1N4460US – 1N4496US and
1N6485US – 1N6491US
Available on
commercial
versions
VOIDLESS HERMETICALLY SEALED SURFACE
MOUNT 1.5 WATT GLASS ZENER DIODES
Qualified per MIL-PRF-19500/406
Qualified Levels:
JAN, JANTX,
JANTXV and JANS
DESCRIPTION
This surface mount, Zener voltage regulator series is military qualified to MIL-PRF-19500/406
and is ideal for high-reliability applications where a failure cannot be tolerated. These industryrecognized 1.5 watt Zener voltage regulators are hermetically sealed with void-less glass
construction using an internal metallurgical bond. It includes Zener selections from 3.3 to 200
volts in standard 5% tolerance. 1% and 2% tolerance versions are also available. Microsemi
also offers numerous other Zener products to meet higher and lower power ratings in both
thru-hole and surface mount packages.
“A” (D-5A) MELF
Package
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
•
•
•
•
•
•
•
Surface mount equivalent of popular JEDEC registered series.
Void-less hermetically sealed glass package.
Triple-layer passivation.
Extremely robust construction.
Internal “Category 1” metallurgical bonds for 1N4462US thru 1N4496US and “Category III” for
1N6485US thru 1N6491US as well as 1N4460US and 1N4461US.
JAN, JANTX, JANTXV and JANS qualifications are available per MIL-PRF-19500/406.
RoHS compliant versions available (commercial grade only).
Also available in:
DO-41 Package
(axial-lead)
1N4460 – 1N4496 and
1N6485 – 1N6491
APPLICATIONS / BENEFITS
•
•
•
•
•
•
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 3.3 to 200 V.
Standard voltage tolerances are plus/minus 5% with no suffix.
Tighter tolerances available in plus or minus 2% or 1%.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Inherently radiation hard as described in Microsemi MicroNote 050.
o
MAXIMUM RATINGS @ T A = 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Steady State Power Dissipation @ TA = 25 ºC
Thermal Resistance Junction-to-End Cap
1N4462 – 1N4496
Thermal Impedance @ 10 ms
1N6485 – 1N6491
1N4460 – 1N4461
Forward Voltage
@ 200 mA
@ 1.0 A
Solder Temperature @ 10 s
Symbol
Value
TJ & TSTG
PD
R ӨJEC
Z ӨJX
-65 to +175
1.5
20
Figure 3
Figure 4
Figure 4
1.0
1.5
260
VF
TSP
Unit
o
C
W
o
C/W
ºC/W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
T4-LDS-0183-1, Rev. 1 (120901)
©2012 Microsemi Corporation
Page 1 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
MECHANICAL and PACKAGING
•
•
•
•
•
•
•
CASE: Hermetically sealed voidless hard glass with tungsten slugs.
TERMINALS: Tin/lead (Sn/Pb) or RoHS compliant matte/tin (commercial grade only) over copper.
MARKING: Polarity band only.
POLARITY: Cathode indicated by band.
TAPE & REEL option: Standard per EIA-481-B. Consult factory for quantities.
WEIGHT: 193 milligrams.
See Package Dimensions on last page.
PART NOMENCLATURE
JAN
1N4460 US
C
(e3)
Reliability Level
JAN = JAN Level
JANTX = JANTX Level
JANTXV = JANTXV Level
JANS = JANS Level
Blank = Commercial
RoHS Compliance
e3 = RoHS compliant (available
on commercial grade only)
Blank = non-RoHS compliant
Tolerance Level
Blank = 5 %
C=2%
D = 1%
JEDEC type number
(See Electrical Characteristics
table)
MELF Surface Mount
SYMBOLS & DEFINITIONS
Definition
Symbol
VZ
I Z , I ZT , I ZK
Z ZT or Z ZK
VF
IR
I ZM
I ZSM
Zener Voltage: The Zener voltage the device will exhibit at a specified current (I Z ) in its breakdown region.
Regulator Current: The dc regulator current (I Z ), at a specified test point (I ZT ), near breakdown knee (I ZK ).
Dynamic Impedance: The small signal impedance of the diode when biased to operate in its breakdown region at a
specified rms current modulation (typically 10% of I ZT or I ZK ) and superimposed on I ZT or I ZK respectively.
Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current.
Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and
temperature.
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
Maximum Zener Surge Current: The non-repetitive peak value of Zener surge current at a specified wave form.
T4-LDS-0183-1, Rev. 1 (120901)
©2012 Microsemi Corporation
Page 2 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
ELECTRICAL CHARACTERISTICS @ 25 ºC Case temperature
TYPE
NOMINAL
ZENER
VOLTAGE
VZ
1N4460US
1N4461US
1N4462US
1N4463US
1N4464US
1N4465US
1N4466US
1N4467US
1N4468US
1N4469US
1N4470US
1N4471US
1N4472US
1N4473US
1N4474US
1N4475US
1N4476US
1N4477US
1N4478US
1N4479US
1N4480US
1N4481US
1N4482US
1N4483US
1N4484US
1N4485US
1N4486US
1N4487US
1N4488US
1N4489US
1N4490US
1N4491US
1N4492US
1N4493US
1N4494US
1N4495US
1N4496US
1N6485US
1N6486US
1N6487US
1N6488US
1N6489US
1N6490US
1N6491US
Volts
6.2
6.8
7.5
8.2
9.1
10.0
11.0
12.0
13.0
15.0
16.0
18.0
20.0
22.0
24.0
27.0
30.0
33.0
36.0
39.0
43.0
47.0
51.0
56.0
62.0
68.0
75.0
82.0
91.0
100.0
110.0
120.0
130.0
150.0
160.0
180.0
200.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
NOTE:
TEST
MAXIMUM
CURRENT
DYNAMIC
IMPEDANCE
I ZT
Z ZT @ I ZT
mA
40.0
37.0
34.0
31.0
28.0
25.0
23.0
21.0
19.0
17.0
15.5
14.0
12.5
11.5
10.5
9.5
8.5
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
3.7
3.3
3.0
2.8
2.5
2.3
2.0
1.9
1.7
1.6
1.4
1.2
76.0
69.0
64.0
58.0
53.0
49.0
45.0
Ohms
4
2.5
2.5
3
4
5
6
7
8
9
10
11
12
14
16
18
20
25
27
30
40
50
60
70
80
100
130
160
200
250
300
400
500
700
1000
1300
1500
10
10
9
9
8
7
5
MAXIMUM KNEE
IMPEDANCE
Z ZK @ I ZK
Ohms
200
200
400
400
500
500
550
550
550
600
600
650
650
650
700
700
750
800
850
900
950
1000
1100
1300
1500
1700
2000
2500
3000
3100
4000
4500
5000
6000
6500
7000
8000
400
400
400
400
500
500
600
mA
1.0
1.0
.5
.5
.5
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
1.0
1.0
1.0
1.0
1.0
1.0
1.0
MAXIMUM
REVERSE
CURRENT
IR @ V R
µA
10.0
5.0
1.0
.50
.30
.30
.30
.20
.05
.05
.05
.05
.05
.05
.05
.05
.05
.05
.05
.05
.05
.05
.05
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
.25
50
50
35
5.0
4.0
1.0
0.5
Volts
3.72
4.08
4.50
4.92
5.46
8.00
8.80
9.60
10.4
12.0
12.8
14.4
16.0
17.6
19.2
21.6
24.0
26.4
28.8
31.2
34.4
37.6
40.8
44.8
49.6
54.4
60.0
65.6
72.8
80.0
88.0
96.0
104.0
120.0
128.0
144.0
160.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
MAXIMUM
CONTINUOUS
CURRENT
I ZM
(Note 1)
mA
230
210
191
174
157
143
130
119
110
95
90
79
71
65
60
53
48
43
40
37
33
30
28
26
23
21
19
17
16
14
13
12
11
9.5
8.9
7.9
7.2
433
397
366
332
304
280
255
SURGE
CURRENT
@ 8.3 ms
square wave
I ZSM
Amps
2.3
2.1
1.9
1.7
1.6
1.4
1.3
1.2
1.1
.95
.90
.79
.71
.65
.60
.53
.48
.43
.40
.37
.33
.30
.28
.26
.23
.21
.19
.17
.16
.14
.13
.12
.11
.095
.089
.079
.072
4.2
3.9
3.6
3.3
3.0
2.7
2.5
1. See “Maximum Ratings” for P D temperature conditions for end-cap package where I ZM is applicable.
T4-LDS-0183-1, Rev. 1 (120901)
©2012 Microsemi Corporation
Page 3 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
ZENER VOLTAGE
GRAPHS
TEMPERATURE COEFFICIENT (%/°C)
DC Operation Maximum Rating (W)
FIGURE 1
Temperature Coefficient Characteristics
T EC (°C) (End Cap)
FIGURE 2
Temperature-Power Derating Curve
T4-LDS-0183-1, Rev. 1 (120901)
©2012 Microsemi Corporation
Page 4 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
ZθJX-(°C/W)
GRAPHS (continued)
t H (Heating time) ms
ZθJX-(°C/W)
FIGURE 3
Thermal Impedance Curve for 1N4462US through 1N4496US
t H (Heating time) ms
FIGURE 4
Thermal Impedance Curve for 1N6485US through 1N6491US and 1N4460US through 1N4461US
T4-LDS-0183-1, Rev. 1 (120901)
©2012 Microsemi Corporation
Page 5 of 6
1N4460US – 1N4496US and
1N6485US – 1N6491US
PACKAGE DIMENSIONS
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. In accordance with ASME Y14.5M, diameters are equivalent to Φx
symbology.
Ltr
BD
BL
ECT
S
DIMENSIONS
INCH
MILLIMETERS
Min
Max
Min
Max
.091
.103
2.31
2.62
.168
.200
4.28
5.08
.019
.028
0.48
0.71
.003
0.08
PAD LAYOUT
DIM
A
B
C
INCH
0.288
0.070
0.155
MILLIMETERS
7.32
1.78
3.94
NOTE: If mounting requires adhesive separate from the solder, an additional 0.080 inch
diameter contact may be placed in the center between the pads as an optional spot
for cement.
T4-LDS-0183-1, Rev. 1 (120901)
©2012 Microsemi Corporation
Page 6 of 6
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