide
FIGURE 3-2:
3.1.5
EVB-LAN9352 WITH BEAGLEBONE BLACK
HBI/SPI Selection
The EVB-LAN9352 supports two host interface modes of LAN9352:
• HBI Mode (Default)
• SPI/SQI Mode
The HBI or SPI/SQI configuration is selected using the DPDT SW8 to SW10 switches.
TABLE 3-12:
HBI AND SPI/SQI SWITCH CONFIGURATIONS
Switch
DS50002415A-page 22
Description
SW8 to SW10
Up
SW8 to SW10
Down
Settings
HBI Mode (Default)
SPI/SQI Mode
2015 Microchip Technology Inc.
FIGURE 3-3:
3.1.6
SW8-SW10 HBI AND SPI/SQI MODE SELECTION
HBI Mode Selection
The LAN9352 supports various HBI modes. The HBI modes (Multiplexed Modes and
Indexed Modes) can be selected using the SPST switches (P/N: 450301014042-Wurth
Electronics) SW4 through SW6 and SW11 through SW12. The LAN9352 HBI signals
are connected to the SoC through the switches.
3.1.6.1
MULTIPLEXED MODES
The following four HBI Multiplexed Modes are supported:
1.
2.
3.
4.
8-bit Multiplexed single-phase mode
16-bit Multiplexed single-phase mode
8-bit Multiplexed dual-phase mode
16-bit Multiplexed dual-phase mode
The BeagleBone Black will be configured by installing specific driver available from
www.microchip.com. This is required to access LAN9352 through HBI Multiplexed
mode.
The switch selection for Multiplexed Mode. All four Multiplexed Modes utilize the same
switch positions.
FIGURE 3-4:
TABLE 3-13:
Note:
2015 Microchip Technology Inc.
MULTIPLEXED HBI MODE SELECTION
SWITCH SELECTION FOR MULTIPLEXED MODE
Switch
Description
SW11
Down
SW4
Down
SW12
Down
SW6
Down
SW5
Down
For Switches to short 1-2, knob position must be in the 1-3 position, and
vice versa.
DS50002415A-page 23
EVB-LAN9352 Evaluation Board User’s Guide
3.1.6.2
INDEXED MODE
Two Indexed modes are supported, namely 8-bit and 16-bit. The BeagleBone Black will
be configured by installing specific driver available from www.microchip.com. This is
required to access LAN9352 through HBI Indexed mode.
Note:
In this mode. DIP switch SW15 to ON Position for PIC32 SoC and OFF
Position for SoC.
FIGURE 3-5:
TABLE 3-14:
Note:
TABLE 3-15:
3.1.7
SWITCH SELECTION FOR 8-BIT INDEXED MODE
Switch
Description
SW11
Down
SW4
Up
SW12
Down
SW6
Up
SW5
Up
For Switches to short 1-2, knob position must be in the 1-3 position, and
vice versa.
FIGURE 3-6:
Note:
8-BIT INDEXED MODE SWITCH SELECTION
16-BIT INDEXED MODE SWITCH SELECTION
SWITCH SELECTION FOR 16-BIT INDEXED MODE
Switch
Description
SW11
Down
SW4
Down
SW12
Down
SW6
Up
SW5
Up
For Switches to short 1-2, knob position must be in the 1-3 position, and
vice versa.
SPI/SQI Mode Selection
The LAN9352 supports SPI/SQI Mode. The SPI/SQI Mode will be selected using the
DPDT SW8 to SW10 switches as shown in Figure 3-3.
DS50002415A-page 24
2015 Microchip Technology Inc.
3.1.8
I2C Aardvark® Header and SPI Storm Header
3.1.8.1
I2C AARDVARK HEADER
J20 connector is used for I2C Aardvark header. Respective pin details are given in
Table 3-16.
PIN NAMES FOR I2C AARDVARK HEADER
TABLE 3-16:
3.1.8.2
Signal Name
Pin Number
I2C2_SCL
J20.1
I2C2_SDA
J20.3
GND
J20.2 & J20.10
SPI STORM HEADER
J20+J21 connectors are used for SPI Storm header. Respective pin details are given
in Table 3-17.
TABLE 3-17:
3.1.9
PIN NAMES FOR SPI STORM HEADER
Signal Name
Pin Number
SIO1
J20.5
SCK
J20.7
SCS#
J20.9
SIO0
J20.8
SIO2
J21.3
SIO3
J21.4
GND
J20.2, J20.10, J21.1 & J21.2
Copper and Fiber Mode Selections
The LAN9352 supports 100BASE-TX (Copper) and 100BASE-FX (Fiber) modes. In
100BASE-FX operation, the presence of the receive signal is indicated by the external
transceiver as either an open-drain, CMOS level, Loss of Signal (SFP) or a LVPECL
Signal Detect (SFF).
This EVB supports 100BASE-TX (Copper) and 100BASE-FX (Fiber) in SFP mode. By
default Copper Mode is active. Fiber Mode is supported as an assembly option. To
select the Copper or Fiber Mode, the respective strap and signal routing resister
assembly options must be configured.
Note:
3.1.9.1
Vendor part number for SFP Transceiver: Finisar/FTLF1217P2
COPPER MODE
The EVB-LAN9352 is set to Copper Mode by default. Table 3-18 details the required
strap resistors settings for Copper Mode operation.
TABLE 3-18:
COPPER MODE STRAP RESISTORS
Resistors
Signal Names
Description
R79 (10K)
FXLOSEN
Copper twisted pair for ports A and B further
determined by FXSDENA and FXSDENB
R76, R80 (10K)
FXSDA/FXSDB
Configures Port 0 and Port 1 to Copper Mode
Note:
2015 Microchip Technology Inc.
R75, R77, and R78 must not be populated (DNP).
DS50002415A-page 25
EVB-LAN9352 Evaluation Board User’s Guide
Additionally, the signal routing resistors detailed in Table 3-19 must be assembled for
Copper Mode operation.
TABLE 3-19:
Note:
3.1.9.2
COPPER MODE SIGNAL ROUTING RESISTORS
Resistors
Description
R17, R19,R21, R23
Port 0 Copper mode is Enabled
R31, R33, R35, R37
Port 1 Copper mode is Enabled
R16, R18, R20, R22, R30, R32, R34, and R36 (0402 package) must not be
populated (DNP).
FIBER MODE
The LAN9352 supports SFP type 100BASE-FX mode. To enable Fiber Mode, the
respective strap and signal routing resisters must be configured.
Note:
Copper Mode related resistors must be DNP while Fiber Mode is active
(refer to Section 3.1.9.1 “Copper Mode”).
Table 3-20 details the required strap resistor settings for Fiber Mode operation.
TABLE 3-20:
Note:
3.1.9.3
FIBER MODE SIGNAL ROUTING RESISTORS
Resistors
Description
R16, R18, R20, R22
Port 0 Fiber mode is Enabled
R30, R32, R34, R36
Port 1 Fiber mode is Enabled
R17, R19, R21, R23, R31, R33, R35, and R37 (0402 package) must not be
populated (DNP).
FX-LOS FIBER MODE STRAP
FX-LOS strap details are shown in Table 3-21. These strap settings determine if the
ports are to operate in FX-LOS Fiber Mode or FX-SD/Copper Mode.
TABLE 3-21:
R77 (10K)
R79 (10K)
Reference Voltage (v)
Function
Populate
DNP
3.3
A level above 2V selects FX-LOS for Port
0 and Port 1
Populate
Populate
1.5
A level of 1.5V selects FX-LOS for Port 0
and FX-SD / Copper twisted pair for Port
1, further determined by FXSDB
DNP
Populate
0 (Default)
A level of 0V selects FX-SD / Copper
twisted pair for Ports 0 and 1, further
determined by FXSDA, FXSDB
Note:
DS50002415A-page 26
FX-LOS MODE STRAP SETTINGS
The above strap details describe the LAN9352 function. This EVB does not
support SFF Fiber Mode. Therefore, FX-SD related straps are not applicable.
2015 Microchip Technology Inc.
3.2
LEDS
LED details are shown in Table 3-22.
TABLE 3-22:
3.3
LEDS
Reference
Color
Indication
D1
Green
3.3V Power active
D2
Red
LAN9352 is in reset condition
Description
Connection
TP1
Single pin populated 5V
5V_EXT
TP2
Single pin populated 3V3
3V3
TP3
Single pin populated GND
GND
TP4
Single pin populated GND
GND
TP5
Single pin unpopulated
VDDCR
VDDCR/1.2V
TEST POINTS
Test points are shown in Table 3-23.
TABLE 3-23:
TEST POINTS
Test Points
2015 Microchip Technology Inc.
DS50002415A-page 27
EVB-LAN9352 Evaluation Board User’s Guide
3.4
MECHANICALS
Figure 3-7 details for EVB-LAN9352 mechanical dimensions. Dimensions are in mm.
FIGURE 3-7:
DS50002415A-page 28
EVB-LAN9352 MECHANICAL DIMENSIONS
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Appendix A. EVB-LAN9352 Evaluation Board
A.1
INTRODUCTION
This appendix shows the EVB-LAN9352 Evaluation Board.
FIGURE A-1:
EVB-LAN9352 EVALUATION BOARD
2015 Microchip Technology Inc.
DS50002415A-page 29
EVB-LAN9352 Evaluation Board User’s Guide
NOTES:
DS50002415A-page 30
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Appendix B. EVB-LAN9352 Evaluation Board Schematics
B.1
INTRODUCTION
This appendix shows the EVB-LAN9352 Evaluation Board Schematics.
2015 Microchip Technology Inc.
DS50002415A-page 31
POWER SUPPLY & RST
POWER SUPPLY
FB1
2
5V_SW
3
EN12_1
2A/0.05DCR
2
R1
Switch, SPDT, Slide
P/N:1101M2S3CQE2
J1
2
1
0E
C2
10uF
25V
VIN
ENABLE
VOUT
TRIM
3_Amp
GND
C3
4
5
C1
3
OKR-T/3-W12-C
0.1uF
R2
1K
VOUT_3V3
R3
3.30K
1%
R4
470E
1%
(Ra)
(Rb)
R4A
33E
1%
C4
C5
10uF
0.1uF
4.7uF
DNP
1
1
A
5V_EXT
3
D1
GRN
C
1
3V3
3V3
"3V3 Present"
SW1
TP2
ORANGE
3 V REGULATOR, 3A
( 3V3 fixed when Rb=470E)
U1
5V
2
TP1
RED
RESET Options
3V3
3V3
3V3
Reset Generator
RESET
NDS355AN_NMOS
1
D
RST#
Q1
3
R8
1K
1
G
5
RESET#
3
S
4
1
R9
TPS3125
SOT23_5
Threshold = 2.64V
Delay = 180ms
RED
U3
2
2.2K
74LVC1G14
A
D2
"Reset"
1
3
MR#
2
3V3
VDD
4
5
U2
2
1/10W
1%
2
sw_pb_2P
1
R7
100
GND
SW2
R5
4.75K
1%
0.1uF
2
1
C6
R6
10.0K
1/10W
1%
2015 Microchip Technology Inc.
TP3
BLACK
TP4
BLACK
C
2
EVB-LAN9352 Evaluation Board User’s Guide
DS50002415A-page 32
FIGURE B-1:
LAN9352 (PART1)
Power Supply Filtering
VDD33TXRX1
3V3
2A/0.05DCR
0.1uF
C24
FB5
2A/0.05DCR
18pF
REG_EN
R10
12.1K
1%
RBIAS
7
65
RST#
11
IRQ
49
ATEST/FXLOSEN
8
46
I2C2_SCL
I2C2_SDA
48
47
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
53
51
50
38
22
21
13
12
REG_EN
RBIAS
RST#
IRQ
ATEST/FXLOSEN
64
67
VDD12TX1
VDD12TX2
6
28
43
VDDCR_1
VDDCR_2
VDDCR_3
16
24
36
42
52
VDDIO_1
VDDIO_2
VDDIO_3
VDDIO_4
VDDIO_5
VDD33BIAS
VDD33
FXSDENA/FXSDA/FXLOSA
TESTMODE
EESCL/TCK
EESDA/TMS
INT PORT0
C27
OSCVDD12
OSCI
OSCO
OSCVSS
TXNA
TXPA
RXNA
RXPA
INT PORT1
1
3
1
2
4
I2C
OSCI
OSCO
3V3
OTHER
SIGNALS
25.000MHz
25ppm
Y1
OSC
POWER
18pF
2
C26
VDD33TXRX1
VDD33TXRX2
59
72
U4-1
Note:
OSCVSS need to connect to Chip gnd.
66
5
VDD12TX1
VDD12TX2
0.1uF
TXNB
TXPB
RXNB
RXPB
GND
73
58
57
54
LAN9352_QFN72
NC_3
NC_2
NC_1
FXSDENB/FXSDB/FXLOSB
GPIO0/LED0/TDO/LEDPOL0/MNGT0
GPIO1/LED1/TDI/LEDPOL1/MNGT1
GPIO2/LED2/LEDPOL2/E2PSIZE
GPIO3/LED3/LEDPOL3/EEEEN
GPIO4/LED4/LEDPOL4/1588EN
GPIO5/LED5/LEDPOL5/PHYADD
GPIO6
GPIO7
9
FXSDA/FXLOSA
60
61
62
63
TXNA
TXPA
RXNA
RXPA
71
70
69
68
TXNB
TXPB
RXNB
RXPB
10
FXSDB/FXLOSB
C20
C21
C22
0.1uF
0.1uF
1uF
470pF
C18
0.1uF
C16
C14
C15
C13
C12
DNP
C11
C17
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
BLM18EG221SN1D
C25
C23
1.0uF
DNP
TP5
SMT
VDDCR
1.0uF
2A/0.05DCR
3V3
2A/0.05DCR
0.1uF
3V3
FB4
C9
3V3
0.1uF
VDD33TXRX2
0.1uF
FB3
C8
C10
C7
1.0uF
DNP
VDDCR
VDD12TX1
VDD12TX2
DNP
1.0uF
FB2
Low ESR C19
3V3
VDD33TXRX1
VDD33TXRX2
2015 Microchip Technology Inc.
FIGURE B-2:
DS50002415A-page 33
COPPER MODE INTERFACE
/,1.$&7
R61
330E
LED2_ANODE
LED2_CATHODE
VDD33TXRX1
FB6
R11
49.9
1/10W
1%
TXPA
DNP
R16
R17
0E
0E
FX_SFP-TXPA
TXNA
DNP
R18
R19
0E
0E
FX_SFP-TXNA
R12
49.9
1/10W
1%
R13
49.9
1/10W
1%
R14
49.9
1/10W
1%
9
10
C
0E
R15
0E
GRN
1
COP-TXPA
4
2
COP-TXNA
A
3257
T1
Pulse J0011D01BNL
RJ45
XMIT
TD+
75
75
1
TXCT
4&5
TD-
2
'HIDXOWDVVHPEO\
LED1 (Green) = LINK/ACT
6
COP-RXNA
DNP
C29
10pF
50V
5%
DNP
C30
10pF
50V
5%
DNP
C31
10pF
50V
5%
7
8
50V
10%
RXCT
6
RD-
1000 pF
NC
14
13
YEL
R62
R24
LED0_ANODE
63(('
/,1.$&7
R63
330E
LED5_ANODE
LED5_CATHODE
VDD33TXRX2
FB7
DNP
R30
R31
0E
0E
FX_SFP-TXPB
TXNB
DNP
R32
R33
0E
0E
FX_SFP-TXNB
RXPB
DNP
R34
R35
0E
0E
FX_SFP-RXPB
RXNB
DNP
R36
R37
R26
49.9
1/10W
1%
R27
49.9
1/10W
1%
R28
49.9
1/10W
1%
R29
0E
GRN
1
COP-TXPB
4
2
COP-TXNB
A
C
R25
49.9
1/10W
1%
9
10
T2
Pulse J0011D01BNL
0E
TXPB
330E
LED0_CATHODE
0E
RES1210
3257
2 kV
CHS GND
Note:
Capacitors C28 through C31 are optional for EMI purposes
and are not populated on the LAN9252 evaluation board.
These capacitors are required for operation in an EMI
constrained environment.
3
7&8
GND
DNP
C28
10pF
50V
5%
C32
0.022uF
75
A1
FX_SFP-RXNA
LED2 (Yellow) = SPEED
75
12
0E
0E
RCV
RD+
C1
5
11
3
COP-RXPA
MTG1
FX_SFP-RXPA
MTG
0E
0E
16
RXNA
DNP
R22
R23
15
DNP
R20
R21
GND1
RXPA
RJ45
XMIT
TD+
75
75
1
TXCT
4&5
TD-
2
LED1 (Green) = LINK/ACT
6
RD-
1000 pF
NC
Note:
Capacitors C33 through C36 are optional for EMI purposes
and are not populated on the LAN9252 evaluation board.
These capacitors are required for operation in an EMI
constrained environment.
2 kV
CHS GND
YEL
A1
8
3
12
50V
10%
7
C1
C37
0.022uF
11
DNP
C36
10pF
50V
5%
MTG1
DNP
C35
10pF
50V
5%
MTG
DNP
C34
10pF
50V
5%
16
DNP
C33
10pF
50V
5%
15
6
COP-RXNB
75
7&8
GND1
FX_SFP-RXNB
75
RXCT
GND
0E
0E
LED2 (Yellow) = SPEED
RD+
13
2015 Microchip Technology Inc.
5
14
3
COP-RXPB
RCV
R64
R38
0E
RES1210
LED3_CATHODE
63(('
330E
LED3_ANODE
EVB-LAN9352 Evaluation Board User’s Guide
DS50002415A-page 34
FIGURE B-3:
SFP INTERFACE
3V3
R39
82
R40
82
R41
49.9
R42
49.9
Note:Place
capacitors,
and resistors
close to FOT
C38
0.1uF
3V3
Fiber Port 0 :SFP Interface
R43
82
R44
82
R45
49.9
R46
49.9
Note:Place
capacitors,
and resistors
close to FOT
Assemble 0E at C38,C40,C42,C44
FX_SFP-RXNA
C39
0.1uF
C41
0.1uF
C43
0.1uF
Fiber Port 1 :SFP Interface
Assemble 0E at C39,C41,C43,C45
FX_SFP-RXNB
C40
0.1uF
C42
0.1uF
FX_SFP-RXPA
FX_SFP-RXPB
FX_SFP-TXPA
FX_SFP-TXPB
DNP
R47
100
C44
SFP_VCCT
0.1uF
L2
SFP_VCCR
FX_SFP-TXNA
DNP
R48
100
3V3
1uH
C45
0.1uF
L1
SFP_VCCR2
1uH
0.1uF
0.1uF
R51
130
R52
130
1uH
R54
4.7K
C55
VeeT1
TDTD+
VeeT2
VccT
VccR
VeeR2
RD+
RDVeeR3
C54 +
10uF
16V
Note:Place
resistors
close to
ASIC
0.1uF
J3
FTLF1217P2
SFP_VCCT2
1
2
3
4
5
6
7
8
9
10
31
30
29
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
9
10
SFP_VCCT
31
30
29
28
27
26
25
24
23
22
21
R55
4.7K
R57
4.7K
R56
4.7K
FXSDA/FXLOSA
R58
4.7K
R59
4.7K
R60
4.7K
FXSDB/FXLOSB
31
30
29
28
27
26
25
24
23
22
21
31
30
29
28
27
26
25
24
23
22
21
C56 +
10uF
16V
C52 +
10uF
16V
C51
0.1uF
L3
20
19
18
17
16
15
14
13
12
11
VeeT1
TDTD+
VeeT2
VccT
VccR
VeeR2
RD+
RDVeeR3
J2
FTLF1217P2
VeeT
TXFault
TX Disable
MOD-DEF(2)
MOD-DEF (1)
MOD-DEF (0)
Rate Select
LOS
VeeR
VeeR1
Note:Place
resistors
close to
ASIC
DNP
C50 +
10uF
16V
20
19
18
17
16
15
14
13
12
11
L4
C49
SFP_RD2+
SFP_RD2-
C48 +
10uF
16V
C47
SFP_TD2SFP_TD2+
R50
130
DNP
C46 +
10uF
16V
SFP_RD+
SFP_RD-
SFP_TDSFP_TD+
FX_SFP-TXNB
R49
130
R53
4.7K
3V3
SFP_VCCT2
VeeT
TXFault
TX Disable
MOD-DEF(2)
MOD-DEF (1)
MOD-DEF (0)
Rate Select
LOS
VeeR
VeeR1
2015 Microchip Technology Inc.
FIGURE B-4:
C57
0.1uF
1uH
C53
0.1uF
DS50002415A-page 35
GPIO [0:2] & LED_POL_Strap
GPIO2
GPIO1
GPIO4
2
2K
2K
5
I2C2_SDA
6
I2C2_SCL
TH IC.
Different sizes can be mounted
2
I2C EEPROM Lower size
Below 16K(2K X 8)
GPIO3
I2C EEPROM Higher size
Above 16K(2K X 8)
3
1
3
J15
1
3
J13
1
3
DNP
R86
1K
2
2
DNP
R85
1K
J14
1
3
J8
1
3
J9
1
J7
GPIO0
DNP
R84
1K
2
DNP
R74
1K
2
2
DNP
R73
1K
SDA
SCL
WP
R68
R67
A0
A1
A2
24FC512
DNP
R72
1K
8
VCC
2
7
2
2
1
2
3
0.1uF
GND
3
1
3
1
2
0E
R83
10.0K
LED3_CATHODE
LED5_CATHODE
2
2
R66
LED3_ANODE
LED5_ANODE
R82
10.0K
LED1_CATHODE
LED4_CATHODE
2
LED0_CATHODE
LED2_CATHODE
R81
10.0K
U5
J12
2
R71
10.0K
GPIO5
4
R70
10.0K
3
1
3
1
LED1_ANODE
LED4_ANODE
1
1
1
LED0_ANODE
LED2_ANODE
R69
10.0K
J10
3V3
C58
GPIO3
J11
3V3
3V3
GPIO4
2
J5
2
J6
2
J4
3V3
GPIO1
3
1
GPIO2
3
1
GPIO0
I2C EEPROM
3V3
1
3V3
1
3V3
1
3V3
GPIO5
FX_Los_Strap_1 & 2
3V3
3V3
LED0_ANODE
LED0_ANODE
LED0_CATHODE
LED0_CATHODE
LED1_ANODE
LED1_CATHODE
DNP
D3 1
GRN A
PORT1
SPEED
2
LED3_ANODE
C
LED3_CATHODE
D4 1
GRN A
FULL DUPLEX
2
C
PORT1
LINK/ACT
2
D5 1
C
GRN A
LED3_ANODE
LED3_CATHODE
LED4_ANODE
LED4_CATHODE
DNP
LED2_ANODE
LED2_ANODE
LED2_CATHODE
LED2_CATHODE
LED5_ANODE
LED5_CATHODE
LED5_ANODE
LED5_CATHODE
DNP
D6 1
GRN A
PORT2
SPEED
1
2
2
GPIO6
R87
C
3
10K
FULL DUPLEX
2
C
PORT2
DNP
LINK/ACT
2
D8 1
C
GRN A
3V3
1
R88
3RXSXODWH
'13
'13
3RXSXODWH
'HIDXOW 'HIDXOW
2
GPIO7
5
3RXSXODWH 3RXSXODWH
J16
OPEN
D7 1
GRN A
5
5HI9ROWDJH
)XQFWLRQ
9
$ERYH9VHOHFWV);/26IRUSRUWVDQG
9
/HYHORI9VHOHFWV);/26IRUSRUWDQG
);6'FRSSHUWZLVWHGSDLUIRUSRUW
IXUWKHUGHWHUPLQHGE\);6'%
'HIDXOW
R77
10K
DNP
ATEST/FXLOSEN
/HYHORI96HOHFWV);6'FRSSHUWZLVWHGSDLU
IRUSRUWV$DQG%
IXUWKHUGHWHUPLQHGE\);6'$DQG);6'%
R79
10K
3
10K
J17
OPEN
3V3
MNGT2
Signal Name
Logic
0
LEDPOL0/
MNGT0
2015 Microchip Technology Inc.
LEDPOL1/
MNGT1
LEDPOL2
E2ESIZE
LEDPOL3
EEEEN
LEDPOL4
1588EN
LEDPOL5
PHYADD
Connector
J4,J7 (2&3)
1
J4,J7 (1&2)
The LED is set as active low/
Serial Management Mode Stratp:0=SMI
J5,J8 (2&3)
The LED is set as active high.
1
J5,J8 (1&2)
The LED is set as active low,
0
J6,J9 (2&3)
The LED is set as active high.
EEPROM Size=1K bits (128 x 8) through 16K bits (2K x 8)
1
J6,J9 (1&2)
The LED is set as active low,
EEPROM Size=32K bits (4K x 8) through 512K bits (64K x 8) or 4Mbits (512K x 8) (LAN9252 only)
0
J10,J13 (2&3)
The LED is set as active high.
EEE Disable
1
J10,J13 (1&2)
The LED is set as active low,
EEE Enable
0
J11,J14 (2&3)
The LED is set as active high.
1588 Disable
1
J11,J14 (1&2)
The LED is set as active low,
1588 Enable
1
J12,J15 (2&3)
J12,J15 (1&2)
R89
The LED is set as active high.
PHYADD=0,1,2
The LED is set as active low,
PHYADD =1,2,3
FX_Mode_Strap_1 & 2
3
10K
3V3
J23
The LED is set as active high/
Serial Management Mode Stratp:1=I2C
0
0
2
A3
LED Polarity Strap
1
FXSDA/FXLOSA
3V3
MNGT3
DNP 10K
R76
10K
3257
3257
1
2
A4
R90
3
10K
3V3
J24
Management Strap Selection
MNGT1 MNGT0 MNGT3 MNGT2
J5 & J8 J4 & J7
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
R75
1
2
3
4
5
6
7
8
J18
HEADER 8
J24
HOST MODE
J23
0
0
X
X
SPI
0
1
0
0
HBI Multiplexed 1 Phase 8-bit
0
1
0
1
HBI Multiplexed 1 Phase 16-bit (Default)
0
1
1
0
HBI Multiplexed 2 Phase 8-bit
0
1
1
1
HBI Multiplexed 2 Phase 16-bit
1
0
X
X
HBI Indexed 8-bit
1
1
X
X
HBI Indexed 16-bit
FXSDB/FXLOSB
R78
DNP 10K
R80
10K
3257
02'( 3RXSXODWH
&RSSHU
5
'HIDXOW
)LEHU
5
&RSSHU
'HIDXOW
)LEHU
'13
5
5
5
5
5
5
EVB-LAN9352 Evaluation Board User’s Guide
DS50002415A-page 36
STRAP, GPIO, I2C & FX-LOS
FIGURE B-5:
LAN9352 (PART2)
A0
A1
A2
SW DIP-4/SM
RD_RDWR
35
WR_ENB
34
CS
32
PME_LATCH1
20
FIFOSEL_LATCH0
39
RD/RD_WR
A0/D15/AD15
D14/AD14
D13/AD13
D12/AD12
D11/AD11
D10/AD10
D9/AD9/SCK
D8/AD8
D7/AD7
D6/AD6
D5/AD5/SCS#
D4/AD4
D3/AD3/SIO3
D2/AD2/SIO2
D1/AD1/SO/SIO1
D0/AD0/SI/SIO0
I2C1_SDA
6
WR/ENB
I2C1_SCL
I2C EEPROM
Only for Host SOC
4
24FC512
R96
5
SDA
SCL
WP
R95
8
7
VCC
1
2
3
I2C3_1
I2C3_2
I2C3_3
I2C3_7
A4/MNGT3
A3/MNGT2
A2/ALEHI
A1/ALELO
U6
GND
1
2
3
4
4.7K
4.7K
4.7K
SW3
8
7
6
5
2K
C59
0.1uF
2K
3V3
R94
R93
R92
Host SOC EEPROM
R91
3V3
4.7K
2015 Microchip Technology Inc.
FIGURE B-6:
CS
PME
FIFOSEL
P8
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
AD7
AD3
GPMC_OEN_REN
GPMC_WEN
AD12
AD10
AD14
AD5
AD1
CS
PME_LATCH1
FIFOSEL_LATCH0
A3_SOC
A1_SOC
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
U4-2
AD6
AD2
ALELO
GPMC_BE0N_CLE
AD13
AD9
AD15
AD11
AD8
AD4
AD0
SW15
A4_SOC
A3_SOC
A2_SOC
A1_SOC
A0_SOC
A4_SOC
A2_SOC
A0_SOC
10 ON
9
8
7
6
1
2
3
4
5
A4
A3
A2
A1
A0
SIO1
SCK
SCS#
1
3
5
7
9
0
0
2
4
6
8
10
R102
0 SIO0
219-5MS
3
4
SIO2
SIO3
VDD3V3EXP
VDD_5V
SYS_RESETN
GPMC_DIR
I2C1_SDA
I2C2_SDA
J25 2
SIO3
SCS#
SIO1
DS50002415A-page 37
IRQ
1
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
C60
DNP
1
2
2
J20 - SPI AARDVAR HEADER
J20+J21 - SPI STROM HEADER
I2C1_SCL
2 J22
I2C2_SCL
ALEHI
SIO2
SIO0
SCK
SW8
AD3
AD3_SIO3
SIO3
1
2
3
AD0
AD0_SIO0
SIO0
1
2
3
AD9
AD9_SCK
SCK
1
2
3
4
5
6
AD2
AD2_SIO2
SIO2
4
5
6
AD1
AD1_SIO1
SIO1
4
5
6
AD5
AD5_SCS#
SCS#
SW9
SW14,SW15 & SW16 = HBI or SPI selection
HEADER 23x2
Board to Board Connectors for SoC
ALELO
2
A1
3
ALEHI
2
A2
3
SW4
*(1-2)
1
A0_AD15
JS102011CQN
SW5
SW6
1
2
2
3
*(1-2)
ALELO_A1
JS102011CQN
*(1-2)
ALEHI_A2
JS102011CQN
SW7
HBI or SPI+GPIO Config selection
Short 1-2 & 4-5 for HBI Config (2-3 & 5-6 open)
Short 2-3 & 5-6 for SPI+GPIO Config (1-2 & 4-5 open)
*(2-3)
1
RST#
JS102011CQN
DIODE
Short 1 -2 = To Reset ASIC from SoC-GPIO
Short 2-3 = To Reset SoC from ASIC
2
SW11
1
SW10
RST_GPIO
3
GPMC_OEN_REN
1 J27
1 J19
5V power to SOC board
from EVB Board
Default Short
0.1uF
2
A0
1
2
5V
VDD3V3EXP
VDD_5V
AD15
SYS_RESETN 1 D9
J21
3V3 power to SOC board
from EVB Board: Default Short
3V3
For TI SoC Open
P9
A0_AD15
AD14
AD13
AD12
AD11
AD10
AD9_SCK
AD8
AD7
AD6
AD5_SCS#
AD4
AD3_SIO3
AD2_SIO2
AD1_SIO1
AD0_SIO0
RST_GPIO
Default : ON position
For TI SOC INDEX MODE: OFF position
HEADER 23x2
37
17
18
25
26
27
23
45
44
41
56
55
40
14
15
19
A4
A3
1
J20
R100
R101
A4
A3
ALEHI_A2
ALELO_A1
LAN9352_QFN72
Aardvark / SPI Storm- Connector
I2C2_SCL
I2C2_SDA
31
30
33
29
GPMC_DIR
3
GPMC_WEN
2
GPMC_BE0N_CLE
3
RD_RDWR
JS102011CQN
SW12
1
WR_ENB
JS102011CQN
EVB-LAN9352 Evaluation Board User’s Guide
NOTES:
DS50002415A-page 38
2015 Microchip Technology Inc.
EVB-LAN9352
EVALUATION BOARD
USER’S GUIDE
Appendix C. Bill of Materials (BOM)
C.1
INTRODUCTION
This appendix includes the EVB-LAN9352 Evaluation Board Bill of Materials (BOM).
2015 Microchip Technology Inc.
DS50002415A-page 39
EVB-LAN9352 EVALUATION BOARD BILL OF MATERIALS
Reference
Part
PCB Footprint
2015 Microchip Technology Inc.
Qty
2
2
C2,C4
10uF
CAP0805
No
Murata
GRM21BR61E106KA73L
3
18
C3,C5,C6,C8,C10,C11,C13,C14,C15,C16,C17,C18,C21, 0.1uF
C22,C24,C25,C58,C59
CAP0603
No
Murata
GRM155R61E104KA7D
5
1
C19
1uF
CAP0603
No
Murata
GRM188R61C105KA93D
6
1
C20
470pF
CAP0603
No
Murata
GRM033R71E471KA01D
7
2
C26,C27
18pF
CAP0603
No
Murata
GRM1885C1H180JA01D
9
2
C32,C37
0.022uF
CAP0603
No
Kemet
C0603C223K5RAC
TU
12
3
D1,D4,D7
GRN
LED0603
No
Wurth electronics
150 060 GS7 500 0
13
1
D2
RED
LED0603
No
Wurth electronics
150 060 RS7 500 0
15
1
D9
DIODE
SOD123
No
Micro Commercial
Co
1N4148W-TP
16
7
FB1,FB2,FB3,FB4,FB5
2A/0.05DCR
RES0603
No
Murata
BLM18EG221SN1
D
17
1
J1
SKT_PWR_2R0mm_4A_T
HRU_RA
th_conn_pwrjack_dc-210_rt
No
Cui Stack
PJ-002AH
19
16
J4,J5,J6,J7,J8,J9,J10,J11,J12,J13,J14,J15,J16,J17,J23,
J24
HDR_1x3
TH_CONN_1X3P
No
FCI
68000-103HLF
20
1
J18
HEADER 8
TH_CONN_1X8P
No
FCI
68000-108HLF
21
4
J19,J22,J25,J27
CONN_2P
th_conn_1x2p
No
FCI
68000-102HLF
22
1
J20
HEADER 5X2
TH_CONN_2X5P
No
FCI
67997-210HLF
23
1
J21
HEADER 2X2
TH_CONN_2X2P
No
FCI
67997-204HLF
25
2
P8,P9
HEADER 23x2
TH_CONN_2X23P_F
No
FCI
67996-8 46 150 030
LF
26
1
Q1
NDS355AN_NMOS sot23-NDS
No
Fairchild
NDS355AN
27
9
R1,R15,R29,R66,R100,R101,R102,FB6,FB7
0E
No
Panasonic
ERJ-3GEY0R00V
RES0603
DNP
Manufacturer
Manufacturer Part
Number
Item
28
2
R2,R8
1K
RES0603
No
Panasonic
ERJ-3GEYJ102V
29
1
R3
3.30K
RES0603
No
Yageo America
9C06031A3301FK
HFT
Notes
EVB-LAN9352 Evaluation Board User’s Guide
DS50002415A-page 40
TABLE C-1:
2015 Microchip Technology Inc.
TABLE C-1:
EVB-LAN9352 EVALUATION BOARD BILL OF MATERIALS (CONTINUED)
Reference
Part
PCB Footprint
DNP
Manufacturer
Manufacturer Part
Number
Item
Qty
30
1
R4A
33E
RES0603
No
BOURNS
CR0603-FX-33R0E
LF
31
1
R4
470E
RES0603
No
BOURNS
CR0603-FX-4700E
LF
DS50002415A-page 41
32
1
R5
4.75K
RES0603
No
Panasonic
ERJ-3EKF4751V
33
14
R6,R69,R70,R71,R81,R82,R83,R76,R79,R80,R87,R88,
R89,R90
10.0K
RES0603
No
Panasonic
ERJ-3EKF1002V
34
1
R7
100E
RES0603
No
Panasonic
ERJ-3EKF1000V
35
1
R9
2.2K
RES0603
No
Panasonic
ERJ-3GEYJ222V
36
1
R10
12.1K
RES0603
No
Rohm
MCR01MZPF1202
37
8
R11,R12,R13,R14,R25,R26,R27,R28
49.9E
RES0603
No
Yageo America
9C06031A49R9FK
HFT
40
8
R17,R19,R21,R23,R31,R33,R35,R37
0E
RES0402
No
Panasonic
ERJ-2GE0R00X
41
2
R24,R38
0E
RES1210
No
Vishay
CRCW12100000Z0
EA
47
4
R61,R62,R63,R64
330E
RES0603
No
Panasonic
ERJ-3GEYJ331V
48
4
R67,R68,R95,R96
2K
RES0603
No
Panasonic
ERJ-3GEYJ202V
53
4
R91,R92,R93,R94
4.7K
RES0603
No
Panasonic
ERJ-3EKF4701V
55
1
SW1
SW-SPDT-SLIDE
sw_ck_1101m2s3c
qe2
No
C&K
1101M2S3CQE2
56
1
SW2
sw_pb_2P
sw_pb_2P
No
Panasonic
EVQ-PJU04K
57
1
SW3
SW DIP-4/SM
TH_SW_DIP4
No
Wurth electronics
418117270904
58
6
SW4,SW5,SW6,SW7,SW11,SW12
JS102011CQN
TH_SW_SPST_3P_10x2p5
No
Wurth electronics
450301014042
59
3
SW8,SW9,SW10
JS202011CQN
TH_SW_DPDT_6P
No
C&K
JS202011CQN
60
1
SW15
219-5MS
SW_DIP_5P-219-5
MST
No
CTS Electrocompo- 219-5MST
nents
61
1
TP1
RED
TH_TP_60D40
No
Keystone
5000
62
1
TP2
ORANGE
TH_TP_60D40
No
Keystone
5003
63
2
TP3,TP4
BLACK
TH_TP_60D40
No
Keystone
5001
65
2
T1,T2
Pulse J0011D01BNL
th_conn_pulse_rj45_j0026
No
Pulse Electronics
J0011D01BNL
66
1
U1
3_Amp
TH_DC-DC_VERT_ No
5PIN_P67
Murata
OKR-T/3-W12-C
67
1
U2
TPS3125
SOT23_5
TI
TPS3125L30DBVR
No
Notes
Item
Qty
68
1
EVB-LAN9352 EVALUATION BOARD BILL OF MATERIALS (CONTINUED)
Reference
Part
PCB Footprint
DNP
Manufacturer
Manufacturer Part
Number
U3
74LVC1G14
SOT23_5
No
TI
SN74L
VCIG14DBVR
69
1
U4
LAN9352_QFN72
ic_qfn72
No
Microchip
LAN9352
70
2
U5,U6
24FC512
IC_DIP8_300
No
Microchip
24FC512-I/P
71
1
Y1
25.000MHz
XTAL_HCM49
No
Cardinal Components Inc.
CSM1Z-A5B2C5-40
-25.0D18-F
Manufacturer
Manufacturer Part
Number
TABLE C-2:
Item
MECHANICAL COMPONENTS
Qty
Reference
Part
PCB Footprint
DNP
1
4
Footrest
3M
SJ61A1
2
15
“Shunt (for jumpers)”
3M
969102-0000-DA
3
1
Microchip Box
Microchip
4
1
Product sticker (4.5X1.5 cm)
avalon
5
1
ESD sticker
avalon
TABLE C-3:
Notes
Notes
Assembly instruction will be given
DO NOT POPULATE (DNP) COMPONENTS
Item
Qty
Reference
Part
PCB Footprint
DNP
1
1
C1
4.7uF
CAP0603
DNP
4
4
C7,C9,C12,C23
1.0uF
CAP0603
DNP
8
8
C28,C29,C30,C31,C33,C34,C35,C36
10pF
CAP0402
DNP
10
15
C38,C39,C40,C41,C42,C43,C44,C45,C47,C49,C51,C53
,C55,C57,C60
0.1uF
CAP0603
DNP
2015 Microchip Technology Inc.
11
6
C46,C48,C50,C52,C54,C56
10uF
CAP_B_3528
DNP
14
4
D3,D5,D6,D8
GRN
LED0603
DNP
18
2
J2,J3
FTLF1217P2
CONN_FX_SFP_FTLF1217P2
DNP
24
4
L1,L2,L3,L4
1uH
L0805
DNP
39
8
R16,R18,R20,R22,R30,R32,R34,R36
0E
RES0402
DNP
42
4
R39,R40,R43,R44
82E
RES0603
DNP
43
4
R41,R42,R45,R46
49.9E
RES0603
DNP
44
2
R47,R48
100E
RES0603
DNP
45
4
R49,R50,R51,R52
130E
RES0603
DNP
Manufacturer
Manufacturer Part
Number
Notes
EVB-LAN9352 Evaluation Board User’s Guide
DS50002415A-page 42
TABLE C-1:
2015 Microchip Technology Inc.
TABLE C-3:
DO NOT POPULATE (DNP) COMPONENTS (CONTINUED)
Item
Qty
Reference
46
8
R53,R54,R55,R56,R57,R58,R59,R60
51
3
R75,R77,R78
64
1
TP5
Part
4.7K
PCB Footprint
DNP
RES0603
DNP
10K
RES0603
DNP
SMT
tp-smd40
DNP
Manufacturer
Manufacturer Part
Number
Notes
DS50002415A-page 43
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS50002415A-page 44
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