MCP16312-E/MS

MCP16311/2 30V Input, 1A Output, High-Efficiency, Integrated Synchronous Switch Step-Down Regulator Features General Description • • • • • • The MCP16311/2 is a compact, high-efficiency, fixed frequency, synchronous step-down DC-DC converter in an 8-pin MSOP, or 2 x 3 mm TDFN package that operates from input voltage sources up to 30V. Integrated features include a high-side and a low-side switch, fixed frequency peak current mode control, internal compensation, peak current limit and overtemperature protection. The MCP16311/2 provides all the active functions for local DC-DC conversion, with fast transient response and accurate regulation. • • • • • • • • • • • Up to 95% Efficiency Input Voltage Range: 4.4V to 30V 1A Output Current Capability Output Voltage Range: 2.0V to 24V Passes Automotive AEC-Q100 Reliability Testing Integrated N-Channel High-Side and Low-Side Switches: - 170 m, Low Side - 300 m, High Side Stable Reference Voltage: 0.8V Automatic Pulse Frequency Modulation/PulseWidth Modulation (PFM/PWM) Operation (MCP16311): - PFM Operation Disabled (MCP16312) - PWM Operation: 500 kHz Low Device Shutdown Current: 3 µA Typical Low Device Quiescent Current: - 44 µA (Non-switching, PFM Mode) Internal Compensation Internal Soft-Start: 300 µs (EN Low-to-High) Peak Current Mode Control Cycle-by-Cycle Peak Current Limit Undervoltage Lockout (UVLO): - 4.1V typical to start - 3.6V typical to stop Overtemperature Protection Thermal Shutdown: - +150°C - +25°C Hysteresis Applications • • • • • • • • • • • • PIC®/dsPIC® Microcontroller Bias Supply 24V Industrial Input DC-DC Conversion General Purpose DC-DC Conversion Local Point of Load Regulation Automotive Battery Regulation Set-Top Boxes Cable Modems Wall Transformer Regulation Laptop Computers Networking Systems AC-DC Digital Control Bias Distributed Power Supplies  2013-2021 Microchip Technology Inc. and its subsidiaries High converter efficiency is achieved by integrating the current-limited, low-resistance, high-speed high-side and low-side switches and associated drive circuitry. The MCP16311 is capable of running in PFM/PWM mode. It switches in PFM mode for light load conditions and for large buck conversion ratios. This results in a higher efficiency over all load ranges. The MCP16312 runs in PWM-only mode, and is recommended for noise-sensitive applications. The MCP16311/2 can supply up to 1A of continuous current while regulating the output voltage from 2V to 12V. An integrated, high-performance peak current mode architecture keeps the output voltage tightly regulated, even during input voltage steps and output current transient conditions common in power systems. The EN input is used to turn the device on and off. While off, only a few micro amps of current are consumed from the input. Output voltage is set with an external resistor divider. The MCP16311/2 is offered in small MSOP-8 and 2 mm x 3 mm TDFN surface mount packages. Passes automotive AEC-Q100 reliability testing. Package Type MCP16311/2 MSOP VFB 1 VCC 2 EN 3 VIN 4 8 7 6 5 MCP16311/2 2x3 mm TDFN* VFB AGND BOOST VCC SW EN PGND VIN 1 2 3 4 8 AGND EP 9 7 BOOST 6 SW 5 PGND * Includes Exposed Thermal Pad (EP); see Table 3-1. DS20005255D-page 1 MCP16311/2 Typical Applications VIN 4.5V to 30V BOOST CIN 2 x 10 µF CVCC 1 µF Vin 6V to 30V EN 31.6 k VFB VCC GND 10 k CBOOST L1 100 nF 22 µH CVCC 1 µF COUT 2 x 10 µF EN 52.3 k VFB VCC GND 10 k        
      VOUT 5V, @ 1A SW VIN                
 
 
 
 

 


        
  
     
       
  DS20005255D-page 2 COUT 2 x 10 µF BOOST CIN 2 x 10 µF VOUT 3.3V @ 1A SW VIN 



 
   
  
 


 
 
 

 CBOOST L1 100 nF 15 µH 
  
 

        


  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) VIN, SW ................................................................................................................................................................................ -0.5V to 32V BOOST – GND..................................................................................................................................................................... -0.5V to 38V BOOST – SW Voltage......................................................................................................................................................... -0.5V to 6.0V VFB Voltage ......................................................................................................................................................................... -0.5V to 6.0V EN Voltage ...............................................................................................................................................................-0.5V to (VIN + 0.3V) Output Short-Circuit Current .................................................................................................................................................. Continuous Power Dissipation ........................................................................................................................................................ Internally Limited Storage Temperature ..................................................................................................................................................... -65°C to +150°C Ambient Temperature with Power Applied ..................................................................................................................... -40°C to +125°C Operating Junction Temperature.................................................................................................................................... -40°C to +150°C ESD Protection on All Pins: HBM ...................................................................................................................................................................................... 1 kV MM ....................................................................................................................................................................................... 200V † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VIN = VEN = 7V, VBOOST – VSW = 5.0V, VOUT = 5.0V, IOUT = 100 mA, L = 22 µH, COUT = CIN = 2 x 10 µF X7R Ceramic Capacitors. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Input Voltage VIN Quiescent Current IQ Quiescent Current PFM Mode Units Conditions 4.4 — 30 V Note 1 — 44 60 µA Nonswitching, VFB = 0.9V IQ_PFM — 85 — µA Switching, IOUT = 0 (MCP16311) Quiescent Current PWM Mode IQ_PWM — 3.8 8 mA Switching, IOUT = 0 (MCP16312) Quiescent Current Shutdown IQ_SHDN — 3 9 µA VOUT = EN = 0V Undervoltage Lockout Start UVLOSTRT — 4.1 4.4 V VIN Rising Undervoltage Lockout Stop UVLOSTOP 3.18 3.6 — V VIN Falling Undervoltage Lockout Hysteresis UVLOHYS 0.2 0.5 1 V — VFB 0.784 0.800 0.816 V IOUT = 5 mA VIN Supply Voltage VIN Undervoltage Lockout Output Characteristics Feedback Voltage Note 1: 2: 3: 4: The input voltage should be greater than the output voltage plus headroom voltage; higher load currents increase the input voltage necessary for regulation. See characterization graphs for typical input-to-output operating voltage range. For VIN < VOUT, VOUT will not remain in regulation; for output voltages above 12V, the maximum current will be limited to under 1A. Determined by characterization, not production tested. This is ensured by design.  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 3 MCP16311/2 DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VIN = VEN = 7V, VBOOST – VSW = 5.0V, VOUT = 5.0V, IOUT = 100 mA, L = 22 µH, COUT = CIN = 2 x 10 µF X7R Ceramic Capacitors. Boldface specifications apply over the TA range of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units VOUT 2.0 — 24 V Note 2, Note 3 Feedback Voltage Line Regulation VFB/VFB)/VIN -0.15 0.01 0.15 %/V VIN = 7V to 30V, IOUT = 50 mA Feedback Voltage Load Regulation VFB / VFB — 0.25 — % IOUT = 5 mA to 1A, MCP16312 Feedback Input Bias Current IFB — 10 250 nA — Output Current IOUT 1 — — A Notes 1 to 3, Figure 2-7 Switching Frequency fSW 425 500 575 kHz Maximum Duty Cycle DCMAX 85 94 — % Note 3 Output Voltage Adjust Range Conditions Switching Characteristics Minimum Duty Cycle — DCMIN — 2 — % Note 4 RDS(ON) — 0.3 —  VBOOST – VSW = 5V, Note 3 I(MAX) — 1.8 — A VBOOST – VSW = 5V, Note 3 RDS(ON) — 0.17 —  Note 3 EN Input Logic High VIH 1.85 — — V — EN Input Logic Low VIL — — 0.4 V — IENLK — 0.1 1 µA VEN = 5V tSS — 300 — µs EN Low-to-High, 90% of VOUT TSD — 150 — °C Note 3 TSDHYS — 25 — °C Note 3 High-Side NMOS Switch-On Resistance Buck NMOS Switch Current Limit Synchronous NMOS SwitchOn Resistance EN Input Characteristics EN Input Leakage Current Soft-Start Time Thermal Characteristics Thermal Shutdown Die Temperature Die Temperature Hysteresis Note 1: 2: 3: 4: The input voltage should be greater than the output voltage plus headroom voltage; higher load currents increase the input voltage necessary for regulation. See characterization graphs for typical input-to-output operating voltage range. For VIN < VOUT, VOUT will not remain in regulation; for output voltages above 12V, the maximum current will be limited to under 1A. Determined by characterization, not production tested. This is ensured by design. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, TA = +25°C, VIN = VEN = 7V, VBOOST – VSW = 5.0V, VOUT = 5.0V. Parameters Sym. Min. Typ. Max. Units Conditions Operating Junction Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C — Maximum Junction Temperature TJ — — +150 °C Transient Temperature Ranges DS20005255D-page 4 Steady State  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 TEMPERATURE CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, TA = +25°C, VIN = VEN = 7V, VBOOST – VSW = 5.0V, VOUT = 5.0V. Parameters Sym. Min. Typ. Max. Units Conditions Thermal Resistance, 8L-MSOP JA — 211 — °C/W EIA/JESD51-3 Standard Thermal Resistance, 8L-2x3 TDFN JA — 52.5 — °C/W EIA/JESD51-3 Standard Package Thermal Resistances  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 5 MCP16311/2 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = EN = 7V, COUT = CIN = 2 x 10 µF, L = 22 µH, VOUT = 5.0V, ILOAD = 100 mA, TA = +25°C, 8L-MSOP package. 





 

   
  

      
    
  
        
  

   
  
 
 


        
  
  
    
     

       
      

   
   
         
     
    
            

 
 

 



 
  


   
  

 
     
      
 


   
  
    
 3.3V VOUT Efficiency vs.

       
  FIGURE 2-1: IOUT.
   



   FIGURE 2-4:   3.3V VOUT Efficiency vs.VIN. 


   
 
 
 
 
  
 
    
 

  
 
   
   

 
 
     
 


 

  
  
 
 
 

 
 
  


 

 


  
  5.0V VOUT Efficiency vs. 

 
 
   

    
 
    
 
 
    
 
      
 
    
 


  

  


  

 
    
  
   
    
   
   



    FIGURE 2-3: IOUT. DS20005255D-page 6 

   
 
 

       


 12.0V VOUT Efficiency vs. 5.0V VOUT Efficiency vs.VIN. FIGURE 2-5: 





    




  

  
FIGURE 2-2: IOUT. 


   
 
   




   
 

 


 
 
 
 
   FIGURE 2-6: VIN.   
  
 

 
    
 12.0V VOUT Efficiency vs.  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 Note: Unless otherwise indicated, VIN = EN = 7V, COUT = CIN = 2 x 10 µF, L = 22 µH, VOUT = 5.0V, ILOAD = 100 mA, TA = +25°C, 8L-MSOP package. 1600 5 VOUT = 3.3V 1400 Input Voltage (V) VOUT = 5V 1200 IOUT (mA) 1000 VOUT = 12V 800 600 400 4.6 4.2 UVLO START 3.8 UVLO STOP 3.4 200 3 0 0 5 10 FIGURE 2-7: 15 VIN (V) 20 25 -40 -25 -10 30 Max IOUT vs.VIN. FIGURE 2-10: Temperature. 0.798 VIN =7V VOUT = 3.3V IOUT = 100 mA 0.796 0.794 0.792 Enable Voltage (V) Feedback Voltage (V) 20 35 50 65 80 95 110 125 Temperature (°C) Undervoltage Lockout vs. 1.4 0.8 VIN = 12V VOUT = 3.3V IOUT = 200 mA 1.3 1.2 HIGH 1.1 LOW 1 0.79 -40 -25 -10 5 FIGURE 2-8: VOUT = 3.3V. 0.9 20 35 50 65 80 95 110 125 Temperature (°C) VFB vs. Temperature; -40 -25 -10 5 FIGURE 2-11: vs. Temperature. 20 35 50 65 80 95 110 125 Temperature (°C) Enable Threshold Voltage 5.03 0.5 0.45 5.02 0.4 0.35 High Side 0.3 0.25 0.2 Low Side 0.15 VIN = 12V VOUT = 5V IOUT = 500 mA 0.1 0.05 0 -40 -25 -10 FIGURE 2-9: Temperature. 5 20 35 50 65 80 95 110 125 Temperature (°C) Switch RDSON vs.  2013-2021 Microchip Technology Inc. and its subsidiaries Output Voltage (V) Switch RDSON (:) 5 VIN = 12V VOUT = 5V IOUT = 100 mA 5.01 5 4.99 4.98 4.97 -40 -25 -10 FIGURE 2-12: 5 20 35 50 65 80 95 110 125 Temperature (°C) VOUT vs. Temperature. DS20005255D-page 7 MCP16311/2 Note: Unless otherwise indicated, VIN = EN = 7V, COUT = CIN = 2 x 10 µF, L = 22 µH, VOUT = 5.0V, ILOAD = 100 mA, TA = +25°C, 8L-MSOP package. 1.8 VIN = 12V VOUT = 5V VOUT = 3.3V 40 Input Current (mA) Quiescent Current (µA) 60 Non-Swithcing 20 1.6 1.4 1.2 Shutdown 0 1 -40 -25 -10 FIGURE 2-13: Temperature. 5 20 35 50 65 80 Temperature (°C) 95 110 125 Input Quiescent Current vs. 5 15 20 VIN (V) 30 Output Current (mA) 150 Non-Switching 40 VOUT = 3.3V 30 20 10 Shutdown 5 10 15 20 125 VOUT = 3.3V 100 VOUT = 5V 75 50 25 0 25 VOUT = 12V 0 30 5 10 15 Input Voltage (°C) FIGURE 2-14: Input Voltage. 20 25 30 VIN (V) Input Quiescent Current vs. FIGURE 2-17: vs. VIN. PFM/PWM IOUT Threshold 50 120 VOUT = 3.3V Output Current (mA) No Load Input Current (µA) 25 FIGURE 2-16: PWM No Load Input Current vs.VIN, MCP16312. 50 Quiescent Current (µA) 10 100 80 60 40 VOUT = 3.3V 30 20 VOUT = 5V 10 VOUT = 12V 0 40 5 10 15 20 Input Voltage (V) 25 30 FIGURE 2-15: PFM No Load Input Current vs. Input Voltage, MCP16311. DS20005255D-page 8 5 10 15 20 25 30 VIN (V) FIGURE 2-18: Skipping/PWM IOUT Threshold vs. Input Voltage.  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 Note: Unless otherwise indicated, VIN = EN = 7V, COUT = CIN = 2 x 10 µF, L = 22 µH, VOUT = 5.0V, ILOAD = 100 mA, TA = +25°C, 8L-MSOP package. 4.5 VIN (V) VOUT = 3.3V To Start VOUT 2 V/div 4 VIN 5 V/div To Stop 3.5 0 200 400 600 800 Output Current (mA) 1000 FIGURE 2-19: Typical Minimum Input Voltage vs. Output Current. 200 µs/div FIGURE 2-22: Start-Up From VIN. Switching Frequency (kHz) 525 VOUT 2 V/div 500 IL 500 mA/div 475 IOUT 2 A/div VIN = 12V VOUT = 3.3V IOUT = 200 mA 450 -40 -25 -10 FIGURE 2-20: Temperature. 5 20 35 50 65 80 95 110 125 Temperature (°C) Switching Frequency vs. 10 µs/div FIGURE 2-23: Short-Circuit Response. Load Step from 100 mA to 800 mA VOUT 2 V/div IOUT 500 mA/div EN 2 V/div VOUT 100 mV/div AC Coupled 80 µs/div FIGURE 2-21: Start-Up From Enable.  2013-2021 Microchip Technology Inc. and its subsidiaries 200 µs/div FIGURE 2-24: Load Transient Response. DS20005255D-page 9 MCP16311/2 Note: Unless otherwise indicated, VIN = EN = 7V, COUT = CIN = 2 x 10 µF, L = 22 µH, VOUT = 5.0V, ILOAD = 100 mA, TA = +25°C, 8L-MSOP package. VOUT 50 mV/div AC Coupled VIN = 12V VOUT = 5V IOUT = 800 mA IL 200 mA/div VIN Step from 7V to 12V SW 10 V/div VIN 5 V/div VOUT 50 mV/div AC Coupled 400 µs/div FIGURE 2-25: Line Transient Response. FIGURE 2-28: Waveforms. 2 µs/div Heavy Load Switching VIN = 24V IOUT = 25 mA SW 10 V/div IL 200 mA/div VOUT 100 mV/div AC Coupled FIGURE 2-26: Waveforms. SW 10 V/div 20 µs/div PFM Light Load Switching VOUT 100 mV/div AC Coupled VIN = 12V VOUT = 5V Load Current 50 mA/div SW 5 V/div 400 µs/div FIGURE 2-29: PFM to PWM Transition; Load Step from 5 mA to 100 mA. VIN = 24V IOUT = 15 mA IL 100 mA/div VOUT 10 mV/div AC Coupled 1 µs/div FIGURE 2-27: Waveforms. DS20005255D-page 10 PWM Light Load Switching  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP16311/2 MCP16311/2 Symbol 2 x 3 TDFN MSOP 3.1 Description 1 1 VFB Output Voltage Feedback pin. Connect VFB to an external resistor divider to set the output voltage. 2 2 VCC Internal Regulator Output pin. Bypass Capacitor is required on this pin to provide high peak current for gate drive. 3 3 EN Enable pin. Logic high enables the operation. Do not allow this pin to float. 4 4 VIN Input Supply Voltage pin for power and internal biasing 5 5 PGND 6 6 SW 7 7 8 8 9 — Power Ground pin Output Switch Node pin, connects to the inductor and the bootstrap capacitor BOOST Boost Voltage pin that supplies the driver used to control the high-side NMOS switch. A bootstrap capacitor is connected between the BOOST and SW pins. AGND Signal Ground pin EP Exposed thermal pad Feedback Voltage Pin (VFB) The VFB pin is used to provide output voltage regulation by using a resistor divider. The VFB voltage will be 0.800V typical with the output voltage in regulation. 3.2 Internal Bias Pin (VCC) The VCC internal bias is derived from the input voltage VIN. VCC is set to 5.0V typical. The VCC is used to provide a stable low bias voltage for the upper and lower gate drive circuits. This output should be decoupled to AGND with a 1 µF capacitor, X7R. This capacitor should be connected as close as possible to the VCC and AGND pin. 3.3 Enable Pin (EN) The EN pin is a logic-level input used to enable or disable the device and lower the quiescent current while disabled. A logic high (> 1.3V) will enable the regulator output. A logic low (< 1V) will ensure that the regulator is disabled. 3.4 Power Supply Input Voltage Pin (VIN) Connect the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF-20 µF capacitor, depending on the impedance of the source and output current. The input capacitor provides current for the switch node and a stable voltage source for the internal device power. This capacitor should be connected as close as possible to the VIN and GND pins. For light-load applications, a 2.2 µF X7R or X5R ceramic capacitor can be used.  2013-2021 Microchip Technology Inc. and its subsidiaries 3.5 Analog Ground Pin (AGND) This ground is used by most internal circuits, such as the analog reference, control loop and other circuits. 3.6 Power Ground Pin (PGND) This is a separate ground connection used for the lowside synchronous switch.The length of the trace from the input cap return, output cap return and GND pin should be made as short as possible to minimize the noise in the system. The power ground and the analog ground should be connected in a single point. 3.7 Switch Node Pin (SW) The switch node pin is connected internally to the lowside and high-side switch, and externally to the SW node, consisting of the inductor and boost capacitor. The SW node can rise very fast as a result of the internal switch turning on. 3.8 Boost Pin (BOOST) The high side of the floating supply used to turn the integrated N-Channel high-side MOSFET on and off is connected to the boost pin. 3.9 Exposed Thermal Pad Pin (EP) There is an internal electrical connection between the EP and the PGND and AGND pins. DS20005255D-page 11 MCP16311/2 4.0 DETAILED DESCRIPTION 4.1.3 4.1 Device Overview An integrated precise 0.8V reference combined with an external resistor divider sets the desired converter output voltage. The resistor divider range can vary without affecting the control system gain. High-value resistors consume less current, but are more susceptible to noise. Consult typical applications for the recommended resistors value. The MCP16311/2 is a high input voltage step-down regulator, capable of supplying 1A typical to a regulated output voltage from 2.0V to 12V. Internally, the trimmed 500 kHz oscillator provides a fixed frequency, while the peak current mode control architecture varies the duty cycle for output voltage regulation. An internal floating driver is used to turn the high-side integrated N-Channel MOSFET on and off. The power for this driver is derived from an external boost capacitor whose energy is replenished when the low-side NChannel MOSFET is turned on. 4.1.1 PFM/PWM MODE OPTION The MCP16311 selects the best operating switching mode (PFM or PWM) for high efficiency across a wide range of load currents. Switching to PFM mode at lightload currents results in a low quiescent current. During the sleep period (between two packets of switching cycles), the MCP16311 draws 44 µA (typical) from the supply line. The switching pulse packets represent a small percentage of the total running cycle, and the overall average current drawn from power line is small. The disadvantages of PFM/PWM mode are higher output ripple voltage and variable PFM mode frequency. The PFM mode threshold is a function of the input voltage, output voltage and load (see Figure 2-17). 4.1.2 PWM-ONLY MODE OPTION In the MCP16312 devices, the PFM mode is disabled and the part runs only in PWM over the entire load range. During normal operation, the MCP16312 continues to operate at a constant 500 kHz switching frequency, keeping the output ripple voltage lower than in PFM mode. At lighter loads, the MCP16312 devices begin to skip pulses. Figure 2-18 represents the input voltage versus load current for the pulse skipping threshold in PWM-only mode. Because the MCP16312 has very low output voltage ripple, it is recommended for noise-sensitive applications. TABLE 4-1: PART NUMBER SELECTION Part Number PFM/PWM PWM MCP16311  — MCP16312 —  4.1.4 INTERNAL REFERENCE VOLTAGE (VFB) INTERNAL BIAS REGULATOR (VCC) An internal Low Dropout Voltage Regulator (LDO) is used to supply 5.0V to all the internal circuits. The LDO regulates the input voltage (VIN) and can supply enough current (up to 50 mA) to sustain the drivers and internal bias circuitry. The VCC pin must be decoupled to ground with a 1 µF capacitor. In the event of a thermal shut down, the LDO will shut down. There is a short-circuit protection for the VCC pin, with a threshold set at 150 mA. In PFM switching mode, during sleep periods, the VCC regulator enters Low Quiescent Current mode to avoid unnecessary power dissipation. Avoid driving any external load using the VCC pin. 4.1.5 INTERNAL COMPENSATION All control system components necessary for stable operation over the entire device operating range are integrated, including the error amplifier and inductor current slope compensation. To add the proper amount of slope compensation, the inductor value changes along with the output voltage (see Table 5-1). 4.1.6 EXTERNAL COMPONENTS External components consist of: • • • • Input capacitor Output filter (inductor and capacitor) Boost capacitor Resistor divider The selection of the external inductor, output capacitor and input capacitor is dependent upon the output voltage and the maximum output current. 4.1.7 ENABLE INPUT The enable input (EN) is used to disable the device. If disabled, the device consumes a minimum current from the input. Once enabled, the internal soft start controls the output voltage rate of rise, preventing high-inrush current and output voltage overshoot. There is no internal pull-up or pull-down resistor. To enable the converter, the EN pin must be pulled high. To disable the converter, the EN pin must be pulled low. DS20005255D-page 12  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 4.1.8 SOFT START Hysteresis is added to prevent starting and stopping during start-up as a result of loading the input voltage source. The internal reference voltage rate of rise is controlled during start-up, minimizing the output voltage overshoot and the inrush current. 4.1.9 4.1.10 OVERTEMPERATURE PROTECTION UNDERVOLTAGE LOCKOUT Overtemperature protection limits the silicon die temperature to +150°C by turning the converter off. The normal switching resumes at +125°C. An integrated Undervoltage Lockout (UVLO) prevents the converter from starting until the input voltage is high enough for normal operation. The converter will typically start at 4.1V and operate down to 3.6V. VREG VIN VCC VCC C VCC BG REF CIN BOOST VOUT SS OTEMP VREF RTOP + Amp - FB RBOT RCOMP VREF CCOMP CBOOST 500 kHz OSC VOUT S Comp + PWM Latch HS Drive SW COUT R UVLO Overtemp CS PFM RSENSE PFM CTR + + VREF EN + - VCC Slope Comp LS Drive SHDN all blocks AGND FIGURE 4-1: 4.2 4.2.1 PGND MCP16311/2 Block Diagram. Functional Description STEP-DOWN OR BUCK CONVERTER The MCP16311/2 is a synchronous step-down or buck converter capable of stepping input voltages ranging from 4.4V to 30V down to 2.0V to 24V for VIN > VOUT. The integrated high-side switch is used to chop or modulate the input voltage using a controlled duty cycle. The integrated low-side switch is used to freewheel current when the high-side switch is turned off. High efficiency is achieved by using low-resistance  2013-2021 Microchip Technology Inc. and its subsidiaries switches and low equivalent series resistance (ESR) inductors and capacitors. When the high-side switch is turned on, a DC voltage is applied to the inductor (VIN – VOUT), resulting in a positive linear ramp of inductor current. When the high-side switch turns off and the low-side switch turns on, the applied inductor voltage is equal to -VOUT, resulting in a negative linear ramp of inductor current. To ensure there is no shoot-through current, a dead time where both switches are off is implemented between the high-side switch turning off and the low-side switch turning on, and the low-side switch turning off and the high-side switch turning on. DS20005255D-page 13 MCP16311/2 For steady-state, continuous inductor current operation, the positive inductor current ramp must equal the negative current ramp in magnitude. While operating in steady state, the switch duty cycle must be equal to the relationship of VOUT/VIN for constant output voltage regulation, under the condition that the inductor current is continuous or never reaches zero. For discontinuous inductor current operation, the steady-state duty cycle will be less than VOUT/VIN to maintain voltage regulation. When the inductor current reaches zero, the low-side switch is turned off so that current does not flow in the reverse direction, keeping the efficiency high. The average of the chopped input voltage or SW node voltage is equal to the output voltage, while the average inductor current is equal to the output current. L VOUT S1 IL VIN S2 IL COUT VIN VOUT S1 ON S2 ON Continuous Inductor Current Mode IL IOUT VIN SW S2 Both ON OFF Discontinuous Inductor Current Mode S1 ON FIGURE 4-2: Converter. DS20005255D-page 14 Synchronous Step-Down PEAK CURRENT MODE CONTROL The MCP16311/2 integrates a peak current mode control architecture, resulting in superior AC regulation while minimizing the number and size of voltage loop compensation components for integration. Peak current mode control takes a small portion of the inductor current, replicates it, and compares this replicated current sense signal with the error voltage. In practice, the inductor current and the internal switch current are equal during the switch-on time. By adding this peak current sense to the system control, the stepdown power train system can be approximated by a first order system rather than a second order system. This reduces the system complexity and increases its dynamic performance. For Pulse-Width Modulation (PWM) duty cycles that exceed 50%, the control system can become bimodal, where a wide pulse followed by a short pulse repeats instead of the desired fixed pulse width. To prevent this mode of operation, an internal compensating ramp is summed into the current sense signal. 4.2.3 IOUT SW 4.2.2 PULSE-WIDTH MODULATION The internal oscillator periodically starts the switching period, which in the MCP16311/2’s case occurs every 2 µs or 500 kHz. With the high-side integrated N-Channel MOSFET turned on, the inductor current ramps up until the sum of the current sense and slope compensation ramp exceeds the integrated error amplifier output. Once this occurs, the high-side switch turns off and the low-side switch turns on. The error amplifier output slews up or down to increase or decrease the inductor peak current feeding into the output LC filter. If the regulated output voltage is lower than its target, the inverting error amplifier output rises. This results in an increase in the inductor current to correct for errors in the output voltage. The fixed frequency duty cycle is terminated when the sensed inductor peak current, summed with the internal slope compensation, exceeds the output voltage of the error amplifier. The PWM latch is set by turning off the highside internal switch and preventing it from turning on until the beginning of the next cycle. The MCP16312 devices will operate in PWM-only mode even during periods of light load operation. By operating in PWM-only mode, the output ripple remains low and the frequency is constant (Figure 2-28). Operating in fixed PWM mode results in lower efficiency during light-load operation (when compared to PFM mode (MCP16311)). When working close to the boundary conduction threshold, a jitter on the SW node may occur, reflecting in the output voltage. Although the low-frequency output component is very small, it may be desirable to completely eliminate this component. To achieve this, an RC Snubber between the SW node and GND is used.  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 Typical values for the snubber are: 680 pF and 430. Using such a snubber completely eliminates the jitter on the SW node, but slightly decreases the overall efficiency of the converter. 4.2.4 PFM MODE OPERATION The MCP16311 devices are capable of automatic operation in normal PWM or PFM mode to maintain high efficiency at all loads. In PFM mode, the output ripple has a variable frequency component that changes with the input voltage and output current. With no load, the quiescent current drawn from the output is very low. There are two comparators that decide when device starts switching in PFM mode. One of the comparators is monitoring the output voltage and has a reference of 810 mV with 10 mV hysteresis. If the load current is low, the output rises and triggers the comparator, which will put the logic control of the drivers and other block circuitry (including the internal regulator VCC) in Sleep mode to minimize the power consumption during the switching cycle’s off period. When the output voltage drops below its nominal value, PFM operation pulses one or several times to bring the output back into regulation (Figure 2-26). The second comparator fixes the minimum duty cycle for PFM mode. Minimum duty cycle in PFM mode depends on the sensed peak current and input voltage. As a result, the PFM-to-PWM mode threshold depends on load current and value of the input voltage (Figure 2-17). If the output load current rises above the upper threshold, the MCP16311 transitions smoothly into PWM mode. 4.2.5 HIGH-SIDE DRIVE The MCP16311/2 features an integrated high-side N-Channel MOSFET for high-efficiency step-down power conversion. An N-Channel MOSFET is used for its low resistance and size (instead of a P-Channel MOSFET). The N-Channel MOSFET gate must be driven above its source to fully turn on the device, resulting in a gate-drive voltage above the input to turn on the high-side N-Channel. The high-side N-channel source is connected to the inductor and boost cap or switch node. When the high-side switch is off and the low-side switch is on, the inductor current flows through the low-side switch, providing a path to recharge the boost cap from the boost voltage source. The voltage for the boost cap is supplied from the internal regulator (VCC). An internal boost blocking diode is used to prevent current flow from the boost cap back into the regulator during the internal switch-on time. 5.0 APPLICATION INFORMATION 5.1 Typical Applications The MCP16311/2 synchronous step-down converter operates over a wide input range, up to 30V maximum. Typical applications include generating a bias or VDD voltage for PIC® microcontrollers, digital control system bias supply for AC-DC converters and 12V industrial input and similar applications. 5.2 Adjustable Output Voltage Calculations To calculate the resistor divider values for the MCP16311/2 adjustable version, use Equation 5-1. RTOP is connected to VOUT, RBOT is connected to AGND, and both are connected to the VFB input pin. EQUATION 5-1: RESISTOR DIVIDER CALCULATION V OUT  R TOP = R BOT   ------------–1  V  FB EXAMPLE 5-1: 3.3V RESISTOR DIVIDER VOUT = 3.3V VFB = 0.8V RBOT = 10 k RTOP = 31.25 k (standard value = 31.6 k) VOUT = 3.328V (using standard value) EXAMPLE 5-2: 5.0V RESISTOR DIVIDER VOUT = 5.0V VFB = 0.8V RBOT = 10 k RTOP = 52.5 k (standard value = 52.3 k) VOUT = 4.984V (using standard values) EXAMPLE 5-3: 12.0V RESISTOR DIVIDER VOUT = 12.0V VFB = 0.8V RBOT = 10 k RTOP = 140 k (standard value = 140 k) The error amplifier is internally compensated to ensure loop stability. External resistor dividers, inductance and output capacitance all have an impact on the control system and should be selected carefully and evaluated for stability. A 10 kΩ bottom resistor is recommended as a good trade-off for quiescent current and noise immunity.  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 15 MCP16311/2 5.3 General Design Equations The step-down converter duty cycle can be estimated using Equation 5-2 while operating in Continuous Inductor Current mode. This equation accounts for the forward drop of the two internal N-Channel MOSFETS. As load current increases, the voltage drop in both internal switches will increase, requiring a larger PWM duty cycle to maintain the output voltage regulation. Switch voltage drop is estimated by multiplying the switch current times the switch resistance or RDSON. EQUATION 5-2: CONTINUOUS INDUCTOR CURRENT DUTY CYCLE V OUT +  I LSW  R DSONL  D = -----------------------------------------------------------V IN –  I HSW  R DSONH  The MCP16311/2 device features an integrated slope compensation to prevent bimodal operation of the PWM duty cycle. Internally, half of the inductor current down slope is summed with the internal current sense signal. For the proper amount of slope compensation, it is recommended to keep the inductor down-slope current constant by varying the inductance with VOUT, where K = 0.22 V/µH. K = V OUT  L For example, for VOUT = 3.3V, an inductance of 15 µH is recommended. RECOMMENDED INDUCTOR VALUES VOUT K LSTANDARD 2.0V 0.20 10 µH 3.3V 0.22 15 µH 5.0V 0.23 22 µH 12V 0.21 56 µH 15V 0.22 68 µH 24V 0.24 100 µH Input Capacitor Selection The step-down converter input capacitor must filter the high-input ripple current that results from pulsing or chopping the input voltage. The MCP16311/2 input voltage pin is used to supply voltage for the power train and as a source for internal bias. A low equivalent series resistance (ESR), preferably a ceramic capacitor, is recommended. The necessary capacitance is dependent upon the maximum load current and source impedance. Three capacitor parameters to keep in mind are the voltage rating, equivalent series resistance and the temperature rating. For wide temperature range applications, a multi-layer X7R dielectric is recommended, while for applications with limited temperature range, a multi-layer X5R dielectric is acceptable. Typically, input capacitance between 10 µF and 20 µF is sufficient for most applications. For applications with 100 mA to 200 mA load, a 4.7 µF to 2.2 µF X7R capacitor can be used, depending on the input source and its impedance. In case of an application with high variations of the input voltage, a higher capacitor value is recommended. The input capacitor voltage rating must be VIN plus margin. Table 5-2 contains the recommended range for the input capacitor value. 5.5 EQUATION 5-3: TABLE 5-1: 5.4 Output Capacitor Selection The output capacitor provides a stable output voltage during sudden load transients and reduces the output voltage ripple. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application. For typical applications, the output capacitance can be as low as 10 µF ceramic and as high as 100 µF electrolytic. In a typical application, a 20 µF output capacitance usage will result in a 10 mV output ripple. The amount and type of output capacitance and equivalent series resistance will have a significant effect on the output ripple voltage and system stability. The range of the output capacitance is limited due to the integrated compensation of the MCP16311/2. See Table 5-2 for the recommended output capacitor range. The output voltage capacitor rating should be a minimum of VOUT plus margin. TABLE 5-2: DS20005255D-page 16 CAPACITOR VALUE RANGE Parameter Min. Max. CIN 2.2 µF None COUT 20 µF None  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 The MCP16311/2 is designed to be used with small surface-mount inductors. Several specifications should be considered prior to selecting an inductor. To optimize system performance, low DCR inductors should be used. To optimize system performance, the inductance value is determined by the output voltage (Table 5-1) so the inductor ripple current is somewhat constant over the output voltage range. EQUATION 5-4: IL INDUCTOR RIPPLE CURRENT V IN – V OUT = ----------------------------  t ON L MCP16311/2 RECOMMENDED 3.3V VOUT INDUCTORS (CONTINUED) Part Number ISAT (A) TABLE 5-3: DCR () Inductor Selection Value (µH) 5.6 Size WxLxH (mm) Wurth Elektronik 74408943150 15 0.136 1.70 4.8x4.8x3.8 744062150 15 0.095 1.10 6.8x6.8x2.3 744778115 15 0.130 2.20 7.3x.7.3x3.2 7447779115 15 0.081 2.50 7.3x7.3x4.5 B82462G4153M000 15 0.097 1.20 6.3x6.3x3.0 CLF6045T-150M-D 15 0.066 2.20 6.2x5.9x4.5 SPM6550T-150M-HZ 15 0.086 4.50 7.1x6.5x5 TDK Corporation Eaton EXAMPLE 5-4: SD25-150-R VIN = 12V VOUT = 3.3V IOUT = 800 mA EQUATION 5-5: INDUCTOR PEAK CURRENT 6.0x6.0x3.0 DRA73-150-R 14.98 0.112 2.00 7.6x7.6x3.55 DRA74-150-R 15.14 0.080 2.36 7.6x7.6x4.35 Inductor ripple current = 319 mA Inductor peak current = 960 mA For this example, an inductor with a current saturation rating of minimum 960 mA is recommended. Low DCR inductors result in higher system efficiency. A trade-off between size, cost and efficiency is made to achieve the desired results. ISAT (A) DCR () MCP16311/2 RECOMMENDED 3.3V VOUT INDUCTORS Value (µH) SRP4020TA-150M 15 0.374 1.90 4.06x4.45x1.8 SRP6540-150M 15 0.121 2.90 6.50x7.2x4.0 SRR5028-150Y 15 0.100 1.15 5.8x5.8x2.8 5.7 Where: Size WxLxH (mm) 15 0.120 2.90 4.0x4.0x4.1 LPS6235-153MR 15 0.125 2.00 6.0x6.0x3.5 MSS6132-153ML 15 0.106 1.56 6.1x6.1x2.85 XAL6060-153ME 15 0.043 5.80 6.36x6.56x6.1 MSS7341-153ML 15 0.055 1.78 7.1x7.1x4.1 XGL4040-153ME 15 0.082 2.50 4.0x4.0x4.1 XGL5050-153ME 15 0.054 3.90 5.28x5.48x5.1 XEL5050-153ME 15 0.076 3.70 5.28x5.48x5.1  2013-2021 Microchip Technology Inc. and its subsidiaries Boost Capacitor The boost capacitor is used to supply current for the internal high-side drive circuitry that is above the input voltage. The boost capacitor must store enough energy to completely drive the high-side switch on and off. A 100 nF X5R or X7R capacitor is recommended for all applications. The boost capacitor maximum voltage is 5V. 5.8 Vcc Capacitor The VCC internal bias regulates at 5V. The VCC pin is current limited to 50 mA and protected from a shortcircuit condition at 150 mA load. The VCC regulator must sustain all load and line transients because it supplies the internal drivers for power switches. For stability reasons, the VCC capacitor must be at least 1 µF X7R ceramic for extended temperature range, or X5R for limited temperature range. 5.9 Coilcraft XAL4040-153ME 0.076 1.10 Bourns , Inc. I LPK = -------- + I OUT 2 Part Number 0.095 1.08 5.45x5.45x2.7 14.1 ®  IL TABLE 5-3: 15 SD6030-150-R MCP16312 – LED Constant Current Driver MCP16312 can be used to drive an LED or a string of LEDs. The process of transforming the MCP16312 from a constant voltage source into a constant current source is simple. It implies that the sensing/feedback for the current is on the low side by adding a resistor in series with the string of LEDs. DS20005255D-page 17 MCP16311/2 When using the MCP16312 as an LED driver, care must be taken when selecting the sense resistor. Due to the high feedback voltage of 0.8V, there will be significant losses on the sense resistor, so a larger package with better power dissipation must be selected. Another important aspect when creating such an application is the value of the inductor. The value of the inductor needs to follow Equation 5-3 or, as a guideline, Table 5-1, where the output voltage is approximated as the sum of the forward voltages of the LEDs and a 0.8V headroom for the sense resistor. A typical application is shown in Figure 5-3. The following equations are used to determine the value and the losses for the sense resistor: EQUATION 5-7: V OUT  I OUT - –  V OUT  I OUT  P DIS = -----------------------------Efficiency The difference between the first term, input power, and the second term, power delivered, is the total system power dissipation. The inductor losses are estimated by PL = IOUT2 x LDCR. EXAMPLE 5-6: EQUATION 5-6: RB V FB = ----------I LED P LOSSES = V FB  I LED Where: TOTAL POWER DISSIPATION ESTIMATE POWER DISSIPATION – MCP16311/2 MSOP PACKAGE VIN = 12V VOUT = 5.0V IOUT = 0.8A Efficiency = Total System Dissipation = VFB = Feedback Voltage 92.5% 324 mW LDCR = 0.15  PL 96 mW = MCP16311/2 internal power dissipation estimate: EXAMPLE 5-5: ILED = 400 mA VFB = 0.8V VF = 1 x 3.2V (one white LED is used) RB = 2 PLOSSES = 0.32 W (sense resistor losses) L = 22 µH 5.10 Thermal Calculations The MCP16311/2 is available in MSOP-8 and DFN-8 packages. By calculating the power dissipation and applying the package thermal resistance (θJA), the junction temperature is estimated. The maximum continuous junction temperature rating for the MCP16311/2 is +125°C. To quickly estimate the internal power dissipation for the switching step-down regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated in Equation 5-7. This power dissipation includes all internal and external component losses. For a quick internal estimate, subtract the estimated inductor DCR loss from the PDIS calculation in Equation 5-7. DS20005255D-page 18 PDIS – PL = 228 mW JA = 211°C/W Estimated Junction = Temperature Rise +48.1°C EXAMPLE 5-7: POWER DISSIPATION – MCP16311/2 DFN PACKAGE VIN = 12V VOUT = 3.3V IOUT = 0.8A Efficiency = Total System Dissipation = 90% 293 mW LDCR = 0.15  PL 96 mW = MCP16311 internal power dissipation estimate: PDIS – PL = 197 mW JA = 68°C/W Estimated Junction = Temperature Rise +13.4°C  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 5.11 Printed Circuit Board (PCB) Layout Information supplying high-frequency switch current, the input capacitor also provides a stable voltage source for the internal MCP16311/2 circuitry. Unstable PWM operation can result if there are excessive transients or ringing on the VIN pin of the MCP16311/2 device. In Figure 5-1, the input capacitors are placed close to the VIN pins. A ground plane on the bottom of the board provides a low-resistive and low-inductive path for the return current. The next priority in placement is the freewheeling current loop formed by output capacitors and inductance (L1), while strategically placing the output capacitor ground return close to the input capacitor ground return. Then, CBOOST should be placed between the boost pin and the switch node pin. This leaves space close to the MCP16311/2 VFB pin to place RTOP and RBOT. The feedback loop must be routed away from the switch node, so noise is not coupled into the high-impedance VFB input. Good PCB layout techniques are important to any switching circuitry, and switching power supplies are no different. When wiring the switching high-current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP16311/2 to minimize the loop area. The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. A good MCP16311/2 layout starts with the placement of the input capacitor, which supplies current to the input of the circuit when the switch is turned on. In addition to CBOOST VIN 12V BOOST VIN CIN CVCC FIGURE 5-1: SW EN REN L1 VFB VCC GND Component Value CIN 2 x 10 µF COUT 2 x 10 µF L1 22 µH RT 52.3 k RB 10 k REN 1 M CVCC 1 µF CBOOST 0.1 µF VOUT 5V @ 1A COUT RT RB MSOP-8 Recommended Layout, 5V Output Design.  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 19 MCP16311/2 CBOOST VIN 12V BOOST VIN SW CIN EN REN CVCC FIGURE 5-2: DS20005255D-page 20 L1 VFB VCC GND Component Value CIN 2 x 10 µF COUT 2 x 10 µF L1 15 µH RT 31.2 k RB 10 k REN 1 M CVCC 1 µF CBOOST 0.1 µF VOUT 3.3V @ 1A COUT RT RB DFN Recommended Layout, 3.3V Output Design.  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 CBOOST VIN 12V BOOST VIN ILED = 400 mA L1 SW COUT LED CIN EN REN CVCC FIGURE 5-3: VFB VCC GND RB Component Value CIN 2 x 10 µF COUT 2 x 10 µF L1 15 µH RB 2 REN 1 M CVCC 1 µF CBOOST 0.1 µF LED 1 x White LED V FB R B = ---------I LED MCP16312 - Typical LED Driver Application: 400 mA Output.  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 21 MCP16311/2 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead MSOP (3x3 mm) Example 16311E 149256 8-Lead TDFN (2x3 mm) Example Part Number Code MCP16311T-E/MNY(VAO) ABM MCP16312T-E/MNY ABU Note: Legend: XX...X Y YY WW NNN e3 * Note: DS20005255D-page 22 ABM 150 25 The content of this table applies to 8-Lead TDFN. Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 23 MCP16311/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005255D-page 24  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 25 MCP16311/2 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C C (A3) A SEATING PLANE 8X 0.08 C A1 SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 0.05 C A B C BOTTOM VIEW Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 1 of 2 DS20005255D-page 26  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Pins e Pitch A Overall Height Standoff A1 Contact Thickness A3 D Overall Length Overall Width E Exposed Pad Length D2 Exposed Pad Width E2 b Contact Width L Contact Length Contact-to-Exposed Pad K MIN 0.70 0.00 1.35 1.25 0.20 0.25 0.20 MILLIMETERS NOM 8 0.50 BSC 0.75 0.02 0.20 REF 2.00 BSC 3.00 BSC 1.40 1.30 0.25 0.30 - MAX 0.80 0.05 1.45 1.35 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04-129-MNY Rev E Sheet 2 of 2  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 27 MCP16311/2 8-Lead Plastic Dual Flat, No Lead Package (MNY) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 8 ØV C Y2 EV Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Thermal Via Diameter V Thermal Via Pitch EV MIN MILLIMETERS NOM 0.50 BSC MAX 1.60 1.50 2.90 0.25 0.85 0.30 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing No. C04-129-MNY Rev. B DS20005255D-page 28  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 APPENDIX A: REVISION HISTORY Revision D (December 2021) • Updated document layout • Updated table Table 5-3 • Added the automotive qualified status of the device to Features and General Description • Updated the Product Identification System with automotive qualification information and examples Revision C (July 2019) • Updated Table 4-1 in Section 4.1.2 “PWM-only Mode Option” • Updated Section 4.2.5 “HIGH-SIDE DRIVE” • Updated Package Drawings for 2 mm x 3 mm 8Lead TDFN in Section 6.1 “Package Marking Information” • Updated Product Identification System section Revision B (November 2014) • • • • Added AEC-Q100 qualification information Updated the Section 5.1 “Typical Applications” Updated the DC Characteristics table Updated Section 4.2.2 “Peak Current Mode Control” • Updated the standard values in Example 5-1 • Added a 24V option in Table 5-1 Revision A (December 2013) • Original release of this document  2013-2021 Microchip Technology Inc. and its subsidiaries DS20005255D-page 29 MCP16311/2 NOTES: DS20005255D-page 30  2013-2021 Microchip Technology Inc. and its subsidiaries MCP16311/2 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) Device Tape and Reel Option Device: MCP16311: MCP16312: -X /XX XXX Temperature Range Package Qualification Examples: a) MCP16311-E/MS: High-Efficiency, PFM/PWM Integrated Synchronous Switch Step-Down Regulator High-Efficiency, PFM Integrated Synchronous Switch Step-Down Regulator Tape and Reel Option: = Standard packaging (tube or tray) T = Tape and Reel(1) Temperature Range: E = -40°C to +125°C (Extended) Package: MS MNY* = 8-Lead Plastic Micro Small Outline Package, MSOP = 8-Lead Plastic Dual Flat, No Lead Package, 2 x 3 x 0.8 mm Body, TDFN *Y = Nickel palladium gold manufacturing designator b) c) d) e) f) Qualification: = Standard qualification VAO = AEC-Q100 Automotive Qualification g) h) i) j) Standard packaging (tube or tray), Extended temperature, 8LD MSOP package MCP16311T-E/MS: Tape and Reel, Extended temperature, 8LD MSOP package MCP16311T-E/MNY: Tape and Reel, Extended temperature, 8LD 2 x 3 TDFN package MCP16311T-E/MSVAO: Tape and Reel, Extended temperature, 8LD MSOP package, Automotive Qualified MCP16311T-E/MNYVAO: Tape and Reel, Extended temperature, 8LD 2 x 3 TDFN package, No lead, Automotive Qualified MCP16312-E/MS: Standard packaging (tube or tray), Extended temperature, 8LD MSOP package MCP16312T-E/MS: Tape and Reel, Extended temperature, 8LD MSOP package MCP16312T-E/MNY: Tape and Reel, Extended temperature, 8LD 2 x 3 TDFN package MCP16312-E/MSVAO: Standard packaging (tube or tray), Extended temperature, 8LD MSOP package, Automotive Qualified MCP16312T-E/MSVAO: Tape and Reel, Extended temperature, 8LD MSOP package, Automotive Qualified Note 1:  2013-2021 Microchip Technology Inc. and its subsidiaries Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005255D-page 31 MCP16311/2 NOTES: DS20005255D-page 32  2013-2021 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2013-2021, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2013-2021 Microchip Technology Inc. and its subsidiaries ISBN: 978-1-5224-9347-1 DS20005255D-page 33 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 Israel - Ra’anana Tel: 972-9-744-7705 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20005255D-page 34 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820  2013-2021 Microchip Technology Inc. and its subsidiaries