MCP1630-E/MSVAO

MCP1630/MCP1630V High-Speed, Microcontroller-Adaptable, Pulse Width Modulator Features Description • High-Speed PWM Operation (12 ns Current Sense to Output Delay) • Operating Temperature Range: - -40°C to +125°C • Precise Peak Current Limit (±5%) (MCP1630) • Voltage Mode and Average Current Mode Control (MCP1630V) • CMOS Output Driver (drives MOSFET driver or low-side N-channel MOSFET directly) • External Oscillator Input (from PIC® Microcontroller (MCU)) • External Voltage Reference Input (for adjustable voltage or current output application) • Peak Current Mode Operation > 1 MHz • Low Operating Current: 2.8 mA (typ.) • Fast Output Rise and Fall Times: 5.9 ns and 6.2 ns • Undervoltage Lockout (UVLO) Protection • Output Short Circuit Protection • Overtemperature Protection The MCP1630/V is a high-speed Pulse Width Modulator (PWM) used to develop intelligent power systems. When used with a microcontroller unit (MCU), the MCP1630/V will control the power system duty cycle to provide output voltage or current regulation. The MCU can be used to adjust output voltage or current, switching frequency, maximum duty cycle and other features that make the power system more intelligent. Applications • • • • • • Intelligent Power Systems Smart Battery Charger Applications Multiple Output/Multiple Phase Converters Output Voltage Calibration AC Power Factor Correction VID Capability (programmed and calibrated by PIC® microcontroller) • Buck/Boost/Buck-Boost/SEPIC/Flyback/Isolated Converters • Parallel Power Supplies Related Literature • “MCP1630 NiMH Demo Board User’s Guide”, Microchip Technology Inc., DS51505, 2004 • “MCP1630 Low-Cost Li-Ion Battery Charger User’s Guide”, Microchip Technology Inc., DS51555, 2005 • “MCP1630 Li-Ion Multi-Bay Battery Charger User’s Guide”, Microchip Technology Inc., DS51515, 2005 • “MCP1630 Dual Buck Demo Board User’s Guide”, Microchip Technology Inc., DS51531, 2005  2004-2013 Microchip Technology Inc. Typical applications include smart battery chargers, intelligent power systems, brick dc/dc converters, ac power-factor correction, multiple output power supplies, multi-phase power supplies and more. The MCP1630/V inputs were developed to be easily attached to the I/O of a MCU. The MCU supplies the oscillator and reference to the MCP1630/V to provide the most flexible and adaptable power system. The power system switching frequency and maximum duty cycle are set using the I/O of the MCU. The reference input can be external, a D/A Converter (DAC) output or as simple as an I/O output from the MCU. This enables the power system to adapt to many external signals and variables in order to optimize performance and facilitate calibration. When operating in Current mode, a precise limit is set on the peak current. With the fast comparator speed (typically 12 ns), the MCP1630 is capable of providing a tight limit on the maximum switch current over a wide input voltage range when compared to other high-speed PWM controllers. For Voltage mode or Average Current mode applications, the MCP1630V provides a larger range for the external ramp voltage. Additional protection features overtemperature and overcurrent. include: UVLO, Package Type 8-Lead DFN (2 mm x 3 mm) 8-Lead MSOP COMP 1 8 VREF COMP 1 FB 2 FB 2 CS 3 7 VIN 6 VEXT CS 3 6 VEXT OSC IN 4 5 GND OSC IN 4 5 GND 8 VREF 7 VIN DS21896C-page 1 MCP1630/MCP1630V Functional Block Diagram – MCP1630 MCP1630 High-Speed PWM VIN Overtemperature 0.1 µA VIN UVLO VEXT OSC IN Note S VIN GND Q 0.1 µA 100 k CS + Comp – COMP R VIN Q Latch Truth Table FB – VREF EA + 2R R 2.7V Clamp Note: DS21896C-page 2 S R Q 0 0 Qn 0 1 1 1 0 0 1 1 1 During overtemperature, VEXT driver is high-impedance.  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V Functional Block Diagram – MCP1630V MCP1630V High-Speed PWM VIN Overtemperature 0.1 µA VIN UVLO VEXT OSC IN Note S VIN GND Q 0.1 µA 100 k CS + Comp – COMP R VIN FB VREF Latch Truth Table – EA + 2.7V Clamp Note: Q S R Q 0 0 Qn 0 1 1 1 0 0 1 1 1 During overtemperature, VEXT driver is high-impedance.  2004-2013 Microchip Technology Inc. DS21896C-page 3 MCP1630/MCP1630V Typical Application Circuit – MCP1630 MCP1630 NiMH Battery Charger and Fuel Gauge Application Diagram CC +VBATT SEPIC Converter +8V to +15V Input Voltage 4 NiMH Cells +5V Bias COUT Cin MCP1630 VIN 5.7V COMP VEXT FB OSC IN CS VREF GND +VBATT 1:1 N-channel MOSFET IBATT ISW +5V Bias + 3V 0V PIC16LF818 PWM OUT VDD MCP1700 3.0V SOT23 VDD A/D 1/2 MCP6042 + VDD I2C™ To System + A/D 1/2 MCP6042 DS21896C-page 4  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V Typical Application Circuit - MCP1630V Bidirectional Power Converter/Battery Charger for 4-Series Cell Li-Ion Batteries 4-Cell Li-Ion Battery Pack Bidirectional Buck/Boost Boost Buck Battery Protection Switches Buck Switch L + Fuse + CIN Boost Switch + DC Bus Voltage PS501 +VBATT COUT – SMBus VSENSE Sync. FET Driver Battery Protection and Monitor -VBATT GND RSENSE 0V to 2.7V ISENSE MCP1630V +2.5 VREF CompVREF VIN FB CS VEXT OSC GND Charge Current Loop (1/2) MCP6021 +DC Bus VREF + (1/2) MCP6021 – + – PIC16F88 DC bus Voltage Loop SMBus IREF Voltage (PWM) Filter + – (1/2) MCP6021  2004-2013 Microchip Technology Inc. DS21896C-page 5 MCP1630/MCP1630V 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VDD...................................................................................6.0V Maximum Voltage on Any Pin .. (VGND - 0.3)V to (VIN + 0.3)V VEXT Short Circuit Current ...........................Internally Limited Storage temperature .....................................-65°C to +150°C Maximum Junction Temperature, TJ ........................... +150°C Continuous Operating Temperature Range ..-40°C to +125°C ESD protection on all pins, HBM 3 kV AC/ AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical values = 5.0V, TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Input Operating Voltage VIN 3.0 — 5.5 V Input Quiescent Current I(VIN) — 2.8 4.5 mA IEXT = 0 mA, FOSC IN = 0 Hz External Oscillator Range FOSC — — 1 MHz Note 1 Min. Oscillator High Time Min. Oscillator Low Time TOH_MIN TOL_MIN — 10 Input Voltage Oscillator Input ns Oscillator Rise Time TRISE 0.01 — 10 µs Note 2 Oscillator Fall Time TFALL 0.01 — 10 µs Note 2 VL — — 0.8 V Oscillator Input Voltage High VH 2.0 — — Oscillator Input Capacitance COSC Oscillator Input Voltage Low 5 V pf External Reference Input Reference Voltage Input VREF 0 — VIN V Note 2, Note 3 Error Amplifier Input Offset Voltage Error Amplifier PSRR Common Mode Input Range VOS -4 0.1 +4 mV PSRR 80 99 — dB VIN = 3.0V to 5.0V, VCM = 1.2V VCM GND - 0.3 — VIN V Note 2, Note 3 — 80 — dB VIN = 5V, VCM = 0V to 2.5V AVOL 85 95 — dB RL = 5 k to VIN/2, 100 mV < VEAOUT < VIN - 100 mV, VCM = 1.2V Common Mode Rejection Ratio Open-loop Voltage Gain Low-level Output Gain Bandwidth Product Error Amplifier Sink Current Error Amplifier Source Current Note 1: 2: 3: VOL — 25 GND + 50 mV RL = 5 k to VIN/2 GBWP — 3.5 — MHz VIN = 5V ISINK 5 11 — mA VIN = 5V, VREF = 1.2V, VFB = 1.4V, VCOMP = 2.0V ISOURCE -2 -9 — mA VIN = 5V, VREF = 1.2V, VFB = 1.0V, VCOMP = 2.0V, Absolute Value Capable of higher frequency operation depending on minimum and maximum duty cycles needed. External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum values. Not production tested. The reference input of the internal amplifier is capable of rail-to-rail operation. DS21896C-page 6  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical values = 5.0V, TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Maximum Current Sense Signal MCP1630 VCS_MAX 0.85 0.9 0.95 V Delay From CS to VEXT MCP1630 TCS_VEXT — 12 25 ns Maximum Current Sense Signal MCP1630V VCS_MAX 2.55 2.7 2.85 V Delay From CS to VEXT MCP1630V TCS_VEXT — 17.5 35 ns Minimum Duty Cycle DCMIN — — 0 % VFB = VREF + 0.1V, VCS = GND Current Sense Input Bias Current ICS_B — -0.1 — µA VIN = 5V RDSON P-channel RDSon_P — 10 30  RDSON N-channel RDSon_N — 7 30  VEXT Rise Time TRISE — 5.9 18 ns CL = 100 pF Typical for VIN = 3V VEXT Fall Time TFALL — 6.2 18 ns CL = 100 pF Typical for VIN = 3V UVLO 2.7 — 3.0 V VIN falling, VEXT low state when in UVLO mV Current Sense Input Set by maximum error amplifier clamp voltage, divided by 3. VIN > 4.25V Maximum CS input range limited by comparator input common mode range. VCS_MAX = VIN-1.4V Internal Driver Protection Features Under Voltage Lockout Under Voltage Lockout Hysteresis UVLO HYS 50 75 150 Thermal Shutdown TSHD — 150 — °C TSHD_HYS — 18 — °C Thermal Shutdown Hysteresis Note 1: 2: 3: Capable of higher frequency operation depending on minimum and maximum duty cycles needed. External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum values. Not production tested. The reference input of the internal amplifier is capable of rail-to-rail operation. TEMPERATURE SPECIFICATIONS Electrical Specifications: VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA = -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Operating Junction Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Thermal Resistance, 8L-DFN (2 mm x 3 mm) JA — 50.8 — °C/W Typical 4-layer board with two interconnecting vias Thermal Resistance, 8L-MSOP JA — 208 — °C/W Typical 4-layer board Steady state Transient Thermal Package Resistances  2004-2013 Microchip Technology Inc. DS21896C-page 7 MCP1630/MCP1630V 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. TA = + 25°C 0 Input Voltage (V) TA = - 40°C TA = + 25°C 5M 0 10M 10000000 Frequency (Hz) FIGURE 2-3: Response. DS21896C-page 8 Error Amplifier Frequency 5.5 5.25 5 4.75 4.5 -14 5.5 -14 1M 1000000 TA = - 40°C -12 5.25 -12 -10 5 50 4.75 Phase TA = + 25°C -8 4.5 -10 TA = + 125°C -6 4.25 100 -8 -4 4 -6 150 3.5 -4 200 VREF = 2V RLOAD = 4.7 k CLOAD = 67 pF 0 3.25 Amplifier Gain (db) -2 Error Amplifier Sink Current -2 3 250 Gain 0 FIGURE 2-5: vs. Input Voltage. Amplifier Source Current (mA) Input Quiescent Current vs. Amplifier Phase Shift (degrees) 2 4.25 Input Voltage (V) Input Voltage (V) FIGURE 2-2: Input Voltage. 4 TA = + 125°C 3.75 5.5 5.25 5 4.75 4.5 4.25 4 3.75 3.5 TA = + 25°C 18 16 14 12 10 8 6 4 2 0 3.5 TA = + 125°C 3 FOSC IN = 1 MHz 3.25 FIGURE 2-4: Error Amplifier Input Bias Current vs. Input Voltage. 3.25 Input Quiescent Current vs. TA = - 40°C 5.5 Input Voltage (V) Amplifier Sink Current (mA) 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 3 VIN Quiescent Current (mA) FIGURE 2-1: Input Voltage. 5.25 -100 5 TA = - 40°C 4.5 5.5 5.25 5 4.75 4.5 4.25 4 3.75 3.25 3.5 0 TA = + 85°C 100 4.75 0.5 200 4.25 1 300 4 1.5 400 3.75 TA = + 25°C TA = + 125°C 500 3.75 TA = - 40°C 2 VCM = VIN 600 3.5 2.5 700 3.25 TA = + 125°C 3 3 FOSC IN = DC Amplifier Input Bias Current (pA) 3.5 3 VIN Quiescent Current (mA) Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical values = 5.0V, TA = -40°C to +125°C. Input Voltage (V) FIGURE 2-6: Error Amplifier Source Current vs. Input Voltage.  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V 10 9 8 7 6 5 4 3 2 1 0 0.9 CS Clamp Voltage (V) CL = 100 pF TA = + 125°C TA = - 40°C TA = + 25°C TA = - 40°C 0.899 0.898 TA = + 125°C 0.897 TA = + 25°C 0.896 Input Voltage (V) VEXT Rise Time vs. Input UVLO Threshold (V) TA = - 40°C 5.5 Turn Off Threshold 2.86 2.84 Input Voltage (V) FIGURE 2-9: Current Sense to VEXT Delay vs. Input Voltage (MCP1630). TA = + 125°C 8 6 TA = + 25°C 4 TA = - 40°C 2 5.5 5.25 5 4.75 0 4.5 5.5 5.25 5 4.75 4.5 4.25 4 3.75 3.5 0 10 4.25 5 12 4 TA = - 40°C Undervoltage Lockout vs. 3.75 15 3.25 FIGURE 2-11: Temperature. 3 TA = + 125°C 3 5.5 2.88 EXT Output N-Channel R DSON (ohms) 25 CS to V EXT delay (ns) 5.25 2.90 -40 -25 -10 5 20 35 50 65 80 95 110 125 Ambient Temperature (°C) VEXT Fall Time vs. Input  2004-2013 Microchip Technology Inc. 5 2.92 Input Voltage (V) TA = + 25°C Turn On Threshold 2.94 3.5 5.25 5 4.75 4.5 4.25 4 3.75 3.5 3.25 TA = + 25°C 10 4.75 2.96 TA = + 125°C 20 4.5 FIGURE 2-10: Current Sense Clamp Voltage vs. Input Voltage (MCP1630). CL = 100 pF FIGURE 2-8: Voltage. 4.25 Input Voltage (V) 3.25 9 8 7 6 5 4 3 2 1 0 3 VEXT Fall Time (ns) FIGURE 2-7: Voltage. 4 3.75 3.5 3.25 3 5.5 5.25 5 4.75 4.5 4.25 4 3.75 3.5 3.25 0.895 3 VEXT Rise Time (ns) Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical values = 5.0V, TA = -40°C to +125°C. Input Voltage (V) FIGURE 2-12: EXT Output N-channel RDSON vs. Input Voltage. DS21896C-page 9 MCP1630/MCP1630V 18 Maximum CS Input (V) 3 16 14 TA = + 125°C 12 10 8 6 TA = - 40°C TA = + 25°C 4 2 CS Common Mode Input Range 2.7 TA = +25°C 2.4 2.1 1.8 1.5 5.5 5 5.25 4.75 4.5 4.25 4 3.75 3.25 3.5 0 3 3 3.5 4 Input Voltage (V) 5 5.5 FIGURE 2-16: Current Sense Common Mode Input Voltage Range vs. Input Voltage (MCP1630V). 0 30 CS to VEXT Delay (ns) TA = + 125°C -50 VCM IN = 0V -100 -150 TA = + 25°C -200 25 TA = +125°C 20 TA = -40°C 15 TA = +25°C 10 5 TA = - 40°C 5.5 5.25 5 4.75 4.5 4 3.75 3.5 3.25 5.5 5.25 5 4.75 4.5 4.25 4 3.75 3.5 3.25 3 0 -250 3 Error Amp Input Offset Voltage (µV) FIGURE 2-13: EXT Output P-channel RDSON vs. Input Voltage. Input Voltage (V) Input Voltage (V) FIGURE 2-14: Error Amplifier Input Offset Voltage vs. Input Voltage. FIGURE 2-17: Current Sense to VEXT Delay vs. Input Voltage (MCP1630V). 150 TA = + 125°C 100 50 VCM IN = 1.2V 0 -50 -100 TA = + 25°C -150 TA = - 40°C 5.5 5.25 5 4.75 4.5 4.25 4 3.75 3.5 3.25 -200 3 Error Amp Input Offset Voltage (µV) 4.5 Input Voltage (V) 4.25 EXT Output P-Channel R DSON (Ohms) Note: Unless otherwise noted, VIN = 3.0V to 5.5V, FOSC = 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typical values = 5.0V, TA = -40°C to +125°C. Input Voltage (V) FIGURE 2-15: Error Amplifier Input Offset Voltage vs. Input Voltage. DS21896C-page 10  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V 3.0 MCP1630 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE DFN/MSOP Name 1 COMP 2 FB Error Amplifier Inverting Input 3 CS Current Sense Input pin (MCP1630) or Voltage Ramp Input pin (MCP1630V) 4 OSC IN Oscillator Input pin 5 GND Circuit Ground pin 6 VEXT External Driver Output pin 7 VIN 8 VREF 3.1 Function Error Amplifier Output pin Input Bias pin Reference Voltage Input pin Error Amplifier Output Pin (COMP) COMP is an internal error amplifier output pin. External compensation is connected from the FB pin to the COMP pin for control-loop stabilization. An internal voltage clamp is used to limit the maximum COMP pin voltage to 2.7V (typ.). This clamp is used to set the maximum peak current in the power system switch by setting a maximum limit on the CS input for Peak Current mode control systems. 3.2 Error Amplifier Inverting Input (FB) FB is an internal error amplifier inverting input pin. The output (voltage or current) is sensed and fed back to the FB pin for regulation. Inverting or negative feedback is used. 3.3 Current Sensing Input (CS) CS is the current sense input pin used for cycle-bycycle control for Peak Current mode converters. The MCP1630 is typically used for sensed current applications to reduce the current sense signal, thus reducing power dissipation. For Voltage mode or Average Current mode applications, a ramp is used to compare the error amplifier output voltage with producing the PWM duty cycle. For applications that require higher signal levels, the MCP1630V is used to increase the level from a maximum of 0.9V (MCP1630) to 2.7V (MCP1630V). The common mode voltage range for the MCP1630V CS input is VIN-1.4V. For normal PWM operation, the CS input should be less than or equal to VIN - 1.4V at all times. 3.4 Oscillator Input (OSC) OSC is an external oscillator input pin. Typically, a microcontroller I/O pin is used to generate the OSC input. When high, the output driver pin (VEXT) is driven  2004-2013 Microchip Technology Inc. low. The high-to-low transition initiates the start of a new cycle. The duty cycle of the OSC input pin determines the maximum duty cycle of the power converter. For example, if the OSC input is low for 75% of the time and high for 25% of the time, the duty cycle range for the power converter is 0% to 75% maximum. 3.5 Ground (GND) Connect the circuit ground to the GND pin. For most applications, this should be connected to the analog or quiet ground plane. Noise on this ground can affect the sensitive cycle-by-cycle comparison between the CS input and the error amplifier output. 3.6 External Driver Output Pin (VEXT) VEXT is an external driver output pin, used to determine the power system duty cycle. For high-power or highside drives, this output should be connected to the logiclevel input of the MOSFET driver. For low-power, lowside applications, the VEXT pin can be used to directly drive the gate of an N-channel MOSFET. 3.7 Input Bias Pin (VIN) VIN is an input voltage pin. Connect the input voltage source to the VIN pin. For normal operation, the voltage on the VIN pin should be between +3.0V and +5.5V. A 0.1 µF bypass capacitor should be connected between the VIN pin and the GND pin. 3.8 Reference Voltage Input (VREF) VREF is an external reference input pin used to regulate the output of the power system. By changing the VREF input, the output (voltage or current) of the power system can be changed. The reference voltage can range from 0V to VIN (rail-to-rail). DS21896C-page 11 MCP1630/MCP1630V 4.0 DETAILED DESCRIPTION 4.1 Device Overview The MCP1630 is comprised of a high-speed comparator, high-bandwidth amplifier and logic gates that can be combined with a PIC MCU to develop an advanced programmable power supply. The oscillator and reference voltage inputs are generated by the PIC MCU so that switching frequency, maximum duty cycle and output voltage are programmable. Refer to Figure 4-1. 4.2 PWM The VEXT output of the MCP1630/V is determined by the output level of the internal high-speed comparator and the level of the external oscillator. When the oscillator level is high, the PWM output (VEXT) is forced low. When the external oscillator is low, the PWM output is determined by the output level of the internal highspeed comparator. During UVLO, the VEXT pin is held in the low state. During overtemperature operation, the VEXT pin is high-impedance (100 k to ground). 4.3 Normal Cycle by Cycle Control The beginning of a cycle is defined when OSC IN transitions from a high state to a low state. For normal operation, the state of the high-speed comparator output (R) is low and the Q output of the latch is low. On the OSC IN high-to-low transition, the S and R inputs to the high-speed latch are both low and the Q output will remain unchanged (low). The output of the OR gate (VDRIVE) will transition from a high state to a low state, turning on the internal P-channel drive transistor in the output stage of the PWM. This will change the PWM output (VEXT) from a low state to a high state, turning on the power-train external switch and ramping current in the power-train magnetic device. The sensed current in the magnetic device is fed into the CS input (shown as a ramp) and increases linearly. Once the sensed current ramp (MCP1630) reaches the same voltage level as 1/3 of the EA output, the comparator output (R) changes states (low-to-high) and resets the PWM latch. The Q output transitions from a low state to a high state, turning on the N-channel MOSFET in the output stage, which turns off the VEXT drive to the external MOSFET driver terminating the duty cycle. The OSC IN will transition from a low state to a high state while the VEXT pin remains unchanged. If the CS input ramp had never reached the same level as 1/3 of the error amplifier output, the low-to-high transition on OSC IN would terminate the duty cycle and this would be considered maximum duty cycle. In either case, while OSC IN is high, the VEXT drive pin is low, turning off the external power-train switch. The next cycle will start on the transition of the OSC IN pin from a high state to a low state. DS21896C-page 12 For Voltage mode or Average Current mode applications that utilize a large signal ramp at the CS input, the MCP1630V is used to provide more signal (2.7V typ.). The operation of the PWM does not change. 4.4 Error Amp/Comparator Current Limit Function The internal amplifier is used to create an error output signal that is determined by the external VREF input and the power supply output fed back into the FB pin. The error amplifier output is rail-to-rail and clamped by a precision 2.7V. The output of the error amplifier is then divided down 3:1 (MCP1630) and connected to the inverting input of the high-speed comparator. Since the maximum output of the error amplifier is 2.7V, the maximum input to the inverting pin of the high-speed comparator is 0.9V. This sets the peak current limit for the switching power supply. For the MCP1630V, the maximum error amplifier output is still 2.7V. However, the resistor divider is removed, raising the maximum input signal level at the high-speed comparator inverting input (CS) to 2.7V. As the output load current demand increases, the error amplifier output increases, causing the inverting input pin of the high-speed comparator to increase. Eventually, the output of the error amplifier will hit the 2.7V clamp, limiting the input of the high-speed comparator to 0.9V max (MCP1630). Even if the FB input continues to decrease (calling for more current), the inverting input is limited to 0.9V. By limiting the inverting input to 0.9V, the current-sense input (CS) is limited to 0.9V, thus limiting the output current of the power supply. For Voltage mode control, the error amplifier output will increase as input voltage decreases. A voltage ramp is used instead of sensed inductor current at the CS input of the MCP1630V. The 3:1 internal error amplifier output resistor divider is removed in the MCP1630V option to increase the maximum signal level input to 2.7V (typ.). 4.5 0% Duty Cycle Operation The duty cycle of the VEXT output is capable of reaching 0% when the FB pin is held higher than the VREF pin (inverting error amplifier). This is accomplished by the rail-to-rail output capability of the error amplifier and the offset voltage of the high-speed comparator. The minimum error amplifier output voltage, divided by three, is less than the offset voltage of the high-speed comparator. In the case where the output voltage of the converter is above the desired regulation point, the FB input will be above the VREF input and the error amplifier will be pulled to the bottom rail (GND). This low voltage is divided down 3:1 by the 2R and 1R resistor (MCP1630) and connected to the input of the highspeed comparator. This voltage will be low enough so that there is no triggering of the comparator, allowing narrow pulse widths at VEXT.  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V 4.6 Undervoltage Lockout (UVLO) When the input voltage (VIN) is less than the UVLO threshold, the VEXT is held in the low state. This will ensure that, if the voltage is not adequate to operate the MCP1630/V, the main power supply switch will be held in the off state. When the UVLO threshold is exceeded, there is some hysteresis in the input voltage prior to the UVLO off threshold being reached. The typical hysteresis is 75 mV. Typically, the MCP1630 will not start operating until the input voltage at VIN is between 3.0V and 3.1V.  2004-2013 Microchip Technology Inc. 4.7 Overtemperature Protection To protect the VEXT output if shorted to VIN or GND, the MCP1630/V VEXT output will be high-impedance if the junction temperature is above the thermal shutdown threshold. There is an internal 100 k pull-down resistor connected from VEXT to ground to provide some pull-down during overtemperature conditions. The protection is set to 150°C (typ.), with a hysteresis of 18°C. DS21896C-page 13 MCP1630/MCP1630V MCP1630 High-Speed PWM Timing Diagram OSC IN S COMP CS R Q VDRIVE VEXT VIN VIN Overtemperature 0.1 µA UVLO VEXT OSC IN Note S VIN GND Q 0.1 µA 100 k CS + Comp – COMP R Q Latch Truth Table VIN FB – VREF EA + 2R R 2.7V Clamp Note: FIGURE 4-1: DS21896C-page 14 S R Q 0 0 Qn 0 1 1 1 0 0 1 1 1 During overtemperature, VEXT driver is high-impedance. Cycle-by-Cycle Timing Diagram (MCP1630).  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V MCP1630V High-Speed PWM Timing Diagram OSC IN S COMP CS R Q VDRIVE VEXT VIN VIN Overtemperature 0.1 µA UVLO VEXT OSC IN VDRIVE Note S VIN GND Q 0.1 µA 100 k CS + Comp – COMP R Q Latch Truth Table VIN FB VREF – EA + 2.7V Clamp Note: During overtemperature, VEXT driver is high-impedance. FIGURE 4-2: Cycle-by-Cycle Timing Diagram (MCP1630V).  2004-2013 Microchip Technology Inc. S R Q 0 0 Qn 0 1 1 1 0 0 1 1 1 DS21896C-page 15 MCP1630/MCP1630V 5.0 5.1 APPLICATION CIRCUITS/ISSUES Typical Applications The MCP1630/V high-speed PWM can be used for any circuit topology and power-train application when combined with a microcontroller. Intelligent, costeffective power systems can be developed for applications that require multiple outputs, multiple phases, adjustable outputs, temperature monitoring and calibration. 5.2 NiMH Battery Charger Application A typical NiMH battery charger application is shown in the “Typical Application Circuit – MCP1630” of this data sheet. In that example, a Single-Ended Primary Inductive Converter (SEPIC) is used to provide a constant charge current to the series-connected batteries. The MCP1630 is used to regulate the charge current by monitoring the current through the battery sense resistor and providing the proper pulse width. 5.3 Bidirectional Power Converter A bidirectional Li-Ion charger/buck regulator is shown in the “Typical Application Circuit” of the this data sheet. In this example, a synchronous, bidirectional power converter example is shown using the MCP1630V. In this application, when the ac-dc input power is present, the bidirectional power converter is used to charge 4-series Li-Ion batteries by boosting the input voltage. When ac-dc power is removed, the bidirectional power converter bucks the battery voltage down to provide a dc bus for system power. By using this method, a single power train is capable of charging 4-series cell Li-Ion batteries and efficiently converting the battery voltage down to a low, usable voltage. 5.4 Multiple Output Converters By using additional MCP1630 devices, multiple output converters can be developed using a single MCU. If a two-output converter is desired, the MCU can provide two PWM outputs that are phased 180° apart. This will reduce the input ripple current to the source and eliminate beat frequencies. The PIC16F818 monitors the battery voltage to provide a termination to the charge current. Additional features (trickle charge, fast charge, overvoltage protection, etc.) can be added to the system using the programmability of the microcontroller and the flexibility of the MCP1630. DS21896C-page 16  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 1630E 522256 8-Lead MSOP XXXXX YWWNNN Example: 1630VE 522256 8-Lead DFN (2 mm x 3 mm) XXX YWW NN Example: ABC 522 25 For DFN samples, contact your Microchip Sales Office for availability.. Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2004-2013 Microchip Technology Inc. DS21896C-page 17 MCP1630/MCP1630V 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D 2 B n 1 α A2 A c φ A1 (F) L β Units Dimension Limits n p MIN INCHES NOM 8 .026 BSC .033 .193 TYP. .118 BSC .118 BSC .024 .037 REF .006 .012 - MAX MILLIMETERS* NOM 8 0.65 BSC 0.75 0.85 0.00 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.95 REF 0° 0.08 0.22 5° 5° - MIN Number of Pins Pitch A .043 Overall Height .037 A2 Molded Package Thickness .030 A1 .006 Standoff .000 E Overall Width E1 Molded Package Width D Overall Length L Foot Length .016 .031 Footprint (Reference) F φ Foot Angle 0° 8° c Lead Thickness .003 .009 B Lead Width .009 .016 α Mold Draft Angle Top 5° 15° β Mold Draft Angle Bottom 5° 15° *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 15° 15° JEDEC Equivalent: MO-187 Drawing No. C04-111 DS21896C-page 18  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V 8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging For DFN samples, contact your Microchip Sales Office for availability.. p D b n L E E2 EXPOSED METAL PAD PIN 1 ID INDEX AREA (NOTE 2) 2 1 D2 BOTTOM VIEW TOP VIEW A A1 A3 EXPOSED TIE BAR (NOTE 1) Units Dimension Limits n p Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width Contact Width Contact Length (Note 3) (Note 3) A A1 A3 D D2 E E2 b L MIN INCHES NOM MAX 8 .031 .000 .055 .047 .008 .012 .020 BSC .035 .001 .008 REF. .079 BSC .065 .118 BSC .059 .010 .016 MILLIMETERS* NOM 8 0.50 BSC 0.80 0.90 0.00 0.02 0.20 REF. 2.00 BSC 1.65 1.39 3.00 BSC 1.50 1.20 0.20 0.25 0.30 0.40 MIN .039 .002 .067 .061 .012 .020 MAX 1.00 0.05 1.70 1.55 0.30 0.50 *Controlling Parameter Notes: 1. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M 2. REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M Exposed pad varies according to die attach paddle size. Package may have one or more exposed tie bars at ends. Pin 1 visual index feature may vary, but must be located within the hatched area. JEDEC equivalent: M0-229 Drawing No. C04-123, Revised 05-05-05  2004-2013 Microchip Technology Inc. DS21896C-page 19 MCP1630/MCP1630V NOTES: DS21896C-page 20  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V APPENDIX A: REVISION HISTORY Revision C (January 2013) • Added a note to each package outline drawing. Revision B (June 2005) The following is the list of modifications: 1. 2. 3. Added MCP1630V device information throughout data sheet Added DFN package information throughout data sheet. Added Appendix A: Revision History. Revision A (June 2004) • Original Release of this Document.  2004-2013 Microchip Technology Inc. DS21896C-page 21 MCP1630/MCP1630V NOTES: DS21896C-page 22 l  2004-2013 Microchip Technology Inc. MCP1630/MCP1630V PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X /XX Device Temperature Range Package Device: MCP1630: High-Speed, Microcontroller-Adaptable, PWM MCP1630T: High-Speed, Microcontroller-Adaptable, PWM (Tape and Reel) Examples: a) b) c) a) Temperature Range: E = -40°C to +125°C Package: MC *= Dual Flat, No Lead (2x3mm Body), 8-lead MS = Plastic MSOP, 8-lead b) c) MCP1630-E/MS: Extended Temperature, 8LD MSOP package. MCP1630T-E/MS: Tape and Reel Extended Temperature, 8LD MSOP package. MCP1630-E/MC: Extended Temperature, 8LD DFN package. MCP1630V-E/MS: Extended Temperature, 8LD MSOP package. MCP1630VT-E/MS: Tape and Reel Extended Temperature, 8LD MSOP package. MCP1630V-E/MC: Extended Temperature, 8LD DFN package. * For DFN samples, contact your Microchip Sales Office for availability.  2004-2013 Microchip Technology Inc. DS21896C-page 23 MCP1630/MCP1630V NOTES: DS21896C-page 24  2004-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2004-2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620769140 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2004-2013 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS21896C-page 25 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 China - Hangzhou Tel: 86-571-2819-3187 Fax: 86-571-2819-3189 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Kaohsiung Tel: 886-7-213-7828 Fax: 886-7-330-9305 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 DS21896C-page 26 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 11/29/12  2004-2013 Microchip Technology Inc.