MCP19122/3
Digitally Enhanced Power Analog Controller
with Integrated Synchronous Driver
Synchronous Buck Features
Microcontroller Features
• Input Voltage: 4.5V to 40V (operating), 48V
(non-operating)
• Output Voltage: 0.3V to 16V
- 0.1% typical output voltage accuracy
- Greater than 16V requires external divider
• Switching Frequency: 100 kHz to 1.6 MHz
• Shutdown Quiescent Current: 50 µA Typical
• High-Drive:
- +5V Gate Drive
- 2A Source Current
- 2A Sink Current
• Low-Drive:
- +5V Gate Drive
- 2A Source Current
- 4A Sink Current
• Emulated Average Current Mode Control
• Differential Remote Output Sense
• Multi-Phase Systems:
- Master or Slave
- Frequency Synchronized
- Common Current Sense Signal
• Multiple Output Systems:
- Master or Slave
- Frequency Synchronized
• AEC-Q100 Qualified
• Configureable Parameters:
- Overcurrent Limit
- Input Undervoltage Lockout
- Input Overvoltage
- Output Overvoltage
- Output Undervoltage
- Internal Analog Compensation
- Soft Start Profile
- Synchronous Driver Dead Time
- Switching Frequency
• Thermal Shutdown
• Precision 8 MHz Internal Oscillator Block:
- Factory Calibrated
• Interrupt Capable
- Firmware
- Interrupt-on-Change Pins
• Only 35 Instructions to Learn
• 4096 Words On-Chip Program Memory
• High Endurance Flash:
- 100,000 Write Flash Endurance
- Flash Retention: >40 years
• Watchdog Timer (WDT) with Independent
Oscillator for Reliable Operation
• Programmable Code Protection
• In-Circuit Debug (ICD) via Two Pins (MCP19123)
• In-Circuit Serial Programming™ (ICSP™) via Two
Pins
• 12 I/O Pins and One Input-Only Pin (MCP19122)
- 3 Open Drain Pins
- 2 Weak Current Source Pins
• 16 I/O Pins and One Input-Only Pin (MCP19123)
- 3 Open Drain Pins
- 2 Weak Current Source Pins
• Analog-to-Digital Converter (ADC):
- 10-bit Resolution
- 24 Internal Channels
- 8 External Channels
• Timer0: 8-bit Timer/Counter with 8-Bit Prescaler
• Enhanced Timer1:
- 16-bit Timer/Counter with Prescaler
- 2 Selectable Clock Sources
- External Gate Input Mode
• Timer2: 8-Bit Timer/Counter with Prescaler
- 8-bit Period Register
• Capture, Compare Module
• I2CTM Communication:
- 7-bit Address Masking
- 2 Dedicated Address Registers
- SMBus/PMBusTM Compatibility
2017 Microchip Technology Inc.
DS20005750A-page 1
MCP19122/3
Pin Diagram – 24-Pin 4X4 QFN (MCP19122)
GPB3
VDD
VIN
21
20
19
3
GPB0
GPA2
22
2
GPB1
GPA1
23
1
GPB2
GPA0
24
MCP19122
24-pin QFN 4 x 4 mm
18
BOOT
17
HDRV
16
PHASE
15
LDRV
14
PGND
13
ISP
MCP19122
GPA3
4
GPA7
5
EXP-25
DS20005750A-page 2
7
8
9
10
11
12
GPA4
GND
-VSEN
+VSEN
ISN
6
GPA5/MCLR
GPA6
2017 Microchip Technology Inc.
MCP19122/3
Timers
MSSP
1
Y
AN0
—
—
GPA1
2
Y
AN1
—
—
GPA2
3
Y
AN2
T0CKI
GPA3
4
Y
AN3
GPA4
8
N
—
—
Pull-up
A/D
GPA0
Interrupt
I/O
ANSEL
24-PIN QFN (MCP19122) SUMMARY
24-Pin QFN
TABLE 1:
Basic
Additional
IOC
Y
—
Analog Debug Output (1)
IOC
Y
—
Sync Signal In/Out (2, 3)
—
IOC
INT
—
—
Weak Current Source
—
IOC
—
—
Weak Current Source
Timer1 Gate Input 1
—
IOC
N
—
—
MCLR
—
—
(4)
IOC
(5)
Y
GPA5
7
N
—
—
GPA6
6
N
—
—
—
IOC
N
ICSPDAT
—
GPA7
5
N
—
—
SCL
IOC
N
ICSPCLK
—
GPB0
22
N
—
—
SDA
IOC
N
—
—
GPB1
23
Y
AN4
—
—
IOC
Y
—
Current Sense Output
Current Reference Input (3)
GPB2
24
Y
AN5
—
—
IOC
Y
—
Timer1 Gate Input 2
GPB3
21
N
—
—
—
IOC
Y
—
Clock Signal In/Out (2, 3)
VIN
19
N
—
—
—
—
—
VIN
Device Input Voltage
VDD
20
N
—
—
—
—
—
VDD
Internal Regulator Output
GND
9
N
—
—
—
—
—
GND
Small Signal Ground
PGND
14
N
—
—
—
—
—
—
Large Signal Ground
LDRV
15
N
—
—
—
—
—
—
Low-Side MOSFET
Connection
HDRV
17
N
—
—
—
—
—
—
High-Side MOSFET
Connection
PHASE
16
N
—
—
—
—
—
—
Switch Node
BOOT
18
N
—
—
—
—
—
—
Floating Bootstrap Supply
+VSEN
11
N
—
—
—
—
—
—
Output Voltage
Differential Sense
–VSEN
10
N
—
—
—
—
—
—
Output Voltage
Differential Sense
ISP
13
N
—
—
—
—
—
—
Current Sense Input
ISN
12
N
—
—
—
—
—
—
Current Sense Input
EP
—
—
—
—
—
—
—
—
Exposed Pad
Note 1:
2:
3:
4:
5:
The Analog Debug Output is selected when the BUFFCON bit is set.
Selected when device is functioning as multiple output master or slave by proper configuration of the MSC bits in
the MODECON register.
Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC bits in the
MODECON register.
The IOC is disabled when MCLR is enabled.
Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control.
2017 Microchip Technology Inc.
DS20005750A-page 3
MCP19122/3
Pin Diagram – 28-Pin 5X5 QFN (MCP19123)
GPB5
GPB1
GPB7
GPB0
GPB3
VDD
26
25
24
23
22
GPA1
27
1
GPB2
GPA0
28
MCP19123
28-pin QFN 5 x 5 mm
21
VIN
2
20
BOOT
GPA2
3
19
HDRV
GPB4
4
18
PHASE
GPA3
5
17
LDRV
GPA7
6
16
PGND
15
ISP
MCP19123
EXP-29
DS20005750A-page 4
8
9
10
11
12
13
14
GPA4
GPB6
GND
-VSEN
+VSEN
ISN
7
GPA5/MCLR
GPA6
2017 Microchip Technology Inc.
MCP19122/3
Timers
MSSP
1
Y
AN0
—
—
GPA1
2
Y
AN1
—
—
GPA2
3
Y
AN2
T0CKI
GPA3
5
Y
AN3
GPA4
9
N
—
GPA5
8
N
—
Pull-up
A/D
GPA0
Interrupt
I/O
ANSEL
28-PIN QFN (MCP19123) SUMMARY
28-Pin QFN
TABLE 2:
Basic
Additional
IOC
Y
—
Analog Debug Output (1)
IOC
Y
—
Sync Signal In/Out (2, 3)
—
IOC
INT
Y
—
Weak Current Source
—
—
IOC
Y
—
Weak Current Source
Timer1 Gate Input 1
—
—
IOC
N
—
—
—
IOC(4)
MCLR
—
—
(5)
Y
GPA6
7
N
—
—
—
IOC
N
—
CCD Input 1
GPA7
6
N
—
—
SCL
IOC
N
—
—
GPB0
24
N
—
—
SDA
IOC
N
—
—
GPB1
26
Y
AN4
—
—
IOC
Y
—
Current Sense Output
Current Reference Input(3)
GPB2
28
Y
AN5
—
—
IOC
Y
—
Timer1 Gate Input 2
GPB3
23
N
—
—
—
IOC
Y
—
Clock Signal In/Out (2, 3)
GPB4
4
Y
AN6
—
—
IOC
Y
ICSPDAT
ICDDAT
—
GPB5
27
Y
AN7
—
—
IOC
Y
ICSPCLK
ICDCLK
—
GPB6
10
N
—
—
—
IOC
Y
—
CCD Input 2
GPB7
25
N
—
—
—
IOC
Y
—
External A/D Reference
VIN
21
N
—
—
—
—
—
VIN
Device Input Voltage
VDD
22
N
—
—
—
—
—
VDD
Internal Regulator Output
GND
11
N
—
—
—
—
—
GND
Small Signal Ground
PGND
16
N
—
—
—
—
—
—
Large Signal Ground
LDRV
17
N
—
—
—
—
—
—
Low-Side MOSFET
Connection
HDRV
19
N
—
—
—
—
—
—
High-Side MOSFET
Connection
PHASE
18
N
—
—
—
—
—
—
Switch Node
BOOT
20
N
—
—
—
—
—
—
Floating Bootstrap Supply
+VSEN
13
N
—
—
—
—
—
—
Output Voltage
Differential Sense
–VSEN
12
N
—
—
—
—
—
—
Output Voltage
Differential Sense
ISP
15
N
—
—
—
—
—
—
Current Sense Input
ISN
14
N
—
—
—
—
—
—
Current Sense Input
—
—
—
—
—
—
—
—
Exposed Pad
EP
Note 1:
2:
3:
4:
5:
The Analog Debug Output is selected when the BUFFCON bit is set.
Selected when device is functioning as multiple output master or slave by proper configuration of the MSC bits in
the MODECON register.
Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC bits in the
MODECON register.
The IOC is disabled when MCLR is enabled.
Weak pull-up always enabled when MCLR is enabled, otherwise the pull-up is under user control.
2017 Microchip Technology Inc.
DS20005750A-page 5
MCP19122/3
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 9
2.0 Pin Description ........................................................................................................................................................................... 12
3.0 Functional Description ................................................................................................................................................................ 17
4.0 Electrical Characteristics ............................................................................................................................................................ 39
5.0 Digital Electrical Characteristics ................................................................................................................................................. 45
6.0 Typical Performance Curves. ..................................................................................................................................................... 55
7.0 Test Mux Control ........................................................................................................................................................................ 57
8.0 Relative Efficiency Measurement ............................................................................................................................................... 59
9.0 Device Calibration ...................................................................................................................................................................... 61
10.0 Memory Organization ................................................................................................................................................................. 75
11.0 Special Features of the CPU ...................................................................................................................................................... 87
12.0 Resets ........................................................................................................................................................................................ 91
13.0 Interrupts .................................................................................................................................................................................... 99
14.0 Power-Down Mode (Sleep) ...................................................................................................................................................... 109
15.0 Watchdog Timer (WDT)............................................................................................................................................................. 111
16.0 Oscillator Modes........................................................................................................................................................................113
17.0 I/O Ports ....................................................................................................................................................................................115
18.0 Interrupt-On-Change ................................................................................................................................................................ 129
19.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 133
20.0 Flash Program Memory Control ............................................................................................................................................... 145
21.0 Timer0 Module.......................................................................................................................................................................... 151
22.0 Timer1 Module With Gate Control ............................................................................................................................................ 153
23.0 Timer2 Module.......................................................................................................................................................................... 163
24.0 Dual Capture/Compare (CCD) Module..................................................................................................................................... 165
25.0 Internal Temperature Indicator Module..................................................................................................................................... 169
26.0 Enhanced PWM Module........................................................................................................................................................... 171
27.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 175
28.0 Instruction Set Summary .......................................................................................................................................................... 217
29.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 227
30.0 Development Support............................................................................................................................................................... 229
31.0 Packaging Information.............................................................................................................................................................. 233
Appendix A: Revision History............................................................................................................................................................. 239
INDEX ................................................................................................................................................................................................ 241
The Microchip Web Site ..................................................................................................................................................................... 247
Customer Change Notification Service .............................................................................................................................................. 247
Customer Support .............................................................................................................................................................................. 247
Product Identification System............................................................................................................................................................. 249
Trademarks ........................................................................................................................................................................................ 251
Worldwide Sales and Service ............................................................................................................................................................ 252
DS20005750A-page 6
2017 Microchip Technology Inc.
MCP19122/3
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
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Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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2017 Microchip Technology Inc.
DS20005750A-page 7
MCP19122/3
NOTES:
DS20005750A-page 8
2017 Microchip Technology Inc.
MCP19122/3
1.0
used to provide complete customization of device operating parameters, start-up and shut-down profiles, protection levels and fault handling procedures.
DEVICE OVERVIEW
The MCP19122/3 is a stand-alone mixed signal
synchronous buck pulse-width modulated (PWM) current mode controller that features an integrated microcontroller core, high-endurance flash memory,
communication and configurable analog circuitry. It features integrated synchronous drivers, bootstrap device,
internal linear regulator and 4k words of nonvolatile
memory. The devices are capable of efficiently converting 4.5V-40V to 0.3V-16V.
After initial device configuration using Microchip’s
MPLAB® X Integrated Development Environment (IDE)
software, PMBus commands or I2C can be used by a
host to communicate with, or modify, the operation of
the MCP19122/3.
Since the MCP19122/3 uses traditional analog control circuitry to regulate the output of the DC/DC converter, the
integration of the PIC® microcontroller mid-range core is
FIGURE 1-1:
TYPICAL APPLICATION CIRCUIT
VIN
BOOT
VIN
HDRV
8
I/O
DATA
I/O
CLK
I/O
SMBALERT
I/O
ENABLE
I/O
PGOOD
I/O
TRACK
I/O
ADDR1
ADDR2
ADDR2
MCP19123
VDD
PHASE
VOUT
LDRV
PGND
ISP
ISN
GPA2
GPA3
-VSEN
+VSEN
GND
2017 Microchip Technology Inc.
DS20005750A-page 9
MCP19122/3 SYNCHRONOUS BUCK BLOCK DIAGRAM
VIN
Sample
+6dB
Bias Gen
ISP
ISN
320:
To ADC
LDO1
ISENSE
LDO2
BGAP
AVDD
500mV
CSGSCON
VINUVLO
REF
VDD
VIN
VDD
AVDD
VINUVLO
4
VINUVLO
REF
VINUVLO
REF
Comp
Ramp
4
VINOVLO
REF
VINOVLO
BOOT
VINOVLO
REF
VINOVLO
REF
4
VOTOVLO
REF
5
VOUT
+
4
VOTUVLO
REF
VIN
VOTOVLO
OC
Comp
VOUT
HIGHDR
VOTUVLO
-
PHASE
10
VREGREF
LOWDR
ISENSE
+VSEN
DLY
4
500mV
VDD
+
-VSEN
VOUT
LVL_SFT
2017 Microchip Technology Inc.
VOUT
ISP
ISN
3
4
MODECON
4
DLY
4
+VSEN
-VSEN
OV UV UVLO OVLO OCFLAG
Debug
MUX
A/D Mux
I/O(Digital Signals)
1 ()
PGND
PIC CORE
I/O
GND
MCP19122/3
DS20005750A-page 10
FIGURE 1-2:
MCP19122/3
FIGURE 1-3:
MICROCONTROLLER CORE BLOCK DIAGRAM
Configuration
13
Flash
8
Data Bus
Program Counter
PORTA
GPA0
GPA1
GPA2
GPA3
GPA4
GPA5
4K x 14
Program
Memory
Program
Bus
RAM
256
bytes
8 Level Stack
(13-bit)
14
File
Registers
RAM Addr
GPA6
GPA7
9
Addr MUX
Instruction reg
7
Direct Addr
8
Indirect
Addr
PORTB
GPB0
GPB1
GPB2
GPB3
FSR reg
STATUS reg
8
Instruction
Decode &
Control
Timing
Generation
CLKIN
CLKOUT
3
Power-up
Timer
GPB4(1)
GPB5(1)
MUX
GPB6(1)
GPB7(1)
Power-on
Reset
ALU
8
Watchdog
Timer
W reg
Brown-out
Reset
MSSP
SDA
SCL
8 MHz Internal
Oscillator
T1G
MCLR
T2G
T0CKI
Timer0
PMDATL
Self read/
write flash
memory
VIN VSS
Timer1
OUV
COMP
Timer2
CCD
Analog interface
registers
CCD1
EEADDR
PWM
CCD2
Note 1: Not implemented on the MCP19122.
2017 Microchip Technology Inc.
DS20005750A-page 11
MCP19122/3
2.0
PIN DESCRIPTION
The MCP19122/3 family of devices features pins that
have multiple functions associated with each pin.
Table 2-1 provides a description of the different functions. See Section 2.1 “Detailed Pin Description” for
more detailed information.
TABLE 2-1:
MCP19122/3 PINOUT DESCRIPTION
Name
GPA0/AN0/ANALOG_TEST
GPA1/AN1/SYC_SIGNAL
GPA2/AN2/T0CKI/INT
GPA3/AN3/T1G1
Function
Input
Type
Output
Type
GPA0
TTL
CMOS
General purpose I/O
AN0
AN
—
A/D Channel 0 input.
ANALOG_TEST
—
—
Internal analog signal multiplexer output (1)
GPA1
TTL
CMOS
General purpose I/O
Description
AN1
AN
—
A/D Channel 1 input
SYC_SIGNAL
—
—
Switching clock synchronization signal input and
output (2 ,3)
GPA2
TTL
CMOS
General purpose I/O
AN2
AN
—
A/D Channel 2 input
T0CKI
ST
—
Timer0 clock input
INT
ST
—
External interrupt
GPA3
TTL
CMOS
General purpose I/O
AN3
AN
—
A/D Channel 3 input
T1G1
ST
—
Timer1 gate input 1
GPA4
GPA4
TTL
OD
General purpose I/O
GPA5/MCLR
GPA5
TTL
—
General purpose input only
MCLR
ST
—
Master Clear with internal pull-up
GPA6
ST
CMOS
General purpose I/O
CCD1
ST
CMOS
Capture/Compare input 1 (4)
CMOS
Serial Programming Data I/O (5)
GPA6/CCD1(4)/ICSPDAT(5)
ICSPDAT
GPA7/SCL/ICSPCLK(5)
GPB0/SDA
GPB1/AN4/CON_SIGNAL
Legend:
Note 1:
2:
3:
4:
5:
GPA7
ST
OD
General purpose open drain I/O
SCL
I2C
OD
I2C clock
ICSPCLK
ST
—
Serial Programming Clock (5)
GPB0
TTL
OD
General purpose I/O
SDA
I2C
OD
I2C data input/output
GPB1
TTL
CMOS
General purpose I/O
AN4
AN
—
A/D Channel 4 input
CON_SIGNAL
—
—
Current sense output or current reference
input (3)
AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open Drain
TTL = TTL compatible input ST =Schmitt Trigger input with CMOS levels
I2C = Schmitt Trigger input with I2C
Analog Test is selected when the BUFFCON bit is set.
Selected when device is functioning as multiple output master or slave by proper configuration of the MSC bits in
the MODECON register.
Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC bits in the
MODECON register.
Feature only available on the MCP19123.
Feature only available on the MCP19122.
DS20005750A-page 12
2017 Microchip Technology Inc.
MCP19122/3
TABLE 2-1:
MCP19122/3 PINOUT DESCRIPTION (CONTINUED)
Name
GPB2/AN5/T1G2
GPB3/CLOCK
GPB4(4)/AN6(4)/ICSPDAT(4)/
ICDDAT(4)
GPB5(4)/AN7(4)/ICSPCLK(4)/
ICDCLK(4)
GPB6/CCD2(4)
GPB7/VADC(4)
Function
Input
Type
Output
Type
GPB2
TTL
CMOS
General purpose I/O
Description
AN5
AN
—
A/D Channel 5 input
T1G2
ST
—
Timer1 gate input 2
GPB3
TTL
CMOS
CLOCK
—
—
General purpose I/O
GPB4
TTL
CMOS
General purpose I/O(4)
AN6
AN
—
A/D Channel 6 input(4)
ICSPDAT
ST
—
Serial Programming Data I/O(4)
ICDDAT
ST
—
In-circuit debug data(4)
GPB5
TTL
CMOS
General purpose I/O(4)
AN7
AN
—
A/D Channel 7 input(4)
ISCPCLK
ST
—
Serial Programming Clock(4)
ICDCLK
ST
—
In-circuit debug clock(4)
GPB6
TTL
CMOS
General purpose I/O
CCD2
ST
CMOS
Capture/Compare input 2(4)
CMOS
General purpose I/O
Clock signal input/output (2 ,3)
GPB7
TTL
VADC
AN
VIN
VIN
—
—
Device input supply voltage
VDD
VDD
—
—
Internal +5V LDO output pin
GND
GND
—
—
Small signal quiet ground
PGND
PGND
—
—
Large signal power ground
LDRV
LDRV
—
—
High-current drive signal connected to the gate
of the low-side MOSFET
HDRV
HDRV
—
—
Floating high-current drive signal connected to
the gate of the high-side MOSFET
PHASE
PHASE
—
—
Synchronous buck switch node connection
External voltage reference for A/D(4)
BOOT
BOOT
—
—
Floating bootstrap supply
+VSEN
+VSEN
—
—
Positive input of the output voltage sense
differential amplifier
–VSEN
–VSEN
—
—
Negative input of the output voltage sense
differential amplifier
ISP
ISP
—
—
Current sense input
ISN
ISN
—
—
Current sense input
—
—
—
Exposed Thermal Pad
EP
Legend:
Note 1:
2:
3:
4:
5:
AN = Analog input or output CMOS = CMOS compatible input or output
OD = Open Drain
TTL = TTL compatible input ST =Schmitt Trigger input with CMOS levels
I2C = Schmitt Trigger input with I2C
Analog Test is selected when the BUFFCON bit is set.
Selected when device is functioning as multiple output master or slave by proper configuration of the MSC bits in
the MODECON register.
Selected when device is functioning as multi-phase master or slave by proper configuration of the MSC bits in the
MODECON register.
Feature only available on the MCP19123.
Feature only available on the MCP19122.
2017 Microchip Technology Inc.
DS20005750A-page 13
MCP19122/3
2.1
2.1.1
Detailed Pin Description
GPA0 PIN
AN3 is an input to the A/D. To configure this pin to be
read by the A/D on channel 3, bits TRISA3 and ANSA3
must be set.
GPA0 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak pull-up and interrupt-on-change are also
available.
T1G1 is an input to the TIMER1 gate. To configure this
pin to be an external source to the TIMER1 gate circuitry, see Section 22.0 “Timer1 Module With Gate
Control”.
AN0 is an input to the A/D. To configure this pin to be
read by the A/D on channel 0, bits TRISA0 and ANSA0
must be set.
2.1.5
When the BUFFCON bit is set, this pin is
configured as the ANALOG_TEST function. It is a
buffered output of the internal analog and digital signal
multiplexer. Analog signals present on this pin are
controlled by the ADCON0 register; see Register 19-1.
Digital signals present on this pin are controlled by the
BUFFCON register; see Register 7-1.
2.1.2
GPA1 PIN
GPA1 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak pull-up and interrupt-on-change are also
available.
AN1 is an input to the A/D. To configure this pin to be
read by the A/D on channel 1, bits TRISA1 and ANSA1
must be set.
When the MCP19122/3 is configured as a multiple
output or multi-phase MASTER or SLAVE, this pin is
configured to be the switching frequency
synchronization input or output, SYN_SIGNAL. See
Section 3.12 “System Configuration Control” for
more information.
2.1.3
GPA2 PIN
GPA2 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak current source and interrupt-on-change
are also available.
AN2 is an input to the A/D. To configure this pin to be
read by the A/D on channel 2, bits TRISA2 and ANSA2
must be set.
When bit T0CS is set, the T0CKI function is enabled.
See Section 21.0 “Timer0 Module” for more
information.
GPA2 can also be configured as an external interrupt
by setting of the INTE bit. See Section 13.0.1 “GPA2/
INT Interrupt” for more information.
2.1.4
GPA3 PIN
GPA3 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPA. An
internal weak current source and interrupt-on-change
are also available.
DS20005750A-page 14
GPA4 PIN
GPA4 is a true open drain general purpose pin whose
data direction is controlled in TRISGPA. There is no
internal connection between this pin and device VDD,
making this pin ideal to be used as an SMBus Alert pin.
This pin does not have a weak pull-up, but interrupt-onchange is available.
2.1.6
GPA5 PIN
GPA5 is a general purpose TTL input-only pin. An internal weak pull-up and interrupt-on-change are also
available.
For programming purposes, this pin is to be connected
to the MCLR pin of the serial programmer. See
Section 29.0 “In-Circuit Serial Programming™
(ICSP™)” for more information.
2.1.7
GPA6 PIN
GPA6 is a general purpose CMOS input/output pin
whose data direction is controlled in TRISGPA. An
interrupt-on-change is also available.
On the MCP19122, the ISCPDAT is the primary serial
programming data input function. This is used in conjunction with ICSPCLK to serial program the device.
This pin function is only implemented on the
MCP19122.
On the MCP19123, this pin can be configured as an
input to the CCD module. For more information refer to
Section 24.0 “Dual Capture/Compare (CCD) Module”.
2.1.8
GPA7 PIN
GPA7 is a true open drain general purpose pin whose
data direction is controlled in TRISGPA. There is no
internal connection between this pin and device VDD.
This pin does not have a weak pull-up, but interrupt-onchange is available.
When the MCP19122/3 is configured for I2C
communication (see Section 27.2 “I2C Mode
Overview”), GPA7 functions as the I2C clock, SCL.
On the MCP19122, the ISCPCLK is the serial
programming clock function. This is used in conjunction
with ICSPDAT to serial program the device. This pin
function is only implemented on the MCP19122.
2017 Microchip Technology Inc.
MCP19122/3
2.1.9
GPB0 PIN
GPB0 is a true open drain general purpose pin whose
data direction is controlled in TRISGPB. There is no
internal connection between this pin and device VDD.
This pin does not have a weak pull-up, but
interrupt-on-change is available.
When the MCP19122/3 is configured for I2C
communication (see Section 27.2 “I2C Mode
Overview”), GPB0 functions as the I2C clock, SDA.
2.1.10
GPB1 PIN
GPB1 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN4 is an input to the A/D. To configure this pin to be
read by the A/D on channel 4, bits TRISB1 and ANSB1
must be set.
When the MCP19122/3 is configured as a multi-phase
MASTER or SLAVE, this pin is configured to be the
sensed current input or output signal. On a device configured to be a MASTER, this is an output signal of the
sensed current that is to be shared with the SLAVE
devices. On a device configured as a SLAVE, this is an
input signal used to as a current regulation point. See
Section 3.12 “System Configuration Control”, for
more information.
2.1.11
GPB2 PIN
GPB2 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN5 is an input to the A/D. To configure this pin to be
read by the A/D on channel 5, bits TRISB2 and ANSB2
must be set.
T1G2 is an input to the TIMER1 gate. To configure this
pin to be an external source to the TIMER1 gate circuitry, see Section 22.0 “Timer1 Module With Gate
Control”.
2.1.12
GPB3 PIN
GPB3 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
When the MCP19122/3 is configured as a multiple output or multi-phase Master or Slave, this pin is configured to be the switching frequency clock input or
output. See Section 3.12 “System Configuration
Control”.
2.1.13
GPB4 PIN
This pin and associated functions are only available on
the MCP19123 device.
2017 Microchip Technology Inc.
GPB4 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN6 is an input to the A/D. To configure this pin to be
read by the A/D on channel 6, bits TRISB4 and ANSB4
must be set.
On the MCP19123, the ISCPDAT is the primary serial
programming data input function. This is used in conjunction with ICSPCLK to serial program the device.
The ICDDAT is the in-circuit debug data function. This
pin function is only implemented on the MCP19123.
See Section 29.2 “In-Circuit Debugger”
2.1.14
GBP5 PIN
This pin and associated functions is only available on
the MCP19123 device.
GPB5 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
AN7 is an input to the A/D. To configure this pin to be
read by the A/D on channel 7, bits TRISB5 and ANSB5
must be set.
On the MCP19123, the ISCPCLK is the primary serial
programming clock function. This is used in conjunction
with ICSPDAT to serial program the device.
The ICDDLK is the in-circuit debug clock function. This
pin function is only implemented on the MCP19123.
See Section 29.2 “In-Circuit Debugger”
2.1.15
GPB6 PIN
This pin and associated functions is only available on
the MCP19123 device.
GPB6 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
CCD2 is an input to the CCD module. For more information refer to Section 24.0 “Dual Capture/Compare
(CCD) Module”.
2.1.16
GPB7 PIN
This pin and associated functions is only available on
the MCP19123 device.
GPB7 is a general purpose TTL input or CMOS output
pin whose data direction is controlled in TRISGPB. An
internal weak pull-up and interrupt-on-change are also
available.
VADC is an external A/D reference voltage input. See
Section 19.0 “Analog-to-Digital Converter (ADC)
Module”.
DS20005750A-page 15
MCP19122/3
2.1.17
VIN PIN
Device input power connection pin. It is recommended
that capacitance be placed between this pin and the
GND pin of the device.
2.1.18
VDD PIN
The output of the internal +5.0V regulator is connected
to this pin. It is recommended that a 1.0 µF bypass
capacitor be connected between this pin and the GND
pin of the device. The bypass capacitor should be
placed physically close to the device.
2.1.19
GND PIN
2.1.27
ISP PIN
The non-inverting input of the current sense amplifier is
connected to the ISP pin.
2.1.28
ISN PIN
The inverting input of the current sense amplifier is
connected to the ISN pin.
2.1.29
EXPOSED PAD (EP)
There is no internal connection to the Exposed Thermal
Pad. The EP should be connected to the GND pin and
to the GND PCB plane to aid in the removal of the heat.
GND is the small signal ground connection pin. This pin
should be connected to the exposed pad, on the
bottom of the package.
2.1.20
PGND PIN
Connect all large signal level ground returns to PGND.
These large-signal level ground traces should have a
small loop area and minimal length to prevent coupling
of switching noise to sensitive traces.
2.1.21
LDRV PIN
The gate of the low-side or rectifying MOSFET is
connected to LDRV. The PCB trace connecting LDRV
to the gate must be of minimal length and appropriate
width to handle the high peak drive currents and fast
voltage transitions.
2.1.22
HDRV PIN
The gate of the high-side MOSFET is connected to
HDRV. This is a floating driver referenced to PHASE.
The PCB trace connecting HDRV to the gate must be
of minimal length and appropriate width to handle the
high peak drive current and fast voltage transitions.
2.1.23
PHASE PIN
The PHASE pin provides the return path for the highside gate driver. The source of the high-side MOSFET,
drain of the low-side MOSFET and the inductor are
connected to this pin.
2.1.24
BOOT PIN
The BOOT pin is the floating bootstrap supply pin for
the high-side gate driver. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side MOSFET.
2.1.25
+VSEN PIN
The non-inverting input of the unity gain amplifier used
for output voltage remote sensing is connected to the
+VSEN pin.
2.1.26
-VSEN PIN
The inverting input of the unity gain amplifier used for output voltage remote sensing is connected to the –VSEN pin.
DS20005750A-page 16
2017 Microchip Technology Inc.
MCP19122/3
3.0
FUNCTIONAL DESCRIPTION
3.1
Internal Supplies
The operating input voltage of the MCP19122/3 ranges
from 4.5V to 40V. There are two internal Low Dropout
(LDO) voltage regulators. A 5V LDO (VDD) is used to
power the internal microcontroller, the internal gate
driver circuitry and provide a 5V output for external use.
It is recommended that a 1 µF ceramic capacitor be
placed between the VDD pin and the PGND pin.
The MODECON bit controls the state of the
5V VDD LDO when the SLEEP command is issued to
the MCP19122/3. See Section 3.12.3 “VDD LDO
Control” for more information.
The gate drive current required to drive the external
power MOSFETs must be added to the MCP19122/3
quiescent current IQ(max). This total current must be
less than the maximum current, IDD-OUT, available
from VDD that is specified in Section 4.0 “Electrical
Characteristics”.
3.2
Switching Frequency
The switching frequency is configurable over the range
of 100 kHz to 1.6 MHz. The Timer2 module is used to
generate the HDRV/LDRV switching frequency. Refer
to Section 26.0, Enhanced PWM Module for more
information. Example 3-1 shows how to configure the
MCP19122/3 for a switching frequency of 300 kHz.
EXAMPLE 3-1:
BANKSEL
CLRF
CLRF
MOVLW
MOVWF
MOVLW
MOVWF
MOVWF
MOVLW
MOVWF
MOVWF
MOVLW
MOVWF
CONFIGURING FSW
T2CON
T2CON
TMR2
0x19
PR2
0x0A
PWMRL
PWMRH
0x00
PWMPHL
PWMPHH
0x04
T2CON
;Turn off Timer2
;Initialize module
;Fsw=300 kHz
;Max duty cycle=40%
;No phase shift
;Turn on Timer2
A second 4V LDO (AVDD) is used to power the internal
analog circuitry. The AVDD is not available externally.
AVDD is calibrated to 4.096V and is the default ADC reference voltage.
EQUATION 3-1:
TOTAL REGULATOR
CURRENT
I DD – OUT > I Q + I DRIVE + I EXT
Where:
- IDD-OUT is the total current available from VDD
- IQ is the device quiescent current
- IDRIVE is the current required to drive the
external MOSFETs
- IEXT is the amount of current used to power
additional external circuitry.
EQUATION 3-2:
GATE DRIVE CURRENT
I DRIVE = Q gHIGH + Q gLOW FSW
Where:
- IDRIVE is the current required to drive the
external MOSFETs
- QgHIGH is the total gate charge of the
high-side MOSFET
- QgLOW is the total gate charge of the
low-side MOSFET
- FSW is the switching frequency
2017 Microchip Technology Inc.
DS20005750A-page 17
MCP19122/3
3.3
Input Voltage Monitoring
The input voltage to the MCP19122/3 is monitored to
determine an input undervoltage or an input overvoltage. It can also be measured by the ADC and reported
as telemetry data.
3.3.1
INPUT UNDERVOLTAGE LOCKOUT
The VINUVLO register contains the digital value that
sets the input under voltage lockout. When the input
voltage on the VIN pin to the MCP19122/3 is below this
programmed level, the PIR2 status flag will
be set. This bit is automatically cleared when the
MCP19122/3 VIN voltage rises above this programmed
level. The VINUVLO shall operate on a rising or falling
input voltage. Hysteresis shall exist between the rising
threshold that clears the flag and the failing threshold
that sets the flag.
A hardware under voltage lockout path can be enabled
by setting the VINCON bit. When this bit is
set and the voltage on the VIN pin is below the threshold set by the VINUVLO register, hardware will keep
REGISTER 3-1:
the high-side and low-side MOSFET drivers off. Once
the voltage on the VIN pin is greater than the threshold
set by the VINUVLO register, the high-side and lowside MOSFET drivers are enabled.
To function properly, the VIN under voltage lockout setting must be lower than the VIN over voltage lockout
setting. The state of the VINUVLO and VINOVLO registers are unknown at power-up. Therefore if only the
VIN under voltage lockout is desired, the VIN over voltage lockout threshold still must be set in the VINOVLO
register.
Note:
The UVLOIF interrupt flag bit is set when
an interrupt condition occurs, regardless
of the state of its corresponding enable bit
or the Global Enable bit, GIE, of the INTCON register.
Note:
The UVLOIF interrupt flag bit is set when
an interrupt condition occurs regardless of
the state of the VINCON bit.
VINUVLO: INPUT UNDER VOLTAGE LOCKOUT CONTROL REGISTER
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
—
UVLO3
UVLO2
UVLO1
UVLO0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
UVLO: Under Voltage Lockout Configuration bits
0000 = 4.0V
0001 = 6.0V
0010 = 8.0V
0011 = 10.0V
0100 = 12.0V
0101 = 14.0V
0110 = 16.0V
0111 = 18.0V
1000 = 20.0V
1001 = 22.0V
1010 = 24.0V
1011 = 26.0V
1100 = 28.0V
1101 = 30.0V
1110 = 32.0V
1111 = 34.0V
DS20005750A-page 18
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.3.2
INPUT OVER VOLTAGE LOCKOUT
The VINOVLO register contains the digital value that
sets the input over voltage lockout. When the input voltage on the VIN pin to the MCP19122/3 is above this
programmed level, the PIR2 status flag will
be set. This bit is automatically cleared when the
MCP19122/3 VIN voltage falls below this programmed
level. The VINOVLO shall operate on a rising or falling
input voltage. Hysteresis shall exist between the rising
threshold that sets the flag and the failing threshold that
clears the flag.
A hardware over voltage lockout path can be enabled
by setting the VINCON bit. When this bit is
set and the voltage on the VIN pin is above the threshold set by the VINOVLO register, hardware will keep
the high-side and low-side MOSFET drivers off. Once
the voltage on the VIN pin is lower than the threshold
set by the VINOVLO register, the high-side and lowside MOSFET drivers are enabled.
REGISTER 3-2:
To function properly, the VIN overvoltage lockout setting
must be lower than the VIN undervoltage lockout setting. The state of the VINUVLO and VINOVLO registers
are unknown at power-up. Therefore if only the VIN
overvoltage lockout is desired, the VIN undervoltage
lockout threshold still must be set in the VINUVLO register.
Note:
The OVLOIF interrupt flag bit is set
when an interrupt condition occurs,
regardless of the state of its corresponding enable bit or the Global Enable bit,
GIE, of the INTCON register.
Note:
The OVLOIF interrupt flag bit is set when
an interrupt condition occurs regardless of
the state of the VINCON bit.
VINOVLO: INPUT OVERVOLTAGE LOCKOUT CONTROL REGISTER
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
—
OVLO3
OVLO2
OVLO1
OVLO0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
OVLO: Overvoltage Lockout Configuration bits
0000 = 12.0V
0001 = 14.0V
0010 = 16.0V
0011 = 18.0V
0100 = 20.0V
0101 = 22.0V
0110 = 24.0V
0111 = 26.0V
1000 = 28.0V
1001 = 30.0V
1010 = 32.0V
1011 = 34.0V
1100 = 36.0V
1101 = 38.0V
1110 = 40.0V
1111 = 42.0V
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 19
MCP19122/3
3.3.3
INPUT UNDER/OVERVOLTAGE
CONTROL REGISTER
overvoltage lockout status output bit in
the VINCON register indicates if an OVLO event has
occurred.
The VINCON register is the comparator control register
for both the input undervoltage lockout and input overvoltage lockout. It contains the enable bits, the polarity
edge detection bits and the status output bits for both
protection circuits. The interrupt flags and
in the PIR2 register are independent of the
enable and bits in the
VINCON register. The undervoltage
lockout status output bit in the VINCON register
indicates if an UVLO event has occurred. The
REGISTER 3-3:
When the input voltage on the VIN pin to the
MCP19122/3 is below the threshold programmed by
the VINUVLO register and the bit is set,
both the HDRV and LDRV gate drivers are disabled.
When the input voltage on the VIN pin to the
MCP19122/3 is above the threshold programmed by
the VINOVLO register and the bit is set,
both the HDRV and LDRV gate drivers are disabled.
VINCON: INPUT VOLTAGE UVLO AND OVLO CONTROL REGISTER
R/W-0
R-0
R/W-0
R/W-0
R/W-0
R-0
R/W-0
R/W-0
UVLOEN
UVLOOUT
UVLOINTP
UVLOINTN
OVLOEN
OVLOOUT
OVLOINTP
OVLOINTN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
UVLOEN: UVLO Comparator Module Logic Enable bit
1 = UVLO Comparator Module Logic enabled
0 = UVLO Comparator Module Logic disabled
bit 6
UVLOOUT: Undervoltage Lock Out Status bit
1 = UVLO event has occurred
0 = UVLO event has not occurred
bit 5
UVLOINTP: UVLO Comparator Interrupt-on-Positive Going Edge Enable bit
1 = UVLOIF will be set upon a positive going edge of the UVLO
0 = No UVLOIF will be set upon a positive going edge of the UVLO
bit 4
UVLOINTN: UVLO Comparator Interrupt on Negative Going Edge Enable bit
1 = UVLOIF will be set upon a negative going edge of the UVLO
0 = No UVLOIF will be set upon a negative going edge of the UVLO
bit 3
OVLOEN: OVLO Comparator Module Logic Enable bit
1 = OVLO Comparator Module Logic enabled
0 = OVLO Comparator Module Logic disabled
bit 2
OVLOOUT: Overvoltage Lock Out Status bit
1 = OVLO event has occurred
0 = OVLO event has not occurred
bit 1
OVLOINTP: OVLO Comparator Interrupt on Positive Going Edge Enable bit
1 = OVLOIF will be set upon a positive going edge of the OVLO
0 = No OVLOIF will be set upon a positive going edge of the OVLO
bit 0
OVLOINTN: OVLO Comparator Interrupt on Negative Going Edge Enable bit
1 = OVLOIF will be set upon a negative going edge of the OVLO
0 = No OVLOIF will be set upon a negative going edge of the OVLO
DS20005750A-page 20
2017 Microchip Technology Inc.
MCP19122/3
3.4
Output Overcurrent
The MCP19122/3 features a cycle-by-cycle peak
current limit. By monitoring the OCIF interrupt flag,
custom over current fault handling can be
implemented.
To detect an output overcurrent, the MCP19122/3
senses the voltage drop across the high-side MOSFET
while it is conducting. Leading-edge blanking is
incorporated to mask the overcurrent measurement for
a given amount of time. This helps prevent false
overcurrent readings.
When an output overcurrent is sensed, the OCIF flag is
set and the high-side drive signal is immediately
terminated. Without any custom overcurrent handling
implemented, the high-side drive signal will be asserted
high at the beginning of the next clock cycle. If the
overcurrent condition still exists, the high-drive signal
will again be terminated.
The OCIF interrupt flag must be cleared in software. It
can only be cleared once a switching cycle without an
overcurrent condition has occurred.
Register OCCON contains the bits used to configure
both the output overcurrent limit and the amount of
leading edge blanking (see Register 3-4).
The OCCON bit must be set to enable the
input overcurrent circuitry.
Note:
The OCIF interrupt flag bit is set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit or
the Global Enable bit, GIE, of the INTCON
register.
2017 Microchip Technology Inc.
DS20005750A-page 21
MCP19122/3
REGISTER 3-4:
OCCON: OUTPUT OVERCURRENT CONTROL REGISTER
R/W-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
OCEN
OCLEB1
OCLEB0
OOC4
OOC3
OOC2
OOC1
OOC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
OCEN: Output Overcurrent Control bit
1 = Output Overcurrent comparator is enabled
0 = Output Overcurrent comparator is disabled
bit 6-5
OCLEB: Leading Edge Blanking
00 = 110 ns blanking
01 = 200 ns blanking
10 = 380 ns blanking
11 = 740 ns blanking
bit 4-0
OOC: Output Overcurrent Configuration bits
00000 = 91 mV drop
00001 = 112 mV drop
00010 = 134 mV drop
00011 = 155 mV drop
00100 = 177 mV drop
00101 = 198 mV drop
00110 = 220 mV drop
00111 = 241 mV drop
01000 = 263 mV drop
01001 = 284 mV drop
01010 = 306 mV drop
01011 = 327 mV drop
01100 = 350 mV drop
01101 = 370 mV drop
01110 = 392 mV drop
01111 = 413 mV drop
10000 = 435 mV drop
10001 = 456 mV drop
10010 = 478 mV drop
10011 = 500 mV drop
10100 = 521 mV drop
10101 = 542 mV drop
10111 = 585 mV drop
11000 = 607 mV drop
11001 = 628 mV drop
11010 = 650 mV drop
11011 = 671 mV drop
11100 = 693 mV drop
11101 = 714 mV drop
11110 = 736 mV drop
11111 = 757 mV drop
DS20005750A-page 22
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.5
3.5.2
Current Sensing
The system output current can be sensed by using
either a low value resistor placed in series with the output or for applications that require the highest possible
efficiency the series resistance (DCR) of the inductor.
For applications that use DCR sensing, a resistor in
series with a capacitor are placed around the inductor,
as shown in Figure 3-1. If the value of RS and CS are
chosen so the RC time constant matches the inductor
time constant, the voltage appearing across CS will
equal the voltage across the DCR and therefore the
current flowing through the inductor. Equation 3-3 can
be used to select RS and CS.
FIGURE 3-1:
INDUCTOR CURRENT
SENSE FILTER
VIN
ISN
ISP
RS
CS
HIGHDR
INDUCTOR OR SENSE RESISTOR
SELECTION
The DCR of the inductor or the value of the sense resistor are to be selected so the output of the internal current sense amplifier output does not exceed 3.0V at full
load current. The internal current sense amplifier has a
fixed gain of 32. See Equation 3-4.
EQUATION 3-4:
SENSE ELEMENT
RESISTANCE
AMP VOUT
R SENSE = -----------------------------------------AMPGAIN I MAX
Where:
- RSENSE is the resistance of the sense
element
- AMPVOUT is the maximum output voltage of the current sense amplifier
- AMPGAIN is the fixed gain of the current
sense amplifier
- IMAX is the maximum application load
current
To Load
PHASE
L
DCR
LOWDR
3.5.3
EQUATION 3-3:
CALCULATING FILTER
VALUES
L
------------ = R S C S
DCR
MEASURING SYSTEM LOAD
CURRENT
The system load current can be measured by the internal ADC. Before being measured by the ADC, the sampled current is gained by a fixed +6 dB. It is
recommended that multiple ADC readings of the sampled current be taken and averaged together to provide
a more uniform measurement.
Where:
- L is the inductance value of the output
inductor
- DCR is the series resistance of the output inductor
- RS is the current sense filter resistor
- CS is the current sense filter capacitor
3.5.1
CURRENT SENSE GAIN
The entire current sense path has a fixed gain of 32.
Additional gain or attenuation can be added. The
amount added is controlled by the CSGSCON register,
Register 3-5. The gain added to this current sense signal does not change the +6 dB of current sense gain
added before being read by the A/D.
2017 Microchip Technology Inc.
DS20005750A-page 23
MCP19122/3
REGISTER 3-5:
CSGSCON: CURRENT SENSE GAIN CONTROL REGISTER
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
CSGS4
CSGS3
CSGS2
CSGS1
CSGS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
CSGS: Current Sense Gain Setting bits
000000 = -3.0 dB
000001 = -2.8 dB
000010 = -2.6 dB
000011 = -2.4 dB
000100 = -2.2 dB
000101 = -2.0 dB
000110 = -1.8 dB
000111 = -1.6 dB
001000 = -1.4 dB
001001 = -1.2 dB
001010 = -1.0 dB
001011 = -0.8 dB
001100 = -0.6 dB
001101 = -0.4 dB
001110 = -0.2 dB
001111 = 0.0 dB
010000 = 0.2 dB
010001 = 0.4 dB
010010 = 0.6 dB
010011 = 0.8 dB
010100 = 1.0 dB
010101 = 1.2 dB
010110 = 1.4 dB
010111 = 1.6 dB
011000 = 1.8 dB
011001 = 2.0 dB
011010 = 2.2 dB
011011 = 2.4 dB
011100 = 2.6 dB
011101 = 2.8 dB
011110 = 3.0 dB
011111 = 3.2 dB
DS20005750A-page 24
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.6
FIGURE 3-2:
Control Parameters
3.6.1
SIMPLIFIED
COMPENSATION
COMPENSATION SETTING
+VSEN
The MCP19122/3 is an emulated current mode
controller with integrated compensation. The desired
response of the overall loop can be tuned by proper
placement of the compensation zero frequency and
gain. The CMPZCON register, Register 3-6, is used to
adjust the compensation zero frequency and gain.
Figure 3-2 shows a simplified drawing of the internal
compensation with and the adjustable gain differential
amplifier.
REGISTER 3-6:
xG
-VSEN
VREF
CMPZCON: COMPENSATION SETTING CONTROL REGISTER
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
CMPZF3
CMPZF2
CMPZF1
CMPZF0
CMPZG3
CMPZG2
CMPZG1
CMPZG0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
x = Bit is unknown
CMPZF: Compensation Zero Frequency Setting bits
0000 = 1500 Hz
0001 = 1850 Hz
0010 = 2300 Hz
0011 = 2840 Hz
0100 = 3460 Hz
0101 = 4300 Hz
0110 = 5300 Hz
0111 = 6630 Hz
1000 = 8380 Hz
1001 = 9950 Hz
1010 = 12200 Hz
1011 = 14400 Hz
1100 = 18700 Hz
1101 = 23000 Hz
1110 = 28400 Hz
1111 = 35300 Hz
bit 3-0
CMPZG: Compensation Gain Setting bits
0000 = 30.13 dB
0001 = 27.73 dB
0010 = 24.66 dB
0011 = 22.41 dB
0100 = 20.08 dB
0101 = 17.78 dB
0110 = 15.42 dB
0111 = 13.06 dB
1000 = 10.75 dB
1001 = 8.30 dB
1010 = 6.02 dB
1011 = 3.52 dB
1100 = 1.21 dB
1101 = –1.41 dB
1110 = –3.74 dB
1111 = –6.02 dB
2017 Microchip Technology Inc.
DS20005750A-page 25
MCP19122/3
3.6.2
SLOPE COMPENSATION RAMP
The difference between the average inductor current
and the DC value of the sampled inductor current can
cause instability for certain operating conditions. This
instability occurs when the inductor ripple current does
not return to its initial value by the start of the next
switching cycle. Adding slope compensation ramp to
REGISTER 3-7:
the current sense signal prevents this oscillation. The
amount of slope added is controlled by the RAMPCON
register, Register 3-7.
Note 1: To enable the slope compensation
circuitry, the RAMPCON bit
must be cleared.
RAMPCON: COMPENSATION RAMP CONTROL REGISTER
R/W-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
R/W-x
RMPEN
—
—
RMP4
RMP3
RMP2
RMP1
RMP0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
RMPEN: Compensation Ramp Disable bit
1 = Compensation ramp is disabled
0 = Compensation ramp is enabled
bit 6-5
Unimplemented: Read as ‘0’
bit 4-0
RMP: Compensation Ramp Configuration bits
RMP = (dV/dt * 200/VIN); Where dV/dt is in V/µs
DS20005750A-page 26
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.7
accomplished by the settings contained in the VOUTH
and VOUTL registers. See Equation 3-5 for more
information.
Determining System Output
Voltage
3.7.1
REFERENCE VOLTAGE
CONFIGURATION
The control system reference voltage is determined by
the setting contained in the 10-bit VREF DAC. The
system reference is adjustable in 2 mV typical
increments. The configuring of this DAC is
REGISTER 3-8:
Note 1: To enable the slope compensation
circuitry, the RAMPCON bit
must be cleared.
See Section 4.0, Electrical Characteristics for more
information regarding the DAC specification.
VOUTL: OUTPUT VOLTAGE SET POINT LSB CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
VOUT7
VOUT6
VOUT5
VOUT4
VOUT3
VOUT2
VOUT1
VOUT0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
VOUT: Output Voltage Set Point LSB Configuration bits
REGISTER 3-9:
VOUTH: OUTPUT VOLTAGE SET POINT MSB CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
—
—
—
—
—
—
VOUT9
VOUT8
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Unimplemented: Read as ‘0’
bit 1-0
OVOUT: Output Voltage Set Point MSB Configuration bits
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 27
MCP19122/3
3.7.2
DIFFERENTIAL AMPLIFIER GAIN
CONTROL
EQUATION 3-5:
The MCP19122/3 contains a low offset programmable
gain differential amplifier used for remote sensing of
the output voltage. Connect the +VSEN and –VSEN pins
directly at the load for better load regulation. The
+VSEN and –VSEN are the positive and negative inputs,
respectively, of the programmable gain differential
amplifier.
SYSTEM OUTPUT
VOLTAGE
V OUT
V REFDAC = -------------------------------------------------DA GAIN DAC STEP
Where:
- VREFDAC is the concatenated decimal
value of VOUTH and VOUTL
- DAGAIN is the programmable gain of the
differential amplifier.
- DACStep is the volts/step of the reference voltage DAC, typically 2 mV/step
- VOUT is the desired output voltage
The programmable gain settings are controlled by the
DAGCON register, Register 3-10.
Note 1: If the hexadecimal VREFDAC value
calculated is larger than 10-bits, the
programmable gain differential amplifier
gain must be adjusted.
REGISTER 3-10:
DAGCON: DIFFERENTIAL AMPLIFIER GAIN CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
DAG2
DAG1
DAG0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-3
Unimplemented: Read as ‘0’
bit 2-0
DAG: Differential Amplifier Gain control bit
000 = Gain of 1
001 = Gain of 1/2
010 = Gain of 1/4
011 = Gain of 1/8
100 = Gain of 2
101 = Gain of 4
110 = Gain of 8
111 = Gain of 1
DS20005750A-page 28
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.8
System Output Voltage Protection
The MCP19122/3 provides the option for hardware
and/or software protection for a system output under
voltage as well as a system output over voltage.
3.8.1
OUTPUT UNDERVOLTAGE
The output voltage is monitored and compared to an
adjustable undervoltage (UV) reference. When the
output voltage is below UV reference the PIR2
flag is set. If the hardware UV accelerator response
circuitry (see Register 3-14) is enabled, the high-side
MOSFET is turned on until the maximum programmed
duty cycle is reached. Then the low-side MOSFET is
turned on for the remainder of the switching period.
REGISTER 3-11:
Once the output voltage is above the UV reference the
MCP19122/3 returns to normal operation. The UVIF
flag must be cleared in software.
The output undervoltage reference is controlled by the
VOTUVLO register, Register 3-11. A fixed voltage is
subtracted from the adjustable system output voltage
reference.
Note 1: The system output voltage reference is
determined by the setting in the VOUTH
and VOUTL registers.
2: The UVIF interrupt flag bit is set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit
or the Global Enable bit, GIE, of the INTCON register.
VOTUVLO: OUTPUT UNDER VOLTAGE DETECT LEVEL CONTROL REGISTER
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
—
OUV3
OUV2
OUV1
OUV0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
OUV: Output Under Voltage Detect Level Configuration bits
0000 = VREF - 50 mV
0001 = VREF - 80 mV
0010 = VREF - 110 mV
0011 = VREF - 140 mV
0100 = VREF - 170 mV
0101 = VREF - 200 mV
0110 = VREF - 230 mV
0111 = VREF - 260 mV
1000 = VREF - 290 mV
1001 = VREF - 320 mV
1010 = VREF - 350 mV
1011 = VREF - 380 mV
1100 = VREF - 410 mV
1101 = VREF - 440 mV
1110 = VREF - 470 mV
1111 = VREF - 500 mV
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 29
MCP19122/3
3.8.2
OUTPUT OVER VOLTAGE
The output voltage is monitored and compared to an
adjustable over voltage (OV) reference. When the
output voltage is above OV reference the PIR2
flag is set. If the hardware OV accelerator response
circuitry, see Register 3-14, is enabled the high-side
and low-side MOSFETs are turned off until the output
voltage fails below the output over voltage reference.
Once the output voltage is below the OV reference the
MCP19122/3 returns to normal operation. The OVIF
flag must be cleared in software.
REGISTER 3-12:
The output under voltage reference is controlled by the
VOTOVLO register, Register 3-12. A fixed voltage is
added to the adjustable system output voltage
reference.
Note 1: The system output voltage reference is
determined by the setting in the VOUTH
and VOUTL registers.
2: The OVIF interrupt flag bit is set when
an interrupt condition occurs, regardless of the state of its corresponding
enable bit or the Global Enable bit, GIE,
of the INTCON register.
VOTOVLO: OUTPUT OVER VOLTAGE DETECT LEVEL CONTROL REGISTER
U-0
U-0
U-0
U-0
R/W-x
R/W-x
R/W-x
R/W-x
—
—
—
—
OOV3
OOV2
OOV1
OOV0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
OOV: Output Over Voltage Detect Level Configuration bits
0000 = VREF + 50 mV
0001 = VREF + 80 mV
0010 = VREF + 110 mV
0011 = VREF + 140 mV
0100 = VREF + 170 mV
0101 = VREF + 200 mV
0110 = VREF + 230 mV
0111 = VREF + 260 mV
1000 = VREF + 290 mV
1001 = VREF + 320 mV
1010 = VREF + 350 mV
1011 = VREF + 380 mV
1100 = VREF + 410 mV
1101 = VREF + 440 mV
1110 = VREF + 470 mV
1111 = VREF + 500 mV
DS20005750A-page 30
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.9
Internal Synchronous Driver
FIGURE 3-3:
The internal synchronous driver is capable of driving
two N-Channel MOSFETs in a synchronous rectified
buck converter topology. The gate of the floating
MOSFET is connected to the HDRV pin. The source of
this MOSFET is connected to the PHASE pin. This pin
is capable is sourcing and sinking 2A of peak current.
HDRV
HDLY
LDLY
The MOSFET connected to the LDRV pin is not
floating. The low-side MOSFET gate is connected to
the LDRV pin and the source of this MOSFET is
connected to PGND. This pin is capable of sourcing a
peak current of 2A. The peak sink current is 4A. This
helps keep the low-side MOSFET off when the
high-side MOSFET is turning on.
LDRV
3.9.2
3.9.1
MOSFET DRIVER DEAD TIME
The MOSFET driver dead time is defined as the time
between one drive signal going low and the
complimentary drive signal going high. Refer to
Figure 3-3. The MCP19122/3 has the capability to
adjust both the high-side and low-side driver dead time
independently. The adjustment of the driver dead time
is controlled by the DEADCON register.
MOSFET DRIVER CONTROL
The MCP19122/3 has the ability to independently
disable high-side or low-side driver circuitry. This
control of the HDRV or LDRV signal is accomplished by
setting or clearing the HIDIS or LODIS bits in the PE1
register. When either driver is disabled, the output
signal is set low. The default power-on or reset state is
to have the high-side and low-side drivers disabled.
3.10
Note 1: The DEADCON register controls the
amount of dead time added to the HDRV
or LDRV signal.
MOSFET DRIVER
DEAD TIME
High-Side MOSFET Driver Supply
A floating voltage is required by the high-side driver. An
external bootstrap capacitor connected between the
BOOT and PHASE pins supplies this gate drive voltage. This capacitor is charged by internally connecting
the BOOT pin to VDD when the PHASE pin is low.
The selection of the bootstrap capacitor is based upon
the total charge of the high-side power MOSFET and
the allowable droop in the voltage applied to the gate of
the high-side power MOSFET.
EQUATION 3-6:
BOOTSTRAP CAPACITOR
Q G Total
C BOOT = -----------------------V DROOP
Where:
- QG(Total) = High-side MOSFET Total Gate
Charge (C)
- VDROOP = Allowable Gate Drive Voltage
Droop (V)
2017 Microchip Technology Inc.
DS20005750A-page 31
MCP19122/3
REGISTER 3-13:
DEADCON: DRIVER DEAD TIME CONTROL REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
HDLY3
HDLY2
HDLY1
HDLY0
LDLY3
LDLY2
LDLY1
LDLY0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
HDLY: High-Side Dead Time Configuration bits
0000 = 14 ns delay
0001 = 18 ns delay
0010 = 22 ns delay
0011 = 26 ns delay
0100 = 30 ns delay
0101 = 34 ns delay
0110 = 38 ns delay
0111 = 42 ns delay
1000 = 46 ns delay
1001 = 50 ns delay
1010 = 54 ns delay
1011 = 58 ns delay
1100 = 62 ns delay
1101 = 66 ns delay
1110 = 70 ns delay
1111 = 74 ns delay
bit 3-0
LDLY: Low-Side Dead Time Configuration bits
0000 = -4 ns delay
0001 = 0 ns delay
0010 = 4 ns delay
0011 = 8 ns delay
0100 = 12 ns delay
0101 = 16 ns delay
0110 = 20 ns delay
0111 = 24 ns delay
1000 = 28 ns delay
1001 = 32 ns delay
1010 = 36 ns delay
1011 = 40 ns delay
1100 = 44 ns delay
1101 = 48 ns delay
1110 = 52 ns delay
1111 = 56 ns delay
DS20005750A-page 32
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.11
Analog Peripheral Control
The MCP19122/3 has various analog peripherals.
These peripherals can be configured to allow customizable operation. Refer to Register 3-14 more
information.
3.11.1
DIODE EMULATION MODE
The MCP19122/3 can operate in either diode
emulation or synchronous rectification mode. When
operating in diode emulation mode, the LDRV signal is
terminated when the voltage across the low-side
MOSFET is approximately 0V. This provides better
light load efficiency by preventing reverse current from
flowing through the inductor. Both the HDRV and LDRV
signals are low until the beginning of the next switching
cycle. At that time, the HDRV signal is asserted high,
turning on the high-side MOSFET.
The PE1 bit controls the diode emulation
operating mode of the MCP19122/3.
3.11.2
HIGH-SIDE DRIVER CONTROL
The high-side driver is enabled by clearing the
PE1 bit. Setting this bit disables the high-side
driver.
Note:
3.11.3
The HIDIS bit is reset to ‘1’ so the highside driver is in a known state after reset.
This bit must be cleared by software for
normal operation.
3.11.5
OUTPUT OVER VOLTAGE
ACCELERATOR
The MCP19122/3 has additional control circuitry to
allow it to respond quickly to an output overvoltage
condition. The enabling of this circuitry is handled by
the PE1 bit. When this bit is set, the
MCP19122/3 will respond to an output overvoltage
condition by turning off the high-side and low-side
MOSFETs until the output voltage is below the output
overvoltage threshold set by the OOVCON register.
The overvoltage reference is controlled by the
VOTOVLO register, Register 3-12.
3.11.6
RELATIVE EFFICIENCY RAMP
MEASUREMENT CONTROL
The PE1 bit determines what portion of the
Relative Efficiency Measurement timing ramp is connected to A/D channel 0x08h. When the
PE1 bit is low and the PE1 bit is
low, the RELEFF channel of the A/D (channel 0x08h)
will measure the valley of the relative efficiency timing
ramp. When the PE1 is low and the
PE1 bit is hit, the RELEFF channel of the A/D
will measure the peak of the relative efficiency timing
ramp.
LOW-SIDE DRIVE CONTROL
The low-side driver is enabled by clearing the
PE1 bit. Setting this bit disables the low-side
driver.
Note:
3.11.4
The LODIS bit is reset to ‘1’ so the lowside driver is in a known state after reset.
This bit must be cleared by software for
normal operation.
OUTPUT UNDERVOLTAGE
ACCELERATOR
The MCP19122/3 has additional control circuitry to
allow it to respond quickly to an output undervoltage
condition. The enabling of this circuitry is handled by
the PE1 bit. When this bit is set, the
MCP19122/3 will respond to an output under voltage
condition by turning on the high-side MOSFET until the
output voltage is above the output undervoltage
threshold set by the OUVCON register. The low-side
MOSFET is off during this time.
The undervoltage reference is controlled by the
VOTUVLO register, Register 3-11.
2017 Microchip Technology Inc.
DS20005750A-page 33
MCP19122/3
REGISTER 3-14:
PE1: ANALOG PERIPHERAL ENABLE 1 CONTROL REGISTER
R/W-0
R/W-0
R/W-1
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
DECON
TOPO
HIDIS
LODIS
MEASEN
SPAN
UVTEE
OVTEE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
DECON: Diode Emulation Mode bit
1 = Diode emulation mode enabled
0 = Synchronous rectification mode enabled
bit 6
TOPO: Topology selection control bit
1 = Boost topology is enabled
0 = Buck topology is enabled
bit 5
HIDIS: High-side driver control bit
1 = High-side driver is disabled
0 = High-side driver is enabled
bit 4
LODIS: Low-side driver control bit
1 = Low-side driver is disabled
0 = Low-side driver is enabled
bit 3
MEASEN: Relative efficiency measurement control bit
1 = Initiate relative efficiency measurement
0 = Relative efficiency measurement not in progress
bit 2
SPAN: Relative efficiency ramp measurement control bit
1 = A/D channel 0x08h measures the peak of the RELEFF signal
0 = A/D channel 0x08h measures the valley of the RELEFF signal
bit 1
UVTEE: Output Undervoltage Accelerator Enable bit
1 = Output undervoltage accelerator is enabled
0 = Output undervoltage accelerator is disabled
bit 0
OVTEE: Output Overvoltage Accelerator Enable bit
1 = Output overvoltage accelerator is enabled
0 = Output overvoltage accelerator is disabled
DS20005750A-page 34
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
3.12
System Configuration Control
The MCP19122/3 is capable of operating in a variety of
different configurations. The MODECON register controls the system configuration of the MCP19122/3.
3.12.1
ERROR AMPLIFIER CLAMP
The internal error amplifier is a rail-to-rail amplifier.
However, the output of the error amplifier can be
clamped
to
an
adjustable
level.
The
MODECON is the error amplifier clamp
control bit. Setting this bit enables the error amplifier
clamp. The bit is cleared on a reset making the error
amplifier clamp disabled by default.
The error amplifier clamp source is controlled by the
MODECON bit. When this bit is set, the
voltage present on GPA3 will set the error amplifier
clamp voltage.
The clamp voltage can also be determined by a combination of the GPA3 pin voltage and the sampled output
current. This is achieved by clearing the
MODECON bit.
Note:
3.12.2
The GPA3 pin can be configured as a
weak current source by setting the
WPUGPA bit. See Register 173.
INTERNAL PEDESTAL VOLTAGE
To improve accuracy at low voltages, a pedestal voltage is implemented throughout the analog control loop.
This voltage is typically 500 mV and can be enabled or
disabled by the MODECON bit. This pedestal voltage is enabled on any reset. The VGNDEN bit
must be cleared to disable the pedestal.
When the MCP19122/3 is disabled, the system output
voltage may float up. If the pedestal voltage is also disabled under this condition, the output voltage will not
float up. It is recommended that the pedestal voltage
always be enabled while operating the MCP19122/3.
Operating with the pedestal voltage disabled may
cause the MCP19122/3 to not meet all of the electrical
specifications contained in the specification table. See
Section 4.0 “Electrical Characteristics”.
3.12.3
VDD LDO CONTROL
The VDDEN bit controls the state of the internal 5V
VDD LDO when the SLEEP command is issued to the
microcontroller core. If the VDDEN bit is set and the
SLEEP command is issued the 5V VDD LDO will
remain operational and capable of supporting a load.
3.12.4
VOLTAGE/CURRENT SOURCE
The system output voltage or load current can be controlled by the MCP19122/3. The MODECON
is the control system configuration bit. When the CNSG
bit is cleared, the MCP19122/3 functions as a voltage
source. The system output voltage is regulated by comparing the sensed voltage to the adjustable reference
voltage.
When the CNSG bit is set, the MCP19122/3 is configured to control the system output current. The output
current is regulated by adjusting the high-side duty
cycle according to the amount of error that exists
between the sampled load current and the adjustable
reference.
3.12.5
MULTIPLE OUTPUT SYSTEM
CONFIGURATION
The MCP19122/3 is capable of being configured as a
Master or Slave in a multiple output system. The device
configuration is set by the MODECON bits.
3.12.5.1
Multiple Output System Master
When configured as a Master, the GPA1 pin is automatically set to output the switching frequency synchronization signal. The frequency of this synchronization
signal sets the converters switching frequency. The
GPB3 pin is automatically set to output the system
clock signal frequency of 8 MHz.
3.12.5.2
Multiple Output System Slave
The are two different multiple output Slave configurations. The first configuration, MSC = 010,
requires the Slave to receive a switching frequency
synchronization signal and system clock signal from a
Master device. For this configuration GPA1 and GPB3
are automatically set as an input. The switching frequency synchronization signal from the Master is connected to the GPA1 pin. Phase shift from this
synchronization signal can be applied. See
Equation 26-2. The 8 MHz system clock from the Master is connected to the GPB3 pin. This multiple output
Slave mode results in less switching waveform frequency jitter when compared to the Master’s switching
waveforms.
The second multiple output system Slave configuration, MSC = 110, requires the Slave to only
receive a switching frequency synchronization signal
from the Master. GPA1 is automatically set as an input
and the switching frequency synchronization signal
from the Master is connected to this pin. Phase shift
When the SLEEP command is issued and the VDDEN
bit is clear, the 5V VDD LDO will be commanded to a
low current consumption state. The voltage will drop to
approximately 3V and will not be able to supply any
external current.
2017 Microchip Technology Inc.
DS20005750A-page 35
MCP19122/3
from the synchronization signal can be applied. See
Equation 26-2. No system clock is required in this
mode.
Note 1: The TMR2 register should be initialized to
0 to allow proper synchronization.
2: The PWMPHL and PWMPHH register
control the amount of phase shift applied.
3.12.6
MULTI-PHASE SYSTEM
The MCP19122/3 is capable of being configured as a
Master or Slave in a multi-phase system. The
MODECON bits determine the device
configuration.
3.12.6.1
Multi-phase System Master
When configured as a Master, the GPA1 pin is automatically set to output the switching frequency synchronization signal. The frequency of this
synchronization signal sets the converters switching
frequency. The GPB3 pin is automatically set to output the system clock signal frequency of 8 MHz. The
GPB1 pin is automatically set to output the sampled
current sense signal.
3.12.6.2
Multi-phase System Slave
When configured as a Slave, GPA1 is set to be the
switching frequency synchronization signal input pin.
The Master’s switching frequency synchronization signal is to be connected to this pin. Phase shift from the
synchronization signal can be applied. See
Register 26-2.
To ensure proper synchronization between the Master
and Slave, GPB3 of the Slave is set to be the system
clock input pin. Both the Master and Slave GPB3 pins
must be connected together.
To properly balance the system output current between
the phases, all devices need to regulate to the same
current. On the Slave devices, GPB1 is set to be the
current sense input signal from the Master. Both the
Master and Slave GPB1 pins must be connected
together. The MODECON must also be set to
a ‘1’ so the Slave device is set to control the system
output current.
Note 1: The TMR2 register should be initialized to
0 to allow proper synchronization.
2: The PWMPHL and PWMPHH register
control the amount of phase shift applied.
DS20005750A-page 36
2017 Microchip Technology Inc.
MCP19122/3
REGISTER 3-15:
MODECON: SYSTEM CONFIGURATION CONTROL REGISTER
R/W-0
R/W-1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
CLMPSEL
VGNDEN
VDDEN
CNSG
EACLMP
MSC2
MSC1
MSC0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
CLMPSEL: Error Amplifier Clamp Configuration bit
1 = EA Clamp current set by GPA3 pin voltage
0 = EA Clamp current set by GPA3 pin voltage and average output current
bit 6
VGNDEN: Virtual Ground Control bit
1 = Virtual Ground is enabled
0 = Virtual Ground is disabled
bit 5
VDDEN: VDD LDO control bit
0 = VDD LDO is disabled when SLEEP command issued
1 = VDD LDO remains enabled when SLEEP command issued
bit 4
CNSG: Control Signal configuration bit
0 = Device set to control system output voltage
1 = Device set to control system output current
bit 3
EACLMP: Error Amplifier Clamp control bit
1 = Error amplifier output clamp enabled
0 = Error amplifier output clamp disabled
bit 2-0
MSC: System configuration control bit
000 = Device set as a stand alone unit
001 = Device set as multiple output Master (GPB3: clock signal out, GPA1: synchronization signal out)
010 = Device set as multiple output Slave (GPB3: clock signal in, GPA1:synchronization signal in)
011 = Device set as multi-phase Master (GPB3: clock signal out,GPA1: synchronization signal out,
GPB1: demand out)
100 = Device set as multi-phase Slave (GPB3: clock signal in, GPA1: synchronization signal in, GPB1:
demand in)
101 = Device set as multiple output Master (GPA1: synchronization signal out)
110 = Device set as multiple output Slave (GPA1: synchronization signal in)
111 = Unimplemented
2017 Microchip Technology Inc.
DS20005750A-page 37
MCP19122/3
3.13
Miscellaneous Features
3.13.1
OVERTEMPERATURE
The MCP19122/3 features a hardware overtemperature shutdown protection typically set at +160°C. No
firmware fault-handling procedure is required to
shutdown the MCP19122/3 for an over temperature
condition.
3.13.2
DEVICE ADDRESSING
The communication address of the MCP19122/3 is
stored in the SSPADD register. This value can be
loaded when the device firmware is programmed or
configured by external components. By reading a voltage on a GPIO with the ADC, a device specific address
can be stored into the SSPADD register.
EXAMPLE 3-2:
BANKSEL
BSF
BANKSEL
BCF
:
:
:
WAIT_ENABLE:
BANKSEL
BTFSS
GOTO
BANKSEL
BSF
:
:
:
3.13.4
3.13.3
DEVICE ENABLE
A GPIO pin can be configured to be a device enable
pin. By configuring the pin as an input, the PORT
register or the interrupt on change (IOC) can be used
to enable the device. Example 3-2 shows how to
configure a GPIO as an enable pin by testing the PORT
register.
CONFIGURING GPA3 AS DEVICE ENABLE
TRISGPA
TRISGPA, 3
ANSELA
ANSELA, 3
;Set GPA3 as input
;Set GPA3 as digital input
;Insert additional user code here
PORTGPA
PORTGPA, 3
WAIT_ENABLE
ATSTCON
ATSTCON, 0
;Test GPA3 to see if pulled high
;A high on GPA3 indicated device to be enabled
;Stay in loop waiting for device enable
;Enable the device by enabling drivers
;Insert additional code here
OUTPUT POWER GOOD
The output voltage measured between the +VSEN and
–VSEN pins can be monitored by the internal ADC. In
firmware, when this ADC reading matches a userdefined power good value, a GPIO can be toggled to
indicate the system output voltage is within a specified
range. Delays, hysteresis and time out values can all
be configured in firmware.
3.13.5
The MCP19122/3 contains a second address register,
SSPADD2. This is a 7-bit address that can be used as
the SMBus alert address when PMBus communication
is used. See Section 27.0, Master Synchronous Serial
Port (MSSP) Module for more information.
voltage applied to it. The firmware then handles the
tracking of the internal output voltage reference to this
ADC reading.
OUTPUT VOLTAGE SOFT-START
During start-up, soft start of the output voltage is
accomplished in firmware. By using one of the internal
timers and incrementing the OVCCON or OVFCON
register on a timer overflow, very long soft start times
can be achieved.
3.13.6
OUTPUT VOLTAGE TRACKING
The MCP19122/3 can be configured to track another
voltage signal at start-up or shutdown. The ADC is
configured to read a GPIO that has the desired tracking
DS20005750A-page 38
2017 Microchip Technology Inc.
MCP19122/3
4.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings (†)
VIN – VGND ................................................................................................................................................. –0.3V to +43V
VIN – VGND (non-switching) .........................................................................................................................–0.3V to +48V
VBOOT – VIN .......................................................................................................................................–0.3V to +VDDMAXV
VPHASE (continuous) ....................................................................................................................... GND – 0.3V to +VINV
VPHASE (transient < 100 ns)............................................................................................................ GND – 5.0V to +VINV
VDD internally generated .....................................................................................................................................+5V ±8%
VHDRV, HDRV Pin..........................................................................................................+VPHASE – 0.3V to VBOOT + 0.3V
VLDRV, LDRV Pin............................................................................................................. +(VGND – 0.3V) to (VDD + 0.3V)
Voltage on MCLR with respect to GND ................................................................................................... –0.3V to +13.5V
+VSEN, ISP, ISN pins.......................................................................................................................(VGND– 0.3V) to +16V
Maximum Voltage: any other pin..................................................................................... +(VGND – 0.3V) to (VDD + 0.3V)
Maximum output current sunk by any single I/O pin ...............................................................................................25 mA
Maximum output current sourced by any single I/O pin ..........................................................................................25 mA
Maximum current sunk by all GPIO ........................................................................................................................65 mA
Maximum current sourced by all GPIO ...................................................................................................................45 mA
ESD protection on all pins (HBM) ........................................................................................................................... 1.0 kV
ESD protection on all pins (MM) 200 V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
2017 Microchip Technology Inc.
DS20005750A-page 39
MCP19122/3
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25°C. Boldface
specifications apply over the TA range of –40°C to +125°C
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Voltage
VIN
4.5
—
40
V
Input Quiescent Current
IQ
—
5
10
mA
Not Switching,
+VSEN > VREF
MODECON = 0
Input Shutdown Current
ISHDN
—
50
150
µA
SLEEP Command, VDD
disabled
VDD
4.6
5.0
5.4
IDD_OUT
35
Line Regulation
VDD-OUT/
(VDDOUT*VIN)
—
0.1
Load Regulation
VDD-OUT/VDD-
–0.5
IDD-OUT_SC
Input
Internal Regulator VDD
Bias Voltage
Maximum external VDD output
current
V
Vin = 6V to 40V
mA
Vin = 6V to 40V
0.45
%/V
(VDD-OUT+1.0V) VIN≥ 40V
Note 2
±0.1
+0.5
%
—
45
—
mA
VIN - VDD-OUT
—
0.5
1
V
IDD-OUT = 35 mA,
VIN = VDD-OUT + 1.0V
Note 2
PSRRLDO
—
60
—
dB
f 1000 Hz,
IDD-OUT = 35mA
CIN = 0 µF, CDD-OUT = 1 µF
BG
1.205
1.230
1.254
V
AVDD
3.97
4.096
4.23
V
OCMIN
90
—
755
mV
OCSTEP_SIZE
15
21
25
mV
OUT
Output Short Circuit Current
Dropout Voltage
Power Supply Rejection Ratio
IDD-OUT = 1 mA to 20 mA
Note 2
VIN = (VDD-OUT + 1.0V)
Note 2
Band Gap
Band Gap Voltage
Internal Regulator AVDD
Internal Analog Supply Voltage
Overcurrent
Adjustable Overcurrent Range
Overcurrent Step Size
Adjustable Leading Edge
Blanking Time
LEB
90
110
135
ns
150
200
250
ns
250
380
480
ns
500
740
950
ns
ISENSE_GAIN
30
32
34
V/V
ISENSE_OFFSET
–10
0
10
mV
Current Sense
Current Sense Fixed Gain
Current Sense Amplifier Offset
Note 1:
2:
3:
4:
5:
Fixed gain removed
These parameters are characterized but not production tested.
VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage.
This is the voltage measured between the PHASE pin and GND. When measured voltage is between
2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low
This is the total source current for all GPIO pins combined. Individually each pin can source a maximum
of 15 mA.
System output voltage tolerance specified when 1.024V VREF 2.046V.
DS20005750A-page 40
2017 Microchip Technology Inc.
MCP19122/3
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25°C. Boldface
specifications apply over the TA range of –40°C to +125°C
Parameter
Sym.
Min.
Typ.
Max.
Units
VPEDESTAL
—
500
—
mV
VOUT_RANGE
0.5
—
16
V
VREFSTEP
—
2
—
mV
System Output Voltage
Tolerance
VTOL
–3%
+3%
Differential amplifier gain
setting of 1/8, 1/4, 1/2, 1
and 2 Note 5
System Output Voltage
Tolerance
VTOL
–5%
+5%
Differential amplifier gain
setting of 4 Note 5
System Output Voltage
Tolerance
VTOL
–6.5%
+6.5%
Differential amplifier gain
setting of 8 Note 5
OVSTEP
27
31
35
mV
UVSTEP
27
31
35
mV
RIN
—
12
—
kOh
ms
Common Mode Voltage Range
VCMR
–0.5
—
+0.5
V
Differential Feedback Voltage
Range
VDIFF
0
16
V
Internal Oscillator Frequency
FOSC
7.60
8.00
8.40
MHz
Switching Frequency
FSW
—
FOSC/
N
—
kHz
Switching Frequency Range
Select
N
4
—
80
—
Maximum Duty Cycle
—
—
(N-1)/
N
—
%/
100
LDRV Dead Time Adjustable
Range
DTRANGE_L
-4
—
56
ns
Labeled LDLY in Figure 3-3
HDRV Dead Time Adjustable
Range
DTRANGE_H
14
—
74
ns
Labeled HDLY in Figure 3-3
DTSTEP
—
4
—
ns
For both HDLY and LDLY
—
1.4
2.7
Measured at 100mA
Note 1
Pedestal Voltage
Conditions
Voltage Reference
Adjustable VOUT Range
Reference Voltage Step Size
VOUT range with no
external voltage divider
Output Over Voltage Reference
Output Over Voltage Step Size
Output Under Voltage DAC
Output Under Voltage Step Size
Remote Sense Differential Amplifier
Input Impedance
Oscillator/PWM
FSW = 100 kHz to 2 MHz
Dead Time Adjustment
Dead Time Step Size
HDRV Output Driver
HDRV Source Resistance
Note 1:
2:
3:
4:
5:
RHIDRV-SCR
These parameters are characterized but not production tested.
VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage.
This is the voltage measured between the PHASE pin and GND. When measured voltage is between
2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low
This is the total source current for all GPIO pins combined. Individually each pin can source a maximum
of 15 mA.
System output voltage tolerance specified when 1.024V VREF 2.046V.
2017 Microchip Technology Inc.
DS20005750A-page 41
MCP19122/3
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25°C. Boldface
specifications apply over the TA range of –40°C to +125°C
Parameter
Sym.
Min.
Typ.
Max.
Units
—
1.2
2.5
Measured at 100mA
Note 1
2
—
A
Note 1
HDRV Sink Resistance
RHIDRV-SINK
HDRV Source Current
IHIDRV-SCR
—
HDRV Sink Current
IHIDRV-SINK
—
HDRV Minimum On Time
tMIN
Conditions
2
—
A
Note 1
75
95
ns
Note 1
LDRV Output Driver
LDRV Source Resistance
RLODRV-SCR
—
1.8
3.2
Measured at 100mA
Note 1
LDRV Sink Resistance
RLODRV-SINK
—
0.6
2
Measured at 100mA
Note 1
LDRV Source Current
ILODRV-SCR
—
2
—
A
Note 1
LDRV Sink Current
ILODRV-SINK
—
4
—
A
Note 1
tMIN
—
167
—
ns
Note 1
20
40
Note 1
LDRV Minimum On Time
Bootstrap Blocking Device
Blocking Device Resistance
RBLOCK
GPIO Pins
GPIO Weak Current Source
—
45
50.0
55
µA
Selected current source on
GPA2, GPA3.
Maximum GPIO Sink Current
ISINK_GPIO
—
—
35
mA
Note 1,Note 4
Maximum GPIO Source Current
ISOURCE_GPIO
—
—
35
mA
Note 1,Note 4
GPIO Weak Pull-up Current
IPULL-UP_GPIO
50
250
400
µA
VDD = 5V
GPIO Input Leakage Current
GPIO_IIL
—
±0.1
±1
µA
Negative current is defined
as current sourced by the
pin. TA = +90°C
VIL
GND
—
0.8
V
I/O Port with TTL buffer
VDD = 5V, TA = +90°C
GND
—
0.2VDD
V
I/O Port with Schmitt Trigger buffer, VDD = 5V,
TA = +90°C
GND
—
0.2VDD
V
MCLR, TA = +90°C
2.0
—
VDD
V
I/O Port with TTL buffer
VDD = 5V, TA = +90°C
0.8VDD
—
VDD
V
I/O Port with Schmitt
Trigger buffer, VDD = 5V,
TA = +90°C
0.8VDD
—
VDD
V
MCLR, TA = +90°C
—
160
—
°C
GPIO Input Low Voltage
GPIO Input High Voltage
VIH
Thermal Shutdown
Thermal Shutdown
Note 1:
2:
3:
4:
5:
TSHD
These parameters are characterized but not production tested.
VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage.
This is the voltage measured between the PHASE pin and GND. When measured voltage is between
2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low
This is the total source current for all GPIO pins combined. Individually each pin can source a maximum
of 15 mA.
System output voltage tolerance specified when 1.024V VREF 2.046V.
DS20005750A-page 42
2017 Microchip Technology Inc.
MCP19122/3
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, TA = +25°C. Boldface
specifications apply over the TA range of –40°C to +125°C
Parameter
Thermal Shutdown Hysteresis
Note 1:
2:
3:
4:
5:
Sym.
Min.
Typ.
Max.
Units
TSHD_HYS
—
20
—
°C
Conditions
These parameters are characterized but not production tested.
VDD-OUT is the voltage present at the VDD pin. VDD is the internally generated bias voltage.
This is the voltage measured between the PHASE pin and GND. When measured voltage is between
2.5 mV and +2.5 mV, the LOWDR signal is to be pulled low
This is the total source current for all GPIO pins combined. Individually each pin can source a maximum
of 15 mA.
System output voltage tolerance specified when 1.024V VREF 2.046V.
THERMAL SPECIFICATIONS
Parameter
Symbol
Min
Typ
Max
Units
Specified Temperature Range
TA
–40
—
+125
C
Operating Temperature Range
TA
–40
—
+125
C
Maximum Junction Temperature
TJ
—
—
+150
C
TA
-65
—
+150
C
Thermal Resistance, 24L-QFN 4x4
JA
—
42
—
C/W
Thermal Resistance, 28L-QFN 5x5
JA
—
35.3
—
C/W
Conditions
Temperature Ranges
Storage Temperature Range
Thermal Package Resistances
Note 1:
Note 1
The parameter is determined using a High K 2S2P 4-layer board as described in JESD51-7, as well as
JESD 51-5 for packages with exposed pads.
2017 Microchip Technology Inc.
DS20005750A-page 43
MCP19122/3
NOTES:
DS20005750A-page 44
2017 Microchip Technology Inc.
MCP19122/3
5.0
DIGITAL ELECTRICAL CHARACTERISTICS
5.1
Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
1. TppS2ppS
2. TppS
T
F
Frequency
Lowercase letters (pp) and their meanings:
pp
cc
CCP1
ck
CLKOUT
cs
CS
di
SDI
do
SDO
dt
Data in
io
I/O port
mc
MCLR
Uppercase letters and their meanings:
S
F
Fall
H
High
I
Invalid (high-impedance)
L
Low
I2C only
AA
output access
BUF
Bus free
TCC:ST (I2C specifications only)
CC
HD
Hold
ST
DAT
DATA input hold
STA
START condition
FIGURE 5-1:
3. TCC:ST
4. Ts
(I2C specifications only)
(I2C specifications only)
T
Time
osc
rd
rw
sc
ss
t0
t1
wr
OSC1
RD
RD or WR
SCK
SS
T0CKI
T1CKI
WR
P
R
V
Z
Period
Rise
Valid
High-impedance
High
Low
High
Low
SU
Setup
STO
STOP condition
LOAD CONDITIONS
Load Condition 1
Load Condition 2
VDD/2
RL
CL
Pin
VSS
CL
Pin
VSS
RL = 464
CL = 50 pF for all GPIO pins
2017 Microchip Technology Inc.
DS20005750A-page 45
MCP19122/3
5.2
AC Characteristics: MCP19122/3
FIGURE 5-2:
EXTERNAL CLOCK TIMING
Q4
Q1
Q2
Q3
Q4
Q1
OSC
1
2
TABLE 5-1:
Param No.
EXTERNAL CLOCK TIMING REQUIREMENTS
Sym.
Characteristic
Min.
Typ.†
Max.
Units
FOSC
Oscillator Frequency(1)
—
8
—
MHz
1
TOSC
2
TCY
Oscillator
Period(1)
Instruction Cycle Time(1)
—
250
—
ns
—
1000
—
ns
Conditions
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for
design guidance only and are not tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values
are based on characterization data for that particular oscillator type under standard operating conditions
with the device executing code.
FIGURE 5-3:
I/O TIMING
Q1
Q4
Q2
Q3
OSC
22
23
19
18
I/O Pin
(input)
17
I/O Pin
(output)
new value
old value
20, 21
DS20005750A-page 46
2017 Microchip Technology Inc.
MCP19122/3
TABLE 5-2:
Param
No.
I/O TIMING REQUIREMENTS
Sym.
Characteristic
Min.
Typ.†
Max.
Units Conditions
17
TosH2ioV OSC1 (Q1 cycle) to Port out valid
—
50
70*
ns
18
TosH2ioI
50
—
—
ns
19
TioV2osH Port input valid to OSC1
(I/O in setup time)
20
—
—
ns
—
32
40
ns
20
TioR
OSC1 (Q2 cycle) to Port input invalid
(I/O in hold time)
Port output rise time
21
TioF
Port output fall time
—
15
30
ns
22*
Tinp
INT pin high or low time
25
—
—
ns
23*
Trbp
GPIO Interrupt-on-change new input
level time
TCY
—
—
ns
*
†
These parameters are characterized but not tested.
Data in “Typ” column is at VIN = 12V (VDD = 5V), +25C unless otherwise stated.
FIGURE 5-4:
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
VDD
MCLR
30
Internal
POR
33
PWRT
Time-out
32
OSC
Time-out
Internal
Reset
Watchdog
Timer
Reset
34
31
34
I/O Pins
2017 Microchip Technology Inc.
DS20005750A-page 47
MCP19122/3
FIGURE 5-5:
BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
VBOR + BVHY
BVHY
VBOR
35
Reset (Due to BOR)
(Device not in Brown-out Reset)
TABLE 5-3:
Param
No.
(Device in Brown-out Reset)
72 ms Time Out (if PWRTE)
RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, AND POWER-UP
TIMER REQUIREMENTS
Sym.
Characteristic
Min.
Typ.†
Max.
Units
Conditions
30
TMCL
MCLR Pulse Width (low)
2
—
—
µs
VDD = 5V, –40°C to +85°C
31
TWDT
Watchdog Timer Time-out
Period (No Prescaler)
7
18
33
ms
VDD = 5V, –40°C to +85°C
32
TOST
Oscillation Start-up Timer
Period
—
1024TOSC
—
—
TOSC = OSC1 period
33*
TPWRT
Power-up Timer Period
(4 x TWDT)
28
72
132
ms
VDD = 5V, –40°C to +85°C
34
TIOZ
I/O high-impedance from
MCLR Low or Watchdog Timer
Reset
—
—
2.0
µs
*
VPOR
Power-on Reset Voltage
—
2.13
—
V
*
VPOR_HYS
Power-on Reset Voltage
Hysteresis
—
100
—
mV
*
VBOR
Brown-out Reset voltage
—
2.7
—
V
*
BVHY
Brown-out Hysteresis
—
100
—
mV
TBCR
Brown-out Reset pulse width
100*
—
—
µs
2TOSC
—
7TOSC
35
TCKEZ-TMR Delay from clock edge to timer
48
increment
*
†
VDD Rising
VDD Falling
VDD VBOR (D005)
These parameters are characterized but not tested.
Data in “Typ.” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for
design guidance only and are not tested.
DS20005750A-page 48
2017 Microchip Technology Inc.
MCP19122/3
FIGURE 5-6:
TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
T0CKI
41
40
42
48
TMR0
FIGURE 5-7:
PNW TIMING
PWM (CLKPIN)
53
Note:
TABLE 5-4:
Param
No.
Sym.
40*
Tt0H
41*
Tt0L
42*
Refer to Figure 5-1 for load conditions.
TABLE5-4: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Characteristic
T0CKI High Pulse Width
T0CKI Low Pulse Width
Tt0P
*
†
54
T0CKI Period
Min.
Typ.†
Max.
Units
No Prescaler
0.5TCY + 20
—
—
ns
With Prescaler
10
—
—
ns
No Prescaler
0.5TCY + 20
—
—
ns
With Prescaler
10
—
—
ns
Greater of:
20 or TCY + 40
N
—
—
ns
Conditions
N = prescale value
(2, 4, ..., 256)
These parameters are characterized but not tested.
Data in “Typ” column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for
design guidance only and are not tested.
2017 Microchip Technology Inc.
DS20005750A-page 49
MCP19122/3
TABLE 5-5:
MCP19122/3 A/D CONVERTER (ADC) CHARACTERISTICS:
Standard Operating Conditions (unless otherwise stated)
Operating temperature
–40°C TA +125°C
Param
No.
Sym.
Characteristic
Min.
Typ.†
Max.
Units
Conditions
AD01*
NR
Resolution
—
—
10
bit
AD02*
EIL
Integral Error
—
—
1
LSb
VREF_ADC=AVDD
VREF_ADC=VDD
AD03*
EDL
Differential Error
—
—
1
LSb
No missing codes to 10 bits
VREF_ADC=AVDD
VREF_ADC=VDD
AD04
EOFF Offset Error
—
+3.0
+7.0
LSb
VREF_ADC=AVDD
VREF_ADC=VDD
AD07
EGN
Gain Error
—
2
6
LSb
VREF_ADC=AVDD
VREF_ADC=VDD
AD07*
VAIN
Full-Scale Range
GND
—
AVDD
V
AVDD Selected as ADC Reference
GND
—
VDD
V
VDD Selected as ADC Reference
—
—
10
k
AD08*
ZAIN
Recommended Impedance
of Analog Voltage Source
* These parameters are characterized but not tested.
† Data in ‘Typ’ column is at VIN = 12V (AVDD = 4.096V), +25°C unless otherwise stated. These parameters
are for design guidance only and are not tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing
codes.
3: When ADC is off, it will not consume any current other than leakage current. The power-down current
specification includes any such leakage from the ADC module. To minimize Sleep current the ADC
Reference must be set to the (default) AVDD.
DS20005750A-page 50
2017 Microchip Technology Inc.
MCP19122/3
TABLE 5-6:
MCP19122/3 A/D CONVERSION REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature
–40°C TA +125°C
Param
No.
Min.
Typ.†
A/D Clock Period
1.6
—
9.0
µs
TOSC-based
A/D Internal RC Oscillator
Period
1.6
4.0
6.0
µs
ADCS = 11 (ADRC mode)
—
11
—
TAD
Set GO/DONE bit to new data in
A/D Result register
AD132* TACQ Acquisition Time
—
11.5
—
µs
AD133* TAMP Amplifier Settling Time
—
—
5
µs
AD134
—
TOSC/2
—
—
Sym.
AD130* TAD
AD131
Characteristic
TCNV Conversion Time
(not including Acquisition
Time)(1)
TGO
Q4 to A/D Clock Start
Max. Units
Conditions
*
†
These parameters are characterized but not tested.
Data in ‘Typ’ column is at VIN = 12V (VDD = 5V), +25°C unless otherwise stated. These parameters are for
design guidance only and are not tested.
Note 1: ADRESH and ADRESL registers may be read on the following TCY cycle.
FIGURE 5-8:
A/D CONVERSION TIMING
BSF ADCON0, GO
134
1/2 TCY
131
Q4
130
A/D CLK
9
A/D DATA
8
7
6
3
OLD_DATA
ADRES
2
1
0
NEW_DATA
ADIF
GO
SAMPLE
DONE
132
SAMPLING STOPPED
Note 1: If the A/D clock source is selected as RC, a time of TCY is added before the A/D clock starts. This
allows the SLEEP instruction to be executed.
2017 Microchip Technology Inc.
DS20005750A-page 51
MCP19122/3
NOTES:
DS20005750A-page 52
2017 Microchip Technology Inc.
MCP19122/3
6.0
TYPICAL PERFORMANCE CURVES.
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
Note:
FIGURE 6-1:
IQ VS. TEMPERATURE
(VIN = 12.0V)
VIN = 12.0V
6.5
513
6.4
512
VOUTL = 0x00h
VOUTH = [K
VREF (mV)
Quiescent Current (mA)
VREF VS. TEMPERATURE
(VREF = 0.512V)
514
6.6
511
6.3
6.2
510
6.1
509
508
6
-40 -25 -10 5
FIGURE 6-2:
-40 -25 -10
20 35 50 65 80 95 110 125
Temperature (°C)
ISHDN VS. TEMPERATURE
(VIN = 12.0V)
50
5
20 35 50 65 80 95 110 125
Temperature (°C)
VREF VS. TEMPERATURE
(VREF = 1.024V)
FIGURE 6-5:
1.030
VIN = 12.0V
48
VOUTL = 0x00h
VOUTH = [K
1.028
1.026
45
VREF (V)
SLEEP Current (uA)
FIGURE 6-4:
1.024
43
1.022
40
1.020
38
1.018
1.016
35
-40 -25 -10 5
FIGURE 6-3:
-40 -25 -10 5
20 35 50 65 80 95 110 125
Temperature (°C)
VDD VS. VIN
20 35 50 65 80 95 110 125
Temperature (°C)
VREF VS. TEMPERATURE
(VREF = 2.048V)
FIGURE 6-6:
5.25
2.060
5.20
VOUTL =0xFFh
VOUTH = [K
2.055
VREF (V)
VDD (V)
2.050
5.15
2.045
-40C
5.10
25
2.040
2.035
125
5.05
2.030
6 8 10121416182022242628303234363840
Input Voltage, VIN (V)
2017 Microchip Technology Inc.
-40 -25 -10
5
20 35 50 65 80
Temperature (°C)
95 110 125
DS20005750A-page 55
MCP19122/3
FIGURE 6-7:
HDRV RDS-ON VS.
TEMPERATURE
FIGURE 6-10:
1.6
32.6
1.5
1.4
RHDRV_source
RHDRV_sink
1.3
1.2
1.1
Current Sense Gain (V/V)
32.6
HDRV RDS-on (Ω)
1.7
1.0
CURRENT SENSE GAIN
VS. TEMPERATURE
32.5
32.5
32.4
32.4
32.3
32.3
32.2
-40 -25 -10 5
FIGURE 6-8:
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
20 35 50 65 80 95 110 125
Temperature (°C)
LDRV RDS-ON VS.
TEMPERATURE
-40 -25 -10 5
FIGURE 6-11:
20 35 50 65 80 95 110 125
Temperture (°C)
GPA2/3 SOURCE
CURRENT VS.
TEMPERATURE
60.0
GPA2
59.5
Source Current (uA)
LDRV RDS-on (Ω)
RLDRV_source
RLDRV_sink
59.0
GPA3
58.5
58.0
57.5
57.0
56.5
-40 -25 -10 5
FIGURE 6-9:
20 35 50 65 80 95 110 125
Temperature (°C)
56.0
-40 -25 -10 5
20 35 50 65 80 95 110 125
Temperature (°C)
OSCILLATOR
FREQUENCY VS.
TEMPERATURE
Oscillator Frequency (MHz)
8.10
8.08
8.06
8.04
8.02
8.00
7.98
7.96
7.94
7.92
-40 -25 -10 5
DS20005750A-page 56
20 35 50 65 80 95 110 125
Temperature (°C)
2017 Microchip Technology Inc.
MCP19122/3
7.0
TEST MUX CONTROL
To allow for easier system design and bench testing,
the MCP19122/3 feature a multiplexer used to output
various internal analog and digital signals. These signals can be measured on the GPA0 pin through a unity
gain buffer. The configuration control of the GPA0 pin is
found in the BUFFCON register.
When the BUFFCON bit is set, the analog multiplexer output is connected to the GPA0 pin
and the CHS bits of the ADCON0 register
determine which internal analog signal can be measured on the GPA0 pin. Refer to the ADCON0 register (Register 19-1) for analog signals that can be
view on GPA0 while BNCHEN is set.
REGISTER 7-1:
When the BUFFCON bit is set, the digital
multiplexer output is connected to the GPA0 pin. The
DSEL bits of the BUFFCON register determine
which internal digital signal can be measured on the
GPA0 pin.
If a conflict exist where both the BNCHEN and
DIGOEN bits are set, the DIGOEN bit takes priority.
When measuring signals with the unity gain buffer, the
buffer offset must be added to the measured signal.
The factory measured buffer offset can be read from
memory location 2087h. Refer to Section 10.1.1
“Reading Program Memory as Data” for more information.
BUFFCON: TEST MUX CONTROL REGISTER
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
BNCHEN
DIGOEN
—
DSEL4
DSEL3
DSEL2
DSEL1
DSEL0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
BNCHEN: GPA0 analog multiplexer configuration control bit
1 = GPA0 is configured to be analog multiplexer output
0 = GPA0 is configured for normal operation
bit 6
DIGOEN: GPA0 digital multiplexer configuration control bit
1 = GPA0 is configured to be digital multiplexer output
0 = GPA0 is configured for normal operation
bit 5
Unimplemented: Read as ‘0’
bit 4-0
DSEL: Multiplexer output control bit
00000 = 50% period signal
00001 = System clock
00010 = Inductor current SAMPLE signal
00011 = OV Comparator Output
00100 = UV Comparator Output
00101 = OVLO Comparator Output
00110 = UVLO Comparator Output
00111 = OC Comparator Output
01000 = high_on signal
01001 = Low-side on signal before the delay block
•
•
•
10000 = Output of PWM Comparator
10001 = SWFRQ Signal
10010 = T2_EQ_PR2 Signal
10011 = PWM_OUT Signal
10100 = Clock Select / Switchover Waveform
10101 = DEM Comparator Output
10111 = DEM Blanking Time
10111 = Auto Zero Time Or’ed Signal
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 57
MCP19122/3
NOTES:
DS20005750A-page 58
2017 Microchip Technology Inc.
MCP19122/3
8.0
RELATIVE EFFICIENCY MEASUREMENT
With a constant input voltage, output voltage and load
current, any change in the high-side MOSFET on-time
represents a change in the system efficiency. The
MCP19122/3 is capable of measuring the on-time of
the high-side MOSFET. Therefore, the relative
efficiency of the system can be measured and
optimized by changing the system parameters’ driver
dead time, such as switching frequency.
8.1
Relative Efficiency Measurement
Procedure
To measure the relative efficiency, the RELEFF register, PE1 bit, and the ADC RELEFF input
are used. The following steps outlines the measurement process:
1.
2.
3.
4.
5.
6.
7.
Clear the PE1 bit.
Set the PE1 bit.
With the ADC, read the RELEFF channel and
store this reading as the High.
Clear the PE1 bit.
With the ADC, read the RELEFF channel and
store this reading as the Low.
Set the PE1 bit to initiate a measurement cycle.
Monitor the RELEFF bit. When set,
it indicates the measurement is complete.
8.
When the measurement is complete, use the
ADC to read the RELEFF channel. This value
becomes the Fractional variable in Equation
10 1. This reading should be accomplished
within 50ms of the RELEFF bit is
set.
9. Read the value of the RE bits in the
RELEFF register and store the reading as
Whole.
10. Clear the PE1 bit.
11. The relative efficiency is then calculated by the
following equation:
EQUATION 8-1:
Fractional – Low
Whole + ------------------------------------------------
High – Low
Duty_Cycle = ------------------------------------------------------------------------------- PR2 + 1
Where:
Whole = Value obtained in Step 9 of the
measurement procedure
Fractional = Value obtained in Step 8 of the
measurement procedure
High = Value obtained in Step 3 of the
measurement procedure
Low = Value obtained in Step 5 of the
measurement procedure
Note 1: The RELEFF bit is set and
cleared automatically.
REGISTER 8-1:
RELEFF: RELATIVE EFFICIENCY MEASUREMENT REGISTER
R-0
R-x
R-x
R-x
R-x
R-x
R-x
R-x
MSDONE
RE6
RE5
RE4
RE3
RE2
RE1
RE0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
MSDONE: Relative efficiency measurement done bit
1 = Relative efficiency measurement is complete
0 = Relative efficiency measurement is not complete
bit 6-0
RE: Whole clock counts for relative efficiency measurement result
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 59
MCP19122/3
NOTES:
DS20005750A-page 60
2017 Microchip Technology Inc.
MCP19122/3
9.0
DEVICE CALIBRATION
Read-only memory locations 2080h through 208Fh
contain factory calibration data. Refer to Section 20.0
“Flash Program Memory Control” for information on
how to read from these memory locations.
9.1
Calibration Word 1
The TTA bits at memory location 2080h calibrate
the over temperature shutdown threshold point.
Firmware must read these values and write them to the
TTACAL register for proper calibration.
The FCAL bits at memory location 2080h set the
internal oscillator calibration. Firmware must read
these values and write them to the OSCCAL register
for proper calibration.
REGISTER 9-1:
CALWD1: CALIBRATION WORD 1 REGISTER
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
—
—
TTA3
TTA2
TTA1
TTA0
bit 13
bit 8
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
FCAL6
FCAL5
FCAL4
FCAL3
FCAL2
FCAL1
FCAL0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-12
Unimplemented: Read as ‘0’
bit 11-8
TTA: Overtemperature shutdown calibration bits.
bit 7
Unimplemented: Read as ‘0’
bit 6-0
FCAL: Internal oscillator calibration bits
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 61
MCP19122/3
9.2
Calibration Word 2
The BGT bits at memory location 2081h calibrate
the internal band gap over temperature. Firmware must
read these values and write them to the BGTCAL
register for proper calibration.
The BGR bits at memory location 2081h calibrate
the internal band gap. Firmware must read these values and write them to the BGRCAL register for proper
calibration.
REGISTER 9-2:
CALWD2: CALIBRATION WORD 2 REGISTER
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
—
—
BGT3
BGT2
BGT1
BGT0
bit 13
bit 8
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
BGR5
BGR4
BGR3
BGR2
BGR1
BGR0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-12
Unimplemented: Read as ‘0’
bit 11-8
BGT: Internal band gap temperature calibration bits.
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
BGR: Internal band gap calibration bits.
DS20005750A-page 62
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
9.3
Calibration Word 3
The AVDD bits at memory location 2082h calibrate
the internal 4.096V bias voltage. Firmware must read
these values and write them to the AVDDCAL register for
proper calibration.
REGISTER 9-3:
The VOUR bits at memory location 2082h calibrate the output overvoltage and undervoltage reference. Firmware must read these values and write them
to the VOURCAL register for proper calibration.
CALWD3: CALIBRATION WORD 3 REGISTER
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
—
—
AVDD3
AVDD2
AVDD1
AVDD0
bit 13
bit 8
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
VOUR4
VOUR3
VOUR2
VOUR1
VOUR0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-12
Unimplemented: Read as ‘0’
bit 11-8
AVDD: Internal 4V bias voltage calibration bits.
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
VOUR: Output overvoltage and undervoltage reference calibration bits.
2017 Microchip Technology Inc.
DS20005750A-page 63
MCP19122/3
9.4
Calibration Word 4
The DOV bits at memory location 2083h set the
offset calibration for the output voltage remote sense
differential amplifier. Firmware must read these values
and write them to the DOVCAL register for proper
calibration.
REGISTER 9-4:
The VEAO bits at memory location 2083h
calibrate the offset of the error amplifier. Firmware must
read these values and write them to the VEAOCAL
register for proper calibration.
CALWD4: CALIBRATION WORD 4 REGISTER
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
DOV4
DOV3
DOV2
DOV1
DOV0
bit 13
bit 8
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
VEAO4
VEAO3
VEAO2
VEAO1
VEAO0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
Unimplemented: Read as ‘0’
bit 12-8
DOV: Output voltage remote sense differential amplifier offset calibration bits
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
VEAO: Error amplifier offset voltage calibration bits
DS20005750A-page 64
2017 Microchip Technology Inc.
MCP19122/3
9.5
Calibration Word 5
The VREF bits at memory location 2084h
calibrate the reference to the DAC that sets the output voltage reference. Firmware must read these values and write them to the VREFCAL register for
proper calibration.
REGISTER 9-5:
The VRFS bits at memory location 2084h
calibrate the full scale range of reference to the DAC
that sets the output voltage reference. Firmware must
read these values and write them to the VRFSCAL register for proper calibration. The VRFS bits are to
be loaded in to the VRFSCAL register when the DAGCON = 0x00h or 0x07h.
CALWD5: CALIBRATION WORD 5 REGISTER
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
VREF4
VREF3
VREF2
VREF1
VREF0
bit 13
bit 8
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
VRFS4
VRFS3
VRFS2
VRFS1
VRFS0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
Unimplemented: Read as ‘0’
bit 12-8
VREF: Output voltage reference DAC calibration bits
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
VRFS: Output voltage reference DAC full scale range calibration bits
2017 Microchip Technology Inc.
DS20005750A-page 65
MCP19122/3
9.6
Calibration Word 6
The RAMP bits at memory location 2085h calibrate the span of the slope compensation ramp. Firmware must read these values and write them to the
RAMPCAL register for proper calibration.
REGISTER 9-6:
The CSR bits at memory location 2085h are used
to calibrate the gain of the current sense amplifier.
Firmware must read these values and write them to the
CSRCAL register for proper calibration.
CALWD6: CALIBRATION WORD 6 REGISTER
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
RAMP4
RAMP3
RAMP2
RAMP1
RAMP0
bit 13
bit 8
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
CSR4
CSR3
CSR2
CSR1
CSR0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13
Unimplemented: Read as ‘0’
bit 12-8
RAMP:Slope compensation ramp span calibration bits
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
CSR: Current sense amplifier gain calibration bits
DS20005750A-page 66
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
9.7
Calibration Word 7
Calibration Word 7 at memory location 2086h contains
the offset calibration for the output overvoltage and
undervoltage comparators.
The OVCO bits contain the output overvoltage
comparator offset voltage calibration.
The UVCO bits contain the output undervoltage
comparator offset voltage calibration.
Firmware must read these values and write them to the
OVUVCAL register for proper operation.
REGISTER 9-7:
CALWD7: CALIBRATION WORD 7 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
UVCO3
UVCO2
UVCO1
UVCO0
OVCO3
OVCO2
OVCO1
OVCO0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-8
Unimplemented: Read as ‘0’
bit 7-4
UVCO: Output Undervoltage Comparator Offset calibration bits
bit 3-0
OVCO: Output Overvoltage Comparator Offset calibration bits
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 67
MCP19122/3
9.8
Calibration Word 8
The DEMOV bits at memory location 2087h
contain the diode emulation mode comparator offset
voltage. Firmware must read these values and write
them to the DEMCAL register for proper operation.
REGISTER 9-8:
CALWD8: CALIBRATION WORD 8 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
U-0
U-0
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
DEMOV4
DEMOV3
DEMOV2
DEMOV1
DEMOV0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-5
Unimplemented: Read as ‘0’
bit 4-0
DEMOV: Diode Emulation Mode Comparator Offset Voltage calibration bits
DS20005750A-page 68
2017 Microchip Technology Inc.
MCP19122/3
9.9
Calibration Word 9
The HCSOV bits at memory location 2088h
contain the calibration values for the offset voltage on
the high-side current sense amplifier. Firmware must
read these values and write them to the HCSOVCAL
register for proper operation.
REGISTER 9-9:
CALWD9: CALIBRATION WORD 9 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
U-0
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
HCSOV6
HCSOV5
HCSOV4
HCSOV3
HCSOV2
HCSOV1
HCSOV0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-7
Unimplemented: Read as ‘0’
bit 6-0
HCSOV: High-side Current Amplifier Offset Voltage calibration bits
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 69
MCP19122/3
9.10
Calibration Word 10
The TANA bits at memory location 2089h contain
the ADC reading from the internal temperature sensor
when the silicon temperature is at +25°C.
REGISTER 9-10:
This 10-bit reading can be used to calculate the silicon
die temperature. See Section 25.0 "Internal
Temperature Indicator Module" for more details.
CALWD10: CALIBRATION WORD 10 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
TANA9
TANA8
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
TANA7
TANA6
TANA5
TANA4
TANA3
TANA2
TANA1
TANA0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13-8
Unimplemented: Read as ‘0’
bit 7-0
TANA: ADC internal temperature sensor at +25°C calibration bits
DS20005750A-page 70
2017 Microchip Technology Inc.
MCP19122/3
9.11
Calibration Word 11
The BUFF bits at memory location 208Ah
represent the offset voltage of the unity gain buffer in
units of millivolts. This is an 8-bit two’s complement
number. The MSB is the sign bit. If the MSB is set to 1,
the resulting number is negative.
REGISTER 9-11:
CALWD11: CALIBRATION WORD 11 REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
—
—
—
—
—
—
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
BUFF7
BUFF6
BUFF5
BUFF4
BUFF3
BUFF2
BUFF1
BUFF0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-8
Unimplemented: Read as ‘0’
bit 7-0
BUFF: Unity gain buffer offset voltage calibration bits
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 71
MCP19122/3
9.12
Calibration Word 12
The ADCCAL bits at memory location 208Bh
contain the calibration bits for the A/D converter.
Calibration Word 12 contains the factory measurement
of the full scale ADC reference. The value represents
the number of A/D converter counts per volt.
REGISTER 9-12:
ADCC represent the fraction of an A/D converter
count, which can provide additional precision when
oversampling the ADC for enhanced resolution. This
calibration word can be used to calibrate signals read
by the A/D converter.
CALWD12: CALIBRATION WORD 12 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
ADCC13
ADCC12
ADCC11
ADCC10
ADCC9
ADCC8
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
ADCC7
ADCC6
ADCC5
ADCC4
ADCC3
ADCC2
ADCC1
ADCC0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-5
ADCC: Whole number of A/D converter counts
111111111 = 511
•
•
•
000000000 = 0
bit 4-0
ADCC: Fraction number of A/D converter counts
1111 = 0.96875
•
•
•
0001 = 0.03125
0000 = 0
DS20005750A-page 72
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
9.13
Calibration Word 13
Calibration Word 13 at memory location 208Ch contain
the offset of the A/D converter. This calibration word
can be used to calibrate signals read by the A/D
converter.
REGISTER 9-13:
CALWD13: CALIBRATION WORD 13 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
ADCO13
ADCO12
ADCO11
ADCO10
ADCO9
ADCO8
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
ADCO7
ADCO6
ADCO5
ADCO4
ADCO3
ADCO2
ADCO1
ADCO0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 13-0
9.14
x = Bit is unknown
ADCO: A/D converter offset
9.14.1
Calibration Words 14-16
Memory locations 208Dh to 208Fh contain reference
voltage span adjustment (VRFSCAL) calibration
values to be used with different settings of the differential amplifier gain. The appropriate VRFSCAL
value must be used to achieve the system output
voltage tolerance specification listed in the Section
“Electrical characteristics”.
REGISTER 9-14:
CALIBRATION WORD 14
The VRS18 bits in CALWD 14 at memory location
208Dh are to be loaded into the VRFSCAL register
when the DAGCON = 0x03h. The VRS14 bits of
CALWD14 are to be loaded into the VRFSCAL register
when the DAGCON = 0x02h.
CALWD14: CALIBRATION WORD 14 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
VRS144
VRS143
VRS142
VRS141
VRS140
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
VRS184
VRS183
VRS182
VRS181
VRS180
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
Unimplemented: Read as ‘0’
bit 12-8
VRS14: VRFSCAL calibration with Differential Amplifier gain of 1/4 (DAGCON = 0x02h)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
VRS18: VRFSCAL calibration with Differential Amplifier gain of 1/8 (DAGCON = 0x03h)
2017 Microchip Technology Inc.
DS20005750A-page 73
MCP19122/3
9.14.2
CALIBRATION WORD 15
The VSR12 bits in CALWD 15 at memory location
208Eh are to be loaded into the VRFSCAL register
when the DAGCON = 0x01h. The VRS2 bits of
CALWD15 are to be loaded into the VRSFCAL register
when the DAGCON = 0x04h.
REGISTER 9-15:
CALWD15: CALIBRATION WORD 15 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
VRS24
VRS23
VRS22
VRS21
VRS20
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
VRS124
VRS123
VRS122
VRS121
VRS120
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
Unimplemented: Read as ‘0’
bit 12-8
VRS2: VRFSCAL calibration with Differential Amplifier gain of 2 (DAGCON = 0x04h)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
VRS12: VRFSCAL calibration with Differential Amplifier gain of 1/2 (DAGCON = 0x01h)
DS20005750A-page 74
2017 Microchip Technology Inc.
MCP19122/3
9.14.3
CALIBRATION WORD 16
The VSR4 bits in CALWD 16 at memory location
208Fh are to be loaded into the VRFSCAL register
when the DAGCON = 0x05h. The VRS8 bits of
CALWD16 are to be loaded into the VRSFCAL register
when the DAGCON = 0x06h.
REGISTER 9-16:
CALWD16: CALIBRATION WORD 16 REGISTER
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
VRS84
VRS83
VRS82
VRS81
VRS80
bit 13
bit 8
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
R/P-1
—
—
—
VRS44
VRS43
VRS42
VRS84
VRS40
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 13
Unimplemented: Read as ‘0’
bit 12-8
VRS8: VRFSCAL calibration with Differential Amplifier gain of 8 (DAGCON = 0x06h)
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
VRS4: VRFSCAL calibration with Differential Amplifier gain of 4 (DAGCON = 0x05h)
2017 Microchip Technology Inc.
DS20005750A-page 75
MCP19122/3
DS20005750A-page 76
2017 Microchip Technology Inc.
MCP19122/3
10.0
MEMORY ORGANIZATION
FIGURE 10-1:
PROGRAM MEMORY MAP
AND STACK FOR
MCP19122/3
There are two types of memory in the MCP19122/3:
• Program Memory
• Data Memory
- Special Function Registers (SFRs)
- General-Purpose RAM
10.1
Program Memory Organization
The MCP19122/3 has a 13-bit program counter
capable of addressing an 8K x 14 program memory
space. Only the first 4K x 14 (0000h-0FFFh) is
physically implemented. Addressing a location above
this boundary will cause a wrap-around within the first
4K x 14 space. The Reset vector is at 0000h and the
interrupt vector is at 0004h (see Figure 10-1). The
width of the program memory bus (instruction word) is
14-bits. Since all instructions are a single word, the
MCP19122/3 has space for 4K of instructions.
PC
CALL, RETURN
RETFIE, RETLW
13
Stack Level 1
Stack Level 8
Reset Vector
0000h
Interrupt Vector
0004h
0005h
On-Chip Program
Memory
0FFFh
1000h
Shadows 000-FFFh
1FFFh
User IDs(1)
2000h
2003h
ICD Instruction(1)
2004h
Revision ID (hardcoded)(1)
2005h
Device ID (hardcoded)(1)
2006h
Config Word(1)
2007h
Reserved
2008h
200Ah
200Bh
Reserved for
Manufacturing & Test(1)
Calibration Words(1)
Unimplemented
207Fh
2080h
208Fh
2090h
20FFh
2100h
Shadows 2000-20FFh
3FFFh
Note 1: Not code protected.
2017 Microchip Technology Inc.
DS20005750A-page 75
MCP19122/3
10.1.1
READING PROGRAM MEMORY AS
DATA
There are two methods of accessing constants in program memory. The first method is to use tables of
RETLW instructions. The second method is to set a
Files Select Register (FSR) to point to the program
memory.
10.1.1.1
RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 10-1.
EXAMPLE 10-1:
RETLW INSTRUCTION
constants
ADDWF_PCL
RETLW DATA0
RETLW DATA1
RETLW DATA2
RETLW DATA3
;Index0 data
;Index1 data
my_function
;… LOTS OF CODE…
MOVLW
DATA_INDEX
call constants
;… THE CONSTANT IS IN W
Indirect REgister Pointer (IRP) bit inthe STATUS
register for access to the Bank0/Bank1 or the
Bank2/Bank3 areas of data memory.
10.2.1
The register file is organized as 64 x 8 in the
MCP19122/3. Each register is accessed, either directly
or indirectly, through the FSR (refer to Section 10.5
“Indirect Addressing, INDF and FSR Registers”).
10.2.2
Data Memory Organization
The data memory (see Table 10-1) is partitioned into
four banks, which contain the General Purpose
Registers (GPR) and the Special Function Registers
(SFR). The Special Function Registers are located in
the first 32 locations of each bank. Register locations
20h-7Fh in Bank 0, A0h-EFh in Bank 1 and 120h-16Fh
in Bank 2 are General Purpose Registers,
implemented as static RAM. All other RAM is
unimplemented and returns ‘0’ when read. The
RP bits of the STATUS register are the bank
select bits.
RP1
RP0
0
0
-> Bank 0 is selected
0
1
-> Bank 1 is selected
1
0
-> Bank 2 is selected
1
1
-> Bank 3 is selected
To move values from one register to another register,
the value must pass throught the W register. This
means that for all register-to-register moves, two
instruction cycles are required.
The entire data memory can be accessed either
directly or indirectly. Direct addressing may require the
use of the RP bits. Indirect addressing uses the
DS20005750A-page 76
CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers can be
addressed from any bank. These registers are listed in
Table 10-1. For detailed information refer to Table 10-2.
TABLE 10-1:
CORE REGISTERS
Addresses
BANKx
x00h, x80h, x100h, or x180h
INDF
x02h, x82h, x102h, or x182h
PCL
x03h, x83h, x103h, or x183h
STATUS
x04h, x84h, x104h, or x184h
FSR
x0Ah, x8Ah, x10Ah, or x18Ah
PCLATH
x0Bh, x8Bh, x10Bh, or x18Bh
INTCON
10.2.3
10.2
GENERAL PURPOSE REGISTER
FILE
STATUS REGISTER
The STATUS register,
contains:
shown in
Register 10-1,
• the arithmetic status of the ALU
• the Reset status
• the bank select bits for data memory (RAM)
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
Therefore, it is recommended that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits, see the Section 28.0
“Instruction Set Summary”.
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in
subtraction.
2017 Microchip Technology Inc.
MCP19122/3
REGISTER 10-1:
R/W-0
STATUS: STATUS REGISTER
R/W-0
IRP
RP1
R/W-0
RP0
R-1
TO
R-1
PD
R/W-x
Z
R/W-x
R/W-x
(1)
DC
bit 7
C(1)
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
IRP: Register Bank Select bit (used for Indirect addressing)
1 = Bank 2 & 3 (100h - 1FFh)
0 = Bank 0 & 1 (00h - FFh)
bit 6-5
RP: Register Bank Select bits (used for Direct addressing)
00 = Bank 0 (00h - 7Fh)
01 = Bank 1 (80h - FFh)
10 = Bank 2 (100h - 17Fh)
11 = Bank 3 (180h - 1FFh)
bit 4
TO: Time-out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3
PD: Power-down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2
Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1
DC: Digit Carry/Digit Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0
C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1:
10.2.4
For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand. For rotate (RRF, RLF) instructions, this bit is loaded with either the high-order or low-order
bit of the source register.
SPECIAL FUNCTION REGISTERS
The Special Function Registers are registers used by
the CPU and peripheral functions for controlling the
desired operation of the device (see Table 10-2). These
registers are static RAM.
The special registers can be classified into two sets:
• core
• peripheral
The Special Function Registers associated with the
microcontroller core are described in this section.
Those related to the operation of the peripheral features are described in the section of that peripheral
feature.
2017 Microchip Technology Inc.
DS20005750A-page 77
MCP19122/3
10.3
DATA MEMORY
TABLE 10-2:
MCP19122/3 DATA MEMORY MAP
File
Address
File
Address
File
Address
File
Address
Indirect addr.(1)
00h
Indirect addr. (1)
80h
Indirect addr.(1)
100h
Indirect addr. (1)
TMR0
01h
OPTION_REG
81h
TMR0
101h
OPTION_REG
181h
PCL
02h
PCL
82h
PCL
102h
PCL
182h
STATUS
03h
STATUS
83h
STATUS
103h
STATUS
183h
184h
180h
FSR
04h
FSR
84h
FSR
104h
FSR
PORTGPA
05h
TRISGPA
85h
WPUGPA
105h
IOCA
185h
PORTGPB
06h
TRISGPB
86h
WPUGPB
106h
IOCB
186h
PIR1
07h
PIE1
87h
PE1
107h
ANSELA
187h
PIE2
88h
MODECON
108h
ANSELB
188h
PIR2
08h
PCON
09h
PCLATH
0Ah
PCLATH
8Ah
PCLATH
10Ah
PCLATH
18Ah
INTCON
0Bh
INTCON
8Bh
INTCON
10Bh
INTCON
18Bh
89h
109h
189h
(2)
TMR1L
0Ch
8Ch
10Ch
PORTICD
TMR1H
0Dh
8Dh
10Dh
TRISICD(2)
18Ch
18Dh
T1CON
0Eh
8Eh
10Eh
ICKBUG(2)
18Eh
TMR2
0Fh
8Fh
10Fh
BIGBUG(2)
18Fh
190h
T2CON
10h
VINUVLO
90h
SSPADD
110h
PMCON1
PR2
11h
VINOVLO
91h
SSPBUF
111h
PMCON2
191h
T1GCON
12h
VINCON
92h
SSPCON1
112h
PMADRL
192h
PWMPHL
13h
DAGCON
93h
SSPCON2
113h
PMADRH
193h
194h
PWMPHH
14h
VOUTL
94h
SSPCON3
114h
PMDATL
PWMRL
15h
VOUTH
95h
SSPMSK
115h
PMDATH
195h
PWMRH
16h
OSCTUNE
96h
SSPSTAT
116h
TTACAL
196h
CC1RL(3)
17h
97h
SSPADD2
117h
OSCCAL
197h
(3)
18h
CMPZCON
98h
SSPMSK2
118h
BGTCAL
198h
CC2RL(3)
19h
VOTUVLO
99h
VREFCAL
119h
BGRCAL
199h
CC2RH(3)
1Ah
VOTOVLO
9Ah
VRFSCAL
11Ah
AVDDCAL
19Ah
CCDCON(3)
1Bh
DEADCON
9Bh
RAMPCAL
11Bh
VOURCAL
19Bh
19Ch
CC1RH
ADRESL
1Ch
RAMPCON
9Ch
CSRCAL
11Ch
DOVCAL
ADRESH
1Dh
OCCON
9Dh
OVUVCAL
11Dh
VEAOCAL
19Dh
ADCON0
1Eh
CSGSCON
9Eh
DEMCAL
11Eh
BUFFCON
19Eh
ADCON1
1Fh
RELEFF
9Fh
HCSOVCAL
11Fh
Reserved
19Fh
General
Purpose
Register
20h
General
Purpose
Register
80 Bytes
A0h
General
Purpose
Register
120h
96 Bytes
80 bytes
EFh
Accesses
Bank 0
7Fh
Bank 0
Note 1:
2:
3:
1A0h
F0h
16F
Accesses
Bank 0
FFh
Bank 1
170h
1EF
Accesses
Bank 0
17Fh
Bank2
1F0h
1FFh
Bank3
Unimplemented data memory locations, read as '0'.
Not a physical register.
Only accessible when DBGEN = 0 and ICKBUG = 1.
Only in MCP19123 and DSTEMP.
DS20005750A-page 78
2017 Microchip Technology Inc.
2017 Microchip Technology Inc.
TABLE 10-3:
Addr.
Name
MCP19122/3 SPECIAL REGISTERS SUMMARY BANK 0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR
Reset
BOR Reset
Value on all
other resets(1)
Bank 0
00h
INDF
Addressing this location uses contents of FSR to address data memory (not a physical register)
xxxx xxxx
xxxx xxxx
01h
TMR0
Timer0 Module’s Register
xxxx xxxx
uuuu uuuu
02h
PCL
Program Counter's (PC) Least Significant byte
0000 0000
0000 0000
03h
STATUS
0001 1xxx
000q quuu
04h
FSR
05h
RP1
RP0
TO
PORTGPA
GPA7
GPA6
GPA5
GPA4
06h
PORTGPB
GPB7
GPB6
GPB5
07h
PIR1
TMR1GIF
ADIF
08h
PIR2
UVIF
09h
PCON
0Ah
PCLATH
0Bh
INTCON
0Ch
TMR1L
0Dh
TMR1H
0Eh
T1CON
0Fh
TMR2
10h
T2CON
11h
PR2
12h
T1GCON
0000 0x00
uuuu uuuu
13h
PWMPHL
SLAVE Phase Shift Register
xxxx xxxx
uuuu uuuu
14h
PWMPHH
SLAVE Phase Shift Register
xxxx xxxx
uuuu uuuu
15h
PWMRL
PWM Register Low Byte
xxxx xxxx
uuuu uuuu
16h
PWMRH
PWM Register High Byte
xxxx xxxx
uuuu uuuu
17h
CC1RL
Capture1/Compare1 Register 1 x Low Byte (LSB)
xxxx xxxx
uuuu uuuu
18h
CC1RH
Capture1/Compare1 Register 1 x High Byte (MSB)
xxxx xxxx
uuuu uuuu
19h
CC2RL
Capture2/Compare2 Register 2 x Low Byte (LSB)
xxxx xxxx
uuuu uuuu
1Ah
CC2RH
Capture2/Compare2 Register 2 x High Byte (MSB)
xxxx xxxx
uuuu uuuu
1Bh
CCDCON
0000 0000
0000 0000
1Ch
ADRESL
xxxx xxxx
uuuu uuuu
---- --xx
uuuu uuuu
PD
Z
DC
C
xxxx xxxx
uuuu uuuu
GPA3
GPA2
GPA1
GPA0
xxxx xxxx
uuuu uuuu
GPB4
GPB3
GPB2
GPB1
GPB0
xxxx xxxx
uuuu uuuu
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
0000 0000
0000 0000
OTIF
OCIF
OVIF
—
—
OVLOIF
UVLOIF
0000 --00
0000 --00
—
—
—
—
BOR
---- --qq
---- --uu
—
—
—
---0 0000
---0 0000
GIE
PEIE
T0IE
IOCF(2)
0000 000x
0000 000u
Holding register for the Least Significant byte of the 16-bit TMR1
xxxx xxxx
uuuu uuuu
Holding register for the Most Significant byte of the 16-bit TMR1
xxxx xxxx
uuuu uuuu
Indirect data memory address pointer
—
—
—
—
POR
Write buffer for upper 5 bits of program counter
INTE
T1CKPS1
T1CKPS0
IOCE
T0IF
—
—
INTF
TMR1CS
TMR1ON
Timer2 Module Register
—
—
—
—
—
TMR2ON
T2CKPS1
T2CKPS0
Timer2 Module Period Register
TMR1GE
CC2M3
T1GPOL
CC2M2
T1GTM
CC2M1
T1GSPM
CC2M0
T1GGO/DONE
T1GVAL
CC1M3
CC1M2
T1GSS1
CC1M1
T1GSS0
CC1M0
Least significant 8 bits of the right-shifted result (3)
3
--uu --uu
xxxx xxxx
uuuu uuuu
---- -000
---- -000
1111 1111
1111 1111
1Dh
ADRESH
1Eh
ADCON0
CHS5
CHS4
CHS3
CHS2
CHS1
CHS0
GO/DONE
ADON
0000 0000
0000 0000
1Fh
ADCON1
—
ADCS2
ADCS1
ADCS0
—
ADFM
VCFG1
VCFG0
-000 -000
-000 -000
Legend:
Note 1:
2:
3:
Most significant 2 bits of right-shifted result ( )
--00 --00
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists.
Results of ADC reading maybe left- or right-shifted. Results shown here are for right-shifted results.
MCP19122/3
DS20005750A-page 79
IRP
Addr.
MCP19122/3 SPECIAL REGISTERS SUMMARY BANK 1
Name
Value on POR
Reset
Values on all
other resets(1)
Addressing this location uses contents of FSR to address data memory (not a physical register)
xxxx xxxx
uuuu uuuu
RAPU
INTEDG
T0CS
1111 1111
1111 1111
0000 0000
0000 0000
IRP
RP1
RP0
0001 1xxx
000q quuu
xxxx xxxx
uuuu uuuu
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Bank 1
80h
INDF
81h
OPTION_REG
T0SE
PSA
PS2
PS1
PS0
Z
DC
C
82h
PCL
83h
STATUS
Program Counter's (PC) Least Significant byte
84h
FSR
85h
TRISGPA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
1111 1111
1111 1111
86h
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
1111 1111
1111 1111
87h
PIE1
TMR1GIE
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
0000 0000
0000 0000
88h
PIE2
UVIE
OTIE
OCIE
OVIE
—
—
OVLOIE
UVLOIE
0000 --00
000 --00
---0 0000
---0 0000
IOCF(3)
0000 000x
0000 000u
TO
PD
Indirect data memory address pointer
89h
8Ah
PCLATH
—
—
—
8Bh
INTCON
GIE
PEIE
T0IE
Write buffer for upper 5 bits of program counter
INTE
IOCE
T0IF
INTF
8Ch
—
Unimplemented
—
—
8Dh
—
Unimplemented
—
—
8Eh
—
Unimplemented
—
—
8Fh
—
Unimplemented
—
—
2017 Microchip Technology Inc.
90h
VINUVLO
—
—
—
—
UVLO3
UVLO2
UVLO1
UVLO0
---- xxxx
---- uuuu
91h
VINOVLO
—
—
—
—
OVLO3
OVLO2
OVLO1
OVLO0
---- xxxx
---- uuuu
92h
VINCON
UVLOEN
UVLOOUT
UVLOINTP
UVLOINTN
OVLOEN
OVLOOUT
OVLOINTP
OVLOINTN
0000 0000
0000 0000
93h
DAGCON
—
—
—
—
—
DAG2
DAG1
DAG0
---- -000
---- -000
94h
VOUTL
VOUT7
VOUT6
VOUT5
VOUT4
VOUT3
VOUT2
VOUT1
VOUT0
0000 0000
0000 0000
95h
VOUTH
—
—
—
—
—
—
VOUT9
VOUT8
---- --00
---- --00
96h
OSCTUNE
—
—
—
TUN4
TUN3
TUN2
TUN1
TUN0
---0 0000
---0 0000
—
—
97h
—
98h
CMPZCON
CMPZF3
CMPZF2
CMPZF1
CMPZF0
CMPZG3
CMPZG2
CMPZG1
CMPZG0
xxxx xxxx
uuuu uuuu
99h
VOTUVLO
—
—
—
—
OUV3
OUV2
OUV1
OUV0
---- xxxx
---- uuuu
9Ah
VOTOVLO
—
—
—
—
OOV3
OOV2
OOV1
OOV0
---- xxxx
---- uuuu
9Bh
DEADCON
HDLY3
HDLY2
HDLY1
HDLY0
LDLY3
LDLY2
LDLY1
LDLY0
1111 1111
1111 1111
9Ch
RAMPCON
RMPEN
—
—
RMP4
RMP3
RMP2
RMP1
RMP0
x--x xxxx
u--u uuuu
9Dh
OCCON
OCEN
OCLEB1
OCLEB0
OOC4
OOC3
OOC2
OOC1
OOC0
0xxx xxxx
0uuu uuuu
9Eh
CSGSCON
—
—
—
CSGS4
CSGS3
CSGS2
CSGS1
CSGS0
---x xxxx
---u uuuu
9Fh
RELEFF
MSDONE
RE6
RE5
RE4
RE3
RE2
RE1
RE0
0xxx xxxx
0uuu uuuu
Legend:
Note 1:
2:
3:
Unimplemented
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
GPA5 pull-up is enabled when pin is configured as MCLR in Configuration Word.
MCLR and WDT Reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists.
MCP19122/3
DS20005750A-page 80
TABLE 10-4:
2017 Microchip Technology Inc.
TABLE 10-5:
Addr.
MCP19122/3 SPECIAL REGISTERS SUMMARY BANK 2
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR
Reset
Value on all
other resets(1)
Bank 2
100h
INDF
Addressing this location uses contents of FSR to address data memory (not a physical register)
xxxx xxxx
xxxx xxxx
101h
TMR0
Timer0 Module’s Register
xxxx xxxx
uuuu uuuu
102h
PCL
Program Counter's (PC) Least Significant byte
0000 0000
0000 0000
103h
STATUS
0001 1xxx
000q quuu
104h
FSR
105h
WPUGPA
—
—
WPUA5
—
WCS1
WCS0
WPUA1
106h
WPUGPB
WPUB7
WPUB6
WPUB5
WPUB4
WPUB3
WPUB2
WPUB1
107h
PE1
DECON
TOPO
HIDIS
LODIS
MEASEN
SPAN
UVTEE
108h
MODECON
CLMPSEL
VGNDEN
VDDEN
CNSG
EACLMP
MSC2
MSC1
MSC0
IRP
RP1
RP0
TO
PD
Z
DC
C
Indirect data memory address pointer
109h
—
10Ah
PCLATH
—
—
—
10Bh
INTCON
GIE
PEIE
T0IE
10Ch
—
Unimplemented
10Dh
—
10Eh
xxxx xxxx
uuuu uuuu
WPUA0
--1- 0011
--u- 00uu
—
1111 111-
uuuu uuu-
OVTEE
0011 0000
0011 0000
0000 0000
0000 0000
Unimplemented
—
---0 0000
0000 000x
0000 000u
—
—
Unimplemented
—
—
—
Unimplemented
—
—
10Fh
—
Unimplemented
—
—
110h
SSPADD
ADD
0000 0000
0000 0000
111h
SSPBUF
xxxx xxxx
uuuu uuuu
112h
SSPCON1
WCOL
SSPOV
SSPEN
CKP
0000 0000
0000 0000
113h
SSPCON2
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
0000 0000
0000 0000
114h
SSPCON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
0000 0000
0000 0000
115h
SSPMSK
116h
SSPSTAT
117h
SSPADD2
118h
SSPMSK2
119h
VREFCAL
—
—
—
11Ah
VRFSCAL
—
—
—
VRFS4
VRFS3
VRFS2
11Bh
RAMPCAL
—
—
—
RAMP4
RAMP3
RAMP2
11Ch
CSRCAL
—
—
—
CSR4
CSR3
CSR2
CSR1
INTE
IOCE
T0IF
IOCF(2)
INTF
Synchronous Serial Port Receive Buffer/Transmit Register
SSPM>3:0>
MSK
SMP
CKE
D/A
1111 1111
1111 1111
0000 0000
0000 0000
ADD2
0000 0000
0000 0000
MSK2
1111 1111
1111 1111
VREF0
---0 0000
---0 0000
VRFS1
VRFS0
---0 0000
---0 0000
RAMP1
RAMP0
---x xxxx
---u uuuu
CSR0
---x xxxx
---u uuuu
P
S
VREF4
VREF3
R/W
VREF2
UA
BF
VREF1
11Dh
OVUVCAL
UVCO3
UVCO2
UVCO1
UVCO0
OVCO3
OVCO2
OVCO1
OVCO0
xxxx xxxx
uuuu uuuu
11Eh
DEMCAL
—
—
—
DEMOV4
DEMOV3
DEMOV2
DEMOV1
DEMOV0
---x xxxx
---u uuuu
11Fh
HCSOVCAL
—
HCSOV6
HCSOV5
HCSOV4
HCSOV3
HCSOV2
HCSOV1
HCSOV0
-xxx xxxx
-uuu uuuu
Legend:
Note 1:
2:
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition shaded = unimplemented
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
MCLR and WDT reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the
mismatch exists.
MCP19122/3
DS20005750A-page 81
—
---0 0000
Write buffer for upper 5 bits of program counter
Addr.
PIC18FXXXX SPECIAL REGISTERS SUMMARY BANK 3
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Value on POR
Reset
Values on all
other resets(1)
xxxx xxxx
uuuu uuuu
1111 1111
Bank 3
180h
INDF
181h
OPTION_REG
Addressing this location uses contents of FSR to address data memory (not a physical register)
RAPU
INTEDG
T0CS
IRP
RP1
RP0
T0SE
PSA
PS1
PS0
1111 1111
0000 0000
0000 0000
Z
DC
C
0001 1xxx
000q quuu
PS2
182h
PCL
183h
STATUS
184h
FSR
xxxx xxxx
uuuu uuuu
185h
IOCA
IOCA7
IOCA6
IOCA5
IOCA4
IOCA3
IOCA2
IOCA1
IOCA0
0000 0000
0000 0000
186h
IOCB
IOCB7
IOCB6
IOCB5
IOCB4
IOCB3
IOCB2
IOCB1
IOCB0
0000 0000
0000 0000
187h
ANSELA
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
---- 1111
---- 1111
188h
ANSELB
—
—
ANSB5
ANSB4
—
ANSB2
ANSB1
—
--11 -11-
--11 -11-
189h
Program Counter's (PC) Least Significant byte
TO
Indirect data memory address pointer
—
18Ah
PCLATH
18Bh
INTCON
PD
Unimplemented
—
—
—
GIE
PEIE
T0IE
Write buffer for upper 5 bits of program counter
INTE
IOCE
T0IF
INTF
IOCF(3)
—
—
---0 0000
---0 0000
0000 000x
0000 000u
In-Circuit Debug Port Register
—
—
TRISICD(4)
In-Circuit Debug TRIS Register
—
—
18Eh
ICKBUG(4)
In-Circuit Debug Register
0--- ----
0--- ----
18Fh
BIGBUG(4)
190h
PMCON1
18Ch
PORTICD
18Dh
(4)
In-Circuit Debug Breakpoint Register
—
CALSEL
—
—
—
WREN
WR
RD
---- ----
-0-- -000
-0-- -000
---- ----
---- ----
2017 Microchip Technology Inc.
191h
PMCON2
192h
PMADRL
PMADRL7
PMADRL6
PMADRL5
PMADRL4
PMADRL3
PMADRL2
PMADRL1
PMADRL0
0000 0000
0000 0000
193h
PMADRH
—
—
—
—
PMADRH3
PMADRH2
PMADRH1
PMADRH0
---- 0000
---- 0000
194h
PMDATL
PMDATL7
PMDATL6
PMDATL5
PMDATL4
PMDATL3
PMDATL2
PMDATL1
PMDATL0
0000 0000
0000 0000
195h
PMDATH
—
—
PMDATH5
PMDATH4
PMDATH3
PMDATH2
PMDATH1
PMDATH0
--00 0000
--00 0000
196h
TTACAL
—
—
—
—
TTA3
TTA2
TTA1
TTA0
---- xxxx
---- uuuu
197h
OSCCAL
—
FACL6
FCAL5
FCAL4
FCAL3
FCAL2
FCAL1
FCAL0
-xxx xxxx
-uuu uuuu
198h
BGTCAL
—
—
—
—
BGT3
BGT2
BGT1
BGT0
---- xxxx
---- uuuu
199h
BGRCAL
—
—
BGR5
BGR4
BGR3
BGR2
BGR1
BGR0
--00 0000
--00 0000
19Ah
AVDDCAL
—
—
—
—
AVDD3
AVDD2
AVDD1
AVDD0
---- xxxx
---- uuuu
19Bh
VOURCAL
—
—
—
VOUR4
VOUR3
VOUR2
VOUR1
VOUR0
---x xxxx
---u uuuu
19Ch
DOVCAL
—
—
—
DOV4
DOV3
DOV2
DOV1
DOV0
---x xxxx
---u uuuu
19Dh
VEAOCAL
—
—
—
VEAO4
VEAO3
VEAO2
VEAO1
VEAO0
---x xxxx
---u uuuu
19Eh
BUFFCON
BNCHEN
DIGOEN
—
DSEL4
DSEL3
DSEL2
DSEL1
DSEL0
00-0 0000
00-0 0000
19Fh
—
—
—
Legend:
Note 1:
2:
3:
4:
Program Memory Control Register 2 (not a physical register)
---- ----
Reserved
— = Unimplemented locations read as ‘0’, u = unchanged, x = unknown, q = value depends on condition, shaded = unimplemented
Other (non power-up) resets include MCLR Reset and Watchdog Timer Reset during normal operation.
GPA5 pull-up is enabled when pin is configured as MCLR in Configuration Word.
MCLR and WDT Reset does not affect the previous value data latch. The IOCF bit will be cleared upon reset but will set again if the mismatch exists.
Only accessible when DBGEN = 0 and ICKBUG = 1.
MCP19122/3
DS20005750A-page 82
TABLE 10-6:
MCP19122/3
10.3.0.1
OPTION Register
Note 1: To achieve a 1:1 prescaler assignment
for Timer0, assign the prescaler to the
WDT by setting PSA bit to ‘1’ of the
OPTION register. See Section 21.1.3
“Software Programmable Prescaler”
The OPTION register is a readable and writable
register, which contains various control bits to
configure:
•
•
•
•
Timer0/WDT prescaler
External GPA2/INT interrupt
Timer0
Weak pull-ups on PORTGPA and PORTGPB
REGISTER 10-2:
OPTION_REG: OPTION REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
RAPU(1)
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
RAPU: Port GPx Pull-up Enable bit
1 = Port GPx pull-ups are disabled
0 = Port GPx pull-ups are enabled
bit 6
INTEDG: Interrupt Edge Select bit
0 = Interrupt on rising edge of INT pin
1 = Interrupt on falling edge of INT pin
bit 5
T0CS: TMR0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock
bit 4
T0SE: TMR0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3
PSA: Prescaler Assignment bit
1 = Prescaler is assigned to WDT
0 = Prescaler is assigned to the Timer0 module
bit 2-0
PS: Prescaler Rate Select bits
Note 1:
Bit Value
TMR0
Rate
WDT Rate
000
001
010
011
100
101
110
111
1: 2
1: 4
1: 8
1: 16
1: 32
1: 64
1: 128
1: 256
1: 1
1: 2
1: 4
1: 8
1: 16
1: 32
1: 64
1: 128
x = Bit is unknown
Individual WPUx bit must also be enabled.
2017 Microchip Technology Inc.
DS20005750A-page 83
MCP19122/3
10.4
10.4.3
PCL and PCLATH
COMPUTED FUNCTION CALLS
The Program Counter (PC) is 13 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 10-2 shows the two
situations for loading the PC. The upper example in
Figure 10-2 shows how the PC is loaded on a write to
PCL (PCLATH PCH). The lower example in
Figure 10-2 shows how the PC is loaded during a CALL
or GOTO instruction (PCLATH PCH).
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
FIGURE 10-2:
The MCP19122/3 has an 8-level x 13-bit wide hardware stack (refer to Figure 10-1). The stack space is
not part of either program or data space and the Stack
Pointer is not readable or writable. The PC is PUSHed
onto the stack when CALL instruction is executed or an
interrupt causes a branch. The stack is POPed in the
event of a RETURN, RETLW or a RETFIE instruction
execution. PCLATH is not affected by a PUSH or POP
operation.
LOADING OF PC IN
DIFFERENT SITUATIONS
PCH
12
PCL
8 7
0
PC
5
8
PCLATH
Instruction with
Destination
ALU Result
PCLATH
PCH
12 11 10 8 7
PCL
0
PC
GOTO, CALL
2
PCLATH
11
Opcode
PCLATH
10.4.1
10.4.4
COMPUTED GOTO
A computed GOTO is accomplished by adding an offset
to the program counter (ADDWF PCL). Care should be
exercised when jumping into a look-up table or
program branch table (computed GOTO) by modifying
the PCL register. Assuming that PCLATH is set to the
table start address, if the table length is greater than
255 instructions or if the lower 8 bits of the memory
address rolls over from 0xFFh to 0X00h in the middle
of the table, then PCLATH must be incremented for
each address rollover that occurs between the table
beginning and the table location within the table.
STACK
The stack operates as a circular buffer. This means that
after the stack has been PUSHed eight times, the ninth
push overwrites the value that was stored from the first
push. The tenth push overwrites the second push (and
so on).
Note 1: There are no Status bits to indicate Stack
Overflow or Stack Underflow conditions.
2: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, RETURN, RETLW and RETFIE
instructions or the vectoring to an
interrupt address.
MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
content of the program counter to be changed by
writing the desired upper 5 bits to the PCLATH register.
When the lower 8 bits are written to the PCL register, all
13 bits of the program counter will change to the values
contained in the PCLATH register and those being
written to the PCL register.
10.4.2
If using the CALL instruction, the PCH and PCL
registers are loaded with the operand of the CALL
instruction. PCH is loaded with PCLATH.
10.5
Indirect Addressing, INDF and
FSR Registers
The INDF register is not a physical register. Addressing
the INDF register will cause indirect addressing.
Indirect addressing is possible by using the INDF
register. Any instruction using the INDF register
actually accesses data pointed to by the File Select
Register (FSR). Reading INDF itself indirectly will
produce 00h. Writing to the INDF register directly
results in a no operation (although Status bits may be
affected). An effective 9-bit address is obtained by
concatenating the 8-bit FSR and the IRP bit of the
STATUS register, as shown in Figure 10-3.
A simple program to clear RAM location 40h-7Fh using
indirect addressing is shown in Example 10-2.
For more information, refer to Application Note AN556
– “Implementing a Table Read” (DS00556).
DS20005750A-page 84
2017 Microchip Technology Inc.
MCP19122/3
EXAMPLE 10-2:
MOVLW
MOVWF
NEXT
CLRF
INCF
BTFSS
GOTO
CONTINUE
FIGURE 10-3:
INDIRECT ADDRESSING
0x40
FSR
INDF
FSR
FSR,7
NEXT
;initialize pointer
;to RAM
;clear INDF register
;inc pointer
;all done?
;no clear next
;yes continue
DIRECT/INDIRECT ADDRESSING
Direct Addressing
RP1 RP0 6
Bank Select
From Opcode
Indirect Addressing
0
IRP
Bank Select
Location Select
00h
7 File Select Register
00
01
10
0
Location Select
11
180h
Data
Memory
7Fh
1FFh
Bank 0
Bank 1
Bank 2
Bank 3
For memory map detail, see Figure 10-2.
2017 Microchip Technology Inc.
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MCP19122/3
NOTES:
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2017 Microchip Technology Inc.
MCP19122/3
11.0
SPECIAL FEATURES OF THE
CPU
The MCP19122/3 has a host of features intended to
maximize system reliability, minimize cost through
elimination of external components, provide powersaving features and offer code protection.
These features are:
• Reset
- Power-on Reset (POR)
- Power-up Timer (PWRT)
- Brown-out Reset (BOR)
• Interrupts
• Watchdog Timer (WDT)
• Oscillator selection
• Sleep
• Code protection
• ID Locations
• In-Circuit Serial Programming
11.1
Configuration Bits
The Configuration bits can be programmed (read as
‘0’), or left unprogrammed (read as ‘1’) to select various
device configurations as shown in Register 11-1.
These bits are mapped in program memory location
2007h.
Note:
Address 2007h is beyond the user program
memory space. It belongs to the special
configuration memory space (2000h3FFFh), which can be accessed only during
programming. See “Memory Programming
Specification” (DS41561) for more
information.
The Power-up Timer (PWRT), which provides a fixed
delay of 72 ms (nominal) on power-up only, is designed
to keep the part in Reset while the power supply
stabilizes. There is also circuitry to reset the device if a
brown-out occurs, which can use the Power-up Timer
to provide at least a 72 ms Reset. With these functionson-chip, most applications need no external Reset
circuitry.
The Sleep mode is designed to offer a very low-current
Power-Down mode. The user can wake-up from Sleep
through:
• External Reset
• Watchdog Timer Wake-up
• An interrupt
2017 Microchip Technology Inc.
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MCP19122/3
REGISTER 11-1:
CONFIGURATION WORD REGISTER
R/P-1
U-1
DEBUG
—
R/P-1
R/P-1
U-1
R/P-1
—
BOREN
WRT
bit 13
bit 8
U-1
R/P-1
R/P-1
R/P-1
R/P-1
U-1
U-1
U-1
—
CP
MCLRE
PWRTE
WDTE
—
—
—
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared
‘1’ = Bit is set
-n = Value when blank or after Bulk Erase
bit 13
DEBUG: Debug Mode Enable bit(2)
1 = Background debugger is disabled
0 = Background debugger is enabled
bit 12
Unimplemented: Read as ‘1’.
bit 11-10
WRT: Flash Program Memory Self Write Enable bits
11 = Write protection off
10 = 000h to FFh write-protected, 100h to 3FFh may be modified by PMCON1 control
01 = 000h to 1FFh write-protected, 200h to 3FFh may be modified by PMCON1 control
00 = 000h to 3FFh write-protected, entire program is write-protected
bit 9
Unimplemented: Read as ‘1’.
bit 8
BOREN: Brown-out Reset Enable bit
1 = BOR enabled during operation and disabled in Sleep
0 = BOR disabled
bit 7
Unimplemented: Read as ‘1’.
bit 6
CP: Code Protection bit
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 5
MCLRE: MCLR/VPP Pin Function Select bit
1 = MCLR pin is MCLR function and weak internal pull-up is enabled
0 = MCLR pin is input function, MCLR function is internally disabled
bit 4
PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
bit 3
WDTE: Watchdog Timer Enable bit
1 = WDT enabled
0 = WDT disabled
bit 2-0
Unimplemented: Read as ‘1’.
Note 1:
2:
Enabling Brown-out Reset does not automatically enable Power-up Timer.
The Configuration bit is managed automatically by the device development tools. The user should not
attempt to manually write this bit location. However, the user should ensure that this location has been
programmed to a ‘1’ and the device checksum is correct for proper operation of production software.
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MCP19122/3
11.2
Code Protection
Code protection allows the device to be protected from
unauthorized access. Internal access to the program
memory is unaffected by any code protection setting.
11.2.1
PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP bit in the Configuration Word. When CP = 0, external reads and writes
of program memory are inhibited and a read will return
all ‘0’s. The CPU can continue to read program memory, regardless of the protection bit settings. Writing the
program memory is dependent upon the write protection setting.
11.3
Write Protection
Write protection allows the device to be protected from
unintended self-writes. Applications, such as boot
loader software, can be protected while allowing other
regions of the program memory to be modified.
The WRT bits in the Configuration Word define
the size of the program memory block that is protected.
11.4
ID Locations
Four memory locations (2000h-2003h) are designated
as ID locations where the user can store checksum or
other code identification numbers. These locations are
not accessible during normal execution but are readable and writable during Program/Verify mode. Only
the Least Significant 7 bits of the ID locations are
reported when using MPLAB Integrated Development
Environment (IDE).
2017 Microchip Technology Inc.
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MCP19122/3
NOTES:
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MCP19122/3
12.0
RESETS
The reset logic is used to place the MCP19122/3 into a
known state. The source of the reset can be
determined by using the device status bits.
There are multiple ways to reset this device:
•
•
•
•
•
•
Power-on Reset (POR)
WDT Reset during normal operation
WDT Reset during Sleep
MCLR Reset during normal operation
MCLR Reset during Sleep
Brown-out Reset (BOR)
To allow VDD to stabilize, an optional power-up timer
can be enabled to extend the Reset time after a POR
event.
Some registers are not affected in any Reset condition;
their status is unknown on POR and unchanged in any
other Reset. Most other registers are reset to a “Reset
state” on:
•
•
•
•
•
Power-on Reset
MCLR Reset
MCLR Reset during Sleep
WDT Reset
Brown-out Reset (BOR)
WDT wake-up does not cause register resets in the
same manner as a WDT Reset since wake-up is
viewed as the resumption of normal operation. TO and
PD bits are set or cleared differently in different Reset
situations, as indicated in Table 12-1. Software can use
these bits to determine the nature of the Reset. See
Table 12-2 for a full description of Reset states of all
registers.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 12-1.
The MCLR Reset path has a noise filter to detect and
ignore small pulses. See Section 5.0, Digital Electrical
Characteristics for pulse-width specifications.
FIGURE 12-1:
SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
External
Reset
MCLR pin
(1)
Sleep
WDT
Module
WDT
Time-out
Reset
VIN Rise
Detect
VIN
Power-on Reset
Brown-out(1)
Reset
BOREN
S
PWRT
On-Chip
RC OSC
Chip_Reset
R
11-bit Ripple Counter
Q
Enable PWRT
Note 1: Refer to the Configuration Word register (Register 11-1).
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MCP19122/3
TABLE 12-1:
TIME-OUT IN VARIOUS SITUATIONS
Power-up
Brown-out Reset
PWRTE = 0
PWRTE = 1
PWRTE = 0
PWRTE = 1
Wake-up from
Sleep
TPWRT
—
TPWRT
—
—
Oscillator Configuration
INTOSC
TABLE 12-2:
STATUS/PCON BITS AND THEIR SIGNIFICANCE
POR
BOR
TO
PD
Condition
0
x
1
1
Power-on Reset
u
0
1
1
Brown-out Reset
u
u
0
u
WDT Reset
u
u
0
0
WDT Wake-up
u
u
u
u
MCLR Reset during normal operation
u
u
1
0
MCLR Reset during Sleep
Legend: u = unchanged, x = unknown
12.1
Power-on Reset (POR)
The on-chip POR circuit holds the chip in Reset until
VDD has reached a high enough level for proper
operation. To take advantage of the POR, simply
connect the MCLR pin through a resistor to VDD. This
will eliminate external RC components usually needed
to create Power-on Reset. If the BOR is enabled, the
maximum rise time specification does not apply. The
BOR circuitry will keep the device in Reset until VDD
reaches VBOR (see Section 12.3 “Brown-out Reset
(BOR)”).
When the device starts normal operation (exits the
Reset condition), device operating parameters (i.e.,
voltage, frequency, temperature, etc.) must be met to
ensure proper operation. If these conditions are not
met, the device must be held in Reset until the
operating conditions are met.
12.2
MCLR
MCP19122/3 has a noise filter in the MCLR Reset path.
The filter will detect and ignore small pulses.
It should be noted that a WDT Reset does not drive
MCLR pin low.
Voltages applied to the MCLR pin that exceed its
specification can result in both MCLR Resets and
excessive current beyond the device specification
during the ESD event. For this reason, Microchip
recommends that the MCLR pin no longer be tied
directly to VDD. The use of an RC network, as shown in
Figure 12-2, is suggested.
An internal MCLR option is enabled by clearing the
MCLRE bit in the Configuration Word register. When
MCLRE = 0, the Reset signal to the chip is generated
internally. When the MCLRE = 1, the MCLR pin
becomes an external Reset input. In this mode, the
MCLR pin has a weak pull-up to VDD.
FIGURE 12-2:
RECOMMENDED MCLR
CIRCUIT
VDD
R2
MCLR
SW1
(optional)
100
(needed with
capacitor)
MCP19122/3
R1
1 k (or greater)
C1
0.1 µF
(optional, not critical)
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MCP19122/3
12.3
VDD + VDROPOUT. During power-down with BOR
enabled, the MCU operation will be held in Reset when
VDD falls below the VBOR threshold. With BOR disabled
or while operating in Sleep mode, the POR will hold the
part in Reset when VDD falls below the VPOR threshold.
Brown-out Reset (BOR)
The BOREN bit in the Configuration Word register
enables or disables the BOR mode. See Register 11-1
for the Configuration Word definition.
A brown-out occurs when VDD falls below VBOR for
greater than 100 µs minimum. On a Reset (Power-On,
Brown-Out, Watchdog Timer, etc.), the chip will remain
in Reset until VDD rises above VBOR (refer to Figure 123). If enabled, the Power-up Timer will be invoked by
the Reset and will keep the chip in Reset an additional
72 ms. During power-up, it is recommended that the
BOR configuration bit is enabled, holding the MCU in
Reset (OSC turned off and no code execution) until
VDD exceeds the VBOR threshold. Users have the
option of adding an additional 72 ms delay be clearing
the PWRTE bit. At this time, the VDD voltage level is
high enough to operate the MCU functions only; all
other device functionality is not operational. This is
independent of the value of VIN, which is typically
FIGURE 12-3:
A brown-out occurs when VIN falls below VBOR for
greater than parameter TBOR. The brown-out condition
will reset the device. This will occur regardless of VIN
slew rate. A Brown-out Reset may not occur if VIN falls
below VBOR for less than parameter TBOR.
Note:
If VDD drops below VBOR while the Power-up Timer is
running, the chip will go back into a Brown-out Reset
and the Power-up Timer will be re-initialized. Once VDD
rises above VBOR, the Power-up Timer will execute a
72 ms Reset.
BROWN-OUT SITUATIONS
VDD
Internal
Reset
VBOR
72 ms(1)
VDD
Internal
Reset
VBOR
< 72 ms
72 ms(1)
VDD
Internal
Reset
Note 1:
The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
register.
VBOR
72 ms(1)
72 ms delay only if PWRTE bit is programmed to ‘0’.
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MCP19122/3
12.4
Power-up Timer (PWRT)
The Power-up Timer provides a fixed 64 ms (nominal)
time-out on power-up only, from POR Reset. The
Power-up Timer operates from an internal RC
oscillator. The chip is kept in Reset as long as PWRT is
active. The PWRT delay allows the VDD to rise to an
acceptable level. A Configuration bit (PWRTE), can
disable (if set) or enable (if cleared or programmed) the
Power-up Timer.
The Power-up Timer delay will vary from chip to chip
due to:
• VDD variation
• Temperature variation
• Process variation
The Power-Up Timer optionally delays device
execution after a POR event. This timer is typically used
to allow VDD to stabilize before allowing the device to
start running.
The Power-up Timer is controlled by the PWRTE bit of
the Configuration Word.
Note:
Voltage spikes below VSS at the MCLR
pin, inducing currents greater than 80 mA,
may cause latch-up. Thus, a series resistor of 50-100 should be used when
applying a “low” level to the MCLR pin,
rather than pulling this pin directly to VSS.
FIGURE 12-4:
12.5
Watchdog Timer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. See Section 15.0,
Watchdog Timer (WDT) for more information.
12.6
Start-up Sequence
Upon the release of a POR, the following must occur
before the device will begin executing:
• Power-up Timer runs to completion (if enabled)
• Oscillator start-up timer runs to completion
• MCLR must be released (if enabled)
The total time-out will vary based on PWRTE bit status.
For example, with PWRTE bit erased (PWRT disabled),
there will be no time-out at all. Figures 12-4, 12-5
and 12-6 depict time-out sequences.
Since the time-outs occur from the POR pulse, if MCLR
is kept low long enough, the time-outs will expire. Then,
bringing MCLR high will begin execution immediately
(see Figure 12-5). This is useful for testing purposes or
to synchronize more than one MCP19122/3 device
operating in parallel.
12.6.1
POWER CONTROL (PCON)
REGISTER
The Power Control register PCON (address 8Eh) has
two Status bits to indicate what type of Reset occurred
last.
TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 1
VDD
MCLR
Internal POR
TPWRT
PWRT Time-out
TIOSCST
OST Time-out
Internal Reset
DS20005750A-page 94
2017 Microchip Technology Inc.
MCP19122/3
FIGURE 12-5:
TIME-OUT SEQUENCE ON POWER-UP (DELAYED MCLR): CASE 2
VDD
MCLR
Internal POR
TPWRT
PWRT Time-out
TIOSCST
OST Time-out
Internal Reset
FIGURE 12-6:
TIME-OUT SEQUENCE ON POWER-UP (MCLR WITH VDD)
VDD
MCLR
Internal POR
TPWRT
PWRT Time-out
TIOSCST
OST Time-out
Internal Reset
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MCP19122/3
12.7
Determining the Cause of a Reset
TABLE 12-3:
Upon any Reset, multiple bits in the STATUS and
PCON register are updated to indicate the cause of the
Reset. Table 12-3 and Table 12-4 show the Reset
conditions of these registers.
TABLE 12-4:
RESET STATUS BITS AND
THEIR SIGNIFICANCE
POR BOR TO
PD
Condition
0
x
1
1
Power-on Reset
u
0
1
1
Brown-out Reset
u
u
0
u
WDT Reset
u
u
0
0
WDT Wake-up from Sleep
u
u
1
0
Interrupt Wake-up from
Sleep
u
u
u
u
MCLR Reset during normal
operation
u
u
1
0
MCLR Reset during Sleep
0
u
0
x
Not allowed. TO is set on
POR
0
u
x
0
Not allowed. PD is set on
POR
RESET CONDITION FOR SPECIAL REGISTERS (Note 2)
Program
Counter
STATUS
Register
PCON
Register
Power-on Reset
0000h
0001 1xxx
---- --0u
Brown-out Reset
000
0001 1xxx
---- --u0
MCLR Reset during normal operation
0000h
000u uuuu
---- --uu
MCLR Reset during Sleep
0000h
0001 0uuu
---- --uu
WDT Reset
0000h
0000 uuuu
---- --uu
Condition
WDT Wake-up from Sleep
Interrupt Wake-up from Sleep
Legend:
Note 1:
2:
PC + 1
uuu0 0uuu
---- --uu
PC + 1(1)
uuu1 0uuu
---- --uu
u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on the stack
and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
If a Status bit is not implemented, that bit will be read as ‘0’.
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MCP19122/3
12.8
The PCON register bits are shown in Register 12-1.
Power Control (PCON) Register
The Power Control (PCON) register contains flag bits
to differentiate between a:
• Power-on Reset (POR)
• Over Temperature (OT)
• Brown-out Reset (BOR)
REGISTER 12-1:
PCON: POWER CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
U-0
R/W-0
U-0
—
—
—
—
—
—
POR
BOR
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-2
Unimplemented: Read as '0'
bit 1
POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0
Unimplemented: Read as '0'
TABLE 12-5:
Name
PCON
STATUS
SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
—
—
—
—
POR
BOR
97
IPR
RP1
RP0
TO
PD
Z
DC
C
77
Legend: — = unimplemented bit, reads as ‘0’. Shaded cells are not used by Resets.
Note 1: Other (non Power-up) Resets include MCLR Reset and Watchdog Timer Reset during normal operation.
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MCP19122/3
NOTES:
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MCP19122/3
13.0
INTERRUPTS
The MCP19122/3 has multiple sources of interrupt:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
External Interrupt (INT pin)
Interrupt-on-Change (IOC) Interrupts
Timer0 Overflow Interrupt
Timer1 Overflow Interrupt
Timer1 Gate Interrupt
Timer2 Match Interrupt
ADC Interrupt
SSP
BCL
Input Undervoltage Interrupt
Input Overvoltage Interrupt
System Output Overvoltage Interrupt
System Output Undervoltage Interrupt
System Output Overcurrent Interrupt
Overtemperature
CC1
CC2
The Interrupt Control register (INTCON) and Peripheral
Interrupt Request Registers (PIRx) record individual
interrupt requests in flag bits. The INTCON register
also has individual and global interrupt enable bits.
The Global Interrupt Enable bit, GIE of the INTCON
register, enables (if set) all unmasked interrupts, or
disables (if cleared) all interrupts. Individual interrupts
can be disabled through their corresponding enable
bits in the INTCON register and PIEx registers. GIE is
cleared on Reset.
When an interrupt is serviced, the following actions
occur automatically:
• The GIE is cleared to disable any further interrupt.
• The return address is pushed onto the stack.
• The PC is loaded with 0004h.
Routine, the source(s) of the interrupt can be
determined by polling the interrupt flag bits. The
interrupt flag bit(s) must be cleared in software before
re-enabling interrupts to avoid multiple interrupt
requests.
Note 1: Individual interrupt flag bits are set,
regardless of the status of their
corresponding mask bit or the GIE bit.
2: When an instruction that clears the GIE
bit is executed, any interrupts that were
pending for execution in the next cycle
are ignored. The interrupts, which were
ignored, are still pending to be serviced
when the GIE bit is set again.
For additional information on Timer1, Timer2,
comparators, ADC, CCD modules, refer to the
respective peripheral section.
13.0.1
GPA2/INT INTERRUPT
The external interrupt on the GPA2/INT pin is edgetriggered; either on the rising edge if the INTEDG bit of
the OPTION register is set, or the falling edge, if the
INTEDG bit is clear. When a valid edge appears on the
GPA2/INT pin, the INTF bit of the INTCON register is
set. This interrupt can be disabled by clearing the INTE
control bit of the INTCON register. The INTF bit must
be cleared by software in the Interrupt Service Routine
before re-enabling this interrupt. The GPA2/INT
interrupt can wake-up the processor from Sleep, if the
INTE bit was set prior to going into Sleep. See
Section 14.0 “Power-Down Mode (Sleep)” for details
on Sleep.
Note:
The ANSELx register must be initialized to
configure an analog channel as a digital
input. Pins configured as analog inputs
will read ‘0’ and cannot generate an
interrupt.
The Return from Interrupt instruction, RETFIE, exits
the interrupt routine, as well as sets the GIE bit, which
re-enables unmasked interrupts.
The following interrupt flags are contained in the
INTCON register:
• INT Pin Interrupt
• Interrupt-on-Change (IOC) Interrupts
• Timer0 Overflow Interrupt
The peripheral interrupt flags are contained in the PIR1
and PIR2 registers. The corresponding interrupt enable
bit is contained in the PIE1 and PIE2 registers.
For external interrupt events, such as the INT pin or
PORTGPx change interrupt, the interrupt latency will
be three or four instruction cycles. The exact latency
depends upon when the interrupt event occurs (see
Figure 13-2). The latency is the same for one or twocycle instructions. Once in the Interrupt Service
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MCP19122/3
13.0.2
TIMER0 INTERRUPT
13.0.3
An overflow (FFh 00h) in the TMR0 register will set
the T0IF bit of the INTCON register. The interrupt can
be enabled/disabled by setting/clearing T0IE bit of the
INTCON register. See Section 21.0 “Timer0 Module”
for operation of the Timer0 module.
An input change on PORTGPx sets the IOCIF bit of the
INTCON register. The interrupt can be enabled/
disabled by setting/clearing the IOCIE bit of the
INTCON register. Plus, individual pins can be
configured through the IOC register.
Note:
FIGURE 13-1:
PORTGPX INTERRUPT-ONCHANGE
If a change on the I/O pin should occur
when any PORTGPx operation is being
executed, then the IOCIF interrupt flag
may not get set.
INTERRUPT LOGIC
UVIF
UVIE
OVIF
OVIE
OCIF
OCIE
OVLOIF
OVLOIE
UVLOIF
UVLOIE
OTIF
OTIE
T0IF
T0IE
ADIF
ADIE
BCLIF
BCLIE
SSPIF
SSPIE
CC1IF
CC1IE
CC2IF
CC2IE
INTF
INTE
IOCF
IOCE
Wake-up (If in Sleep mode)
Interrupt to CPU
PEIF
PEIE
GIE
TMR2IF
TMR2IE
TMR1IF
TMR1IE
TMR1GIF
TMR1GIE
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MCP19122/3
FIGURE 13-2:
INT PIN INTERRUPT TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
CLKIN
(3)
CLKOUT
(4)
INT pin
(1)
INTF flag
(INTCON reg.)
(1)
(5)
Interrupt Latency(2)
GIE bit
(INTCON reg.)
INSTRUCTION FLOW
PC
PC
Instruction
Fetched
Instruction
Executed
Inst (PC)
Inst (PC – 1)
PC + 1
Inst (PC + 1)
Inst (PC)
PC + 1
—
Dummy Cycle
0004h
0005h
Inst (0004h)
Inst (0005h)
Dummy Cycle
Inst (0004h)
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-4 TCY. Synchronous latency = 3 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT is available only in INTOSC and RC Oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 5.0, Digital Electrical Characteristics.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
13.1
13.1.1
Interrupt Control Registers
INTCON REGISTER
The INTCON register is a readable and writable register, that contains the various enable and flag bits for the
TMR0 register overflow, interrupt-on-change and
external INT pin interrupts.
Note:
Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the appropriate interrupt flag bits are clear prior to
enabling an interrupt.
2017 Microchip Technology Inc.
DS20005750A-page 101
MCP19122/3
REGISTER 13-1:
INTCON: INTERRUPT CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-x
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
GIE: Global Interrupt Enable bit
1 = Enables all unmasked interrupts
0 = Disables all interrupts
bit 6
PEIE: Peripheral Interrupt Enable bit
1 = Enables all unmasked peripheral interrupts
0 = Disables all peripheral interrupts
bit 5
T0IE: TMR0 Overflow Interrupt Enable bit
1 = Enables the TMR0 interrupt
0 = Disables the TMR0 interrupt
bit 4
INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3
IOCE: Interrupt-on-Change Enable bit(1)
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2
T0IF: TMR0 Overflow Interrupt Flag bit(2)
1 = TMR0 register has overflowed (must be cleared in software)
0 = TMR0 register did not overflow
bit 1
INTF: External Interrupt Flag bit
1 = The external interrupt occurred (must be cleared in software)
0 = The external interrupt did not occur
bit 0
IOCF: Interrupt-on-Change Interrupt Flag bit
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
Note 1:
2:
x = Bit is unknown
IOC register must also be enabled.
T0IF bit is set when TMR0 rolls over. TMR0 is unchanged on Reset and should be initialized before clearing T0IF bit.
DS20005750A-page 102
2017 Microchip Technology Inc.
MCP19122/3
13.1.1.1
PIE1 Register
The PIE1 register contains the Peripheral Interrupt
Enable bits, as shown in Register 13-1.
Note 1: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 13-1: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TMR1GIE
ADIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 gate interrupt
1 = Disables the Timer1 gate interrupt
bit 6
ADIE: ADC Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5
BCLIE: MSSP Bus Collision Interrupt Enable bit
1 = Enables the MSSP Bus Collision Interrupt
0 = Disables the MSSP Bus Collision Interrupt
bit 4
SSPIE: Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 3
CC2IE: Capture2/Compare2 Interrupt Enable bit
1 = Enables the Capture2/Compare2 interrupt
0 = Disables the Capture2/Compare2 interrupt
bit 2
CC1IE: Capture1/Compare1 Interrupt Enable bit
1 = Enables the Capture1/Compare1 interrupt
0 = Disables the Capture1/Compare1 interrupt
bit 1
TMR2IE: Timer2 Interrupt Enable
1 = Enables the Timer2 interrupt
0 = Disables the Timer2 interrupt
bit 2
TMR1IE: Timer1 Interrupt Enable
1 = Enables the Timer1 interrupt
0 = Disables the Timer1 interrupt
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 103
MCP19122/3
13.1.1.2
PIE2 Register
The PIE2 register contains the Peripheral Interrupt
Enable bits, as shown in Register 13-2.
Note 1: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
REGISTER 13-2: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
R/W-0
UVIE
OTIE
OCIE
OVIE
—
—
OVLOIE
UVLOIE
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
UVIE: Output Undervoltage Interrupt enable bit
1 = Enables the UV interrupt
0 = Disables the UV interrupt
bit 6
OTIE: Overtemperature Interrupt enable bit
1 = Enables over temperature interrupt
0 = Disables over temperature interrupt
bit 5
OCIE: Output Overcurrent Interrupt enable bit
1 = Enables the OC interrupt
0 = Disables the OC interrupt
bit 4
OVIE: Output Overvoltage Interrupt enable bit
1 = Enables the OV interrupt
0 = Disables the OV interrupt
bit 3-2
Unimplemented: Read as '0'
bit 1
OVLOIE: VIN Overvoltage Lock Out Interrupt Enable bit
1 = Enables the VIN OVLO interrupt
0 = Disables the VIN OVLO interrupt
bit 0
UVLOIE: VIN Undervoltage Lock Out Interrupt Enable bit
1 = Enables the VIN UVLO interrupt
0 = Disables the VIN UVLO interrupt
DS20005750A-page 104
x = Bit is unknown
2017 Microchip Technology Inc.
MCP19122/3
13.1.1.3
PIR1 Register
The PIR1 register contains the Peripheral Interrupt
Flag bits, as shown in Register 13-3.
Note 1: Interrupt flag bits are set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit
or the Global Enable bit, GIE of the
INTCON register. User software should
ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt.
REGISTER 13-3: PIR1: PERIPHERAL INTERRUPT FLAG REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
TMR1GIF
ADIF
BCLIF
SSPIF
CC2IF
CC1IE
TMR2IF
TMR1IF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6
ADIF: ADC Interrupt Flag bit
1 = ADC conversion complete
0 = ADC conversion has not completed or has not been started
bit 5
BCLIF: MSSP Bus Collision Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4
SSPIF: Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3
CC2IF: Capture2/Compare2 Interrupt Flag bit
1 = Capture or Compare has occurred
0 = Capture or Compare has not occurred
bit 2
CC1IF: Capture2/Compare2 Interrupt Flag bit
1 = Capture or Compare has occurred
0 = Capture or Compare has not occurred
bit 1
TMR2IF: Timer2 to PR2 Match Interrupt Flag
1 = Timer2 to PR2 match occurred (must be cleared in software)
0 = Timer2 to PR2 match did not occur
bit 0
TMR1IF: Timer1 Interrupt Flag
1 = Timer1 rolled over (must be cleared in software)
0 = Timer1 has not rolled over
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 105
MCP19122/3
13.1.1.4
PIR2 Register
The PIR2 register contains the Peripheral Interrupt
Flag bits, as shown in Register 13-4.
Note 1: Interrupt flag bits are set when an
interrupt condition occurs, regardless of
the state of its corresponding enable bit
or the Global Enable bit, GIE of the
INTCON register. User software should
ensure the appropriate interrupt flag bits
are clear prior to enabling an interrupt.
REGISTER 13-4: PIR2: PERIPHERAL INTERRUPT FLAG REGISTER 2
R/W-0
R/W-0
R/W-0
R/W-0
U-0
U-0
R/W-0
R/W-0
UVIF
OTIF
OCIF
OVIF
—
—
OVLOIF
UVLOIF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
UVIF: Output Undervoltage error interrupt flag bit
1 = Output undervoltage error has occurred
0 = Output undervoltage error has not occurred
bit 6
OTIF: Overtemperature interrupt flag bit
1 = Overtemperature error has occurred
0 = Overtemperature error has not occurred
bit 5
OCIF: Output over current error interrupt flag bit
1 = Output overcurrent error has occurred
0 = Output overcurrent error has not occurred
bit 4
OVIF: Output overvoltage error interrupt flag bit
1 = Output overvoltage error has occurred
0 = Output overvoltage error has not occurred
bit 3-2
Unimplemented: Read as '0'
bit 1
OVLOIF: VIN Overvoltage Lock Interrupt Flag bit
With OVLOINTP bit set
1 = A VIN NOT overvoltage to VIN overvoltage edge has been detected
0 = A VIN NOT overvoltage to VIN overvoltage edge has NOT been detected
With OVLOINTN bit set
1 = A VIN overvoltage to VIN NOT overvoltage edge has been detected
0 = A VIN overvoltage to VIN NOT overvoltage edge has NOT been detected
bit 0
UVLOIF: VIN Undervoltage Lock Out Interrupt Flag bit
With UVLOINTP bit set
1 = A VIN NOT undervoltage to VIN undervoltage edge has been detected
0 = A VIN NOT undervoltage to VIN undervoltage edge has NOT been detected
With UVLOINTN bit set
1 = A VIN undervoltage to VIN NOT undervoltage edge has been detected
0 = A VIN undervoltage to VIN NOT undervoltage edge has NOT been detected
DS20005750A-page 106
2017 Microchip Technology Inc.
MCP19122/3
TABLE 13-5:
SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
Name
INTCON
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
102
RAPU
INTEDG
T0CE
T0SE
PSA
PS2
PS1
PS0
83
PIE1
—
ADIE
BCLIE
SSPIE
—
—
TMR2IE
TMR1IE
103
PIE2
UVIE
—
OCIE
OVIE
—
—
VINIE
—
104
PIR1
—
ADIF
BCLIF
SSPIF
—
—
TMR2IF
TMR1IF
105
UVIF
—
OCIF
OVIF
—
—
VINIF
—
106
OPTION_REG
PIR2
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by Interrupts.
13.2
Context Saving During Interrupts
During an interrupt, only the return PC value is saved
on the stack. Typically, users may wish to save key
registers during an interrupt (e.g., W and STATUS
registers). This must be implemented in software.
Temporary
holding
registers
W_TEMP
and
STATUS_TEMP should be placed in the last 16 bytes
of GPR. These 16 locations are common to all banks
and do not require banking. This makes context save
and restore operations simpler. The code shown in
Example 13-1 can be used to:
•
•
•
•
•
Store the W register
Store the STATUS register
Execute the ISR code
Restore the Status (and Bank Select Bit register)
Restore the W register
Note:
The MCP19122/3 device does not require
saving the PCLATH. However, if
computed GOTOs are used in both the ISR
and the main code, the PCLATH must be
saved and restored in the ISR.
EXAMPLE 13-1:
MOVWF
SWAPF
SAVING STATUS AND W REGISTERS IN RAM
W_TEMP
STATUS,W
MOVWF
STATUS_TEMP
:
:(ISR)
:
SWAPF
STATUS_TEMP,W
MOVWF
SWAPF
SWAPF
STATUS
W_TEMP,F
W_TEMP,W
2017 Microchip Technology Inc.
;Copy W to TEMP
;Swap status to
;Swaps are used
;Save status to
register
be saved into W
because they do not affect the status bits
bank zero STATUS_TEMP register
;Insert user code here
;Swap STATUS_TEMP register into W
;(sets bank to original state)
;Move W into STATUS register
;Swap W_TEMP
;Swap W_TEMP into W
DS20005750A-page 107
MCP19122/3
NOTES:
DS20005750A-page 108
2017 Microchip Technology Inc.
MCP19122/3
14.0
POWER-DOWN MODE (SLEEP)
The Power-down mode is entered by executing a
SLEEP instruction.
Upon entering SLEEP, the following conditions exist:
• WDT will be cleared but keeps running, if enabled
for operation during SLEEP.
• PD bit of the STATUS register is cleared.
• TO bit of the STATUS register is set.
• CPU clock is disabled.
• The ADC is inoperable due to the absence of the
4V LDO power (AVDD) while the ADC reference is
set to AVDD. To minimize sleep current the ADC
reference must be set to the default AVDD.
• I/O Ports maintain the status they had before
SLEEP was executed (driving high, low or highimpedance).
• Resets other than WDT and BOR are not affected
by SLEEP mode.
• Analog circuitry power (AVDD) is removed during
SLEEP.
Refer to individual chapters for more details on
peripheral operation during SLEEP.
To minimize current consumption,
conditions should be considered:
the
following
•
•
•
•
I/O pins should not be floating.
External circuitry sinking current from I/O pins.
Internal circuitry sourcing current from I/O pins.
Current draw from pins with internal weak pullups.
• Modules using Timer1 oscillator.
• ADC reference must be set to default condition
(AVDD).
• I/O pins that are high-impedance inputs should be
pulled to VDD or GND externally to avoid switching currents caused by floating inputs.
If the VDDEN bit is set, the SLEEP instruction removes
power from the analog circuitry. AVDD is shut down to
minimize current draw in SLEEP Mode and to achieve
the 50µA typical shutdown current. Shutdown current
specifications can only be met with no current draw
from external loads. The 5V VDD voltage drops to
2.5V-3.0V and is only capable of supplying >1mA in
SLEEP Mode. If more than 1mA of current are drawn
form VDD while in the low current SLEEP Mode, VDD
will collapse causing a reset of the device and the
device coming back out of SLEEP.
A POR event during SLEEP will wake the device from
SLEEP. The enable state of the analog circuitry does
not change with the execution of the SLEEP command.
2017 Microchip Technology Inc.
14.0.1
WAKE-UP FROM SLEEP
The device can wake-up from SLEEP through one of
the following events:
1.
2.
3.
4.
5.
External Reset input on MCLR pin, if enabled.
POR Reset.
Watchdog Timer, if enabled.
Any external interrupt.
Interrupts by peripherals capable of running
during SLEEP (see individual peripheral for
more information).
The first two events will cause a device reset. The last
three events are considered a continuation of program
execution. To determine whether a device reset or
wake-up event occurred, refer to Section 12.7
“Determining the Cause of a Reset”
The following peripheral interrupts can wake the device
from SLEEP:
• Interrupt-on-change
• External interrupt from INT pin
When the SLEEP instruction is being executed, the
next instruction (PC + 1) is prefetched. For the device
to wake up through an interrupt event, the corresponding interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction, the device will
then call the Interrupt Service Routine. In cases where
the execution of the instruction following SLEEP is not
desirable, the user should have a NOP after the
SLEEP instruction.
The WDT is cleared when the device wakes up from
SLEEP, regardless of the source of the wake-up.
14.0.2
WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of the
SLEEP instruction
- SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared.
- TO bit in the STATUS register will not be set.
- PD bit in the STATUS register will not be
cleared.
• If the interrupt occurs during or after the execution of a SLEEP instruction
- SLEEP instruction will be completely executed
- Device will immediately wake up from SLEEP
- WDT and WDT prescaler will be cleared
- TO bit in STATUS register will be set
- PD bit in the STATUS register will be cleared
DS20005750A-page 109
MCP19122/3
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flags bits to
become set before the SLEEP instruction completes. To
FIGURE 14-1:
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3
Q4 Q1
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC
TOST
Interrupt Latency (1)
Interrupt flag
GIE bit
(INTCON reg.)
Processor in
Sleep
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
Note
1:
PC
Inst(PC) = Sleep
Inst(PC - 1)
INTCON
PC + 2
PC + 2
Inst(PC + 2)
Sleep
Inst(PC + 1)
PC + 2
Dummy Cycle
0004h
0005h
Inst(0004h)
Inst(0005h)
Dummy Cycle
Inst(0004h)
GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
TABLE 14-1:
Name
PC + 1
Inst(PC + 1)
SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register on
Page
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
102
IOCA
IOCA7
IOCA6
IOCA5
—
IOCA3
IOCA2
IOCA1
IOCA0
130
IOCB
IOCB7
IOCB6
IOCB5
IOCB4
—
—
IOCB1
IOCB0
130
PIE1
TXIE
RCIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
103
PIE2
CDSIE
ADIE
—
OTIE
OVIE
DRUVIE
OVLOIE
UVLOIE
104
PIR1
TXIF
RCIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
105
PIR2
CDSIF
ADIF
—
OTIF
OVIF
DRUVIF
OVLOIF
UVLOIF
106
IRP
RP1
RP0
TO
PD
Z
DC
C
77
STATUS
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-down mode.
DS20005750A-page 110
2017 Microchip Technology Inc.
MCP19122/3
15.0
WATCHDOG TIMER (WDT)
15.2
The WDT has a nominal time-out period of 18 ms (with
no prescaler). The time-out periods vary with
temperature, VDD and process variations from part to
part (see DC specs). If longer time-out periods are
desired, a prescaler with a division ratio of up to 1:128
can be assigned to the WDT under software control by
writing to the OPTION register. Thus, time-out periods
up to 2.3 seconds can be realized.
The Watchdog Timer is a free-running timer, using the
on chip RC oscillator as its clock source. The WDT is
enabled by setting the WDTE bit of the Configuration
Word (default setting). When WDTE is set, the on-chip
RC oscillator will always be enabled to provide a clock
source to the WDT module.
15.1
WDT Period
Watchdog Timer (WDT) Operation
The CLRWDT and SLEEP instructions clear the WDT
and the prescaler, if assigned to the WDT, and prevent
it from timing out and generating a device Reset.
During normal operation, a WDT time-out generates a
device Reset. If the device is in Sleep mode, a WDT
time-out causes the device to wake-up and continue
with normal operation; this is known as a WDT wakeup. The WDT can be permanently disabled by clearing
the WDTE configuration bit.
The TO bit in the STATUS register will be cleared upon
a Watchdog Timer time-out.
15.3
The postscaler assignment is fully under software control and can be changed during program execution.
WDT Programming
Considerations
It should also be taken in account that under worstcase conditions (i.e., VDD = Min., Temperature = Max.,
Max. WDT prescaler) it may take several seconds
before a WDT time-out occurs.
FIGURE 15-1:
WATCHDOG TIMER WITH SHARED PRESCALE BLOCK DIAGRAM
FOSC/4
Data Bus
0
8
1
1
Sync
2 TCY
Shared Prescale
T0CKI
pin
TMR0
0
0
T0CS
T0SE
Set Flag bit T0IF
on Overflow
PSA
8-bit
Prescaler
1
PSA
PS
Watchdog
Timer
RC OSC
8
1
WDT
Time-out
2
0
PSA
PSA
WDTE
Note 1: T0SE, T0CS, PSA, PS are bits in the OPTION_REG register.
2: WDTE bit is in the Configuration Word register.
2017 Microchip Technology Inc.
DS20005750A-page 111
MCP19122/3
TABLE 15-1:
WDT STATUS
Conditions
WDT
WDTE = 0
CLRWDT Command
Cleared
Exit Sleep
SLEEP Command
TABLE 15-2:
Name
OPTION_REG
SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
RAPU
INTEDG
T0CE
T0SE
PSA
PS2
PS1
PS0
83
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer.
TABLE 15-3:
Name
Bits
CONFIG
13:8
7:0
SUMMARY OF CONFIGURATION WORD ASSOCIATED WITH WATCHDOG TIMER
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
—
—
DBGEN
—
WRT1
—
CP
MCLRE
PWRTE
WDTE
Bit 9/1
Bit 8/0
Register
on Page
WRT0
—
BOREN
88
—
—
—
Bit 11/3 Bit 10/2
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer.
DS20005750A-page 112
2017 Microchip Technology Inc.
MCP19122/3
16.0
OSCILLATOR MODES
16.3
The MCP19122/3 has one oscillator configuration,
which is an 8 MHz internal oscillator.
16.1
Internal Oscillator (INTOSC)
The Internal Oscillator module provides a system
clock source of 8 MHz. The frequency of the internal
oscillator can be trimmed with a calibration value in the
OSCTUNE register.
16.2
Frequency Tuning in User Mode
In addition to the factory calibration, the base
frequency can be tuned in the user's application. This
frequency tuning capability allows the user to deviate
from the factory calibrated frequency. The user can
tune the frequency by writing to the OSCTUNE
register (see Register 16-1).
Oscillator Calibration
The 8 MHz internal oscillator is factory calibrated. The
factory calibration values reside in the read-only
Calibration Word 1 register. These values must be read
from the Calibration Word 1 register and stored in the
OSCCAL register. Refer to Section 20.0 “Flash
Program Memory Control” for the procedure on
reading from program memory.
Note 1: The FCAL bits from the Calibration
Word 1 register must be written into the
OSCCAL register to calibrate the internal
oscillator.
REGISTER 16-1:
OSCTUNE: – OSCILLATOR TUNING REGISTER
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
—
—
—
TUN4
TUN3
TUN2
TUN1
TUN0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-5
Unimplemented: Read as ‘0’
bit 4-0
TUN: Frequency Tuning bits
01111 = Maximum frequency
01110 =
•
•
•
00001 =
00000 = Center frequency. Oscillator Module is running at the calibrated frequency.
11111 =
•
•
•
10000 = Minimum frequency
2017 Microchip Technology Inc.
DS20005750A-page 113
MCP19122/3
16.3.1
OSCILLATOR DELAY UPON
POWER-UP, WAKE-UP AND
BASE FREQUENCY CHANGE
On power-up, the device is held in reset by the
power-up time, if the power-up timer is enabled.
In applications where the OSCTUNE register is used to
shift the frequency of the internal oscillator, the user
should not expect the frequency of the internal
oscillator to stabilize immediately. In this case, the
frequency may shift gradually toward the new value.
The time for this frequency shift is less than eight cycles
of the base frequency.
TABLE 16-1:
Following a wake-up from Sleep mode or POR, an
internal delay of ~10 µs is invoked to allow the
memory bias to stabilize before program execution
can begin.
SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
OSCTUNE
—
—
—
TUN4
TUN3
TUN2
TUN1
TUN0
113
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources.
TABLE 16-2:
SUMMARY OF CALIBRATION WORD ASSOCIATED WITH CLOCK SOURCES
Name
Bits
Bit -/7
Bit -/6
Bit 13/5
Bit 12/4
Bit 11/3
Bit 10/2
Bit 9/1
Bit 8/0
CALWD1
13:8
—
—
BGR5
BGR4
BGR3
BGR2
BGR1
BGR0
7:0
—
FCAL6
FCAL5
FCAL4
FCAL3
FCAL2
FCAL1
FCAL0
Register
on Page
61
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by clock sources.
DS20005750A-page 114
2017 Microchip Technology Inc.
MCP19122/3
17.0
I/O PORTS
17.1
In general, when a peripheral is enabled, that pin may
not be used as a general purpose I/O pin.
Each port has two registers for its operation. These
registers are:
• TRISGPx registers (data direction register)
• PORTGPx registers (reads the levels on the pins
of the device)
Some ports may have one or more of the following
additional registers. These registers are:
• ANSELx (analog select)
• WPUx (weak pull-up)
Ports with analog functions also have an ANSELx
register, which can disable the digital input and save
power. A simplified model of a generic I/O port, without
the interfaces to other peripherals, is shown in
Figure 17-1.
FIGURE 17-1:
GENERIC I/O PORTGPX
OPERATION
Read
D
Write PORTx
TRISx
Data Register
Data Bus
I/O pin
Read PORTx
To peripherals
ANSELx
EXAMPLE 17-1:
;
;
;
;
VSS
INITIALIZING PORTA
This code example illustrates
initializing the PORTGPA register. The
other ports are initialized in the same
manner.
BANKSEL
CLRF
BANKSEL
CLRF
BANKSEL
MOVLW
MOVWF
PORTGPA;
PORTGPA;Init PORTA
ANSELA;
ANSELA;digital I/O
TRISGPA;
B'00011111';Set GPA as
;inputs
TRISGPA;and set GPA as
;outputs
2017 Microchip Technology Inc.
Reading the PORTGPA register (Register 17-1) reads
the status of the pins, whereas writing to it will write to
the PORT latch. All write operations are read-modifywrite operations.
The TRISGPA register (Register 17-2) controls the
PORTGPA pin output drivers, even when they are being
used as analog inputs. The user must ensure the bits in
the TRISGPA register are maintained set when using
them as analog inputs. I/O pins configured as analog
input always read ‘0’. If the pin is configured for a digital
output (either port or alternate function), the TRISGPA bit
must be cleared in order for the pin to drive the signal, and
a read will reflect the state of the pin.
INTERRUPT-ON-CHANGE
Each PORTGPA pin is individually configurable as an
interrupt-on-change pin. Control bits IOCA
enable or disable the interrupt function for each pin.
The interrupt-on-change feature is disabled on a
Power-on Reset. Reference Section 18.0 “InterruptOn-Change” for more information.
VDD
CK
PORTGPA is an 8-bit wide, bidirectional port consisting
of five CMOS I/O, two open drain I/O, and one open
drain input-only pin. The corresponding data direction
register is TRISGPA (Register 17-2). Setting a
TRISGPA bit (= 1) will make the corresponding
PORTGPA pin an input (i.e., disable the output driver).
Clearing a TRISGPA bit (= 0) will make the
corresponding PORTGPA pin an output (i.e., enables
output driver). The exception is GPA5, which is input
only and its TRISGPA bit will always read as ‘1’.
Example 17-1 shows how to initialize an I/O port.
17.1.1
Q
PORTGPA and TRISGPA Registers
17.1.2
WEAK PULL-UPS
PORTGPA and PORTGPA5 have an internal weak
pull-up. PORTGPA are special ports for the SSP
module and do not have weak pull-ups. PORTGPA
are special current source ports and do not have weak
pull-ups. PORTGPA4 is a true open drain pin and does
not have a weak pull-up. Individual control bits can enable
or disable the internal weak pull-ups (see Register 17-3).
The weak pull-up is automatically turned off when the port
pin is configured as an output or on a Power-on Reset
setting the RAPU bit of the OPTION register. The weak
pull-up on GPA5 is enabled when configured as MCLR
pin by setting bit 5 of the Configuration Word or when
controlled by software.
17.1.3
WEAK CURRENT SOURCE
PORTGPA are capable of being configured as
weak current sources. Setting WPUGPA allow
each pin to source 50 µA (typical). By connecting GPA2
or GPA3 to ground with a resistor The voltage on the
pin can be read with the A/D to determine device I2C/
PMBus address. The value of the resistor to ground
shall be 3 k to 50 k.
DS20005750A-page 115
MCP19122/3
The current source on GPA3 also functions as the Error
Amplifier clamp control source.
17.1.5
17.1.4
Each PORTGPA pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are shown in Table 17-1. For additional
information, refer to the appropriate section in this data
sheet.
ANSELA REGISTER
The ANSELA register (Register 17-4) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELA bit high will cause all
digital reads on the pin to be read as ‘0’ and allows
analog functions on the pin to operate correctly.
The state of the ANSELA bits has no effect on the digital output functions. A pin with TRISGPA clear and
ANSELA set will still operate as a digital output, but the
Input mode will be analog. This can cause unexpected
behavior when executing read-modify-write instructions on the affected port.
Note:
The ANSELA bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSELA bits
must be initialized to ‘0’ by user software.
DS20005750A-page 116
PORTGPA FUNCTIONS AND
OUTPUT PRIORITIES
PORTGPA pins GPA7 and GPA4 are true open-drain
pins with no connection back to VDD.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input functions, such as ADC, are not shown in
the priority lists. These inputs are active when the I/O
pin is set for Analog mode using the ANSELA registers.
Digital output functions may control the pin when it is in
Analog mode with the priority shown in Table 17-1.
2017 Microchip Technology Inc.
MCP19122/3
TABLE 17-1:
Pad Name
GPA0
GPA1
GPA2
GPA3
GPA4
GPA5
PORTGPA FUNCTIONS2
Function
I/O
Type &
Priority(1)
Description
The GPA0 pad has basic port, peripheral and test mode features. The test mode outputs of the
ALT_ICSPDAT and ANALOG_TEST take priority over the port data. The TRISGPA bit is overridden when configured as ALT_ICSPDAT or analog test output. The pad is an output only when
configured so by the user. Enabling the AN0 input disables the input buffers and forces
PORTGPA to read ‘0’.
OUT
CMOS-4 PORTGPA data output
GPA0
IN
TTL
PORTGPA data input
AN0
IN
ANA
Channel 0 A/D input
ANALOG_TE
OUT
ANA-3
Analog test mode output
ST
The GPA1 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. Enabling the AN1 input disables the input buffers and forces PORTGPA to
read ‘0’.
OUT
CMOS-2 PORTGPA data output
GPA1
IN
TTL
PORTGPA data input
AN1
IN
ANA
Channel 1 A/D input
IN
ST
Synchronization signal input
SYC_SIGNAL
OUT
CMOS-1 Synchronization signal output
The GPA2 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. Enabling the AN2 input disables the input buffers and forces PORTGPA to
read ‘0’.
OUT
CMOS-1 PORTGPA data output
GPA2
IN
ST
PORTGPA data input
AN2
IN
ANA
Channel 2 A/D input
T0CKI
IN
ST
Timer 0 input
INT
IN
ST
External interrupt input
The GPA3 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user. Enabling the AN3 input disables the input buffers and forces PORTGPA to
read ‘0’.
OUT
CMOS-1 PORTGPA data output
GPA3
IN
ST
PORTGPA data input
AN3
IN
ANA
Channel 3 A/D input
T1G1
IN
ST
Input 1 to Timer1 gate
The GPA4 pad is a high voltage port. The TRISGPA bit is always set.
OUT
OD
PORTGPA open drain data output
GPA4
IN
TTL
PORTGPA open drain date input
The GPA5 pad is an input-only high voltage port. The TRISGPA bit is always set.
GPA5
IN
TTL
PORTGPA open drain data input
MCLR
IN
ST
MCLR input
TEST
IN
HV
ICSP and test mode entry high voltage pin
Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt
Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage
Note 1:Output priority number determines the precedence of data into the MUX when multiple outputs are available
at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same
priority number are mutually exclusive.
2: Pad module signal connections reflect only the module input signals. Output connections are addressed in
the corresponding consumer module.
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MCP19122/3
TABLE 17-1:
Pad Name
PORTGPA FUNCTIONS2 (CONTINUED)
Function
I/O
Type &
Priority(1)
Description
The GPA6 pad has basic port, peripheral and test mode features. The ICSPDAT output signal takes
priority over the port data. The TRISGPA bit is overridden to ‘0’ when configured to output ICSPDAT,
otherwise, the pad is an output only when configured so by the user.
OUT
CMOS-3 PORTGPA data output
GPA6
IN
ST
PORTGPA data input
OUT
CMOS-1 ICSP Data output (MCP19122 Only)
ICSPDAT
IN
ST
ICSP Data input (MCP19122 Only)
OUT
CMOS-2 CCD1 output
CCD1
IN
ST
CCD1 input
GPA7
The GPA7 pad has basic port, peripheral and test mode features.
OUT
OD-2
PORTGPA open drain
GPA7
IN
ST
PORTGPA data input
IN
I2C
I2C slave mode clock input with selectable I2C or SMBus
input levels
SCL
OUT
OD-1
I2C master mode clock output
ICSPCLK
IN
ST
ICSPCK input (MCP19122 Only)
Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt
Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage
Note 1:Output priority number determines the precedence of data into the MUX when multiple outputs are available
at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same
priority number are mutually exclusive.
2: Pad module signal connections reflect only the module input signals. Output connections are addressed in
the corresponding consumer module.
GPA6
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MCP19122/3
REGISTER 17-1:
PORTGPA: PORTGPA REGISTER
R/W-x
R/W-x
R-x
R-x
R/W-x
R/W-x
R/W-x
R/W-x
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
GPA7: General Purpose Open Drain I/O pin
bit 6
GPA6: General Purpose I/O pin
1 = Port pin is > VIH
0 = Port pin is < VIL
bit 5
GPA5/MCLR: General Purpose Open Drain Input pin
bit 4
GPA4: General Purpose Open Drain I/O pin
bit 3-0
GPA: General Purpose I/O pin
1 = Port pin is > VIH
0 = Port pin is < VIL
REGISTER 17-2:
x = Bit is unknown
TRISGPA: PORTGPA TRI-STATE REGISTER
R/W-1
R/W-1
R-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
TRISA: PORTGPA Tri-State Control bit
1 = PORTGPA pin configured as an input (tri-stated)
0 = PORTGPA pin configured as an output
bit 5
TRISA5: GPA5 Port Tri-State Control bit
This bit is always ‘1’ as GPA5 is an input only
bit 4-0
TRISA: PORTGPA Tri-State Control bit
1 = PORTGPA pin configured as an input (tri-stated)
0 = PORTGPA pin configured as an output
2017 Microchip Technology Inc.
x = Bit is unknown
DS20005750A-page 119
MCP19122/3
REGISTER 17-3:
WPUGPA: WEAK PULL-UP PORTGPA REGISTER
U-0
U-0
R/W-1
U-0
R/W-1
R/W-1
R/W-1
R/W-1
—
—
WPUA5
—
WCS1
WCS0
WPUA1
WPUA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5
WPUA5: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 4
Unimplemented: Read as ‘0’
bit 3-2
WCS: Weak Current Source bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 1-0
WPUA: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
Note 1:
2:
3:
x = Bit is unknown
The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in input mode
(TRISGPA = 1), and the individual WPUA bit is enabled (WPUA = 1), and the pin is not configured as an
analog input.
GPA5 weak pull-up is also enabled when the pin is configured as MCLR in Configuration word.
GPA2 and GPA3 weak current sources are not dependant on the global RAPU.
REGISTER 17-4:
ANSELA: ANALOG SELECT PORTGPA REGISTER
U-0
U-0
U-0
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
ANSA: Analog Select PORTGPA Register bit
1 = Analog input. Pin is assigned as analog input.(1)
0 = Digital I/O. Pin is assigned to port or special function.
Note 1:
x = Bit is unknown
Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups, and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
DS20005750A-page 120
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MCP19122/3
TABLE 17-2:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPA
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
120
OPTION_REG
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
83
IOCA
IOCA7
IOCA6
IOCA5
IOCA4
IOCA3
IOCA2
IOCA1
IOCA0
130
Name
ANSELA
PORTGPA
GPA7
GPA6
GPA5
GPA4
GPA3
GPA2
GPA1
GPA0
119
TRISGPA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
WPUGPA
—
—
WPUA5
—
WCS1
WCS0
WPUA1
WPUA0
120
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by PORTGPA.
2017 Microchip Technology Inc.
DS20005750A-page 121
MCP19122/3
17.2
PORTGPB and TRISGPB
Registers
PORTGPB is an 8-bit wide, bidirectional port consisting
of seven general purpose I/O ports. The corresponding
data direction register is TRISGPB (Register 17-6).
Setting a TRISGPB bit (= 1) will make the corresponding
PORTGPB pin an input (i.e., disable the output driver).
Clearing a TRISGPB bit (= 0) will make the
corresponding PORTGPB pin an output (i.e., enable the
output driver). Example 17-1 shows how to initialize an
I/O port.
Some pins for PORTGPB are multiplexed with an
alternate function for the peripheral, or a clock function.
In general, when a peripheral or clock function is
enabled, that pin may not be used as a general purpose
I/O pin.
Reading the PORTGPB register (Register 17-5) reads
the status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations.
The TRISGPB register (Register 17-6) controls the
PORTGPB pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits in
the TRISGPB register are maintained set when using
them as analog inputs. I/O pins configured as analog
input always read ‘0’. If the pin is configured for a digital
output (either port or alternate function), the TRISGPB bit
must be cleared in order for the pin to drive the signal and
a read will reflect the state of the pin.
17.2.1
Input mode will be analog. This can cause unexpected
behavior when executing read-modify-write instructions
on the affected port.
Note:
17.2.4
The ANSELB bits default to the Analog
mode after Reset. To use any pins as
digital general purpose or peripheral
inputs, the corresponding ANSELB bits
must be initialized to ‘0’ by the user’s
software.
PORTGPB FUNCTIONS AND
OUTPUT PRIORITIES
Each PORTGPB pin is multiplexed with other functions.
The pins, their combined functions and their output
priorities are shown in Table 17-3. For additional
information, refer to the appropriate section in this data
sheet.
PORTGPB pin GPB0 is a true open drain pin with no
connection back to VDD.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input functions, such as ADC, and some digital
input functions are not included in the list below. These
inputs are active when the I/O pin is set for Analog
mode using the ANSELB registers. Digital output
functions may control the pin when it is in Analog mode,
with the priority shown in Table 17-3.
INTERRUPT-ON-CHANGE
Each PORTGPB pin is individually configurable as an
interrupt-on-change pin. Control bits IOCB and
IOCB enable or disable the interrupt function for
each pin. The interrupt-on-change feature is disabled
on a Power-on Reset. Reference Section 18.0
“Interrupt-On-Change” for more information.
17.2.2
WEAK PULL-UPS
Each of the PORTGPB pins, except GPB0, has an
individually configurable internal weak pull-up. Control
bits WPUB and WPUB enable or disable
each pull-up (see Register 17-7). Each weak pull-up is
automatically turned off when the port pin is configured
as an output. All pull-ups are disabled on a Power-on
Reset by the RAPU bit of the OPTION register.
17.2.3
ANSELB REGISTER
The ANSELB register (Register 17-8) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELB bit high will cause all
digital reads on the pin to be read as ‘0’ and allows
analog functions on the pin to operate correctly.
The state of the ANSELB bits has no effect on the digital
output functions. A pin with TRISGPB clear and
ANSELB set will still operate as a digital output, but the
DS20005750A-page 122
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MCP19122/3
TABLE 17-3:
Pad Name
PORTGPB FUNCTIONS(2)
Function
I/O
Type &
Priority (1)
Description
The GPB0 pad has basic port, peripheral and test mode features. The pad is an output only when configured so by the user.
OUT
OD-2
PORTGPB data output, open drain
GPB0
IN
TTL
PORTGPB data input, open drain
I2C slave mode data input with selectable I2C or SMBus
IN
I2C
input levels
SDA
OUT
OD-1
I2C master mode data open drain output
GPB1
The GPB1 pad has basic port, peripheral and test mode features. The pad is an output only when sp
configured by the user. Enabling the AN4 input disables the input buffers and forces PORTGPB to
read ‘0’.
OUT
CMOS-2 PORTGPB data output
GPB1
IN
TTL
PORTGPB data input
AN4
IN
ANA
Channel 4 A/D input
CON_SIGNAL
IN
ANA
Slave mode Current Reference input
OUT
ANA-1
Master mode Current Sense output
GPB2
The GPB2 pad has basic port and peripheral features. The pad is an output only when so configured by
the user. Enabling the AN5 input disables the input buffers and forces PORTGPB to read ‘0’.
OUT
CMOS
PORTGPB data output
GPB2
IN
TTL
PORTGPB data input
AN5
IN
ANA
Channel 5 A/D input
T1G2
IN
ST
Input 2 to TIMER1 gate
GPB3
The GPB3 pad has basic port and peripheral features. The pad is an output only when so configured by
the user.
OUT
CMOS
PORTGPB data output
GBP3
IN
TTL
PORTGPA data input
OUT
CMOS
Oscillator output
CLOCK
IN
ST
Oscillator input
GPB4
The GPB4 pad has basic port, peripheral and test mode features. The test mode outputs of ICSPDAT
take priority over the port data. The TRISGPB bit is overridden to ‘0’ when configured as ICSPDAT. The
pad is an output only when configured so by the user. Enabling the AN6 input disables the input buffers
and forces PORTGPB to read ‘0’. This pin is only available on the MCP19123.
OUT
CMOS-3 PORTGPB data output
GPB4
IN
TTL
PORTGPB data input
AN6
IN
ANA
Channel 6 A/D input
OUT
CMOS-2 Serial programming data output
ICSPDAT
IN
ST
Serial programming data input
OUT
CMOS-1 In-Circuit debug data output
ICDDAT
IN
ST
In-Circuit debug data input
Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt
Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage
Note 1: Output priority number determines the precedence of data into the MUX when multiple outputs are available
at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same
priority number are mutually exclusive.
2: Pad module signal connections reflect only the module input signals. Output connections are addressed in
the corresponding consumer module.
GPB0
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MCP19122/3
Pad Name
Function
I/O
Type &
Priority (1)
Description
The GPB5 pad has basic port and peripheral features. The pad is an output only when configured so by
the user. This pin is only available on the MCP19123.
OUT
CMOS
PORTGPB data output
GPB5
IN
TTL
PORTGPB data input
AN7
IN
ANA
Channel 7 A/D input
ICSPCLK
IN
ST
Serial programming clock input
ICDCLK
IN
ST
In-Circuit debugger clock input
GPB6
The GPB6 pad has basic port and peripheral features. The pad is an output only when so configured by
the user. This pin is only available on the MCP19123.
OUT
CMOS-2 PORTGPB data output
GPB6
IN
TTL
PORTGPB data input
OUT
CMOS-1 CCD2 output
CCD2
IN
ST
CCD2 input
GPB7
The GPB7 pad has basic port and peripheral features. The pad is an output only when so configured by
the user. This pin is only available on the MCP19123.
OUT
CMOS-1 PORTGPB data output
GPB7
IN
TTL
PORTGPB data input
VDAC
IN
ANA
External ADC reference
Legend: OUT - Output, IN - Input, ANA - Analog Signal, DIG - Digital Output, OD - Open Drain Output, ST - Schmitt
Buffer Input, TTL - TTL Buffer Input, XTAL - Crystal connection, HV - High Voltage
Note 1: Output priority number determines the precedence of data into the MUX when multiple outputs are available
at the same time (1 - highest priority). This number affects drive data, but not drive enable. Items with same
priority number are mutually exclusive.
2: Pad module signal connections reflect only the module input signals. Output connections are addressed in
the corresponding consumer module.
GPB5
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MCP19122/3
REGISTER 17-5:
R/W-x
GPB7
PORTGPB: PORTGPB REGISTER
R/W-x
(1)
(1)
GPB6
R/W-x
GPB5
R/W-x
(1)
(1)
GPB4
R/W-x
R/W-x
R/W-x
R/W-x
GPB3
GPB2
GPB1
GPB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
x = Bit is unknown
GPB: General Purpose I/O Pin bit
1 = Port pin is > VIH
0 = Port pin is < VIL
Not implemented on MCP19122.
REGISTER 17-6:
TRISGPB: PORTGPB TRI-STATE REGISTER
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
TRISB7(1)
TRISB6(1)
TRISB5(1)
TRISB4(1)
TRISB3
TRISB2
TRISB1
TRISB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
x = Bit is unknown
TRISB: PORTGPB Tri-State Control bit
1 = PORTGPB pin configured as an input (tri-stated)
0 = PORTGPB pin configured as an output
Not implemented on MCP19122.
2017 Microchip Technology Inc.
DS20005750A-page 125
MCP19122/3
REGISTER 17-7:
R/W-1
WPUGPB: WEAK PULL-UP PORTGPB REGISTER
R/W-1
(2)
WPUB7
WPUB6
(2)
R/W-1
WPUB5
(2)
R/W-1
WPUB4
(2)
R/W-0
R/W-1
R/W-1
U-0
WPUB3
WPUB2
WPUB1
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-3
WPUB: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 2-1
WPUB: Weak Pull-up Register bit
1 = Pull-up enabled
0 = Pull-up disabled
bit 0
x = Bit is unknown
Unimplemented: Read as ‘0’
Note 1:
2:
The weak pull-up device is enabled only when the global RAPU bit is enabled, the pin is in Input mode
(TRISGPA = 1), the individual WPUB bit is enabled (WPUB = 1), and the pin is not configured as an
analog input.
Not implemented on MCP19122.
REGISTER 17-8:
ANSELB: ANALOG SELECT PORTGPB REGISTER
U-0
U-0
R/W-1
R/W-1
U-0
R/W-1
R/W-1
U-0
—
—
ANSB5(2)
ANSB4(2)
—
ANSB2
ANSB1
—
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
ANSB: Analog Select PORTGPB Register bit
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 3
Unimplemented: Read as ‘0’
bit 2-1
ANSB: Analog Select PORTGPB Register bit
1 = Analog input. Pin is assigned as analog input(1).
0 = Digital I/O. Pin is assigned to port or special function.
bit 0
Unimplemented: Read as ‘0’
Note 1:
2:
x = Bit is unknown
Setting a pin to an analog input automatically disables the digital input circuitry, weak pull-ups and
interrupt-on-change if available. The corresponding TRIS bit must be set to Input mode in order to allow
external control of the voltage on the pin.
Not implemented on MCP19122.
DS20005750A-page 126
2017 Microchip Technology Inc.
MCP19122/3
TABLE 17-4:
SUMMARY OF REGISTERS ASSOCIATED WITH PORTGPB
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
—
—
ANSB5
ANSB4
—
ANSB2
ANSB1
—
126
OPTION_REG
RAPU
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
83
IOCB
IOCB7
IOCB6
IOCB5
IOCB4
IOCB3
IOCB2
IOCB1
IOCB0
130
Name
ANSELB
PORTGPB
GPB7
GPB6
GPB5
GPB4
GPB3
GPB2
GPB1
GPB0
125
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
WPUB1
—
126
WPUGPB
Legend:
WPUB7
—
WPUB6
WPUB5
WPUB4
WPUB3
WPUB2
= unimplemented locations read as ‘0’. Shaded cells are not used by PORTGPB.
2017 Microchip Technology Inc.
DS20005750A-page 127
MCP19122/3
NOTES:
DS20005750A-page 128
2017 Microchip Technology Inc.
MCP19122/3
18.0
INTERRUPT-ON-CHANGE
Each PORTGPA and PORTGPB pin is individually
configurable as an interrupt-on-change pin. Control bits
IOCA and IOCB enable or disable the interrupt function
for each pin. Refer to Register 18-1 and Register 18-2.
The interrupt-on-change is disabled on a Power-on
Reset.
The interrupt-on-change on GPA5 is disabled when
configured as MCLR pin in the Configuration Word.
For enabled interrupt-on-change pins, the values are
compared with the old value latched on the last read of
PORTGPA or PORTGPB. The mismatched outputs of
the last read of all the PORTGPA and PORTGPB pins
are OR’ed together to set the Interrupt-on-Change
Interrupt Flag bit (IOCF) in the INTCON register.
18.1
Enabling the Module
To allow individual port pins to generate an interrupt, the
IOCIE bit of the INTCON register must be set. If the
IOCIE bit is disabled, the edge detection on the pin will
still occur, but an interrupt will not be generated.
18.2
Individual Pin Configuration
To enable a pin to detect an interrupt-on-change, the
associated IOCAx or IOCBx bit of the IOCA or IOCB
register is set.
2017 Microchip Technology Inc.
18.3
Clearing Interrupt Flags
The user, in the Interrupt Service Routine, clears the
interrupt by:
a)
Any read of PORTGPA or PORTGPB AND
Clear flag bit IOCF. This will end the mismatch
condition;
b)
Any write of PORTGPA or PORTGPB AND
Clear flag bit IOCF will end the mismatch
condition.
OR
A mismatch condition will continue to set flag bit IOCF.
Reading PORTGPA or PORTGPB will end the
mismatch condition and allow flag bit IOCF to be
cleared. The latch holding the last read value is not
affected by a MCLR Reset. After this Reset, the IOCF
flag will continue to be set if a mismatch is present.
Note:
18.4
If a change on the I/O pin should occur
when any PORTGPA or PORTGPB
operation is being executed, then the
IOCF interrupt flag may not get set.
Operation in Sleep
The interrupt-on-change interrupt sequence will wake
the device from Sleep mode, if the IOCE bit is set.
DS20005750A-page 129
MCP19122/3
18.5
Interrupt-On-Change Registers
REGISTER 18-1:
IOCA: INTERRUPT-ON-CHANGE PORTGPA REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
IOCA7
IOCA6
IOCA5
IOCA4
IOCA3
IOCA2
IOCA1
IOCA0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
IOCA: Interrupt-on-Change PORTGPA Register bits.
1 = Interrupt-on-change enabled on the pin
0 = Interrupt-on-change disabled on the pin
bit 5
IOCA: Interrupt-on-Change PORTGPA Register bits(1).
1 = Interrupt-on-change enabled on the pin
0 = Interrupt-on-change disabled on the pin
bit 4-0
IOCA: Interrupt-on-Change PORTGPA Register bits.
1 = Interrupt-on-change enabled on the pin
0 = Interrupt-on-change disabled on the pin
Note 1:
x = Bit is unknown
The Interrupt-on-change on GPA5 is disabled if GPA5 is configured as MCLR.
REGISTER 18-2:
IOCB: INTERRUPT-ON-CHANGE PORTGPB REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
IOCB7(1)
IOCB6(1)
IOCB5(1)
IOCB4(1)
IOCB3
IOCB2
IOCB1
IOCB0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
x = Bit is unknown
IOCB: Interrupt-on-Change PORTGPB Register bits.
1 = Interrupt-on-change enabled on the pin
0 = Interrupt-on-change disabled on the pin
Not implemented on MCP19122.
DS20005750A-page 130
2017 Microchip Technology Inc.
MCP19122/3
TABLE 18-1:
SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ANSELA
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
120
ANSELB
—
—
ANSB5
ANSB4
—
ANSB2
ANSB1
—
126
Name
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
102
IOCA
IOCA7
IOCA6
IOCA5
IOCA4
IOCA3
IOCA2
IOCA1
IOCA0
130
IOCB
IOCB7
IOCB6
IOCB5
IOCB4
IOCB3
IOCB2
IOCB1
IOCB0
130
TRISGPA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
TRISB3
TRISB2
TRISB1
TRISB0
125
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by interrupt-on-change.
2017 Microchip Technology Inc.
DS20005750A-page 131
MCP19122/3
NOTES:
DS20005750A-page 132
2017 Microchip Technology Inc.
MCP19122/3
19.0
ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESH:ADRESL register pair).
Figure 19-1 shows the block diagram of the ADC.
On the MCP19122/3 devices the 4.096V AVDD or 5V
VDD can be used for the ADC reference. On the
MCP19123 device an external reference can be used
by selecting the ADREF pin as the ADC voltage reference source. The ADCON1 bit controls the
ADC reference source.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
Note:
Once VIN is greater than AVDD + VDROPOUT,
AVDD is in regulation, allowing A/D readings
to be accurate. Once VIN is greater than
VDD + VDROPOUT, VDD is in regulation.
Setting the ADC reference to VDD allows
accurate ratiometric measurements.
2017 Microchip Technology Inc.
DS20005750A-page 133
MCP19122/3
FIGURE 19-1:
ADC BLOCK DIAGRAM
RELEFF
001000
VIN/16
001001
INT_VREG
001010
VREF_REG
001011
E/A Output
001100
IAVE after S&H
001101
ISENSE after Ramp Comp
001110
IOUT w/ 6dB gain
001111
TEMP_SNS
010000
Band Gap Ref
010001
VREF_REP
010010
VOTUVLO Ref
010011
VOTOVLO Ref
010100
VINUVLO Ref
010101
VINOVLO Ref
010110
OC Ref
MASTER ISENSE
Input
VBGR_REP
010111
GPA3 Buffered
011010
Internal Virtual GND
011011
ISENSE After S&H and
Added Gain
011100
E/A Output
After Clamp
Raw ISENSE
Error Amp Clamp Ref
TRIͲSTATE
011000
VCFG
011001
ADREF Pin
11
ADREF Pin
10
011101
011110
VDD
01
AVDD
00
011111
CHS5:CHS0
GPA0/AN0
000000
GPA1/AN1
000001
GPA2/AN2
000010
GPA3/AN3
000011
GPB1/AN4
000100
GPB2/AN5
000101
(MCP19123 Only) GPB4/AN6
000110
(MCP19123 Only) GPB5/AN7
000111
ADC
10
GO/DONE
10
ADON
ADRESH ADRESL
VSS
CHS5:CHS0
DS20005750A-page 134
2017 Microchip Technology Inc.
MCP19122/3
19.1
ADC Configuration
When configuring and using the ADC, the following
functions must be considered:
•
•
•
•
•
Port configuration
Channel selection
ADC conversion clock source
Interrupt control
Result formatting
19.1.1
PORT CONFIGURATION
The ADC can be used to convert both analog and
digital signals. When converting analog signals, the I/O
pin should be configured for analog by setting the
associated TRIS and ANSEL bits. Refer to
Section 17.0 “I/O Ports” for more information.
Note:
19.1.2
Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
CHANNEL SELECTION
There are up to 30 channel selections available on the
MCP19122 and 32 channel selections available on the
MCP19123. See Figure 19-1 and Register 19-1 for
channel information.
19.1.3
ADC CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits of the ADCON1 register.
There are five possible clock options:
•
•
•
•
•
FOSC/8
FOSC/16
FOSC/32
FOSC/64
FRC (clock derived from internal oscillator with a
divisor of 16)
The time to complete one bit conversion is defined as
TAD. One full 10-bit conversion requires 11 TAD periods
as shown in Figure 19-2.
For a correct conversion, the appropriate TAD
specification must be met. Refer to the A/D conversion
requirements in Section 5.0 “Digital Electrical
Characteristics” for more information. Table 19-1
gives examples of appropriate ADC clock selections.
Note:
Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
TABLE 19-1:
The CHS bits of the ADCON0 register determine
which channel is connected to the sample and hold
circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 19.2
“ADC Operation” for more information.
ADC CLOCK PERIOD (TAD) VS.
DEVICE OPERATING
FREQUENCIES
Device
Frequency
(FOSC)
ADC Clock Period (TAD)
ADC
Clock Source
ADCS
8 MHz
FOSC/8
001
1.0 µs(2)
FOSC/16
101
2.0 µs
FOSC/32
010
4.0 µs
FOSC/64
110
8.0 µs(3)
FRC
x11
2.0 – 6.0 µs(1,4)
Legend: Shaded cells are outside of recommended
range.
Note 1: The FRC source has a typical TAD time of
4 µs for VDD > 3.0V.
2: These values violate the minimum
required TAD time.
3: For faster conversion times, the selection
of another clock source is recommended.
4: The FRC clock source is only
recommended if the conversion will be
preformed during Sleep.
2017 Microchip Technology Inc.
DS20005750A-page 135
MCP19122/3
FIGURE 19-2:
ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
TCY - TAD TAD1 TAD2 TAD3 TAD4 TAD5 TAD6 TAD7 TAD8 TAD9 TAD10 TAD11
b9
b8
b7
b6
b5
b4
b3
b1
b2
b0
Conversion starts
Holding capacitor is disconnected from analog input (typically 100 ns)
Set GO/DONE bit
On the following cycle:
ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input.
19.1.4
INTERRUPTS
This interrupt can be generated while the device is
operating, or while in Sleep. If the device is in Sleep,
the interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the GIE and PEIE bits of the INTCON
register must be disabled. If the GIE and PEIE bits of
the INTCON register are enabled, execution will switch
to the Interrupt Service Routine.
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC Interrupt Flag is the ADIF bit in
the PIR1 register. The ADC Interrupt Enable is the
ADIE bit in the PIE1 register. The ADIF bit must be
cleared in software.
Note 1: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
19.1.5
RESULT FORMATTING
The 10-bit A/D conversion result can be supplied in two
formats, left justified or right justified. The ADFM bit of
the ADCON0 register controls the output format.
Figure 19-3 shows the output format.
FIGURE 19-3:
10-BIT A/D CONVERSION RESULT FORMAT
ADRESH
(ADFM = 0)
ADRESL
MSB
LSB
bit 7
bit 0
bit 7
10-bit A/D Result
(ADFM = 1)
Unimplemented: Read as ‘0’
MSB
bit 7
Unimplemented: Read as ‘0’
DS20005750A-page 136
bit 0
LSB
bit 0
bit 7
bit 0
10-bit A/D Result
2017 Microchip Technology Inc.
MCP19122/3
19.2
19.2.1
ADC Operation
STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digital conversion.
Note:
19.2.2
The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer
to
Section 19.2.4
“A/D
Conversion Procedure”.
COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF Interrupt Flag bit
• Update the ADRESH:ADRESL registers with new
conversion result
19.2.3
TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH:ADRESL registers will not be updated with
the partially complete Analog-to-Digital conversion
sample. Instead, the ADRESH:ADRESL register pair
will retain the value of the previous conversion.
Additionally, a two TAD delay is required before another
acquisition can be initiated. Following the delay, an
input acquisition is automatically started on the
selected channel.
Note:
A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
19.2.4
A/D CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1.
2.
3.
4.
5.
6.
7.
8.
Configure Port:
• Disable pin output driver (Refer to the TRIS
register)
• Configure pin as analog (Refer to the ANSEL
register)
Configure the ADC module:
• Select ADC conversion clock
• Select ADC input channel
• Turn on ADC module
Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
Wait the required acquisition time(2).
Start conversion by setting the GO/DONE bit.
Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
Read ADC Result.
Clear the ADC interrupt flag (required if interrupt
is enabled).
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: Refer to Section 19.4 “A/D Acquisition
Requirements”.
EXAMPLE 19-1:
A/D CONVERSION
;This code block configures the ADC
;for polling, Frc clock and AN0 input.
;
;Conversion start & polling for completion ;
are included.
;
BANKSEL
ADCON1
;
MOVLW
B’01110000’
;Frc clock
MOVWF
ADCON1
;
BANKSEL
TRISGPA
;
BSF
TRISGPA,0
;Set GPA0 to input
BANKSEL
ANSELA
;
BSF
ANSELA,0
;Set GPA0 to analog
BANKSEL
ADCON0
;
MOVLW
B’01000001’
;Select channel AN0
MOVWF
ADCON0
;Turn ADC On
CALL
SampleTime
;Acquisiton delay
BSF
ADCON0,1
;Start conversion
BTFSC
ADCON0,1
;Is conversion done?
GOTO
$-1
;No, test again
BANKSEL
ADRESH
;
MOVF
ADRESH,W
;Read upper 2 bits
MOVWF
RESULTHI
;store in GPR space
BANKSEL
ADRESL
;
MOVF
ADRESL,W
;Read lower 8 bits
MOVWF
RESULTLO
;Store in GPR space
2017 Microchip Technology Inc.
DS20005750A-page 137
MCP19122/3
19.3
ADC Register Definitions
REGISTER 19-1:
R/W-0
ADCON0: A/D CONTROL REGISTER 0
R/W-0
CHS5
CHS4
R/W-0
CHS3
R/W-0
CHS2
R/W-0
CHS1
R/W-0
CHS0
R/W-0
R/W-0
GO/DONE
ADON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-2
CHS: Analog Channel Select bits
000000 = GPA0
000001 = GPA1
000010 = GPA2
000011 = GPA3
000100 = GPB1
000101 = GPB2
000110 = GPB4(1)
000111 = GPB5(1)
001000 = RELEFF (see Section 3.11.6 “Relative Efficiency Ramp Measurement Control”)
001001 = Ratio of input voltage (VIN/16)
001010 = Output voltage measured after differential amplifier
001011 = VREF_REG
001100 = Error amplifier output
001101 = Average current after Sample & Hold and gain trim
001110 = ISENSE signal after gain and slope compensation signal
001111 = Average output current with +6dB gain added
010000 = Internal temperature sensor
010001 = Band gap voltage reference
010010 = VREF_REP: Center of the two VOUT floating references
010011 = Output under voltage comparator reference
010100 = Output over voltage comparator reference
010101 = Input under voltage comparator reference
010110 = Input over voltage comparator reference
010111 = Over current reference
011000 = Master’s current sense signal input (measured on Slave unit)
011001 = VBGR_REP: DAC reference voltage amplifier output
011010 = GPA3 Buffered
011011 = Internal virtual ground (~500mV)
011100 = RAWI after Sample & Hold and added gain, but before slope is added
011101 = E/A output after the clamp, input to the PWM comparator
011110 = Raw ISENSE (input to Sample & Hold)
011111 = Error Amplifier clamp reference level shifted by 500mV
•
111111 = Unimplemented
bit 1
GO/DONE: A/D Conversion Status bit
1 = A/D conversion cycle in progress. Setting this bit starts an A/D conversion cycle.
This bit is automatically cleared by hardware when the A/D conversion has completed.
0 = A/D conversion completed/not in progress
bit 0
ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1:
Not implemented on MCP19122.
DS20005750A-page 138
2017 Microchip Technology Inc.
MCP19122/3
REGISTER 19-2:
ADCON1: A/D CONTROL REGISTER 1
U-0
R/W-0
R/W-0
R/W-0
U-0
R/W-0
R/W-0
R/W-0
—
ADCS2
ADCS1
ADCS0
—
ADFM
VCFG1
VCFG0
bit 7
bit 0
Legend:
R = Readable bit
P = Programmable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
Unimplemented: Read as ‘0’
bit 6-4
ADCS: A/D Conversion Clock Select bits
000 = Reserved
001 = FOSC/8
010 = FOSC/32
x11 = FRC (clock derived from internal oscillator with a divisor of 16)
100 = Reserved
101 = FOSC/16
110 = FOSC/64
bit 3
Unimplemented: Read as ‘0’
bit 2
ADFM: A/D Result Format Select
1 = Right justified
0 = Left justified
bit 1-0
VCFG: A/D Voltage Reference bit
11 = ADREF pin
10 = ADREF pin
01 = Internal Vdd Reference
00 = Internal A/D Reference
2017 Microchip Technology Inc.
x = Bit is unknown
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REGISTER 19-3:
ADRESH: ADC RESULT REGISTER HIGH (ADRESH)
U-0
U-0
U-0
U-0
U-0
U-0
R-x
R-x
—
—
—
—
—
—
ADRES9
ADRES8
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-2
Unimplemented: Read as ‘0’
bit 1-0
Note 1:
x = Bit is unknown
ADRES: Most Significant A/D Results
Only for ADFM = 1.
REGISTER 19-4:
ADRESL: ADC RESULT REGISTER LOW (ADRESL)
R-x
R-x
R-x
R-x
R-x
R-x
R-x
R-x
ADRES7
ADRES6
ADRES5
ADRES4
ADRES3
ADRES2
ADRES1
ADRES0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
Note 1:
x = Bit is unknown
ADRES: Least Significant A/D results
Only for ADFM = 1.
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19.4
A/D Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 19-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 19-4.
EQUATION 19-1:
The maximum recommended impedance for
analog sources is 10 k. As the source impedance is
decreased, the acquisition time may be decreased.
After the analog input channel is selected (or changed),
an A/D acquisition must be done before the conversion
can be started. To calculate the minimum acquisition
time, Equation 19-1 may be used. This equation
assumes that 1/2 LSb error is used (1,024 steps for the
ADC). The 1/2 LSb error is the maximum error allowed
for the ADC to meet its specified resolution.
ACQUISITION TIME EXAMPLE
Assumptions: Temperature = +50°C and external impedance of 10 k 5.0V V
DD
T ACQ = Amplifier Settling Time + Hold Capacitor Charging Time + Temperature Coefficient
= T AMP + T C + T COFF
= 2 µs + T C + Temperature - 25°C 0.05 µs/°C
The value for TC can be approximated with the following equations:
V
1
1 – ------------------------------ = V
APPLIED
CHOLD
n+1
2
– 1
–T C
----------
RC
VAPPLIED 1 – e
= VCHOLD
–T C
----------
RC
1
VAPPLIED 1 – e
= VAPPLIED 1 – ------------------------------
n+1
2
– 1
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
Note: Where n = number of bits of the ADC.
Solving for TC:
T C = – C HOLD R IC + R SS + R S ln(1/2047)
= – 10 pF 1 k + 7 k + 10 k ln(0.0004885)
= 1.37 µs
Therefore:
T ACQ = 2 µs + 1.37µs + 50°C- 25°C 0.05µs/°C
= 4.67 µs
Note 1: The charge holding capacitor (CHOLD) is not discharged after each conversion.
2: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
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FIGURE 19-4:
ANALOG INPUT MODEL
RS
VA
VDD
Analog
Input
pin
CPIN
5 pF
Sampling
Switch
VT 0.6V
RIC 1k
VT 0.6V
ILEAKAGE(1)
SS RSS
CHOLD = 10 pF
VSS/VREF-
6V
5V
VDD 4V
3V
2V
Legend:
CHOLD = Sample/Hold Capacitance
CPIN = Input Capacitance
ILEAKAGE = Leakage current at the pin due to various junctions
RSS
5 6 7 8 91011
Sampling Switch
(k)
RIC = Interconnect Resistance
RSS = Resistance of Sampling Switch
SS = Sampling Switch
VT = Threshold Voltage
Note 1: Refer to Section 5.0 “Digital Electrical Characteristics”.
FIGURE 19-5:
ADC TRANSFER FUNCTION
Full-Scale Range
3FFh
3FEh
3FDh
ADC Output Code
3FCh
3FBh
03h
02h
01h
00h
Analog Input Voltage
0.5 LSB
VREF-
DS20005750A-page 142
Zero-Scale
Transition
1.5 LSB
Full-Scale
Transition
VREF+
2017 Microchip Technology Inc.
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TABLE 19-2:
Name
SUMMARY OF REGISTERS ASSOCIATED WITH ADC
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
ADCON0
—
CHS4
CHS3
CHS2
CHS1
CHS0
GO/DONE
ADON
138
ADCON1
—
ADCS2
ADCS1
ADCS0
—
ADFM
VCFG1
VCFG0
139
140
ADRESH
—
—
—
—
—
—
ADRES9
ADRES8
ADRESL
ADRES7
ADRES6
ADRES5
ADRES4
ADRES3
ADRES2
ADRES1
ADRES0
140
ANSELA
—
—
—
—
ANSA3
ANSA2
ANSA1
ANSA0
120
ANSELB
—
—
ANSB5
ANSB4
—
ANSB2
ANSB1
—
126
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
102
—
ADIE
BCLIE
SSPIE
—
—
TMR2IE
TMR1IE
103
105
PIE1
PIR1
—
ADIF
BCLIF
SSPIF
—
—
TMR2IF
TMR1IF
TRISGPA
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
—
TRISB2
TRISB1
TRISB0
125
Legend: — = unimplemented read as ‘0’. Shaded cells are not used for ADC module.
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NOTES:
DS20005750A-page 144
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20.0
FLASH PROGRAM MEMORY
CONTROL
The Flash program memory is readable and writable
during normal operation (full VIN range). This memory
is not directly mapped in the register file space.
Instead, it is indirectly addressed through the Special
Function Registers (see Registers 20-1 to 20-5).
There are six SFRs used to read and write this
memory:
•
•
•
•
•
•
PMCON1
PMCON2
PMDATL
PMDATH
PMADRL
PMADRH
When interfacing the program memory block, the
PMDATL and PMDATH registers form a two-byte
word, which holds the 14-bit data for read/write, and
the PMADRL and PMADRH registers form a two-byte
word, which holds the 13-bit address of the FLASH
location being accessed. These devices have 4K
words of program Flash with an address range from
0000h to 0FFFh.
The program memory allows single-word read and a
by four word write. A four-word write automatically
erases the row of the location and writes the new data
(erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range
of the device for byte or word operations.
20.1
PMADRH and PMADRL Registers
The PMADRH and PMADRL registers can address up
to a maximum of 4K words of program memory.
When selecting a program address value, the Most
Significant Byte (MSB) of the address is written to the
PMADRH register and the Least Significant Byte
(LSB) is written to the PMADRL register.
20.2
PMCON1 and PMCON2 Registers
PMCON1 is the control register for the data program
memory accesses.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental premature
termination of a write operation.
The WREN bit, when set, will allow a write operation.
On power-up, the WREN bit is clear.
The CALSEL bit allows the user to read locations in
test memory in case there are calibration bits stored in
the calibration word locations that need to be
transferred to SFR trim registers. The CALSEL bit is
only for reads, and if a write operation is attempted
with CALSEL = 1, no write will occur.
PMCON2 is not a physical register. Reading PMCON2
will read all '0's. The PMCON2 register is used
exclusively in the flash memory write sequence.
When the device is code protected, the CPU may
continue to read and write the Flash program memory.
Depending on the settings of the Flash Program
Memory Enable (WRT) bits, the device may or
may not be able to write certain blocks of the program
memory, however, reads of the program memory are
allowed.
When the Flash Program Memory Code Protection
(CP) bit is enabled, the program memory is code
protected, and the device programmer (ICSP) cannot
access data or program memory.
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20.3
Flash Program Memory
Control Registers
REGISTER 20-1:
R/W-0
PMDATL: PROGRAM MEMORY DATA LOW BYTE REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PMDATL
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
PMDATL: 8 Least Significant Data bits Read from Program Memory
REGISTER 20-2:
R/W-0
PMADRL: PROGRAM MEMORY ADDRESS LOW BYTE REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PMADRL
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
PMADRL: 8 Least Significant Address bits for Program Memory Read/Write Operation
REGISTER 20-3:
PMDATH: PROGRAM MEMORY DATA HIGH BYTE REGISTER
U-0
U-0
—
—
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
PMDATH
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-6
Unimplemented: Read as ‘0’
bit 5-0
PMDATH: 6 Most Significant Data bits Read from Program Memory
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MCP19122/3
REGISTER 20-4:
PMADRH: PROGRAM MEMORY ADDRESS HIGH BYTE REGISTER
U-0
U-0
U-0
U-0
—
—
—
—
R/W-0
R/W-0
R/W-0
R/W-0
PMADRH
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7-4
Unimplemented: Read as ‘0’
bit 3-0
PMADRH: Specifies the 4 Most Significant Address bits or High bits for Program Memory Reads.
REGISTER 20-5:
PMCON1: PROGRAM MEMORY CONTROL REGISTER 1
U-0
R/W-0
U-0
U-0
U-0
R/W-0
R/S-0
R/S-0
—
CALSEL
—
—
—
WREN
WR
RD
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
Unimplemented: Read as '0'
bit 6
CALSEL: Program Memory calibration space select bit
1 = Select test memory area for reads only, for loading calibration (excluding Configuration Word and
Device ID)
0 = Select user area for reads
bit 5-3
Unimplemented: Read as '0'
bit 2
WREN: Program Memory Write Enable bit
1 = Allows write cycles
0 = Inhibits write to the Flash Program Memory
bit 1
WR: Write Control bit
1 = Initiates a write cycle to program memory. (The bit is cleared by hardware when write is complete.
The WR bit can only be set (not cleared) in software.)
0 = Write cycle to the Flash memory is complete
bit 0
RD: Read Control bit
1 = Initiates a program memory read. (The read takes one cycle. The RD is cleared in hardware; the
RD bit can only be set (not cleared) in software).
0 = Does not initiate a Flash memory read
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20.3.1
READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must
write two bytes of the address to the PMADRL and
PMADRH registers, and then set control bit RD
(PMCON1). Once the read control bit is set, the
program memory Flash controller will use the second
instruction cycle after to read the data. This causes the
second instruction immediately following the “BSF
PMCON1,RD” instruction to be ignored. The data is
available, in the very next cycle, in the PMDATL and
PMDATH registers; it can be read as two bytes in the
following instructions. PMDATL and PMDATH registers will hold this value until another read or until it is
written to by the user (during a write operation).
EXAMPLE 20-1:
FLASH PROGRAM READ
BANKSELPM_ADR; Change STATUS bits RP1:0 to select bank with PMADR
MOVLWMS_PROG_PM_ADDR;
MOVWFPMADRH; MS Byte of Program Address to read
MOVLWLS_PROG_PM_ADDR;
MOVWFPMADRL; LS Byte of Program Address to read
BANKSELPMCON1; Bank to containing PMCON1
BSF PMCON1, RD; EE Read
NOP
; First instruction after BSF PMCON1,RD executes normally
NOP
; Any instructions here are ignored as program
; memory is read in second cycle after BSF PMCON1,RD
;
BANKSELPMDATL; Bank to containing PMADRL
MOVFPMDATL, W; W = LS Byte of Program PMDATL
MOVFPMDATH, W; W = MS Byte of Program PMDATL
FIGURE 20-1:
FLASH PROGRAM MEMORY READ CYCLE EXECUTION – NORMAL MODE
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
Flash ADDR
PC
Flash DATA
PC + 1
INSTR (PC)
PMADRH,PMADRL
INSTR (PC + 1)
PC+3
PC
+3
PMDATH,PMDATL
INSTR (PC - 1) BSF PMCON1,RD INSTR (PC + 1)
Executed here
Executed here
Executed here
PC + 4
PC + 5
INSTR (PC + 3) INSTR (PC + 4)
NOP
Executed here
INSTR (PC + 3)
Executed here
INSTR (PC + 4)
Executed here
RD bit
PMDATH
PMDATL
Register
EERHLT
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20.3.2
WRITING TO THE FLASH
PROGRAM MEMORY
A word of the Flash program memory may only be
written to if the word is in an unprotected segment of
memory, as defined in Section 11.1 “Configuration
Bits” (bits WRT1:WRT0).
Note: The write protect bits are used to protect the
users’ program from modification by the
user’s code. They have no effect when
programming is performed by ICSP. The
code-protect bits, when programmed for
code protection, will prevent the program
memory from being written via the ICSP
interface.
Flash program memory must be written in four-word
blocks. See Figures 20-2 and 20-3 for more details. A
block consists of four words with sequential addresses,
with a lower boundary defined by an address, where
PMADRL = 00. All block writes to program
memory are done as 16-word erase by four-word write
operations. The write operation is edge-aligned and
cannot occur across boundaries.
To write program data, the WREN bit must be set and
the data must first be loaded into the buffer registers
(see Figure 20-2). This is accomplished by first writing
the destination address to PMADRL and PMADRH,
and then writing the data to PMDATL and PMDATH.
After the address and data have been set, then the
following sequence of events must be executed:
1.
2.
Write 55h, then AAh, to PMCON2 (Flash
programming sequence).
Set the WR control bit of the PMCON1 register.
All four buffer register locations should be written to
with correct data. If less than four words are being written to in the block of four words, then a read from the
program memory location(s) not being written to must
be performed. This takes the data from the program
memory location(s) not being written and loads it into
the PMDATL and PMDATH registers. Then the
sequence of events to transfer data to the buffer registers must be executed.
To transfer data from the buffer registers to the program
memory, the PMADRL and PMADRH must point to the
last
location
in
the
four-word
block
(PMADRL = 11). Then the following sequence of
events must be executed:
1.
2.
The user must follow the same specific sequence to
initiate the write for each word in the program block,
writing each program word in sequence (000, 001,
010, 011). When the write is performed on the last
word (PMADRL = 11), a block of 16 words is
automatically erased and the content of the four-word
buffer registers are written into the program memory.
After the “BSF PMCON1,WR” instruction, the processor
requires two cycles to set up the erase/write operation.
The user must place two NOP instructions after the WR
bit is set. Since data is being written to buffer registers,
the writing of the first three words of the block appears
to occur immediately. The processor will halt internal
operation for the typical 2ms to write to the memory
only when the PMADRL = xx11. The halt time
will be 4ms typical if the part is also erasing which only
occurs if the PMADRL = 0011.
Refer to Figure 20-2 for a block diagram of the buffer
registers and the control signals for test mode.
20.3.3
PROTECTION AGAINST SPURIOUS
WRITE
There are conditions when the device should not write
to the program memory. To protect against spurious
writes, various mechanisms have been built in. On
power-up, WREN is cleared. Also, the Power-up Timer
(72 ms duration) prevents program memory writes.
The write initiate sequence, and the WREN bit, help
prevent an accidental write during a power glitch or
software malfunction.
20.3.4
OPERATION DURING CODE PROTECT
When the device is code protected, the CPU is able to
read and write unscrambled data to the program
memory. The test mode access is disabled.
20.3.5
OPERATION DURING WRITE PROTECT
When the program memory is write protected, the
CPU can read and execute from the program memory.
The portions of program memory that are write protected can not be modified by the CPU using the
PMCON registers. The write protection has no effect in
ICSP mode.
Write 55h, then AAh, to PMCON2 (Flash
programming sequence).
Set control bit WR of the PMCON1 register to
begin the write operation.
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FIGURE 20-2:
BLOCK WRITES TO 4K FLASH PROGRAM MEMORY
7
6
8
If at new row
sixteen words of
Flash are erased,
then four buffers
are transferred to
Flash
automatically after
this word is written
14
14
14
5
0
07
PMDATH
PMDATL
First word of block
to be written
14
PMADRL = 00
PMADRL = 01
Buffer Register
PMADRL = 10
Buffer Register
PMADRL = 11
Buffer Register
Buffer Register
Program Memory
FIGURE 20-3:
FLASH PROGRAM MEMORY LONG WRITE CYCLE EXECUTION
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1
Flash
ADDR
PMADRH,PMADRL
PC + 1
INSTR
(PC)
Flash
DATA
Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
INSTR
(PC + 1)
ignored
read
BSF PMCON1,WR INSTR (PC + 1)
Executed here
Executed here
PMDATH,PMDATL
Processor halted
EE Write Time
PC + 2
PC + 3
PC + 4
INSTR (PC+2) INSTR (PC+3)
(INSTR (PC + 2)
NOP
INSTR (PC + 3)
NOP
Executed here Executed here Executed here
Flash
Memory
Location
WR bit
PMWHLT
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21.0
TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
•
•
•
•
•
8-bit timer/counter register (TMR0)
8-bit prescaler (shared with Watchdog Timer)
Programmable internal or external clock source
Programmable external clock edge selection
Interrupt on overflow
Figure 21-1 is a block diagram of the Timer0 module.
FIGURE 21-1:
BLOCK DIAGRAM OF THE TIMER0
FOSC/4
Data Bus
0
8
T0CKI
1
1
Sync
2 TCY
TMR0
0
TMR0SE TMR0CS
8-bit
Prescaler
PSA
Set Flag bit TMR0IF
on Overflow
Overflow to Timer1
8
PS
21.1
Timer0 Operation
The Timer0 module can be used as either an 8-bit timer
or an 8-bit counter.
21.1.1
8-BIT TIMER MODE
The Timer0 module will increment every instruction
cycle, if used without a prescaler. 8-Bit Timer mode is
selected by clearing the T0CS bit of the OPTION_REG
register.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
Note:
21.1.2
The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
8-BIT COUNTER MODE
21.1.3
SOFTWARE PROGRAMMABLE
PRESCALER
A single software programmable prescaler is available for use with either Timer0 or the Watchdog
Timer (WDT), but not both simultaneously. The prescaler assignment is controlled by the PSA bit of the
OPTION_REG register. To assign the prescaler to
Timer0, the PSA bit must be cleared to ‘0’.
There are 8 prescaler options for the Timer0 module
ranging from 1:2 to 1:256. The prescale values are
selectable via the PS bits of the OPTION_REG
register. In order to have a 1:1 prescaler value for the
Timer0 module, the prescaler must be disabled by
setting the PSA bit of the OPTION_REG register.
The prescaler is not readable or writable. When
assigned to the Timer0 module, all instructions writing to
the TMR0 register will clear the prescaler.
In 8-Bit Counter mode, the Timer0 module will increment
on every rising or falling edge of the T0CKI pin. The
incrementing edge is determined by the T0SE bit of the
OPTION_REG register.
8-Bit Counter mode using the T0CKI pin is selected by
setting the T0CS bit in the OPTION_REG register to ‘1’.
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21.1.4
21.1.5
SWITCHING PRESCALER
BETWEEN TIMER0 AND WDT
MODULES
The prescaler is shared between the Timer0 and the
WDT. As a result of having the prescaler assigned to
either Timer0 or the WDT, it is possible to generate an
unintended device Reset when switching prescaler
values. When changing the prescaler assignment from
Timer0 to the WDT module, the instruction sequence
shown in Example 21-1 must be executed.
EXAMPLE 21-1:
CHANGING PRESCALER
(TIMER0 WDT)
BANKSELTMR0
CLRWDT
CLRFTMR0
;
;Clear WDT
;Clear TMR0 and
;prescaler
BANKSELOPTION_REG;
BSF OPTION_REG,PSA;Select WDT
CLRWDT
;
;
MOVLWb’11111000’;Mask prescaler
ANDWFOPTION_REG,W;bits
IORLWb’00000101’;Set WDT prescaler
MOVWFOPTION_REG;to 1:32
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The T0IF interrupt
flag bit of the INTCON register is set every time the
TMR0 register overflows, regardless of whether or not
the Timer0 interrupt is enabled. The T0IF bit can only
be cleared in software. The Timer0 interrupt enable is
the T0IE bit of the INTCON register.
Note:
21.1.6
The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
USING TIMER0 WITH AN
EXTERNAL CLOCK
When Timer0 is in Counter mode, the synchronization
of the T0CKI input and the Timer0 register is
accomplished by sampling the prescaler output on the
Q2 and Q4 cycles of the internal phase clocks.
Therefore, the high and low periods of the external
clock source must meet the timing requirements as
shown
in
Section 5.0
“Digital
Electrical
Characteristics”.
21.1.7
When changing the prescaler assignment from the
WDT to the Timer0 module, the following instruction
sequence must be executed (see Example 21-2).
EXAMPLE 21-2:
TIMER0 INTERRUPT
OPERATION DURING SLEEP
Timer0 cannot operate while the processor is in Sleep
mode. The contents of the TMR0 register will remain
unchanged while the processor is in Sleep mode.
CHANGING PRESCALER
(WDT TIMER0)
CLRWDT
;Clear WDT and
;prescaler
BANKSEL OPTION_REG
;
MOVLW
b’11110000’ ;Mask TMR0 select and
ANDWF
OPTION_REG,W ;prescaler bits
IORLW
b’00000011’ ;Set prescale to 1:16
MOVWF
OPTION_REG
;
TABLE 21-1:
Name
INTCON
OPTION_REG
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
GIE
PEIE
T0IE
INTE
IOCIE
T0IF
INTF
IOCIF
102
RAUP
INTEDG
T0CS
T0SE
PSA
PS2
PS1
PS0
TMR0
TRISGPA
Timer0 Module Register
TRISA7
TRISA6
TRISA5
TRISA4
TRISA3
83
151*
TRISA2
TRISA1
TRISA0
119
Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by the Timer0 module.
* Page provides register information.
DS20005750A-page 152
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MCP19122/3
22.0
•
•
•
•
•
•
•
•
TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer with the following
features:
•
•
•
•
•
16-bit timer/counter register pair (TMR1H:TMR1L)
Two selectable internal clock sources
2-bit prescaler
Synchronous or asynchronous operation
Multiple Timer1 gate (count enable) sources
FIGURE 22-1:
Interrupt on overflow
Time base for the Capture/Compare function
Special Event Trigger (with CCD)
Selectable Gate Source Polarity
Gate Toggle mode
Gate Single-pulse mode
Gate Value Status
Gate Event Interrupt
Figure 22-1 is a block diagram of the Timer1 module.
TIMER1 BLOCK DIAGRAM
T1GSS
T1G1
From Timer0
Overflow
T1G2
Output of UV
Comparator
T1GSPM
00
0
T1G_IN
01
0
Single Pulse
Acq. Control
10
D
Q
CK
R
Q
11
1
1
Q1
D
Q
EN
Interrupt
T1GGO/DONE
det
T1GPOL
TMR1ON
T1GTM
Data Bus
RD
T1GCON
TMR1GIF
TMR1GE
TMR1ON
TMR1(1)
Set flag bit
TMR1IF on
Overflow
T1GVAL
TMR1H
TMR1L
R
CCD Special Event Trigger
EN
Q
D
T1CLK
TMR1CS
FOSC
Internal
Clock
1
FOSC/4
Internal
Clock
0
Prescaler
1, 2, 4, 8
2
T1CKPS
Note 1:Timer1 register increments on rising edge.
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22.1
Timer1 Operation
22.2
The Timer1 module is a 16-bit incrementing timer,
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
timer. The module is a timer and increments on every
instruction cycle.
Timer1 is enabled by configuring the TMR1ON and
TMR1GE bits in the T1CON and T1GCON registers,
respectively. Table 22-1 displays the Timer1 enable
selections.
TABLE 22-1:
TIMER1 ENABLE
SELECTIONS
The TMR1CS bit of the T1CON register is used to select
the clock source for Timer1. Table 22-2 displays the
clock source selections.
TABLE 22-2:
TMR1CS
22.2.1
Timer1
Operation
TMR1ON
TMR1GE
0
0
Off
0
1
Off
1
0
Always On
1
1
Externally
Enabled
Clock Source Selection
CLOCK SOURCE
SELECTIONS
Clock Source
1
8 MHz System Clock (FOSC)
0
2 MHz Instruction Clock (FOSC/4)
INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of FOSC or FOSC/4 as determined by the Timer1
prescaler.
As an example, when the FOSC internal claok source is
selected, the TIMER1 register value will increment by
four counts every instruction clock cycle.
Note:
In Counter mode, a falling edge must be
registered by the counter prior to the first
incrementing rising edge (see Figure 22-2)
after any one or more of the following
conditions:
• Timer1 enabled after POR Reset
• Write to TMR1H or TMR1L
• Timer1 is disabled
• Timer1 is disabled (TMR1ON = 0)
when T1CKI is high then Timer1 is
enabled (TMR1ON=1) when T1CKI is
low.
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22.3
Timer1 Prescaler
TABLE 22-4:
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
22.4
Timer1 Gate
Timer1 can be configured to increment freely or the
incrementing can be enabled and disabled using
Timer1 gate circuitry. This is also referred to as Timer1
gate increment enable.
Timer1 gate can also be driven by multiple selectable
sources.
22.4.1
TIMER1 GATE INCREMENT
ENABLE
The Timer1 gate is enabled by setting the TMR1GE bit
of the T1GCON register. The polarity of the Timer1 gate
is configured using the T1GPOL bit of the T1GCON
register.
When Timer1 Gate (T1Gx) input is active, Timer1 will
increment on the rising edge of the Timer1 clock
source. When Timer1 gate input is inactive, no
incrementing will occur and Timer1 will hold the current
count. See Figure 22-3 for timing details.
TABLE 22-3:
TIMER1 GATE ENABLE
SELECTIONS
T1CLK
T1GPOL
T1Gx
0
0
Increments
0
1
Holds Count
1
0
Holds Count
1
1
Increments
22.4.2
Timer1 Operation
TIMER1 GATE SOURCE
SELECTION
The Timer1 gate source can be selected from one of
three different sources. Source selection is controlled
by the T1GSS bits of the T1GCON register. The polarity for each available source is also selectable. Polarity
selection is controlled by the T1GPOL bit of the
T1GCON register.
T1GSS
TIMER1 GATE SOURCES
Timer1 Gate Source
11
Output of UV Comparator
10
Timer1 Gate Pin T1G2
01
Overflow of Timer0
(TMR0 increments from FFh to 00h)
00
Timer1 Gate Pin T1G1
22.4.2.1
T1G1 Pin Gate Operation
The GPBA3/T1G1 pin is one source for Timer1 gate
control. It can be used to supply an external source to
the Timer1 gate circuitry.
22.4.2.2
Timer0 Overflow Gate Operation
When Timer0 increments from FFh to 00h, a low-tohigh pulse will automatically be generated and
internally supplied to the Timer1 gate circuitry.
22.4.2.3
T1G2 Pin Gate Operation
The GPB2/T1G2 pin is one source for the Timer1 gate
control. It can be used to supply an external source to
the Timer1 gate circuitry.
22.4.2.4 UV Comparator Output
The output of the output under voltage comparator is
one source for the Timer1 gate control. A low-to-high
transition of the comparator output shall stop TIMER1.
22.4.3
TIMER1 GATE TOGGLE MODE
When Timer1 Gate Toggle mode is enabled, it is
possible to measure the full-cycle length of a Timer1
gate signal, as opposed to the duration of a single level
pulse.
The Timer1 gate source is routed through a flip-flop that
changes state on every incrementing edge of the signal. See Figure 22-4 for timing details.
Timer1 Gate Toggle mode is enabled by setting the
T1GTM bit of the T1GCON register. When the T1GTM
bit is cleared, the flip-flop is cleared and held clear. This
is necessary in order to control which edge is
measured.
Note:
22.4.4
Enabling Toggle mode at the same time
as changing the gate polarity may result in
indeterminate operation.
TIMER1 GATE SINGLE-PULSE
MODE
When Timer1 Gate Single-Pulse mode is enabled, it is
possible to capture a single pulse gate event. Timer1
Gate Single-Pulse mode is first enabled by setting the
T1GSPM bit in the T1GCON register. Next, the
T1GGO/DONE bit in the T1GCON register must be set.
The Timer1 will be fully enabled on the next
incrementing edge. On the next trailing edge of the
2017 Microchip Technology Inc.
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pulse, the T1GGO/DONE bit will automatically be
cleared. No other gate events will be allowed to
increment Timer1 until the T1GGO/DONE bit is once
again set in software.
In Compare mode, an event is triggered when the value
CCxRH:CCxRL register pair matches the value in the
TMR1H:TMR1L register pair. This event can be a Special Event Trigger.
Clearing the T1GSPM bit of the T1GCON register will
also clear the T1GGO/DONE bit. See Figure 22-5 for
timing details.
For more information, see Section 24.0, Dual Capture/
Compare (CCD) Module.
Enabling the Toggle mode and the Single-Pulse mode
simultaneously will permit both sections to work
together. This allows the cycle times on the Timer1 gate
source to be measured. See Figure 22-6 for timing
details.
22.7
22.4.5
TIMER1 GATE VALUE STATUS
When Timer1 gate value status is utilized, it is possible
to read the most current level of the gate control value.
The value is stored in the T1GVAL bit in the T1GCON
register. The T1GVAL bit is valid even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
22.4.6
TIMER1 GATE EVENT INTERRUPT
When Timer1 gate event interrupt is enabled, it is
possible to generate an interrupt upon the completion
of a gate event. When the falling edge of T1GVAL
occurs, the TMR1GIF flag bit in the PIR1 register will be
set. If the TMR1GIE bit in the PIE1 register is set, then
an interrupt will be recognized.
CCD Special Event Trigger
When the CCD is configured to trigger a special event,
the trigger will clear the TMR1H:TMR1L register pair.
This special event does not cause a Timer1 interrupt.
The CCD module may still be configured to generate a
CCD interrupt.
In this mode of operation, the CCxRH:CCxRL register
pair becomes the period register for Timer1.
Timer1 should be clocked by FOSC/4 to utilize the Special Event Trigger.
In the event that a write to TMR1H or TMR1L coincides
with a Special Event Trigger from the CCD, the write
will take precedence.
For more information, see Section 24.2.3, Special
Event Trigger.
The TMR1GIF flag bit operates even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
22.5
Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
•
•
•
•
TMR1ON bit of the T1CON register
TMR1IE bit of the PIE1 register
PEIE bit of the INTCON register
GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
Note:
22.6
The TMR1H:TMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
CCD Capture/Compare Time Base
The CCD module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCxRH:CCxRL register
pair on a configured event.
DS20005750A-page 156
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MCP19122/3
FIGURE 22-2:
TIMER1 INCREMENTING EDGE
T1CLK
T1CLK
TMR1 enabled
Note 1: Arrows indicate counter increments.
FIGURE 22-3:
TIMER1 GATE COUNT ENABLE MODE
TMR1GE
T1GPOL
T1G_IN
T1CLK
T1GVAL
TIMER1
N
2017 Microchip Technology Inc.
N+1
N+2
N+3
N+4
DS20005750A-page 157
MCP19122/3
FIGURE 22-4:
TIMER1 GATE TOGGLE MODE
TMR1GE
T1GPOL
T1GTM
T1G_IN
T1CLK
T1GVAL
TIMER1
N
FIGURE 22-5:
N+1 N+2 N+3
N+4
N+5 N+6 N+7
N+8
TIMER1 GATE SINGLE-PULSE MODE
TMR1GE
T1GPOL
T1GSPM
T1GGO/
Cleared by hardware on
falling edge of T1GVAL
Set by software
DONE
Counting enabled on
rising edge of T1G
T1G_IN
T1CLK
T1GVAL
TIMER1
TMR1GIF
DS20005750A-page 158
N
Cleared by software
N+1
N+2
Set by hardware on
falling edge of T1GVAL
Cleared by
software
2017 Microchip Technology Inc.
MCP19122/3
FIGURE 22-6:
TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE
TMR1GE
T1GPOL
T1GSPM
T1GTM
T1GGO/
Cleared by hardware on
falling edge of T1GVAL
Set by software
DONE
Counting enabled on
rising edge of T1G
T1G_IN
T1CLK
T1GVAL
TIMER1
TMR1GIF
N
Cleared by software
2017 Microchip Technology Inc.
N+1
N+2
N+3
Set by hardware on
falling edge of T1GVAL
N+4
Cleared by
software
DS20005750A-page 159
MCP19122/3
22.8
Timer1 Control Registers
REGISTER 22-1:
T1CON: TIMER1 CONTROL REGISTER
U-0
U-0
—
—
R/W-0
R/W-0
T1CKPS
U-0
U-0
R/W-0
R/W-0
—
—
TMR1CS
TMR1ON
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
Unimplemented: Read as ‘0’
bit 5-4
T1CKPS: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3-2
Unimplemented: Read as ‘0’
bit 1
TMR1CS: Timer1 Clock Source Select bits
1 = Timer1 clock source is 8 MHz system clock (FOSC)
0 = Timer1 clock source is 2 MHz instruction clock (FOSC/4)
bit 0
TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1
Clears Timer1 gate flip-flop
DS20005750A-page 160
x = Bit is unknown
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MCP19122/3
REGISTER 22-2:
T1GCON: TIMER1 GATE CONTROL REGISTER
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R-x
TMR1GE
T1GPOL
T1GTM
T1GSPM
T1GGO/
DONE
T1GVAL
R/W-0
R/W-0
T1GSS
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
x = Bit is unknown
bit 7
TMR1GE: Timer1 Gate Enable bit
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 incrementing is controlled by the Timer1 gate function
0 = Timer1 increments regardless of Timer1 gate function
bit 6
T1GPOL: Timer1 Gate Polarity bit
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 5
T1GTM: Timer1 Gate Toggle mode bit
1 = Timer1 Gate Toggle mode is enabled.
0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared
Timer1 gate flip-flop toggles on every rising edge.
bit 4
T1GSPM: Timer1 Gate Single Pulse mode bit
1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate
0 = Timer1 Gate Single-Pulse mode is disabled
bit 3
T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit
1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge
0 = Timer1 gate single-pulse acquisition has completed or has not been started
This bit is automatically cleared when T1GSPM is cleared.
bit 2
T1GVAL: Timer1 Gate Current State bit
Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L.
Unaffected by Timer1 Gate Enable (TMR1GE).
bit 1-0
T1GSS: Timer1 Gate Source Select bits
11 = UV Comparator Output
10 = Timer1 gate pin T1G2
01 = Timer0 overflow output
00 = Timer1 gate pin T1G1
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NOTES:
DS20005750A-page 162
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MCP19122/3
23.0
TIMER2 MODULE
The Timer2 module is an 8-bit timer with the following
features:
•
•
•
•
8-bit timer register (TMR2)
8-bit period register (PR2)
Interrupt on TMR2 match with PR2
Software programmable prescaler (1:1, 1:4, 1:16)
See Figure 23-1 for a block diagram of Timer2.
23.1
Timer2 Operation
The clock input to the Timer2 module is the system
clock (FOSC). The clock is fed into the Timer2 prescaler,
which has prescale options of 1:1, 1:4 or 1:16. The
output of the prescaler is then used to increment the
TMR2 register.
The values of TMR2 and PR2 are constantly compared
to determine when they match. TMR2 will increment
from 00h until it matches the value in PR2. When a
match occurs, TMR2 is reset to 00h on the next
increment cycle.
FIGURE 23-1:
The match output of the Timer2/PR2 comparator is
used to set the TMR2IF interrupt flag bit in the PIR1
register.
The TMR2 and PR2 registers are both fully readable
and writable. On any Reset, the TMR2 register is set to
00h and the PR2 register is set to FFh.
Timer2 is turned on by setting the TMR2ON bit in the
T2CON register to a ‘1’. Timer2 is turned off by clearing
the TMR2ON bit to a ‘0’.
The Timer2 prescaler is controlled by the T2CKPS bits
in the T2CON register. The prescaler counter are
cleared when:
• A write to TMR2 occurs.
• A write to T2CON occurs.
• Any device Reset occurs (Power-on Reset, MCLR
Reset, Watchdog Timer Reset, or Brown-out
Reset).
Note:
TMR2 is not cleared when T2CON is
written.
TIMER2 BLOCK DIAGRAM
TMR2
Output
FOSC
Prescaler
1:1, 1:4, 1:8, 1:16
2
TMR2
Comparator
Sets Flag
bit TMR2IF
Reset
EQ
T2CKPS
PR2
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23.2
Timer2 Control Register
REGISTER 23-1:
T2CON: TIMER2 CONTROL REGISTER
U-0
U-0
U-0
U-0
U-0
R/W-0
R/W-0
R/W-0
—
—
—
—
—
TMR2ON
T2CKPS1
T2CKPS0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-3
Unimplemented: Read as ‘0’
bit 2
TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0
T2CKPS: Timer2 Clock Prescale Select bits
00 = Prescaler is 1
01 = Prescaler is 4
10 = Prescaler is 8
11 = Prescaler is 16
TABLE 23-1:
x = Bit is unknown
SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Register
on Page
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
102
PIE1
—
ADIE
BCLIE
SSPIE
—
—
TMR2IE
TMR1IE
103
PIR1
—
ADIF
BCLIF
SSPIF
—
—
TMR2IF
TMR1IF
105
—
—
—
PR2
T2CON
Timer2 Module Period Register
TMR2
—
—
163*
TMR2ON T2CKPS1 T2CKPS0
Holding Register for the 8-bit TMR2 Time Base
164
163*
Legend: — = unimplemented read as ‘0’. Shaded cells are not used for Timer2 module.
* Page provides register information.
DS20005750A-page 164
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MCP19122/3
24.0
DUAL CAPTURE/COMPARE
(CCD) MODULE
The Dual Capture/Compare module is a peripheral
that allows the user to time and control different
events. In Capture mode, the peripheral allows the
timing of the duration of an event. The Compare mode
allows the user to trigger an external event when a
predetermined amount of time has expired. This module is only available in the MCP19123 device.
24.1
Every falling edge
Every rising edge
Every 4th rising edge
Every 16th rising edge
When a capture is made, the Interrupt Request Flag bit
CCDxIF of the PIR2 register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCxRH:CCxRL register pair is
read, the old captured value is overwritten by the new
captured value.
Figure 24-1 shows a simplified diagram of the Capture
operation.
24.1.1
CCDX PIN CONFIGURATION
In Capture mode, the CCDx pin should be configured
as an input by setting the associated TRIS control bit.
Note:
SOFTWARE INTERRUPT MODE
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCDxIE interrupt enable bit of the PIE2 register clear to
avoid false interrupts. Additionally, the user should
clear the CCDxIF interrupt flag bit of the PIR2 register
following any change in Operating mode.
Note:
Capture Mode
Capture mode makes use of the 16-bit Timer1
resource. When an event occurs on the CCDx pin, the
16-bit CCxRH:CCxRL register pair captures and stores
the 16-bit value of the TMR1H:TMR1L register pair,
respectively. An event is defined as one of the following
and is configured by the CCxM bits of the
CCDCON register:
•
•
•
•
24.1.2
24.1.3
Clocking Timer1 from the system clock
(FOSC) should not be used in Capture
mode. In order for Capture mode to
recognize the trigger event on the CCDx
pin, Timer1 must be clocked from the
instruction clock (FOSC/4).
CCP1 PRESCALER
There are four prescaler settings specified by the
CCxM bits of the CCDCON register. Whenever
the CCDx module is turned off, or the CCDx module is
not in Capture mode, the prescaler counter is cleared.
Any Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCDCON register before changing the
prescaler. Example 24-1 demonstrates the code to
perform this function.
EXAMPLE 24-1:
CHANGING BETWEEN
CAPTURE PRESCALERS
BANKSEL CCDCON
CLRF
MOVLW
MOVWF
;Set Bank bits to point
;to CCDCON
CCDCON
;Turn CCDx module off
NEW_CAPT_PS ;Load the W reg with
;the new prescaler
;move value and CCDx ON
CCDCON
;Load CCDCON with this
;value
If the CCDx pin is configured as an output,
a write to the port can cause a capture
condition.
FIGURE 24-1:
Prescaler
1, 4, 16
CAPTURE MODE
OPERATION BLOCK
DIAGRAM
Set Flag bit CCDxIF
(PIR2 register)
CCDx
pin
CCxRH
and
Edge Detect
CCxRL
Capture
Enable
TMR1H
TMR1L
CCxM
System Clock (FOSC)
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24.2
Compare Mode
Compare mode makes use of the 16-bit Timer1
resource. The 16-bit value of the CCxRH:CCxRL
register pair is constantly compared against the 16-bit
value of the TMR1H:TMR1L register pair. When a
match occurs, one of the following events can occur:
•
•
•
•
•
Toggle the CCDx output
Set the CCDx output
Clear the CCDx output
Generate a Special Event Trigger
Generate a Software Interrupt
The Special Event Trigger output of the CCDx occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCxRH, CCxRL register
pair. The TMR1H, TMR1L register pair is not reset until
the next rising edge of the Timer1 clock. The Special
Event Trigger output starts an A/D conversion (if the A/
D module is enabled). This allows the CCxRH, CCxRL
register pair to effectively provide a 16-bit programmable period register for Timer1.
TABLE 24-1:
The action on the pin is based on the value of the
CCXM control bits of the CCDCON register. At
the same time, the interrupt flag CCDxIF bit is set.
All Compare modes can generate an interrupt.
Figure 24-2 shows a simplified diagram of the
Compare operation.
FIGURE 24-2:
The CCD module does not assert control of the CCDx
pin in this mode.
COMPARE MODE
OPERATION BLOCK
DIAGRAM
CCxM
Mode Select
SPECIAL EVENT TRIGGER
Device
MCP19123
CCD1/CCD2
CCD1/CCD2
Refer to A/D Section for more information.
Note 1: The Special Event Trigger from the CCD
module does not set interrupt flag bit
TMR1IF of the PIR1 register.
24.2.4
COMPARE DURING SLEEP
The Compare mode is dependent upon the system
clock (FOSC) for proper operation. Since FOSC is shut
down during Sleep mode, the Compare mode will not
function properly during Sleep.
Set CCDxIF Interrupt Flag
(PIR2)
4
CCxRH CCxRL
CCDx
Pin
Q
S
R
Output
Logic
Match
TRIS
Output Enable
Comparator
TMR1H
TMR1L
Special Event Trigger
24.2.1
CCDX PIN CONFIGURATION
The user must configure the CCDx pin as an output by
clearing the associated TRIS bit.
Note:
24.2.2
Clearing the CCDCON register will force
the CCDx compare output latch to the
default low level. This is not the PORT I/O
data latch.
SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCxM = 1010), the CCD module does not
assert control of the CCDx pin (see the CCP1CON
register).
24.2.3
SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCxM = 1011), the CCD module does the
following:
• Starts an ADC conversion if ADC is enabled
DS20005750A-page 166
2017 Microchip Technology Inc.
MCP19122/3
24.3
CCP Control Registers
REGISTER 24-1:
CCDCON: DUAL CAPTURE/COMPARE CONTROL REGISTER
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
CC2M3
CC2M2
CC2M1
CC2M0
CC1M3
CC1M2
CC1M1
CC1M0
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Reset
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-4
CC2M: Capture/Compare Register Set 2 Mode Select bits
00xx = Capture/Compare off (resets module)
0100 = Capture mode: every falling edge
0101 = Capture mode: every rising edge
0110 = Capture mode: every 4th rising edge
0111 = Capture mode: every 16th rising edge
1000 = Compare mode: set output on match (CC2IF bit is set)
1001 = Compare mode: clear output on match (CC2IF bit is set)
1010 = Compare mode: toggle output on match (CC2IF bit is set)
1011 = Reserved
11xx = Compare mode: generate software interrupt on match (CC2IF bit is set, CMP2 pin is unaffected and configured as an I/O port)
1111 = Compare mode: trigger special event (CC2IF bit is set; CCD2 does not rest TMR1 and starts
an A/D conversion, if the A/D module is enabled. CMP2 pin is unaffected and configured as
an I/O port).
bit 3-0
CC1M: Capture/Compare Register Set 1 Mode Select bits
00xx = Capture/Compare off (resets module)
0100 = Capture mode: every falling edge
0101 = Capture mode: every rising edge
0110 = Capture mode: every 4th rising edge
0111 = Capture mode: every 16th rising edge
1000 = Compare mode: set output on match (CC1IF bit is set)
1001 = Compare mode: clear output on match (CC1IF bit is set)
1010 = Compare mode: toggle output on match (CC1IF bit is set)
1011 = Reserved
11xx = Compare mode: generate software interrupt on match (CC1IF bit is set, CMP1 pin is unaffected and configured as an I/O port)
1111 = Compare mode: trigger special event (CC1IF bit is set; CCD1 does not rest TMR1 and starts
an A/D conversion, if the A/D module is enabled. CMP1 pin is unaffected and configured as
an I/O port).
Note: When a Compare interrupt is set, the TMR1 is not rest. This is different than standard Microchip microcontroller operation.
2017 Microchip Technology Inc.
DS20005750A-page 167
MCP19122/3
NOTES:
DS20005750A-page 168
2017 Microchip Technology Inc.
MCP19122/3
25.0
INTERNAL TEMPERATURE
INDICATOR MODULE
The MCP19122/3 is equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit's range of the operating
temperature falls between –40°C and +125°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
25.1
Temperature Output
The output of the circuit is measured using the internal
analog-to-digital converter. Channel 10 is reserved for
the temperature circuit output. Refer to Section 19.0
“Analog-to-Digital Converter (ADC) Module” for
detailed information.
The temperature of the silicon die can be calculated by
the ADC measurement by using Equation 25-1.
EQUATION 25-1:
FIGURE 25-1:
TEMPERATURE CIRCUIT
DIAGRAM
VDD
SILICON DIE
TEMPERATURE
ADC READING – 305
TEMP_DIE = --------------------------------------------------------3.08mV/ C
The 10-bit ADC value located at memory address
2089h can be used to obtain a more accurate reading
of the silicon die. This factory stored ADC value is
obtained by measuring the silicon die temperature with
an ambient temperature of 25C (+/-5C). Equation 252 shows how to use this stored value.
VOUT
ADC
MUX
n
CHS bits
(ADCON0 register)
2017 Microchip Technology Inc.
ADC
EQUATION 25-2:
USING CALWD 10 TO
OBTAIN SILICON DIE
TEMPERATURE
ADC_READING(counts) – ADC25 C_READING (counts
TEMP_DIE( C = -----------------------------------------------------------------------------------------------------------------------------------------------+ 25 C
·
3(counts/ C
DS20005750A-page 169
MCP19122/3
DS20005750A-page 170
2017 Microchip Technology Inc.
MCP19122/3
26.0
ENHANCED PWM MODULE
The PWM module implemented on the MCP19122/3 is
a modified version of the Capture/Compare/PWM
(CCP) module found in standard mid-range
microcontrollers. The module only features the PWM
module, which is slightly modified from standard midrange microcontrollers. In the MCP19122/3, the PWM
module is used to generate the system clock or
system oscillator. This system clock will control the
MCP19122/3 switching frequency, as well as set the
maximum allowable duty cycle. The PWM module
does not continuously adjust the duty cycle to control
the output voltage. This is accomplished by the analog
control loop and associated circuitry.
26.1
Standard Pulse-Width Modulation
(PWM) Mode
The PWM module output signal is used to set the
operating switching frequency and maximum
allowable duty cycle of the MCP19122/3. The actual
duty cycle on the HDRV and LDRV is controlled by the
analog PWM control loop. However, this duty cycle
cannot be greater than the value in the PWMRL
register.
There are two modes of operation that concern the
system clock PWM signal. These modes are
stand-alone (non-frequency synchronization) and
frequency synchronization.
26.1.1
STAND-ALONE (NON-FREQUENCY
SYNCHRONIZATION) MODE
26.1.2
SWITCHING FREQUENCY
SYNCHRONIZATION MODE
The MCP19122/3 can be programmed to be a switching frequency MASTER or SLAVE device. The MASTER device functions as described in Section 26.1.1
“Stand-Alone (Non-Frequency Synchronization)
Mode” with the exception of the 8 MHz system clock
also being applied to GPB3 and the synchronization
signal applied to GPA1.
A SLAVE device will receive the MASTER 8 MHz system clock on GPB3 and synchronization signal on
GPA1. The synchronization signal will be ORed with
the output of the TIMER2 module. This ORed signal
will latch PWMRL into PWMRH and PWMPHL into
PWMPHH.
Figure 26-1 shows a simplified block diagram of the
CCP module in PWM mode.
The PWMPHL register allows for a phase shift to be
added to the SLAVE system clock.
It is desired to have the MCP19122/3 SLAVE devices
system clock start point shifted by a programmed
amount from the MASTER system clock. This SLAVE
phase shift is specified by writing to the PWMPHL register. The SLAVE phase shift can be calculated by
using the following equation.
EQUATION 26-2:
SLAVE PHASE SHIFT=PWMPHL•TOSC•(T2 PRESCALE VALUE)
When the MCP19122/3 is running stand-alone, the
PWM signal functions as the system clock. It is
operating at the programmed switching frequency with
a programmed maximum duty cycle (DCLOCK). The
programmed maximum duty cycle is not adjusted on a
cycle-by-cycle basis to control the MCP19122/3
system output. The required duty cycle (DBUCK) to
control the output is adjusted by the MCP19122/3
analog control loop and associated circuitry. DCLOCK
does, however, set the maximum allowable DBUCK.
EQUATION 26-1:
D BUCK 1 – D CLOCK
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DS20005750A-page 171
MCP19122/3
FIGURE 26-1:
SIMPLIFIED PWM BLOCK DIAGRAM
PWMRL
PWMPHL
8
8
PWMPHH
(SLAVE)
PWMRH
(SLAVE)
LATCH DATA
LATCH DATA
8
8
Comparator
Comparator
8
8
Q
SYSTEM
CLOCK
RESET TIMER
Comparator
8
8
PWMPHH + (PR2+1)/2
Shift Right
1 bit
PWM OUTPUT
CLKPIN_IN
PR2 + 1
8
A PWM output (Figure 26-2) has a time base
(period) and a time that the output stays high (duty
cycle). The frequency of the PWM is the inverse of
the period (1/period).
FIGURE 26-2:
S
OSC
8
Comparator
8
Q
8
TMR2
(Note 1)
50% Period
R
NOTE 1: TIMER 2 should be clocked by FOSC (8MHz)
26.1.3
PWM PERIOD
The PWM period is specified by writing to the PR2
register. The PWM period can be calculated using the
following equation:
EQUATION 26-3:
Period
PWM PERIOD=[(PR2)+1] x TOSC x (T2 PRESCALE VALUE)
Duty Cycle
TMR2 = PR2 + 1
TMR2 = PWMRH
TMR2 = PR2 + 1
DS20005750A-page 172
When TMR2 is equal to PR2, the following two events
occur on the next increment cycle:
• TMR2 is cleared
• The PWM duty cycle is latched from PWMRL into
PWMRH
2017 Microchip Technology Inc.
MCP19122/3
26.1.4
PWM DUTY CYCLE (DCLOCK)
26.2
The PWM duty cycle (DCLOCK) is specified by writing
to the PWMRL register. Up to 8-bit resolution is
available. The following equation is used to calculate
the PWM duty cycle (DCLOCK):
Operation during Sleep
When the device is placed in Sleep, the allocated
timer will not increment and the state of the module will
not change. If the CLKPIN pin is driving a value, it will
continue to drive that value. When the device wakes
up, it will continue from this state.
EQUATION 26-4:
PWM DUTY CYCLE=PWMRL x TOSC x (T2 PRESCALE VALUE)
The PWMRL bits can be written to at any time, but the
duty cycle value is not latched into PWMRH until after
a match between PR2 and TMR2 occurs.
TABLE 26-1:
Name
T2CON
SUMMARY OF REGISTERS ASSOCIATED WITH PWM MODULE
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
—
—
—
—
—
PR2
Bit 2
Bit 1
Bit 0
TMR2ON T2CKPS1 T2CKPS0
Register
on Page
164
Timer2 Module Period Register
172*
PWMRL
PWM Register Low Byte
171*
PWMPHL
SLAVE Phase Shift Byte
171*
Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by Capture mode.
* Page provides register information.
2017 Microchip Technology Inc.
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MCP19122/3
NOTES:
DS20005750A-page 174
2017 Microchip Technology Inc.
MCP19122/3
27.0
27.1
The I2C interface supports the following modes and
features:
MASTER SYNCHRONOUS
SERIAL PORT (MSSP)
MODULE
•
•
•
•
•
•
•
•
•
•
•
•
•
MSSP Module Overview
The Master Synchronous Serial Port (MSSP) module is
a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be Serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The MSSP module
in the MCP19122/3 only operates in Inter-Integrated
Circuit (I2C) mode.
Master mode
Slave mode
Byte NACKing (Slave mode)
Limited Multi-Master support
7-bit and 10-bit addressing
Start and Stop interrupts
Interrupt masking
Clock stretching
Bus collision detection
General call address matching
Dual Address masking
Address Hold and Data Hold modes
Selectable SDA hold times
Figure 27-1 is a block diagram of the I2C interface
module in Master mode. Figure 27-2 is a diagram of the
I2C interface module in Slave mode.
FIGURE 27-1:
MSSP BLOCK DIAGRAM (I2C MASTER MODE)
Internal
Data Bus
Read
[SSPxM 3:0]
Write
SSPBUF
Baud rate
generator
(SSPADD)
Shift
Clock
SDA
SDA in
Start bit, Stop bit,
Acknowledge
Generate (SSPCON2)
SCL in
Bus Collision
2017 Microchip Technology Inc.
Start bit detect,
Stop bit detect
Write collision detect
Clock arbitration
State counter for
end of XMIT/RCV
Address Match detect
Clock arbitrate/BCOL detect
(Hold off clock source)
Receive Enable (RCEN)
SCL
LSb
Clock Cntl
SSPSR
MSb
Set/Reset: S, P, SSPSTAT, WCOL, SSPxOV
Reset SEN, PEN (SSPCON2)
Set SSPIF, BCLIF
DS20005750A-page 175
MCP19122/3
FIGURE 27-2:
MSSP BLOCK DIAGRAM
(I2C SLAVE MODE)
Internal
Data Bus
Read
Write
SSPBUF Reg
SCL
If the requested slave exists on the bus, it will respond
with an Acknowledge bit, otherwise known as an ACK.
The master then continues in either Transmit mode or
Receive mode and the slave continues in the
complement, either in Receive mode or Transmit
mode, respectively.
Shift
Clock
SSPSR Reg
SDA
LSb
MSb
SSPMSK1 Reg
Match Detect
Addr Match
SSPADD Reg
Start and
Stop bit Detect
27.2
To begin communication, a master device starts out in
Master Transmit mode. The master device sends out a
Start bit followed by the address byte of the slave it
intends to communicate with. This is followed by a
single Read/Write bit, which determines whether the
master intends to transmit to or receive data from the
slave device.
Set, Reset
S, P bits
(SSPSTAT Reg)
A Start bit is indicated by a high-to-low transition of the
SDA line while the SCL line is held high. Address and
data bytes are sent out Most Significant bit (MSb) first.
The Read/Write bit is sent out as a logical one when the
master intends to read data from the slave, and is sent
out as a logical zero when it intends to write data to the
slave.
FIGURE 27-3:
I2C MODE OVERVIEW
VDD
The Inter-Integrated Circuit Bus (I2C) is a multi-master
serial data communication bus. Devices communicate
in a master/slave environment, where the master
devices initiate the communication. A Slave device is
controlled through addressing.
The I
2C
bus specifies two signal connections:
• Serial Clock (SCL)
• Serial Data (SDA)
Both the SCL and SDA connections are bidirectional
open-drain lines, each requiring pull-up resistors for the
supply voltage. Pulling the line to ground is considered
a logical zero; letting the line float is considered a
logical one.
Figure 27-3 shows a typical connection between two
devices configured as master and slave.
The I2C bus can operate with one or more master
devices and one or more slave devices.
There are four potential modes of operation for a given
device:
• Master Transmit mode
(master is transmitting data to a slave)
• Master Receive mode
(master is receiving data from a slave)
• Slave Transmit mode
(slave is transmitting data to a master)
• Slave Receive mode
(slave is receiving data from a master)
DS20005750A-page 176
I2C MASTER/
SLAVE CONNECTION
SCL
SCL
VDD
Master
Slave
SDA
SDA
The Acknowledge bit (ACK) is an active-low signal that
holds the SDA line low to indicate to the transmitter that
the slave device has received the transmitted data and
is ready to receive more.
The transition of a data bit is always performed while
the SCL line is held low. Transitions that occur while the
SCL line is held high are used to indicate Start and Stop
bits.
If the master intends to write to the slave, it repeatedly
sends out a byte of data, with the slave responding
after each byte with an ACK bit. In this example, the
master device is in Master Transmit mode and the
slave is in Slave Receive mode.
If the master intends to read from the slave, it
repeatedly receives a byte of data from the slave and
responds after each byte with an ACK bit. In this
example, the master device is in Master Receive mode
and the slave is Slave Transmit mode.
2017 Microchip Technology Inc.
MCP19122/3
On the last byte of data communicated, the master
device may end the transmission by sending a Stop bit.
If the master device is in Receive mode, it sends the
Stop bit in place of the last ACK bit. A Stop bit is
indicated by a low-to-high transition of the SDA line
while the SCL line is held high.
In some cases, the master may want to maintain
control of the bus and re-initiate another transmission.
If so, the master device may send another Start bit in
place of the Stop bit or last ACK bit when it is in Receive
mode.
The I2C bus specifies three message protocols:
• Single message where a master writes data to a
slave
• Single message where a master reads data from
a slave
• Combined message where a master initiates a
minimum of two writes, or two reads, or a
combination of writes and reads, to one or more
slaves
When one device is transmitting a logical one, or letting
the line float, and a second device is transmitting a
logical zero, or holding the line low, the first device can
detect that the line is not a logical one. This detection,
when used on the SCL line, is called clock stretching.
Clock stretching gives slave devices a mechanism to
control the flow of data. When this detection is used on
the SDA line, it is called arbitration. Arbitration ensures
that there is only one master device communicating at
any single time.
27.2.1
CLOCK STRETCHING
When a slave device has not completed processing
data, it can delay the transfer of more data through the
process of Clock Stretching. An addressed slave
device may hold the SCL clock line low after receiving
or sending a bit, indicating that it is not yet ready to
continue. The master that is communicating with the
slave will attempt to raise the SCL line in order to
transfer the next bit, but will detect that the clock line
has not yet been released. Because the SCL
connection is open-drain, the slave has the ability to
hold that line low until it is ready to continue
communicating.
27.2.2
ARBITRATION
Each master device must monitor the bus for Start and
Stop bits. If the device detects that the bus is busy, it
cannot begin a new message until the bus returns to an
idle state.
However, two master devices may try to initiate a
transmission at or about the same time. When this
occurs, the process of arbitration begins. Each
transmitter checks the level of the SDA data line and
compares it to the level that it expects to find. The first
transmitter to observe that the two levels don't match
loses arbitration and must stop transmitting on the SDA
line.
For example, if one transmitter holds the SDA line to a
logical one (lets it float) and a second transmitter holds
it to a logical zero (pulls it low), the result is that the
SDA line will be low. The first transmitter then observes
that the level of the line is different than expected and
concludes that another transmitter is communicating.
The first transmitter to notice this difference is the one
that loses arbitration and must stop driving the SDA
line. If this transmitter is also a master device, it must
also stop driving the SCL line. It then can monitor the
lines for a Stop condition before trying to reissue its
transmission. In the meantime, the other device that
has not noticed any difference between the expected
and actual levels on the SDA line continues with its
original transmission. It can do so without any
complications, because so far the transmission
appears exactly as expected, with no other transmitter
disturbing the message.
Slave Transmit mode can also be arbitrated, when a
master addresses multiple slaves, but this is less
common.
If two master devices are sending a message to two
different slave devices at the address stage, the master
sending the lower slave address always wins
arbitration. When two master devices send messages
to the same slave address, and addresses can
sometimes refer to multiple slaves, the arbitration
process must continue into the data stage.
Arbitration usually occurs very rarely, but it is a
necessary process for proper multi-master support.
Clock stretching allows receivers that cannot keep up
with a transmitter to control the flow of incoming data.
2017 Microchip Technology Inc.
DS20005750A-page 177
MCP19122/3
27.3
I2C MODE OPERATION
All MSSP I2C communication is byte-oriented and
shifted out MSb first. Six SFR registers and two
interrupt flags interface the module with the PIC
microcontroller and with the user’s software. Two pins,
SDA and SCL, are exercised by the module to
communicate with other external I2C devices.
27.3.1
BYTE FORMAT
All communication in I2C is done in 9-bit segments. A
byte is sent from a Master to a Slave or vice versa,
followed by an Acknowledge bit sent back. After the 8th
falling edge of the SCL line, the device outputting data
on the SDA changes that pin to an input and reads in
an acknowledge value on the next clock pulse.
The clock signal, SCL, is provided by the master. Data is
valid to change while the SCL signal is low, and sampled
on the rising edge of the clock. Changes on the SDA line
while the SCL line is high define special conditions on
the bus, explained in the following sections.
TABLE 27-1:
27.3.2
DEFINITION OF I2C TERMINOLOGY
There is language and terminology in the description
of I2C communication that have definitions specific to
I2C. Such word usage is defined in Table 27-1 and
may be used in the rest of this document without
explanation. The information in this table was adapted
from the Philips I2C specification.
27.3.3
SDA AND SCL PINS
Selecting any I2C mode with the SSPEN bit set forces
the SCL and SDA pins to be open-drain. These pins
should be set by the user to inputs by setting the
appropriate TRIS bits.
Note: Data is tied to output zero when an I2C
mode is enabled.
27.3.4
SDA HOLD TIME
The hold time of the SDA pin is selected by the SDAHT
bit in the SSPCON3 register. Hold time is the time SDA
is held valid after the falling edge of SCL. Setting the
SDAHT bit selects a longer 300 ns minimum hold time
and may help on buses with large capacitance.
I2C BUS TERMS
Term
Description
Transmitter
The device that shifts data out onto the bus
Receiver
The device that shifts data in from the bus
Master
The device that initiates a transfer, generates clock signals and terminates a transfer
Slave
The device addressed by the master
Multi-Master
A bus with more than one device that can initiate data transfers
Arbitration
Procedure to ensure that only one master at a time controls the bus. Winning arbitration
ensures that the message is not corrupted.
Synchronization
Procedure to synchronize the clocks of two or more devices on the bus
Idle
No master is controlling the bus and both SDA and SCL lines are high
Active
Any time one or more master devices are controlling the bus
Addressed Slave
Slave device that has received a matching address and is actively being clocked by a master
Matching Address
Address byte that is clocked into a slave that matches the value stored in SSPADDx
Write Request
Slave receives a matching address with R/W bit clear and is ready to clock in data
Read Request
Master sends an address byte with the R/W bit set, indicating that it wishes to clock data out of
the Slave. This data is the next and all following bytes until a Restart or Stop.
Clock Stretching
When a device on the bus holds SCL low to stall communication
Bus Collision
Any time the SDA line is sampled low by the module while it is outputting and expected high
state
DS20005750A-page 178
2017 Microchip Technology Inc.
MCP19122/3
27.3.5
START CONDITION
27.3.7
2
RESTART CONDITION
The I C specification defines a Start condition as a
transition of SDA from a high state to a low state, while
the SCL line is high. A Start condition is always generated by the master and signifies the transition of the
bus from an Idle to an Active state. Figure 27-4 shows
the wave forms for Start and Stop conditions.
A Restart is valid any time that a Stop is valid. A master
can issue a Restart if it wishes to hold the bus after
terminating the current transfer. A Restart has the same
effect on the slave that a Start would, resetting all slave
logic and preparing it to clock in an address. The master
may want to address the same or another slave.
A bus collision can occur on a Start condition if the
module samples the SDA line low before asserting it
low. This does not conform to the I2C Specification that
states no bus collision can occur on a Start.
In 10-bit Addressing Slave mode, a Restart is required
for the master to clock data out of the addressed
slave. Once a slave has been fully addressed,
matching both high and low address bytes, the master
can issue a Restart and the high address byte with the
R/W bit set. The slave logic will then hold the clock
and prepare to clock out data.
27.3.6
STOP CONDITION
A Stop condition is a transition of the SDA line from
low-to-high state while the SCL line is high.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained. Until a Stop
condition, a high address with R/W clear or a high
address match fails.
Note: At least one SCL low time must appear
before a Stop is valid. Therefore, if the SDA
line goes low then high again while the SCL
line stays high, only the Start condition is
detected.
27.3.8
START/STOP CONDITION
INTERRUPT MASKING
The SCIE and PCIE bits in the SSPCON3 register can
enable the generation of an interrupt in Slave modes
that do not typically support this function. These bits
will have no effect on slave modes where interrupt on
Start and Stop detect are already enabled.
FIGURE 27-4:
I2C START AND STOP CONDITIONS
SDA
SCL
S
Start
Condition
FIGURE 27-5:
P
Change of
Data Allowed
Change of
Data Allowed
Stop
Condition
I2C RESTART CONDITION
Sr
Change of
Data Allowed
2017 Microchip Technology Inc.
Restart
Condition
Change of
Data Allowed
DS20005750A-page 179
MCP19122/3
27.3.9
ACKNOWLEDGE SEQUENCE
th
27.4.2
2
The 9 SCL pulse for any transferred byte in I C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDA line low. The transmitter must release control
of the line during this time to shift in the response. The
Acknowledge (ACK) is an active-low signal, pulling the
SDA line low, indicating to the transmitter that the
device has received the transmitted data and is ready
to receive more.
The result of an ACK is placed in the ACKSTAT bit in
the SSPCON2 register.
Slave software, when the AHEN and DHEN bits are
set, allows the user to set the ACK value sent back to
the transmitter. The ACKDT bit in the SSPCON2
register is set/cleared to determine the response.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits in the SSPCON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit in the SSPSTAT register
or the SSPOV bit in the SSPCON1 register are set
when a byte is received, the ACK will not be sent.
When the module is addressed, after the 8th falling
edge of SCL on the bus, the ACKTIM bit in the
SSPCON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus. The ACKTIM
status bit is only active when the AHEN or DHEN bits
are enabled.
27.4
I2C SLAVE MODE OPERATION
The MSSP Slave mode operates in one of the four
modes selected in the SSPM bits in SSPCON1
register. The modes can be divided into 7-bit and
10-bit Addressing mode. 10-bit Addressing mode
operates the same as 7-bit, with some additional
overhead for handling the larger addresses.
Modes with Start and Stop bit interrupts operate the
same as the other modes, with SSPIF additionally getting
set upon detection of a Start, Restart or Stop condition.
27.4.1
SLAVE MODE ADDRESSES
The SSPADD register contains the Slave mode
address. The first byte received after a Start or Restart
condition is compared against the value stored in this
register. If the byte matches, the value is loaded into
the SSPBUF register and an interrupt is generated. If
the value does not match, the module goes idle and no
indication is given to the software that anything
happened.
The SSPMSK1 register affects the address matching
process. Refer to Section 27.4.10 “SSPMSK1
Register” for more information.
DS20005750A-page 180
SECOND SLAVE MODE ADDRESS
The SSPADD2 register contains a second 7-bit Slave
mode address. The first byte received after a Start or
Restart condition is compared against the value stored
in this register. If the byte matches, the value is loaded
into the SSPBUF register and an interrupt is
generated. If the value does not match, the module
goes idle and no indication is given to the software that
anything happened.
The SSPMSK2 register affects the address matching
process. Refer to Section 27.4.10 “SSPMSK1
Register” for more information.
27.4.2.1
I2C Slave 7-Bit Addressing Mode
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
27.4.2.2
I2C Slave 10-Bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of ‘1 1 1 1 0 A9 A8
0’. A9 and A8 are the two MSb of the 10-bit address
and are stored in bits 2 and 1 in the SSPADD register.
After the high byte has been acknowledged, the UA bit
is set and SCL is held low until the user updates
SSPADD with the low address. The low address byte is
clocked in, and all 8 bits are compared to the low
address value in SSPADD. Even if there is no address
match, SSPIF and UA are set and SCL is held low until
SSPADD is updated to receive a high byte again. When
SSPADD is updated, the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
A high and low address match as a write request is
required at the start of all 10-bit addressing
communication. A transmission can be initiated by
issuing a Restart once the slave is addressed, and
clocking in the high address with the R/W bit set. The
slave hardware will then acknowledge the read
request and prepare to clock out data. This is only
valid for a slave after it has received a complete high
and low address-byte match.
27.4.3
SLAVE RECEPTION
When the R/W bit of a matching received address byte
is clear, the R/W bit in the SSPSTAT register is cleared.
The received address is loaded into the SSPBUF
register and acknowledged.
When an overflow condition exists for a received
address, then Not Acknowledge is given. An overflow
condition is defined as either bit BF in the SSPSTAT
register is set, or bit SSPOV in the SSPCON1 register is
set. The BOEN bit in the SSPCON3 register modifies this
operation. For more information, refer to Register 27-4.
2017 Microchip Technology Inc.
MCP19122/3
An MSSP interrupt is generated for each transferred
data byte. Flag bit SSPIF must be cleared by software.
27.4.3.2
When the SEN bit in the SSPCON2 register is set, SCL
will be held low (clock stretch) following each received
byte. The clock must be released by setting the CKP
bit in the SSPCON1 register, except sometimes in
10-bit mode.
Slave device reception with AHEN and DHEN set
operates the same as without these options with extra
interrupts and clock stretching added after the 8th falling
edge of SCL. These additional interrupts allow the slave
software to decide whether it wants the ACK to receive
address or data byte, rather than the hardware.
27.4.3.1
7-Bit Addressing Reception
This section describes a standard sequence of events
for the MSSP module configured as an I2C Slave in
7-bit Addressing mode, including all decisions made
by hardware or software and their effect on reception.
Figures 27-5 and 27-6 are used as a visual reference
for this description.
This is a step-by-step process of what typically must
be done to accomplish I2C communication.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
Start bit detected.
S bit in the SSPSTAT register is set; SSPIF is set
if interrupt on Start detect is enabled.
Matching address with R/W bit clear is received.
The slave pulls SDA low, sending an ACK to the
master, and sets SSPIF bit.
Software clears the SSPIF bit.
Software reads received address from SSPBUF
clearing the BF flag.
If SEN = 1, Slave software sets CKP bit to
release the SCL line.
The master clocks out a data byte.
Slave drives SDA low sending an ACK to the
master, and sets SSPIF bit.
Software clears SSPIF.
Software reads the received byte from SSPBUF
clearing BF.
Steps 8–12 are repeated for all received bytes
from the Master.
Master sends Stop condition, setting P bit in the
SSPSTAT register, and the bus goes idle.
2017 Microchip Technology Inc.
7-Bit Reception with AHEN and
DHEN
This list describes the steps that need to be taken by
slave software to use these options for I2C
communication. Figure 27-7 displays a module using
both address and data holding. Figure 27-8 includes
the operation with the SEN bit in the SSPCON2
register set.
1.
S bit in the SSPSTAT register is set; SSPIF is set
if interrupt on Start detect is enabled.
2. Matching address with R/W bit clear is clocked
in. SSPIF is set and CKP cleared after the 8th
falling edge of SCL.
3. Slave clears the SSPIF.
4. Slave can look at the ACKTIM bit in the
SSPCON3 register to determine if the SSPIF
was after or before the ACK.
5. Slave reads the address value from SSPBUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
8. SSPxIF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
clock after the ACK.
10. Slave clears SSPIF.
Note: SSPIF is still set after the 9th falling edge of
SCL even if there is no clock stretching and
BF has been cleared. Only if NACK is sent
to Master is SSPIF not set.
11. SSPIF set and CKP cleared after 8th falling edge
of SCL for a received data byte.
12. Slave looks at ACKTIM bit in the SSPCON3
register to determine the source of the interrupt.
13. Slave reads the received data from SSPBUF
clearing BF.
14. Steps 7-14 are the same for each received data
byte.
15. Communication is ended by either the slave
sending an ACK = 1 or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop Detect is disabled, the slave will only know
by polling the P bit in the SSPSTAT register.
DS20005750A-page 181
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
Bus Master sends
Stop condition
From Slave to Master
Receiving Address
SDA
A7 A6 A5 A4
SCL
S
1
2
3
4
Receiving Data
A3 A2 A1
5
6
7
ACK
8
9
Receiving Data
ACK = 1
D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
SSPIF
Cleared by software
BF
SSPBUF is read
SSPOV
Cleared by software
First byte
of data is
available
in SSPBUF
SSPOV set because
SSPBUF is still full.
ACK is not sent.
8
9
P
SSPIF set on 9th
falling edge of
SCL
MCP19122/3
DS20005750A-page 182
FIGURE 27-6:
2017 Microchip Technology Inc.
2017 Microchip Technology Inc.
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
FIGURE 27-7:
Bus Master sends
Stop condition
Receive Address
SDA
SCL
A7 A6 A5 A4 A3 A2 A1
S
1
2
3
4
5
6
7
R/W=0
8
9
Receive Data
ACK
Receive Data
D7 D6 D5 D4 D3 D2 D1 D0 ACK
SEN 1 2 3 4 5 6 7 8
Clock is held low until CKP is
set to ‘1’
9
ACK
D7 D6 D5 D4 D3 D2 D1 D0
SEN 1
2
3
4
5
6
7
8
SSPIF
Cleared by software
BF
SSPBUF is read
SSPOV
Cleared by software
9
P
SSPIF set on
9th falling
edge of SCL
First byte
of data is
available
in SSPBUF
SSPOV set because
SSPBUF is still full.
ACK is not sent.
CKP
CKP is written to ‘1’ in software,
releasing SCL
CKP is written to ‘1’ in software,
releasing SCL
DS20005750A-page 183
MCP19122/3
SCL is not held
low because
ACK = 1
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
Master Releases SDAx
to slave for ACK sequence
Receiving Address
SDA
A7 A6 A5 A4 A3 A2 A1
Master sends
Stop condition
Receiving Data
ACK D7 D6 D5 D4 D3 D2 D1 D0
ACK
Received Data
ACK = 1
D7 D6 D5 D4 D3 D2 D1 D0
SCL
S
1 2 3
4 5 6 7 8
9 1 2 3 4 5
6 7 8
9 1 2 3 4 5 6 7 8
9
P
SSPIF
If AHEN = 1,
SSPIF is set
BF
ACKDT
CKP
Address is read
from SSBUF
ACKTIM
ACKTIM set by hardware
on 8th falling edge of SCL
2017 Microchip Technology Inc.
P
Cleared by software
Data is read from SSPBUF
Slave software
clears ACKDT to
ACK the received byte
When AHEN = 1:
CKP is cleared by hardware
and SCL is stretched
S
SSPIF is set on
9th falling edge of
SCL, after ACK
Slave software
sets ACKDT to
not ACK
When DHEN = 1:
CKP is cleared by
hardware on 8th falling
edge of SCL
ACKTIM cleared by
hardware on 9th
rising edge of SCL
CKP set by software,
SCL is released
ACKTIM set by hardware
on 8th falling edge of SCL
No interrupt
after not ACK
from Slave
MCP19122/3
DS20005750A-page 184
FIGURE 27-8:
2017 Microchip Technology Inc.
I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
FIGURE 27-9:
R/W = 0
Receiving Address
SDA
A7 A6 A5 A4 A3 A2 A1
SCL
S
1
2 3
4
5
6
7
Master sends
Stop condition
Master releases
SDA to slave for ACK sequence
Receive Data
ACK D7 D6 D5 D4 D3 D2 D1 D0
8
9
1
2
3
4 5
6
7
8
ACK
Receive Data
D7 D6 D5 D4 D3 D2 D1 D0
9
1
2
3
4
5
6 7
8
SSPIF
Received
address is loaded into
SSPBUF
ACKDT
Slave software clears
ACKDT to ACK
the received byte
CKP
When AHEN = 1:
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
ACKTIM
ACKTIM is set by hardware
on 8th falling edge of SCL
P
SSPBUF can be
read any time before
next byte is loaded
Slave sends
not ACK
When DHEN = 1:
on the 8th falling edge
of SCL of a received
data byte, CKP is
cleared
Set by software,
release SCL
CKP is not cleared
if not ACK
ACKTIM is cleared by hardware
on 9th rising edge of SCL
DS20005750A-page 185
MCP19122/3
S
Received data is
available
on SSPBUF
P
No interrupt after
if not ACK
from Slave
Cleared by software
BF
9
MCP19122/3
27.4.4
SLAVE TRANSMISSION
27.4.4.2
7-Bit Transmission
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit in the
SSPSTAT register is set. The received address is
loaded into the SSPBUF register and an ACK pulse is
sent by the slave on the 9th bit.
A master device can transmit a read request to a
slave, and then it clocks data out of the slave. The list
below outlines what software for a slave will need to
do to accomplish a standard transmission.
Figure 27-10 can be used as a reference to this list.
Following the ACK, slave hardware clears the CKP bit
and the SCL pin is held low. Refer to Section 27.4.7
“Clock Stretching” for more details. By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
1.
The transmit data must be loaded into the SSPBUF
register, which also loads the SSPSR register. Then the
SCL pin should be released by setting the CKP bit in
the SSPCON1 register. The eight data bits are shifted
out on the falling edge of the SCL input. This ensures
that the SDA signal is valid during the SCL high time.
The ACK pulse from the master-receiver is latched on
the rising edge of the 9th SCL input pulse. This ACK
value is copied to the ACKSTAT bit in the SSPCON2
register. If ACKSTAT is set (not ACK), the data transfer
is complete. In this case, when the not ACK is latched
by the slave, the slave goes idle and waits for another
occurrence of the Start bit. If the SDA line was low
(ACK), the next transmit data must be loaded into the
SSPBUF register. Again, the SCL pin must be released
by setting bit CKP.
An MSSP interrupt is generated for each data transfer
byte. The SSPIF bit must be cleared by software, and
the SSPSTAT register is used to determine the status
of the byte. The SSPIF bit is set on the falling edge of
the 9th clock pulse.
27.4.4.1
Slave Mode Bus Collision
A slave receives a Read request and begins shifting
data out on the SDA line. If a bus collision is detected
and the SBCDE bit in the SSPCON3 register is set, the
BCLIF bit in the PIR register is set. Once a bus collision
is detected, the slave goes idle and waits to be
addressed again. The user’s software can use the
BCLIF bit to handle a slave bus collision.
DS20005750A-page 186
Master sends a Start condition on SDA and
SCL.
2. S bit in the SSPSTAT register is set; SSPIF is set
if interrupt on Start detect is enabled.
3. Matching address with R/W bit set is received by
the Slave setting SSPIF bit.
4. Slave hardware generates an ACK and sets
SSPIF.
5. SSPIF bit is cleared by user.
6. Software reads the received address from
SSPBUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
8. The slave software loads the transmit data into
SSPBUF.
9. CKP bit is set releasing SCL, allowing the
master to clock the data out of the slave.
10. SSPIF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSPIF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
Note 1: If the master ACKs, the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCL (9th) rather than on the
falling edge.
13. Steps 9–13 are repeated for each transmitted
byte.
14. If the master sends a not ACK, the clock is not
held but SSPIF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
2017 Microchip Technology Inc.
2017 Microchip Technology Inc.
FIGURE 27-10:
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
Master sends
Stop condition
Receiving Address R/W = 1 Automatic
Transmitting Data
Automatic
Transmitting Data ACK
ACK
A7 A6 A5 A4 A3 A2 A1
D7 D6 D5 D4 D3 D2 D1 D0 ACK
D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
S
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
SSPIF
Cleared by software
BF
Received address
is read from SSPBUF
Data to transmit is
loaded into SSPBUF
BF is automatically
cleared after 8th
falling edge of SCL
CKP
ACKSTAT
When R/W is set,
SCL is always
held low after 9th SCL
falling edge
Master’s not ACK
is copied to
ACKSTAT
R/W
D/A
R/W is copied from the
matching address byte
DS20005750A-page 187
P
MCP19122/3
Indicates an address
has been received
S
Set by software
CKP is not
held for not
ACK
MCP19122/3
27.4.4.3
7-Bit Transmission with Address
Hold Enabled
Setting the AHEN bit in the SSPCON3 register
enables additional clock stretching and interrupt
generation after the 8th falling edge of a received
matching address. Once a matching address has
been clocked in, CKP is cleared and the SSPIF
interrupt is set.
Figure 27-11 displays a standard waveform of a 7-bit
Address Slave Transmission with AHEN enabled.
1.
2.
Bus starts idle.
Master sends Start condition; the S bit in the
SSPSTAT register is set; SSPIF is set if interrupt
on Start detect is enabled.
3. Master sends matching address with R/W bit
set. After the 8th falling edge of the SCL line, the
CKP bit is cleared and SSPIF interrupt is
generated.
4. Slave software clears SSPIF.
5. Slave software reads ACKTIM bit in the
SSPCON3 register and R/W and D/A bits in the
SSPSTAT register to determine the source of
the interrupt.
6. Slave reads the address value from the
SSPBUF register, clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK, and sets ACKDT bit
in the SSPCON2 register accordingly.
8. Slave sets the CKP bit releasing SCL.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSPIF after the ACK if the R/W bit is
set.
11. Slave software clears SSPIF.
12. Slave loads value to transmit to the master into
SSPBUF setting the BF bit.
Note:
SSPBUF cannot be loaded until after the
ACK.
13. Slave sets CKP bit releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCL pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit in the SSPCON2 register.
16. Steps 10–15 are repeated for each byte
transmitted to the master from the slave.
17. If the master sends a not ACK, the slave
releases the bus, allowing the master to send a
Stop and end the communication.
Note:
Master must send a not ACK on the last
byte to ensure that the slave releases the
SCL line to receive a Stop.
DS20005750A-page 188
2017 Microchip Technology Inc.
2017 Microchip Technology Inc.
I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
FIGURE 27-11:
Master sends
Stop condition
Receiving Address R/W = 1
SDA
SCL
A7 A6 A5 A4 A3 A2 A1
S
1
2 3 4
5 6 7 8
9
SSPIF
BF
Automatic
Transmitting Data
Automatic
Transmitting Data ACK
ACK
D7 D6 D5 D4 D3 D2 D1 D0 ACK
D7 D6 D5 D4 D3 D2 D1 D0
1
2 3
4 5 6 7 8 9
1 2
3 4
5 6 7 8
9
P
Cleared by software
Received address
is read from SSPBUF
Data to transmit is
loaded into SSPBUF
BF is automatically
cleared after 8th
falling edge of SCL
ACKDT
Slave clears
ACKDT to ACK
address
ACKSTAT
Master’s ACK
response is copied
to SSPSTAT
CKP
ACKTIM
DS20005750A-page 189
D/A
ACKTIM is set on 8th falling
edge of SCL
When R/W = 1:
CKP is always
cleared after ACK
Set by software,
releases SCL
ACKTIM is set on 9th rising
edge of SCL
CKP not cleared
after not ACK
MCP19122/3
R/W
When AHEN = 1:
CKP is cleared by hardware
after receiving matching
address.
MCP19122/3
27.4.5
SLAVE MODE 10-BIT ADDRESS
RECEPTION
This section describes a standard sequence of events
for the MSSP module configured as an I2C Slave in
10-bit Addressing mode.
Figure 27-12 is used as a visual reference for this
description.
This is a step-by-step process of what must be done
by slave software to accomplish I2C communication:
1.
2.
3.
4.
5.
6.
7.
8.
Bus starts idle.
Master sends Start condition; S bit in the
SSPSTAT register is set; SSPIF is set if interrupt on Start detect is enabled.
Master sends matching high address with R/W
bit clear; UA bit in the SSPSTAT register is set.
Slave sends ACK and SSPIF is set.
Software clears the SSPIF bit.
Software reads received address from SSPBUF,
clearing the BF flag.
Slave loads low address into SSPADD,
releasing SCL.
Master sends matching low-address byte to the
Slave; UA bit is set.
27.4.6
10-BIT ADDRESSING WITH
ADDRESS OR DATA HOLD
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSPADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and the SCL line is held low, is the
same. Figure 27-13 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 27-14 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
Note: Updates to the SSPADD register are not
allowed until after the ACK sequence.
9.
Slave sends ACK and SSPIF is set.
Note: If the low address does not match, SSPIF
and UA are still set so that the slave
software can set SSPADD back to the high
address. BF is not set because there is no
match. CKP is unaffected.
10. Slave clears SSPIF.
11. Slave reads the received matching address
from SSPBUF, clearing BF.
12. Slave loads high address into SSPADD.
13. Master clocks a data byte to the slave and
clocks out the slave’s ACK on the 9th SCL pulse;
SSPIF is set.
14. If SEN bit in the SSPCON2 register is set, CKP
is cleared by hardware and the clock is
stretched.
15. Slave clears SSPIF.
16. Slave reads the received byte from SSPBUF,
clearing BF.
17. If SEN is set, the slave sets CKP to release the
SCL.
18. Steps 13–17 are repeated for each received
byte.
19. Master sends Stop to end the transmission.
DS20005750A-page 190
2017 Microchip Technology Inc.
2017 Microchip Technology Inc.
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
FIGURE 27-12:
Master sends
Stop condition
Receive First Address Byte
SDA
S
SSPIF
BF
UA
ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5 D4 D3 D2 D1 D0 ACK
1 1 1 1 0 A9 A8
SCL
1
2
3
4
5
6
7
Receive Data
Receive Data
Receive Second Address Byte
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
P
SCL is held low
while CKP = 0
Set by hardware
on 9th falling edge
Cleared by software
Receive address is
read from SSPBUF
If address matches
SSPADD, it is loaded into
SSPBUF
When UA = 1:
SCL is held low
Data is read
from SSPBUF
Software updates SSPADD
and releases SCL
CKP
Set by software,
releasing SCL
DS20005750A-page 191
MCP19122/3
When SEN = 1:
CKP is cleared after
9th falling edge of received byte
Receive First Address Byte
SDA
SCL
S
1
1
1
1
0 A9 A8
1
2
3
4
5
6
7
R/W = 0 Receive Second Address Byte
ACK
A7 A6 A5 A4 A3 A2 A1 A0
8
9 UA 1
2
3
4
5
6
7
8
Receive Data
Receive Data
ACK
D7 D6 D5 D4 D3 D2 D1 D0 ACK D7 D6 D5
9 UA 1
2
3
4
5
6
7
8
9
1
2
SSPIF
Set by hardware
on 9th falling edge
Cleared by software
Cleared by software
BF
ACKDT
Slave software clears
ACKDT to ACK
the received byte
SSPBUF can be
read anytime
before the next
received cycle
Received data
is read from
SSPBUF
UA
Update to SSPADD is
not allowed until 9th
falling edge of SCL
If when AHEN = 1:
on the 8th falling edge of SCL
of an address byte, CKP is
ACKTIM cleared
ACKTIM is set by hardware
on 8th falling edge of SCL
CKP
Update of SSPADD,
clears UA and releases
SCL
2017 Microchip Technology Inc.
Set CKP with software
releases SCL
MCP19122/3
DS20005750A-page 192
I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
FIGURE 27-13:
2017 Microchip Technology Inc.
FIGURE 27-14:
I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
Master sends
Master sends
Stop condition
not ACK
Master sends
Restart event
Receiving Address R/W = 0 Receiving Second Address Byte
1 1 1 1 0 A9 A8 ACK A7 A6 A5 A4 A3 A2 A1 A0 ACK
SDA
SCL
S
1 2 3 4 5 6 7 8 9
1 2 3 4 5 6 7 8 9
Receive First Address Byte
1 1 1 1 0 A9 A8 ACK
1 2 3 4 5 6 7 8 9
Transmitting Data Byte ACK = 1
D7 D6 D5 D4D3 D2 D1 D0
1 2 3 4 5 6 7 8 9
Sr
P
SSPIF
Set by hardware
BF
UA
CKP
Cleared by
software
Received address is
read from SSPBUF
SSPBUF loaded
with received address
UA indicates SSPADD
must be updated
ACKSTAT
Set by hardware
After SSPADD is updated.
UA is cleared and SCL is
released
Data to transmit is
loaded into SSPBUF
High address is loaded
back into SSPADD
When R/W = 1:
CKP is cleared on 9th falling edge of SCLx
Set by software
releases SCL
Master’s not ACK is copied
R/W
Indicates an address
has been received
DS20005750A-page 193
MCP19122/3
R/W is copied from the
matching address byte
D/A
MCP19122/3
27.4.7
CLOCK STRETCHING
27.4.7.2
Clock stretching occurs when a device on the bus holds
the SCL line low, effectively pausing communication.
The slave may stretch the clock to allow more time to
handle data or prepare a response for the master
device. A master device is not concerned with
stretching, as it is stretching anytime it is active on the
bus and not transferring data. Any stretching done by a
slave is invisible to the master software and handled by
the hardware that generates SCL.
The CKP bit in the SSPCON1 register is used to
control stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCL line to go low
and then hold it. Setting CKP will release SCL and
allow more communication.
27.4.7.1
Normal Clock Stretching
Following an ACK, if the R/W bit in the SSPSTAT
register is set, causing a read request, the slave
hardware will clear CKP. This allows the slave time to
update SSPBUF with data to transfer to the master. If
the SEN bit in the SSPCON2 register is set, the slave
hardware will always stretch the clock after the ACK
sequence. Once the slave is ready, CKP is set by
software and communication resumes.
Note 1: The BF bit has no effect on whether the
clock will be stretched or not. This is
different than previous versions of the
module that would not stretch the clock or
clear CKP if SSPBUF was read before
the 9th falling edge of SCL.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSPBUF was loaded before the 9th falling
edge of SCL. It is now always cleared for
read requests.
FIGURE 27-15:
10-Bit Addressing Mode
In 10-bit Addressing mode, when the UA bit is set, the
clock is always stretched. This is the only time the SCL
is stretched without CKP being cleared. SCL is
released immediately after a write to SSPADD.
Note:
27.4.7.3
Previous versions of the module did not
stretch the clock if the second address
byte did not match.
Byte NACKing
When AHEN bit in the SSPCON3 register is set, CKP
is cleared by hardware after the 8th falling edge of SCL
for a received matching address byte. When DHEN bit
in the SSPCON3 register is set, CKP is cleared after
the 8th falling edge of SCL for received data.
Stretching after the 8th falling edge of SCL allows the
slave to look at the received address or data and
decide if it wants to ACK the received data.
27.4.8
CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCL line to go low and then hold it. However,
clearing the CKP bit will not assert the SCL output low
until the SCL output is already sampled low.
Therefore, the CKP bit will not assert the SCL line until
an external I2C master device has already asserted
the SCL line. The SCL output will remain low until the
CKP bit is set and all other devices on the I2C bus
have released SCL. This ensures that a write to the
CKP bit will not violate the minimum high time
requirement for SCL (refer to Figure 27-16).
CLOCK SYNCHRONIZATION TIMING
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SDA
DX
DX ‚ – 1
SCL
CKP
Master device
asserts clock
Master device
releases clock
WR
SSPCON1
DS20005750A-page 194
2017 Microchip Technology Inc.
MCP19122/3
27.4.9
GENERAL CALL ADDRESS
SUPPORT
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually
determines which device will be the slave addressed
by the master device. The exception is the general call
address, which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
If the AHEN bit in the SSPCON3 register is set, just as
with any other address reception, the slave hardware
will stretch the clock after the 8th falling edge of SCL.
The slave must then set its ACKDT value and release
the clock with communication progressing as it would
normally.
The general call address is a reserved address in the
I2C protocol, defined as address 0x00. When the
GCEN bit in the SSPCON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSPADD.
After the slave clocks in an address of all zeros with
the R/W bit clear, an interrupt is generated and slave
software can read SSPBUF and respond.
Figure 27-17 shows a general call reception
sequence.
FIGURE 27-16:
SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
Address is compared to General Call Address
after ACK, set interrupt
Receiving Data
ACK
R/W = 0
ACK D7 D6 D5 D4 D3 D2 D1 D0
General Call Address
SDA
SCL
S
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
SSPIF
BF (SSPSTAT)
GCEN (SSPCON2)
Cleared by software
SSPBUF is read
‘1’
27.4.10
SSPMSK1 REGISTER
An SSP Mask (SSPMSK1) register is available in I2C
Slave mode as a mask for the value held in the
SSPSR register during an address comparison
operation. A zero (‘0’) bit in the SSPMSK1 register has
the effect of making the corresponding bit of the
received address a “don’t care”.
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSP operation until written with a mask value.
The SSPMSK1 register is active during:
• 7-bit Address mode: address compare of A.
• 10-bit Address mode: address compare of A
only. The SSP mask has no effect during the
reception of the first (high) byte of the address.
2017 Microchip Technology Inc.
DS20005750A-page 195
MCP19122/3
27.5
I2C MASTER MODE
Master mode is enabled by setting and clearing the
appropriate SSPM bits in the SSPCON1 register and
by setting the SSPEN bit. In Master mode, the SDA and
SCK pins must be configured as inputs. The MSSP
peripheral hardware will override the output driver TRIS
controls when necessary, to drive the pins low.
The Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop
conditions. The Stop (P) and Start (S) bits are cleared
from a Reset or when the MSSP module is disabled.
Control of the I 2C bus may be taken when the P bit is
set or the bus is idle.
In Firmware-Controlled Master mode, user code
conducts all I 2C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user’s software
directly manipulating the SDA and SCL lines.
The following events will cause the SSP Interrupt Flag
bit (SSPIF) to be set (SSP interrupt, if enabled):
•
•
•
•
•
Start condition detected
Stop condition detected
Data transfer byte transmitted/received
Acknowledge transmitted/received
Repeated Start generated
Note 1: The MSSP module, when configured in
I2C Master mode, does not allow queuing
of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSPBUF register to
initiate transmission before the Start
condition is complete. In this case, the
SSPBUF will not be written to and the
WCOL bit will be set, indicating that a
write to the SSPBUF did not occur.
2: When in Master mode, Start/Stop
detection is masked and an interrupt is
generated when the SEN/PEN bit is
cleared and the generation is complete.
DS20005750A-page 196
27.5.1
I2C MASTER MODE OPERATION
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer
ends with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmit mode, serial data is output through
SDA while SCL outputs the serial clock. The first byte
transmitted contains the slave address of the receiving
device (7 bits) and the Read/Write (R/W) bit. In this
case, the R/W bit will be logic ‘0’. Serial data is
transmitted 8 bits at a time. After each byte is
transmitted, an Acknowledge bit is received. Start and
Stop conditions are output to indicate the beginning
and the end of a serial transfer.
In Master Receive mode, the first byte transmitted
contains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDA, while SCL outputs the
serial clock. Serial data is received 8 bits at a time. After
each byte is received, an Acknowledge bit is
transmitted. Start and Stop conditions indicate the
beginning and end of transmission.
A Baud Rate Generator is used to set the clock
frequency output on SCL. Refer to Section 27.6
“Baud Rate Generator” for more details.
27.5.2
CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate
Generator (BRG) is suspended from counting until the
SCL pin is actually sampled high. When the SCL pin is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSPADD and begins
counting. This ensures that the SCL high time will
always be at least one BRG rollover count in the event
that the clock is held low by an external device
(Figure 27-17).
2017 Microchip Technology Inc.
MCP19122/3
FIGURE 27-17:
BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
SDA
DX
DX ‚ – 1
SCL deasserted but slave holds
SCL low (clock arbitration)
SCL allowed to transition high
SCL
BGR decrements on
Q2 and Q4 cycles
BRG
Value
03h
02h
01h
00h (hold off)
03h
02h
SCL is sampled high, reload takes
place and BRG starts its count
BRG
Reload
27.5.3
WCOL STATUS FLAG
If the user writes the SSPBUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set, it indicates that an action on SSPBUF
was attempted while the module was not idle.
Note:
27.5.4
Because queuing of events is not allowed,
writing to the lower 5 bits in the SSPCON2
register is disabled until the Start condition
is complete.
I2C MASTER MODE START
CONDITION TIMING
To initiate a Start condition, the user sets the Start
Enable bit, SEN, in the SSPCON2 register. If the SDA
and SCL pins are sampled high, the Baud Rate
Generator is reloaded with the contents of
SSPADD and starts its count. If SCL and SDA
are both sampled high when the Baud Rate Generator
times out (TBRG), the SDA pin is driven low. The action
FIGURE 27-18:
of the SDA being driven low while SCL is high is the
Start condition and causes the S bit in the SSPSTAT1
register to be set. Following this, the Baud Rate
Generator is reloaded with the contents of
SSPADD and resumes its count. When the Baud
Rate Generator times out (TBRG), the SEN bit in the
SSPCON2 register will be automatically cleared by
hardware; the Baud Rate Generator is suspended,
leaving the SDA line held low and the Start condition is
complete.
Note 1: If, at the beginning of the Start condition,
the SDA and SCL pins are already
sampled low, or if, during the Start
condition, the SCL line is sampled low
before the SDA line is driven low, a bus
collision occurs, the Bus Collision
Interrupt Flag, BCLIF, is set, the Start
condition is aborted and the I2C module is
reset into its idle state.
2: The Philips I2C Specification states that a
bus collision cannot occur on a Start.
FIRST START BIT TIMING
Write to SEN bit occurs here Set S bit (SSPSTAT)
At completion of Start bit,
SDA = 1,
hardware clears SEN bit
SCL = 1
and sets SSPIF bit
TBRG
TBRG
SDA
Write to SSPBUF occurs here
1st bit
2nd bit
TBRG
SCL
S
2017 Microchip Technology Inc.
TBRG
DS20005750A-page 197
MCP19122/3
27.5.5
I2C MASTER MODE REPEATED
START CONDITION TIMING
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
A Repeated Start condition occurs when the RSEN bit
in the SSPCON2 register is programmed high and the
Master state machine is no longer active. When the
RSEN bit is set, the SCL pin is asserted low. When the
SCL pin is sampled low, the Baud Rate Generator is
loaded and begins counting. The SDA pin is released
(brought high) for one Baud Rate Generator count
(TBRG). When the Baud Rate Generator times out, if
SDA is sampled high, the SCL pin will be deasserted
(brought high). When SCL is sampled high, the Baud
Rate Generator is reloaded and begins counting. SDA
and SCL must be sampled high for one TBRG. This
action is then followed by assertion of the SDA pin
(SDA = 0) for one TBRG while SCL is high. SCL is
asserted low. Following this, the RSEN bit in the
SSPCON2 register will be automatically cleared and
the Baud Rate Generator will not be reloaded, leaving
the SDA pin held low. As soon as a Start condition is
detected on the SDA and SCL pins, the S bit in the
SSPSTAT register will be set. The SSPIF bit will not be
set until the Baud Rate Generator has timed out.
FIGURE 27-19:
2: A bus collision during the Repeated Start
condition occurs if:
•SDA is sampled low when SCL goes
from low to high.
•SCL goes low before SDA is
asserted low. This may indicate
that another master is attempting to
transmit a data ‘1’.
REPEAT START CONDITION WAVEFORM
Write to SSPCON2
occurs here
SDA = 1,
SCL (no change)
S bit set by hardware
At completion of Start bit,
hardware clears RSEN bit
and sets SSPIF
SDA = 1,
SCL = 1
TBRG TBRG TBRG
1st bit
SDA
Write to SSPBUF occurs here
TBRG
SCL
Sr
Repeated Start
DS20005750A-page 198
TBRG
2017 Microchip Technology Inc.
MCP19122/3
27.5.6
I2C MASTER MODE
TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSPBUF register. This action will
set the Buffer Full (BF) flag bit and allow the Baud Rate
Generator to begin counting and start the next
transmission. Each bit of address/data will be shifted
out onto the SDA pin after the falling edge of SCL is
asserted. SCL is held low for one Baud Rate Generator
rollover count (TBRG). Data should be valid before SCL
is released high. When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin must
remain stable for that duration and some hold time after
the next falling edge of SCL. After the 8th bit is shifted
out (the falling edge of the 8th clock), the BF flag is
cleared and the master releases the SDA. This allows
the slave device being addressed to respond with an
ACK bit during the 9th bit time if an address match
occurred or if data was received properly. The status of
ACK is written into the ACKSTAT bit on the rising edge
of the 9th clock. If the master receives an Acknowledge,
the Acknowledge Status bit (ACKSTAT) is cleared. If
not, the bit is set. After the 9th clock, the SSPIF bit is set
and the master clock (Baud Rate Generator) is
suspended until the next data byte is loaded into the
SSPBUF, leaving SCL low and SDA unchanged
(Figure 27-20).
After the write to the SSPBUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W bit are completed. On
the falling edge of the 8th clock, the master will release
the SDA pin, allowing the slave to respond with an
Acknowledge. On the falling edge of the 9th clock, the
master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT status bit in the SSPCON2
register. Following the falling edge of the 9th clock
transmission of the address, the SSPIF is set, the BF
flag is cleared and the Baud Rate Generator is turned
off until another write to the SSPBUF takes place,
holding SCL low and allowing SDA to float.
27.5.6.1
27.5.6.2
If the user writes the SSPBUF when a transmit is
already in progress (i.e., SSPSR is still shifting out a
data byte), the WCOL is set and the contents of the
buffer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
27.5.6.3
2017 Microchip Technology Inc.
ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit in the SSPCON2
register is cleared when the slave has sent an
Acknowledge (ACK = 0) and is set when the slave
does not Acknowledge (ACK = 1). A slave sends an
Acknowledge when it has recognized its address
(including a general call) or when the slave has
properly received its data.
27.5.6.4
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
BF Status Flag
In Transmit mode, the BF bit in the SSPSTAT register
is set when the CPU writes to SSPBUF and is cleared
when all 8 bits are shifted out.
WCOL Status Flag
12.
13.
Typical Transmit Sequence:
The user generates a Start condition by setting
the SEN bit in the SSPCON2 register.
SSPIF is set by hardware on completion of the
Start.
SSPIF is cleared by software.
The MSSP module will wait the required start
time before any other operation takes place.
The user loads the SSPBUF with the slave
address to transmit.
Address is shifted out the SDA pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPBUF is written to.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit in the SSPCON2 register.
The MSSP module generates an interrupt at the
end of the 9th clock cycle by setting the SSPIF
bit.
The user loads the SSPBUF with 8 bits of data.
Data is shifted out the SDA pin until all 8 bits are
transmitted.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit in the SSPCON2 register.
Steps 8-11 are repeated for all transmitted data
bytes.
The user generates a Stop or Restart condition
by setting the PEN or RSEN bits in the
SSPCON2 register. Interrupt is generated once
the Stop/Restart condition is complete.
DS20005750A-page 199
ACKSTAT in
SSPCON2 = 1
Write SSPCON2 SEN = 1
From slave, clear ACKSTAT bit
SSPCON2
Transmitting Data or Second Half
of 10-bit Address
Start condition begins
SEN = 0
Transmit Address to Slave
SDA
A7
A6
A5
A4
A3
R/W = 0
A2
ACK = 0
A1
ACK
D7
D6
D5
D4
D3
D2
D1
D0
1
2
3
4
5
6
7
8
SSPBUF written with 7-bit address and R/W
start transmit
SCL
S
1
2
3
4
5
6
7
8
9
SCL held low
while CPU
responds to SSPIF
9
P
SSPIF
Cleared by software
Cleared by software service routine
from SSP interrupt
BF (SSPSTAT)
SSPBUF written
SEN
After Start condition, SEN cleared by hardware
2017 Microchip Technology Inc.
PEN
R/W
SSPBUF is written by software
Cleared by software
MCP19122/3
DS20005750A-page 200
I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
FIGURE 27-20:
MCP19122/3
27.5.7
I2C MASTER MODE RECEPTION
Master mode reception is enabled by programming the
Receive Enable (RCEN) bit in the SSPCON2 register.
27.5.7.4
1.
2.
Note:
The MSSP module must be in an idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
The Baud Rate Generator begins counting and, upon
each rollover, the state of the SCL pin changes
(high-to-low/low-to-high) and data is shifted into the
SSPSR. After the falling edge of the 8th clock, the
receive enable flag is automatically cleared, the
contents of the SSPSR are loaded into the SSPBUF,
the BF flag bit is set, the SSPIF flag bit is set and the
Baud Rate Generator is suspended from counting,
holding SCL low. The MSSP is now in idle state
awaiting the next command. When the buffer is read by
the CPU, the BF flag bit is automatically cleared. The
user can then send an Acknowledge bit at the end of
reception by setting the Acknowledge Sequence
Enable (ACKEN) bit in the SSPCON2 register.
27.5.7.1
BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSPBUF from SSPSR. It is
cleared when the SSPBUF register is read.
27.5.7.2
SSPOV Status Flag
In receive operation, the SSPOV bit is set when 8 bits
are received into the SSPSR and the BF flag bit is
already set from a previous reception.
27.5.7.3
WCOL Status Flag
If the user writes the SSPBUF when a receive is
already in progress (i.e., SSPSR is still shifting in a data
byte), the WCOL bit is set and the contents of the buffer
are unchanged (the write does not occur).
2017 Microchip Technology Inc.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
Typical Receive Sequence:
The user generates a Start condition by setting
the SEN bit in the SSPCON2 register.
SSPIF is set by hardware on completion of the
Start.
SSPIF is cleared by software.
User writes SSPBUF with the slave address to
transmit and the R/W bit set.
Address is shifted out the SDA pin until all 8 bits
are transmitted. Transmission begins as soon
as SSPBUF is written to.
The MSSP module shifts in the ACK bit from the
slave device and writes its value into the
ACKSTAT bit in the SSPCON2 register.
The MSSP module generates an interrupt at the
end of the 9th clock cycle by setting the SSPIF
bit.
User sets the RCEN bit in the SSPCON2 register
and the Master clocks in a byte from the slave.
After the 8th falling edge of SCL, SSPIF and BF
are set.
Master clears SSPIF and reads the received
byte from SSPUF, then clears BF.
Master sets ACK value sent to slave in ACKDT
bit in the SSPCON2 register and initiates the
ACK by setting the ACKEN bit.
Masters ACK is clocked out to the Slave and
SSPIF is set.
The user clears SSPIF.
Steps 8-13 are repeated for each received byte
from the slave.
Master sends a not ACK or Stop to end
communication.
DS20005750A-page 201
I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
Write to SSPCON2 to start Acknowledge
sequence SDA = ACKDT (SSPCON2) = 0
Write to SSPCON2
(SEN = 1),
ACK from Master
begin Start condition
Master configured as a receiver
SDA = ACKDT = 0
SEN = 0
by programming SSPCON2 (RCEN = 1)
Write to SSPBUF
RCEN = 1, start
RCEN cleared
ACK from Slave
occurs here, start XMIT
next receive
automatically
A7
A6 A5 A4 A3 A2
A1 R/W ACK
D7 D6 D5 D4 D3 D2 D1
RCEN cleared
automatically
PEN bit = 1 written here
Receiving Data from Slave
Receiving Data from Slave
SDA
Set ACKEN, start Acknowledge sequence
SDA = ACKDT = 1
ACK
D0
D7 D6 D5 D4 D3 D2 D1
D0
ACK
ACK is not sent
SCL
S
1
2
3
4
5
6
7
8
9
1
2 3
4
5
6
7
9
8
SSPIF
Cleared by software
Cleared by software
Cleared by software
BF
(SSPSTAT)
2
3
4
5 6
7
8
9
Data shifted in on falling edge of CLK Set SSPIF
Set SSPIF interrupt
at end of receive
at end of Acknowledge
sequence
Set SSPIF interrupt
at end of receive
SDA = 0, SCLx = 1
while CPU
responds to SSPxIR
1
Cleared by software
Cleared in
software
P
Bus master
terminates
transfer
Set SSPIF interrupt
at end of
Acknowledge
sequence
Set P bit
(SSPSTAT)
and SSPIF
Last bit is shifted into SSPSR and
contents are unloaded into SSPBUF
SSPOV
SSPOV is set because
SSPBUF is still full
ACKEN
2017 Microchip Technology Inc.
RCEN
Master configured as a receiver
by programming SSPCON2 (RCEN = 1)
RCEN cleared
automatically
ACK from Master
SDA = ACKDT = 0
RCEN cleared
automatically
MCP19122/3
DS20005750A-page 202
FIGURE 27-21:
MCP19122/3
27.5.8
ACKNOWLEDGE SEQUENCE
TIMING
27.5.9
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN, in the SSPCON2 register. At the end of a
receive/transmit, the SCL line is held low after the
falling edge of the 9th clock. When the PEN bit is set,
the master will assert the SDA line low. When the SDA
line is sampled low, the Baud Rate Generator is
reloaded and counts down to ‘0’. When the Baud Rate
Generator times out, the SCL pin will be brought high
and then, one TBRG (Baud Rate Generator rollover
count) later, the SDA pin will be deasserted. When the
SDA pin is sampled high while SCL is high, the P bit in
the SSPSTAT register, is set. A TBRG later, the PEN bit
is cleared and the SSPIF bit is set (Figure 27-23).
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable (ACKEN) bit in the
SSPCON2 register. When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to
generate an Acknowledge, then the ACKDT bit should
be cleared. If not, the user should set the ACKDT bit
before starting an Acknowledge sequence. The Baud
Rate Generator then counts for one rollover period
(TBRG) and the SCL pin is deasserted (pulled high).
When the SCL pin is sampled high (clock arbitration),
the Baud Rate Generator counts for TBRG. The SCL pin
is then pulled low. Following this, the ACKEN bit is
automatically cleared, the Baud Rate Generator is
turned off and the MSSP module then goes into Idle
mode (Figure 27-22).
27.5.8.1
STOP CONDITION TIMING
27.5.9.1
WCOL Status Flag
If the user writes the SSPBUF when a Stop sequence
is in progress, the WCOL bit is set and the contents of
the buffer are unchanged (the write does not occur).
WCOL Status Flag
If the user writes the SSPBUF when an Acknowledge
sequence is in progress, WCOL is set and the contents
of the buffer are unchanged (the write does not occur).
FIGURE 27-22:
ACKNOWLEDGE SEQUENCE WAVEFORM
Acknowledge sequence starts here,
write to SSPCON2
ACKEN = 1, ACKDT = 0
SDA
ACKEN automatically cleared
SCL
TBRG
TBRG
D0
ACK
8
9
SSPIF
SSPIF set at the end
of receive
Note:
TBRG = one Baud Rate Generator period.
FIGURE 27-23:
Cleared in
software
STOP CONDITION RECEIVE OR TRANSMIT MODE
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
after SDA sampled high. P bit (SSPSTAT) is set.
PEN bit (SSPCON2) is cleared by
hardware and the SSPIF bit is set
Write to SSPCON2,
set PEN
Falling edge of 9th clock
TBRG
SCL
SDA
ACK
TBRG
Note:
Cleared in
software
SSPIF set at the end
of Acknowledge sequence
P
TBRG
TBRG
SCL brought high after TBRG
TBRG = one Baud Rate Generator period.
2017 Microchip Technology Inc.
DS20005750A-page 203
MCP19122/3
27.5.10
SLEEP OPERATION
27.5.13
2
While in Sleep mode, the I C slave module can receive
addresses or data and, when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP interrupt is enabled).
27.5.11
EFFECTS OF A RESET
A Reset disables the MSSP module and terminates the
current transfer.
27.5.12
MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSPx module is disabled. Control of the I 2C bus may
be taken when the P bit in the SSPSTAT register is set
or the bus is idle, with both the S and P bits clear. When
the bus is busy, enabling the SSP interrupt will
generate the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCLIF bit.
The states where arbitration can be lost are:
•
•
•
•
•
Address Transfer
Data Transfer
A Start Condition
A Repeated Start Condition
An Acknowledge Condition
MULTI-MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA by letting SDA float high,
and another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA pin is
‘0’, a bus collision has taken place. The master will set
the Bus Collision Interrupt Flag (BCLIF) and reset the
I2C port to its Idle state (Figure 27-24).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSPBUF can be written to. When the user services the
bus collision Interrupt Service Routine and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDA and SCL
lines are deasserted and the respective control bits in
the SSPCON2 register are cleared. When the user
services the bus collision Interrupt Service Routine and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSPIF bit will be set.
A write to the SSPBUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the SSPSTAT
register, or the bus is idle and the S and P bits are
cleared.
FIGURE 27-24:
BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
Data changes
while SCL = 0
SDA line pulled low Sample SDA. While SCL is high,
by another source data does not match what is driven
by the master.
Bus collision has occurred.
SDA released
by master
SDA
SCL
Set Bus Collision
Interrupt (BCLIF)
BCLIF
DS20005750A-page 204
2017 Microchip Technology Inc.
MCP19122/3
27.5.13.1
Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a)
b)
SDA or SCL are sampled low at the beginning of
the Start condition (Figure 27-25)
SCL is sampled low before SDA is asserted low
(Figure 27-26)
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 27-27). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to zero; if the SCL pin is sampled as ‘0’
during this time, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
Note:
If the SDA pin is already low or the SCL pin is already
low, all of the following occur:
• the Start condition is aborted
• the BCLIF flag is set and
• the MSSP module is reset to its Idle state
(Figure 27-25)
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded and counts down. If the
SCL pin is sampled low while SDA is high, a bus
collision occurs because it is assumed that another
master is attempting to drive a data ‘1’ during the Start
condition.
FIGURE 27-25:
The reason why bus collision is not a
factor during a Start condition is that no
two bus masters can assert a Start
condition at the exact same time.
Therefore, one master will always assert
SDA before the other. This condition does
not cause a bus collision because the two
masters must be allowed to arbitrate the
first address following the Start condition.
If the address is the same, arbitration
must be allowed to continue into the data
portion, Repeated Start or Stop
conditions.
BUS COLLISION DURING A START CONDITION (SDA ONLY)
SDA goes low before the SEN bit is set.
Set BCLIF,
S bit and SSPIF set because
SDA = 0, SCL = 1.
SDA
SCL
Set SEN, enable Start condition
if SDA = 1, SCL = 1
SEN
BCLIF
SEN cleared automatically because of bus
collision.
SSP module reset into Idle state.
SDA sampled low before Start condition.
Set BCLIF. S bit and SSPIF set because
SDA = 0, SCL = 1.
SSPIF and BCLIF
are cleared by software
S
SSPIF
SSPIF and BCLIF
are cleared by software
2017 Microchip Technology Inc.
DS20005750A-page 205
MCP19122/3
FIGURE 27-26:
BUS COLLISION DURING A START CONDITION (SCL = 0)
SDA = 0, SCL = 1
TBRG
TBRG
SDA
SCL
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
SCL = 0 before SDA = 0,
bus collision occurs. Set BCLIF.
SEN
SCL = 0 before BRG time out,
bus collision occurs. Set BCLIF.
BCLIF
S
‘0’
SSPIF
‘0’
FIGURE 27-27:
Interrupt cleared
by software
‘0’
‘0’
BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA = 0, SCL = 1
Set S
Less than Tbrg
T
Set SSPIF
BRG
SDA
SDA pulled low by other master.
Reset BRG and assert SDAx.
SCL
s
SCLx pulled low after BRG
time out
SEN
BCLIF
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
‘0’
S
SSPIF
DS20005750A-page 206
SDAx = 0, SCL = 1,
set SSPIF
Interrupts cleared
by software
2017 Microchip Technology Inc.
MCP19122/3
27.5.13.2
Bus Collision During a Repeated
Start Condition
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’; see
Figure 27-28). If SDA is sampled high, the BRG is
reloaded and begins counting. If SDA goes from high to
low before the BRG times out, no bus collision occurs
because no two masters can assert SDA at exactly the
same time.
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
A low level is sampled on SDA when SCL goes
from low level to high level
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’
If SCL goes from high to low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(refer to Figure 27-29).
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to zero. The SCL pin is then deasserted and,
when sampled high, the SDA pin is sampled.
FIGURE 27-28:
If, at the end of the BRG time out, both SCL and SDA are
still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is complete.
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
SDA
SCL
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
RSEN
BCLIF
Cleared by software
‘0’
S
‘0’
SSPIF
FIGURE 27-29:
BUS COLLISION DURING A REPEATED START CONDITION (CASE 2)
TBRG
TBRG
SDA
SCL
BCLIF
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
RSEN
Interrupt cleared
by software
S
‘0’
SSPIF
‘0’
2017 Microchip Technology Inc.
DS20005750A-page 207
MCP19122/3
27.5.13.3
Bus Collision During a Stop
Condition
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSPADD and
counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 27-30). If the SCL pin is sampled
low before SDA is allowed to float high, a bus collision
occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 27-31).
Bus collision occurs during a Stop condition if:
a)
b)
After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out.
After the SCL pin is deasserted, SCL is sampled
low before SDA goes high.
FIGURE 27-30:
BUS COLLISION DURING A STOP CONDITION (CASE 1)
TBRG
TBRG
SDA sampled
low after TBRG,
set BCLIF
TBRG
SDA
SCL
SDA asserted low
PEN
BCLIF
P
‘0’
SSPIF
‘0’
FIGURE 27-31:
BUS COLLISION DURING A STOP CONDITION (CASE 2)
TBRG
SDA
Assert SDA
TBRG
TBRG
SCL goes low before SDA goes high,
set BCLIF
SCL
PEN
BCLIF
P
‘0’
SSPIF
‘0’
DS20005750A-page 208
2017 Microchip Technology Inc.
MCP19122/3
TABLE 27-2:
SUMMARY OF REGISTERS ASSOCIATED WITH I2C OPERATION
Name
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
Reset
Values
on
Page:
INTCON
GIE
PEIE
T0IE
INTE
IOCE
T0IF
INTF
IOCF
102
PIE1
TXIE
RCIE
BCLIE
SSPIE
CC2IE
CC1IE
TMR2IE
TMR1IE
103
TXIF
RCIF
BCLIF
SSPIF
CC2IF
CC1IF
TMR2IF
TMR1IF
105
TRISGPA
PIR1
TRISA7
TRISA6
TRISA5
—
TRISA3
TRISA2
TRISA1
TRISA0
119
TRISGPB
TRISB7
TRISB6
TRISB5
TRISB4
—
—
TRISB1
TRISB0
125
SSPADD
ADD7
ADD6
ADD5
ADD4
ADD3
ADD2
ADD1
ADD0
215
WCOL
SSPOV
SSPEN
CKP
SSPCON2
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
SSPCON3
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
SSPMSK1
MSK7
MSK6
MSK5
MSK4
MSK3
MSK2
SSPSTAT
SMP
CKE
D/A
P
S
R/W
SSPMSK2
MSK27
MSK26
MSK25
MSK24
MSK23
SSPADD2
ADD27
ADD26
ADD25
ADD24
ADD23
SSPBUF
SSPCON1
Synchronous Serial Port Receive Buffer/Transmit Register
SSPM3
SSPM2
175*
SSPM1
SSPM0
212
RSEN
SEN
213
AHEN
DHEN
214
MSK1
MSK0
215
UA
BF
211
MSK22
MSK21
MSK20
216
ADD22
ADD21
ADD20
216
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the MSSP module in I
* Page provides register information.
2017 Microchip Technology Inc.
2C
mode.
DS20005750A-page 209
MCP19122/3
27.6
Baud Rate Generator
The MSSP module has a Baud Rate Generator
available for clock generation in the I2C Master mode.
The Baud Rate Generator (BRG) reload value is placed
in the SSPADD register. When a write occurs to
SSPBUF, the Baud Rate Generator will automatically
begin counting down.
Once the given operation is complete, the internal clock
will automatically stop counting and the clock pin will
remain in its last state.
An internal signal “Reload” in Figure 27-32 triggers the
value from SSPADD to be loaded into the BRG counter.
This occurs twice for each oscillation of the module
clock line. The logic dictating when the reload signal is
asserted depends on the mode the MSSP is being
operated in.
Table 27-3 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSPADD.
EQUATION 27-1:
FOSC
F CLOCK = --------------------------------------------- SSPADD + 1 4
FIGURE 27-32:
BAUD RATE GENERATOR BLOCK DIAGRAM
SSPM
SSPM
SCL
Reload
Control
SSPCLK
Note:
Reload
BRG Down Counter
FOSC/2
Values of 0x00, 0x01 and 0x02 are not
valid for SSPADD when used as a Baud
Rate Generator for I2C. This is an
implementation limitation.
TABLE 27-3:
Note 1:
SSPADD
MSSP CLOCK RATE W/BRG
FOSC
FCY
BRG Value
FCLOCK
(2 Rollovers of BRG)
8 MHz
2 MHz
04h
400 kHz(1)
8 MHz
2 MHz
0Bh
166 kHz
8 MHz
2 MHz
13h
100 kHz
The I2C interface does not conform to the 400 kHz I2C specification (which applies to rates greater than
100 kHz) in all details, but may be used with care where higher rates are required by the application.
DS20005750A-page 210
2017 Microchip Technology Inc.
MCP19122/3
REGISTER 27-1:
SSPSTAT: SSP STATUS REGISTER
R/W-0
R/W-0
R-0
R-0
R-0
R-0
R-0
R-0
SMP
CKE
D/A
P
S
R/W
UA
BF
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
SMP: Data Input Sample bit
1 = Slew rate control disabled for standard-speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high-speed mode (400 kHz)
bit 6
CKE: Clock Edge Select bit
1 = Enable input logic so that thresholds are compliant with SM bus specification
0 = Disable SM bus specific inputs
bit 5
D/A: Data/Address bit
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4
P: Stop bit
(This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0 = Stop bit was not detected last
bit 3
S: Start bit
(This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2
R/W: Read/Write bit information
This bit holds the R/W bit information following the last address match. This bit is only valid from the
address match to the next Start bit, Stop bit, or not ACK bit.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode.
bit 1
UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0
BF: Buffer Full status bit
Receive:
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit:
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
2017 Microchip Technology Inc.
DS20005750A-page 211
MCP19122/3
REGISTER 27-2:
SSPCON1: SSP CONTROL REGISTER 1
R/C/HS-0
R/C/HS-0
R/W-0
R/W-0
WCOL
SSPOV
SSPEN
CKP
R/W-0
R/W-0
R/W-0
R/W-0
SSPM
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
HS = Bit is set by hardware
C = User cleared
bit 7
WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSPBUF register was attempted while the I2C conditions were not valid for a
transmission to be started
0 = No collision
Slave mode:
1 = The SSPBUF register is written while it is still transmitting the previous word (must be cleared in
software)
0 = No collision
bit 6
SSPOV: Receive Overflow Indicator bit(1)
1 = A byte is received while the SSPBUF register is still holding the previous byte. SSPOV is a “don’t
care” in Transmit mode (must be cleared in software).
0 = No overflow
bit 5
SSPEN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port
pins(2)
0 = Disables serial port and configures these pins as I/O port pins
bit 4
CKP: Clock Polarity Select bit
In I2 C Slave mode: SCL release control
1 = Enable clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
In I2 C Master mode: Unused in this mode
bit 3-0
SSPM: Synchronous Serial Port Mode Select bits
0000 = Reserved
0001 = Reserved
0010 = Reserved
0011 = Reserved
0100 = Reserved
0101 = Reserved
0110 = I2C Slave mode, 7-bit address
0111 = I2C Slave mode, 10-bit address
1000 = I2C Master mode, clock = FOSC/(4 * (SSPADD+1))(3)
1001 = Reserved
1010 = Reserved
1011 = I2C Firmware-Controlled Master mode (Slave idle)
1100 = Reserved
1101 = Reserved
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
Note 1:
2:
3:
In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by
writing to the SSPBUF register.
When enabled, the SDA and SCL pins must be configured as inputs.
SSPADD values of 0, 1 or 2 are not supported for I2C mode.
DS20005750A-page 212
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MCP19122/3
REGISTER 27-3:
SSPCON2: SSP CONTROL REGISTER 2
R/W-0/0
R-0/0
R/W-0/0
R/S/HS-0/0
R/S/HS-0/0
R/S/HS-0/0
R/S/HS-0/0
R/W/HS-0/0
GCEN
ACKSTAT
ACKDT
ACKEN
RCEN
PEN
RSEN
SEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
H = Bit is set by hardware
S = User set
bit 7
GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSPSR register
0 = General call address disabled
bit 6
ACKSTAT: Acknowledge Status bit (in I2C mode only)
1 = Acknowledge was not received
0 = Acknowledge was received
bit 5
ACKDT: Acknowledge Data bit (in I2C mode only)
In Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowledge
0 = Acknowledge
bit 4
ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins and transmit ACKDT data bit. Automatically
cleared by hardware.
0 = Acknowledge sequence idle
bit 3
RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2
PEN: Stop Condition Enable bit (in I2C Master mode only)
SCK Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition idle
bit 1
RSEN: Repeated Start Condition Enabled bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition idle
bit 0
SEN: Start Condition Enabled bit (in I2C Master mode only)
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition idle
In Slave mode:
1 = Clock stretching is enabled for both Slave Transmit and Slave Receive (stretch enabled)
0 = Clock stretching is disabled
Note 1:
For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSPBUF may not be written (or writes to the SSPBUF are disabled).
2017 Microchip Technology Inc.
DS20005750A-page 213
MCP19122/3
REGISTER 27-4:
SSPCON3: SSP CONTROL REGISTER 3
R-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
R/W-0/0
ACKTIM
PCIE
SCIE
BOEN
SDAHT
SBCDE
AHEN
DHEN
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
ACKTIM: Acknowledge Time status bit (I2C mode only)(2)
1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8th falling edge of SCL clock
0 = Not an Acknowledge sequence, cleared on 9th rising edge of SCL clock
bit 6
PCIE: Stop Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Stop condition
0 = Stop detection interrupts are disabled(1)
bit 5
SCIE: Start Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Start or Restart conditions
0 = Start detection interrupts are disabled(1)
bit 4
BOEN: Buffer Overwrite Enable bit
In I2C Master mode:
This bit is ignored.
In I2C Slave mode:
1 = SSPBUF is updated and ACK is generated for a received address/data byte, ignoring the state of
the SSPOV bit only if the BF bit = 0.
0 = SSPBUF is only updated when SSPOV is clear.
bit 3
SDAHT: SDA Hold Time Selection bit
1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL
0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL
bit 2
SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only)
If, on the rising edge of SCL, SDA is sampled low when the module outputs a high state, the BCLIF bit
in the PIR1 register is set and bus goes idle.
1 = Enable slave bus collision interrupts
0 = Slave bus collision interrupts are disabled
bit 1
AHEN: Address Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit in the
SSPCON1 register will be cleared and the SCL will be held low.
0 = Address holding is disabled
bit 0
DHEN: Data Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit
in the SSPCON1 register and SCL is held low.
0 = Data holding is disabled
Note 1:
2:
This bit has no effect in Slave modes where Start and Stop condition detection is explicitly listed as
enabled.
The ACKTIM status bit is only active when the AHEN bit or DHEN bit is set.
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MCP19122/3
REGISTER 27-5:
R/W-1
SSPMSK1: SSP MASK REGISTER 1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
MSK
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-1
MSK: Mask bits
1 = The received address bit n is compared to SSPADD to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0
MSK: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPM = 0111 or 1111):
1 = The received address bit 0 is compared to SSPADD to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address,
the bit is ignored
REGISTER 27-6:
R/W-0
SSPADD: MSSP ADDRESS AND BAUD RATE REGISTER 1
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADD
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
Master mode:
bit 7-0
ADD: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD + 1) * 4)/FOSC
10-Bit Slave mode — Most Significant Address byte:
bit 7-3
Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1
ADD: Two Most Significant bits of 10-bit address.
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode — Least Significant Address byte:
bit 7-0
ADD: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1
ADD: 7-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
2017 Microchip Technology Inc.
DS20005750A-page 215
MCP19122/3
REGISTER 27-7:
R/W-1
SSPMSK2: SSP MASK REGISTER 2
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
R/W-1
MSK2
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-1
MSK2: Mask bits
1 = The received address bit n is compared to SSPADD2 to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0
MSK2: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSPM = 0111 or 1111):
1 = The received address bit 0 is compared to SSPADD2 to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match I2C Slave mode, 7-bit address,
the bit is ignored
REGISTER 27-8:
R/W-0
SSPADD2: MSSP ADDRESS 2
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
R/W-0
ADD2
bit 7
bit 0
Legend:
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
u = Bit is unchanged
x = Bit is unknown
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
Master mode:
bit 7-0
ADD2: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD + 1) * 4)/FOSC
10-Bit Slave mode — Most Significant Address byte:
bit 7-3
Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1
ADD2: Two Most Significant bits of 10-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
10-Bit Slave mode — Least Significant Address byte:
bit 7-0
ADD2: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1
ADD2: 7-bit address
bit 0
Not used: Unused in this mode. Bit state is a “don’t care”.
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MCP19122/3
28.0
INSTRUCTION SET SUMMARY
The MCP19122/3 instruction set is highly orthogonal
and comprises three basic categories:
• Byte-oriented operations
• Bit-oriented operations
• Literal and control operations
Each instruction is a 14-bit word divided into an
opcode, which specifies the instruction type, and one
or more operands, which further specify the operation
of the instruction. The formats for each of the
categories is presented in Figure 28-1, while the
various opcode fields are summarized in Table 28-1.
Table 28-2 lists the instructions recognized by the
MPASMTM assembler.
For byte-oriented instructions, ‘f’ represents a file
register designator and ‘d’ represents a destination
designator. The file register designator specifies which
file register is to be used by the instruction.
The destination designator specifies where the result of
the operation is to be placed. If ‘d’ is zero, the result is
placed in the W register. If ‘d’ is one, the result is placed
in the file register specified in the instruction.
For bit-oriented instructions, ‘b’ represents a bit field
designator, which selects the bit affected by the
operation, while ‘f’ represents the address of the file in
which the bit is located.
For literal and control operations, ‘k’ represents an
8-bit or 11-bit constant, or literal value.
One instruction cycle consists of four oscillator periods;
for an oscillator frequency of 4 MHz, this gives a normal
instruction execution time of 1 µs. All instructions are
executed within a single instruction cycle, unless a
conditional test is true, or the program counter is
changed as a result of an instruction. When this occurs,
the execution takes two instruction cycles, with the
second cycle executed as a NOP.
TABLE 28-1:
OPCODE FIELD
DESCRIPTIONS
Field
f
Description
Register file address (0x00 to 0x7F)
W
Working register (accumulator)
b
Bit address within an 8-bit file register
k
Literal field, constant data or label
x
Don’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
d
Destination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
PC
Program Counter
TO
Time-Out bit
C
DC
Z
PD
Carry bit
Digit carry bit
Zero bit
Power-Down bit
FIGURE 28-1:
GENERAL FORMAT FOR
INSTRUCTIONS
Byte-Oriented file register operations
13
8 7 6
OPCODE
d
f (FILE #)
0
d = 0 for destination W
d = 1 for destination f
f = 7-bit file register address
Bit-Oriented file register operations
13
10 9
7 6
OPCODE
b (BIT #)
f (FILE #)
0
b = 3-bit bit address
f = 7-bit file register address
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
Literal and control operations
28.1
Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (RMW)
operation. The register is read, the data is modified,
and the result is stored according to either the
instruction or the destination designator ‘d’. A read
operation is performed on a register even if the
instruction writes to that register.
For example, a CLRF PORTA instruction will read
PORTGPA, clear all the data bits, then write the result
back to PORTGPA. This example would have the
unintended consequence of clearing the condition that
set the IOCF flag.
2017 Microchip Technology Inc.
General
13
8
7
OPCODE
0
k (literal)
k = 8-bit immediate value
CALL and GOTO instructions only
13
11
OPCODE
10
0
k (literal)
k = 11-bit immediate value
DS20005750A-page 217
MCP19122/3
TABLE 28-2:
MCP19122/3 INSTRUCTION SET
14-Bit Opcode
Mnemonic,
Operands
Description
Cycles
MSb
LSb
Status
Notes
Affected
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ANDWF
CLRF
CLRW
COMF
DECF
DECFSZ
INCF
INCFSZ
IORWF
MOVF
MOVWF
NOP
RLF
RRF
SUBWF
SWAPF
XORWF
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
Add W and f
AND W with f
Clear f
Clear W
Complement f
Decrement f
Decrement f, Skip if 0
Increment f
Increment f, Skip if 0
Inclusive OR W with f
Move f
Move W to f
No Operation
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1(2)
1
1(2)
1
1
1
1
1
1
1
1
1
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
00
0111
0101
0001
0001
1001
0011
1011
1010
1111
0100
1000
0000
0000
1101
1100
0010
1110
0110
dfff
dfff
lfff
0xxx
dfff
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0xx0
dfff
dfff
dfff
dfff
dfff
1, 2
ffff C, DC, Z
Z
1, 2
ffff
Z
2
ffff
Z
xxxx
ffff
Z
1, 2
ffff
Z
1, 2
ffff
1, 2, 3
ffff
Z
1, 2
ffff
1, 2, 3
ffff
Z
1, 2
ffff
Z
1, 2
ffff
0000
ffff
C
1, 2
ffff
C
1, 2
ffff C, DC, Z
1, 2
ffff
1, 2
ffff
Z
1, 2
bfff
bfff
bfff
bfff
ffff
ffff
ffff
ffff
kkkk
kkkk
kkkk
0110
kkkk
kkkk
kkkk
0000
kkkk
0000
0110
kkkk
kkkk
kkkk C, DC, Z
kkkk
Z
kkkk
0100 TO, PD
kkkk
Z
kkkk
kkkk
1001
kkkk
1000
0011 TO, PD
kkkk C, DC, Z
Z
kkkk
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
BTFSC
BTFSS
f, b
f, b
f, b
f, b
Bit Clear f
Bit Set f
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1
1
1 (2)
1 (2)
01
01
01
01
00bb
01bb
10bb
11bb
1, 2
1, 2
3
3
LITERAL AND CONTROL OPERATIONS
ADDLW
ANDLW
CALL
CLRWDT
GOTO
IORLW
MOVLW
RETFIE
RETLW
RETURN
SLEEP
SUBLW
XORLW
Note 1:
2:
3:
k
k
k
–
k
k
k
–
k
–
–
k
k
Add literal and W
AND literal with W
Call Subroutine
Clear Watchdog Timer
Go to address
Inclusive OR literal with W
Move literal to W
Return from interrupt
Return with literal in W
Return from Subroutine
Go into Standby mode
Subtract W from literal
Exclusive OR literal with W
1
1
2
1
2
1
1
2
2
2
1
1
1
11
11
10
00
10
11
11
00
11
00
00
11
11
111x
1001
0kkk
0000
1kkk
1000
00xx
0000
01xx
0000
0000
110x
1010
When an I/O register is modified as a function of itself (e.g., MOVF PORTA, 1), the value used will be that
value present on the pins themselves. For example, if the data latch is ‘1’ for a pin configured as input and
is driven low by an external device, the data will be written back with a ‘0’.
If this instruction is executed on the TMR0 register (and where applicable, d = 1), the prescaler will be
cleared if assigned to the Timer0 module.
If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles.
The second cycle is executed as a NOP.
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MCP19122/3
28.2
Instruction Descriptions
ADDLW
Add literal and W
Syntax:
[ label ] ADDLW
Operands:
0 k 255
Operation:
(W) + k (W)
Status Affected:
Description:
BCF
k
Bit Clear f
Syntax:
[ label ] BCF
Operands:
0 f 127
0b7
C, DC, Z
Operation:
0 (f)
The contents of the W register
are added to the eight-bit literal ‘k’
and the result is placed in the
W register.
Status Affected:
None
Description:
Bit ‘b’ in register ‘f’ is cleared.
ADDWF
Add W and f
BSF
Bit Set f
Syntax:
[ label ] ADDWF
Syntax:
[ label ] BSF
Operands:
0 f 127
d 0,1
Operands:
0 f 127
0b7
Operation:
(W) + (f) (destination)
Operation:
1 (f)
Status Affected:
C, DC, Z
Status Affected:
None
Description:
Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If
‘d’ is ‘1’, the result is stored back
in register ‘f’.
Description:
Bit ‘b’ in register ‘f’ is set.
ANDLW
AND literal with W
BTFSC
Bit Test f, Skip if Clear
Syntax:
[ label ] ANDLW
Syntax:
[ label ] BTFSC f,b
Operands:
0 k 255
Operands:
Operation:
(W) .AND. (k) (W)
0 f 127
0b7
Status Affected:
Z
Operation:
skip if (f) = 0
Description:
The contents of W register are
AND’ed with the eight-bit literal
‘k’. The result is placed in the W
register.
Status Affected:
None
Description:
ANDWF
AND W with f
If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is discarded, and a NOP
is executed instead, making this a
two-cycle instruction.
Syntax:
[ label ] ANDWF
Operands:
0 f 127
d 0,1
Operation:
(W) .AND. (f) (destination)
Status Affected:
Z
Description:
AND the W register with register
‘f’. If ‘d’ is ‘0’, the result is stored in
the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
2017 Microchip Technology Inc.
f,d
k
f,b
f,b
f,d
DS20005750A-page 219
MCP19122/3
BTFSS
Bit Test f, Skip if Set
CLRWDT
Clear Watchdog Timer
Syntax:
[ label ] BTFSS f,b
Syntax:
[ label ] CLRWDT
Operands:
0 f 127
0b