HV9801ALG-G

HV9801A Switch-Dimmable LED Driver Features General Description • • • • The HV9801A LED driver is ideally suited for switch-dimmable applications using LED bulbs and fixtures. Four-level Switch Dimming Highly Accurate Current Regulator Output Overcurrent or Short-circuit Protection IC Overtemperature Protection Through switch dimming, the lamp can be adjusted to four discrete brightness levels by rapid cycling of the light switch. The brightness levels are traversed in an up-and-down manner. Brightness resumes at the highest level when power is removed for more than a second. Applications • Switch-dimmable LED Bulbs and Fixtures The device can be powered directly from rectified AC through an internal VDD regulator rated at 450V. Package Types 16-lead SOIC (Top view) 8-lead SOIC (Top view) VIN 1 16 DNC DNC 2 15 DNC DNC 3 14 RT CS 4 13 DNC 8 RT GND 5 12 VDD CS 2 7 DNC DNC 6 11 DNC GND 3 6 VDD DNC 7 10 DNC GATE 4 5 DNC GATE 8 VIN 1 9 DNC See Table 2-1 for pin information.  2017 Microchip Technology Inc. DS20005692A-page 1 HV9801A Functional Block Diagram GND VIN VDD Regulator OTP VDD CS UVLO AND Leading Edge Blanking 250mV OR Hiccup 440mV RT Current Mirror from VDD Rail DS20005692A-page 2 GATE Average Current Regulator S Q R Q OFF Time Generator HV9801A  2017 Microchip Technology Inc. HV9801A Typical Application Circuit VIN BUS AC L VIN GATE HV9801A CS GND VDD CDD  2017 Microchip Technology Inc. RT RT RCS DS20005692A-page 3 HV9801A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† VIN .......................................................................................................................................................................... 470V VDD ........................................................................................................................................................................... 12V VCS, VGATE ....................................................................................................................................–0.3V to (VDD +0.3V) Junction Temperature Range, TJ ......................................................................................................... –40°C to +150°C Storage Temperature Range, TS ......................................................................................................... –65°C to +150°C Power Dissipation (TA = 25 °C): 8-lead SOIC ............................................................................................................................................ 650 mW 16-lead SOIC ........................................................................................................................................ 1000 mW † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS Electrical Specifications: Specifications are at TA = 25°C, VIN = 15V unless otherwise noted. Parameter Sym. Min. Typ. Max. Unit Conditions Input Voltage VIN 15 — 450 V Input Current IIN — 1 2 mA IIN, OT — — 500 μA Note 1 Undervoltage Lockout Threshold VUVLO 6.45 6.7 7.1 V VIN rising (Note 2) Undervoltage Lockout Hysteresis ∆VUVLO — 500 — mV VIN falling 3.5 — — mA TA = 25°C (Note 1) mA TA = 125°C (Note 1) INPUT Supply Current, OTP Shutdown Note 2 VDD REGULATOR Maximum Input Current, Limited by UVLO IUVLO 1.5 — — Output Voltage VDD 7.25 7.5 7.75 V CGATE = 500 pF, RT = 226 kΩ Line Regulation ∆VDD, LINE — — 1 V VIN = 15V to 450V, CGATE = 500 pF, RT = 226 kΩ VDD Voltage Margin ∆VDD(UV) 500 — — mV ∆VDD(UV) = VDD–VUVLO, FALL (Note 2) ∆VDD, LOAD — — 100 mV IVDD = 0 mA to 1 mA, CGATE = 500 pF, RT = 226 kΩ Supply Current after Power Loss IVDDX — — 700 μA Note 2 Undervoltage Lockout during VIN Power Loss VUVLO, DIM — 3.5 — V VIN falling TPL1 — 60 — ms Power Loss, Time to Reset TPL2 — 1 — s PWM Dimming Frequency FPWM — 1.2 — kHz VCST 236 250 256 Load Regulation SWITCH DIMMING Power Loss, Qualification Time VIN falling below VUVLO (Note 1) LED CURRENT REGULATOR Current Sense Threshold Note 1: 2: mV Note 2 Determined by characterization; not production tested Specifications apply over the full operating ambient temperature range of –40°C < TA < +125°C. DS20005692A-page 4  2017 Microchip Technology Inc. HV9801A ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Specifications are at TA = 25°C, VIN = 15V unless otherwise noted. Parameter Sym. Min. Typ. Max. Unit Conditions Leading Edge Blanking Time TLEB 110 — 260 ns Note 2 Minimum On-time TONX — — 760 ns VCS = VCST + 30 mV Maximum Duty Cycle Maintaining Regulation DMAX 80 — — % LED current falls beyond this duty cycle Hiccup Threshold VCSH — 440 — mV VCS High to Gate Low Delay TDLY — — 180 ns Hiccup Time TSCH — 750 — μs TONXSC — — 430 ns 32 40 48 8 10 12 SHORT-CIRCUIT PROTECTION Minimum On-time VCS = VCSH + 30 mV VCS = VDD TOFF TIMER Off-time TOFF μs RT = 1 MΩ RT = 226 kΩ GATE DRIVER Sourcing Current ISRC 165 — — mA VGATE = 0V Sinking Current ISINK 165 — — mA VGATE = VDD Rise Time tr — 30 50 ns CGATE = 500 pF Fall Time tf — 30 50 ns CGATE = 500 pF TTRIP — 140 — °C Note 1 ∆TTRIP — 20 — °C Note 1 OVERTEMPERATURE PROTECTION Trip Temperature Hysteresis Note 1: 2: Determined by characterization; not production tested Specifications apply over the full operating ambient temperature range of –40°C < TA < +125°C. TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Operating Ambient Temperature TA –40 — +125 °C Maximum Junction Temperature TJ –40 — +150 °C Storage Temperature TS –65 — +150 °C 8-lead SOIC JA — 101 — °C/W 16-lead SOIC JA — 83 — °C/W Conditions TEMPERATURE RANGE PACKAGE THERMAL RESISTANCE  2017 Microchip Technology Inc. DS20005692A-page 5 HV9801A 2.0 PIN DESCRIPTION The details on the pins of HV9801A are listed on Table 2-1. See location of pins in Package Types. TABLE 2-1: Pin Name PIN FUNCTION TABLE 8-lead SOIC Pin Number 16-lead SOIC Pin Number Description VIN 1 1 Connect to bridge rectifier output. Supplies power to the VDD regulator. Detects light switch power-off event through loss of bridge rectifier output voltage. Do not connect excessive capacitance before or after the bridge to allow VIN to drop rapidly after loss of power. CS 2 4 Current sense input GND 3 5 Ground GATE 4 8 Gate driver output VDD 6 12 VDD regulator output. Connect a high-frequency bypass and a hold-up capacitor at VDD. Bypass capacitor to be 100 nF minimum. See Section 3.0 “Application Information” for hold-up capacitance. RT 8 14 Off-time programming input. Connect programming resistor to GND. DNC 5, 7 DS20005692A-page 6 2, 3, 6, 7, 9, 10, Stands for “Do Not Connect.” 11, 13, 15, 16  2017 Microchip Technology Inc. HV9801A 3.0 APPLICATION INFORMATION 3.1 Current Control CONTINUOUS CONDUCTION MODE (CCM) The HV9801A is designed to control a buck converter operating in CCM. Continuous Conduction Mode operation is characterized by converter operation with non-zero inductor current throughout the switching cycle. Such operation can be achieved by proper selection of the inductance. 3.1.2 0.60 HV9801A Average LED current is set by the current sense resistor RCS and the current regulator reference voltage. See Equation 3-1 and Equation 3-2. EQUATION 3-1: 0.50 0.45 0.40 0.25 EQUATION 3-2: 250mV = I LED  R CS 0 10 20 CURRENT CONTROL PERFORMANCE The control method of the HV9801A virtually eliminates the regulation errors associated with Peak Current mode controllers, such as errors caused by inductor tolerance, propagation delay of the current sense comparator, tolerance in the oscillator frequency or off-timer and changes in line and load voltage. Figure 3-1 compares the load regulation of the HV9801A and that of a device with peak current control. The graph clearly shows the difference in load regulation between the HV9801A and the HV9910B, which is a peak current regulator. 40 50 60 FIGURE 3-1: Output Characteristics of the HV9801A LED Driver. 3.2 Duty Cycle, Off-time, On-time and Inductor DUTY CYCLE The duty cycle (D) is related to the load voltage (VLED) and input voltage (VBUS) by the simple relation shown in Equation 3-3 and Equation 3-4. EQUATION 3-3: V OUT = D  V IN For example, a 2Ω resistor corresponds to a 125 mA (average) LED current. 3.1.3 30 Output Voltage, V 3.2.1 V = IR HV9910B 0.35 0.30 LED CURRENT The HV9801A regulates the LED current with an accuracy far superior to that of competing Peak Current mode controllers. VIN = 170VDC 0.55 LED Current, A 3.1.1 EQUATION 3-4: V LED = D  VBUS 3.2.2 OFF-TIME The HV9801A operates with constant off-time control, which avoids subharmonic oscillation. Switching period and switching frequency are related to on-time and off-time as shown in Equation 3-5 and Equation 3-6. EQUATION 3-5: T SW = T ON + T OFF EQUATION 3-6: 1 F SW = ---------T SW  2017 Microchip Technology Inc. DS20005692A-page 7 HV9801A On-time is related to off-time and duty cycle. See Equation 3-7. EQUATION 3-7: T ON D = ---------------------------------- T ON + T OFF  T ON =  D   1 – D    T OFF With a given TOFF, the HV9801A dynamically adjusts TON to regulate the LED current. Specifically, TON adapts to the duty cycle associated with the given VBUS and VLED. 3.2.3 OFF-TIME PROGRAMMING Off-time is programmed by the RT resistor as illustrated in Equation 3-8. EQUATION 3-8: T OFF =  A  R T  + B Where: A = 40 ps / Ω and B = 300 ns cycle corresponds to 1.67 µs on-time. Hence, the switching frequency is 160 kHz at 150V bus voltage and 150 kHz at 120V bus voltage. 3.2.5 MAXIMUM DUTY CYCLE Duty cycle should be limited to the specified maximum of 80%. Accordingly, the targeted LED string voltage and the bus voltage are limited to the same ratio. Operation at a larger desired duty cycle than the maximum duty cycle results in an LED current lower than programmed. 3.2.6 MINIMUM DUTY CYCLE Duty cycle is limited on the low side by the minimum on-time specification (760 ns). Operation at a smaller desired on-time than the minimum causes the LED current to exceed the programmed value. LED string voltage cannot be made arbitrarily low. Minimum LED string voltage can be determined with Equation 3-11. EQUATION 3-11: T ONX D MIN = ------------------------------------- T OFF + T ONX  For instance, a 200 kΩ resistor corresponds to 8.3 μs off-time. An acceptable range for RT is 30 kΩ to 1 MΩ, corresponding to an off-time range between 1.5 µs and 40.3 µs. 3.2.4 INDUCTOR V LED = D MIN  V BUS For instance, with 5 µs off-time, the duty cycle should be kept above 13%. Such a duty cycle corresponds to an LED string voltage of 19.5V at 150V bus voltage. Because the converter should operate in CCM, the inductor current should not fall to zero within a switching cycle and the inductor current ripple should be sized accordingly. A design that needs a lower LED string voltage requires a longer off-time. A common choice for peak-to-peak inductor current ripple (PPR) is 30% to 40% of nominal LED current. An increase in the LED current sense signal above 440 mV (176% of nominal) trips the short-circuit comparator, thereby causing the converter to switch to Hiccup mode. In Hiccup mode, off-time is lengthened to about 750 µs to allow the inductor current to drop to a safe level. Inductance can be calculated from the current drop during off-time as shown in Equation 3-9 and Equation 3-10. EQUATION 3-9: L  I = V  T EQUATION 3-10: 3.2.7 SHORT-CIRCUIT PROTECTION Without the extended off-time, the inductor current increases with every switching cycle, causing an overcurrent damage to the converter. The off-time extension can be observed in Figure 3-2 below. L  PPR  I LED = V LED  T OFF 440mV/RCS For example, 30% PPR on 350 mA average current equates to 105 mA ripple, which together with 5 µs off-time and 30V LED string voltage corresponds to 1.43 mH inductance. A design with 30V LED voltage and 150V bus voltage corresponds to a 20% duty cycle, while a 120V bus voltage coincides with a 25% duty cycle. A 20% duty cycle corresponds to 1.25 µs on-time, and a 25% duty DS20005692A-page 8 S ~750µs FIGURE 3-2: Current. Short-circuit Inductor  2017 Microchip Technology Inc. HV9801A 3.2.8 LEADING EDGE BLANKING The MOSFET drain current and the current sense signal exhibit a spike at the start of a switching cycle, which arises from the MOSFET gate charging current and the current required for discharging the MOSFET drain node. These two currents typically exceed the inductor by quite a margin. The current sense signal is blanked at the start of the switching cycle in order to avoid a premature trigger of the current sense and the short-circuit protection comparators. 3.2.9 VDD REGULATOR The VDD regulator generates a source of regulated voltage for operation of internal and external circuits from the power applied at the VIN pin. Alternatively, the VDD voltage can be supplied from a source directly connected to the VDD pin. 3.3 3.3.1 Switch Dimming GENERAL Lamp brightness can be adjusted to one of four discrete levels by rapidly cycling power with the light switch. The brightness levels are traversed in an up-and-down manner, the four levels being 100%, 50%, 25% and 12.5%. Brightness resumes at the highest level when power is removed for more than a second. Reduction of LED current is accomplished through PWM dimming with a PWM dimming frequency of about 1 kHz. The PWM frequency is generated by an internal oscillator, and the PWM duty cycle is controlled by digital logic. Turning the light switch off and on within one second adjusts LED current to the next level in each dimming step. The direction of dimming depends on the existing position in the dimming sequence. The illustration in Figure 3-3 shows more details. The sequence starts at 100% and adjusts to the next lower level by the first dimming step and then adjusts to the next lower level by the next dimming step. Upon reaching the lowest or highest level, the direction of the sequence reverses. Therefore, the actual overall dimming sequence is 100%, 50%, 25%, 12.5%, 25%, 50%, 100%, and the sequence repeats as the dimming steps continue. When power is removed for more than one second, the dimming sequence is terminated and the brightness is reset to 100% upon turn-on of the light switch.  2017 Microchip Technology Inc. AC Line Power OFF/ON cycle time 1second (max.) ON Brightness 50% 100% 25% 12.5% 25% FIGURE 3-3: Line Power. 3.3.2 100% LED Brightness and AC VDD CAPACITOR The VDD voltage should be maintained for at least one second and above the 3.5V level after loss of VIN power to allow certain timing circuits to function. The minimum VDD capacitance required can be calculated with Equation 3-12. EQUATION 3-12: C  V = I  T C DD   7.5V – 3.5V  = I VDDX  1s With 700 µA of IVDDX the bypass capacitance should be 175 µF. 3.3.3 DETECTION OF POWER CYCLING The presence of AC line power is detected at the VIN pin. To this end, loss of AC power should result in a rapidly falling voltage at the output of the bridge rectifier. The VIN voltage drops due to the current draw from the VDD regulator. In order to facilitate a quick drop in voltage, a diode should be added to isolate the bus capacitor from the VIN pin as shown in the Typical Application Circuit. DS20005692A-page 9 HV9801A 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 8-lead SOIC Example XXXXXXXX XX e3 YYWW NNN HV9801A LG e3 1727 991 16-lead SOIC XXXXXXXX e3 YYWWNNN Legend: XX...X Y YY WW NNN e3 * Note: DS20005692A-page 10 Example HV9801ANG e3 1711541 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo.  2017 Microchip Technology Inc. HV9801A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.  2017 Microchip Technology Inc. DS20005692A-page 11 HV9801A 16-Lead SOIC (Narrow Body) Package Outline (NG) 9.90x3.90mm body, 1.75mm height (max), 1.27mm pitch D 16 θ1 E1 E Note 1 (Index Area D/2 x E1/2) L2 1 L Top View View B View B A h A A2 h Seating Plane e A1 Seating Plane θ L1 Gauge Plane Note 1 b Side View View A-A A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. 7KLVFKDPIHUIHDWXUHLVRSWLRQDO,ILWLVQRWSUHVHQWWKHQD3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEH DPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURUDSULQWHGLQGLFDWRU Symbol MIN Dimension (mm) A A1 A2 b D 1.35* 0.10 1.25 0.31 9.80* NOM - - - - MAX 1.75 0.25 1.65* 0.51 9.90 E E1 e 5.80* 3.80* 6.00 3.90 10.00* 6.20* 4.00* 1.27 BSC h L 0.25 0.40 L1 L2 1.04 0.25 REF BSC - - 0.50 1.27 ș ș 0O 5O - - 8O 15O JEDEC Registration MS-012, Variation AC, Issue E, Sept. 2005. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ Drawings are not to scale. DS20005692A-page 12  2017 Microchip Technology Inc. HV9801A APPENDIX A: REVISION HISTORY Revision A (September 2017) • Converted Supertex Doc# DSFP-HV9801A to Microchip DS20005692A • Updated the part marking format • Removed the 16-lead SOIC Narrow (NG) M934 media type • Changed the quantity of the 8-lead SOIC (Narrow) LG package from 2500/Reel to 3300/Reel • Made minor text changes throughout the document  2017 Microchip Technology Inc. DS20005692A-page 13 HV9801A PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. XX PART NO. Device Device: Packages: - Package Options HV9801A X - Environmental = X Media Type Switch-Dimmable LED Driver LG = 8-lead SOIC NG = 16-lead SOIC Environmental: G = Lead (Pb)-free/RoHS-compliant Package Media Type: (blank) DS20005692A-page 14 = 3300/Reel for an LG Package = 45/Tube for an NG Package Examples: a) HV9801ALG-G: Switch-Dimmable LED Driver, 8-lead SOIC Package, 3300/Reel b) HV9801ANG-G: Switch-Dimmable LED Driver, 16-lead SOIC Package, 45/Tube  2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2134-4 == ISO/TS 16949 ==  2017 Microchip Technology Inc. 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