MCP9601T-E/MX

MCP960X/L0X/RL0X Thermocouple EMF to Temperature Converter, ±1.5°C Maximum Accuracy Features Description • Thermocouple Electromotive Force (EMF) to °C Converter: - Integrated cold-junction compensation - Integrated thermocouple open-circuit and short-circuit detection • Supported Types (designated by NIST ITS-90): - Type K, J, T, N, S, E, B and R • Sensor Accuracy for Thermocouple Hot-Junction: - MCP9600/01 ±0.5°C/±1.5°C (typ./max.) - MCP96L00/L01 ±2.0°C/±4.0°C (typ./max.) - MCP96RL00/RL01 ±4.0°C/±8.0°C (typ./max.) • Measurement Resolution: - Hot and cold-junctions: +0.0625°C (typical) • Four Programmable Temperature Alert Outputs: - Monitor hot or cold-junction temperatures - Detect rising or falling temperatures - Up to 255°C of programmable hysteresis • Programmable Digital Filter for Temperature • Low Power: - Shutdown mode - Burst mode: 1 to 128 temperature samples • 2-Wire Interface: I2C Compatible, 100 kHz: - Supports eight devices per I2C Bus • Operating Voltage Range: 2.7V to 5.5V • Operating Current: 300 µA (typical) • Shutdown Current: 2 µA (typical) • Package: 20-Lead MQFN The Microchip Technology Inc. MCP960X/L0X/RL0X converts thermocouple EMF to degree Celsius with integrated cold-junction compensation. The temperature correction coefficients are derived from the National Institute of Standards and Technology (NIST) ITS-90 Thermocouple Database. The MCP9600/01 corrects the thermocouple nonlinear error characteristics of eight thermocouple types and outputs ±0.5°C/±1.5°C (Typ./Max.). Typical Applications • • • • • • Petrochemical Thermal Management Hand-Held Measurement Equipment Industrial Equipment Thermal Management Commercial and Industrial Ovens Industrial Engine Thermal Monitor Temperature Detection Racks The MCP960X/L0X/RL0X digital temperature sensor comes with user-programmable registers which provide design flexibility for various temperature sensing applications. The registers allow user-selectable settings, such as Low-Power modes for battery powered applications, adjustable digital filter for fast transient temperatures and four individually programmable temperature alert outputs which can be used to detect multiple temperature zones. In addition, the MCP9601/L01/RL01 family provides integrated Thermocouple open-circuit and short-circuit detection features. An alert signal is asserted when the thermocouple wire is broken or disconnected. Similarly, alert signal is asserted when the Thermocouple is shorted to ground or power. The temperature alert limits have multiple user-programmable configurations, such as alert polarity as either an active-low or active-high push-pull output, and output function as a Comparator mode (useful for thermostat-type operation) or Interrupt mode for microprocessor-based systems. In addition, the alerts can detect either a rising or a falling temperature with up to +255°C hysteresis. This sensor uses an industry standard 2-wire, I2C compatible serial interface and supports up to eight devices per bus by setting the device address using the ADDR pin. PIC® MCU VDD VIN+ 2 I C 4 Alert MCP9600/L00/RL00 ADDR GND TC+ TC- VIN- Types K, J, T, N, E, B, S, R  2015-2019 Microchip Technology Inc. DS20005426F-page 1 MCP960X/L0X/RL0X 20 19 18 17 16 ADDR GND GND 20 19 18 17 16 15 Alert 4 GND 1 VIN+ 2 14 Alert 3 VIN+ 2 13 GND GND 3 EP 21 SCL 5 mm × 5 mm MQFN* GND 1 GND 3 SDA MCP9601/L01/RL01 ADDR GND 5 mm × 5 mm MQFN* GND SDA MCP9600/L00/RL00 SCL Package Types 15 Alert 4 14 Alert 3 EP 21 13 GND 11 Alert 1 GND 5 11 Alert 1 7 8 9 10 GND 6 OC Alert 9 10 VSENSE 8 GND 7 GND GND 6 VDD 12 Alert 2 GND 5 SC Alert VIN- 4 VDD 12 Alert 2 GND VIN- 4 * Includes Exposed Thermal Pad (EP); see Table 3-1. MCP960X/L0X/RL0X Block Diagram ADC Core + VIN+ User Registers Del Sig Thermocouple Hot-Junction TH VINError Correction Junctions Delta Temperature T ∑ Thermocouple Cold-Junction TC Digital Filter Thermocouple Type Selection Sensor Status Sensor Configuration Device Resolution + Power Modes VSENSE Alert Config. Registers Open Circuit & Short Circuit Detection Open Circuit Alert Alert Registers Alert 1 Output Alert 2 Output Alert 3 Output Hysteresis Registers Alert 4 Output Device ID Short Circuit Alert MCP9601/L01/RL01 Only SCL I2C Module SDA ADDR  2015-2019 Microchip Technology Inc. DS20005426F-page 2 MCP960X/L0X/RL0X 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD............................................................................................................................................................................ 6.0V Voltage at All Input/Output Pins ........................................................................................................ GND – 0.3V to 6.0V Storage Temperature ..............................................................................................................................-65°C to +150°C Ambient Temperature with Power Applied ..............................................................................................-40°C to +125°C Junction Temperature (TJ) .................................................................................................................................... +150°C ESD Protection on All Pins (HBM:MM) .......................................................................................................... (4 kV:300V) Latch-up Current at Each Pin............................................................................................................................. ±100 mA † Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA = TC, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. -1.5 ±0.5 +1.5 -3.0 ±1 +3.0 -1.0 ±0.5 +1.0 -2.0 ±1 +2.0 ±0.25 +0.5 Unit Conditions Thermocouple Sensor Measurement Accuracy — MCP9600/01 TH Hot-Junction Accuracy (VDD = 3.3V) TH = TC + T∆ (Note 1) TH_ACY TC Cold-Junction Accuracy (VDD = 3.3V) TC_ACY °C °C TA = 0°C to +85°C, TA = -40°C to +125°C TA = 0°C to +85°C TA = -40°C to +125°C T∆ Junctions Temperature Delta Accuracy — MCP9600/01 Type K: T∆ = -200°C to +1372°C VEMF Range: -5.907 mV to 54.886 mV T∆_ACY -0.5 °C TA = 0°C to +85°C, VDD = 3.3V (Note 2) Type J: T∆ = -150°C to +1200°C VEMF Range: -3.336 mV to 47.476 mV Type T: T∆ = -200°C to +400°C VEMF Range: -5.603 mV to 20.81 mV Type N: T∆ = -150°C to +1300°C VEMF Range: -3.336 mV to 47.476 mV Type E: T∆ = -200°C to +1000°C VEMF Range: -8.825 mV to 76.298 mV Type S: T∆ = 250°C to +1664°C VEMF Range: -1.875 mV to 17.529 mV Type B: T∆ = 1000°C to +1800°C VEMF Range: -4.834 mV to 13.591 mV TA = 0°C to +85°C, VDD = 3.3V (Notes 2, Note 3) Type R: T∆ = 250°C to +1664°C VEMF Range: -1.923 mV to 19.732 mV Note 1 2 3 4 The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature difference between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C. The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see Figures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17). Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested.  2015-2019 Microchip Technology Inc. DS20005426F-page 3 MCP960X/L0X/RL0X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA = TC, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Thermocouple Sensor Measurement Accuracy — MCP96L00/L01 TH Hot-Junction Accuracy (VDD = 3.3V) TH = TC + T∆ (Note 1) TH_ACY TC Cold-Junction Accuracy (VDD = 3.3V) TC_ACY -4.0 ±2 +4.0 -6.0 ±4 +6.0 -1.0 ±0.5 +1.0 -2.0 ±1 +2.0 ±1.5 +3.0 °C °C TA = 0°C to +85°C, TA = -40°C to +125°C TA = 0°C to +85°C TA = -40°C to +125°C T∆ Junctions Temperature Delta Accuracy — MCP96L00/L01 Type K: T∆ = -200°C to +1372°C VEMF Range: -5.907 mV to 54.886 mV T∆_ACY -3.0 °C TA = 0°C to +85°C, VDD = 3.3V (Note 2) Type J: T∆ = -150°C to +1200°C VEMF Range: -3.336 mV to 47.476 mV Type T: T∆ = -200°C to +400°C VEMF Range: -5.603 mV to 20.81 mV Type N: T∆ = -150°C to +1300°C VEMF Range: -3.336 mV to 47.476 mV Type E: T∆ = -200°C to +1000°C VEMF Range: -8.825 mV to 76.298 mV Type S: T∆ = 250°C to +1664°C VEMF Range: -1.875 mV to 17.529 mV Type B: T∆ = 1000°C to +1800°C VEMF Range: -4.834 mV to 13.591 mV TA = 0°C to +85°C, VDD = 3.3V (Notes 2, Note 3) Type R: T∆ = 250°C to +1664°C VEMF Range: -1.923 mV to 19.732 mV Note 1 2 3 4 The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature difference between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C. The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see Figures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17). Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested.  2015-2019 Microchip Technology Inc. DS20005426F-page 4 MCP960X/L0X/RL0X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA = TC, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit Conditions Thermocouple Sensor Measurement Accuracy — MCP96RL00/01 TH Hot-Junction Accuracy (VDD = 3.3V) TH = TC + T∆ (Note 1) TH_ACY TC Cold-Junction Accuracy (VDD = 3.3V) TC_ACY -8.0 ±4 +8.0 -10.0 ±6 +10.0 -2.0 ±1 +2.0 °C TA = -40°C to +125°C ±3.0 +6.0 °C TA = 0°C to +85°C, VDD = 3.3V (Note 2) °C TA = 0°C to +85°C, TA = -40°C to +125°C T∆ Junctions Temperature Delta Accuracy — MCP96RL00/01 Type K: T∆ = -200°C to +1372°C VEMF Range: -5.907 mV to 54.886 mV T∆_ACY -6.0 Type J: T∆ = -150°C to +1200°C VEMF Range: -3.336 mV to 47.476 mV Type T: T∆ = -200°C to +400°C VEMF Range: -5.603 mV to 20.81 mV Type N: T∆ = -150°C to +1300°C VEMF Range: -3.336 mV to 47.476 mV Type E: T∆ = -200°C to +1000°C VEMF Range: -8.825 mV to 76.298 mV Type S: T∆ = 250°C to +1664°C VEMF Range: -1.875 mV to 17.529 mV Type B: T∆ = 1000°C to +1800°C VEMF Range: -4.834 mV to 13.591 mV TA = 0°C to +85°C, VDD = 3.3V (Notes 2, Note 3) Type R: T∆ = 250°C to +1664°C VEMF Range: -1.923 mV to 19.732 mV Note 1 2 3 4 The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature difference between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C. The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see Figures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17). Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested.  2015-2019 Microchip Technology Inc. DS20005426F-page 5 MCP960X/L0X/RL0X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA = TC, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Unit TC and TH Temperature Resolution TRES — ±0.0625 — °C Sampling Rate (TA = +25°C) tCONV — 320 — — 80 — — 20 — Conditions Sensor Characteristics With max. resolution 18-bit resolution ms 16-bit resolution 14-bit resolution — 5 — tCALC — 12 — ms Offset Error VOERR — ±2 — µV Offset Error Drift VOE_DR — 50 — nV/°C GERR — — ±0.04 Full-Scale Gain Error — MCP96L00/L01 — ±0.12 — Full-Scale Gain Error — MCP96RL00/RL01 — ±0.24 — GER_DR — ±0.01 — %FS INL — 10 — ppm VRES — 2 — µV 18-bit resolution Differential Mode Range VIN_DF -250 — +250 mV ADC input range Differential Mode Impedance ZIN_DF — 300 — k Common-Mode Range VIN_CM VDD – 0.3 — VDD + 0.3 V Common-Mode Impedance ZIN_CM — 25 — M Common-Mode Rejection Ratio CMRR — 105 — dB Power Supply Rejection Ratio PSRR — 60 — dB Line Regulation VLine_R — 0.2 — °C/V Temperature Calculation Time 12-bit resolution TA = +25°C Thermocouple Input Full-Scale Gain Error — MCP9600/01 Full-Scale Gain Error Drift Full-Scale Integral Nonlinearity Voltage Resolution TA = 0°C to +85°C %FS TA = -40°C to +125°C (Note 4) Voltage Sense Input (VSENSE) for Thermocouple Open and Short-Circuit Detection (MCP9601/L01/RL01) VSENSE Input Range - Range: Short Circuit to VDD VSiRNG 0 — 100 (see Figure 1-1) VSiSC 90 — 100 SC Alert asserts 0 — 10 - Range: Short Circuit to GND %VDD - Range: Open Circuit VSiOC 58 — 75 OC Alert asserts - Range: Normal Operation VSiNOR 40 — 58 OC Alert deasserts Note 1 2 3 4 The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature difference between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C. The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see Figures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17). Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested.  2015-2019 Microchip Technology Inc. DS20005426F-page 6 MCP960X/L0X/RL0X DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA = TC, defined as Device Ambient Temperature). Parameters VSENSE Input Leakage Sym. Min. Typ. Max. Unit ISiLEAK — 0.1 1 µA Conditions Alert 1, 2, 3, 4 Outputs, SC Alert and OC Alert Outputs (MCP9601/L01/RL01) Low-Level Voltage VOL — — 0.4 V IOL= 3 mA High-Level Voltage VOH VDD – 0.5 — — V IOH= 3 mA Operating Voltage VDD 2.7 — 5.5 V I2 IDD — 0.3 0.5 mA — 1.5 2.5 mA Operating Voltage and Current C Inactive Current I2 C Active Current or During tCALC VDD = 3.3V, TA = +85°C Shutdown Current ISHDN — 2 5 µA I2C inactive, TA = +85°C Power-on Reset (POR) Thresholds VPOR 1.0 2.1 2.6 V Rising/Falling VDD tRSP — 3 — s +25°C (air) to +125°C (oil bath), 2x2” PCB Thermal Response Package Thermal Response (Time to 63% of Final Temperature) Note 1 2 3 4 The TC and T summation is implemented in milli-volt (mV) domain. The result, TH (mV), is converted to Degree Celsius using the NIST ITS-90 Conversion database. The T_ACY temperature accuracy specification is defined as the device accuracy to the NIST ITS-90 Thermocouple EMF to Degree Celsius Conversion Database. T is also defined as the temperature difference between the hot and cold-junctions or temperatures from the NIST ITS-90 database with TC = 0°C. The device measures temperature below the specified range, however, the sensitivity to changes in temperature reduces exponentially. Type R and S measure down to -50°C, or -0.226 mVEMF and -0.235 mVEMF, respectively. Type B measures down to 500°C or 1.242 mVEMF (see Figures 2-7, 2-8, 2-10, 2-11, 2-14 and 2-17). Exceeding the VIN_CM input range may cause leakage current through the ESD protection diodes at the thermocouple input pins. This parameter is characterized but not production tested. VDD RA RB VSENSE + VIN+ Del Sig Where: C VIN- MCP9601/L01/RL01 FIGURE 1-1: Thermocouple RB RA = 1 M ± 5% Tolerance (Max.) RB = 2 M ± 20% Range C = 0.1 µF Open and Short Circuit Detection Configuration.  2015-2019 Microchip Technology Inc. DS20005426F-page 7 MCP960X/L0X/RL0X INPUT/OUTPUT PIN DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C (where: TA = TC, defined as Device Ambient Temperature). Parameters Sym. Min. Typ. Max. Units V Conditions 2 Serial Input/Output and I C Slave Address Input (ADDR) Input (SCL, SDA, ADDR) High-Level Voltage Low-Level Voltage VIH 0.7 × VDD — — VIL — — 0.3 × VDD V Input Current ILEAK — — ±2 µA Hysteresis VHYST — 0.05 × VDD — V TSP — 50 — ns Low-Level Voltage VOL — — 0.4 V IOL= 3 mA High-Level Current (leakage) IOH — — 1 µA VOH = VDD Low-Level Current IOL 6 — — mA VOL = 0.6V Capacitance CIN — 5 — pF V Spike Suppression VDD > 2V Output (SDA) I2C Slave Address Selection Levels (Note 1) Command Byte [1100 000x] GND — — VADDR_L VADDR_TYP VADDR_H (Note 2) (Note 2) (Note 2) VADDR Command Byte [1100 001x] Command Byte [1100 010x] Command Byte [1100 011x] Address = 0 Address = 1 Address = 2 Address = 3 Command Byte [1100 100x] Address = 4 Command Byte [1100 101x] Address = 5 Command Byte [1100 110x] Address = 6 Command Byte [1100 111x] Note 1 2 — — Address = 7 VDD The ADDR pin can be tied to VDD or VSS. For additional slave addresses, a resistive divider network can be used to set voltage levels that are rationed to VDD. The device supports up to eight levels (see Section 6.3.1 “I2C Addressing” for recommended resistor values). VADDR_TYP = Address * VDD/8 + VDD/16, VADDR_L = VADDR_TYP – VDD/32 and VADDR_H = VADDR_TYP + VDD/32 (where: Address = 1, 2, 3, 4, 5, 6). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground. Parameters Sym. Min. Typ. Max. Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C JA — 38.8 — °C/W Conditions Temperature Ranges (Note 1) Thermal Package Resistances Thermal Resistance, MQFN Note 1 Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).  2015-2019 Microchip Technology Inc. DS20005426F-page 8 MCP960X/L0X/RL0X SENSOR SERIAL INTERFACE TIMING SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, GND = Ground, TA = -40°C to +125°C, VDD = 2.7V to 5.5V and CL = 80 pF (Note 1). Parameters Sym. Min. Max. Units 2 2-Wire I C Interface Serial Port Frequency fSCL 10 100 kHz Low Clock (Note 2) tLOW 4700 — ns High Clock tHIGH 4000 — ns tR — 1000 ns Rise Time (Note 3) Fall Time (Note 3) tF 20 300 ns Data in Setup Time (Note 2) tSU:DAT 250 — ns Data in Hold Time tHD:DAT 0 — ns Start Condition Setup Time tSU:STA 4700 — ns Start Condition Hold Time tHD:STA 4000 — ns Stop Condition Setup Time tSU:STO 4000 — ns Bus Idle/Free tB-FREE 10 — µs Cb — 400 pf tSTRETCH 60 — µs Bus Capacitive Load Clock Stretching (Note 4) P RE E TO -F U -S tB tL I DD tH tS U -D AT A tR ,t F SD A SC L tS tS IG H tH TR ET O W H C AC K D -S tH tS U -S TA RT 3 4 All values referred to VIL MAX and VIH MIN levels. This device can be used in a Standard mode I2C bus system, but the requirement, tSU:DAT  250 ns, must be met. Characterized, but not production tested. Master controllers without features to detect clock stretching by Slave devices, should reduce fSCL for proper I2C communication for Read commands. See Figure 2-29 for a typical tSTRETCH performance. TA RT Note 1 2 Start Condition FIGURE 1-2: Data Transmission Stop Condition Timing Diagram.  2015-2019 Microchip Technology Inc. DS20005426F-page 9 MCP960X/L0X/RL0X 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore, outside the warranted range. Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and TA = -40°C to +125°C. 0.500 Type K MCP9600 Type K MCP9600/L00/RL00 0.25 Sensitivity (' '°C/LSb) Temperature Accuracy (°C) 0.50 0.00 -0.25 -0.50 -200 300 800 1300 0.250 0.000 -200 1800 300 TA (°C) FIGURE 2-1: Typical Temperature Accuracy from NIST ITS-90 Database, Type K. Sensitivity (' '°C/LSb) 7HPSHUDWXUH$FFXUDF\ƒ&       Type J MCP9600/L00/RL00 0.250 0.000 -200  300 7$ ƒ& FIGURE 2-2: Typical Temperature Accuracy from NIST ITS-90 Database, Type J. 800 TA (°C) 1300 1800 FIGURE 2-5: Temperature Sensitivity with 18-Bit Resolution, Type J.  0.500 7\SH1 0&3  Sensitivity (' '°C/LSb) 7HPSHUDWXUH$FFXUDF\ƒ& 1800 0.500 7\SH0&3     1300 FIGURE 2-4: Temperature Sensitivity with 18-Bit Resolution, Type K.    800 TA (°C)     7$ ƒ& FIGURE 2-3: Typical Temperature Accuracy from NIST ITS-90 Database, Type N.  2015-2019 Microchip Technology Inc. Type N MCP9600/L00/RL00 0.250 0.000 -200 300 800 1300 1800 TA (°C) FIGURE 2-6: Temperature Sensitivity with 18-Bit Resolution, Type N. DS20005426F-page 10 MCP960X/L0X/RL0X Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and TA = -40°C to +125°C. 0.500 7\SH6 0&3  Sensitivity (' '°C/LSb) 7HPSHUDWXUH$FFXUDF\ƒ&  6SHFLILHG5DQJH        Type S MCP9600/L00/RL00 Specified Range 0.250 0.000 -200  300 7$ ƒ& FIGURE 2-7: Typical Temperature Accuracy from NIST ITS-90 Database, Type S. Sensitivity (' '°C/LSb) 7HPSHUDWXUH$FFXUDF\ƒ& 6SHFLILHG5DQJH      Type R MCP9600/L00/RL00 Specified Range 0.250 0.000 -200  300 7$ ƒ& FIGURE 2-8: Typical Temperature Accuracy from NIST ITS-90 Database, Type R. 1300 1800 0.500 Type E MCP9600 Type E MCP9600/L00/RL00 0.25 Sensitivity (' '°C/LSb) Temperature Accuracy (°C) 800 TA (°C) FIGURE 2-11: Temperature Sensitivity with 18-Bit Resolution, Type R. 0.50 0.00 -0.25 -0.50 -200 1800 0.500 7\SH5 0&3   1300 FIGURE 2-10: Temperature Sensitivity with 18-Bit Resolution, Type S.   800 TA (°C) 300 800 1300 1800 TA (°C) FIGURE 2-9: Typical Temperature Accuracy from NIST ITS-90 Database, Type E.  2015-2019 Microchip Technology Inc. 0.250 0.000 -200 300 800 TA (°C) 1300 1800 FIGURE 2-12: Temperature Sensitivity with 18-Bit Resolution, Type E. DS20005426F-page 11 MCP960X/L0X/RL0X Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and TA = -40°C to +125°C. 0.500 Type T MCP9600 0.25 Sensitivity (' '°C/LSb) Temperature Accuracy (°C) 0.50 0.00 -0.25 -0.50 -200 300 800 1300 Type T MCP9600/L00/RL00 0.250 0.000 -200 1800 300 800 TA (°C) TA (°C) FIGURE 2-13: Typical Temperature Accuracy from NIST ITS-90 Database, Type T. Sensitivity (' '°C/LSb) Temperature Accuracy (°C) 0.500 Type B MCP9600 Specified Range 0.00 -0.25 -0.50 -200 300 800 1300 Type B MCP9600/L00/RL00 Specified Range 0.250 0.000 -200 1800 300 TA (°C) FIGURE 2-14: Typical Temperature Accuracy from NIST ITS-90 Database, Type B. 800 TA (°C) 1300 1800 FIGURE 2-17: Temperature Sensitivity with 18-Bit Resolution, Type B. 0.4 10 Gain Error (% of FSR) MCP9600 Offset Error (µV) 1800 FIGURE 2-16: Temperature Sensitivity with 18-Bit Resolution, Type T. 0.50 0.25 1300 5 0 -5 -10 VDD = 3.3V MCP9600 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -40 -20 0 20 40 60 80 100 120 -40 -20 Temperature (°C) FIGURE 2-15: (VIN+, VIN-). Input Offset Error Voltage  2015-2019 Microchip Technology Inc. 0 20 40 60 80 100 120 Temperature (°C) FIGURE 2-18: Full-Scale Gain Error. DS20005426F-page 12 MCP960X/L0X/RL0X Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and TA = -40°C to +125°C. 0.005 Integral Nonlinearity (% of FSR) 10.0 TA = +25°C 5.0 2.5 0.0 -100 -75 -50 -25 0 25 50 Input Voltage (% of Full-Scale) FIGURE 2-19: 75 Input Noise,% of Full Scale. 0.001 0.000   2FFXUUHQFHV  9 $YHUDJH  3.0 FIGURE 2-22: VDD. 9'' 9 XQLWVDWƒ&ƒ&ƒ& XQLWVDWRWKHUWHPSHUDWXUHV 6SHF /LPLW 3.5 4.0 VDD (V) 4.5 5.0 5.5 Integral Nonlinearity Across 7$ ƒ&WRƒ& 9'' 9 XQLWV 0&3   6WG'HY 6WGHY 6WGHY 6WG'HY FIGURE 2-20: Cold-Junction Sensor Temperature Accuracy. 400 300       7HPSHUDWXUH$FFXUDF\ƒ& FIGURE 2-23: Cold-Junction Sensor Temperature Accuracy Distribution. T-40C A = -40°C 35C TA = +35°C 85C TA = +85°C 125C TA = +125°C SDA, and Alert 1, 2, 3, 4 outputs           7ǻ 7HPSHUDWXUH,76'DWDEDVHƒ& 200 500 T-40C A = -40°C 35C TA = +35°C 85C TA = +85°C 125C TA = +125°C Alert 1, 2, 3, 4 outputs 400 VDD - VOH (µA)      7ǻB$&< ƒ& 0.002 2.5  VOL (µA) 0.003 100  0&3 0.004  Noise (µV, rms) 7.5 300 200 100 100 0 2.5 3.0 FIGURE 2-21: Across VDD. 3.5 4.0 VDD (V) 4.5 5.0 5.5 SDA and Alert Outputs, VOL  2015-2019 Microchip Technology Inc. 2.5 3.0 FIGURE 2-24: VDD. 3.5 4.0 VDD (V) 4.5 5.0 5.5 Alert Outputs, VOH Across DS20005426F-page 13 MCP960X/L0X/RL0X Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and TA = -40°C to +125°C. 500 2.0 400 85C TA = +85°C 300 TA = +125°C 125C 1.0 TA = -40°C -40C 35C TA = +35°C 85C TA = + 85°C 125C TA = +125°C 200 100 2.5 3.0 3.5 4.0 VDD (V) 4.5 5.0 0.0 2.5 5.5 I2C Inactive, IDD Across VDD. FIGURE 2-25: -40C TA = -40°C 35C TA = +35°C 85C TA = + 85°C 125C TA = +125°C 1500 1000 3.5 4.0 VDD (V) 4.5 5.0 5.5 T-40C A = -40°C TA = +35°C 35C 85C TA = +85°C 125C TA = +125°C 40.0 tSTRETCH (µs) 2000 3.0 FIGURE 2-28: SDA, SCL and ADDR Input Pins Leakage Current, ILEAK Across VDD. 60.0 2500 I2C Active, IDD (µA) T-40C A = -40°C 35C TA = +35°C ILEAK (µA) I2C Inactive, IDD (µA) ADDR/SDA/SCL pins 20.0 0.0 500 2.5 3.0 FIGURE 2-26:  3.5 4.0 VDD (V) 4.5 5.0 2.5 5.5 I2C Active, IDD Across VDD. 2.0% ΔtCALC (%) 1.0% ,6+'1 —$   3.5 4.0 VDD (V) 4.5 5.5 Conditions: tCALC = 12 ms (typical) VDD = 3.3V TA = Room Temperature 0.0% -40C TA = -40°C 35C TA = +35°C 85C TA = + 85°C 125C TA = +125°C -1.0%  5.0 FIGURE 2-29: I2C Interface Clock Stretch Duration, tSTRETCH Across VDD. & 7$ ƒ& & 7$ ƒ& & 7$ ƒ& & 7$ ƒ&  3.0 -2.0%    FIGURE 2-27: Across VDD.   9'' 9    Shutdown Current, ISHDN  2015-2019 Microchip Technology Inc. 2.5 3.0 3.5 4.0 VDD (V) 4.5 5.0 5.5 FIGURE 2-30: Temperature Calculation Duration, tCALC Change Across VDD. DS20005426F-page 14 MCP960X/L0X/RL0X 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE MCP9600/L00/RL00 MCP9601/L01/RL01 1, 3, 5,13, 17 3.1 Symbol Pin Function 1, 3, 5, 13, 17 GND Electrical Ground 2 2 VIN+ Thermocouple Positive Terminal Input 4 4 VIN- Thermocouple Negative Terminal Input 6, 7, 9, 10, 18 10, 18 GND — 6 VSENSE — 7 SC Alert 8 8 VDD Not Electrical Ground; must be tied to Ground Thermocouple Open and Short Circuit detection input Thermocouple Short Circuit Alert Output Power — 9 OC Alert 11 11 Alert 1 Alert Output 1 12 12 Alert 2 Alert Output 2 14 14 Alert 3 Alert Output 3 15 15 Alert 4 Alert Output 4 16 16 ADDR I2C Save Address Selection Voltage Input 19 19 SCL I2C Clock Input 20 20 SDA I2C Data Input 21 21 EP Ground Pin (GND) Thermocouple Open Circuit Alert Output Exposed Thermal Pad (EP); must be connected to GND 3.5 I2C Slave Address Pin (ADDR) The GND pin is the system ground pin. Pins 1, 3, 5, 13 and 17 are system ground pins and they are at the same potential. However, pins 6, 7, 9, 10 and 18 must be connected to ground for normal operation. This pin is used to set the I2C slave address. This pin can be tied to VDD, GND, or a ratio of VDD can be selected to set up to eight address levels using a resistive voltage divider network. 3.2 3.6 Thermocouple Input (VIN+, VIN-) The thermocouple wires are directly connected to these inputs. The positive node is connected to the VIN+ pin, while the negative node connects to the VINnode. The thermocouple voltage is converted to degree Celsius. 3.3 Power Pin (VDD) Serial Clock Line (SCL) The SCL is a clock input pin. All communication and timing is relative to the signal on this pin. The clock is generated by the host or master controller on the bus (see Section 4.0 “Serial Communication”). 3.7 Serial Data Line (SDA) VDD is the power pin. The operating voltage range, as specified in the DC Characteristics table, is applied on this pin. SDA is a bidirectional input/output pin used to serially transmit data to/from the host controller. This pin requires a pull-up resistor (see Section 4.0 “Serial Communication”). 3.4 3.8 Push-Pull Alert Outputs (Alert 1, 2, 3, 4 and OC/SC Alert) The Alert pins are user-programmable push-pull outputs which can be used to detect rising or falling temperatures. The device outputs signal when the ambient temperature exceeds the user-programmed temperature alert limit. The OC Alert and the SC Alert outputs are also active-high push-pull outputs (MCP9601/L01/RL01). These outputs are asserted when Open-Circuit and Short-Circuit conditions are detected on the VSENSE pin.  2015-2019 Microchip Technology Inc. Thermocouple Open/Short Detection Input (VSENSE) The VSENSE pin is a thermocouple detection input pin (MCP9601/L01/RL01) and the voltage level on this pin is used to determine whether the thermocouple is operating normally, shorted to VDD/VSS, or it is disconnected from the VIN+ and VIN- pins (see Figure 1-1). DS20005426F-page 15 MCP960X/L0X/RL0X 4.0 SERIAL COMMUNICATION 4.1 2-Wire Standard Mode I2C Protocol-Compatible Interface The MCP960X/L0X/RL0X Serial Clock Input (SCL) and the bidirectional Serial Data Line (SDA) form a 2-wire bidirectional data communication line (refer to the Input/Output Pin DC Characteristics table and Sensor Serial Interface Timing Specifications table). The following bus protocol has been defined: TABLE 4-1: Term MCP9600/L00/RL00 SERIAL BUS PROTOCOL DESCRIPTIONS Description Master The device that controls the serial bus, typically a microcontroller Slave The device addressed by the master, such as the MCP960X/L0X/RL0X Transmitter Device sending data to the bus Receiver Device receiving data from the bus START A unique signal from master to initiate serial interface with a slave STOP A unique signal from the master to terminate serial interface from a slave Read/Write A read or write to the MCP960X/L0X/RL0X registers ACK A receiver Acknowledges (ACK) the reception of each byte by polling the bus NAK A receiver Not Acknowledges (NAK) or releases the bus to show End-of-Data (EOD) Busy Communication is not possible because the bus is in use Not Busy The bus is in the Idle state, both SDA and SCL remain high Data Valid SDA must remain stable before SCL becomes high in order for a data bit to be considered valid. During normal data transfers, SDA only changes state while SCL is low. 4.1.1 DATA TRANSFER Data transfers are initiated by a Start condition (START), followed by a 7-bit device address and a read/write bit. An Acknowledge (ACK) from the slave confirms the reception of each byte. Each access must be terminated by a Stop condition (STOP). Repeated communication is initiated after tB-FREE.  2015-2019 Microchip Technology Inc. This device supports the Receive Protocol. The register can be specified using the pointer for the initial read. Each repeated read or receive begins with a Start condition and address byte. The MCP960X/L0X/RL0X retains the previously selected register. Therefore, it outputs data from the previously-specified register (repeated pointer specification is not necessary). 4.1.2 MASTER/SLAVE The bus is controlled by a master device (typically a microcontroller) that controls the bus access, and generates the Start and Stop conditions. The MCP960X/L0X/RL0X is a slave device and does not control other devices in the bus. Both master and slave devices can operate as either transmitter or receiver. However, the master device determines which mode is activated. 4.1.3 START/STOP CONDITION A high-to-low transition of the SDA line (while SCL is high) is the Start condition. All data transfers must be preceded by a Start condition from the master. A low-to-high transition of the SDA line (while SCL is high) signifies a Stop condition. If a Start or Stop condition is introduced during data transmission, the MCP960X/L0X/RL0X releases the bus. All data transfers are ended by a Stop condition from the master. 4.1.4 ADDRESS BYTE Following the Start condition, the host must transmit an 8-bit address byte to the MCP960X/L0X/RL0X. The address for the MCP960X/L0X/RL0X temperature sensor is ‘11,0,0,A2,A1,A0’ in binary, where the A2, A1 and A0 bits are set externally by connecting the corresponding VADDR voltage levels on the ADDR pin (see the “Input/Output Pin DC Characteristics” section). The 7-bit address transmitted in the serial bit stream must match the selected address for the MCP960X/L0X/RL0X to respond with an ACK. Bit 8 in the address byte is a read/write bit. Setting this bit to ‘1’ commands a read operation, while ‘0’ commands a write operation (see Figure 4-1). Command Byte 1 SCL SDA 2 1 1 Start 3 4 5 6 7 0 0 A2 A1 A0 8 9 A C K Slave Address R/W MCP960X/L0X/RL0X Response FIGURE 4-1: Device Addressing. DS20005426F-page 16 MCP960X/L0X/RL0X 4.1.5 DATA VALID After the Start condition, each bit of data in transmission needs to be settled for a time specified by tSU-DATA before SCL toggles from low-to-high (see the “Sensor Serial Interface Timing Specifications” section). 4.1.6 ACKNOWLEDGE (ACK/NAK) Each receiving device, when addressed, is expected to generate an ACK bit after the reception of each byte. The master device must generate an extra clock pulse for ACK to be recognized. The Acknowledging device pulls down the SDA line for tSU-DATA before the low-to-high transition of SCL from the master. SDA also needs to remain pulled down for tHD-DAT after a high-to-low transition of SCL. During read, the master must signal an End-of-Data (EOD) to the slave by not generating an ACK bit (NAK) once the last bit has been clocked out of the slave. In this case, the slave will leave the data line released to enable the master to generate the Stop condition. 4.1.7 CLOCK STRETCHING 2 During the I C read operation, this device will hold the I2C clock line low for tSTRECH after the falling edge of the ACK signal. In order to prevent bus contention, the master controller must release or hold the SCL line low during this period. Note: If the master controller does not provide the adequate delay as specified by tSTRECH, then the device will output the previously transmitted data. In addition, the master controller must provide eight consecutive clock cycles after generating the ACK bit from a read command. This allows the device to push out data from the SDA Output Shift registers. Missing clock cycles could result in bus contention. At the end of one or more data transmission, the master controller must provide the NAK bit, followed by a Stop Condition to terminate communication (see Figure 4-3). MCP9600/L00/RL00 Clock Stretching – tSTRETCH 7 A 0 8 R 1 A C K x 2 3 x x 4 x 5 x 6 x 7 x 8 x A C K TH MSB Data Master MCP960X/L0X/RL0X FIGURE 4-2: 4.1.8 Clock Stretching. SEQUENTIAL READ During a sequential read, the device transmits data bytes starting from the previously set Register Pointer. The MCP960X/L0X/RL0X increments an internal address pointer each time a byte transmission is successfully completed with an ACK bit from the master controller. Therefore, the device can sequentially output the entire register values shown in Table 5-1 (see Figure 4-6). A Stop Condition terminates the sequential read.  2015-2019 Microchip Technology Inc. DS20005426F-page 17 MCP960X/L0X/RL0X 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 A 2 0 A 1 A 0 A W C 0 K Address Byte 0 0 0 0 0 0 Pointer (Table 4-2) Slave* A C P K 0 Slave* MCP960X/L0X/RL0X Clock Stretching, tSTRETCH 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 0 A 2 A 1 A 0 Address Byte A R C 0 K Slave* 0 0 0 0 0 0 MSB Data 1 A C K 1 Master 0 0 1 0 1 0 LSB Data 0 N A K P Master *MCP960X/L0X/RL0X TABLE 4-2: POINTERS Read-Only Registers Pointer TH 0000 0000 T∆ 0000 0001 TC 0000 0010 Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); // WRITE Command // also, make sure bit 0 is cleared ‘0’ i2c_write(b’0000 00XX’); // Write TH, T∆, or TC registers i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); // READ Command // also, make sure bit 0 is set ‘1’ UpperByte = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay) // and Send ACK bit LowerByte = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) // and Send NAK bit i2c_stop(); // send STOP command //Convert the temperature data if ((UpperByte & 0x80) == 0x80){ //Temperature  0°C Temperature = (UpperByte x 16 + LowerByte / 16) - 4096; }else //Temperature  0°C Temperature = (UpperByte x 16 + LowerByte / 16); //TH, TD, or TC Temperature (°C) depending on the register pointer value shown in Table 4-2. FIGURE 4-3: Timing Diagram to Set a Register Pointer and Read a Two-Byte Data.  2015-2019 Microchip Technology Inc. DS20005426F-page 18 MCP960X/L0X/RL0X 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 0 A 2 A 1 A C K A W 0 0 0 0 0 1 0 A C K 1 Configuration (Table 4-3) Slave* Address Byte 0 x x Slave* x x x x x x A C K P Register Data MCP960X/L0X/RL0X Clock Stretching, tSTRETCH 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 A 0 A A A R C 2 1 0 K Address Byte TABLE 4-3: x x Slave* x x x x N x A P K Master LSB Data POINTERS Read/Write Registers Pointer STATUS 0000 0100 Configuration x *MCP960X/L0X/RL0X 0000 0101 0000 0110 Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); // WRITE Command // also, make sure bit 0 is cleared ‘0’ i2c_write(b’0000 0101’); // Write Status or Configuration registers i2c_write(b’XXXX XXXX’); // Write register data i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); // READ Command // also, make sure bit 0 is set ‘1’ Data = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) // and Send NAK bit i2c_stop(); FIGURE 4-4: // send STOP command Timing Diagram to Set a Register Pointer, Write One Byte, and Read the Data.  2015-2019 Microchip Technology Inc. DS20005426F-page 19 MCP960X/L0X/RL0X 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 0 A 2 A 1 A A W C 0 K 0 0 0 Slave* Address Byte 1 0 0 0 A C K 0 x x x x 1 2 x x 3 Slave* 4 x x A C K x x Alert 1 MSB Slave* Alert Limit 1 (Table 4-4) x x 5 6 x x 7 x 8 x A C P K Slave* Alert 1 LSB MCP960X/L0X/RL0X Clock Stretching, tSTRETCH 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 0 A 2 A 1 Address Byte TABLE 4-4: A 0 A R C K x x x Slave* x x x x Alert 1 MSB x A C K Pointer Alert 1 0001 0000 Alert 2 0001 0001 Alert 3 0001 0010 Alert 4 0001 0011 x x x x x x Alert 1 LSB Master x N A K P Master *MCP960X/L0X/RL0X POINTERS Alert Limit Registers x Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); //WRITE Command //also, make sure bit 0 is cleared ‘0’ i2c_write(b’0001 00XX’); // Write Alert registers i2c_write(b’XXXX XXXX’); // Write register Upper Byte i2c_write(b’XXXX XXXX’); // Write register Lower Byte i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); //READ Command //also, make sure bit 0 is set ‘1’ UpperByte = i2c_read(ACK); // READ 8 bits (with tSTRETCH delay) //and Send ACK bit LowerByte = i2c_read(NAK); // READ 8 bits (with tSTRETCH delay) //and Send NAK bit i2c_stop(); FIGURE 4-5: // send STOP command Timing Diagram to Set a Register Pointer, Write Two Bytes, and Read the Data.  2015-2019 Microchip Technology Inc. DS20005426F-page 20 MCP960X/L0X/RL0X 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 A 1 A 2 0 A A 0 W C 0 K Address Byte 0 0 0 0 0 0 Pointer to TH Register Slave* A C P K 0 Slave* MCP960X/L0X/RL0X Clock Stretching, tSTRETCH 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 SCL SDA S 1 1 0 A 2 0 A 1 A A 0 R C x K x x Slave* Address Byte x x x x x TH MSB Data A C K x x x x x x x x TH LSB Data Master A C K Master MCP960X/L0X/RL0X Clock Stretching, tSTRETCH 1 x 2 x 3 4 x x 5 x 6 x 7 x TC MSB Data 8 x A C K 1 2 3 4 5 6 7 8 x x x x x x x x Master TC LSB Data A C K Master x x x x T MSB Data x x N A K P Master Device ID LSB Note: this is an example pseudo routine: i2c_start(); // send START command i2c_write(b’1100 0000’); // WRITE Command *MCP960X/L0X/RL0X // also, make sure bit 0 is cleared ‘0’ i2c_write(b’0000 0000’); // Write TH register to set the starting register for sequential read i2c_stop(); // send STOP command i2c_start(); // send START command i2c_write(b’1100 0001’); // READ Command // also, make sure bit 0 is set ‘1’ for (i=0; i