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MAX3637ETM2

MAX3637ETM2

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    WFQFN-48

  • 描述:

    IC PLL CLOCK GEN LO JITT 48TQFN

  • 数据手册
  • 价格&库存
MAX3637ETM2 数据手册
19-4909; Rev 0; 10/09 TION KIT EVALUA BLE IL AVA A Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs The MAX3637 is a highly flexible, precision phaselocked loop (PLL) clock generator optimized for the next generation of network equipment that demands low-jitter clock generation and distribution for robust high-speed data transmission. The device features subpicosecond jitter generation, excellent power-supply noise rejection, and pin-programmable LVDS/LVPECL output interfaces. The MAX3637 provides nine differential outputs and one LVCMOS output, divided into three banks. The frequency and output interface of each output bank can be individually programmed, making this device an ideal replacement for multiple crystal oscillators and clock distribution ICs on a system board, saving cost and space. This 3.3V IC is available in a 7mm x 7mm, 48-pin TQFN package and operates from -40°C to +85°C. Applications Ethernet Switch/Router Fibre Channel SAN Wireless Base Station SONET Line Cards Features S Inputs Crystal Interface: 18MHz to 33.5MHz LVCMOS Input: 15MHz to 160MHz Differential Input: 15MHz to 350MHz S Outputs LVCMOS Output: Up to 160MHz LVPECL/LVDS Outputs: Up to 800MHz S Three Individual Output Banks Pin-Programmable Dividers Pin-Programmable Output Interface S Wide VCO Tuning Range (3.60GHz to 3.83GHz) S Low Phase Jitter 0.34psRMS (12kHz to 20MHz) 0.14psRMS (1.875MHz to 20MHz) S Excellent Power-Supply Noise Rejection S -40NC to +85NC Operating Temperature Range S +3.3V Supply Ordering Information Typical Application Circuits and Pin Configuration appear at end of data sheet. PART TEMP RANGE PIN-PACKAGE MAX3637ETM+ -40NC to +85NC 48 TQFN-EP* +Denotes a lead(Pb)-free/RoHS-compliant package. *EP = Exposed pad. Functional Diagram LVPECL/LVDS QA0 QA0 LVPECL/LVDS MAX3637 QA1 QA1 LVPECL/LVDS QA2 QA2 XOUT LVPECL/LVDS XO QA3 XIN LVPECL/LVDS LVCMOS CIN QA3 QA4 PLL, DIVIDERS, MUXES VCO QA4 LVPECL/LVDS QB0 QB0 LVPECL/LVDS DIN DIN QB1 QB1 LVPECL/LVDS QB2 QB2 LVPECL/LVDS QC QC LVCMOS QCC ________________________________________________________________ Maxim Integrated Products   1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX3637 General Description MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs ABSOLUTE MAXIMUM RATINGS Supply Voltage Range (VCC, VCCA, VCCQA, VCCQB, VCCQC, VCCQCC).................................-0.3V to +4.0V Voltage Range at CIN, IN_SEL, DM, DF[1:0], DP, PLL_BP, DA[1:0], DB[1:0], DC[1:0], QA_CTRL1, QA_CTRL2, QB_CTRL, QC_CTRL, QCC, RES............................ -0.3V to (VCC + 0.3V) Voltage Range at DIN, DIN......... (VCC - 2.35V) to (VCC - 0.35V) Voltage Range at QA[4:0], QA[4:0], QB[2:0], QB[2:0], QC, QC when LVDS Output.... -0.3V to (VCC + 0.3V) Current into QA[4:0], QA[4:0], QB[2:0], QB[2:0], QC, QC when LVPECL Output...................................... -56mA Current into QCC.............................................................. Q50mA Voltage Range at XIN............................................-0.3V to +1.2V Voltage Range at XOUT..............................-0.3V to (VCC - 0.6V) Continuous Power Dissipation (TA = +70NC) 48-Pin TQFN (derate 40mW/NC above +70NC)...........3200mW Operating Junction Temperature Range.......... -55NC to +150NC Storage Temperature Range............................. -65NC to +160NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VCC = +3.0V to +3.6V, TA = -40°C to +85°C. Typical values are at VCC = +3.3V, TA = +25°C, unless otherwise noted. Signal applied to CIN or DIN/DIN only when selected as the reference clock.) (Note 1) PARAMETER Supply Current with PLL Enabled (Note 2) SYMBOL ICC Supply Current with PLL Bypassed (Note 2) TYP MAX Configured with LVPECL outputs CONDITIONS MIN 170 215 Configured with LVDS outputs 290 365 Configured with LVPECL outputs 110 Configured with LVDS outputs 230 UNITS mA mA LVCMOS/LVTTL CONTROL INPUTS (IN_SEL, DM, DF[1:0], DA[1:0], DB[1:0], DC[1:0], PLL_BP, DP, QA_CTRL1, QA_CTRL2, QB_CTRL, QC_CTRL) Input High Voltage VIH Input Low Voltage VIL 2.0 Input High Current IIH VIN = VCC Input Low Current IIL VIN = 0V V 0.8 V 80 FA -80 FA LVCMOS/LVTTL CLOCK INPUT (CIN) Reference Clock Input Frequency fREF Input Amplitude Range Internally AC-coupled (Note 3) Input High Current IIH Input Low Current IIL VIN = VCC VIN = 0V Reference Clock Input DutyCycle Distortion 15 160 MHz 1.2 3.6 VP-P 80 FA -80 40 Input Capacitance Input Differential Voltage Swing VCMI 15 VCC 1.8 % pF 350 VCC 1.3 MHz V 150 1800 mVP-P Single-Ended Voltage Range VCC 2.0 VCC 0.7 V Input Differential Impedance 80 120 I Differential Input Capacitance 2 60 1.5 DIFFERENTIAL CLOCK INPUT (DIN, DIN) (Note 4) Differential Input Frequency fREF Input Bias Voltage FA 100 1.5 pF Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs (VCC = +3.0V to +3.6V, TA = -40°C to +85°C. Typical values are at VCC = +3.3V, TA = +25°C, unless otherwise noted. Signal applied to CIN or DIN/DIN only when selected as the reference clock.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP LVDS OUTPUTS (QA[4:0], QA[4:0], QB[2:0], QB[2:0], QC, QC) (Note 5) Output Frequency Output High Voltage VOH Output Low Voltage VOL 0.925 Differential Output Voltage |VOD| 250 Change in Magnitude of Differential Output for Complementary States Output Offset Voltage Change in Magnitude of Output Offset Voltage for Complementary States 1.125 D|VOS| Differential Output Impedance 80 Output Current Output Current When Disabled Output Rise/Fall Time Output Duty-Cycle Distortion 100 Short together 3 Short to ground 6 VQ__ = VQ__ = 0V to VCC 20% to 80% 10 PLL enabled 48 PLL bypassed (Note 6) UNITS 800 MHz 1.475 V V D|VOD| VOS MAX 400 mV 25 mV 1.3 V 25 mV 140 I mA FA 160 240 50 52 50 LVPECL OUTPUTS (QA[4:0], QA[4:0], QB[2:0], QB[2:0], QC, QC) (Note 7) Output Frequency ps % 800 MHz VCC 0.98 VCC 0.83 V Output High Voltage VOH VCC 1.13 Output Low Voltage VOL VCC 1.85 VCC 1.70 VCC 1.55 V 0.5 0.7 0.9 VP-P Output-Voltage Swing (Single-Ended) Output Current When Disabled VO = 0V to VCC 10 Output Rise/Fall Time 20% to 80%, differential load = 100I 140 240 50 52 Output Duty-Cycle Distortion PLL enabled 48 PLL bypassed (Note 6) FA 50 ps % LVCMOS/LVTTL OUTPUT (QCC) Output Frequency Output High Voltage IOH = -12mA Output Low Voltage IOL = 12mA Output Rise/Fall Time 20% to 80% (Note 8) 150 PLL enabled 42 Output Duty-Cycle Distortion Output Impedance PLL bypassed (Note 6) 2.6 160 MHz VCC V 0.4 V 400 850 ps 50 58 50 15 % I 3 MAX3637 ELECTRICAL CHARACTERISTICS (continued) MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs ELECTRICAL CHARACTERISTICS (continued) (VCC = +3.0V to +3.6V, TA = -40°C to +85°C. Typical values are at VCC = +3.3V, TA = +25°C, unless otherwise noted. Signal applied to CIN or DIN/DIN only when selected as the reference clock.) (Note 1) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS 3750 3830 MHz 42 MHz PLL SPECIFICATIONS VCO Frequency Range fVCO 3600 Phase-Frequency Detector Compare Frequency fPFD 15 PLL Jitter Transfer Bandwidth Integrated Phase Jitter RJ 25MHz crystal input (Note 9) 0.34 1.875MHz to 20MHz 0.14 kHz 1.0 psRMS 25MHz LVCMOS or differential input (Notes 9, 10) 0.34 Supply-Noise Induced Phase Spur at LVPECL/LVDS Output (Note 11) -56 dBc Supply-Noise Induced Phase Spur at LVCMOS Output (Note 11) -45 dBc Determinisitic Jitter Induced by Power-Supply Noise LVPECL or LVDS (Note 11) 6 psP-P Nonharmonic and Subharmonic Spurs (Note 12) -70 dBc fOFFSET = 1kHz -109 fOFFSET = 10kHz -112 fOFFSET = 100kHz -118 fOFFSET = 1MHz -134 fOFFSET R 10MHz -146 fOFFSET = 1kHz -119 fOFFSET = 10kHz -121 fOFFSET = 100kHz -127 fOFFSET = 1MHz -143 fOFFSET R 10MHz -151 fOFFSET = 1kHz -122 fOFFSET = 10kHz -123 fOFFSET = 100kHz -129 fOFFSET = 1MHz -145 fOFFSET R 10MHz -152 fOFFSET = 1kHz -123 fOFFSET = 10kHz -124 fOFFSET = 100kHz -130 fOFFSET = 1MHz -147 fOFFSET R 10MHz -153 SSB Phase Noise at 622.08MHz SSB Phase Noise at 212.5MHz SSB Phase Noise at 156.25MHz SSB Phase Noise at 125MHz 4 130 12kHz to 20MHz dBc/ Hz dBc/ Hz dBc/ Hz dBc/ Hz Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs (VCC = +3.0V to +3.6V, TA = -40°C to +85°C. Typical values are at VCC = +3.3V, TA = +25°C, unless otherwise noted. Signal applied to CIN or DIN/DIN only when selected as the reference clock.) (Note 1) PARAMETER SYMBOL SSB Phase Noise at 62.5MHz CONDITIONS MIN TYP fOFFSET = 1kHz -129 fOFFSET = 10kHz -130 fOFFSET = 100kHz -137 fOFFSET = 1MHz -152 fOFFSET R 10MHz -156 MAX UNITS dBc/ Hz Note 1: A series resistor of up to 10.5I is allowed between VCC and VCCA for filtering supply noise when system power-supply tolerance is VCC = 3.3V Q5%. See Figure 3. Note 2: Measured with all outputs enabled and unloaded. Note 3: CIN can be AC- or DC-coupled. See Figure 8. Input high voltage must be ≤ VCC + 0.3V. Note 4: DIN can be AC- or DC-coupled. See Figure 10. Note 5: Measured with 100I differential load. Note 6: Measured with crystal input, or with 50% duty cycle LVCMOS or differential input. Note 7: Measured with output termination of 50I to VCC - 2V or Thevenin equivalent. Note 8: Measured with a series resistor of 33I to a load capacitance of 3.0pF. See Figure 1. Note 9: Measured at 156.25MHz output. Note 10: Measured using LVCMOS/LVTTL input with slew rate R 1.0V/ns, or differential input with slew rate R 0.5V/ns. Note 11: Measured at 156.25MHz output with 200kHz, 50mVP-P sinusoidal signal on the supply using the crystal input and the power-supply filter shown in Figure 3. See the Typical Operating Characteristics for other supply noise frequencies. Deterministic jitter is calculated from the measured power-supply-induced spurs. For more information, refer to Application Note 4461: HFAN-04.5.5: Characterizing Power-Supply Noise Rejection in PLL Clock Synthesizers. Note 12: Measured with all outputs enabled and all three banks at different frequencies. LVCMOS QCC 33Ω 499Ω Z = 50Ω OSCILLOSCOPE 0.1µF Z = 50Ω 3pF 50Ω MAX3637 Figure 1. LVCMOS Output Measurement Setup 5 MAX3637 ELECTRICAL CHARACTERISTICS (continued) Typical Operating Characteristics (VCC = 3.3V, TA = +25NC, unless otherwise noted.) PLL BYPASS, ALL OUTPUTS LOADED 250 PLL NORMAL, ALL OUTPUTS UNLOADED 200 150 400 PLL NORMAL 350 300 250 200 150 PLL BYPASS 400 300 150 100 50 10 35 60 0 85 QA[2:0] ENABLED 200 50 -15 QA[4:3] AND QA[2:0] ENABLED 250 50 -40 QA[4:3], QA[2:0], AND QB[2:0] ENABLED 350 100 PLL BYPASS, ALL OUTPUTS UNLOADED QA[4:3], QA[2:0], QB[2:0], QC, AND QCC ENABLED 450 100 0 ALL OUTPUTS DISABLED 0 -40 -15 10 35 60 85 -40 -15 10 35 60 85 TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C) SUPPLY CURRENT vs. TEMPERATURE (LVDS OUTPUTS) DIFFERENTIAL OUTPUT AT 737.28MHz (LVPECL) DIFFERENTIAL OUTPUT AT 312.5MHz (LVPECL) QA[4:3], QA[2:0], QB[2:0], QC, AND QCC ENABLED 300 250 QA[4:3], QA[2:0], AND QB[2:0] ENABLED 200 QA[4:3] AND QA[2:0] ENABLED 150 QA[2:0] ENABLED 100 MAX3637 toc06 MAX3637 toc04 MAX3637 toc05 350 SUPPLY CURRENT (mA) 500 SUPPLY CURRENT (mA) 350 300 450 SUPPLY CURRENT (mA) 400 SUPPLY CURRENT vs. TEMPERATURE (LVPECL OUTPUTS, ALL LOADED) MAX3637 toc02 PLL NORMAL, ALL OUTPUTS LOADED 450 500 MAX3637 toc01 500 SUPPLY CURRENT vs. TEMPERATURE (LVDS OUTPUTS, ALL ENABLED) MAX3637 toc03 SUPPLY CURRENT vs. TEMPERATURE (LVPECL OUTPUTS, ALL ENABLED) SUPPLY CURRENT (mA) MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs 200mV/div 200mV/div ALL OUTPUTS DISABLED 50 0 -40 -15 10 35 60 85 200ps/div 500ps/div DIFFERENTIAL OUTPUT AT 156.25MHz (LVPECL) DIFFERENTIAL OUTPUT AT 156.25MHz (LVDS) QCC OUTPUT AT 125MHz (LVCMOS) MAX3637 toc07 MAX3637 toc08 TEMPERATURE (°C) 200mV/div 100mV/div 1ns/div 6 MAX3637 toc09 500mV/div 1ns/div 1ns/div Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs OUTPUT SWING vs. TEMPERATURE LVPECL 1500 500 0 0 100 LVDS 1000 500 10 MAX3637 toc11 2000 LVPECL 0 -15 OUTPUT FREQUENCY (MHz) LVPECL/LVDS 50.2 50.0 49.8 49.6 -90 -100 -110 -120 -130 -140 -110 -120 -130 -140 -150 85 1k TEMPERATURE (°C) 100k 1M 10M 100M 1k -100 -110 -120 -130 -90 -100 -110 -120 -130 -90 -110 -120 -130 -150 -150 -150 -160 -160 -160 100k 1M 10M OUTPUT FREQUENCY (Hz) 100M 100M -100 -140 10k 10M -80 -140 1k 1M PHASE JITTER = 0.36psRMS INTEGRATED 12kHz TO 20MHz -70 PHASE NOISE (dBc/Hz) -90 100k PHASE NOISE AT 125MHz -60 MAX3637 toc17 -80 PHASE NOISE (dBc/Hz) -80 PHASE JITTER = 0.34psRMS INTEGRATED 12kHz TO 20MHz -70 10k OUTPUT FREQUENCY (Hz) PHASE NOISE AT 156.25MHz -60 MAX3637 toc16 PHASE JITTER = 0.31psRMS INTEGRATED 12kHz TO 20MHz -70 10k OUTPUT FREQUENCY (Hz) PHASE NOISE AT 212.5MHz -60 85 -90 -160 60 60 -100 -160 35 35 -80 49.0 10 10 PHASE JITTER = 0.32psRMS INTEGRATED 12kHz TO 20MHz -70 -150 -15 -15 PHASE NOISE AT 312.5MHz -60 49.2 -40 PHASE NOISE (dBc/Hz) -40 TEMPERATURE (°C) -80 LVCMOS 49.4 85 PHASE NOISE (dBc/Hz) 50.4 60 PHASE JITTER = 0.27psRMS INTEGRATED 12kHz TO 20MHz -70 PHASE NOISE (dBc/Hz) 50.6 35 PHASE NOISE AT 622.08MHz -60 MAX3637 toc13 DUTY-CYCLE DISTORTION (%) 50.8 10 TEMPERATURE (°C) DUTY-CYCLE DISTORTION vs. TEMPERATURE 51.0 LVDS 200 100 -40 1000 300 MAX3637 toc15 LVDS 1000 LVCMOS MAX3637 toc18 1500 2500 LVCMOS 400 RISE/FALL TIME (ps) LVPECL 2000 3000 OUTPUT SWING (mVP-P) LVCMOS 2500 500 MAX3637 toc14 3000 OUTPUT SWING (mVP-P) 3500 MAX3637 toc10 3500 RISE/FALL TIME vs. TEMPERATURE (20% TO 80%) MAX3637 toc12 OUTPUT SWING vs. OUTPUT FREQUENCY -140 1k 10k 100k 1M 10M OUTPUT FREQUENCY (Hz) 100M 1k 10k 100k 1M 10M 100M OUTPUT FREQUENCY (Hz) 7 MAX3637 Typical Operating Characteristics (continued) (VCC = 3.3V, TA = +25NC, unless otherwise noted.) Typical Operating Characteristics (continued) (VCC = 3.3V, TA = +25NC, unless otherwise noted.) -90 -100 -110 -120 -130 -140 -150 OUTPUT FREQUENCY = 156.25MHz 0.55 0.50 0.45 LVCMOS 0.40 0.35 0.30 LVPECL 0.25 0.20 -160 1k 10k 100k 1M 10M -15 -40 100M 10 35 60 85 OUTPUT FREQUENCY (Hz) TEMPERATURE (°C) JITTER TRANSFER SPURS INDUCED BY POWER-SUPPLY NOISE vs. NOISE FREQUENCY 0 MAX3637 toc21 5 0 -5 fC = 156.25MHz, NOISE = 50mVP-P -10 SPUR AMPLITUDE (dBc) -10 -15 -20 -25 -30 -35 -20 LVCMOS -30 -40 -50 -60 LVDS -70 -40 LVPECL -80 -45 -50 -90 1k 10k 100k 1M 10M 100 10 JITTER FREQUENCY (Hz) NOISE FREQUENCY (kHz) 40 fC = 156.25MHz, NOISE = 50mVP-P DETERMINISTIC JITTER (psP-P) 35 30 MAX3637 toc23 DETERMINISTIC JITTER INDUCED BY POWERSUPPLY NOISE vs. NOISE FREQUENCY LVCMOS 25 20 LVPECL 15 10 5 LVDS 0 10 100 NOISE FREQUENCY (kHz) 8 LVDS MAX3637 toc22 PHASE NOISE (dBc/Hz) -80 INTEGRATED PHASE JITTER (psRMS) PHASE JITTER = 0.40psRMS INTEGRATED 12kHz TO 20MHz -70 0.60 MAX3637 toc19 -60 MAX3637 toc20 INTEGRATED PHASE JITTER (12kHz TO 20MHz) vs. TEMPERATURE PHASE NOISE AT 62.5MHz JITTER TRANSFER (dB) MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs 1000 1000 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs PIN NAME MAX3637 Pin Description FUNCTION 1 DM LVCMOS/LVTTL Input. Three-level control for input divider M. See Table 3. 2 XIN Crystal Oscillator Input 3 XOUT 4 VCC Crystal Oscillator Output Core Power Supply. Connect to +3.3V. 5 IN_SEL LVCMOS/LVTTL Input. Three-level control for input mux. See Table 1. 6 PLL_BP LVCMOS/LVTTL Input. Three-level control for PLL bypass mode. See Table 2. 7, 8 DF1, DF0 LVCMOS/LVTTL Inputs. Three-level controls for feedback divider F. See Table 4. 9 QC_CTRL LVCMOS/LVTTL Input. Three-level control input for C-bank output interface. See Table 10. 10 VCCA Power Supply for Internal Voltage-Controlled Oscillators (VCOs). See Figure 3. 11 RES Reserved. Connect to GND for normal operation. 12 DP LVCMOS/LVTTL Input. Three-level control for prescale divider P. See Table 7. 13, 14 DB1, DB0 LVCMOS/LVTTL Inputs. Three-level controls for output divider B. See Table 5. 15, 16 DA1, DA0 LVCMOS/LVTTL Inputs. Three-level controls for output divider A. See Table 5. 17, 18 DC1, DC0 LVCMOS/LVTTL Inputs. Three-level controls for output divider C. See Table 6. 19 QA_CTRL2 LVCMOS/LVTTL Input. Three-level control for QA[4:3] output interface. See Table 8. 20 VCCQCC 21 QCC 22, 23 QC, QC VCCQC C-Bank Differential Output. Configured as LVPECL or LVDS with the QC_CTRL pin. 24 25, 36 VCCQA Power Supply for A-Bank Differential Outputs. Connect to +3.3V. 26, 27 QA4, QA4 A-Bank Differential Output. Configured as LVPECL or LVDS with the QA_CTRL2 pin. 28, 29 QA3, QA3 A-Bank Differential Output. Configured as LVPECL or LVDS with the QA_CTRL2 pin. 30, 31 QA2, QA2 A-Bank Differential Output. Configured as LVPECL or LVDS with the QA_CTRL1 pin. 32, 33 QA1, QA1 A-Bank Differential Output. Configured as LVPECL or LVDS with the QA_CTRL1 pin. 34, 35 A-Bank Differential Output. Configured as LVPECL or LVDS with the QA_CTRL1 pin. 37 QA0, QA0 VCCQB 38, 39 QB0, QB0 B-Bank Differential Output. Configured as LVPECL or LVDS with the QB_CTRL pin. 40, 41 QB1, QB1 B-Bank Differential Output. Configured as LVPECL or LVDS with the QB_CTRL pin. 42, 43 B-Bank Differential Output. Configured as LVPECL or LVDS with the QB_CTRL pin. 44 QB2, QB2 QA_CTRL1 45 QB_CTRL LVCMOS/LVTTL Input. Three-level control for B-bank output interface. See Table 9. 46, 47 DIN, DIN Differential Clock Input. Operates up to 350MHz. This input can accept DC-coupled LVPECL signals, and is internally biased to accept AC-coupled LVDS, CML, and LVPECL signals. 48 CIN LVCMOS Clock Input. Operates up to 160MHz. — EP Exposed Pad. Connect to supply ground for proper electrical and thermal performance. Power Supply for QCC Output. Connect to +3.3V. C-Bank LVCMOS Clock Output Power Supply for C-Bank Differential Output. Connect to +3.3V. Power Supply for B-Bank Differential Outputs. Connect to +3.3V. LVCMOS/LVTTL Input. Three-level control for QA[2:0] output interface. See Table 8. 9 MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs Detailed Description banks of clock outputs. See Figure 2. The output banks include nine pin-programmable LVDS/LVPECL output buffers and one LVCMOS output buffer. The frequency, enabling, and output interface of each output bank can be individually programmed. In addition the A-bank is split into two banks with programmable enabling and The MAX3637 is a low-jitter clock generator designed to operate over a wide range of frequencies. It consists of a selectable reference clock (on-chip crystal oscillator, LVCMOS input, or differential input), PLL with on-chip VCO, pin-programmable dividers and muxes, and three IN_SEL VCC DM DP VCCA DA[1:0] PLL_BP VCCQA QA_CTRL1 2 QA0 QA0 XOUT CRYSTAL OSCILLATOR QA1 1 0 XIN fREF LVCMOS CIN NC ÷M PFD VCO CP fVCO ÷P ÷A fQA QA1 QA2 0/NC QA2 fPFD 15MHz TO 42MHz 3600MHz TO 3830MHz QA3 QA3 DIN DIN QA4 ÷F QA4 1 QA_CTRL2 VCCQB QB_CTRL QB0 MAX3637 QB0 QB1 1 ÷B fQB QB1 QB2 0/NC QB2 DIVIDER A: 1, 2, 3, 4, 5, 6, 8, 10, 12 DIVIDER B: 1, 2, 3, 4, 5, 6, 8, 10, 12 DIVIDER C: 2, 3, 4, 5, 6, 8, 10, 12, 25 DIVIDER F: 16, 20, 24, 25, 28, 30, 32, 40, 48 DIVIDER M: 1, 4, 5 DIVIDER P: 5, 6, 8 QC_CTRL QC 1/NC ÷C 2 EP Figure 2. Detailed Functional Diagram 10 DF[1:0] 2 DB[1:0] fQC QC 0 QCC 2 DC[1:0] VCCQC VCCQCC Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs Crystal Oscillator The on-chip crystal oscillator provides the low-frequency reference clock for the PLL. This oscillator requires an external crystal connected between XIN and XOUT. See the Crystal Selection and Layout section for more information. The XIN and XOUT pins can be left open if not used. LVCMOS Clock Input An LVCMOS-compatible clock source can be connected to CIN to serve as the PLL reference clock. The input is internally biased to allow AC- or DC-coupling (see the Applications Information section). It is designed to operate from 15MHz to 160MHz. No signal should be applied to CIN if not used. (see the Applications Information section). No signal should be applied to DIN if not used. Phase-Locked Loop (PLL) The PLL takes the signal from the crystal oscillator, LVCMOS clock input, or differential clock input and synthesizes a low-jitter, high-frequency clock. The PLL contains a phase-frequency detector (PFD), a charge pump (CP), and a low phase noise VCO with a wide 3.60GHz to 3.83GHz frequency range. The high-frequency VCO output is divided by prescale divider P, then is connected to the PFD input through a feedback divider. The PFD compares the reference frequency to the divided-down VCO output and generates a control signal that keeps the VCO locked to the reference clock. The high-frequency VCO/P output clock is sent to the output dividers. To minimize noise-induced jitter, the VCO supply (VCCA) is isolated from the core logic and output buffer supplies. Differential Clock Input A differential clock source can be connected to DIN to serve as the PLL reference clock. This input operates from 15MHz to 350MHz and contains an internal 100ω differential termination. This input can accept DC-coupled LVPECL signals, and is internally biased to accept AC-coupled LVDS, CML, and LVPECL signals Dividers and Muxes The dividers and muxes are set with three-level control inputs. Leakage in the NC case must be less than 1µA. Divider settings and routing information are given in Tables 1 to 7. See Table 11 for example divider configurations used in various applications. Table 1. PLL Input IN_SEL INPUT 0 Crystal Input. XO circuit is disabled when not selected. 1 Differential Input. No signal should be applied to DIN if not selected. NC LVCMOS Input. No signal should be applied to CIN if not selected. Table 2. PLL Bypass PLL_BP PLL OPERATION 0 PLL Enabled for Normal Operation. All outputs from the A, B, and C banks are derived from the VCO. 1 PLL Bypassed. Selected input passes directly to the outputs. The VCO is disabled to minimize power consumption and intermodulation spurs. Used for system testing or clock distribution. NC The outputs from A-bank and B-bank are derived from the VCO, but the C-bank outputs are directly driven from the input signal for purposes of daisy chaining. 11 MAX3637 output interface. A PLL bypass mode is also available for system testing or clock distribution. MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs Table 3. Input Divider M Table 7. Prescale Divider P DM M DIVIDER RATIO DP P DIVIDER RATIO 0 ÷1 0 ÷5 1 ÷5 1 ÷6 NC ÷4 NC ÷8 Note: When the on-chip XO is selected (IN_SEL = 0), the setting DM = 0 is required. Table 4. PLL Feedback Divider F QA_CTRL1 QA[2:0] OUTPUT 0 QA[2:0] = LVDS DF1 DF0 F DIVIDER RATIO 1 QA[2:0] = LVPECL 0 0 ÷25 NC QA[2:0] disabled to high impedance 0 1 ÷20 QA_CTRL2 QA[4:3] OUTPUT 1 0 ÷16 0 QA[4:3] = LVDS 1 1 ÷32 1 QA[4:3] = LVPECL 1 NC ÷24 NC QA[4:3] disabled to high impedance NC 1 ÷30 0 NC ÷40 NC 0 ÷48 NC NC ÷28 Table 5. Output Divider A, B DA1/DB1 DA0/DB0 A, B DIVIDER RATIO 0 0 ÷2 0 1 ÷3 1 0 ÷4 1 1 ÷5 1 NC ÷6 NC 1 ÷8 0 NC ÷10 NC 0 ÷12 NC NC ÷1 Table 6. Output Divider C 12 Table 8. A-Bank Output Interface DC1 DC0 C DIVIDER RATIO 0 0 ÷2 0 1 ÷3 1 0 ÷4 1 1 ÷5 1 NC ÷6 NC 1 ÷8 0 NC ÷10 NC 0 ÷12 NC NC ÷25 Table 9. B-Bank Output Interface QB_CTRL QB[2:0] OUTPUT 0 QB[2:0] = LVDS 1 QB[2:0] = LVPECL NC QB[2:0] disabled to high impedance Table 10. C-Bank Output Interface QC_CTRL QC AND QCC OUTPUT 0 QC = LVDS, QCC = LVCMOS 1 QC = LVPECL, QCC = LVCMOS NC QC and QCC disabled to high impedance LVDS/LVPECL Clock Outputs The differential clock outputs (QA[4:0], QB[2:0], QC) operate up to 800MHz and have a pin-programmable LVDS/LVPECL output interface. See Tables 8 to 10. When configured as LVDS, the buffers are designed to drive transmission lines with a 100ω differential termination. When configured as LVPECL, the buffers are designed to drive transmission lines terminated with 50ω to VCC - 2V. Unused output banks can be disabled to high impedance and unused outputs can be left open. LVCMOS Clock Output The LVCMOS clock output operates up to 160MHz and is designed to drive a single-ended high-impedance load. If unused, this output can be left open or the C-bank can be disabled to high impedance. Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs The prescale divider P is set by DP as given in Table 7. In addition, the reference clock frequency and input divider M must also be selected so the PFD compare frequency (fPFD) falls within the specified range of 15MHz to 42MHz. If applicable, the higher fPFD should be selected for optimal jitter performance. Applications Information Output Frequency Configuration The MAX3637 output frequencies (fQA, fQB, fQC) are functions of the reference frequency (fREF) and the pinprogrammable dividers (A, B, C, F, M). The relationships can be expressed as: f F fQA = REF × M A (1) f F fQB = REF × M B (2) f F fQC = REF × M C (3) The frequency ranges for the selected reference clocks are 18MHz to 33.5MHz for the crystal oscillator input, 15MHz to 160MHz for the LVCMOS input, and 15MHz to 350MHz for the differential input. The available dividers are given in Tables 3 to 6. For a given reference frequency fREF, the input divider M, the PLL feedback divider F, and VCO prescale divider P must be configured so the VCO frequency (fVCO) falls within the specified ranges. Invalid PLL configuration leads to VCO frequencies beyond the specified ranges and can result in loss of lock. An expression for the VCO frequency along with the specified ranges is given by: f fVCO = REF × F × P M (4) 3600MHz ≤ fVCO ≤ 3830MHz (5) f f fPFD = REF = VCO M P ×F (6) 15MHz ≤ fPFD ≤ 42MHz (7) Note that the reference clock frequency is not limited by the fPFD range when the PLL is in bypass mode. Example Frequency Configuration The following is an example of how to find divider ratios for a valid PLL configuration, given a requirement of input and output frequencies. 1) S  elect input and output frequencies for system clocking. fREF = 25MHz fQA = 312.5MHz fQB = 156.25MHz fQC = 125MHz 2) F  ind the input divider M for a valid PFD compare frequency. Using Table 3 and equations (6) and (7), it is determined that M = ÷1 is the only valid option. 3) F  ind the feedback divider F and prescale divider P for a valid fVCO. Using Tables 4 and 7 along with equations (4) and (5), it is determined that F = ÷25 and P = ÷6 results in fVCO = 3750MHz, which is within the valid range of the low VCO. 4) F  ind the output dividers A, B, C for the required output frequencies. Using Tables 5 and 6 and equations (1), (2), and (3), it is determined that A = ÷2 gives fQA = 312.5MHz, B = ÷4 gives fQB = 156.25MHz, and C = ÷5 gives fQC = 125MHz. Table 11 provides input and output frequencies along with valid divider ratios for a variety of applications. 13 MAX3637 Internal Reset During power-on, a power-on reset (POR) signal is generated to synchronize all dividers. A reset signal is also generated if any control pin is changed. Outputs within a bank are phase aligned, but outputs bank-to-bank may not be phase aligned. MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs Table 11. Reference Frequencies and Divider Ratios for Various Applications fREF (MHz) INPUT DIVIDER (M) PLL FEEDBACK DIVIDER (F) 15.36 1 48 30.72 1 24 61.44 4 48 VCO FREQUENCY (MHz) 3686.4 VCO PRESCALE DIVIDER (P) OUTPUT DIVIDER (A, B, C) OUTPUT FREQUENCY (MHz) 5 1 737.28 5 2 368.64 5 3 245.76 5 4 184.32 5 6 122.88 5 8 92.16 5 12 61.44 122.88 4 24 15.36 1 40 6 1 614.4 19.2 1 32 6 2 307.2 30.72 1 20 6 3 204.8 38.4 1 16 6 4 153.6 61.44 4 40 6 5 122.88 122.88 4 20 6 6 102.4 153.6 4 16 6 8 76.8 6 12 51.3 25/31.25/ 62.5/125/ 156.25 25/20/40/ 25/20 6 1 625 1/1/4/5/5 6 2 312.5 6 4 156.25 6 5 125 6 10 62.5 6 20 31.25 6 25 25 5 3 250 5 4 187.5 5 5 150 5 6 125 5 12 62.5 6 2 318.75 6 3 212.5 6 4 159.375 6 6 106.25 6 12 53.125 3686.4 3750 26.04166 25/31.25/ 125 26.5625 1 1/1/4 1 24 30/24/24 24 3750 3825 19.44 1 32 6 1 622.08 38.88 1 16 6 2 311.04 6 4 155.52 6 8 77.76 155.52 4 16 3732.48 cdma2000 is a registered trademark of the Telecommunications Industry Association. WiMAX is a trademark of WiMAX Forum. 14 APPLICATIONS Wireless Base Station: WCDMA, cdma2000®, LTE, TD_SCDMA, WiMAX™, GSM Ethernet FC-SAN SONET/SDH, STM-N Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs +3.3V ±5% VCC 0.1µF 10.5Ω MAX3637 VCCA 0.1µF 10µF Figure 3. Power-Supply Filter Ground Connection The 48-pin TQFN package features an exposed pad (EP), which provides a low resistance thermal path for heat removal from the IC and also the electrical ground. For proper operation, the EP must be connected to the circuit board ground plane with multiple vias. Crystal Selection and Layout The MAX3637 features an integrated on-chip crystal oscillator to minimize system implementation cost. The crystal oscillator is designed to drive a fundamental mode, AT-cut crystal resonator. See Table 12 for recommended crystal specifications. See Figure 4 for the crystal equivalent circuit and Figure 5 for the recommended external capacitor connections. The crystal, trace, and two external capacitors should be placed on the board as close as possible to the XIN and XOUT pins to reduce crosstalk of active signals into the oscillator.
 The total load capacitance for the crystal is a combination of external and on-chip capacitance. The layout shown in Figure 6 gives approximately 1.7pF of trace plus footprint capacitance per side of the crystal. Note the ground plane is removed under the crystal to minimize capacitance. There is approximately 2.5pF of on-chip capacitance between XIN and XOUT. With an external 27pF capacitor connected to XIN and a 33pF external capacitor connected to XOUT, the total load capacitance for the crystal is approximately 18pF. The XIN and XOUT pins can be left open if not used. Table 12. Crystal Selection Parameters PARAMETER Crystal Oscillation Frequency SYMBOL MIN fOSC 18 TYP MAX UNITS 25 33.5 MHz Shunt Capacitance C0 2.0 7.0 pF Load Capacitance CL 18 Equivalent Series Resistance (ESR) RS 10 pF Maximum Crystal Drive Level XTAL 50 I 200 FW 27pF XIN CRYSTAL (CL = 18pF) C0 RS LS Figure 4. Crystal Equivalent Circuit CS MAX3637 XOUT 33pF Figure 5. Crystal, Capacitor Connections 15 MAX3637 Power-Supply Filtering The MAX3637 is a mixed analog/digital IC. The PLL contains analog circuitry susceptible to random noise. To take full advantage of on-board filtering and noise attenuation, in addition to excellent on-chip power-supply rejection, this part provides a separate power-supply pin, VCCA, for the VCO circuitry. Figure 3 illustrates the recommended power-supply filter network for VCCA. The purpose of this design technique is to ensure clean input power supply to the VCO circuitry and to improve the overall immunity to power-supply noise. This network requires that the power supply is +3.3V ±5%. Decoupling capacitors should be used on all other supply pins for best performance. All supply connections should be driven from the same source. Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs MAX3637 Interfacing with LVCMOS Input The equivalent LVCMOS input circuit for CIN is given in Figure 7. This input is internally biased to allow AC- or DC-coupling, and has 180kI input impedance. See Figure 8 for the interface circuit. No signal should be applied to CIN if not used. Interfacing with Differential Input The equivalent input circuit for DIN is given in Figure 9. This input operates up to 350MHz and contains an internal 100I differential termination as well as a 35I common-mode termination. The common-mode termination ensures good signal integrity when connected to a source with large common-mode signals. The input can accept DC-coupled LVPECL signals, and is internally biased to accept AC-coupled LVDS, CML, and LVPECL signals (Figure 10). No signal should be applied to DIN if not used. Figure 6. Crystal Layout 1.4V VCC VBIAS VCC 180kΩ CIN VCC ESD STRUCTURES ESD STRUCTURES DIN Figure 7. Equivalent CIN Circuit 50Ω 20kΩ 10Ω VCC VCC - 1.3V 16pF 50Ω DC-COUPLED MAX3637 DIN CIN XO ESD STRUCTURES Figure 9. Equivalent DIN Circuit AC-COUPLED MAX3637 0.1µF XO Figure 8. Interface to CIN 16 CIN 20kΩ Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs MAX3637 150Ω +3.3V +3.3V DIN Z = 50Ω LVPECL 100Ω LVPECL DIN Z = 50Ω The equivalent LVPECL output circuit is given in Figure 11. These outputs are designed to drive a pair of 50ω transmission lines terminated with 50ω to VTT = VCC - 2V. If a separate termination voltage (VTT) is not available, other terminations methods can be used, as shown in Figure 12. For more information on LVPECL terminations and how to interface with other logic families, refer to Application Note 291: HFAN-01.0: Introduction to LVDS, PECL, and CML. 150Ω VCC_ _ LVPECL SOURCE DRIVING MAX3637 DIFFERENTIAL INPUT AC-COUPLED +3.3V MAX3637 150Ω 0.1µF Z = 50Ω LVPECL 0.1µF Z = 50Ω +3.3V DIN 100Ω Q_ _ LVPECL Q_ _ DIN 150Ω ESD STRUCTURES LVDS OR CML SOURCE DRIVING MAX3637 DIFFERENTIAL INPUT AC-COUPLED Figure 11. Equivalent LVPECL Output Circuit MAX3637 VDD 0.1µF Z = 50Ω LVDS OR CML 0.1µF Z = 50Ω +3.3V DIN 100Ω LVPECL DIN Figure 10. Interfacing to DIN 17 MAX3637 Interfacing with LVPECL Outputs LVPECL SOURCE DRIVING MAX3637 DIFFERENTIAL INPUT DC-COUPLED MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs DC-COUPLED LVPECL DRIVING THEVENIN EQUIVALENT TERMINATION +3.3V +3.3V +3.3V 130Ω MAX3637 Q_ _ +3.3V 130Ω HIGH IMPEDANCE WITH/WITHOUT DC BIAS Z = 50Ω LVPECL LVPECL Q_ _ Z = 50Ω 82Ω 82Ω AC-COUPLED LVPECL DRIVING INTERNAL 100Ω DIFFERENTIAL TERMINATION +3.3V VDD 150Ω MAX3637 Q_ _ ON-CHIP TERMINATION WITH DC BIAS 0.1µF Z = 50Ω LVPECL 100Ω 0.1µF Q_ _ LVPECL Z = 50Ω 150Ω AC-COUPLED LVPECL DRIVING EXTERNAL 50Ω WITH COMMON-MODE TERMINATION +3.3V VDD 150Ω MAX3637 Q_ _ 0.1µF HIGH IMPEDANCE WITH DC BIAS Z = 50Ω LVPECL LVPECL 0.1µF Q_ _ Z = 50Ω 150Ω 50Ω 0.1µF Figure 12. Interface to LVPECL Outputs 18 50Ω Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs Interfacing with LVDS Outputs VCC_ _ 50Ω Q_ _ The equivalent LVDS output circuit is given in Figure 13. These outputs provide 100ω differential output impedance designed to drive a 100ω differential transmission line terminated with a 100ω differential load. Example interface circuits are shown in Figure 14. For more information on LVDS terminations and how to interface with other logic families, refer to Application Note 291: HFAN01.0: Introduction to LVDS, PECL, and CML. 50Ω Q_ _ ESD STRUCTURES Interfacing with LVCMOS Output The equivalent LVCMOS output circuit is given in Figure 15. This output provides 15ω output impedance and is designed to drive a high-impedance load. A series resistor of 33ω is recommended at the LVCMOS output before the transmission line. An example interface circuit is shown in Figure 16. Figure 13. Equivalent LVDS Output Circuit VCCQCC DC-COUPLED LVDS OUTPUT DRIVING LVDS INPUT +3.3V +3.3V 10Ω MAX3637 Q_ _ Z = 50Ω LVDS QCC LVDS* Q_ _ 10Ω Z = 50Ω ESD STRUCTURES AC-COUPLED LVDS OUTPUT DRIVING LVDS INPUT +3.3V MAX3637 Figure 15. Equivalent LVCMOS Output Circuit VDD Q_ _ LVDS Q_ _ 0.1µF Z = 50Ω LVDS* 0.1µF LVCMOS QCC 33Ω Z = 50Ω HIGH IMPEDANCE Z = 50Ω MAX3637 *100Ω DIFFERENTIAL INPUT IMPEDANCE ASSUMED. Figure 16. Interface to LVCMOS Output Figure 14. Interface to LVDS Outputs 19 MAX3637 VREG Layout Considerations • T  he crystal, trace, and two external capacitors should be placed on the board as close as possible to the XIN and XOUT pins to reduce crosstalk of active signals into the oscillator. The inputs and outputs are the most critical paths for the MAX3637; great care should be taken to minimize discontinuities on the transmission lines. Here are some suggestions for maximizing the performance of the MAX3637: • M  aintain 100ω differential (or 50ω single-ended) transmission line impedance into and out of the part. • A  n uninterrupted ground plane should be positioned beneath the clock outputs. The ground plane under the crystal should be removed to minimize capacitance. • P  rovide space between differential output pairs to reduce crosstalk, especially if the outputs are operating at different frequencies. • U  se multilayer boards with an uninterrupted ground plane to minimize EMI and crosstalk. • S  upply decoupling capacitors should be placed close to the supply pins, preferably on the same side of the board as the MAX3637. Refer to the MAX3637 evaluation kit for more information. Chip Information • T  ake care to isolate input traces from the MAX3637 outputs. PROCESS: BiCMOS QA0 QA1 QA1 QA2 QA2 QA3 QA3 QA4 QA4 VCCQA 36 QA0 TOP VIEW VCCQA Pin Configuration 35 34 33 32 31 30 29 28 27 26 25 VCCQB 37 24 VCCQC QB0 38 23 QC QB0 39 22 QC QB1 40 21 QCC QB1 41 20 VCCQCC MAX3637 QB2 42 19 QA_CTRL2 QB2 43 18 DC0 QA_CTRL1 44 17 DC1 QB_CTRL 45 16 DA0 DIN 46 15 DA1 DIN 47 14 DB0 CIN 48 13 DB1 *EP 5 6 7 8 9 10 11 12 DF1 DF0 QC_CTRL VCCA RES DP XOUT 4 PLL_BP 3 VCC 2 IN_SEL 1 XIN + DM MAX3637 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs THIN QFN (7mm × 7mm × 0.8mm) *THE EXPOSED PAD OF THE QFN PACKAGE MUST BE SOLDERED TO GROUND FOR PROPER THERMAL AND ELECTRICAL OPERATION. 20 Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs +3.3V 10.5Ω 10µF 0.1µF 0.1µF VCCA 27pF VCC 0.1µF VCCQA VCCQB XIN 0.1µF VCCQC 0.1µF 0.1µF VCCQCC 150Ω 312.5MHz LVPECL Z = 50Ω QA[4:0] 0.1µF 25MHz XOUT NC CIN NC DIN NC DIN 100Ω 0.1µF Z = 50Ω QA[4:0] 33pF ASIC WITH LVPECL TERMINATION 150Ω 156.25MHz LVDS Z = 50Ω IN_SEL MAX3637 PLL_BP QB[2:0] ASIC WITH LVDS TERMINATION 100Ω DM DF1 QB[2:0] Z = 50Ω QC 125MHz LVDS Z = 50Ω DF0 DA1 +3.3V DA0 DB1 ASIC WITH LVDS TERMINATION 100Ω DB0 DC1 Z = 50Ω QC DC0 DP RES 33Ω QA_CTRL1 QCC QA_CTRL2 125MHz LVCMOS Z = 50Ω ASIC WITH LVCMOS TERMINATION HIGH IMPEDANCE QB_CTRL QC_CTRL EP 21 MAX3637 Typical Application Circuits Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs MAX3637 Typical Application Circuits (continued) CLOCK GENERATOR FOR ETHERNET AND SYSTEM CLOCKING XIN QA[4:0] 312.5MHz LVPECL OR LVDS BACKPLANE TRANSCEIVER QB[2:0] 156.25MHz LVPECL OR LVDS 10GbE PHY 25MHz LVCMOS ASIC QA[4:0] 125MHz LVPECL OR LVDS 1GbE PHY QB[2:0] 100MHz LVPECL OR LVDS PCIe QC 66.67MHz LVPECL OR LVDS NETWORK PROCESSOR QCC 66.67MHz LVCMOS FPGA 25MHz XOUT MAX3637 QCC QC 25MHz LVPECL DIN MAX3638 FREQUENCY TRANSLATOR FOR BASE STATION 30.72MHz 122.88MHz LVPECL OR LVDS CPRI SerDes QB[2:0] 153.6MHz LVPECL OR LVDS SRIO QC 30.72MHz LVPECL OR LVDS FPGA QCC 30.72MHz LVCMOS FPGA DIN MAX3637 22 QA[4:0] Low-Jitter, Wide Frequency Range, Programmable Clock Generator with 10 Outputs CLOCK GENERATOR FOR FIBRE CHANNEL XIN QA[4:0] 212.5MHz LVPECL OR LVDS 8G PHY QB[2:0] 106.25MHz LVPECL OR LVDS 4G PHY QC 106.25MHz LVPECL OR LVDS ASIC 26.5625MHz XOUT MAX3637 QCC NC FREQUENCY SYNTHESIZER FOR SONET LINE CARD 19.44MHz QA[4:0] 622.08MHz LVPECL OR LVDS OC-192 PHY QB[2:0] 155.52MHz LVPECL OR LVDS OC-48 PHY QC 155.52MHz LVPECL OR LVDS ASIC QCC 38.88MHz LVCMOS ASIC DIN MAX3637 Package Information For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. PACKAGE TYPE PACKAGE CODE DOCUMENT NO. 48 TQFN-EP T4877+4 21-0144 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ©  2009 Maxim Integrated Products 23 Maxim is a registered trademark of Maxim Integrated Products, Inc. MAX3637 Typical Application Circuits (continued)
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