0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
MCP1642DT-33I/MC

MCP1642DT-33I/MC

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    VFDFN8_EP

  • 描述:

    ICREGBOOSTSYNC3.3V1.8A

  • 数据手册
  • 价格&库存
MCP1642DT-33I/MC 数据手册
MCP1642B/D 1.8A Input Current Switch, 1 MHz Low-Voltage Start-Up Synchronous Boost Regulator Features General Description • Up to 96% Typical Efficiency • 1.8A Typical Peak Input Current Limit: - IOUT > 175 mA @ 1.2V VIN, 3.3V VOUT - IOUT > 600 mA @ 2.4V VIN, 3.3V VOUT - IOUT > 800 mA @ 3.3V VIN, 5.0V VOUT - IOUT > 1A @ VIN > 3.6V, 5.0V VOUT • Low Start-Up Voltage: 0.65V, typical 3.3V VOUT @ 1 mA • Low Operating Input Voltage: 0.35V, typical 3.3V VOUT @ 1 mA • Output Voltage Range: - Reference Voltage, VFB = 1.21V - 1.8V to 5.5V for the adjustable device option - 1.8V, 3.0V, 3.3V and 5.0V for fixed VOUT options • Maximum Input Voltage  VOUT < 5.5V • PWM Operation: 1 MHz - Low Noise, Anti-Ringing Control • Power Good Open-Drain Output • Internal Synchronous Rectifier • Internal Compensation • Inrush Current Limiting and Internal Soft-Start • Selectable, Logic-Controlled Shutdown States: - True Load Disconnect Option (MCP1642B) - Input-to-Output Bypass Option (MCP1642D) • Shutdown Current (All States): 1 µA • Overtemperature Protection • Available Packages: - 8-Lead MSOP - 8-Lead 2x3 DFN The MCP1642B/D devices are compact, high-efficiency, fixed-frequency, synchronous step-up DC-DC converters. This family of devices provides an easy-to-use power supply solution for applications powered by either one-cell, two-cell, or three-cell alkaline, Ultimate Lithium, NiCd, NiMH, one-cell Li-Ion or Li-Polymer batteries. Low-voltage technology allows the regulator to start-up without high inrush current or output voltage overshoot from a low voltage input. High efficiency is accomplished by integrating the low-resistance N-Channel Boost switch and synchronous P-Channel switch. All compensation and protection circuitry are integrated to minimize the number of external components. An open-drain Power Good output is provided to indicate when the output voltage is within 10% of regulation and facilitates the interface with an MCU. For standby applications, MCP1642B provides a “true output disconnect” from input to output while in shutdown (EN = GND). An additional device option (MCP1642D) is available and connects “input to output bypass” while in shutdown. Both options consume less than 1 µA of input current. For the adjustable (ADJ) device options, the output voltage is set by a small external resistor divider. Fixed VOUT device options do not require external divider resistors. Two package options, 8-lead MSOP and 8lead 2x3 DFN, are available. Applications • One, Two and Three-Cell Alkaline, Lithium Ultimate and NiMH/NiCd Portable Products • Single-Cell Li-Ion to 5V Converters • PIC® MCU Power • USB Emergency Backup Charger from Batteries • Personal Medical Products • Wireless Sensors • Hand-Held Instruments • GPS Receivers • +3.3V to +5.0V Distributed Power Supply Package Types MCP1642B/D-xx MSOP MCP1642B/D-xx 2x3 DFN* EN 1 8 VIN NC 2 7 SGND NC 2 PG 3 6 PGND PG 3 VOUT 4 VOUT 4 5 SW MCP1642B/D-ADJ MSOP EN 1 8 VIN VFB 2 7 SGND VFB 2 PG 3 6 PGND PG 3 VOUT 4 5 SW EP 9 7 SGND 6 PGND 5 SW MCP1642B/D-ADJ 2x3 DFN* EN 1 VOUT 4 8 VIN 8 VIN EN 1 EP 9 7 SGND 6 PGND 5 SW * Includes Exposed Thermal Pad (EP); see Table 3-1.  2014 Microchip Technology Inc. DS20005253A-page 1 MCP1642B/D Typical Application L1 4.7 µH VOUT 3.3V CIN 4.7...10 µF VIN= 0.9 to 1.6V VIN + SW VOUT COUT 4.7...10 µF ALKALINE MCP1642B-33 NC PG EN - GND ON OFF L 4.7 µH VOUT CIN 4.7...10 µF 5.0V SW VOUT VIN VIN= 1.8 to 3.2V MCP1642D-ADJ VFB ALKALINE + RTOP 976 k RBOT 309 k EN - COUT 4.7...10 µF RPG 1 M ON ALKALINE + OFF ® From PIC MCU I/O GND PG To PIC MCU I/O - 100 90 VIN = 1.2V, VOUT = 3.3V Efficiency (%) 80 70 VIN = 2.5V, VOUT = 5.0V 60 50 40 30 20 10 0 1 10 100 1000 IOUT (mA) DS20005253A-page 2  2014 Microchip Technology Inc. MCP1642B/D 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † EN, FB, VIN, VSW, VOUT – GND .......................... +6.5V EN, FB ...... (GND – 0.3V) Output Short-Circuit Current ...................... Continuous Output Current Bypass Mode........................... 800 mA Power Dissipation ............................ Internally Limited Storage Temperature ..........................-65°C to +150°C Ambient Temp. with Power Applied.......-40°C to +85°C Operating Junction Temperature.........-40°C to +125°C ESD Protection On All Pins: HBM........................................................ 4 kV MM......................................................... 300V DC CHARACTERISTICS Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Conditions Minimum Start-Up Voltage VIN — 0.65 0.8 V Note 1 — 0.9 1.8 V MCP1642B/D-50, Note 1 Minimum Input Voltage After Start-Up VIN — 0.35 — V Note 1, Note 5 — 0.5 — V Note 1, Note 5, MCP1642B/D-50 Output Voltage Adjust. Range (MCP1642B/D-ADJ) VOUT 1.8 — 5.5 V VOUT  VIN (MCP1642B/D-ADJ); Note 2 Output Voltage (MCP1642B/D-XX) VOUT — 1.8 — V VIN < 1.8V, MCP1642B/D-18, Note 2 — 3.0 — V VIN < 3.0V, MCP1642B/D-30, Note 2 — 3.3 — V VIN < 3.3V, MCP1642B/D-33, Note 2 — 5.0 — V VIN < 5.0V, MCP1642B/D-50, Note 2 — 175 — mA 1.2V VIN, 1.8V VOUT, Note 5 — 300 — mA 1.5V VIN, 3.3V VOUT, Note 5 — 800 — mA 3.3V VIN, 5.0V VOUT, Note 5 Input Characteristics Maximum Output Current IOUT Feedback Voltage VFB 1.173 1.21 1.247 V Feedback Input Bias Current IVFB — 1.0 — nA Note 1: 2: 3: 4: 5: Note 5 Resistive load, 1 mA. For VIN > VOUT, VOUT will not remain in regulation. IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPWM * (VOUT/VIN)). 220 resistive load, 3.3V VOUT (15 mA). Determined by characterization, not production tested.  2014 Microchip Technology Inc. DS20005253A-page 3 MCP1642B/D DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Quiescent Current – PWM Mode IQPWM — 400 500 µA Measured at VOUT, EN = VIN, IOUT = 0 mA, Note 3 Quiescent Current – Shutdown IQSHDN — 1 — µA VOUT = EN = GND, IOUT = 0 mA includes N-Channel and P-Channel Switch Leakage NMOS Switch Leakage INLK — 0.5 — µA VIN = VSW = 5V, VOUT = 5.5V, VEN = VFB = GND PMOS Switch Leakage IPLK — 0.2 — µA VIN = VSW = GND, VOUT = 5.5V NMOS Switch ON Resistance RDS(ON)N — 0.15 —  VIN = 3.3V, ISW = 250 mA, Note 5 PMOS Switch ON Resistance RDS(ON)P — 0.3 —  VIN = 3.3V, ISW = 250 mA, Note 5 IN(MAX) — 1.8 — A Note 5 NMOS Peak Switch Current Limit Accuracy Line Regulation Load Regulation Note 1: 2: 3: 4: 5: Conditions VFB% -3 — 3 % MCP1642B/D-ADJ, VIN = 1.2V VOUT% -3 — 3 % MCP1642B/D-18, VIN = 1.2V -3 — 3 % MCP1642B/D-30, VIN = 1.2V -3 — 3 % MCP1642B/D-33, VIN = 1.2V -3 — 3 % VFB/VFB) /VIN| -0.5 0.01 0.5 %/V MCP1642B/D-ADJ, VIN = 1.5V to 3.0V, IOUT = 25 mA MCP1642B/D-50, VIN = 2.5V VOUT/VOUT) /VIN| -0.5 0.05 0.5 %/V MCP1642B/D-18, VIN = 1.0V to 1.5V, IOUT = 25 mA -0.5 0.01 0.5 %/V MCP1642B/D-30, VIN = 1.5V to 2.5V, IOUT = 25 mA -0.5 0.01 0.5 %/V MCP1642B/D-33, VIN = 1.5V to 3.0V, IOUT = 25 mA -0.5 0.01 0.5 %/V MCP1642B/D-50, VIN = 2.5V to 4.2V, IOUT = 25 mA VFB/VFB| -1.5 0.05 1.5 % IOUT = 25 mA to 150 mA, VIN = 1.5V VOUT/VOUT| -1.5 0.1 1.5 % MCP1642B/D-18, VIN = 1.5V, IOUT = 25 mA to 75 mA -1.5 0.1 1.5 % MCP1642B/D-30, VIN = 1.5V, IOUT = 25 mA to 125 mA -1.5 0.1 1.5 % MCP1642B/D-33, VIN = 1.5V, IOUT = 25 mA to 150 mA — 0.5 — % MCP1642B/D-50, VIN = 3.0V, IOUT = 25 mA to 500 mA, Note 5 Resistive load, 1 mA. For VIN > VOUT, VOUT will not remain in regulation. IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPWM * (VOUT/VIN)). 220 resistive load, 3.3V VOUT (15 mA). Determined by characterization, not production tested. DS20005253A-page 4  2014 Microchip Technology Inc. MCP1642B/D DC CHARACTERISTICS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C, MCP1642B/D-ADJ. Boldface specifications apply over the TA range of -40°C to +85°C. Parameters Sym. Min. Typ. Max. Units Maximum Duty Cycle DCMAX — 90 — % Switching Frequency fSW 0.85 1.0 1.15 MHz EN Input Logic High VIH 75 — — % of VIN IOUT = 1 mA, for MCP1642B/D-50 VIN = 2.5V EN Input Logic Low VIL — — 20 % of VIN IOUT = 1 mA, for MCP1642B/D-50 VIN = 2.5V EN Input Leakage Current Conditions Note 5 Note 5, IOUT = 65 mA, for MCP1642B/D-50 VIN = 2.5V IENLK — 0.1 — µA VEN = 1.2V Power Good Threshold PGTHF — 90 — % VFB Falling, Note 5 Power Good Hysteresis PGHYS — 3 — % Note 5 Power Good Output Low PGLOW — 0.4 — V ISINK = 5 mA, VFB = 0V, Note 5 PGDELAY — 600 — µs Note 5 Power Good Output Response Power Good Output Delay PGRES — 250 — µs Note 5 Power Good Input Voltage Operating Range VPG_VIN 0.9 — 5.5 V ISINK = 5 mA, VFB = 0V, Note 5 Power Good Leakage Current PGLEAK — 0.01 — µA VPG = 5.5V, VOUT in Regulation, Note 5 Soft Start Time tSS — 550 — µs Thermal Shutdown Die Temperature TSD — 150 — C EN Low to High, 90% of VOUT, Note 4, Note 5 Note 5 TSDHYS — 35 — C Note 5 Die Temperature Hysteresis Note 1: 2: 3: 4: 5: Resistive load, 1 mA. For VIN > VOUT, VOUT will not remain in regulation. IQPWM is measured from VOUT; VOUT is externally supplied with a voltage higher than the nominal 3.3V output (device is not switching), no load. VIN quiescent current will vary with boost ratio. VIN quiescent current can be estimated by: (IQPWM * (VOUT/VIN)). 220 resistive load, 3.3V VOUT (15 mA). Determined by characterization, not production tested. TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, IOUT = 15 mA, TA = +25°C. Parameters Sym. Min. Typ. Max. Units Operating Ambient Temperature Range TA -40 — +85 °C Storage Temperature Range TA -65 — +150 °C Maximum Junction Temperature TJ — — +150 °C Thermal Resistance, 8L-MSOP JA — 211 — °C/W Thermal Resistance, 8L-2x3 DFN JA — 68 — °C/W Conditions Temperature Ranges Steady State Transient Package Thermal Resistances  2014 Microchip Technology Inc. DS20005253A-page 5 MCP1642B/D NOTES: DS20005253A-page 6  2014 Microchip Technology Inc. MCP1642B/D 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). 100 500 80 450 Efficiency (%) IQ PWM Mode (µA) 475 425 VOUT = 5.0V 400 375 VOUT = 3.3V VIN = 1.6V 70 VIN = 1.2V 60 50 40 30 350 VOUT = 2.0V 20 325 10 300 0 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) FIGURE 2-1: Temperature. 80 VOUT IQPWM vs. Ambient 0.1 100 IOUT = 50 mA VIN = 1.8V 90 3.312 Efficiency (%) 3.310 3.308 3.306 10 IOUT (mA) 100 1000 2.0V VOUT Mode Efficiency VOUT = 3.3V VIN = 2.5V 80 VIN = 1.2V 1 FIGURE 2-4: vs. IOUT. 3.314 VOUT (V) VOUT = 2.0V 90 VIN = 1.2V VIN = 1.2V 70 60 50 40 30 20 10 3.304 -40 -25 -10 5 20 35 50 65 Ambient Temperature (°C) 3.3V VOUT vs. Ambient FIGURE 2-2: Temperature. 0 80 0.1 90 IOUT = 50 mA 5.000 VIN = 2.5V 4.995 4.990 4.985 100 1000 VOUT = 5.0V 80 Efficiency (%) VOUT (V) 5.005 10 IOUT (mA) 3.3V VOUT Mode Efficiency FIGURE 2-5: vs. IOUT. 100 5.010 1 VIN = 3.6V 70 VIN = 2.5V 60 50 40 30 20 VIN = 1.8V 10 4.980 -40 FIGURE 2-3: Temperature. -25 -10 5 20 35 50 65 Ambient Temperature (°C) 80 5.0V VOUT vs. Ambient  2014 Microchip Technology Inc. 0 0.1 FIGURE 2-6: vs. IOUT. 1 10 IOUT (mA) 100 1000 5.0V VOUT Mode Efficiency DS20005253A-page 7 MCP1642B/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). 1.50 1400 VOUT = 5.0V 1200 1.30 VOUT = 3.3V 1.10 VIN (V) IOUT (mA) 1000 VOUT = 5.0V 800 600 VOUT = 2.0V Start-up 0.70 400 Shutdown 0.50 TA = +25°C TA = +85°C 200 0.30 0 0.8 1.2 1.6 FIGURE 2-7: 2 2.4 2.8 VIN (V) 3.2 3.6 4 0 4.4 Maximum IOUT vs. VIN. 20 80 100 Switching Frequency (kHz) 1004 IOUT = 15 mA 3.302 TA = 25°C 3.300 3.298 3.296 TA = 85°C 3.294 TA = -40°C 3.292 VOUT = 3.3V 1000 996 992 988 3.290 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 2.8 -40 3 -25 -10 5 20 35 50 65 Ambient Temperature (°C) VIN (V) FIGURE 2-8: 4.5 VOUT = 3.3V 0.65 80 fSW vs. Ambient FIGURE 2-11: Temperature. 3.3V VOUT vs. VIN. 0.70 VOUT = 5.0V 4 Start-up 3.5 0.60 0.55 VIN (V) VIN (V) 40 60 IOUT (mA) FIGURE 2-10: 5.0V VOUT Minimum Start-Up and Shutdown VIN into Resistive Load vs. IOUT. 3.304 VOUT (V) 0.90 0.50 Shutdown 0.45 3 VOUT = 3.3V 2.5 VOUT = 2.0V 2 1.5 0.40 1 0.35 0.5 0.30 0 0 20 40 60 IOUT (mA) 80 100 FIGURE 2-9: 3.3V VOUT Minimum Start-Up and Shutdown VIN into Resistive Load vs. IOUT. DS20005253A-page 8 0 5 10 15 IOUT (mA) 20 25 FIGURE 2-12: PWM Pulse-Skipping Mode Threshold vs. IOUT.  2014 Microchip Technology Inc. MCP1642B/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). IIN (mA) 100 VOUT 20 mV/div AC coupled IOUT = 100 mA 10 VOUT = 5.0V VOUT = 3.3V 1 VSW 2V/div VOUT = 2.0V 0.1 0.8 1.2 1.6 2 FIGURE 2-13: Current vs. VIN. 2.4 2.8 VIN (V) 3.2 3.6 4 4.4 1 µs/div Average of No Load Input 2.5 Switch Resistance (:) IL 200 mA/div FIGURE 2-16: MCP1642B/D High Load PWM Mode Waveforms. 0.25 2 IOUT = 15 mA 0.2 N - Channel 1.5 0.15 1 0.1 VOUT 1V/div P - Channel 0.5 VIN 1V/div 0.05 0 0 1 1.4 1.8 2.2 2.6 3 3.4 > VIN or VOUT 3.8 VEN 1V/div 4.2 FIGURE 2-14: N-Channel and P-Channel RDSON vs. > of VIN or VOUT. 200 µs/div FIGURE 2-17: 3.3V Start-Up After Enable. IOUT = 1 mA VOUT 20 mV/div AC coupled I OUT = 15 mA VOUT 2V/div VSW 1V/div IL 100 mA/div VIN 1V/div IL 200 mA/div 200 µs/div 1 µs/div FIGURE 2-15: MCP1642B/D 3.3V VOUT Light Load PWM Mode Waveforms.  2014 Microchip Technology Inc. FIGURE 2-18: VIN = VENABLE. 3.3V Start-Up When DS20005253A-page 9 MCP1642B/D Note: Unless otherwise indicated, VIN = EN = 1.2V, COUT = CIN = 10 µF, L = 4.7 µH, VOUT = 3.3V, ILOAD = 15 mA, TA = +25°C (MCP1642B/D-ADJ, MSOP-8 package). VOUT 100 mV/div AC coupled IOUT 100 mA/div Step from 20 mA to 150 mA 400 µs/div FIGURE 2-19: MCP1642B 3.3V VOUT Load Transient Waveforms. VOUT 100 mV/div AC coupled VIN 1V/div Step from 1.2V to 2.4V 400 µs/div FIGURE 2-20: Waveforms. DS20005253A-page 10 3.3V VOUT Line Transient  2014 Microchip Technology Inc. MCP1642B/D 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP1642B/D-XX MCP1642B/D-ADJ MSOP, 2x3 DFN MSOP, 2x3 DFN 3.1 1 1 Symbol Description EN Enable pin. Logic high enables operation. Do not allow this pin to float. 2 — NC Not Connected. — 2 VFB Reference Voltage pin. Connect VFB to an external resistor divider to set the output voltage (for fixed VOUT options, this pin is not connected). 3 3 PG Open-Drain Power Good pin. Indicates when the output voltage is within regulation. 4 4 VOUT 5 5 SW 6 6 PGND Power Ground reference. 7 7 SGND Signal Ground reference. 8 8 VIN Input supply voltage. Local bypass capacitor required. 9 9 EP Exposed Thermal Pad (2x3 DFN only). Boost Converter Output. Boost and Rectifier Switch input. Connect boost inductor between SW and VIN. Enable Pin (EN) The EN pin is a logic-level input used to enable or disable device switching and lower quiescent current while disabled. A logic high (>75% of VIN) will enable the regulator output. A logic low ( VOUT SITUATION To calculate the resistor divider values for the MCP1642B/D, the following equation can be used. Where RTOP is connected to VOUT, RBOT is connected to GND and both are connected to the VFB input pin: For VIN > VOUT, the output voltage will not remain in regulation. VIN > VOUT is an unusual situation for a boost converter, and there is a common issue when two alkaline cells (2 x 1.6V typical) are used to boost to 3.0V output. A minimum headroom of approximately 200 to 300 mV between VOUT and VIN must be ensured, unless a low frequency higher than the PWM output ripple on VOUT is expected. This ripple and its frequency are VIN dependent. EQUATION 5-1: 5.3 5.2 Adjustable Output Voltage Calculations R TOP V OUT = R BOT   ------------- – 1  V FB  EXAMPLE 1: VOUT = 3.3V VFB = 1.21V RBOT = 309 k RTOP = 533.7 k (standard value = 536 k) EXAMPLE 2: VOUT = 5.0V VFB = 1.21V RBOT = 309 k RTOP = 967.9 k (standard value = 976 k) There are some potential issues with higher-value resistors. For small surface-mount resistors, environment contamination can create leakage paths that significantly change the resistive divider ratio, which in turn affects the output voltage. The FB input leakage current can also impact the divider and change the output voltage tolerance. For boost converters, the removal of the feedback resistors during operation must be avoided. In this case, the output voltage will increase above the absolute maximum output limits of the MCP1642B/D and damage the device (for additional information, see Application Note AN1337).  2014 Microchip Technology Inc. Power Good Output The Power Good output is meant to provide a method that gives information about the output state of the device. The Power Good comparator is triggered when VOUT reaches approximately 90% of regulation (on the falling edge). The PG pin is an open-drain output, which should be connected to VOUT through an external pull-up resistor. It is recommended to use a high-value resistor (to sink µA from output) in order to use less power while interfacing with an I/O PIC MCU port. The Power Good block is internally supplied by the maximum between the input and output voltage, and the minimum voltage necessary is 0.9V. This is important for applications in which the Power Good pin is pulled-up to an external supply. If the output voltage is less than 0.9V (e.g., due to an overcurrent situation or an output short circuit, and also if the device is in Shutdown - EN = GND), the input voltage has to be high enough to drive the Power Good circuitry. Power Good delay time is measured between the time when VOUT starts to regulate and the time when there is a response from Power Good output. Power Good response time is measured between the time when VOUT goes out of regulation with a 10% drop, and the time when Power Good output gets to a low level. Both Power Good delay time and Power Good response time are specified in the DC Characteristics table. Additionally, there are no blanking time or delays; there is only a 3% hysteresis of the Power Good comparator. Due to the dynamic response, MCU must interpret longer transients. DS20005253A-page 17 MCP1642B/D When VOUT resumes to a value higher than 93%, the PG pin switches to high level. 600 µs (typ.) 250 µs (typ.) VOUT PG DELAY PG RESPONSE PG Where: dV = Ripple voltage dt = ON time of the N-Channel switch (DC x 1/FSW) Table 5-1 contains the recommended range for the input and output capacitor value. Power Good Timing Diagram. Input Capacitor Selection The boost input current is smoothed by the boost inductor, reducing the amount of filtering necessary at the input. Some capacitance is recommended to provide decoupling from the source. Low ESR X5R or X7R are well suited, since they have a low temperature coefficient and small size. For light-load applications, 4.7 µF of capacitance is sufficient at the input. For high-power applications that have high source impedance or long leads which connect the battery to the input, 10 µF of capacitance is recommended. Additional input capacitance can be added to provide a stable input voltage. Table 5-1 contains the recommended range for the input capacitor value. 5.5 dV IOUT = C OUT   -------  dt  TABLE 5-1: FIGURE 5-1: 5.4 EQUATION 5-2: Output Capacitor Selection The output capacitor helps provide a stable output voltage during sudden load transients and reduces the output voltage ripple. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application. Using other capacitor types (aluminum or tantalum) with large ESR has impact on the converter's efficiency (see AN1337) and maximum output power. The MCP1642B/D devices are internally compensated, so output capacitance range is limited. See Table 5-1 for the recommended output capacitor range. An output capacitance higher than 10 µF adds a better load step response and high-frequency noise attenuation, especially while stepping from light current loads to heavy current loads. In addition, 2 x 10 µF output capacitors ensure a better recovery of the output after a short period of overloading. While the N-Channel switch is on, the output current is supplied by the output capacitor COUT. The amount of output capacitance and equivalent series resistance will have a significant effect on the output ripple voltage. While COUT provides load current, a voltage drop also appears across its internal ESR that results in ripple voltage. DS20005253A-page 18 CAPACITOR VALUE RANGE CIN COUT Minimum 4.7 µF 10 µF Maximum — 100 µF 5.6 Inductor Selection The MCP1642B/D devices are designed to be used with small surface-mount inductors; the inductance value can range from 2.2 µH to 6.8 µH. An inductance value of 4.7 µH is recommended to achieve a good balance between the inductor size, the converter load transient response and the minimized noise. TABLE 5-2: MCP1642B/D RECOMMENDED INDUCTORS Part Number Value DCR (µH)  (typ.) ISAT (A) Size WxLxH (mm) Coilcraft LPS4018-472 4.7 0.125 1.9 4.1x4.1x1.8 XFL4020-472 4.7 0.057 2.7 4.2x4.2x2.1 LPS5030-472 4.7 0.083 2 5x5x3 LPS6225-472 4.7 0.065 3.2 6.2x6.2x2.5 MSS6132-472 4.7 0.043 2.84 6.1x6.1x3.2 Würth Elektronik 744025004 Type WE-TPC 4.7 0.1 1.7 2.8x2.8x2.8 744042004 WE-TPC 4.7 0.07 1.65 4.8x4.8x1.8 744052005 WE-TPC 5 0.047 1.8 5.8x5.8x1.8 7447785004 WE-PD 4.7 0.06 2.5 6.2x5.9x3.3 B82462A2472M000 4.7 0.084 2.00 6.0x6.0x2.5 B82462G4472M 4.7 0.04 1.8 6.3x6.3x3.0 TDK/EPCOS Several parameters are used to select the correct inductor: maximum rated current, saturation current and copper resistance (ESR). For boost converters, the inductor current can be much higher than the output current. The lower the inductor ESR, the higher the efficiency of the converter: a common trade-off in size versus efficiency. The saturation current typically specifies a point at which the inductance has rolled off a percentage of the rated value. This can range from a 20% to 40% reduction in inductance. As inductance rolls off, the inductor ripple current increases, as does the peak switch current. It is important to keep the inductance from rolling off too much, causing switch current to reach the peak limit.  2014 Microchip Technology Inc. MCP1642B/D 5.7 Thermal Calculations The MCP1642B/D devices are available in two different packages (MSOP-8 and 2 x 3 DFN-8). By calculating the power dissipation and applying the package thermal resistance (JA), the junction temperature is estimated. The maximum continuous junction temperature rating for the MCP1642B/D family of devices is +125°C. To quickly estimate the internal power dissipation for the switching boost regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by Equation 5-3. EQUATION 5-3: V OUT  I OUT  ------------------------------- –  VOUT  I OUT  = P Dis  Efficiency  The difference between the first term, input power, and the second term, power delivered, is the power dissipation of the MCP1642B/D devices. This is an estimate assuming that most of the power lost is internal to the MCP1642B/D and not CIN, COUT and the inductor. There is some percentage of power lost in the boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the IINRMS2 x LESR power dissipation. 5.8 PCB Layout Information Good printed circuit board layout techniques are important to any switching circuitry, and switching power supplies are no different. When wiring the switching high-current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP1642B/D to minimize the loop area. The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference. +VIN L CIN GND MCP1642 COUT 1 RTOP RBOT +VOUT Via To Bottom Plane Enable FIGURE 5-2: Power Good MCP1642B/D Recommended Layout, Applicable to Both Packages.  2014 Microchip Technology Inc. DS20005253A-page 19 MCP1642B/D 6.0 TYPICAL APPLICATION CIRCUITS L 4.7 µH VOUT VIN 5.0V @ min. 500 mA SW 3.3V to 4.2V VOUT VIN LI-ION + MCP1642B-ADJ CIN 10 µF EN FIGURE 6-1: VFB PGND CC 27 pF COUT 10 µF RBOT 309 k PG - RTOP 976 k SGND Portable USB Powered by Li-Ion. L 4.7 µH VIN 1.8V to 3.6V SW VOUT 5.0V @ min. 500 mA VOUT VIN + CIN 10 µF COUT 10 µF MCP1642B-50 EN PG NC PGND SGND + 28.7 Service Estimate (hours) 30.0 - ® AA Energizer® MAX® AA Energizer® MAX Energizer® UltimateLithium LithiumAA AA Energizer® Ultimate 25.0 20.0 15.0 12.7 10.0 5.8 5.0 1.8 0.3 0.0 50 mA 250 mA 2.3 500 mA Constant Output Current with 5V DC VOUT Note: Service estimates apply to using two Energizer® MAX® AA or Energizer® Ultimate Lithium AA batteries as the power source. Note that, if PG or feedback divider network is used, some additional input drain current should be included, but there will be negligible effects on the service estimates at these three load currents. FIGURE 6-2: Portable USB Powered by Two Energizer® MAX® AA or Energizer® Ultimate Lithium AA Batteries with the 5.0V Fixed Option of the MCP1642B. DS20005253A-page 20  2014 Microchip Technology Inc. MCP1642B/D 7.0 PACKAGING INFORMATION 7.1 Package Marking Information 8-Lead DFN (2x3x0.9 mm) Example Part Number Code MCP1642B-18I/MC AJY MCP1642BT-18I/MC AJY MCP1642B-30I/MC AJU MCP1642BT-30I/MC AJU MCP1642B-33I/MC AJQ MCP1642BT-33I/MC AJQ MCP1642B-50I/MC AJL MCP1642BT-50I/MC AJL MCP1642B-ADJI/MC AKC MCP1642BT-ADJI/MC AKC MCP1642D-18I/MC AKA MCP1642DT-18I/MC AKA MCP1642D-30I/MC AJW MCP1642DT-30I/MC AJW MCP1642D-33I/MC AJS MCP1642DT-33I/MC AJS MCP1642D-50I/MC AJN MCP1642DT-50I/MC AJN MCP1642D-ADJI/MC AKE MCP1642DT-ADJI/MC AKE 8-Lead MSOP (3x3 mm) AJY 348 25 Example 42B50I 348256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2014 Microchip Technology Inc. DS20005253A-page 21 MCP1642B/D        !""#$%&  ' )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW KWWSZZZPLFURFKLSFRPSDFNDJLQJ e D b N N L K E2 E EXPOSED PAD NOTE 1 NOTE 1 2 1 1 2 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 8QLWV 'LPHQVLRQ/LPLWV 1XPEHURI3LQV 0,//,0(7(56 0,1 1 120 0$;  3LWFK H 2YHUDOO+HLJKW $    6WDQGRII $    &RQWDFW7KLFNQHVV $ 5() 2YHUDOO/HQJWK ' %6& 2YHUDOO:LGWK ( ([SRVHG3DG/HQJWK '  ± ([SRVHG3DG:LGWK (  ±  E    &RQWDFW/HQJWK /    &RQWDFWWR([SRVHG3DG .  ± ± &RQWDFW:LGWK %6& %6&   '  3LQYLVXDOLQGH[IHDWXUHPD\YDU\EXWPXVWEHORFDWHGZLWKLQWKHKDWFKHGDUHD  3DFNDJHPD\KDYHRQHRUPRUHH[SRVHGWLHEDUVDWHQGV  3DFNDJHLVVDZVLQJXODWHG  'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(
MCP1642DT-33I/MC 价格&库存

很抱歉,暂时无法提供与“MCP1642DT-33I/MC”相匹配的价格&库存,您可以联系我们找货

免费人工找货