HV507
64-Channel Serial-to-Parallel Converter with High-Voltage Push-Pull Outputs
Features
General Description
• Up to 300V Output Voltage
• Low-power Level Shifting from 5V to 300V
• Shift Register Speed:
- 8 MHz at VDD = 5V
• Latched Data Outputs
• Output Polarity and Blanking
• CMOS-compatible Inputs
• Forward and Reverse Shifting Options
The HV507 is a low-voltage to high-voltage
serial-to-parallel converter with 64 push-pull outputs.
This device is designed as a printer driver for
electrostatic applications. It can also be used in any
application requiring multiple-output high-voltage
low-current sourcing-and-sinking capabilities.
Applications
• Display Driver
• Print Head Driver
• Microelectromechanical Systems Applications
The device consists of a 64-bit Shift register,
64 latches and control logic to perform the polarity
select and blanking of the outputs. A DIR pin controls
the direction of data shift through the device. With the
DIR grounded, DIOA is data in and DIOB is data out.
Data is shifted from HVOUT64 to HVOUT1. When DIR is
at logic high, DIOB is data in and DIOA is data out. The
data is then shifted from HVOUT1 to HVOUT64 through
the Shift register on the low-to-high transition of the
clock. Data output buffers are provided for cascading
devices. The operation of the shift register is not
affected by the latch enable (LE), blanking (BL) and
polarity (POL) inputs. Transfer of data from the Shift
register to the latch occurs when the LE is high. The
data in the latch is stored during LE transition from high
to low.
Package Type
80-lead PQFP
(Top view)
80
1
See Table 2-1 for pin information.
2017 Microchip Technology Inc.
DS20005845A-page 1
HV507
Functional Block Diagram
POL
BL
Latch Enable
VPP
DIOA
L/T
CLOCK
L/T
DIR
64 bit
Static Shift
Register
HVOUT1
L/T
HVOUT2
•
•
•
60 Additional
Outputs
•
•
•
HVOUT63
L/T
HVOUT64
64
Latches
DIOB
L/T = Level Translator
DS20005845A-page 2
2017 Microchip Technology Inc.
HV507
Typical Application Circuit
2017 Microchip Technology Inc.
DS20005845A-page 3
HV507
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Low-supply Voltage, VDD ........................................................................................................................... –0.5V to +6V
High-supply Voltage, VPP .......................................................................................................................... VDD to +320V
Logic Input Levels ............................................................................................................................ –0.5V to VDD+0.5V
Ground Current (Note 2) ......................................................................................................................................... 0.5A
High-voltage Supply Current (Note 1) ..................................................................................................................... 0.5A
Operating Ambient Temperature, TA ........................................................................................................ 0°C to +70°C
Storage Temperature, TS .................................................................................................................... –65°C to +150°C
Continuous Total Power Dissipation:
80-lead PQFP (Note 2) ......................................................................................................................... 1200 mW
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1:
Connection to all power and ground pads is required. Duty cycle is limited by the total power dissipated in
the package.
2: For operations above 25°C ambient, derate linearly to 70°C at 26.7 mW/°C.
RECOMMENDED OPERATING CONDITIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Logic Supply Voltage
VDD
4.5
5
5.5
V
High-voltage Supply Voltage
VPP
60
—
300
V
High-level Input Voltage
VIH
VDD–0.9V
—
VDD
V
Low-level Input Voltage
VIL
0
—
0.9
V
DS20005845A-page 4
Conditions
2017 Microchip Technology Inc.
HV507
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: For VDD = 5V, VPP = 300V and TA = 25°C.
Parameter
VDD Supply Current
Quiescent VDD Supply Current
High-voltage Supply Current
Low-level Logic Input Current
Low-level Output
Min.
Typ.
Max.
Unit
Conditions
IDD
—
—
15
mA
fCLK = 8 MHz,
fDATA = 4 MHz, LE = low
IDDQ
—
—
200
µA
All VIN = 0V or VDD
—
—
0.5
mA
VPP = 300V, all outputs
high
—
—
0.5
mA
VPP = 300V, all outputs
low
IIH
—
—
10
µA
VIN = VDD
IIL
—
—
–10
µA
VIN = 0V
265
—
—
V
VDD –1
—
—
V
VPP = 300V,
IHVOUT = –1 mA,
IDOUT = –100 µA
—
—
35
V
—
—
1
V
—
—
VPP + 1.5
V
IOL = 1 mA
—
—
–30
V
IOL = –1 mA
IPP
High-level Logic Input Current
High-level Output
Sym.
HVOUT
Data Out
HVOUT
Data Out
HVOUT Clamp Voltage
VOH
VOL
VOC
VDD = 5V,
IHVOUT = 1 mA,
IDOUT = 100 µA
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: For VDD = 5V, VPP = 300V and TA = 25°C. Shift register speed can be as low as DC as
long as data set-up and hold time meet the specifications.
Parameter
Sym.
Min.
Typ.
Max.
Unit
fCLK
—
—
8
MHz
tWL, tWH
62
—
—
ns
Data Set-up Time before Clock Rises
tSU
35
—
—
ns
Data Hold Time after Clock Rises
tH
30
—
—
ns
Time from Latch Enable to HVOUT
tON, tOFF
—
—
4
ns
Latch Enable Pulse Width
tWLE
80
—
—
ns
Delay Time Clock to Latch Enable Low to
High
tDLE
35
—
—
ns
Latch Enable Set-up Time before Clock
Rises
tSLE
40
—
—
ns
Delay Time Clock to Data Low to High
tDLH
—
—
125
ns
CL = 20 pF
Delay Time Clock to Data High to Low
tDHL
—
—
125
ns
CL = 20 pF
All Logic Inputs
tr, tf
—
—
5
ns
Clock Frequency
Clock Width High or Low
2017 Microchip Technology Inc.
Conditions
CL = 20 pF
DS20005845A-page 5
HV507
TEMPERATURE SPECIFICATIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Operating Ambient Temperature
TA
0
—
+70
°C
Storage Temperature
TS
–65
—
+150
°C
JA
—
37
—
°C/W
Conditions
TEMPERATURE RANGE
PACKAGE THERMAL RESISTANCE
80-lead PQFP
Timing Waveforms
VIH
Data In
(DIOA/DIOB)
50%
50%
Data Valid
VIL
tSU
tH
VIH
CLK
50%
tWL
VIL
tWH
VOH
50%
Data Out
(DIOA/DIOB)
VOL
tDLH
VOH
50%
VOL
tDHL
VOH
50%
50%
Latch Enable
tWLE
tDLE
HV OUT
w/ S/R LOW
tSLE
90%
10%
VOL
VOH
VOL
tOFF
HV OUT
w/ S/R HIGH
DS20005845A-page 6
10%
tON
90%
VOH
VOL
2017 Microchip Technology Inc.
HV507
2.0
PIN DESCRIPTION
The details on the pins of HV507 are listed on
Table 2-1. Refer to Package Type for the location of
pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
Description
1
HVOUT41
High-voltage output
2
HVOUT42
High-voltage output
3
HVOUT43
High-voltage output
4
HVOUT44
High-voltage output
5
HVOUT45
High-voltage output
6
HVOUT46
High-voltage output
7
HVOUT47
High-voltage output
8
HVOUT48
High-voltage output
9
HVOUT49
High-voltage output
10
HVOUT50
High-voltage output
11
HVOUT51
High-voltage output
12
HVOUT52
High-voltage output
13
HVOUT53
High-voltage output
14
HVOUT54
High-voltage output
15
HVOUT55
High-voltage output
16
HVOUT56
High-voltage output
17
HVOUT57
High-voltage output
18
HVOUT58
High-voltage output
19
HVOUT59
High-voltage output
20
HVOUT60
High-voltage output
21
HVOUT61
High-voltage output
22
HVOUT62
High-voltage output
23
HVOUT63
High-voltage output
24
HVOUT64
High-voltage output
25
VPP
High-voltage power supply
26
DIOA
Serial Data Input/Output A
27
NC
No connection
28
NC
No connection
29
BL
Blanking
30
POL
Polarity
31
VDD
Low-voltage power supply
32
DIR
Direction
33
GND
Logic voltage ground
34
HVGND
35
NC
No connection
36
NC
No connection
2017 Microchip Technology Inc.
High-voltage power supply
DS20005845A-page 7
HV507
TABLE 2-1:
PIN FUNCTION TABLE (CONTINUED)
Pin Number
Pin Name
37
CLK
38
LE
39
DIOB
Serial Data Input/Output B
40
VPP
High-voltage power supply
41
HVOUT1
High-voltage output
42
HVOUT2
High-voltage output
43
HVOUT3
High-voltage output
44
HVOUT4
High-voltage output
45
HVOUT5
High-voltage output
46
HVOUT6
High-voltage output
47
HVOUT7
High-voltage output
48
HVOUT8
High-voltage output
49
HVOUT9
High-voltage output
50
HVOUT10
High-voltage output
51
HVOUT11
High-voltage output
52
HVOUT12
High-voltage output
53
HVOUT13
High-voltage output
54
HVOUT14
High-voltage output
55
HVOUT15
High-voltage output
56
HVOUT16
High-voltage output
57
HVOUT17
High-voltage output
58
HVOUT18
High-voltage output
59
HVOUT19
High-voltage output
60
HVOUT20
High-voltage output
61
HVOUT21
High-voltage output
62
HVOUT22
High-voltage output
63
HVOUT23
High-voltage output
64
HVOUT24
High-voltage output
65
HVOUT25
High-voltage output
66
HVOUT26
High-voltage output
67
HVOUT27
High-voltage output
68
HVOUT28
High-voltage output
69
HVOUT29
High-voltage output
70
HVOUT30
High-voltage output
71
HVOUT31
High-voltage output
72
HVOUT32
High-voltage output
73
HVOUT33
High-voltage output
74
HVOUT34
High-voltage output
75
HVOUT35
High-voltage output
76
HVOUT36
High-voltage output
DS20005845A-page 8
Description
Data Shift Register Clock. Inputs are shifted into the Shift register on the positive
edge of the clock.
Latch Enable
2017 Microchip Technology Inc.
HV507
TABLE 2-1:
PIN FUNCTION TABLE (CONTINUED)
Pin Number
Pin Name
77
HVOUT37
High-voltage output
78
HVOUT38
High-voltage output
79
HVOUT39
High-voltage output
80
HVOUT40
High-voltage output
2017 Microchip Technology Inc.
Description
DS20005845A-page 9
HV507
3.0
FUNCTIONAL DESCRIPTION
Follow the steps in Table 3-1 to power up and power
down the HV507.
TABLE 3-1:
POWER-UP AND POWER-DOWN SEQUENCE
Power-up
Step
Power-down
Description
Step
Description
1
Connect ground.
1
2
2
Apply VDD.
3
Set all inputs (Data, CLK, Enable, etc.) to a known state.
3
4
Apply VPP. (Note 1)
4
Note 1: The VPP should not drop below VDD or float during operation.
TABLE 3-2:
Remove VPP. (Note 1)
Remove all inputs.
Remove VDD.
Disconnect ground.
TRUTH FUNCTION TABLE
Inputs
Function
Outputs
Data
CLK
LE
BL
All On
X
X
X
L
L
All Off
X
X
X
L
Invert Mode
X
X
L
H
H or L
↑
L
H
X
X
↓
H
X
X
↓
H
L
↑
H
Load S/R
Store Data in
Latches
Transparent
Latch Mode
I/O Relation
Note:
POL DIR
Shift Register
High-voltage Output
Data Out
1
2...64
1
2...64
*
X
*
*...*
H
H...H
*
H
X
*
*...*
L
L...L
*
L
X
*
*...*
*
*...*
*
H
X
H or L
*...*
*
*...*
*
H
X
*
*...*
*
*...*
*
L
X
*
*...*
*
*...*
*
H
H
X
L
*...*
L
*...*
*
H
*
H
↑
H
H
H
X
H
*...*
DIOA
↑
X
X
X
L
QN→
QN+1
—
*...*
DIOB
DIOB
↑
X
X
X
H
QN→
QN+1
—
DIOA
H = High-logic level
L = Low-logic level
X = Irrelevant
↑ = Low-to-high transition
↓ = High-to-low transition
* = Dependent on the previous stage’s state before the last CLK or last LE high
VDD
VDD
VPP
Data Out
Input
GND
GND
Logic Inputs
FIGURE 3-1:
DS20005845A-page 10
HVOUT
HVGND
Logic Data Output
High Voltage Outputs
Input and Output Equivalent Circuits.
2017 Microchip Technology Inc.
HV507
4.0
PACKAGE MARKING INFORMATION
4.1
Packaging Information
80-lead PQFP
XXXXXXXXX
YYWWNNN
e3
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example
HV507PG
e3 1741975
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2017 Microchip Technology Inc.
DS20005845A-page 11
HV507
80-Lead PQFP Package Outline (PG)
20.00x14.00mm body, 3.40mm height (max), 0.80mm pitch, 3.90mm footprint
D
D1
E
Note 1
(Index Area
D1/4 x E1/4)
E1
80
ș
1
e
b
Top View
View B
Gauge
Plane
L2
A A2
L
L1
Seating
Plane
A1
Side View
Seating
Plane
ș
View B
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Note:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU
a printed indicator.
Symbol
Dimension
(mm)
MIN
NOM
MAX
A
A1
2.80*
0.25
3.40
-
A2
b
D
D1
E
E1
e
2.55 0.30 23.65* 19.80* 17.65* 13.80*
2.80
-
23.90
20.00
17.90
14.00
0.50* 3.05 0.45 24.15* 20.20* 18.15* 14.20*
L
L1
L2
0.73
0.80
BSC
0.88
1.03
1.95
REF
0.25
BSC
ș
ș
0O
5O
3.5O
-
7
O
16O
JEDEC Registration MO-112, Variation CB-1, Issue B, Sept.1995.
7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ
Drawings not to scale.
S
D
# DSPD 80PQFPPG V i C041309
DS20005845A-page 12
2017 Microchip Technology Inc.
HV507
APPENDIX A:
REVISION HISTORY
Revision A (October 2017)
• Converted Supertex Doc # DSFP-HV507 to
Microchip DS20005845A
• Removed “Processed with HVCMOS® Technology” in the Features section
• Changed the package marking format
• Changed the quantity of the 80-lead PQFP PG
package from 1000/Reel to 66/Tray
• Made minor changes throughout the document
2017 Microchip Technology Inc.
DS20005845A-page 13
HV507
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
-
Package
Options
X
-
Environmental
X
Media Type
Device:
HV507
=
64-Channel Serial-to-Parallel Converter
with High-Voltage Push-Pull Outputs
Package:
PG
=
80-lead PQFP
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Type:
(blank)
=
66/Tray for a PG Package
DS20005845A-page 14
Example:
a)
HV507PG-G:
64-Channel Serial-to-Parallel
Converter with High-Voltage
Push-Pull Outputs, 80-lead
PQFP, 66/Tray
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
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All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2262-4
== ISO/TS 16949 ==
2017 Microchip Technology Inc.
DS20005845A-page 15
Worldwide Sales and Service
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Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005845A-page 16
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-3326-8000
Fax: 86-21-3326-8021
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2017 Microchip Technology Inc.
10/10/17
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