HV513K7-G

HV513 8-Channel Serial-to-Parallel Converter with High-Voltage Push-Pull Outputs, Polarity, Hi-Z and Short-Circuit Detect Features General Description • Up to 250V Output Voltage • Low-Power Level Shifting from 5V to 250V • Shift Register Speed: - 8 MHz at VDD = 5V • Latched Data Outputs • Output Polarity and Blanking • Output Short-Circuit Detect • Output High-Z (Hi-Z) Control • CMOS-Compatible Inputs The HV513 is a low-voltage-to-high-voltage serial-to-parallel converter with eight high-voltage push-pull outputs. This device is designed to drive small capacitive loads such as piezoelectric transducers. It can also be used in any application requiring multiple high-voltage outputs with medium-current source-and-sink capabilities. Applications • • • • • • Piezoelectric Transducer Driver Braille Driver Weaving Applications Printer Drivers Microelectromechanical Systems Applications Displays The device consists of an 8-bit Shift register, eight latches and control logic to perform the polarity select and blanking of the outputs. Data is shifted through the Shift register on the low-to-high transition of the clock. A data output buffer is provided for cascading devices. The operation of the Shift register is not affected by the latch enable (LE), blanking (BL), polarity (POL) and Hi-Z control inputs. The transfer of data from the Shift register to the latch occurs when the LE is high. The data in the latch is stored when LE is low. A Hi-Z pin is provided to set all the outputs in a High-Z state. All outputs have short-circuit protection that detects if the outputs have reached the required output state. If an output does not track the required state, then the SHORT pin will be low. This output will pulse low during the output transition period under normal operation. See Figure 3-2 for details. All outputs will have a break-before-make circuitry to reduce crossover current during output state changes. The POL, BL, LE and Hi-Z inputs have an internal pull-up resistor. Package Types 32 32-lead QFN (Top view) 24-lead SOW (Top view) 1 24 1 See Table 2-1 and Table 2-2 for pin information.  2019 Microchip Technology Inc. DS20005846B-page 1 HV513 Functional Block Diagram POL VPP BL LE DIN CLK L/T 8-Bit Static Shift Register 8 Latches L/T DOUT Hi-Z Short Detect HVOUT1 • • • 6 Additional Outputs • • • HVOUT8 Short Note 1: POL, BL, LE and Hi-Z have internal 20 kΩ pull-up resistors. DS20005846B-page 2  2019 Microchip Technology Inc. HV513 Typical Application Circuit Low Voltage Power Supply High Voltage Power Supply HVOUT1 DIN CLK Low Voltage High Voltage Shift Register Latches Output Controller Level Translators & Push-Pull Output Buffers LE FPGA BL POL Hi-Z 8 / DOUT DIN  2019 Microchip Technology Inc. to the next HV513 for cascading HVOUT8 SHORT Piezo Element HV513 DS20005846B-page 3 HV513 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Logic Supply Voltage, VDD ........................................................................................................................ –0.5V to +6V High-Voltage Supply, VPP .......................................................................................................................... VDD to +275V Logic Input Levels ........................................................................................................................... –0.5V to VDD +0.5V Ground Current (Note 1) ......................................................................................................................................... 0.3A High-Voltage Supply Current (Note 1) .................................................................................................................. 0.25A Maximum Junction Temperature, TJ(MAX) ........................................................................................................... +125°C Storage Temperature, TS .................................................................................................................... –65°C to +150°C Continuous Total Power Dissipation: 32-lead QFN (Note 2) ............................................................................................................................. 750 mW 24-lead SOW (Note 2) ............................................................................................................................ 750 mW † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: Connection to all power and ground pads is required. Duty cycle is limited by the total power dissipated in the package. 2: For operations above 25°C ambient, derate linearly to 85°C at 12 mW/°C. RECOMMENDED OPERATING CONDITIONS Parameter Sym. Min. Typ. Max. Unit Logic Supply Voltage VDD 4.5 5 5.5 V High-Voltage Supply Voltage VPP 50 — 250 V High-Level Input Voltage VIH VDD–0.9V — VDD V Low-Level Input Voltage VIL 0 — 0.9 V Operating Junction Temperature TJ –40 — +85 °C Note 1: Conditions Note 1 The output may not switch below the minimum VPP. DS20005846B-page 4  2019 Microchip Technology Inc. HV513 DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over typical operating conditions unless otherwise specified, TJ = 25°C. Parameter Sym. Min. IDD — — 4 mA fCLK = 8 MHz, LE = Low — — 0.1 mA All VIN = VDD — — 2 mA All VIN = 0V IPP — — 100 µA VPP = 250V, fOUT = 300 Hz, no load Quiescent VPP Supply Voltage IPPQ — — 100 µA VPP = 240V, outputs are static High-Level Logic Input Current IIH — — 10 µA VIH = VDD — — –10 µA VIL = 0V — — –350 µA VIL = 0V, for inputs with pull-up resistors 140 — — V VPP = 200V, IHVOUT = –20 mA VDD –1V — — V IDOUT = –0.1 mA — — 60 V VDD = 4.5V, IHVOUT = 20 mA 1 V IDOUT = –0.1 mA VDD Supply Current Quiescent VDD Supply Current IDDQ High-Voltage Supply Current Low-Level Logic Input Current High-Level Output IIL HVOUT Data Out Low-Level Output HVOUT Data Out VOH VOL — Typ. Max. Unit — Conditions AC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over typical operating conditions unless otherwise specified, TJ = 25°C. Parameter Sym. Min. Clock Frequency fCLK 0 — 8 MHz Output Switching Frequency (SOA Limited) fOUT — 300 — Hz tWL, tWH 62 — — ns Data Set-Up Time before Clock Rises tSU 15 — — ns Data Hold Time after Clock Rises tH 30 — — ns Latch Enable Pulse Width tWLE 80 — — ns Latch Enable Delay Time after Rising Edge of Clock tDLE 35 — — ns Latch Enable Set-Up Time before Clock Rises tSLE 40 — — ns HVOUT Rise/Fall Time tOR, tOF — — 1000 µs Delay Time for Output to Start Rise/Fall tdON/OFF — — 500 ns Delay Time Clock to Data Low to High tDLH — — 110 ns CL = 15 pF Delay Time Clock to Data High to Low tDHL — — 110 ns CL = 15 pF All Logic Inputs tr, tf — — 5 ns Output Short-Circuit Detection tSD — — 500 ns CL = 15 pF, short to output fall of SHORT Output Short-Circuit Clear tSC — — 3000 ns Short clear to output rise of SHORT Output High-Z State tHI-Z — — 500 ns Clock Width High and Low  2019 Microchip Technology Inc. Typ. Max. Unit Conditions CL = 50 nF, VPP = 200V CL = 100 nF, VPP = 200V DS20005846B-page 5 HV513 TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Operating Junction Temperature TJ –40 — +85 °C Maximum Junction Temperature TJ(MAX) — — +125 °C TS –65 — +150 °C 32-lead QFN JA — 22 — °C/W 24-lead SOW JA — 44 — °C/W Conditions TEMPERATURE RANGE Storage Temperature PACKAGE THERMAL RESISTANCE Timing Waveforms VIH DATA INPUT Data Valid 50% 50% VIL tSU tH VIH CLK 50% 50% 50% 50% VIL tWH tWL VOH 50% VOL tDLH DATA OUT VOH 50% VOL tDHL VIH 50% 50% LE VIL tWLE tDLE td(OFF) 10% td(ON) DS20005846B-page 6 VOH 90% 10% HVOUT w/S/R Low HVOUT w/S/R High tSLE VOL tOR 90% VOH VOL tOR  2019 Microchip Technology Inc. HV513 2.0 PIN DESCRIPTION The details on the pins of HV513 32-lead QFN and 24-lead SOW packages are listed in Table 2-1 and Table 2-2, respectively. Refer to Package Types for the location of pins. TABLE 2-1: 32-LEAD QFN PIN FUNCTION TABLE Pin Number Pin Name 1 NC Description No connection 2 NC No connection 3 NC No connection 4 LGND Low-voltage ground 5 HVGND High-voltage ground 6 HVGND High-voltage ground 7 NC No connection 8 NC No connection 9 HVOUT1 High-voltage push-pull output 10 HVOUT2 High-voltage push-pull output 11 HVOUT3 High-voltage push-pull output 12 HVOUT4 High-voltage push-pull output 13 HVOUT5 High-voltage push-pull output 14 HVOUT6 High-voltage push-pull output 15 HVOUT7 High-voltage push-pull output 16 HVOUT8 High-voltage push-pull output 17 NC No connection 18 NC No connection 19 VPP High-voltage supply 20 VPP High-voltage supply 21 VDD Logic supply voltage 22 DOUT 23 NC No connection 24 NC No connection 25 BL Blanking. A logic input low sets all HVOUTs low. Data output 26 NC No connection 27 POL Polarity bar input logic 28 CLK Clock. Shift registers shift data on the rising edge of input clock. 29 LE 30 SHORT 31 Hi-Z High-impedance pin. Logic input low sets all outputs in a High-impedance state. 32 DIN Data input Center Pad  2019 Microchip Technology Inc. Latch enable bar input logic If output does not reach its required state, a logic‘0’will be asserted at the SHORT pin. Center Pad is at VPP potential. Connect to VPP or leave floating. DS20005846B-page 7 HV513 TABLE 2-2: 24-LEAD SOW PIN FUNCTION TABLE Pin Number Pin Name 1 NC 2 VDD 3 DOUT Description No connection Logic supply voltage Data output Blanking. A logic input low sets all HVOUTs low. 4 BL 5 POL Polarity bar input logic 6 CLK Clock. Shift registers shift data on the rising edge of input clock. 7 LE 8 SHORT 9 Hi-Z High-impedance pin. Logic input low sets all outputs in a high-impedance state. 10 DIN Data input Latch enable bar input logic If output does not reach its required state, a logic‘0’will be asserted at the SHORT pin. 11 LGND 12 NC 13 HVGND High-voltage ground 14 HVGND High-voltage ground 15 HVOUT1 High-voltage push-pull output 16 HVOUT2 High-voltage push-pull output 17 HVOUT3 High-voltage push-pull output 18 HVOUT4 High-voltage push-pull output 19 HVOUT5 High-voltage push-pull output 20 HVOUT6 High-voltage push-pull output 21 HVOUT7 High-voltage push-pull output 22 HVOUT8 High-voltage push-pull output 23 VPP High-voltage supply 24 VPP High-voltage supply DS20005846B-page 8 Low-voltage ground No connection  2019 Microchip Technology Inc. HV513 3.0 FUNCTIONAL DESCRIPTION Follow the steps in Table 3-1 to power up and power down the HV513. TABLE 3-1: POWER-UP AND POWER-DOWN SEQUENCE Power-up Power-down Step Description Step 1 2 3 4 Connect ground. Apply VDD. Set all inputs (Data, CLK, Enable, etc.) to a known state. Apply VPP. 1 2 3 4 TABLE 3-2: Description Remove VPP. Remove all inputs. Remove VDD. Disconnect ground. TRUTH FUNCTION TABLE Inputs Function Outputs Data CLK LE BL All On X X X L L All Off X X X L H Shift Register High-Voltage Output Data Out 1 2...8 1 2...8 * H * *...* H H...H * H * *...* L L...L * X X L H L H * *...* * *...* * H or L ↑ L H H H H or L *...* * *...* * X X L H H H * *...* * *...* * X X L H L H * *...* * *...* * Invert Mode Load S/R POL Hi-Z Store Data in Latches Transparent Latch Mode L ↑ H H H H L *...* L *...* * H ↑ H H H H H *...* H *...* * Outputs Hi-Z X X X X X L * *...* Outputs On X X X X X H * *...* Note: High-impedance outputs * *...* * * H = High-logic level L = Low-logic level X = Irrelevant ↑ = Low-to-high transition * = Dependent on the previous stage’s state before the last CLK or last LE high VDD VDD VPP 20kΩ* DATA OUT INPUT GND GND Logic Inputs FIGURE 3-1: Logic Data Output HVOUT HVGND High Voltage Outputs Input and Output Equivalent Circuits.  2019 Microchip Technology Inc. DS20005846B-page 9 HV513 LE VIH POL VIL BL VIH HI-Z VIL tHi-Z VOH HVOUT Within xV of rail VOL Short Detect tSD tSC VIH VIL Note 1: For VPP greater than 150V, the short detect output will flag short conditions. There are two possibilities: Case 1: HVOUT is higher than 10V when expected low. Case 2: HVOUT is lower than VP–100V when expected high. 2: For VPP greater than 150V, the short detect output will stay clear. There are two possibilities: Case 1: HVOUT is lower than 2V when expected low. Case 2: HVOUT is higher than VPP–60V when expected high. FIGURE 3-2: DS20005846B-page 10 Short-Circuit Detect Detail Timing.  2019 Microchip Technology Inc. HV513 4.0 PACKAGE MARKING INFORMATION 4.1 Packaging Information 32-lead QFN XXXXXXX e3 XX YYWWNNN 24-lead SOW XXXXXXX e3 YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: Example HV513 e3 K7 1917321 Example HV513WG e3 1923864 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo.  2019 Microchip Technology Inc. DS20005846B-page 11 HV513 Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. DS20005846B-page 12  2019 Microchip Technology Inc. HV513 24-Lead SOW (Wide Body) Package Outline (WG) 15.40x7.50 body, 2.65mm height (max), 1.27mm pitch D 24 θ1 E1 E L2 Note 1 (Index Area 0.25D x 0.75E1) L 1 Top View Seating Plane θ L1 Gauge Plane View B A View B h A A2 e A1 Note 1 h Seating Plane b A Side View View A - A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU a printed indicator. Symbol MIN Dimension NOM (mm) MAX A A1 A2 b D E E1 2.15* 0.10 2.05 0.31 15.20* 9.97* 7.40* - - - - 2.65 0.30 2.55* 0.51 15.40 10.30 7.50 15.60* 10.63* 7.60* e 1.27 BSC h L 0.25 0.40 - - 0.75 1.27 L1 1.40 REF L2 0.25 BSC ș ș 0O 5O - - 8O 15O JEDEC Registration MS-013, Variation AD, Issue E, Sep. 2005. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ Drawings are not to scale.  2019 Microchip Technology Inc. DS20005846B-page 13 HV513 NOTES: DS20005846B-page 14  2019 Microchip Technology Inc. HV513 APPENDIX A: REVISION HISTORY Revision A (October 2017) • Converted Supertex Doc # DSFP-HV513 to Microchip DS20005846B • Removed “HVCMOS® Technology” in the Features section • Changed the package marking format • Removed the 32-lead (6 x 6) WQFN K7 M935 media type • Changed the quantity of the 32-lead (6 x 6) WQFN K7 package from 400/Tray to 490/Tray • Made minor changes throughout the document Revision B (June 2019) • Added Center Pad details to Table 2-1.  2019 Microchip Technology Inc. DS20005846B-page 15 HV513 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device XX Package Options - X - Environmental X Media Type Device: HV513 = 8-Channel Serial-to-Parallel Converter with High-Voltage Push-Pull Outputs, Polarity, Hi-Z and Short-Circuit Detect Packages: K7 = 32-lead (6 x 6) WQFN WG = 24-lead SOW Environmental: G = Lead (Pb)-free/RoHS-compliant Package Media Types: (blank) = 490/Tray for a K7 package Examples: a) HV513K7-G: 8-Channel Serial-to-Parallel Converter with High-Voltage Push-Pull Outputs, Polarity, Hi-Z and Short-Circuit Detect, 32-lead (6 x 6) WQFN, 490/ Tray b) HV513WG-G: 8-Channel Serial-to-Parallel Converter with High-Voltage Push-Pull Outputs, Polarity, Hi-Z and Short-Circuit Detect, 24-lead SOW, 1000/Reel = 1000/Reel for a WG package DS20005846B-page 16  2019 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 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The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2019 Microchip Technology Inc. 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