JANTX1N6642

1N6638, 1N6642, 1N6643 Available on commercial versions Qualified Levels: JAN, JANTX, JANTXV and JANS VOIDLESS HERMETICALLY SEALED SWITCHING DIODES Qualified per MIL-PRF-19500/578 DESCRIPTION These popular JEDEC registered switching/signal diodes are military qualified and available with internal metallurgical bonded construction. These small low capacitance diodes with very fast switching speeds are hermetically sealed and bonded into a “D” package. They may be used in a variety of fast switching applications including computers and peripheral equipment such as magnetic cores, thin-film memories, plated-wire memories, as well as decoding or encoding applications, etc. Microsemi also offers a variety of other switching/signal diodes. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • • • JEDEC registered 1N6638, 1N6642, and 1N6643. Ultra fast recovery time. Very low capacitance. Metallurgically bonded. Non-cavity glass package. JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/578. Replacements for 1N4148, 1N4148-1, 1N4150, 1N4150-1, and 1N914. RoHS compliant devices available (commercial grade only). “D” Package APPLICATIONS / BENEFITS • • Also available in: Small size for high density mounting using flexible thru-hole leads (see package illustration). Ideal for: High frequency data lines RS-232 & RS–422 Interface Networks Ethernet 10 Base T Switching core drivers LAN Computers “B” SQ MELF or D-5B Package (surface mount) 1N6638US_42US_43US o MAXIMUM RATINGS @ TA = +25 C unless otherwise noted. Parameters/Test Conditions Junction and Storage Temp (1) Thermal Resistance Junction-to-Lead = 0.375 inch (1) Thermal Resistance Junction-to-Ambient o Peak Forward Surge Current @ TA = +25 C (Test pulse = 8.3 ms, half-sine wave.) o Average Rectified Forward Current @ TA = +75 C o o (Derate at 3.0 mA/ C above TL = +75 C @ L = 3/8”) Breakdown Voltage: 1N6638 1N6642 1N6643 Working Peak Reverse Voltage: 1N6638 1N6642 1N6643 Symbol Value TJ and TSTG RӨJL RӨJA IFSM -65 to +175 150 250 2.5 IO 300 mA VBR 150 100 75 125 75 50 V VRWM Unit o C C/W o C/W A o V NOTES: 1. TA = +75 °C on printed circuit board (PCB), PCB = FR4 - .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, in still air; pads for axial = .092 inch (2.34 mm) diameter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L ≤ .187 inch (≤ 4.75 mm); RΘJA with a defined PCB thermal resistance condition included, is measured at IO = 300 mA. T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 Tel: (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 5 1N6638, 1N6642, 1N6643 MECHANICAL and PACKAGING • • • • • • CASE: Voidless hermetically sealed hard glass. TERMINALS: Tin-lead plate with >3% lead. Solder dip is available upon request. MARKING: Body painted and alpha numeric. POLARITY: Cathode indicated by band. Tape & Reel option: Standard per EIA-296. Consult factory for quantities. See Package Dimensions on last page. PART NOMENCLATURE JAN 1N6638 (e3) Reliability Level JAN = JAN Level JANTX = JANTX Level JANTXV = JANTXV Level JANS = JANS Level Blank = commercial RoHS Compliance e3 = RoHS compliant (available in commercial grade only) Blank = non-RoHS compliant JEDEC type number See Electrical Characteristics table SYMBOLS & DEFINITIONS Definition Symbol VBR VRWM VF IF IR C trr Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Forward Current: The forward current dc value, no alternating component. Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Capacitance: The capacitance in pF at a frequency of 1 MHz and specified voltage. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified recovery decay point after a peak reverse current is reached. ELECTRICAL CHARACTERISTICS @ 25oC unless otherwise noted. TYPE NUMBER 1N6638 1N6642 1N6643 MAXIMUM FORWARD VOLTAGE VF @ IF V @ mA 0.8 V @ 10 mA 0.8 V @ 10 mA 0.8 V @ 10 mA V @ mA 1.1 V @ 200 mA 1.2 V @ 100 mA 1.2 V @ 100 mA MAXIMUM DC REVERSE CURRENT IR1 VR= 20 V IR2 VR=VRWM nA 35 25 50 nA 500 500 500 IR3 VR=20 V TA= +150 oC µA 50 50 75 IR4 VR=VRWM TA= +150 oC µA 100 100 100 REVERSE RECOVERY TIME trr (Note 1) ns 4.5 5.0 6.0 MAXIMUM FORWARD RECOVERY VOLTAGE AND TIME IF=200mA, tr=1ns MAXIMUM JUNCTION CAPACITANCE f = 1 MHz Vsig = 50 mV (p-p) VFRM tfr VR=0 V VR=1.5 V V 5.0 5.0 5.0 ns 20 20 20 pf 2.5 5.0 5.0 pf 2.0 2.8 2.8 NOTE: 1. Reverse Recovery Time Test Conditions – IF=IR=10 mA, IR(REC) = 1.0 mA, C=3 pF, RL = 100 ohms. T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 2 of 5 1N6638, 1N6642, 1N6643 Sinewave Operation Maximum IO Rating (mA) GRAPHS o TA ( C) Ambient Temperature o Thermal Impedance ( C/W) FIGURE 1 Temperature – Current Derating Time (s) FIGURE 2 Maximum Thermal Impedance at TA = 55 oC T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 3 of 5 1N6638, 1N6642, 1N6643 o Thermal Impedance ( C/W) GRAPHS (continued) Time (s) FIGURE 3 Maximum Thermal Impedance at TL = 25 oC T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 4 of 5 1N6638, 1N6642, 1N6643 PACKAGE DIMENSIONS INCH MILLIMETERS DIM MIN MAX MIN MAX NOTES BD 0.056 0.080 1.42 2.03 2 BL 0.130 0.180 3.30 4.57 LD 0.018 0.022 0.46 0.56 LL 1.00 1.50 25.40 38.10 3 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Dimension BD shall be measured at the largest diameter. 3. The specified lead diameter applies in the zone between .050 inch (1.27 mm) from the diode body to the end of the lead. Outside of this zone lead shall not exceed BD. 4. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. T4-LDS-0218, Rev. 1 (111513) ©2011 Microsemi Corporation Page 5 of 5