MCP1602T-150I/MF

MCP1602 2.0 MHz, 500 mA Synchronous Buck Regulator with Power-Good Features General Description • • • • • • • The MCP1602 is a high efficient, fully integrated 500 mA synchronous buck regulator with a powergood monitor. The 2.7V to 5.5V input voltage range and low quiescent current (45 µA, typical) makes the MCP1602 ideally suited for applications powered from 1-cell Li-Ion or 2-cell/3-cell NiMH/NiCd batteries. • • • • • • • Over 90% Typical Efficiency Output Current: Up To 500 mA Power-Good Output with 262 ms Delay Low Quiescent Current: 45 µA (typical) Low Shutdown Current: 0.05 µA (typical) Automatic PWM to PFM Mode Transition Adjustable Output Voltage: - 0.8V to 4.5V Fixed Output Voltage: - 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V 2.0 MHz Fixed-Frequency PWM (Heavy Load) Internally Compensated Undervoltage Lockout (UVLO) Overtemperture Protection Overcurrent Protection Space Saving Packages: - 8-Lead MSOP - 8-Lead 3x3 DFN Applications • • • • • • • Cellular Telephones Portable Computers Organizers / PDAs USB Powered Devices Digital Cameras Portable Equipment +5V or +3.3V Distributed Systems At heavy loads, the MCP1602 operates in the 2.0 MHz fixed frequency PWM mode which provides a low noise, low output ripple, small-size solution. When the load is reduced to light levels, the MCP1602 automatically changes operation to a PFM mode to minimize quiescent current draw from the battery. No intervention is necessary for a smooth transition from one mode to another. These two modes of operation allow the MCP1602 to achieve the highest efficiency over the entire operating current range. The open-drain power-good feature of the MCP1602 monitors the output voltage and provides indication when the output voltage is within 94% (typical) of the regulation value. The typical 2% hystereses in the power-good transition threshold as well as a 262 ms (typical) delay time ensures accurate powergood signaling. The MCP1602 is available in either the 8-pin DFN or MSOP package. It is also available with either an adjustable or fixed output voltage. The available fixed output voltage options are 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. Additional protection features include: overtemperature, and overcurrent protection. UVLO, Package Types MSOP-8 3x3 DFN-8 PGND 8 SHDN 1 8 PGND 2 VCC LX 7 VCC 2 7 LX 3 PG VIN 6 PG 3 6 VIN 4 AGND VOUT/VFB 5 AGND 4 5 VOUT/VFB 1 SHDN © 2007 Microchip Technology Inc. DS22061A-page 1 MCP1602 Typical Application Circuit 4.7 µH VIN 2.7V to 4.5V 4.7 µF LX 7 6 VIN 10Ω 2 VCC 0.1 µF 4 AGND 1 SHDN VOUT 1.5V @ 500 mA 4.7 µF VFB 5 PGND 8 PG 3 MCP1602 RPULLUP Processor Reset ON OFF VIN DS22061A-page 2 © 2007 Microchip Technology Inc. MCP1602 Functional Block Diagram VCC UVLO VIN VREF Band Gap Thermal Shutdown UVLO Soft Start SHDN ILIMPWM TSD ILIMPFM IPK Limit IPEAKPWM Disable Switcher IPEAKPFM Slope Comp OSC -ILPK S Q POFF LX NOFF Switch Drive R Q Logic and Timing PWM/PFM PFM Error Amp PWM/PFM Logic PGND IPEAKPFM VREF IPEAKPWM PWM Error Amp EA -ILPK -IPK Limit VREF VREF VCC PG OV Threshold PG Generator with Delay VFB / VOUT AGND UV Threshold VOUT © 2007 Microchip Technology Inc. DS22061A-page 3 MCP1602 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VIN - AGND ......................................................................+6.0V All Other I/O .............................. (AGND - 0.3V) to (VIN + 0.3V) LX to PGND ............................................. -0.3V to (VIN + 0.3V) Output Short Circuit Current..................................Continuous Power Dissipation (Note 6) ..........................Internally Limited Storage Temperature.................................... -65oC to +150oC Ambient Temp. with Power Applied................ -40oC to +85oC Operating Junction Temperature.................. -40oC to +125oC ESD Protection On All Pins: HBM..............................................................................3 kV MM...............................................................................200V DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VIN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply for the TA range of -40oC to +85oC. Parameters Sym Min Typ Max Units VIN 2.7 — 5.5 V Conditions Input Characteristics Input Voltage Note 1 IOUT 500 — — mA Note 1 Shutdown Current IIN_SHDN — 0.05 1 µA SHDN = GND Quiescent Current IQ — 45 60 µA SHDN = VIN, IOUT = 0 mA Maximum Output Current Shutdown/UVLO/Thermal Shutdown Characteristics SHDN, Logic Input Voltage Low VIL — — 15 %VIN VIN = 2.7V to 5.5V SHDN, Logic Input Voltage High VIH 45 — — %VIN VIN = 2.7V to 5.5V SHDN, Input Leakage Current Undervoltage Lockout Undervoltage Lockout Hysteresis VL_SHND -1.0 ±0.1 1.0 µA VIN = 2.7V to 5.5V, SHDN = AGND UVLO 2.40 2.55 2.70 V VIN Falling UVLOHYS — 200 — mV TSHD — 150 — °C Note 5, Note 6 TSHD-HYS — 10 — °C Note 5, Note 6 VOUT 0.8 — 4.5 V Note 2 Reference Feedback Voltage VFB — 0.8 — V Feedback Input Bias Current IVFB — -1.5 — nA Thermal Shutdown Thermal Shutdown Hysteresis Output Characteristics Adjustable Output Voltage Range Note 1: 2: 3: 4: 5: 6: 7: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V. Reference Feedback Voltage Tolerance applies to adjustable output voltage setting. VR is the output voltage setting. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range of 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered too. Thermal protection is not able to limit the junction temperature for these cases. The current limit threshold is a cycle-by-cycle current limit. DS22061A-page 4 © 2007 Microchip Technology Inc. MCP1602 DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply for the TA range of -40oC to +85oC. Parameters Sym Min Typ Max Output Voltage Tolerance Fixed VOUT Line Regulation VLINE- Load Regulation VLOAD- Units -2.5 VR +2.5 % — 0.3 — %/V — 0.4 — % FOSC 1.6 2.0 2.4 MHz TSS — 0.5 — ms TR = 10% to 90% RDSon P-Channel RDSon-P — 450 — mΩ IP = 100 mA RDSon N-Channel RDSon-N — 450 — mΩ IN = 100 mA ILX -1.0 ±0.01 1.0 µA SHDN = 0V, VIN = 5.5V, LX = 0V, LX = 5.5V Positive Current Limit Threshold +ILX(MAX) Power-Good (PG) — 700 — mA Note 7 Voltage Range VPG 1.0 1.2 — 5.5 5.5 V PG Threshold High VTH_H — 94 96 % of VOUT On Rising VOUT PG Threshold Low VTH_L 89 92 — % of VOUT On Falling VOUT PG Threshold Hysteresis VTH_HYS — 2 — % of VOUT PG Threshold Tempco ΔVTH/ΔT — 30 — ppm/°C PG Delay tRPD — 165 — µs VOUT = (VTH_H + 100 mV) to (VTH_L - 100 mV) PG Active Time-out Period tRPU 140 262 560 ms VOUT = (VTH_L - 100 mV) to (VTH_H + 100 mV), ISINK = 1.2mA PG_VOL — — 0.2 V REG REG Internal Oscillator Frequency Start Up Time LX Pin Leakage Current PG Output Voltage Low Note 1: 2: 3: 4: 5: 6: 7: Conditions Note 3 VIN = VR + 1V to 5.5V, IOUT = 100 mA VIN = VR +1.5V, ILOAD = 100 mA to 500 mA, Note 1 TA = 0°C to +70°C TA = -40°C to +85°C VIN ≤ 2.7V, ISINK = 100 µA VOUT = VTH_L - 100 mV, IPG = 1.2 mA, VIN > 2.7V IPG = 100 µA, 1.0 < VIN < 2.7V The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V. Reference Feedback Voltage Tolerance applies to adjustable output voltage setting. VR is the output voltage setting. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range of 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered too. Thermal protection is not able to limit the junction temperature for these cases. The current limit threshold is a cycle-by-cycle current limit. © 2007 Microchip Technology Inc. DS22061A-page 5 MCP1602 TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 2.7V to 5.5V Parameters Sym Min Typ Max Units Conditions Operating Junction Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Thermal Resistance, 8L-MSOP θJA — 211 — °C/W Typical 4-layer Board with Internal Ground Plane Thermal Resistance, 8L-3x3 DFN θJA — 60 — °C/W Typical 4-layer Board with Internal Ground Plane and 2-Vias in Thermal Pad Temperature Ranges Steady State Transient Package Thermal Resistances DS22061A-page 6 © 2007 Microchip Technology Inc. MCP1602 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. 55 VOUT = 1.8V Quiescent Current (µA) Quiescent Current (µA) 60 55 VIN = 5.5V 50 45 VIN = 3.6V 40 VIN = 4.2V 35 30 -40 -25 -10 5 TA = +25°C TA = +90°C 50 45 TA = -40°C 40 35 30 20 35 50 65 80 95 110 125 2.7 3.05 3.4 3.75 Ambient Temperature (oC) FIGURE 2-1: FIGURE 2-4: 4.8 5.15 5.5 IQ vs. Input Voltage. 100 VOUT = 1.2V 95 IOUT = 100 mA 90 85 80 IOUT = 300 mA 75 VIN = 3.6V 90 Efficiency (%) Efficiency (%) 4.45 Input Voltage (V) IQ vs. Ambient Temperature. 100 IOUT = 500 mA 70 80 VIN = 3.0V 70 60 50 40 VIN = 4.2V 30 65 3.0 3.2 3.4 3.6 3.8 4.0 VOUT = 1.2V 20 4.2 0.1 1 Input Voltage (V) FIGURE 2-2: (VOUT = 1.2V). Efficiency vs. Input Voltage 1000 Efficiency vs. Output Load 100 VOUT = 1.8V 90 85 IOUT = 300 mA IOUT = 500 mA 80 VIN = 3.6V 90 IOUT = 100 mA 75 Efficiency (%) 95 10 100 Output Current (mA) FIGURE 2-5: (VOUT = 1.2V). 100 Efficiency (%) 4.1 80 70 VIN = 3.0V 60 50 40 VIN = 4.2V 30 70 3.0 3.2 3.4 3.6 3.8 4.0 4.2 VOUT = 1.8V 20 0.1 Input Voltage (V) FIGURE 2-3: (VOUT = 1.8V). Efficiency vs. Input Voltage © 2007 Microchip Technology Inc. 1 10 100 1000 Output Current (mA) FIGURE 2-6: (VOUT = 1.8V). Efficiency vs. Output Load DS22061A-page 7 MCP1602 Typical Performance Curves (Continued) Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. 100.0 100 VOUT = 3.3V IOUT = 100 mA 95.0 IOUT = 300 mA 92.5 90.0 VIN = 4.2V 90 Efficiency (%) Efficiency (%) 97.5 IOUT = 500 mA 87.5 80 70 60 50 40 30 85.0 VIN = 5.5V 4.2 4.4 4.6 4.8 5.0 5.2 5.4 0.1 1 Input Voltage (V) FIGURE 2-7: (VOUT = 3.3V). Efficiency vs. Input Voltage FIGURE 2-10: (VOUT = 3.3V). 100 1000 Efficiency vs. Output Load 96 PG Threshold (% of V OUT ) PG Active Time-Out (ms) 10 Output Current (mA) 340 320 300 280 260 240 220 200 95 PG Threshold High 94 93 92 91 90 PG Threshold Low 89 88 -40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 Ambient Temperature (°C) 5 20 35 50 65 80 95 110 125 Ambient Temperature (°C) FIGURE 2-8: PG Active Time-out vs. Ambient Temperature. FIGURE 2-11: PG Threshold Voltage vs. Ambient Temperature. 1.85 0.832 0.828 Output Voltage (V) Feedback Voltage (V) VOUT = 3.3V 20 0.824 0.820 0.816 Ambient Temperature (°C) FIGURE 2-9: Feedback Voltage vs. Ambient Temperature. DS22061A-page 8 125 95 110 80 65 50 35 5 20 -10 -25 -40 0.812 1.84 1.83 1.82 1.81 0 50 100 150 200 250 300 350 400 450 500 Output Current (mA) FIGURE 2-12: Output Voltage vs. Load Current (VOUT = 1.8V). © 2007 Microchip Technology Inc. MCP1602 Typical Performance Curves (Continued) Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. Switching Frequency (MHz) Switching Frequency (MHz) 2.00 1.98 1.96 1.94 1.92 1.90 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient Temperature (°C) FIGURE 2-13: Switching Frequency vs. Ambient Temperature. 2.05 2.00 1.95 1.90 1.85 2.70 3.05 3.40 3.75 4.10 4.45 4.80 5.15 5.50 Input Voltage (V) FIGURE 2-16: Input Voltage. 0.6 Switching Frequency vs. 0.7 0.5 P-Channel 0.4 N-Channel 0.3 0.2 2.70 3.05 3.40 3.75 4.10 4.45 4.80 5.15 5.50 Switch Resistance (Ω) Switch Resistance (Ω) 2.10 0.6 0.5 P-Channel 0.4 N-Channel 0.3 0.2 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient Temperature (°C) Input Voltage (V) FIGURE 2-14: Voltage. Switch Resistance vs. Input FIGURE 2-17: Switch Resistance vs. Ambient Temperature. FIGURE 2-15: Waveform. Output Voltage Startup FIGURE 2-18: Waveform. © 2007 Microchip Technology Inc. Heavy Load Switching DS22061A-page 9 MCP1602 Typical Performance Curves (Continued) Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics. FIGURE 2-19: Waveform. Light Load Switching FIGURE 2-20: Output Voltage Load Step Response vs. Time. DS22061A-page 10 FIGURE 2-21: Output Voltage Line Step Response vs. Time. FIGURE 2-22: Power-Good Output Timing. © 2007 Microchip Technology Inc. MCP1602 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MSOP DFN Sym 1 1 SHDN 2 2 VCC Analog Input Supply Voltage Pin 3 3 PG Power Good Output Pin 4 4 AGND 5 5 VFB/VOUT 6 6 VIN Input Supply Voltage Pin 7 7 LX Buck Inductor Output Pin 8 8 PGND — Exposed Pad EP 3.1 Description Shutdown Input Pin Analog Ground Pin Feedback Voltage (Adjustable Version) / Output Voltage (Fixed Version) Pin Power Ground Pin For the DFN package, the center exposed pad is a thermal path to remove heat from the device. Electrically this pad is at ground potential and should be connected to AGND Shutdown Control Input Pin (SHDN) 3.6 Power Supply Input Voltage Pin (VIN) The SHDN pin is a logic-level input used to enable or disable the device. A logic high (>45% of VIN) will enable the regulator output. A logic-low (