MCP73213
Dual-Cell Li-Ion/Li-Polymer Battery Charge Management
Controller with Input Overvoltage Protection
Features
Description
• Complete Linear Charge Management Controller:
- Integrated Input Overvoltage Protection
- Integrated Pass Transistor
- Integrated Current Sense
- Integrated Reverse Discharge Protection
• Constant Current/Constant Voltage Operation
with Thermal Regulation
• 4.15V Undervoltage Lockout (UVLO)
• 13V Input Overvoltage Protection
• High Accuracy Preset Voltage Regulation through
Full Temperature Range (–5°C to +55°C ±0.6%)
• Battery Charge Voltage Options:
- 8.20V, 8.40V, 8.7V or 8.8V
• Resistor Programmable Fast Charge Current:
- 130 mA-1100 mA
• Preconditioning of Deeply Depleted Cells:
- Available Options: 10% or Disable
• Integrated Precondition Timer:
- 32 Minutes or Disable
• Automatic End-of-Charge Control:
- Selectable Minimum Current Ratio:
5%, 7.5%, 10% or 20%
- Elapse Safety Timer: 4 hr., 6 hr., 8 hr. or
Disable
• Automatic Recharge:
- Available Options: 95% or Disable
• Factory Preset Charge Status Output:
- On/Off or Flashing
• Soft Start
• Temperature Range: –40°C to +85°C
• Packaging: DFN-10 (3 mm x 3 mm)
The MCP73213 is a highly integrated Li-Ion battery
charge management controller for use in space-limited
and cost-sensitive applications. The MCP73213
provides specific charge algorithms for dual-cell Li-Ion/
Li-Polymer batteries to achieve optimal capacity and
safety in the shortest charging time possible. Along
with its small physical size, the low number of external
components makes the MCP73213 ideally suitable for
portable applications. The absolute maximum voltage,
up to 18V, allows the use of MCP73213 in harsh
environments, such as low-cost wall wart or voltage
spikes from plug/unplug.
The MCP73213 employs a constant current/constant
voltage charge algorithm. The various charging voltage
regulations provide design engineers flexibility to use in
different applications. The fast charge, constant current
value is set with one external resistor from 130 mA to
1100 mA. The MCP73213 limits the charge current
based on die temperature during high-power or highambient conditions. This thermal regulation optimizes
the charge cycle time while maintaining device
reliability.
The PROG pin of the MCP73213 also serves as enable
pin. When high impedance is applied, the MCP73213
will be in Standby mode.
The MCP73213 is fully specified over the ambient
temperature range of -40°C to +85°C. The MCP73213
is available in a 10-lead DFN package.
Applications
•
•
•
•
•
•
•
Digital Camcorders
Portable Media Players
Ultra Mobile Personal Computers
Netbook Computers
Handheld Devices
Walkie-Talkie
Low-Cost 2-Cell Li-Ion/Li-Poly Chargers/Cradles
2009-2018 Microchip Technology Inc.
Package Types (Top View)
MCP73213
3x3 DFN *
VDD
VDD
VBAT
VBAT
NC
1
2
3
4
5
EP
11
10
9
8
7
6
PROG
VSS
VSS
STAT
NC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
DS20002190D-page 1
MCP73213
Typical Application
2
CIN
RLED
7
VDD
VDD
STAT
5 NC
6 NC
DS20002190D-page 2
VBAT
VBAT
MCP73213
1
AC-DC-Adapter
PROG
VSS
VSS
3
+
4
COUT
2-Cell
Li-Ion
Battery
10
9
8
RPROG
-
2009-2018 Microchip Technology Inc.
2009-2018 Microchip Technology Inc.
TABLE 1:
AVAILABLE FACTORY PRESET OPTIONS
Charge
Voltage
OVP
Preconditioning
Charge Current
Preconditioning
Threshold
Precondition
Timer
Elapse
Timer
End-of-Charge
Control
Automatic
Recharge
Output
Status
8.2V
13V
Disable/10%
66.5%/71.5%
Disable/
32 Minimum
Disable/4 hr/
6 hr/8 hr
5%/7.5%/
10%/20%
No/
Yes
Type 1/
Type 2
8.4V
13V
Disable/10%
66.5%/71.5%
Disable/
32 Minimum
Disable/4 hr/
6 hr/8 hr
5%/7.5%/
10%/20%
No/
Yes
Type 1/
Type 2
8.7V
13V
Disable/10%
66.5%/71.5%
Disable/
32 Minimum
Disable/4 hr/
6 hr/8 hr
5%/7.5%/
10%/20%
No/
Yes
Type 1/
Type 2
8.8V
13V
Disable/10%
66.5%/71.5%
Disable/
32 Minimum
Disable/4 hr/
6 hr/8 hr
5%/7.5%/
10%/20%
No/
Yes
Type 1/
Type 2
Note 1:
2:
3:
4:
5:
6:
7:
TABLE 2:
IREG: Regulated fast charge current.
VREG: Regulated charge voltage.
IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current.
ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current.
VRTH/VREG: Recharge threshold; ratio of regulated battery voltage.
VPTH/VREG: Preconditioning threshold voltage.
Type 1: On/Off; Type 2: Flashing. Please refer to Table 5-2.
STANDARD SAMPLE OPTIONS
Part
Number
VREG
OVP
IPREG/IREG
Precharge
Timer
Elapse
Timer
ITERM/IREG
VRTH/VREG
VPTH/VREG
Output
Status
MCP73213-B6S/MF
8.20V
13V
10%
32 Minimum
6 hr
10%
95%
71.5%
Type 1
MCP73213-A6S/MF
8.40V
13V
10%
32 Minimum
6 hr
10%
95%
71.5%
Type 1
Note 1:
Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample. Local sales offices are also available to help customers. A listing of sales offices and locations is included at the back of this document. Technical support is available through the web site
at: http://www.microchip.com/support
MCP73213
DS20002190D-page 3
MCP73213
Functional Block Diagram
VOREG
DIRECTION
CONTROL
VBAT
VDD
+
CURRENT
LIMIT
-
VREF
G=0.001
PROG
REFERENCE,
BIAS, UVLO,
AND SHDN
VOREG
+
VREF (1.21V)
CA
-
+
UVLO
-
PRECONDITION
+
TERM
+
CHARGE
+
VA
-
13V
+
CHARGE
CONTROL,
TIMER,
AND
STATUS
LOGIC
-
STAT
VDD
VSS
Input OverVP
+
Thermal Regulation
DS20002190D-page 4
95% VREG
+
TSD
-
110°C
VBAT
*Recharge
*Only available on selected options
2009-2018 Microchip Technology Inc.
MCP73213
1.0
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
VDD......................................................................18.0V
VPROG ...................................................................6.0V
All Inputs and Outputs w.r.t. VSS .....-0.3 to (VDD+0.3)V
Maximum Junction Temperature, TJ . Internally Limited
Storage Temperature ........................ –65°C to +150°C
ESD Protection on All Pins 4 kV HBM
ESD Protection on All Pins 300V MM
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Input
Input Voltage Range
VDD
4
—
16
V
Operating Supply Voltage
VDD
4.2
—
13
V
Supply Current
ISS
—
4
5.5
μA
Shutdown (VDD ≤ VBAT – 150 mV)
—
700
1500
μA
Charging
—
50
125
μA
Standby (PROG Floating)
—
50
150
μA
Charge Complete; No Battery;
VDD < VSTOP
—
0.5
2
μA
Standby (PROG Floating)
—
0.5
2
μA
Shutdown (VDD ≤ VBAT
or VDD < VSTOP)
—
10
17
μA
Charge Complete; VDD is present
Battery Discharge Current
Output Reverse Leakage
Current
IDISCHARGE
Undervoltage Lockout
UVLO Start Threshold
VSTART
4.10
4.15
4.25
V
UVLO Stop Threshold
VSTOP
4.00
4.05
4.10
V
UVLO Hysteresis
VHYS
—
100
—
mV
VOVP
12.8
13
13.2
V
VOVPHYS
—
150
—
mV
Overvoltage Protection
OVP Start Threshold
OVP Hysteresis
Voltage Regulation (Constant Voltage Mode)
Regulated Output Voltage
Options
VREG
8.15
8.20
8.25
V
8.35
8.40
8.45
V
8.65
8.70
8.75
V
8.75
8.80
8.85
V
VRTOL
–0.6
—
0.6
%
Line Regulation
VBAT/
VBAT)/VDD|
—
0.05
0.20
%/V
Load Regulation
VBAT/VBAT|
—
0.05
0.20
%
Output Voltage Tolerance
Note 1:
TA= –5°C to +55°C
VDD = [VREG(Typical)+1V]
IOUT = 50 mA
VDD = [VREG(Typical)+1V] to 12V
IOUT = 50 mA
IOUT = 50 mA – 150 mA
VDD = [VREG(Typical)+1V]
Not production tested. Ensured by design.
2009-2018 Microchip Technology Inc.
DS20002190D-page 5
MCP73213
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply Ripple Attenuation
PSRR
—
–46
—
dB
IOUT = 20 mA, 10 Hz to 1 kHz
—
–30
—
dB
IOUT = 20 mA, 10 Hz to 10 kHz
Battery Short Protection
BSP Start Threshold
VSHORT
—
3.4
—
V
BSP Hysteresis
VBSPHYS
—
150
—
mV
ISHORT
—
25
—
mA
BSP Regulation Current
Current Regulation (Fast Charge, Constant-Current Mode)
Fast Charge Current
Regulation
IREG
130
—
1100
mA
TA = –5°C to +55°C
117
130
143
mA
PROG = 10 k
900
1000
1100
mA
PROG = 1.1 k
Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)
Precondition Current
Ratio
IPREG/IREG
—
10
—
%
PROG = 1 kto 10 k
TA=-5°C to +55°C
—
100
—
%
No Preconditioning
Precondition Voltage
Threshold Ratio
VPTH/VREG
64
66.5
69
%
VBAT Low-to-High
VBAT Low-to-High
69
71.5
74
%
VPHYS
—
100
—
mV
ITERM/IREG
3.7
5
6.3
%
5.6
7.5
9.4
%
7.5
10
12.5
%
15
20
25
%
93
95.0
97
%
VBAT High-to-Low
—
0
—
%
No Automatic Recharge
RDSON
—
350
—
m
Sink Current
ISINK
—
20
35
mA
Low Output Voltage
VOL
—
0.2
0.5
V
ISINK = 4 mA
Input Leakage Current
ILK
—
0.001
1
μA
High Impedance, VDD on pin
Charge Impedance
Range
RPROG
1
—
22
k
Shutdown Impedance
RPROG
—
200
—
k
Automatic Power-Down
Entry Threshold
VPDENTRY
VBAT + 10
mV
VBAT + 50
mV
—
V
VDD Falling
Automatic Power-Down
Exit Threshold
VPDEXIT
—
V
VDD Rising
Precondition Hysteresis
VBAT High-to-Low (Note 1)
Charge Termination
Charge Termination
Current Ratio
PROG = 1 kto 10 k
TA=–5°C to +55°C
Automatic Recharge
Recharge Voltage
Threshold Ratio
VRTH/VREG
Pass Transistor ON-Resistance
ON-Resistance
VDD = 4.5V, TJ = 105°C (Note 1)
Status Indicator - STAT
PROG Input
Impedance for Shutdown
Automatic Power-Down
Note 1:
VBAT + 150 VBAT + 250
mV
mV
Not production tested. Ensured by design.
DS20002190D-page 6
2009-2018 Microchip Technology Inc.
MCP73213
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 12V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Die Temperature
TSD
—
150
—
C
Die Temperature
Hysteresis
TSDHYS
—
10
—
C
Conditions
Thermal Shutdown
Note 1:
Not production tested. Ensured by design.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 12V,
TA=–40°C to +85°C. Typical values are at +25°C, VDD= [VREG(Typical)+1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
tEL-
—
0
—
Hours
APSED
3.6
4.0
4.4
Hours
5.4
6.0
6.6
Hours
7.2
8.0
8.8
Hours
Conditions
Elapsed Timer
Elapsed Timer Period
Timer Disabled
Preconditioning Timer
Preconditioning Timer Period
tPRECHG
—
0
—
Hours
0.4
0.5
0.6
Hours
Disabled Timer
Status Indicator
Status Output Turn-Off
tOFF
—
—
500
μs
ISINK = 1 mA to 0 mA
(Note 1)
Status Output Turn-On
tON
—
—
500
μs
ISINK = 0 mA to 1 mA
(Note 1)
Note 1:
Not production tested. Ensured by design.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG (Typical) + 1.0V]
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Specified Temperature Range
TA
–40
—
+85
°C
Operating Temperature Range
TJ
–40
—
+125
°C
Storage Temperature Range
TA
–65
—
+150
°C
JA
—
62
—
°C/W
JC
—
20.5
—
°C/W
Thermal Package Resistances
Thermal Resistance, DFN-10LD
(3x3)
2009-2018 Microchip Technology Inc.
4-Layer JC51-7 Standard
Board, Natural Convection
DS20002190D-page 7
MCP73213
NOTES:
DS20002190D-page 8
2009-2018 Microchip Technology Inc.
MCP73213
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], TA= +25°C, Constant Voltage mode.
FIGURE 2-1:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-4:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-2:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-5:
Charge Current (IOUT) vs.
Programming Resistor (RPROG).
FIGURE 2-3:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-6:
Charge Current (IOUT) vs.
Supply Voltage (VDD).
2009-2018 Microchip Technology Inc.
DS20002190D-page 9
MCP73213
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], TA= +25°C, Constant-voltage mode.
FIGURE 2-10:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
FIGURE 2-8:
Charge Current (IOUT) vs.
Supply Voltage (VDD).
FIGURE 2-11:
Battery Short Protection
Regulation Current (ISHORT) vs. Ambient
Temperature (TA).
Discharge Current (µA)
FIGURE 2-7:
Charge Current (IOUT) vs.
Supply Voltage (VDD).
9.0
8.0
7.0
6.0
5.0 End of Charge
4.0
3.0
2.0
VDD < VBAT
1.0
0.0
VDD < VSTOP
-1.0
-5.0
5.0
15.0
25.0
35.0
45.0
55.0
Ambient Temperature (°C)
FIGURE 2-9:
Charge Current (IOUT) vs.
Ambient Temperature (TA).
DS20002190D-page 10
FIGURE 2-12:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
2009-2018 Microchip Technology Inc.
MCP73213
TYPICAL PERFORMANCE CURVES (CONTINUED)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], TA= +25°C, Constant-voltage mode.
200 mA/div
2V/div
5V/div
FIGURE 2-13:
Battery Voltage Accuracy
(VRTOL) vs. Supply Voltage (VDD).
Input Overvoltage Protection
FIGURE 2-16:
(VIN= 5V/Div, VBAT= 2V/Div, ILOAD= 200 mA/Div, Time:
200 ms/Div)
12V
Output Ripple (V)
Source Voltage (V)
9.2V
Output Current (mA)
FIGURE 2-14:
Load Transient Response
(ILOAD = 50 mA/Div, Output: 100 mV/Div, Time:
100 μs/Div).
Output Ripple (V)
FIGURE 2-17:
Line Transient Response
(ILOAD = 10 mA, VIN= 1V/Div, VOUT= 100 mV/Div,
Time: 100 μs/Div).
12V
Source Voltage (V)
9.2V
Output Ripple (V)
FIGURE 2-15:
Complete Charge Cycle.
FIGURE 2-18:
Line Transient Response
(ILOAD = 100 mA, VIN= 1V/Div, VOUT= 100 mV/
Div, Time:100 μs/Div).
2009-2018 Microchip Technology Inc.
DS20002190D-page 11
MCP73213
NOTES:
DS20002190D-page 12
2009-2018 Microchip Technology Inc.
MCP73213
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP73213
Symbol
I/O
Description
DFN-10
3.1
1, 2
VDD
I
3, 4
VBAT
I/O
Battery Charge Control Output Pin
5, 6
NC
—
No Connection Pin
7
STAT
O
Battery Charge Status Output Pin
Battery Management Input Supply Pin
8, 9
VSS
—
Battery Management 0V Reference Pin
10
PROG
I/O
Battery Charge Current Regulation Program and Charge Control Enable Pin
11
EP
—
Exposed Pad Pin
Battery Management Input Supply
(VDD)
A supply voltage of [VREG (Typical) + 0.3V] to 13.0V is
recommended. Bypass to VSS with a minimum of 1 μF.
The VDD pin is rated 18V absolute maximum to prevent
a sudden rise in input voltage from spikes or low-cost
AC-DC wall adapters from causing an over-voltage
condition and damaging the device.
3.2
Battery Charge Control Output
(VBAT)
Connect to the positive terminal of the battery. Bypass
to VSS with a minimum of 1 μF to ensure loop stability
when the battery is disconnected.
3.5
Connect to the negative terminal of the battery and
input supply.
3.6
No Connection (NC)
No connection.
3.4
Status Output (STAT)
STAT is an open-drain logic output for connection to an
LED for charge status indication in stand-alone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-2 for a summary of the status output during a
charge cycle.
2009-2018 Microchip Technology Inc.
Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from
PROG to VSS during constant current (CC) mode.
PROG pin also serves as charge control enable. When
a typical 200 k impedance is applied to the PROG
pin, the MCP73213 will go into standby mode until the
high impedance is removed. Refer to Section 5.5
“Constant-Current Mode - Fast Charge” for details.
3.7
3.3
Battery Management 0V Reference
(VSS)
Exposed Pad (EP)
Connect the Exposed Thermal Pad (EP) to the
exposed copper area on the Printed Circuit Board
(PCB) for thermal enhancement. Additional vias in the
copper area under the MCP73213 device can improve
heat dissipation performance and simplify the
assembly process.
DS20002190D-page 13
MCP73213
NOTES:
DS20002190D-page 14
2009-2018 Microchip Technology Inc.
MCP73213
4.0
DEVICE OVERVIEW
The MCP73213 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the
operational flow algorithm.
SHUTDOWN MODE
VDD < VUVLO
VDD < VPD
or
PROG > 200 k
STAT = High Z
VBAT < VPTH
VDD < VOVP
PRECONDITIONING MODE
Charge Current = IPREG
STAT = LOW
Timer Reset
Timer Enable
Timer Expired
TIMER FAULT
No Charge Current
STAT = Flashing (Type 2)
STAT = High Z (Type 1)
Timer Suspended
VDD > VOVP
VDD > VOVP
VBAT > VPTH
VBAT > VPTH
FAST CHARGE MODE
Charge Current = IREG
STAT = LOW
Timer Reset
Timer Enabled
OVERVOLTAGE PROTECTION
No Charge Current
STAT = High Z
Timer Suspended
VDD < VOVP
VDD > VOVP
VDD < VOVP
VBAT = VREG
Timer Expired
VBAT < VRTH
TIMER FAULT
No Charge Current
STAT = Flashing (Type 2)
STAT = High Z (Type 1)
Timer Suspended
CONSTANT VOLTAGE MODE
Charge Voltage = VREG
STAT = LOW
VBAT < ITERM
Die Temperature < TSDHYS
Charge Mode Resume
CHARGE COMPLETE MODE
No Charge Current
STAT = High Z
Timer Reset
Die Temperature > TSD
VBAT < VSHORT
TEMPERATURE FAULT
No Charge Current
STAT = Flashing (Type 2)
STAT = High Z (Type 1)
Timer Suspended
FIGURE 4-1:
VBAT > VSHORT
Charge Mode Resume
BATTERY SHORT PROTECTION
Charge Current = ISHORT
STAT = Flashing (Type 2)
STAT = High Z (Type 1)
Timer Suspended
The MCP73213 Flow Chart.
2009-2018 Microchip Technology Inc.
DS20002190D-page 15
MCP73213
NOTES:
DS20002190D-page 16
2009-2018 Microchip Technology Inc.
MCP73213
5.0
DETAILED DESCRIPTION
5.3.2
5.1
Undervoltage Lockout (UVLO)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73213
provides constant current and voltage regulation to the
battery pack by controlling this MOSFET in the linear
region. The battery charge control output should be
connected to the positive terminal of the battery pack.
An internal undervoltage lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
shutdown mode until the input supply rises above the
UVLO threshold. In the event a battery is present when
the input power is applied, the input supply must rise
approximately 150 mV above the battery voltage
before the MCP73213 device becomes operational.
The UVLO circuit places the device in shutdown mode
if the input supply falls to approximately 150 mV above
the battery voltage.The UVLO circuit is always active.
Any time the input supply is below the UVLO threshold
or approximately 150 mV of the voltage at the VBAT pin,
the MCP73213 device is placed in a shutdown mode.
5.2
Overvoltage Protection (OVP)
An internal overvoltage protection (OVP) circuit
monitors the input voltage and keeps the charger in
shutdown mode when the input supply rises above the
typical 13V OVP threshold. The OVP hysteresis is
approximately 150 mV for the MCP73213 device.
The MCP73213 device is operational between UVLO
and OVP thresholds. The OVP circuit is also recognized as overvoltage lockout (OVLO).
5.3
Charge Qualification
When the input power is applied, the input supply must
rise 150 mV above the battery voltage before the
MCP73213 becomes operational.
The automatic power-down circuit places the device in
a shutdown mode if the input supply falls to within
+50 mV of the battery voltage.
The automatic circuit is always active. At any time the
input supply is within +50 mV of the voltage at the VBAT
pin, the MCP73213 is placed in a shutdown mode.
For a charge cycle to begin, the automatic
power-down conditions must be met and the charge
enable input must be above the input high threshold.
5.3.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supply to the MCP73213. The
MCP73213 automatically enters a power-down mode if
the voltage on the VDD input falls to within +50 mV of the
battery voltage. This feature prevents draining the
battery pack when the VDD supply is not present.
2009-2018 Microchip Technology Inc.
5.3.3
BATTERY CHARGE CONTROL
OUTPUT (VBAT)
BATTERY DETECTION
The MCP73213 detects the battery presence with
charging of the output capacitor. The charge flow will
initiate when the voltage on VBAT is pulled below the
VRECHARGE threshold. Refer to Section 1.0 “Electrical
Characteristics” for VRECHARGE values. The value will
be the same for nonrechargeable devices.
When VBAT > VREG + Hysteresis, the charge will be
suspended (or not started, depending on the condition)
to prevent overcharging.
5.4
Preconditioning
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73213 device
enters a preconditioning mode. The preconditioning
threshold is factory set. Refer to Section 1.0
“Electrical Characteristics” for preconditioning
threshold options.
In this mode, the MCP73213 device supplies 10% of
the fast charge current (established with the value of
the resistor connected to the PROG pin) to the battery.
When the voltage at the VBAT pin rises above the
preconditioning threshold, the MCP73213 device
enters the Constant Current (Fast Charge) mode.
Note:
5.4.1
The MCP73213 device also offers options
with no preconditioning.
TIMER EXPIRED DURING
PRECONDITIONING MODE
If the internal timer expires before the voltage threshold
is reached for Fast Charge mode, a timer fault is
indicated and the charge cycle terminates. The
MCP73213 device remains in this condition until the battery is removed or input power is cycled. If the battery is
removed, the MCP73213 device enters the Standby
mode, where it remains until a battery is reinserted.
Note:
The typical preconditioning timer for
MCP73213
is
32
minutes. The
MCP73213 also offers options with no
preconditioning timer.
DS20002190D-page 17
MCP73213
5.5
Constant-Current Mode - Fast
Charge
During Constant-Current mode, the programmed
charge current is supplied to the battery or load.
The charge current is established using a single
resistor from PROG to VSS. The program resistor and
the charge current are calculated using the following
equation:
EQUATION 5-1:
I REG = 1104 R PROG
– 0.93
Where:
RPROG
=
kilohm (k)
IREG
=
milliampere (mA)
I REG
log ----------- – 0.93
1104
If the internal timer expires before the recharge voltage
threshold is reached, a timer fault is indicated and the
charge cycle terminates. The MCP73213 device
remains in this condition until the battery is removed. If
the battery is removed or input power is cycled, the
MCP73213 device enters the Standby mode where it
remains until a battery is reinserted.
5.7
RPROG
=
kilohm (k)
IREG
=
milliampere (mA)
Table 5-1 provides commonly seen E96 (1%) and E24
(5%) resistors for various charge current to reduce
design time.
RESISTOR LOOKUP TABLE
Charge
Recommended Recommended
Current (mA) E96 Resistor () E24 Resistor ()
130
10k
10k
150
8.45k
8.20k
200
6.20k
6.20k
250
4.99k
5.10k
300
4.02k
3.90k
350
3.40k
3.30k
400
3.00k
3.00k
450
2.61k
2.70k
500
2.32k
2.37k
550
2.10k
2.20k
600
1.91k
2.00k
650
1.78k
1.80k
700
1.62k
1.60k
750
1.50k
1.50k
800
1.40k
1.50k
850
1.33k
1.30k
900
1.24k
1.20k
950
1.18k
1.20k
1000
1.10k
1.10k
1100
1.00k
1.00k
DS20002190D-page 18
TIMER EXPIRED DURING
CONSTANT-CURRENT - FAST
CHARGE MODE
Constant-Voltage Mode
When the voltage at the VBAT pin reaches the
regulation voltage, VREG, constant voltage regulation
begins. The regulation voltage is factory set to 8.2V,
8.4V, 8.7V or 8.8V with a tolerance of ± 0.5%.
Where:
TABLE 5-1:
5.5.1
5.6
EQUATION 5-2:
R PROG = 10
Constant-Current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When Constant Current mode is invoked, the internal
timer is reset.
Charge Termination
The charge cycle is terminated when, during ConstantVoltage mode, the average charge current diminishes
below a threshold established with the value of 5%,
7.5%, 10% or 20% of fast charge current or the internal
timer expires. A 1 ms filter time on the termination comparator ensures that transient load conditions do not
result in premature charge cycle termination. The timer
period is factory set and can be disabled. Refer to
Section 1.0 “Electrical Characteristics” for timer
period options.
5.8
Automatic Recharge
The MCP73213 device continuously monitors the
voltage at the VBAT pin in the charge complete mode. If
the voltage drops below the recharge threshold,
another charge cycle begins and current is once again
supplied to the battery or load. The recharge threshold
is factory set. Refer to Section 1.0 “Electrical
Characteristics” for recharge threshold options.
Note:
The MCP73213 also offers options with
no automatic recharge.
For the MCP73213 device with no recharge option, the
MCP73213 will go into Standby mode when the termination condition is met. The charge will not restart until
the following conditions have been met:
• Battery is removed from the system and inserted
again
• VDD is removed and plugged in again
• RPROG is disconnected (or high-impedance) and
reconnected
2009-2018 Microchip Technology Inc.
MCP73213
5.9
Thermal Regulation
The MCP73213 shall limit the charge current based on
the die temperature. The thermal regulation optimizes
the charge cycle time while maintaining device
reliability. Figure 5-1 depicts the thermal regulation for
the MCP73213 device. Refer to Section 1.0
“Electrical Characteristics” for thermal package
resistances
and
Section 6.1.1.2
“Thermal
Considerations” for calculating power dissipation.
TABLE 5-2:
STATUS OUTPUTS
CHARGE CYCLE
STATE
Shutdown
High Z
Standby
High Z
Preconditioning
L
Constant Current Fast
Charge
L
Constant Voltage
.
Charge Complete - Standby
5.10
Thermal Regulation.
Thermal Shutdown
The MCP73213 suspends charge if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by approximately
10°C. The thermal shutdown is a secondary safety
feature in the event that there is a failure within the
thermal regulation circuitry.
5.11
Status Indicator
L
High Z
Temperature Fault
1.6 second 50% D.C.
Flashing (Type 2)
High Z (Type 1)
Timer Fault
1.6 second 50% D.C.
Flashing (Type 2)
High Z (Type 1)
Preconditioning Timer Fault
1.6 second 50% D.C.
Flashing (Type 2)
High Z (Type 1)
5.12
FIGURE 5-1:
STAT
Battery Short Protection
Once a single-cell Li-Ion battery is detected, an internal
battery short protection (BSP) circuit starts monitoring
the battery voltage. When VBAT falls below a typical
1.7V battery short protection threshold voltage, the
charging behavior is postponed. A typical 25 mA
detection current is supplied for recovering from the
battery short condition.
Preconditioning mode resumes when VBAT raises
above the battery short protection threshold. The battery voltage must rise approximately 150 mV above the
battery short protection voltage before the MCP73213
device becomes operational.
The charge status outputs are open-drain outputs with
two different states: Low (L), and High-Impedance
(High Z). The charge status outputs can be used to
illuminate LEDs. Optionally, the charge status outputs
can be used as an interface to a host microcontroller.
Table 5-2 summarizes the state of the status outputs
during a charge cycle.
2009-2018 Microchip Technology Inc.
DS20002190D-page 19
MCP73213
NOTES:
DS20002190D-page 20
2009-2018 Microchip Technology Inc.
MCP73213
6.0
APPLICATIONS
The MCP73213 is designed to operate in conjunction
with a host microcontroller or in stand-alone
applications. The MCP73213 provides the preferred
charge
algorithm
for
dual
Lithium-Ion
or
Lithium-Polymer cells: Constant Current followed by
Constant Voltage. Figure 6-1 depicts a typical
stand-alone application circuit, while Figure 6-2
depicts the accompanying charge profile.
2
CIN
RLED
7
VDD
VDD
STAT
5 NC
6 NC
FIGURE 6-1:
VBAT
VBAT
MCP73213
1
AC-DC-Adapter
PROG
VSS
VSS
3
+
4
COUT
2-Cell
Li-Ion
Battery
10
9
8
RPROG
-
Typical Application Circuit.
FIGURE 6-2:
Typical Charge Profile
(875 mAh Li-Ion Battery).
2009-2018 Microchip Technology Inc.
DS20002190D-page 21
MCP73213
6.1
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from the
Preconditioning mode to the Constant Current mode. In
this situation, the battery charger has to dissipate the
maximum power. A trade-off must be made between
the charge current, cost and thermal requirements of
the charger.
6.1.1
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
6.1.1.1
Charge Current
The preferred fast charge current for Li-Ion/Li-Poly cells
is below the 1C rate, with an absolute maximum current
at the 2C rate. The recommended fast charge current should be obtained from the battery
manufacturer. For example, a 500 mAh battery pack
with 0.7C preferred fast charge current has a charge
current of 350 mA. Charging at this rate provides the
shortest charge cycle times without degradation to the
battery pack performance or life.
Note:
6.1.1.2
Please consult with your battery supplier
or refer to the battery data sheet for the
preferred charge rate.
Thermal Considerations
The worst-case power dissipation in the battery
charger occurs when the input voltage is at the
maximum and the device has transitioned from
Preconditioning mode to Constant-Current mode. In
this case, the power dissipation is:
EQUATION 6-1:
PowerDissipation = V DDMAX – V PTHMIN I REGMAX
Where:
VDDMAX
=
the maximum input voltage
IREGMAX
=
the maximum fast charge current
VPTHMIN
=
the minimum transition threshold
voltage
DS20002190D-page 22
Power dissipation with a 9V, ±10% input voltage
source, 350 mA ±10% and preconditioning threshold
voltage at 6V is:
EQUATION 6-2:
Power dissipation = 9.9V – 6.0V 385 mA = 1.50W
This power dissipation with the battery charger in the
DFN-10 package will result approximately 93C above
room temperature.
6.1.1.3
External Capacitors
The MCP73213 is stable with or without a battery load.
In order to maintain good AC stability in Constant-Voltage mode, a minimum capacitance of 1 μF is
recommended to bypass the VBAT pin to VSS. This
capacitance provides compensation when there is no
battery load. In addition, the battery and
interconnections appear inductive at high frequencies.
These elements are in the control feedback loop during
Constant
Voltage
mode.
Therefore,
bypass
capacitance may be necessary to compensate for the
inductive nature of the battery pack.
For typical applications, it is recommended to apply a
minimum of 16V rated 1 μF to the output capacitor and
a minimum of 25V rated 1 μF to the input capacitor.
TABLE 6-1:
MLCC CAPACITOR EXAMPLE
MLCC
Capacitors
Temperature
Range
Tolerance
X7R
-55C to +125C
±15%
X5R
-55C to +85C
±15%
Virtually any good quality output filter capacitor can be
used independent of the capacitor’s minimum Effective
Series Resistance (ESR) value. The actual value of the
capacitor (and its associated ESR) depends on the output load current. A 1 μF ceramic, tantalum or aluminum
electrolytic capacitor at the output is usually sufficient
to ensure stability.
6.1.1.4
Reverse-Blocking Protection
The MCP73213 provides protection from a faulted or
shorted input. Without the protection, a faulted or
shorted input would discharge the battery pack through
the body diode of the internal pass transistor.
2009-2018 Microchip Technology Inc.
MCP73213
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins
to minimize voltage drops along the high-currentcarrying PCB traces.
If the PCB layout is used as a heatsink, adding multiple
vias in the heatsink pad can help conduct more heat to
the backplane of the PCB, thus reducing the junction
temperature. Figures 6-4 and 6-5 depict a typical layout
with PCB heatsinking.
FIGURE 6-5:
Typical Layout (Bottom).
102-00261
MCP73213EV
FIGURE 6-3:
Typical Layout (Top).
FIGURE 6-4:
Typical Layout (Top Metal).
2009-2018 Microchip Technology Inc.
DS20002190D-page 23
MCP73213
NOTES:
DS20002190D-page 24
2009-2018 Microchip Technology Inc.
MCP73213
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
10-Lead DFN (3x3)
Example:
Standard *
XXXX
Part Number
YYWW
MCP73213-A6SI/MF
MCP73213T-A6SI/MF
MCP73213-B6SI/MF
MCP73213T-B6SI/MF
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Z3HI
Code
Z3HI
Z3HI
Y3HI
Y3HI
1443
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2009-2018 Microchip Technology Inc.
DS20002190D-page 25
MCP73213
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002190D-page 26
2009-2018 Microchip Technology Inc.
MCP73213
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2009-2018 Microchip Technology Inc.
DS20002190D-page 27
MCP73213
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20002190D-page 28
2009-2018 Microchip Technology Inc.
MCP73213
APPENDIX A:
REVISION HISTORY
Revision D (January 2018)
The following is the list of modifications:
1.
2.
Changed captions for Figure 2-16, Figure 2-17,
Figure 2-18.
Minor typographical corrections.
Revision C (December 2014)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
8.
Added Note 7 in Table 1 regarding the Type 1
and Type 2 descriptions.
Updated the Functional Block Diagram.
Updated the thermal resistances in the
Temperature Specifications.
Changed captions for the Figures 2-7, 2-8, 2-15,
2-16.
Updated Figure 4-1.
Updated Section 6.1.1.2, Thermal Considerations.
Updated
Section 7.1,
Package
Marking
Information.
Minor typographical corrections.
Revision B (December 2009)
The following is the list of modifications:
1.
Updated the Battery Short Protection values in
the DC Characteristics table.
Revision A (July 2009)
• Original Release of this Document.
2009-2018 Microchip Technology Inc.
DS20002190D-page 29
MCP73213
NOTES:
DS20002190D-page 30
2009-2018 Microchip Technology Inc.
MCP73213
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
[X](1)
X
/XX
XXX
Device
Tape and Reel
Option
Temperature
Range
Package
Pattern
Device:
a)
MCP73213-xxx: Dual Cell Li-Ion/Li-Polymer Battery Device
MCP73213T-xxx: Dual Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
Tape and Reel T
Option:
Examples:
= Tape and Reel(1)
b)
c)
d)
MCP73213-A6SI/MF: Dual Cell Li-Ion/
Li-Polymer Battery Device
MCP73213-B6SI/MF: Dual Cell Li-Ion/
Li-Polymer Battery Device
MCP73213T-A6SI/MF: Tape and Reel,
Dual Cell Li-Ion/
Li-Polymer Battery Device
MCP73213T-B6SI/MF: Tape and Reel,
Dual Cell Li-Ion/
Li-Polymer Battery Device
Note 1:
Temperature
Range:
I
= -40C to +85C (Industrial)
Package:
MF
= 10-Lead Plastic Dual Flat, No Lead - 3x3 mm Body
(DFN)
2009-2018 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier
is used for ordering purposes and is not
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
DS20002190D-page 31
MCP73213
NOTES:
DS20002190D-page 32
2009-2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT
logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR,
Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK
MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST
logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32
logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,
SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are
registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, InterChip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi,
MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix,
RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial
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SQTP is a service mark of Microchip Technology Incorporated in
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Silicon Storage Technology is a registered trademark of Microchip
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All other trademarks mentioned herein are property of their
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© 2009-2018, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-2559-5
2009-2018 Microchip Technology Inc.
DS20002190D-page 33
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Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20002190D-page 34
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
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Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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10/25/17
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