MCP6001/1R/1U/2/4
1 MHz, Low-Power Op Amp
Features
Description
•
•
•
•
•
•
•
The Microchip Technology Inc. MCP6001/2/4 family of
operational amplifiers (op amps) is specifically
designed for general-purpose applications. This family
has a 1 MHz Gain Bandwidth Product (GBWP) and 90°
phase margin (typical). It also maintains 45° phase
margin (typical) with a 500 pF capacitive load. This
family operates from a single supply voltage as low as
1.8V, while drawing 100 µA (typical) quiescent current.
Additionally, the MCP6001/2/4 supports rail-to-rail input
and output swing, with a common mode input voltage
range of VDD + 300 mV to VSS – 300 mV. This family of
op amps is designed with Microchip’s advanced CMOS
process.
Available in SC-70-5 and SOT-23-5 packages
Gain Bandwidth Product: 1 MHz (typical)
Rail-to-Rail Input/Output
Supply Voltage: 1.8V to 6.0V
Supply Current: IQ = 100 µA (typical)
Phase Margin: 90° (typical)
Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
• Available in Single, Dual and Quad Packages
Applications
The MCP6001/2/4 family is available in the industrial
and extended temperature ranges, with a power supply
range of 1.8V to 6.0V.
Automotive
Portable Equipment
Photodiode Amplifier
Analog Filters
Notebooks and PDAs
Battery-Powered Systems
Package Types
VOUT 1
VOUT
SOT-23-5
VOUTA 1
8 VDD
VINA– 2
- +
+
-
5 VDD
VIN+ 1
7 VOUTB
VSS 2
6 VINB–
VIN– 3
-
4 VOUT
5 VINB+
VOUTA 1
VINA+ 3
VSS 4
MCP6004
PDIP, SOIC, TSSOP
8 VDD
EP
9
14 VOUTD
VOUTA 1
V –
7 VOUTB INA 2
- + + - 13 VIND–
V +
6 VINB– INA 3
5 V + VDD 4
12 VIND+
11 VSS
INB
VINB+ 5
R1
VINB– 6
VREF
4 VIN–
MCP6001U
VINA– 2
VSS
+
+
-
MCP6002
MCP6002
2x3 DFN *
MCP6001
–
5 VSS
PDIP, SOIC, MSOP
VSS 4
VDD
R2
4 VIN–
VIN+ 3
VDD 2
VIN+ 3
VINA+ 3
Typical Application
5 VDD
VOUT 1
-
+
VSS 2
SPICE Macro Models
FilterLab® Software
Mindi™ Circuit Designer & Simulator
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
VIN
SOT-23-5
SC70-5, SOT-23-5
Design Aids
•
•
•
•
•
•
MCP6001R
MCP6001
+
•
•
•
•
•
•
R
Gain = 1 + -----1R2
Non-Inverting Amplifier
© 2009 Microchip Technology Inc.
VOUTB 7
10 VINC+
- + + -
9 VINC–
8 VOUTC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
DS21733J-page 1
MCP6001/1R/1U/2/4
NOTES:
DS21733J-page 2
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
1.0
ELECTRICAL
CHARACTERISTICS
VDD – VSS ........................................................................7.0V
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
Current at Analog Input Pins (VIN+, VIN–).....................±2 mA
†† See Section 4.1.2 “Input Voltage and Current Limits”.
Absolute Maximum Ratings †
Analog Inputs (VIN+, VIN–) †† ........ VSS – 1.0V to VDD + 1.0V
All Other Inputs and Outputs ......... VSS – 0.3V to VDD + 0.3V
Difference Input Voltage ...................................... |VDD – VSS|
Output Short Circuit Current ................................ Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature ................................... –65°C to +150°C
Maximum Junction Temperature (TJ)......................... .+150°C
ESD Protection On All Pins (HBM; MM) .............. ≥ 4 kV; 200V
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VL = VDD/2,
RL = 10 kΩ to VL, and VOUT ≈ VDD/2 (refer to Figure 1-1).
Parameters
Sym
Min
Typ
Max
Units
VOS
-4.5
—
+4.5
mV
ΔVOS/ΔTA
—
±2.0
—
µV/°C
PSRR
—
86
—
dB
Conditions
Input Offset
Input Offset Voltage
Input Offset Drift with Temperature
Power Supply Rejection Ratio
VCM = VSS (Note 1)
TA= -40°C to +125°C,
VCM = VSS
VCM = VSS
Input Bias Current and Impedance
IB
—
±1.0
—
pA
Industrial Temperature
IB
—
19
—
pA
TA = +85°C
Extended Temperature
IB
—
1100
—
pA
TA = +125°C
Input Offset Current
IOS
—
±1.0
—
pA
Common Mode Input Impedance
ZCM
—
1013||6
—
Ω||pF
Differential Input Impedance
ZDIFF
—
1013||3
—
Ω||pF
Common Mode Input Range
VCMR
VSS − 0.3
—
VDD + 0.3
V
Common Mode Rejection Ratio
CMRR
60
76
—
dB
VCM = -0.3V to 5.3V,
VDD = 5V
AOL
88
112
—
dB
VOUT = 0.3V to VDD – 0.3V,
VCM = VSS
VOL, VOH
VSS + 25
—
VDD – 25
mV
VDD = 5.5V,
0.5V Input Overdrive
Input Bias Current:
Common Mode
Open-Loop Gain
DC Open-Loop Gain (Large Signal)
Output
Maximum Output Voltage Swing
Output Short Circuit Current
—
±6
—
mA
VDD = 1.8V
—
±23
—
mA
VDD = 5.5V
VDD
1.8
—
6.0
V
Note 2
IQ
50
100
170
µA
IO = 0, VDD = 5.5V, VCM = 5V
ISC
Power Supply
Supply Voltage
Quiescent Current per Amplifier
Note 1:
2:
MCP6001/1R/1U/2/4 parts with date codes prior to December 2004 (week code 49) were tested to ±7 mV minimum/
maximum limits.
All parts with date codes November 2007 and later have been screened to ensure operation at
VDD = 6.0V. However, the other minimum and maximum specifications are measured at 1.8V and 5.5V.
© 2009 Microchip Technology Inc.
DS21733J-page 3
MCP6001/1R/1U/2/4
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8 to 5.5V, VSS = GND, VCM = VDD/2,
VL = VDD/2, VOUT ≈ VDD/2, RL = 10 kΩ to VL, and CL = 60 pF (refer to Figure 1-1).
Parameters
Sym
Min
Typ
Max
Units
Conditions
GBWP
—
1.0
—
MHz
Phase Margin
PM
—
90
—
°
Slew Rate
SR
—
0.6
—
V/µs
Input Noise Voltage
Eni
—
6.1
—
µVp-p
Input Noise Voltage Density
eni
—
28
—
nV/√Hz
f = 1 kHz
Input Noise Current Density
ini
—
0.6
—
fA/√Hz
f = 1 kHz
AC Response
Gain Bandwidth Product
G = +1 V/V
Noise
f = 0.1 Hz to 10 Hz
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Industrial Temperature Range
TA
-40
—
+85
°C
Extended Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 5L-SC70
θJA
—
331
—
°C/W
Thermal Resistance, 5L-SOT-23
θJA
—
256
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
85
—
°C/W
Thermal Resistance, 8L-SOIC (150 mil)
θJA
—
163
—
°C/W
Thermal Resistance, 8L-MSOP
θJA
—
206
—
°C/W
Thermal Resistance, 8L-DFN (2x3)
θJA
—
68
—
°C/W
Thermal Resistance, 14L-PDIP
θJA
—
70
—
°C/W
Thermal Resistance, 14L-SOIC
θJA
—
120
—
°C/W
Thermal Resistance, 14L-TSSOP
θJA
—
100
—
°C/W
Conditions
Temperature Ranges
Note
Thermal Package Resistances
Note:
The industrial temperature devices operate over this extended temperature range, but with reduced
performance. In any case, the internal Junction Temperature (TJ) must not exceed the Absolute Maximum
specification of +150°C.
DS21733J-page 4
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
1.1
Test Circuits
The circuit used for most DC and AC tests is shown in
Figure 1-1. This circuit can independently set VCM and
VOUT; see Equation 1-1. Note that VCM is not the
circuit’s common mode voltage ((VP + VM)/2), and that
VOST includes VOS plus the effects (on the input offset
error, VOST) of temperature, CMRR, PSRR and AOL.
CF
6.8 pF
RG
100 kΩ
RF
100 kΩ
VP
VDD
VIN+
EQUATION 1-1:
G DM = R F ⁄ R G
CB1
100 nF
MCP600X
V CM = ( V P + V DD ⁄ 2 ) ⁄ 2
V OUT = ( V DD ⁄ 2 ) + ( V P – V M ) + V OST ( 1 + G DM )
VM
RG
100 kΩ
Where:
GDM = Differential Mode Gain
(V/V)
VCM = Op Amp’s Common Mode
Input Voltage
(V)
© 2009 Microchip Technology Inc.
CB2
1 µF
VIN–
V OST = V IN– – V IN+
VOST = Op Amp’s Total Input Offset
Voltage
VDD/2
(mV)
RL
10 kΩ
RF
100 kΩ
CF
6.8 pF
VOUT
CL
60 pF
VL
FIGURE 1-1:
AC and DC Test Circuit for
Most Specifications.
DS21733J-page 5
MCP6001/1R/1U/2/4
NOTES:
DS21733J-page 6
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Input Offset Voltage (µV)
-300
-400
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
-500
-600
0
0.05
0.04
0.03
0.02
0.01
0.00
-0.01
-0.02
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
-300
-400
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
-500
-600
6.0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
Common Mode Input Voltage (V)
Input Offset Quadratic Temp. Co.;
TC2 (µV/°C2)
Input Offset Quadratic
© 2009 Microchip Technology Inc.
-200
-700
10 12
2453 Samples
TA = -40°C to +125°C
VCM = VSS
FIGURE 2-3:
Temp. Co.
VDD = 5.5V
-100
-0.5
8
Input Offset Voltage Drift.
45%
40%
35%
30%
25%
20%
15%
10%
5%
0%
0.4
FIGURE 2-4:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 1.8V.
2453 Samples
TA = -40°C to +125°C
VCM = VSS
FIGURE 2-2:
0.2
Common Mode Input Voltage (V)
Input Offset Voltage.
-12 -10 -8 -6 -4 -2 0 2 4 6
Input Offset Voltage Drift;
TC1 (µV/°C)
0.0
5
-0.2
4
-0.4
-2 -1
0
1
2
3
Input Offset Voltage (mV)
Input Offset Voltage (µV)
Percentage of Occurrences
-200
0.0
-3
FIGURE 2-5:
Input Offset Voltage vs.
Common Mode Input Voltage at VDD = 5.5V.
200
Input Offset Voltage (µV)
-4
FIGURE 2-1:
Percentage of Occurrences
VDD = 1.8V
-100
-700
5
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
0
64,695 Samples
VCM = VSS
0.07
20%
18%
16%
14%
12%
10%
8%
6%
4%
2%
0%
0.06
Percentage of Occurrences
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, and CL = 60 pF.
150
100
50
0
VDD = 5.5V
VDD = 1.8V
-50
-100
-150
VCM = VSS
-200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
FIGURE 2-6:
Output Voltage.
Input Offset Voltage vs.
DS21733J-page 7
MCP6001/1R/1U/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, and CL = 60 pF.
8%
6%
4%
2%
70
PSRR–
60
PSRR+
50
CMRR
40
6
55%
50%
45%
40%
35%
30%
25%
20%
15%
10%
5%
0%
9 12 15 18 21 24
Input Bias Current (pA)
27
Input Bias Current at +85°C.
Input Bias Current (pA)
Input Bias Current at
PSRR (VCM = VSS)
80
CMRR (VCM = -0.3V to +5.3V)
70
-25
FIGURE 2-9:
Temperature.
DS21733J-page 8
PSRR, CMRR vs.
0
100
-30
80
Phase
60
Gain
20
0
-60
-90
40
-120
-150
VCM = VSS
-20
0.1 1.E+
1 1.E+
10
1.E01 00 01
Input Noise Voltage Density
(nV/√Hz)
90
-50
100k
1.E+05
-180
-210
100 1.E+
1k 1.E+
10k 100k
1M 10M
1.E+
1.E+ 1.E+
1.E+
Frequency
(Hz) 05 06 07
02 03 04
Open-Loop Gain, Phase vs.
1,000
95
75
1k
10k
1.E+03
1.E+04
Frequency (Hz)
120
FIGURE 2-11:
Frequency.
VDD = 5.0V
85
100
1.E+02
FIGURE 2-10:
Frequency.
Open-Loop Gain (dB)
1500
1350
1200
1050
900
750
600
300
150
0
605 Samples
VDD = 5.5V
VCM = VDD
TA = +125°C
FIGURE 2-8:
+125°C.
20
10
1.E+01
30
Open-Loop Phase (°)
3
FIGURE 2-7:
PSRR, CMRR (dB)
80
30
0%
100
VCM = VSS
90
PSRR, CMRR (dB)
10%
0
Percentage of Occurrences
100
1230 Samples
VDD = 5.5V
VCM = VDD
TA = +85°C
12%
450
Percentage of Occurrences
14%
0
25
50
75
Ambient Temperature (°C)
100
125
CMRR, PSRR vs. Ambient
100
10
0.1
1
10
100 1.E+0
1k
10k 1.E+0
100k
1.E-01
1.E+0
1.E+0
1.E+0
1.E+0
0
1Frequency
2 (Hz)3
4
5
FIGURE 2-12:
vs. Frequency.
Input Noise Voltage Density
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, and CL = 60 pF.
30
0.08
Output Voltage (20 mV/div)
Short Circuit Current
Magnitude (mA)
G = +1 V/V
25
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
20
15
10
5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Power Supply Voltage (V)
FIGURE 2-13:
Output Short Circuit Current
vs. Power Supply Voltage.
0.02
0.00
-0.02
-0.04
-0.06
1.E-06
2.E-06
3.E-06
4.E-06
5.E-06
6.E-06
7.E-06
8.E-06
FIGURE 2-16:
Pulse Response.
G = +1 V/V
VDD = 5.0V
VOL – VSS
10
1
10µ
1.E-05
160
10m
1.E-02
120
100
80
40
20
3.5
3.0
2.5
2.0
1.5
1.0
0.0
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
0.E+00
1.E-05
© 2009 Microchip Technology Inc.
3.E-05
FIGURE 2-17:
Pulse Response.
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
4.E-05
5.E-05
6.E-05
7.E-05
8.E-05
9.E-05
1.E-04
Large-Signal, Non-Inverting
VDD = 5.5V
Falling Edge
VDD = 1.8V
Rising Edge
-50
-25
0
25
50
75
100
125
Ambient Temperature (°C)
Power Supply Voltage (V)
FIGURE 2-15:
Quiescent Current vs.
Power Supply Voltage.
2.E-05
Time (10 µs/div)
VCM = VDD - 0.5V
140
60
4.0
0.5
100µ
1m
1.E-04
1.E-03
Output Current Magnitude (A)
FIGURE 2-14:
Output Voltage Headroom
vs. Output Current Magnitude.
180
Output Voltage (V)
4.5
VDD – VOH
1.E-05
Small-Signal, Non-Inverting
5.0
100
9.E-06
Time (1 µs/div)
Slew Rate (V/µs)
Output Voltage Headroom
(mV)
0.04
-0.08
0.E+00
1,000
Quiescent Current
per amplifier (µA)
0.06
FIGURE 2-18:
Temperature.
Slew Rate vs. Ambient
DS21733J-page 9
MCP6001/1R/1U/2/4
6
10
Input, Output Voltages (V)
Output Voltage Swing (V
P-P )
Note: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/2, VOUT ≈ VDD/2,
VL = VDD/2, RL = 10 kΩ to VL, and CL = 60 pF.
VDD = 5.5V
VDD = 1.8V
1
0.1
1k
1.E+03
FIGURE 2-19:
Frequency.
Input Current Magnitude (A)
1.E-02
10m
1m
1.E-03
100µ
1.E-04
10µ
1.E-05
1µ
1.E-06
100n
1.E-07
10n
1.E-08
1n
1.E-09
100p
1.E-10
10p
1.E-11
1p
1.E-12
10k
100k
1.E+04
1.E+05
Frequency (Hz)
1M
1.E+06
Output Voltage Swing vs.
VIN
5
VDD = 5.0V
G = +2 V/V
VOUT
4
3
2
1
0
-1
0.E+00
1.E-05
2.E-05
3.E-05
4.E-05
5.E-05
6.E-05
7.E-05
8.E-05
9.E-05
1.E-04
Time (10 µs/div)
FIGURE 2-21:
Phase Reversal.
The MCP6001/2/4 Show No
+125°C
+85°C
+25°C
-40°C
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
FIGURE 2-20:
Measured Input Current vs.
Input Voltage (below VSS).
DS21733J-page 10
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP6001 MCP6001R MCP6001U
SC70-5,
SOT-23-5
3.1
SOT-23-5
SOT-23-5
MCP6002
MSOP,
PDIP,
SOIC
DFN
2x3
PDIP,
SOIC,
TSSOP
Symbol
Description
1
1
4
1
1
1
VOUT, VOUTA Analog Output (op amp A)
4
4
3
2
2
2
VIN–, VINA– Inverting Input (op amp A)
3
3
1
3
3
3
VIN+, VINA+ Non-inverting Input (op amp A)
5
2
5
8
8
4
VDD
—
—
—
5
5
5
VINB+
—
—
—
6
6
6
VINB–
Inverting Input (op amp B)
—
—
—
7
7
7
VOUTB
Analog Output (op amp B)
—
—
—
—
—
8
VOUTC
Analog Output (op amp C)
—
—
—
—
—
9
VINC–
Inverting Input (op amp C)
—
—
—
—
—
10
VINC+
Non-inverting Input (op amp C)
Positive Power Supply
Non-inverting Input (op amp B)
2
5
2
4
4
11
VSS
—
—
—
—
—
12
VIND+
Non-inverting Input (op amp D)
—
—
—
—
—
13
VIND–
Inverting Input (op amp D)
—
—
—
—
—
14
VOUTD
—
—
—
—
9
—
EP
Analog Outputs
The output pins are low-impedance voltage sources.
3.2
MCP6004
Analog Inputs
3.4
Negative Power Supply
Analog Output (op amp D)
Exposed Thermal Pad (EP);
must be connected to VSS.
Exposed Thermal Pad (EP)
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the VSS pin; they must
be connected to the same potential on the Printed
Circuit Board (PCB).
The non-inverting and inverting inputs are
high-impedance CMOS inputs with low bias currents.
3.3
Power Supply Pins
The positive power supply (VDD) is 1.8V to 6.0V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD will
need bypass capacitors.
© 2009 Microchip Technology Inc.
DS21733J-page 11
MCP6001/1R/1U/2/4
NOTES:
DS21733J-page 12
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
4.0
APPLICATION INFORMATION
The MCP6001/2/4 family of op amps is manufactured
using Microchip’s state-of-the-art CMOS process and
is specifically designed for low-cost, low-power and
general-purpose applications. The low supply voltage,
low quiescent current and wide bandwidth makes the
MCP6001/2/4 ideal for battery-powered applications.
This device has high phase margin, which makes it
stable for larger capacitive load applications.
VDD, and dump any currents onto VDD. When
implemented as shown, resistors R1 and R2 also limit
the current through D1 and D2.
VDD
D1
R1
4.1
Rail-to-Rail Inputs
4.1.1
R2
PHASE REVERSAL
INPUT VOLTAGE AND CURRENT
LIMITS
The ESD protection on the inputs can be depicted as
shown in Figure 4-1. This structure was chosen to
protect the input transistors, and to minimize input bias
current (IB). The input ESD diodes clamp the inputs
when they try to go more than one diode drop below
VSS. They also clamp any voltages that go too far
above VDD; their breakdown voltage is high enough to
allow normal operation, and low enough to bypass
quick ESD events within the specified limits.
VDD Bond
Pad
R3
VSS – (minimum expected V1)
2 mA
VSS – (minimum expected V2)
R2 >
2 mA
R1 >
FIGURE 4-2:
Inputs.
Input
Stage
Bond V –
IN
Pad
VSS Bond
Pad
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
In order to prevent damage and/or improper operation
of these op amps, the circuit they are in must limit the
currents and voltages at the VIN+ and VIN– pins (see
Absolute Maximum Ratings † at the beginning of
Section 1.0 “Electrical Characteristics”). Figure 4-2
shows the recommended approach to protecting these
inputs. The internal ESD diodes prevent the input pins
(VIN+ and VIN–) from going too far below ground, and
the resistors R1 and R2 limit the possible current drawn
out of the input pins. Diodes D1 and D2 prevent the
input pins (VIN+ and VIN–) from going too far above
© 2009 Microchip Technology Inc.
Protecting the Analog
It is also possible to connect the diodes to the left of
resistors R1 and R2. In this case, current through the
diodes D1 and D2 needs to be limited by some other
mechanism. The resistors then serve as in-rush current
limiters; the DC current into the input pins (VIN+ and
VIN–) should be very small.
A significant amount of current can flow out of the
inputs when the common mode voltage (VCM) is below
ground (VSS); see Figure 2-20. Applications that are
high impedance may need to limit the usable voltage
range.
4.1.3
VIN+ Bond
Pad
MCP600X
V2
The MCP6001/1R/1U/2/4 op amp is designed to
prevent phase reversal when the input pins exceed the
supply voltages. Figure 2-21 shows the input voltage
exceeding the supply voltage without any phase
reversal.
4.1.2
D2
V1
NORMAL OPERATION
The input stage of the MCP6001/1R/1U/2/4 op amps
use two differential CMOS input stages in parallel. One
operates at low common mode input voltage (VCM),
while the other operates at high VCM. WIth this
topology, the device operates with VCM up to 0.3V
above VDD and 0.3V below VSS.
The transition between the two input stages occurs
when VCM = VDD – 1.1V. For the best distortion and
gain linearity, with non-inverting gains, avoid this region
of operation.
4.2
Rail-to-Rail Output
The output voltage range of the MCP6001/2/4 op amps
is VDD – 25 mV (minimum) and VSS + 25 mV
(maximum) when RL = 10 kΩ is connected to VDD/2
and VDD = 5.5V. Refer to Figure 2-14 for more
information.
DS21733J-page 13
MCP6001/1R/1U/2/4
4.3
Capacitive Loads
4.4
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. While a unity-gain buffer (G = +1) is the most
sensitive to capacitive loads, all gains show the same
general behavior.
When driving large capacitive loads with these op
amps (e.g., > 100 pF when G = +1), a small series
resistor at the output (RISO in Figure 4-3) improves the
feedback loop’s phase margin (stability) by making the
output load resistive at higher frequencies. The
bandwidth will be generally lower than the bandwidth
with no capacitance load.
–
MCP600X
+
VIN
Supply Bypass
With this family of operational amplifiers, the power
supply pin (VDD for single-supply) should have a local
bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm
for good high-frequency performance. It also needs a
bulk capacitor (i.e., 1 µF or larger) within 100 mm to
provide large, slow currents. This bulk capacitor can be
shared with nearby analog parts.
4.5
Unused Op Amps
An unused op amp in a quad package (MCP6004)
should be configured as shown in Figure 4-5. These
circuits prevent the output from toggling and causing
crosstalk. Circuits A sets the op amp at its minimum
noise gain. The resistor divider produces any desired
reference voltage within the output voltage range of the
op amp; the op amp buffers that reference voltage.
Circuit B uses the minimum number of components
and operates as a comparator, but it may draw more
current.
RISO
VOUT
CL
¼ MCP6004 (A)
VDD
R1
FIGURE 4-3:
Output resistor, RISO
stabilizes large capacitive loads.
VDD
VDD
VREF
R2
Figure 4-4 gives recommended RISO values for
different capacitive loads and gains. The x-axis is the
normalized load capacitance (CL/GN), where GN is the
circuit's noise gain. For non-inverting gains, GN and the
Signal Gain are equal. For inverting gains, GN is
1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V).
R2
V REF = V DD • -----------------R1 + R2
FIGURE 4-5:
Recommended RISO (Ω)
1000
100
VDD = 5.0V
RL = 100 k
GN = 1
GN ≥ 2
10
10p
1.E-11
100p
1n
10n
1.E-10
1.E-09
1.E-08
Normalized Load Capacitance; CL/GN (F)
FIGURE 4-4:
Recommended RISO values
for Capacitive Loads.
After selecting RISO for your circuit, double-check the
resulting frequency response peaking and step
response overshoot. Modify RISO’s value until the
response is reasonable. Bench evaluation and
simulations with the MCP6001/1R/1U/2/4 SPICE
macro model are very helpful.
DS21733J-page 14
¼ MCP6004 (B)
4.6
Unused Op Amps.
PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012Ω. A 5V difference would
cause 5 pA of current to flow; which is greater than the
MCP6001/1R/1U/2/4 family’s bias current at 25°C (typically 1 pA).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-6.
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
VIN-
VIN+
VSS
–
1/2
MCP6002
VIN1
R1
R2
+
–
MCP6001
VOUT
+
Guard Ring
FIGURE 4-6:
for Inverting Gain.
1.
2.
4.7.1
VIN2
R2
+
Example Guard Ring Layout
Non-inverting Gain and Unity-Gain Buffer:
a. Connect the non-inverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b. Connect the guard ring to the inverting input
pin (VIN–). This biases the guard ring to the
common mode input voltage.
Inverting Gain and Transimpedance Gain
Amplifiers (convert current to voltage, such as
photo detectors):
a. Connect the guard ring to the non-inverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the op
amp (e.g., VDD/2 or ground).
b. Connect the inverting pin (VIN–) to the input
with a wire that does not touch the PCB
surface.
4.7
–
1/2
MCP6002
Application Circuits
UNITY-GAIN BUFFER
The rail-to-rail input and output capability of the
MCP6001/2/4 op amp is ideal for unity-gain buffer
applications. The low quiescent current and wide
bandwidth makes the device suitable for a buffer
configuration in an instrumentation amplifier circuit, as
shown in Figure 4-7.
R1 = 20 kΩ
R1
R2 = 10 kΩ
VREF
R1
V OUT = ( V IN2 – V IN1 ) • ------ + V REF
R2
FIGURE 4-7:
Instrumentation Amplifier
with Unity-Gain Buffer Inputs.
4.7.2
ACTIVE LOW-PASS FILTER
The MCP6001/2/4 op amp’s low input bias current
makes it possible for the designer to use larger
resistors and smaller capacitors for active low-pass
filter applications. However, as the resistance
increases, the noise generated also increases.
Parasitic capacitances and the large value resistors
could also modify the frequency response. These
trade-offs need to be considered when selecting circuit
elements.
Usually, the op amp bandwidth is 100x the filter cutoff
frequency (or higher) for good performance. It is
possible to have the op amp bandwidth 10X higher
than the cutoff frequency, thus having a design that is
more sensitive to component tolerances.
Figure 4-8 shows a second-order Butterworth filter with
100 kHz cutoff frequency and a gain of +1 V/V; the op
amp bandwidth is only 10x higher than the cutoff
frequency. The component values were selected using
Microchip’s FilterLab® software.
100 pF
VIN 14.3 kΩ 53.6 kΩ
+
MCP6002
33 pF
FIGURE 4-8:
Low-Pass Filter.
© 2009 Microchip Technology Inc.
–
VOUT
Active Second-Order
DS21733J-page 15
MCP6001/1R/1U/2/4
4.7.3
EQUATION 4-1:
PEAK DETECTOR
dV C1
I SC = C 1 ------------dt
I SC
dV C1
------------- = -------dt
C1
The MCP6001/2/4 op amp has a high input impedance,
rail-to-rail input/output and low input bias current, which
makes this device suitable for peak detector
applications. Figure 4-9 shows a peak detector circuit
with clear and sample switches. The peak-detection
cycle uses a clock (CLK), as shown in Figure 4-9.
25mA= -------------0.1μF
At the rising edge of CLK, Sample Switch closes to
begin sampling. The peak voltage stored on C1 is
sampled to C2 for a sample time defined by tSAMP. At
the end of the sample time (falling edge of Sample
Signal), Clear Signal goes high and closes the Clear
Switch. When the Clear Switch closes, C1 discharges
through R1 for a time defined by tCLEAR. At the end of
the clear time (falling edge of Clear Signal), op amp A
begins to store the peak value of VIN on C1 for a time
defined by tDETECT.
dV C1
------------- = 250mV ⁄ μs
dt
This voltage rate of change is less than the MCP6001/2/4
slew rate of 0.6 V/µs. When the input voltage swings
below the voltage across C1, D1 becomes reversebiased. This opens the feedback loop and rails the
amplifier. When the input voltage increases, the amplifier
recovers at its slew rate. Based on the rate of voltage
change shown in the above equation, it takes an
extended period of time to charge a 0.1 µF capacitor. The
capacitors need to be selected so that the circuit is not
limited by the amplifier slew rate. Therefore, the
capacitors should be less than 40 µF and a stabilizing
resistor (RISO) needs to be properly selected. (Refer to
Section 4.3 “Capacitive Loads”).
In order to define tSAMP and tCLEAR, it is necessary to
determine the capacitor charging and discharging
period. The capacitor charging time is limited by the
amplifier source current, while the discharging time (τ)
is defined using R1 (τ = R1C1). tDETECT is the time that
the input signal is sampled on C1 and is dependent on
the input voltage change frequency.
The op amp output current limit, and the size of the
storage capacitors (both C1 and C2), could create
slewing limitations as the input voltage (VIN) increases.
Current through a capacitor is dependent on the size of
the capacitor and the rate of voltage change. From this
relationship, the rate of voltage change or the slew rate
can be determined. For example, with an op amp short
circuit current of ISC = 25 mA and a load capacitor of
C1 = 0.1 µF, then:
VIN
+
1/2
MCP6002
–
D1
Op Amp A
RISO VC1
C1
R1
+ 1/2
MCP6002
–
RISO VC2
C2
Op Amp B
+
MCP6001
–
VOUT
Op Amp C
Sample
Switch
Clear
Switch
tSAMP
Sample Signal
tCLEAR
Clear Signal
tDETECT
CLK
FIGURE 4-9:
DS21733J-page 16
Peak Detector with Clear and Sample CMOS Analog Switches.
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
5.0
DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6001/1R/1U/2/4 family of op amps.
5.1
SPICE Macro Model
The latest SPICE macro model for the MCP6001/1R/
1U/2/4 op amps is available on the Microchip web site
at www.microchip.com. The model was written and
tested in official Orcad (Cadence) owned PSPICE. For
the other simulators, it may require translation.
The model covers a wide aspect of the op amp's
electrical specifications. Not only does the model cover
voltage, current, and resistance of the op amp, but it
also covers the temperature and noise effects on the
behavior of the op amp. The model has not been
verified outside of the specification range listed in the
op amp data sheet. The model behaviors under these
conditions can not be guaranteed that it will match the
actual op amp performance.
Moreover, the model is intended to be an initial design
tool. Bench testing is a very important part of any
design and cannot be replaced with simulations. Also,
simulation results using this macro model need to be
validated by comparing them to the data sheet
specifications and characteristic curves.
5.2
FilterLab® Software
Microchip’s FilterLab® software is an innovative
software tool that simplifies analog active filter (using
op amps) design. Available at no cost from the
Microchip web site at www.microchip.com/filterlab, the
FilterLab design tool provides full schematic diagrams
of the filter circuit with component values. It also
outputs the filter circuit in SPICE format, which can be
used with the macro model to simulate actual filter
performance.
5.3
5.4
Microchip Advanced Part Selector
(MAPS)
MAPS is a software tool that helps semiconductor
professionals efficiently identify Microchip devices that
fit a particular design requirement. Available at no cost
from the Microchip web site at www.microchip.com/
maps, the MAPS is an overall selection tool for
Microchip’s product portfolio that includes Analog,
Memory, MCUs and DSCs. Using this tool you can
define a filter to sort features for a parametric search of
devices and export side-by-side technical comparison
reports. Helpful links are also provided for Data sheets,
Purchase, and Sampling of Microchip parts.
5.5
Analog Demonstration and
Evaluation Boards
Microchip offers a broad spectrum of Analog
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market. For
a complete listing of these boards and their
corresponding user’s guides and technical information,
visit the Microchip web site at www.microchip.com/
analogtools.
Some boards that are especially useful are:
•
•
•
•
•
•
•
MCP6XXX Amplifier Evaluation Board 1
MCP6XXX Amplifier Evaluation Board 2
MCP6XXX Amplifier Evaluation Board 3
MCP6XXX Amplifier Evaluation Board 4
Active Filter Demo Board Kit
5/6-Pin SOT-23 Evaluation Board, P/N VSUPEV2
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board,
P/N SOIC8EV
• 14-Pin SOIC/TSSOP/DIP Evaluation Board,
P/N SOIC14EV
Mindi™ Circuit Designer &
Simulator
Microchip’s Mindi™ Circuit Designer & Simulator aids
in the design of various circuits useful for active filter,
amplifier and power-management applications. It is a
free online circuit designer & simulator available from
the Microchip web site at www.microchip.com/mindi.
This interactive circuit designer & simulator enables
designers to quickly generate circuit diagrams,
simulate circuits. Circuits developed using the Mindi
Circuit Designer & Simulator can be downloaded to a
personal computer or workstation.
© 2009 Microchip Technology Inc.
DS21733J-page 17
MCP6001/1R/1U/2/4
5.6
Application Notes
The following Microchip Analog Design Note and
Application Notes are available on the Microchip web
site at www.microchip. com/appnotes and are
recommended as supplemental reference resources.
• ADN003: “Select the Right Operational Amplifier
for your Filtering Circuits”, DS21821
• AN722: “Operational Amplifier Topologies and DC
Specifications”, DS00722
• AN723: “Operational Amplifier AC Specifications
and Applications”, DS00723
• AN884: “Driving Capacitive Loads With Op
Amps”, DS00884
• AN990: “Analog Sensor Conditioning Circuits –
An Overview”, DS00990
• AN1177: “Op Amp Precision Design: DC Errors”,
DS01177
• AN1228: “Op Amp Precision Design: Random
Noise”, DS01228
• AN1297: "Microchip 's Op Amp SPICE Macro
Models"
These application notes and others are listed in the
design guide:
• “Signal Chain Design Guide”, DS21825
DS21733J-page 18
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SC-70 (MCP6001)
XXN (Front)
YWW (Back)
Example: (I-Temp)
Device
MCP6001
I-Temp
Code
E-Temp
Code
AAN
CDN
AA7 (Front)
432 (Back)
Note: Applies to 5-Lead SC-70.
OR
OR
XXNN
Device
I-Temp
Code
E-Temp
Code
MCP6001
AANN
CDNN
AA74
Note: Applies to 5-Lead SC-70.
Example: (E-Temp)
5-Lead SOT-23 (MCP6001/1R/1U)
5
4
XXNN
1
2
I-Temp
Code
E-Temp
Code
MCP6001
AANN
CDNN
MCP6001R
ADNN
CENN
MCP6001U
AFNN
CFNN
Device
3
5
4
CD25
1
2
3
Note: Applies to 5-Lead SOT-23.
8-Lead PDIP (300 mil)
MCP6002
I/P256
0432
XXXXXXXX
XXXXXNNN
YYWW
8-Lead DFN (2 x 3)
XXX
YWW
NN
OR
MCP6002
e3
I/P^^256
0746
Example:
ABY
944
25
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2009 Microchip Technology Inc.
DS21733J-page 19
MCP6001/1R/1U/2/4
Package Marking Information (Continued)
8-Lead SOIC (150 mil)
Example:
MCP6002I
SN0432
256
XXXXXXXX
XXXXYYWW
NNN
MCP6002I
e3
SN^^0746
256
OR
Example:
8-Lead MSOP
XXXXXX
6002I
YWWNNN
432256
14-Lead PDIP (300 mil) (MCP6004)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
MCP6004
e3
I/P^^
0432256
OR
MCP6004
e3
E/P^^
0746256
14-Lead SOIC (150 mil) (MCP6004)
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
14-Lead TSSOP (MCP6004)
Example:
OR
0432256
Example:
XXXXXX
YYWW
6004ST
0432
NNN
256
DS21733J-page 20
MCP6004
e3
E/SL^^
0746256
MCP6004ISL
OR
6004STE
0432
256
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
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DS21733J-page 26
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
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© 2009 Microchip Technology Inc.
DS21733J-page 27
MCP6001/1R/1U/2/4
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DS21733J-page 28
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
"
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© 2009 Microchip Technology Inc.
DS21733J-page 29
MCP6001/1R/1U/2/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS21733J-page 30
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
12
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© 2009 Microchip Technology Inc.
DS21733J-page 31
MCP6001/1R/1U/2/4
12
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DS21733J-page 32
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
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DS21733J-page 33
MCP6001/1R/1U/2/4
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DS21733J-page 34
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
© 2009 Microchip Technology Inc.
DS21733J-page 35
MCP6001/1R/1U/2/4
NOTES:
DS21733J-page 36
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
APPENDIX A:
REVISION HISTORY
Revision J (November 2009)
Revision G (November 2007)
The following is the list of modifications:
1.
The following is the list of modifications:
1.
Added new 2x3 DFN 8-Lead package on
page 1.
2. Updated the Temperature Specifications table
with 2x3 DFN thermal resistance information.
3. Updated Section 1.1 “Test Circuits”.
4. Updated Figure 2-15.
5. Added the 2x3 DFN column to Table 3-1.
6. Added new Section 3.4 “Exposed Thermal
Pad (EP)”.
7. Updated Section 5.1 “SPICE Macro Model”.
8. Updated Section 5.5 “Analog Demonstration
and Evaluation Boards”.
9. Updated Section 5.6 “Application Notes”.
10. Updated Section 6.1 “Package Marking
Information” with the new 2x3 DFN package
marking information.
11. Updated the package drawings.
12. Updated the Product Identification System
section with new 2x3 DFN package information.
2.
3.
4.
5.
6.
7.
8.
9.
Revision F (March 2005)
The following is the list of modifications:
1.
Revision H (May 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
Design Aids: Name change for Mindi
Simulation Tool.
Package Types: Correct device labeling error.
Section 1.0 “Electrical Characteristics”, DC
Electrical Specifications: Changed “Maximum
Output Voltage Swing” condition from 0.9V Input
Overdrive to 0.5V Input Overdrive.
Section 1.0 “Electrical Characteristics”, AC
Electrical Specifications: Changed Phase
Margin condition from G = +1 to G= +1 V/V.
Section 5.0 “Design AIDS”: Name change for
Mindi Simulation Tool.
Updated notes to Section 1.0 “Electrical
Characteristics”.
Increased Absolute Maximum Voltage range at
input pins.
Increased maximum operating supply voltage
(VDD).
Added test circuits.
Added Figure 2-3 and Figure 2-20.
Added Section 4.1.1 “Phase Reversal”,
Section 4.1.2 “Input Voltage and Current
Limits”, Section 4.1.3 “Normal Operation”
and Section 4.5 “Unused Op Amps”.
Updated Section 5.0 “Design AIDS”,
Updated
Section 6.0
“Packaging
Information”
Updated Package Outline Drawings.
Updated
Section 6.0
“Packaging
Information” to include old and new packaging
examples.
Revision E (December 2004)
The following is the list of modifications:
1.
2.
3.
VOS specification reduced to ±4.5 mV from
±7.0 mV for parts starting with date code
YYWW = 0449
Corrected package markings in Section 6.0
“Packaging Information”.
Added Appendix A: Revision History.
Revision D (May 2003)
• Undocumented changes.
Revision C (December 2002)
• Undocumented changes.
Revision B (October 2002)
• Undocumented changes.
Revision A (June 2002)
• Original data sheet release.
© 2009 Microchip Technology Inc.
DS21733J-page 35
MCP6001/1R/1U/2/4
NOTES:
DS21733J-page 36
© 2009 Microchip Technology Inc.
MCP6001/1R/1U/2/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
MCP6001T:
MCP6001RT:
MCP6001UT:
MCP6002:
MCP6002T:
MCP6004:
MCP6004T:
Single Op Amp (Tape and Reel)
(SC-70, SOT-23)
Single Op Amp (Tape and Reel) (SOT-23)
Single Op Amp (Tape and Reel) (SOT-23)
Dual Op Amp
Dual Op Amp (Tape and Reel)
(SOIC, MSOP)
Quad Op Amp
Quad Op Amp (Tape and Reel)
(SOIC, MSOP)
Temperature Range:
I
E
= -40°C to +85°C
= -40°C to +125°C
Package:
LT = Plastic Package (SC-70), 5-lead (MCP6001 only)
OT = Plastic Small Outline Transistor (SOT-23), 5-lead
(MCP6001, MCP6001R, MCP6001U)
MS = Plastic MSOP, 8-lead
MC = Plastic DFN, 8-lead
P
= Plastic DIP (300 mil body), 8-lead, 14-lead
SN = Plastic SOIC, (3.99 mm body), 8-lead
SL = Plastic SOIC (3.99 body), 14-lead
ST = Plastic TSSOP (4.4mm body), 14-lead
Examples:
a) MCP6001T-I/LT:
Tape and Reel,
Industrial Temperature,
5LD SC-70 package
b) MCP6001T-I/OT:
Tape and Reel,
Industrial Temperature,
5LD SOT-23 package.
c) MCP6001RT-I/OT: Tape and Reel,
Industrial Temperature,
5LD SOT-23 package.
d) MCP6001UT-E/OT: Tape and Reel,
Extended Temperature,
5LD SOT-23 package.
a) MCP6002-I/MS:
b) MCP6002-I/P:
c) MCP6002-E/P:
d) MCP6002-E/MC:
e) MCP6002-I/SN:
f)
MCP6002T-I/MS:
g) MCP6002T-E/MC:
a) MCP6004-I/P:
b) MCP6004-I/SL:
c) MCP6004-E/SL:
d) MCP6004-I/ST:
e) MCP6004T-I/SL:
f)
© 2009 Microchip Technology Inc.
MCP6004T-I/ST:
Industrial Temperature,
8LD MSOP package.
Industrial Temperature,
8LD PDIP package.
Extended Temperature,
8LD PDIP package.
Extended Temperature,
8LD DFN package.
Industrial Temperature,
8LD SOIC package.
Tape and Reel,
Industrial Temperature,
8LD MSOP package.
Tape and Reel,
Extended Temperature,
8LD DFN package.
Industrial Temperature,
14LD PDIP package.
Industrial Temperature,
14LD SOIC package.
Extended Temperature,
14LD SOIC package.
Industrial Temperature,
14LD TSSOP package.
Tape and Reel,
Industrial Temperature,
14LD SOIC package.
Tape and Reel,
Industrial Temperature,
14LD TSSOP package.
DS21733J-page 37
MCP6001/1R/1U/2/4
NOTES:
DS21733J-page 38
© 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2009, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2009 Microchip Technology Inc.
DS21733J-page 39
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4080
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
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Tel: 216-447-0464
Fax: 216-447-0643
Dallas
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Tel: 972-818-7423
Fax: 972-818-2924
Detroit
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Tel: 248-538-2250
Fax: 248-538-2260
Kokomo
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Tel: 765-864-8360
Fax: 765-864-8387
Los Angeles
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Tel: 949-462-9523
Fax: 949-462-9608
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-6578-300
Fax: 886-3-6578-370
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
03/26/09
DS21733J-page 40
© 2009 Microchip Technology Inc.