MCP73113/4
Single-Cell Li-Ion/Li-Polymer Battery Charge Management
Controller with Input Overvoltage Protection
Features:
Description:
• Complete Linear Charge Management Controller:
- Integrated Input Overvoltage Protection
- Integrated Pass Transistor
- Integrated Current Sense
- Integrated Reverse Discharge Protection
• Constant Current/Constant Voltage Operation
with Thermal Regulation
The MCP73113/4 are highly integrated Li-Ion battery
charge management controllers for use in
space-limited and cost-sensitive applications. The
MCP73113/4 devices provide specific charge
algorithms for Li-Ion/Li-Polymer batteries to achieve
optimal capacity and safety in the shortest charging
time possible. Along with their small physical size, the
low number of external components make the
MCP73113/4 ideally suitable for portable applications.
The absolute maximum voltage, up to 18V, allows the
use of MCP73113/4 in harsh environments, such as
low cost wall wart or voltage spikes from plug/unplug.
• 4.15V Undervoltage Lockout (UVLO)
• 18V Absolute Maximum Input with OVP:
- 6.5V (MCP73113)
- 5.8V (MCP73114)
• High Accuracy Preset Voltage Regulation Through
Full Temperature Range (-5°C to +55°C): +0.5%
• Battery Charge Voltage Options:
- 4.10V, 4.20V, 4.35V or 4.4V
• Resistor Programmable Fast Charge Current:
- 130 mA-1100 mA
• Preconditioning of Deeply Depleted Cells:
- Available Options: 10% or Disable
• Integrated Precondition Timer:
- 32 Minutes or Disable
• Automatic End-of-Charge Control:
- Selectable Minimum Current Ratio:
5%, 7.5%, 10% or 20%
- Elapse Safety Timer: 4 HR, 6 HR, 8 HR or
Disable
• Automatic Recharge:
- Available Options: 95% or Disable
• Charge Status Output-Two Style Options
• Soft Start
• Temperature Range: -40°C to +85°C
• Packaging: DFN-10 (3 mm x 3 mm)
Applications:
•
•
•
•
•
•
•
Low-Cost Li-Ion/Li-Poly. Battery Chargers
MP3 Players
Digital Still Camera
Portable Media Players
Handheld Devices
Bluetooth® Headsets
USB Chargers
2009-2013 Microchip Technology Inc.
The MCP73113/4 devices employ a constant current/
constant voltage charge algorithm. The various
charging voltage regulations provide design engineers
flexibility to use in different applications. The fast
charge, constant current value is set with one external
resistor from 130 mA to 1100 mA. The MCP73113/4
devices limit the charge current based on die
temperature during high power or high ambient
conditions. This thermal regulation optimizes the
charge cycle time while maintaining device reliability.
The PROG pin of the MCP73113/4 also serves as
enable pin. When high-impedance is applied, the
MCP73113/4 will be in Standby mode.
The MCP73113/4 devices are fully specified over the
ambient temperature range of -40°C to +85°C. They
are available in a 10-lead, DFN package.
Package Types (Top View)
MCP73113/4
3x3 DFN *
VDD 1
VDD 2
VBAT 3
VBAT 4
NC 5
10 PROG
EP
11
9 VSS
8 VSS
7 STAT
6 NC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
DS20002183E-page 1
MCP73113/4
Typical Application
MCP73113/4 Typical Application
1
AC-DC Adapter
2
CIN
RLED
7
VBAT
VDD
VBAT 4
STAT
PROG
5 NC
VSS
6 NC
TABLE 1:
3
VDD
VSS
COUT
+
10
9
RPROG
AVAILABLE FACTORY PRESET OPTIONS
Preconditioning
Charge Current
Preconditioning
Threshold
Precondition
Timer
Elapse
Timer
End-ofCharge
Control
4.10V
5.8V/6.5V
Disable/10%
66.5%/71.5%
Disable/
32 Minimum
Disable/4 HR/
6 HR/8 HR
4.20V
5.8V/6.5V
Disable/10%
66.5%/71.5%
Disable/
32 Minimum
4.35V
5.8V/6.5V
Disable/10%
66.5%/71.5%
4.40V
5.8V/6.5V
Disable/10%
66.5%/71.5%
Note 1:
2:
3:
4:
5:
6:
7:
8:
–
8
OVP
Charge
Voltage
1-Cell
Li-Ion
Battery
Automatic
Recharge
Output
Status
5%/7.5%/
10%/20%
No/Yes
Type 1/
Type 2
Disable/4 HR/
6 HR/8 HR
5%/7.5%/
10%/20%
No/Yes
Type 1/
Type 2
Disable/
32 Minimum
Disable/4 HR/
6 HR/8 HR
5%/7.5%/
10%/20%
No/Yes
Type 1/
Type 2
Disable/
32 Minimum
Disable/4 HR/
6 HR/8 HR
5%/7.5%/
10%/20%
No/Yes
Type 1/
Type 2
IREG: Regulated fast charge current
VREG: Regulated charge voltage
IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current
ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current
MCP73113: VOVP = 6.5V, MCP73114: VOVP = 5.8V
VRTH/VREG: Recharge threshold; ratio of regulated battery voltage, 0% or 95%. 0% = Disabled
VPTH/VREG: Preconditioning threshold voltage
Output Status: Type 1 Fault Output Status = High Z, Type 2 Fault Output Status = Flashing
TABLE 2:
STANDARD SAMPLE OPTIONS
Part
Number
VREG
OVP
IPREG/IREG
Precharge
Timer
Elapsed
Timer
ITERM/IREG
Auto Recharge
Threshold
(0%=Disabled)
VPTH/VREG
Output
Status
MCP73113-16S/MF
4.10V
6.5V
10%
32 Min.
6 HR
10%
95%
71.5%
Type 1
MCP73113-06S/MF
4.20V
6.5V
10%
32 Min.
6 HR
10%
95%
71.5%
Type 1
MCP73114-0NS/MF 4.20V
5.8V
10%
32 Min.
6 HR
10%
95%
71.5%
Type 1
Note 1:
Customers should contact their distributor, representatives or field application engineer (FAE) for support and samples.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of
this document. Technical support is available through the web site at: http//support.microchip.com.
DS20002183E-page 2
2009-2013 Microchip Technology Inc.
MCP73113/4
Functional Block Diagram
VOREG
DIRECTION
CONTROL
VBAT
VDD
+
CURRENT
LIMIT
-
VREF
G=0.001
PROG
REFERENCE,
BIAS, UVLO,
AND SHDN
VOREG
+
VREF (1.21V)
CA
-
+
UVLO
-
PRECONDITION
+
TERM
+
CHARGE
+
VA
-
5.8V/6.5V
+
CHARGE
CONTROL,
TIMER,
AND
STATUS
LOGIC
-
STAT
VDD
VSS
Input OverVP
95% VREG
+
+
2009-2013 Microchip Technology Inc.
TSD
Thermal Regulation
110°C
VBAT
*Recharge
*Only available on selected options
DS20002183E-page 3
MCP73113/4
NOTES:
DS20002183E-page 4
2009-2013 Microchip Technology Inc.
MCP73113/4
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings†
VDD ................................................................................18.0V
VPROG ..............................................................................6.0V
All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ ............ Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins
Human Body Model (1.5 k in Series with 100 pF)4 kV
Machine Model (200 pF, No Series Resistance) .............300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Voltage Range
VDD
4
—
16
V
Operating Supply Voltage
VDD
4.2
—
6.5
V
Supply Current
ISS
—
4
5.5
µA
Shutdown (VDD < VBAT - 150 mV)
—
700
1500
µA
Charging
—
30
100
µA
Standby (PROG Floating)
—
50
150
µA
Charge Complete; No Battery;
VDD < VSTOP
—
0.5
2
µA
Standby (PROG Floating)
—
0.5
2
µA
Shutdown (VDD < VBAT,
or VDD < VSTOP)
6
17
µA
Charge Complete; VDD is present
Supply Input
Battery Discharge Current
Output Reverse Leakage
Current
IDISCHARGE
Undervoltage Lockout
UVLO Start Threshold
VSTART
4.10
4.15
4.25
V
UVLO Stop Threshold
VSTOP
4.00
4.05
4.15
V
UVLO Hysteresis
VHYS
—
100
—
mV
VOVP
6.4
6.5
6.6
V
MCP73113
5.8
5.9
6.0
V
MCP73114
—
150
—
mV
4.079
4.10
4.121
V
TA = -5°C to 55°C
4.179
4.20
4.221
V
VDD = [VREG(Typical)+1V]
IOUT = 50 mA
Overvoltage Protection
OVP Start Threshold
OVP Hysteresis
VOVPHYS
Voltage Regulation (Constant-Voltage Mode)
Regulated Output Voltage
Options
VREG
4.328
4.35
4.372
V
4.378
4.40
4.422
V
VRTOL
-0.5
—
0.5
%
Line Regulation
VBAT/
VBAT)/VDD|
—
0.05
0.20
%/V
Load Regulation
VBAT/VBAT|
—
0.05
0.20
%
IOUT = 50 mA - 150 mA
VDD = [VREG(Typical)+1V]
PSRR
—
-46
—
dB
IOUT = 20 mA, 10 Hz to 1 kHz
—
-30
—
dB
IOUT = 20 mA, 10 Hz to 10 kHz
Output Voltage Tolerance
Supply Ripple Attenuation
Note 1:
VDD = [VREG(Typical)+1V] to 6V
IOUT = 50 mA
Not production tested. Ensured by design.
2009-2013 Microchip Technology Inc.
DS20002183E-page 5
MCP73113/4
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
BSP Start Threshold
VSHORT
—
1.7
—
V
BSP Hysteresis
VBSPHYS
—
150
—
mV
ISHORT
—
25
—
mA
—
1100
mA
TA = -5°C to +55°C
—
130
—
mA
PROG = 10 k
—
1000
—
mA
PROG = 1.1 k
—
10
—
%
Battery Short Protection
BSP Regulation Current
Current Regulation (Fast Charge, Constant-Current Mode)
Fast Charge Current
Regulation
IREG
Charge Current Tolerance
IRTOL
130
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current Ratio
Precondition Voltage
Threshold Ratio
Precondition Hysteresis
IPREG / IREG
VPTH / VREG
8
10
15
%
PROG = 1 kto 10 k
TA = -5°C to +55°C
—
100
—
%
No Preconditioning
VBAT Low-to-High
64
66.5
69
%
69
71.5
74
%
VPHYS
—
100
—
mV
ITERM / IREG
3.75
5
6.25
%
5.6
7.5
9.4
%
7.5
10
12.5
%
15
20
25
%
93
95.0
97
%
—
0
—
%
RDSON
—
350
—
m
mA
VBAT High-to-Low (Note 1)
Charge Termination
Charge Termination
Current Ratio
PROG = 1 kto 10 k
TA = -5°C to +55°C
Automatic Recharge
Recharge Voltage
Threshold Ratio
VRTH / VREG
VBAT High-to-Low
No Automatic Recharge
Pass Transistor ON-Resistance
ON-Resistance
VDD = 4.5V, TJ = 105°C (Note 1)
Status Indicator – STAT
Sink Current
ISINK
—
20
35
Low Output Voltage
VOL
—
0.2
0.5
V
ISINK = 4 mA
Input Leakage Current
ILK
—
0.001
1
A
High-Impedance, VDD on pin
PROG Input
Charge Impedance Range
RPROG
1
—
21
k
Shutdown Impedance
RPROG
70
200
—
k
PROG Voltage Range
VPROG
0
—
5
V
Automatic Power Down
Entry Threshold
VPDENTRY
VBAT +
10 mV
VBAT +
50 mV
—
V
2.3V < VBAT < VREG
VDD Falling
Automatic Power Down
Exit Threshold
VPDEXIT
—
VBAT +
150 mV
VBAT +
250 mV
V
2.3V < VBAT < VREG
VDD Rising
Die Temperature
TSD
—
150
—
C
Die Temperature
Hysteresis
TSDHYS
—
10
—
C
Impedance for Shutdown
Automatic Power Down
Thermal Shutdown
Note 1:
Not production tested. Ensured by design.
DS20002183E-page 6
2009-2013 Microchip Technology Inc.
MCP73113/4
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 6V, TA=-40°C to +85°C.
Typical values are at +25°C, VDD= [VREG(Typical)+1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Elapsed Timer
Elapsed Timer Period
tELAPSED
—
0
—
Hours
3.6
4.0
4.4
Hours
5.4
6.0
6.6
Hours
7.2
8.0
8.8
Hours
Timer Disabled
Preconditioning Timer
Preconditioning Timer Period
tPRECHG
—
0
—
Hours
0.4
0.5
0.6
Hours
Disabled Timer
Status Indicator
Status Output turn-off delay
tOFF
—
—
500
µs
ISINK = 1 mA to 0 mA
(Note 1)
Status Output turn-on delay
tON
—
—
500
µs
ISINK = 0 mA to 1 mA
(Note 1)
Note 1:
Not production tested. Ensured by design.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
TA
-40
—
+85
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
64
—
°C/W
JC
—
12
—
°C/W
Conditions
Temperature Ranges
Specified Temperature Range
Thermal Package Resistances
Thermal Resistance, DFN-10 (3x3)
2009-2013 Microchip Technology Inc.
4-Layer JC51-7 Standard Board,
Natural Convection
DS20002183E-page 7
MCP73113/4
NOTES:
DS20002183E-page 8
2009-2013 Microchip Technology Inc.
MCP73113/4
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
4.220
ILOAD = 50 mA
VBAT = 4.2V
TA = +25 C
4.215
4.210
4.205
4.200
4.195
4.190
4.185
4.180
4.5
4.8
5.0
5.3
5.5
5.8
Battery Regulation Voltage (V)
Battery Regulation Voltage (V)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 50 mA and TA= +25°C, Constant-Voltage mode.
4.220
4.215
4.210
4.205
4.200
4.195
4.190
4.185
ILOAD = 150 mA
VDD = 5.2V
4.180
4.175
4.170
6.0
-5
5
4.220
I LOAD = 150 mA
VBAT = 4.2V
TA = +25°C
4.210
4.205
4.200
4.195
4.190
4.185
4.180
4.5
4.8
5.1
5.4
5.7
VDD = 5.2V
TA = +25°C
Charge Current (mA)
Battery Regulation Voltage (V)
FIGURE 2-5:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
4.215
4.210
4.205
4.200
4.195
4.190
4.185
ILOAD = 50 mA
VDD = 5.2V
4.170
5
15
25
35
45
55
Ambient Temperature (°C)
FIGURE 2-3:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
2009-2013 Microchip Technology Inc.
55
Programming Resistor (kΩ)
4.220
-5
45
1 2 3 4 5 6 7 8 9 10 1112 13 141516 1718 1920
6.0
FIGURE 2-2:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
4.175
35
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
Supply Voltage (V)
4.180
25
FIGURE 2-4:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
Charge Current (mA)
Battery Regulation Voltage (V)
FIGURE 2-1:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
4.215
15
Ambient Temperature (°C)
Supply Voltage (V)
950
930
910
890
870
850
830
810
790
770
750
RPROG = 1.33 kΩ
TA = +25°C
4.5
4.8
5.1
5.4
5.7
6.0
Supply Voltage (V)
FIGURE 2-6:
Charge Current (IOUT) vs.
Supply Voltage (VDD).
DS20002183E-page 9
MCP73113/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
675
655
635
615
595
575
555
535
515
495
475
Charge Curent (mA)
Charge Current (mA)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-Voltage mode.
RPROG = 2 kΩ
TA = +25°C
4.5
4.8
5.1
5.4
5.7
6.0
80
77
74
71
68
65
62
59
56
53
50
RPROG = 20 kΩ
TA = +25°C
4.5
4.8
Supply Voltage (V)
5.4
5.7
6.0
FIGURE 2-10:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
950
350
330
310
290
270
250
230
210
190
170
150
930
Charge Current (mA)
Charge Current (mA)
FIGURE 2-7:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
RPROG = 5 kΩ
TA = +25°C
910
890
870
850
830
810
RPROG = 1.33 kΩ
VDD = 5.2V
790
770
750
4.5
4.8
5.1
5.4
5.7
6.0
-5
Supply Voltage (V)
RPROG = 10 kΩ
TA = +25°C
4.5
4.8
5.1
5.4
5.7
6.0
Supply Voltage (V)
FIGURE 2-9:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
DS20002183E-page 10
15
25
35
45
55
FIGURE 2-11:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
Discharge Current (uA)
150
144
138
132
126
120
114
108
102
96
90
5
Ambient Temperature (°C)
FIGURE 2-8:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
Fast Charge (mA)
5.1
Supply Voltage (V)
9.0
8.0
7.0
6.0
5.0 End of Charge
4.0
3.0
2.0
VDD < VBAT
1.0
0.0 VDD < VSTOP
-1.0
-5.0
5.0
15.0
25.0
35.0
45.0
55.0
Ambient Temperature (°C)
FIGURE 2-12:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
2009-2013 Microchip Technology Inc.
MCP73113/4
TYPICAL PERFORMANCE CURVES (CONTINUED)
Battery Voltage (V)
Charge Current
Input Voltage
Battery Voltage
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
1.0
0.5
0.0
0
FIGURE 2-13:
(50 ms/Div).
Overvoltage Protection Start
Input Voltage
0.2
0.1
0
R PROG = 2 kΩ
875 mAh Battery
15
30
45
60
75
90
Time (Minutes)
Supply Current (A)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant-Voltage mode.
105 120
FIGURE 2-16:
Complete Charge Cycle
(875 mAh Li-Ion Battery.
Source Voltage (V)
Battery Voltage
Charge Current
Output Ripple (V)
FIGURE 2-14:
(50 ms/Div).
Overvoltage Protection Stop
FIGURE 2-17:
Line Transient Response
(ILOAD = 10 mA, Output: 1.0V/Div,
Source: 2.0V/Div).
Output Ripple (mV)
Source Voltage (V)
Output Ripple (V)
Output Current (mA)
FIGURE 2-15:
Load Transient Response
(ILOAD = 50 mA, Output: 100 mV/Div,
Time: 100 µs/Div).
2009-2013 Microchip Technology Inc.
FIGURE 2-18:
Line Transient Response
(ILOAD = 100 mA, Output: 1.0V/Div,
Source: 2.0V/Div).
DS20002183E-page 11
MCP73113/4
NOTES:
DS20002183E-page 12
2009-2013 Microchip Technology Inc.
MCP73113/4
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
MCP73113/4
DFN-10
1, 2
3.1
PIN FUNCTION TABLES
Symbol
I/O
Function
VDD
I
3, 4
VBAT
I/O
Battery Management Input Supply
Battery Charge Control Output
5, 6
NC
—
No Connection
7
STAT
O
Battery Charge Status Output
8, 9
VSS
—
Battery Management 0V Reference
10
PROG
I/O
Battery Charge Current Regulation Program and Charge Control Enable
11
EP
—
Exposed Pad
Battery Management Input Supply
(VDD)
A supply voltage of [VREG (Typical) + 0.3V] to 6.0V is
recommended. Bypass to VSS with a minimum of 1 µF.
The VDD pin is rated 18V absolute maximum to prevent
sudden rise of input voltage from spikes or low-cost
AC-DC wall adapter.
3.2
Battery Charge Control Output
(VBAT)
Connect to the positive terminal of the battery. Bypass
to VSS with a minimum of 1 µF to ensure loop stability
when the battery is disconnected.
3.3
No Connect (NC)
No connect.
3.4
Battery Management 0V Reference
(VSS)
3.6
Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from
PROG to VSS during Constant-Current (CC) mode.
PROG pin is rated up to 5V with 6V absolute maximum
value.
The PROG pin also serves as a charge control enable
pin. Allowing the PROG pin to float or connecting the
pin to an impedance greater than 200 k will disable
the MCP73113/4 charger. Refer to Section 5.5
“Constant Current MODE – Fast Charge” for
details.
3.7
Exposed Pad (EP)
The Exposed Thermal Pad (EP) should be connected
to the exposed copper area on the Printed Circuit
Board (PCB) to enhance thermal power dissipation.
Additional vias on the copper area under the
MCP73113/4 device will improve the performance of
heat dissipation and simplify the assembly process.
Connect to the negative terminal of the battery and
input supply.
3.5
Status Output (STAT)
STAT is an open-drain logic output for connection to an
LED for charge status indication in stand-alone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-2 for a summary of the status output during a
charge cycle.
2009-2013 Microchip Technology Inc.
DS20002183E-page 13
MCP73113/4
NOTES:
DS20002183E-page 14
2009-2013 Microchip Technology Inc.
MCP73113/4
4.0
DEVICE OVERVIEW
The MCP73113/4 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the
operational flow algorithm.
SHUTDOWN MODE
VDD < VUVLO
VDD < VPD
or
PROG > 200 k
STAT = high Z
VBAT < VPTH
VDD < VOVP
PRECONDITIONING MODE
Charge Current = IPREG
STAT = LOW
Timer Reset
Timer Enable
Timer Expired
TIMER FAULT
No Charge Current
STAT = Flashing (Type 2)
STAT = high Z (Type 1)
Timer Suspended
VDD > VOVP
VDD > VOVP
VBAT > VPTH
VBAT > VPTH
FAST CHARGE MODE
Charge Current = IREG
STAT = LOW
Timer Reset
Timer Enabled
OVERVOLTAGE PROTECTION
No Charge Current
STAT = high Z
Timer Suspended
VDD < VOVP
VDD > VOVP
VDD < VOVP
VBAT = VREG
Timer Expired
VBAT < VRTH
TIMER FAULT
No Charge Current
STAT = Flashing (Type 2)
STAT = high Z (Type 1)
Timer Suspended
CONSTANT VOLTAGE MODE
Charge Voltage = VREG
STAT = LOW
VBAT < ITERM
Die Temperature < TSDHYS
Charge Mode Resume
CHARGE COMPLETE MODE
No Charge Current
STAT = high Z
Timer Reset
Die Temperature > TSD
VBAT < VSHORT
TEMPERATURE FAULT
No Charge Current
STAT = Flashing (Type 2)
STAT = high Z (Type 1)
Timer Suspended
FIGURE 4-1:
VBAT > VSHORT
Charge Mode Resume
BATTERY SHORT PROTECTION
Charge Current = ISHORT
STAT = Flashing (Type 2)
STAT = high Z (Type 1)
Timer Suspended
The MCP73113/4 Flowchart.
2009-2013 Microchip Technology Inc.
DS20002183E-page 15
MCP73113/4
NOTES:
DS20002183E-page 16
2009-2013 Microchip Technology Inc.
MCP73113/4
5.0
DETAILED DESCRIPTION
5.3.2
5.1
Undervoltage Lockout (UVLO)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73113/4
devices provide constant current and voltage
regulation to the battery pack by controlling this
MOSFET in the linear region. The battery charge
control output should be connected to the positive
terminal of the battery pack.
An internal undervoltage lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
Shutdown mode until the input supply rises above the
UVLO threshold. In the event a battery is present when
the input power is applied, the input supply must rise
approximately 150 mV above the battery voltage
before the MCP73113/4 device becomes operational.
The UVLO circuit places the device in Shutdown mode
if the input supply falls to approximately 150 mV above
the battery voltage.The UVLO circuit is always active.
At any time, the input supply is below the UVLO
threshold or approximately 150 mV of the voltage at the
VBAT pin, the MCP73113/4 device is placed in a
Shutdown mode.
5.2
Overvoltage Protection (OVP)
An internal overvoltage protection (OVP) circuit
monitors the input voltage and keeps the charger in
Shutdown mode when the input supply rises above the
OVP threshold. The hysteresis of OVP is
approximately 150 mV for the MCP73113/4 device.
The MCP73113/4 device is operational between UVLO
and OVP threshold. The OVP circuit is also recognized
as overvoltage lockout (OVLO).
5.3
Charge Qualification
When the input power is applied, the input supply must
rise 150 mV above the battery voltage before the
MCP73113/4 becomes operational.
The automatic power-down circuit places the device in
a Shutdown mode if the input supply falls to within
+50 mV of the battery voltage.
The automatic circuit is always active. At any time the
input supply is within +50 mV of the voltage at the
VBAT pin, the MCP73113/4 is placed in a Shutdown
mode.
For a charge cycle to begin, the automatic powerdown conditions must be met and the charge enable
input must be above the input high threshold.
5.3.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supply to the MCP73113/4.
The MCP73113/4 automatically enters a Power-Down
mode if the voltage on the VDD input falls to within
+50 mV of the battery voltage. This feature prevents
draining the battery pack when the VDD supply is not
present.
2009-2013 Microchip Technology Inc.
5.3.3
BATTERY CHARGE CONTROL
OUTPUT (VBAT)
BATTERY DETECTION
The MCP73113/4 detects the battery presence by
monitoring the voltage at VBAT. The charge flow will initiate when the voltage on VBAT is below the VRECHARGE
threshold. Refer to Section 1.0 “Electrical Characteristics” for VRECHARGE values. The value will be the
same for the non-rechargeable device.
When VBAT > VREG + hysteresis, the charge will be
suspended or not started, depending on the current
charge status, to prevent overcharging.
5.4
Preconditioning
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73113/4 device
enters a Preconditioning mode. The preconditioning
threshold is factory set. Refer to Section 1.0
“Electrical Characteristics” for preconditioning
threshold options.
In this mode, the MCP73113/4 device supplies 10% of
the fast charge current (established with the value of
the resistor connected to the PROG pin) to the battery.
When the voltage at the VBAT pin rises above the preconditioning threshold, the MCP73113/4 device enters
the constant current (Fast Charge) mode.
Note:
5.4.1
The MCP73113/4 also offer options with
no preconditioning.
TIMER EXPIRED DURING
PRECONDITIONING MODE
If the internal timer expires before the voltage threshold
is reached for Fast Charge mode, a timer fault is
indicated and the charge cycle terminates. The
MCP73113/4 device remains in this condition until the
battery is removed or input power is cycled. If the
battery is removed, the MCP73113/4 device enters the
Standby mode where it remains until a battery is
reinserted.
Note:
The typical preconditioning timer for
MCP73113/4 is 32 minutes. The
MCP73113/4 also offer options with no
preconditioning timer.
DS20002183E-page 17
MCP73113/4
5.5
Constant Current MODE – Fast
Charge
During the Constant-Current mode, the programmed
charge current is supplied to the battery or load.
The charge current is established using a single
resistor from PROG to VSS. The program resistor and
the charge current are calculated using the following
equations:
EQUATION 5-1:
I REG = 1104 R
– 0.93
Where:
RPROG
=
kilo-ohms (k)
IREG
=
milliampere (mA)
5.5.1
TIMER EXPIRED DURING
CONSTANT CURRENT – FAST
CHARGE MODE
If the internal timer expires before the recharge voltage
threshold is reached, a timer fault is indicated and the
charge cycle terminates. The MCP73113/4 device
remains in this condition until the battery is removed. If
the battery is removed or input power is cycled, the
MCP73113/4 device enters the Standby mode where it
remains until a battery is reinserted.
5.6
Constant-Voltage Mode
When the voltage at the VBAT pin reaches the
regulation voltage, VREG, constant voltage regulation
begins. The regulation voltage is factory set to 4.10V,
4.20V, 4.35V or 4.40V with a tolerance of ±0.5%.
EQUATION 5-2:
RPROG = 10^
Constant-Current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When Constant-Current mode is invoked, the internal
timer is reset.
(log(IREG)/(-0.93))log
1104
Where:
RPROG
=
kilo-ohms (k)
IREG
=
milliampere (mA)
5.7
Table 5-1 provides commonly seen E96 (1%) and E24
(5%) resistors for various charge current to reduce
design time.
TABLE 5-1:
RESISTOR LOOK-UP TABLE
Charge
Recommended Recommended
Current (mA) E96 Resistor () E24 Resistor ()
130
10k
10k
150
8.45k
8.20k
200
6.20k
6.20k
250
4.99k
5.10k
300
4.02k
3.90k
350
3.40k
3.30k
400
3.00k
3.00k
450
2.61k
2.70k
500
2.32k
2.37k
550
2.10k
2.20k
600
1.91k
2.00k
650
1.78k
1.80k
700
1.62k
1.60k
750
1.50k
1.50k
800
1.40k
1.50k
850
1.33k
1.30k
900
1.24k
1.20k
950
1.18k
1.20k
1000
1.10k
1.10k
1100
1.00k
1.00k
DS20002183E-page 18
Charge Termination
The charge cycle is terminated when, during ConstantVoltage mode, the average charge current diminishes
below a threshold established with the value of 5%,
7.5%, 10% or 20% of fast charge current or internal
timer has expired. A 1 ms filter time on the termination
comparator ensures that transient load conditions do
not result in premature charge cycle termination. The
timer period is factory set and can be disabled. Refer to
Section 1.0, "Electrical Characteristics" for timer
period options.
5.8
Automatic Recharge
The MCP73113/4 device continuously monitors the
voltage at the VBAT pin in the Charge Complete mode.
If the voltage drops below the recharge threshold,
another charge cycle begins and current is once again
supplied to the battery or load. The recharge threshold
is factory set. Refer to Section 1.0, "Electrical
Characteristics" for recharge threshold options.
Note:
The MCP73113/4 also offer options with
no automatic recharge.
For the MCP73113/4 devices with no recharge option,
the MCP73113/4 will go into Standby mode when a
termination condition is met. The charge will not restart
until at least one of the following conditions have been
met:
• Battery is removed from the system and inserted
again
• VDD is removed and plugged in again
• RPROG is disconnected (or high-impedance) and
reconnected
2009-2013 Microchip Technology Inc.
MCP73113/4
5.9
Thermal Regulation
The MCP73113/4 shall limit the charge current based
on the die temperature. The thermal regulation
optimizes the charge cycle time while maintaining
device reliability. Figure 5-1 depicts the thermal
regulation for the MCP73113/4 device. Refer to
Section 1.0 “Electrical Characteristics” for thermal
package resistances and Section 6.1.1.2 “Thermal
Considerations” for calculating power dissipation.
TABLE 5-2:
STATUS OUTPUTS
CHARGE CYCLE STATE
high Z
Standby
high Z
Preconditioning
L
Constant Current Fast
Charge
L
Constant Voltage
Charge Complete - Standby
.
Charge Current (mA)
600
100
25 35 45 55 65 75 85 95 105 115 125 135 145
Junction Temperature (°C)
FIGURE 5-1:
Charge Current (IOUT) vs.
Junction Temperature (TJ).
Thermal Shutdown
The MCP73113/4 suspends the charge if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by
approximately 10°C. The thermal shutdown is a
secondary safety feature in the event that there is a
failure within the thermal regulation circuitry.
5.11
Timer Fault
1.6 second 50% D.C.
Flashing (Type 2)
high Z (Type 1)
Preconditioning Timer Fault
1.6 second 50% D.C.
Flashing (Type 2)
high Z (Type 1)
VDD = 5.2V
RPROG = 2 kΩ
0
5.10
1.6 second 50% D.C.
Flashing (Type2)
high Z (Type 1)
300
200
L
high Z
Temperature Fault
500
400
STAT
Shutdown
5.12
Battery Short Circuit Protection
When a single-cell Li-Ion battery is detected, an internal battery short circuit protection (BSP) circuit starts
monitoring the battery voltage. When VBAT is below the
typical 1.7V battery short circuit protection threshold
voltage, the charging behavior is postponed. A 25 mA
(typical) detection current is supplied for recovering
from the battery short circuit condition.
Preconditioning mode resumes when VBAT raises
above the battery short circuit protection threshold. The
battery voltage must rise approximately 150 mV above
the battery short circuit protection voltage before the
MCP73113/4 device becomes operational.
Status Indicator
The charge status outputs are open-drain outputs with
two different states: Low (L), and High-Impedance
(high-Z). The charge status outputs can be used to
illuminate LEDs. Optionally, the charge status outputs
can be used as an interface to a host microcontroller.
Table 5-2 summarizes the state of the status outputs
during a charge cycle.
2009-2013 Microchip Technology Inc.
DS20002183E-page 19
MCP73113/4
NOTES:
DS20002183E-page 20
2009-2013 Microchip Technology Inc.
MCP73113/4
6.0
APPLICATIONS
The MCP73113/4 devices are designed to operate
with a host microcontroller or in stand-alone applications. The MCP73113/4 provides the preferred charge
algorithm for Lithium-Ion and Lithium-Polymer cells
Constant-current followed by Constant-voltage.
Figure 6-1 depicts a typical stand-alone application
circuit, while Figure 6-2 depicts the accompanying
charge profile.
MCP73113/4 Typical Application
1
AC-DC Adapter
2
CIN
FIGURE 6-1:
RLED
VBAT
VDD
VBAT 4
STAT
VSS 9
6 NC
8
VSS
+
10
5 NC
6.1.1
1
RPROG
1-Cell
Li-Ion
Battery
–
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
0.9
4.0
0.8
3.5
0.7
3.0
0.6
2.5
0.5
2.0
0.4
6.1.1.1
1.5
0.3
1.0
0.2
The preferred fast charge current for Li-Ion/Li-Poly cells
is below the 1C rate, with an absolute maximum current
at the 2C rate. The recommended fast charge
current should be obtained from the battery
manufacturer. For example, a 500 mAh battery pack
with 0.7C preferred fast charge current has a charge
current of 350 mA. Charging at this rate provides the
shortest charge cycle times without degradation to the
battery pack performance or life.
Supply Current (A)
4.5
RPROG = 2 K
875 mAh Battery
0.5
0.1
0
0.0
0
15
30
45
60
75
90
Time (Minutes)
105 120
FIGURE 6-2:
Typical Charge Profile
(875 mAh Battery).
6.1
PROG
COUT
Typical Application Circuit.
5.0
Battery Voltage (V)
7
3
VDD
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from the
Preconditioning mode to the Constant-Current mode.
In this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
2009-2013 Microchip Technology Inc.
Note:
Charge Current
Please consult with your battery supplier
or refer to the battery data sheet for
preferred charge rate.
DS20002183E-page 21
MCP73113/4
6.1.1.2
Thermal Considerations
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from the
Preconditioning mode to the Constant-Current mode.
In this case, the power dissipation is:
PowerDissipation = V
DDMAX
–V
PTHMIN
I
REGMAX
Where:
VDDMAX
=
the maximum input voltage
IREGMAX
=
the maximum fast charge current
VPTHMIN
=
the minimum transition threshold
voltage
Power dissipation with a 5V, ±10% input voltage
source, 500 mA ±10% and preconditioning threshold
voltage at 2.7V is:
A minimum of 1 µF, is recommended for both the output
capacitor and the input capacitor for typical applications.
TABLE 6-1:
MLCC
Capacitors
Temperature
Range
Tolerance
X7R
-55C to +125C
±15%
X5R
-55C to +85C
±15%
Virtually any good quality output filter capacitor can be
used, independent of the capacitor’s minimum
Effective Series Resistance (ESR) value. The actual
value of the capacitor (and its associated ESR)
depends on the output load current. A 1 µF ceramic,
tantalum or aluminum electrolytic capacitor at the
output is usually sufficient to ensure stability.
6.1.1.4
EQUATION 6-1:
PowerDissipation = 5.5V – 2.7V 550mA = 1.54W
MLCC CAPACITOR EXAMPLE
Reverse-Blocking Protection
The MCP73113/4 provide protection from a faulted or
shorted input. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
This power dissipation with the battery charger in the
DFN-10 package will result approximately 63C above
room temperature.
6.1.1.3
External Capacitors
The MCP73113/4 are stable with or without a battery
load. In order to maintain good AC stability in the
Constant-Voltage mode, a minimum capacitance of
1 µF is recommended to bypass the VBAT pin to VSS.
This capacitance provides compensation when there is
no battery load. In addition, the battery and
interconnections appear inductive at high frequencies.
These elements are in the control feedback loop during
Constant-Voltage mode. Therefore, the bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
DS20002183E-page 22
2009-2013 Microchip Technology Inc.
MCP73113/4
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
recommended to minimize voltage drops along the
high current-carrying PCB traces.
If the PCB layout is used as a heat sink, adding many
vias in the heat sink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figure 6-4 and Figure 6-5 depict
a typical layout with PCB heat sinking.
FIGURE 6-5:
FIGURE 6-3:
Typical Layout (Top).
FIGURE 6-4:
Typical Layout (Top Metal).
2009-2013 Microchip Technology Inc.
Typical Layout (Bottom).
DS20002183E-page 23
MCP73113/4
NOTES:
DS20002183E-page 24
2009-2013 Microchip Technology Inc.
MCP73113/4
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
Example:
10-Lead DFN (3x3)
Standard *
XXXX
Part Number
YYWW
MCP73113-06SI/MF
MCP73113-16SI/MF
MCP73114-0NSI/MF
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Code
93HI
83HI
9MHI
93HI
1229
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2009-2013 Microchip Technology Inc.
DS20002183E-page 25
MCP73113/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002183E-page 26
2009-2013 Microchip Technology Inc.
MCP73113/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2013 Microchip Technology Inc.
DS20002183E-page 27
MCP73113/4
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002183E-page 28
2009-2013 Microchip Technology Inc.
MCP73113/4
APPENDIX A:
REVISION HISTORY
Revision E (November 2013)
The following is the list of modifications:
1.
2.
3.
Updated the Functional Block Diagram.
Updated FIGURE 4-1: “The MCP73113/4
Flowchart.”
Minor typographical edits.
Revision D (February 2013)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
9.
Updated the Functional Block Diagram.
Updated the DC Characteristics table.
Updated the Temperature Specifications table.
Updated Section 3.6 “Current Regulation Set
(PROG)”.
Updated Section 3.7 “Exposed Pad (EP)”.
Updated Section 5.3.3 “Battery Detection”.
Updated Equation 5-2.
Updated Section 5.12 “Battery Short Circuit
Protection”.
Updated Section 6.1.1.3 “External Capacitors”.
Revision C (January 2010)
The following is the list of modifications:
1.
DC Characteristics table: Removed the
minimum and maximum values for the BSP Start
Threshold parameter.
Revision B (July 2009)
The following is the list of modifications:
1.
2.
3.
4.
Added MCP73114 device throughout the
document.
Updated specifications for the MCP73113/4
device family throughout the document.
Updated package marking information.
Updated the Product Identification System
page.
Revision A (May 2009)
• Original Release of this Document.
2009-2013 Microchip Technology Inc.
DS20002183E-page 29
MCP73113/4
NOTES:
DS20002183E-page 30
2009-2013 Microchip Technology Inc.
MCP73113/4
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
XX
Device
Temperature
Range
Package
Device:
MCP73113:
MCP73113T:
MCP73114:
MCP73114T:
Single-Cell Li-Ion/Li-Polymer Battery device
Single-Cell Li-Ion/Li-Polymer Battery device,
Tape and Reel
Single-Cell Li-Ion/Li-Polymer Battery device
Single-Cell Li-Ion/Li-Polymer Battery device,
Tape and Reel
Examples:
a) MCP73113-06SI/MF:
Single-Cell Li-Ion/Li-Polymer
Battery device
b) MCP73113-16SI/MF: Single-Cell Li-Ion/Li-Polymer
Battery device
c) MCP73113T-06SI-MF: Tape and Reel,
Single-Cell Li-Ion/Li-Polymer
Battery device
d) MCP73113T-16SI/MF: Tape and Reel,
Single-Cell Li-Ion/Li-Polymer
Battery device
a) MCP73114-0NSI/MF:
Temperature
Range:
I
Package:
MF
= -40C to +85C (Industrial)
Single-Cell Li-Ion/Li-Polymer
Battery device
b) MCP73114T-0NSI/MF: Tape and Reel,
Single-Cell Li-Ion/Li-Polymer
Battery device
= Plastic Dual Flat No Lead, 3x3 mm Body (DFN),
10-Lead
2009-2013 Microchip Technology Inc.
DS20002183E-page 31
MCP73113/4
NOTES:
DS20002183E-page 32
2009-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2004-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077--695-7
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2004-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20002183E-page 33
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
DS20002183E-page 34
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Germany - Pforzheim
Tel: 49-7231-424750
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Italy - Venice
Tel: 39-049-7625286
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Poland - Warsaw
Tel: 48-22-3325737
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/28/13
2009-2013 Microchip Technology Inc.
