MCP6V01/2/3
300 µA, Auto-Zeroed Op Amps
Features
Description
• High DC Precision:
- VOS Drift: ±50 nV/°C (maximum)
- VOS: ±2 µV (maximum)
- AOL: 130 dB (minimum)
- PSRR: 130 dB (minimum)
- CMRR: 130 dB (minimum)
- Eni: 2.5 µVP-P (typical), f = 0.1 Hz to 10 Hz
- Eni: 0.79 µVp-p (typical), f = 0.01 Hz to 1 Hz
• Low Power and Supply Voltages:
- IQ: 300 µA/amplifier (typical)
- Wide Supply Voltage Range: 1.8V to 5.5V
• Easy to Use:
- Rail-to-Rail Input/Output
- Gain Bandwidth Product: 1.3 MHz (typical)
- Unity Gain Stable
- Available in Single and Dual
- Single with Chip Select (CS): MCP6V03
• Extended Temperature Range: -40°C to +125°C
The Microchip Technology Inc. MCP6V01/2/3 family of
operational amplifiers has input offset voltage
correction for very low offset and offset drift. These
devices have a wide gain bandwidth product (1.3 MHz,
typical) and strongly reject switching noise. They are
unity gain stable, have no 1/f noise, and have good
PSRR and CMRR. These products operate with a
single supply voltage as low as 1.8V, while drawing
300 µA/amplifier (typical) of quiescent current.
Typical Applications
•
•
•
•
•
Portable Instrumentation
Sensor Conditioning
Temperature Measurement
DC Offset Correction
Medical Instrumentation
Design Aids
•
•
•
•
•
•
SPICE Macro Models
FilterLab® Software
Mindi™ Circuit Designer & Simulator
Microchip Advanced Part Selector (MAPS)
Analog Demonstration and Evaluation Boards
Application Notes
Related Parts
The Microchip Technology Inc. MCP6V01/2/3 op amps
are offered in single (MCP6V01), single with Chip
Select (CS) (MCP6V03), and dual (MCP6V02). They
are designed in an advanced CMOS process.
Package Types (top view)
MCP6V01
SOIC
MCP6V01
2x3 TDFN *
NC 1
8 NC
NC 1
VIN– 2
7 VDD
VIN– 2
VIN+ 3
VSS 4
6 VOUT
5 NC
VIN+ 3
VINA– 2
VINA+ 3
VSS 4
7 VDD
6 VOUT
5 NC
MCP6V02
4x4 DFN *
8 VDD
VOUTA
7 VOUTB V –
INA
6 VINB– V +
INA
5 VINB+
V
SS
MCP6V03
SOIC
EP
9
VSS 4
MCP6V02
SOIC
VOUTA 1
8 NC
8 VDD
1
2
3
EP
9
7 VOUTB
6 VINB–
5 VINB+
4
MCP6V03
2x3 TDFN *
NC 1
NC 1
8 CS
VIN– 2
7 VDD
VIN– 2
VIN+ 3
VSS 4
6 VOUT
5 NC
VIN+ 3
VSS 4
8 CS
EP
9
7 VDD
6 VOUT
5 NC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
• MCP6V06/7/8: Non-spread clock, lower noise
© 2008 Microchip Technology Inc.
DS22058C-page 1
MCP6V01/2/3
Typical Application Circuit
VIN
R1
R2
R2
VDD/2
R3
VOUT
C2
3 kΩ
MCP6XXX
MCP6V01
Offset Voltage Correction for Power Driver
DS22058C-page 2
© 2008 Microchip Technology Inc.
MCP6V01/2/3
1.0
ELECTRICAL CHARACTERISTICS
1.1
Absolute Maximum Ratings †
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification is not
implied. Exposure to maximum rating conditions for extended
periods may affect device reliability.
VDD – VSS .......................................................................6.5V
Current at Input Pins ....................................................±2 mA
Analog Inputs (VIN+ and VIN–) †† ... VSS – 1.0V to VDD+1.0V
All other Inputs and Outputs ............ VSS – 0.3V to VDD+0.3V
Difference Input voltage ...................................... |VDD – VSS|
Output Short Circuit Current ................................ Continuous
Current at Output and Supply Pins ............................±30 mA
Storage Temperature ...................................-65°C to +150°C
Max. Junction Temperature ........................................ +150°C
ESD protection on all pins (HBM, MM) ................≥ 4 kV, 300V
1.2
†† See Section 4.2.1 “Rail-to-Rail Inputs”.
Specifications
TABLE 1-1:
DC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3,
VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL, and CS = GND (refer to Figure 1-5 and Figure 1-6).
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input Offset
Input Offset Voltage
VOS
-2.0
—
+2.0
µV
Input Offset Voltage Drift with Temperature
(linear Temp. Co.)
TC1
-50
—
+50
nV/°C
Input Offset Voltage Quadratic Temp. Co.
TC2
—
±0.1
—
PSRR
130
143
—
Input Bias Current
IB
—
±1
—
pA
Input Bias Current across Temperature
IB
—
60
—
pA
TA = +85°C
IB
—
600
5000
pA
TA = +125°C
IOS
—
-30
—
pA
Power Supply Rejection
TA = +25°C (Note 1)
TA = -40 to +125°C
(Note 1)
nV/°C2 TA = -40 to +125°C
dB
(Note 1)
Input Bias Current and Impedance
Input Offset Current
IOS
—
-50
—
pA
TA = +85°C
IOS
-1000
-75
1000
pA
TA = +125°C
Common Mode Input Impedance
ZCM
—
1013||6
—
Ω||pF
Differential Input Impedance
ZDIFF
—
1013||6
—
Ω||pF
Common-Mode Input Voltage Range
VCMR
VSS − 0.20
—
VDD + 0.20
V
(Note 2)
Common-Mode Rejection
CMRR
130
142
—
dB
VDD = 1.8V,
VCM = -0.2V to 2.0V
(Note 1, Note 2)
CMRR
140
152
—
dB
VDD = 5.5V,
VCM = -0.2V to 5.7V
(Note 1, Note 2)
AOL
130
145
—
dB
VDD = 1.8V,
VOUT = 0.2V to 1.6V (Note 1)
AOL
140
156
—
dB
VDD = 5.5V,
VOUT = 0.2V to 5.3V (Note 1)
Input Offset Current across Temperature
Common Mode
Open-Loop Gain
DC Open-Loop Gain (large signal)
Note 1:
2:
Set by design and characterization. Due to thermal junction and other effects in the production environment, these parts
can only be screened in production (except TC1; see Appendix B: “Offset Related Test Screens”).
Figure 2-18 shows how VCMR changed across temperature for the first three production lots.
© 2008 Microchip Technology Inc.
DS22058C-page 3
MCP6V01/2/3
TABLE 1-1:
DC ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3,
VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL, and CS = GND (refer to Figure 1-5 and Figure 1-6).
Parameters
Sym
Min
Typ
Max
Units
Conditions
VOL, VOH
ISC
VSS + 15
—
VDD − 15
mV
G = +2, 0.5V input overdrive
—
±7
—
mA
VDD = 1.8V
ISC
—
±22
—
mA
VDD = 5.5V
Output
Maximum Output Voltage Swing
Output Short Circuit Current
Power Supply
VDD
1.8
—
5.5
V
IQ
200
300
400
µA
VPOR
1.15
—
1.65
V
Supply Voltage
Quiescent Current per amplifier
POR Trip Voltage
Note 1:
2:
IO = 0
Set by design and characterization. Due to thermal junction and other effects in the production environment, these parts
can only be screened in production (except TC1; see Appendix B: “Offset Related Test Screens”).
Figure 2-18 shows how VCMR changed across temperature for the first three production lots.
TABLE 1-2:
AC ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3,
VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL, CL = 60 pF, and CS = GND (refer to Figure 1-5 and Figure 1-6).
Parameters
Sym
Min
Typ
Max
Units
Conditions
Amplifier AC Response
Gain Bandwidth Product
GBWP
—
1.3
—
MHz
Slew Rate
SR
—
0.5
—
V/µs
Phase Margin
PM
—
65
—
°
Eni
—
0.79
—
µVP-P
f = 0.01 Hz to 1 Hz
Eni
—
2.5
—
µVP-P
f = 0.1 Hz to 10 Hz
eni
—
120
—
nV/√Hz f < 2.5 kHz
eni
—
45
—
nV/√Hz f = 100 kHz
ini
—
0.6
—
fA/√Hz
IMD
—
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© 2008 Microchip Technology Inc.
DS22058C-page 37
MCP6V01/2/3
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DS22058C-page 38
© 2008 Microchip Technology Inc.
MCP6V01/2/3
APPENDIX A:
REVISION HISTORY
Revision C (December 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
Added the 8-lead, 2x3 TDFN package for the
MCP6V01 and MCP6V03 devices.
Corrected the IMD specification in Table 1-2.
Added 8-lead, 2x3 TDFN package information to
Thermal Characteristic table.
Added information on the Exposed Thermal Pad
(EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4
DFN packages.
Added Section 4.3.6 “Stabilizing Output
Loads”
Other minor typographical corrections.
Revision B (June 2008)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
Updated the specifications and their conditions.
Corrected the Timing Diagrams.
Added to the Test Circuits.
Added RISO (see Figure 4-6) to all circuit
diagrams.
Added the Typical Performance Curves.
Corrected
and
expanded
Applications
Information.
Minor edits due to change in production status.
Added Appendix B, Offset Related Test
Screens.
Revision A (September 2007)
• Original Release of this Document.
© 2008 Microchip Technology Inc.
DS22058C-page 41
MCP6V01/2/3
APPENDIX B:
OFFSET RELATED
TEST SCREENS
We use production screens to ensure the quality of our
outgoing products. These screens are set at wider limits to eliminate any fliers; see Table B-1.
Input offset voltage related specifications in the DC
spec table (Table 1-1) are based on bench measurements (see Section 2.1 “DC Input Precision”). These
measurements are much more accurate because:
•
•
•
•
More compact circuit
Soldered parts on the PCB
More time spent averaging (reduces noise)
Better temperature control
- Reduced temperature gradients
- Greater accuracy
TABLE B-1:
OFFSET RELATED TEST SCREENS
Electrical Characteristics: Unless otherwise indicated, TA = 25°C, VDD = +1.8V to +5.5V, VSS = GND, VCM = VDD/3,
VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL, and CS = GND (refer to Figure 1-5 and Figure 1-6).
Parameters
Sym
Min
Max
Units
Conditions
Input Offset Voltage
VOS
-10
+10
Input Offset Voltage Drift with Temperature
(linear Temp. Co.)
TC1
—
—
PSRR
115
—
dB
(Note 1)
CMRR
106
—
dB
VDD = 1.8V, VCM = -0.2V to 2.0V (Note 1)
CMRR
116
—
dB
VDD = 5.5V, VCM = -0.2V to 5.7V (Note 1)
AOL
114
—
dB
VDD = 1.8V, VOUT = 0.2V to 1.6V (Note 1)
AOL
122
—
dB
VDD = 5.5V, VOUT = 0.2V to 5.3V (Note 1)
Input Offset
Power Supply Rejection
µV
TA = +25°C (Note 1, Note 2)
nV/°C TA = -40 to +125°C (Note 3)
Common Mode
Common Mode Rejection
Open-Loop Gain
DC Open-Loop Gain (large signal)
Note 1:
2:
3:
Due to thermal junctions and other errors in the production environment, these specifications are only screened in
production.
VOS is also sample screened at +125°C.
TC1 is not measured in production.
DS22058C-page 42
© 2008 Microchip Technology Inc.
MCP6V01/2/3
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
–X
/XXX
Device
Temperature
Range
Package
Device:
MCP6V01
Single Op Amp
MCP6V01T Single Op Amp
(Tape and Reel for 2x3 TDFN andSOIC)
MCP6V02
Dual Op Amp
MCP6V02T Dual Op Amp
(Tape and Reel for 4×4 DFN and SOIC)
MCP6V03
Single Op Amp with Chip Select
MCP6V03T Single Op Amp with Chip Select
(Tape and Reel for SOIC)
Temperature Range:
E
Package:
MD
Examples:
a)
b)
a)
b)
a)
b)
MCP6V01T-E/SN: Extended temperature,
8LD SOIC package.
MCP6V01-E/MNY:Extended temperature,
8LD 2x3 TDFN package.
MCP6V02-E/MD: Extended temperature,
8LD 4x4 DFN package.
MCP6V02T-E/SN: Tape and Reel,
Extended temperature,
8LD SOIC package.
MCP6V03-E/SN: Extended temperature,
8LD SOIC package.
MCP6V03-E/MNY:Extended temperature,
8LD 2x3 TDFN package.
= -40°C to +125°C
= Plastic Dual Flat, No-Lead (4×4x0.9 mm), 8-lead
(MCP6V02 only)
MNY * = Plastic Dual Flat No Lead (2x3x0.75 mm), 8-lead
(MCP6V01, MCP6V03)
SN
= Plastic SOIC (150mil Body), 8-lead
* Y = nickel palladium gold manufacturing designator. Only
available on the TDFN package.
© 2008 Microchip Technology Inc.
DS22058C-page 43
MCP6V01/2/3
NOTES:
DS22058C-page 44
© 2008 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2008 Microchip Technology Inc.
DS22058C-page 45
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Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
01/02/08
DS22058C-page 46
© 2008 Microchip Technology Inc.
