MCP6V71UT-E/OT

MCP6V71/1U/2/4 170 µA, 2 MHz Zero-Drift Op Amps Features Description • High DC Precision: - VOS Drift: ±15 nV/°C (maximum, VDD = 5.5V) - VOS: ±8 µV (maximum) - AOL: 126 dB (minimum, VDD = 5.5V) - PSRR: 115 dB (minimum, VDD = 5.5V) - CMRR: 117 dB (minimum, VDD = 5.5V) - Eni: 0.45 µVP-P (typical), f = 0.1 Hz to 10 Hz - Eni: 0.15 µVP-P (typical), f = 0.01 Hz to 1 Hz • Enhanced EMI Protection: - Electromagnetic Interference Rejection Ratio (EMIRR) at 1.8 GHz: 96 dB • Low Power and Supply Voltages: - IQ: 170 µA/amplifier (typical) - Wide Supply Voltage Range: 2V to 5.5V • Small Packages: - Singles in SC70, SOT-23 - Duals in MSOP-8, 2x3 TDFN - Quads in TSSOP-14 • Easy to Use: - Rail-to-Rail Input/Output - Gain Bandwidth Product: 2 MHz (typical) - Unity Gain Stable • Extended Temperature Range: -40°C to +125°C The Microchip Technology MCP6V71/1U/2/4 family of operational amplifiers provides input offset voltage correction for very low offset and offset drift. These are low-power devices with a gain bandwidth product of 2 MHz (typical). They are unity gain stable, have virtually no 1/f noise and have good Power Supply Rejection Ratio (PSRR) and Common-Mode Rejection Ratio (CMRR). These products operate with a single supply voltage as low as 2V, while drawing 170 µA/amplifier (typical) of quiescent current. The MCP6V71/1U/2/4 family has enhanced EMI protection to minimize any electromagnetic interference from external sources. This feature makes it well suited for EMI sensitive applications such as power lines, radio stations and mobile communications, etc. The Microchip Technology Inc. MCP6V71/1U/2/4 op amps are offered in single (MCP6V71 and MCP6V71U), dual (MCP6V72) and quad (MCP6V74) packages. They were designed using an advanced CMOS process. Typical Applications • • • • • Portable Instrumentation Sensor Conditioning Temperature Measurement DC Offset Correction Medical Instrumentation Design Aids • • • • FilterLab® Software Microchip Advanced Part Selector (MAPS) Analog Demonstration and Evaluation Boards Application Notes Related Parts • • • • • MCP6V11/1U/2/4: Zero-Drift, Low Power MCP6V31/1U/2/4 MCP6V61/1U: Zero-Drift 1 MHz MCP6V81/1U: Zero-Drift, 5 MHz MCP6V91/1U: Zero-Drift, 10 MHz Package Types MCP6V71 SOT-23 VOUT 1 VSS 2 VIN+ 3 MCP6V72 MSOP 5 VDD VOUTA VINA– 4 VIN– VINA+ VSS VSS 2 VIN– 3 8 7 6 5 VDD VOUTB VINB– VINB+ MCP6V72 2×3 TDFN * MCP6V71U SC70, SOT-23 VIN+ 1 1 2 3 4 5 VDD 8 VDD VOUTA 1 VINA– 2 4 VOUT VINA+ 3 VSS 4 EP 9 7 VOUTB 6 VINB– 5 VINB+ MCP6V74 TSSOP 1 2 3 4 VINB+ 5 VINB– 6 VOUTB 7 VOUTA VINA– VINA+ VDD 14 VOUTD 13 VIND– 12 VIND+ 11 VSS 10 VINC+ 9 VINC– 8 VOUTC * Includes Exposed Thermal Pad (EP); see Table 3-1.  2015-2020 Microchip Technology Inc. DS20005385C-page 1 MCP6V71/1U/2/4 Typical Application Circuit R1 R2 VDD/2 R3 R4 C2 R2 R5 U2 MCP6V71 VOUT 8 U1 MCP6XXX VDD/2 Offset Voltage Correction for Power Driver Input Offset Voltage (µV) VIN Figure 1 and Figure 2 show input offset voltage versus ambient temperature for different power supply voltages. 28 Samples 6 VDD = 2V 4 2 0 -2 -4 -6 -8 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 1: Input Offset Voltage vs. Temperature with VDD = 2V. Input Offset Voltage (µV) 8 28 28Samples Samples VVDD = = 2V 5.5V 6 DD 4 2 0 -2 -4 -6 -8 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 2: Input Offset Voltage vs. Temperature with VDD = 5.5V. As seen in Figure 1 and Figure 2, the MCP6V71/1U/2/4 op amps have excellent performance across temperature. The input offset voltage temperature drift (TC1) shown is well within the specified maximum values of 15 nV/°C at VDD = 5.5V and 30 nV/°C at VDD = 2V. This performance supports applications with stringent DC precision requirements. In many cases, it will not be necessary to correct for temperature effects (i.e., calibrate) in a design. In the other cases, the correction will be small. DS20005385C-page 2  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 1.0 1.1 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD – VSS ................................................................................................................................................................. 6.5V Current at Input Pins ..............................................................................................................................................±2 mA Analog Inputs (VIN+ and VIN-) (1) ...............................................................................................VSS – 1.0V to VDD+1.0V All Other Inputs and Outputs ......................................................................................................VSS – 0.3V to VDD+0.3V Difference Input Voltage .................................................................................................................................|VDD – VSS| Output Short-Circuit Current .......................................................................................................................... Continuous Current at Output and Supply Pins ...................................................................................................................... ±30 mA Storage Temperature .............................................................................................................................-65°C to +150°C Maximum Junction Temperature .......................................................................................................................... +150°C ESD protection on all pins (HBM, CDM, MM) MCP6V71/1U   4 kV, 1.5 kV, 400V MCP6V72/4  4 kV, 1.5 kV, 300V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Note 1: See Section 4.2.1, Rail-to-Rail Inputs. 1.2 Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2V to +5.5V, VSS = GND, VCM = VDD/3,VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figure 1-4 and Figure 1-5). Parameters Sym. Min. Typ. Max. Units VOS -8 — +8 µV Conditions Input Offset Input Offset Voltage Input Offset Voltage Drift with Temperature (Linear Temperature Coefficient) Input Offset Voltage Quadratic Temperature Coefficient TC1 TC2 -30 — +30 -15 — +15 — -30 — — -6 — TA = +25°C nV/°C pV/°C Input Offset Voltage Aging ΔVOS — ±0.75 — µV Power Supply Rejection Ratio PSRR 115 125 — dB 2 TA = -40 to +125°C, VDD = 2V (Note 1) TA = -40 to +125°C, VDD = 5.5V (Note 1) TA = -40 to +125°C, VDD = 2V TA = -40 to +125°C, VDD = 5.5V (Note 1) 408 hours Life Test at +150°, measured at +25°C Input Bias Current and Impedance Note 1: 2: 3: 4: For design guidance only; not tested. Figure 2-19 shows how VCML and VCMH changed across temperature for the first production lot. Parts with date codes prior to September 2015 (week code 27) were screened to a +3 nA maximum limit. Parts with date codes prior to September 2015 (week code 27) were screened to ±1 nA minimum/maximum limits.  2015-2020 Microchip Technology Inc. DS20005385C-page 3 MCP6V71/1U/2/4 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2V to +5.5V, VSS = GND, VCM = VDD/3,VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figure 1-4 and Figure 1-5). Parameters Input Bias Current Sym. Min. Typ. Max. Units IB -50 ±1 +50 pA IB — +20 — pA IB 0 +0.2 +1.5 nA Input Offset Current IOS -250 ±60 +250 pA Input Offset Current across Temperature IOS — ±50 — pA ±50 +800 pA — Ω||pF — Ω||pF Input Bias Current across Temperature Conditions TA = +85°C TA = +125°C (Note 3) TA = +85°C TA = +125°C (Note 4) IOS -800 Common-Mode Input Impedance ZCM — Differential Input Impedance ZDIFF — 1013||6 Common-Mode Input Voltage Range Low VCML — — VSS  0.2 V (Note 2) Common-Mode Input Voltage Range High VCMH VDD + 0.3 — — V (Note 2) CMRR 111 122 — dB VDD = 2V, VCM = -0.2V to 2.3V (Note 2) CMRR 117 130 — dB VDD = 5.5V, VCM = -0.2V to 5.8V (Note 2) AOL 117 132 — dB VDD = 2V, VOUT = 0.3V to 1.8V AOL 126 137 — dB VDD = 5.5V, VOUT = 0.3V to 5.3V VOL VSS VSS + 35 VSS + 121 mV RL = 2 kΩ, G = +2, 0.5V input overdrive VOL — VSS + 3.5 — mV RL = 20 kΩ, G = +2, 0.5V input overdrive VOH VDD – 121 VDD – 45 VDD mV RL = 2 kΩ, G = +2, 0.5V input overdrive VOH — VDD – 4.5 — mV RL = 20 kΩ, G = +2, 0.5V input overdrive Common-Mode 1013||6 Common-Mode Rejection Ratio Open-Loop Gain DC Open-Loop Gain (large signal) Output Minimum Output Voltage Swing Maximum Output Voltage Swing Output Short-Circuit Current Power Supply Supply Voltage Quiescent Current per Amplifier POR Trip Voltage Note 1: 2: 3: 4: ISC — ±9 — mA VDD = 2V ISC — ±26 — mA VDD = 5.5V VDD 2 — 5.5 V IQ 100 170 260 µA VPOR 0.9 1.2 1.6 V IO = 0 For design guidance only; not tested. Figure 2-19 shows how VCML and VCMH changed across temperature for the first production lot. Parts with date codes prior to September 2015 (week code 27) were screened to a +3 nA maximum limit. Parts with date codes prior to September 2015 (week code 27) were screened to ±1 nA minimum/maximum limits. DS20005385C-page 4  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = +25°C, VDD = +2V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF (refer to Figure 1-4 and Figure 1-5). Parameters Sym. Min. Typ. Max. Units Conditions Amplifier AC Response Gain Bandwidth Product GBWP — 2 — MHz Slew Rate SR — 1.0 — V/µs Phase Margin PM — 60 — ° G = +1 Amplifier Noise Response Eni — 0.15 — µVP-P f = 0.01 Hz to 1 Hz Eni — 0.45 — µVP-P f = 0.1 Hz to 10 Hz Input Noise Voltage Density eni — 21 — nV/√Hz f < 2 kHz Input Noise Current Density ini — 5 — fA/√Hz IMD — 11 — µVPK Start Up Time tSTR — 200 — µs G = +1, 0.1% VOUT settling (Note 2) Offset Correction Settling Time tSTL — 15 — µs G = +1, VIN step of 2V, VOS within 100 µV of its final value Output Overdrive Recovery Time tODR — 40 — µs G = -10, ±0.5V input overdrive to VDD/2, VIN 50% point to VOUT 90% point (Note 3) — 75 — VIN = 0.1 VPK, f = 400 MHz — 89 — VIN = 0.1 VPK, f = 900 MHz — 96 — — 98 — Input Noise Voltage Amplifier Distortion (Note 1) Intermodulation Distortion (AC) Amplifier Step Response EMI Protection EMI Rejection Ratio Note 1: 2: 3: EMIRR dB VCM tone = 100 mVPK at 1 kHz, GN = 1 VIN = 0.1 VPK, f = 1800 MHz VIN = 0.1 VPK, f = 2400 MHz These parameters were characterized using the circuit in Figure 1-6. In Figure 2-40 and Figure 2-41, there is an IMD tone at DC, a residual tone at 1 kHz and other IMD tones and clock tones. High gains behave differently; see Section 4.3.3, Offset at Power-Up. tODR includes some uncertainty due to clock edge timing. TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +2V to +5.5V, VSS = GND. Parameters Sym. Min. Typ. Max. Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 5L-SC-70 JA — 209 — °C/W Thermal Resistance, 5L-SOT-23 JA — 201 — °C/W Thermal Resistance, 8L-2x3 TDFN JA — 53 — °C/W Thermal Resistance, 8L-MSOP JA — 211 — °C/W Thermal Resistance, 14L-TSSOP JA — 100 — °C/W Conditions Temperature Ranges Note 1 Thermal Package Resistances Note 1: Operation must not cause TJ to exceed Maximum Junction Temperature specification (+150°C).  2015-2020 Microchip Technology Inc. DS20005385C-page 5 MCP6V71/1U/2/4 1.3 Timing Diagrams 1.4 2V to 5.5V 2V VDD 0V tSTR 1.001(VDD/3) VOUT Test Circuits The circuits used for most DC and AC tests are shown in Figure 1-4 and Figure 1-5. Lay out the bypass capacitors as discussed in Section 4.3.10 “Supply Bypassing and Filtering”. RN is equal to the parallel combination of RF and RG to minimize bias current effects. 0.999(VDD/3) FIGURE 1-1: Amplifier Start-up. VIN VDD 1 µF RN VIN RISO MCP6V7X tSTL VOS + 100 µV VOS VOS – 100 µV FIGURE 1-2: Time. Offset Correction Settling 100 nF VDD/3 RG 1 µF VOUT tODR VDD/2 VSS FIGURE 1-3: RISO MCP6V7X VDD Output Overdrive Recovery. VL FIGURE 1-4: AC and DC Test Circuit for Most Noninverting Gain Conditions. VDD/3 RN tODR RL RF VDD VIN CL VOUT 100 nF VIN RG CL VOUT RL VL RF FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. The circuit in Figure 1-6 tests the input’s dynamic behavior (i.e., IMD, tSTR, tSTL and tODR). The potentiometer balances the resistor network (VOUT should equal VREF at DC). The op amp’s Commonmode input voltage is VCM = VIN/2. The error at the input (VERR) appears at VOUT with a noise gain of 10 V/V. 11.0 kΩ 100 kΩ 500Ω 0.1% 0.1% 25 turn VREF = VDD/3 VDD 1 µF VIN 100 nF MCP6V7X 11.0 kΩ 100 kΩ 249Ω 1% 0.1% 0.1% FIGURE 1-6: Input Behavior. DS20005385C-page 6 RISO 0Ω VOUT RL open CL 30 pF VL Test Circuit for Dynamic  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. DC Input Precision 8 28 Samples 6 2 0 -2 -4 -6 Representative Part VCM = VCML Input Offset Voltage (µV) FIGURE 2-1: 0% FIGURE 2-2: Input Offset Voltage Drift. 6.5 6.0 5.0 5.5 6.5 6.0 5.5 5.0 4.5 4.0 Power Supply Voltage (V) FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. 8 28 Samples TA = -40°C to +125°C VDD = 5.5V 50% 40% VDD = 2V 20% 10% Input Offset Voltage (µV) 80% Percentage of Occurrences 3.5 -8 8 10 12 Input Offset Voltage Drift; TC1 (nV/°C) 30% 4.5 Representative Part VCM = VCMH 3.0 6 -6 2.5 4 -4 2.0 2 0 -2 0.0 -12 -10 -8 -6 -4 -2 0 2 1.5 10% TA = - 40°C TA = +25°C TA = +85°C TA = +125°C 4 1.0 20% 6 0.5 VDD = 2V Input Offset Voltage (µV) Percentage of Occurances VDD = 5.5V 30% 60% 4.0 FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. 8 28 Samples TA = -40°C to +125°C 40% 70% 3.5 Power Supply Voltage (V) Input Offset Voltage. 60% 50% 3.0 0.0 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 2.5 -8 2.0 VDD = 2V TA = +125°C TA = +85°C TA = +25°C TA = - 40°C 4 1.5 VDD = 5.5V 1.0 TA = 25ºC 0.5 50% 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% Input Offset Voltage (µV) Percentage of Occurences 2.1 Representative Part VDD = 2.0V 6 4 2 0 TA = +125°C TA = +85°C TA = +25°C TA = -40°C -2 -4 -6 0% -200 -160 -120 -80 -40 0 40 80 120 Input Offset Voltage Quadratric Temp Co; TC2 (pV/°C2) FIGURE 2-3: Input Offset Voltage Quadratic Temp. Co.  2015-2020 Microchip Technology Inc. -8 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Output Voltage (V) 1.6 1.8 2.0 FIGURE 2-6: Input Offset Voltage vs. Output Voltage with VDD = 2.0V. DS20005385C-page 7 MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Percentage of Occurrences Input Offset Voltage (µV) 8 6 TA = - 40°C TA = +25°C TA = +85°C TA = +125°C 4 2 0 -2 -4 Representative Part VDD = 5.5V -6 50% 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% Tester Data 617 Samples TA = +25ºC VDD = 5.5V VDD = 2V -1.6 -1.2 -0.8 -0.4 -8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-7: Input Offset Voltage vs. Output Voltage with VDD = 5.5V. 0 0.4 0.8 1.2 1.6 1/CMRR (µV/V) FIGURE 2-10: Ratio. Common-Mode Rejection TA = +125°C TA = +85°C TA = +25°C TA = - 40°C 6 4 Percentage of Occurrences Input Offset Voltage (µV) 8 2 0 -2 -4 -6 Representative Part VDD = 2.0V -8 -0.5 60% 50% Tester Data 617 Samples TA = +25ºC 40% 30% 20% 10% 0% -1 -0.8 -0.6 -0.4 -0.2 0.0 0.5 1.0 1.5 2.0 Common Mode Input Voltage (V) 2.5 FIGURE 2-8: Input Offset Voltage vs. Common-Mode Voltage with VDD = 2V. 0 0.2 0.4 0.6 0.8 1 1/PSRR (µV/V) FIGURE 2-11: Ratio. Power Supply Rejection Representative Part VDD = 5.5V 6 Percentage of Occurrences Input Offset Voltage (µV) 8 TA = +125°C TA = +85°C TA = +25°C TA = -40°C 4 2 0 -2 -4 -6 70% 60% 50% Tester Data 617 Samples TA = +25ºC VDD = 5.5V 40% 30% 20% VDD = 2.0V 10% 0% 5.5 6.0 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -8 -0.5 -0.4 -0.3 -0.2 -0.1 0 1/AOL (µV/V) Common Mode Input Voltage (V) FIGURE 2-9: Input Offset Voltage vs. Common-Mode Voltage with VDD = 5.5V. DS20005385C-page 8 0.1 0.2 0.3 0.4 0.5 FIGURE 2-12: DC Open-Loop Gain.  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 120 110 -25 0 25 50 75 100 6.0 5.5 5.0 4.5 Input Bias Current 1 1p 0.1 0.1p 125 Ambient Temperature (°C) 125 130 10 10p 115 VDD= 2V Input Offset Current 100 100p 105 150 VDD = 5.5 V 95 160 1000 1n 85 VDD= 5.5V 25 Input Bias, Offset Currents (A) DC Open-Loop Gain (dB) FIGURE 2-16: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +125°C. 170 -50 4.0 Input Common Mode Voltage (V) FIGURE 2-13: CMRR and PSRR vs. Ambient Temperature. 140 3.5 125 3.0 100 2.5 75 75 50 65 25 55 0 Ambient Temperature (°C) 45 -25 35 -50 -0.5 110 Input Offset Current 2.0 CMRR @ VDD = 5.5V @ VDD = 2V 120 Input Bias Current 1.5 130 TA = 125ºC 1.0 PSRR 140 VDD = 5.5 V 0.5 150 1000 800 600 400 200 0 -200 -400 -600 -800 -1000 0.0 Input Bias and Offset Currents (pA) CMRR, PSRR (dB) 160 Ambient Temperature (°C) FIGURE 2-14: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-17: Input Bias and Offset Currents vs. Ambient Temperature with VDD = +5.5V. Input Bias and Offset Currents (pA) VDD = 5.5 V TA = 85ºC Input Offset Current 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 Input Bias Current Input Current Magnitude (A) 1m 1,000 800 600 400 200 0 -200 -400 -600 -800 -1,000 100µ 10µ 1µ 100n 10n 1n TA = +125°C TA = +85°C TA = +25°C TA = -40°C 100p -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 Input Common Mode Voltage (V) Input Voltage (V) FIGURE 2-15: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +85°C.  2015-2020 Microchip Technology Inc. FIGURE 2-18: Input Bias Current vs. Input Voltage (below VSS). DS20005385C-page 9 MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 -0.5 Output Short Circuit Current (mA) Other DC Voltages and Currents 1 Wafer Lot Upper (VCMH – VDD) Lower (VCML – VSS) TA = +125°C TA = +85°C TA = +25°C TA = -40°C 30 20 10 0 -10 TA = +125°C TA = +85°C TA = +25°C TA = -40°C -20 -30 -40 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 125 Power Supply Voltage (V) FIGURE 2-19: Input Common-Mode Voltage Headroom (Range) vs. Ambient Temperature. FIGURE 2-22: Output Short-Circuit Current vs. Power Supply Voltage. 1000 Quiescent Current (µA/Amplifier) VDD = 2V VDD -VOH VDD = 5.5V 10 VOL -VSS 1 10 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 Output Current Magnitude (mA) Power Supply Voltage (V) 70 60 50 VDD = 5.5V VOL - VSS 40 30 20 VDD = 2V 10 VDD - VOH 0 -50 -25 0 25 50 75 800 Samples 100 125 1 Wafer Lot TA = +25ºC Ambient Temperature (°C) FIGURE 2-21: Output Voltage Headroom vs. Ambient Temperature. DS20005385C-page 10 1.6 VDD - VOH 1.04 80 Supply Current vs. Power 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% RL = 2 kΩ 0.9 90 FIGURE 2-23: Supply Voltage. Percentage of Occurences Output Voltage Headroom (mV) FIGURE 2-20: Output Voltage Headroom vs. Output Current. 1.32 1 1.24 0.1 TA = +125°C TA = +85°C TA = +25°C TA = -40°C 1.2 100 200 180 160 140 120 100 80 60 40 20 0 1.28 0 25 50 75 100 Ambient Temperature (°C) 1.16 -25 1.12 -50 Output Voltage Headroom (mV) 40 1.08 Input Common Mode Voltage Headroom (V) 2.2 POR Trip Voltage (V) FIGURE 2-24: Voltage. Power-On Reset Trip  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 1.6 POR Trip Voltage (V) 1.4 1.2 1 0.8 0.6 800 Samples 0.4 1 Wafer Lot 0.2 0 -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 2-25: Power-On Reset Voltage vs. Ambient Temperature.  2015-2020 Microchip Technology Inc. DS20005385C-page 11 MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Frequency Response 4.0 CMRR PSRRPSRR+ 100 100 1000 1k 10000 10k 60 2.5 50 GBWP 2.0 1.5 30 1.0 0.5 10 0 -50 -25 -120 20 -150 Open-Loop Gain 10 -180 0 -210 VDD = 2V CL = 30 pF -240 -270 1.E+07 10M Gain Bandwidth Product (MHz) Open-Loop Phase 30 2.5 80 2 70 1.5 Open-Loop Phase 30 -120 -150 Open-Loop Gain 10 -180 0 -210 VDD = 5.5V CL = 30 pF -240 1.E+06 1M -270 1.E+07 10M FIGURE 2-28: Open-Loop Gain vs. Frequency with VDD = 5.5V. DS20005385C-page 12 Gain Bandwidth Product (MHz) -90 Open-Loop Phase (°) Open-Loop Gain (dB) 40 f (Hz) 60 VDD = 5.5V VDD = 2V 1 50 GBWP 0.5 40 0 30 0 1 2 3 4 5 6 7 Common Mode Input Voltage (V) -60 1.E+05 100k 100 125 FIGURE 2-30: Gain Bandwidth Product and Phase Margin vs. Common-Mode Input Voltage. 50 -20 1.E+04 10k 75 90 f (Hz) -10 50 PM -1 FIGURE 2-27: Open-Loop Gain vs. Frequency with VDD = 2V. 20 25 3 Open-Loop Phase (°) Open-Loop Gain (dB) -90 1.E+06 1M 0 Ambient Temperature (°C) 40 1.E+05 100k 20 VDD = 2V FIGURE 2-29: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. CMRR and PSRR vs. -60 -20 1.E+04 10k 40 0.0 100000 100k 50 -10 70 3.0 Frequency (Hz) FIGURE 2-26: Frequency. VDD = 5.5V PM Phase Margin (º) 10 10 80 3.5 Phase Margin (°) Representative Part 4 65 3.5 60 3 55 VDD = 5.5V PM 2.5 50 2 45 1.5 40 VDD = 2V 1 35 Phase Margin (º) CMRR, PSRR (dB) 140 130 120 110 100 90 80 70 60 50 40 30 Gain Bandwidth Product (MHz) 2.3 GBWP 0.5 30 0 25 0 1 2 3 4 5 6 Output Voltage (V) FIGURE 2-31: Gain Bandwidth Product and Phase Margin vs. Output Voltage.  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Closed Loop Output Impedance (:)) 100000 100k VDD = 2V EMIRR (dB) 10000 10k 1000 1k GN: 101 V/V 11 V/V 1 V/V 100 10 1.0E+03 1k 1.0E+04 10k 1.0E+05 1.0E+06 100k 1.0E+07 1M 10M 120 110 100 90 80 70 60 50 40 30 20 10 0 10 10M VPK = 100 mV VDD = 5.5V 100 100M FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with VDD = 2V. 100000 100k 1000 1G 10000 10G Frequency (Hz) Frequency (Hz) FIGURE 2-35: EMIRR vs Frequency. 120 VDD = 5.5V Closed Loop Output Impedance (Ω) 100 10000 10k EMIRR (dB) 80 1000 1k GN: 101 V/V 11 V/V 1 V/V 100 100 10 10 1.0E+03 1k 1.0E+04 10k 1.0E+05 100k 60 40 EMIRR @ 2400 MHz EMIRR @ 1800 MHz EMIRR @ 900 MHz EMIRR @ 400 MHz VDD = 5.5V 20 1.0E+06 0 0.01 1.0E+07 1M 10M Frequency (Hz) FIGURE 2-33: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V. FIGURE 2-36: Voltage. Channel-to-Channel Separation; RTI (dB) Output Voltage Swing (VP-P) 1.00 10.00 EMIRR vs RF Input Peak 130 10 VDD = 5.5V VDD = 2V 1 0.1 0.10 RF Input Peak Voltage (Vp) 1000 1k 10000 10k 100000 100k Frequency (Hz) 1000000 1M 10000000 10M FIGURE 2-34: Maximum Output Voltage Swing vs. Frequency.  2015-2020 Microchip Technology Inc. 120 110 VDD = 5.5V 100 90 VDD = 2.0V 80 70 60 10k 1.E+04 100k 1.E+05 Frequency (Hz) 1M 1.E+06 FIGURE 2-37: Channel-to-Channel Separation vs. Frequency. DS20005385C-page 13 MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Input Noise and Distortion 1000 VDD = 5.5V, green VDD = 2V, blue 100 100 eni 10 10 1.E+3 1m Eni(0 Hz to f) FIGURE 2-38: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. 1.E+1 10µ VDD = 2.0V 20 VDD = 5.5V 15 DC tone 100n 1.E-1 ǻf = 64 Hz ǻf = 2 Hz 10 5 10 1.E+1 100 1k 1.E+2 1.E+3 Frequency (Hz) NPBW = 10 Hz NPBW = 1 Hz 0 10 20 30 40 Common Mode Input Voltage (V) Residual 1 kHz tone (due to resistor mismatch) DC tone 1.E+0 1µ 100n 1.E-1 60 70 80 90 100 FIGURE 2-42: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 2V. VDD = 5.5V Input Noise Voltage; eni(t) (0.1 µV/div) IMD Spectrum, RTI (VPK) VDD = 2.0V VDD = 5.5V 1.E+2 100µ 1.E+1 10µ 50 Time (s) FIGURE 2-39: Input Noise Voltage Density vs. Input Common-Mode Voltage. G = 11 V/V VCM tone = 100 mVPK, f = 1 kHz 100k 1.E+5 VDD = 2V 0 -0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.E+3 1m 10k 1.E+4 FIGURE 2-41: Intermodulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). Input Noise Voltage; eni(t) (0.1 µV/div) Input Noise Voltage Density Q9¥+] f < 2 kHz Residual 1 kHz tone (due to resistor mismatch) 1.E+0 1µ 35 30 VDD = 2.0V VDD = 5.5V 1.E+2 100µ 10n 1.E-2 1 1.E+0 1 1 1 10 100 1.E+3 1k 10k 1.E+5 100k 1.E+0 1.E+1 1.E+2 1.E+4 Frequency (Hz) 25 G = 11 V/V VCM tone = 100 mVPK, f = 1 kHz IMD Spectrum, RTI (VPK) Input Noise Voltage Density; eni (nV/¥+] 1000 Integrated Input Noise Voltage; Eni (µVP-P) 2.4 NPBW = 10 Hz NPBW = 1 Hz ǻf = 64 Hz ǻf = 2 Hz 10n 1.E-2 1 1.E+0 0 10 1.E+1 100 1k 1.E+2 1.E+3 Frequency (Hz) 10k 1.E+4 FIGURE 2-40: Intermodulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). DS20005385C-page 14 10 20 30 40 50 60 70 80 90 100 100k 1.E+5 Time (s) FIGURE 2-43: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 5.5V.  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. Input Offset Voltage (µV) 45 40 35 30 25 20 15 10 5 0 -5 -10 100 80 60 40 20 0 -20 -40 -60 -80 -100 -120 TPCB VDD = 5.5V VDD = 2V VOS Temperature increased by using heat gun for 5 seconds. Output Voltage (20 mV/div) Time Response PCB Temperature (ºC) 2.5 0 0 10 20 30 40 50 60 70 80 90 100110120 Time (s) 5 VDD 4 20 VDD = 5.5V G = +1 V/V 15 10 3 2 POR Trip Point 5 1 VOS 0 0 0 1 2 3 4 5 6 7 8 9 2 2.5 3 3.5 4 4.5 5 Noninverting Small Signal 5 4 3 2 VDD = 5.5 V G = +1 V/V 1 0 -1 -5 1.5 6 Output Voltage (V) 25 1 FIGURE 2-47: Step Response. Power Supply Voltage (V) Input Offset Voltage (mV) 6 0.5 Time (µs) FIGURE 2-44: Input Offset Voltage vs. Time with Temperature Change. 30 VDD = 5.5V G = +1 V/V 0 10 2.5 5 7.5 10 12.5 15 17.5 20 Time (µs) Time (ms) FIGURE 2-45: Input Offset Voltage vs. Time at Power-Up. FIGURE 2-48: Step Response. Noninverting Large Signal 5 4 VOUT VIN 3 2 1 0 VDD = 5.5 V G = +1 V/V -1 Output Voltage (20 mV/div) Input, Output Voltages (V) 6 VDD = 5.5 V G = -1 V/V 0 0.5 FIGURE 2-46: The MCP6V71/1U/2/4 Family Shows No Input Phase Reversal with Overdrive.  2015-2020 Microchip Technology Inc. 1 1.5 2 2.5 3 3.5 4 4.5 5 Time (µs) Time (5 µs/div) FIGURE 2-49: Response. Inverting Small Signal Step DS20005385C-page 15 MCP6V71/1U/2/4 Note: Unless otherwise indicated, TA = +25°C, VDD = +2V to 5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 20 kΩ to VL and CL = 30 pF. 1m Output Voltage (V) 5 Overdrive Recovery Time (s) 6 VDD = 5.5 V G = -1 V/V 4 3 2 1 0 0 2.5 5 7.5 10 12.5 15 17.5 20 Slew Rate (V/µs) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 tODR, low VDD = 2.0V 100µ VDD = 5.5V 10µ tODR, high 1µ 1 10 100 1000 Inverting Gain Magnitude (V/V) Time (µs/div) FIGURE 2-50: Response. 0.5V Input Overdrive Inverting Large Signal Step FIGURE 2-53: Output Overdrive Recovery Time vs. Inverting Gain. Falling Edge, VDD = 5.5V Rising Edge, VDD = 5.5V Falling Edge, VDD = 2V Rising Edge, VDD = 2V -50 -25 0 25 50 75 100 125 Ambient Temperature (°C) FIGURE 2-51: Temperature. Slew Rate vs. Ambient Input and Output Voltage (V) 7 6 VDD = 5.5 V G = -10 V/V 0.5V Overdrive 5 4 VOUT GVIN GVIN VOUT 3 2 1 0 -1 Time (50 µs/div) FIGURE 2-52: Output Overdrive Recovery vs. Time with G = -10 V/V. DS20005385C-page 16  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP6V71 MCP6V71U SOT-23 SOT-23, SC-70 2×3 TDFN MSOP TSSOP 1 4 1 1 1 2 2 4 4 11 VSS 3 1 3 3 3 VIN+, VINA+ 4 3 2 2 2 VIN-, VINA- 5 5 8 8 4 VDD 3.1 MCP6V72 MCP6V74 VOUT, VOUTA Output (Op Amp A) Negative Power Supply Noninverting Input (Op Amp A) Inverting Input (Op Amp A) Positive Power Supply — — 5 5 5 VINB+ Noninverting Input (Op Amp B) — 6 6 6 VINB- Inverting Input (Op Amp B) — — 7 7 7 VOUTB Output (Op Amp B) — — — — 8 VOUTC Output (Op Amp C) — — — — 9 VINC- Inverting Input (Op Amp C) — — — — 10 VINC+ Noninverting Input (Op Amp C) — — — — 12 VIND+ Noninverting Input (Op Amp D) — — — — 13 VIND- Inverting Input (Op Amp D) — — — — 14 VOUTD Output (Op Amp D) — — 9 — — EP Analog Outputs Analog Inputs The noninverting and inverting inputs (VIN+, VIN-, …) are high-impedance CMOS inputs with low bias currents. 3.3 Description — The analog output pins (VOUT) are low-impedance voltage sources. 3.2 Symbol 3.4 Exposed Thermal Pad (EP); must be connected to VSS Exposed Thermal Pad (EP) There is an internal connection between the exposed thermal pad (EP) and the VSS pin; they must be connected to the same potential on the printed circuit board (PCB). This pad can be connected to a PCB ground plane to provide a larger heat sink. This improves the package thermal resistance (θJA). Power Supply Pins The positive power supply (VDD) is 2V to 5.5V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors.  2015-2020 Microchip Technology Inc. DS20005385C-page 17 MCP6V71/1U/2/4 NOTES: DS20005385C-page 18  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 4.0 APPLICATIONS The MCP6V71/1U/2/4 family of zero-drift op amps is manufactured using Microchip’s state of the art CMOS process. It is designed for precision applications with requirements for small packages and low power. Its low supply voltage and low quiescent current make the MCP6V71/1U/2/4 devices ideal for battery-powered applications. 4.1 Overview of Zero-Drift Operation Figure 4-1 shows a simplified diagram of the MCP6V71/1U/2/4 zero-drift op amp. This diagram will be used to explain how slow voltage errors are reduced in this architecture (much better VOS, ΔVOS/ΔTA (TC1), CMRR, PSRR, AOL and 1/f noise). VREF Output Buffer VOUT Main Amp. The output buffer drives external loads at the VOUT pin (VREF is an internal reference voltage). The oscillator runs at fOSC1 = 200 kHz. Its output is divided by two to produce the chopping clock rate of fCHOP = 100 kHz. The internal Power-on Reset (POR) starts the part in a known good state, protecting against power supply brown-outs. The digital control block controls switching and POR events. 4.1.2 CHOPPING ACTION Figure 4-2 shows the amplifier connections for the first phase of the chopping clock and Figure 4-3 shows them for the second phase. Its slow voltage errors alternate in polarity, making the average error small. VIN+ VIN+ VIN– The low-pass filter reduces high-frequency content, including harmonics of the chopping clock. VIN– Main Amp. Low-Pass Filter Low-Pass Filter Chopper Input Switches Oscillator Aux. Amp. Digital Control Chopper Output Switches POR FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. 4.1.1 BUILDING BLOCKS The Main amplifier is designed for high gain and bandwidth, with a differential topology. Its main input pair (+ and - pins at the top left) is used for the higher frequency portion of the input signal. Its auxiliary input pair (+ and - pins at the bottom left) is used for the lowfrequency portion of the input signal and corrects the op amp’s input offset voltage. Both inputs are added together internally. The Auxiliary amplifier, chopper input switches and chopper output switches provide a high DC gain to the input signal. DC errors are modulated to higher frequencies, while white noise is modulated to low frequencies.  2015-2020 Microchip Technology Inc. NC NC Aux. Amp. FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. VIN+ VIN– Main Amp. NC Low-Pass Filter Aux. Amp. FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. DS20005385C-page 19 MCP6V71/1U/2/4 4.1.3 INTERMODULATION DISTORTION (IMD) These op amps will show intermodulation distortion (IMD) products when an AC signal is present. The signal and clock can be decomposed into sine wave tones (Fourier series components). These tones interact with the zero-drift circuitry’s nonlinear response to produce IMD tones at sum and difference frequencies. Each of the square wave clock’s harmonics has a series of IMD tones centered on it. See Figure 2-40 and Figure 2-41. 4.2 4.2.1 Other Functional Blocks RAIL-TO-RAIL INPUTS The input stage of the MCP6V71/1U/2/4 op amps uses two differential CMOS input stages in parallel. One operates at low Common-Mode Input Voltage (VCM, which is approximately equal to VIN+ and VIN- in normal operation) and the other at high VCM. With this topology, the input operates with VCM up to VDD + 0.3V, and down to VSS – 0.2V, at +25°C (see Figure 2-19). The input offset voltage (VOS) is measured at VCM = VSS – 0.2V and VDD + 0.3V to ensure proper operation. 4.2.1.1 Phase Reversal The input devices are designed to not exhibit phase inversion when the input pins exceed the supply voltages. Figure 2-46 shows an input voltage exceeding both supplies with no phase inversion. 4.2.1.2 VDD Bond Pad VIN+ Bond Pad VSS Bond Pad FIGURE 4-4: Structures. Simplified Analog Input ESD The input ESD diodes clamp the inputs when they try to go more than one diode drop below VSS. They also clamp any voltages well above VDD; their breakdown voltage is high enough to allow normal operation, but not low enough to protect against slow overvoltage (beyond VDD) events. Very fast ESD events (that meet the spec) are limited so that damage does not occur. In some applications, it may be necessary to prevent excessive voltages from reaching the op amp inputs; Figure 4-5 shows one approach to protecting these inputs. D1 and D2 may be small signal silicon diodes, Schottky diodes for lower clamping voltages or diodeconnected FETs for low leakage. VDD Input Voltage Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the voltages at the input pins (see Section 1.1 “Absolute Maximum Ratings †”). This requirement is independent of the current limits discussed later on. The ESD protection on the inputs can be depicted as shown in Figure 4-4. This structure was chosen to protect the input transistors against many (but not all) overvoltage conditions and to minimize input bias current (IB). DS20005385C-page 20 Bond V – IN Pad Input Stage U1 D1 V1 V2 MCP6V7X D2 VOUT FIGURE 4-5: Protecting the Analog Inputs Against High Voltages.  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 4.2.1.3 4.3 Input Current Limits In order to prevent damage and/or improper operation of these amplifiers, the circuit must limit the currents into the input pins (see Section 1.1 “Absolute Maximum Ratings †”). This requirement is independent of the voltage limits discussed previously. Figure 4-6 shows one approach to protecting these inputs. The resistors R1 and R2 limit the possible current in or out of the input pins (and into D1 and D2). The diode currents will dump onto VDD. Application Tips 4.3.1 INPUT OFFSET VOLTAGE OVER TEMPERATURE Table 1-1 gives both the linear and quadratic Temperature Coefficients (TC1 and TC2) of the input offset voltage. The input offset voltage, at any temperature in the specified range, can be calculated as follows: EQUATION 4-1: VDD D1 V1 V2 R1 Where: U1 MCP6V7X D2 FIGURE 4-6: Protecting the Analog Inputs Against High Currents. It is also possible to connect the diodes to the left of resistors R1 and R2. In this case, the currents through diodes D1 and D2 need to be limited by some other mechanism. The resistors then serve as in-rush current limiters; the DC current into the input pins (VIN+ and VIN-) should be very small. A significant amount of current can flow out of the inputs (through the ESD diodes) when the CommonMode Voltage (VCM) is below ground (VSS) (see Figure 2-18). 4.2.2 ΔT = TA – 25°C = input offset voltage at TA VOS = input offset voltage at +25°C TC1 = linear temperature coefficient TC2 = quadratic temperature coefficient R2 VSS – min(V1, V2) 2 mA max(V1, V2) – VDD min(R1, R2) > 2 mA RAIL-TO-RAIL OUTPUT The output voltage range of the MCP6V71/1U/2/4 zerodrift op amps is VDD – 5.9 mV (typical) and VSS + 4.5 mV (typical) when RL = 20 kΩ is connected to VDD/2 and VDD = 5.5V. Refer to Figure 2-20 and Figure 2-21 for more information. This op amp is designed to drive light loads; use another amplifier to buffer the output from heavy loads.  2015-2020 Microchip Technology Inc. 2 VOS(TA) VOUT min(R1, R2) > V OS  T A  = V OS + TC 1  T + TC 2  T 4.3.2 DC GAIN PLOTS Figure 2-10 to Figure 2-12 are histograms of the reciprocals (in units of µV/V) of CMRR, PSRR and AOL, respectively. They represent the change in input offset voltage (VOS) with a change in Common-Mode Input Voltage (VCM), Power Supply Voltage (VDD) and Output Voltage (VOUT). The 1/AOL histogram is centered near 0 µV/V because the measurements are dominated by the op amp’s input noise. The negative values shown represent noise and tester limitations, not unstable behavior. Production tests make multiple VOS measurements, which validate an op amp's stability; an unstable part would show greater VOS variability or the output would stick at one of the supply rails. 4.3.3 OFFSET AT POWER-UP When these parts power-up, the Input Offset (VOS) starts at its uncorrected value (usually less than ±5 mV). Circuits with high DC gain can cause the output to reach one of the two rails. In this case, the time to a valid output is delayed by an Output Overdrive Time (like tODR) in addition to the Start-up Time (like tSTR). It can be simple to avoid this extra start-up time. Reducing the gain is one method. Adding a capacitor across the Feedback Resistor (RF) is another method. DS20005385C-page 21 MCP6V71/1U/2/4 SOURCE RESISTANCES The input bias currents have two significant components: switching glitches that dominate at room temperature and below and input ESD diode leakage currents that dominate at +85°C and above. Make the resistances seen by the inputs small and equal. This minimizes the output offset caused by the input bias currents. The inputs should see a resistance on the order of 10Ω to 1 kΩ at high frequencies (i.e., above 1 MHz). This helps minimize the impact of switching glitches, which are very fast, on overall performance. In some cases, it may be necessary to add resistors in series with the inputs to achieve this improvement in performance. Small input resistances may be needed for high gains. Without them, parasitic capacitances might cause positive feedback and instability. 4.3.5 GN is the circuit’s Noise Gain. For noninverting gains, GN and the Signal Gain are equal. For inverting gains, GN is 1+|Signal Gain| (e.g., -1 V/V gives GN = +2 V/V). 10000 VDD = 5.5 V RL = 20 kȍ 1000 CAPACITIVE LOADS Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop’s phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. These zero-drift op amps have a different output impedance than most op amps, due to their unique topology. When driving a capacitive load with these op amps, a series resistor at the output (RISO in Figure 4-7) improves the feedback loop’s phase margin (stability) by making the output load resistive at higher frequencies. The bandwidth will be generally lower than the bandwidth with no capacitive load. RISO 100 GN: 1 V/V 10 V/V 100 V/V 10 1 100p 1.E-10 SOURCE CAPACITANCE The capacitances seen by the two inputs should be small. Large input capacitances and source resistances, together with high gain, can lead to positive feedback and instability. 4.3.6 Figure 4-8 gives recommended RISO values for different capacitive loads and gains. The x-axis is the normalized Load Capacitance (CL/√GN). The y-axis is the Resistance (RISO). Recommended R ISO (Ω) 4.3.4 1n 1.E-09 10n 1.E-08 FIGURE 4-8: Recommended RISO values for Capacitive Loads. After selecting RISO for your circuit, double check the resulting frequency response peaking and step response overshoot. Modify RISO's value until the response is reasonable. Bench evaluation is helpful. 4.3.7 STABILIZING OUTPUT LOADS This family of zero-drift op amps has an output impedance (Figure 2-32 and Figure 2-33) that has a double zero when the gain is low. This can cause a large phase shift in feedback networks that have lowimpedance near the part’s bandwidth. This large phase shift can cause stability problems. Figure 4-9 shows that the load on the output is (RL + RISO)||(RF + RG), where RISO is before the load (like Figure 4-7). This load needs to be large enough to maintain stability; it should be at least 10 kΩ. RG RF RISO VOUT RL CL MCP6V7X 1µ 1.E-06 Normalized Load Capacitance; CL/¥GN (F) VOUT U1 100n 1.E-07 CL U1 MCP6V7X FIGURE 4-9: Output Load. FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. DS20005385C-page 22  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 4.3.8 GAIN PEAKING 4.3.9 Figure 4-10 shows an op amp circuit that represents noninverting amplifiers (VM is a DC voltage and VP is the input) or inverting amplifiers (VP is a DC voltage and VM is the input). The capacitances CN and CG represent the total capacitance at the input pins; they include the op amp’s Common-Mode Input Capacitance (CCM), board parasitic capacitance and any capacitor placed in parallel. The capacitance CFP represents the parasitic capacitance coupling the output and noninverting input pins. RN VP CN CFP MCP6V7X VM RG FIGURE 4-10: Capacitance. CG Reduce undesired noise and signals with: • Low bandwidth signal filters: - Minimize random analog noise - Reduce interfering signals • Good PCB layout techniques: - Minimize crosstalk - Minimize parasitic capacitances and inductances that interact with fast switching edges • Good power supply design: - Isolation from other parts - Filtering of interference on supply line(s) 4.3.10 U1 RF VOUT Amplifier with Parasitic CG acts in parallel with RG (except for a gain of +1 V/V), which causes an increase in gain at high frequencies. CG also reduces the phase margin of the feedback loop, which becomes less stable. This effect can be reduced by either reducing CG or RF||RG. CN and RN form a low-pass filter that affects the signal at VP. This filter has a single real pole at 1/(2πRNCN). The largest value of RF that should be used depends on noise gain (see GN in Section 4.3.6 “Capacitive Loads”), CG and the open-loop gain’s phase shift. An approximate limit for RF is: EQUATION 4-2: 2 12 pF R F   10 k    --------------  G N CG Some applications may modify these values to reduce either output loading or gain peaking (step response overshoot). At high gains, RN needs to be small in order to prevent positive feedback and oscillations. Large CN values can also help.  2015-2020 Microchip Technology Inc. REDUCING UNDESIRED NOISE AND SIGNALS SUPPLY BYPASSING AND FILTERING With this family of operational amplifiers, the power supply pin (VDD for single supply) should have a local bypass capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm of the pin for good high-frequency performance. These parts also need a bulk capacitor (i.e., 1 µF or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other low-noise analog parts. In some cases, high-frequency power supply noise (e.g., switched mode power supplies) may cause undue intermodulation distortion with a DC offset shift; this noise needs to be filtered. Adding a resistor into the supply connection can be helpful. 4.3.11 PCB DESIGN FOR DC PRECISION In order to achieve DC precision on the order of ±1 µV, many physical errors need to be minimized. The design of the Printed Circuit Board (PCB), the wiring and the thermal environment have a strong impact on the precision achieved. A poor PCB design can easily be more than 100 times worse than the MCP6V71/1U/2/4 op amps’ minimum and maximum specifications. 4.3.11.1 PCB Layout Any time two dissimilar metals are joined together, a temperature dependent voltage appears across the junction (the Seebeck or thermojunction effect). This effect is used in thermocouples to measure temperature. The following are examples of thermojunctions on a PCB: • Components (resistors, op amps, …) soldered to a copper pad • Wires mechanically attached to the PCB • Jumpers • Solder joints • PCB vias DS20005385C-page 23 MCP6V71/1U/2/4 Typical thermojunctions have temperature to voltage conversion coefficients of 1 to 100 µV/°C (sometimes higher). 4.4 Microchip’s AN1258 (“Op Amp Precision Design: PCB Layout Techniques”) contains in-depth information on PCB layout techniques that minimize thermojunction effects. It also discusses other effects, such as crosstalk, impedances, mechanical stresses and humidity. Many sensors are configured as Wheatstone bridges. Strain gauges and pressure sensors are two common examples. These signals can be small and the Common-mode noise large. Amplifier designs with high differential gain are desirable. 4.3.11.2 Crosstalk DC crosstalk causes offsets that appear as a larger input offset voltage. Common causes include: Typical Applications 4.4.1 WHEATSTONE BRIDGE Figure 4-11 shows how to interface to a Wheatstone bridge with a minimum of components. Because the circuit is not symmetric, the ADC input is single-ended and there is a minimum of filtering; the CMRR is good enough for moderate Common-mode noise. • Common-mode noise (remote sensors) • Ground loops (current return paths) • Power supply coupling 0.01C VDD R R R R Interference from the mains (usually 50 Hz or 60 Hz) and other AC sources can also affect the DC performance. Nonlinear distortion can convert these signals to multiple tones, including a DC shift in voltage. When the signal is sampled by an ADC, these AC signals can also be aliased to DC, causing an apparent shift in offset. FIGURE 4-11: To reduce interference: 4.4.2 - Keep traces and wires as short as possible Use shielding Use ground plane (at least a star ground) Place the input signal source near to the DUT Use good PCB layout techniques Use a separate power supply filter (bypass capacitors) for these zero-drift op amps 4.3.11.3 Miscellaneous Effects Keep the resistances seen by the input pins as small and as near to equal as possible to minimize biascurrent-related offsets. Make the (trace) capacitances seen by the input pins small and equal. This is helpful in minimizing switching glitch-induced offset voltages. Bending a coax cable with a radius that is too small causes a small voltage drop to appear on the center conductor (the triboelectric effect). Make sure the bending radius is large enough to keep the conductors and insulation in full contact. Mechanical stresses can make some capacitor types (such as some ceramics) output small voltages. Use more appropriate capacitor types in the signal path and minimize mechanical stresses and vibration. Humidity can cause electrochemical potential voltages to appear in a circuit. Proper PCB cleaning helps, as does the use of encapsulants. DS20005385C-page 24 0.2R 1 kΩ 100R VDD ADC U1 0.2R MCP6V71 Simple Design. RTD SENSOR The ratiometric circuit in Figure 4-12 conditions a twowire RTD for applications with a limited temperature range. U1 acts as a difference amplifier with a lowfrequency pole. The sensor’s wiring resistance (RW) is corrected in firmware. Failure (open) of the RTD is detected by an out-of-range voltage. VDD RT RN 34.8 kΩ 10.0 kΩ RF 2.00 MΩ RW RRTD 100Ω RW 10 nF U1 MCP6V71 RG RF 10.0 kΩ 2.00 MΩ RB 4.99 kΩ 1.0 µF 10 nF 1.00 kΩ 100 nF VDD ADC FIGURE 4-12: RTD Sensor.  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 4.4.3 OFFSET VOLTAGE CORRECTION Figure 4-13 shows MCP6V71 (U2) correcting the input offset voltage of another op amp (U1). R2 and C2 integrate the offset error seen at U1’s input; the integration needs to be slow enough to be stable (with the feedback provided by R1 and R3). R4 and R5 attenuate the integrator’s output; this shifts the integrator pole down in frequency. R1 VIN R3 R2 R4 C2 VDD/2 U1 R5 R2 VOUT MCP6XXX U2 VDD/2 MCP6V71 FIGURE 4-13: 4.4.4 Offset Correction. PRECISION COMPARATOR Use high gain before a comparator to improve the latter’s performance. Do not use MCP6V71/1U/2/4 as a comparator by itself; the VOS correction circuitry does not operate properly without a feedback loop. VIN U1 MCP6V71 R1 R2 R3 R4 R5 VDD/2 VOUT U2 MCP6541 FIGURE 4-14: Precision Comparator.  2015-2020 Microchip Technology Inc. DS20005385C-page 25 MCP6V71/1U/2/4 NOTES: DS20005385C-page 26  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 5.0 DESIGN AIDS Microchip provides the basic design aids needed for the MCP6V71/1U/2/4 family of op amps. 5.1 FilterLab® Software Microchip’s FilterLab® software is an innovative software tool that simplifies analog active filter (using op amps) design. Available at no cost from the Microchip web site at www.microchip.com/filterlab, the FilterLab design tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. 5.2 Microchip Advanced Part Selector (MAPS) MAPS is a software tool that helps efficiently identify Microchip devices that fit a particular design requirement. Available at no cost from the Microchip web site at www.microchip.com/maps, MAPS is an overall selection tool for Microchip’s product portfolio that includes Analog, Memory, MCUs and DSCs. Using this tool, a customer can define a filter to sort features for a parametric search of devices and export side-by-side technical comparison reports. Helpful links are also provided for data sheets, purchase and sampling of Microchip parts. 5.3 Analog Demonstration and Evaluation Boards Microchip offers a broad spectrum of Analog Demonstration and Evaluation Boards that are designed to help customers achieve faster time to market. For a complete listing of these boards and their corresponding user’s guides and technical information, visit the Microchip web site at www.microchip.com/analog tools. Some boards that are especially useful are: • MCP6V01 Thermocouple Auto-Zeroed Reference Design (P/N MCP6V01RD-TCPL) • MCP6XXX Amplifier Evaluation Board 1 (P/N DS51667) • MCP6XXX Amplifier Evaluation Board 2 (P/N DS51668) • MCP6XXX Amplifier Evaluation Board 3 (P/N DS51673) • MCP6XXX Amplifier Evaluation Board 4 (P/N DS51681) • Active Filter Demo Board Kit User’s Guide (P/N DS51614) • 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board (P/N SOIC8EV) • 14-Pin SOIC/TSSOP/DIP Evaluation Board (P/N SOIC14EV) 5.4 Application Notes The following Microchip Application Notes are available on the Microchip web site at www.microchip. com/appnotes and are recommended as supplemental reference resources. • ADN003: “Select the Right Operational Amplifier for your Filtering Circuits” (DS21821) • AN722: “Operational Amplifier Topologies and DC Specifications” (DS00722) • AN723: “Operational Amplifier AC Specifications and Applications” (DS00723) • AN884: “Driving Capacitive Loads With Op Amps” (DS00884) • AN990: “Analog Sensor Conditioning Circuits – An Overview” (DS00990) • AN1177: “Op Amp Precision Design: DC Errors”, (DS01177) • AN1228: “Op Amp Precision Design: Random Noise” (DS01228) • AN1258: “Op Amp Precision Design: PCB Layout Techniques” (DS01258) These Application Notes and others are listed in the design guide: “Signal Chain Design Guide” (DS21825)  2015-2020 Microchip Technology Inc. DS20005385C-page 27 MCP6V71/1U/2/4 NOTES: DS20005385C-page 28  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 6.0 PACKAGING INFORMATION 6.1 Package Marking Information Example: 5-Lead SC70 (MCP6V71U) Device Code MCP6V71UT-E/LTY DUNN Example: 5-Lead SOT-23 (MCP6V71, MCP6V71U) XXXXY WWNNN Device Before 4/28/2020 DU56 Code MCP6V71T-E/OT AAAYY MCP6V71UT-E/OT AAAZY AAAY4 31256 AAAY or AAA (Note 1) After 4/28/2020 AAA1 (Note 2) Note 1: The “Y” in the “AAAY” code is the letter Y, while and are numbers indicating the year (e.g., 2023 gives “AAA23” or “AAAY3”. 2: is a number indicating the year (e.g., 2023 results in AAA13). Note: Applies to 5-Lead SOT-23. Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2015-2020 Microchip Technology Inc. DS20005385C-page 29 MCP6V71/1U/2/4 8-Lead MSOP (3x3 mm) (MCP6V72) Example 6V72E 031256 8-Lead TDFN (2x3x0.75 mm) (MCP6V72) Device MCP6V72T-E/MNY Note: 14-Lead TSSOP (4.4 mm) (MCP6V74) XXXXXXXX YYWW NNN DS20005385C-page 30 Example Code ACT Applies to 8-Lead 2x3 TDFN. ACT 031 25 Example 6V74E/ST 2031 256  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 5-Lead Plastic Small Outline Transistor (LTY) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A e e 3 B 1 E1 E 2X 0.15 C 4 N 5X TIPS 0.30 C NOTE 1 2X 0.15 C 5X b 0.10 C A B TOP VIEW C c A2 A SEATING PLANE A1 L SIDE VIEW END VIEW Microchip Technology Drawing C04-061-LTY Rev E Sheet 1 of 2  2015-2020 Microchip Technology Inc. DS20005385C-page 31 MCP6V71/1U/2/4 5-Lead Plastic Small Outline Transistor (LTY) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch A Overall Height Standoff A1 A2 Molded Package Thickness Overall Length D Overall Width E E1 Molded Package Width b Terminal Width L Terminal Length c Lead Thickness MIN 0.80 0.00 0.80 0.15 0.10 0.08 MILLIMETERS NOM 5 0.65 BSC 2.00 BSC 2.10 BSC 1.25 BSC 0.20 - MAX 1.10 0.10 1.00 0.40 0.46 0.26 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-061-LTY Rev E Sheet 2 of 2 DS20005385C-page 32  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 5-Lead Plastic Small Outline Transistor (LTY) [SC70] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E Gx SILK SCREEN 3 2 1 C G 4 5 Y X RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width X Contact Pad Length Y Distance Between Pads G Distance Between Pads Gx MIN MILLIMETERS NOM 0.65 BSC 2.20 MAX 0.45 0.95 1.25 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2061-LTY Rev E  2015-2020 Microchip Technology Inc. DS20005385C-page 33 MCP6V71/1U/2/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A A2 0.20 C SEATING PLANE A SEE SHEET 2 A1 C SIDE VIEW Microchip Technology Drawing C04-091-OT Rev F Sheet 1 of 2 DS20005385C-page 34  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c T L L1 VIEW A-A SHEET 1 Units Dimension Limits Number of Pins N e Pitch e1 Outside lead pitch Overall Height A Molded Package Thickness A2 Standoff A1 E Overall Width E1 Molded Package Width D Overall Length L Foot Length Footprint L1 I Foot Angle c Lead Thickness b Lead Width MIN 0.90 0.89 - 0.30 0° 0.08 0.20 MILLIMETERS NOM 5 0.95 BSC 1.90 BSC 2.80 BSC 1.60 BSC 2.90 BSC 0.60 REF - MAX 1.45 1.30 0.15 0.60 10° 0.26 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-091-OT Rev F Sheet 2 of 2  2015-2020 Microchip Technology Inc. DS20005385C-page 35 MCP6V71/1U/2/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X5) X Contact Pad Length (X5) Y Distance Between Pads G Distance Between Pads GX Overall Width Z MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.10 1.70 0.35 3.90 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2091-OT Rev F DS20005385C-page 36  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2015-2020 Microchip Technology Inc. DS20005385C-page 37 MCP6V71/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005385C-page 38  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2015-2020 Microchip Technology Inc. DS20005385C-page 39 MCP6V71/1U/2/4 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.15 C 1 2 2X 0.15 C TOP VIEW 0.10 C C (A3) A SEATING PLANE 8X 0.08 C A1 SIDE VIEW 0.10 C A B D2 L 1 2 0.10 C A B NOTE 1 E2 K N 8X b e 0.10 0.05 C A B C BOTTOM VIEW Microchip Technology Drawing No. C04-129-MN Rev E Sheet 1 of 2 DS20005385C-page 40  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Pins e Pitch A Overall Height A1 Standoff Contact Thickness A3 D Overall Length E Overall Width D2 Exposed Pad Length E2 Exposed Pad Width b Contact Width L Contact Length Contact-to-Exposed Pad K MIN 0.70 0.00 1.35 1.25 0.20 0.25 0.20 MILLIMETERS NOM 8 0.50 BSC 0.75 0.02 0.20 REF 2.00 BSC 3.00 BSC 1.40 1.30 0.25 0.30 - MAX 0.80 0.05 1.45 1.35 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Package is saw singulated 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing No. C04-129-MN Rev E Sheet 2 of 2  2015-2020 Microchip Technology Inc. DS20005385C-page 41 MCP6V71/1U/2/4 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV 8 ØV C Y2 EV Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Thermal Via Diameter V Thermal Via Pitch EV MIN MILLIMETERS NOM 0.50 BSC MAX 1.60 1.50 2.90 0.25 0.85 0.30 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing No. C04-129-MN Rev. B DS20005385C-page 42  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N E 2 E1 2 E1 E 1 2X 7 TIPS 0.20 C B A 2 e TOP VIEW A C A2 A SEATING PLANE 14X 0.10 C 14X b 0.10 A1 A C B A SIDE VIEW SEE DETAIL B VIEW A–A Microchip Technology Drawing C04-087 Rev D Sheet 1 of 2  2015-2020 Microchip Technology Inc. DS20005385C-page 43 MCP6V71/1U/2/4 14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: (ș2) R1 H R2 c L ș1 (L1) (ș3) DETAIL B Number of Terminals Pitch Overall Height Standoff Molded Package Thickness Overall Length Overall Width Molded Package Width Terminal Width Terminal Thickness Terminal Length Footprint Lead Bend Radius Lead Bend Radius Foot Angle Mold Draft Angle Mold Draft Angle Notes: Units Dimension Limits N e A A1 A2 D E E1 b c L L1 R1 R2 ș1 ș2 ș3 MIN – 0.05 0.80 4.90 4.30 0.19 0.09 0.45 0.09 0.09 0° – – MILLIMETERS NOM 14 0.65 BSC – – 1.00 5.00 6.40 BSC 4.40 – – 0.60 1.00 REF – – – 12° REF 12° REF MAX 1.20 0.15 1.05 5.10 4.50 0.30 0.20 0.75 – – 8° – – 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-087 Rev D Sheet 2 of 2 DS20005385C-page 44  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 14Lead Thin Shrink Small Outline Package [ST] 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging G SILK SCREEN C Y X E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Contact Pad Spacing C Contact Pad Width (Xnn) X Contact Pad Length (Xnn) Y Contact Pad to Contact Pad (Xnn) G MIN MILLIMETERS NOM 0.65 BSC 5.90 MAX 0.45 1.45 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2087 Rev D  2015-2020 Microchip Technology Inc. DS20005385C-page 45 MCP6V71/1U/2/4 NOTES: DS20005385C-page 46  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 APPENDIX A: REVISION HISTORY Revision A (March 2015) • Original release of this document. Revision B (September 2015) The following is the list of modifications: • Added new devices to the family: MCP6V72 and MCP6V74, and related information throughout the document. • Added Figure 2-37. • Updated Table 1-3 in Section 3.0 “Pin Descriptions”. • Added markings and specification drawings for the new packages in Section 6.0 “Packaging Information”. • Updated the Product Identification System section with the new packages. Revision C (August 2020) The following is the list of modifications: • Added Table and Notes to Section 6.1 “Package Marking Information” further explaining the package markings on the 5-Lead SOT-23 parts.  2015-2020 Microchip Technology Inc. DS20005385C-page 47 MCP6V71/1U/2/4 NOTES: DS20005385C-page 48  2015-2020 Microchip Technology Inc. MCP6V71/1U/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. [X](1) –X Device Tape and Reel Temperature Range Device: /XX Package MCP6V71T: Single Op Amp (Tape and Reel) (SOT-23 only) MCP6V71UT: Single Op Amp (Tape and Reel) (SC-70, SOT-23) MCP6V72: Dual Op Amp (MSOP, 2x3 TDFN) MCP6V72T: Dual Op Amp (Tape and Reel) (MSOP, 2x3 TDFN) MCP6V74: Quad Op Amp (TSSOP) MCP6V74T: Quad Op Amp (Tape and Reel) (TSSOP) Temperature Range: E Package: LTY* = Plastic Small Outline Transistor, 5-lead SC70 OT = Plastic Small Outline Transistor, 5-lead SOT-23 MNY* = Plastic Dual Flat, No-Lead - 2×3×0.75 mm Body, 8-lead MS = Plastic Micro Small Outline, 8-lead ST = Plastic Thin Shrink Small Outline - 4.4 mm Body, 14-lead Examples: a) MCP6V71T-E/OT: a) MCP6V71UT-E/LTY: Tape and Reel Extended temperature, 5LD SC70 package MCP6V71UT-E/OT: Tape and Reel, Extended temperature, 5LD SOT-23 package b) a) MCP6V72-E/MS: b) MCP6V72T-E/MS: = -40°C to +125°C (Extended) c) *Y Extended temperature, 8LD MSOP package Tape and Reel, Extended temperature, 8LD MSOP package MCP6V72T-E/MNY: Tape and Reel, Extended temperature, 8LD 2x3 TDFN package a) MCP6V74-E/ST: b) MCP6V74T-E/ST: = Nickel palladium gold manufacturing designator. Only available on the SC70 and TDFN packages. Note 1:  2015-2020 Microchip Technology Inc. Tape and Reel, Extended temperature, 5LD SOT-23 package Extended temperature, 14LD TSSOP package Tape and Reel, Extended temperature, 14LD TSSOP package Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005385C-page 49 MCP6V71/1U/2/4 NOTES: DS20005385C-page 50  2015-2020 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights. • Microchip is willing to work with any customer who is concerned about the integrity of its code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015-2020, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2015-2020 Microchip Technology Inc. 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