MCP1406/07
6A High-Speed Power MOSFET Drivers
Features
General Description
• High Peak Output Current: 6.0A (typical)
• Low Shoot-Through/Cross-Conduction Current in
Output Stage
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability:
- 2500 pF in 20 ns
- 6800 pF in 40 ns
• Short Delay Times: 40 ns (typical)
• Matched Rise/Fall Times
• Low Supply Current:
- With Logic ‘1’ Input – 130 µA (typical)
- With Logic ‘0’ Input – 35 µA (typical)
• Latch-Up Protected: Will Withstand 1.5A Reverse
Current
• Logic Input Will Withstand Negative Swing up to 5V
• Pin compatible with the TC4420/TC4429 devices
• Space-saving 8-Pin SOIC, PDIP and
8-Pin 6 x 5 mm DFN Packages
The MCP1406/07 devices are a family of
buffers/MOSFET drivers that feature a single-output
with 6A peak drive current capability, low shoot-through
current, matched rise/fall times and propagation delay
times. These devices are pin-compatible and are
improved versions of the TC4420/TC4429 MOSFET
drivers.
Applications
•
•
•
•
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Motor and Solenoid Drive
2006-2016 Microchip Technology Inc.
The MCP1406/07 MOSFET drivers can easily charge
and discharge 2500 pF gate capacitance in under
20 ns, provide low enough impedances (in both the ON
and OFF states) to ensure that intended state of the
MOSFETs will not be affected, even by large transients.
The input to the MCP1406/07 may be driven directly
from either TTL or CMOS (3V to 18V).
These devices are highly latch-up resistant under any
conditions that fall within their power and voltage
ratings. They are not subject to damage when up to 5V
of noise spiking (of either polarity) occurs on the ground
pin. All terminals are fully protected against
electrostatic discharge (ESD), up to 2.0 kV (HBM) and
400V (MM).
The MCP1406/07 single-output 6A MOSFET driver
family is offered in both surface-mount and
pin-through-hole packages with a -40°C to +125°C
temperature rating, making it useful in any wide
temperature range application.
DS20002019C-page 1
MCP1406/07
Package Types
8-Pin PDIP/SOIC
MCP1406
MCP1407
VDD 1
8 VDD
VDD 1
INPUT 2
7 OUT
INPUT 2
NC 3
6 OUT
NC 3
GND 4
5 GND
GND 4
8 VDD
7 OUT
6
OUT
5 GND
8-Pin 6x5 DFN-S(2)
MCP1407
MCP1406
VDD 1
INPUT 2
NC 3
GND 4
EP
9
8 VDD
VDD 1
7 OUT
INPUT 2
6 OUT
5 GND
NC 3
GND 4
8 VDD
7 OUT
EP
9
6 OUT
5 GND
5-Pin TO-220
MCP1406
MCP1407
Tab is common to VDD
GND
OUT
1 2 3 4 5
INPUT
GND
VDD
GND
OUT
INPUT
GND
VDD
1 2 3 4 5
Note 1: Duplicate pins must both be connected for proper operation.
2: Exposed pad of the DFN package is electrically isolated; see Table 3-1.
DS20002019C-page 2
2006-2016 Microchip Technology Inc.
MCP1406/07
Functional Block Diagram(1)
VDD
Inverting
130 µA
300 mV
Output
Output
Non-Inverting
Input
Effective
Input C = 25 pF
4.7V
MCP1406 Inverting
MCP1407 Non-Inverting
GND
Note 1: Unused inputs should be grounded.
2006-2016 Microchip Technology Inc.
DS20002019C-page 3
MCP1406/07
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this
specification is not intended. Exposure to maximum
rating conditions for extended periods may affect
device reliability.
Absolute Maximum Ratings †
Supply Voltage ................................................................+20V
Input Voltage ..................................(VDD +0.3V) to (GND -5V)
Input Current (VIN > VDD) ..............................................50 mA
Package Power Dissipation (TA ;
<
8-
7
#
'
<
'
!
!2 0
7
#
>>
<
>''
:7
#
6
<
>
:0
<
''
$# 6
+
#
?
<
$# 6
#
2
>
<
'
7
;
<
'
;
<
'
<
'
7
!7
#
*
#*## %7
!
7
!0
7
!=!#
:
'
!"!#$!
!%
#$ !%
#$ #
&
! '(
!
!#
") '
*+, *
#
& #- $
..#$##
. + >*
DS20002019C-page 16
2006-2016 Microchip Technology Inc.
MCP1406/07
! "#$ %&'(()* +
/#
#$
#
0
! . 1
#
2 0
% # #
! #
##
,33...
3
0
e
D
L
b
N
N
K
E2
E
EXPOSED PAD
NOTE 1
1
2
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
4#
7 #
5$ :
%2
77 ""
5
5
58
9
;
2#
8-
6
#
;
*+
;'
# !%%
'
+# #0
>
"/
8-
7
#
' *+
8-
=!#
"
"&
!2 !7
#
>
"&
!2 !=!#
"
>
+# #=!#
:
>'
;
+# #7
#
7
'
'
*+
+# # # "&
!2 !
@
<
2 - $ !
&%
#$
- 1:$# $ #:
#
!.##
#
!
2 0
-
&
!#
: #
!
> 2 0
. $ #
!
!#
") '
*+, *
#
& #- $
..#$##
"/,
%
1$ $ .#$##
1%% #
$
<
. + *
2006-2016 Microchip Technology Inc.
DS20002019C-page 17
MCP1406/07
/#
#$
#
0
! . 1
#
2 0
% # #
! #
##
,33...
3
0
DS20002019C-page 18
2006-2016 Microchip Technology Inc.
MCP1406/07
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
PLANE
L
A1
e
c
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
2006-2016 Microchip Technology Inc.
DS20002019C-page 19
MCP1406/07
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
DS20002019C-page 20
2006-2016 Microchip Technology Inc.
MCP1406/07
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2006-2016 Microchip Technology Inc.
DS20002019C-page 21
MCP1406/07
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002019C-page 22
2006-2016 Microchip Technology Inc.
MCP1406/07
+(
+ % ,!-./(()*+01
/#
#$
#
0
! . 1
#
2 0
% # #
! #
##
,33...
3
0
2006-2016 Microchip Technology Inc.
DS20002019C-page 23
MCP1406/07
NOTES:
DS20002019C-page 24
2006-2016 Microchip Technology Inc.
MCP1406/07
APPENDIX A:
REVISION HISTORY
Revision C (April 2016)
The following is the list of modifications:
• Updated the Package Thermal Resistances section of Temperature Characteristics table with the
latest information.
• Updated Figure 2-21 in Section 2.0 “Typical
Performance Curves”.
Revision B (May 2012)
The following is the list of modifications:
Removed the information referring to the
Electrostatic Discharge from the General
Description section.
Revision A (December 2006)
Original release of this document.
2006-2016 Microchip Technology Inc.
DS20002019C-page 25
MCP1406/07
NOTES:
DS20002019C-page 26
2006-2016 Microchip Technology Inc.
MCP1406/07
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
Temperature
Range
XX
XXX
Package
Tape & Reel
Examples:
a)
b)
Device:
MCP1406:
6A High-Speed MOSFET Driver,
Inverting
MCP1406T: 6A High-Speed MOSFET Driver,
Inverting, Tape and Reel
MCP1407: 6A High-Speed MOSFET Driver,
Non-Inverting
MCP1407T: 6A High-Speed MOSFET Driver,
Non-Inverting, Tape and Reel
Temperature Range:
E
=
Package: *
AT
MF
= Plastic Transistor Outline, 5-Lead (TO-220)
= Plastic Dual Flat - 6x5 mm Body,
8-Lead (DFN-S)
= Plastic Dual In-Line - 300 mil Body,
8-Lead (PDIP)
= Plastic Small Outline - Narrow, 3.90 mm Body,
8-Lead (SOIC)
P
SN
-40°C to +125°C
* All package offerings are Pb Free (Lead Free)
c)
d)
e)
f)
a)
b)
c)
d)
e)
f)
2006-2016 Microchip Technology Inc.
MCP1406-E/MF: 6A High-Speed MOSFET
Driver, Inverting,
8LD DFN Package
MCP1406-E/AT: 6A High-Speed MOSFET
Driver, Inverting,
5LD TO-220 Package
MCP1406-E/SN: 6A High-Speed MOSFET
Driver, Inverting,
8LD SOIC Package
MCP1406-E/P:
6A High-Speed MOSFET
Driver, Inverting,
8LD PDIP Package
MCP1406T-E/MF: Tape and Reel,
6A High-Speed MOSFET
Driver, Inverting,
8LD DFN Package
MCP1406T-E/SN: Tape and Reel,
6A High-Speed MOSFET
Driver, Inverting,
8LD SOIC Package
MCP1407-E/MF: 6A High-Speed MOSFET
Driver, Non-Inverting,
8LD DFN Package
MCP1407-E/AT: 6A High-Speed MOSFET
Driver, Non-Inverting,
5LD TO-220 Package
MCP1407-E/SN: 6A High-Speed MOSFET
Driver, Non-Inverting,
8LD SOIC Package
MCP1407-E/P:
6A High-Speed MOSFET
Driver, Non-Inverting,
8LD PDIP Package
MCP1407T-E/MF: Tape and Reel,
6A High-Speed MOSFET
Driver, Non-Inverting,
8LD DFN Package
MCP1407T-E/SN: Tape and Reel,
6A High-Speed MOSFET
Driver, Non-Inverting,
8LD SOIC Package
DS20002019C-page 27
MCP1406/07
NOTES:
DS20002019C-page 28
2006-2016 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2006-2016 Microchip Technology Inc.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2006-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0450-7
DS20002019C-page 29
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
Germany - Karlsruhe
Tel: 49-721-625370
India - Pune
Tel: 91-20-3019-1500
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Italy - Venice
Tel: 39-049-7625286
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS20002019C-page 30
2006-2016 Microchip Technology Inc.
工商网监
湘ICP备2023018690号
