MCP1407-E/SN

MCP1406/07 6A High-Speed Power MOSFET Drivers Features General Description • High Peak Output Current: 6.0A (typical) • Low Shoot-Through/Cross-Conduction Current in Output Stage • Wide Input Supply Voltage Operating Range: - 4.5V to 18V • High Capacitive Load Drive Capability: - 2500 pF in 20 ns - 6800 pF in 40 ns • Short Delay Times: 40 ns (typical) • Matched Rise/Fall Times • Low Supply Current: - With Logic ‘1’ Input – 130 µA (typical) - With Logic ‘0’ Input – 35 µA (typical) • Latch-Up Protected: Will Withstand 1.5A Reverse Current • Logic Input Will Withstand Negative Swing up to 5V • Pin compatible with the TC4420/TC4429 devices • Space-saving 8-Pin SOIC, PDIP and 8-Pin 6 x 5 mm DFN Packages The MCP1406/07 devices are a family of buffers/MOSFET drivers that feature a single-output with 6A peak drive current capability, low shoot-through current, matched rise/fall times and propagation delay times. These devices are pin-compatible and are improved versions of the TC4420/TC4429 MOSFET drivers. Applications • • • • Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Motor and Solenoid Drive  2006-2016 Microchip Technology Inc. The MCP1406/07 MOSFET drivers can easily charge and discharge 2500 pF gate capacitance in under 20 ns, provide low enough impedances (in both the ON and OFF states) to ensure that intended state of the MOSFETs will not be affected, even by large transients. The input to the MCP1406/07 may be driven directly from either TTL or CMOS (3V to 18V). These devices are highly latch-up resistant under any conditions that fall within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. All terminals are fully protected against electrostatic discharge (ESD), up to 2.0 kV (HBM) and 400V (MM). The MCP1406/07 single-output 6A MOSFET driver family is offered in both surface-mount and pin-through-hole packages with a -40°C to +125°C temperature rating, making it useful in any wide temperature range application. DS20002019C-page 1 MCP1406/07 Package Types 8-Pin PDIP/SOIC MCP1406 MCP1407 VDD 1 8 VDD VDD 1 INPUT 2 7 OUT INPUT 2 NC 3 6 OUT NC 3 GND 4 5 GND GND 4 8 VDD 7 OUT 6 OUT 5 GND 8-Pin 6x5 DFN-S(2) MCP1407 MCP1406 VDD 1 INPUT 2 NC 3 GND 4 EP 9 8 VDD VDD 1 7 OUT INPUT 2 6 OUT 5 GND NC 3 GND 4 8 VDD 7 OUT EP 9 6 OUT 5 GND 5-Pin TO-220 MCP1406 MCP1407 Tab is common to VDD GND OUT 1 2 3 4 5 INPUT GND VDD GND OUT INPUT GND VDD 1 2 3 4 5 Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed pad of the DFN package is electrically isolated; see Table 3-1. DS20002019C-page 2  2006-2016 Microchip Technology Inc. MCP1406/07 Functional Block Diagram(1) VDD Inverting 130 µA 300 mV Output Output Non-Inverting Input Effective Input C = 25 pF 4.7V MCP1406 Inverting MCP1407 Non-Inverting GND Note 1: Unused inputs should be grounded.  2006-2016 Microchip Technology Inc. DS20002019C-page 3 MCP1406/07 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † Supply Voltage ................................................................+20V Input Voltage ..................................(VDD +0.3V) to (GND -5V) Input Current (VIN > VDD) ..............................................50 mA Package Power Dissipation (TA ; <  8- 7 #  ' < '  ! !20 7 #  >> < >'' :7 # 6  < > :0   < '' $#6 + #  ?  <  $#6  #  2 > < ' 7 ; < '  ; < '   < ' 7 !7 # * #*##%7 ! 7 !0 7 !=!# : '        !"!#$! !%  #$  !%  #$   # & !'(  !     !#  ")' *+, *     # &#-$  ..#$##      . + >* DS20002019C-page 16  2006-2016 Microchip Technology Inc. MCP1406/07     ! "#$ %&'(()* +  /#  #$ # 0 !. 1    #  20 %## !# ## ,33... 3 0  e D L b N N K E2 E EXPOSED PAD NOTE 1 1 2 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 4#   7# 5$: %2 77"" 5 5 58 9 ; 2# 8- 6 #  ; *+ ;'  #!%%    ' +##0 > "/ 8- 7 #  '*+ 8- =!# " "&  !2!7 #  >   "&  !2!=!# "  >  +##=!# : >'  ; +##7 # 7 '  ' *+ +## # "&  !2! @  <   2- $! &% #$ -1:$#$ #: # !.## # !   20 -    &  !# : # !  > 20   . $# !    !#  ")' *+, *     # &#-$  ..#$##   "/,  %     1$ $.#$##  1%%# $   <    . + *  2006-2016 Microchip Technology Inc. DS20002019C-page 17 MCP1406/07  /#  #$ # 0 !. 1    #  20 %## !# ## ,33... 3 0 DS20002019C-page 18  2006-2016 Microchip Technology Inc. MCP1406/07 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A PLANE L A1 e c eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2  2006-2016 Microchip Technology Inc. DS20002019C-page 19 MCP1406/07 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2 DS20002019C-page 20  2006-2016 Microchip Technology Inc. MCP1406/07 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2016 Microchip Technology Inc. DS20002019C-page 21 MCP1406/07 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20002019C-page 22  2006-2016 Microchip Technology Inc. MCP1406/07   +(  +%,!-./(()*+01  /#  #$ # 0 !. 1    #  20 %## !# ## ,33... 3 0  2006-2016 Microchip Technology Inc. DS20002019C-page 23 MCP1406/07 NOTES: DS20002019C-page 24  2006-2016 Microchip Technology Inc. MCP1406/07 APPENDIX A: REVISION HISTORY Revision C (April 2016) The following is the list of modifications: • Updated the Package Thermal Resistances section of Temperature Characteristics table with the latest information. • Updated Figure 2-21 in Section 2.0 “Typical Performance Curves”. Revision B (May 2012) The following is the list of modifications: Removed the information referring to the Electrostatic Discharge from the General Description section. Revision A (December 2006) Original release of this document.  2006-2016 Microchip Technology Inc. DS20002019C-page 25 MCP1406/07 NOTES: DS20002019C-page 26  2006-2016 Microchip Technology Inc. MCP1406/07 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX XXX Package Tape & Reel Examples: a) b) Device: MCP1406: 6A High-Speed MOSFET Driver, Inverting MCP1406T: 6A High-Speed MOSFET Driver, Inverting, Tape and Reel MCP1407: 6A High-Speed MOSFET Driver, Non-Inverting MCP1407T: 6A High-Speed MOSFET Driver, Non-Inverting, Tape and Reel Temperature Range: E = Package: * AT MF = Plastic Transistor Outline, 5-Lead (TO-220) = Plastic Dual Flat - 6x5 mm Body, 8-Lead (DFN-S) = Plastic Dual In-Line - 300 mil Body, 8-Lead (PDIP) = Plastic Small Outline - Narrow, 3.90 mm Body, 8-Lead (SOIC) P SN -40°C to +125°C * All package offerings are Pb Free (Lead Free) c) d) e) f) a) b) c) d) e) f)  2006-2016 Microchip Technology Inc. MCP1406-E/MF: 6A High-Speed MOSFET Driver, Inverting, 8LD DFN Package MCP1406-E/AT: 6A High-Speed MOSFET Driver, Inverting, 5LD TO-220 Package MCP1406-E/SN: 6A High-Speed MOSFET Driver, Inverting, 8LD SOIC Package MCP1406-E/P: 6A High-Speed MOSFET Driver, Inverting, 8LD PDIP Package MCP1406T-E/MF: Tape and Reel, 6A High-Speed MOSFET Driver, Inverting, 8LD DFN Package MCP1406T-E/SN: Tape and Reel, 6A High-Speed MOSFET Driver, Inverting, 8LD SOIC Package MCP1407-E/MF: 6A High-Speed MOSFET Driver, Non-Inverting, 8LD DFN Package MCP1407-E/AT: 6A High-Speed MOSFET Driver, Non-Inverting, 5LD TO-220 Package MCP1407-E/SN: 6A High-Speed MOSFET Driver, Non-Inverting, 8LD SOIC Package MCP1407-E/P: 6A High-Speed MOSFET Driver, Non-Inverting, 8LD PDIP Package MCP1407T-E/MF: Tape and Reel, 6A High-Speed MOSFET Driver, Non-Inverting, 8LD DFN Package MCP1407T-E/SN: Tape and Reel, 6A High-Speed MOSFET Driver, Non-Inverting, 8LD SOIC Package DS20002019C-page 27 MCP1406/07 NOTES: DS20002019C-page 28  2006-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2006-2016 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. 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