M2GL010TS-1VFG400I

Product Brief IGLOO2 FPGAs Microsemi’s IGLOO®2 FPGAs integrate fourth generation flash-based FPGA fabric and high-performance communications interfaces on a single chip. The IGLOO2 family is the industry’s lowest power, most reliable and highest security programmable logic solution. This next generation IGLOO2 architecture offers up to 3.6X gate count implemented with 4-input look-up table (LUT) fabric with carry chains, giving 2X performance, and includes multiple embedded memory options and mathblocks for digital signal processing (DSP). High speed serial interfaces include PCI EXPRESS® (PCIe®), 10 Gbps attachment unit interface (XAUI) / XGMII extended sublayer (XGXS) plus native serialization/deserialization (SERDES) communication, while double data rate 2 (DDR2)/DDR3 memory controllers provide high speed memory interfaces. IGLOO2 Family High-Performance FPGA • Efficient 4-Input LUTs with Carry Chains for HighPerformance and Low Power • Up to 236 Blocks of Dual-Port 18 Kbit SRAM (Large SRAM) with 400 MHz Synchronous Performance (512 x 36, 512 x 32, 1kbit x 18, 1kbit x 16, 2kbit x 9, 2kbit x 8, 4kbit x 4, 8kbit x 2, or 16kbit x 1) • • • Up to 240 Blocks of Three-Port 1 Kbit SRAM with 2 Read Ports and 1 Write Port (micro SRAM) Up to 2 High Speed DDRx Memory Controllers – HPMS DDR (MDDR) and Fabric DDR (FDDR) Controllers – Supports LPDDR/DDR2/DDR3 – Maximum 333 MHz Clock Rate – SECDED Enable/Disable Feature – Supports Various DRAM Bus Width Modes, x8, x9, x16, x18, x32, x36 – Supports Command Reordering to Optimize Memory Efficiency – Supports Data Reordering, Returning Critical Word First for Each Command High-Performance DSP Signal Processing – Up to 240 Fast Mathblocks with 18 x 18 Signed Multiplication, 17 x 17 Unsigned Multiplication and 44-Bit Accumulator High Speed Serial Interfaces • High Speed Memory Interfaces Up to 16 SERDES Lanes, Each Supporting: – XGXS/XAUI Extension (To Implement a 10 Gbps (XGMII) Ethernet PHY Interface) – Native SERDES Interface Facilitates Implementation of Serial RapidIO in Fabric or an SGMII Interface to a soft Ethernet MAC – PCI Express (PCIe) Endpoint Controller • High-Performance Memory Subsystem • 64 KB Embedded SRAM (eSRAM) • Up to 512 KB Embedded Nonvolatile Memory (eNVM) • One SPI/COMM_BLK • DDR Bridge (2 Port Data R/W Buffering Bridge to DDR Memory) with 64-Bit AXI Interface • Non-Blocking, Multi-Layer AHB Bus Matrix Allowing Multi-Master Scheme Supporting 5 Masters and 7 Slaves x1, x2, x4 Lane PCI Express Core Up to 2 Kbytes Maximum Payload Size 64-/32-Bit AXI/AHB Master and Slave Interfaces to the Application Layer December 2013 © 2013 Microsemi Corporation SDRAM Support through a Soft SDRAM Memory Controller I IGLOO2 FPGAs • • Two AHB/APB Interfaces to FPGA Fabric (Master/Slave Capable) Two DMA Controllers to Offload Data Transactions – • 8-Channel Peripheral DMA (PDMA) for Data Transfer Between HPMS Peripherals and Memory • High-Performance DMA (HPDMA) for Data Transfer Between eSRAM and DDR Memories Clocking Resources • • – Non-Deterministic Random Bit Generator (NRBG) – User Cryptographic Services (AES-256, SHA-256, Elliptical Curve Cryptographic (ECC) Engine) – User Physically Unclonable Function (PUF) Key Enrollment and Regeneration CRI Pass-Through DPA Patent Portfolio License – 1 MHz Embedded RC Oscillator – – 50 MHz Embedded RC Oscillator Hardware Firewalls Protecting Subsystem (HPMS) Memories Up to 8 Clock Conditioning Circuits (CCCs) with Up to 8 Integrated Analog PLLs Output Clock with 8 Output Phases and 45° Phase Difference (Multiply/Divide, and Delay Capabilities) Frequency: Input 1 to 200 MHz, Output 20 to 400 MHz 1.2 V Core Voltage Multi-Standard User I/Os (MSIO/MSIOD) – – LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V – DDR (SSTL2_1, SSTL2_2) – DDR2 (SSTL18_1, SSTL18_2) – LVDS, MLVDS, Standards – PCI – LVPECL (receiver only) Mini-LVDS, RSDS Differential DDR I/Os (DDRIO) – DDR, DDR2, DDR3, LPDDR, SSTL2, SSTL18, HSTL – LVCMOS 1.2 V, 1.5 V, 1.8 V, 2.5 V Market Leading Number of User I/Os with 5G SERDES Design Security Features (available on all devices) – Intellectual Property (IP) Protection through Unique Security Features and Use Models New to the PLD Industry – Encrypted User Key and Bitstream Loading, Enabling Programming in Less-Trusted Locations Microcontroller Reliability • Single Event Upset (SEU) Immune – Zero FIT FPGA Configuration Cells • Junction Temperature: 125°C – Military Temperature, 100°C – Industrial Temperature, 85°C – Commercial Temperature • Single Error Correct Double Error Detect (SECDED) Protection on the Following: LVTTL/LVCMOS 3.3 V (MSIO only) Security II Zeroization – • • – Data Security Features (available on premium devices) High Precision 32 KHz to 20 MHz Main Crystal Oscillator • • Enhanced Anti-Tamper Features – Operating Voltage and I/Os • Supply-Chain Assurance Device Certificate – Clock Sources – • – • – Embedded Memory (eSRAMs) – PCIe Buffer – DDR Memory Controllers with Optional SECDED Modes Buffers Implemented with SEU Resistant Latches on the Following: – DDR Bridges (HPMS, MDDR, FDDR) – SPI FIFO • NVM Integrity Check at Power-Up and On-Demand • No External Configuration Memory Required—InstantOn, Retains Configuration When Powered Off Low Power • Low Static and Dynamic Power – Flash*Freeze Mode for Fabric • Power as low as 13 mW/Gbps per lane for SERDES devices • Up to 25% lower total power than competing devices P r od u ct B r i ef R ev i si o n 5 IGLOO2 FPGAs IGLOO2 FPGA Block Diagram Acronyms AES AHB APB AXI COMM_BLK DDR DPA ECC EDAC FDDR FIC Advanced Encryption Standard Advanced High-Performance Bus Advanced Peripheral Bus Advanced eXtensible Interface Communication Block Double Data Rate Differential Power Analysis Elliptical Curve Cryptography Error Detection And Correction DDR2/3 Controller in FPGA Fabric Fabric Interface Controller HPMS IAP MACC MDDR SECDED SEU SHA XAUI XGMII XGXS Pro d uc t Brie f R e visi on 5 High-Performance Memory Subsystem In-Application Programming Multiply-Accumulate DDR2/3 Controller in HPMS Single Error Correct Double Error Detect Single Event Upset Secure Hashing Algorithm 10 Gbps Attachment Unit Interface 10 Gigabit Media Independent Interface XGMII Extended Sublayer III IGLOO2 FPGAs Table 1 • IGLOO2 FPGA Product Family Features M2GL005 M2GL010(T) M2GL025(T) M2GL050(T) M2GL090(T) M2GL100(T) M2GL150(T) Logic/DSP Maximum Logic Elements (4LUT + DEF)* 6,060 Mathblocks (18x18) 12,084 27,696 56,340 86,316 99,512 22 34 72 84 160 11 PLLs and CCCs 2 SPI/HPDMA/PDMA Memory 8 1 each 1 2 eNVM (kbytes) 128 LSRAM 18K Blocks 10 21 31 69 109 160 236 uSRAM 1K Blocks 11 22 34 72 112 160 240 256 512 1826 2586 3552 2x36 1x18 eSRAM (kbytes) 64 Total RAM (kbits) High Speed 240 6 Fabric Interface Controllers (FIC) 703 912 DDR Controllers 1104 1x18 SERDES Lanes (T) 0 4 PCIe Endpoints 0 1 MSIO (3.3 V) User I/O 146,124 115 8 5000 2x36 4 8 16 292 292 2 123 157 139 4 309 MSIOD (2.5 V) 28 40 40 62 40 106 106 DDRIO (2.5 V) 66 70 70 176 76 176 176 Total User I/Os 209 233 267 377 425 574 574 Notes: *Total Logic may vary based on utilization of DSP and memories in your design. See the IGLOO2 Fabric UG for details. *Feature availability is package dependent, see Table 3. I/Os Per Package Table 2 • I/Os per Package and Package Options Package Options Type FCS325 VF256 VF400 FCV484 VQ144 FG484 FG676 FG896 FC1152 Pitch (mm) 0.5 0.8 0.8 0.8 0.5 1.0 1.0 1.0 1.0 Length x Width (mm) 11x11 14x14 17x17 19x19 20x20 23x23 27x27 31x31 35x35 Device I/O Lanes I/O Lanes I/O M2GL005 Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes I/O Lanes 171 M2GL010 (T) M2GL025 (T) 180 2 M2GL050 (T) 200 2 M2GL090 (T)² 200¹ 4¹ 831 209 751 233 4 148¹ 2¹ 195 4 148¹ 2¹ 207 4 267 4 207 4 267 4 267 4 377 425 8 4 M2GL100 (T) 273¹ 4¹ 574 8 M2GL150 (T) 273¹ 4¹ 574 16 Notes: 1. Preliminary 2. 090 FCS325 is 11x13.5 package dimension IV P r od u ct B r i ef R ev i si o n 5 IGLOO2 FPGAs Features per Device and Package Combination Table 3 • Features per Device/Package Combination Features Package VQ1445 FCS325 Total User I/O - 2 - - TBD TBD TBD 83 M2GL010 - - 2 - - TBD TBD TBD 75 x181 - 2 2 1 94 22 64 180 x18 2 - 1 2 1 90 22 88 200 x18 1 - 2 - - 79 28 64 171 x18 1 - 2 4 1 99 32 64 195 x18 1 - 2 4 1 111 32 64 207 x18 2 - M2GL100 (T) x18 1 M2GL150 (T) M2GL005 M2GL005 M2GL050 (T) M2GL010 (T) M2GL025 (T) M2GL050 (T) M2GL090 (T) FG676 DDRIO (2.5 V Max) - M2GL025 (T) FG484 MSIOD (2.5 V Max) M2GL005 M2GL010 (T) FCV484 MSIO (3.3 V Max) FDDR M2GL050 (T) 5 PCIe Endpoints MDDR Devices M2GL025(T) VF400 5G SERDES Lanes Crystal Oscillators M2GL090 (T) 1 4 1 87 32 88 207 1 x18 2 4 2 TBD TBD TBD 273 x181 x181 2 4 2 TBD TBD TBD 273 x181 - 2 - - 115 28 66 209 x18 1 - 2 4 1 123 40 70 233 x18 1 - 2 4 1 157 40 70 267 x18 2 - 1 4 1 105 40 122 267 x18 1 - 2 4 2 157 40 70 267 x18 1 - 4 2 4 2 309 40 76 425 4 x36 1 8 2 139 62 176 377 FG896 M2GL050 (T) x36 FC1152 M2GL100 (T) x363 x363 2 8 2 292 106 176 574 M2GL150 (T) x363 x363 2 16 4 292 106 176 574 Notes: 1. DDR supports x18, x16, x9, and x8 modes 2. DDR supports x18 and x16 modes 3. DDR supports x36, x32, x18, x16, x9, and x8 modes 4. DDR supports x36, x32, x18, and x16 modes 5. Preliminary Pro d uc t Brie f R e visi on 5 V IGLOO2 FPGAs IGLOO2 Ordering Information . M2GL050 T _ 1 G FG 896 I Application (Temperature Range) Blank= Commercial (0°C to +85°C Junction Temperature) I= Industrial (–40°C to +100°C Junction Temperature) Package Lead Count Lead-Free Packaging Blank = Standard Packaging G = RoHS-Compliant Package Type FG = Fine Pitch Ball Grid Array (1.0 mm pitch) VF = Very Fine Pitch Ball Grid Array (0.8 mm pitch) FC = Flip Chip Ball Grid Array (1.0 mm pitch) FCS = Flip Chip Ball Grid Array (0.5 mm pitch) Speed Grade Blank = PCIe Gen 1 Support Only 1 = 15 % Faster than STD, PCIe Gen 1 and Gen 2 Transceiver T = With Transceiver Blank = No Transceiver Part Number (Digits Indicate Thousands of LUTs) M2GL005 2 M2GL010 M2GL025 M2GL050 M2GL090 M2GL100 M2GL150 Notes: 1. Design and Data Security Devices (S) are only available in -1 Industrial speed grades 2. M2GL005 device not available with Transceivers IGLOO2 Device Status Refer to the IGLOO2 Datasheet for device status. IGLOO2 Datasheet and Pin Descriptions The datasheet and pin descriptions are published separately: IGLOO2 Datasheet IGLOO2 Pin Descriptions VI P r od u ct B r i ef R ev i si o n 5 1 – IGLOO2 Device Family Overview Microsemi’s IGLOO2 FPGAs integrate fourth generation flash-based FPGA fabric and high-performance communications interfaces on a single chip. The IGLOO2 family is the industry’s lowest power, highest reliability and most secure programmable logic solution. This next generation IGLOO2 architecture offers up to 3.6X gate count, implemented with 4-input look-up table (LUT) fabric with carry chains, giving 2X performance, and includes multiple embedded memory options and mathblocks for DSP. High speed serial interfaces enable PCIe, XAUI / XGXS plus native SERDES communication while DDR2/DDR3 memory controllers provide high speed memory interfaces. High-Performance FPGA Fabric Built on 65 nm process technology, the IGLOO2 FPGA fabric is composed of four building blocks: the logic module, the large SRAM, the micro SRAM and the mathblock. The logic module is the basic logic element and has advanced features: • A fully permutable 4-input LUT (look-up table) optimized for lowest power • A dedicated carry chain based on carry look-ahead technique • A separate flip-flop which can be used independently from the LUT The 4-input look-up table can be configured either to implement any 4-input combinatorial function or to implement an arithmetic function where the LUT output is XORed with carry input to generate the sum output. Dual-Port Large SRAM (LSRAM) Large SRAM (RAM1Kx18) is targeted for storing large memory for use with various operations. Each LSRAM block can store up to 18,432 bits. Each RAM1Kx18 block contains two independent data ports: Port A and Port B. The LSRAM is synchronous for both Read and Write operations. Operations are triggered on the rising edge of the clock. The data output ports of the LSRAM have pipeline registers which have control signals that are independent of the SRAM’s control signals. Three-Port Micro SRAM (uSRAM) Micro SRAM (RAM64x18) is the second type of SRAM which is embedded in the fabric of IGLOO2 devices. RAM64x18 uSRAM is a 3-port SRAM; it has two read ports (Port A and Port B) and one write port (Port C). The two read ports are independent of each other and can perform Read operations in both synchronous and asynchronous modes. The write port is always synchronous. The uSRAM block is approximately 1 KB 152 bits) in size. These uSRAM blocks are primarily targeted for building embedded FIFOs to be used by any embedded fabric masters. Mathblocks for DSP Applications The fundamental building block in any digital signal processing algorithm is the multiply-accumulate function. The IGLOO2 device implements a custom 18x18 Multiply-Accumulate (18x18 MACC) block for efficient implementation of complex DSP algorithms such as finite impulse response (FIR) filters, infinite impulse response (IIR) filters, and fast Fourier transform (FFT) for filtering and image processing applications. Each mathblock has the following capabilities: • Supports 18x18 signed multiplications natively (A[17:0] x B[17:0]) • Supports dot product; the multiplier computes: (A[8:0] x B[17:9] + A[17:9] x B[8:0]) x 29 • Built-in addition, subtraction, and accumulation units to combine multiplication results efficiently P r o d uc t B r i e f R ev i si o n 5 1-1 IGLOO2 Device Family Overview In addition to the basic MACC function, DSP algorithms typically need small amounts of RAM for coefficients and larger RAMs for data storage. IGLOO2 micro RAMs are ideally suited to serve the needs of coefficient storage while the large RAMs are used for data storage. High Speed Serial Interfaces SERDES Interface IGLOO2 FPGA has up to four 5 Gbps SERDES transceivers, each supporting the following: • 4 SERDES/PCS lanes • The native SERDES interface facilitates implementation of Serial RapidIO (SRIO) in fabric or a SGMII interface for a soft Ethernet MAC PCI Express (PCIe) PCIe is a high speed, packet-based, point-to-point, low pin count, serial interconnect bus. The IGLOO2 family has two hard high-speed serial interface blocks. Each SERDES block contains a PCIe system block. The PCIe system is connected to the SERDES block and following are the main features supported: • Supports x1, x2, and x4 lane configuration • Endpoint configuration only • PCI Express Base Specification Revision 2.0 • 2.5 and 5.0 Gbps compliant • Embedded receive (2 KB), transmit (1 KB) and retry (1 KB) buffer dual-port RAM implementation • Up to 2 kbytes maximum payload size • 64-bit AXI or 32-bit/64-bit AHBL Master and Slave interface to the application layer • 32-bit APB interface to access configuration and status registers of PCIe system • Up to 3 x 64 bit base address registers • 1 virtual channel (VC) XAUI/XGXS Extension The XAUI/XGXS extension allows the user to implement a 10 Gbps (XGMII) Ethernet PHY interface by connecting the XGMII fabric interface through an appropriate soft IP block in the fabric. 1- 2 P r o d uc t B r i e f R ev i si o n 5 IGLOO2 FPGAs High Speed Memory Interfaces: DDRx Memory Controllers There are up to two DDR subsystems, MDDR (HPMS DDR) and FDDR (fabric DDR) present in IGLOO2 devices. Each subsystem consists of a DDR controller, PHY, and a wrapper. The MDDR has an interface to/from the HPMS and fabric, and FDDR provides an interface to/from the fabric. The following are the main features supported by the FDDR and MDDR: • Support for LPDDR, DDR2, and DDR3 memories • Simplified DDR command interface to standard AMBA AXI/AHB interface • Up to 667 Mbps (333 MHz double data rate) performance • Supports 1, 2, or 4 ranks of memory • Supports different DRAM bus width modes: x8, x9, x16, x18, x32, and x36 • Supports DRAM burst length of 2, 4, or 8 in full bus-width mode; supports DRAM burst length of 2, 4, 8, or 16 in half bus-width mode • Supports memory densities up to 4 GB • Supports a maximum of 8 memory banks • SECDED enable/disable feature • Embedded physical interface (PHY) • Read and Write buffers in fully associative CAMs, configurable in powers of 2, up to 64 Reads plus 64 Writes • Support for dynamically changing clock frequency while in self-refresh • Supports command reordering to optimize memory efficiency • Supports data reordering, returning critical word first for each command MDDR Subsystem The MDDR subsystem has two interfaces to the DDR. One is an AXI 64-bit bus from the DDR bridge within the HPMS. The other is a multiplexed interface from the FPGA fabric, which can be configured as either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is also a 16-bit APB configuration bus, which is used to initialize the majority of the internal registers within the MDDR subsystem after reset. This APB configuration bus is mastered by a master in the FPGA fabric. Support for 3.3 V Single Data Rate DRAMs (SDRAM) can be obtained by instantiating a soft AHB or AXI SDRAM memory controller in the FPGA fabric and connecting I/O ports to 3.3 V MSIO. FDDR Subsystem The FDDR subsystem has one interface to the DDR. This is a multiplexed interface from the FPGA fabric, which can be configured as either a single AXI 64-bit bus or two 32-bit AHB-Lite buses. There is also a 16-bit APB configuration bus, which is used to initialize the majority of the internal registers within the FDDR subsystem after reset. This APB configuration bus can be mastered by a master in the FPGA fabric. P r o d uc t B r i e f R ev i si o n 5 1-3 IGLOO2 Device Family Overview High-Performance Memory Subsystem (HPMS) The high-performance memory subsystem (HPMS) embeds two separates 32 kbyte SRAM blocks that have optional SECDED capabilities (32 kbytes with SECDED enabled, 40 kbytes with SECDED disabled), up to two separate 256 kbyte eNVM (flash) blocks, and two separate DMA controllers for fast DMA user logic offloading. The HPMS provides multiple interfacing options to the FPGA fabric in order to facilitate tight integration between the HPMS and user logic in the fabric. DDR Bridge The DDR bridge is a data bridge between two AHB bus masters and a single AXI bus slave. The DDR bridge accumulates AHB writes into write combining buffers prior to bursting out to external DDR memory. The DDR bridge also includes read combining buffers, allowing AHB masters to efficiently read data from the external DDR memory from a local buffer. The DDR bridge optimizes reads and writes from multiple masters to a single external DDR memory. Data coherency rules between the masters and the external DDR memory are implemented in hardware. The DDR bridge contains two write combining / read buffers. All buffers within the DDR bridge are implemented with SEU tolerant latches and are not subject to the single event upsets (SEUs) that SRAM exhibits. IGLOO2 devices implement three DDR bridges in the HPMS, FDDR, and MDDR subsystems. AHB Bus Matrix (ABM) The AHB bus matrix (ABM) is a non-blocking, AHB-Lite multi-layer switch, supporting 4 master interfaces and 8 slave interfaces. The switch decodes access attempts by masters to various slaves, according to the memory map and security configurations. When multiple masters are attempting to access a particular slave simultaneously, an arbiter associated with that slave decides which master gains access, according to a configurable set of arbitration rules. These rules can be configured by the user to provide different usage patterns to each slave. For example, a number of consecutive access opportunities to the slave can be allocated to one particular master, to increase the likelihood of same type accesses (all reads or all writes), which makes more efficient usage of the bandwidth to the slave. Fabric Interface Controller (FIC) The FIC block provides two separate interfaces between the HPMS and the FPGA fabric: the HPMS master (MM) and fabric master (FM). Each of these interfaces can be configured to operate as AHB-Lite or APB3. Depending on device density, there are up to two FIC blocks present in the HPMS (FIC_0 and FIC_1). Embedded SRAM (eSRAM) The HPMS contains two blocks of 32 KB eSRAM, giving a total of 64 KB. Having the eSRAM arranged as two separate blocks allows the user to take advantage of the parallelism that exists in the HPMS. The eSRAM is designed for Single Error Correct Double Error Detect (SECDED) protection. When SECDED is disabled, the SRAM usually used to store SECDED data may be reused as an extra 16 KB of eSRAM. Embedded NVM (eNVM) The HPMS contains up to 512 KB of eNVM (64 bits wide). DMA Engines Two DMA engines are present in the HPMS: high-performance DMA and peripheral DMA. 1- 4 P r o d uc t B r i e f R ev i si o n 5 IGLOO2 FPGAs High-Performance DMA (HPDMA) The high-performance DMA (HPDMA) engine provides efficient memory to memory data transfers between an external DDR memory and internal eSRAM. This engine has two separate AHB-Lite interfaces—one to the MDDR bridge and the other to the AHB bus matrix. All transfers by the HPDMA are full word transfers. Peripheral DMA (PDMA) The peripheral DMA engine (PDMA) is tuned for offloading byte-intensive operations, involving HPMS peripherals, to and from the internal eSRAMs. Data transfers can also be targeted to user logic/RAM in the FPGA fabric. APB Configuration Bus On every IGLOO2 device memory, an APB configuration bus is present to allow the user to initialize the SERDES ASIC blocks, the fabric DDR memory controller, and user instantiated peripherals in the FPGA fabric. Peripherals A large number of communications and general purpose peripherals are implemented in the HPMS. Communication Block (COMM_BLK) The COMM block provides a UART-like communications channel between the HPMS and the system controller. System services are initiated through the COMM block. System services such as Enter Flash*Freeze Mode are initiated though this block. SPI The serial peripheral interface controller is compliant with the Motorola SPI, Texas Instruments synchronous serial, and National Semiconductor MICROWIRE™ formats. In addition, the SPI supports interfacing to large SPI flash and EEPROM devices by way of the slave protocol engine. The SPI controller supports both Master and Slave modes of operation. The SPI controller embeds two 4×32 (depth × width) FIFOs for receive and transmit. These FIFOs are accessible through RX data and TX data registers. Writing to the TX data register causes the data to be written to the transmit FIFO. This is emptied by transmit logic. Similarly, reading from the RX data register causes data to be read from the receive FIFO. Clock Sources: On-Chip Oscillators, PLLs, and CCCs IGLOO2 devices have two on-chip RC oscillators—a 1 MHz RC oscillator and a 50 MHz RC oscillator— and the main crystal oscillator (32 KHz–20 MHz). These are available to the user for generating clocks to the on-chip resources and the logic built on the FPGA fabric array. These oscillators can be used in conjunction with the integrated user phase-locked loops (PLLs) and FAB_CCCs to generate clocks of varying frequency and phase. In addition to being available to the user, these oscillators are also used by the system controller, power-on reset circuitry, and HPMS during the Flash*Freeze mode. IGLOO2 devices have up to eight fabric CCC (FAB_CCC) blocks and a dedicated PLL associated with each CCC to provide flexible clocking to the FPGA fabric portion of the device. The user has the freedom to use any of the eight PLLs and CCCs to generate the fabric clocks and the internal HPMS clock from the base fabric clock (CLK_BASE). There is also a dedicated CCC block for the HPMS (HPMS_CCC) and an associated PLL (MPLL) for HPMS clocking and de-skewing the CLK_BASE clock. The fabric alignment clock controller (FACC), part of the HPMS CCC, is responsible for generating various aligned clocks required by the HPMS for correct operation of the HPMS blocks and synchronous communication with the user logic in the FPGA fabric. P r o d uc t B r i e f R ev i si o n 5 1-5 IGLOO2 Device Family Overview Highest Security Devices Building further on the intrinsic security benefits of flash nonvolatile memory technology, the IGLOO2 family incorporates essentially all the legacy security features that made the original SmartFusion®, Fusion®, IGLOO®, and ProASIC®3 third-generation flash FPGAs and cSoCs the gold standard for secure devices in the PLD industry. In addition, the fourth-generation flash-based SmartFusion2 and IGLOO2 FPGAs add many unique design and data security features and use models new to the PLD industry. Design Security Design security is protecting the intent of the owner of the design, such as keeping the design and associated bitstream keys confidential, preventing design changes (insertion of Trojan Horses, for example), and controlling the number of copies made throughout the device life cycle. Design security may also be known as intellectual property (IP) protection. It is one aspect of anti-tamper (AT) protection. Design security applies to the device from initial production, includes any updates such as in-the-field upgrades, and can include decommissioning of the device at the end of its life, if desired. Good design security is a prerequisite for good data security. The following are the main design security features supported: Table 1-1 • Design Security Features Feature M2GL005 M2GL090 M2GL010 M2GL100 M2GL025 M2GL150 M2GL050 FlashLock™ Passcode Security (256-bit) x x Flexible security settings using flash lock-bits x x Encrypted/Authenticated Design Key Loading x x Symmetric Key Design Security (256-bit) x x Design Key Verification Protocol x x Encrypted/Authenticated Configuration Loading x x Certificate-of-Conformance (C-of-C) x x Back-Tracking Prevention (also known as, Versioning) x x Device Certificate(s) (Anti-Counterfeiting) x x Support for Configuration Variations x x Fabric NVM and eNVM Integrity Tests x x Information Services (S/N, Cert., USERCODE, and others) x x Tamper Detection x x Tamper Response (includes Zeroization) x x ECC Public Key Design Security (384-bit) x Hardware Intrinsic Design Key (SRAM-PUF) x 1- 6 P r o d uc t B r i e f R ev i si o n 5 IGLOO2 FPGAs Reliability IGLOO2 flash-based fabric has zero FIT configuration rate due to its single event upset (SEU) immunity, which is critical in reliability applications. The flash fabric also has the advantage that no external configuration memory is required, making the device instant-on; it retains configuration when powered off. To complement this unique FPGA capability, IGLOO2 devices add reliability to many other aspects of the device. Single Error Correct Double Error Detect (SECDED) protection is implemented on the embedded SRAM (eSRAM), and is optional on the DDR memory controllers. This means that if a one-bit error is detected, it will be corrected. Errors of more than one bit are detected only and not corrected. SECDED error signals are brought to the FPGA fabric to allow the user to monitor the status of these protected internal memories. Other areas of the architecture are implemented with latches, which are not subject to SEUs. Therefore, no correction is needed in these locations: DDR bridges (HPMS, MDDR, FDDR), SPI, and PCIe FIFOs. Low Power Microsemi’s flash-based FPGA fabric results in extremely low power design implementation with static power on the M2GL050 device as low as 10 mW. Flash*Freeze (F*F) technology provides an ultra-low power static mode (Flash*Freeze mode) for IGLOO2 devices, with power less than 1 mW. F*F mode entry retains all the SRAM and register information and the exit from F*F mode achieves rapid recovery to active mode. P r o d uc t B r i e f R ev i si o n 5 1-7 2 – Product Brief Information List of Changes The following table lists critical changes that were made in each revision of IGLOO2 Product Brief. Revision Changes Page Revision 5 (Dec 2013) Tables 3-6 were combined into Table 3. Fabric Interface Controller features were added 1-V,1-IV to "IGLOO2 FPGA Product Family" table. Packages VQ144 and FCV484 were added 1-IV, 1-V to Table 2 and Table 3. Revision 4 (Nov 2013) The Data Security Features section, table and the Device Status table were removed. "IGLOO2 FPGA Block Diagram" was updated. Revision 3 (Oct 2013) Packages FCS325 and VF256 were added to "I/Os Per Package". "IGLOO2 Ordering Information" was updated. Typo fixed on "IGLOO2 FPGA Block Diagram". Revision 2 (Sept 2013) LSRAM x32/36 widths added. "IGLOO2 FPGA Product Family" table note added 1-IV, referring to updates in Table 3 – Table 6. 1-V – 1-VI N/A,1-III 1-IV,1-III "IGLOO2 Ordering Information" was updated. Part Numbers (tables 7 and 8) were 1-VI, 1-VI removed. "IGLOO2 Device Status" table was updated. M2GL090-FG676 and M2GL005-VF400 package pinouts finalized. 1-IV Datasheet Categories Categories In order to provide the latest information to designers, some datasheet parameters are published before data has been fully characterized from silicon devices. The data provided for a given device, as highlighted in the "IGLOO2 Device Status", is designated as either "Product Brief," "Advance," "Preliminary," or "Production." The definitions of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advance or production) and contains general product information. This document gives an overview of specific device and family information. Advance This version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. This label only applies to the DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not been fully characterized. Preliminary The datasheet contains information based on simulation and/or initial characterization. The information is believed to be correct, but changes are possible. Production This version contains information that is considered to be final. P r o d uc t B r i e f R ev i si o n 3 2-1 Product Brief Information Export Administration Regulations (EAR) The products described in this document are subject to the Export Administration Regulations (EAR). They could require an approved export license prior to export from the United States. An export includes release of product or disclosure of technology to a foreign national inside or outside the United States. Safety Critical, Life Support, and High-Reliability Applications Policy The products described in this advance status document may not have completed the Microsemi qualification process. Products may be amended or enhanced during the product introduction and qualification process, resulting in changes in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications. Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating to life-support applications. Refer to the Reliability Report for all of the SoC Products Group’s products. Microsemi also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for additional reliability information. 2- 2 P r o d uc t B r i e f R ev i si o n 3 Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor solutions for: aerospace, defense and security; enterprise and communications; and industrial and alternative energy markets. Products include high-performance, high-reliability analog and RF devices, mixed signal and RF integrated circuits, customizable SoCs, FPGAs, and complete subsystems. Microsemi is headquartered in Aliso Viejo, Calif. Learn more at www.microsemi.com. Microsemi Corporate Headquarters One Enterprise, Aliso Viejo CA 92656 USA Within the USA: +1 (949) 380-6100 Sales: +1 (949) 380-6136 Fax: +1 (949) 215-4996 © 2013 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation. All other trademarks and service marks are the property of their respective owners. 51700121PB-5/12.13