HCS101
Fixed Code Encoder
FEATURES
The 8-pin HCS101 operates over a wide voltage range
of 3.5V to 13.3V and has three button inputs allowing
the system designer the freedom to utilize up to 7 functions. The only components required for device operation are the buttons and RF circuitry, allowing a very low
system cost.
Operating
2 Programmable 32-bit Serial Numbers
10-bit Serial Number
66-bit Transmission Code Length
Nonvolatile 16-bit Counter
3.5V -13.3V Operation
3 Inputs, 7 Functions Available
Selectable Baud Rate
Automatic Code Word Completion
Battery Low Signal Transmitted to Receiver
PACKAGE TYPES
PDIP, SOIC
Other
•
•
•
•
•
•
S0
1
S1
2
S2
3
NC
4
HCS101
•
•
•
•
•
•
•
•
•
VDD
7
NC
6
DATA
5
VSS
KEELOQ®
Pinout Compatible With Most
Encoders
Simple Programming Interface
On-chip EEPROM
On-chip Oscillator and Timing Components
Button Inputs Have Internal Pull-down Resistors
Minimum External Components Required
HCS101 BLOCK DIAGRAM
Power
latching
and
switching
Oscillator
Controller
RESET Circuit
Typical Applications
The HCS101 is ideal for remote control applications.
These applications include:
•
•
•
•
•
•
•
8
Low-end Automotive Alarm Systems
Low-end Automotive Immobilizers
Gate and Garage Door Openers
Identity Tokens
Low-end Burglar Alarm Systems
Fan and Lighting Controls
Toys
EEPROM
DATA
VSS
Transmit register
Button input port
VDD
S2
S1
S0
DESCRIPTION
The HCS101 from Microchip Technology Inc. is a fixed
code encoder designed for remote control systems. It
provides a small package outline and low cost to make
this device a perfect solution for unidirectional remote
control systems.
It is pin compatible with Microchip’s HCS201 Code
Hopping Encoder allowing easy upgrading to a more
secure remote keyless entry (RKE) system.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 1
HCS101
1.0
SYSTEM OVERVIEW
As indicated in the block diagram in Figure 1-1, the
HCS101 has a small EEPROM array, which must be
loaded with several parameters before use. These
parameters include:
•
•
•
•
Two 32-bit serial numbers
16-bit counter value
Additional 10-bit serial number
Configuration data
FIGURE 1-1:
The EEPROM data for each transmitter is programmed
by the manufacturer at the time of production.
Any type of controller may be used as a receiver, but it
is typically a microcontroller with compatible firmware
that allows the receiver to operate in conjunction with a
transmitter, based on the HCS101.
BASIC OPERATION OF TRANSMITTER ENCODER
Transmitted Information
Serial
Function
Number 3
Bits
Counter
Serial Number 1
Function
Bits
EEPROM Array
Serial Number 3
Counter
Serial Number 1
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 2
HCS101
2.0
DEVICE OPERATION
As shown in the typical application circuits in Figure 21, the HCS101 is easy to use. It requires only the addition of buttons and RF circuitry for use as the transmitter in your application. A description of each pin is given
in Table 2-1.
FIGURE 2-1:
TYPICAL CIRCUITS
VDD
B0
B1
S0
VDD
S1
NC
S2
DATA
NC
VSS
The HCS101 will wake-up upon detecting a switch closure and then delay for a debounce delay (TDB) as
shown in Figure 2-2. The device will then update the
16-bit counter before it loads the transmit register. The
data is then transmitted serially on the DATA pin in
Pulse Width Modulation (PWM) format.
If additional buttons are pressed during a transmission,
the current transmission is terminated. The HCS101
restarts and the new transmission will contain the latest
button information. When all buttons are released, the
device completes the current code word and then powers down. Released buttons do not terminate and/or
restart transmissions.
FIGURE 2-2:
ENCODER OPERATION
Power-Up
(A button has been pressed)
Tx out
RESET and Debounce Delay
2 button remote control
Sample Inputs
VDD
Update Counter
B3 B2 B1 B0
Load Transmit Register
S0
VDD
S1
NC
S2
DATA
NC
VSS
Transmit
Tx out
Yes
Buttons
Added
?
4 button remote control
Note:
Up to 7 functions can be implemented
by pressing more than one button
simultaneously or by using a suitable
diode array.
TABLE 2-1:
PIN DESCRIPTIONS
No
All
No
Buttons
Released
?
Yes
Complete Code
Word Transmission
Stop
Name
Pin
Number
Description
S0
1
Switch input 0
S1
2
Switch input 1
S2
3
Switch input 2/Clock pin for
Programming mode
NC
4
No connection
VSS
5
Ground reference connection
DATA
6
Pulse Width Modulation (PWM)
output pin/Data pin for
Programming mode
NC
7
No connection
VDD
8
Positive supply voltage connection
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 3
HCS101
3.0
TRANSMITTED WORD
3.2
3.1
Transmission Format (PWM Mode)
The HCS101 transmits a 66-bit code word. The 66-bit
word is constructed from the serial numbers, counter
and function information. The code word format is
shown in Figure 3-2.
The HCS101 transmission is made up of several code
words as shown in Figure 3-1. Each code word starts
with a preamble and a header, followed by the data.
The code word is followed by a guard period before the
next code word begins. The same code word is transmitted as long as the button is pressed. Refer to
Table 7-3 for transmission timing requirements.
FIGURE 3-1:
Code Word Organization
Under normal conditions, serial number 1 is transmitted
with the counter and serial number 3. If all the buttons
are pressed, serial number 2 is transmitted in place of
the counter and serial number 3.
CODE WORD TRANSMISSION FORMAT
TE
LOGIC ‘0’
LOGIC ‘1’
Bit
Period
Preamble
Tp
Header
Th
Counter, SER_3
and Function
SER_1
and Function
Guard
Time
Tg
Start Pulse
(Te)
FIGURE 3-2:
‘1’
(1 bit)
VLOW
(1 bit)
CODE WORD ORGANIZATION
Function**
(0/4 bits)
Serial Number 1
(32/28 bits)**
Counter
(16 bits)
Function
(4 bits)
‘00’
(2 bits)
Serial Number 3
(10 bits)
S2 S1 S0 S3*
Serial Number 2***
(32 bits)
S2 S1 S0 S3*
LSb
MSb
* See Section 4.3.6, S3 Setting (S3SET)
** See Section 4.3.7 Extended Serial Number (XSER)
Transmission Direction
LSb first
*** Serial Number 2 is transmitted when all buttons are pressed
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 4
HCS101
4.0
EEPROM MEMORY
ORGANIZATION
TABLE 4-2:
Bit Number
Bit Name
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
OSC0
OSC1
OSC2
OSC3
VLOWS
BRS
MTX4
TXEN
S3SET
XSER
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
The HCS101 contains 192 bits (12 x 16-bit words) of
EEPROM memory as shown in Table 4-1. Further
descriptions of the memory array are given in the following sections.
TABLE 4-1:
CONFIGURATION WORD
EEPROM MEMORY MAP
WORD
ADDRESS
MNEMONIC
DESCRIPTION
0
RESERVED
Set to 0000H
1
RESERVED
Set to 0000H
2
RESERVED
Set to 0000H
3
RESERVED
Set to 0000H
4
CNTR
Counter
5
RESERVED
Set to 0000H
6
SER_1
Device Serial Number 1
(word 0) 16 LSb’s
7
SER_1
Device Serial Number 1
(word 1) 16 MSb’s
8
SER_2
Device Serial Number 2
(word 0) 16 LSb’s
9
SER_2
Device Serial Number 2
(word 1) 16 MSb’s
4.3.2
10
SER_3
Device Serial Number 3
11
CONFIG
Config Word
The low voltage trip point select bit (VLOWS) and the S3
setting bit (S3SET) are used to determine the voltage
level for the low voltage detector.
4.1
4.3.1
OSCILLATOR TUNING BITS
(OSC0 TO OSC3)
These bits are used to tune the nominal frequency of
the HCS101 to within ±10% of its nominal value over
temperature and voltage.
CNTR (Counter)
LOW VOLTAGE TRIP POINT
SELECT (VLOWS)
VLOWS
S3SET*
Trip Point
This is the 16-bit gray code counter value that can be
used to track the number of times a transmitter has
been activated.
0
0
4.4
0
1
4.4
4.2
1
0
9
1
1
6.75
SER_1, SER_2, SER_3 (Encoder
Serial Number)
SER_1, and SER_2 are the 32-bit device serial numbers. SER_3 is an additional 10-bit serial number transmitted with every transmission. The most significant 6
bits of the 16-bit SER_3 word are reserved and should
be set to zero.
4.3
Configuration Word
The configuration word is a 16-bit word stored in the
EEPROM array that is used by the device to store the
status configuration options. Further explanations of
each of the bits are described in the following sections.
1999-2017 Microchip Technology Inc.
* See also Section 4.3.6
4.3.3
BAUD RATE SELECT BITS (BRS)
BRS selects the speed of transmission and the code
word blanking. Table 4-3 shows how the bit is used to
select the different baud rates and Section 5.2 provides
a detailed explanation of code word blanking.
TABLE 4-3:
0
Basic Pulse
Element
400µs
Code Words
Transmitted
All
1
200µs
1 out of 2
BRS
Preliminary
BAUD RATE SELECT
DS40001115E-page 5
HCS101
4.3.4
MINIMUM FOUR TRANSMISSIONS
(MTX4)
If this bit is cleared, at least one code word is completed
when the HCS101 is activated. If this bit is set, at least
four complete code words are transmitted.
4.3.5
TRANSMIT PULSE ENABLE (TXEN)
S3 SETTING (S3SET)
5.1
Code Word Completion
5.2
This bit determines the value of S3 in the function code
during a transmission and the high trip point selected
by VLOWS in Section 4.3.2. If this bit is cleared, S3 mirrors S2 during a transmission. If the S3SET bit is set,
S3 in the function code is always set, independent of
the value of S2.
4.3.7
SPECIAL FEATURES
Code word completion is an automatic feature that
ensures the entire code word is transmitted, even if the
button is released before the transmission is complete.
If the button is held down beyond the time for one code
word, multiple code words will result. If another button
is activated during a transmission, the active transmission will be aborted and a new transmission will begin
using the new button information.
If this bit is cleared, no start pulse occurs before a
transmission. If the bit is set, a start pulse (1 TE long) is
transmitted before the first code word’s preamble.
4.3.6
5.0
Blank Alternate Code Word
Federal Communications Commission (FCC) Rules,
Part 15 specify the limits on fundamental power and harmonics that can be transmitted. Power is calculated on
the worst case average power transmitted in a 100 ms
window. It is therefore advantageous to minimize the
duty cycle of the transmission by minimizing the duty
cycle of the individual bits and by blanking out consecutive words. The transmission duty cycle can be lowered
by setting BRS. This reduces the average power transmitted and hence, assists in FCC approval of a transmitter device. Shortening the code word length and
transmitting only every other code word (Figure 5-1) also
may allow a higher amplitude transmission for greater
range.
EXTENDED SERIAL NUMBER
(XSER)
If this bit is cleared, the most significant four bits of the
32-bit Serial Number 1 are replaced with the function
code. If this bit is set, the full 32-bit Serial Number 1 is
transmitted.
5.3
Auto-Shutoff
The auto-shutoff function automatically stops the
device from transmitting if a button inadvertently gets
pressed for longer than the time-out period, TTO. This
will prevent the device from draining the battery if a button gets pressed while the transmitter is in a pocket or
purse.
5.4
VLOW: Voltage LOW Indicator
The VLOW bit is included in every transmission and will
be transmitted as a one if the operating voltage has
dropped below the low voltage trip point. Refer to
Figure 3-2. The trip point is selectable based on the
battery voltage being used. See Section 4.3.2 for a
description of how the low voltage select option is set.
FIGURE 5-1:
CODE WORD TRANSMISSIONS
Amplitude
100ms
BRS = 0
BRS = 1
One Code Word
100ms
100ms
100ms
A
2A
Time
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 6
HCS101
PROGRAMMING THE HCS101
The HCS101 will signal that the write is complete by
sending out a train of ACK pulses, TACKH high, TACKL
low on DATA. The ACK pulses will continue until S2 is
dropped. These times can be used to calculate the
oscillator calibration value. The first pulse’s width
should NOT be used for calibration.
When using the HCS101 in a system, the user will have
to program some parameters into the device, including
the serial number and the counter, before it can be
used. The programming cycle allows the user to input
a 192-bit serial data stream which is then stored internally in EEPROM. Programming will be initiated by
forcing the DATA line high after the S2 line has been
held high for the appropriate length of time. Refer to
Table 6-1 and Figure 6-1.
At the end of the programming cycle, the device can be
verified as shown in Figure 6-2 by reading back the
EEPROM. Reading is done by clocking the S2 line and
reading the data bits on the DATA pin. A verify operation can only be done once, immediately following
the program cycle.
After the Program mode is entered, a delay must be
provided to the device for the automatic bulk write cycle
to complete. This will write all locations in the EEPROM
to all zeros. The device can then be programmed by
clocking in 16 bits at a time, using S2 as the clock line
and DATA as the data in line. After each 16-bit word is
loaded, a programming delay is required for the internal
program cycle to complete. This delay can take up to
Twc.
To ensure that the device does not accidentally enter Programming mode, DATA
should never be pulled high by the circuit
connected to it. Special care should be
taken when driving PNP RF transistors.
PROGRAMMING WAVEFORMS
Initiate Data Polling Here
H
O
LD
TPBW
TDS
TCLKH
TP
Enter Program
Mode
TCLKL
DATA
(Data)
Bit 0
Bit 1
TWC
TDH
TCLKL
Bit 2
Bit 3
TA
C
TPS TPH1
C
LK
L
S2
(Clock)
LK
H
FIGURE 6-1:
Note:
TA
6.0
Bit 14 Bit 15
TPH2
Bit 16 Bit 17
Write Cycle
Complete Here
Calibration Pulses
Data for Word 1
Repeat 12 times for each word
Note: S0 and S1 button inputs to be held to ground during the entire programming sequence.
FIGURE 6-2:
VERIFY WAVEFORMS
End of
Programming Cycle
DATA
(Data)
Bit190 Bit191
Begin Verify Cycle Here
Bit 0
Data in Word 0
Bit 1 Bit 2 Bit 3
Bit 14
Bit 15
Bit 16 Bit 17
Bit190 Bit191
TDV
S2
(Clock)
TWC
Note: If a Verify operation is to be done, then it must immediately follow the Program cycle.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 7
HCS101
TABLE 6-1:
PROGRAMMING/VERIFY TIMING REQUIREMENTS
VDD = 5.0V ± 10%
25C ± 5C
Parameter
Symbol
Min.
Max.
Units
TPS
1.5
1.75
ms
Hold time 1
TPH1
4.5
—
ms
Hold time 2
TPH2
50
—
µs
Bulk Write time
TPBW
4.0
—
ms
Program delay time
TPROG
4.0
—
ms
Program cycle time
TWC
50
—
ms
Clock low time
TCLKL
50
—
µs
Clock high time
TCLKH
50
—
µs
Data setup time
TDS
0
—
µs
Data hold time
TDH
30
—
µs
Data out valid time
TDV
—
30
µs
TPHOLD
100
—
µs (1)
Acknowledge low time
TACKL
800
—
µs (1)
Acknowledge high time
TACKH
800
—
µs (1)
Program mode setup time
Hold time
Note 1: Typical values - not tested in production
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 8
HCS101
7.0
ELECTRICAL CHARACTERISTICS FOR HCS101
Absolute Maximum Ratings†
VDD Supply voltage .....................................................................................................................................-0.3 to 13.5 V
VIN Input voltage ................................................................................................................................ -0.3 to VDD + 0.3 V
VOUT Output voltage .......................................................................................................................... -0.3 to VDD + 0.3 V
IOUT Max Output current ........................................................................................................................................ 50 mA
TSTG Storage temperature (Note) .............................................................................................................. -55 to +125°C
TLSOL Lead soldering temperature (Note) ............................................................................................................. 300°C
VESD ESD rating ....................................................................................................................................................2000 V
†
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.
TABLE 7-1:
DC CHARACTERISTICS
Commercial (C):TAMB = 0C to +70C
Industrial (I):TAMB = -40C to +85C
3.5V < VDD < 5.0V
Parameter
Operating Current
(avg)(2)
Sym.
Min.
ICC
Typ
1
—
Max.
5.0V < VDD < 13.3V
Min.
Typ1
Max.
Unit
—
2
mA
mA
0.5
Standby Current
ICCS
0.1
1.0
0.1
1.0
µA
Auto-shutoff
Current(3,4)
ICCS
40
75
160
300
µA
High Level Input
Voltage
VIH
0.55VDD
VDD+0.3
2.75
VDD+0.3
V
Low Level Input
Voltage
VIL
-0.3
0.15VDD
-0.3
0.75
V
High Level Output
Voltage
VOH
0.6VDD
Low Level Output
Voltage
VOL
Conditions
V
V
IOH = -1.0 mA VDD = 3.5V
IOH = -2.0 mA VDD = 10V
0.4
V
V
IOL = 1.0 mA VDD = 3.5V
IOL = 2.0 mA VDD = 10V
3.3
0.08VDD
Pull-down Resistance;
S0-S2
RSO-2
40
60
80
40
60
80
k
VDD = 4.0V
Pull-down Resistance;
DATA
RDATA
80
120
160
80
120
160
k
VDD = 4.0V
Note 1:
2:
3:
4:
Typical values are at 25C.
No load.
Auto-shutoff current specification does not include the current through the input pulldown resistors.
Auto-shutoff current is periodically sampled and not 100% tested.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 9
HCS101
FIGURE 7-1:
POWER-UP AND TRANSMIT TIMING
Button Press Detect
Code Word Transmission
TBP
TTD
TDB
DATA
Code
Word
1
TS
Code
Word
2
Code
Word
3
Code
Word
n
TTO
Sn
TABLE 7-2:
POWER-UP AND TRANSMIT TIMING(2)
Standard Operating Conditions (unless otherwise specified):
Commercial (C): 0°C TA +70°C
Industrial (I):-40°C TA +85°C
Symbol
Parameters
Min.
Typ.
Max.
Units
Conditions
10 + Code
Word Time
—
26 + Code
Word Time
ms
(Note 1)
12
—
26
ms
TBP
Time to second button press
TTD
Transmit delay from button detect
TDB
Debounce delay
6
—
20
ms
TTO
Auto-shutoff time-out period
—
27
—
s
Start pulse delay
—
4.5
—
ms
Ts
Note 1: TBP is the time in which a second button can be pressed without completion of the first code word and the
intention was to press the combination of buttons.
2: Typical values - not tested in production.
FIGURE 7-2:
PREAMBLE/HEADER FORMAT
Preamble
P1
Data Word
Transmission
Bit 0 Bit 1
Header
P12
23 TE
FIGURE 7-3:
10 TE
DATA WORD FORMAT (XSER = 0)
Counter & Serial Number 3
& Function Code
LSB
Bit 0 Bit 1
MSB LSB
Serial Number 1
Function Code
MSB
S3*
S0
S1
Status
S2
Vlow
Bit 30 Bit 31 Bit 32 Bit 33 Bit 58 Bit 59 Bit 60 Bit 61 Bit 62 Bit 63 Bit 64 Bit 65
Header
1999-2017 Microchip Technology Inc.
* See S3SET
Preliminary
Guard
Time
DS40001115E-page 10
HCS101
TABLE 7-3:
CODE WORD TRANSMISSION TIMING REQUIREMENTS
VDD = +3.5 to 13.3V
Commercial (C):TAMB = 0C to +70C
Industrial (I):TAMB = -40C to +85C
Symbol
Characteristic
Code Words Transmitted
All
1 out of 2
Number of TE
Min.
Typ.
Max.
Min.
Typ.
Max.
Units
TE
Basic pulse element
1
360
400
440
180
200
220
µs
TBP
PWM bit pulse width
3
—
3
—
—
3
—
ms
TP
Preamble duration
24
8.64
9.6
10.56
4.32
4.8
5.28
ms
TH
Header duration
10
3.6
4.0
4.4
1.8
2.0
2.2
ms
THOP
Hopping code duration
96
34.56
38.4
42.24
17.28
19.2
21.12
ms
TFIX
Fixed code duration
102
36.72
40.8
44.88
18.36
20.4
22.44
ms
TG
Guard Time
39
14.04
15.6
17.16
7.02
7.8
8.58
ms
Total Transmit Time
271
97.56
108.4
119.24
48.78
54.2
59.62
ms
PWM data rate
925
833
757
1851
1667
1515
bps
Note:
The timing parameters are not tested but derived from the oscillator clock.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 11
HCS101
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
HCS101
XXXXXNNN
0025
8-Lead SOIC (150 mil)
XXXXXXX
XXXYYWW
NNN
HCS101
XXX0025
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 12
HCS101
8.2
Package Details
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
PLANE
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 13
HCS101
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 14
HCS101
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC)
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
NOTE 1
2
1
e
B
NX b
0.25
C A–B D
NOTE 5
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
0.23
L
SEE VIEW C
(L1)
VIEW A–A
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 15
HCS101
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
L1
Footprint
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 16
HCS101
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SN Rev B
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 17
HCS101
HCS101 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
HCS101 -
/P
Package:
Temperature
Range:
Device:
P = Plastic DIP (300 mil Body), 8-lead)
SN = Plastic SOIC (150 mil Body), 8-lead
Blank = 0°C to +70°C
I = –40°C to +85°C
HCS101 = Code Hopping Encoder
HCS101T = Code Hopping Encoder (Tape and Reel)
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office.
The Microchip Worldwide Web Site. (www.microchip.com)
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 18
HCS101
APPENDIX A:
REVISION HISTORY
Revision D (January 2013)
Added a note to each package outline drawing.
Revision E (October 2017)
Updated Table 6-1; Updated Package Drawings;
Replaced Reader Response page with On-Line
Customer Support page.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 19
HCS101
THE MICROCHIP WEB SITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 20
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT
logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR,
Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK
MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST
logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32
logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,
SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are
registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, InterChip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi,
MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix,
RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial
Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II,
Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 1999-2017, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-2325-6
== ISO/TS 16949 ==
1999-2017 Microchip Technology Inc.
Preliminary
DS40001115E-page 21
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Finland - Espoo
Tel: 358-9-4520-820
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
2017 Microchip Technology Inc.
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Preliminary
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS40001115E-page 22
10/10/17
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