MCP9700T-H/LT

MCP9700/9700A MCP9701/9701A Low-Power Linear Active Thermistor ICs Features General Description • Tiny Analog Temperature Sensor • Available Packages: - SC70-5, SOT-23-3, TO-92-3 • Wide Temperature Measurement Range: - -40°C to +125°C (Extended Temperature) - -40°C to +150°C (High Temperature) (MCP9700, SOT-23-3 and SC70-5 only) • Accuracy: - ±2°C (max.), 0°C to +70°C (MCP9700A/9701A) - ±4°C (max.), 0°C to +70°C (MCP9700/9701) • Optimized for Analog-to-Digital Converters (ADCs): - 10.0 mV/°C (typical) (MCP9700/9700A) - 19.5 mV/°C (typical) (MCP9701/9701A) • Wide Operating Voltage Range: - VDD = 2.3V to 5.5V (MCP9700/9700A) - VDD = 3.1V to 5.5V (MCP9701/9701A) • Low Operating Current: 6 µA (typical) • Optimized to Drive Large Capacitive Loads MCP9700/9700A and MCP9701/9701A sensors with Linear Active Thermistor Integrated Circuit (IC) comprise a family of analog temperature sensors that convert temperature to analog voltage. The low-cost, low-power sensors feature an accuracy of ±2°C from 0°C to +70°C (MCP9700A/9701A) and ±4°C from 0°C to +70°C (MCP9700/9701) while consuming 6 µA (typical) of operating current. Unlike resistive sensors, e.g., thermistors, the Linear Active Thermistor IC does not require an additional signal-conditioning circuit. Therefore, the biasing circuit development overhead for thermistor solutions can be avoided by implementing a sensor from these low-cost devices. The Voltage Output pin (VOUT) can be directly connected to the ADC input of a microcontroller. The MCP9700/9700A and MCP9701/9701A temperature coefficients are scaled to provide a 1°C/bit resolution for an 8-bit ADC with a reference voltage of 2.5V and 5V, respectively. The MCP9700/9700A output 0.1°C/bit for a 12-bit ADC with 4.096V reference. The MCP9700/9700A and MCP9701/9701A provide a low-cost solution for applications that require measurement of a relative change of temperature. When measuring relative change in temperature from +25°C, an accuracy of ±1°C (typical) can be realized from 0°C to +70°C. This accuracy can also be achieved by applying system calibration at +25°C. Typical Applications • • • • • • Hard Disk Drives and Other PC Peripherals Entertainment Systems Home Appliance Office Equipment Battery Packs and Portable Equipment General Purpose Temperature Monitoring In addition, this family of devices is immune to the effects of parasitic capacitance and can drive large capacitive loads. This provides printed circuit board (PCB) layout design flexibility by enabling the device to be remotely located from the microcontroller. Adding some capacitance at the output also helps the output transient response by reducing overshoots or undershoots. However, capacitive load is not required for the stability of sensor output. Package Types 3-Pin TO-92 MCP9700/9700A MCP9701/9701A 3-Pin SOT-23 MCP9700/9700A MCP9701/9701A GND 123 Bottom View 1 VDD VOUT GND  2005-2016 Microchip Technology Inc. 5-Pin SC70 MCP9700/9700A MCP9701/9701A NC 1 3 5 NC GND 2 VOUT 3 1 2 VDD VOUT 4 VDD DS20001942G-page 1 MCP9700/9700A and MCP9701/9701A 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † VDD ....................................................................... 6.0V Storage Temperature......................... -65°C to +150°C Ambient Temp. with Power Applied... -40°C to +150°C Output Current .................................................±30 mA Junction Temperature (TJ).................................. 150°C ESD Protection on All Pins (HBM:MM) ..... (4 kV:200V) Latch-Up Current at Each Pin ....................... ±200 mA † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load Parameter Sym. Min. Typ. Max. Unit Conditions Operating Voltage Range VDD VDD 2.3 3.1 — — 5.5 5.5 V V Operating Current IDD — 6 12 µA IDD — — 15 µA °C/VDD — 0.1 — °C/V TA = +25°C TACY — ±1 — °C TA = 0°C to +70°C TACY -2.0 ±1 +2.0 °C MCP9700A/9701A TA = -40°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9700A TA = -10°C to +125°C TACY -2.0 ±1 +4.0 °C MCP9701A TA = 0°C to +70°C TACY -4.0 ±2 +4.0 °C MCP9700/9701 TA = -40°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9700 TA = -10°C to +125°C TACY -4.0 ±2 +6.0 °C MCP9701 TA = -40°C to +150°C TACY -4.0 ±2 +6.0 °C HighTemperature (Note 1) Power Supply Line Regulation MCP9700/9700A MCP9701/9701A TA = 150°C (Note 1) Sensor Accuracy (Notes 2, 3) Sensor Output Output Voltage, TA = 0°C V0°C — 500 — mV MCP9700/9700A Output Voltage, TA = 0°C V0°C — 400 — mV MCP9701/9701A Temperature Coefficient TC — 10.0 — mV/°C MCP9700/9700A TC — 19.5 — mV/°C MCP9701/9701A VONL — ±0.5 — Output Nonlinearity Note 1: 2: 3: 4: 5: °C TA = 0°C to +70°C (Note 3) MCP9700 with SC70-5 and SOT-23-3 packages only. The MCP9700 High Temperature is not available with TO-92 package. The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). DS20001942G-page 2  2005-2016 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load Parameter Sym. Min. Typ. Max. Unit Output Current IOUT — — 100 µA Output Impedance ZOUT — 20 —  IOUT = 100 µA, f = 500 Hz VOUT/ IOUT — 1 —  TA = 0°C to +70°C IOUT = 100 µA tON — 800 — µs CLOAD — — 1000 pF SC-70 Thermal Response to 63% tRES — 1.3 — s TO-92 Thermal Response to 63% tRES — 1.65 — s Output Load Regulation Turn-On Time Typical Load Capacitance Note 1: 2: 3: 4: 5: Conditions Note 4 30°C (Air) to +125°C (Fluid Bath) (Note 5) MCP9700 with SC70-5 and SOT-23-3 packages only. The MCP9700 High Temperature is not available with TO-92 package. The MCP9700/9700A family accuracy is tested with VDD = 3.3V, while the MCP9701/9701A accuracy is tested with VDD = 5.0V. The MCP9700/9700A and MCP9701/9701A family is characterized using the first-order or linear equation, as shown in Equation 4-2. Also refer to Figure 2-16. The MCP9700/9700A and MCP9701/9701A family is characterized and production tested with a capacitive load of 1000 pF. SC70-5 package thermal response with 1x1 inch, dual-sided copper clad, TO-92-3 package thermal response without PCB (leaded). TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated: MCP9700/9700A: VDD = 2.3V to 5.5V, GND = Ground, TA = -40°C to +125°C and No load MCP9701/9701A: VDD = 3.1V to 5.5V, GND = Ground, TA = -10°C to +125°C and No load Parameters Sym. Min. Typ. Max. Units Conditions TA -40 — +125 °C MCP9700/9700A TA -10 — +125 °C MCP9701/9701A TA -40 — +150 °C High Temperature (MCP9700, SOT23-3 and SC70-5 only) TA -40 — +125 °C Extended Temperature TA -40 — +150 °C High Temperature TA -65 — +150 °C Thermal Resistance, 5LD SC70 JA — 331 — °C/W Thermal Resistance, 3LD SOT-23 JA — 308 — °C/W Thermal Resistance, 3LD TO-92 JA — 146 — °C/W Temperature Ranges Specified Temperature Range (Note 1) Operating Temperature Range Storage Temperature Range Thermal Package Resistances Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+150°C).  2005-2016 Microchip Technology Inc. DS20001942G-page 3 MCP9700/9700A and MCP9701/9701A 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 6.0 6.0 5.0 Accuracy (°C) Accuracy (°C) 4.0 4.0 MCP9701A VDD = 5.0V 3.0 2.0 Spec. Limits 1.0 0.0 MCP9700A VDD = 3.3V -50 -25 0 25 50 75 TA (°C) 100 125 MCP9700 MCP9700A VDD = 5.5V VDD = 2.3V Accuracy (°C) 4.0 -50 -25 0 25 50 75 TA (°C) 100 125 150 0.2 MCP9701/ MCP9701A VDD = 5.5V VDD = 3.1V ILOAD = 100 µA 0.1 2.0 0.0 MCP9701/MCP9701A VDD = 5.0V 0 MCP9700/MCP9700A VDD = 3.3V -0.1 -2.0 -0.2 -50 -25 0 25 50 75 TA (°C) 100 125 -50 150 FIGURE 2-2: Accuracy vs. Ambient Temperature, with VDD. Load Regulation ∆V/∆I (Ω) 4.0 10.0 MCP9701 MCP9701A 8.0 6.0 MCP9700/MCP9700A 4.0 2.0 0.0 -50 -25 0 FIGURE 2-3: Temperature. DS20001942G-page 4 25 50 75 TA (°C) 100 125 Supply Current vs. -25 0 25 50 75 TA (°C) 100 125 150 FIGURE 2-5: Changes in Accuracy vs. Ambient Temperature (Due to Load). 12.0 IDD (µA) MCP9700 VDD = 3.3V FIGURE 2-4: Accuracy vs. Ambient Temperature (MCP9700/9701). ∆ Accuracy Due to Load (°C) 6.0 Spec. Limits 0.0 -4.0 150 FIGURE 2-1: Accuracy vs. Ambient Temperature (MCP9700A/9701A). -4.0 2.0 -2.0 -1.0 -2.0 MCP9701 VDD = 5.0V 150 3.0 MCP9700/MCP9700A MCP9701/MCP9701A VDD = 3.3V 2.0 IOUT = 50 µA IOUT = 100 µA IOUT = 200 µA 1.0 0.0 -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-6: Load Regulation vs. Ambient Temperature.  2005-2016 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 30% V0°C (mV) MCP9700/MCP9700A VDD = 2.3V to 5.5V 500 20.0 19.9 19.8 19.7 19.7 FIGURE 2-11: Occurrences vs. Temperature Coefficient (MCP9701/9701A). Normalized Line Regulation (ǻ°C/ǻVDD) Normalized Line Regulation (ǻ°C/ǻVDD) 19.6 TC (mV/°C) 0.20 0.15 0.10 19.5 19.4 19.3 MCP9701 MCP9701A VDD = 5.0V 108 samples 19.3 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 19.2 Occurrences 10.5 10.4 10.3 10.2 10.2 10.1 10.0 9.9 9.8 9.8 9.7 Occurrences MCP9700 MCP9700A VDD = 3.3V 108 samples FIGURE 2-8: Occurrences vs. Temperature Coefficient (MCP9700/9700A). 0.25 480 FIGURE 2-10: Output Voltage at 0°C (MCP9701/9701A). TC (mV/°C) 0.30 460 V0°C (mV) FIGURE 2-7: Output Voltage at 0°C (MCP9700/9700A). 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% 440 MCP9701 300 600 580 560 540 520 500 480 0% 460 0% 440 5% 420 10% 5% 420 MCP9701A 15% 400 MCP9700 10% 20% 380 15% 25% 360 Occurrences 20% MCP9701 VDD = 5.0V 108 samples 340 MCP9700A 25% 400 Occurrences 30% 35% VDD = 3.3V 108 samples 320 35% MCP9700/MCP9700A VDD = 2.3V to 4.0V 0.05 0.00 0.30 0.25 MCP9701/MCP9701A VDD = 3.1V to 5.5V 0.20 0.15 0.10 MCP9701/MCP9701A VDD = 3.1V to 4.0V 0.05 0.00 -50 -25 0 25 50 75 TA (°C) 100 125 150 FIGURE 2-9: Line Regulation (°C/VDD) vs. Ambient Temperature.  2005-2016 Microchip Technology Inc. -50 -25 0 25 50 TA (°C) 75 100 125 FIGURE 2-12: Line Regulation (°C/VDD) vs. Ambient Temperature. DS20001942G-page 5 MCP9700/9700A and MCP9701/9701A Note: Unless otherwise indicated, MCP9700/9700A: VDD = 2.3V to 5.5V; MCP9701/9701A: VDD = 3.1V to 5.5V; GND = Ground, Cbypass = 0.1 µF. 1.6 3.0 TA = +26°C 1.4 2.5 1.0 VOUT (V) 0.8 0.6 0.4 MCP9701 MCP9701A 2.0 1.5 1.0 MCP9700 MCP9700A 0.5 0.2 0.0 0.0 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 -25 0 FIGURE 2-13: Supply. Output Voltage vs. Power 2.5 VDD_STEP = 5V TA = 26°C 10 1.7 IDD 0.8 VOUT 2.0 Output vs. Settling Time to 0.5 TA (°C) -30.0 -42.0 FIGURE 2-17: Ramp VDD. Output Impedance (Ω) SC70-5 1 in. x 1 in. Copper Clad PCB 80 Leaded, without PCB SC70-5 SOT-23-3 TO-92-3 30 2 4 6 8 10 12 14 Time (s) FIGURE 2-15: Thermal Response (Air-to-Fluid Bath). DS20001942G-page 6 16 -18.0 VOUT 1000 0 18.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Time (ms) 130 -2 30.0 -6.0 1.0 Time (ms) 55 125 6.0 0.0 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -2.5 0.0 0 -0.1 -1.7 105 100 1.5 -0.8 2 FIGURE 2-14: Step VDD. 75 VDD_RAMP = 5V/ms TA = +26°C IDD 2.5 0.0 4 50 Output Voltage vs. Ambient 3.0 V OUT (V) 6 VOUT (V) FIGURE 2-16: Temperature. IDD (mA) 12 8 25 TA (°C) VDD (V) IDD (µA) V OUT (V) 1.2 18 Output vs. Settling Time to VDD = 5.0V IOUT = 100 µA TA = +26°C 100 10 1 0. 0.1 1 1 FIGURE 2-18: Frequency. 100 1k 10 10 100 1000 Frequency (Hz) 10k 100k 10000 100000 Output Impedance vs.  2005-2016 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. SC70 Pin No. SOT-23 Pin No. TO-92 Symbol 1 — — NC 2 3 3 GND Power Ground Pin 3 2 2 VOUT Output Voltage Pin 4 1 1 VDD Power Supply Input 5 — — NC No Connect (this pin is not connected to the die.) 3.1 Power Ground Pin (GND) GND is the system ground pin. 3.2 Output Voltage Pin (VOUT) The sensor output can be measured at VOUT. The voltage range over the operating temperature range for the MCP9700/9700A is 100 mV to 1.75V. The voltage range over the operating temperature range for the MCP9701/9701A is 200 mV to 3V.  2005-2016 Microchip Technology Inc. Function No Connect (this pin is not connected to the die.) 3.3 Power Supply Input (VDD) The operating voltage as specified in the DC Electrical Characteristics table is applied to VDD. 3.4 No Connect Pin (NC) This pin is not connected to the die. It can be used to improve thermal conduction to the package by connecting it to a printed circuit board (PCB) trace from the thermal source. DS20001942G-page 7 MCP9700/9700A and MCP9701/9701A APPLICATIONS INFORMATION The Linear Active Thermistor™ IC uses an internal diode to measure temperature. The diode electrical characteristics have a temperature coefficient that provides a change in voltage based on the relative ambient temperature from -40°C to 150°C. The change in voltage is scaled to a temperature coefficient of 10.0 mV/°C (typical) for the MCP9700/9700A and 19.5 mV/°C (typical) for the MCP9701/9701A. The output voltage at 0°C is also scaled to 500 mV (typical) and 400 mV (typical) for the MCP9700/9700A and MCP9701/9701A, respectively. This linear scale is described in the first-order transfer function shown in Equation 4-1 and Figure 2-16. EQUATION 4-1: SENSOR TRANSFER FUNCTION V OUT = T C  T A + V 0°C Where: TA = Ambient Temperature VOUT = Sensor Output Voltage V0°C = Sensor Output Voltage at 0°C (see DC Electrical Characteristics table) TC = Temperature Coefficient (see DC Electrical Characteristics table) 3.0 2.0 Accuracy (°C) 4.0 1.0 0.0 -1.0 VDD= 3.3V 10 Samples -2.0 -3.0 -50 -25 0 FIGURE 4-2: vs. Temperature. 25 50 TA (°C) 75 100 125 Relative Accuracy to +25°C The change in accuracy from the calibration temperature is due to the output nonlinearity from the first-order equation, as specified in Equation 4-2. The accuracy can be further improved by compensating for the output nonlinearity. For higher accuracy using a sensor compensation technique, refer to Application Note AN1001, “IC Temperature Sensor Accuracy Compensation with a PIC® Microcontroller” (DS00001001). The application note shows that if the device is compensated in addition to room temperature calibration, the sensor accuracy can be improved to ±0.5°C (typical) accuracy over the operating temperature (Figure 4-3). 6.0 100 Samples MCP9700 VDD VOUT ANI PIC® MCU 4.0 Accuracy (°C) VDD Spec. Limits 2.0 0.0 +s Average -s -2.0 GND -4.0 GND GND -50 -25 0 25 50 75 100 125 Temperature (°C) FIGURE 4-1: 4.1 Typical Application Circuit. Improving Accuracy The MCP9700/9700A and MCP9701/9701A accuracy can be improved by performing a system calibration at a specific temperature. For example, calibrating the system at +25°C ambient improves the measurement accuracy to a ±0.5°C (typical) from 0°C to +70°C, as shown in Figure 4-2. Therefore, when measuring relative temperature change, this family of devices measures temperature with higher accuracy. DS20001942G-page 8 FIGURE 4-3: Sensor Accuracy. MCP9700/9700A Calibrated The compensation technique provides a linear temperature reading. The application note includes compensation firmware so that a look-up table can be generated to compensate for the sensor error.  2005-2016 Microchip Technology Inc. MCP9700/9700A and MCP9701/9701A 4.2 Shutdown Using Microcontroller I/O Pin The 6 µA (typical) low operating current of the MCP9700/9700A and MCP9701/9701A family makes it ideal for battery-powered applications. However, for applications that require a tighter current budget, this device can be powered using a microcontroller Input/Output (I/O) pin. The I/O pin can be toggled to shut down the device. In such applications, the microcontroller internal digital switching noise is emitted to the MCP9700/9700A and MCP9701/9701A as power supply noise. However, this switching noise compromises measurement accuracy, therefore a decoupling capacitor and series resistor will be necessary to filter out the system noise. 4.3 Layout Considerations The MCP9700/9700A and MCP9701/9701A family of sensors does not require any additional components to operate. However, it is recommended that a decoupling capacitor of 0.1 µF to 1 µF be used between the VDD and GND pins. In high-noise applications, connect the power supply voltage to the VDD pin using a 200 resistor with a 1 µF decoupling capacitor. A high frequency ceramic capacitor is recommended. It is necessary that the capacitor is located as close as possible to the VDD and GND pins in order to provide effective noise protection. In addition, avoid tracing digital lines in close proximity to the sensor. 4.4 Thermal Considerations The MCP9700/9700A and MCP9701/9701A family measures temperature by monitoring the voltage of a diode located in the die. A low-impedance thermal path between the die and the PCB is provided by the pins. Therefore, the sensor effectively monitors the temperature of the PCB. However, the thermal path for the ambient air is not as efficient because the plastic device package functions as a thermal insulator from the die. This limitation applies to plastic-packaged silicon temperature sensors. If the application requires the measurement of ambient air, the TO-92 package should be considered. The MCP9700/9700A and MCP9701/9701A sensors are designed to source/sink 100 µA (max.). The power dissipation due to the output current is relatively insignificant. The effect of the output current can be described by Equation 4-2. EQUATION 4-2: EFFECT OF SELF-HEATING T J – T A =  JA  VDD I DD +  VDD – VOUT  I OUT  Where: TJ = Junction Temperature TA = Ambient Temperature JA = Package Thermal Resistance (331°C/W) VOUT = Sensor Output Voltage IOUT = Sensor Output Current IDD = Operating Current VDD = Operating Voltage At TA = +25°C (VOUT = 0.75V) and maximum specification of IDD = 12 µA, VDD = 5.5V and IOUT = +100 µA, the self-heating due to power dissipation (TJ – TA) is 0.179°C.  2005-2016 Microchip Technology Inc. DS20001942G-page 9 MCP9700/9700A and MCP9701/9701A 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 5-Lead SC70 Example Device XXNN Code MCP9700T-E/LT AUNN MCP9700AT-E/LT AXNN MCP9700T-H/LT BCNN MCP9701T-E/LT AVNN MCP9701AT-E/LT AYNN BC25 Note: Applies to 5-Lead SC70. 3-Lead SOT-23 Example Device XXNN Code MCP9700T-E/TT AENN MCP9700AT-E/TT AFNN MCP9700T-H/TT AGNN MCP9701T-E/TT AMNN MCP9701AT-E/TT APNN AE25 Note: Applies to 3-Lead SOT-23. Example 3-Lead TO-92 XXXXXX XXXXXX XXXXXX YWWNNN Device MCP9700-E/TO MCP9700A-E/TO MCP9701-E/TO MCP9701A-E/TO MCP 9700E TO e3 614256 Note: Applies to 3-Lead TO-92. Legend: XX...X Y YY WW NNN e3 * Note: DS20001942G-page 10 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. 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