LE87271EQCT

Le87271 Datasheet xDSL CPE Line Driver Preliminary August, 2019 xDSL CPE Line Driver Contents 1 Revision History ............................................................................................................................. 1 1.1 Revision 3.0 ........................................................................................................................................ 1 1.2 Revision 2.0 ........................................................................................................................................ 1 1.3 Revision 1.0 ........................................................................................................................................ 1 2 Product Overview .......................................................................................................................... 2 2.1 Features .............................................................................................................................................. 2 2.2 Applications ........................................................................................................................................ 2 2.3 Block Diagram ..................................................................................................................................... 3 3 Pin Descriptions ............................................................................................................................. 4 3.1 Pin Description ................................................................................................................................... 5 4 Electrical Specifications .................................................................................................................. 6 4.1 Absolute Maximum Ratings ................................................................................................................ 6 4.1.1 Thermal Resistance ................................................................................................................................. 6 4.1.2 Package Assembly ................................................................................................................................... 6 4.1.3 Operating Ranges .................................................................................................................................... 7 4.2 Device Specifications .......................................................................................................................... 7 4.3 Operational States ............................................................................................................................ 10 4.3.1 TX States ................................................................................................................................................ 10 4.3.2 Power Down State ................................................................................................................................. 10 4.3.3 Thermal Shut-down ............................................................................................................................... 10 5 Applications ................................................................................................................................. 11 5.1 Typical Application Circuits ............................................................................................................... 11 5.1.1 IREF ........................................................................................................................................................ 12 5.1.2 Input Consideration ............................................................................................................................... 12 5.1.3 Output Driving Considerations .............................................................................................................. 12 5.1.4 Protection .............................................................................................................................................. 12 5.1.5 Power Supplies and Component Placement ......................................................................................... 12 6 Package Specifications ................................................................................................................. 13 6.1 Physical Dimension - 20-Pin Diagram ............................................................................................... 13 7 Ordering Information ................................................................................................................... 14 Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 xDSL CPE Line Driver 1 Revision History The revision history describes the changes that were implemented in the document. The changes are listed by revision, starting with the most current publication. 1.1 Revision 3.0 Revision 3.0 of this document was published in August 2019. The following is a summary of the changes. Features and applications of the Le87271 device were updated. For more information, see the Product Overview (see page 2) section. Section Output Driving Considerations (see page 12) was edited. 1.2 Revision 2.0 Moved from Advance to Preliminary. 1.3 Revision 1.0 Revision 1.0 was published in December 2018. Revision 1.0 was the first publication of this document. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 1 xDSL CPE Line Driver 2 Product Overview The Le87271 device is a single-channel differential amplifier designed to work in Customer Premise Equipment (CPE) systems. It provides multiple bias levels to optimize power and performance. In addition, the line driver features a power-down state, which forces low power. The control pins respond to input levels that can be generated with a standard GPIO. The Le87271 device is available in a 20-pin (4 mm x 4 mm) QFN package with an exposed pad for enhanced thermal conductivity. 2.1 Features The Le87271 device has the following important features: High-power differential output Delivers line power up to 14 dBm Operates at 14 V ±10 % Class AB amplifiers Four biased up states for VDSL applications Four biased up states for ADSL applications Power down states Thermal shutdown circuitry Miniature 4 mm x 4 mm thermally enhanced package RoHS compliant 2.2 Applications The following applications use the Le87271 device. CPE Line Driver for ADSL, ADSL2, and ADSL2+ CPE Line Driver for VDSL2, all profiles up to 17a, 30a, and 35b. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 2 xDSL CPE Line Driver 2.3 Block Diagram The following figure shows the Le87271 block diagram. Figure 1 • Line Driver Block Diagram Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 3 xDSL CPE Line Driver 3 Pin Descriptions The Le87271 device has 20 pins that are described in the following section. The following figure shows the top-view of the Le87271 pin configuration. Figure 2 • Pin Diagram Note: The device incorporates an exposed die pad on the underside of its package. The pad acts as a heat sink and must be connected to a copper plane through the thermal plane for proper heat dissipation. It is internally connected to VSS, but on the board, it should be connected to ground. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 4 xDSL CPE Line Driver 3.1 Pin Description The following table lists the functional pin descriptions of the Le87271 device. Table 1 • Pin Descriptions Pin Pin Name Pin Type 1 NC No connects, no internal connection 2 NC No connects, no internal connection 3 C0 Input Logic level inputs for state control 4 C1 Input Logic level inputs for state control 5 C2 Input Logic level inputs for state control 6 NC No connects, no internal connection 7 IREF Bias current reference 8 VDD Power supply 9 VDD_N Power supply 10 NC No connects, no internal connection 11 OUT_N 12 NC 13 VSS 14 NC 15 OUT_P 16 NC No connects, no internal connection 17 VDD_P Power supply 18 VDD Power supply 19 IN_P Input Line driver differential input 20 IN_N Input Line driver differential input Output Description Line driver differential output No connects, no internal connection Ground Ground No connects, no internal connection Output Line driver differential output Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 5 xDSL CPE Line Driver 4 Electrical Specifications The following section shows the electrical specifications of the Le87271 device. 4.1 Absolute Maximum Ratings The following section shows the absolute maximum ratings, thermal resistance, and operating ranges of the Le87271 device. The following table lists the absolute maximum ratings of the Le87271 device. Table 2 • Absolute Maximum Ratings Names Range Unit VDD with respect to VSS –0.3 to 16 V Control inputs with respect to VSS –0.3 to 4 Junction temperature –40 to 150 ESD immunity (Human Body Model) JESD22 Class 2 complaint ESD immunity (Charge Body Model) JESD22 class IV compliant °C Continuous operation above 145 °C junction temperature may degrade the device reliability. The typical TSD temperature is 170 °C, with 20 °C hysteresis. 4.1.1 Thermal Resistance Thermal performance of a thermally enhanced package is assured through an optimized PCB layout. The specified performance requires that the exposed thermal pad should be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through multiple vias to larger internal copper planes. The following table lists the simulation results of a device mounted on a 4-layer JEDEC PCB with 12 thermal vias in still air. These numbers are only for reference. Table 3 • Thermal Resistance Specifications 4.1.2 Names Value Unit Maximum device power dissipation, continuous - TA = 150 °C 1.37 W Junction to ambient thermal resistance, θJA 47.5 °C/W Junction-to-board thermal resistance, θJB 25.8 Junction-to-case bottom (exposed pad) thermal resistance, θJP 11.7 Junction-to-top characterization parameter, θJC 30.8 Package Assembly Green package devices are assembled with enhanced, environmental-friendly lead-free, halogen-free, and antimony-free materials. The leads possess a matte-tin plating, which is compatible with conventional board assembly processes or newer lead-free board assembly processes. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 6 xDSL CPE Line Driver See IPC/JEDEC J-Std-020 for recommended peak soldering temperature and solder re-flow temperature profile. 4.1.3 Operating Ranges Microsemi guarantees the performance of this device over the –40 °C to 85 °C temperature range by conducting electrical characterization and a single insertion production test coupled with periodic sampling. These procedures comply with the Telcordia GR-357-CORE generic requirements for assuring the reliability of components used in telecommunications equipment. The following table lists the operating ranges used in this device. Table 4 • Operating Ranges 4.2 Name Unit Minimum Typical Maximum Supply voltage, VDD/VDD_P/VDD_N V 12.6 14 15.4 Ambient temperature °C –40 25 85 Line impedance Ω 80 100 150 Device Specifications The following section shows the DC characteristics, AC characteristics, and recommended operating conditions of the Le87271 device. Typical values are characteristics of the Le87271 device and are the result of the engineering evaluation. Minimum and maximum values apply across the operating temperature range and the entire supply range does not vary unless otherwise specified. Note: Typical values are for information purposes only and are not part of the testing requirement. Typical Conditions: VDD = VDD_P = VDD_N = 14 V; RL = 50 Ω differential load; RREF = 75 KΩ; TA = 25 °C. For more information, see the Basic Test Circuit (see page 9) figure. The following table lists the electrical specifications. As VDD, VDD_P, and VDD_N are expected to be tied together, IVDD represents the total current through these three pins, and PVDD represents the total supply power. Table 5 • Electrical Specifications Symbol Parameter Description Condition Min Typ Max Unit IVDD Quiescent supply ATX4 14.8 17.4 20.0 mA ATX3 13.3 15.6 17.9 mA ATX2 10.7 12.6 14.5 mA ATX1 9.4 11.0 12.7 mA Note current IVDD Quiescent supply current IVDD Quiescent supply current IVDD Quiescent supply current Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 7 xDSL CPE Line Driver Symbol Parameter Description Condition Min Typ Max Unit IVDD Quiescent supply VTX4 19.3 22.7 26.1 mA VTX3 17.8 20.9 24.0 mA VTX2 15.1 17.8 20.5 mA VTX1 13.7 16.1 18.5 mA 600 mW Note current IVDD Quiescent supply current IVDD Quiescent supply current IVDD Quiescent supply current PVDD Supply power PLine = 13 dBm VOUT Output voltage Between OUT_P/N 10.5 Vpkd IOUT Drive current Through OUT_P/N 240 mApk 2 iN Input-referred noise VTX States 6 nV/rtHz 1 iN Input-referred noise ATX States 4 nV/rtHz 1 AV Gain 8.20 V/V BW Bandwidth –3 dB, ATX4 States 146 MHz 1 BW Bandwidth –3 dB, ATX3 States 140 MHz 1 BW Bandwidth –3 dB, ATX2 States 90 MHz 1 BW Bandwidth –3 dB, ATX1 States 72 MHz 1 BW Bandwidth –3 dB, VTX4 States 200 MHz 1 BW Bandwidth –3 dB, VTX3 States 190 MHz 1 BW Bandwidth –3 dB, VTX2 States 148 MHz 1 BW Bandwidth –3 dB, VTX1 States 137 MHz 1 AVF Gain flatness f < Signal BW –0.3 dB 1, 3 MTPR Missing tone power VDSL, PAR = 6.8 64 dBc 1 dBc 1 7.88 8.03 0.3 1 ratio MTPR Power ratio ADSL, PAR = 6.3 90 RI Input impedance Differential 12 RO Output impedance Differential 0 CMRR Common mode f < Signal BW 15 18 kΩ 1 Ω 1 dB 1, 3 dB 1, 3 35 rejection ratio PSRR Power supply rejection f < Signal BW 50 Power down state 0.4 ratio IVDD Quiescent supply 0.6 0.8 mA current ON Output noise Power down state 0.9 nV/rtHz 1 680 Ω 1 (100 kHz–30 MHz) RO Output impedance Power down state (Differential) VIH Input high voltage 2.0 VIL Input low voltage VIM Input middle voltage C0 1.4 IIH Input high current VIH = 3 V, C0 15 V 0.8 V 1.5 1.6 V 50 85 µA Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 8 xDSL CPE Line Driver Symbol Parameter Description Condition Min Typ Max Unit IIH Input high current VIH = 3 V, C1, C2 60 120 180 µA IIL Input low current VIL = 0 V, C0 –85 –50 –15 µA IIL Input low current VIL = 0 V, C1, C2 –2 0 2 µA Zin Logic input impedance 25 Note kΩ Notes: 1. Not tested in production. Guaranteed by design and characterization. 2. For line impedance of 80 Ω. 3. Frequency range within signal bandwidth is 552 kHz for ADSL and 30 MHz for VDSL. The following figure shows the basic test circuit of the Le87271 device. Figure 3 • Basic Test Circuit Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 9 xDSL CPE Line Driver 4.3 Operational States Operating state is controlled through three input pins: C0, C1, and C2. C1 and C2 are binary inputs with internal pull-down resistors. C0 is a tri-state input with an internal resistor pulling to the middle (M) logic value if the pin is not driven. If the inputs are not driven, the line driver by default changes into the power down state. The following table lists the operational state control of the Le87271 device. Table 6 • Operational State Control C2 C1 C0 State Device State H H M ATX4 Low noise for ADSL H L H ATX3 Low noise for ADSL H H L ATX2 Low noise for ADSL H H H ATX1 Low noise for ADSL L H M VTX4 High speed for VDSL L L H VTX3 High speed for VDSL L H L VTX2 High speed for VDSL L H H VTX1 High speed for VDSL X L L Power down Amplifiers off, high impedance outputs X L M Power down Amplifiers off, high impedance outputs X X X Thermal Amplifiers off, high impedance outputs shut-down 4.3.1 TX States In TX states, the amplifiers are fully active with gain from INx to OUTx. TX states provide four steps of bias current to the amplifiers. This allows some selection of power versus linearity in the line driver performance. The TX states are further identified as ADSL states (lower bias current, lower noise) or VDSL states (higher bias current, higher bandwidth). 4.3.2 Power Down State Line driver amplifiers are turned off, and there is no gain from INx to OUTx. The amplifier outputs are high-impedance. The gain-setting resistors around the amplifiers remain in place and present a differential impedance at the OUT_P/N. 4.3.3 Thermal Shut-down Thermal shut-down (TSD) is activated at high silicon temperature. Amplifiers are turned off. There is hysteresis in the TSD temperature threshold. After the silicon cools down below the threshold level, the line driver returns to the operating state indicated by the control inputs. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 10 xDSL CPE Line Driver 5 Applications This section shows the applications that use the Le87271 device, and the block diagram describe the functionalities. 5.1 Typical Application Circuits The following figure shows the typical application circuit of the Le87271 device. Figure 4 • Typical Application Circuit The following table lists the resistors and capacitors with the tolerance values. Table 7 • Application Circuit Names and Values Names Type Value Unit Tolerance Rating RREF Resistor 75.0 kΩ 1% 0402 RSP Resistor 12.4 Ω 1% 0805 RSN Resistor 12.4 Ω 1% 0805 CS1 Capacitor 1 µF 20% X7R, 25 V CS2 Capacitor 0.01 µF 20% X7R, 25 V D1 Diode Bridge BAV99 D2 Diode Bridge BAV99 CTXP Capacitor 0.047 µF 20% X7R, 25 V CTXN Capacitor 0.047 µF 20% X7R, 25 V Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 11 xDSL CPE Line Driver 5.1.1 IREF Connect RREF from IREF pin to ground. DC current through RREF provides reference bias current for the device. 5.1.2 Input Consideration The inductance of the trace from driving source to CTXP or CTXN should be less than 100 nH to avoid any ringing or oscillation. 5.1.3 Output Driving Considerations Inside the amplifier, there is no current limit mechanism. RSA and RSB in a few ohms enable to limit current viewed by the line driver in case of large fault transients. If a DC current path exists between the two outputs, DC current can flow through the outputs. With RSP and RSN resistors as shown in place, however, any DC current will be trivial, and therefore, such DC blocking capacitor may not be needed. 5.1.4 Protection The line driver has thermal shutdown protection. Amplifiers turn off and outputs appear as high-impedance if the silicon temperature rises above the TSD temperature. As shown in the Typical Application Circuit (see page 11) figure, diode bridges may be used at the secondary side of the data transformer to clamp transients between the VDD and VSS rails. It is possible that additional transient clamping devices are needed to protect on the line side of the data transformer the isolation of the data transformer in the event of common mode faults. 5.1.5 Power Supplies and Component Placement The power supply should be well bypassed with decoupling placed close to the Le87271 device. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 12 xDSL CPE Line Driver 6 Package Specifications This section shows the package information of the Le87271 device. 6.1 Physical Dimension - 20-Pin Diagram The following figure shows the package drawing for the Le87271 device. The drawing contains the top, bottom, and side views. Figure 5 • Physical Dimension - 20 Pins Note: Packages might have mold tooling markings on the surface. These markings have no impact on the form, fit, or function of the device. Markings vary with the mold tool used during manufacturing. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 13 xDSL CPE Line Driver 7 Ordering Information The following table lists the ordering information of Le87271. Part Order Number Description Packing System Le87271EQC 20-pin, 4mm x 4mm QFN green package with an exposed pad Tray Le87271EQCT 20-pin, 4mm x 4mm QFN green package with an exposed pad Tape and reel Note: The green package is halogen free and meets the RoHS2 directive 2011/65/EU of the European Council to minimize the environmental impact of electrical equipment. Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 14 xDSL CPE Line Driver Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information provided by Microsemi hereunder is provided "as is, where is" and with all faults, and the entire risk associated with such information is entirely with the Buyer. Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other IP rights, whether with regard to such information itself or anything described by such information. Information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes to the information in this document or to any products and services at any time without notice. Microsemi Headquarters One Enterprise, Aliso Viejo, CA 92656 USA Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 Email: sales.support@microsemi.com www.microsemi.com © 2019 Microsemi. All rights reserved. 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Microsemi is headquartered in Aliso Viejo, California, and has approximately 4,800 employees globally. Learn more at www. microsemi.com. PS-0331435 Microsemi Proprietary and Confidential. PS-0331435 Le87271 Datasheet Revision 3.0 15