HV5630
32-Channel Serial-to-Parallel Converter With Open Drain Outputs
Features
General Description
•
•
•
•
•
•
The HV5630 is a low-voltage to high-voltage
serial-to-parallel converter with open drain outputs.
This device has been designed for use as a driver for
AC-electroluminescent displays. It can also be used in
any application requiring multiple-output high-voltage
current-sinking capabilities, such as driving inkjet and
electrostatic print heads, plasma panels, vacuum
fluorescent and large matrix LCD displays.
100 mA Minimum Sink Current
8 MHz Shift Register Speed
Polarity and Blanking Inputs
CMOS-compatible Inputs
Forward and Reverse Shifting Options
Diode to VPP allows Efficient Power Recovery
Applications
•
•
•
•
The device consists of a 32-bit Shift register, 32 latches
and control logic to perform the polarity select and
blanking of the outputs. Data is shifted through the Shift
register on the high-to-low transition of the clock. The
HV5630 shifts in a clockwise direction when viewed
from the top of the package. A data output buffer is
provided for cascading devices. This output reflects the
current status of the last bit of the Shift register. The
operation of the Shift register is not affected by the latch
enable (LE), blanking (BL) and polarity (POL) inputs.
The transfer of data from the Shift register to the latch
occurs when the LE input is high. The data in the latch
is stored when LE is low.
Display Driver
Inkjet Driver
Print Head Driver
Microelectromechanical Systems Applications
Package Type
44-lead PLCC
(Top view)
6
1 44
40
See Table 2-1 for pin information.
2017 Microchip Technology Inc.
DS20005855A-page 1
HV5630
Functional Block Diagram
POL
BL
LE
HVOUT1
DATA
IN
Latch
HVOUT2
CLK
Latch
32-Bit
Shift
Register
(Outputs 3 to 30 not shown)
HVOUT31
Latch
HVOUT32
DATA
OUT
Latch
DS20005855A-page 2
2017 Microchip Technology Inc.
HV5630
Typical Application Circuit
2017 Microchip Technology Inc.
DS20005855A-page 3
HV5630
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Supply Voltage, VDD (Note 1) .................................................................................................................. –0.5V to +15V
High-voltage Output Voltage, HVOUT (Note 1) ....................................................................................... –0.5V to +315V
Logic Input Levels (Note 1) .............................................................................................................. –0.5V to VDD+0.5V
Ground Current (Note 2) ......................................................................................................................................... 1.5A
Maximum Junction Temperature, TJ(MAX) .......................................................................................................... +125°C
Storage Temperature, TS .................................................................................................................... –65°C to +150°C
Continuous Total Power Dissipation:
44-lead PLCC (Note 3) ......................................................................................................................... 1200 mW
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: All voltages are referenced to VSS.
2: Duty cycle is limited by the total power dissipated in the package.
3: For operations above 25°C ambient, derate linearly to the maximum operating temperature at 20 mW/°C.
RECOMMENDED OPERATING CONDITIONS
Parameter
Logic Supply Voltage
High-voltage Output Voltage
Sym.
Min.
Typ.
Max.
Unit
VDD
10.8
—
13.2
V
HVOUT
–0.3
—
+300
V
High-level Input Voltage
VIH
VDD–2
—
VDD
V
Low-level Input Voltage
VIL
0
—
2
V
Clock Frequency
fCLK
—
—
8
MHz
TA
–40
—
+85
°C
Operating Ambient Temperature
DS20005855A-page 4
Conditions
2017 Microchip Technology Inc.
HV5630
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Over recommended operating conditions unless otherwise stated
Parameter
Sym.
Min.
Typ.
Max.
Unit
IDD
—
—
15
mA
fCLK = 8 MHz,
fDATA = 4 MHz
IDDQ
—
—
100
µA
VIN = 0V
IO(OFF)
—
—
10
µA
All outputs high, all SWS
parallel
High-level Logic Input Current
IIH
—
—
1
µA
VIH = VDD
Low-level Logic Input Current
IIL
—
—
–1
µA
VIL = 0V
VOH
VDD–1V
—
—
V
IDOUT = –100 µA
—
—
15
V
IHVOUT = 100 mA
VDD Supply Current
Quiescent VDD Supply Current
Off State Output Current
High-level Output Data Out
Low-level Output Voltage
HVOUT
Data Out
HVOUT Clamp Voltage
VOL
VOC
Conditions
—
—
1
V
IDOUT = 100 µA
—
—
–1.5
V
IOL = –100 mA
Typ.
Max.
Unit
AC ELECTRICAL CHARACTERISTICS
Electrical Specifications: For VDD = 12V and TA = 25°C
Parameter
Sym.
Min.
Conditions
fCLK
—
—
8
MHz
tWL, tWH
62
—
—
ns
Data Set-up Time before Clock Falls
tSU
25
—
—
ns
Data Hold Time after Clock Falls
tH
10
—
—
ns
Turn-on Time, HVOUT from Enable
tON
—
—
500
ns
Latch Enable Pulse Width
tWLE
50
—
—
ns
Delay Time Clock to Latch Enable Low to
High
tDLE
50
—
—
ns
Latch Enable Set-up Time before Clock
Falls
tSLE
50
—
—
ns
Delay Time Clock to Data Low to High
tDLH
—
—
100
ns
CL = 15 pF
Delay Time Clock to Data High to Low
tDHL
—
—
100
ns
CL = 15 pF
Sym.
Min.
Typ.
Max.
Unit
Operating Ambient Temperature
TA
–40
—
+85
°C
Maximum Junction Temperature
TJ(MAX)
—
—
+125
°C
TS
–65
—
+150
°C
JA
—
37
—
°C/W
Clock Frequency
Clock Width High or Low
RL = 2 kΩ
to VPP maximum
TEMPERATURE SPECIFICATIONS
Parameter
Conditions
TEMPERATURE RANGE
Storage Temperature
PACKAGE THERMAL RESISTANCE
44-lead PLCC
2017 Microchip Technology Inc.
DS20005855A-page 5
HV5630
Timing Waveforms
VIH
DATA
IN
50%
Data Valid
50%
VIL
tSU
tH
VIH
CLK
50%
50%
50%
50%
VIL
tWH
tWL
VOH
50%
DATA
OUT
VOL
tDLH
VOH
50%
VOL
tDHL
VIH
50%
50%
LE
VIL
tWLE
tDLE
VOH
HVOUT
w/ S/R HIGH
10%
tON
DS20005855A-page 6
tSLE
VOL
2017 Microchip Technology Inc.
HV5630
2.0
PIN DESCRIPTION
The details on the pins of HV5630 are in Table 2-1.
Refer to Package Type for the location of pins.
TABLE 2-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
Description
1
HVOUT17
High-voltage output
2
HVOUT16
High-voltage output
3
HVOUT15
High-voltage output
4
HVOUT14
High-voltage output
5
HVOUT13
High-voltage output
6
HVOUT12
High-voltage output
7
HVOUT11
High-voltage output
8
HVOUT10
High-voltage output
9
HVOUT9
High-voltage output
10
HVOUT8
High-voltage output
11
HVOUT7
High-voltage output
12
HVOUT6
High-voltage output
13
HVOUT5
High-voltage output
14
HVOUT4
High-voltage output
15
HVOUT3
High-voltage output
16
HVOUT2
High-voltage output
17
HVOUT1
High-voltage output
18
DATA OUT
Data output pin
19
NC
No connection
20
NC
No connection
21
NC
No connection
22
POL
Inverts the polarity of the HVOUT pins
23
CLK
Clock pin. Shift registers shift data on the falling edge of the input clock.
24
VSS
Reference voltage (usually ground)
25
VDD
Logic supply voltage
26
LE
27
DATA IN
28
BL
This blanking pin sets all HVOUT pins low or high depending upon the state of
polarity. See Table 3-2.
29
NC
No connection
30
HVOUT32
High-voltage output
31
HVOUT31
High-voltage output
32
HVOUT30
High-voltage output
33
HVOUT29
High-voltage output
34
HVOUT28
High-voltage output
35
HVOUT27
High-voltage output
2017 Microchip Technology Inc.
Latch enable pin. Data is shifted from the Shift register to the latches on logic
input high.
Data input pin
DS20005855A-page 7
HV5630
TABLE 2-1:
PIN FUNCTION TABLE (CONTINUED)
Pin Number
Pin Name
36
HVOUT26
High-voltage output
37
HVOUT25
High-voltage output
38
HVOUT24
High-voltage output
39
HVOUT23
High-voltage output
40
HVOUT22
High-voltage output
41
HVOUT21
High-voltage output
42
HVOUT20
High-voltage output
43
HVOUT19
High-voltage output
44
HVOUT18
High-voltage output
DS20005855A-page 8
Description
2017 Microchip Technology Inc.
HV5630
3.0
FUNCTIONAL DESCRIPTION
Follow the steps in Table 3-1 to power up and power
down the HV5630.
TABLE 3-1:
POWER-UP AND POWER-DOWN SEQUENCE
Power-up
Step
Power-down
Description
1
2
3
Step
Connect ground.
Apply VDD.
Set all inputs to a known state.
TABLE 3-2:
1
2
3
Description
Remove all inputs.
Remove VDD.
Disconnect ground.
TRUTH FUNCTION TABLE
Inputs
Function
Outputs
Data
CLK
LE
BL
POL
All On
X
X
X
L
All Off
X
X
X
Invert Mode
X
X
L
H or L
↓
L
X
H or L
X
L
H
Load S/R
Load Latches
Transparent
Latch Mode
Note:
Shift Register
High-voltage Output
Data Out
1
2...32
1
2...32
*
L
*
*...*
On
On...On
*
L
H
*
*...*
Off
Off...Off
*
H
L
*
*...*
*
*...*
*
H
H
H or L
*...*
*
*...*
*
↑
H
H
*
*...*
*
*...*
*
H or L
↑
H
L
*
*...*
*
*...*
*
↓
H
H
H
L
*...*
Off
*...*
*
↓
H
H
H
H
*...*
On
*...*
*
H = High-logic level
L = Low-logic level
X = Irrelevant
↓ = High-to-low transition
↑ = Low-to-high transition
* = Dependent on the previous stage’s state before the last CLK ↓ or last LE high
VDD
VDD
HVOUT
DATA
OUT
DATA
IN
HVIN
VSS
VSS
VSS
Logic Inputs
FIGURE 3-1:
Logic Data Output
High Voltage Outputs
Input and Output Equivalent Circuits.
2017 Microchip Technology Inc.
DS20005855A-page 9
HV5630
4.0
PACKAGE MARKING INFORMATION
4.1
Packaging Information
44-lead PLCC
XXXXXXXXX
e3 YYWWNNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005855A-page 10
Example
HV5630PJ
e3 1723458
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2017 Microchip Technology Inc.
HV5630
44-Lead PLCC Package Outline (PJ)
.653x.653in body, .180in height (max), .050in pitch
D
D1
1 44
.048/.042 x 45O
6
.150 MAX
.056/.042 x 45O
40
Note 1
(Index Area)
.075 MAX
E1
E
Note 2
.020max
(3 Places)
Top View
Vertical Side View
View B
b1
A
Base
Plane
A2
Seating
Plane
e
A1
.020 MIN
b
Horizontal Side View
R
View B
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
Notes:
1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HU DQHPEHGGHGPHWDOPDUNHU RU
a printed indicator.
2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\
Symbol
Dimension
(inches)
A
A1
A2
b
b1
D
D1
E
E1
MIN
.165
.090
.062
.013
.026
.685
.650
.685
.650
NOM
.172
.105
-
-
-
.690
.653
.690
.653
.695
.656
.695
.656
MAX
.180
.120
.083
.021
†
.036
e
R
.025
.050
BSC
.035
.045
JEDEC Registration MS-018, Variation AC, Issue A, June, 1993.
† This dimension differs from the JEDEC drawing.
Drawings not to scale.
2017 Microchip Technology Inc.
DS20005855A-page 11
HV5630
NOTES:
DS20005855A-page 12
2017 Microchip Technology Inc.
HV5630
APPENDIX A:
REVISION HISTORY
Revision A (October 2017)
• Converted Supertex Doc # DSFP-HV5630 to
Microchip DS20005855A
• Removed “Processed with HVCMOS® Technology” in the Features section
• Changed the package marking format
• Removed the 44-lead PLCC PJ M903 media type
• Made minor changes throughout the document
2017 Microchip Technology Inc.
DS20005855A-page 13
HV5630
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
XX
PART NO.
Device
-
Package
Options
X
-
Environmental
X
Media Type
Device:
HV5630
=
32-Channel Serial-to-Parallel Converter
with Open Drain Outputs
Package:
PJ
=
44-lead PLCC
Environmental:
G
=
Lead (Pb)-free/RoHS-compliant Package
Media Type:
(blank)
=
27/Tube for a PJ Package
DS20005855A-page 14
Example:
a) HV5630PJ-G:
32-Channel Serial-to-Parallel
Converter with Open Drain
Outputs, 44-lead PLCC,
27/Tube
2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
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SQTP is a service mark of Microchip Technology Incorporated in
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All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2252-5
== ISO/TS 16949 ==
2017 Microchip Technology Inc.
DS20005855A-page 15
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
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Technical Support:
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DS20005855A-page 16
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Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
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Tel: 39-049-7625286
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Fax: 31-416-690340
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Fax: 34-91-708-08-91
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Tel: 46-8-5090-4654
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Fax: 44-118-921-5820
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10/10/17
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