KSZ9893RNX
3-Port Gigabit Ethernet Switch
with RGMII/MII/RMII Interface
Highlights
• Non-blocking wire-speed Ethernet switching fabric
• Full-featured forwarding and filtering control, including Access Control List (ACL) filtering
• Full VLAN and QoS support
• Two ports with integrated 10/100/1000BASE-T PHYs
• One port with 10/100/1000 Ethernet MAC and
configurable RGMII/MII/RMII interface
• IEEE 802.1X port-based authentication support
• EtherGreen™ power management features,
including low power standby and IEEE 802.3az
• Flexible management interface options: SPI, I2C,
MIIM, and in-band management via any port
• Commercial/Industrial temperature range support
• 64-pin VQFN (8 x 8mm) lead-free package
Target Applications
•
•
•
•
•
•
•
•
Stand-alone 10/100/1000Mbps Ethernet switches
VoIP infrastructure switches
Broadband gateways/firewalls
Wi-Fi access points
Integrated DSL/cable modems
Security/surveillance systems
Industrial control/automation switches
Networked measurement and control systems
Features
• Switch Management Capabilities
- 10/100/1000Mbps Ethernet switch basic functions:
frame buffer management, address look-up table,
queue management, MIB counters
- Non-blocking store-and-forward switch fabric assures
fast packet delivery by utilizing 4096 entry forwarding
table with 128kByte frame buffer
- Jumbo packet support up to 9000 bytes
- Port mirroring/monitoring/sniffing:
ingress and/or egress traffic to any port
- MIB counters for fully-compliant statistics gathering
34 counters per port
- Tail tagging mode (one byte added before FCS) support at host port to inform the processor which ingress
port receives the packet and its priority
- Loopback modes for remote failure diagnostics
- Rapid spanning tree protocol (RSTP) support for topology management and ring/linear recovery
- Multiple spanning tree protocol (MSTP) support
2016 Microchip Technology Inc.
• Two Integrated PHY Ports
-
1000BASE-T/100BASE-TX/10BASE-T IEEE 802.3
Fast Link-up option significantly reduces link-up time
Auto-negotiation and Auto-MDI/MDI-X support
Energy-Efficient Ethernet (EEE) support with lowpower idle mode and clock stoppage
- On-chip termination resistors and internal biasing for
differential pairs to reduce power
- LinkMD® cable diagnostic capabilities for determining
cable opens, shorts, and length
• One Configurable External MAC Port
- Reduced Gigabit Media Independent Interface
(RGMII) v2.0
- Reduced Media Independent Interface (RMII) v1.2
with 50MHz reference clock input/output option
- Media Independent Interface (MII) in PHY/MAC mode
• Advanced Switch Capabilities
- IEEE 802.1Q VLAN support for 128 active VLAN
groups and the full range of 4096 VLAN IDs
- IEEE 802.1p/Q tag insertion/removal on per port basis
- VLAN ID tag/untag options on per port or VLAN basis
- IEEE 802.3x full-duplex flow control and half-duplex
back pressure collision control
- IEEE 802.1X (Port-Based Network Access Control)
- IGMP v1/v2/v3 snooping for multicast packet filtering
- IPv6 multicast listener discovery (MLD) snooping
- IPv4/IPv6 QoS support, QoS/CoS packet prioritization
- 802.1p QoS packet classification with 4 priority queues
- Programmable rate limiting at ingress/egress ports
- Broadcast storm protection
- Four priority queues with dynamic packet mapping for
IEEE 802.1p, IPv4 DIFFSERV, IPv6 Traffic Class
- MAC filtering function to filter or forward unknown unicast, multicast and VLAN packets
- Self-address filtering for implementing ring topologies
• Comprehensive Configuration Registers Access
- High-speed 4-wire SPI (up to 50MHz), I2C interfaces
provide access to all internal registers
- MII Management (MIIM, MDC/MDIO 2-wire) Interface
provides access to all PHY registers
- In-band management via any of the three ports
- I/O pin strapping facility to set certain register bits from
I/O pins at reset time
- On-the-fly configurable control registers
• Power Management
-
IEEE 802.3az Energy Efficient Ethernet (EEE)
Energy detect power-down mode on cable disconnect
Dynamic clock tree control
Unused ports can be individually powered down
Full-chip software power-down
Wake-on-LAN (WoL) standby power mode
DS00002318A-page 1
KSZ9893RNX
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
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Most Current Documentation
To obtain the most up-to-date version of this documentation, please register at our Worldwide Web site at:
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You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the
revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
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• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include -literature number) you are
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Register on our web site at www.microchip.com to receive the most current information on all of our products.
DS00002318A-page 2
2016 Microchip Technology Inc.
KSZ9893RNX
1.0
INTRODUCTION
1.1
General Description
The KSZ9893RNX is a highly-integrated, IEEE 802.3 compliant networking device that incorporates a layer-2+ managed Gigabit Ethernet switch, two 10BASE-T/100BASE-TX/1000BASE-T physical layer transceivers (PHYs) and associated MAC units, and one MAC port with a configurable RGMII/MII/RMII interface for direct connection to a host
processor/controller, another Ethernet switch, or an Ethernet PHY transceiver.
The KSZ9893RNX is built upon industry-leading Ethernet technology, with features designed to offload host processing
and streamline the overall design:
•
•
•
•
•
•
Non-blocking wire-speed Ethernet switch fabric
Full-featured forwarding and filtering control, including port-based Access Control List (ACL) filtering
Full VLAN and QoS support
Traffic prioritization with per-port ingress/egress queues and by traffic classification
Spanning Tree support for RSTP and MSTP
IEEE 802.1X port-based authentication support
A host processor can access all KSZ9893RNX registers for control over all PHY, MAC, and switch functions. Full register
access is available via the integrated SPI or I2C interfaces, and by in-band management via any one of the data ports.
PHY register access is provided by a MIIM interface. Flexible digital I/O voltage allows the MAC port to interface directly
with a 1.8/2.5/3.3V host processor/controller/FPGA.
Additionally, a robust assortment of power-management features including IEEE 802.3az Energy-Efficient Ethernet
(EEE) for power savings with idle link, and Wake-on-LAN (WoL) for low power standby operation, have been designed
to satisfy energy-efficient system requirements.
The KSZ9893RNX is available in commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature ranges. An
internal block diagram of the KSZ9893RNX is shown in Figure 1-1.
FIGURE 1-1:
INTERNAL BLOCK DIAGRAM
Port 2
10/100/1000
PHY 1
10/100/1000
PHY 2
GMAC 1
GMAC 2
Control
Registers
KSZ9893RNX
2016 Microchip Technology Inc.
Switch Engine
Port 1
Queue Management, QoS, Etc.
GMAC 3
RGMII/MII/RMII
Address
Lookup
MIB
Counters
Frame
Buffers
Queue
Mgmt.
SPI/I2C/MIIM
DS00002318A-page 3
KSZ9893RNX
2.0
PACKAGE INFORMATION
2.1
Package Drawings
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
FIGURE 2-1:
PACKAGE (DRAWING)
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
NOTE 1
A
SEE
DETAIL A
B
N
1
2
E
(DATUM B)
(DATUM A)
2X
0.10 C
2X
A
0.10 C
0.10 C
TOP VIEW
64X
0.08 C
C
0.10
C A B
SIDE VIEW
D2
0.10
SEATING
PLANE
C A B
E2
e
2
K
2
1
NOTE 1
N
L
e
64X b
0.07
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-437A Sheet 1 of 2
2016 Microchip Technology Inc.
DS00002318A-page 4
KSZ9893RNX
FIGURE 2-2:
PACKAGE (DIMENSIONS)
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(A3)
C
A
SEATING
PLANE
A1
DETAIL A
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
Standoff
A1
A3
Terminal Thickness
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
E2
Exposed Pad Width
b
Terminal Width
Terminal Length
L
K
Terminal-to-Exposed-Pad
MIN
0.80
0.00
6.40
6.40
0.15
0.35
0.25
MILLIMETERS
NOM
64
0.40 BSC
0.85
0.02
0.20 REF
8.00 BSC
6.50
8.00 BSC
6.50
0.20
0.40
-
MAX
0.90
0.05
6.60
6.60
0.25
0.45
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-437A Sheet 2 of 2
DS00002318A-page 5
2016 Microchip Technology Inc.
KSZ9893RNX
FIGURE 2-3:
PACKAGE (LAND PATTERN)
64-Lead Very Thin Plastic Quad Flat, No Lead Package (JXX) - 8x8 mm Body [VQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
64
1
2
ØV
C2 Y2
EV
G1
X1
Y1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X64)
X1
Contact Pad Length (X64)
Y1
Contact Pad to Center Pad (X64)
G1
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.40 BSC
MAX
6.60
6.60
7.90
7.90
0.20
0.80
0.20
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-2437A
2016 Microchip Technology Inc.
DS00002318A-page 6
KSZ9893RNX
APPENDIX A:
TABLE A-1:
PRODUCT BRIEF REVISION HISTORY
REVISION HISTORY
Revision
DS00002318A (12-16-16)
2016 Microchip Technology Inc.
Section/Figure/Entry
Correction
Initial Document Release
DS00002318A-page 7
KSZ9893RNX
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make
files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
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• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion
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CUSTOMER CHANGE NOTIFICATION SERVICE
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To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales
offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support
2016 Microchip Technology Inc.
DS00002318A-page 8
KSZ9893RNX
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
XX
Device
Package
[XX]( 1)
X
Examples:
Temp. Tape & Reel
Range
Option
a)
b)
Device:
KSZ9893R = 3-Port Switch with 1 RGMII/MII/RMII Interface
Package:
NX
= 64-pin VQFN
Temperature
Range:
C
I
=
0C to
= -40C to
Tape and Reel
Option:
Blank
-TR
= Standard packaging (tray)
= Tape and Reel (Note 1)
2016 Microchip Technology Inc.
+70C
+85C
KSZ9893RNXC
64-pin VQFN package,
Commercial temperature,
Standard packaging
KSZ9893RNXI-TR
64-pin VQFN package,
Industrial temperature,
Tape and reel
(Commercial)
(Industrial)
Note
1:
Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
Check with your Microchip Sales Office for
package availability with the Tape and Reel
option.
DS00002318A-page 9
KSZ9893RNX
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold
harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,
SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and
other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision
Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard,
CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench,
MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher,
SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other
countries.
All other trademarks mentioned herein are property of their respective companies.
© 2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 9781522411130
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2016 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS00002318A-page 10
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DS00002318A-page 11
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2016 Microchip Technology Inc.
11/07/16