MCP4011/2/3/4
Low-Cost 64-Step Volatile Digital POT
Package Types
• Volatile Digital Potentiometer in SOT-23, SOIC,
MSOP and DFN Packages
• 64 Taps: 63 Resistors with Taps to Terminal A and
Terminal B
• Simple Up/Down (U/D) Protocol
• Power-on Recall of Default Wiper Setting
- Custom POR Wiper Settings Available
(Contact Factory)
• Resistance Values: 2.1 k, 5 k, 10 k or 50 k
• Low Tempco:
- Absolute (Rheostat): 50 ppm (0°C to 70°C Typ.)
- Ratiometric (Potentiometer): 10 ppm (Typ.)
• Low Wiper Resistance: 75 (Typ.)
• High-Voltage Tolerant Digital Inputs: up to 12.5V
• Low-Power Operation: 1 µA Max Static Current
• Wide Operating Voltage Range:
- 1.8V to 5.5V - Device Operation
- 2.7V to 5.5V - Resistor Characteristics
Specified
• Extended Temperature Range: –40°C to +125°C
• Wide Bandwidth (–3 dB) Operation:
- 4 MHz (Typ.) for 2.1 k Device
Description
MCP4011
MCP4012
SOIC, MSOP, DFN
Potentiometer
SOT-23-6
Rheostat
VDD 1
VSS 2
A 3
A
W
W 4
VDD 1
7 NC
VSS 2
6 B
U/D 3
A
4 CS
B
MCP4014
SOT-23-5
Rheostat
VSS 2
U/D 3
A
W
B
5 W
5 CS
SOT-23-6
Potentiometer
VDD 1
6 A
W
MCP4013
6 A
VDD 1
5 W
VSS 2
4 CS
U/D 3
5 W
W
B
A
4 CS
Block Diagram
A
VDD
VSS
CS
The MCP4011/2/3/4 devices are volatile, 6-bit Digital
Potentiometers that can be configured as either a
potentiometer or rheostat. The wiper setting is
controlled through a simple Up/Down (U/D) serial
interface.
B
8 U/D
U/D
Power-Up
and
Brown-Out
Control
Wiper Register
(Resistor Array)
Features
2-Wire
Interface
and
Control
Logic
W
B
Device
Wiper
Configuration
Memory POR Wiper
Type
Setting
Options (k)
# of
Wiper Steps
()
VDD
Operating
Range (2)
WiperLock™
Technology
Resistance (typical)
Control
Interface
Device Features
MCP4011 Potentiometer (1)
RAM
Mid-Scale
2.1, 5.0, 10.0, 50.0
75
64
1.8V to 5.5V U/D
No
MCP4012
Rheostat
RAM
Mid-Scale
2.1, 5.0, 10.0, 50.0
75
64
1.8V to 5.5V U/D
No
MCP4013
Potentiometer
RAM
Mid-Scale
2.1, 5.0, 10.0, 50.0
75
64
1.8V to 5.5V U/D
No
MCP4014
Rheostat
RAM
Mid-Scale
2.1, 5.0, 10.0, 50.0
75
64
1.8V to 5.5V U/D
No
Note 1: Floating either terminal (A or B) allows the device to be used in Rheostat mode.
2: Analog characteristics (resistor) tested from 2.7V to 5.5V.
.
2006-2017 Microchip Technology Inc.
DS20001978D-page 1
MCP4011/2/3/4
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
VDD ............................................................................................................. 6.5V
CS and U/D inputs w.r.t VSS................................... –0.3V to 12.5V
A,B and W terminals w.r.t VSS.................... –0.3V to VDD + 0.3V
Current at Input Pins ..................................................±10 mA
Current at Supply Pins ...............................................±10 mA
Current at Potentiometer Pins ...................................±2.5 mA
Storage temperature ....................................–65°C to +150°C
Ambient temp. with power applied ...............–55°C to +125°C
ESD protection on all pins 4 kV (HBM), 400V (MM)
Maximum Junction Temperature (TJ) . .........................+150°C
AC/DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges.
TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 2.7V to 5.5V,
VSS = 0V, TA = +25°C.
Parameters
Sym.
Min.
VDD
VDD
CS Input Voltage
Supply Current
Operating Voltage Range
Resistance
(± 20%)
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Typ.
Max.
Units
2.7
—
5.5
V
—
1.8
—
V
VDD = 1.8V, CS:VIHH = 8.5V,
VIH = 1.8V, VIL = 0V,
U/D:VIH = 1.8V, VIL = 0V
VCS
VSS
—
12.5
V
The CS pin will be at one of three
input levels (VIL, VIH or VIHH).
(Note 6)
IDD
—
45
—
µA
5.5V, CS = VSS, fU/D = 1 MHz
—
15
—
µA
2.7V, CS = VSS, fU/D = 1 MHz
—
0.3
1
µA
Serial Interface Inactive
(CS = VIH, U/D = VIH)
1.68
2.1
2.52
k
–202 devices(Note 1)
RAB
Conditions
4.0
5
6.0
k
–502 devices(Note 1)
8.0
10
12.0
k
–103 devices(Note 1)
40.0
50
60.0
k
–503 devices(Note 1)
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V).
MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h.
MCP4012/14 only, test conditions are:
Current at Voltage
Device
Resistance
5.5V
2.1 k
2.25 mA
1.1 mA
5 k
1.4 mA
450 µA
10 k
450 µA
210 µA
50 k
90 µA
40 µA
2.7V
Comments
MCP4012 includes VWZSE
MCP4014 includes VWFSE
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Nonlinearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See
Section 6.0, "Resistor" for additional information.
For voltages below 2.7V, refer to Section 2.0, "Typical Performance Curves".
The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested.
DS20001978D-page 2
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges.
TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 2.7V to 5.5V,
VSS = 0V, TA = +25°C.
Parameters
Sym.
Resolution
Min.
N
Typ.
Max.
64
Units
Taps
Conditions
No Missing Codes
Step Resistance
RS
—
RAB / 63
—
Note 6
Wiper Resistance (Note 3, Note 4)
RW
—
70
125
5.5V
—
70
325
—
50
—
ppm/°C
TA = -20°C to +70°C
—
100
—
ppm/°C
TA = -40°C to +85°C
—
150
—
ppm/°C
TA = -40°C to +125°C
10
—
ppm/°C
MCP4011 and MCP4013 only,
code = 1Fh
R/T
Nominal Resistance Tempco
2.7V
Ratiometeric Tempco
VWA/
T
—
Full-Scale Error (MCP4011/13 only)
VWFSE
-0.5
-0.1
+0.5
LSb
Code 3Fh, 2.7V VDD 5.5V
Zero-Scale Error (MCP4011/13 only)
VWZSE
-0.5
+0.1
+0.5
LSb
Code 00h, 2.7V VDD 5.5V
VA,VW,
VB
Vss
—
VDD
V
Current through A, W or B
IW
—
—
2.5
mA
Note 6
Leakage current into A, W or B
IWL
—
100
—
nA
MCP4011 A = W = B = VSS
—
100
—
nA
MCP4012/13 A = W = VSS
Monotonicity
N
Resistor Terminal Input Voltage Range
(Terminals A, B and W)
Yes
Bits
Note 5, Note 6
—
100
—
nA
MCP4014 W = VSS
CAW
—
75
—
pF
f =1 MHz, code = 1Fh
Capacitance (Pw)
CW
—
120
—
pF
f =1 MHz, code = 1Fh
Capacitance (PB)
CBW
—
75
—
pF
f =1 MHz, code = 1Fh
Bandwidth -3 dB
BW
—
4
—
MHz
-202
devices
—
2
—
MHz
-502
devices
—
1
—
MHz
-103
devices
—
200
—
kHz
-503
devices
Capacitance (PA)
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
Code = 1F,
output load = 30 pF
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V).
MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h.
MCP4012/14 only, test conditions are:
Current at Voltage
Device
Resistance
5.5V
2.7V
2.1 k
2.25 mA
1.1 mA
5 k
1.4 mA
450 µA
10 k
450 µA
210 µA
50 k
90 µA
40 µA
Comments
MCP4012 includes VWZSE
MCP4014 includes VWFSE
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Nonlinearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See
Section 6.0, "Resistor" for additional information.
For voltages below 2.7V, refer to Section 2.0, "Typical Performance Curves".
The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested.
2006-2017 Microchip Technology Inc.
DS20001978D-page 3
MCP4011/2/3/4
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges.
TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 2.7V to 5.5V,
VSS = 0V, TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
INL
–0.5
±0.25
+0.5
LSb
MCP4011/13 only (Note 2)
Potentiometer Differential Nonlinearity
DNL
–0.5
±0.25
+0.5
LSb
MCP4011/13 only (Note 2)
Rheostat Integral Nonlinearity
MCP4011 (Note 4, Note 9)
MCP4012 and MCP4014 (Note 4)
R-INL
–0.5
±0.25
+0.5
LSb
+4.5
+8.5
LSb
Potentiometer Integral Nonlinearity
–8.5
See Section 2.0
LSb
–0.5
±0.25
+0.5
LSb
–5.5
+2.5
+5.5
LSb
See Section 2.0
–0.5
–3
LSb
±0.25
+0.5
LSb
+1
+3
LSb
See Section 2.0
LSb
–0.5
±0.25
+0.5
LSb
–1
+0.25
+1
LSb
See Section 2.0
Rheostat Differential Nonlinearity
MCP4011 (Note 4, Note 9)
MCP4012 and MCP4014 (Note 4)
R-DNL
–0.5
–1
LSb
±0.25
+0.5
LSb
+0.5
+2
LSb
See Section 2.0
LSb
–0.5
±0.25
+0.5
LSb
–1
+0.25
+1.25
LSb
See Section 2.0
–0.5
–1
LSb
±0.25
+0.5
LSb
0
+1
LSb
See Section 2.0
LSb
–0.5
±0.25
+0.5
LSb
–0.5
0
+0.5
LSb
See Section 2.0
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
LSb
Conditions
–202
devices
(2.1 k
5.5V
2.7V (Note 7)
1.8V (Note 7, Note 8)
–502
devices
(5 k
5.5V
–103
devices
(10 k
5.5V
–503
devices
(50 k
5.5V
–202
devices
(2.1 k
5.5V
–502
devices
(5 k
5.5V
–103
devices
(10 k
5.5V
–503
devices
(50 k
5.5V
2.7V (Note 7)
1.8V (Note 7, Note 8)
2.7V (Note 7)
1.8V (Note 7, Note 8)
2.7V (Note 7)
1.8V (Note 7, Note 8)
2.7V (Note 7)
1.8V (Note 7, Note 8)
2.7V (Note 7)
1.8V (Note 7, Note 8)
2.7V (Note 7)
1.8V (Note 7, Note 8)
2.7V (Note 7)
1.8V (Note 7, Note 8)
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V).
MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h.
MCP4012/14 only, test conditions are:
Current at Voltage
Device
Resistance
5.5V
2.7V
2.1 k
2.25 mA
1.1 mA
5 k
1.4 mA
450 µA
10 k
450 µA
210 µA
50 k
90 µA
40 µA
Comments
MCP4012 includes VWZSE
MCP4014 includes VWFSE
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Nonlinearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See
Section 6.0, "Resistor" for additional information.
For voltages below 2.7V, refer to Section 2.0, "Typical Performance Curves".
The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested.
DS20001978D-page 4
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
AC/DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges.
TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 2.7V to 5.5V,
VSS = 0V, TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
VIH
0.7 VDD
—
—
V
Conditions
Digital Inputs/Outputs (CS, U/D)
Input High Voltage
VIL
—
—
0.3 VDD
V
High-Voltage Input Entry Voltage
(Threshold for WiperLock Technology)
VIHH
8.5(9)
—
12.5(6)
V
+7°C to +125°C
9.0
—
(6)
V
–40°C to +125°C
High-Voltage Input Exit Voltage
VIHH
—
—
CS Pull-Up/Pull-Down Resistance
RCS
—
CS Weak Pull-Up/Pull-Down Current
IPU
—
Input Low Voltage
12.5
VDD+0.8(6)
V
16
—
k
VDD = 5.5V, VCS = 3V
170
—
µA
VDD = 5.5V, VCS = 3V
IIL
–1
—
1
µA
VIN = VDD
CIN,
COUT
—
10
—
pF
fC = 1 MHz, VDD 2.7V
Value Range
N
0h
—
3Fh
Default POR Setting
N
Input Leakage Current
CS and U/D Pin Capacitance
RAM (Wiper) Value
1Fh
hex
hex
Power Requirements
Power Supply Sensitivity
(MCP4011 and MCP4013 only)
Note 1:
2:
3:
4:
5:
6:
7:
8:
9:
PSS
—
0.0015
0.0035
%/%
VDD = 4.5V to 5.5V, VA = 4.5V,
Code = 1Fh
—
0.0015
0.0035
%/%
VDD = 2.7V to 4.5V, VA = 2.7V,
Code = 1Fh
Resistance is defined as the resistance between terminal A to terminal B.
INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V).
MCP4011/13 only, test conditions are: IW = 1.9 mA, code = 00h.
MCP4012/14 only, test conditions are:
Current at Voltage
Device
Resistance
5.5V
2.7V
2.1 k
2.25 mA
1.1 mA
5 k
1.4 mA
450 µA
10 k
450 µA
210 µA
50 k
90 µA
40 µA
Comments
MCP4012 includes VWZSE
MCP4014 includes VWFSE
Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
This specification by design.
Nonlinearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See
Section 6.0, "Resistor" for additional information.
For voltages below 2.7V, refer to Section 2.0, "Typical Performance Curves".
The MCP4011 is externally connected to match the configurations of the MCP4012 and MCP4014 and then tested.
2006-2017 Microchip Technology Inc.
DS20001978D-page 5
MCP4011/2/3/4
tCSHI
tCSLO
CS
tLUC
1/fUD
tLO
tLCUF
tLUC
tLCUF
U/D
tHI
tLCUR
tS
tS
W
FIGURE 1-1:
Increment Timing Waveform.
SERIAL TIMING CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges.
Extended (E): VDD = +1.8V to 5.5V, TA = -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
CS Low Time
tCSLO
5
—
—
µs
CS High Time
tCSHI
500
—
—
ns
2.7V VDD 5.5V
—
—
—
ns
1.8V VDD < 2.7V
500
—
—
ns
2.7V VDD 5.5V
750
—
—
ns
1.8V VDD < 2.7V
U/D to CS Hold Time
tLUC
Conditions
CS to U/D Low Setup Time
tLCUF
500
—
—
ns
CS to U/D High Setup Time
tLCUR
3
—
—
µs
U/D High Time
tHI
500
—
—
ns
U/D Low Time
tLO
500
—
—
ns
Up/Down Toggle Frequency
fUD
—
—
1
MHz
tS
0.5
—
—
µs
2.1 k CL = 100 pF
1
—
—
µs
5 k CL = 100 pF
2
—
—
µs
10 k CL = 100 pF
10
5
—
µs
50 k CL = 100 pF
—
200
—
ns
Wiper Settling Time
Wiper Response on Power-Up
DS20001978D-page 6
tPU
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
tCSHI
tCSLO
CS
1/fUD
tLUC
tLUC
tHI
tLCUF
U/D
tLO
tLCUR
tS
tS
W
FIGURE 1-2:
Decrement Timing Waveform.
SERIAL TIMING CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges.
Extended (E): VDD = +1.8V to 5.5V, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
CS Low Time
tCSLO
5
—
—
µs
CS High Time
tCSHI
500
—
—
ns
2.7V VDD 5.5V
—
—
—
ns
1.8V VDD < 2.7V
500
—
—
ns
2.7V VDD 5.5V
750
—
—
ns
1.8V VDD < 2.7V
U/D to CS Hold Time
tLUC
Conditions
CS to U/D Low Setup Time
tLCUF
500
—
—
ns
CS to U/D High Setup Time
tLCUR
3
—
—
µs
U/D High Time
tHI
500
—
—
ns
U/D Low Time
tLO
500
—
—
ns
Up/Down Toggle Frequency
fUD
—
—
1
MHz
tS
0.5
—
—
µs
2.1 k CL = 100 pF
1
—
—
µs
5 k CL = 100 pF
2
—
—
µs
10 k CL = 100 pF
10
5
—
µs
50 k CL = 100 pF
—
200
—
ns
Wiper Settling Time
Wiper Response on Power-up
2006-2017 Microchip Technology Inc.
tPU
DS20001978D-page 7
MCP4011/2/3/4
tCSHI
tCSLO
12V
CS
5V
tHUC
1/fUD
tLO
tHCUF
tHUC
tHCUF
U/D
tHI
tHCUR
tS
tS
W
FIGURE 1-3:
High-Voltage Increment Timing Waveform.
SERIAL TIMING CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges.
Extended (E): VDD = +1.8V to 5.5V, TA = –40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
CS Low Time
tCSLO
5
—
—
µs
CS High Time
tCSHI
500
—
—
ns
2.7V VDD 5.5V
—
—
—
ns
1.8V VDD < 2.7V
U/D High Time
tHI
500
—
—
ns
U/D Low Time
tLO
500
—
—
ns
Up/Down Toggle Frequency
fUD
—
—
1
MHz
HV U/D to CS Hold Time
tHUC
1.5
—
—
µs
HV CS to U/D Low Setup Time
tHCUF
8
—
—
µs
HV CS to U/D High Setup Time
tHCUR
4.5
—
—
µs
tS
0.5
—
—
µs
2.1 k CL = 100 pF
1
—
—
µs
5 k CL = 100 pF
2
—
—
µs
10 k CL = 100 pF
10
5
—
µs
50 k CL = 100 pF
—
200
—
ns
Wiper Settling Time
Wiper Response on Power-Up
DS20001978D-page 8
tPU
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
tCSHI
tCSLO
CS
12V
5V
1/fUD
tHUC
tHUC
tHI
tHCUF
U/D
tLO
tHCUR
tS
tS
W
FIGURE 1-4:
High-Voltage Decrement Timing Waveform.
SERIAL TIMING CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges.
Extended (E): VDD = +1.8V to 5.5V, TA = -40°C to +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
CS Low Time
tCSLO
5
—
—
µs
CS High Time
tCSHI
500
—
—
ns
2.7V VDD 5.5V
—
—
—
ns
1.8V VDD < 2.7V
U/D High Time
tHI
500
—
—
ns
U/D Low Time
tLO
500
—
—
ns
Up/Down Toggle Frequency
fUD
—
—
1
MHz
HV U/D to CS Hold Time
tHUC
1.5
—
—
µs
HV CS to U/D Low Setup Time
tHCUF
8
—
—
µs
HV CS to U/D High Setup Time
tHCUR
4.5
—
—
µs
tS
0.5
—
—
µs
2.1 k CL = 100 pF
1
—
—
µs
5 k CL = 100 pF
2
—
—
µs
10 k CL = 100 pF
10
5
—
µs
50 k CL = 100 pF
—
200
—
ns
Wiper Settling Time
Wiper Response on Power-up
2006-2017 Microchip Technology Inc.
tPU
DS20001978D-page 9
MCP4011/2/3/4
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym.
Min.
Typ.
Max.
Units
Specified Temperature Range
TA
–40
—
+125
°C
Operating Temperature Range
TA
–40
—
+125
°C
Storage Temperature Range
TA
–65
—
+150
°C
Thermal Resistance, 5L-SOT-23
JA
—
70
—
°C/W
Thermal Resistance, 6L-SOT-23
JA
—
120
—
°C/W
Thermal Resistance, 8L-DFN (2x3)
JA
—
85
—
°C/W
Thermal Resistance, 8L-MSOP
JA
—
206
—
°C/W
Thermal Resistance, 8L-SOIC
JA
—
163
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
DS20001978D-page 10
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
250
2.7V -40°C
2.7V 25°C
2.7V 85°C
2.7V 125°C
5.5V -40°C
5.5V 25°C
5.5V 85°C
5.5V 125°C
60
50
40
800
200
30
20
600
400
150
200
ICS
0
100
-200
-400
50
10
-600
RCS
0
0.20
0.40
0.60
fU/D (MHz)
0.80
-1000
9
8
12
CS VPP Threshold (V)
VDD = 5.5V
0.6
0.5
0.4
0.3
0.2
VDD = 2.7V
0.1
0.0
7
6
5
4
VCS (V)
3
2
1
FIGURE 2-3:
CS Pull-Up/Pull-Down
Resistance (RCS) and Current (ICS) vs. CS Input
Voltage (VCS) (VDD = 5.5V).
0.8
0.7
-800
0
1.00
FIGURE 2-1:
Device Current (IDD) vs. U/D
Frequency (fU/D) and Ambient Temperature
(VDD = 2.7V and 5.5V).
Device Current (IDD) (µA)
1000
ICS (µA)
70
RCS (kOhms)
Device Current (IDD) (µA)
80
1.8V Entry
2.7V Entry
5.5V Entry
1.8V Exit
2.7V Exit
5.5V Exit
10
8
6
4
2
0
-40
25
85
125
Ambient Temperature (°C)
FIGURE 2-2:
Device Current (ISHDN) and
VDD. (CS = VDD) vs. Ambient Temperature.
2006-2017 Microchip Technology Inc.
-40
-20
0
20
40
60
80 100
Ambient Temperature (°C)
120
FIGURE 2-4:
CS High Input Entry/Exit
Threshold vs. Ambient Temperature and VDD.
DS20001978D-page 11
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
0.05
100
0.025
80
0
DNL
60
-0.025
40
-0.05
20
0
8
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
300
0.4
60
0.2
40
0
200
0
DNL
RW
100
DNL
RW
500
-0.05
16 24 32 40 48
Wiper Setting (decimal)
56
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
6
4
2
16 24 32 40 48
Wiper Setting (decimal)
0
56
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
DNL
RW
0
8
2.25
1.75
1.25
0.75
0.25
-0.25
-0.75
-1.25
-1.75
-2.25
-2.75
Error (LSb)
Wiper Resistance
(Rw)(ohms)
-40C Rw
-40C INL
-40C DNL
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-7:
2.1 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
DS20001978D-page 12
-2
0
FIGURE 2-6:
2.1 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
1100
1000
900
800
700
600
500
400
300
200
100
0
0
DNL
RW
8
16
24
32
40
48
Wiper Setting (decimal)
56
FIGURE 2-9:
2.1 k Rheo Mode – RW
(), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
1100
1000
900
800
700
600
500
400
300
200
100
0
-40C Rw
-40C INL
-40C DNL
Wiper Resistance
(Rw)(ohms)
8
8
200
-0.1
0
10
300
100
0
-0.2
-0.4
8
400
INL
0.6
FIGURE 2-8:
2.1 k Rheo Mode – RW
(), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
0.1
0.05
0.8
INL
0
Error (LSb)
Wiper Resistance
(Rw)(ohms)
-40C Rw
-40C INL
-40C DNL
125C Rw
125C INL
125C DNL
80
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-5:
2.1 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
400
85C Rw
85C INL
85C DNL
0
-0.1
0
25C Rw
25C INL
25C DNL
20
-0.075
RW
-40C Rw
-40C INL
-40C DNL
Error (LSb)
INL
100
0.075
Error (LSb)
125C Rw
125C INL
125C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
INL
RW
DNL
0
8
16 24 32 40 48
Wiper Setting (decimal)
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-2
Error (LSb)
85C Rw
85C INL
85C DNL
Wiper Resistance
(Rw)(ohms)
Wiper Resistance
(Rw)(ohms)
120
25C Rw
25C INL
25C DNL
Wiper Resistance
(Rw)(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
140
56
FIGURE 2-10:
2.1 k Rheo Mode – RW
(), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
2500
2000
2060
RWB (Ohms)
Nominal Resistance (RAB)
(Ohms)
2080
VDD = 5.5V
2040
2020
1500
1000
-40°C
25°C
85°C
125°C
500
VDD = 2.7V
0
2000
-40
0
40
80
Ambient Temperature (°C)
120
FIGURE 2-11:
2.1 k – Nominal
Resistance () vs. Ambient Temperature and
VDD.
2006-2017 Microchip Technology Inc.
0
8
16
24
32
40
48
Wiper Setting (decimal)
56
64
FIGURE 2-12:
2.1 k – RWB () vs. Wiper
Setting and Ambient Temperature.
DS20001978D-page 13
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
WIPER
WIPER
WIPER
U/D
U/D
U/D
FIGURE 2-13:
2.1 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V).
FIGURE 2-16:
2.1 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V).
WIPER
WIPER
U/D
U/D
FIGURE 2-14:
2.1 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V).
FIGURE 2-17:
2.1 k – Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V).
WIPER
VDD
FIGURE 2-15:
Response Time.
DS20001978D-page 14
2.1 k – Power-Up Wiper
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
0.05
100
0.025
INL
80
0
DNL
60
-0.025
40
-0.05
20
0
-0.1
0
8
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
350
0.1
300
0.025
250
0
DNL
-0.025
150
-0.05
RW
100
50
0
16
24
32
40
48
-0.4
-0.6
8
16 24 32 40 48
Wiper Setting (decimal)
-40C Rw
-40C INL
-40C DNL
INL
1500
DNL
1000
RW
500
0
0
8
0
DNL
0
-1
8
16 24 32 40 48
Wiper Setting (decimal)
56
FIGURE 2-22:
5 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
2000
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-20:
5 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
2006-2017 Microchip Technology Inc.
3
1
0
2.25
1.75
1.25
0.75
0.25
-0.25
-0.75
-1.25
-1.75
-2.25
-2.75
4
200
Wiper Resistance
(Rw)(ohms)
125C Rw
125C INL
125C DNL
5
2
56
Error (LSb)
Wiper Resistance
(Rw)(ohms)
2000
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
300
2500
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
RW
FIGURE 2-19:
5 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
INL
400
Wiper Setting (decimal)
2500
56
FIGURE 2-21:
5 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
-0.125
8
-0.2
RW
100
-0.1
0
40
500
-0.075
0.4
0
DNL
600
0.075
0.6
0.2
INL
0
0.05
INL
200
60
125C Rw
125C INL
125C DNL
0
Error (LSb)
Wiper Resistance
(Rw)(ohms)
400
85C Rw
85C INL
85C DNL
80
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-18:
5 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
450
25C Rw
25C INL
25C DNL
20
-0.075
RW
-40C Rw
-40C INL
-40C DNL
Error (LSb)
0.075
Error (LSb)
125C Rw
125C INL
125C DNL
INL
1500
1000
RW
500
DNL
0
0
8
16 24 32 40 48
Wiper Setting (decimal)
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-2
Error (LSb)
100
85C Rw
85C INL
85C DNL
Wiper Resistance
(Rw)(ohms)
Wiper Resistance
(Rw)(ohms)
120
25C Rw
25C INL
25C DNL
Wiper Resistance
(Rw)(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
140
56
FIGURE 2-23:
5 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
DS20001978D-page 15
MCP4011/2/3/4
4950
6000
4925
5000
4900
4000
RWB (Ohms)
Nominal Resistance (RAB)
(Ohms)
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
4875
VDD = 5.5V
4850
4825
3000
2000
-40°C
25°C
85°C
125°C
1000
VDD = 2.7V
4800
0
-40
-20
0
20
40
60
80
100 120
Ambient Temperature (°C)
FIGURE 2-24:
5 k – Nominal Resistance
() vs. Ambient Temperature and VDD.
DS20001978D-page 16
0
8
16
24
32
40
48
Wiper Setting (decimal)
56
64
FIGURE 2-25:
5 k – RWB () vs. Wiper
Setting and Ambient Temperature.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
WIPER
WIPER
U/D
U/D
FIGURE 2-26:
5 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V).
FIGURE 2-28:
5 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V).
WIPER
WIPER
U/D
FIGURE 2-27:
5 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V).
2006-2017 Microchip Technology Inc.
U/D
FIGURE 2-29:
5 k – Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V).
DS20001978D-page 17
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
0.05
120
0.025
100
DNL
80
0
INL
60
-0.025
40
-0.05
RW
20
-0.075
0
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
DNL
300
INL
250
-0.05
150
-0.075
RW
100
-0.1
50
0
-0.125
8
60
0
40
-0.05
RW
-0.1
-0.15
8
-40C Rw
-40C INL
-40C DNL
3000
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
2500
DNL
2000
1500
INL
1000
500
RW
0
0
8
125C Rw
125C INL
125C DNL
1.5
200
DNL
-0.5
RW
100
-1.5
-2.5
8
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-34:
10 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
2500
FIGURE 2-32:
10 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
2.5
0.5
3000
16 24 32 40 48 56
Wiper Setting (decimal)
DS20001978D-page 18
85C Rw
85C INL
85C DNL
INL
0
2.25
1.75
1.25
0.75
0.25
-0.25
-0.75
-1.25
-1.75
-2.25
-2.75
25C Rw
25C INL
25C DNL
0
Error (LSb)
-40C Rw
-40C INL
-40C DNL
56
300
3500
3500
16 24 32 40 48
Wiper Setting (decimal)
400
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-31:
10 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
Wiper Resistance
(Rw)(ohms)
0.05
500
0.025
-0.025
200
0.1
FIGURE 2-33:
10 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
0.05
0
0.15
DNL
Wiper Resistance
(Rw)(ohms)
Wiper Resistance
(Rw)(ohms)
25C Rw
25C INL
25C DNL
350
0
80
0
Error (LSb)
-40C Rw
-40C INL
-40C DNL
400
125C Rw
125C INL
125C DNL
0
FIGURE 2-30:
10 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
450
85C Rw
85C INL
85C DNL
INL
16 24 32 40 48 56
Wiper Setting (decimal)
Wiper Resistance
(Rw)(ohms)
8
25C Rw
25C INL
25C DNL
20
-0.1
0
-40C Rw
-40C INL
-40C DNL
Error (LSb)
125C Rw
125C INL
125C DNL
Error (LSb)
85C Rw
85C INL
85C DNL
Error (LSb)
Wiper Resistance
(Rw)(ohms)
100
25C Rw
25C INL
25C DNL
RW
2000
1500
INL
1000
500
DNL
0
0
8
16 24 32 40 48
Wiper Setting (decimal)
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-2
Error (LSb)
-40C Rw
-40C INL
-40C DNL
Wiper Resistance
(Rw)(ohms)
120
56
FIGURE 2-35:
10 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
12000
10250
10230
10210
10190
10170
10150
10130
10110
10090
10070
10050
10000
VDD = 5.5V
VDD = 2.7V
RWB (Ohms)
Nominal Resistance (RAB)
(Ohms)
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
8000
6000
4000
-40°C
25°C
85°C
125°C
2000
0
-40
-20
0
20 40 60 80 100 120
Ambient Temperature (°C)
FIGURE 2-36:
10 k – Nominal Resistance
() vs. Ambient Temperature and VDD.
2006-2017 Microchip Technology Inc.
0
8
16
24
32
40
48
Wiper Setting (decimal)
56
64
FIGURE 2-37:
10 k – RWB () vs. Wiper
Setting and Ambient Temperature.
DS20001978D-page 19
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
WIPER
WIPER
U/D
FIGURE 2-38:
10 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V).
WIPER
U/D
FIGURE 2-39:
10 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V).
DS20001978D-page 20
U/D
FIGURE 2-40:
10 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V).
WIPER
U/D
FIGURE 2-41:
10 k – Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V).
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
120
0
INL
-0.05
RW
40
150
-0.1
0
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
400
300
600
0.025
500
-0.025
INL
200
-0.05
100
-0.075
RW
0
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
RW
INL
DNL
0
8
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-44:
50 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
2006-2017 Microchip Technology Inc.
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
1.5
1
RW
0.5
INL
0
DNL
200
-0.5
100
-1
-1.5
0
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-2
56
0
Error (LSb)
25C Rw
25C INL
25C DNL
Wiper Resistance
(Rw)(ohms)
-40C Rw
-40C INL
-40C DNL
16 24 32 40 48
Wiper Setting (decimal)
300
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-43:
50 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
12000
11000
10000
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
-0.1
8
400
-0.1
8
-0.05
FIGURE 2-45:
50 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
0.05
0
0
50
0
DNL
0.1
0
RW
0
Error (LSb)
Wiper Resistance
(Rw)(ohms)
500
25C Rw
25C INL
25C DNL
0.15
0.05
16 24 32 40 48 56
Wiper Setting (decimal)
-40C Rw
-40C INL
-40C DNL
125C Rw
125C INL
125C DNL
DNL
FIGURE 2-42:
50 k Pot Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
600
85C Rw
85C INL
85C DNL
INL
Wiper Resistance
(Rw)(ohms)
8
25C Rw
25C INL
25C DNL
100
-0.15
0
-40C Rw
-40C INL
-40C DNL
Error (LSb)
0.05
DNL
80
200
Error (LSb)
0.1
125C Rw
125C INL
125C DNL
8
16 24 32 40 48
Wiper Setting (decimal)
56
FIGURE 2-46:
50 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 2.7V).
12000
11000
10000
9000
8000
7000
6000
5000
4000
3000
2000
1000
0
-40C Rw
-40C INL
-40C DNL
25C Rw
25C INL
25C DNL
85C Rw
85C INL
85C DNL
125C Rw
125C INL
125C DNL
RW
INL
DNL
0
8
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
-2
Error (LSb)
85C Rw
85C INL
85C DNL
Wiper Resistance
(Rw)(ohms)
Wiper Resistance
(Rw)(ohms)
160
25C Rw
25C INL
25C DNL
Wiper Resistance
(Rw)(ohms)
-40C Rw
-40C INL
-40C DNL
Error (LSb)
200
16 24 32 40 48 56
Wiper Setting (decimal)
FIGURE 2-47:
50 k Rheo Mode – RW (),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
DS20001978D-page 21
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
60000
49600
50000
49400
VDD = 5.5V
49200
49000
48800
VDD = 2.7V
48600
48400
RWB (Ohms)
Nominal Resistance (RAB)
(Ohms)
49800
40000
30000
20000
-40C
25C
85C
125C
10000
48200
48000
0
-40
-20
0
20 40 60 80 100 120
Ambient Temperature (°C)
FIGURE 2-48:
50 k – Nominal Resistance
() vs. Ambient Temperature and VDD.
DS20001978D-page 22
0
8
16
24
32
40
48
Wiper Setting (decimal)
56
64
FIGURE 2-49:
50 k – RWB () vs. Wiper
Setting and Ambient Temperature.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
U/D
U/D
WIPER
WIPER
FIGURE 2-50:
50 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V).
FIGURE 2-53:
50 k – Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V).
U/D
U/D
WIPER
WIPER
FIGURE 2-51:
50 k – Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V).
FIGURE 2-54:
50 k - Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V).
WIPER
VDD
FIGURE 2-52:
Response Time.
50 k – Power-Up Wiper
2006-2017 Microchip Technology Inc.
DS20001978D-page 23
MCP4011/2/3/4
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
-3dB Frequency (MHz)
4.5
4
A
2.1 k:
3.5
3
VIN
2.5
5 k:
2
1.5
10 k:
1
0.5
W
~
Offset
Gnd
+5V
DUT
+
VOUT
-
B
50 k:
2.5V DC
0
-40
25
125
Temperature (°C)
FIGURE 2-55:
Temperature.
DS20001978D-page 24
–3 dB Bandwidth vs.
FIGURE 2-56:
Circuit.
–3 dB Bandwidth Test
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
MCP4011
(SOIC-8)
MCP4012
MCP4014 Symbol
MCP4013
(SOT-23-5)
(SOT-23-6)
Buffer
Type
1
1
VDD
P
—
Positive Power Supply Input
2
2
2
VSS
P
—
Ground
3
6
—
A
I/O
A
Potentiometer Terminal A
4
5
5
W
I/O
A
Potentiometer Wiper Terminal
5
4
4
CS
I
TTL
6
—
—
B
I/O
A
Potentiometer Terminal B
7
—
—
NC
—
—
No Connection
8
3
3
U/D
I
TTL
Chip Select Input
Increment/Decrement Input
A = Analog input
O = Output
Positive Power Supply Input (VDD)
The VDD pin is the device’s positive power supply
input. The input power supply is relative to VSS and
can range from 1.8V to 5.5V. A decoupling capacitor
on VDD (to VSS) is recommended to achieve maximum performance.
3.2
Function
1
Legend: TTL = TTL compatible input
I = Input
P = Power
3.1
Pin
Type
Ground (VSS)
3.4
Potentiometer Wiper (W) Terminal
The terminal W pin is connected to the internal potentiometer’s terminal W (the wiper). The wiper terminal is
the adjustable terminal of the digital potentiometer. The
terminal W pin does not have a polarity relative to
terminals A or B pins. The terminal W pin can support
both positive and negative current. The voltage on
terminal W must be between VSS and VDD.
The VSS pin is the device ground reference.
3.5
3.3
The terminal B pin is connected to the internal potentiometer’s terminal B (available on some devices). The
potentiometer’s terminal B is the fixed connection to the
0x00 terminal of the digital potentiometer.
Potentiometer Terminal A
The terminal A pin is connected to the internal potentiometer’s terminal A (available on some devices). The
potentiometer’s terminal A is the fixed connection to the
0x3F terminal of the digital potentiometer.
The terminal A pin is available on the MCP4011,
MCP4012 and MCP4013 devices. The terminal A pin
does not have a polarity relative to the terminal W or B
pins. The terminal A pin can support both positive and
negative current. The voltage on terminal A must be
between VSS and VDD.
The terminal A pin is not available on the MCP4014.
The potentiometer’s terminal A is internally floating.
Potentiometer Terminal B
The terminal B pin is available on the MCP4011 device.
The terminal B pin does not have a polarity relative to
the terminal W or A pins. The terminal B pin can
support both positive and negative current. The voltage
on terminal B must be between VSS and VDD.
The terminal B pin is not available on the MCP4012,
MCP4013 and MCP4014 devices.
For the MCP4013 and MCP4014, the internal potentiometer’s terminal B is internally connected to VSS.
Terminal B does not have a polarity relative to
terminals W or A. Terminal B can support both positive
and negative current.
For the MCP4012, terminal B is internally floating.
2006-2017 Microchip Technology Inc.
DS20001978D-page 25
MCP4011/2/3/4
3.6
Chip Select (CS)
The CS pin is the chip select input. Forcing the CS pin
to VIL enables the serial commands. These commands
can increment and decrement the wiper. Forcing the
CS pin to VIHH enables the high-voltage serial
commands. These commands can increment and
decrement the wiper and are compatible with the
MCP402X devices. The wiper is saved to volatile
memory (RAM).
3.7
Increment/Decrement (U/D)
The U/D pin input is used to increment or decrement
the wiper on the digital potentiometer. An increment
moves the wiper one step toward terminal A, while a
decrement moves the wiper one step toward
terminal B.
The CS pin has an internal pull-up resistor. The resistor
will become “disabled” when the voltage on the CS pin
is below the VIH level. This means that when the CS pin
is “floating”, the CS pin will be pulled to the VIH level
(serial communication (the U/D pin) is ignored). And
when the CS pin is driven low (VIL), the resistance
becomes very large to reduce the device current
consumption when serial commands are occurring.
See Figure 2-3 for additional information.
DS20001978D-page 26
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
4.0
GENERAL OVERVIEW
EQUATION 4-1:
The MCP402X devices are general-purpose digital
potentiometers intended to be used in applications
where a programmable resistance with moderate
bandwidth is desired.
Applications generally suited for the MCP402X devices
include:
•
•
•
•
Set point or offset trimming
Sensor calibration
Selectable gain and offset amplifier designs
Cost-sensitive mechanical trim pot replacement
There are 63 resistors in a string between terminal A
and terminal B. The wiper can be set to tap onto any of
these 63 resistors thus providing 64 possible settings
(including terminal A and terminal B).
Figure 4-1 shows a block diagram for the resistive
network of the device. Equation 4-1 shows the
calculation for the step resistance, while Equation 4-2
illustrates the calculation used to determine the
resistance between the wiper and terminal B.
A
N = 62
RS
3Eh
RW
(1)
RW
(1)
3Dh
N = 61
RS
W
N=1
01h
RW
RS
(1)
N=0
B
00h
RW (1)
EQUATION 4-2:
RWB CALCULATION
R AB N
- + RW
R WB = ------------63
The ideal resistance difference between two successive
codes is 1 LSb. If we use N = 1 and RW = 0 in
Equation 4-2, we can calculate the step size for each
increment or decrement command.
The MCP4011 device offers a voltage divider
(potentiometer) with all terminals available on pins.
The MCP4012 is a true rheostat, with terminal A and
the wiper (W) of the variable resistor available on pins.
The MCP4013 device offers a voltage divider (potentiometer) with terminal B connected to ground.
The MCP4014 device is a Rheostat device with
terminal A of the resistor floating, terminal B connected
to ground, and the wiper (W) available on pin.
The MCP4011 can be externally configured to
implement any of the MCP4012, MCP4013 or
MCP4014 configurations.
4.1
3Fh
RW (1)
RS
R AB
R S = --------63
N = 0 to 63 (decimal)
The digital potentiometer is available in four nominal
resistances (RAB), where the nominal resistance is
defined as the resistance between terminal A and
terminal B. The four nominal resistances are 2.1 k,
5 k, 10 k and 50 k
N = 63
RS CALCULATION
Serial Interface
A 2-wire synchronous serial protocol is used to
increment or decrement the digital potentiometer’s
wiper terminal. The Increment/Decrement (U/D)
protocol utilizes the CS and U/D input pins. Both inputs
are tolerant of signals up to 12.5V without damaging
the device. The CS pin can differentiate between two
high-voltage levels, VIH and VIHH. This enables
additional commands without requiring additional input
pins. The high-voltage commands (VIHH on the CS pin)
are similar to the standard commands and are
supported for compatibility to the MCP401X family of
devices.
The simple U/D protocol uses the state of the U/D pin
at the falling edge of the CS pin to determine if
Increment or Decrement mode is desired. Subsequent
rising edges of the U/D pin move the wiper.
The wiper value will not underflow or overflow.
Analog
Mux
Note 1: The wiper resistance is tap dependent.
That is, each tap selection resistance
has a small variation. This variation
effects the smaller resistance devices
(2.1 k) more.
FIGURE 4-1:
Resistor Block Diagram.
2006-2017 Microchip Technology Inc.
DS20001978D-page 27
MCP4011/2/3/4
4.2
Power-Up
4.3
When the device powers up (rising VDD crosses the
Trip Point Voltage (VTP)), the default wiper setting is
restored. Table 4-1 shows the default value loaded into
the wiper on POR/BOR.
TABLE 4-1:
DEFAULT POR WIPER
SETTING SELECTION
Default
POR
Wiper
Setting
Wiper
Code
Typical
RAB Value
Mid-scale
1Fh
2.1 k
Package
Code
–202
–502
Mid-scale
1Fh
5.0 k
–103
Mid-scale
1Fh
10.0 k
–503
Mid-scale
1Fh
50.0 k
Brown-Out
If the device VDD is below the specified minimum
voltage, care must be taken to ensure that the CS and
U/D pins do not “create” any of the serial commands.
When the device VDD drops below VMIN (1.8V), the
electrical performance may not meet the data sheet
specifications (see Figure 4-2). The wiper state may be
unknown. Also, the device may be capable of
incrementing or decrementing, if a valid command is
detected on the CS and U/D pins.
When the device voltage rises from below the powerup trip point (VTP) into the valid operation voltage
range, the wiper state will be forced to the default POR
wiper setting (see Table 4-1).
4.4
Serial Interface Inactive
The serial interface is inactive any time the CS pin is at
VIH and all write cycles are completed.
While VDD < Vmin (1.8V), the electrical performance
may not meet the data sheet specifications (see
Figure 4-2). The wiper state may be unknown. Also, the
device may be capable of incrementing or decrementing, if a valid command is detected on the CS and U/D
pins.
VDD
1.8V
VTP
VSS
POR Trip Point (on Rising VDD)
Outside Device Operation
Wiper Forced to Default POR Setting
FIGURE 4-2:
DS20001978D-page 28
Power-Up and Brown-Out.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
5.0
SERIAL INTERFACE
5.1
Overview
5.2
The MCP4011/2/3/4 utilizes a simple 2-wire interface to
increment or decrement the digital potentiometer’s wiper
terminal (W). This interface uses the CS and U/D pins.
The CS pin is the Chip Select input, while the U/D pin is
the Up/Down input.
The Increment/Decrement protocol enables the device
to move one step at a time through the range of
possible resistance values. The wiper value is
initialized with the “default” value upon power-up.
A wiper value of 00h connects the wiper to terminal B.
A wiper value of 3Fh connects the wiper to terminal A.
Increment commands move the wiper toward terminal
A, but will not increment to a value greater than 3Fh.
Decrement commands move the wiper toward terminal
B, but will not decrement below 00h.
Refer to Section 1.0 “Electrical Characteristics”,
AC/DC Electrical Characteristics table for detailed input
threshold and timing specifications.
Serial Commands
The MCP401X devices support eight serial commands.
Six of these commands are for support and to ease
migration with the MCP402X family of devices. The
commands can be grouped into the following types:
• Serial Commands
• High-voltage Serial Commands
All the commands are shown in Table 5-1.
The command type is determined by the voltage level
the CS pin is driven to. The initial state that the CS pin
must be driven is VIH. From VIH, the two levels that the
CS pin can be driven are:
• VIL
• VIHH
If the CS pin is driven from VIH to VIL, a serial
command is selected. If the CS pin is driven from VIH to
VIHH, a high-voltage serial command is selected.
Support of the high-voltage serial commands is for
compatibility with the MCP402X devices.
Communication is unidirectional. Therefore, the value
of the current wiper setting cannot be read out of the
MCP401X device.
TABLE 5-1:
COMMANDS
Command Name
High Voltage
on CS Pin?
Increment
—
Increment (for MCP402X Compatibility)
—
Decrement
—
Decrement (for MCP402X Compatibility)
—
High-Voltage Increment 1 (for MCP402X Compatibility)
Yes
High-Voltage Increment 2 (for MCP402X Compatibility)
Yes
High-Voltage Decrement 1 (for MCP402X Compatibility)
Yes
High-Voltage Decrement 2 (for MCP402X Compatibility)
Yes
2006-2017 Microchip Technology Inc.
DS20001978D-page 29
MCP4011/2/3/4
5.2.1
INCREMENT
When the device voltage falls below the RAM retention
voltage of the device, the wiper state may be corrupted.
When the device returns to the operating range, the
wiper will be loaded with the default POR wiper setting.
This mode is achieved by initializing the U/D pin to a
high state (VIH) prior to achieving a low state (VIL) on the
CS pin. Subsequent rising edges of the U/D pin
increment the wiper setting toward terminal A. This is
shown in Figure 5-1.
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
After the wiper is incremented to the desired position,
the CS pin should be forced to VIH to ensure that
“unexpected” transitions on the U/D pin do not cause
the wiper setting to increment. Driving the CS pin to VIH
should occur as soon as possible (within device
specifications) after the last desired increment occurs.
Note:
The wiper value will not overflow. That is,
once the wiper value equals 0x3F,
subsequent increment commands are
ignored.
VIH
CS
VIL
1
U/D
DS20001978D-page 30
3
5
4
6
VIH
VIL
Wiper
FIGURE 5-1:
2
X
X+1
X+2
X+3
X+4
Increment.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
5.2.2
Note:
INCREMENT (FOR MCP402X
COMPATIBILITY)
When the device voltage falls below the RAM retention
voltage of the device, the wiper state may be corrupted.
When the device returns to the operating range, the
wiper will be loaded with the Default POR wiper setting.
This command allows compatibility with
the MCP402X family, which supports
updating of the nonvolatile wiper setting.
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
This mode is achieved by initializing the U/D pin to a
high state (VIH) prior to achieving a low state (VIL) on the
CS pin. Subsequent rising edges of the U/D pin
increments the wiper setting toward terminal A. This is
shown in Figure 5-2.
Note:
The wiper value will not overflow. That is,
once the wiper value equals 0x3F,
subsequent increment commands are
ignored.
After the wiper is incremented to the desired position,
the U/D pin should be driven low (VIL), and the CS pin
should be forced to VIH to ensure that “unexpected”
transitions on the U/D pin do not cause the wiper
setting to increment. Driving the CS pin to VIH should
occur as soon as possible (within device specifications)
after the last desired increment occurs.
VIH
VIH
VIL
CS
VIH
1
2
3
4
5
Wiper
FIGURE 5-2:
6
VIL
U/D
X
X+1
X+2
X+3
X+4
Increment (For MCP402X Compatibility).
2006-2017 Microchip Technology Inc.
DS20001978D-page 31
MCP4011/2/3/4
5.2.3
DECREMENT
When the device voltage falls below the RAM retention
voltage of the device, the wiper state may be corrupted.
When the device returns to the operating range, the
wiper will be loaded with the default POR wiper setting.
This mode is achieved by initializing the U/D pin to a low
state (VIL) prior to achieving a low state (VIL) on the CS
pin. Subsequent rising edges of the U/D pin will
decrement the wiper setting toward terminal B. This is
shown in Figure 5-3.
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
After the wiper is decremented to the desired position,
the U/D pin should be forced low (VIL) and the CS pin
should be forced to VIH. This will ensure that
“unexpected” transitions on the U/D pin do not cause
the wiper setting to decrement. Driving the CS pin to
VIH should occur as soon as possible (within device
specifications) after the last desired increment occurs.
Note:
The wiper value will not underflow. That is,
once the wiper value equals 0x00,
subsequent decrement commands are
ignored.
VIH
VIL
CS
1
U/D
Wiper
FIGURE 5-3:
DS20001978D-page 32
2
4 VIH
3
5
6
VIL
VIL
X
X-1
X-2
X-3
X-4
Decrement.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
5.2.4
Note:
DECREMENT (FOR MCP402X
COMPATIBILITY)
When the device voltage falls below the RAM retention
voltage of the device, the wiper state may be corrupted.
When the device returns to the operating range, the
wiper will be loaded with the default POR wiper setting.
This command allows compatibility with
the MCP402X family, which supports
updating of the nonvolatile wiper setting.
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
This mode is achieved by initializing the U/D pin to a
low state (VIL) prior to achieving a low state (VIL) on the
CS pin. Subsequent rising edges of the U/D pin
decrement the wiper setting toward terminal B. This is
shown in Figure 5-4.
Note:
The wiper value will not underflow. That is,
once the wiper value equals 0x00,
subsequent decrement commands are
ignored.
After the wiper is decremented to the desired position,
the U/D pin should remain high (VIH), and the CS pin
should be forced to VIH to ensure that “unexpected”
transitions on the U/D pin do not cause the wiper
setting to increment. Driving the CS pin to VIH should
occur as soon as possible (within device specifications)
after the last desired increment occurs.
VIH
VIL
CS
1
U/D
Wiper
FIGURE 5-4:
2
3
4
5
6
VIH
VIL
X
X-1
X-2
X-3
X-4
Decrement (for MCP402X Compatibility).
2006-2017 Microchip Technology Inc.
DS20001978D-page 33
MCP4011/2/3/4
5.2.5
Note:
HIGH-VOLTAGE INCREMENT 1
(FOR MCP402X COMPATIBILITY)
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
Note:
This command allows compatibility with
the MCP402X family, which supports
updating of the nonvolatile wiper setting
with the WiperLock Technology feature.
The wiper value will not overflow. That is,
once the wiper value equals 0x3F,
subsequent increment commands are
ignored.
This mode is achieved by initializing the U/D pin to a
high state (VIH) prior to the CS pin being driven to VIHH.
Subsequent rising edges of the U/D pin increment the
wiper setting toward terminal A. Set the U/D pin to the
high state (VIH) prior to forcing the CS pin to VIH. This
is shown in Figure 5-5.
VIHH
VIH
VIH
CS
VIH
U/D
Wiper
FIGURE 5-5:
DS20001978D-page 34
1
2
3
5
4
6
VIH
VIL
X
X+1
X+2
X+3
X+4
High-Voltage Increment 1 (for MCP402X Compatibility).
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
5.2.6
Note:
HIGH-VOLTAGE INCREMENT 2
(FOR MCP402X COMPATIBILITY)
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
Note:
This command allows compatibility with
the MCP402X family, which supports
updating of the nonvolatile wiper setting
with the WiperLock Technology feature.
The wiper value will not overflow. That is,
once the wiper value equals 0x3F,
subsequent increment commands are
ignored.
This mode is achieved by initializing the U/D pin to a
high state (VIH) prior to the CS pin being driven to VIHH.
Subsequent rising edges of the U/D pin increment the
wiper setting toward terminal A. Set the U/D pin to the
low state (VIL) prior to forcing the CS pin to VIH. This is
shown in Figure 5-6.
VIHH
VIH
VIH
CS
VIH
U/D
1
3
4
5
6
VIL
VIL
Wiper
FIGURE 5-6:
2
X
X+1
X+2
X+3
X+4
High-Voltage Increment 2 (for MCP402X Compatibility).
2006-2017 Microchip Technology Inc.
DS20001978D-page 35
MCP4011/2/3/4
5.2.7
Note:
HIGH-VOLTAGE DECREMENT 1
(FOR MCP402X COMPATIBILITY)
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
Note:
This command allows compatibility with
the MCP402X family, which supports
updating of the nonvolatile wiper setting
with the WiperLock Technology feature.
The wiper value will not underflow. That is,
once the wiper value equals 0x00,
subsequent decrement commands are
ignored.
This mode is achieved by initializing the U/D pin to a
low state (VIL) prior to the CS pin being driven to VIHH.
Subsequent rising edges of the U/D pin decrement the
wiper setting toward terminal B. Set the U/D pin to the
low state (VIL) prior to forcing the CS pin to VIH. This is
shown in Figure 5-7.
VIHH
VIH
VIH
CS
1
U/D
Wiper
FIGURE 5-7:
DS20001978D-page 36
2
3
4
6 VIH
5
VIL
VIL
X
X-1
X-2
X-3
X-4
High-Voltage Decrement 1 (for MCP402X Compatibility).
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
5.2.8
Note:
HIGH-VOLTAGE DECREMENT 2
(FOR MCP402X COMPATIBILITY)
After the CS pin is driven to VIH (from VIL), any other
serial command may immediately be entered.
Note:
This command allows compatibility with
the MCP402X family, which supports
updating of the nonvolatile wiper setting
with the WiperLock Technology feature.
The wiper value will not underflow. That is,
once the wiper value equals 0x00,
subsequent decrement commands are
ignored.
This mode is achieved by initializing the U/D pin to the
low state (VIL) prior to driving the CS pin to VIHH.
Subsequent rising edges of the U/D pin decrement the
wiper setting toward terminal B. Set the U/D pin to a
high state (VIH) prior to forcing the CS pin to VIH. This
is shown in Figure 5-8.
VIHH
VIH
VIH
CS
1
U/D
Wiper
FIGURE 5-8:
2
3
VDD 5
4
6
VIH
VIL
X
X-1
X-2
X-3
X-4
High-Voltage Decrement 2 (for MCP402X Compatibility).
2006-2017 Microchip Technology Inc.
DS20001978D-page 37
MCP4011/2/3/4
5.3
CS High Voltage
The CS pin is high-voltage (VIHH) tolerant, like the
MCP402X. This allows the MCP401X to be used in
MCP402X applications without needing to change
other portions of the application circuit.
6.0
RESISTOR
Digital potentiometer applications can be divided into
two categories:
Figure 6-1 shows a block diagram for the MCP401X
resistors.
A
RW
(1)
RW
(1)
RW
(1)
N = 62
Typical Resistance ()
Total (RAB)
Step (RS)
MCP401X-202E
2100
33.33
MCP401X-502E
5000
79.37
MCP401X-103E
10000
158.73
MCP401X-503E
50000
793.65
Terminal A and B, as well as the wiper W, do not have
a polarity. These terminals can support both positive
and negative current.
3Eh
3Dh
N = 61
RS
TABLE 6-1: TYPICAL STEP RESISTANCES
3Fh
N = 63
RS
The total resistance of the device has minimal variation
due to operating voltage (see Figure 2-11, Figure 2-24,
Figure 2-36 or Figure 2-48).
Part Number
• Rheostat configuration
• Potentiometer (or voltage divider) configuration
RS
Step resistance (RS) is the resistance from one tap
setting to the next. This value will be dependent on the
RAB value that has been selected. Table 6-1 shows the
typical step resistances for each device.
W
N=1
01h
RW (1)
RS
N=0
B
00h
RW
(1)
Analog
Mux
Note 1: The wiper resistance is tap dependent.
That is, each tap selection resistance
has a small variation. This variation
effects the smaller resistance devices
(2.1 k) more.
FIGURE 6-1:
DS20001978D-page 38
Resistor Block Diagram.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
6.1
Resistor Configurations
6.1.1
6.1.2
RHEOSTAT CONFIGURATION
When used as a rheostat, two of the three digital potentiometer’s terminals are used as a resistive element in
the circuit. With terminal W (wiper) and either terminal
A or terminal B, a variable resistor is created. The
resistance will depend on the tap setting of the wiper
and the wiper’s resistance. The resistance is controlled
by changing the wiper setting.
The unused terminal (B or A) should be left floating.
Figure 6-2 shows the two possible resistors that can be
used. Reversing the polarity of the A and B terminals
will not affect operation.
POTENTIOMETER
CONFIGURATION
When used as a potentiometer, all three terminals are
tied to different nodes in the circuit. This allows the
potentiometer to output a voltage proportional to the
input voltage. This configuration is sometimes called
voltage divider mode. The potentiometer is used to
provide a variable voltage by adjusting the wiper
position between the two endpoints as shown in
Figure 6-3. Reversing the polarity of the A and B
terminals will not affect operation.
V1
A
W
A
V3
B
W
RAW or
RBW
B
FIGURE 6-3:
Resistor
FIGURE 6-2:
Rheostat Configuration.
This allows the control of the total resistance between
the two nodes. The total resistance depends on the
“starting” terminal to the wiper terminal. At the code
00h, the RBW resistance is minimal (RW), but the RAW
resistance in maximized (RAB + RW). Conversely, at the
code 3Fh, the RAW resistance is minimal (RW), but the
RBW resistance in maximized (RAB + RW).
The resistance step size (RS) equates to one LSb of the
resistor.
Note:
V2
To avoid damage to the internal wiper
circuitry in this configuration, care should
be taken to insure the current flow never
exceeds 2.5 mA.
Potentiometer Configuration.
The temperature coefficient of the RAB resistors is
minimal by design. In this configuration, the resistors all
change uniformly, so minimal variation should be seen.
The wiper resistor temperature coefficient is different
from the RAB temperature coefficient. The voltage at
node V3 (Figure 6-3) is not dependent on this wiper
resistance, just the ratio of the RAB resistors, so this
temperature coefficient in most cases can be
ignored.
Note:
To avoid damage to the internal wiper
circuitry in this configuration, care should
be taken to insure the current flow never
exceeds 2.5 mA.
The change in wiper-to-end terminal resistance over
temperature is shown in Figure 2-11, Figure 2-24,
Figure 2-36 and Figure 2-48. The most variation over
temperature will occur in the first few codes due to the
wiper resistance coefficient affecting the total
resistance. The remaining codes are dominated by the
total resistance tempco RAB.
2006-2017 Microchip Technology Inc.
DS20001978D-page 39
MCP4011/2/3/4
6.2
Wiper Resistance
The slope of the resistance has a linear area (at the
higher voltages) and a nonlinear area (at the lower voltages), where resistance increases faster than the voltage drop (at low voltages).
Wiper resistance is the series resistance of the wiper.
This resistance is typically measured when the wiper is
positioned at either zero-scale (00h) or full-scale (3Fh).
The wiper resistance in potentiometer-generated
voltage divider applications is not a significant source
of error.
The wiper resistance in rheostat applications can
create significant nonlinearity as the wiper is moved
toward zero-scale (00h). The lower the nominal
resistance, the greater the possible error.
RW
Wiper resistance is significant depending on the
devices operating voltage. As the device voltage
decreases, the wiper resistance increases (see
Figure 6-4 and Table 6-2).
VDD
Note:
In a rheostat configuration, this change in voltage
needs to be taken into account, particularly for the
lower resistance devices. For the 2.1 k device, the
maximum wiper resistance at 5.5V is approximately 6%
of the total resistance, while at 2.7V, it is approximately
15.5% of the total resistance.
FIGURE 6-4:
Relationship of Wiper
Resistance (RW) to Voltage.
Since there is minimal variation of the total device
resistance over voltage, at a constant temperature (see
Figure 2-11, Figure 2-24, Figure 2-36 or Figure 2-48),
the change in wiper resistance over voltage can have a
significant impact on the INL and DNL error.
In a potentiometer configuration, the wiper resistance
variation does not effect the output voltage seen on the
terminal W pin.
TABLE 6-2:
The slope of the resistance has a linear
area (at the higher voltages) and a nonlinear area (at the lower voltages).
TYPICAL STEP RESISTANCES AND RELATIONSHIP TO WIPER RESISTANCE
RW / RS (%) (1, 2)
Resistance ()
Typical
Wiper (RW)
Max @ Max @
5.5V
2.7V
RW =
Typical
RW = Max RW = Max
@ 5.5V
@ 2.7V
RW / RAB (%) (1, 3)
RW =
Typical
RW = Max RW = Max
@ 5.5V
@ 2.7V
Total
(RAB)
Step
(RS)
Typical
2100
33.33
75
125
325
225.0%
375.0%
975.0%
3.57%
5.95%
15.48%
5000
79.37
75
125
325
94.5%
157.5%
409.5%
1.5%
2.50%
6.50%
10000
158.73
75
125
325
47.25%
78.75%
204.75%
0.75%
1.25%
3.25%
50000
793.65
75
125
325
9.45%
15.75%
40.95%
0.15%
0.25%
0.65%
Note 1: The wiper resistance (RW) is not a significant source of error in potentiometer-generated voltage divider
applications. In rheostat applications, the variation of the RW value can create significant nonlinearity.
2: RS is the typical value. The variation of this resistance is minimal over voltage.
3: RAB is the typical value. The variation of this resistance is minimal over voltage.
DS20001978D-page 40
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
6.3
Operational Characteristics
Understanding the operational characteristics of the
device’s resistor components is important to the system
design.
6.3.1
6.3.1.1
6.3.1.2
Differential Nonlinearity (DNL)
DNL error is the measure of variations in code widths
from the ideal code width. A DNL error of zero would
imply that every code is exactly 1 LSb wide.
ACCURACY
Integral Nonlinearity (INL)
INL error for these devices is the maximum deviation
between an actual code transition point and its
corresponding ideal transition point after offset and
gain errors have been removed. These endpoints are
from 0x00 to 0x3F. Refer to Figure 6-5.
Positive INL means higher resistance than ideal.
Negative INL means lower resistance than ideal.
111
110
101
Digital
Input
Code
100
011
010
Actual
Transfer
Function
Ideal Transfer
Function
Wide Code, > 1 LSb
001
INL < 0
000
111
110
Narrow Code < 1 LSb
Actual
Rransfer
Function
Digital Pot Output
101
Digital
Input
Code
FIGURE 6-6:
100
6.3.1.3
011
Ideal Transfer
Function
010
001
000
INL < 0
Digital Pot Output
FIGURE 6-5:
INL Accuracy.
2006-2017 Microchip Technology Inc.
DNL Accuracy.
Ratiometric Temperature Coefficient
The ratiometric temperature coefficient quantifies the
error in the ratio RAW/RWB due to temperature drift.
This is typically the critical error when using a
potentiometer device (MCP4011 and MCP4013) in a
voltage divider configuration.
6.3.1.4
Absolute Temperature Coefficient
The absolute temperature coefficient quantifies the
error in the end-to-end resistance (nominal resistance
RAB) due to temperature drift. This is typically the
critical error when using a rheostat device (MCP4012
and MCP4014) in an adjustable resistor configuration.
DS20001978D-page 41
MCP4011/2/3/4
6.3.2
MONOTONIC OPERATION
Monotonic operation means that the device’s
resistance increases with every step change (from
terminal A to terminal B or terminal B to terminal A).
The wiper resistance is different at each tap location.
When changing from one tap position to the next (either
increasing or decreasing), the RW is less than the
RS. When this change occurs, the device voltage and
temperature are the same for the two tap positions.
RS63
0x3F
RS62
Digital Input Code
0x3E
0x3D
RS3
0x03
RS1
0x02
RS0
0x01
0x00
RW
n=?
(@ tap) R
=
RSn + RW(@ Tap n)
BW
n=0
Resistance (RBW)
FIGURE 6-7:
DS20001978D-page 42
Resistance RBW.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
7.0
DESIGN CONSIDERATIONS
In the design of a system with the MCP401X devices,
the following considerations should be taken into
account:
• The Power Supply
• The Layout
7.1
Power Supply Considerations
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 7-1 illustrates an
appropriate bypass strategy.
7.2
Layout Considerations
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP402X’s performance.
Careful board layout will minimize these effects and
increase the Signal-to-Noise Ratio (SNR). Bench
testing has shown that a multi-layer board utilizing a
low-inductance ground plane, isolated inputs, isolated
outputs and proper decoupling are critical to achieving
the performance that the silicon is capable of providing.
Particularly harsh environments may require shielding
of critical signals.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
In this example, the recommended bypass capacitor
value is 0.1 µF. This capacitor should be placed as
close (within 4 mm) to the device power pin (VDD) as
possible.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
VDD
0.1 µF
VDD
A
B
U/D
MCP402X
W
CS
VSS
FIGURE 7-1:
Connections.
PIC® Microcontroller
0.1 µF
VSS
Typical Microcontroller
2006-2017 Microchip Technology Inc.
DS20001978D-page 43
MCP4011/2/3/4
8.0
APPLICATIONS EXAMPLES
VDD
Nonvolatile digital potentiometers have a multitude of
practical uses in modern electronic circuits. The most
popular uses include precision calibration of set point
thresholds, sensor trimming, LCD bias trimming, audio
attenuation, adjustable power supplies, motor control
overcurrent trip setting, adjustable gain amplifiers and
offset trimming. The MCP4011/2/3/4 devices can be
used to replace the common mechanical trim pot in
applications where the operating and terminal voltages
are within CMOS process limitations (VDD = 2.7V to
5.5V).
8.1
R1
MCP4011
A
CS
U/D
W
VOUT
B
R2
Set Point Threshold Trimming
Applications that need accurate detection of an input
threshold event often need several sources of error
eliminated. Use of comparators and operational
amplifiers (op amps) with low offset and gain error can
help achieve the desired accuracy, but in many
applications, the input source variation is beyond the
designer’s control. If the entire system can be
calibrated after assembly in a controlled environment
(like factory test), these sources of error are minimized,
if not entirely eliminated.
Figure 8-1 illustrates a common digital potentiometer
configuration. This configuration is often referred to as
a “windowed voltage divider”. Note that R1 and R2 are
not necessary to create the voltage divider, but their
presence is useful when the desired threshold has
limited range. It is “windowed” because R1 and R2 can
narrow the adjustable range of VTRIP to a value much
less than VDD – VSS. If the output range is reduced, the
magnitude of each output step is reduced. This
effectively increases the trimming resolution for a fixed
digital potentiometer resolution. This technique may
allow a lower-cost digital potentiometer to be utilized
(64 steps instead of 256 steps).
The MCP4011’s and MCP4013’s low DNL performance
is critical to meeting calibration accuracy in production
without having to use a higher precision digital
potentiometer.
EQUATION 8-1:
V TRIP
CALCULATING THE
WIPER SETTING FROM
THE DESIRED VTRIP
R 2 + R WB
= V DD -----------------------------------
R 1 + R AB + R 2
FIGURE 8-1:
Using the Digital
Potentiometer to Set a Precise Output Voltage.
8.1.1
TRIMMING A THRESHOLD FOR AN
OPTICAL SENSOR
If the application has to calibrate the threshold of a
diode, transistor or resistor, a variation range of 0.1V is
common. Often, the desired resolution of 2 mV or
better is adequate to accurately detect the presence of
a precise signal. A “windowed” voltage divider, utilizing
the MCP4011 or MCP4013, would be a potential
solution as shown in Figure 8-2.
VDD
VDD
Rsense
VCC+
R1
MCP4011 A
CS
U/D
VTRIP
W
B
R2
FIGURE 8-2:
Calibration.
Comparator
MCP6021
0.1 µF
VCC–
Set Point or Threshold
R AB = R Nominal
D
R WB = R AB ------
63
V TRIP
D = -------------- R 1 + R AB + R 2 – R 2 63
V DD
Where:
D = Digital Potentiometer Wiper Setting (0-63)
DS20001978D-page 44
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
8.2
Operational Amplifier
Applications
VDD
VIN
Figure 8-3, Figure 8-4 and Figure 8-5 illustrate typical
amplifier circuits that could replace fixed resistors with
the MCP4011/2/3/4 to achieve digitally-adjustable
analog solutions.
R3
A
VIN
MCP4011
A
R3
MCP4012
FIGURE 8-4:
Trimming Offset and Gain in
a Noninverting Amplifier.
MCP4011
R3
A
R4
B
W
Pot2
VDD
A
B
–
–
Op Amp
VIN
W
Pot1
MCP4011
+
VOUT
MCP6021
1
fc = -----------------------------
2 R Eq C
R2
Op Amp
R1
W
B
R4
B
VOUT
–
A
W
R2
W
VDD
A
R1
MCP4011
Op Amp
VW
R1
MCP4011
Figure 8-4 shows a circuit that allows a noninverting
amplifier to have its’ offset and gain to be independently
trimmed. The MCP4011 is used along with resistors R1
and R2 to set the offset voltage. The sum of R1 + R2
resistance should be significantly greater (> 100 times)
the resistance value of the MCP4011. This allows each
increment or decrement in the MCP4011 to be a fine
adjustment of the offset voltage. The input voltage of
the op amp (VIN) should be centered at the op amps Vw
voltage. The gain is adjusted by the MCP4012. If the
resistance value of the MCP4012 is small compared to
the resistance value of R3, then this is a fine adjustment
of the gain. If the resistance value of the MCP4012 is
equal (or large) compared to the resistance value of R3,
then this is a course adjustment of the gain. In general,
trim the course adjustments first and then trim the fine
adjustments.
VDD
MCP6291
+
VOUT
+
MCP6001
W
B
Thevenin R
= R 1 + R AB – R WB R 2 + R WB + R w
Equivalent Eq
FIGURE 8-5:
Programmable Filter.
R2
FIGURE 8-3:
Trimming Offset and Gain in
an Inverting Amplifier.
2006-2017 Microchip Technology Inc.
DS20001978D-page 45
MCP4011/2/3/4
8.3
Temperature Sensor Applications
VDD
Thermistors are resistors with very predictable
variation with temperature. Thermistors are a popular
sensor choice when a low-cost, temperature-sensing
solution is desired. Unfortunately, thermistors have
nonlinear characteristics that are undesirable, typically
requiring trimming in an application to achieve greater
accuracy. There are several common solutions to trim
and linearize thermistors. Figure 8-6 and Figure 8-7
are simple methods for linearizing a 3-terminal NTC
thermistor. Both are simple voltage dividers using a
Positive Temperature Coefficient (PTC) resistor (R1)
with a transfer function capable of compensating for the
linearity error in the Negative Temperature Coefficient
(NTC) thermistor.
The circuit, illustrated by Figure 8-6, utilizes a digital
rheostat for trimming the offset error caused by the
thermistor’s part-to-part variation. This solution puts the
digital potentiometer’s RW into the voltage divider
calculation. The MCP4011/2/3/4’s RAB temperature
coefficient is 50 ppm (–20°C to +70°C). RW’s error is
substantially greater than RAB’s error because RW
varies with VDD, wiper setting and temperature. For the
50 k devices, the error introduced by RW is, in most
cases, insignificant as long as the wiper setting is > 6.
For the 2 k devices, the error introduced by RW is
significant because it is a higher percentage of RWB.
For these reasons, the circuit illustrated in Figure 8-6 is
not the most optimum method for “exciting” and
linearizing a thermistor.
VDD
R1
NTC
Thermistor
MCP4011
VOUT
R2
FIGURE 8-7:
Thermistor Calibration using
a Digital Potentiometer in a Potentiometer
Configuration.
8.4
Wheatstone Bridge Trimming
Another common configuration to “excite” a sensor
(such as a strain gauge, pressure sensor or thermistor)
is the Wheatstone bridge configuration. The Wheatstone bridge provides a differential output instead of a
single-ended output. Figure 8-8 illustrates a Wheatstone bridge utilizing one to three digital
potentiometers. The digital potentiometers in this
example are used to trim the offset and gain of the
Wheatstone bridge.
VDD
R1
NTC
Thermistor
VOUT
2.1 k
MCP4012
R2
A
W
MCP4012
FIGURE 8-6:
Thermistor Calibration using
a Digital Potentiometer in a Rheostat
Configuration.
The circuit illustrated by Figure 8-7 utilizes a digital
potentiometer for trimming the offset error. This
solution removes RW from the trimming equation along
with the error associated with RW. R2 is not required,
but can be utilized to reduce the trimming “window” and
reduce variation due to the digital potentiometer’s RAB
part-to-part variability.
DS20001978D-page 46
VOUT
MCP4012
50 k
FIGURE 8-8:
Trimming.
MCP4012
50 k
Wheatstone Bridge
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
9.0
DEVELOPMENT SUPPORT
9.1
Evaluation/Demonstration Boards
Currently there are three boards that are available that
can be used to evaluate the MCP401X family of
devices.
1.
The MCP402X Digital Potentiometer Evaluation
Board kit (MCP402XEV) contains a simple
demonstration board utilizing a PIC10F206, the
MCP401X and a blank PCB, which can be populated with any desired MCP4011/2/3/4 device
in a SOT-23-5, SOT-23-6 or 150 mil SOIC 8-pin
package.
This board has two push buttons to control when
the PIC® microcontroller generates MCP402X
serial commands. The example firmware
demonstrates the following commands:
• Increment
• Decrement
• High-Voltage Increment and Enable
WiperLock Technology
• High-Voltage Decrement and Enable
WiperLock Technology
• High-Voltage Increment and Disable
WiperLock Technology
• High-Voltage Decrement and Disable
WiperLock Technology
The populated board (with the MCP4011) can
be used to evaluate the other MCP401X devices
by appropriately jumpering the PCB pads.
2.
3.
4.
The SOT-23-5/6 Evaluation Board (VSUPEV2)
can be used to evaluate the characteristics of
the MCP4012, MCP4013 and MCP4014
devices.
The 8-pin SOIC/MSOP/TSSOP/DIP Evaluation
Board (SOIC8EV) can be used to evaluate the
characteristics of the MCP4011 device in either
the SOIC or MSOP package.
The MCP4XXX Digital Potentiometer Daughter
Board allows the system designer to quickly
evaluate the operation of Microchip Technology's MCP42XXX and MCP402X Digital Potentiometers. The board supports two MCP42XXX
devices and an MCP402X device, which can be
replaced with an MCP401X device.
The board also has a voltage doubler device
(TC1240A), which can be used to show the
WiperLock Technology feature of the MCP4021.
These boards may be purchased directly from the
Microchip web site at www.microchip.com.
2006-2017 Microchip Technology Inc.
DS20001978D-page 47
MCP4011/2/3/4
10.0
PACKAGING INFORMATION
10.1
Package Marking Information
Example:
5-Lead SOT-23 (MCP4014)
XXNN
JU25
Part Number
Code
MCP4014T-202E/OT
JUNN
MCP4014T-502E/OT
JVNN
MCP4014T-103E/OT
JWNN
MCP4014T-503E/OT
JXNN
Note: Applies to 5-Lead SOT-23
Example:
6-Lead SOT-23 (MCP4012 / MCP4013)
XXNN
BJ25
Part Number
Code
MCP4012 MCP4013
MCP401xT-202E/CH
BJNN
BPNN
MCP401xT-502E/CH
BKNN
BQNN
MCP401xT-103E/CH
BLNN
BRNN
MCP401xT-503E/CH
BMNN
BSNN
Note: Applies to 6-Lead SOT-23
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20001978D-page 48
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Package Marking Information
8-Lead DFN (2x3) (MCP4011)
Example:
ABE
640
25
Part Number
Code
MCP4011T-202E/MC
ABE
MCP4011T-502E/MC
ABF
MCP4011T-103E/MC
ABG
MCP4011T-503E/MC
ABH
Note: Applies to 8-Lead DFN
Example:
8-Lead MSOP (MCP4011)
401122
640256
8-Lead SOIC (150 mil) (MCP4011)
Example:
401152E
e3 1640
SN^^
NNN
256
Part Numbers
8L-MSOP
8L-SOIC
Code
MCP4011-202E/MS MCP4011-202E/SN
22
MCP4011-502E/MS MCP4011-502E/SN
52
MCP4011-103E/MS MCP4011-103E/SN
13
MCP4011-503E/MS MCP4011-503E/SN
53
2006-2017 Microchip Technology Inc.
DS20001978D-page 49
MCP4011/2/3/4
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
0.20 C 2X
D
e1
A
D
N
E/2
E1/2
E1
E
(DATUM D)
(DATUM A-B)
0.15 C D
2X
NOTE 1
1
2
e
B
NX b
0.20
C A-B D
TOP VIEW
A
A A2
0.20 C
SEATING PLANE
A
SEE SHEET 2
C
A1
SIDE VIEW
Microchip Technology Drawing C04-028D [OT] Sheet 1 of
DS20001978D-page 50
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
T
L
L1
VIEW A-A
SHEET 1
Units
Dimension Limits
Number of Pins
N
e
Pitch
e1
Outside lead pitch
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
E
Overall Width
E1
Molded Package Width
D
Overall Length
L
Foot Length
Footprint
L1
I
Foot Angle
c
Lead Thickness
b
Lead Width
MIN
0.90
0.89
-
0.30
0°
0.08
0.20
MILLIMETERS
NOM
6
0.95 BSC
1.90 BSC
2.80 BSC
1.60 BSC
2.90 BSC
0.60 REF
-
MAX
1.45
1.30
0.15
0.60
10°
0.26
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-091D [OT] Sheet 2 of
2006-2017 Microchip Technology Inc.
DS20001978D-page 51
MCP4011/2/3/4
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
SILK SCREEN
5
Y
Z
C
G
1
2
E
GX
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
C
Contact Pad Spacing
X
Contact Pad Width (X5)
Contact Pad Length (X5)
Y
Distance Between Pads
G
Distance Between Pads
GX
Overall Width
Z
MIN
MILLIMETERS
NOM
0.95 BSC
2.80
MAX
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2091A [OT]
DS20001978D-page 52
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.15 C A-B
D
e1
A
D
E
2
E1
E
E1
2
2X
0.15 C D
2X
0.20 C A-B
e
6X b
B
0.20
C A-B D
TOP VIEW
C
A
A2
SEATING PLANE
6X
A1
0.10 C
SIDE VIEW
R1
L2
R
c
GAUGE PLANE
L
Ĭ
(L1)
END VIEW
Microchip Technology Drawing C04-028C (CH) Sheet 1 of 2
2006-2017 Microchip Technology Inc.
DS20001978D-page 53
MCP4011/2/3/4
6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
N
Number of Leads
e
Pitch
Outside lead pitch
e1
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Footprint
L1
Seating Plane to Gauge Plane
L1
φ
Foot Angle
c
Lead Thickness
Lead Width
b
MIN
0.90
0.89
0.00
0.30
0°
0.08
0.20
MILLIMETERS
NOM
6
0.95 BSC
1.90 BSC
1.15
2.80 BSC
1.60 BSC
2.90 BSC
0.45
0.60 REF
0.25 BSC
-
MAX
1.45
1.30
0.15
0.60
10°
0.26
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-028C (CH) Sheet 2 of 2
DS20001978D-page 54
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
GX
Y
Z
C G
G
SILK SCREEN
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
C
Contact Pad Spacing
X
Contact Pad Width (X3)
Y
Contact Pad Length (X3)
G
Distance Between Pads
Distance Between Pads
GX
Z
Overall Width
MIN
MILLIMETERS
NOM
0.95 BSC
2.80
MAX
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2028B (CH)
2006-2017 Microchip Technology Inc.
DS20001978D-page 55
MCP4011/2/3/4
/HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH 0& ±[[ PP%RG\>')1@
1RWH
G&
'!&"
&
7
# 3 !*
!
!
&
7
% & &
# &
&&
@JJ333 '
'J
7
D
e
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
2
1
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
K&!
'
!Q'&!
U"'+
% !
QQ;;
U
U
UY
Z
[
&
Y
\
&
[
& #%%
=
?& &7
!!
9
;G
Y
Q
&
>?
Y
]#&
;
;$
!
# #Q
&
9
^
;$
!
# #]#&
;
=
^
=
+
=
9
?& &Q
&
Q
9
=
?& & & ;$
!
# #
_
^
^
?& &]#&
=>?
9 >?
==
1RWHV
!" #
$%
&"
' *+"&'"!&+
&
#3&&
&
#
7
'
'
$
!
#&
+ ! &
#!
9 7
!! 3! " &
#
'
! #&
;?@ > !'
!
&
$ & "
!33&"&&
!
;G@
%
'
!*"!" 3&"&&
*%%' &
"
!
!
3 ? 9?
DS20001978D-page 56
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2006-2017 Microchip Technology Inc.
DS20001978D-page 57
MCP4011/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001978D-page 58
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2006-2017 Microchip Technology Inc.
DS20001978D-page 59
MCP4011/2/3/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001978D-page 60
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
NOTE 1
2
1
e
B
NOTE 5
NX b
0.25
C A–B D
TOP VIEW
0.10 C
C
SEATING
PLANE
A A2
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
SEE VIEW C
VIEW A–A
0.23
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2
2006-2017 Microchip Technology Inc.
DS20001978D-page 61
MCP4011/2/3/4
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
L1
Footprint
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2
DS20001978D-page 62
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SN Rev B
2006-2017 Microchip Technology Inc.
DS20001978D-page 63
MCP4011/2/3/4
NOTES:
DS20001978D-page 64
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
APPENDIX A:
REVISION HISTORY
Revision D (December 2017)
The following is the list of modifications:
1.
2.
Updated the High-Voltage Input Entry Voltage
entry in the “AC/DC Characteristics” table.
Updated Table 6-1“Typical Step Resistances”.
Revision C (December 2006)
The following is the list of modifications:
1.
2.
Added device designators in conditions column
to associate units (MHz) in Bandwidth -3 dB
parameter in “AC/DC Characteristics” table.
Added device designations in conditions column
for R-INL and R-DNL specifications.
Revision B (October 2006)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
For the 10 k device, the rheostat differential
nonlinearity specification at 2.7V was changed
from ±0.5 LSb to ±1 LSb.
Figure 2-9 in Section 2.0 “Typical Performance Curves” was updated with the correct
data.
Added Figure 2-55 for -3 db Bandwidth
information.
Added Figure 2-56 for -3 db Bandwidth test
circuit.
Updated available Development Tools.
Added disclaimer to package outline drawings
and updated changed drawings as needed.
Revision A (November 2005)
• Original release of this document.
2006-2017 Microchip Technology Inc.
DS20001978D-page 65
MCP4011/2/3/4
NOTES:
DS20001978D-page 66
2006-2017 Microchip Technology Inc.
MCP4011/2/3/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
XXX
X
/XX
Resistance Temperature Package
Version
Range
Device:
MCP4011:
MCP4011T:
MCP4012:
MCP4012T:
MCP4013:
MCP4013T:
MCP4014:
MCP4014T:
Resistance Version:
Single Potentiometer with U/D Interface
Single Potentiometer with U/D Interface
(Tape and Reel) (SOIC, MSOP)
Single Rheostat with U/D interface
Single Rheostat with U/D interface
(Tape and Reel) (SOT-23-6)
Single Potentiometer to GND with U/D
Interface
Single Potentiometer to GND with U/D
Interface (Tape and Reel) (SOT-23-6)
Single Rheostat to GND with U/D
Interface
Single Rheostat to GND with U/D
Interface (Tape and Reel)(SOT-23-5)
202 = 2.1 k
502 = 5 k
103 = 10 k
503 = 50 k
Temperature Range:
Package:
CH
MC
MS
SN
OT
=
=
=
=
=
Plastic Small Outline Transistor, 6-lead
Plastic Dual Flat No Lead (2x3x0.9 mm), 8-lead
Plastic MSOP, 8-lead
Plastic SOIC, (150 mil Body), 8-lead
Plastic Small Outline Transistor, 5-lead
2006-2017 Microchip Technology Inc.
Examples:
a)
b)
c)
d)
e)
f)
g)
h)
i)
j)
k)
l)
m)
n)
o)
p)
q)
r)
s)
t)
MCP4011-103E/MS:
MCP4011-103E/SN:
MCP4011T-103E/MC:
MCP4011T-103E/MS:
MCP4011T-103E/SN:
MCP4011-202E/MS:
MCP4011-202E/SN:
MCP4011T-202E/MC:
MCP4011T-202E/MS:
MCP4011T-202E/SN:
MCP4011-502E/MS:
MCP4011-502E/SN:
MCP4011T-502E/MC:
MCP4011T-502E/MS:
MCP4011T-502E/SN:
MCP4011-503E/MS:
MCP4011-503E/SN:
MCP4011T-503E/MC:
MCP4011T-503E/MS:
MCP4011T-503E/SN:
10 k, 8-LD MSOP
10 k, 8-LD SOIC
T/R, 10 k, 8-LD DFN
T/R, 10 k, 8-LD MSOP
T/R, 10 k, 8-LD SOIC
2.1 k, 8-LD MSOP
2.1 k, 8-LD SOIC
T/R, 2.1 k, 8-LD DFN
T/R, 2.1 k, 8-LD MSOP
T/R, 2.1 k, 8-LD SOIC
5 k, 8-LD MSOP
5 k, 8-LD SOIC
T/R, 5 k, 8-LD DFN
T/R, 5 k, 8-LD MSOP
T/R, 5 k, 8-LD SOIC
50 k, 8-LD MSOP
50 k, 8-LD SOIC
T/R, 50 k, 8-LD DFN
T/R, 50 k, 8-LD MSOP
T/R, 50 k, 8-LD SOIC
a)
b)
c)
d)
MCP4012T-202E/CH
MCP4012T-502E/CH
MCP4012T-103E/CH
MCP4012T-503E/CH
2.1 k, 6-LD SOT-23
5 k, 6-LD SOT-23
10 k, 6-LD SOT-23
50 k, 6-LD SOT-23
a)
b)
c)
d)
MCP4013T-202E/CH
MCP4013T-502E/CH
MCP4013T-103E/CH
MCP4013T-503E/CH
2.1 k, 6-LD SOT-23
5 k, 6-LD SOT-23
10 k, 6-LD SOT-23
50 k, 6-LD SOT-23
a)
b)
c)
d)
MCP4014T-202E/OT
MCP4014T-502E/OT
MCP4014T-103E/OT
MCP4014T-503E/OT
2.1 k, 5-LD SOT-23
5 k, 5-LD SOT-23
10 k, 5-LD SOT-23
50 k, 5-LD SOT-23
DS21978C-page 67
MCP4011/2/3/4
NOTES:
DS21978C-page 68
2006-2017 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2017, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2437-6
== ISO/TS 16949 ==
2006-2017 Microchip Technology Inc.
DS20001978D-page 69
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 86-23-8980-9588
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China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Israel - Ra’anana
Tel: 972-9-744-7705
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20001978D-page 70
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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10/25/17
