MCP6476/6R/6U/7/9
3 MHz Operational Amplifier with EMI Filtering
Features
Description
• Low Quiescent Current:
- 170 µA (maximum)/amplifier
• Low Input Offset Voltage:
- ±1.6 mV (maximum)
• Enhanced EMI Protection:
- Electromagnetic Interference Rejection Ratio
(EMIRR) at 1.8 GHz: 90 dB
• Supply Voltage Range: 1.8V to 5.5V
• Gain Bandwidth Product: 3 MHz (typical)
• Rail-to-Rail Input/Output
• Unity Gain Stable
• No Phase Reversal
• Quick Start-up Time: 6 µs (typical)
• Small Packages
• Extended Temperature Range: -40°C to +125°C
• AEC Q100 Qualified, Grade 1
The Microchip Technology Inc. MCP6476/6R/6U/7/9
operational amplifier (op amp) operates with a single
supply voltage as low as 1.8V, while drawing low quiescent current (170 µA, maximum per amplifier). This op
amp also has low input offset voltage (±1.6 mV, maximum), and rail-to-rail input and output operation. In
addition, the MCP6476/6R/6U/7/9 is unity gain stable
and has a gain bandwidth product of 3 MHz (typical).
This combination of features supports battery-powered
and portable applications.
Applications
• Smoke Detectors
• Automotive, see Product Identification System
(Automotive)
• Battery-Powered Systems
• Sensor Conditioning
• Battery Current Monitoring
SPICE Macro Models
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
Input, Output Voltages (V)
MCP6476
5-Lead SC70, SOT-23
V OUT 1
VIN+ 3
5 VDD
VDD = 5.5V
No Bypass Capacitors
VIN = 100mVPP
3
2
V OUT 1
5 VSS
VDD 2
4 VIN -
VIN+ 1
VIN + 3
4 VIN -
5 VDD
4 V OUT
MCP6477
8-Lead SOIC, MSOP
5
MCP6476R
5-Lead SOT-23
MCP6476U
5-Lead 6&SOT-23
VIN- 3
6
1
Package Types
V SS 2
Start-up Time
4
This product family is offered in single (MCP6476), dual
(MCP6477) and quad (MCP6479) packages. All
devices are designed using an advanced CMOS process and fully specified in the extended temperature
range, from -40°C to +125°C.
V SS 2
Design Aids
•
•
•
•
The MCP6476/6R/6U/7/9 has enhanced EMI protection minimizing Electromagnetic Interference from
external sources. This feature makes it well-suited for
EMI-sensitive applications, such as power lines, radio
stations and mobile communications.
V INA+ 3
8 VDD
7 VOUTB
6 VINB -
VSS 4
5 VINB +
V OUTA 1
V INA- 2
MCP6479
14-Lead TSSOP, SOIC
VOUTA 1
V INA- 2
VINA + 3
VDD 4
VINB + 5
V INB- 6
VOUTB 7
14 V OUTD
13 V IND 12 V IND +
11 V SS
10 V INC +
9 V INC 8 V OUTC
MCP6477
Start-up time is 6μs
0
-1
Time (5 μs/div)
2020-2021 Microchip Technology Inc.
DS20006419B-page 1
MCP6476/6R/6U/7/9
1.0
ELECTRICAL CHARACTERISTICS
1.1
Absolute Maximum Ratings†
VDD – VSS .....................................................................................................................................................................6V
Current at Analog Input Pins (VIN+, VIN-) ................................................................................................................±5 mA
Analog Inputs (VIN+, VIN-)†† ..................................................................................................... VSS – 0.5V to VDD + 0.5V
Difference Input Voltage ................................................................................................................................ |VDD – VSS|
Output Short-Circuit Current (Note 1) .............................................................................................................Continuous
Storage Temperature...............................................................................................................................-65°C to +150°C
Maximum Junction Temperature (TJ) .................................................................................................................... +150°C
ESD Protection on All Pins (HBM; CDM; MM) 3 kV; 2 kV; 300V
Note 1: Short-circuit to ground, one amplifier per package.
†
Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
†† See Section 4.1.2 “Input Voltage Limits”.
1.2
Specifications
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/4,
VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Offset Voltage
VOS
-1.6
—
1.6
mV
Input Offset Drift with
Temperature
VOS/TA
—
±0.6
—
µV/°C
PSRR
80
95
—
dB
IB
—
±1
—
pA
—
19
—
pA
TA = +85°C
TA = +125°C
Input Offset
Power Supply Rejection Ratio
TA= -40°C to +125°C
Input Bias Current and Impedance
Input Bias Current
—
200
—
pA
Input Offset Current
IOS
—
±1
—
pA
Common-Mode Input Impedance
ZCM
—
1013||6
—
||pF
Differential Input Impedance
ZDIFF
—
1013||1
—
|pF
DS20006419B-page 2
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/4,
VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Common-Mode Input Voltage
Range
VCMR
VSS – 0.3
—
VDD + 0.3
V
VSS – 0.1
—
VDD + 0.1
Common-Mode Rejection Ratio
CMRR
—
90
—
dB
VDD = 5.5V,
VCM = -0.3V to 4.1V
60
76
—
dB
VDD = 5.5V,
VCM = -0.3V to 5.8V
60
76
—
dB
VDD = 1.8V,
VCM = -0.3V to 2.1V
50
76
—
dB
VDD = 5.5V, VCM = -0.3V
to 5.8V (MCP6476/6R/6U)
50
76
—
dB
VDD = 1.8V, VCM = -0.3V
to 2.1V (MCP6476/6R/6U)
AOL
105
126
—
dB
0.2 < VOUT < (VDD – 0.2V)
High-Level Output Voltage
VOH
VDD – 10
VDD – 6
—
mV
VDD = 5.5V, RL = 10 k
VDD – 90
VDD – 54
—
VDD = 5.5V, RL = 1 k
Low-Level Output Voltage
VOL
—
VSS + 6
VSS + 10
VDD = 5.5V, RL = 10 k
—
VSS + 54
VSS + 90
Output Short-Circuit Current
ISC
—
±6
—
mA
VDD = 1.8V
—
±30
—
mA
VDD = 5.5V
Common-Mode
TA= -40°C to +125°C
Open-Loop Gain
DC Open-Loop Gain
(Large Signal)
Output
VDD = 5.5V, RL = 1 k
Power Supply
Supply Voltage
Quiescent Current per Amplifier
Start-up Time
VDD
1.8
—
5.5
V
IQ
—
140
170
µA
IO = 0
VDD = 0V to 5.5V
tstart
Crosstalk
—
6
—
µs
—
135
—
dB
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND,
VCM = VDD/4, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
GBWP
—
3
—
MHz
Phase Margin
PM
—
65
—
°
G = +1 V/V
Slew Rate
SR
—
3.2
—
V/µs
VDD = 5.5V
ts
—
1.36
—
µs
—
1.63
—
—
0.0015
—
AC Response
Gain Bandwidth Product
Settling Time
Total Harmonic Distortion + Noise
2020-2021 Microchip Technology Inc.
THD+N
To 0.1%, VDD = 5V,
2V step, G = +1
To 0.01%, VDD = 5V,
2V step, G = +1
%
VDD = 5V, Vo = 1 VRMS,
G = +1, f = 1 kHz,
80 kHz measurement BW
DS20006419B-page 3
MCP6476/6R/6U/7/9
AC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND,
VCM = VDD/4, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Noise Voltage
Eni
—
3.8
—
µVP-P
f = 0.1 Hz to 10 Hz
Input Noise Voltage Density
eni
—
17
—
nV/Hz
f = 1 kHz
—
14
—
nV/Hz
f = 10 kHz
f = 1 kHz
Noise
Input Noise Current Density
ini
—
0.6
—
fA/Hz
Electromagnetic Interference
Rejection Ratio
EMIRR
—
48
—
dB
—
70
—
VIN = 100 mVPK, 900 MHz
—
90
—
VIN = 100 mVPK,
1800 MHz
—
93
—
VIN = 100 mVPK,
2400 MHz
—
100
—
VIN = 100 mVPK,
5800 MHz
VIN = 100 mVPK, 400 MHz
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VDD = +1.8V to +5.5V and VSS = GND.
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Temperature Range
TA
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 5-Lead SC70
JA
—
331
—
°C/W
Thermal Resistance, 5-Lead SOT-23
JA
—
221
—
°C/W
Thermal Resistance, 8-Lead MSOP
JA
—
206
—
°C/W
Thermal Resistance, 8-Lead SOIC
JA
—
150
—
°C/W
Thermal Resistance, 14-Lead TSSOP
JA
—
100
—
°C/W
Thermal Resistance, 14-Lead SOIC
JA
—
120
—
°C/W
Conditions
Temperature Ranges
Note 1
Thermal Package Resistances
Note 1:
The internal junction temperature (TJ) must not exceed the absolute maximum specification of +150°C.
DS20006419B-page 4
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
DC Inputs
35
600
1570 Samples
TA = +25°C
25
20
15
VDD = 1.8V
VDD = 5.5V
10
5
Input Offset Voltage (μV)
30
0
Input Offset Voltage (μV)
Input Offset Voltage
25
VDD = 5.5V
VDD = 1.8V
10
5
Input Offset Voltage (μV)
30
15
-200
VCM = VSS
150
100
50
0
VDD = 5.5V
-50
VDD = 1.8V
-100
-150
-200
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Output Voltage (V)
Input Offset Voltage Drift (μV/°C)
Input Offset Voltage Drift
1000
VDD = 1.8V
800
TA = -40°C
600
TA = +25°C
TA = +85°C
400
TA = +125°C
200
0
-200
-400
-600
-800
-1000
-0.4 -0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2
Input Common Mode Voltage (V)
FIGURE 2-3:
Input Offset Voltage vs.
Common-Mode Input Voltage.
2020-2021 Microchip Technology Inc.
FIGURE 2-5:
Output Voltage.
Input Offset Voltage (μV)
FIGURE 2-2:
Histogram.
Input Offset Voltage (μV)
TA = +85°C
TA = +125°C
-400
200
68 Samples
TA = -40°C to +125°C
20
0
FIGURE 2-4:
Input Offset Voltage vs.
Common-Mode Input Voltage.
40
35
TA = -40°C
TA = +25°C
200
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
4
Percentage of Occurances (%)
FIGURE 2-1:
Histogram.
VDD = 5.5V
400
-600
-0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Input Common Mode Voltage (V)
-1600
-1400
-1200
-1000
-800
-600
-400
-200
0
200
400
600
800
1000
1200
1400
1600
Percentage of Occurances (%)
2.1
500
400
300
200
100
0
-100
-200
-300
-400
-500
Input Offset Voltage vs.
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
VCM = VSS
1.5
2.0
2.5
3.0
3.5
4.0
Supply Voltage (V)
4.5
5.0
5.5
FIGURE 2-6:
Input Offset Voltage vs.
Power Supply Voltage.
DS20006419B-page 5
MCP6476/6R/6U/7/9
140
5
4
3
2
1
0
-1
-2
-3
-4
-5
VDD = 5.5V
DC Open-Loop Gain (dB)
Input Bias, Offset Currents
(pA)
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
IOS
IB-
IB+
VDD = 5.5V
130
120
VDD = 1.8V
110
100
90
80
-50
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common Mode Voltage (V)
FIGURE 2-7:
Input Bias, Offset Current
vs. Common-Mode Voltage.
0
25
50
75
Ambient Temperature (°C)
100
125
FIGURE 2-10:
DC Open-Loop Gain vs.
Ambient Temperature.
0.001
1m
400
VDD = 5.5V
0.0001
100μ
300
0.00001
10μ
200
1μ
0.000001
TA = +125°C
-IIN (A)
Input Bias Current (pA)
-25
100
0
TA = +85°C
0.0000001
100n
1E-08
10n
1E-09
1n
-100
TA = +125°C
TA = +85°C
TA = +25°C
TA = -40°C
1E-10
100p
-200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Common Mode Voltage (V)
1E-11
10p
-1
-0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1
VIN (V)
0
FIGURE 2-11:
Measured Input Current vs.
Input Voltage (below VSS).
FIGURE 2-8:
Input Bias Current vs.
Common-Mode Input Voltage.
110
VDD = +5.5V
CMRR, PSRR (dB)
105
100
PSRR
95
90
CMRR (VCM = -0.1V to +5.6V)
85
80
75
70
-50
-25
0
25
50
75
Ambient Temperature (°C)
FIGURE 2-9:
Temperature.
DS20006419B-page 6
100
125
CMRR, PSRR vs. Ambient
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.2
Other DC Voltages and Currents
Output Short-Circuit Current
(mA)
Quiescent Current (μA)
160
150
140
VDD = +5.5V
130
VDD = +1.8V
120
110
Per Amplifier
100
-50
-25
0
25
50
75
Ambient Temperature (°C)
100
TA = -40°C
TA = +25°C
TA = +85°C
TA = +125°C
Per Amplifier
Output Voltage Headroom
(mV)
Quiescent Current (μA)
1
1.5 2 2.5 3 3.5 4 4.5
Power Supply Voltage (V)
5
5.5
400
350
300
250
200
VOL - VSS
150
VDD - VOH
100
50
VDD = 1.8V
0
FIGURE 2-13:
Quiescent Current vs.
Power Supply Voltage.
0.0
1.0
2.0
3.0
Output Current Magnitude (mA)
4.0
FIGURE 2-16:
Output Voltage Headroom
vs. Output Current.
300
VDD = 1.8V
VDD = 5.5V
Per Amplifier
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Common Mode Input Voltage (V)
FIGURE 2-14:
Quiescent Current vs.
Common-Mode Input Voltage.
2020-2021 Microchip Technology Inc.
Output Voltage Headroom
(mV)
Quiescent Current (μA)
0.5
FIGURE 2-15:
Output Short-Circuit Current
vs. Power Supply Voltage.
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Supply Voltage (V)
200
180
160
140
120
100
80
60
40
20
0
+125°C
+85°C
+25°C
-40°C
0
125
FIGURE 2-12:
Quiescent Current vs.
Ambient Temperature.
200
180
160
140
120
100
80
60
40
20
0
50
40
30
20
10
0
-10
-20
-30
-40
-50
250
200
VDD - VOH
150
VOL - VSS
100
50
VDD = 5.5V
0
0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0
Output Current Magnitude (mA)
FIGURE 2-17:
Output Voltage Headroom
vs. Output Current.
DS20006419B-page 7
MCP6476/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Frequency Response
120
Gain Bandwidth Product
(MHz)
CMRR, PSRR (dB)
100
CMRR
80
60
40
PSRR+
R
20
100
1k
Open-Loop Gain (dB)
FIGURE 2-18:
Frequency.
1E+4
1E+5
10k
100k
Frequency (Hz)
1E+6
225
120
180
100
135
90
60
45
40
0
Gain
20
0
80
2.0
60
Phase Margin
1.5
40
1.0
20
VDD = 1.8V
-50
-25
0
0
25
50
75
100
Ambient Temperature (°C)
125
-45
10000
1000
100
10
GN:
101 V/V
11 V/V
1 V/V
1
0.1
-90
VDD = 5.5V
0.01
-20
-135
0.1 1.E+01.E+11.E+21.E+31.E+41.E+51.E+61.E+7
1
10 100 1k 10k 100k 1M 10M
1.E-1
Frequency (Hz)
FIGURE 2-19:
Frequency.
160
4.0
140
3.0
100
2.5
80
2.0
60
Phase Margin
1.5
40
1.0
0.5
20
VDD = 5.5V
-50
-25
0
25
50
75
100
Ambient Temperature (°C)
0
125
FIGURE 2-20:
Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature.
DS20006419B-page 8
10k
1E+05
1E+06
100k
1M
1E+07
10M
120
100
EMIRR (dB)
120
1E+04
1k
FIGURE 2-22:
Closed Loop Output
Impedance vs. Frequency.
Gain Bandwidth Product
3.5
1E+03
Frequency (Hz)
Open-Loop Gain, Phase vs.
4.5
1E+02
100
Phase Margin (°)
Gain Bandwidth Product
(MHz)
100
2.5
FIGURE 2-21:
Gain Bandwidth Product,
Phase Margin vs. Ambient Temperature.
140
Phase
120
3.0
10M
1M
CMRR, PSRR vs.
80
Gain Bandwidth Product
3.5
1E+7
Closed Loop Output
Impedance (Ω)
1E+3
Open-Loop Phase (°)
1E+2
140
4.0
0.5
PSRR0
160
4.5
Representative Part
Phase Margin (°)
2.3
80
60
40
20
0
VIN = 100 mVPK
VDD = 5.5V
10
10M
FIGURE 2-23:
100
1000
100M
1G
Frequency (Hz)
10000
10G
EMIRR vs. Frequency.
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
10
Output Voltage Swing (VP-P)
120
EMIRR (dB)
100
80
60
40
EMIRR @ 2400 MHz
EMIRR @ 1800 MHz
EMIRR @ 900 MHz
EMIRR @ 400 MHz
20
0
0.01
0.1
RF Input Peak Voltage (VPK)
VDD = 5.5V
1
0.1
1
1E+3
1k
FIGURE 2-24:
EMIRR vs. RF Input
Peak-to-Peak Voltage.
1E+4
10k
1E+5
100k
Frequency (Hz)
1E+6
1M
1E+7
10M
FIGURE 2-26:
Maximum Output Voltage
Swing vs. Frequency.
Channel Separation (dB)
0
-20
-40
-60
-80
-100
-120
-140
1E+3
1k
FIGURE 2-25:
Frequency.
1E+4
10k
1E+5
100k
Frequency (Hz)
1E+6
1M
1E+7
10M
Channel Separation vs.
2020-2021 Microchip Technology Inc.
DS20006419B-page 9
MCP6476/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
Input Noise
30
-50
25
-60
VDD = 5.5V
VCM = 2.5V
G=1
BW = 80 kHz
VOUT = 0.5VRMS
VDD = 1.8V
THD + N (dB)
Input Noise Voltage Density
(nV/√Hz)
2.4
20
15
10
VDD = 5.5V
5
-70
-80
RL = 2 kΩ
-90
-100
RL = 10 kΩ
f = 10 kHz
0
-110
0
0.5
1 1.5 2 2.5 3 3.5 4 4.5
Common Mode Input Voltage (V)
5
5.5
100
1000
1k
10000
10k
Frequency (Hz)
FIGURE 2-27:
Input Noise Voltage Density
vs. Common-Mode Voltage.
FIGURE 2-30:
THD + N vs. Frequency.
VDD = 5.5V
VCM = 2.5V
G=1
BW = 80 kHz
f = 1 kHz
-10
1000
1μ
THD + N (dB)
Input Noise Voltage Density
(V/√Hz)
10000
10μ
100
100n
10
10n
1
1n
0.1
1.E-1
-30
-50
-70
-90
1
1.E+0
10
100
1k
1.E+1
1.E+2
1.E+3
Frequency (Hz)
10k
1.E+4
100k
1.E+5
FIGURE 2-28:
vs. Frequency.
Input Noise Voltage Density
FIGURE 2-29:
Noise.
0.1 Hz to 10 Hz Voltage
DS20006419B-page 10
-110
0.001
FIGURE 2-31:
G = -1, RL = 2 kΩ
G = +1, RL = 2 kΩ
G = -1, RL = 10 kΩ
G = +1, RL = 10 kΩ
0.01
0.1
Amplitude (VRMS)
1
THD + N vs. Amplitude.
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
2.5
Time Response
4.0
5
Slew Rate (V/μs)
Input, Output Voltages (V)
Rising Edge, VDD =5.5V
3.5
3.0
Falling Edge, VDD =5.5V
2.5
2.0
Falling Edge, VDD =1.8V
1.5
1.0
0.5
Rising Edge, VDD =1.8V
0.0
-50
-25
0
25
50
75
Ambient Temperature (°C)
FIGURE 2-32:
Temperature.
100
125
Slew Rate vs. Ambient
4
VIN
VOUT
3
2
VDD = 5.5V
G = +1 V/V
1
0
-1
Time (1 μs/div)
FIGURE 2-35:
Pulse Response.
Large Signal Noninverting
5
VOUT
VDD = 5.5V
G = +1 V/V
Input, Output Voltages (V)
Input, Output Voltages
(20 mV/Step)
VIN
Small Signal Noninverting
3
VDD = 5.5V
G = -1 V/V
2
1
VIN
0
-1
Time (10 μs/div)
FIGURE 2-33:
Pulse Response.
VOUT
4
Time (10 μs/div)
FIGURE 2-36:
Response.
Large Signal Inverting Pulse
7
VDD = 5.5V
G = -1 V/V
VOUT
Time (10 μs/div)
FIGURE 2-34:
Response.
Small Signal Inverting Pulse
2020-2021 Microchip Technology Inc.
Input, Output Voltages (V)
Input, Output Voltages
(20 mV/Step)
VIN
VIN
6
VDD = 5.5V
G = +1 V/V
5
VOUT
4
3
2
1
0
-1
Time (0.1 ms/div)
FIGURE 2-37:
The MCP6476/6R/6U/7/9
Device Shows No Phase Reversal.
DS20006419B-page 11
MCP6476/6R/6U/7/9
Note: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/4, VOUT = VDD/2,
VL = VDD/2, RL = 10 k to VL and CL = 30 pF.
5
4
VDD = 5.5V
No Bypass Capacitors
VIN = 100mVPP
3
2
1
VOUT
0
tstart
FIGURE 2-38:
DS20006419B-page 12
Overshoot (%)
Input, Output Voltages (V)
6
100
90
80
70
60
50
40
30
20
10
0
Overshoot (+)
O
Overshoot (-)
0
200
Time (5 μs/div)
Start-up Time.
VIN = 100mV
G = +1 V/V
FIGURE 2-39:
Load.
400
600
Capacitive Load (pF)
800
1000
Overshoot vs. Capacitive
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
3.0
PIN DESCRIPTIONS
Descriptions of the pins are listed in Table 3-1, Table 3-2 and Table 3-3.
TABLE 3-1:
PIN FUNCTION TABLE – SINGLES
MCP6476
MCP6476R
MCP6476U
5-Lead SC70, SOT-23
5-Lead SOT-23
5-Lead SC70, SOT-23
1
1
4
VOUT
2
5
2
VSS
3
3
1
VIN+
Noninverting Input
4
4
3
VIN-
Inverting Input
5
2
5
VDD
Positive Power Supply
TABLE 3-2:
Symbol
Description
Analog Output
Negative Power Supply
PIN FUNCTION TABLE – DUALS
MCP6477
8-Lead MSOP, SOIC
Symbol
Description
1
VOUTA
Analog Output; Op Amp A
2
VINA-
Inverting Input; Op Amp A
3
VINA+
4
VSS
5
VINB+
Noninverting Input; Op Amp B
6
VINB-
Inverting Input; Op Amp B
7
VOUTB
Analog Output; Op Amp B
8
VDD
TABLE 3-3:
Noninverting Input; Op Amp A
Negative Power Supply
Positive Power Supply
PIN FUNCTION TABLE – QUADS
MCP6479
14-Lead TSSOP, SOIC
Symbol
Description
VOUTA
Analog Output; Op Amp A
2
VINA-
Inverting Input; Op Amp A
3
VINA+
Noninverting Input; Op Amp A
1
4
VDD
5
VINB+
Noninverting Input; Op Amp B
6
VINB-
Inverting Input; Op Amp B
7
VOUTB
Analog Output; Op Amp B
8
VOUTC
Analog Output; Op Amp C
9
VINC-
Inverting Input; Op Amp C
10
VINC+
11
VSS
12
VIND+
Noninverting Input; Op Amp D
13
VIND-
Inverting Input; Op Amp D
14
VOUTD
Analog Output; Op Amp D
2020-2021 Microchip Technology Inc.
Positive Power Supply
Noninverting Input; Op Amp C
Negative Power Supply
DS20006419B-page 13
MCP6476/6R/6U/7/9
3.1
Analog Outputs
The analog output pins (VOUTx) are low-impedance
voltage sources.
3.2
Analog Inputs
The noninverting and inverting inputs (VINx+, VINx-) are
high-impedance CMOS inputs with low bias currents.
DS20006419B-page 14
3.3
Power Supply Pins (VSS, VDD)
The positive power supply (VDD) is 1.8V to 5.5V higher
than the negative power supply (VSS). For normal
operation, the other pins are at voltages between VSS
and VDD.
Typically, these parts are used in a single (positive)
supply configuration. In this case, VSS is connected to
ground and VDD is connected to the supply. VDD needs
bypass capacitors.
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
4.0
APPLICATION INFORMATION
4.1.3
INPUT CURRENT LIMITS
The MCP6476/6R/6U/7/9 operational amplifier is unity
gain stable and suitable for a wide range of general
purpose applications.
In order to prevent damage and/or improper operation
of the amplifier, the circuit must limit the currents into
the input pins (see Section 1.1 “Absolute Maximum
Ratings†”).
4.1
Figure 4-2 shows one approach to protecting these
inputs. The resistors, R1 and R2, limit the possible
currents in or out of the input pins through the ESD
diodes to either VDD or VSS.
4.1.1
Rail-to-Rail Input
PHASE REVERSAL
The MCP6476/6R/6U/7/9 op amp is designed to
prevent phase reversal when the input pins exceed the
supply voltages. Figure 2-37 shows the input voltage
exceeding the supply voltage with no phase reversal.
4.1.2
VDD
INPUT VOLTAGE LIMITS
In order to prevent damage and/or improper operation
of the amplifier, the circuit must limit the voltages at the
input pins (see Section 1.1 “Absolute Maximum
Ratings†”).
The Electrostatic Discharge (ESD) protection on the
inputs can be depicted as shown in Figure 4-1. This
structure was chosen to protect the input transistors
against many, but not all, overvoltage conditions, and
to minimize the Input Bias (IB) current.
–
VOUT
R1
MCP6476
V2
R2
min(R1,R2) >
VSS – min(V1, V2)
5 mA
min(R1,R2) >
max(V1,V2) – VDD
5 mA
FIGURE 4-2:
VDD
-IN
V1
Protecting the Analog Inputs.
VDD
OUT
+IN
+
VSS
VSS
FIGURE 4-1:
Structures.
Simplified Analog Input ESD
The input ESD diodes clamp the inputs when they try
to go more than one diode drop below VSS. They also
clamp any voltages that go well above VDD; their
breakdown voltage is high enough to allow normal
operation. At 0.5V above VDD or below VSS, the input
currents are typically less than 5 mA. Very fast ESD
events that meet the specification are limited so that
damage does not occur.
2020-2021 Microchip Technology Inc.
DS20006419B-page 15
MCP6476/6R/6U/7/9
4.1.4
NORMAL OPERATION
The input stage of the MCP6476/6R/6U/7/9 op amp
uses two differential input stages in parallel. One operates at a low Common-Mode Input Voltage (VCM), while
the other operates at a high VCM. With this topology,
the device operates with a VCM up to 300 mV above
VDD and 300 mV below VSS. The input offset voltage is
measured at VCM = VSS – 0.3V and VDD + 0.3V to
ensure proper operation.
A
The transition between the input stages occurs when
VCM is near VDD – 0.9V (see Figures 2-3 and 2-4). For
the best distortion performance and gain linearity, with
noninverting gains, avoid this region of operation.
B
FIGURE 4-4:
4.2
Rail-to-Rail Output
The output voltage range of the MCP6476/6R/6U/7/9
op amp is 0.006V (typical) and 5.494V (typical) when
RL = 10 k is connected to VDD/2 and VDD = 5.5V.
Refer to Figures 2-16 and 2-17 for more information.
4.3
Start-up
The MCP6476/6R/6U/7/9 family of parts quickly controls the output when power (VDD) is initially applied to
the device (start-up). Bypass capacitors are removed
during the start-up testing to minimize inrush currents
(see Figure 4-3). When the op amp is controlled and is
off, the output impedance is high and VOUT will be VL or
1V. When the op amp turns on, the output becomes
low-impedance and VOUT will follow the input sine
wave; this is used as the start-up time.
5.5V
0
VDD
+
-
Capacitive Loads
Driving large capacitive loads can cause stability
problems for voltage feedback op amps. As the load
capacitance increases, the feedback loop’s phase
margin decreases and the closed-loop bandwidth is
reduced. This produces gain peaking in the frequency
response, with overshoot and ringing in the step
response. While a unity gain buffer (G = +1 V/V) is the
most sensitive to the capacitive loads, all gains show
the same general behavior.
When driving large capacitive loads with the
MCP6476/6R/6U/7/9 op amp, a small series resistor at
the output (RISO in Figure 4-5) improves the feedback
loop’s phase margin (stability) by making the output
load resistive at higher frequencies. The bandwidth is
generally lower than the bandwidth with no capacitance
load.
–
VDD
VOUT
VSS
RL
VL = 1V
FIGURE 4-3:
4.4
Start-up Time Voltages.
VIN
RISO
MCP6476
+
VOUT
CL
FIGURE 4-5:
Output Resistor, RISO,
Stabilizes Large Capacitive Loads.
Start-up Test Circuit.
Figure 4-4 shows the input voltage (blue line) for the
MCP6477 and the output voltage (black line). When
power is first applied to the MCP6477, the output is
turned off (Point A) and driven by the load. After 6 µs,
the output is turned on (Point B) and VOUT follows the
input sine wave.
DS20006419B-page 16
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
4.5
Supply Bypass
4.7
The MCP6476/6R/6U/7/9 op amp’s power supply pin
(VDD for single-supply) should have a local bypass
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good
high-frequency performance. It can use a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large,
slow currents. This bulk capacitor can be shared with
other analog parts.
4.6
PCB Surface Leakage
In applications where low input bias current is critical,
Printed Circuit Board (PCB) surface leakage effects
need to be considered. Surface leakage is caused by
humidity, dust or other contamination on the board.
Under low humidity conditions, a typical resistance
between nearby traces is 1012. A 5V difference would
cause 5 pA of current to flow, which is greater than the
MCP6476/6R/6U/7/9’s bias current at +25°C (±1 pA,
typical).
The easiest way to reduce surface leakage is to use a
guard ring around sensitive pins (or traces). The guard
ring is biased at the same voltage as the sensitive pin.
An example of this type of layout is shown in
Figure 4-6.
An unused op amp in a dual (MCP6477) or quad
(MCP6479) package should be configured as shown in
Figure 4-7. These circuits prevent the output from
toggling and causing crosstalk. Circuit A sets the
op amp at its minimum noise gain. The resistor divider
produces any desired reference voltage within the output voltage range of the op amp; the op amp buffers
that reference voltage. Circuit B uses the minimum
number of components.
VDD
VIN-
VIN+
VSS
¼ MCP6479 (A)
¼ MCP6479 (B)
VDD
R1
VDD
VREF
R2
V
REF
= V
DD
R2
R +R
1
FIGURE 4-7:
4.8
Guard Ring
Unused Op Amps
2
Unused Op Amps.
Electromagnetic Interference
Rejection Ratio (EMIRR)
Definitions
The Electromagnetic Interference (EMI) is the
disturbance that affects an electrical circuit due to
either electromagnetic induction or electromagnetic
radiation emitted from an external source.
FIGURE 4-6:
for Inverting Gain.
1.
2.
Example Guard Ring Layout
Noninverting Gain and Unity Gain Buffer:
a) Connect the noninverting pin (VIN+) to the
input with a wire that does not touch the
PCB surface.
b) Connect the guard ring to the inverting input
pin (VIN-). This biases the guard ring to the
Common-mode input voltage.
Inverting gain and transimpedance gain
amplifiers (convert current to voltage, such as
photo detectors):
a) Connect the guard ring to the noninverting
input pin (VIN+). This biases the guard ring
to the same reference voltage as the
op amp (e.g., VDD/2 or ground).
b) Connect the inverting pin (VIN-) to the input
with a wire that does not touch the PCB
surface.
2020-2021 Microchip Technology Inc.
The parameter which describes the EMI robustness of
an op amp is the Electromagnetic Interference Rejection Ratio (EMIRR). It quantitatively describes the
effect that an RF interfering signal has on op amp performance. Internal passive filters make EMIRR better
compared with older parts. This means that with good
PCB layout techniques, your EMC performance should
be better.
EMIRR is defined as:
EQUATION 4-1:
Where:
V RF
EMIRR dB = 20 log -------------
V OS
VRF = Peak Amplitude of RF Interfering
Signal (VPK)
VOS = Input Offset Voltage Shift (V)
DS20006419B-page 17
MCP6476/6R/6U/7/9
4.9
Application Circuits
4.9.1
4.9.2
CARBON MONOXIDE GAS SENSOR
A Carbon Monoxide (CO) gas detector is a device that
detects the presence of carbon monoxide gas. Usually
this is battery powered and transmits audible and
visible warnings.
The sensor responds to CO gas by reducing its resistance proportionaly to the amount of CO present in the
air exposed to the internal element. On the sensor
module, this variable is part of a voltage divider formed
by the internal element and potentiometer R1. The output of this voltage divider is fed into the noninverting
inputs of the MCP6476 op amp. The device is configured as a buffer with unity gain and is used to provide
a nonloaded test point for sensor sensitivity.
Because this sensor can be corrupted by parasitic
electromagnetic signals, the MCP6476 op amp can be
used for conditioning this sensor.
In Figure 4-8, the variable resistor is used to calibrate
the sensor in different environments.
PRESSURE SENSOR AMPLIFIER
The MCP6476/6R/6U/7/9 is well-suited for conditioning sensor signals in battery-powered applications.
Many sensors are configured as Wheatstone bridges.
Strain gauges and pressure sensors are two common
examples.
Figure 4-9 shows a strain gauge amplifier, using the
MCP6476/6R/6U/7/9 Enhanced EMI protection device.
The difference amplifier with EMI robustness op amp is
used to amplify the signal from the Wheatstone bridge.
The two op amps, configured as buffers and connected
at the outputs of pressure sensors, prevents resistive
loading of the bridge by resistors, R1 and R2. Resistors,
R1, R2 and R3, R5, need to be chosen with very low
tolerance to match the CMRR.
VDD
R+∆R
VDD
R-∆R
½ MCP6477
Vb
-
Va
VDD
+
R-∆R
R+∆R
-
R4
+
10 kΩ
10k
V OUT = V a – V b ------------100
Strain Gauge
FIGURE 4-9:
DS20006419B-page 18
MCP6476
R2
100:
½ MCP6477
VOUT
MCP6476
R1
FIGURE 4-8:
VOUT
+
VDD
VDD
VDD
R1
100:
+
.
VREF
R3
10 k:
Pressure Sensor Amplifier.
CO Gas Sensor Circuit.
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
5.0
DESIGN AIDS
Microchip provides the basic design tools needed for
the MCP6476/6R/6U/7/9 op amp.
5.1
Microchip Advanced Part Selector
(MAPS)
MAPS is a software tool that helps semiconductor
professionals efficiently identify the Microchip
devices that fit a particular design requirement.
Available at no cost from the Microchip website at
www.microchip.com/maps, MAPS is an overall
selection tool for Microchip’s product portfolio that
includes Analog, Memory, MCUs and DSCs. Using this
tool, you can define a filter to sort features for a
parametric search of devices and export side-by-side
technical comparison reports. Helpful links are also
provided for data sheets, purchase and sampling of
Microchip parts.
5.2
Analog Demonstration and
Evaluation Boards
Microchip offers a broad spectrum of Analog
Demonstration and Evaluation Boards that are designed
to help you achieve faster time to market. For a complete
listing of these boards and their corresponding user’s
guides and technical information, visit the Microchip
website at www.microchipdirect.com.
Some boards that are especially useful are:
• MCP6XXX Amplifier Evaluation Board 2
(P/N DS51668)
• MCP6XXX Amplifier Evaluation Board 3
(P/N DS51673)
• 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
(P/N SOIC8EV)
• 5/6-Pin SOT-23 Evaluation Board
(P/N VSUPEV2)
• 14-Pin SOIC/TSSOP/DIP Evaluation Board
(P/N SOIC14EV)
2020-2021 Microchip Technology Inc.
5.3
Application Notes
The following Microchip Analog Design Notes and
Application Notes are available on the Microchip
website at www.microchip.com/appnotes, and are
recommended as supplemental reference resources:
• ADN003 – “Select the Right Operational Amplifier
for your Filtering Circuits”, Microchip Technology
Inc. (DS21821)
• AN722 – “Operational Amplifier Topologies and
DC Specifications”, Microchip Technology Inc.
(DS00722)
• AN723 – “Operational Amplifier AC Specifications
and Applications”, Microchip Technology Inc.
(DS00723)
• AN884 – “Driving Capacitive Loads With
Op Amps”, Microchip Technology Inc. (DS00884)
• AN990 – “Analog Sensor Conditioning
Circuits – An Overview”, Microchip Technology
Inc. (DS00990)
• AN1177 – “Op Amp Precision Design: DC Errors”,
Microchip Technology Inc. (DS01177)
• AN1228 – “Op Amp Precision Design: Random
Noise”, Microchip Technology Inc. (DS01228)
• AN1258 – “Op Amp Precision Design: PCB
Layout Techniques”, Microchip Technology Inc.
(DS01258).
These application notes and others are listed in the
design guide:
• “Signal Chain Design Guide”, Microchip
Technology inc. (DS21825).
DS20006419B-page 19
MCP6476/6R/6U/7/9
NOTES:
DS20006419B-page 20
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
5-Lead SC70 (MCP6476/6U)
XXNN
Example
Device
Marking
MCP6476
GCNN
MCP6476U
GGNN
5-Lead SOT-23 (MCP6476/6R/6U)
XXXXY
WWNNN
Device
GC25
Example
Marking
MCP6476
AAB3
MCP6476U
AAB4
MCP6476R
AAB5
AAB30
31256
Note: Applies to 5-Lead SOT-23.
8-Lead SOIC (MCP6477)
8-Lead SOIC (MCP6477)
XXXXXXXX
MCP6477
NNN
256
XXXXYYWW
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
SN e3 2031
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2020-2021 Microchip Technology Inc.
DS20006419B-page 21
MCP6476/6R/6U/7/9
Package Marking Information (Continued)
8-Lead MSOP (MCP6477)
XXXXXX
YWWNNN
14-Lead SOIC (MCP6479)
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
14-Lead TSSOP (MCP6479)
XXXXXXXX
YYWW
NNN
DS20006419B-page 22
Example
6477E
031256
Example
MCP6479
E/SL e3
2031256
Example
MCP6479E
3124
256
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
e
e
3
B
1
E1
E
2X
0.15 C
4
N
5X TIPS
0.30 C
NOTE 1
2X
0.15 C
5X b
0.10
C A B
TOP VIEW
C
c
A2
A
SEATING
PLANE
A1
L
SIDE VIEW
END VIEW
Microchip Technology Drawing C04-061-LT Rev E Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006419B-page 23
MCP6476/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Standoff
A1
A2
Molded Package Thickness
Overall Length
D
Overall Width
E
Molded Package Width
E1
b
Terminal Width
Terminal Length
L
c
Lead Thickness
MIN
0.80
0.00
0.80
0.15
0.10
0.08
MILLIMETERS
NOM
5
0.65 BSC
2.00 BSC
2.10 BSC
1.25 BSC
0.20
-
MAX
1.10
0.10
1.00
0.40
0.46
0.26
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-061-LT Rev E Sheet 2 of 2
DS20006419B-page 24
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
E
Gx
SILK SCREEN
3
2
1
C
G
4
5
Y
X
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width
X
Contact Pad Length
Y
Distance Between Pads
G
Distance Between Pads
Gx
MIN
MILLIMETERS
NOM
0.65 BSC
2.20
MAX
0.45
0.95
1.25
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2061-LT Rev E
2020-2021 Microchip Technology Inc.
DS20006419B-page 25
MCP6476/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
0.20 C 2X
D
e1
A
D
N
E/2
E1/2
E1
E
(DATUM D)
(DATUM A-B)
0.15 C D
2X
NOTE 1
1
2
e
B
NX b
0.20
C A-B D
TOP VIEW
A
A A2
0.20 C
SEATING PLANE
A
SEE SHEET 2
A1
C
SIDE VIEW
Microchip Technology Drawing C04-091-OT Rev F Sheet 1 of 2
DS20006419B-page 26
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
c
T
L
L1
VIEW A-A
SHEET 1
Units
Dimension Limits
N
Number of Pins
e
Pitch
e1
Outside lead pitch
A
Overall Height
A2
Molded Package Thickness
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Footprint
L1
I
Foot Angle
c
Lead Thickness
b
Lead Width
MIN
0.90
0.89
-
0.30
0°
0.08
0.20
MILLIMETERS
NOM
5
0.95 BSC
1.90 BSC
2.80 BSC
1.60 BSC
2.90 BSC
0.60 REF
-
MAX
1.45
1.30
0.15
0.60
10°
0.26
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006419B-page 27
MCP6476/6R/6U/7/9
5-Lead Plastic Small Outline Transistor (OT) [SOT23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X
SILK SCREEN
5
Y
Z
C
G
1
2
E
GX
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
C
Contact Pad Spacing
X
Contact Pad Width (X5)
Contact Pad Length (X5)
Y
Distance Between Pads
G
Distance Between Pads
GX
Overall Width
Z
MIN
MILLIMETERS
NOM
0.95 BSC
2.80
MAX
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2091-OT Rev F
DS20006419B-page 28
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
2X
0.10 C A–B
2X
0.10 C A–B
NOTE 1
2
1
e
B
NX b
0.25
C A–B D
NOTE 5
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
SEE VIEW C
VIEW A–A
0.23
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006419B-page 29
MCP6476/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
L1
Footprint
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev F Sheet 2 of 2
DS20006419B-page 30
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SN Rev F
2020-2021 Microchip Technology Inc.
DS20006419B-page 31
MCP6476/6R/6U/7/9
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006419B-page 32
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2020-2021 Microchip Technology Inc.
DS20006419B-page 33
MCP6476/6R/6U/7/9
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20006419B-page 34
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
NOTE 5
D
N
E
2
E2
2
E1
E
2X
0.10 C D
NOTE 1
1
2
2X N/2 TIPS
0.20 C
3
e
NX b
B
0.25
NOTE 5
C A–B D
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
14X
h
0.10 C
SIDE VIEW
A1
h
R0.13
H
R0.13
c
SEE VIEW C
L
VIEW A–A
(L1)
VIEW C
Microchip Technology Drawing No. C04-065-SL Rev D Sheet 1 of 2
2020-2021 Microchip Technology Inc.
DS20006419B-page 35
MCP6476/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Lead Angle
Foot Angle
c
Lead Thickness
Lead Width
b
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0°
0.10
0.31
5°
5°
MILLIMETERS
NOM
14
1.27 BSC
6.00 BSC
3.90 BSC
8.65 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimension D does not include mold flash, protrusions or gate burrs, which shall
not exceed 0.15 mm per end. Dimension E1 does not include interlead flash
or protrusion, which shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-065-SL Rev D Sheet 2 of 2
DS20006419B-page 36
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
14
SILK SCREEN
C
Y
1
2
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X14)
X
Contact Pad Length (X14)
Y
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2065-SL Rev D
2020-2021 Microchip Technology Inc.
DS20006419B-page 37
MCP6476/6R/6U/7/9
14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
E
2
E1
2
E1
E
1
2X 7 TIPS
0.20 C B A
2
e
TOP VIEW
A
C
A2 A
SEATING
PLANE
14X
0.10 C
14X b
0.10
A1
A
C B A
SIDE VIEW
SEE DETAIL B
VIEW A–A
Microchip Technology Drawing C04-087 Rev D Sheet 1 of 2
DS20006419B-page 38
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(ș2)
R1
H
R2
c
L
ș1
(L1)
(ș3)
DETAIL B
Number of Terminals
Pitch
Overall Height
Standoff
Molded Package Thickness
Overall Length
Overall Width
Molded Package Width
Terminal Width
Terminal Thickness
Terminal Length
Footprint
Lead Bend Radius
Lead Bend Radius
Foot Angle
Mold Draft Angle
Mold Draft Angle
Notes:
Units
Dimension Limits
N
e
A
A1
A2
D
E
E1
b
c
L
L1
R1
R2
ș1
ș2
ș3
MIN
–
0.05
0.80
4.90
4.30
0.19
0.09
0.45
0.09
0.09
0°
–
–
MILLIMETERS
NOM
14
0.65 BSC
–
–
1.00
5.00
6.40 BSC
4.40
–
–
0.60
1.00 REF
–
–
–
12° REF
12° REF
MAX
1.20
0.15
1.05
5.10
4.50
0.30
0.20
0.75
–
–
8°
–
–
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-087 Rev D Sheet 2 of 2
2020-2021 Microchip Technology Inc.
DS20006419B-page 39
MCP6476/6R/6U/7/9
14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
G
SILK SCREEN
C
Y
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C
Contact Pad Width (Xnn)
X
Contact Pad Length (Xnn)
Y
Contact Pad to Contact Pad (Xnn)
G
MIN
MILLIMETERS
NOM
0.65 BSC
5.90
MAX
0.45
1.45
0.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2087 Rev D
DS20006419B-page 40
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
APPENDIX A:
REVISION HISTORY
Revision B (June 2021)
Below is a list of changes:
• Updated Figure 4-2.
• Updated Section 6.0, Packaging Information.
• Updated the Product Identification System to
include Automotive models.
• Minor corrections and editorial changes.
Revision A (September 2020)
• Original release of this document.
2020-2021 Microchip Technology Inc.
DS20006419B-page 41
MCP6476/6R/6U/7/9
NOTES:
DS20006419B-page 42
2020-2021 Microchip Technology Inc.
MCP6476/6R/6U/7/9
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device
Device:
-X
/XX
XXX(2)
Temperature
Range
Package
Class
[X](1)
PART NO.
Tape and Reel
Option
MCP6476T
Single Op Amp (Tape and Reel) (SC70, SOT-23)
MCP6476RT
Single Op Amp (Tape and Reel) (SOT-23)
MCP6476UT
Single Op Amp (Tape and Reel) (SC70, SOT-23)
MCP6477
Dual Op Amp
MCP6477T
Dual Op Amp (Tape and Reel for SOIC, MSOP)
MCP6479
Quad Op Amp
MCP6479T
Quad Op Amp (Tape and Reel for SOIC, TSSOP)
Temperature Range:
E
=
-40°C to +125°C
Examples:
a) MCP6476T-E/LT:
Tape and Reel,
Extended Temperature,
5-Lead SC-70 Package.
b) MCP6476T-E/OT: Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
c) MCP6476RT-E/OT: Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
d) MCP6476UT-E/LT: Tape and Reel,
Extended Temperature,
5-Lead SC-70 Package.
e) MCP6476UT-E/OT: Tape and Reel,
Extended Temperature,
5-Lead SOT-23 Package.
a) MCP6477-E/SN:
Package:
Class
LT
=
Plastic Package (SC70), 5-Lead (MCP6476
only)
b) MCP6477-E/MS:
OT
=
Plastic Small Outline Transistor (SOT-23),
5-Lead (MCP6476 only)
c) MCP6477T-E/SN:
SN
=
Plastic Small Outline (3.90 mm), 8-Lead
(MCP6477 only)
MS
=
Plastic MSOP, 8-Lead (MCP6477 only)
ST
=
Plastic Thin Shrink Small Outline (4.4 mm),
14-Lead (MCP6479 only)
SL
=
Plastic Small Outline, (3.90 mm),
14-Lead (MCP6479 only)
(Blank)
=
Non-Automotive
VAO
=
Automotive
d) MCP6477T-E/MS:
a) MCP6479-E/ST:
b) MCP6479-E/SL:
c) MCP6479T-E/ST:
d) MCP6479T-E/SL:
Note 1:
2:
Extended Temperature,
8-Lead SOIC Package.
Extended Temperature,
8-Lead MSOP Package.
Tape and Reel,
Extended Temperature,
8-Lead SOIC Package.
Tape and Reel,
Extended Temperature,
8-Lead MSOP Package.
Extended Temperature,
14-Lead TSSOP Package.
Extended Temperature,
14-Lead SOIC Package.
Tape and Reel,
Extended Temperature,
14-Lead TSSOP Package.
Tape and Reel,
Extended Temperature,
14-Lead SOIC Package.
The Tape and Reel identifier only appears in the catalog part
number description. This identifier is used for ordering purposes
and is not printed on the device package. Check with your
Microchip Sales Office for package availability with the Tape and
Reel option.
Automotive parts are AEC-Q100 qualified, Grade 1
2020-2021 Microchip Technology Inc.
DS20006419B-page 43
MCP6476/6R/6U/7/9
PRODUCT IDENTIFICATION SYSTEM (AUTOMOTIVE)
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
[X](1)
PART NO.
Device
Device:
Tape and Reel
Option
Class
Note 1:
2:
/XX
XXX(2)
Temperature Package Class
Range
MCP6476T
Single Op Amp (Tape and Reel) (SC70,
SOT-23)
MCP6476RT
Single Op Amp (Tape and Reel)
(SOT-23)
MCP6476UT
Single Op Amp (Tape and Reel)
(SC70, SOT-23)
MCP6477
Dual Op Amp
MCP6477T
Dual Op Amp
(Tape and Reel for SOIC, MSOP)
MCP6479
Quad Op Amp
MCP6479T
Quad Op Amp
(Tape and Reel for SOIC, TSSOP)
Temperature Range:
Package:
-X
E
=
-40°C to +125°C
LT
= Plastic Package (SC70), 5-Lead
OT
= Plastic Small Outline Transistor
(SOT-23), 5-Lead
SN
= Plastic Small Outline (3.90 mm), 8-Lead
MS
= Plastic MSOP, 8-Lead
ST
= Plastic Thin Shrink Small Outline,
(4.4 mm),14-Lead
SL
= Plastic Small Outline, (3.90 mm),
14-Lead
(Blank)
= Non-Automotive
VAO
= Automotive
The Tape and Reel identifier only appears in the catalog
part number description. This identifier is used for
ordering purposes and is not printed on the device
package. Check with your Microchip Sales Office for
package availability with the Tape and Reel option.
Automotive parts are AEC-Q100 qualified, Grade 1
DS20006419B-page 44
Examples:
a) MCP6476T-E/LTVAO:
Tape and Reel, Automotive,
Extended Temperature,
5-Lead SC70 Package.
b) MCP6476T-E/OTVAO: Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
c) MCP6476RT-E/OTVAO: Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
d) MCP6476UT-E/LTVAO: Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOC70 Package.
e) MCP6476UT-E/OTVAO: Tape and Reel, Automotive,
Extended Temperature,
5-Lead SOT-23 Package.
a) MCP6477-E/SNVAO:
Extended Temperature,
Automotive,
8-Lead SOIC Package.
b) MCP6477-E/MSVAO:
Extended Temperature,
Automotive,
8-Lead MSOP Package.
c) MCP6477T-E/SNVAO: Tape and Reel,
Automotive,
Extended Temperature,
8-Lead SOIC Package.
d) MCP6477T-E/MSVAO: Tape and Reel,
Automotive,
Extended Temperature,
8-Lead MSOP Package.
a) MCP6479-E/STVAO:
Extended Temperature,
Automotive,
14-Lead TSSOP Package.
b) MCP6479-E/SLVAO:
Extended Temperature,
Automotive,
14-Lead SOIC Package.
c) MCP6479T-E/STVAO:
Tape and Reel,
Automotive,
Extended Temperature,
14-Lead TSSOP Package.
d) MCP6479T-E/SLVAO:
Tape and Reel,
Automotive,
Extended Temperature,
14-Lead SOIC Package.
2020-2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip
devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications
contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished
without violating Microchip's intellectual property rights.
•
Microchip is willing to work with any customer who is concerned about the integrity of its code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are
committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection
feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or
other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication is provided for the sole
purpose of designing with and using Microchip products. Information regarding device applications and the like is provided
only for your convenience and may be superseded by updates.
It is your responsibility to ensure that your application meets
with your specifications.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND
WHATSOEVER RELATED TO THE INFORMATION OR ITS
USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and
the buyer agrees to defend, indemnify and hold harmless
Microchip from any and all damages, claims, suits, or expenses
resulting from such use. No licenses are conveyed, implicitly or
otherwise, under any Microchip intellectual property rights
unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020-2021, Microchip Technology Incorporated, All Rights
Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020-2021 Microchip Technology Inc.
ISBN: 978-1-5224-8225-3
DS20006419B-page 45
Worldwide Sales and Service
AMERICAS
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DS20006419B-page 46
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
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2020-2021 Microchip Technology Inc.
02/28/20
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