MCP1603/B/L
2.0 MHz, 500 mA Synchronous Buck Regulator
Features
General Description
• Over 90% Typical Efficiency
• Output Current Up To 500 mA
• Low PFM Quiescent Current = 45 µA, typical
(MCP1603/L)
• Low Shutdown Current = 0.1 µA, typical
• Adjustable Output Voltage:
- 0.8V to 4.5V
• Fixed Output Voltage:
- 1.2V, 1.5V, 1.8V, 2.5V, 3.3V (MCP1603/L)
- 1.8V, 3.3V (MCP1603B)
• 2.0 MHz Fixed-Frequency PWM (Heavy Load)
• Automatic PWM-to-PFM Mode Transition
(MCP1603/L)
• PWM Mode Only Option (MCP1603B)
• 100% Duty Cycle Operation
• Internally Compensated
• Undervoltage Lockout (UVLO)
• Overtemperature Protection
• Space Saving Packages:
- 5-Lead TSOT, Two Pinout Types (MCP1603/L)
- 8-Lead 2 x 3 DFN
The MCP1603/B/L is a high-efficiency, fully-integrated
500 mA synchronous buck regulator whose 2.7V to
5.5V input voltage range makes it ideally suited for
applications powered from 1-cell Li-Ion or 2-cell/3-cell
NiMH/NiCd batteries.
Applications
•
•
•
•
•
•
•
•
Cellular Telephones
Portable Computers
Organizers / PDAs
USB Powered Devices
Digital Cameras
Portable Equipment
+5V or +3.3V Distributed Systems
Headsets
2007-2012 Microchip Technology Inc.
At heavy loads, the MCP1603/B/L operates in the
2.0 MHz fixed frequency pulse-width modulation
(PWM) mode, which provides a low noise, low-output
ripple, small-size solution. When the load is reduced to
light levels, the MCP1603/L automatically changes
operation to a Pulse Frequency Modulation (PFM)
mode to minimize quiescent current draw from the
battery. No intervention is necessary for a smooth
transition from one mode to another. These two modes
of operation allow the MCP1603/L to achieve the
highest efficiency over the entire operating current
range.
The MCP1603B device disables the PFM mode
switching, and operates only in normal PWM mode
over the entire load range (without skipping).
MCP1603B is for applications that cannot tolerate the
low-frequency output ripple associated with PFM
switching.
The MCP1603/B/L family is available with either an
adjustable or fixed-output voltage. The available fixed
output voltage options for MCP1603/L are 1.2V, 1.5V,
1.8V, 2.5V and 3.3V, and for MCP1603B are 1.8 and
3.3V. When a fixed option is used, only three additional
small external components are needed to form a
complete solution. Couple this with the low profile,
small-foot print packages and the entire system
solution is achieved with minimal size.
Additional protection features include:
overtemperature and overcurrent protection.
UVLO,
DS22042B-page 1
MCP1603/B/L
Package Types
MCP1603L
TSOT
MCP1603/MCP1603B
TSOT
VIN
1
GND
2
SHDN
3
5
LX
SHDN
1
GND
2
LX
3
MCP1603
2 x 3 DFN*
5
LX 1
VFB/VOUT
NC 2
4
VFB/VOUT
4
SHDN 3
VFB/VOUT 4
VIN
8 GND
EP
9
7 VIN
6 NC
5 NC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
Typical Application Circuit
L1
4.7 µH
VIN
2.7V to 4.5V
VIN
CIN
4.7 µF
VOUT
1.8V @ 500 mA
LX
COUT
4.7 µF
SHDN VFB
GND
100
Efficiency (%)
90
VIN = 2.7V
VOUT = 1.8V
80
70
60
50
40
VIN = 3.6V
30
VIN = 4.5V
__ PFM/PWM (MCP1603/L)
--- PWM (MCP1603B)
20
10
0.1
1
10
100
1000
Output Current (mA)
DS22042B-page 2
2007-2012 Microchip Technology Inc.
MCP1603/B/L
Functional Block Diagram
VIN
Band
Gap
UVLO
Thermal
Shutdown
UVLO
VREF
Soft Start
SHDN
ILIMPWM
TSD
IPK Limit
IPEAKPWM
ILIMPFM
IPEAKPFM
Slope
Comp.
+
OSC
-ILPK
+
S
R
Q
POFF
Q
Switch Drive
Logic and Timing
NOFF
LX
PWM/PFM - PWM ONLY
PWM-ONLY
PFM Error Amp
PWM/PFM
Logic
GND
IPEAKPFM
IPEAKPWM
VREF
PWM Error Amp
-ILPK
EA
-IPK Limit
VREF
OV Threshold
Disable
Switcher
VFB / VOUT
UVLO
TSD
UV Threshold
2007-2012 Microchip Technology Inc.
DS22042B-page 3
MCP1603/B/L
NOTES:
DS22042B-page 4
2007-2012 Microchip Technology Inc.
MCP1603/B/L
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - GND.......................................................................+6.0V
All Other I/O ............................... (GND - 0.3V) to (VIN + 0.3V)
LX to GND .............................................. -0.3V to (VIN + 0.3V)
Output Short Circuit Current ................................. Continuous
Power Dissipation (Note 5) .......................... Internally Limited
Storage Temperature ....................................-65°C to +150°C
Ambient Temp. with Power Applied ................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
HBM ............................................................................. 4 kV
MM ..............................................................................300V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device
reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,
L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C
to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VIN
2.7
—
5.5
V
Note 1
IOUT
500
—
—
mA
Note 1
IIN_SHDN
—
0.1
1
µA
SHDN = GND
Quiescent Current - PFM
IQ
—
45
60
µA
SHDN = VIN, IOUT = 0 mA,
device switching
Quiescent Current - PWM
IQ
1.0
2.7
4
mA
SHDN = VIN, IOUT = 0 mA,
device switching (MCP1603B)
—
15
%VIN VIN = 2.7V to 5.5V
%VIN VIN = 2.7V to 5.5V
Input Characteristics
Input Voltage
Maximum Output Current
Shutdown Current
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN, Logic Input Voltage Low
SHDN, Logic Input Voltage High
SHDN, Input Leakage Current
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
Note 1:
2:
3:
4:
5:
6:
VIL
—
VIH
45
—
—
IL_SHDN
-1.0
±0.1
1.0
µA
VIN = 2.7V to 5.5V
UVLO
2.12
2.28
2.43
V
VIN Falling
UVLOHYS
—
140
—
mV
TSHD
—
150
—
°C
Note 4, Note 5
TSHD-HYS
—
10
—
°C
Note 4, Note 5
The input voltage should be greater then the output voltage plus headroom voltage; higher load currents
increase the input voltage required for regulation. MCP1603B device requires a minimum load for
regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
VR is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
2007-2012 Microchip Technology Inc.
DS22042B-page 5
MCP1603/B/L
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF,
L = 4.7 µH, VOUT(ADJ) = 1.8V, IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C
to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VOUT
0.8
—
4.5
V
—
0.8
—
V
-3.0
—
+3.0
%
TA = -40°C to +25°C
TA = +25°C to +85°C
Output Characteristics
Adjustable Output Voltage Range
Reference Feedback Voltage
VFB
Reference Feedback Voltage
Tolerance
Note 2
-2.5
—
+2.5
%
Feedback Input Bias Current
IVFB
—
0.1
—
nA
Output Voltage Tolerance Fixed
VOUT
-3.0%
VR
+3.0%
%
TA = -40°C to +25°C, Note 3
VOUT
-2.5
VR
+2.5
%
TA = +25°C to +85°C, Note 3
Line Regulation
VLINE-REG
—
0.3
—
%/V
Load Regulation
VLOAD-REG
—
0.35
—
%
FOSC
1.5
2.0
2.8
MHz
Internal Oscillator Frequency
VIN = VR + 1V to 5.5V,
IOUT = 100 mA
VIN = VR +1.5V,
ILOAD = 100 mA to 500 mA
TSS
—
0.6
—
ms
TR = 10% to 90%
RDSon P-Channel
RDSon-P
—
500
—
m
IP = 100 mA
RDSon N-Channel
RDSon-N
—
500
—
m
IN = 100 mA
ILX
-1.0
±0.1
1.0
µA
SHDN = 0V, VIN = 5.5V,
LX = 0V, LX = 5.5V
+ILX(MAX)
—
860
—
mA
Note 6
Start Up Time
LX Pin Leakage Current
Positive Current Limit Threshold
Note 1:
2:
3:
4:
5:
6:
The input voltage should be greater then the output voltage plus headroom voltage; higher load currents
increase the input voltage required for regulation. MCP1603B device requires a minimum load for
regulation. See Section 2.0, Typical Performance Curves for typical operating voltage ranges.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
VR is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, JA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 2.7V to 5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
Operating Junction Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Thermal Resistance, 5L-TSOT
JA
—
207.4
—
°C/W Typical 4-layer Board with
Internal Ground Plane
Thermal Resistance, 8L-2x3 DFN
JA
—
68
—
°C/W Typical 4-layer Board with
Internal Ground Plane and
2-Vias in Thermal Pad
Temperature Ranges
Steady State
Transient
Package Thermal Resistances
DS22042B-page 6
2007-2012 Microchip Technology Inc.
MCP1603/B/L
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
50
49
48
47
46
45
44
43
42
41
40
52
VOUT = 1.8V
VIN = 3.6V
VIN = 4.2V
VIN = 3.0V
3 0V
Quiiescent Current (µA)
Quie
escent Current (µA)
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
48
46
5
44
42
TA = -40oC
2.7
20 35 50 65 80 95 110 125
Ambient Temperature
3.4
Quies
scent Current (mA)
VIN = 3.0V
3.1
3
VIN = 4.2V
2.8
2.7
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
VOUT = 1.8V
2.9
3.4
FIGURE 2-4:
(MCP1603/L).
3.3
3.2
3.05
(oC)
FIGURE 2-1:
PFM IQ vs. Ambient
Temperature (MCP1603/L).
Quies
scent Current (mA)
TA = +25oC
40
-40 -25 -10
VIN = 3.6V
2.6
2.5
PFM IQ vs. Input Voltage
VOUT = 1.8V
TA = +90oC
3.2
TA = +25oC
3
2.8
2.6
2.4
TA = -40oC
2.2
2
2.4
-40
-25
-10
5
20 35 50 65
Ambient Temperature (oC)
2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5
80
Input Voltage (V)
FIGURE 2-2:
PWM IQ vs. Ambient
Temperature (MCP1603B).
PWM IQ vs. Input Voltage
FIGURE 2-5:
(MCP1603B).
100
100
90
VOUT = 1.2V
95
80
IOUT = 100 mA
90
85
80
IOUT = 300 mA
75
IOUT = 500 mA
70
Efficiency (%)
E
Efficiency (%)
TA = +90oC
50
70
60
50
40
65
60
10
3.05
3.4
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
FIGURE 2-3:
(VOUT = 1.2V).
Efficiency vs. Input Voltage
2007-2012 Microchip Technology Inc.
VOUT = 1.2V
30
20
2.7
VIN = 3.6V
VIN = 2.7V
VIN = 4.2V
PFM/PWM
PWM Only
0
0.1
FIGURE 2-6:
(VOUT = 1.2V).
1
10
100
Output Current (mA)
1000
Efficiency vs. Output Load
DS22042B-page 7
MCP1603/B/L
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
0.6
100
Efficiency (%)
95
IOUT = 100 mA
90
85
IOUT = 300 mA
IOUT = 500 mA
80
75
VOUT = 1.8V
Lin
ne Regualtion (%/V)
VOUT = 1.8V
0.5
IOUT = 300 mA
0.4
0.3
IOUT = 100 mA
0.2
02
0.1
70
2.7
3.05
3.4
3.75
4.1
4.45
4.8
5.15
-40 -25 -10
5.5
Efficiency vs. Input Voltage
FIGURE 2-10:
Line Regulation vs. Ambient
Temperature (VOUT = 1.8V).
100
Output
O
Voltage (V)
70
60
50
VIN = 4.2V
40
30
VOUT = 1.8V
1 8V
20
PFM/PWM
PWM Only
10
TA = +90oC
1.80
1.79
1.78
TA = +25oC
TA = -40oC
1.77
1.76
1.75
1.74
0
1
FIGURE 2-8:
(VOUT = 1.8V).
10
100
Output Current (mA)
VOUT = 2.4V
IOUT = 100 mA
95
90
IOUT = 300 mA
IOUT = 500 mA
85
80
75
3
3.5
4
4.5
5
5.5
Input Voltage (V)
FIGURE 2-9:
(VOUT = 2.4V).
DS22042B-page 8
150
200
250
300
350
400
450
500
Output Current (mA)
Efficiency vs. Output Load
100
100
1000
Efficiency vs. Input Voltage
FIGURE 2-11:
Output Voltage vs. Load
Current (VOUT = 1.8V).
100
90
80
70
60
50
40
30
20
10
0
VIN = 2.7V
VIN = 3.6V
Efficiency (%)
E
0.1
Efficiency (%)
TA = +125oC
1.81
VIN = 3.6V
80
Efficiency (%)
E
1.82
VIN = 2.7V
90
20 35 50 65 80 95 110 125
Ambient Temperature (oC)
Input Voltage (V)
FIGURE 2-7:
(VOUT = 1.8V).
5
VIN = 4.2V
VOUT = 2.4V
2 4V
PFM/PWM
PWM Only
0.1
1
10
100
Output Current (mA)
1000
FIGURE 2-12:
PFM/PWM Efficiency vs.
Output Load (VOUT = 2.4V).
2007-2012 Microchip Technology Inc.
MCP1603/B/L
100.0
VOUT = 3.3V
97.5
Efficiency (%)
IOUT = 100 mA
IOUT = 300 mA
95.0
92.5
90.0
IOUT = 500 mA
87.5
85.0
3.5 3.75
4
4.25 4.5 4.75
5
Switch
hing Frequency (MHz)
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
2.20
2.15
2.10
2.05
2.00
1.95
5.25 5.5
-40 -25 -10 5 20 35 50 65 80 95 110 125
Ambient Temperature (oC)
Input Voltage (V)
FIGURE 2-13:
(VOUT = 3.3V).
Efficiency vs. Input Voltage
FIGURE 2-16:
Switching Frequency vs.
Ambient Temperature.
90
VIN = 3.6V
80
Efficiency (%)
E
70
60
50
VIN = 4.2V
40
30
VOUT = 3.3V
20
PFM/PWM
PWM Only
10
Switch
hing Frequency (MHz)
100
2.20
2.15
2.10
2.05
2 00
2.00
1.95
2.7
0
0.1
1
FIGURE 2-14:
(VOUT = 3.3V).
10
100
Output Current (mA)
3.4
Efficiency vs. Output Load
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
FIGURE 2-17:
Input Voltage.
10
Switching Frequency vs.
0.65
8
Regulation
7
6
TA= +25oC
5
4
TA=
-40oC
TA= +85oC
3
2
No Regulation
1
Swittch Resistance ()
9
Lo
oad Current (mA)
3.05
1000
0.60
0.55
0.50
N-Channel
P-Channel
0.45
0.40
0.35
0
2.7
1.8
2
2.2 2.4
2.6 2.8 3
VIN - VOUT (V)
3.2
FIGURE 2-15:
PWM-Only Device Minimum
Load for Regulation (MCP1603B).
2007-2012 Microchip Technology Inc.
3.05
3.4 3.6
3.4
3.75
4.1
4.45
4.8
5.15
5.5
Input Voltage (V)
FIGURE 2-18:
Voltage.
Switch Resistance vs. Input
DS22042B-page 9
MCP1603/B/L
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
Swittch Resistance ()
0.9
0.8
N-Channel
0.7
0.6
0.5
0.4
P-Channel
0.3
-40 -25 -10
5
20 35 50 65 80 95 110 125
Ambient Temperature (oC)
FIGURE 2-19:
Switch Resistance vs.
Ambient Temperature.
FIGURE 2-22:
PFM Light Load Switching
Waveforms (MCP1603/L).
FIGURE 2-20:
Waveform.
Output Voltage Startup
FIGURE 2-23:
Output Voltage Load Step
Response vs. Time.
FIGURE 2-21:
Waveform.
Heavy Load Switching
FIGURE 2-24:
Output Voltage Line Step
Response vs. Time.
DS22042B-page 10
2007-2012 Microchip Technology Inc.
MCP1603/B/L
Note: Unless otherwise indicated, MCP1603/L, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH,
VOUT(ADJ) = 1.8V, ILOAD = 100 mA, TA = +25°C. Adjustable or fixed output voltage options can be used to generate the
Typical Performance Characteristics.
VLx = 2 V/div
VOUT = 50 mV/div, AC
IOUT = 5 mA
IL = 20 mA/div
0.4 µs/div
FIGURE 2-25:
PWM Light Load Switching
Waveforms (MCP1603B).
2007-2012 Microchip Technology Inc.
DS22042B-page 11
MCP1603/B/L
NOTES:
DS22042B-page 12
2007-2012 Microchip Technology Inc.
MCP1603/B/L
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP1603/B
TSOT-23
MCP1603L
TSOT-23
MCP1603
2 x 3 DFN
1
4
7
VIN
2
2
8
GND
3
1
3
SHDN
4
5
4
VFB/VOUT
5
3
1
LX
Switch Node, Buck Inductor Connection Pin
3.1
Symbol
Shutdown Control Input Pin
Feedback / Output Voltage Pin
—
2, 5, 6
NC
No Connect
—
—
Exposed
Pad
EP
For the DFN package, the center exposed pad is a thermal
path to remove heat from the device. Electrically, this pad is
at ground potential and should be connected to GND.
Power Supply Input Voltage Pin
(VIN)
Ground Pin (GND)
Ground pin for the device. The loop area of the ground
traces should be kept as minimal as possible.
3.3
Power Supply Input Voltage Pin
Ground Pin
—
Connect the input voltage source to VIN. The input
source must be decoupled to GND with a 4.7 µF
capacitor.
3.2
Description
Shutdown Control Input Pin
(SHDN)
The SHDN pin is a logic-level input used to enable or
disable the device. A logic high (>45% of VIN) will
enable the regulator output. A logic low (
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