HV3418
64-Channel Serial-to-Parallel Converter with High-Voltage Push-Pull Outputs
Features
General Description
• Up to 180V Output Voltage
• Low-power Level Shifting
• Shift Register Speed:
- 6 MHz at VDD = 5V
- 12 MHz at VDD = 12V
• Latched Data Outputs
• Output Polarity and Blanking
• CMOS-compatible Inputs
• Forward and Reverse Shifting Options
The HV3418 is a low-voltage serial-to-high-voltage
parallel converter with push-pull outputs. This device
has been designed as a printer driver for inkjet
applications. It can also be used in any application
requiring multiple-output high-voltage low-current
sourcing-and-sinking capabilities.
The device consists of a 64-bit Shift register,
64 latches and control logic to perform the polarity
select and blanking of the outputs. A DIR pin controls
the direction of data shift through the device. With the
DIR grounded, DIOA is data in and DIOB is data out.
Data is shifted from HVOUT64 to HVOUT1. When DIR is
at logic high, DIOB is data in and DIOA is data out.
The data is then shifted from HVOUT1 to HVOUT64. The
data is shifted through the Shift register on the
low-to-high transition of the clock. Data output buffers
are provided for cascading devices. The operation of
the shift register is not affected by the latch enable (LE),
blanking (BL) and the polarity (POL) inputs. The
transfer of data from the Shift register to the latch
occurs when the LE is high. The data in the latch is
stored during LE transition from high to low.
Applications
• Display Driver
• Print Head Driver
• MEMS Applications
Package Type
80-lead PQFP
(Top view)
80
1
See Table 2-1 for pin information.
2017-2018 Microchip Technology Inc.
DS20005843B-page 1
HV3418
Functional Block Diagram
POL
BL
LE
VPP
DIOA
HVOUT1
CLK
HVOUT2
DIR
64 bit
Static Shift
Register
64 Latches
•
•
•
60 Additional
Outputs
•
•
•
HVOUT63
HVOUT64
DIOB
DS20005843B-page 2
2017-2018 Microchip Technology Inc.
HV3418
Typical Application Circuit
2017-2018 Microchip Technology Inc.
DS20005843B-page 3
HV3418
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Low-supply Voltage, VDD ......................................................................................................................... –0.5V to +15V
High-supply Voltage, VPP .......................................................................................................................... VDD to +200V
Logic Input Levels ............................................................................................................................ –0.5V to VDD+0.5V
Ground Current (Note 1) ......................................................................................................................................... 1.5A
High-voltage Supply Current (Note 1) ..................................................................................................................... 1.3A
Operating Ambient Temperature, TA ..................................................................................................... –40°C to +85°C
Storage Temperature, TS .................................................................................................................... –65°C to +150°C
Continuous Total Power Dissipation:
80-lead PQFP (Note 2) ......................................................................................................................... 1200 mW
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1:
Connection to all power and ground pads is required. Duty cycle is limited by the total power dissipated in
the package.
2: For operations above 25°C ambient, derate linearly to the maximum operating temperature at 20 mW/°C.
RECOMMENDED OPERATING CONDITIONS
Parameter
Logic Supply Voltage
VDD = 5V
VDD
Min.
Typ.
Max.
Unit
4.5
5
5.5
V
10.8
12
13.2
V
High-voltage Supply Voltage
VPP
60
—
180
V
High-level Input Voltage
VIH
VDD–0.9V
—
VDD
V
Low-level Input Voltage
VIL
0
—
0.9
V
Maximum Operating Ambient
Temperature
TA
-40
+85
°C
Maximum Operating Junction
Temperature
TJ
—
+125
°C
DS20005843B-page 4
VDD = 12V
Sym.
—
—
Conditions
2017-2018 Microchip Technology Inc.
HV3418
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions unless otherwise noted
Parameter
VDD Supply Current
Quiescent VDD Supply Current
High-voltage Supply Current
Typ.
Max.
Unit
Conditions
IDD
—
—
25
mA
fCLK = 12 MHz,
fDATA = 12 MHz, LE = low
IDDQ
—
—
200
µA
All VIN = 0V or VDD
—
—
0.5
mA
VPP = 180V, all outputs
high
—
—
0.5
mA
VPP = 180V, all outputs
low
—
—
10
µA
VIN = VDD
IIH
Low-level Logic Input Current
Low-level Output
Min.
IPP
High-level Logic Input Current
High-level Output
Sym.
IIL
HVOUT
Data out
HVOUT
Data out
HVOUT Clamp Voltage
VOH
VOL
VOC
—
—
–10
µA
VIN = 0V
155
—
—
V
VDD–1
—
—
V
VPP = 180V,
IHVOUT = –5 mA,
IDOUT = –100 µA
—
—
25
V
—
—
1
V
—
—
VDD + 1.5
V
IOL = 5 mA
—
—
–1.5
V
IOL = –5 mA
VPP = 180V,
IHVOUT = 5 mA,
IDOUT = 100 µA
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: AC characteristics are guaranteed only under VDD = 12V and VDD = 5V.
Parameter
Clock Frequency
Clock Width High or Low
Sym.
Min.
Typ.
Max.
Unit
Conditions
fCLK
—
—
12 (6)
MHz Note 2
tWL, tWH
40 (83)
—
—
ns
Note 2
Data Set-up Time before Clock Rises
tSU
25 (35)
—
—
ns
Note 2
Data Hold Time after Clock Rises
tH
10 (30)
—
—
ns
Note 2
Time from Latch Enable to HVOUT
tON, tOFF
—
—
1 (1.5)
ns
CL = 20 pF (Note 2)
Latch Enable Pulse Width
tWLE
62 (80)
—
—
ns
Note 2
Delay Time Clock to Latch Enable Low to
High
tDLE
25 (35)
—
—
ns
Note 2
Latch Enable Set-up Time before Clock
Rises
tSLE
30 (40)
—
—
ns
Note 2
Delay Time Clock to Data High to Low
tDHL
—
—
50 (110)
ns
CL = 20 pF (Note 2)
Delay Time Clock to Data Low to High
tDLH
—
—
75 (160)
ns
CL = 20 pF (Note 2)
All Logic Inputs
t r, t f
—
—
5
ns
Note 1:
2:
Shift register speed can be as low as DC as long as data set-up and hold time meet the specifications.
Value in parenthesis is for VDD = 5V, VPP = 180V and TA = 25°C.
2017-2018 Microchip Technology Inc.
DS20005843B-page 5
HV3418
TEMPERATURE SPECIFICATIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Operating Ambient Temperature
TA
–40
—
+85
°C
Storage Temperature
TS
–65
—
+150
°C
JA
—
37
—
°C/W
Conditions
TEMPERATURE RANGE
PACKAGE THERMAL RESISTANCE
80-lead PQFP
Timing Waveforms
VIH
DATA
INPUT
50%
Data Valid
50%
VIL
tH
tSU
VIH
CLK
50%
50%
50%
tWL
50%
VIL
tWH
VOH
50%
VOL
tDLH
DIO/DIO
VOH
50%
VOL
tDHL
VOH
50%
50%
LE
VOL
tWLE
tDLE
tSLE
90%
10%
HVOUT
w/ S/R LOW
VOH
VOL
tOFF
HVOUT
w/ S/R HIGH
10%
tON
DS20005843B-page 6
90%
VOH
VOL
2017-2018 Microchip Technology Inc.
HV3418
2.0
PIN DESCRIPTION
The details on the pins of HV3418 are listed on
Table 2-1. Refer to Package Type for the location of
pins.
TABLE 2-1:
Pin Number
PIN FUNCTION TABLE
Pin Name
Description
1
HVOUT41/24 High-voltage output
2
HVOUT42/23 High-voltage output
3
HVOUT43/22 High-voltage output
4
HVOUT44/21 High-voltage output
5
HVOUT45/20 High-voltage output
6
HVOUT46/19 High-voltage output
7
HVOUT47/18 High-voltage output
8
HVOUT48/17 High-voltage output
9
HVOUT49/16 High-voltage output
10
HVOUT50/15 High-voltage output
11
HVOUT51/14 High-voltage output
12
HVOUT52/13 High-voltage output
13
HVOUT53/12 High-voltage output
14
HVOUT54/11
15
HVOUT55/10 High-voltage output
16
HVOUT56/9
High-voltage output
17
HVOUT57/8
High-voltage output
18
HVOUT58/7
High-voltage output
19
HVOUT59/6
High-voltage output
20
HVOUT60/5
High-voltage output
21
HVOUT61/4
High-voltage output
22
HVOUT62/3
High-voltage output
23
HVOUT63/2
High-voltage output
24
HVOUT64/1
25
VPP
High-voltage power supply
26
DIOA
Serial Data Input/Output A
27
NC
No connection
28
NC
No connection
29
BL
Blanking
30
POL
Polarity
31
VDD
Low-voltage power supply
32
DIR
Direction (See Note 1.)
33
LGND
Logic voltage ground
34
OGND
High-voltage power supply ground
35
NC
Note 1:
High-voltage output
High-voltage output
No connection
Pin designation for DIR = H/L. Example: For DIR = H, Pin 1 is HVOUT41 and for DIR = L, Pin 1 is
HVOUT24.
2017-2018 Microchip Technology Inc.
DS20005843B-page 7
HV3418
TABLE 2-1:
PIN FUNCTION TABLE (CONTINUED)
Pin Number
Pin Name
36
NC
No connection
37
CLK
Data Shift register clock. Inputs are shifted into the Shift register on the positive edge
of the clock.
38
LE
39
DIOB
Serial Data Input/Output B
40
VPP
High-voltage power supply
41
HVOUT1/64
High-voltage output
42
HVOUT2/63
High-voltage output
43
HVOUT3/62
High-voltage output
44
HVOUT4/61
High-voltage output
45
HVOUT5/60
High-voltage output
46
HVOUT6/59
High-voltage output
47
HVOUT7/58
High-voltage output
48
HVOUT8/57
High-voltage output
49
HVOUT9/56
High-voltage output
50
HVOUT10/55 High-voltage output
51
HVOUT11/54
52
HVOUT12/53 High-voltage output
53
HVOUT13/52 High-voltage output
54
HVOUT14/51 High-voltage output
55
HVOUT15/50 High-voltage output
56
HVOUT16/49 High-voltage output
57
HVOUT17/48 High-voltage output
58
HVOUT18/47 High-voltage output
59
HVOUT19/46 High-voltage output
60
HVOUT20/45 High-voltage output
61
HVOUT21/44 High-voltage output
62
HVOUT22/43 High-voltage output
63
HVOUT23/42 High-voltage output
64
HVOUT24/41 High-voltage output
65
HVOUT25/40 High-voltage output
66
HVOUT26/39 High-voltage output
67
HVOUT27/38 High-voltage output
68
HVOUT28/37 High-voltage output
69
HVOUT29/36 High-voltage output
70
HVOUT30/35 High-voltage output
71
HVOUT31/34 High-voltage output
72
HVOUT32/33 High-voltage output
73
HVOUT33/32 High-voltage output
74
HVOUT34/31 High-voltage output
Note 1:
Description
Latch enable
High-voltage output
Pin designation for DIR = H/L. Example: For DIR = H, Pin 1 is HVOUT41 and for DIR = L, Pin 1 is
HVOUT24.
DS20005843B-page 8
2017-2018 Microchip Technology Inc.
HV3418
TABLE 2-1:
Pin Number
PIN FUNCTION TABLE (CONTINUED)
Pin Name
75
HVOUT35/30 High-voltage output
76
HVOUT36/29 High-voltage output
77
HVOUT37/28 High-voltage output
78
HVOUT38/27 High-voltage output
79
HVOUT39/26 High-voltage output
80
Note 1:
Description
HVOUT40/25 High-voltage output
Pin designation for DIR = H/L. Example: For DIR = H, Pin 1 is HVOUT41 and for DIR = L, Pin 1 is
HVOUT24.
2017-2018 Microchip Technology Inc.
DS20005843B-page 9
HV3418
3.0
FUNCTIONAL DESCRIPTION
Follow the steps in Table 3-1 to power up and power
down the HV3418.
TABLE 3-1:
POWER-UP AND POWER-DOWN SEQUENCE
Power-up
Step
Power-down
Description
Step
1
Connect ground.
1
2
Apply VDD.
2
3
Set all inputs (Data, CLK, Enable, etc.) to a known state.
3
4
Apply VPP. (Note 1)
4
Note 1: The VPP should not drop below VDD or float during operation.
TABLE 3-2:
Description
Remove VPP. (Note 1)
Remove all inputs.
Remove VDD.
Disconnect ground.
TRUTH FUNCTION TABLE
Inputs
Function
Outputs
Data
CLK
LE
BL
All On
X
X
X
All Off
X
X
X
Invert Mode
X
X
H or L
Load/store Data
in Latches
Transparent
Latch Mode
Load S/R
I/O Relation
Note:
POL
DIR
L
L
L
H
L
H
↑
L
X
X
X
X
L
Shift Register
HV Output
Data Out
1
2...64
1
2...64
*
X
*
*...*
H
H...H
*
X
*
*...*
L
L...L
*
L
X
*
*...*
*
*...*
*
H
H
X
H or L
*...*
*
*...*
*
↓
H
H
X
*
*...*
*
*...*
*
↓
H
L
X
*
*...*
*
*...*
*
↑
H
H
H
X
L
*...*
L
*...*
*
H
↑
H
H
H
X
H
*...*
H
*...*
*
DIOA
↑
X
X
X
L
QN→
QN+1
—
DIOB
DIOB
↑
X
X
X
H
QN→
QN+1
—
DIOA
H = High-logic level
L = Low-logic level
X = Irrelevant
↑ = Low-to-high transition
↓ = High-to-low transition
* = Dependent on previous stage’s state before the last CLK or last LE high
VDD
VDD
VPP
DATA
OUT
INPUT
GND
GND
Logic Inputs
FIGURE 3-1:
DS20005843B-page 10
HVOUT
GND
Logic Data Output
High Voltage Outputs
Input and Output Equivalent Circuits.
2017-2018 Microchip Technology Inc.
HV3418
4.0
PACKAGE MARKING INFORMATION
4.1
Packaging Information
80-lead PQFP
Example
XXXXXXXXX
YYWWNNN
HV3418PG
e3 1741975
e3
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2017-2018 Microchip Technology Inc.
DS20005843B-page 11
HV3418
80-Lead PQFP Package Outline (PG)
20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint
D
D1
E
Note 1
(Index Area
D1/4 x E1/4)
E1
80
ș
1
e
b
Top View
View B
Gauge
Plane
L2
A A2
L
L1
Seating
Plane
A1
Side View
Seating
Plane
ș
View B
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU
a printed indicator.
Symbol
Dimension
(mm)
MIN
NOM
MAX
A
A1
2.80*
0.25
3.40
-
A2
b
D
D1
E
E1
e
2.55 0.30 23.65* 19.80* 17.65* 13.80*
2.80
-
23.90
20.00
17.90
14.00
0.50* 3.05 0.45 24.15* 20.20* 18.15* 14.20*
L
L1
L2
0.73
0.80
BSC
0.88
1.03
1.95
REF
0.25
BSC
ș
ș
0O
5O
3.5O
-
7
O
16O
JEDEC Registration MO-112, Variation CB-1, Issue B, Sept.1995.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings not to scale.
S
D
# DSPD 80PQFPPG V i C041309
DS20005843B-page 12
2017-2018 Microchip Technology Inc.
HV3418
APPENDIX A:
REVISION HISTORY
Revision A (September 2017)
• Converted Supertex Doc #DSFP-HV3418 to
Microchip DS20005843B
• Removed “Processed with HVCMOS® Technology” in the Features section
• Changed the package marking format
• Made minor changes throughout the document
Revision B (August 2018)
• Correction to TABLE 2-1: “Pin Function Table”
Pin #34 Description.
• Updates to “RECOMMENDED OPERATING
CONDITIONS” table.
2017-2018 Microchip Technology Inc.
DS20005843B-page 13
HV3418
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
-
Package
Options
X
-
Environmental
X
Media Type
Device:
HV3418 =
64-Channel Serial-to-Parallel Converter
with High-Voltage Push-Pull Outputs
Package:
PG
=
80-lead PQFP
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Type:
(blank)
=
66/Tray for a PG Package
DS20005843B-page 14
Example:
a) HV3418PG-G:
64-Channel Serial-to-Parallel
Converter with High-Voltage
Push-Pull Outputs, 80-lead
PQFP, 66/Tray
2017-2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
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Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3453-5
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20005843B-page 15
Worldwide Sales and Service
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Corporate Office
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support
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Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005843B-page 16
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2018 Microchip Technology Inc.
08/15/18