JANTXV1N5553/TR

1N5550 thru 1N5554 Available on commercial versions VOIDLESS HERMETICALLY SEALED STANDARD RECOVERY GLASS RECTIFIERS Qualified Levels: JAN, JANTX, JANTXV and JANS Qualified to MIL-PRF-19500/420 DESCRIPTION This “standard recovery” rectifier diode series is military qualified and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 5.0 amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-glass construction using an internal “Category 1” metallurgical bond. These devices are also available in surface mount MELF package configurations. Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both throughhole and surface mount packages. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • • • • • • • JEDEC registered 1N5550 thru 1N5554 series. Voidless hermetically sealed glass package. Extremely robust construction. Quadruple-layer passivation. Internal “Category 1” metallurgical bonds. JAN, JANTX, JANTXV and JANS qualified versions available per MIL-PRF-19500/420. RoHS compliant versions available (commercial grade only). “B” Package Also available in: APPLICATIONS / BENEFITS • • • • • • Standard recovery 5 amp 200 to 1000 volts rectifier series. Military and other high-reliability applications. General rectifier applications including bridges, half-bridges, catch diodes, etc. High forward surge current capability. Low thermal resistance. Controlled avalanche with peak reverse power capability. • • Extremely robust construction. Inherently radiation hard as described in Microsemi “MicroNote 050”. “B” SQ-MELF (D-5B) Package (surface mount) 1N5550US – 1N5554US MAXIMUM RATINGS @ TA = 25 oC unless otherwise noted. Parameters/Test Conditions Junction and Storage Temperature (1) Thermal Resistance Junction-to-Lead Thermal Impedance @ 10 ms heating time Maximum Forward Surge Current (8.3 ms half sine) (1) o Average Rectified Forward Current @ TL = 30 C (3) o Average Rectified Forward Current @ TA = 55 C o @ TA = 100 C Working Peak Reverse Voltage 1N5550 1N5551 1N5552 1N5553 1N5554 Solder Temperature @ 10 s Symbol Value TJ and TSTG R ӨJL Z ӨJX I FSM I O(L) (2) I O2 (4) I O3 V RWM -65 to +175 22 1.5 100 5 3 2 200 400 600 800 1000 260 TSP Unit o C C/W o C/W A A A A V o o C MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com See notes on next page. T4-LDS-0230, Rev. 1 (111901) ©2011 Microsemi Corporation Page 1 of 6 1N5550 thru 1N5554 MAXIMUM RATINGS Notes: 1. At .375 inch (9.52 mm) lead length from body. o 2. Derate linearly at 22.2 mA/ºC from +55 ºC to +100 C. 3. These I O ratings are for a thermally (PC boards or other) mounting methods where the lead or end-cap temperatures cannot be maintained and where thermal resistance from mounting point to ambient is still sufficiently controlled where T J(MAX) does not exceed 175 oC. This equates to R θJX ≤ 47 ºC/W. 4. Derate linearly at 26.7 mA/°C above T A = +100 °C to +175 °C ambient. MECHANICAL and PACKAGING • • • • • • • CASE: Hermetically sealed voidless hard glass with tungsten slugs. TERMINALS: Axial-leads are tin/lead (Sn/Pb) over copper. RoHS compliant matte-tin is available for commercial only. MARKING: Body paint and part number. POLARITY: Cathode band. TAPE & REEL option: Standard per EIA-296. Consult factory for quantities. WEIGHT: 750 milligrams. See Package Dimensions on last page. PART NOMENCLATURE JAN 1N5550 (e3) Reliability Level JAN = JAN Level JANTX = JANTX Level JANTXV = JANTXV Level JANS = JANS Level Blank = commercial RoHS Compliance e3 = RoHS compliant (available on commercial grade only) Blank = non-RoHS compliant JEDEC type number See Electrical Characteristics table SYMBOLS & DEFINITIONS Definition Symbol V BR V RWM IO VF IR t rr Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range excluding all transient voltages (ref JESD282-B). Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input and a 180 degree conduction angle. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs. T4-LDS-0230, Rev. 1 (111901) ©2011 Microsemi Corporation Page 2 of 6 1N5550 thru 1N5554 ELECTRICAL CHARACTERISTICS @ TA = 25 oC unless otherwise noted. TYPE 1N5550 1N5551 1N5552 1N5553 1N5554 MINIMUM BREAKDOWN VOLTAGE V BR I R @ 50 µA Volts 220 440 660 880 1100 FORWARD VOLTAGE V F @ I F = 9 A (pk) MIN. Volts 0.6 V (pk) 0.6 V (pk) 0.6 V (pk) 0.6 V (pk) 0.6 V (pk) MAX. Volts 1.2 V (pk) 1.2 V (pk) 1.2 V (pk) 1.3 V (pk) 1.3 V (pk) MAXIMUM REVERSE CURRENT I R @ V RWM REVERSE RECOVERY t rr (Note 1) µA 1.0 1.0 1.0 1.0 1.0 µs 2.0 2.0 2.0 2.0 2.0 NOTE 1: I F = 0.5 A, I RM = 1.0 A, I R(REC) = .250 A. T4-LDS-0230, Rev. 1 (111901) ©2011 Microsemi Corporation Page 3 of 6 1N5550 thru 1N5554 o ZӨJX ( C/Watt) GRAPHS t H Heating Time (seconds) Average Rectified Current in (Amps) FIGURE 1 Maximum Thermal Impedance o Lead Temperature TL ( C) FIGURE 2 Maximum Current vs. Lead Temperature NOTES: 1. Dimensions are in inches. 2. Metric equivalents (to the nearest .01 mm) are given for general information only and are based upon 1 inch = 25.4 mm. T4-LDS-0230, Rev. 1 (111901) ©2011 Microsemi Corporation Page 4 of 6 1N5550 thru 1N5554 IF – Forward Current (A) GRAPHS (continued) V F – Forward Voltage (V) FIGURE 3 Typical Forward Voltage vs. Forward Current T4-LDS-0230, Rev. 1 (111901) ©2011 Microsemi Corporation Page 5 of 6 1N5550 thru 1N5554 PACKAGE DIMENSIONS Dimensions Ltr Inch Min Max Millimeters Min Max BD BL 0.115 0.130 0.180 0.300 2.92 3.30 4.57 7.62 LD LL 0.036 0.900 0.042 1.300 0.92 22.86 1.07 33.02 Notes 3, 4 4 NOTES: 1. Dimensions are in inches. 2. Millimeter equivalents are given for general information only. 3. The BL dimension shall include the entire body including slugs and sections of the lead over which the diameter is uncontrolled. This uncontrolled area is defined as the zone between the edge of the diode body and extending .050 inch (1.27 mm) onto the leads. 4. Dimension BD shall be measured at the largest diameter. 5. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology. T4-LDS-0230, Rev. 1 (111901) ©2011 Microsemi Corporation Page 6 of 6