MAQ5283
120VIN, 150 mA, Ultra-Low IQ, High PSRR, Automotive Linear Regulator
Features
General Description
•
•
•
•
•
•
•
•
•
The MAQ5283 high-performance linear regulator offers
a very wide input operating voltage range, up to 120V
DC, and supplies an output current of up to 150 mA.
AEC-Q100 Qualified
Wide Input Voltage Range: 6V to 120V DC
Ultra-Low Quiescent Current: 8 µA
150 mA Guaranteed Output Current
Adjustable Output from 1.23V to 5.5V
Stable with Ceramic Capacitors
Ultra-High PSRR (75 dB at 10 kHz)
Ultra-High Line Rejection (Load Dump)
High Output Accuracy:
- ±3% Initial Accuracy
• Thermal Shutdown and Current Limit Protection
• Thermally Efficient, 8-Lead ePad SOIC Package
The MAQ5283 is offered in both fixed output voltage
(3.3V or 5.0V) and adjustable output voltage (1.23V to
5.5V) options.
The MAQ5283 operates over a –40°C to +125°C
temperature range and is available in a lead-free,
RoHS-compliant, ePad SOIC-8 package.
Applications
•
•
•
•
•
The MAQ5283 is ideal for high input voltage
applications, such as automotive, industrial, and
telecom, because it offers ±3% initial accuracy,
extremely high power supply rejection ratio (75 dB at
10 kHz) and an ultra-low quiescent current of 8 µA. The
MAQ5283 is optimized for high-voltage line transients,
making it ideal for harsh environment applications.
Automotive
Industrial
Remote Keyless Entry
Telecom
Offline Power Supplies
Package Type
MAQ5283-x.xYME
8-Lead SOIC (ME)
Fixed Output Voltage
(Top View)
VIN
1
NC
2
NC
CPSRR
MAQ5283YME
8-Lead SOIC (ME)
Adjustable Output Voltage
(Top View)
8
EP
VOUT
VIN
1
EP
8
VOUT
7
NC
7
NC
NC
2
3
6
SNS
NC
3
6
FB
4
5
GND
CPSRR
4
5
GND
2019 Microchip Technology Inc.
DS20006151A-page 1
MAQ5283
Typical Application Circuits
MAQ5283 Fixed Output Voltage
MAQ5283-5.0YME
VIN
8.0V – 120V
1
VOUT
VIN
C1
1.0μF
120V
8
6
SNS
4
C3
0.1μF
CPSRR
C2
10μF
10V
VOUT
5.0V
150mA
EP
GND
5
MAQ5283 Adjustable Output Voltage
MAQ5283YME
VIN
6.0V – 120V
1
VOUT
VIN
C1
1.0μF
120V
R1
FB
4
C3
0.1μF
8
CPSRR
6
R2
EP
GND
VOUT
1.23V to 5.5V
C2
150mA
10μF
10V
5
Functional Block Diagrams
Fixed Output Version
Adjustable Output Version
VIN
VIN
CPSRR
CPSRR
VREF
1.228V
VOUT
VREF
1.228V
VOUT
SNS
THERMAL
SHUTDOWN
THERMAL
SHUTDOWN
GND
DS20006151A-page 2
FB
GND
2019 Microchip Technology Inc.
MAQ5283
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VIN to GND............................................................................................................................................... –0.3V to +125V
VCPSRR to GND.............................................................................................................................................–0.3 to +14V
VFB, VSNS, VOUT to GND ............................................................................................................................. –0.3V to +6V
ESD Ratings (Note 1)
HBM .................................................................................................................................................................. 2 kV
MM ...................................................................................................................................................................200V
Operating Ratings ††
VIN ............................................................................................................................................................... +6V to +120V
VOUT Adjust Range ................................................................................................................................. +1.23V to +5.5V
Power Dissipation (PD) ............................................................................................................ Internally Limited (Note 2)
† Notice: Exceeding an absolute maximum rating may damage the device.
†† Notice: The device is not guaranteed to function outside its operating rating.
Note 1: Device is ESD sensitive; use proper handling precautions. Human body model, 1.5 kΩ in series with 100 pF.
2: The maximum allowable power dissipation at any TA (ambient temperature) is PD(MAX) = (TJ(MAX) – TA)/θJA.
Exceeding the maximum allowable power dissipation results in excessive die temperature and causes the
regulator to enter thermal shutdown.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = 12V, CIN = 1.0 µF, CPSRR = 0.1 µF, COUT = 10 µF, IOUT = 100 µA, TJ = +25°C,
bold values indicate –40°C ≤ TJ ≤ +125°C, unless noted. Note 1
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Voltage Range
VIN
6
—
120
V
—
Quiescent Supply Current
IQ
—
8
14
µA
IOUT = 0
–5
—
5
%
Variation from nominal VOUT,
100 µA ≤ IOUT ≤ 150 mA
–0.5
0.04
0.5
%
VIN = 10V to 120V
Power Supply Input
Output Voltage
Output Voltage Accuracy
Line Regulation
Feedback Input (Adjustable)
FB Voltage
VFB
1.167
1.228
1.289
V
100 µA ≤ IOUT ≤ 150 mA
FB Current
IFB
—
3.2
—
nA
—
ILIM
180
300
500
mA
VOUT = 0V
—
70
—
—
75
—
—
65
—
—
1.8
2.8
Current Limit
Current Limit
Ripple Rejection
Power Supply Rejection
Ratio
PSRR
IOUT = 50 mA, 100 Hz ≤ f ≤ 1 kHz
dB
IOUT = 50 mA, 1 kHz < f ≤ 30 kHz
IOUT = 50 mA, 30 kHz < f ≤ 100 kHz
Power Dropout Voltage
Dropout Voltage
Note 1:
VDO
V
IOUT = 150 mA
Specification for packaged product only.
2019 Microchip Technology Inc.
DS20006151A-page 3
MAQ5283
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = 12V, CIN = 1.0 µF, CPSRR = 0.1 µF, COUT = 10 µF, IOUT = 100 µA, TJ = +25°C,
bold values indicate –40°C ≤ TJ ≤ +125°C, unless noted. Note 1
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
TSHDN
—
155
—
°C
TJ rising
—
15
—
°C
—
Thermal Protection
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
Note 1:
Specification for packaged product only.
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Temperature Range
TJ
–40
—
+125
°C
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
260
—
°C
Soldering, 10 sec.
JA
—
41
—
°C/W
Temperature Ranges
—
Package Thermal Resistances
Thermal Resistance, 8-Lead ePad
SOIC
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20006151A-page 4
2019 Microchip Technology Inc.
MAQ5283
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
vs. Input Voltage.
Quiescent Supply Current
FIGURE 2-4:
Current.
Output Voltage vs. Output
FIGURE 2-2:
vs. Temperature.
Quiescent Supply Current
FIGURE 2-5:
Temperature.
Output Voltage vs.
FIGURE 2-3:
Voltage.
Output Voltage vs. Input
FIGURE 2-6:
Current.
Dropout Voltage vs. Output
2019 Microchip Technology Inc.
DS20006151A-page 5
MAQ5283
FIGURE 2-7:
Temperature.
Dropout Voltage vs.
FIGURE 2-10:
Temperature.
Feedback Pin Voltage vs.
FIGURE 2-8:
Temperature.
Feedback Pin Current vs.
FIGURE 2-11:
Output Current.
Feedback Pin Voltage vs.
FIGURE 2-9:
Input Voltage.
Feedback Pin Current vs.
FIGURE 2-12:
Temperature.
Current Limit vs.
DS20006151A-page 6
2019 Microchip Technology Inc.
MAQ5283
FIGURE 2-13:
Temperature.
Line Regulation vs.
FIGURE 2-16:
PSRR vs. Frequency.
IDC = 10mA
1mA
VILDO
= =12V
IN
= 3.6V
VVOUT
IN = 5V
IOUT = 150mA
CIN = 1.0μF
COUT = 10μF
VIN
(5V/div)
VOUT
(2V/div)
Time (2.0ms/div)
FIGURE 2-14:
Output Current.
Case Temperature* vs.
FIGURE 2-17:
Soft Turn-On into Full Load.
VIN = 12V
VOUT = 5V
IOUT = 150mA
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
VIN
(5V/div)
VOUT
(2V/div)
Time (10ms/div)
FIGURE 2-15:
Output Current.
Note:
Power Dissipation vs.
FIGURE 2-18:
Soft Turn-Off.
*The temperature measurement was taken at the hottest point on the MAQ5283 case mounted on a
2.25-square-inch PCB at an ambient temperature of 25°C; see the Thermal Measurements section. Actual
results depend on the size of the PCB, ambient temperature, and proximity to other heat emitting components.
2019 Microchip Technology Inc.
DS20006151A-page 7
MAQ5283
VIN = 12V
VOUT = 5V
IOUT = 50mA
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
VIN
(5V/div)
VOUT
(2V/div)
OUT
IOUT
(100mA/div)
VOUT
(2V/div)
Time (20ms/div)
Time (200μs/div)
FIGURE 2-19:
FIGURE 2-22:
Fast Turn-On.
VIN = 12V
VOUT = 5V
IOUT = 50mA
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
VIN
(5V/div)
VOUT
(2V/div)
COUT = 10μF
Time (100ms/div)
FIGURE 2-23:
Response.
Fast Turn-Off.
VIN
(2V/div)
VOUT
(2V/div)
Thermal Shutdown
VIN = 80V
VOUT = 5V
IOUT = From short to IOUT = 100μA
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
OUT
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
VOUT
(2V/div)
IOUT
(100mA/div)
Time (200ms/div)
DS20006151A-page 8
VIN = 80V
5V
VVOUT= =12V
IOUT = ShortINto GND
VOUT = 5V
until thermal shutdown
IOUT
CIN==50mA
1.0μF
CIN ==1.0μF
0.1μF
CCPSRR
COUT==0.1μF
10μF
CCPSRR
VOUT
(200mA/div)
VIN = 0V to 12V
Ramp
VOUT = 5V
IOUT = 50 mA
CIN = 1.0μf
V = 12V
CCPSRR = 0.1μF V IN = 5V
COUT = 10μF I OUT
= 50mA
FIGURE 2-21:
Current Limit.
VIN
(20V/div)
Time (1.00ms/div)
FIGURE 2-20:
VIN = 0V to 12V
Ramp
VOUT = 5V
IOUT = 50 mA VIN = 12V
VOUT = 5V
CIN = 1.0μf
= 12V
IOUT V=IN10mA,
CCPSRR = 0.1μF
V output
= 5V
then short
COUT = 10μF I OUT
=
50mA
for 100ms
OUT
CIN == 1.0μF
1.0μF
C
IN
0.1μF
CCPSRR == 0.1μF
C
CPSRR
COUT == 10μF
10μF
C
VIN UVLO Threshold.
Time (10.0ms/div)
FIGURE 2-24:
VOUT Recovery from
Thermal Shutdown.
2019 Microchip Technology Inc.
MAQ5283
VIN
(5V/div)
VOUT
(20mV/div)
VIN
(5V/div)
VIN = 12V
VOUT = 5V
IOUT = Short circuit to GND
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
IOUT
(200mA/div)
IOUT
(10mV/div)
(AC)
Time (10.0ms/div)
FIGURE 2-25:
Turn-On into Short Circuit.
FIGURE 2-26:
Inrush Current Response.
Time (20.0μs/div)
FIGURE 2-28:
Line Transient Response.
VIN = 12V
VOUT = 5V
IOUT = 100μA to 150mA
to 100μA
CIN = 1.0μF
CCPSRR = 0.1μF
COUT = 10μF
VOUT
(100mV/div)
(AC)
IOUT
(100mA/div)
Time (100μs/div)
FIGURE 2-27:
Load Transient Response.
2019 Microchip Technology Inc.
DS20006151A-page 9
MAQ5283
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
(Fixed)
Pin Number
(Adjustable)
Pin Name
1
1
VIN
Supply Voltage Input. Connect 1 µF capacitor from VIN to GND.
2, 3, 7
2, 3, 7
NC
Not internally connected. Connect NC to GND or leave unconnected.
4
4
CPSRR
Bypass Capacitor Connection. Connect 0.1 µF capacitor from CPSRR
to GND.
5
5
GND
—
6
FB
6
—
SNS
8
8
VOUT
Regulator Output. Connect 10 µF capacitor from VOUT to GND.
EP
EP
ePad
Exposed Pad (ePad) for Thermal Dissipation. Connect to GND.
DS20006151A-page 10
Description
Ground.
Feedback Connection. For external resistor divider to set VOUT.
Sense input. Connect SNS to VOUT.
2019 Microchip Technology Inc.
MAQ5283
4.0
APPLICATION INFORMATION
The MAQ5283 voltage regulator accepts a 6V to 120V
input voltage and has an ultra-low 8 µA typical
quiescent current while offering an excellent line
transient response and PSRR. These features make it
ideal for harsh, noisy environments. All options offer
150 mA of output current. The MAQ5283YME offers an
adjustable output voltage from 1.23V to 5.5V. The
MAQ5283-3.3YME offers a fixed 3.3V output and the
MAQ5283-5.0YME offers a fixed 5.0V output. The YME
packaged devices feature a heat slug to remove heat
from the die more effectively.
4.1
Output Voltage Setting
For the MAQ5283YME, VOUT is programmable from
1.23V to 5.5V using an external resistive divider. VOUT
is set using the following equation:
EQUATION 4-1:
R1
V OUT = V REF ------- + 1
R2
Where:
VREF = 1.228V
Thermal Protection
The MAQ5283 has internal thermal shutdown to
protect it from excessive heating of the die. When the
junction temperature exceeds approximately +155°C,
the output is disabled and the device begins to cool
down. The device turns back on when the junction
temperature cools by 15°C. This results in a cycled
output during continuous thermal-overload conditions.
4.2
4.6
R1 and R2 form the feedback voltage divider from
VOUT to GND.
1
+
CIN
1μF
120V
VIN
6V to 120V
Current Limit
VOUT
VIN
8
MAQ5283YME
4
CPSRR
0.1μF
16V
CPSRR
FB
GND
R1
6
COUT
10μF
10V
+
VOUT
1.23V to 5.5V
150mA
R2
5
-
The MAQ5283 features output current-limit protection.
The output sustains a continuous short circuit to GND
without damage to the device, but thermal shutdown
often results. The typical value for the current limit of
the MAQ5283 is 300 mA.
4.3
Input Capacitor
Connect a 1.0 µF capacitor from VIN to GND.
Microchip recommends the C5750X7R2E105M,
1.0 µF, 250V capacitor made by TDK. When using a
different capacitor, make sure that the voltage rating of
the capacitor has enough headroom to withstand any
potential transient.
4.4
CPSRR Capacitor
To maintain high power supply rejection, connect a
0.1 µF capacitor from CPSRR to GND. The voltage
rating of the capacitor must be at least 14V.
4.5
Output Capacitor
Connect a 10 µF capacitor from VOUT to GND. Make
sure that the voltage rating of the capacitor is greater
than the designed output voltage of the MAQ5283.
2019 Microchip Technology Inc.
-
FIGURE 4-1:
Diagram.
4.7
Output Voltage Setting
Thermal Measurements
It is always a good idea to measure an IC’s case
temperature to make sure that it is within operating
limits, but it is easy to get false results. The standard
thermocouple that comes with many voltage meters
uses a large wire gauge that behaves like a heat-sink.
This causes artificially low case temperature
measurements. Use a thermocouple of 36-gauge wire
or smaller, such as the Omega (5SC-TT-K-36-36), to
minimize the heat-sinking effect. Also, apply a thermal
compound to maximize heat transfer between the IC
and the thermocouple.
An infrared thermometer is a recommended
alternative. The IR thermometer from Optris has a
1 mm spot size, which is ideal for monitoring small
surface-mount packages. Also, the optional stand
makes it easy to keep the beam on the IC for long
periods of time.
DS20006151A-page 11
MAQ5283
5.0
MAQ5283 EVALUATION BOARD SCHEMATIC
VIN
VOUT
PGND
5
3
1
SVOUT 4
2
7
6
9
8
11
10
KELVIN
13
12
15
14
SGND
17
16
19
18
VOUT
J1
U1
MAQ5283YME
VIN
1
2
3
4
VIN
C4 +
OPEN
C5 +
OPEN
J2
2PIN
C1
1.0μF
KELVIN
KELVIN
SVIN 20
20-PIN
VIN
NC
NC
CPSRR
VOUT
NC
FB/SNS
GND
VOUT
8
7
6
5
VOUT
R1
0
C2
0.1μF
J8
2PIN
C3
10μF
29.4k
GND1
R6
61.9k
1.8V
J6
2PIN
FIGURE 5-1:
TABLE 5-1:
Item
J5
2PIN
R5
28.0k
2.5V
2PIN
R4
17.4k
3.3V
GND
R3
9.53k
5.0V
J3
2PIN
FB
J7
2PIN
MAQ5283 Evaluation Board Schematic.
BILL OF MATERIALS
Part Number
Manufacturer
Description
Qty.
C1
C5750X7R2E105M
TDK
1.0 µF, 250V, 20%, X7R capacitor (2220)
1
C2
08053C104KAT2A
AVX
0.1 µF 25V 20%, X7R capacitor (0805)
1
C3
0805ZD106KAT2A
AVX
R1
CRCW06030000F
Vishay/Dale
R2
CRCW06032942F
Vishay/Dale
R3
CRCW06039531F
Vishay
R4
CRCW06031742F
Vishay
17.4 kΩ Film Resistor, Size 0603, 1%
1
R5
CRCW06032802F
Vishay
28.0 kΩ Film Resistor, Size 0603, 1%
1
R6
CRCW06036192F
Vishay
61.9 kΩ Film Resistor, Size 0603, 1%
1
U1
MAQ5283YME
120VIN, 150 mA, Ultra-Low IQ, High-PSRR Linear
Regulator
1
DS20006151A-page 12
Microchip
10 µF, 10V, 20%, X5R, capacitor (0805)
1
0Ω, 1% resistor, 0603
1
29.4 kΩ, 1% resistor, 0603
1
9.53 kΩ Film Resistor, Size 0603, 1%
1
2019 Microchip Technology Inc.
MAQ5283
6.0
PCB EVALUATION BOARD LAYOUT
MAQ5283
FIGURE 6-1:
YME
Top Layer.
FIGURE 6-3:
Dimensions.
FIGURE 6-2:
Evaluation Board
Bottom Layer.
2019 Microchip Technology Inc.
DS20006151A-page 13
MAQ5283
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
Legend: XX...X
Y
YY
WW
NNN
e3
*
8-Lead SOIC*
(Fixed)
Example
XXXXXXX
-XXXXX
WNNN
MAQ5283
-33YME
2230
8-Lead SOIC*
(Adjustable)
Example
XXXXXXX
XXX
WNNN
MAQ5283
YME
9051
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (⎯) symbol may not be to scale.
DS20006151A-page 14
2019 Microchip Technology Inc.
MAQ5283
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2019 Microchip Technology Inc.
DS20006151A-page 15
MAQ5283
NOTES:
DS20006151A-page 16
2019 Microchip Technology Inc.
MAQ5283
APPENDIX A:
REVISION HISTORY
Revision A (January 2019)
• Converted Micrel document MAQ5283 to Microchip data sheet template DS20006151A.
• Minor grammatical text changes throughout.
2019 Microchip Technology Inc.
DS20006151A-page 17
MAQ5283
NOTES:
DS20006151A-page 18
2019 Microchip Technology Inc.
MAQ5283
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
Device
-X.X
X
XX
-XX
XXX
Part No.
Output
Voltage
Junction
Temp.
Range
Package
Media Type
Automotive
Option
Device:
Output Voltage:
MAQ5283:
120VIN, 150 mA, Ultra-Low IQ, High-PSRR
Linear Regulator
= Adjustable
3.3
= 3.3V
5.0
= 5.0V
Junction
Temperature
Range:
Y
Package:
ME =
Media Type:
= 95/Tube
TR =
2,500/Reel
T5 =
500/Reel
Automotive
Option:
VAO = Automotive Option
=
–40°C to +125°C, RoHS-Compliant
8-Lead ePad SOIC
2019 Microchip Technology Inc.
a) MAQ5283YME-VAO:
MAQ5283, Adjustable Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
ePad SOIC, 95/Tube,
Automotive Option
b) MAQ5283-3.3YME-TRVAO:
MAQ5283, 3.3V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
ePad SOIC, 2,500/Reel,
Automotive Option
c) MAQ5283-5.0YME-T5VAO:
MAQ5283, 5.0V Output
Voltage, –40°C to +125°C
Temperature Range, 8-Lead
ePad SOIC, 500/Reel,
Automotive Option
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006151A-page 19
MAQ5283
NOTES:
DS20006151A-page 20
2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4054-3
== ISO/TS 16949 ==
2019 Microchip Technology Inc.
DS20006151A-page 21
Worldwide Sales and Service
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DS20006151A-page 22
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Fax: 44-118-921-5820
2019 Microchip Technology Inc.
08/15/18