MCP3004/3008
2.7V 4-Channel/8-Channel 10-Bit A/D Converters
with SPI Serial Interface
Features
Description
•
•
•
•
•
The Microchip Technology Inc. MCP3004/3008
devices are successive approximation 10-bit Analogto-Digital (A/D) converters with on-board sample and
hold circuitry. The MCP3004 is programmable to
provide two pseudo-differential input pairs or four
single-ended inputs. The MCP3008 is programmable
to provide four pseudo-differential input pairs or eight
single-ended inputs. Differential Nonlinearity (DNL)
and Integral Nonlinearity (INL) are specified at ±1 LSB.
Communication with the devices is accomplished using
a simple serial interface compatible with the SPI
protocol. The devices are capable of conversion rates
of up to 200 ksps. The MCP3004/3008 devices operate
over a broad voltage range (2.7V - 5.5V). Low-current
design permits operation with typical standby currents
of only 5 nA and typical active currents of 320 µA. The
MCP3004 is offered in 14-pin PDIP, 150 mil SOIC and
TSSOP packages, while the MCP3008 is offered in 16pin PDIP and SOIC packages.
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•
•
•
•
•
•
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•
10-bit resolution
± 1 LSB max DNL
± 1 LSB max INL
4 (MCP3004) or 8 (MCP3008) input channels
Analog inputs programmable as single-ended or
pseudo-differential pairs
On-chip sample and hold
SPI serial interface (modes 0,0 and 1,1)
Single supply operation: 2.7V - 5.5V
200 ksps max. sampling rate at VDD = 5V
75 ksps max. sampling rate at VDD = 2.7V
Low power CMOS technology
5 nA typical standby current, 2 µA max.
500 µA max. active current at 5V
Industrial temp range: -40°C to +85°C
Available in PDIP, SOIC and TSSOP packages
Applications
Package Types
Sensor Interface
Process Control
Data Acquisition
Battery Operated Systems
PDIP, SOIC, TSSOP
Functional Block Diagram
VDD VSS
VREF
CH0
CH1
CH0
CH1
CH2
CH3
NC
NC
DGND
1
2
3
4
5
6
7
MCP3004
•
•
•
•
14
13
12
11
10
9
8
VDD
VREF
AGND
CLK
DOUT
DIN
CS/SHDN
PDIP, SOIC
Input
Channel
Max
DAC
Comparator
10-Bit SAR
Sample
and
Hold
Control Logic
CS/SHDN DIN CLK
Shift
Register
1
2
3
4
5
6
7
8
MCP3008
CH7*
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
16
15
14
13
12
11
10
9
VDD
VREF
AGND
CLK
DOUT
DIN
CS/SHDN
DGND
DOUT
* Note: Channels 4-7 are available on MCP3008 Only
© 2008 Microchip Technology Inc.
DS21295D-page 1
MCP3004/3008
NOTES:
DS21295D-page 2
© 2008 Microchip Technology Inc.
MCP3004/3008
1.0
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VDD ..................................................................................7.0V
All Inputs and Outputs w.r.t. VSS ............– 0.6V to VDD + 0.6V
Storage Temperature ................................... –65°C to +150°C
Ambient temperature with power applied.......–65°C to +150°C
Soldering temperature of leads (10 seconds) ............. +300°C
ESD Protection On All Pins (HBM) ...................................≥ 4 kV
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25°C.
Parameter
Sym
Min
Typ
Max
Units
tCONV
—
—
10
clock
cycles
Conditions
Conversion Rate
Conversion Time
Analog Input Sample Time
tSAMPLE
Throughput Rate
fSAMPLE
1.5
—
—
clock
cycles
200
75
ksps
ksps
VDD = VREF = 5V
VDD = VREF = 2.7V
DC Accuracy
Resolution
10
bits
Integral Nonlinearity
INL
—
±0.5
±1
LSB
Differential Nonlinearity
DNL
—
±0.25
±1
LSB
Offset Error
—
—
±1.5
LSB
Gain Error
—
—
±1.0
LSB
Total Harmonic Distortion
—
-76
dB
VIN = 0.1V to 4.9V@1 kHz
Signal-to-Noise and Distortion
(SINAD)
—
61
dB
VIN = 0.1V to 4.9V@1 kHz
Spurious Free Dynamic Range
—
78
dB
VIN = 0.1V to 4.9V@1 kHz
No missing codes over
temperature
Dynamic Performance
Reference Input
Voltage Range
0.25
—
VDD
V
Note 2
Current Drain
—
100
0.001
150
3
µA
µA
CS = VDD = 5V
V
Analog Inputs
Input Voltage Range for CH0 or
CH1 in Single-Ended Mode
VSS
—
VREF
Input Voltage Range for IN+ in
pseudo-differential mode
Input Voltage Range for IN- in
pseudo-differential mode
IN-
—
VREF+IN-
VSS-100
—
VSS+100
mV
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock
Speed”, “Maintaining Minimum Clock Speed”, for more information.
© 2008 Microchip Technology Inc.
DS21295D-page 3
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25°C.
Parameter
Sym
Min
Typ
Max
Units
—
0.001
±1
µA
Switch Resistance
—
1000
—
Ω
See Figure 4-1
Sample Capacitor
—
20
—
pF
See Figure 4-1
—
—
V
—
0.3 VDD
V
V
Leakage Current
Conditions
Digital Input/Output
Data Coding Format
Straight Binary
High Level Input Voltage
VIH
Low Level Input Voltage
VIL
High Level Output Voltage
VOH
4.1
—
—
Low Level Output Voltage
VOL
—
—
0.4
V
IOL = 1 mA, VDD = 4.5V
ILI
-10
—
10
µA
VIN = VSS or VDD
Input Leakage Current
Output Leakage Current
0.7 VDD
IOH = -1 mA, VDD = 4.5V
ILO
-10
—
10
µA
VOUT = VSS or VDD
CIN,
COUT
—
—
10
pF
VDD = 5.0V (Note 1)
TA = 25°C, f = 1 MHz
fCLK
—
—
3.6
1.35
MHz
MHz
VDD = 5V (Note 3)
VDD = 2.7V (Note 3)
Clock High Time
tHI
125
—
—
ns
Clock Low Time
tLO
125
—
—
ns
CS Fall To First Rising CLK Edge
tSUCS
100
—
—
ns
CS Fall To Falling CLK Edge
tCSD
—
—
0
ns
Data Input Setup Time
tSU
50
—
—
ns
Data Input Hold Time
tHD
50
—
—
ns
CLK Fall To Output Data Valid
tDO
—
—
125
200
ns
ns
VDD = 5V, See Figure 1-2
VDD = 2.7V, See Figure 1-2
CLK Fall To Output Enable
tEN
—
—
125
200
ns
ns
VDD = 5V, See Figure 1-2
VDD = 2.7V, See Figure 1-2
CS Rise To Output Disable
tDIS
—
—
100
ns
See Test Circuits, Figure 1-2
CS Disable Time
tCSH
270
—
—
ns
DOUT Rise Time
tR
—
—
100
ns
See Test Circuits, Figure 1-2
(Note 1)
DOUT Fall Time
tF
—
—
100
ns
See Test Circuits, Figure 1-2
(Note 1)
Pin Capacitance
(All Inputs/Outputs)
Timing Parameters
Clock Frequency
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock
Speed”, “Maintaining Minimum Clock Speed”, for more information.
DS21295D-page 4
© 2008 Microchip Technology Inc.
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40°C to +85°C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25°C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Operating Voltage
VDD
2.7
—
5.5
V
Operating Current
IDD
—
425
225
550
µA
VDD = VREF = 5V,
DOUT unloaded
VDD = VREF = 2.7V,
DOUT unloaded
Standby Current
IDDS
—
0.005
2
µA
CS = VDD = 5.0V
Power Requirements
Note 1: This parameter is established by characterization and not 100% tested.
2: See graphs that relate linearity performance to VREF levels.
3: Because the sample cap will eventually lose charge, effective clock rates below 10 kHz can affect linearity
performance, especially at elevated temperatures. See Section 6.2 “Maintaining Minimum Clock
Speed”, “Maintaining Minimum Clock Speed”, for more information.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+85
°C
Operating Temperature Range
TA
-40
—
+85
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 14L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
—
108
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—
100
—
°C/W
Thermal Resistance, 16L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 16L-SOIC
θJA
—
90
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
TCSH
CS
TSUCS
THI TLO
CLK
TSU
DIN
THD
MSB IN
TEN
DOUT
FIGURE 1-1:
TR
TDO
NULL BIT
MSB OUT
TF
TDIS
LSB
Serial Interface Timing.
© 2008 Microchip Technology Inc.
DS21295D-page 5
MCP3004/3008
Test Point
1.4V
VDD
3 kΩ
Test Point
VDD/2
3 kΩ
DOUT
DOUT
100 pF
CL = 100 pF
tEN Waveform
tDIS Waveform 1
VSS
Voltage Waveforms for tR, tF
tDIS Waveform 2
Voltage Waveforms for tEN
VOH
VOL
DOUT
tF
tR
Voltage Waveforms for tDO
CS
1
CLK
2
3
B9
DOUT
CLK
tEN
tDO
Voltage Waveforms for tDIS
DOUT
CS
FIGURE 1-2:
4
Load Circuit for tR, tF, tDO.
VIH
DOUT
Waveform 1*
90%
TDIS
DOUT
Waveform 2†
*
†
Waveform 1 is for an output with internal
conditions such that the output is high,
unless disabled by the output control.
Waveform 2 is for an output with internal
conditions such that the output is low,
unless disabled by the output control.
FIGURE 1-3:
DS21295D-page 6
10%
Load circuit for tDIS and tEN.
© 2008 Microchip Technology Inc.
MCP3004/3008
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note:
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
1.0
1.0
0.8
0.6
0.4
0.4
Positive INL
0.2
INL (LSB)
INL (LSB)
VDD = VREF = 2.7 V
0.8
0.6
0.0
-0.2
Negative INL
-0.4
Positive INL
0.2
0.0
-0.2
Negative INL
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
25
50
75
100
125
150
175
200
225
250
0
25
Sample Rate (ksps)
FIGURE 2-1:
vs. Sample Rate.
50
75
100
Sample Rate (ksps)
Integral Nonlinearity (INL)
FIGURE 2-4:
Integral Nonlinearity (INL)
vs. Sample Rate (VDD = 2.7V).
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.8
0.6
INL(LSB)
INL(LSB)
1.0
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Positive INL
0.4
Positive INL
0.2
0.0
-0.2
Negative INL
-0.4
Negative INL
-0.6
-0.8
-1.0
0
1
2
3
4
5
0.0
6
0.5
1.0
VREF (V)
FIGURE 2-2:
vs. VREF.
Integral Nonlinearity (INL)
2.0
2.5
3.0
FIGURE 2-5:
Integral Nonlinearity (INL)
vs. VREF (VDD = 2.7V).
0.5
0.5
VDD = VREF = 5 V
fSAMPLE = 200 ksps
0.4
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.4
0.3
0.3
0.2
0.2
INL (LSB)
INL (LSB)
1.5
VREF (V)
0.1
0.0
-0.1
0.1
0.0
-0.1
-0.2
-0.2
-0.3
-0.3
-0.4
-0.4
-0.5
-0.5
0
128
256
384
512
640
768
896
1024
Digital Code
FIGURE 2-3:
Integral Nonlinearity (INL)
vs. Code (Representative Part).
© 2008 Microchip Technology Inc.
0
128
256
384
512
640
768
896
1024
Digital Code
FIGURE 2-6:
Integral Nonlinearity (INL)
vs. Code (Representative Part, VDD = 2.7V).
DS21295D-page 7
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
0.6
0.6
0.4
0.4
INL (LSB)
INL (LSB)
Positive INL
0.2
0.0
-0.2
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
Positive INL
0.2
0.0
Negative INL
-0.2
Negative INL
-0.4
-0.4
-0.6
-0.6
-50
-25
0
25
50
75
-50
100
-25
0
FIGURE 2-7:
vs. Temperature.
25
50
75
100
Temperature (°C)
Temperature (°C)
Integral Nonlinearity (INL)
FIGURE 2-10:
Integral Nonlinearity (INL)
vs. Temperature (VDD = 2.7V).
0.6
0.6
VDD = VREF = 2.7 V
0.4
0.2
DNL (LSB)
DNL (LSB)
0.4
Positive DNL
0.0
Negative DNL
-0.2
0.2
Positive DNL
0.0
Negative DNL
-0.2
-0.4
-0.4
-0.6
-0.6
0
25
50
75
100
125
150
175
200
225
0
250
25
Sample Rate (ksps)
FIGURE 2-8:
Differential Nonlinearity
(DNL) vs. Sample Rate.
0.8
0.8
0.6
0.2
0.0
Negative DNL
-0.4
0.0
-0.2
-0.6
-0.8
1
2
3
4
VREF (V)
FIGURE 2-9:
(DNL) vs. VREF.
DS21295D-page 8
Differential Nonlinearity
5
Negative DNL
-0.4
-0.8
-1.0
Positive DNL
0.2
-0.6
0
100
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.4
Positive DNL
DNL (LSB)
DNL (LSB)
0.6
-0.2
75
FIGURE 2-11:
Differential Nonlinearity
(DNL) vs. Sample Rate (VDD = 2.7V).
1.0
0.4
50
Sample Rate (ksps)
-1.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VREF(V)
FIGURE 2-12:
Differential Nonlinearity
(DNL) vs. VREF (VDD = 2.7V).
© 2008 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
1.0
1.0
VDD = VREF = 5 V
fSAMPLE = 200 ksps
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.8
0.6
0.6
0.4
0.4
DNL (LSB)
DNL (LSB)
0.8
0.2
0.0
-0.2
0.2
0.0
-0.2
-0.4
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
128
256
384
512
640
768
896
1024
0
128
256
384
Digital Code
512
640
768
896
1024
Digital Code
FIGURE 2-16:
Differential Nonlinearity
(DNL) vs. Code (Representative Part,
VDD =2.7V).
FIGURE 2-13:
Differential Nonlinearity
(DNL) vs. Code (Representative Part).
0.6
0.6
0.4
0.4
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
DNL (LSB)
DNL (LSB)
Positive DNL
0.2
0.0
-0.2
0.2
Positive DNL
0.0
Negative DNL
-0.2
Negative DNL
-0.4
-0.4
-0.6
-0.6
-50
-25
0
25
50
75
-50
100
-25
Temperature (°C)
25
50
75
100
Temperature (°C)
FIGURE 2-14:
Differential Nonlinearity
(DNL) vs. Temperature.
FIGURE 2-17:
Differential Nonlinearity
(DNL) vs. Temperature (VDD = 2.7V).
2.0
8
1.5
7
VDD = 2.7 V
fSAMPLE = 75 ksps
1.0
Offset Error (LSB)
Gain Error (LSB)
0
0.5
0.0
-0.5
VDD = 5 V
fSAMPLE = 200 ksps
-1.0
-1.5
6
VDD = 5 V
fSAMPLE = 200 ksps
5
4
3
VDD = 2.7 V
fSAMPLE = 75 ksps
2
1
-2.0
0
0
1
2
3
4
5
0
1
VREF(V)
FIGURE 2-15:
Gain Error vs. VREF.
© 2008 Microchip Technology Inc.
2
3
4
5
VREF (V)
FIGURE 2-18:
Offset Error vs. VREF.
DS21295D-page 9
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
1.2
0.0
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
-0.2
-0.3
-0.4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-0.5
VDD = VREF = 5 V
fSAMPLE = 200 ksps
1.0
Offset Error (LSB)
Gain Error (LSB)
-0.1
0.8
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.6
0.4
0.2
0.0
-0.6
-50
-25
0
25
50
75
-50
100
-25
0
FIGURE 2-19:
Gain Error vs. Temperature.
FIGURE 2-22:
Temperature.
80
50
75
100
Offset Error vs.
80
VDD = VREF = 5 V
fSAMPLE = 200 ksps
70
VDD = VREF = 5 V
fSAMPLE = 200 ksps
70
60
60
SINAD (dB)
SNR (dB)
25
Temperature (°C)
Temperature (°C)
50
40
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
30
50
30
20
20
10
10
0
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
40
0
1
10
100
1
10
FIGURE 2-20:
Input Frequency.
100
Input Frequency (kHz)
Input Frequency (kHz)
Signal-to-Noise (SNR) vs.
FIGURE 2-23:
Signal-to-Noise and
Distortion (SINAD) vs. Input Frequency.
0
70
-10
60
THD (dB)
-30
SINAD (dB)
-20
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
-40
-50
-60
-70
-80
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-90
VDD = VREF = 5 V
fSAMPLE = 200 ksps
50
40
30
20
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
10
0
-100
1
10
100
Input Frequency (kHz)
FIGURE 2-21:
Total Harmonic Distortion
(THD) vs. Input Frequency.
DS21295D-page 10
-40
-35
-30
-25
-20
-15
-10
-5
0
Input Signal Level (dB)
FIGURE 2-24:
Signal-to-Noise and
Distortion (SINAD) vs. Input Signal Level.
© 2008 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
10.00
10.0
9.8
9.6
9.4
9.2
9.0
8.8
8.6
8.4
8.2
8.0
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
9.50
9.25
VDD = VREF = 5 V
fSAMPLE = 200 ksps
9.00
0.0
0.5
1.0
1.5
2.0
2.5
VDD = VREF = 5V
fSAMPLE = 200 ksps
ENOB (rms)
ENOB (rms)
9.75
3.0
3.5
4.0
4.5
5.0
VDD = VREF = 2.7V
fSAMPLE = 75 ksps
1
10
Input Frequency (kHz)
VREF (V)
FIGURE 2-25:
(ENOB) vs. VREF.
Effective Number of Bits
VDD = VREF = 5 V
fSAMPLE = 200 ksps
90
SFDR (dB)
80
70
60
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
50
40
FIGURE 2-28:
Effective Number of Bits
(ENOB) vs. Input Frequency.
Power Supply Rejection (dB)
100
30
20
10
0
1
10
0
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-10
-20
-30
-40
-50
-60
-70
1
100
10
VDD = VREF = 5 V
FSAMPLE = 200 ksps
FINPUT = 10.0097 kHz
4096 points
20000
40000
60000
80000
100000
Frequency (Hz)
FIGURE 2-27:
Frequency Spectrum of
10 kHz Input (Representative Part).
© 2008 Microchip Technology Inc.
1000
10000
FIGURE 2-29:
Power Supply Rejection
(PSR) vs. Ripple Frequency.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
fINPUT = 1.00708 kHz
4096 points
Amplitude (dB)
Amplitude (dB)
FIGURE 2-26:
Spurious Free Dynamic
Range (SFDR) vs. Input Frequency.
0
100
Ripple Frequency (kHz)
Input Frequency (kHz)
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
100
0
5000
10000 15000 20000 25000 30000 35000
Frequency (Hz)
FIGURE 2-30:
Frequency Spectrum of
1 kHz Input (Representative Part, VDD = 2.7V).
DS21295D-page 11
MCP3004/3008
550
550
500
500
450
450
400
400
350
350
IDD (µA)
IDD (µA)
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
300
250
200
VREF = VDD
All points at fCLK = 3.6 MHz except
at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
150
100
50
300
250
200
150
VREF = VDD
All points at fCLK = 3.6 MHz except
at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
100
50
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
6.0
2.5
3.0
3.5
FIGURE 2-31:
FIGURE 2-34:
IDD vs. VDD.
500
450
400
IREF (µA)
IDD (µA)
350
300
VDD = VREF = 5 V
250
200
VDD = VREF = 2.7 V
150
100
50
0
10
100
1000
120
110
100
90
80
70
60
50
40
30
20
10
0
4.5
5.0
5.5
6.0
VDD = VREF = 2.7 V
10
10000
IREF vs. VDD.
VDD = VREF = 5 V
100
1000
10000
Clock Frequency (kHz)
Clock Frequency (kHz)
FIGURE 2-32:
4.0
VDD (V)
VDD (V)
IDD vs. Clock Frequency.
FIGURE 2-35:
IREF vs. Clock Frequency.
550
500
VDD = VREF = 5 V
fCLK = 3.6 MHz
450
140
IREF (µA)
IDD (µA)
350
300
250
200
150
50
100
80
60
40
VDD = VREF = 2.7 V
fCLK = 1.35 MHz
100
VDD = VREF = 5 V
fCLK = 3.6 MHz
120
400
VDD = VREF = 2.7 V
fCLK = 1.35 MHz
20
0
0
-50
-25
0
25
50
75
100
-50
-25
Temperature (°C)
FIGURE 2-33:
DS21295D-page 12
IDD vs. Temperature.
0
25
50
75
100
Temperature (°C)
FIGURE 2-36:
IREF vs. Temperature.
© 2008 Microchip Technology Inc.
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25°C.
2.0
70
Analog Input Leakage (nA)
VREF = CS = VDD
60
IDDS (pA)
50
40
30
20
10
0
1.8
VDD = VREF = 5 V
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 2-37:
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-39:
Analog Input Leakage
Current vs. Temperature.
IDDS vs. VDD.
100.00
VDD = VREF = CS = 5 V
IDDS (nA)
10.00
1.00
0.10
0.01
-50
-25
0
25
50
75
100
Temperature (°C)
FIGURE 2-38:
IDDS vs. Temperature.
© 2008 Microchip Technology Inc.
DS21295D-page 13
MCP3004/3008
NOTES:
DS21295D-page 14
© 2008 Microchip Technology Inc.
MCP3004/3008
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
Additional descriptions of the device pins follows.
TABLE 3-1:
PIN FUNCTION TABLE
MCP3004
MCP3008
PDIP, SOIC,
TSSOP
PDIP, SOIC
1
1
CH0
Analog Input
2
2
CH1
Analog Input
3
3
CH2
Analog Input
4
4
CH3
Analog Input
–
5
CH4
Analog Input
–
6
CH5
Analog Input
–
7
CH6
Analog Input
–
8
CH7
Analog Input
3.1
Symbol
7
9
DGND
8
10
CS/SHDN
9
11
DIN
10
12
DOUT
Serial Data In
Serial Data Out
13
CLK
14
AGND
13
15
VREF
Reference Voltage Input
14
16
VDD
+2.7V to 5.5V Power Supply
5,6
–
NC
No Connection
Digital Ground (DGND)
Serial Clock
Analog Ground
3.5
Serial Data Input (DIN)
The SPI port serial data input pin is used to load
channel configuration data into the device.
Analog Ground (AGND)
Analog inputs (CH0 - CH7)
Analog inputs for channels 0 - 7, respectively, for the
multiplexed inputs. Each pair of channels can be
programmed to be used as two independent channels
in single-ended mode or as a single pseudo-differential
input where one channel is IN+ and one channel is IN.
See Section 4.1 “Analog Inputs”, “Analog Inputs”,
and Section 5.0 “Serial Communication”, “Serial
Communication”, for information on programming the
channel configuration.
3.4
Chip Select/Shutdown Input
11
Analog ground connection to internal analog circuitry.
3.3
Digital Ground
12
Digital ground connection to internal digital circuitry.
3.2
Description
3.6
Serial Data Output (DOUT)
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
3.7
Chip Select/Shutdown (CS/SHDN)
The CS/SHDN pin is used to initiate communication
with the device when pulled low. When pulled high, it
will end a conversion and put the device in low-power
standby. The CS/SHDN pin must be pulled high
between conversions.
Serial Clock (CLK)
The SPI clock pin is used to initiate a conversion and
clock out each bit of the conversion as it takes place.
See Section 6.2 “Maintaining Minimum Clock
Speed”, “Maintaining Minimum Clock Speed”, for
constraints on clock speed.
© 2008 Microchip Technology Inc.
DS21295D-page 15
MCP3004/3008
NOTES:
DS21295D-page 16
© 2008 Microchip Technology Inc.
MCP3004/3008
4.0
DEVICE OPERATION
The MCP3004/3008 A/D converters employ a
conventional SAR architecture. With this architecture,
a sample is acquired on an internal sample/hold
capacitor for 1.5 clock cycles starting on the first rising
edge of the serial clock once CS has been pulled low.
Following this sample time, the device uses the
collected charge on the internal sample and hold
capacitor to produce a serial 10-bit digital output code.
Conversion rates of 100 ksps are possible on the
MCP3004/3008. See Section 6.2 “Maintaining Minimum Clock Speed”, “Maintaining Minimum Clock
Speed”, for information on minimum clock rates.
Communication with the device is accomplished using
a 4-wire SPI-compatible interface.
4.2
Reference Input
For each device in the family, the reference input
(VREF) determines the analog input voltage range. As
the reference input is reduced, the LSB size is reduced
accordingly.
EQUATION 4-1:
V REF
LSB Size = -----------1024
The theoretical digital output code produced by the A/D
converter is a function of the analog input signal and
the reference input, as shown below.
EQUATION 4-2:
4.1
Analog Inputs
The MCP3004/3008 devices offer the choice of using
the analog input channels configured as single-ended
inputs or pseudo-differential pairs. The MCP3004 can
be configured to provide two pseudo-differential input
pairs or four single-ended inputs. The MCP3008 can be
configured to provide four pseudo-differential input
pairs or eight single-ended inputs. Configuration is
done as part of the serial command before each
conversion begins. When used in the pseudodifferential mode, each channel pair (i.e., CH0 and
CH1, CH2 and CH3 etc.) are programmed as the IN+
and IN- inputs as part of the command string transmitted to the device. The IN+ input can range from IN- to
(VREF + IN-). The IN- input is limited to ±100 mV from
the VSS rail. The IN- input can be used to cancel small
signal common-mode noise, which is present on both
the IN+ and IN- inputs.
LSB SIZE CALCULATION
DIGITAL OUTPUT CODE
CALCULATION
1024 × V IN
Digital Output Code = -------------------------V REF
Where:
VIN
=
analog input voltage
VREF
=
analog input voltage
When using an external voltage reference device, the
system designer should always refer to the
manufacturer’s recommendations for circuit layout.
Any instability in the operation of the reference device
will have a direct effect on the operation of the A/D
converter.
When operating in the pseudo-differential mode, if the
voltage level of IN+ is equal to or less than IN-, the
resultant code will be 000h. If the voltage at IN+ is
equal to or greater than {[VREF + (IN-)] - 1 LSB}, then
the output code will be 3FFh. If the voltage level at INis more than 1 LSB below VSS, the voltage level at the
IN+ input will have to go below VSS to see the 000h
output code. Conversely, if IN- is more than 1 LSB
above VSS, the 3FFh code will not be seen unless the
IN+ input level goes above VREF level.
For the A/D converter to meet specification, the charge
holding capacitor (CSAMPLE) must be given enough
time to acquire a 10-bit accurate voltage level during
the 1.5 clock cycle sampling period. The analog input
model is shown in Figure 4-1.
This diagram illustrates that the source impedance (RS)
adds to the internal sampling switch (RSS) impedance,
directly affecting the time that is required to charge the
capacitor (CSAMPLE). Consequently, larger source
impedances increase the offset, gain and integral
linearity errors of the conversion (see Figure 4-2).
© 2008 Microchip Technology Inc.
DS21295D-page 17
MCP3004/3008
VDD
RSS
Sampling
Switch
VT = 0.6V
CHx
CPIN
7 pF
VA
VT = 0.6V
SS
ILEAKAGE
±1 nA
RS = 1 kΩ
CSAMPLE
= DAC capacitance
= 20 pF
VSS
Legend
VA = Signal Source
ILEAKAGE = Leakage Current At The Pin
Due To Various Junctions
RSS = Source Impedance
SS = sampling switch
CHx = Input Channel Pad
RS = sampling switch resistor
CPIN = Input Pin Capacitance
VT = Threshold Voltage
FIGURE 4-1:
CSAMPLE = sample/hold capacitance
Analog Input Model.
Clock Frequency (Mhz)
4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
3
2
1
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0
100
1000
10000
Input Resistance (Ohms)
FIGURE 4-2:
Maximum Clock Frequency
vs. Input resistance (RS) to maintain less than a
0.1 LSB deviation in INL from nominal
conditions.
DS21295D-page 18
© 2008 Microchip Technology Inc.
MCP3004/3008
5.0
SERIAL COMMUNICATION
Communication with the MCP3004/3008 devices is
accomplished using a standard SPI-compatible serial
interface. Initiating communication with either device is
done by bringing the CS line low (see Figure 5-1). If the
device was powered up with the CS pin low, it must be
brought high and back low to initiate communication.
The first clock received with CS low and DIN high will
constitute a start bit. The SGL/DIFF bit follows the start
bit and will determine if the conversion will be done
using single-ended or differential input mode. The next
three bits (D0, D1 and D2) are used to select the input
channel configuration. Table 5-1 and Table 5-2 show
the configuration bits for the MCP3004 and MCP3008,
respectively. The device will begin to sample the
analog input on the fourth rising edge of the clock after
the start bit has been received. The sample period will
end on the falling edge of the fifth clock following the
start bit.
Once the D0 bit is input, one more clock is required to
complete the sample and hold period (DIN is a “don’t
care” for this clock). On the falling edge of the next
clock, the device will output a low null bit. The next 10
clocks will output the result of the conversion with MSB
first, as shown in Figure 5-1. Data is always output from
the device on the falling edge of the clock. If all 10 data
bits have been transmitted and the device continues to
receive clocks while the CS is held low, the device will
output the conversion result LSB first, as is shown in
Figure 5-2. If more clocks are provided to the device
while CS is still low (after the LSB first data has been
transmitted), the device will clock out zeros indefinitely.
If necessary, it is possible to bring CS low and clock in
leading zeros on the DIN line before the start bit. This is
often done when dealing with microcontroller-based
SPI ports that must send 8 bits at a time. Refer to
Section 6.1 “Using the MCP3004/3008 with Microcontroller (MCU) SPI Ports”, “Using the MCP3004/
3008 with Microcontroller (MCU) SPI Ports”, for more
details on using the MCP3004/3008 devices with
hardware SPI ports.
© 2008 Microchip Technology Inc.
TABLE 5-1:
CONFIGURE BITS FOR THE
MCP3004
Control Bit
Selections
Input
Configuration
Single/
D2* D1 D0
Diff
Channel
Selection
1
X
0
0
single-ended
CH0
1
X
0
1
single-ended
CH1
1
X
1
0
single-ended
CH2
1
X
1
1
single-ended
CH3
0
X
0
0
differential
CH0 = IN+
CH1 = IN-
0
X
0
1
differential
CH0 = INCH1 = IN+
0
X
1
0
differential
CH2 = IN+
CH3 = IN-
0
X
1
1
differential
CH2 = INCH3 = IN+
* D2 is “don’t care” for MCP3004
TABLE 5-2:
CONFIGURE BITS FOR THE
MCP3008
Control Bit
Selections
Input
Configuration
Channel
Selection
0
single-ended
CH0
1
single-ended
CH1
1
0
single-ended
CH2
1
1
single-ended
CH3
1
0
0
single-ended
CH4
1
1
0
1
single-ended
CH5
1
1
1
0
single-ended
CH6
1
1
1
1
single-ended
CH7
0
0
0
0
differential
CH0 = IN+
CH1 = IN-
0
0
0
1
differential
CH0 = INCH1 = IN+
0
0
1
0
differential
CH2 = IN+
CH3 = IN-
0
0
1
1
differential
CH2 = INCH3 = IN+
0
1
0
0
differential
CH4 = IN+
CH5 = IN-
0
1
0
1
differential
CH4 = INCH5 = IN+
0
1
1
0
differential
CH6 = IN+
CH7 = IN-
0
1
1
1
differential
CH6 = INCH7 = IN+
Single
/Diff
D2
1
0
0
1
0
0
1
0
1
0
1
D1 D0
DS21295D-page 19
MCP3004/3008
tCYC
tCYC
tCSH
CS
tSUCS
CLK
DIN
DOUT
Start
D2 D1 D0
SGL/
DIFF
HI-Z
Null
Bit B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 *
tCONV
tSAMPLE
D2
Start
Don’t Care
SGL/
DIFF
HI-Z
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output LSB
first data, then followed with zeros indefinitely. See Figure 5-2 below.
** tDATA: during this time, the bias current and the comparator powers down while the reference input becomes
a high-impedance node.
FIGURE 5-1:
Communication with the MCP3004 or MCP3008.
tCYC
CS
tCSH
tSUCS
Power Down
CLK
DIN
DOUT
Start
Don’t Care
D2 D1 D0
SGL/
DIFF
HI-Z
Null
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9*
Bit
HI-Z
(MSB)
tSAMPLE
tCONV
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output zeros
indefinitely.
** tDATA: During this time, the bias circuit and the comparator powers down while the reference input becomes
a high-impedance node, leaving the CLK running to clock out LSB first data or zeroes.
FIGURE 5-2:
DS21295D-page 20
Communication with MCP3004 or MCP3008 in LSB First Format.
© 2008 Microchip Technology Inc.
MCP3004/3008
6.0
APPLICATIONS INFORMATION
6.1
Using the MCP3004/3008 with
Microcontroller (MCU) SPI Ports
As is shown in Figure 6-1, the first byte transmitted to
the A/D converter contains seven leading zeros before
the start bit. Arranging the leading zeros this way
induces the 10 data bits to fall in positions easily
manipulated by the MCU. The MSB is clocked out of
the A/D converter on the falling edge of clock number
14. Once the second eight clocks have been sent to the
device, the MCU receive buffer will contain five
unknown bits (the output is at high-impedance for the
first two clocks), the null bit and the highest order 2 bits
of the conversion. Once the third byte has been sent to
the device, the receive register will contain the lowest
order eight bits of the conversion results. Employing
this method ensures simpler manipulation of the
converted data.
With most microcontroller SPI ports, it is required to
send groups of eight bits. It is also required that the
microcontroller SPI port be configured to clock out data
on the falling edge of clock and latch data in on the
rising edge. Because communication with the
MCP3004/3008 devices may not need multiples of
eight clocks, it will be necessary to provide more clocks
than are required. This is usually done by sending
‘leading zeros’ before the start bit. As an example,
Figure 6-1 and Figure 6-2 shows how the MCP3004/
3008 can be interfaced to a MCU with a hardware SPI
port. Figure 6-1 depicts the operation shown in SPI
Mode 0,0, which requires that the SCLK from the MCU
idles in the ‘low’ state, while Figure 6-2 shows the similar case of SPI Mode 1,1, where the clock idles in the
‘high’ state.
CS
SCLK
Figure 6-2 shows the same thing in SPI Mode 1,1,
which requires that the clock idles in the high state. As
with mode 0,0, the A/D converter outputs data on the
falling edge of the clock and the MCU latches data from
the A/D converter in on the rising edge of the clock.
MCU latches data from A/D
converter on rising edges of SCLK
1
2
3
4
5
6
DIN
MCU Transmitted Data
(Aligned with falling
0
edge of clock)
X = “Don’t Care” Bits
8
9
10
11
12
13
14 15 16
17
0
?
0
NULL
BIT B9 B8
?
0
?
0
?
0
?
0
?
Start
Bit
1
?
Data stored into MCU receive
register after transmission of first
8 bits
SGL/
DIFF D2 D1 DO X
?
?
?
18 19
20
21 22
23
24
Don’t Care
HI-Z
DOUT
MCU Received Data
(Aligned with rising
?
edge of clock)
7
Data is clocked out of
A/D converter on falling edges
SGL/ D2 D1 DO
Start DIFF
?
X
X
B7
X
0 B9 B8
? (Null)
Data stored into MCU receive
register after transmission of
second 8 bits
B6 B5 B4 B3 B2 B1 B0
X
X
X
X
X
X
X
X
B7 B6 B5 B4 B3 B2 B1 B0
Data stored into MCU receive
register after transmission of last
8 bits
FIGURE 6-1:
SPI Communication with the MCP3004/3008 using 8-bit segments
(Mode 0,0: SCLK idles low).
© 2008 Microchip Technology Inc.
DS21295D-page 21
MCP3004/3008
MCU latches data from A/D converter
on rising edges of SCLK
CS
1
SCLK
2
3
4
5
6
7
8
9
10
11 12 13 14 15
16
17 18 19
20
21 22
23
24
Data is clocked out of A/D
converter on falling edges
DIN
Start
Don’t Care
NULL
BIT B9
HI-Z
DOUT
Start
Bit
MCU Transmitted Data
(Aligned with falling
0
edge of clock)
MCU Received Data
(Aligned with rising
edge of clock)
X = “Don’t Care” Bits
FIGURE 6-2:
6.2
SGL/ D2 D1 DO
DIFF
0
?
0
?
0
?
0
?
0
?
?
SGL/
DIFF D2
1
0
?
?
?
Data stored into MCU receive
register after transmission of first
8 bits
?
D1 DO X
?
?
X
?
B8
X
X
Maintaining Minimum Clock Speed
0
(Null) B9 B8
X
X
X
X
X
X
X
B7 B6 B5 B4 B3 B2 B1 B0
Data stored into MCU receive
register after transmission of last
8 bits
Data stored into MCU receive
register after transmission of
second 8 bits
Low-pass (anti-aliasing) filters can be designed using
Microchip’s free interactive FilterLab® software.
FilterLab will calculate capacitor and resistors values,
as well as determine the number of poles that are
required for the application. For more information on filtering signals, see AN699, “Anti-Aliasing Analog Filters
for Data Acquisition Systems”.
VDD
If the signal source for the A/D converter is not a lowimpedance source, it will have to be buffered or
inaccurate conversion results may occur (see Figure 42). It is also recommended that a filter be used to
eliminate any signals that may be aliased back in to the
conversion results, as is illustrated in Figure 6-3, where
an op amp is used to drive, filter and gain the analog
input of the MCP3004/3008. This amplifier provides a
low-impedance source for the converter input, plus a
low-pass filter, which eliminates unwanted highfrequency noise.
10 µF
4.096V
Reference
0.1 µF
MCP1541
1 µF
1 µF
VIN
R1
C1
R2
C2
Buffering/Filtering the Analog
Inputs
DS21295D-page 22
X
SPI Communication with the MCP3004/3008 using 8-bit segments (Mode 1,1: SCLK idles high).
When the MCP3004/3008 initiates the sample period,
charge is stored on the sample capacitor. When the
sample period is complete, the device converts one bit
for each clock that is received. It is important for the
user to note that a slow clock rate will allow charge to
bleed off the sample capacitor while the conversion is
taking place. At 85°C (worst case condition), the part
will maintain proper charge on the sample capacitor for
at least 1.2 ms after the sample period has ended. This
means that the time between the end of the sample
period and the time that all 10 data bits have been
clocked out must not exceed 1.2 ms (effective clock
frequency of 10 kHz). Failure to meet this criterion may
introduce linearity errors into the conversion outside
the rated specifications. It should be noted that during
the entire conversion cycle, the A/D converter does not
require a constant clock speed or duty cycle, as long as
all timing specifications are met.
6.3
B6 B5 B4 B3 B2 B1 B0
B7
MCP601
IN+ V
REF
MCP3004
IN-
+
-
R
R3 4
FIGURE 6-3:
The MCP601 Operational
Amplifier is used to implement a second order
anti-aliasing filter for the signal being converted
by the MCP3004.
© 2008 Microchip Technology Inc.
MCP3004/3008
6.4
Layout Considerations
When laying out a printed circuit board for use with
analog components, care should be taken to reduce
noise wherever possible. A bypass capacitor should
always be used with this device and should be placed
as close as possible to the device pin. A bypass
capacitor value of 1 µF is recommended.
Digital and analog traces should be separated as much
as possible on the board, with no traces running
underneath the device or bypass capacitor. Extra
precautions should be taken to keep traces with highfrequency signals (such as clock lines) as far as
possible from analog traces.
Use of an analog ground plane is recommended in
order to keep the ground potential the same for all
devices on the board. Providing VDD connections to
devices in a “star” configuration can also reduce noise
by eliminating return current paths and associated
errors (see Figure 6-4). For more information on layout
tips when using A/D converters, refer to AN688,
“Layout Tips for 12-Bit A/D Converter Applications”.
VDD
Connection
VDD
MCP3004/08
Digital Side
Analog Side
-SPI Interface
-Shift Register
-Control Logic
-Sample Cap
-Capacitor Array
-Comparator
Substrate
5 - 10Ω
DGND
AGND
0.1 µF
Device 4
Device 1
If no ground plane is utilized, both grounds must be
connected to VSS on the board. If a ground plane is
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be
connected to the analog ground plane. Following these
steps will reduce the amount of digital noise from the
rest of the board being coupled into the A/D converter.
Analog Ground Plane
FIGURE 6-5:
Separation of Analog and
Digital Ground Pins.
Device 3
Device 2
FIGURE 6-4:
VDD traces arranged in a
‘Star’ configuration in order to reduce errors
caused by current return paths.
6.5
Utilizing the Digital and Analog
Ground Pins
The MCP3004/3008 devices provide both digital and
analog ground connections to provide additional
means of noise reduction. As is shown in Figure 6-5,
the analog and digital circuitry is separated internal to
the device. This reduces noise from the digital portion
of the device being coupled into the analog portion of
the device. The two grounds are connected internally
through the substrate which has a resistance of 5 -10Ω.
© 2008 Microchip Technology Inc.
DS21295D-page 23
MCP3004/3008
NOTES:
DS21295D-page 24
© 2008 Microchip Technology Inc.
MCP3004/3008
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
14-Lead PDIP (300 mil)
Example:
MCP3004
I/P e3
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil)
0819256
Example:
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
14-Lead TSSOP (4.4mm) *
MCP3004
3
ISL e^^
XXXXXXXXXXX
0819256
Example:
XXXXXXXX
3004
YYWW
I819
NNN
256
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information.
© 2008 Microchip Technology Inc.
DS21295D-page 25
MCP3004/3008
Package Marking Information (Continued)
16-Lead PDIP (300 mil) (MCP3008)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
16-Lead SOIC (150 mil) (MCP3008)
XXXXXXXXXXXXX
XXXXXXXXXXXXX
YYWWNNN
DS21295D-page 26
MCP3008-I/P e3
0819256
Example:
MCP3008
3
I/SL e^^
XXXXXXXXXX
0819256
© 2008 Microchip Technology Inc.
MCP3004/3008
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DS21295D-page 27
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DS21295D-page 29
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© 2008 Microchip Technology Inc.
MCP3004/3008
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© 2008 Microchip Technology Inc.
DS21295D-page 31
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© 2008 Microchip Technology Inc.
MCP3004/3008
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© 2008 Microchip Technology Inc.
DS21295D-page 33
MCP3004/3008
NOTES:
DS21295D-page 34
© 2008 Microchip Technology Inc.
MCP3004/3008
APPENDIX A:
REVISION HISTORY
Revision D (December 2008)
The following is the list of modifications:
1.
Updates to Section 7.0 “Packaging Information”.
Revision C (January 2007)
The following is the list of modifications:
1.
Updates to the packaging diagrams.
Revision B (May 2002)
The following is the list of modifications:
1.
Undocumented changes.
Revision A (February 2000)
• Initial release of this document.
© 2008 Microchip Technology Inc.
DS21295D-page 35
MCP3004/3008
NOTES:
DS21295D-page 36
© 2008 Microchip Technology Inc.
MCP3004/3008
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device
Examples:
a)
b)
MCP3004: 4-Channel 10-Bit Serial A/D Converter
MCP3004T: 4-Channel 10-Bit Serial A/D Converter
(Tape and Reel)
MCP3008: 8-Channel 10-Bit Serial A/D Converter
MCP3008T: 8-Channel 10-Bit Serial A/D Converter
(Tape and Reel)
c)
d)
a)
Temperature Range
I
Package
P
SL
ST
= -40°C to
+85°C
(Industrial)
b)
MCP3004-I/P:
Industrial Temperature,
PDIP package.
MCP3004-I/SL: Industrial Temperature,
SOIC package.
MCP3004-I/ST: Industrial Temperature,
TSSOP package.
MCP3004T-I/ST: Industrial Temperature,
TSSOP package, Tape and
Reel.
MCP3008-I/P: Industrial Temperature,
PDIP package.
MCP3008-I/SL: Industrial Temperature,
SOIC package.
= Plastic DIP (300 mil Body), 14-lead, 16-lead
= Plastic SOIC (150 mil Body), 14-lead, 16-lead
= Plastic TSSOP (4.4mm), 14-lead
© 2008 Microchip Technology Inc.
DS21295D-page 37
MCP3004/3008
NOTES:
DS21295D-page 38
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS21295D-page 39
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-4182-8400
Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
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Tel: 774-760-0087
Fax: 774-760-0088
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Dallas
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Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS21295D-page 40
© 2008 Microchip Technology Inc.
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