HV508
High-Voltage Liquid Crystal Shutter Driver
Features
General Description
•
•
•
•
The HV508 is a 45V liquid crystal shutter driver in an
8-lead SOIC surface-mount package. It is composed of
two outputs that provide square waves of opposite
phases. The liquid crystal shutter is connected
between the two outputs. Its equivalent load can be
modeled as a minimum of 1 MΩ resistor in parallel with
a maximum of 0.1 uF capacitor.
Logic-selectable Output Voltage
100 nF Drive Capability
90 VP-P Maximum Output Voltage
25 µs Response Time
Applications
• Liquid Crystal Shutter
The HV508 has three input supply voltages—HVIN,
LVIN and VDD. The output amplitude is either LVIN or
HVIN. A logic high on the HVEN input sets the output to
operate from the HVIN supply. On the other hand, a
logic low on the HVEN input sets the output to operate
from the LVIN supply. The output frequency is
determined by the logic input frequency applied to the
POL input.
Package Type
8-lead SOIC
(Top view)
LVIN 1
8
HVOUT1
POL 2
7
HVIN
HVEN 3
6
VDD
GND 4
5
HVOUT2
See Table 2-1 for pin information.
2017 Microchip Technology Inc.
DS20005728A-page 1
HV508
Functional Block Diagram
LVIN
HVIN
VDD
Level
Translator
Level
Translator
HVOUT1
HVEN
POL
GND
CMOS
Logic
Level
Translator
Level
Translator
HVOUT2
DS20005728A-page 2
2017 Microchip Technology Inc.
HV508
Typical Application Circuit
VDD LVIN HVIN
HVOUT1
HVEN
Image
Controller
Liquid
Crystal
Shutter
HV508
POL
HVOUT2
2017 Microchip Technology Inc.
DS20005728A-page 3
HV508
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
High-voltage Input, HVIN ......................................................................................................................................... +60V
Low-voltage Input, LVIN ......................................................................................................................................... +7.5V
Logic Supply voltage, VDD....................................................................................................................................... +12V
Operating Ambient Temperature, TA ....................................................................................................... –5°C to +60°C
Storage Temperature, TS .................................................................................................................... –65°C to +150°C
Power Dissipation (Note 1):
8-lead SOIC ............................................................................................................................................ 700 mW
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: For operation above 25°C ambient, derate linearly at 6 mW/°C.
RECOMMENDED OPERATING CONDITIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Logic Supply Voltage
VDD
5
—
10
V
Low-output Supply Voltage
LVIN
3
—
6
V
High-output Supply Voltage
HVIN
5
—
45
V
Logic Input Voltage Low
VIL
0
—
0.3 VDD
V
Logic Input Voltage High
VIH
0.7 VDD
—
VDD
V
Ambient Temperature
TA
–5
—
+60
°C
Conditions
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over operating supply voltages; TA = –5°C to +60°C unless otherwise indicated.
Parameter
Sym.
Min.
Typ.
Max.
Unit
IHVQ
—
—
10
µA
LVIN Quiescent Current
ILVQ
—
—
10
µA
VDD Quiescent Current
IDDQ
—
—
10
µA
HVIN Quiescent Current
HVIN Operating Current
IHV
—
—
2.8
mA
POL = 100 Hz, HVEN = high,
TA = 25°C, Load = 1 MΩ in parallel
with 0.1 µF between HVOUT1 and
HVOUT2
POL = 100 Hz, HVEN = low,
TA = 25°C, Load = 1 MΩ in parallel
with 0.1 µF between HVOUT1 and
HVOUT2
LVIN Operating Current
ILV
—
—
380
µA
Logic Input Current Low
IIL
–5
—
—
µA
Logic Input Current High
IIH
—
—
5
µA
Output Capacitive Load
CLOAD
0
—
0.25
µF
Note 1:
Conditions
CLOAD in parallel with a 1 MΩ
resistor (Note 1)
The device can operate continuously in this range without damage. AC limits are not implemented.
DS20005728A-page 4
2017 Microchip Technology Inc.
HV508
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: HVIN = 45V, LVIN = 6V, VDD = 5V, and TA = –5°C to +60°C.
Parameter
Sym.
Min.
Typ.
Max.
Unit
Conditions
POL Input Frequency
fPOL
0
—
100
Hz
Turn-on Time when
High-voltage is Enabled
tHV(ON)
—
—
16
µs
Turn-off Time when
high-voltage is Enabled
tHV(OFF)
—
—
16
µs
Turn-on time when
High-voltage is Disabled
tLV(ON)
—
—
40
µs
Turn-off time when
High-voltage is Disabled
tLV(OFF)
—
—
6
µs
Turn-on time from HVEN to
HVOUT
tEN(ON)
—
—
25
µs
Load = 1 MΩ in parallel with 0.1 µF
between HVOUT1 and HVOUT2
(See Fig.2 in Timing Waveforms.)
Conditions
Load = 1 MΩ in parallel with
0.1 µF between HVOUT1 and
HVOUT2, HVEN = high, outputs rise
to HVIN (See Fig.1 in Timing Waveforms.)
Load = 1 MΩ in parallel with 0.1 µF
between HVOUT1 and HVOUT2,
HVEN = low, outputs rise to HVIN
(See Fig.1 in Timing Waveforms.)
TEMPERATURE SPECIFICATIONS
Parameter
Sym.
Min.
Typ.
Max.
Unit
Operating Ambient Temperature
TA
–5
—
+60
°C
Storage Temperature
TS
–65
—
+150
°C
—
101
—
°C/W
TEMPERATURE RANGE
PACKAGE THERMAL RESISTANCE
JA
8-lead SOIC
Timing Waveforms
VIH
50%
50%
VIL
POL
GND
HVIN
or LVIN
80%
HVOUT1
t(OFF)
t(ON)
5%
Fig. 1
VIH
50%
VIL
HVEN
HVIN
80%
HVOUT1
LVIN
t(ENON)
2017 Microchip Technology Inc.
Fig. 2
DS20005728A-page 5
HV508
2.0
PIN DESCRIPTION
The details on the pins of HV508 are listed on
Table 2-1. Refer to Package Type for the location of
pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
1
LVIN
Low Voltage Supply
2
POL
Polarity
3
HVEN
High Voltage Enable
4
GND
Ground
5
HVOUT2
6
VDD
Logic Voltage Supply
7
HVIN
High Voltage Supply
8
HVOUT1
DS20005728A-page 6
Description
High Voltage Output Channel 2
High Voltage Output Channel 1
2017 Microchip Technology Inc.
HV508
3.0
FUNCTIONAL DESCRIPTION
Follow the steps in Table 3-1 to power up and power
down the HV508.
TABLE 3-1:
POWER-UP AND POWER-DOWN SEQUENCE
Power-up
Step
1
2
3
4
5
Power-down
Description
Step
Connect ground.
Apply VDD.
Connect logic Inputs.
Connect HVIN.
Connect LVIN.
TABLE 3-2:
1
2
2
3
4
Description
Remove LVIN.
Remove HVIN.
Remove all logic inputs.
Remove VDD.
Disconnect ground.
TRUTH FUNCTION TABLE
HVEN
POL
H
H
L
L
2017 Microchip Technology Inc.
HVOUT1
HVOUT2
H
HVIN
GND
L
GND
HVIN
H
LVIN
GND
L
GND
LVIN
DS20005728A-page 7
HV508
4.0
PACKAGE MARKING INFORMATION
4.1
Packaging Information
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005728A-page 8
8-lead SOIC
Example
XXXXXXXX
e3 YYWW
NNN
HV508LG
e3 1718
897
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2017 Microchip Technology Inc.
HV508
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2017 Microchip Technology Inc.
DS20005728A-page 9
HV508
NOTES:
DS20005728A-page 10
2017 Microchip Technology Inc.
HV508
APPENDIX A:
REVISION HISTORY
Revision A (March 2017)
• Converted Supertex Doc# DSFP-HV508 to Microchip DS20005728A
• Removed “HVCMOS® Technology” throughout
the data sheet
• Changed part marking format
• Changed the quantity of the 8-lead SOIC LG
package from 2500/Reel to 3300/Reel
• Made minor text changes throughout the document
2017 Microchip Technology Inc.
DS20005728A-page 11
HV508
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
XX
-
Package
Options
X
-
Environmental
X
Media Type
Device:
HV508
=
High-Voltage Liquid Crystal Shutter Driver
Package:
LG
=
8-lead SOIC
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Type:
(blank)
=
3300/Reel for an LG Package
DS20005728A-page 12
Example:
a) HV508LG-G:
High-Voltage Liquid Crystal
Shutter Driver, 8-lead SOIC,
3300/Reel
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
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and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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OTHERWISE, RELATED TO THE INFORMATION,
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CERTIFIED BY DNV
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© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-1530-5
== ISO/TS 16949 ==
2017 Microchip Technology Inc.
DS20005728A-page 13
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DS20005728A-page 14
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