MCP6006/6R/6U/7/9
1 MHz Operational Amplifier with EMI Filtering
Features
Description
• Low Quiescent Current:
- 70 µA (maximum)/amplifier
• Low Input Offset Voltage:
- ±1.6 mV (maximum)
• Enhanced EMI Protection:
- Electromagnetic Interference Rejection Ratio
(EMIRR) at 1.8 GHz: 95 dB
• Supply Voltage Range: 1.8V to 5.5V
• Gain Bandwidth Product: 1 MHz (typical)
• Rail-to-Rail Input/Output
• Unity Gain Stable
• No Phase Reversal
• Quick Start-up Time: 6 µs (typical)
• Small Packages
• Extended Temperature Range: -40°C to +125°C
• AEC Q100 Qualified, Grade 1
The Microchip Technology Inc. MCP6006/6R/6U/7/9
operational amplifier operates with a single supply
voltage as low as 1.8V, while drawing low quiescent
current (70 µA, maximum per amplifier). This op amp
also has low input offset voltage (±1.6 mV, maximum),
and rail-to-rail input and output operation. In addition, the
MCP6006/6R/6U/7/9 is unity gain stable and has a gain
bandwidth product of 1 MHz (typical). This combination
of features supports battery-powered and portable
applications.
Applications
• Smoke Detectors
• Automotive, see Product Identification System
(Automotive)
• Battery-Powered Systems
• Sensor Conditioning
• Battery Current Monitoring
Design Aids
•
•
•
•
The MCP6006/6R/6U/7/9 has enhanced EMI protection, minimizing electromagnetic interference from
external sources. This feature makes it well-suited for
EMI-sensitive applications, such as power lines, radio
stations and mobile communications.
This product family is offered in single (MCP6006), dual
(MCP6007) and quad (MCP6009) packages. All
devices are designed using an advanced CMOS process and fully specified in the extended temperature
range from -40°C to +125°C.
Package Types
MCP6006
5-Lead SC70, SOT-23
V OUT 1
SPICE Macro Models
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
VIN+ 3
Start-up Time vs. Nearest Competitor
4 VIN -
VIN + 3
4 VIN -
5 VDD
VIN - 3
4 V OUT
MCP6007
8-Lead SOIC, MSOP
VIN = 100 mVPP
5 VSS
VDD 2
V SS 2
Start-up Time
V OUT 1
MCP6006U
5-Lead6& SOT-23
VIN+ 1
Output Voltage (500 mV/div)
5 VDD
V SS 2
MCP6006R
5-Lead SOT-23
MCP6009
14-Lead TSSOP, SOIC
VOUTA 1
V INA - 2
VINA + 3
VDD 4
14 V OUTD
13 V IND 12 V IND +
11 V SS
V INA+ 3
8 VDD
7 VOUTB
6 VINB -
VINB + 5
V INB- 6
10 V INC +
9 V INC -
VSS 4
5 VINB +
VOUTB 7
8 V OUTC
V OUTA 1
V INA - 2
Time (10 µs/div)
2020-2021 Microchip Technology Inc.
DS20006411B-page 1
MCP6006/6R/6U/7/9
1.0
ELECTRICAL CHARACTERISTICS
1.1
Absolute Maximum Ratings†
VDD – VSS .....................................................................................................................................................................6V
Current at Analog Input Pins (VIN+, VIN-) ................................................................................................................±5 mA
Analog Inputs (VIN+, VIN-)†† ..................................................................................................... VSS – 0.5V to VDD + 0.5V
Difference Input Voltage ................................................................................................................................ |VDD – VSS|
Output Short-Circuit Current (Note 1) .............................................................................................................Continuous
Storage Temperature...............................................................................................................................-65°C to +150°C
Maximum Junction Temperature (TJ) .................................................................................................................... +150°C
ESD Protection on All Pins (HBM; CDM; MM) 3 kV; 2 kV; 300V
Note 1: Short-circuit to ground, one amplifier per package.
†
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
†† See Section 4.1.2 “Input Voltage Limits”.
1.2
Specifications
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4,
VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Offset Voltage
VOS
-1.6
—
1.6
mV
Input Offset Drift with
Temperature
VOS/TA
—
±0.6
—
µV/°C
PSRR
80
95
—
dB
IB
—
±1
—
pA
—
19
—
pA
TA = +85°C
TA = +125°C
Input Offset
Power Supply Rejection Ratio
TA= -40°C to +125°C
Input Bias Current and Impedance
Input Bias Current
—
200
—
pA
Input Offset Current
IOS
—
±1
—
pA
Common-Mode Input Impedance
ZCM
—
1013||6
—
||pF
Differential Input Impedance
ZDIFF
—
1013||1
—
|pF
DS20006411B-page 2
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4,
VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Common-Mode Input Voltage
Range
VCMR
VSS – 0.3
—
VDD + 0.3
V
VSS – 0.1
—
VDD + 0.1
Common-Mode Rejection Ratio
CMRR
—
90
—
dB
VDD = 5.5V,
VCM = -0.3V to 4.1V
60
76
—
dB
VDD = 5.5V,
VCM = -0.3V to 5.8V
60
76
—
dB
VDD = 1.8V,
VCM = -0.3V to 2.1V
50
76
—
dB
VDD = 5.5V, VCM = -0.3V
to 5.8V (MCP6006/6R/6U)
50
76
—
dB
VDD = 1.8V, VCM = -0.3V
to 2.1V (MCP6006/6R/6U)
AOL
105
126
—
dB
0.2 < VOUT < (VDD – 0.2V)
High-Level Output Voltage
VOH
VDD – 10
VDD – 6
—
mV
VDD = 5.5V, RL = 10 k
VDD – 80
VDD – 54
—
VDD = 5.5V, RL = 1 k
Low-Level Output Voltage
VOL
—
VSS + 6
VSS + 10
VDD = 5.5V, RL = 10 k
—
VSS + 54
VSS + 80
Output Short-Circuit Current
ISC
—
±6
—
mA
VDD = 1.8V
—
±30
—
mA
VDD = 5.5V
Common-Mode
TA= -40°C to +125°C
Open-Loop Gain
DC Open-Loop Gain
(Large Signal)
Output
VDD = 5.5V, RL = 1 k
Power Supply
Supply Voltage
Quiescent Current per Amplifier
Start-up Time
VDD
1.8
—
5.5
V
IQ
—
50
70
µA
IO = 0
VDD = 0V to 5.5V
tstart
Crosstalk
—
6
—
µs
—
140
—
dB
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND,
VCM = VDD/4, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
GBWP
—
1
—
MHz
Phase Margin
PM
—
70
—
°
G = +1 V/V
Slew Rate
SR
—
1.9
—
V/µs
VDD = 5.5V
ts
—
3
—
µs
—
3.5
—
—
0.0025
—
AC Response
Gain Bandwidth Product
Settling Time
Total Harmonic Distortion + Noise
2020-2021 Microchip Technology Inc.
THD + N
To 0.1%, VDD = 5V,
2V step, G = +1
To 0.01%, VDD = 5V,
2V step, G = +1
%
VDD = 5V, Vo = 1VRMS,
G = +1, f = 1kHz, 80 kHz
measurement BW
DS20006411B-page 3
MCP6006/6R/6U/7/9
AC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND,
VCM = VDD/4, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Noise Voltage
Eni
—
3.3
—
µVP-P
f = 0.1 Hz to 10 Hz
Input Noise Voltage Density
eni
—
25
—
nV/Hz
f = 1 kHz
—
22
—
nV/Hz
f = 10 kHz
f = 1 kHz
Noise
Input Noise Current Density
ini
—
0.6
—
fA/Hz
Electromagnetic Interference
Rejection Ratio
EMIRR
—
60
—
dB
—
90
—
VIN = 100 mVPK, 900 MHz
—
95
—
VIN = 100 mVPK, 1800 MHz
—
100
—
VIN = 100 mVPK, 2400 MHz
—
100
—
VIN = 100 mVPK, 5800 MHz
VIN = 100 mVPK, 400 MHz
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Conditions
Temperature Ranges
Note 1
Thermal Package Resistances
Thermal Resistance, 5-Lead SC70
JA
—
331
—
°C/W
Thermal Resistance, 5-Lead SOT-23
JA
—
221
—
°C/W
Thermal Resistance, 8-Lead MSOP
JA
—
206
—
°C/W
Thermal Resistance, 8-Lead SOIC
JA
—
150
—
°C/W
Thermal Resistance, 14-Lead TSSOP
JA
—
100
—
°C/W
Thermal Resistance, 14-Lead SOIC
JA
—
120
—
°C/W
Note 1:
The internal Junction Temperature (TJ) must not exceed the absolute maximum specification of +150°C.
DS20006411B-page 4
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
DC Inputs
600
35
1900 Samples
TA = +25°C
30
25
20
15
VDD = 1.8V
VDD = 5.5V
10
5
0
Input Offset Voltage (μV)
40
-1600
-1400
-1200
-1000
-800
-600
-400
-200
0
200
400
600
800
1000
1200
1400
1600
Percentage of Occurances (%)
2.1
VDD = 5.5V
400
200
0
-200
-600
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Common Mode Voltage (V)
FIGURE 2-4:
Input Offset Voltage vs.
Common-Mode Input Voltage.
40
200
114 Samples
TA = -40°C to +125°C
30
25
VDD = 5.5V
20
VDD = 1.8V
15
10
5
0
Input Offset Voltage (μV)
35
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
4
Percentage of Occurances (%)
Input Offset Voltage
150
100
0
Input Offset Voltage Drift
1000
TA = -40°C
800
TA = +25°C
600
TA = +85°C
TA = +125°C
400
200
0
-200
-400
-600
-800
VDD = 1.8V
-1000
-0.4 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2
Input Common Mode Voltage (V)
FIGURE 2-3:
Input Offset Voltage vs.
Common-Mode Input Voltage.
2020-2021 Microchip Technology Inc.
VDD = 1.8V
-50
-100
-150
VCM = VSS
-200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
FIGURE 2-5:
Output Voltage.
Input Offset Voltage (μV)
FIGURE 2-2:
Histogram.
VDD = 5.5V
50
Input Offset Voltage Drift (μV/°C)
Input Offset Voltage (μV)
TA = +85°C
TA = +125°C
-400
Input Offset Voltage (μV)
FIGURE 2-1:
Histogram.
TA = -40°C
TA = +25°C
Input Offset Voltage vs.
500
400
300
200
100
0
-100
-200
-300
-400
-500
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
1.5
2.0
2.5
3.0
3.5
4.0
Supply Voltage (V)
VCM = VSS
4.5
5.0
5.5
FIGURE 2-6:
Input Offset Voltage vs.
Power Supply Voltage.
DS20006411B-page 5
MCP6006/6R/6U/7/9
140
5
4
3
2
1
0
-1
-2
-3
-4
-5
VDD = 5.5V
DC Open-Loop Gain (dB)
Input Bias, Offset Currents
(pA)
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
IOS
IB-
IB+
120
VDD = 1.8V
110
100
90
80
-50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common Mode Voltage (V)
FIGURE 2-7:
Input Bias, Offset Current
vs. Common-Mode Voltage.
-25
0
25
50
75
Ambient Temperature (°C)
100
125
FIGURE 2-10:
DC Open-Loop Gain vs.
Ambient Temperature.
400
0.001
1m
0.0001
100μ
VDD = 5.5V
300
0.00001
10μ
TA = +125°C
200
1μ
0.000001
-IIN (A)
Input Bias Current (pA)
VDD = 5.5V
130
100
TA = +85°C
0
0.0000001
100n
1E-08
10n
1E-09
1n
-100
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
1E-10
100p
-200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common Mode Voltage (V)
1E-11
10p
-1
-0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1
VIN (V)
0
FIGURE 2-11:
Measured Input Current vs.
Input Voltage (below VSS).
FIGURE 2-8:
Input Bias Current vs.
Common-Mode Input Voltage.
110
VDD = +5.5V
CMRR, PSRR (dB)
105
100
PSRR
95
90
CMRR (VCM = -0.1V to +5.6V)
85
80
75
70
-50
-25
0
25
50
75
Ambient Temperature (°C)
FIGURE 2-9:
Temperature.
DS20006411B-page 6
100
125
CMRR, PSRR vs. Ambient
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.2
Other DC Voltages and Currents
Output Short-Circuit Current
(mA)
Quiescent Current (μA)
80
70
60
VDD = +5.5V
50
VDD = +1.8V
40
30
Per Amplifier
20
-50
-25
0
25
50
75
Ambient Temperature (°C)
100
0.5
1
1.5 2 2.5 3 3.5 4 4.5
Power Supply Voltage (V)
5
5.5
FIGURE 2-15:
Output Short-Circuit Current
vs. Power Supply Voltage.
400
70
60
50
40
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
30
20
10
Per Amplifier
Output Voltage Headroom
(mV)
80
VDD = 1.8V
350
300
250
200
VOL - VSS
150
VDD - VOH
100
50
0
0
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
FIGURE 2-13:
Quiescent Current vs.
Power Supply Voltage.
100
90
80
70
60
50
40
30
20
10
0
1.0
2.0
3.0
Output Current Magnitude (mA)
4.0
FIGURE 2-16:
Output Voltage Headroom
vs. Output Current.
300
VDD = 1.8V
VDD = 5.5V
Per Amplifier
Output Voltage Headroom
(mV)
Quiescent Current (μA)
+125ᵒC
+85ᵒC
+25ᵒC
-40ᵒC
0
125
FIGURE 2-12:
Quiescent Current vs.
Ambient Temperature.
Quiescent Current (μA)
50
40
30
20
10
0
-10
-20
-30
-40
-50
250
200
VDD - VOH
150
VOL - VSS
100
50
VDD = 5.5V
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Common Mode Input Voltage (V)
FIGURE 2-14:
Quiescent Current vs.
Common-Mode Input Voltage.
2020-2021 Microchip Technology Inc.
0.0
2.0
4.0
6.0
8.0
Output Current Magnitude (mA)
10.0
FIGURE 2-17:
Output Voltage Headroom
vs. Output Current.
DS20006411B-page 7
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Frequency Response
140
1.6
Gain Bandwidth Product
(MHz)
Representative Part
100
CMRR
80
60
PSRRPSRR+
40
20
0
100
1k
10k
Frequency (Hz)
100k
CMRR, PSRR vs.
180
Open-Loop Gain (dB)
225
120
100
135
Phase
80
90
60
45
40
0
Gain
20
-45
0
100
0.8
80
0.6
60
Phase Margin
0.4
20
VDD = 1.8V
-50
10
140
Gain Bandwidth Product
120
1.0
100
0.8
80
0.6
60
0.4
40
Phase Margin
VDD = 5.5V
0
25
50
75
100
Ambient Temperature (°C)
20
0
125
FIGURE 2-20:
Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature.
DS20006411B-page 8
100
100
1000
1k
10k
100000
100k
10000
1M
1000000
FIGURE 2-22:
Closed-Loop Output
Impedance vs. Frequency.
120
100
EMIRR (dB)
160
1.4
GN:
101 V/V
1
11 V/V
1 V/V
Frequency (Hz)
Phase Margin (°)
1.6
-25
125
100
1
Open-Loop Gain, Phase vs.
0.0
0
0
25
50
75
100
Ambient Temperature (°C)
1000
-20
-135
0.1
1
10 100 1k 10k 100k 1M 10M
1.E-11.E+01.E+11.E+21.E+31.E+41.E+51.E+61.E+7
Frequency (Hz)
0.2
-25
10000
-90
1.2
40
0.2
VDD = 5.5V
FIGURE 2-19:
Frequency.
120
1.0
FIGURE 2-21:
Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature.
140
Gain Bandwidth Product
(MHz)
140
Gain Bandwidth Product
1.2
1M
Open-Loop Phase (°)
FIGURE 2-18:
Frequency.
-50
160
1.4
0.0
Closed Loop Output
()
Impedance (W)
CMRR, PSRR (dB)
120
Phase Margin (°)
2.3
80
60
40
20
0 10
10M
FIGURE 2-23:
VIN = 100 mVPK
VDD = 5.5V
100
1000
100M
1G
Frequency
Frequency(Hz)
(Hz)
10000
10G
EMIRR vs. Frequency.
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
10
Output Voltage Swing (VP-P)
120
EMIRR (dB)
100
80
60
EMIRR @ 2400 MHz
EMIRR @ 1800 MHz
EMIRR @ 900 MHz
EMIRR @ 400 MHz
40
20
0
0.01
0.1
RF Input Peak Voltage (VPK)
VDD = 5.5V
1
0.1
1
1E+3
1k
FIGURE 2-24:
EMIRR vs. RF Input
Peak-to-Peak Voltage.
1E+4
10k
1E+5
100k
Frequency (Hz)
1E+6
1M
1E+7
10M
FIGURE 2-26:
Maximum Output Voltage
Swing vs. Frequency.
Channel Separation (dB)
0
-20
-40
-60
-80
-100
-120
-140
1E+3
1k
FIGURE 2-25:
Frequency.
1E+4
10k
1E+5
100k
Frequency (Hz)
1E+6
1M
1E+7
10M
Channel Separation vs.
2020-2021 Microchip Technology Inc.
DS20006411B-page 9
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.4
Input Noise
VDD = 5.5V
VCM = 2.5V
G=1
BW = 80 kHz
f = 1 kHz
-10
35
30
THD + N (dB)
Input Noise Voltage Density
(nV/√Hz)
40
VDD = 1.8V
25
20
VDD = 5.5V
15
10
-30
-50
-90
5
f = 10 kHz
0
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
Common Mode Input Voltage (V)
5
5.5
FIGURE 2-27:
Input Noise Voltage Density
vs. Common-Mode Voltage.
G = -1, RL = 2 kΩ
G = +1, RL = 2 kΩ
-70
G = -1, RL = 10 kΩ
G = +1, RL = 10 kΩ
-110
0.001
0.01
0.1
Amplitude (VRMS)
1
FIGURE 2-30:
THD + N vs. Amplitude.
FIGURE 2-31:
Noise.
0.1 Hz to 10 Hz Voltage
Input Noise Voltage Density
(V/√Hz)
10000
10μ
1000
1μ
100
100n
10
10n
1
1n
0.1
1.E-1
1
1.E+0
FIGURE 2-28:
vs. Frequency.
10
100
1k
1.E+1
1.E+2
1.E+3
Frequency (Hz)
10k
1.E+4
100k
1.E+5
Input Noise Voltage Density
-50
VDD = 5.5V
VCM = 2.5V
G=1
BW = 80 kHz
VOUT = 0.5VRMS
THD + N (dB)
-60
-70
RL = 2 kΩ
-80
-90
RL = 10 kΩ
-100
-110
100
FIGURE 2-29:
DS20006411B-page 10
1000
1k
Frequency (Hz)
10000
10k
THD + N vs. Frequency.
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.5
Time Response
6
3.0
Slew Rate (V/μs)
2.5
Input, Output Voltages (V)
Falling Edge, VDD =5.5V
2.0
1.5
Rising Edge, VDD =5.5V
Falling Edge, VDD =1.8V
1.0
Rising Edge, VDD =1.8V
0.5
0.0
-50
-25
0
25
50
75
Ambient Temperature (°C)
FIGURE 2-32:
Temperature.
100
125
Slew Rate vs. Ambient
5
VIN
4
VOUT
3
2
VDD = 5.5V
G = +1 V/V
1
0
Time (10 μs/div)
FIGURE 2-35:
Pulse Response.
Large Signal Noninverting
FIGURE 2-36:
Response.
Large Signal Inverting Pulse
Input, Output Voltages
(20 mV/Step)
VOUT
VIN
VDD = 5.5V
G = +1 V/V
Time (10 μs/div)
FIGURE 2-33:
Pulse Response.
Small Signal Noninverting
Input, Output Voltages
(20 mV/Step)
VDD = 5.5V
G = -1 V/V
VOUT
Time (10 μs/div)
FIGURE 2-34:
Response.
Small Signal Inverting Pulse
2020-2021 Microchip Technology Inc.
Input, Output Voltages (V)
7
VIN
VIN
6
5
4
VOUT
3
2
1
VDD = 5.5V
G = +1 V/V
0
-1
Time (0.1 ms/div)
FIGURE 2-37:
The MCP6006/6R/6U/7/9
Device Shows No Phase Reversal.
DS20006411B-page 11
MCP6006/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
60
50
5
4
VDD = 5.5V
No Bypass Capacitors
VIN = 100mVPP
3
2
Overshoot (%)
Input, Output Voltages (V)
6
40
30
Overshoot (+)
20
Overshoot (-)
10
VIN = 100 mV
G = +1 V/V
1
0
VOUT
0
tstart
FIGURE 2-38:
DS20006411B-page 12
0
200
Time (10 μs/div)
Start-up Time.
FIGURE 2-39:
Load.
400
600
Capacitive Load (pF)
800
1000
Overshoot vs. Capacitive
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1, Table 3-2, and Table 3-3.
TABLE 3-1:
PIN FUNCTION TABLE – SINGLES
MCP6006
MCP6006R
MCP6006U
5-Lead SC70, SOT-23
5-Lead SOT-23
5-Lead SC70, SOT-23
1
1
4
VOUT
2
5
2
VSS
Symbol
Description
Analog Output
Negative Power Supply
3
3
1
VIN+
Noninverting Input
4
4
3
VIN-
Inverting Input
5
2
5
VDD
Positive Power Supply
TABLE 3-2:
PIN FUNCTION TABLE – DUALS
MCP6007
8-Lead MSOP, SOIC
Symbol
Description
VOUTA
Analog Output; Op Amp A
2
VINA-
Inverting Input; Op Amp A
3
VINA+
Noninverting Input; Op Amp A
1
4
VSS
5
VINB+
Noninverting Input; Op Amp B
6
VINB-
Inverting Input; Op Amp B
7
VOUTB
Analog Output; Op Amp B
8
VDD
TABLE 3-3:
Negative Power Supply
Positive Power Supply
PIN FUNCTION TABLE – QUADS
MCP6009
14-Lead TSSOP, SOIC
Symbol
Description
VOUTA
Analog Output; Op Amp A
2
VINA-
Inverting Input; Op Amp A
3
VINA+
Noninverting Input; Op Amp A
1
4
VDD
5
VINB+
Noninverting Input; Op Amp B
6
VINB-
Inverting Input; Op Amp B
7
VOUTB
Analog Output; Op Amp B
8
VOUTC
Analog Output; Op Amp C
9
VINC-
Inverting Input; Op Amp C
10
VINC+
11
VSS
12
VIND+
Noninverting Input; Op Amp D
13
VIND-
Inverting Input; Op Amp D
14
VOUTD
Analog Output; Op Amp D
2020-2021 Microchip Technology Inc.
Positive Power Supply
Noninverting Input; Op Amp C
Negative Power Supply
DS20006411B-page 13
MCP6006/6R/6U/7/9
3.1
Analog Outputs
The analog output pins (VOUTx) are low-impedance
voltage sources.
3.2
Analog Inputs
The noninverting and inverting inputs (VINx+, VINx-) are
high-impedance CMOS inputs with low bias currents.
DS20006411B-page 14
3.3
Power Supply Pins (VSS, VDD)
The positive power supply (VDD) is 1.8V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD needs
bypass capacitors.
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
4.0
APPLICATION INFORMATION
4.1.3
INPUT CURRENT LIMITS
The MCP6006/6R/6U/7/9 operational amplifier is unity
gain stable and suitable for a wide range of general
purpose applications.
In order to prevent damage and/or improper operation
of the amplifier, the circuit must limit the currents into
the input pins (see Section 1.1, Absolute Maximum
Ratings†).
4.1
Figure 4-2 shows one approach to protecting these
inputs. The resistors, R1 and R2, limit the possible
currents in or out of the input pins through the ESD
diodes to either VDD or VSS.
4.1.1
Rail-to-Rail Input
PHASE REVERSAL
The MCP6006/6R/6U/7/9 op amp is designed to
prevent phase reversal, when the input pins exceed the
supply voltages. Figure 2-37 shows the input voltage
exceeding the supply voltage with no phase reversal.
4.1.2
VDD
INPUT VOLTAGE LIMITS
In order to prevent damage and/or improper operation
of the amplifier, the circuit must limit the voltages at the
input pins (see Section 1.1, Absolute Maximum
Ratings†).
The Electrostatic Discharge (ESD) protection on the
inputs can be depicted as shown in Figure 4-1. This
structure was chosen to protect the input transistors
against many, but not all, overvoltage conditions and to
minimize the Input Bias (IB) current.
‐
+
R1
VOUT
MCP6006
V2
–
R2
min(R1, R2) >
VSS – min(V1, V2)
5 mA
min(R1, R2) >
max(V1,V2) – VDD
5 mA
FIGURE 4-2:
VDD
-IN
V1
Protecting the Analog Inputs.
VDD
OUT
+IN
+
VSS
VSS
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
The input ESD diodes clamp the inputs when they try
to go more than one diode drop below VSS. They also
clamp any voltages that go well above VDD; their
breakdown voltage is high enough to allow normal
operation. At 0.5V above VDD or below VSS, the input
currents are typically less than 5 mA. Very fast ESD
events that meet the specification are limited so that
damage does not occur.
2020-2021 Microchip Technology Inc.
DS20006411B-page 15
MCP6006/6R/6U/7/9
4.1.4
NORMAL OPERATION
The input stage of the MCP6006/6R/6U/7/9 op amp
uses two differential input stages in parallel. One operates at a low Common-Mode Input Voltage (VCM), while
the other operates at a high VCM. With this topology,
the device operates with a VCM of up to 300 mV above
VDD and 300 mV below VSS. The input offset voltage is
measured at VCM = VSS – 0.3V and VDD + 0.3V to
ensure proper operation.
Figure 4-4 shows the output voltage for the MCP6007
and a similar op amp from a competitor, while Figure 4-5
shows the inrush current. When power is first applied to
the MCP6007, the output is turned off (Point B) and
driven by the load. After 6 µs, the output is turned on
(Point C) and VOUT follows the input sine wave. Meanwhile, the competitor’s output is uncontrolled during the
first 4 µs (Point A) and has some distortion on the output
(Point D) prior to turning on after 50 µs (Point E).
The transition between the input stages occurs when
VCM is near VDD – 0.9V (see Figures 2-3 and 2-4). For
the best distortion performance and gain linearity with
noninverting gains, avoid this region of operation.
4.2
Rail-to-Rail Output
B
D
The output voltage range of the MCP6006/6R/6U/7/9
op amp is 0.006V (typical) and 5.494V (typical) when
RL = 10 k is connected to VDD/2 and VDD = 5.5V.
Refer to Figures 2-16 and 2-17 for more information.
4.3
A
C
E
FIGURE 4-4:
Start-up Time Voltages.
FIGURE 4-5:
IDD During Start-up.
Start-up
The MCP6006/6R/6U/7/9 family of parts quickly
controls the output when power (VDD) is initially applied
to the device (start-up). Bypass capacitors are
removed during the start-up testing to minimize inrush
currents (see Figure 4-3). When the op amp is controlled and is off, the output impedance is high and
VOUT is VL or 1V. When the op amp turns on, the output
becomes low-impedance and VOUT follows the input
sine wave; this is used as the start-up time.
3V
0
VDD
+
-
VDD
VOUT
VSS
RL
VL = 1V
FIGURE 4-3:
DS20006411B-page 16
Start-up Test Circuit.
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
4.4
Capacitive Loads
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. While a unity gain buffer (G = +1 V/V) is the
most sensitive to the capacitive loads, all gains show
the same general behavior.
When driving large capacitive loads with the
MCP6006/6R/6U/7/9 op amp, a small series resistor at
the output (RISO in Figure 4-6) improves the feedback
loop’s phase margin (stability) by making the output
load resistive at higher frequencies. The bandwidth will
be generally lower than the bandwidth with no
capacitance load.
Guard Ring
FIGURE 4-7:
for Inverting Gain.
1.
VIN
MCP6006
+
RISO
VOUT
CL
FIGURE 4-6:
Output Resistor, RISO,
Stabilizes Large Capacitive Loads.
4.5
Supply Bypass
The MCP6006/6R/6U/7/9 op amp’s power supply pin
(VDD for single-supply) should have a local bypass
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good
high-frequency performance. It can use a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large,
slow currents. This bulk capacitor can be shared with
other analog parts.
4.6
PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow, which is greater than the
MCP6006/6R/6U/7/9’s bias current at +25°C (±1 pA,
typical).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-7.
2020-2021 Microchip Technology Inc.
VIN+
VSS
Example Guard Ring Layout
Noninverting Gain and Unity Gain Buffer:
a) Connect the noninverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b) Connect the guard ring to the inverting input
pin (VIN-). This biases the guard ring to the
Common-mode input voltage.
Inverting Gain and Transimpedance Gain
Amplifiers (convert current to voltage, such as
photo detectors):
a) Connect the guard ring to the noninverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the
op amp (e.g., VDD/2 or ground).
b) Connect the inverting pin (VIN-) to the input
with a wire that does not touch the PCB
surface.
2.
–
VIN-
4.7
Unused Op Amps
An unused op amp in a dual (MCP6007) or quad
(MCP6009) package should be configured as shown in
Figure 4-8. These circuits prevent the output from
toggling and causing crosstalk. Circuit A sets the
op amp at its minimum noise gain. The resistor divider
produces any desired reference voltage within the output voltage range of the op amp; the op amp buffers
that reference voltage. Circuit B uses the minimum
number of components.
VDD
¼ MCP6009 (A)
¼ MCP6009 (B)
VDD
R1
VDD
VREF
R2
V
REF
= V
DD
FIGURE 4-8:
R2
R +R
1
2
Unused Op Amps.
DS20006411B-page 17
MCP6006/6R/6U/7/9
4.8
Electromagnetic Interference
Rejection Ratio (EMIRR)
Definitions
The Electromagnetic Interference (EMI) is the
disturbance that affects an electrical circuit due to
either electromagnetic induction or electromagnetic
radiation emitted from an external source.
The parameter which describes the EMI robustness of
an op amp is the Electromagnetic Interference Rejection Ratio (EMIRR). It quantitatively describes the
effect that an RF interfering signal has on op amp
performance. Internal passive filters make EMIRR
better compared with older parts. This means that with
good PCB layout techniques, your EMC performance
should be better.
EMIRR is defined as:
EQUATION 4-1:
V RF
EMIRR dB = 20 log -------------
V OS
Where:
VRF = Peak Amplitude of
RF Interfering Signal (VPK)
VOS = Input Offset Voltage Shift (V)
4.9
4.9.1
.
VDD
A Carbon Monoxide (CO) gas detector is a device that
detects the presence of carbon monoxide gas. Usually
this is battery powered and transmits audible and
visible warnings.
The sensor responds to CO gas by reducing its resistance proportionaly to the amount of CO present in the
air exposed to the internal element. On the sensor
module, this variable is part of a voltage divider formed
by the internal element and potentiometer R1. The
output of this voltage divider is fed into the noninverting
inputs of the MCP6006 op amp. The device is configured as a buffer with unity gain and is used to provide
a nonloaded test point for sensor sensitivity.
–
+
R1
FIGURE 4-9:
4.9.2
VOUT
MCP6006
CO Gas Sensor Circuit.
PRESSURE SENSOR AMPLIFIER
The MCP6006/6R/6U/7/9 is well-suited for conditioning
sensor signals in battery-powered applications. Many
sensors are configured as Wheatstone bridges. Strain
gauges and pressure sensors are two common
examples.
Figure 4-10 shows a strain gauge amplifier, using the
MCP6006/6R/6U/7/9 Enhanced EMI protection device.
The difference amplifier with EMI robustness op amp is
used to amplify the signal from the Wheatstone bridge.
The two op amps, configured as buffers and connected
at outputs of pressure sensors, prevent resistive loading of the bridge by resistors, R1 and R2. Resistors, R1,
R2 and R3, R5, need to be chosen with very low
tolerance to match the CMRR.
Application Circuits
CARBON MONOXIDE GAS SENSOR
VDD
VREF
VDD
R+∆R
VDD
R-∆R
½ MCP6007
-
R3
10 k
VDD
R1
100
+
Vb
-
Va
VDD
R-∆R
VOUT
+
R+∆R
R2
100
MCP6006
-
R4
+
10 kΩ
½ MCP6007
10k
V OUT = V a – V b ------------100
Strain Gauge
FIGURE 4-10:
Pressure Sensor Amplifier.
Because this sensor can be corrupted by parasitic
electromagnetic signals, the MCP6006 op amp can be
used for conditioning this sensor.
In Figure 4-9, the variable resistor is used to calibrate
the sensor in different environments.
DS20006411B-page 18
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5.0
DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6006/6R/6U/7/9 op amp.
5.1
Microchip Advanced Part Selector
(MAPS)
MAPS is a software tool that helps semiconductor
professionals efficiently identify the Microchip
devices that fit a particular design requirement.
Available at no cost from the Microchip website at
www.microchip.com/ maps, MAPS is an overall selection tool for Microchip’s product portfolio that includes
Analog, Memory, MCUs and DSCs. Using this tool, you
can define a filter to sort features for a parametric
search of devices and export side-by-side technical
comparison reports. Helpful links are also provided for
data sheets, purchase and sampling of Microchip parts.
5.2
Analog Demonstration and
Evaluation Boards
Microchip offers a broad spectrum of Analog
Demonstration and Evaluation Boards that are
designed to help you achieve faster time to market.
For a complete listing of these boards and their
corresponding user’s guides and technical information, visit the Microchip website at:
www.microchipdirect.com.
Some boards that are especially useful are:
• MCP6XXX Amplifier Evaluation Board 2
(P/N DS51668)
• MCP6XXX Amplifier Evaluation Board 3
(P/N DS51673)
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
(P/N SOIC8EV)
• 5/6-Pin SOT-23 Evaluation Board
(P/N VSUPEV2)
• 14-Pin SOIC/TSSOP/DIP Evaluation Board
(P/N SOIC14EV)
2020-2021 Microchip Technology Inc.
5.3
Application Notes
The following Microchip Analog Design Notes and Application Notes are available on the Microchip website at
www.microchip.com/appnotes and are recommended
as supplemental reference resources:
• ADN003 – “Select the Right Operational Amplifier
for your Filtering Circuits”, Microchip Technology
Inc. (DS21821)
• AN722 – “Operational Amplifier Topologies and
DC Specifications”, Microchip Technology Inc.
(DS00722)
• AN723 – “Operational Amplifier AC Specifications
and Applications”, Microchip Technology Inc.
(DS00723)
• AN884 – “Driving Capacitive Loads With
Op Amps”, Microchip Technology Inc. (DS00884)
• AN990 – “Analog Sensor Conditioning
Circuits – An Overview”, Microchip Technology
Inc. (DS00990)
• AN1177 – “Op Amp Precision Design: DC Errors”,
Microchip Technology Inc. (DS01177)
• AN1228 – “Op Amp Precision Design: Random
Noise”, Microchip Technology Inc. (DS01228)
• AN1258 – “Op Amp Precision Design: PCB
Layout Techniques”, Microchip Technology Inc.
(DS01258).
These application notes and others are listed in the
design guide:
• “Signal Chain Design Guide”, Microchip
Technology inc. (DS21825).
DS20006411B-page 19
MCP6006/6R/6U/7/9
NOTES:
DS20006411B-page 20
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SC70 (MCP6006/6U)
XXNN
Example
Device
Marking
MCP6006
GANN
MCP6006U
GFNN
Example:
5-Lead SOT-23 (MCP6006/6U/6R)
Device
XXXXY
WWNNN
8-Lead SOIC (MCP6007)
GA25
Marking
MCP6006
AAA5
MCP6006U
AAA6
MCP6006R
AAA7
Note: Applies to 5-Lead SOT-23.
AAA50
31256
Example:
XXXXXXXX
MCP6007
NNN
256
XXXXYYWW
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
SN e3 2031
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2020-2021 Microchip Technology Inc.
DS20006411B-page 21
MCP6006/6R/6U/7/9
Package Marking Information (Continued)
8-Lead MSOP (MCP6007)
XXXXXX
YWWNNN
14-Lead SOIC (MCP6009)
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
14-Lead TSSOP (MCP6009)
XXXXXXXX
YYWW
NNN
DS20006411B-page 22
Example:
6007E
031256
Example:
MCP6009
E/SL e3
3124256
Example:
MCP6009E
2031
256
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
e
e
3
B
1
E1
E
2X
0.15 C
4
N
5X TIPS
0.30 C
NOTE 1
2X
0.15 C
5X b
0.10
C A B
TOP VIEW
C
c
A2
A
SEATING
PLANE
A1
L
SIDE VIEW
END VIEW
Microchip Technology Drawing C04-061-LT Rev E Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 23
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Standoff
A1
A2
Molded Package Thickness
Overall Length
D
Overall Width
E
Molded Package Width
E1
b
Terminal Width
Terminal Length
L
c
Lead Thickness
MIN
0.80
0.00
0.80
0.15
0.10
0.08
MILLIMETERS
NOM
5
0.65 BSC
2.00 BSC
2.10 BSC
1.25 BSC
0.20
-
MAX
1.10
0.10
1.00
0.40
0.46
0.26
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-061-LT Rev E Sheet 2 of 2
DS20006411B-page 24
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
Gx
SILK SCREEN
3
2
1
C
G
4
5
Y
X
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width
X
Contact Pad Length
Y
Distance Between Pads
G
Distance Between Pads
Gx
MIN
MILLIMETERS
NOM
0.65 BSC
2.20
MAX
0.45
0.95
1.25
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2061-LT Rev E
2020-2021 Microchip Technology Inc.
DS20006411B-page 25
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
0.20 C 2X
D
e1
A
D
N
E/2
E1/2
E1
E
(DATUM D)
(DATUM A-B)
0.15 C D
2X
NOTE 1
1
2
e
B
NX b
0.20
C A-B D
TOP VIEW
A
A A2
0.20 C
SEATING PLANE
A
SEE SHEET 2
A1
C
SIDE VIEW
Microchip Technology Drawing C04-091-OT Rev F Sheet 1 of 2
DS20006411B-page 26
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
T
L
L1
VIEW A-A
SHEET 1
Units
Dimension Limits
N
Number of Pins
e
Pitch
e1
Outside lead pitch
A
Overall Height
A2
Molded Package Thickness
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Footprint
L1
I
Foot Angle
c
Lead Thickness
b
Lead Width
MIN
0.90
0.89
-
0.30
0°
0.08
0.20
MILLIMETERS
NOM
5
0.95 BSC
1.90 BSC
2.80 BSC
1.60 BSC
2.90 BSC
0.60 REF
-
MAX
1.45
1.30
0.15
0.60
10°
0.26
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 27
MCP6006/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
SILK SCREEN
5
Y
Z
C
G
1
2
E
GX
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
C
Contact Pad Spacing
X
Contact Pad Width (X5)
Contact Pad Length (X5)
Y
Distance Between Pads
G
Distance Between Pads
GX
Overall Width
Z
MIN
MILLIMETERS
NOM
0.95 BSC
2.80
MAX
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2091-OT Rev F
DS20006411B-page 28
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
2X
0.10 C A–B
2X
0.10 C A–B
NOTE 1
2
1
e
B
NX b
0.25
C A–B D
NOTE 5
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
SEE VIEW C
VIEW A–A
0.23
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 29
MCP6006/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
L1
Footprint
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 2 of 2
DS20006411B-page 30
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SN Rev F
2020-2021 Microchip Technology Inc.
DS20006411B-page 31
MCP6006/6R/6U/7/9
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006411B-page 32
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2020-2021 Microchip Technology Inc.
DS20006411B-page 33
MCP6006/6R/6U/7/9
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006411B-page 34
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
NOTE 5
D
N
E
2
E2
2
E1
E
2X
0.10 C D
NOTE 1
1
2
2X N/2 TIPS
0.20 C
3
e
NX b
B
0.25
NOTE 5
C A–B D
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
14X
A1
h
0.10 C
SIDE VIEW
h
R0.13
H
R0.13
c
SEE VIEW C
L
VIEW A–A
(L1)
VIEW C
Microchip Technology Drawing No. C04-065-SL Rev D Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 35
MCP6006/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Lead Angle
Foot Angle
c
Lead Thickness
Lead Width
b
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0°
0.10
0.31
5°
5°
MILLIMETERS
NOM
14
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall
not exceed 0.15 mm per end. Dimension E1 does not include interlead flash
or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-065-SL Rev D Sheet 2 of 2
DS20006411B-page 36
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
14
SILK SCREEN
C
Y
1
2
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X14)
X
Contact Pad Length (X14)
Y
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2065-SL Rev D
2020-2021 Microchip Technology Inc.
DS20006411B-page 37
MCP6006/6R/6U/7/9
14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
E
2
E1
2
E1
E
1
2X 7 TIPS
0.20 C B A
2
e
TOP VIEW
A
C
A2 A
SEATING
PLANE
14X
0.10 C
14X b
0.10
A1
A
C B A
SIDE VIEW
SEE DETAIL B
VIEW A–A
Microchip Technology Drawing C04-087 Rev D Sheet 1 of 2
DS20006411B-page 38
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(ș2)
R1
H
R2
c
L
ș1
(L1)
(ș3)
DETAIL B
Number of Terminals
Pitch
Overall Height
Standoff
Molded Package Thickness
Overall Length
Overall Width
Molded Package Width
Terminal Width
Terminal Thickness
Terminal Length
Footprint
Lead Bend Radius
Lead Bend Radius
Foot Angle
Mold Draft Angle
Mold Draft Angle
Notes:
Units
Dimension Limits
N
e
A
A1
A2
D
E
E1
b
c
L
L1
R1
R2
ș1
ș2
ș3
MIN
–
0.05
0.80
4.90
4.30
0.19
0.09
0.45
0.09
0.09
0°
–
–
MILLIMETERS
NOM
14
0.65 BSC
–
–
1.00
5.00
6.40 BSC
4.40
–
–
0.60
1.00 REF
–
–
–
12° REF
12° REF
MAX
1.20
0.15
1.05
5.10
4.50
0.30
0.20
0.75
–
–
8°
–
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087 Rev D Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006411B-page 39
MCP6006/6R/6U/7/9
14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
G
SILK SCREEN
C
Y
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C
Contact Pad Width (Xnn)
X
Contact Pad Length (Xnn)
Y
Contact Pad to Contact Pad (Xnn)
G
MIN
MILLIMETERS
NOM
0.65 BSC
5.90
MAX
0.45
1.45
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2087 Rev D
DS20006411B-page 40
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
APPENDIX A:
REVISION HISTORY
Revision B (June 2021)
Below is a list of changes:
• Updated mentions of the MCP6006 device
throughout the document.
• Updated Figure 4-2.
• Updated Section 6.0, Packaging Information.
• Updated the Product Identification System to
include Automotive models.
• Minor corrections and editorial changes.
Revision A (September 2020)
• Original Release of this Document.
2020-2021 Microchip Technology Inc.
DS20006411B-page 41
MCP6006/6R/6U/7/9
NOTES:
DS20006411B-page 42
2020-2021 Microchip Technology Inc.
MCP6006/6R/6U/7/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.
Device
Device:
Tape and Reel
Option
Class
Note 1:
2:
/XX
Temperature
Range
Package
XXX(2)
Class
MCP6006T
Single Op Amp (Tape and Reel) (SC70, SOT-23)
MCP6006RT
Single Op Amp (Tape and Reel) (SOT-23)
MCP6006UT
Single Op Amp (Tape and Reel) (SC70, SOT-23)
MCP6007
Dual Op Amp
MCP6007T
Dual Op Amp (Tape and Reel for SOIC, MSOP)
MCP6009
Quad Op Amp
MCP6009T
Quad Op Amp (Tape and Reel for SOIC, TSSOP)
Temperature Range:
Package:
-X
E
=
Examples:
a)
MCP6006T-E/LT:
b)
MCP6006T-E/OT:
c)
MCP6006RT-E/OT:
d)
MCP6006UT-E/LT:
e)
MCP6006UT-E/OT:
a)
MCP6007-E/SN:
b)
MCP6007-E/MS:
c)
MCP6007T-E/SN:
d)
MCP6007T-E/MS:
a)
MCP6009-E/ST:
b)
MCP6009-E/SL:
c)
MCP6009T-E/ST:
d)
MCP6009T-E/SL:
-40°C to +125°C
LT
= Plastic Package (SC70), 5-Lead (MCP6006 only)
OT
= Plastic Small Outline Transistor (SOT-23),
5-Lead (MCP6006 only)
SN
= Plastic Small Outline (3.90 mm), 8-Lead
(MCP6007 only)
MS
= Plastic MSOP, 8-Lead (MCP6007 only)
ST
= Plastic Thin Shrink Small Outline (4.4 mm),
14-Lead (MCP6009 only)
SL
= Plastic Small Outline, (3.90 mm),
14-Lead (MCP6009 only)
(Blank)
= Non-Automotive
VAO
= Automotive
The Tape and Reel identifier only appears in the catalog part number
description. This identifier is used for ordering purposes and is not
printed on the device package. Check with your Microchip Sales Office
for package availability with the Tape and Reel option.
Tape and Reel,
Extended Temperature,
5-Lead SC70 Package.
Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
Tape and Reel,
Extended Temperature,
5-Lead SC70 Package.
Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
Extended Temperature,
8-Lead SOIC Package.
Extended Temperature,
8-Lead MSOP Package.
Tape and Reel,
Extended Temperature,
8-Lead SOIC Package.
Tape and Reel,
Extended Temperature,
8-Lead MSOP Package.
Extended Temperature,
14-Lead TSSOP Package.
Extended Temperature,
14-Lead SOIC Package.
Tape and Reel,
Extended Temperature,
14-Lead TSSOP Package.
Tape and Reel,
Extended Temperature,
14-Lead SOIC Package.
Automotive parts are AEC-Q100 qualified, Grade 1.
2020-2021 Microchip Technology Inc.
DS20006411B-page 43
MCP6006/6R/6U/7/9
PRODUCT IDENTIFICATION SYSTEM (AUTOMOTIVE)
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office..
[X](1)
PART NO.
Device
Device:
-X
Class
Note 1:
2:
XXX(2)
Tape and Reel Temperature Package Class
Range
Option
MCP6006T
Single Op Amp (Tape and Reel)
(SC70, SOT-23)
MCP6006RT
Single Op Amp (Tape and Reel)
(SOT-23)
MCP6006UT
Single Op Amp (Tape and Reel)
(SC70, SOT-23)
MCP6007
Dual Op Amp
MCP6007T
Dual Op Amp (Tape and Reel for
SOIC, MSOP)
MCP6009
Quad Op Amp
MCP6009T
Quad Op Amp (Tape and Reel for
SOIC, TSSOP)
Temperature Range:
Package:
/XX
E
=
-40°C to +125°C
LT
=
Plastic Package (SC70), 5-Lead
OT
=
Plastic Small Outline Transistor
(SOT-23), 5-Lead
SN
=
Plastic Small Outline (3.90 mm),
8-Lead
MS
=
Plastic MSOP, 8-Lead
ST
=
Plastic Thin Shrink Small Outline
(4.4 mm), 14-Lead
SL
=
Plastic Small Outline, (3.90 mm),
14-Lead
(Blank)
=
Non-Automotive
VAO
=
Automotive
The Tape and Reel identifier only appears in the catalog
part number description. This identifier is used for ordering purposes and is not printed on the device package.
Check with your Microchip Sales Office for package
availability with the Tape and Reel option.
Examples:
a)
MCP6006T-E/LTVAO:
b)
MCP6006T-E/OTVAO:
c)
MCP6006UT-E/OTVAO:
d)
MCP6006RT-E/OTVAO:
e)
MCP6006UT-E/LTVAO:
a)
MCP6007-E/SNVAO:
b)
MCP6007-E/MSVAO:
c)
MCP6007T-E/SNVAO:
d)
MCP6007T-E/MSVAO:
a)
MCP6009-E/STVAO:
b)
MCP6009-E/SLVAO:
c)
MCP6009T-E/STVAO:
d)
MCP6009T-E/SLVAO:
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SC70 Package.
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SC70 Package.
Extended Temperature,
Automotive,
8-Lead SOIC Package.
Extended Temperature,
Automotive,
8-Lead MSOP Package.
Tape and Reel,
Automotive,
Extended Temperature,
8-Lead SOIC Package.
Tape and Reel, Automotive,
Extended Temperature,
8-Lead MSOP Package.
Extended Temperature,
Automotive,
14-Lead TSSOP Package.
Extended Temperature,
Automotive,
14-Lead SOIC Package.
Tape and Reel, Automotive,
Extended Temperature,
14-Lead TSSOP Package.
Tape and Reel, Automotive,
Extended Temperature,
14-Lead SOIC Package.
Automotive parts are AEC-Q100 qualified, Grade 1.
DS20006411B-page 44
2020-2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Information regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020-2021, Microchip Technology Incorporated, All Rights
Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020-2021 Microchip Technology Inc.
ISBN: 978-1-5224-8232-1
DS20006411B-page 45
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4485-5910
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Israel - Ra’anana
Tel: 972-9-744-7705
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006411B-page 46
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2020-2021 Microchip Technology Inc.
02/28/20
工商网监
湘ICP备2023018690号
